WO2018054382A1 - Wafer clamping device - Google Patents

Wafer clamping device Download PDF

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Publication number
WO2018054382A1
WO2018054382A1 PCT/CN2017/103478 CN2017103478W WO2018054382A1 WO 2018054382 A1 WO2018054382 A1 WO 2018054382A1 CN 2017103478 W CN2017103478 W CN 2017103478W WO 2018054382 A1 WO2018054382 A1 WO 2018054382A1
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WO
WIPO (PCT)
Prior art keywords
clamping
wafer
driving member
section
sensor
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PCT/CN2017/103478
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French (fr)
Chinese (zh)
Inventor
王剑
许振杰
王同庆
李昆
路新春
Original Assignee
清华大学
天津华海清科机电科技有限公司
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Application filed by 清华大学, 天津华海清科机电科技有限公司 filed Critical 清华大学
Publication of WO2018054382A1 publication Critical patent/WO2018054382A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to the field of wafer technology, and in particular, to a wafer clamping device.
  • the wafer holding device is often one end rigidly fixed, and the other end is driven by a cylinder or the like to hold the wafer.
  • the wafer is held, one side of the wafer is placed on the step of the stationary end, and the wafer is slid to contact with the stationary end by the clamping action of the movable end, thereby clamping the wafer through the movable end and the stationary end.
  • the surface of the wafer will have sliding friction with the stepped surface of the stationary end, which will wear the surface of the wafer.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a wafer holding device that can avoid wafer surface wear.
  • a wafer clamping device includes: a first clamping member having a first clamping end and a first movable end; a second clamping member, the second clamping member Having a second clamping end and a second movable end; a driving member, the driving member being arranged to synchronously drive the first movable end and the second movable end to face or face the movement, wherein the first clamping The end is disposed opposite the second clamping end for clamping the wafer.
  • the two clamping ends can synchronously move and hold the wafer, thereby preventing the wafer from coming into contact with other surfaces. Avoid wafer surface wear and improve wafer quality.
  • the wafer chucking apparatus may further have the following technical features:
  • the first clamping member and the second clamping member each include: a cantilever and a jaw, one end of the cantilever being configured as a movable end and the other end being mounted with a jaw,
  • the jaws are configured as grip ends.
  • a groove is formed in a side of the jaw facing the wafer.
  • the groove is configured as a V-shaped groove.
  • the cross-section of the sidewall of the groove is configured as a circular arc or a diagonal line, and the intersection of the two sidewalls is a curve.
  • the cantilever includes: a sliding segment, a connecting segment and a clamping segment, the sliding segment being coupled to the drive member, the connecting segment being coupled to the sliding segment and the clamping Between the segments, the jaws are mounted on the clamping section.
  • the wafer holding device further includes: a first sensor, the first sensor Mounted on the driving member and used to detect the release position of the first clamping end and the second clamping end to release the wafer.
  • the wafer holding apparatus further includes: a second sensor mounted on the driving member and configured to detect the first clamping end and the second The clamping end clamps the first clamping position of the wafer.
  • the wafer holding apparatus further includes: a third sensor mounted on the driving member and configured to detect the first clamping end and the second The clamping end does not clamp the second clamping position of the wafer.
  • the drive member is a motor, a cylinder or a pawl.
  • FIG. 1 is a schematic view of a wafer holding device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of a wafer holding device holding two wafers at a clamping end thereof according to an embodiment of the invention.
  • Wafer clamping device 100 Wafer clamping device 100;
  • a first clamping member 10 a first clamping end 11; a first movable end 12;
  • a second clamping member 20 a second clamping end 21; a second movable end 22;
  • Groove 40 cantilever 50; sliding section 51; connecting section 52; clamping section 53;
  • a first sensor 60 a second sensor 70; a third sensor 80;
  • a wafer holding apparatus 100 may be described in detail below with reference to the accompanying drawings, which may be used to hold a wafer 200 so that the wafer 200 is in a plurality of spaced process chambers. Process processing.
  • the wafer chucking apparatus 100 may include a first holder 10, a second holder 20, and a driving member 30.
  • the first clamping member 10 has a first clamping end 11 and a first movable end 12
  • the second clamping member 20 has a second clamping end 21 and a second movable end 22, and the driving member 30 is disposed.
  • the first movable end 12 and the second movable end 22 are synchronously driven to move toward or away from each other, wherein the first clamping end 11 and the second clamping end 21 are disposed opposite to each other for holding the wafer 200.
  • the driving member 30 can synchronously drive the movement of the first movable end 12 and the second movable end 22, when When the first movable end 12 and the second movable end 22 move toward each other, the first clamping end 11 and the second clamping end 21 are close to each other, and at this time, the wafer clamping device 100 can be used to clamp the wafer 200.
  • the wafer clamping device 100 can release the wafer 200.
  • the first clamping member 10 and the second clamping member 20 move synchronously until the first clamping end 11 and the second clamping end 21 are clamped together. Holding the wafer 200, the wafer 200 can be prevented from coming into contact with other surfaces, the wear of the surface of the wafer 200 can be avoided, and the quality of the wafer 200 can be improved.
  • the wafer clamping device 100 of the embodiment of the present invention by providing the first clamping member 10 and the second clamping member 20, the wafer 200 can be held in synchronization, so that the wafer 200 can be prevented from coming into contact with other surfaces.
  • the wear of the surface of the wafer 200 can be avoided, and the quality of the wafer 200 can be improved.
  • both the first clamping member 10 and the second clamping member 20 may include: a cantilever 50 and a jaw, one end of the cantilever 50 being configured as a movable end, and the cantilever 50 The other end is fitted with a jaw, and the jaw is configured as a clamping end.
  • the driving member 30 can drive the clamping members 50 of the first clamping member 10 and the second clamping member 20 such that the jaws disposed on the two cantilevers 50 move in opposite or opposite directions to achieve the clamping of the wafer 200. Hold or release.
  • the structures of the first clamping member 10 and the second clamping member 20 can be the same, so that the structure of the wafer clamping device 100 can be simplified, and the synchronization effect of the wafer clamping device 100 can be better.
  • a groove 40 may be formed on a side of the jaw facing the wafer 200.
  • the edge of the wafer 200 can extend into the recess 40, and the sidewall of the recess 40 can stop against the edge of the wafer 200 when the sidewalls of the two recesses 40 are synchronized against the edge of the wafer 200.
  • the wafer holding device 100 holds the wafer 200.
  • the recess 40 can be configured as a V-shaped slot. It can be understood that the contact area between the groove wall of the V-shaped groove and the surface and the edge of the wafer 200 is small, and the surface of the wafer 200 can be prevented from being worn at least to some extent, and the quality of the wafer 200 can be improved.
  • the cross section of the side wall of the groove 40 may be configured as a circular arc, and the circular arc may protrude toward the direction of the wafer 200.
  • the circular arc may also face away from the crystal.
  • the direction of the circle 200 is convex, and the intersection of the two side walls can be curved.
  • the interface of the side walls of the recess 40 may also be configured as a diagonal line.
  • the two sidewalls of the recess 40 can be symmetrically disposed with respect to the intersection of the two sidewalls, which can ensure the reliability of the wafer clamping device 100 for clamping the wafer 200, and can also be reduced at least to some extent.
  • the contact area of the groove 40 with the wafer 200 can be symmetrically disposed with respect to the intersection of the two sidewalls, which can ensure the reliability of the wafer clamping device 100 for clamping the wafer 200, and can also be reduced at least to some extent.
  • the contact area of the groove 40 with the wafer 200 can be symmetrically disposed with respect to the intersection of the two sidewalls, which can ensure the reliability of the wafer clamping device 100 for clamping the wafer 200, and can also be reduced at least to some extent.
  • the cantilever 50 can include a sliding section 51, a connecting section 52 and a clamping section 53, the sliding section 51 being coupled to the driving member 30, and the connecting section 52 being coupled to the sliding section 51. Between the clamping section 53, a clamping jaw is mounted on the clamping section 53.
  • the sliding section 51 can extend in the left-right direction and slide One end of the movable section 51 is connected with the driving member 30 to form a movable end, the clamping section 53 extends in the up and down direction, the clamping jaws are disposed on the clamping section 53, and the clamping jaws extend in the up and down direction to facilitate the clamping of the wafer 200.
  • the wafer clamping device 100 may further include: a first sensor 60, the first sensor 60 is mounted on the driving member 30, and the first sensor 60 is configured to detect the first clamping end 11 And the second clamping end 21 releases the release position of the wafer 200.
  • the first sensor 60 By mounting the first sensor 60 on the driving member 30, the mounting reliability of the first sensor 60 can be ensured.
  • the first sensor 60 By detecting the release position of the two clamping ends to release the wafer 200 by the first sensor 60, it can be determined whether the position where the wafer 200 is placed meets the requirements, thereby ensuring that the wafer 200 is placed in the correct position in time and accurately, and then The operational reliability of the wafer holding apparatus 100 can be improved.
  • the wafer clamping device 100 may further include: a second sensor 70, the second sensor 70 is mounted on the driving member 30, and the second sensor 70 is configured to detect the first clamping end 11 And the second clamping end 21 clamps the first clamping position of the wafer 200.
  • the second sensor 70 By arranging the second sensor 70 on the driving member 30, the mounting reliability of the second sensor 70 can be ensured.
  • the second sensor 70 it can be accurately determined whether the wafer clamping device 100 has clamped the wafer 200, and confirming whether the next step can be performed, thereby ensuring the wafer clamping device 100.
  • the operational reliability and the efficiency of the wafer holding apparatus 100 are improved.
  • the wafer clamping device 100 may further include: a third sensor 80, the third sensor 80 is mounted on the driving member 30, and the third sensor 80 is configured to detect the first clamping end 11 And the second clamping end 21 does not grip the second clamping position of the wafer 200.
  • the third sensor 80 By mounting the third sensor 80 on the driving member 30, the mounting reliability of the third sensor 80 can be ensured.
  • the first sensor 60, the second sensor 70, and the third sensor 80 may be spaced apart from each other on the driving member 30, so that the first sensor 60, the second sensor 70, and the third sensor 80 may be arranged reasonably, and The space utilization of the drive member 30 can be made reasonable.
  • the third sensor 80 By detecting the second clamping position by the third sensor 80, it can be determined whether the first clamping end 11 and the second clamping end 21 return to the first sensor 60, the second sensor 70, and the third when the wafer 200 is not clamped.
  • the sensor 80 is configured to facilitate the wafer holding apparatus 100 to hold the wafer 200 next time.
  • the third sensor 80 can also cooperate with the second sensor 70 to improve the accuracy of determining that the wafer clamping device 100 holds the wafer 200, and can improve the operational reliability of the wafer clamping device 100.
  • the drive member 30 can be a motor, a cylinder or a pawl.
  • the air gripper may have three end portions, one end portion is fixed, and the other two end portions are respectively movable, and the two movable end portions are respectively opposite to the two movable ends to drive the two movable ends to face or face each other. Movement, the first sensor 60, the second sensor 70, and the third sensor 80 are mounted on the fixed ends, respectively.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A wafer clamping device (100) comprising: a first clamping member (10) having a first clamping end (11) and a first moving end (12); a second clamping member (20) having a second clamping end (21) and a second moving end (22); a drive member (30) configured to synchronously drive the first moving end (12) and the second moving end (22) to move toward or against each other. The first clamping end (11) and the second clamping end (21) are provided opposite to each other to clamp a wafer (200). Due to the configuration of the first clamping member (10) and the second clamping member (20), the two clamping ends can synchronously move to clamp the wafer (200), so as to prevent the wafer (200) from contacting other surfaces, thereby preventing the abrasion of the surface of the wafer (200) and improving the quality of the wafer (200).

Description

晶圆夹持装置Wafer holding device 技术领域Technical field
本发明涉及晶圆技术领域，尤其涉及一种晶圆夹持装置。The present invention relates to the field of wafer technology, and in particular, to a wafer clamping device.
背景技术Background technique
相关技术中，晶圆夹持装置多为一端刚性固定，另一端依靠气缸等驱动夹持晶圆的装置。在夹持晶圆时，晶圆一侧放在静止端的台阶上，通过活动端的夹持动作，使晶圆滑至与静止端接触，从而通过活动端和静止端共同作用夹持晶圆。但是在整个夹持过程中晶圆表面会与静止端的台阶面产生滑动摩擦，磨损晶圆表面。In the related art, the wafer holding device is often one end rigidly fixed, and the other end is driven by a cylinder or the like to hold the wafer. When the wafer is held, one side of the wafer is placed on the step of the stationary end, and the wafer is slid to contact with the stationary end by the clamping action of the movable end, thereby clamping the wafer through the movable end and the stationary end. However, during the entire clamping process, the surface of the wafer will have sliding friction with the stepped surface of the stationary end, which will wear the surface of the wafer.
发明内容Summary of the invention
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种可以避免晶圆表面磨损的晶圆夹持装置。The present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, the present invention proposes a wafer holding device that can avoid wafer surface wear.
根据本发明的晶圆夹持装置，包括：第一夹持件，所述第一夹持件具有第一夹持端和第一活动端；第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；驱动件，所述驱动件设置成同步驱动所述第一活动端和所述第二活动端相向或背向运动，其中，所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。A wafer clamping device according to the present invention includes: a first clamping member having a first clamping end and a first movable end; a second clamping member, the second clamping member Having a second clamping end and a second movable end; a driving member, the driving member being arranged to synchronously drive the first movable end and the second movable end to face or face the movement, wherein the first clamping The end is disposed opposite the second clamping end for clamping the wafer.
根据本发明的晶圆夹持装置，通过设置第一夹持件和第二夹持件，两个夹持端可以同步运动夹持住晶圆，从而可以避免晶圆与其他表面相接触，可以避免晶圆表面的磨损，可以提高晶圆的品质。According to the wafer clamping device of the present invention, by providing the first clamping member and the second clamping member, the two clamping ends can synchronously move and hold the wafer, thereby preventing the wafer from coming into contact with other surfaces. Avoid wafer surface wear and improve wafer quality.
另外，根据本发明的晶圆夹持装置还可以具有以下技术特征：In addition, the wafer chucking apparatus according to the present invention may further have the following technical features:
在本发明的一些示例中，所述第一夹持件和所述第二夹持件均包括：悬臂和夹爪，所述悬臂的一端构造为活动端且另一端安装有夹爪，所述夹爪构造为夹持端。In some examples of the invention, the first clamping member and the second clamping member each include: a cantilever and a jaw, one end of the cantilever being configured as a movable end and the other end being mounted with a jaw, The jaws are configured as grip ends.
在本发明的一些示例中，所述夹爪的朝向所述晶圆的侧面上开设有凹槽。In some examples of the invention, a groove is formed in a side of the jaw facing the wafer.
在本发明的一些示例中，所述凹槽构造为V形槽。In some examples of the invention, the groove is configured as a V-shaped groove.
在本发明的一些示例中，所述凹槽的侧壁的截面构造为圆弧或斜线，所述两条侧壁的交线为曲线。In some examples of the invention, the cross-section of the sidewall of the groove is configured as a circular arc or a diagonal line, and the intersection of the two sidewalls is a curve.
在本发明的一些示例中，所述悬臂包括：滑动段、连接段和夹持段，所述滑动段连接在所述驱动件上，所述连接段连接在所述滑动段和所述夹持段之间，所述夹持段上安装有所述夹爪。In some examples of the invention, the cantilever includes: a sliding segment, a connecting segment and a clamping segment, the sliding segment being coupled to the drive member, the connecting segment being coupled to the sliding segment and the clamping Between the segments, the jaws are mounted on the clamping section.
在本发明的一些示例中，所述晶圆夹持装置还包括：第一传感器，所述第一传感器安 装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端松开所述晶圆的松开位置。In some examples of the present invention, the wafer holding device further includes: a first sensor, the first sensor Mounted on the driving member and used to detect the release position of the first clamping end and the second clamping end to release the wafer.
在本发明的一些示例中，所述晶圆夹持装置还包括：第二传感器，所述第二传感器安装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端夹紧所述晶圆的第一夹紧位置。In some examples of the present invention, the wafer holding apparatus further includes: a second sensor mounted on the driving member and configured to detect the first clamping end and the second The clamping end clamps the first clamping position of the wafer.
在本发明的一些示例中，所述晶圆夹持装置还包括：第三传感器，所述第三传感器安装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端未夹持所述晶圆的第二夹紧位置。In some examples of the present invention, the wafer holding apparatus further includes: a third sensor mounted on the driving member and configured to detect the first clamping end and the second The clamping end does not clamp the second clamping position of the wafer.
在本发明的一些示例中，所述驱动件为电机、气缸或气爪。In some examples of the invention, the drive member is a motor, a cylinder or a pawl.
附图说明DRAWINGS
图1是根据本发明实施例的晶圆夹持装置的示意图；1 is a schematic view of a wafer holding device according to an embodiment of the present invention;
图2是根据本发明实施例的晶圆夹持装置的两个夹持端夹持晶圆的示意图。2 is a schematic view of a wafer holding device holding two wafers at a clamping end thereof according to an embodiment of the invention.
附图标记：Reference mark:
晶圆夹持装置100； Wafer clamping device 100;
第一夹持件10；第一夹持端11；第一活动端12；a first clamping member 10; a first clamping end 11; a first movable end 12;
第二夹持件20；第二夹持端21；第二活动端22；a second clamping member 20; a second clamping end 21; a second movable end 22;
驱动件30； Drive member 30;
凹槽40；悬臂50；滑动段51；连接段52；夹持段53； Groove 40; cantilever 50; sliding section 51; connecting section 52; clamping section 53;
第一传感器60；第二传感器70；第三传感器80；a first sensor 60; a second sensor 70; a third sensor 80;
晶圆200。Wafer 200.
具体实施方式detailed description
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.
下面参考附图详细描述根据本发明实施例的晶圆夹持装置100，该晶圆夹持装置100可以用于夹持晶圆200，以便于晶圆200在多个间隔开的工艺腔室之间进行工艺处理。A wafer holding apparatus 100 according to an embodiment of the present invention may be described in detail below with reference to the accompanying drawings, which may be used to hold a wafer 200 so that the wafer 200 is in a plurality of spaced process chambers. Process processing.
根据本发明实施例的晶圆夹持装置100可以包括：第一夹持件10、第二夹持件20和驱动件30。如图1所示，第一夹持件10具有第一夹持端11和第一活动端12，第二夹持件20具有第二夹持端21和第二活动端22，驱动件30设置成同步驱动第一活动端12和第二活动端22相向或背向运动，其中，第一夹持端11与第二夹持端21相对设置以用于夹持晶圆200。可以理解的是，驱动件30可以同步驱动第一活动端12和第二活动端22运动，当 第一活动端12和第二活动端22相向运动时，第一夹持端11和第二夹持端21彼此靠近，此时，晶圆夹持装置100可以用于夹持晶圆200。当第一活动端12和第二活动端22背向运动时，第一活动端12和第二活动端22彼此远离对方，此时，晶圆夹持装置100可以松开晶圆200。The wafer chucking apparatus 100 according to an embodiment of the present invention may include a first holder 10, a second holder 20, and a driving member 30. As shown in FIG. 1, the first clamping member 10 has a first clamping end 11 and a first movable end 12, and the second clamping member 20 has a second clamping end 21 and a second movable end 22, and the driving member 30 is disposed. The first movable end 12 and the second movable end 22 are synchronously driven to move toward or away from each other, wherein the first clamping end 11 and the second clamping end 21 are disposed opposite to each other for holding the wafer 200. It can be understood that the driving member 30 can synchronously drive the movement of the first movable end 12 and the second movable end 22, when When the first movable end 12 and the second movable end 22 move toward each other, the first clamping end 11 and the second clamping end 21 are close to each other, and at this time, the wafer clamping device 100 can be used to clamp the wafer 200. When the first movable end 12 and the second movable end 22 move back, the first movable end 12 and the second movable end 22 are away from each other, and at this time, the wafer clamping device 100 can release the wafer 200.
由此，当晶圆夹持装置100需要夹持晶圆200时，第一夹持件10和第二夹持件20同步运动，直至第一夹持端11和第二夹持端21共同夹持住晶圆200，从而可以避免晶圆200与其他表面相接触，可以避免晶圆200表面的磨损，可以提高晶圆200的品质。Therefore, when the wafer clamping device 100 needs to clamp the wafer 200, the first clamping member 10 and the second clamping member 20 move synchronously until the first clamping end 11 and the second clamping end 21 are clamped together. Holding the wafer 200, the wafer 200 can be prevented from coming into contact with other surfaces, the wear of the surface of the wafer 200 can be avoided, and the quality of the wafer 200 can be improved.
根据本发明实施例的晶圆夹持装置100，通过设置第一夹持件10和第二夹持件20，可以同步运动夹持住晶圆200，从而可以避免晶圆200与其他表面相接触，可以避免晶圆200表面的磨损，可以提高晶圆200的品质。According to the wafer clamping device 100 of the embodiment of the present invention, by providing the first clamping member 10 and the second clamping member 20, the wafer 200 can be held in synchronization, so that the wafer 200 can be prevented from coming into contact with other surfaces. The wear of the surface of the wafer 200 can be avoided, and the quality of the wafer 200 can be improved.
根据本发明的一个优选实施例，如图1所示，第一夹持件10和第二夹持件20均可以包括：悬臂50和夹爪，悬臂50的一端构造为活动端，而且悬臂50的另一端安装有夹爪，夹爪构造为夹持端。换言之，驱动件30可以通过驱动第一夹持件10和第二夹持件20的悬臂50以使得设置在两个悬臂50上的夹爪同步相向或者背向运动，以实现晶圆200的夹持或者松开。优选地，第一夹持件10和第二夹持件20的结构可以相同，从而可以简化晶圆夹持装置100的结构，可以使得晶圆夹持装置100的同步效果较好。According to a preferred embodiment of the present invention, as shown in FIG. 1, both the first clamping member 10 and the second clamping member 20 may include: a cantilever 50 and a jaw, one end of the cantilever 50 being configured as a movable end, and the cantilever 50 The other end is fitted with a jaw, and the jaw is configured as a clamping end. In other words, the driving member 30 can drive the clamping members 50 of the first clamping member 10 and the second clamping member 20 such that the jaws disposed on the two cantilevers 50 move in opposite or opposite directions to achieve the clamping of the wafer 200. Hold or release. Preferably, the structures of the first clamping member 10 and the second clamping member 20 can be the same, so that the structure of the wafer clamping device 100 can be simplified, and the synchronization effect of the wafer clamping device 100 can be better.
可选地，如图2所示，夹爪的朝向晶圆200的侧面上可以开设有凹槽40。晶圆200的边缘可以伸入到凹槽40内，凹槽40的侧壁可以止抵住晶圆200的边缘上，当两个凹槽40的侧壁同步止抵住晶圆200的边缘时，晶圆夹持装置100夹持住晶圆200。Optionally, as shown in FIG. 2, a groove 40 may be formed on a side of the jaw facing the wafer 200. The edge of the wafer 200 can extend into the recess 40, and the sidewall of the recess 40 can stop against the edge of the wafer 200 when the sidewalls of the two recesses 40 are synchronized against the edge of the wafer 200. The wafer holding device 100 holds the wafer 200.
优选地，如图2所示，凹槽40可以构造为V形槽。可以理解的是，V形槽的槽壁与晶圆200的表面和边部的接触面积较小，可以至少一定程度上防止晶圆200的表面磨损，可以晶圆200的品质。Preferably, as shown in FIG. 2, the recess 40 can be configured as a V-shaped slot. It can be understood that the contact area between the groove wall of the V-shaped groove and the surface and the edge of the wafer 200 is small, and the surface of the wafer 200 can be prevented from being worn at least to some extent, and the quality of the wafer 200 can be improved.
根据本发明的一个具体实施例，如图2所示，凹槽40的侧壁的截面可以构造为圆弧，圆弧可以朝向晶圆200的方向凸出，当然，圆弧还可以朝向背离晶圆200的方向凸出，两条侧壁的交线可以为曲线。当然，本发明并不限于此，在本发明未示出的实施例中，凹槽40的侧壁的界面还可以构造为斜线。According to a specific embodiment of the present invention, as shown in FIG. 2, the cross section of the side wall of the groove 40 may be configured as a circular arc, and the circular arc may protrude toward the direction of the wafer 200. Of course, the circular arc may also face away from the crystal. The direction of the circle 200 is convex, and the intersection of the two side walls can be curved. Of course, the invention is not limited thereto, and in an embodiment not shown in the present invention, the interface of the side walls of the recess 40 may also be configured as a diagonal line.
其中，优选地，凹槽40的两个侧壁可以关于两条侧壁的交线对称设置，可以保证晶圆夹持装置100夹持晶圆200的可靠性，还可以至少一定程度上减小凹槽40与晶圆200的接触面积。Preferably, the two sidewalls of the recess 40 can be symmetrically disposed with respect to the intersection of the two sidewalls, which can ensure the reliability of the wafer clamping device 100 for clamping the wafer 200, and can also be reduced at least to some extent. The contact area of the groove 40 with the wafer 200.
下面详细描述一种可选的悬臂50的布置形式，悬臂50可以包括：滑动段51、连接段52和夹持段53，滑动段51连接在驱动件30上，连接段52连接在滑动段51和夹持段53之间，夹持段53上安装有夹爪。如图1所示，滑动段51可以在左右方向上延伸，而且滑 动段51的一端与驱动件30相连以构成活动端，夹持段53在上下方向上延伸，夹爪设置在夹持段53上，而且夹爪在上下方向上延伸，以便于夹持晶圆200。An optional arrangement of the cantilever 50 can be described in detail below. The cantilever 50 can include a sliding section 51, a connecting section 52 and a clamping section 53, the sliding section 51 being coupled to the driving member 30, and the connecting section 52 being coupled to the sliding section 51. Between the clamping section 53, a clamping jaw is mounted on the clamping section 53. As shown in FIG. 1, the sliding section 51 can extend in the left-right direction and slide One end of the movable section 51 is connected with the driving member 30 to form a movable end, the clamping section 53 extends in the up and down direction, the clamping jaws are disposed on the clamping section 53, and the clamping jaws extend in the up and down direction to facilitate the clamping of the wafer 200.
为了检测晶圆夹持装置100的使用状态，下面详细描述一种可选的传感器的布置形式。In order to detect the state of use of the wafer holding apparatus 100, an alternative arrangement of sensors will be described in detail below.
可选地，如图1所示，晶圆夹持装置100还可以包括：第一传感器60，第一传感器60安装在驱动件30上，而且第一传感器60用于检测第一夹持端11和第二夹持端21松开晶圆200的松开位置。通过将第一传感器60安装在驱动件30上，可以保证第一传感器60的安装可靠性。而且通过第一传感器60检测两个夹持端松开晶圆200的松开位置，可以判断晶圆200放置的位置是否符合要求，从而可以保证晶圆200及时且准确地放置在正确位置，进而可以提高晶圆夹持装置100的工作可靠性。Optionally, as shown in FIG. 1 , the wafer clamping device 100 may further include: a first sensor 60, the first sensor 60 is mounted on the driving member 30, and the first sensor 60 is configured to detect the first clamping end 11 And the second clamping end 21 releases the release position of the wafer 200. By mounting the first sensor 60 on the driving member 30, the mounting reliability of the first sensor 60 can be ensured. Moreover, by detecting the release position of the two clamping ends to release the wafer 200 by the first sensor 60, it can be determined whether the position where the wafer 200 is placed meets the requirements, thereby ensuring that the wafer 200 is placed in the correct position in time and accurately, and then The operational reliability of the wafer holding apparatus 100 can be improved.
可选地，如图1所示，晶圆夹持装置100还可以包括：第二传感器70，第二传感器70安装在驱动件30上，而且第二传感器70用于检测第一夹持端11和第二夹持端21夹紧晶圆200的第一夹紧位置。通过将第二传感器70设置在驱动件30上，可以保证第二传感器70的安装可靠性。而且通过第二传感器70检测第一夹紧位置，可以准确地判断晶圆夹持装置100是否已经夹持住晶圆200，以及确认是否可以下一步操作，从而可以保证晶圆夹持装置100的工作可靠性，以及提高晶圆夹持装置100的工作效率。Optionally, as shown in FIG. 1, the wafer clamping device 100 may further include: a second sensor 70, the second sensor 70 is mounted on the driving member 30, and the second sensor 70 is configured to detect the first clamping end 11 And the second clamping end 21 clamps the first clamping position of the wafer 200. By arranging the second sensor 70 on the driving member 30, the mounting reliability of the second sensor 70 can be ensured. Moreover, by detecting the first clamping position by the second sensor 70, it can be accurately determined whether the wafer clamping device 100 has clamped the wafer 200, and confirming whether the next step can be performed, thereby ensuring the wafer clamping device 100. The operational reliability and the efficiency of the wafer holding apparatus 100 are improved.
可选地，如图1所示，晶圆夹持装置100还可以包括：第三传感器80，第三传感器80安装在驱动件30上，而且第三传感器80用于检测第一夹持端11和第二夹持端21未夹持晶圆200的第二夹紧位置。通过将第三传感器80安装在驱动件30上，可以保证第三传感器80的安装可靠性。需要说明的是，第一传感器60、第二传感器70和第三传感器80可以在驱动件30上彼此间隔开设置，可以使得第一传感器60、第二传感器70和第三传感器80布置合理，以及可以使得驱动件30的空间利用合理。Optionally, as shown in FIG. 1, the wafer clamping device 100 may further include: a third sensor 80, the third sensor 80 is mounted on the driving member 30, and the third sensor 80 is configured to detect the first clamping end 11 And the second clamping end 21 does not grip the second clamping position of the wafer 200. By mounting the third sensor 80 on the driving member 30, the mounting reliability of the third sensor 80 can be ensured. It should be noted that the first sensor 60, the second sensor 70, and the third sensor 80 may be spaced apart from each other on the driving member 30, so that the first sensor 60, the second sensor 70, and the third sensor 80 may be arranged reasonably, and The space utilization of the drive member 30 can be made reasonable.
通过第三传感器80检测第二夹紧位置，可以判断第一夹持端11和第二夹持端21在未夹持晶圆200时是否回复到第一传感器60、第二传感器70和第三传感器80，以便于晶圆夹持装置100下次夹持晶圆200。而且第三传感器80还可以与第二传感器70相配合，可以提高判断晶圆夹持装置100夹持晶圆200的准确性，可以提高晶圆夹持装置100的工作可靠性。By detecting the second clamping position by the third sensor 80, it can be determined whether the first clamping end 11 and the second clamping end 21 return to the first sensor 60, the second sensor 70, and the third when the wafer 200 is not clamped. The sensor 80 is configured to facilitate the wafer holding apparatus 100 to hold the wafer 200 next time. Moreover, the third sensor 80 can also cooperate with the second sensor 70 to improve the accuracy of determining that the wafer clamping device 100 holds the wafer 200, and can improve the operational reliability of the wafer clamping device 100.
可选地，驱动件30可以为电机、气缸或者气爪。下面以气爪进行说明，气爪可以具有三个端部，一个端部固定，另外两个端部分别活动，两个活动端部分别与两个活动端以驱动两个活动端相向或者背向运动，第一传感器60、第二传感器70和第三传感器80分别安装在固定端部上。Alternatively, the drive member 30 can be a motor, a cylinder or a pawl. The following description is made with the air gripper. The air gripper may have three end portions, one end portion is fixed, and the other two end portions are respectively movable, and the two movable end portions are respectively opposite to the two movable ends to drive the two movable ends to face or face each other. Movement, the first sensor 60, the second sensor 70, and the third sensor 80 are mounted on the fixed ends, respectively.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者 特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. , structure, material or Features are included in at least one embodiment or example of the present invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。 Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims (10)

  1. 一种晶圆夹持装置，其特征在于，包括：A wafer clamping device, comprising:
    第一夹持件，所述第一夹持件具有第一夹持端和第一活动端；a first clamping member having a first clamping end and a first movable end;
    第二夹持件，所述第二夹持件具有第二夹持端和第二活动端；a second clamping member having a second clamping end and a second movable end;
    驱动件，所述驱动件设置成同步驱动所述第一活动端和所述第二活动端相向或背向运动，其中，a driving member, the driving member is configured to synchronously drive the first movable end and the second movable end to face or face the movement, wherein
    所述第一夹持端与所述第二夹持端相对设置以用于夹持晶圆。The first clamping end is disposed opposite to the second clamping end for clamping a wafer.
  2. 根据权利要求1所述的晶圆夹持装置，其特征在于，所述第一夹持件和所述第二夹持件均包括：悬臂和夹爪，所述悬臂的一端构造为活动端且另一端安装有夹爪，所述夹爪构造为夹持端。The wafer clamping device according to claim 1, wherein the first clamping member and the second clamping member each comprise: a cantilever and a jaw, one end of the cantilever being configured as a movable end and The other end is fitted with a jaw configured as a grip end.
  3. 根据权利要求2所述的晶圆夹持装置，其特征在于，所述夹爪的朝向所述晶圆的侧面上开设有凹槽。The wafer clamping device according to claim 2, wherein a groove is formed on a side of the jaw facing the wafer.
  4. 根据权利要求3所述的晶圆夹持装置，其特征在于，所述凹槽构造为V形槽。The wafer chucking apparatus according to claim 3, wherein the groove is configured as a V-shaped groove.
  5. 根据权利要求3所述的晶圆夹持装置，其特征在于，所述凹槽的侧壁的截面构造为圆弧或斜线，所述两条侧壁的交线为曲线。The wafer clamping device according to claim 3, wherein the cross section of the side wall of the groove is configured as a circular arc or a diagonal line, and the intersection of the two side walls is a curved line.
  6. 根据权利要求2所述的晶圆夹持装置，其特征在于，所述悬臂包括：滑动段、连接段和夹持段，所述滑动段连接在所述驱动件上，所述连接段连接在所述滑动段和所述夹持段之间，所述夹持段上安装有所述夹爪。The wafer clamping device according to claim 2, wherein the cantilever comprises: a sliding section, a connecting section and a clamping section, the sliding section is connected to the driving member, and the connecting section is connected Between the sliding section and the clamping section, the clamping jaw is mounted on the clamping section.
  7. 根据权利要求1所述的晶圆夹持装置，其特征在于，还包括：第一传感器，所述第一传感器安装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端松开所述晶圆的松开位置。The wafer chucking apparatus according to claim 1, further comprising: a first sensor mounted on the driving member and configured to detect the first clamping end and the The second clamping end releases the release position of the wafer.
  8. 根据权利要求7所述的晶圆夹持装置，其特征在于，还包括：第二传感器，所述第二传感器安装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端夹紧所述晶圆的第一夹紧位置。A wafer chucking apparatus according to claim 7, further comprising: a second sensor mounted on said driving member for detecting said first gripping end and said The second clamping end clamps the first clamping position of the wafer.
  9. 根据权利要求8所述的晶圆夹持装置，其特征在于，还包括：第三传感器，所述第三传感器安装在所述驱动件上且用于检测所述第一夹持端和所述第二夹持端未夹持所述晶圆的第二夹紧位置。A wafer chucking apparatus according to claim 8, further comprising: a third sensor mounted on said driving member for detecting said first gripping end and said The second clamping end does not clamp the second clamping position of the wafer.
  10. 根据权利要求1所述的晶圆夹持装置，其特征在于，所述驱动件为电机、气缸或气爪。 The wafer chucking device according to claim 1, wherein the driving member is a motor, a cylinder or a gripper.
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