WO2018055846A1 - Light emitting element mounting substrate, method for manufacturing same, and light emitting element mounting package - Google Patents

Light emitting element mounting substrate, method for manufacturing same, and light emitting element mounting package Download PDF

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Publication number
WO2018055846A1
WO2018055846A1 PCT/JP2017/021410 JP2017021410W WO2018055846A1 WO 2018055846 A1 WO2018055846 A1 WO 2018055846A1 JP 2017021410 W JP2017021410 W JP 2017021410W WO 2018055846 A1 WO2018055846 A1 WO 2018055846A1
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Prior art keywords
emitting element
light emitting
element mounting
aluminum nitride
substrate
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PCT/JP2017/021410
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French (fr)
Japanese (ja)
Inventor
芳夫 馬屋原
久美子 姫井
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日本電気硝子株式会社
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Publication of WO2018055846A1 publication Critical patent/WO2018055846A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode, a manufacturing method thereof, and a light emitting element mounting package using the light emitting element mounting substrate.
  • a light-emitting element mounting substrate is used to mount a light-emitting element.
  • An LED Light Emitting Diode
  • a light emitting element mounted on a light emitting element mounting substrate is a light source that is small in size and low in power consumption.
  • white LEDs are attracting attention as an alternative to incandescent bulbs and fluorescent lamps.
  • ultraviolet LED attracts attention as an ultraviolet light source in applications such as sterilization, air cleaning, cancer treatment, or resin curing.
  • Patent Document 1 discloses a light emitting element mounting substrate in which a light reflecting layer is provided on an aluminum nitride substrate.
  • filled vias are provided in an aluminum nitride substrate. The filled via connects the front surface side electrode and the back surface side electrode.
  • Patent Document 1 discloses a light emitting device in which a light emitting element is mounted on the light emitting element mounting substrate. The light emitting element is connected to the surface side electrode.
  • a resin is provided so as to cover the light emitting element, thereby sealing the light emitting element.
  • deep ultraviolet LEDs In recent years, attention has been focused on deep ultraviolet LEDs from the viewpoint of further improving performance such as sterilization, air cleaning, and resin curing.
  • deep UV LED When deep UV LED is used as a light emitting element, higher airtightness is required.
  • the light-emitting device of Patent Document 1 is based on a light-emitting element that emits visible light, and is not sufficiently airtight.
  • An object of the present invention is to provide a light emitting element mounting substrate that can exhibit high airtightness when the light emitting element is mounted and sealed, a method for manufacturing the light emitting element mounting substrate, and the light emitting element mounting. Another object is to provide a light-emitting element mounting package using a substrate.
  • the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element, and has an aluminum nitride substrate having first and second main surfaces facing each other, and the aluminum nitride
  • a wiring electrode provided on the first main surface of the substrate; connected to the light emitting element; a terminal electrode provided on the second main surface of the aluminum nitride substrate;
  • a frame-shaped electrode provided in the aluminum nitride substrate, connected to the wiring electrode and the terminal electrode, and provided on the first main surface of the aluminum nitride substrate.
  • a through hole is provided in the aluminum nitride substrate so as to reach the second main surface from the first main surface, and the through hole electrode is provided in the through hole. Are location, the through hole, characterized in that it is sealed by the light reflecting layer.
  • the light reflecting layer is made of glass ceramics.
  • the manufacturing method of the light emitting element mounting substrate of this invention is a manufacturing method of the light emitting element mounting substrate comprised according to this invention, Comprising: The process of forming the said through hole in the said aluminum nitride substrate, The said aluminum nitride substrate And forming the through-hole electrode in the through-hole, and forming the wiring electrode and the terminal electrode on the first and second main surfaces, respectively, and the first of the aluminum nitride substrate. And forming the light reflecting layer so as to seal the through-hole on the main surface.
  • the light emitting element mounting package of the present invention is a light emitting element mounting package for mounting and sealing a light emitting element therein, and the light emitting element mounting substrate configured according to the present invention and the light emitting element mounting substrate A light emitting element mounted on the light reflecting layer of the light emitting element mounting substrate, the glass lid sealing the inside of the light emitting element mounting package, and the light reflecting layer; And a sealing material layer disposed between the glass lid and the glass lid.
  • the present invention it is possible to provide a light emitting element mounting substrate that can exhibit high airtightness when the light emitting element is mounted and sealed.
  • FIG. 1 is a schematic sectional view showing a light emitting element mounting substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic bottom view of a light emitting element mounting substrate according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing a modification of the light emitting element mounting substrate according to the embodiment of the present invention.
  • 4A to 4D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting substrate according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing a light emitting element mounting package according to an embodiment of the present invention.
  • 6A to 6D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting package according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view showing a light emitting element mounting package of a comparative example.
  • FIG. 1 is a schematic sectional view showing a light emitting element mounting substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic bottom view of the light emitting element mounting substrate according to the embodiment of the present invention.
  • the light emitting element mounting substrate 1 includes an aluminum nitride substrate 2, a light reflecting layer 3, wiring electrodes 4a and 4b, through-hole electrodes 5a and 5b, and terminal electrodes 6a and 6b.
  • the light emitting element mounting substrate 1 is a substrate for mounting a light emitting element such as a deep ultraviolet LED.
  • the aluminum nitride substrate 2 has first and second main surfaces 2a and 2b.
  • the first and second main surfaces 2a and 2b face each other.
  • wiring electrodes 4a and 4b are provided on the first main surface 2a of the aluminum nitride substrate 2.
  • the wiring electrodes 4a and 4b are electrodes for connecting to the light emitting element.
  • terminal electrodes 6 a and 6 b are provided on the second main surface 2 b of the aluminum nitride substrate 2.
  • the terminal electrodes 6a and 6b are electrodes for connecting to the outside.
  • the aluminum nitride substrate 2 is provided with through holes 7a and 7b.
  • the through holes 7a and 7b are provided from the first main surface 2a to the second main surface 2b.
  • through-hole electrodes 5a and 5b are provided in the through-holes 7a and 7b.
  • the through-hole electrodes 5a and 5b connect the wiring electrodes 4a and 4b and the terminal electrodes 6a and 6b.
  • a light emitting element mounting region 2 c for mounting a light emitting element is provided on the first main surface 2 a of the aluminum nitride substrate 2.
  • a frame-shaped light reflecting layer 3 is provided so as to surround the light emitting element mounting region 2c.
  • the light reflecting layer 3 is provided so as to cover the through holes 7a and 7b. More specifically, the light reflecting layer 3 is provided so as to seal the through holes 7a and 7b.
  • the light reflection layer 3 can be comprised by glass ceramics, for example.
  • the aluminum nitride substrate 2 is used in the light emitting element mounting substrate 1 of this embodiment, the heat dissipation is excellent. Moreover, since it has the light reflection layer 3, it has a high reflectance. Further, in the light emitting element mounting substrate 1, the light reflecting layer 3 is provided so as to cover the through holes 7 a and 7 b of the aluminum nitride substrate 2, and the through holes 7 a and 7 b are sealed by the light reflecting layer 3. . Therefore, airtightness can be enhanced when the light emitting element is mounted and sealed. This will be described in detail in the section of the light emitting element mounting package described later.
  • the inner side surface 3 a of the light reflecting layer 3 is formed to extend in a substantially vertical direction with respect to the aluminum nitride substrate 2.
  • the inner side surface 3a of the light reflecting layer 3 may have a tapered shape that expands from the lower surface 3c toward the upper surface 3b.
  • a light-transmitting functional layer may be provided on the inner side surface 3 a of the light reflecting layer 3.
  • the functional layer include a protective coating layer, a wavelength filter layer, a light diffusion layer, an interference layer, and the like against scratches, dirt, chemical corrosion, and the like.
  • the aluminum nitride substrate is made of aluminum nitride.
  • the aluminum nitride substrate may contain a sintering aid for sintering aluminum nitride such as an yttrium compound or a tungsten compound.
  • the light reflection layer can be made of glass ceramics, for example.
  • a mixed powder of glass powder and ceramic powder, or crystalline glass powder can be used.
  • glass powder examples include SiO 2 —B 3 O 3 glass, SiO 2 —RO glass (R represents an alkaline earth metal), SiO 2 —Al 2 O 3 glass, SiO 2 —ZnO glass, SiO 2 —R 2 O-based glass (R represents an alkali metal), SiO 2 —TiO 2 -based glass, or the like can be used. These glass powders may be used alone or in combination.
  • alumina, zirconia, titania or the like can be used as the ceramic powder. These ceramic powders may be used alone or in combination.
  • the material of the functional layer is not particularly limited, glass such as silicate glass, metal oxide such as silica, alumina, zirconia, tantalum oxide, or niobium oxide, resin such as polymethyl methacrylate, polycarbonate, or polyacrylate Is mentioned. These materials may be used alone or in combination.
  • an aluminum nitride substrate 2A before firing is prepared.
  • through holes 7a and 7b are formed in the prepared pre-fired aluminum nitride substrate 2A.
  • the method for forming the through holes 7a and 7b is not particularly limited, and for example, the through holes 7a and 7b can be formed by machining with a drill or laser processing.
  • wiring electrodes 4a and 4b, through-hole electrodes 5a and 5b, and terminal electrodes 6a and 6b are formed.
  • each electrode is not particularly limited, but can be formed by printing, for example. It does not specifically limit as a paste used for printing, For example, pastes, such as silver, copper, gold
  • the through-hole electrodes 5a and 5b are filled with the paste for forming the through-hole electrodes 5a and 5b.
  • the paste for forming the wiring electrodes 4a and 4b is formed on the aluminum nitride substrate 2A before firing. And it can carry out by printing the paste for terminal electrode 6a, 6b formation.
  • the aluminum nitride substrate 2A and each paste before firing are fired.
  • the aluminum nitride substrate 2, the wiring electrodes 4a and 4b, the through-hole electrodes 5a and 5b, and the terminal electrodes 6a and 6b are formed.
  • the paste is fired in a nitrogen atmosphere.
  • gold, silver, or an alloy containing silver is used as the material constituting each paste, the paste is fired in the atmosphere.
  • the firing temperature is preferably 1200 ° C. or lower.
  • the firing temperature exceeds 1200 ° C., the surface of the aluminum nitride may be oxidized and the thermal conductivity may be lowered.
  • each electrode for example, gold plating can be performed.
  • the plating method include electroless plating and electrolytic plating, and can be appropriately selected depending on the thickness of the plating layer.
  • a light reflecting layer 3 is formed on the aluminum nitride substrate 2. At this time, the light reflecting layer 3 is formed so as to cover the through holes 7a and 7b. Thereby, the through holes 7a and 7b are sealed, and the light emitting element mounting substrate 1 can be obtained.
  • the light reflecting layer 3 is preferably formed of glass ceramics. In this case, the light reflectance can be further increased, and the adhesiveness with the aluminum nitride substrate 2 can be further increased.
  • the method for forming the light reflecting layer 3 is not particularly limited, and examples thereof include a screen printing method and a green sheet laminating method.
  • a high viscosity paste prepared by adding a resin binder and a solvent to the glass ceramic powder and kneading is used with a screen printing machine. This can be done by printing on the aluminum nitride substrate 2.
  • a slurry is prepared by adding a resin binder, a plasticizer and a solvent to the glass ceramic powder and kneading them. Subsequently, the prepared slurry is formed into a green sheet using a sheet forming machine such as a doctor blade. Next, the obtained green sheet is punched into the shape of the light reflecting layer 3 and laminated on the aluminum nitride substrate 2 by pressure bonding.
  • the firing can be performed in two stages, that is, a resin removal binder and a main firing in which the glass ceramic powder is sintered.
  • the deresin binder can be performed at 400 ° C. to 600 ° C. Further, the main baking can be performed at, for example, 850 ° C. to 1000 ° C.
  • the aluminum nitride substrate 2 In the manufacturing method of the light emitting element mounting substrate 1, since the aluminum nitride substrate 2 is used, heat dissipation is excellent. Moreover, since the light reflection layer 3 is provided, it has a high reflectance. Further, in the light emitting element mounting substrate 1, since the light reflecting layer 3 is formed so as to seal the through holes 7a and 7b of the aluminum nitride substrate 2, airtightness is achieved when the light emitting element is mounted and sealed. Can be increased. This will be described in detail in the section of the light emitting element mounting package described later.
  • FIG. 5 is a schematic cross-sectional view showing a light emitting element mounting package according to an embodiment of the present invention.
  • the light emitting element mounting package 21 includes a light emitting element mounting substrate 1, a glass lid 8, a sealing material layer 9, and a light emitting element 10.
  • the light emitting element mounting substrate 1 is a light emitting element mounting substrate according to an embodiment of the present invention described above.
  • the light emitting element 10 is mounted on the light emitting element mounting substrate 1.
  • the light emitting element 10 is connected to the wiring electrodes 4 a and 4 b of the light emitting element mounting substrate 1.
  • Examples of the light emitting element 10 include a deep ultraviolet LED and a white LED in which a blue LED and a yellow phosphor are combined.
  • a glass lid 8 is disposed on the upper surface 3 b of the light reflecting layer 3 in the light emitting element mounting substrate 1.
  • the glass lid 8 is a member for sealing the inside of the light emitting element mounting package 21.
  • a sealing material layer 9 is provided between the light reflecting layer 3 and the glass lid 8. The light reflecting layer 3 and the glass lid 8 are joined by the sealing material layer 9.
  • the light emitting element mounting package 21 since the aluminum nitride substrate 2 is used for the light emitting element mounting substrate 1, heat dissipation is excellent. Further, since the light reflecting layer 3 is used for the light emitting element mounting substrate 1, the reflectance is increased. Furthermore, since the light emitting element mounting package 21 is sealed with the glass lid 8 instead of the resin, it does not deteriorate due to ultraviolet rays and does not lower the airtightness like the resin. Further, since the light reflecting layer 3 is provided so as to cover the through holes 7a and 7b of the aluminum nitride substrate 2, the through holes 7a and 7b are sealed, and the airtightness is further enhanced. Furthermore, the light emitting element mounting package 21 is excellent in durability against ultraviolet rays because the constituent materials are all inorganic materials.
  • FIG. 7 is a schematic cross-sectional view showing a light emitting element mounting package of a comparative example.
  • the through holes 107a and 107b are not provided at positions overlapping the light reflecting layer 103 in plan view. More specifically, the through holes 107 a and 107 b are not sealed by the light reflecting layer 103. Therefore, even when the light emitting element mounting substrate 100 is sealed with the glass lid 108, moisture may enter through the through holes 107a and 107b. More specifically, moisture may enter from the interface between the aluminum nitride substrate 102 and the through-hole electrodes 105a and 105b in the through-holes 107a and 107b. Therefore, in the light emitting element mounting package 101 of the comparative example, the airtightness is not sufficiently improved.
  • the through holes 7a and 7b are sealed by the light reflecting layer 3. Therefore, the light reflection layer 3 can prevent moisture from entering through the through holes 7a and 7b. More specifically, the light reflection layer 3 can prevent moisture from entering from the interface between the aluminum nitride substrate 2 and the through-hole electrodes 5a and 5b. Thus, in the light emitting element mounting package 21, since the light reflection layer 3 can prevent moisture from entering, the airtightness is improved.
  • FIGS. 6A to 6D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting package according to an embodiment of the present invention.
  • the light emitting element mounting substrate 1 shown in FIG. 6B the light emitting element 10 is mounted on the light emitting element mounting substrate 1.
  • the connection between the light emitting element 10 and the light emitting element mounting substrate 1 can be performed by, for example, a connection by a solder hole or a connection by a wire bond.
  • a sealing material is printed on the upper surface 3 b of the light reflecting layer 3. After the sealing material is printed, it is dried and heat-treated to sinter the sealing material to form a sealing material layer 9 shown in FIG.
  • the sealing material layer 9 may be formed on the glass lid 8 side, or may be formed on both the glass lid 8 side and the light reflecting layer 3 side.
  • a glass lid 8 is disposed on a portion where the sealing material layer 9 is provided on the upper surface 3 b of the light reflecting layer 3.
  • the glass lid 8 may be arranged so that at least a part thereof overlaps the portion where the sealing material layer 9 is provided in a plan view. But it is preferable to arrange
  • a laser is irradiated from a laser light source to soften the sealing material layer 9, and the light reflecting layer 3 And the glass cover 8 is joined.
  • the inside is hermetically sealed, and the light emitting element mounting package 21 is obtained.
  • the laser for example, a laser having a wavelength of 600 nm to 1600 nm can be used.
  • Glass lid As the glass constituting the glass lid, ultraviolet transmissive glass is preferable.
  • Specific examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ Includes Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na, or Ka) glass, and the like.
  • the sealing material for forming the sealing material layer is a low melting point sealing glass such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, or V 2 O 5 —TeO 2 glass powder. It is preferable that it contains. In particular, when sealing is performed by irradiating with a laser, the sealing glass has a low softening point in view of the necessity of softening the sealing material by heating for a shorter time and further enhancing the bonding strength. More preferably, powder is used. Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like.
  • Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, ⁇ -quartz solid solution, ⁇ -eucryptite, and spodumene.
  • Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
  • Example 1 In Example 1, the light emitting element mounting package 21 shown in FIG. 5 was produced.
  • through holes 7a and 7b having a diameter of 0.2 mm were formed at two locations on the aluminum nitride substrate 2 having a thickness of 0.3 mm using a semiconductor laser.
  • a silver paste is filled into the through holes 7a and 7b through a metal mask, and the silver paste is printed with a wiring width of 0.2 mm, so that the first and second main surfaces 2a, 2a of the aluminum nitride substrate 2 are printed. Electrical connection was made in 2b.
  • a silver paste for forming the wiring electrodes 4a and 4b was printed on the first main surface 2a.
  • the silver paste for terminal electrode 6a, 6b formation was printed on the 2nd main surface 2b.
  • the aluminum nitride substrate 2 coated with each silver paste was baked at a temperature of 850 ° C. for 20 minutes in the air.
  • thermocompression bonding was performed at a position where the through holes 7 a and 7 b were completely sealed by the light reflecting layer 3.
  • a green sheet was formed on the aluminum nitride substrate 2 and fired using an electric furnace. In order to vaporize the resin binder contained in the silver paste and the green sheet, it was held at 500 ° C. for 2 hours, and then held at 850 ° C. for 1 hour in order to sinter silver and glass ceramics.
  • the obtained light emitting element mounting substrate 1 was subjected to nickel plating and gold plating, and a deep ultraviolet LED as the light emitting element 10 was mounted using a solder hole. Subsequently, a glass frit is applied to the upper surface 3b of the light reflecting layer 3, an ultraviolet ray transmitting glass as a glass lid 8 is attached, and laser sealing is performed to obtain a light emitting element mounting package 21 on which deep ultraviolet LEDs are mounted. It was.
  • Comparative Example 1 In Comparative Example 1, the light emitting element mounting package 101 shown in FIG. 7 was manufactured.
  • a light emitting element mounting package 101 was produced in the same manner as in Example 1 except that the through holes 107a and 107b were formed at positions where they did not overlap the light reflecting layer 103.
  • Example 1 The light emitting element mounting packages 21 and 101 obtained in Example 1 and Comparative Example 1 were held in a pressure vessel for 24 hours under the conditions of 121 ° C., 2 atm and 100% humidity, respectively. As a result, in Example 1, no change was observed, but in Comparative Example 1, condensation was observed inside the package. As a result, it was confirmed that the light-emitting element mounting package 21 of Example 1 had higher airtightness than the light-emitting element mounting package 101 of Comparative Example 1.

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Abstract

Provided is a light emitting element mounting substrate capable of exhibiting high hermeticity when a light emitting element is mounted and sealed. The present invention is characterized by comprising an aluminum nitride substrate 2, wiring electrodes 4a and 4b which are provided on a first main surface 2a of the aluminum nitride substrate 2 and are for connection with a light emitting element, terminal electrodes 6a and 6b which are provided on a second main surface 2b of the aluminum nitride substrate 2, through-hole electrodes 5a and 5b which are provided inside the aluminum nitride substrate 2 and connect the wiring electrodes 4a and 4b with the terminal electrodes 6a and 6b, and a frame-shaped light reflecting layer 3 which is provided on the first main surface 2a of the aluminum nitride substrate 2, wherein through-holes 7a and 7b are provided in the aluminum nitride substrate 2 so as to extend from the first main surface 2a to the second main surface 2b, the through-hole electrodes 5a and 5b are disposed inside the through-holes 7a and 7b, and the through-holes 7a and 7b are sealed by the light reflecting layer 3.

Description

発光素子搭載用基板及びその製造方法、並びに発光素子搭載パッケージLight emitting element mounting substrate, method for manufacturing the same, and light emitting element mounting package
　本発明は、発光ダイオード等の発光素子を搭載するための発光素子搭載用基板及びその製造方法、並びに該発光素子搭載用基板を用いた発光素子搭載パッケージに関する。 The present invention relates to a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode, a manufacturing method thereof, and a light emitting element mounting package using the light emitting element mounting substrate.
　従来、発光素子を搭載するために、発光素子搭載用基板が用いられている。発光素子搭載用基板に搭載される発光素子の一例としてのＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）は、小型で消費電力が低い光源である。なかでも、白色ＬＥＤは、白熱球や、蛍光ランプに代わる照明として注目を集めている。また、紫外ＬＥＤは、殺菌、空気洗浄、がん治療、又は樹脂硬化等の用途において、紫外線光源として注目を集めている。 Conventionally, a light-emitting element mounting substrate is used to mount a light-emitting element. An LED (Light Emitting Diode) as an example of a light emitting element mounted on a light emitting element mounting substrate is a light source that is small in size and low in power consumption. Of these, white LEDs are attracting attention as an alternative to incandescent bulbs and fluorescent lamps. Moreover, ultraviolet LED attracts attention as an ultraviolet light source in applications such as sterilization, air cleaning, cancer treatment, or resin curing.
　下記の特許文献１には、窒化アルミニウム基板上に光反射層が設けられてなる発光素子搭載用基板が開示されている。特許文献１では、窒化アルミニウム基板内にフィルドビアが設けられている。上記フィルドビアは、表面側電極と裏面側電極とを接続している。 The following Patent Document 1 discloses a light emitting element mounting substrate in which a light reflecting layer is provided on an aluminum nitride substrate. In Patent Document 1, filled vias are provided in an aluminum nitride substrate. The filled via connects the front surface side electrode and the back surface side electrode.
　また、特許文献１には、上記発光素子搭載用基板に発光素子が搭載された発光デバイスが開示されている。上記発光素子は、上記表面側電極に接続されている。特許文献１では、上記発光素子を覆うように樹脂が設けられており、それによって発光素子が封止されている。 Patent Document 1 discloses a light emitting device in which a light emitting element is mounted on the light emitting element mounting substrate. The light emitting element is connected to the surface side electrode. In Patent Document 1, a resin is provided so as to cover the light emitting element, thereby sealing the light emitting element.
特開２０１５－１４４２１０号公報Japanese Patent Laid-Open No. 2015-144210
　近年、殺菌や空気清浄、または樹脂硬化などの性能をより一層向上させる観点から、深紫外線ＬＥＤへの注目が高まっている。深紫外線ＬＥＤを発光素子として用いる場合、より一層高い気密性が必要となる。 In recent years, attention has been focused on deep ultraviolet LEDs from the viewpoint of further improving performance such as sterilization, air cleaning, and resin curing. When deep UV LED is used as a light emitting element, higher airtightness is required.
　しかしながら、特許文献１の発光デバイスは、可視光線を発光する発光素子を前提としており、気密性が十分でなかった。 However, the light-emitting device of Patent Document 1 is based on a light-emitting element that emits visible light, and is not sufficiently airtight.
　本発明の目的は、発光素子を搭載して封止したときに、高い気密性を発現することを可能とする発光素子搭載用基板、該発光素子搭載用基板の製造方法、及び該発光素子搭載用基板を用いた発光素子搭載パッケージを提供することにある。 An object of the present invention is to provide a light emitting element mounting substrate that can exhibit high airtightness when the light emitting element is mounted and sealed, a method for manufacturing the light emitting element mounting substrate, and the light emitting element mounting. Another object is to provide a light-emitting element mounting package using a substrate.
　本発明の発光素子搭載用基板は、発光素子を搭載するための発光素子搭載用基板であって、互いに対向している第１及び第２の主面を有する、窒化アルミニウム基板と、前記窒化アルミニウム基板の前記第１の主面上に設けられており、前記発光素子と接続するための配線電極と、前記窒化アルミニウム基板の前記第２の主面上に設けられている、端子電極と、前記窒化アルミニウム基板内に設けられており、前記配線電極と前記端子電極とを接続している、スルーホール電極と、前記窒化アルミニウム基板の前記第１の主面上に設けられている、枠状の光反射層と、を備え、前記第１の主面から前記第２の主面に至るように、前記窒化アルミニウム基板にスルーホールが設けられており、前記スルーホール内に、前記スルーホール電極が配置されており、前記スルーホールが、前記光反射層により封止されていることを特徴とする。 The light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element, and has an aluminum nitride substrate having first and second main surfaces facing each other, and the aluminum nitride A wiring electrode provided on the first main surface of the substrate; connected to the light emitting element; a terminal electrode provided on the second main surface of the aluminum nitride substrate; A frame-shaped electrode provided in the aluminum nitride substrate, connected to the wiring electrode and the terminal electrode, and provided on the first main surface of the aluminum nitride substrate. A through hole is provided in the aluminum nitride substrate so as to reach the second main surface from the first main surface, and the through hole electrode is provided in the through hole. Are location, the through hole, characterized in that it is sealed by the light reflecting layer.
　本発明の発光素子搭載用基板は、好ましくは、前記光反射層が、ガラスセラミックスにより構成されている。 In the light emitting element mounting substrate of the present invention, preferably, the light reflecting layer is made of glass ceramics.
　本発明の発光素子搭載用基板の製造方法は、本発明に従って構成される発光素子搭載用基板の製造方法であって、前記窒化アルミニウム基板に、前記スルーホールを形成する工程と、前記窒化アルミニウム基板において、前記スルーホール内に前記スルーホール電極を形成し、前記第１及び第２の主面上に、それぞれ、前記配線電極及び前記端子電極を形成する工程と、前記窒化アルミニウム基板の前記第１の主面上において、前記スルーホールを封止するように前記光反射層を形成する工程と、を備えることを特徴とする。 The manufacturing method of the light emitting element mounting substrate of this invention is a manufacturing method of the light emitting element mounting substrate comprised according to this invention, Comprising: The process of forming the said through hole in the said aluminum nitride substrate, The said aluminum nitride substrate And forming the through-hole electrode in the through-hole, and forming the wiring electrode and the terminal electrode on the first and second main surfaces, respectively, and the first of the aluminum nitride substrate. And forming the light reflecting layer so as to seal the through-hole on the main surface.
　本発明の発光素子搭載パッケージは、発光素子を内部に搭載して封止するための発光素子搭載パッケージであって、本発明に従って構成される発光素子搭載用基板と、前記発光素子搭載用基板に搭載されている、発光素子と、前記発光素子搭載用基板における前記光反射層の上部に配置されており、前記発光素子搭載パッケージ内を封止している、ガラス蓋と、前記光反射層と、前記ガラス蓋との間に配置されている、封着材料層と、を備えることを特徴とする。 The light emitting element mounting package of the present invention is a light emitting element mounting package for mounting and sealing a light emitting element therein, and the light emitting element mounting substrate configured according to the present invention and the light emitting element mounting substrate A light emitting element mounted on the light reflecting layer of the light emitting element mounting substrate, the glass lid sealing the inside of the light emitting element mounting package, and the light reflecting layer; And a sealing material layer disposed between the glass lid and the glass lid.
　本発明によれば、発光素子を搭載して封止したときに、高い気密性を発現することを可能とする発光素子搭載用基板を提供することができる。 According to the present invention, it is possible to provide a light emitting element mounting substrate that can exhibit high airtightness when the light emitting element is mounted and sealed.
図１は、本発明の一実施形態に係る発光素子搭載用基板を示す模式的断面図である。FIG. 1 is a schematic sectional view showing a light emitting element mounting substrate according to an embodiment of the present invention. 図２は、本発明の一実施形態に係る発光素子搭載用基板の模式的底面図である。FIG. 2 is a schematic bottom view of a light emitting element mounting substrate according to an embodiment of the present invention. 図３は、本発明の一実施形態に係る発光素子搭載用基板の変形例を示す模式的断面図である。FIG. 3 is a schematic cross-sectional view showing a modification of the light emitting element mounting substrate according to the embodiment of the present invention. 図４（ａ）～（ｄ）は、本発明の一実施形態に係る発光素子搭載用基板の製造方法を説明するための模式的断面図である。4A to 4D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting substrate according to an embodiment of the present invention. 図５は、本発明の一実施形態に係る発光素子搭載パッケージを示す模式的断面図である。FIG. 5 is a schematic cross-sectional view showing a light emitting element mounting package according to an embodiment of the present invention. 図６（ａ）～（ｄ）は、本発明の一実施形態に係る発光素子搭載パッケージの製造方法を説明するための模式的断面図である。6A to 6D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting package according to an embodiment of the present invention. 図７は、比較例の発光素子搭載パッケージを示す模式的断面図である。FIG. 7 is a schematic cross-sectional view showing a light emitting element mounting package of a comparative example.
　以下、好ましい実施形態について説明する。但し、以下の実施形態は単なる例示であり、本発明は以下の実施形態に限定されるものではない。また、各図面において、実質的に同一の機能を有する部材は同一の符号で参照する場合がある。 Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. Moreover, in each drawing, the member which has the substantially the same function may be referred with the same code | symbol.
　［発光素子搭載用基板］
　図１は、本発明の一実施形態に係る発光素子搭載用基板を示す模式的断面図である。また、図２は、本発明の一実施形態に係る発光素子搭載用基板の模式的底面図である。 [Light emitting element mounting substrate]
FIG. 1 is a schematic sectional view showing a light emitting element mounting substrate according to an embodiment of the present invention. FIG. 2 is a schematic bottom view of the light emitting element mounting substrate according to the embodiment of the present invention.
　図１に示すように、発光素子搭載用基板１は、窒化アルミニウム基板２、光反射層３、配線電極４ａ，４ｂ、スルーホール電極５ａ，５ｂ及び端子電極６ａ，６ｂを備える。なお、発光素子搭載用基板１は、深紫外線ＬＥＤなどの発光素子を搭載するための基板である。 As shown in FIG. 1, the light emitting element mounting substrate 1 includes an aluminum nitride substrate 2, a light reflecting layer 3, wiring electrodes 4a and 4b, through- hole electrodes 5a and 5b, and terminal electrodes 6a and 6b. The light emitting element mounting substrate 1 is a substrate for mounting a light emitting element such as a deep ultraviolet LED.
　窒化アルミニウム基板２は、第１及び第２の主面２ａ，２ｂを有する。第１及び第２の主面２ａ，２ｂは、互いに対向している。窒化アルミニウム基板２の第１の主面２ａ上には、配線電極４ａ，４ｂが設けられている。配線電極４ａ，４ｂは、発光素子と接続するための電極である。他方、窒化アルミニウム基板２の第２の主面２ｂ上には、端子電極６ａ，６ｂが設けられている。端子電極６ａ，６ｂは、外部と接続するための電極である。 The aluminum nitride substrate 2 has first and second main surfaces 2a and 2b. The first and second main surfaces 2a and 2b face each other. On the first main surface 2a of the aluminum nitride substrate 2, wiring electrodes 4a and 4b are provided. The wiring electrodes 4a and 4b are electrodes for connecting to the light emitting element. On the other hand, terminal electrodes 6 a and 6 b are provided on the second main surface 2 b of the aluminum nitride substrate 2. The terminal electrodes 6a and 6b are electrodes for connecting to the outside.
　窒化アルミニウム基板２には、スルーホール７ａ，７ｂが設けられている。スルーホール７ａ，７ｂは、第１の主面２ａから第２の主面２ｂに至るように設けられている。また、スルーホール７ａ，７ｂ内にスルーホール電極５ａ，５ｂが設けられている。スルーホール電極５ａ，５ｂは、配線電極４ａ，４ｂ及び端子電極６ａ，６ｂを接続している。 The aluminum nitride substrate 2 is provided with through holes 7a and 7b. The through holes 7a and 7b are provided from the first main surface 2a to the second main surface 2b. Further, through- hole electrodes 5a and 5b are provided in the through- holes 7a and 7b. The through- hole electrodes 5a and 5b connect the wiring electrodes 4a and 4b and the terminal electrodes 6a and 6b.
　窒化アルミニウム基板２の第１の主面２ａには、発光素子を搭載するための発光素子搭載領域２ｃが設けられている。第１の主面２ａ上においては、この発光素子搭載領域２ｃを囲むように、枠状の光反射層３が設けられている。光反射層３は、スルーホール７ａ，７ｂを覆うように設けられている。より具体的に、光反射層３は、スルーホール７ａ，７ｂを封止するように設けられている。なお、光反射層３は、例えば、ガラスセラミックスにより構成することができる。 A light emitting element mounting region 2 c for mounting a light emitting element is provided on the first main surface 2 a of the aluminum nitride substrate 2. On the first main surface 2a, a frame-shaped light reflecting layer 3 is provided so as to surround the light emitting element mounting region 2c. The light reflecting layer 3 is provided so as to cover the through holes 7a and 7b. More specifically, the light reflecting layer 3 is provided so as to seal the through holes 7a and 7b. In addition, the light reflection layer 3 can be comprised by glass ceramics, for example.
　本実施形態の発光素子搭載用基板１では、窒化アルミニウム基板２が用いられているので、放熱性に優れている。また、光反射層３を有しているので、高い反射率を有している。さらに、発光素子搭載用基板１では、窒化アルミニウム基板２のスルーホール７ａ，７ｂを覆うように光反射層３が設けられており、光反射層３によりスルーホール７ａ，７ｂが封止されている。そのため、発光素子を搭載して封止したときに気密性を高めることができる。この点については、後述の発光素子搭載パッケージの欄で詳細に説明する。 Since the aluminum nitride substrate 2 is used in the light emitting element mounting substrate 1 of this embodiment, the heat dissipation is excellent. Moreover, since it has the light reflection layer 3, it has a high reflectance. Further, in the light emitting element mounting substrate 1, the light reflecting layer 3 is provided so as to cover the through holes 7 a and 7 b of the aluminum nitride substrate 2, and the through holes 7 a and 7 b are sealed by the light reflecting layer 3. . Therefore, airtightness can be enhanced when the light emitting element is mounted and sealed. This will be described in detail in the section of the light emitting element mounting package described later.
　なお、図１に示すように、発光素子搭載用基板１では、光反射層３の内側面３ａが、窒化アルミニウム基板２に対して略垂直方向に延びるように形成されている。もっとも、本発明においては、図３に変形例で示すように、光反射層３の内側面３ａが、下面３ｃから上面３ｂに向かって拡がるテーパー形状を有していてもよい。 As shown in FIG. 1, in the light emitting element mounting substrate 1, the inner side surface 3 a of the light reflecting layer 3 is formed to extend in a substantially vertical direction with respect to the aluminum nitride substrate 2. However, in the present invention, as shown in a modified example in FIG. 3, the inner side surface 3a of the light reflecting layer 3 may have a tapered shape that expands from the lower surface 3c toward the upper surface 3b.
　また、本発明においては、光反射層３の内側面３ａ上に、光透過性の機能層が設けられていてもよい。機能層としては、例えば、傷や汚れ又は化学的腐食等に対する保護コーティング層、波長フィルター層、光拡散層、又は干渉層等が挙げられる。 In the present invention, a light-transmitting functional layer may be provided on the inner side surface 3 a of the light reflecting layer 3. Examples of the functional layer include a protective coating layer, a wavelength filter layer, a light diffusion layer, an interference layer, and the like against scratches, dirt, chemical corrosion, and the like.
　以下、発光素子搭載用基板１などの本発明の発光素子搭載用基板を構成する各部材の詳細を説明する。 Hereinafter, details of each member constituting the light emitting element mounting substrate of the present invention such as the light emitting element mounting substrate 1 will be described.
　窒化アルミニウム基板；
　窒化アルミニウム基板は、窒化アルミニウムにより構成されている。窒化アルミニウム基板には、イットリウム化合物や、タングステン化合物などの窒化アルミニウムを焼結する際の焼結助剤が含まれていてもよい。 Aluminum nitride substrate;
The aluminum nitride substrate is made of aluminum nitride. The aluminum nitride substrate may contain a sintering aid for sintering aluminum nitride such as an yttrium compound or a tungsten compound.
　光反射層；
　光反射層は、例えば、ガラスセラミックスにより構成することができる。ガラスセラミックスの材料としては、ガラス粉末及びセラミックス粉末の混合粉末、又は結晶性ガラス粉末を用いることができる。 Light reflecting layer;
The light reflection layer can be made of glass ceramics, for example. As a material of the glass ceramic, a mixed powder of glass powder and ceramic powder, or crystalline glass powder can be used.
　ガラス粉末としては、ＳｉＯ２―Ｂ３Ｏ３系ガラス、ＳｉＯ２－ＲＯ系ガラス（Ｒは、アルカリ土類金属を表す）、ＳｉＯ２－Ａｌ２Ｏ３系ガラス、ＳｉＯ２－ＺｎＯ系ガラス、ＳｉＯ２－Ｒ２Ｏ系ガラス（Ｒは、アルカリ金属を表す）、又はＳｉＯ２－ＴｉＯ２系ガラスなどを用いることができる。これらのガラス粉末は、単独で用いてもよく、複数を併用してもよい。 Examples of the glass powder include SiO 2 —B 3 O 3 glass, SiO 2 —RO glass (R represents an alkaline earth metal), SiO 2 —Al 2 O 3 glass, SiO 2 —ZnO glass, SiO 2 —R 2 O-based glass (R represents an alkali metal), SiO 2 —TiO 2 -based glass, or the like can be used. These glass powders may be used alone or in combination.
　セラミックス粉末としては、アルミナ、ジルコニア又はチタニアなどを用いることができる。これらのセラミックス粉末は、単独で用いてもよく、複数を併用してもよい。 As the ceramic powder, alumina, zirconia, titania or the like can be used. These ceramic powders may be used alone or in combination.
　機能層；
　機能層の材料としては、特に限定されず、ケイ酸系ガラス等のガラス、シリカ、アルミナ、ジルコニア、酸化タンタル、又は酸化ニオブ等の金属酸化物、ポリメチルメタクリレート、ポリカーボネート、又はポリアクリレート等の樹脂が挙げられる。これらの材料は、単独で用いてもよく、複数を併用してもよい。 Functional layer;
The material of the functional layer is not particularly limited, glass such as silicate glass, metal oxide such as silica, alumina, zirconia, tantalum oxide, or niobium oxide, resin such as polymethyl methacrylate, polycarbonate, or polyacrylate Is mentioned. These materials may be used alone or in combination.
　［発光素子搭載用基板の製造方法］
　以下、図４（ａ）～（ｄ）を参照して、発光素子搭載用基板１の製造方法について説明する。 [Method for manufacturing substrate for mounting light emitting element]
Hereinafter, a method for manufacturing the light-emitting element mounting substrate 1 will be described with reference to FIGS.
　まず、図４（ａ）に示すように、焼成前の窒化アルミニウム基板２Ａを用意する。続いて、図４（ｂ）に示すように、用意した焼成前の窒化アルミニウム基板２Ａにスルーホール７ａ，７ｂを形成する。スルーホール７ａ，７ｂの形成方法としては、特に限定されず、例えば、ドリルによる機械加工や、レーザー加工により形成することができる。 First, as shown in FIG. 4A, an aluminum nitride substrate 2A before firing is prepared. Subsequently, as shown in FIG. 4B, through holes 7a and 7b are formed in the prepared pre-fired aluminum nitride substrate 2A. The method for forming the through holes 7a and 7b is not particularly limited, and for example, the through holes 7a and 7b can be formed by machining with a drill or laser processing.
　次に、図４（ｃ）に示すように、配線電極４ａ，４ｂ、スルーホール電極５ａ，５ｂ及び端子電極６ａ，６ｂを形成する。 Next, as shown in FIG. 4C, wiring electrodes 4a and 4b, through- hole electrodes 5a and 5b, and terminal electrodes 6a and 6b are formed.
　各電極の形成方法としては、特に限定されないが、例えば、印刷により形成することができる。印刷に用いられるペーストとしては、特に限定されず、例えば、銀、銅、金、銀パラジウム合金、又は銀白金合金などのペーストを用いることができる。これらは、単独で用いてもよく複数を併用してもよい。 The formation method of each electrode is not particularly limited, but can be formed by printing, for example. It does not specifically limit as a paste used for printing, For example, pastes, such as silver, copper, gold | metal | money, a silver palladium alloy, or a silver platinum alloy, can be used. These may be used alone or in combination.
　なお、ペーストの印刷は、まず、スルーホール７ａ，７ｂ内に、スルーホール電極５ａ，５ｂ形成用ペーストを充填し、続いて、焼成前の窒化アルミニウム基板２Ａに、配線電極４ａ，４ｂ形成用ペースト及び端子電極６ａ，６ｂ形成用ペーストを印刷することにより行うことができる。 In the printing of the paste, first, the through- hole electrodes 5a and 5b are filled with the paste for forming the through- hole electrodes 5a and 5b. Subsequently, the paste for forming the wiring electrodes 4a and 4b is formed on the aluminum nitride substrate 2A before firing. And it can carry out by printing the paste for terminal electrode 6a, 6b formation.
　次に、焼成前の窒化アルミニウム基板２Ａ及び各ペーストを焼成する。それによって、窒化アルミニウム基板２、配線電極４ａ，４ｂ、スルーホール電極５ａ，５ｂ及び端子電極６ａ，６ｂを形成する。この際、各ペーストを構成する材料に、銅を用いる場合は、窒素雰囲気下で焼成する。他方、各ペーストを構成する材料に、金、銀、又は銀を含む合金を用いる場合は、大気中で焼成する。大気中で焼成する場合は、焼成温度を１２００℃以下にすることが好ましい。焼成温度が１２００℃を超えると、窒化アルミニウムの表面が酸化し、熱伝導率が低下する場合がある。なお、各ペーストの焼成は、後述の光反射層３を形成する際の焼成と同時に行ってもよい。 Next, the aluminum nitride substrate 2A and each paste before firing are fired. Thereby, the aluminum nitride substrate 2, the wiring electrodes 4a and 4b, the through- hole electrodes 5a and 5b, and the terminal electrodes 6a and 6b are formed. At this time, when copper is used as the material constituting each paste, the paste is fired in a nitrogen atmosphere. On the other hand, when gold, silver, or an alloy containing silver is used as the material constituting each paste, the paste is fired in the atmosphere. When firing in the air, the firing temperature is preferably 1200 ° C. or lower. When the firing temperature exceeds 1200 ° C., the surface of the aluminum nitride may be oxidized and the thermal conductivity may be lowered. In addition, you may perform baking of each paste simultaneously with baking at the time of forming the below-mentioned light reflection layer 3. FIG.
　また、各電極にメッキを行う場合は、例えば金メッキを施すことができる。メッキの方法としては、例えば、無電解メッキや、電解メッキが挙げられ、メッキ層の厚みにより適宜選択することができる。 Moreover, when plating each electrode, for example, gold plating can be performed. Examples of the plating method include electroless plating and electrolytic plating, and can be appropriately selected depending on the thickness of the plating layer.
　次に、図４（ｄ）に示すように、窒化アルミニウム基板２上に、光反射層３を形成する。この際、光反射層３は、スルーホール７ａ，７ｂを覆うように形成する。それによって、スルーホール７ａ，７ｂを封止し、発光素子搭載用基板１を得ることができる。 Next, as shown in FIG. 4D, a light reflecting layer 3 is formed on the aluminum nitride substrate 2. At this time, the light reflecting layer 3 is formed so as to cover the through holes 7a and 7b. Thereby, the through holes 7a and 7b are sealed, and the light emitting element mounting substrate 1 can be obtained.
　光反射層３は、ガラスセラミックスにより形成されることが好ましい。この場合、光の反射率をより一層高めることができ、窒化アルミニウム基板２との接着性をより一層高めることができる。 The light reflecting layer 3 is preferably formed of glass ceramics. In this case, the light reflectance can be further increased, and the adhesiveness with the aluminum nitride substrate 2 can be further increased.
　光反射層３を形成する方法としては、特に限定されないが、例えば、スクリーン印刷法やグリーンシート積層法などが挙げられる。 The method for forming the light reflecting layer 3 is not particularly limited, and examples thereof include a screen printing method and a green sheet laminating method.
　ガラスセラミックスを用いてスクリーン印刷法により光反射層３を形成する場合は、ガラスセラミックス粉末に、樹脂バインダー及び溶剤を添加して混練することにより作製した高粘性のペーストを、スクリーン印刷機を用いて窒化アルミニウム基板２に印刷することにより行うことができる。 When the light reflecting layer 3 is formed by a screen printing method using glass ceramics, a high viscosity paste prepared by adding a resin binder and a solvent to the glass ceramic powder and kneading is used with a screen printing machine. This can be done by printing on the aluminum nitride substrate 2.
　また、ガラスセラミックスを用いてグリーンシート積層法により光反射層３を形成する場合は、まず、ガラスセラミックス粉末に、樹脂バインダー、可塑剤及び溶剤を添加して混練することにより、スラリーを作製する。続いて、作製したスラリーをドクターブレード等のシート成形機を用いて、グリーンシートに成形する。次に、得られたグリーンシートを光反射層３の形状に打ち抜き、圧着により窒化アルミニウム基板２に積層させる。 Further, when the light reflecting layer 3 is formed using glass ceramics by the green sheet laminating method, first, a slurry is prepared by adding a resin binder, a plasticizer and a solvent to the glass ceramic powder and kneading them. Subsequently, the prepared slurry is formed into a green sheet using a sheet forming machine such as a doctor blade. Next, the obtained green sheet is punched into the shape of the light reflecting layer 3 and laminated on the aluminum nitride substrate 2 by pressure bonding.
　スクリーン印刷法及びグリーンシート積層法のいずれの方法においても、樹脂バインダーを用いているため、焼成は、脱樹脂バインダーと、ガラスセラミックス粉末を焼結させる本焼成との２段階で行なうことができる。 In any of the screen printing method and the green sheet laminating method, since a resin binder is used, the firing can be performed in two stages, that is, a resin removal binder and a main firing in which the glass ceramic powder is sintered.
　樹脂バインダーとして、アクリル樹脂及びブチラール樹脂を用いる場合は、例えば、４００℃～６００℃で脱樹脂バインダーを行うことができる。また、本焼成は、例えば、８５０℃～１０００℃で行なうことができる。 When an acrylic resin and a butyral resin are used as the resin binder, for example, the deresin binder can be performed at 400 ° C. to 600 ° C. Further, the main baking can be performed at, for example, 850 ° C. to 1000 ° C.
　なお、テーパー加工が必要な場合は、焼成前の光反射層３をドリル加工機等で斜めに削り取ることによって、テーパー形状に加工することができる。 In addition, when a taper process is required, it can process into a taper shape by scraping off the light reflection layer 3 before baking diagonally with a drilling machine etc.
　発光素子搭載用基板１の製造方法では、窒化アルミニウム基板２を用いているので、放熱性に優れている。また、光反射層３を設けているので、高い反射率を有している。さらに、発光素子搭載用基板１では、窒化アルミニウム基板２のスルーホール７ａ，７ｂを封止するように光反射層３を形成しているので、発光素子を搭載して封止したときに気密性を高めることができる。この点については、後述の発光素子搭載パッケージの欄で詳細に説明する。 In the manufacturing method of the light emitting element mounting substrate 1, since the aluminum nitride substrate 2 is used, heat dissipation is excellent. Moreover, since the light reflection layer 3 is provided, it has a high reflectance. Further, in the light emitting element mounting substrate 1, since the light reflecting layer 3 is formed so as to seal the through holes 7a and 7b of the aluminum nitride substrate 2, airtightness is achieved when the light emitting element is mounted and sealed. Can be increased. This will be described in detail in the section of the light emitting element mounting package described later.
　［発光素子搭載パッケージ］
　図５は、本発明の一実施形態に係る発光素子搭載パッケージを示す模式的断面図である。 [Light Emitting Device Package]
FIG. 5 is a schematic cross-sectional view showing a light emitting element mounting package according to an embodiment of the present invention.
　図５に示すように、発光素子搭載パッケージ２１は、発光素子搭載用基板１、ガラス蓋８、封着材料層９及び発光素子１０を備える。発光素子搭載用基板１は、上述した本発明の一実施形態に係る発光素子搭載用基板である。 As shown in FIG. 5, the light emitting element mounting package 21 includes a light emitting element mounting substrate 1, a glass lid 8, a sealing material layer 9, and a light emitting element 10. The light emitting element mounting substrate 1 is a light emitting element mounting substrate according to an embodiment of the present invention described above.
　発光素子１０は、発光素子搭載用基板１に搭載されている。発光素子１０は、発光素子搭載用基板１の配線電極４ａ，４ｂに接続されている。発光素子１０としては、深紫外線ＬＥＤや、青色ＬＥＤと黄色蛍光体を組み合わせた白色ＬＥＤが挙げられる。 The light emitting element 10 is mounted on the light emitting element mounting substrate 1. The light emitting element 10 is connected to the wiring electrodes 4 a and 4 b of the light emitting element mounting substrate 1. Examples of the light emitting element 10 include a deep ultraviolet LED and a white LED in which a blue LED and a yellow phosphor are combined.
　また、発光素子搭載用基板１における光反射層３の上面３ｂ上に、ガラス蓋８が配置されている。ガラス蓋８は、発光素子搭載パッケージ２１内を封止するための部材である。なお、光反射層３とガラス蓋８との間には、封着材料層９が設けられている。封着材料層９によって、光反射層３と、ガラス蓋８とが、接合されている。 Further, a glass lid 8 is disposed on the upper surface 3 b of the light reflecting layer 3 in the light emitting element mounting substrate 1. The glass lid 8 is a member for sealing the inside of the light emitting element mounting package 21. A sealing material layer 9 is provided between the light reflecting layer 3 and the glass lid 8. The light reflecting layer 3 and the glass lid 8 are joined by the sealing material layer 9.
　発光素子搭載パッケージ２１では、発光素子搭載用基板１に窒化アルミニウム基板２を用いているので放熱性に優れている。また、発光素子搭載用基板１に光反射層３を用いているので反射率が高められている。さらに、発光素子搭載パッケージ２１では、樹脂ではなくガラス蓋８により封止しているので、樹脂のように紫外線により劣化して気密性が低下することがない。また、窒化アルミニウム基板２のスルーホール７ａ，７ｂを覆うように光反射層３が設けられているので、スルーホール７ａ，７ｂが封止され、気密性がより一層高められている。さらに、発光素子搭載パッケージ２１では、構成材料が全て無機材料であるため、紫外線に対する耐久性に優れている。 In the light emitting element mounting package 21, since the aluminum nitride substrate 2 is used for the light emitting element mounting substrate 1, heat dissipation is excellent. Further, since the light reflecting layer 3 is used for the light emitting element mounting substrate 1, the reflectance is increased. Furthermore, since the light emitting element mounting package 21 is sealed with the glass lid 8 instead of the resin, it does not deteriorate due to ultraviolet rays and does not lower the airtightness like the resin. Further, since the light reflecting layer 3 is provided so as to cover the through holes 7a and 7b of the aluminum nitride substrate 2, the through holes 7a and 7b are sealed, and the airtightness is further enhanced. Furthermore, the light emitting element mounting package 21 is excellent in durability against ultraviolet rays because the constituent materials are all inorganic materials.
　なお、光反射層３によりスルーホール７ａ，７ｂを封止することで、気密性が高められる理由については以下のようにして説明することができる。 The reason why the airtightness is improved by sealing the through holes 7a and 7b with the light reflecting layer 3 can be explained as follows.
　図７は、比較例の発光素子搭載パッケージを示す模式的断面図である。 FIG. 7 is a schematic cross-sectional view showing a light emitting element mounting package of a comparative example.
　図７に示すように、比較例の発光素子搭載パッケージ１０１においては、平面視において、スルーホール１０７ａ，１０７ｂが、光反射層１０３と重なる位置に設けられていない。より具体的には、スルーホール１０７ａ，１０７ｂが、光反射層１０３によって封止されていない。そのため、発光素子搭載用基板１００をガラス蓋１０８によって封止した場合においても、スルーホール１０７ａ，１０７ｂを介して水分が浸入することがある。より具体的には、スルーホール１０７ａ，１０７ｂ内において、窒化アルミニウム基板１０２とスルーホール電極１０５ａ，１０５ｂとの界面から水分が浸入することがある。従って、比較例の発光素子搭載パッケージ１０１では、十分に気密性が高められていない。 As shown in FIG. 7, in the light emitting element mounting package 101 of the comparative example, the through holes 107a and 107b are not provided at positions overlapping the light reflecting layer 103 in plan view. More specifically, the through holes 107 a and 107 b are not sealed by the light reflecting layer 103. Therefore, even when the light emitting element mounting substrate 100 is sealed with the glass lid 108, moisture may enter through the through holes 107a and 107b. More specifically, moisture may enter from the interface between the aluminum nitride substrate 102 and the through- hole electrodes 105a and 105b in the through- holes 107a and 107b. Therefore, in the light emitting element mounting package 101 of the comparative example, the airtightness is not sufficiently improved.
　これに対して、本実施形態の発光素子搭載パッケージ２１では、スルーホール７ａ，７ｂが、光反射層３によって封止されている。そのため、スルーホール７ａ，７ｂを介した水分の浸入を、光反射層３によって防止することができる。より具体的に、窒化アルミニウム基板２とスルーホール電極５ａ，５ｂとの界面からの水分の浸入を光反射層３によって防止することができる。このように、発光素子搭載パッケージ２１では、光反射層３により水分の浸入を防止することができるので、気密性が高められている。 On the other hand, in the light emitting element mounting package 21 of the present embodiment, the through holes 7a and 7b are sealed by the light reflecting layer 3. Therefore, the light reflection layer 3 can prevent moisture from entering through the through holes 7a and 7b. More specifically, the light reflection layer 3 can prevent moisture from entering from the interface between the aluminum nitride substrate 2 and the through- hole electrodes 5a and 5b. Thus, in the light emitting element mounting package 21, since the light reflection layer 3 can prevent moisture from entering, the airtightness is improved.
　以下、発光素子搭載パッケージ２１の製造方法の一例について説明する。 Hereinafter, an example of a manufacturing method of the light emitting element mounting package 21 will be described.
　（製造方法）
　図６（ａ）～（ｄ）は、本発明の一実施形態に係る発光素子搭載パッケージの製造方法を説明するための模式的断面図である。 (Production method)
6A to 6D are schematic cross-sectional views for explaining a method for manufacturing a light emitting element mounting package according to an embodiment of the present invention.
　発光素子搭載パッケージ２１の製造方法では、まず、上述の方法で、図６（ａ）に示す発光素子搭載用基板１を用意する。続いて、図６（ｂ）に示すように、発光素子搭載用基板１上に、発光素子１０を搭載する。発光素子１０と発光素子搭載用基板１との接続は、例えば、半田ホールによる接続や、ワイヤーボンドによる接続によって行うことができる。 In the manufacturing method of the light emitting element mounting package 21, first, the light emitting element mounting substrate 1 shown in FIG. Subsequently, as illustrated in FIG. 6B, the light emitting element 10 is mounted on the light emitting element mounting substrate 1. The connection between the light emitting element 10 and the light emitting element mounting substrate 1 can be performed by, for example, a connection by a solder hole or a connection by a wire bond.
　次に、光反射層３の上面３ｂ上に、封着材料を印刷する。封着材料の印刷後、乾燥、熱処理して封着材料を焼結させ、図６（ｃ）に示す封着材料層９を形成する。なお、封着材料層９は、ガラス蓋８側に形成してもよく、あるいはガラス蓋８側及び光反射層３側の双方に形成してもよい。 Next, a sealing material is printed on the upper surface 3 b of the light reflecting layer 3. After the sealing material is printed, it is dried and heat-treated to sinter the sealing material to form a sealing material layer 9 shown in FIG. The sealing material layer 9 may be formed on the glass lid 8 side, or may be formed on both the glass lid 8 side and the light reflecting layer 3 side.
　次に、図６（ｄ）に示すように、光反射層３の上面３ｂ上において封着材料層９が設けられている部分に、ガラス蓋８を配置する。なお、ガラス蓋８は、平面視において、封着材料層９が設けられている部分と少なくとも一部が重なるように配置すればよい。もっとも、ガラス蓋８は、平面視において、封着材料層９が設けられている部分と完全に重なるように配置することが好ましい。 Next, as shown in FIG. 6 (d), a glass lid 8 is disposed on a portion where the sealing material layer 9 is provided on the upper surface 3 b of the light reflecting layer 3. Note that the glass lid 8 may be arranged so that at least a part thereof overlaps the portion where the sealing material layer 9 is provided in a plan view. But it is preferable to arrange | position the glass cover 8 so that it may overlap with the part in which the sealing material layer 9 is provided in planar view.
　次に、光反射層３の上面３ｂ上において封着材料層９を介してガラス蓋８を配置した状態で、レーザー光源からレーザーを照射し、封着材料層９を軟化させ、光反射層３及びガラス蓋８を接合させる。それによって、内部を気密封止して、発光素子搭載パッケージ２１を得る。この方法によれば、封着材料層９のみを局所的に加熱することが可能であることから、深紫外線ＬＥＤなどの耐熱性の低い発光素子１０を劣化させることなくパッケージ内を気密封止することができる。上記レーザーとしては、例えば、波長が、６００ｎｍ～１６００ｎｍのレーザーを用いることができる。 Next, in a state where the glass lid 8 is disposed on the upper surface 3b of the light reflecting layer 3 via the sealing material layer 9, a laser is irradiated from a laser light source to soften the sealing material layer 9, and the light reflecting layer 3 And the glass cover 8 is joined. Thereby, the inside is hermetically sealed, and the light emitting element mounting package 21 is obtained. According to this method, since only the sealing material layer 9 can be locally heated, the inside of the package is hermetically sealed without deteriorating the light-emitting element 10 having low heat resistance such as deep ultraviolet LED. be able to. As the laser, for example, a laser having a wavelength of 600 nm to 1600 nm can be used.
　以下、発光素子搭載パッケージ２１などの本発明の発光素子搭載パッケージを構成する各部材の詳細を説明する。 Hereinafter, details of each member constituting the light emitting element mounting package of the present invention such as the light emitting element mounting package 21 will be described.
　ガラス蓋；
　ガラス蓋を構成するガラスとしては、紫外線透過ガラスが好ましい。ガラス蓋を構成するガラスの具体例としては、ＳｉＯ２－Ｂ２Ｏ３－ＲＯ（ＲはＭｇ、Ｃａ、ＳｒまたはＢａ）系ガラス、ＳｉＯ２－Ｂ２Ｏ３－Ｒ’２Ｏ（Ｒ’はＬｉ、ＮａまたはＫａ）系ガラス、ＳｉＯ２－Ｂ２Ｏ３－ＲＯ－Ｒ’２Ｏ（Ｒ’はＬｉ、ＮａまたはＫａ）系ガラスなどが挙げられる。 Glass lid;
As the glass constituting the glass lid, ultraviolet transmissive glass is preferable. Specific examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ Includes Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na, or Ka) glass, and the like.
　封着材料層；
　封着材料層を形成するための封着材料は、Ｂｉ２Ｏ３系ガラス粉末、ＳｎＯ－Ｐ２Ｏ５系ガラス粉末、Ｖ２Ｏ５－ＴｅＯ２系ガラス粉末等の低融点の封着ガラスを含んでいることが好ましい。特に、レーザーを照射して封着する場合、封着材料をより一層短時間の加熱で軟化させる必要性とより一層接合強度を高める観点から、封着ガラスには、軟化点の低いビスマス系ガラス粉末を用いることがより好ましい。また、封着材料には、低膨張耐火性フィラーや、レーザー吸収材などが含まれていてもよい。低膨張耐火性フィラーとしては、例えば、コーディエライト、ウイレマイト、アルミナ、リン酸ジルコニウム系化合物、ジルコン、ジルコニア、酸化スズ、石英ガラス、β－石英固溶体、β－ユークリプタイト、スポジュメンが挙げられる。また、レーザー吸収材としては、例えば、Ｆｅ、Ｍｎ、Ｃｕなどから選ばれる少なくとも１種の金属または該金属を含む酸化物等の化合物が挙げられる。 Sealing material layer;
The sealing material for forming the sealing material layer is a low melting point sealing glass such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, or V 2 O 5 —TeO 2 glass powder. It is preferable that it contains. In particular, when sealing is performed by irradiating with a laser, the sealing glass has a low softening point in view of the necessity of softening the sealing material by heating for a shorter time and further enhancing the bonding strength. More preferably, powder is used. Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like. Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, β-quartz solid solution, β-eucryptite, and spodumene. Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
　以下、本発明について、具体的な実施例に基づいて、さらに詳細に説明するが、本発明は以下の実施例に何ら限定されるものではなく、その要旨を変更しない範囲において適宜変更して実施することが可能である。 Hereinafter, the present invention will be described in more detail on the basis of specific examples. However, the present invention is not limited to the following examples, and may be appropriately modified and implemented without departing from the scope of the present invention. Is possible.
　（実施例１）
　実施例１では、図５に示す発光素子搭載パッケージ２１を作製した。 (Example 1)
In Example 1, the light emitting element mounting package 21 shown in FIG. 5 was produced.
　より具体的には、まず、厚み０．３ｍｍの窒化アルミニウム基板２の２カ所に、半導体レーザーを用いて直径０．２ｍｍのスルーホール７ａ，７ｂを形成した。次に、メタルマスクを介して銀ペーストをスルーホール７ａ，７ｂ内に充填し、０．２ｍｍの配線幅で銀ペーストを印刷して、窒化アルミニウム基板２の第１及び第２の主面２ａ，２ｂで電気接続を行った。次に、第１の主面２ａに、配線電極４ａ，４ｂ形成用の銀ペーストを印刷した。また、第２の主面２ｂには、端子電極６ａ，６ｂ形成用の銀ペーストを印刷した。次に、各銀ペーストが塗布された窒化アルミニウム基板２を、大気中にて８５０℃の温度で、２０分焼成した。 More specifically, first, through holes 7a and 7b having a diameter of 0.2 mm were formed at two locations on the aluminum nitride substrate 2 having a thickness of 0.3 mm using a semiconductor laser. Next, a silver paste is filled into the through holes 7a and 7b through a metal mask, and the silver paste is printed with a wiring width of 0.2 mm, so that the first and second main surfaces 2a, 2a of the aluminum nitride substrate 2 are printed. Electrical connection was made in 2b. Next, a silver paste for forming the wiring electrodes 4a and 4b was printed on the first main surface 2a. Moreover, the silver paste for terminal electrode 6a, 6b formation was printed on the 2nd main surface 2b. Next, the aluminum nitride substrate 2 coated with each silver paste was baked at a temperature of 850 ° C. for 20 minutes in the air.
　次に、光反射層３となる厚み２００μｍのグリーンシートを所望のパターンに打ち抜き、６層積層した状態で１２００μｍの厚みで、窒化アルミニウム基板２に８０℃の温度で熱圧着した。この際、スルーホール７ａ，７ｂが、光反射層３により完全に封止される位置で熱圧着した。 Next, a 200 μm-thick green sheet to be the light reflecting layer 3 was punched into a desired pattern, and six layers were laminated and thermocompression bonded to the aluminum nitride substrate 2 at a temperature of 80 ° C. with a thickness of 1200 μm. At this time, thermocompression bonding was performed at a position where the through holes 7 a and 7 b were completely sealed by the light reflecting layer 3.
　次に、窒化アルミニウム基板２上にグリーンシートを形成した状態で、電気炉を用いて焼成させた。銀ペースト及びグリーンシートに含まれる樹脂バインダーを気化させるため、５００℃で２時間保持した後、銀とガラスセラミックスを焼結させるため、８５０℃で１時間保持した。 Next, a green sheet was formed on the aluminum nitride substrate 2 and fired using an electric furnace. In order to vaporize the resin binder contained in the silver paste and the green sheet, it was held at 500 ° C. for 2 hours, and then held at 850 ° C. for 1 hour in order to sinter silver and glass ceramics.
　次に、得られた発光素子搭載用基板１にニッケルメッキ及び金メッキを施し、発光素子１０としての深紫外線ＬＥＤを、半田ホールを用いて実装した。続いて、光反射層３の上面３ｂにガラスフリットを塗布し、ガラス蓋８としての紫外線透過ガラスを装着してレーザーシールを行うことにより、深紫外線ＬＥＤが実装された発光素子搭載パッケージ２１を得た。 Next, the obtained light emitting element mounting substrate 1 was subjected to nickel plating and gold plating, and a deep ultraviolet LED as the light emitting element 10 was mounted using a solder hole. Subsequently, a glass frit is applied to the upper surface 3b of the light reflecting layer 3, an ultraviolet ray transmitting glass as a glass lid 8 is attached, and laser sealing is performed to obtain a light emitting element mounting package 21 on which deep ultraviolet LEDs are mounted. It was.
　（比較例１）
　比較例１では、図７に示す発光素子搭載パッケージ１０１を作製した。 (Comparative Example 1)
In Comparative Example 1, the light emitting element mounting package 101 shown in FIG. 7 was manufactured.
　具体的には、図７に示すように、スルーホール１０７ａ，１０７ｂを光反射層１０３と重ならない位置で形成したこと以外は、実施例１と同様にして発光素子搭載パッケージ１０１を作製した。 Specifically, as shown in FIG. 7, a light emitting element mounting package 101 was produced in the same manner as in Example 1 except that the through holes 107a and 107b were formed at positions where they did not overlap the light reflecting layer 103.
　（評価）
　実施例１及び比較例１で得られた発光素子搭載パッケージ２１，１０１について、それぞれ、１２１℃、２気圧及び湿度１００％の条件で、圧力容器内にて２４時間保持した。その結果、実施例１では、変化が観察されなかったが、比較例１ではパッケージ内部に結露が観察された。これによって、実施例１の発光素子搭載パッケージ２１は、比較例１の発光素子搭載パッケージ１０１と比較して、気密性が高められていることを確認することができた。 (Evaluation)
The light emitting element mounting packages 21 and 101 obtained in Example 1 and Comparative Example 1 were held in a pressure vessel for 24 hours under the conditions of 121 ° C., 2 atm and 100% humidity, respectively. As a result, in Example 1, no change was observed, but in Comparative Example 1, condensation was observed inside the package. As a result, it was confirmed that the light-emitting element mounting package 21 of Example 1 had higher airtightness than the light-emitting element mounting package 101 of Comparative Example 1.
　１…発光素子搭載用基板
　２…窒化アルミニウム基板
　２Ａ…焼成前の窒化アルミニウム基板
　２ａ，２ｂ…第１，第２の主面
　２ｃ…発光素子搭載領域
　３…光反射層
　３ａ…内側面
　３ｂ，３ｃ…上面，下面
　４ａ，４ｂ…配線電極
　５ａ，５ｂ…スルーホール電極
　６ａ，６ｂ…端子電極
　７ａ，７ｂ…スルーホール
　８…ガラス蓋
　９…封着材料層
　１０…発光素子
　２１…発光素子搭載パッケージ DESCRIPTION OF SYMBOLS 1 ... Light emitting element mounting board | substrate 2 ... Aluminum nitride board | substrate 2A ... Aluminum nitride board | substrates 2a, 2b before baking ... 1st, 2nd main surface 2c ... Light emitting element mounting area 3 ... Light reflection layer 3a ... Inner side surface 3b, 3c ... Upper surface, lower surface 4a, 4b ... Wiring electrode 5a, 5b ... Through hole electrode 6a, 6b ... Terminal electrode 7a, 7b ... Through hole 8 ... Glass cover 9 ... Sealing material layer 10 ... Light emitting element 21 ... Light emitting element mounting package

Claims (4)

  1. 　発光素子を搭載するための発光素子搭載用基板であって、
    　互いに対向している第１及び第２の主面を有する、窒化アルミニウム基板と、
    　前記窒化アルミニウム基板の前記第１の主面上に設けられており、前記発光素子と接続するための配線電極と、
    　前記窒化アルミニウム基板の前記第２の主面上に設けられている、端子電極と、
    　前記窒化アルミニウム基板内に設けられており、前記配線電極と前記端子電極とを接続している、スルーホール電極と、
    　前記窒化アルミニウム基板の前記第１の主面上に設けられている、枠状の光反射層と、を備え、
    　前記第１の主面から前記第２の主面に至るように、前記窒化アルミニウム基板にスルーホールが設けられており、
    　前記スルーホール内に、前記スルーホール電極が配置されており、
    　前記スルーホールが、前記光反射層により封止されている、発光素子搭載用基板。     A light emitting element mounting substrate for mounting a light emitting element,
    An aluminum nitride substrate having first and second major surfaces facing each other;
    A wiring electrode provided on the first main surface of the aluminum nitride substrate and connected to the light emitting element;
    A terminal electrode provided on the second main surface of the aluminum nitride substrate;
    A through-hole electrode provided in the aluminum nitride substrate and connecting the wiring electrode and the terminal electrode;
    A frame-shaped light reflecting layer provided on the first main surface of the aluminum nitride substrate,
    A through hole is provided in the aluminum nitride substrate so as to reach the second main surface from the first main surface,
    The through-hole electrode is disposed in the through-hole,
    A substrate for mounting a light emitting element, wherein the through hole is sealed by the light reflecting layer.
  2. 　前記光反射層が、ガラスセラミックスにより構成されている、請求項１に記載の発光素子搭載用基板。 The light-emitting element mounting substrate according to claim 1, wherein the light reflecting layer is made of glass ceramics.
  3. 　請求項１又は２に記載の発光素子搭載用基板の製造方法であって、
    　前記窒化アルミニウム基板に、前記スルーホールを形成する工程と、
    　前記窒化アルミニウム基板において、前記スルーホール内に前記スルーホール電極を形成し、前記第１及び第２の主面上に、それぞれ、前記配線電極及び前記端子電極を形成する工程と、
    　前記窒化アルミニウム基板の前記第１の主面上において、前記スルーホールを封止するように前記光反射層を形成する工程と、
    を備える、発光素子搭載用基板の製造方法。     It is a manufacturing method of the light emitting element mounting substrate according to claim 1 or 2,
    Forming the through hole in the aluminum nitride substrate;
    Forming the through-hole electrode in the through-hole in the aluminum nitride substrate, and forming the wiring electrode and the terminal electrode on the first and second main surfaces, respectively;
    Forming the light reflecting layer on the first main surface of the aluminum nitride substrate so as to seal the through hole;
    A method for manufacturing a substrate for mounting a light emitting element.
  4. 　発光素子を内部に搭載して封止するための発光素子搭載パッケージであって、
    　請求項１又は２に記載の発光素子搭載用基板と、
    　前記発光素子搭載用基板に搭載されている、発光素子と、
    　前記発光素子搭載用基板における前記光反射層の上部に配置されており、前記発光素子搭載パッケージ内を封止している、ガラス蓋と、
    　前記光反射層と、前記ガラス蓋との間に配置されている、封着材料層と、
    を備える、発光素子搭載パッケージ。     A light emitting element mounting package for mounting and sealing a light emitting element inside,
    The light emitting element mounting substrate according to claim 1 or 2,
    A light emitting element mounted on the light emitting element mounting substrate;
    A glass lid that is disposed on the light reflecting layer of the light emitting element mounting substrate and seals the inside of the light emitting element mounting package;
    A sealing material layer disposed between the light reflecting layer and the glass lid;
    A light emitting element mounting package.
PCT/JP2017/021410 2016-09-23 2017-06-09 Light emitting element mounting substrate, method for manufacturing same, and light emitting element mounting package WO2018055846A1 (en)

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