WO2018043054A1 - Dresser - Google Patents
Dresser Download PDFInfo
- Publication number
- WO2018043054A1 WO2018043054A1 PCT/JP2017/028633 JP2017028633W WO2018043054A1 WO 2018043054 A1 WO2018043054 A1 WO 2018043054A1 JP 2017028633 W JP2017028633 W JP 2017028633W WO 2018043054 A1 WO2018043054 A1 WO 2018043054A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inner ring
- ring
- dresser
- diamond
- peripheral portion
- Prior art date
Links
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 134
- 239000010432 diamond Substances 0.000 claims abstract description 134
- 238000005498 polishing Methods 0.000 claims abstract description 81
- 230000002093 peripheral effect Effects 0.000 claims abstract description 46
- 239000006061 abrasive grain Substances 0.000 claims abstract description 30
- 239000004744 fabric Substances 0.000 claims description 31
- 229910001220 stainless steel Inorganic materials 0.000 claims description 13
- 239000010935 stainless steel Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000000717 retained effect Effects 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 16
- 238000004070 electrodeposition Methods 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Definitions
- the present invention relates to a dresser for a polishing cloth of a double-side polishing apparatus.
- each process such as chamfering, lapping, and etching is sequentially performed on the wafer, and then at least one main surface of the wafer is mirror-finished. Polishing is performed.
- a single-side polishing apparatus that polishes one side of a wafer and a double-side polishing apparatus that simultaneously polishes both sides of the wafer may be used.
- the double-side polishing apparatus usually includes an upper surface plate and a lower surface plate to which polishing cloth made of urethane pad or the like is attached, and a sun gear 101 is provided at the center of the double-side polishing device 100 as shown in FIG.
- the outer peripheral portion has a planetary gear structure in which internal gears 102 are respectively arranged.
- the double-side polishing apparatus can simultaneously polish both sides of the wafer, there is a problem that the wafer shape gradually changes if polishing is continued using the same polishing cloth. This is mainly due to the life of the polishing cloth, which is affected by changes in the compressibility of the polishing cloth, clogging, etc., and the wafer shape becomes different as the use frequency increases. Therefore, in order to prevent such a change in the shape of the wafer, dressing on the surface of the polishing pad is performed regularly or constantly.
- a diamond electrodeposition plate made of a plurality of fan-shaped members in which diamond is electrodeposited on a stainless steel plate is used on the outer periphery of a disk-shaped base portion. It can.
- a plurality of fan-shaped members of the diamond electrodeposition plate are detachably installed on the surface of the outer peripheral portion of the base portion with screws, and the diamond electrodeposition plate is thus installed in a ring shape on the outer peripheral portion of the base portion Can be used.
- the base portion 201 is formed in a ring shape, and diamond is electrodeposited directly on the upper surface of the base portion (diamond electrodeposition portion 202), and the diamond electrodeposition portion 202 is arranged in a ring shape.
- a dresser 200 or the like can also be used.
- the dresser with diamond electrodeposited on the surface of the base part was distorted during the electrodeposition of diamond as described below, and the surface accuracy deteriorated. That is, in the diamond electrodeposition operation, blasting or the like is performed as a pretreatment for diamond electrodeposition, and then diamond abrasive grains are electrodeposited on the base portion 201. However, when diamond electrodeposition is performed by such a method, stress is applied to the base portion 201 other than the electrodeposition portion in the electrodeposition pretreatment and electrodeposition as shown in FIGS. 8B and 8C. As a result, the overall distortion of the dresser has increased.
- the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a dresser with high thickness accuracy, capable of efficient and uniform dressing, and lighter than conventional ones.
- the present invention provides a dresser comprising a diamond plate to which diamond abrasive grains are fixed for dressing a polishing cloth attached to an upper surface plate and a lower surface plate of a double-side polishing apparatus.
- a diamond plate disposed between the outer ring and the outer ring, and the outer ring and the inner ring. The diamond plate is held non-fixed in the thickness direction of the diamond plate on the outer peripheral part of the inner ring and the inner peripheral part of the outer ring, Providing a dresser, characterized in that the bets in the thickness direction is capable floating.
- the dresser of the present invention can perform uniform dressing with high efficiency.
- the dresser of the present invention has a configuration in which the diamond plate is mainly held from the side surface by an annular, hollow inner and outer ring, and the inner and outer rings can be thinned with such a configuration.
- the thickness itself can be designed to be thin, lighter than conventional dressers, and easy to handle.
- the outer peripheral portion of the inner ring, the side surface of the diamond plate facing the outer peripheral portion of the inner ring, the inner peripheral portion of the outer ring, and the side surface of the diamond plate facing the inner peripheral portion of the outer ring Has a concave shape or a convex shape, and the convex shape is meshed with the concave shape so as to have play in the thickness direction of the diamond plate. It is preferable that the diamond plate is held so as to be floatable in the thickness direction by the inner periphery of the outer ring and the outer ring.
- the diamond plate can be held unfixed in the thickness direction and can float in the thickness direction of the diamond plate.
- the diamond plate is composed of a plurality of fan-shaped members electrodeposited with diamond on a stainless steel plate, and each of the plurality of fan-shaped members is installed between the inner ring and the outer ring to form a ring shape. It is preferable that it is arrange
- a dresser equipped with such a diamond plate can perform dressing more efficiently and more uniformly.
- the flatness and parallelism of the diamond plate are preferably 0.02 mm or less.
- the inner ring and the outer ring are made of stainless steel (SUS) or resin.
- the strength of the dresser can be further improved.
- the dresser becomes lighter at a lower cost.
- the double-side polishing apparatus is a planetary motion type double-side polishing that simultaneously polishes both the front and back surfaces of the semiconductor wafer by revolving the carrier holding the semiconductor wafer in the holding hole between the sun gear and the internal gear.
- the outer ring is one in which outer teeth are provided around an outer peripheral surface, and the outer teeth can mesh with the sun gear and the internal gear.
- the entire surface of the surface plate can be dressed efficiently and uniformly by meshing the external teeth with the sun gear and the internal gear of the double-side polishing machine and revolving.
- the dresser of the present invention is capable of highly efficient and uniform dressing.
- the dresser of the present invention is lighter than the conventional dresser, is easy to handle, and can improve workability.
- FIG. 2 is a cross-sectional view of the dresser of the present invention taken along line A-A ′ in FIG. 1. It is an exploded top view of the dresser of the present invention. It is a partial exploded perspective view of the dresser of the present invention.
- FIG. 2 is a diagram illustrating an example of a method for manufacturing a dresser according to the present invention with a cross section taken along line A-A ′ in FIG. 1. It is the schematic which shows a general double-side polish apparatus. It is the schematic of the conventional dresser. It is a figure explaining the flatness change at the time of preparation of the conventional dresser.
- the dresser 1 of the present invention has an inner ring 2, a diameter larger than that of the inner ring 2, a concentric arrangement with the inner ring 2 on the outer side of the inner ring 2, and connection to the inner ring And an outer ring 3 having a portion 4.
- the inner ring 2 may be one in which an upper inner ring 2a and a lower inner ring 2b are overlapped and fixed vertically. For example, as shown in FIG.
- FIG. 4 illustrates the base ring including the lower inner ring 2b
- the base ring may include the upper inner ring 2a
- the lower inner ring 2b may be fixed to the base ring with a bolt.
- the dresser 1 includes a diamond plate 5 to which diamond abrasive grains 6 for dressing a polishing cloth attached to an upper surface plate and a lower surface plate of a double-side polishing apparatus are fixed.
- the diamond plate 5 is disposed between the inner ring 2 and the outer ring 3.
- the side surface of the diamond plate 5 is held by the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3, and the thickness is larger than that of the inner ring 2 and the outer ring 3.
- the diamond plates 5 When a plurality of diamond plates 5 are installed as shown in FIG. 1, the diamond plates 5 may be arranged so that the surfaces (upper surfaces in FIG. 2) to which the diamond abrasive grains 6 are fixed are all in the same direction.
- the diamond plate 5 whose upper surface is the surface to which the abrasive grains 6 are fixed and the diamond plate 5 whose lower surface is the surface to which the diamond abrasive grains 6 are fixed may be arranged alternately.
- the diamond abrasive grains 6 are fixed only on the upper surface of the diamond plate 5.
- the diamond abrasive grains 6 are fixed on both the upper and lower surfaces of the diamond plate 5. Also good.
- the diamond plate 5 is held in the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 in an unfixed manner in the thickness direction of the diamond plate 5. Can float in the thickness direction.
- such a configuration includes the outer periphery of the inner ring 2, the side surface of the diamond plate 5 facing the outer periphery of the inner ring 2, the inner periphery of the outer ring 3, and the inner periphery of the outer ring 3.
- the side surface of the diamond plate 5 facing the portion has either a concave shape or a convex shape, and the convex shape meshes with the concave shape so that there is play in the thickness direction of the diamond plate 5.
- the diamond plate 5 can be held by the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 so as to float in the thickness direction.
- the outer peripheral portion of the inner ring 2 that is thinner than the diamond plate 5 has a concave shape, and the side surface of the diamond plate 5 that faces the outer peripheral portion of the inner ring 2 has a convex shape. These irregularities mesh with each other so as to have play in the thickness direction of the diamond plate 5.
- the inner peripheral portion of the outer ring 3 that is thinner than the diamond plate 5 has a convex shape, and the side surface of the diamond plate 5 facing the inner peripheral portion of the outer ring 3 has a concave shape.
- the plates 5 are engaged so as to have play in the thickness direction. With these configurations, the diamond plate 5 can float in the thickness direction.
- any one of the outer peripheral portion of the inner ring 2 and the side surface of the diamond plate 5 facing the inner ring 2 may be a concave shape, and the other may be a convex shape, and is limited to the embodiment shown in FIG. There is no.
- the outer peripheral portion of the inner ring 2 may have a convex shape
- the side surface of the diamond plate 5 facing this may be concave
- the inner peripheral portion of the outer ring 3 may have a concave shape, and the diamond plate 5 facing this.
- the side surface may be convex.
- the dresser 1 is such that the side face of the diamond plate 5 is held by the inner and outer rings 2 and 3, the dress surface to which the diamond abrasive grains 6 of the diamond plate 5 are fixed is the thickness of the inner and outer rings 2 and 3. Since it is not affected by accuracy, the surface accuracy of the dress surface is not deteriorated by the support member (base portion or the like) of the diamond plate as in the prior art. Further, the floatable diamond plate 5 can move following the shape of the polishing cloth surface of the double-side polishing apparatus during dressing. Therefore, dressing can be performed with improved dressing efficiency (improvement in the thickness variation of the polishing cloth) and uniform roughness. Further, since the diamond plate is not pasted on the support member as in the prior art, it is not necessary to increase the thickness of the inner and outer rings 2 and 3 in order to suppress distortion. Therefore, the dresser 1 becomes light and easy to handle.
- the diamond plate 5 is preferably composed of a plurality of fan-shaped members as shown in FIG. 1 in which diamond is electrodeposited on a stainless steel plate. It is preferable that the ring is disposed between the outer ring 3 and the outer ring 3.
- the “fan shape” in the present invention means a shape obtained by dividing the ring-shaped diamond plate 5 in the outer peripheral direction as shown in FIG. That is, the ring-shaped diamond plate 5 can be formed by combining a plurality of fan-shaped members. If the diamond plate 5 is divided into a plurality of sector members, the area of each sector member can be reduced.
- the fan-shaped member having a small area also has a small amount of stress change of the stainless steel plate due to the electrodeposition treatment of the diamond abrasive grains, and has a high flatness, so that the dresser 1 has high surface accuracy of the dress surface.
- the dresser 1 of the present invention since the dresser 1 of the present invention has a structure in which the diamond plate can be easily exchanged, for example, when a defect is found in the diamond abrasive grains of the sector member, only the problematic sector member can be removed and easily replaced. It is.
- the flatness and parallelism of the diamond plate 5 are preferably 0.02 mm or less.
- the dresser 1 is capable of further improving dressing efficiency and more uniform dressing.
- the inner ring 2 and the outer ring 3 may be made of stainless steel or resin. If the inner ring and the outer ring are made of SUS, the strength of the dresser will be higher. In addition, if the inner ring and the outer ring are made of resin, the cost is lower and there is no metal contamination, and the dresser is lighter.
- the outer ring 3 has outer teeth 7 around the outer peripheral surface, and the outer teeth 7 can mesh with the sun gear and the internal gear.
- the planetary motion type double-side polishing apparatus 100 as shown in FIG. 6 causes the carrier 103 holding the semiconductor wafer W in the holding hole to revolve between the sun gear 101 and the internal gear 102, thereby causing the semiconductor wafer W to rotate.
- the front and back surfaces can be polished simultaneously. If the outer teeth 7 of the outer ring 3 of the dresser 1 can mesh with the sun gear 101 and the internal gear 102, the entire surface of the polishing cloth can be easily dressed by revolving with the sun gear 101 and the internal gear 102. Become a dresser.
- FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG.
- the base ring in which the outer ring 3, the connecting portion 4, and the lower inner ring 2b are integrated, and the upper inner ring 2a The diamond plate 5 may be prepared.
- a plurality of sector members in which diamond abrasive grains are electrodeposited on a sector plate can be prepared.
- the fan-shaped member electrodeposited with diamond abrasive grains is selected according to the thickness in advance so that the variation in thickness among the plurality of fan-shaped members is reduced, a more accurate dresser can be produced. it can.
- the outer end of the diamond plate 5 is engaged with the inner peripheral portion of the outer ring.
- the meshing portion has play in the thickness direction of the diamond plate 5.
- the upper inner ring 2a is attached so that the inner end of the diamond plate 5 is sandwiched from above and below by the upper inner ring 2a and the lower inner ring 2b.
- the portion is engaged with the inner end of the diamond plate 5.
- the meshing portion has play in the thickness direction of the diamond plate 5.
- the diamond plate 5 is held non-fixed in the thickness direction on the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 so that the diamond plate 5 can float in the thickness direction.
- the dresser 1 can be manufactured.
- the dresser 1 In order to perform dressing, if the dresser 1 is sandwiched between the upper surface plate and the lower surface plate of the double-side polishing apparatus and the apparatus is operated in the same manner as normal polishing, the upper and lower polishing cloths can be dressed simultaneously. At this time, if the external teeth 7 of the outer ring 3 are engaged with the sun gear and the internal gear as described above, the dresser 1 rotates and revolves by these gears, and the entire surfaces of the upper and lower polishing cloths are moved. Can be dressed.
- the upper and lower polishing cloths may be dressed simultaneously using the dresser 1 in which the surface on which the diamond abrasive grains 6 are fixed is in two directions.
- a plurality of diamond plates 5 each having diamond abrasive grains 6 fixed on only one side thereof are installed, diamond plates 6 with diamond abrasive grains 6 facing the lower surface plate, and diamond plates 5 with diamond abrasive grains 6 facing the upper surface plate direction.
- a dresser 1 in which diamond abrasive grains 6 are fixed to both upper and lower surfaces of the diamond plate 5 may be used.
- Example 2 A silicon wafer was polished using a double-side polishing apparatus as shown in FIG. 6, and dressing of upper and lower polishing cloths was performed between polishing batches with the dresser of the present invention as shown in FIGS. And the thickness change amount of the polishing cloth of dressing, the surface shape measurement of the polishing cloth after dressing, and Si content measurement of the polishing cloth after dressing were performed. Furthermore, the change in flatness of the polished wafer was evaluated before and after dressing.
- the dresser of the example was manufactured by the following procedure. That is, first, diamond abrasive grains are fixed to one surface of a stainless steel base ring, a stainless steel upper inner ring, and a stainless steel plate, in which a lower inner ring and an outer ring are integrated via a connecting portion. A diamond plate was prepared. For the diamond plate, a ring-shaped stainless steel plate having a thickness of 1 cm was cut into eight fan shapes, and diamond abrasive grains were electrodeposited on the respective surfaces to prepare eight fan-shaped members. And these members were assembled in the procedure shown in FIG. 5, and the dresser of this invention like FIG. 1 was produced.
- the inner ring of this dresser has a thickness of 0.3 cm, an inner diameter of 62 cm, and an outer diameter of 65 cm.
- the outer ring has a thickness of 0.6 cm, an outer diameter of 74 cm, and a gear tooth bottom of 73 cm.
- the weight of this dresser was about 5 kg, which was about 1/3 the weight of the conventional dresser used in the comparative example described later. In this procedure, four dressers were produced and used for dressing.
- a double-side polishing machine 30B manufactured by Fujikoshi Machine Industry Co., Ltd. was used as a double-side polishing apparatus.
- the external gear of the dresser was installed so as to mesh with the sun gear and the internal gear.
- the two dressers were installed so that the diamond abrasive grains face upward, and the remaining two dressers were placed so that the diamond abrasive grains face downward.
- a urethane polishing pad was used as the polishing cloth.
- the upper and lower surface plates and the dresser were revolved so that the relative rotational speed of the upper and lower surface plates was 1: 1 with respect to the revolution of the dresser.
- the load on the dresser was the same as the load during polishing, and the dressing time was 60 minutes.
- the load is 150 gf / cm 2
- the rotation speed of the upper and lower surface plates, the sun gear and the internal gear is the difference between the carrier revolution number and the upper surface plate rotation number
- the lower surface plate rotation number and the carrier Processing was performed so that the carrier rotation speed was set to 2.5 rpm so that the difference in revolution number was 10 rpm.
- the amount of change in thickness of the upper and lower polishing cloths After dressing between polishing batches, the amount of change in thickness of the upper and lower polishing cloths, measurement of the surface shape of the polishing cloth, and measurement of the Si content of the polishing cloth after dressing were performed.
- the amount of change in the thickness of the polishing pad was calculated from the thickness of the polishing pad before and after dressing.
- the surface shape of the polishing cloth was measured using a straightness measuring machine.
- Si content of polishing cloth was measured by SEM.
- the amount of change in the thickness of the polishing cloth is larger in the example than in the comparative example described later, and the amount of change in the thickness of the polishing cloth is 10% higher than the comparative example described later. And found that effective dressing was done.
- a relative value with the amount of change in the thickness of the polishing cloth of the comparative example as 1 is shown as the amount of change in the thickness of the polishing cloth.
- the Si content of the polishing cloth was 10% less than that of the comparative example, and it was found that clogging due to polishing scraps of the silicon wafer was sufficiently removed as compared with the comparative example. It was.
- the relative value which set Si content of the comparative example to 1 is described as Si content.
- the thickness change amount of the polishing cloth was smaller than that of the example, and the dressing effect was low. Furthermore, as shown in FIG. 10, the Si content of the polishing cloth is larger than that in the example, and the clogging due to the polishing scraps of the silicon wafer remains more than in the example, and the dressing effect more effective than the comparative example is achieved. It was confirmed that it was obtained.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a dresser provided with a diamond plate on which diamond abrasive grains, for dressing upper and lower polishing cloths of a double-side polishing machine, are fixed, the dresser being characterized by being provided with: an inner ring (2); an outer ring (3) having a larger diameter than the inner ring, disposed to be concentric with the inner ring and outside the inner ring, and having a connection part connected to the inner ring; and a diamond plate (5) disposed between the inner ring and the outer ring, having a side surface retained by an outer peripheral portion of the inner ring and an inner peripheral portion of the outer ring, and having a greater thickness than the inner ring and the outer ring, wherein the diamond plate is retained in a non-fixed manner in the thickness direction of the diamond plate by the outer peripheral portion of the inner ring and the inner peripheral portion of the outer ring and can float in the thickness direction of the diamond plate. Thus, there is provided a dresser having a high thickness precision, enabling uniform dressing to be efficiently performed, and having a lighter weight than conventional dressers.
Description
本発明は、両面研磨装置の研磨布用のドレッサーに関する。
The present invention relates to a dresser for a polishing cloth of a double-side polishing apparatus.
従来、シリコンウェーハの製造では、シリコン単結晶インゴットをスライスしてシリコンウェーハを作製した後、このウェーハに対して面取り、ラッピング、エッチング等の各工程が順次なされ、次いで少なくともウェーハの一主面を鏡面化する研磨が施される。この研磨工程では、ウェーハの片面を研磨する片面研磨装置のほか、ウェーハの両面を同時に研磨する両面研磨装置が用いられることがある。
Conventionally, in the manufacture of a silicon wafer, after a silicon single crystal ingot is sliced to produce a silicon wafer, each process such as chamfering, lapping, and etching is sequentially performed on the wafer, and then at least one main surface of the wafer is mirror-finished. Polishing is performed. In this polishing process, a single-side polishing apparatus that polishes one side of a wafer and a double-side polishing apparatus that simultaneously polishes both sides of the wafer may be used.
両面研磨装置としては、通常、ウレタンパッドなどからなる研磨布がそれぞれに貼付された上定盤と下定盤を具備し、図6に示すように、両面研磨装置100の中心部にはサンギヤ101が、外周部にはインターナルギヤ102がそれぞれ配置された遊星歯車構造を有するものが用いられている。半導体ウェーハWを研磨する場合には、キャリア103に形成されたウェーハ保持孔104の内部に半導体ウェーハWを挿入・保持し、その上方から研磨スラリーを半導体ウェーハWに供給し、上下の定盤を回転させながら上定盤と下定盤の対向する研磨布を半導体ウェーハWの表裏両面に押し付けるとともに、キャリア103をサンギヤ101とインターナルギヤ102との間で自転公転させることで各半導体ウェーハWの両面を同時に研磨することができる。
The double-side polishing apparatus usually includes an upper surface plate and a lower surface plate to which polishing cloth made of urethane pad or the like is attached, and a sun gear 101 is provided at the center of the double-side polishing device 100 as shown in FIG. The outer peripheral portion has a planetary gear structure in which internal gears 102 are respectively arranged. When polishing the semiconductor wafer W, the semiconductor wafer W is inserted and held in the wafer holding hole 104 formed in the carrier 103, and the polishing slurry is supplied to the semiconductor wafer W from above, and the upper and lower surface plates are moved. While rotating, the opposing polishing cloths of the upper surface plate and the lower surface plate are pressed against both the front and back surfaces of the semiconductor wafer W, and the carrier 103 is rotated and revolved between the sun gear 101 and the internal gear 102 so that both surfaces of each semiconductor wafer W are rotated. Can be polished simultaneously.
両面研磨装置はウェーハの両面を同時に研磨することができる一方、同じ研磨布を用いて研磨を続けているとウェーハ形状が徐々に変化してしまうという問題がある。これは主に研磨布の寿命に起因しており、研磨布の圧縮率の変化や目詰まり等が影響し、使用頻度が増えるにつれウェーハ形状が異なるようになる。そこで、このようなウェーハ形状の変化を防ぐため、研磨布表面のドレッシングが定期的にあるいは常時行われている。
While the double-side polishing apparatus can simultaneously polish both sides of the wafer, there is a problem that the wafer shape gradually changes if polishing is continued using the same polishing cloth. This is mainly due to the life of the polishing cloth, which is affected by changes in the compressibility of the polishing cloth, clogging, etc., and the wafer shape becomes different as the use frequency increases. Therefore, in order to prevent such a change in the shape of the wafer, dressing on the surface of the polishing pad is performed regularly or constantly.
ドレッサーとしては、例えば、特許文献1のように、円盤状のベース部の外周部に、ステンレス鋼板上にダイヤモンドを電着した複数の扇形部材から成るダイヤ電着プレートを配置したものを用いることができる。ダイヤ電着プレートの複数の扇形部材は、ベース部の外周部の表面上にネジによって取り外し可能に設置されており、これによってダイヤ電着プレートがベース部の外周部にリング状に設置されたものを使用できる。このダイヤ電着プレートのダイヤモンド砥粒を研磨布に摺接させることで、研磨布表面を荒らすことができ、また、目詰まりを除去できる。
As the dresser, for example, as in Patent Document 1, a diamond electrodeposition plate made of a plurality of fan-shaped members in which diamond is electrodeposited on a stainless steel plate is used on the outer periphery of a disk-shaped base portion. it can. A plurality of fan-shaped members of the diamond electrodeposition plate are detachably installed on the surface of the outer peripheral portion of the base portion with screws, and the diamond electrodeposition plate is thus installed in a ring shape on the outer peripheral portion of the base portion Can be used. By bringing the diamond abrasive grains of the diamond electrodeposition plate into sliding contact with the polishing cloth, the surface of the polishing cloth can be roughened and clogging can be removed.
またその他にも、図7のようにベース部201をリング状にし、該ベース部の上表面に直接ダイヤモンドを電着し(ダイヤ電着部202)、ダイヤ電着部202をリング状に配置したドレッサー200なども使用できる。
In addition, as shown in FIG. 7, the base portion 201 is formed in a ring shape, and diamond is electrodeposited directly on the upper surface of the base portion (diamond electrodeposition portion 202), and the diamond electrodeposition portion 202 is arranged in a ring shape. A dresser 200 or the like can also be used.
例えば、特許文献1のような従来のドレッサーでは、ダイヤ電着プレートをベース部の外周部の表面上にネジで固定する際に、ベース部の面精度、及び、ネジでベース部に取り付ける精度が必要であった。即ち、これらの精度が悪いと、ドレッサーのドレス面の面精度が悪化し、ダイヤモンド砥粒の一部が研磨布の表面に接触せずにドレッシングの効率が落ちたり、均一にドレッシングができなかったりするという問題があった。
For example, in a conventional dresser such as Patent Document 1, when the diamond electrodeposition plate is fixed to the surface of the outer peripheral portion of the base portion with screws, the surface accuracy of the base portion and the accuracy of attaching to the base portion with screws are high. It was necessary. That is, if these precisions are poor, the dresser's dressing surface precision will deteriorate, and some of the diamond abrasive grains will not come into contact with the surface of the polishing cloth, resulting in poor dressing efficiency or even uniform dressing. There was a problem to do.
また、ベース部の表面にダイヤモンドを電着したドレッサーは、以下のように、ダイヤモンドの電着作業においてドレッサーが歪み、面精度が悪化してしまっていた。即ち、ダイヤモンドの電着作業では、ダイヤモンドの電着の前処理としてブラスト処理など行い、その後、ベース部201にダイヤモンド砥粒を電着していた。しかしながら、このような手法でダイヤモンドの電着を行うと、図8の(b)、(c)のように、電着の前処理及び電着において電着部以外のベース部201などにも応力がかかるため、結果として、ドレッサー全体の歪みが大きくなってしまっていた。
In addition, the dresser with diamond electrodeposited on the surface of the base part was distorted during the electrodeposition of diamond as described below, and the surface accuracy deteriorated. That is, in the diamond electrodeposition operation, blasting or the like is performed as a pretreatment for diamond electrodeposition, and then diamond abrasive grains are electrodeposited on the base portion 201. However, when diamond electrodeposition is performed by such a method, stress is applied to the base portion 201 other than the electrodeposition portion in the electrodeposition pretreatment and electrodeposition as shown in FIGS. 8B and 8C. As a result, the overall distortion of the dresser has increased.
さらに、このような従来のドレッサーでは、電着作業などによる面精度の悪化を抑制するために、ベース部の歪みが小さくなるようにベース部を厚くしていたが、これによってドレッサーが重くなり、ドレッサーの取り扱いが困難であるという問題もあった。
Furthermore, in such a conventional dresser, in order to suppress deterioration of surface accuracy due to electrodeposition work or the like, the base portion was thickened so as to reduce the distortion of the base portion, but this increases the dresser weight, There was also a problem that it was difficult to handle the dresser.
本発明は前述のような問題に鑑みてなされたもので、厚さ精度が高く、効率よく均一なドレッシングが可能であり、また、従来よりも軽量なドレッサーを提供することを目的とする。
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a dresser with high thickness accuracy, capable of efficient and uniform dressing, and lighter than conventional ones.
上記目的を達成するために、本発明は、両面研磨装置の上定盤と下定盤にそれぞれ貼り付けられた研磨布をドレッシングするためのダイヤモンド砥粒を固着したダイヤプレートを具備するドレッサーであって、内リングと、該内リングよりも直径が大きく、前記内リングの外側に前記内リングと同心円状に配置され、前記内リングに連結する連結部を有する外リングと、前記内リングと前記外リングとの間に配置され、前記内リングの外周部と前記外リングの内周部によって側面を保持され、厚さが前記内リングと前記外リングよりも厚い前記ダイヤプレートと、を具備し、前記ダイヤプレートが、前記内リングの外周部と前記外リングの内周部に、前記ダイヤプレートの厚さ方向に非固定で保持されたものであることで、前記ダイヤプレートの厚さ方向に浮動可能なものであることを特徴とするドレッサーを提供する。
In order to achieve the above object, the present invention provides a dresser comprising a diamond plate to which diamond abrasive grains are fixed for dressing a polishing cloth attached to an upper surface plate and a lower surface plate of a double-side polishing apparatus. An inner ring, an outer ring having a diameter larger than that of the inner ring, concentrically arranged on the outer side of the inner ring and connected to the inner ring, and the inner ring and the outer ring. A diamond plate disposed between the outer ring and the outer ring, and the outer ring and the inner ring. The diamond plate is held non-fixed in the thickness direction of the diamond plate on the outer peripheral part of the inner ring and the inner peripheral part of the outer ring, Providing a dresser, characterized in that the bets in the thickness direction is capable floating.
このようなドレッサーでは、ダイヤプレートの側面を内リング及び外リングで保持しているため、ダイヤプレートが内リング及び外リングの厚さ精度の影響を受け難く、ドレス面の面精度が悪化しにくい。また、ダイヤプレートが厚さ方向に浮動可能であることで、研磨布の表面形状(定盤形状)への追従性が向上する。よって、本発明のドレッサーは、高効率で均一なドレッシングが可能なものとなる。また、本発明のドレッサーは、主に、環状で中空の内外のリングによって、ダイヤプレートを側面から保持する構成であり、また、このような構成であれば内外のリングを薄くできるため、ドレッサーの厚みそのものを薄く設計することができ、従来のドレッサーよりも軽量となり、取り扱いやすいものとなる。
In such a dresser, since the side surface of the diamond plate is held by the inner ring and the outer ring, the diamond plate is hardly affected by the thickness accuracy of the inner ring and the outer ring, and the surface accuracy of the dress surface is hardly deteriorated. . In addition, since the diamond plate can float in the thickness direction, the followability to the surface shape (surface plate shape) of the polishing cloth is improved. Therefore, the dresser of the present invention can perform uniform dressing with high efficiency. In addition, the dresser of the present invention has a configuration in which the diamond plate is mainly held from the side surface by an annular, hollow inner and outer ring, and the inner and outer rings can be thinned with such a configuration. The thickness itself can be designed to be thin, lighter than conventional dressers, and easy to handle.
このとき、前記内リングの外周部、該内リングの外周部に対向する前記ダイヤプレートの側面、前記外リングの内周部、及び、該外リングの内周部に対向する前記ダイヤプレートの側面が凹形状又は凸形状のいずれかの形状を有し、前記凹形状に対して前記凸形状が前記ダイヤプレートの厚さ方向に遊びを有するように噛合していることで、前記内リングの外周部と前記外リングの内周部によって、前記ダイヤプレートが厚さ方向に浮動可能なように保持されたものであることが好ましい。
At this time, the outer peripheral portion of the inner ring, the side surface of the diamond plate facing the outer peripheral portion of the inner ring, the inner peripheral portion of the outer ring, and the side surface of the diamond plate facing the inner peripheral portion of the outer ring Has a concave shape or a convex shape, and the convex shape is meshed with the concave shape so as to have play in the thickness direction of the diamond plate. It is preferable that the diamond plate is held so as to be floatable in the thickness direction by the inner periphery of the outer ring and the outer ring.
このようにして、ダイヤプレートを厚さ方向に非固定で保持でき、ダイヤプレートの厚さ方向に浮動可能なものとできる。
In this way, the diamond plate can be held unfixed in the thickness direction and can float in the thickness direction of the diamond plate.
また、前記ダイヤプレートが、ステンレス鋼板上にダイヤモンドを電着した複数の扇形部材から成り、該複数の扇形部材のそれぞれが前記内リングと前記外リングとの間に設置されることで、リング状に配置されたものであることが好ましい。
Further, the diamond plate is composed of a plurality of fan-shaped members electrodeposited with diamond on a stainless steel plate, and each of the plurality of fan-shaped members is installed between the inner ring and the outer ring to form a ring shape. It is preferable that it is arrange | positioned.
このようなダイヤプレートを具備するドレッサーであれば、より効率よく、より均一なドレッシングができる。
A dresser equipped with such a diamond plate can perform dressing more efficiently and more uniformly.
また、前記ダイヤプレートの平坦度及び平行度は0.02mm以下であることが好ましい。
The flatness and parallelism of the diamond plate are preferably 0.02 mm or less.
ダイヤプレートの平坦度及び平行度が0.02mm以下であれば、より確実に、効率よく均一なドレッシングができる。
If the flatness and parallelism of the diamond plate are 0.02 mm or less, uniform dressing can be performed more reliably and efficiently.
また、前記内リング及び前記外リングが、ステンレス鋼(SUS)又は樹脂からなるものであることが好ましい。
Moreover, it is preferable that the inner ring and the outer ring are made of stainless steel (SUS) or resin.
内リング及び外リングがSUS製であればドレッサーの強度をより向上できる。また、内リング及び外リングが樹脂製であればより低コストでより軽量なドレッサーとなる。
If the inner ring and outer ring are made of SUS, the strength of the dresser can be further improved. In addition, if the inner ring and the outer ring are made of resin, the dresser becomes lighter at a lower cost.
また、前記両面研磨装置が、保持孔に半導体ウェーハを保持したキャリアを、サンギヤとインターナルギヤとの間で自公転させることで、前記半導体ウェーハの表裏両面を同時に研磨する遊星運動方式の両面研磨装置であり、前記外リングが、外周面に外歯が周設されたものであり、該外歯を前記サンギヤと前記インターナルギヤとに噛合できるものであることが好ましい。
Further, the double-side polishing apparatus is a planetary motion type double-side polishing that simultaneously polishes both the front and back surfaces of the semiconductor wafer by revolving the carrier holding the semiconductor wafer in the holding hole between the sun gear and the internal gear. It is a device, and it is preferable that the outer ring is one in which outer teeth are provided around an outer peripheral surface, and the outer teeth can mesh with the sun gear and the internal gear.
このようなドレッサーであれば、外歯を両面研磨装置のサンギヤとインターナルギヤに噛合させて自公転させることで、定盤の全面を効率よく均一にドレッシングできる。
With such a dresser, the entire surface of the surface plate can be dressed efficiently and uniformly by meshing the external teeth with the sun gear and the internal gear of the double-side polishing machine and revolving.
本発明のドレッサーは高効率で均一なドレッシングが可能なものである。また、本発明のドレッサーは従来のドレッサーよりも軽量で、取り扱いやすく、作業性を向上できるものである。
The dresser of the present invention is capable of highly efficient and uniform dressing. The dresser of the present invention is lighter than the conventional dresser, is easy to handle, and can improve workability.
以下、本発明について実施の形態を説明するが、本発明はこれに限定されるものではない。
Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.
まず、本発明のドレッサーについて図1~4を参照して説明する。図1に示すように、本発明のドレッサー1は、内リング2と、内リング2よりも直径が大きく、内リング2の外側に内リング2と同心円状に配置され、内リングに連結する連結部4を有する外リング3とを具備する。内リング2は、図2に示すように、上内リング2a、下内リング2bが上下に重ね合わされて固定されたものであってもよい。例えば、図3のように、外リング3と、外リング3の内周部に位置し、下内リング2bに連結する連結部4と、内リング2の一部を構成する下内リング2bとが一体となったベースリングを用意し、図4のように、ベースリングの下内リング2b上に上内リング2aをボルトなどで固定することで外リング3と内リング2を形成したものであってもよい。なお、図4には下内リング2bを具備するベースリングを例示したが、ベースリングは上内リング2aを具備していても良く、これに下内リング2bをボルトで固定してもよい。
First, the dresser of the present invention will be described with reference to FIGS. As shown in FIG. 1, the dresser 1 of the present invention has an inner ring 2, a diameter larger than that of the inner ring 2, a concentric arrangement with the inner ring 2 on the outer side of the inner ring 2, and connection to the inner ring And an outer ring 3 having a portion 4. As shown in FIG. 2, the inner ring 2 may be one in which an upper inner ring 2a and a lower inner ring 2b are overlapped and fixed vertically. For example, as shown in FIG. 3, the outer ring 3, the connecting portion 4 that is located on the inner peripheral portion of the outer ring 3 and is connected to the lower inner ring 2 b, and the lower inner ring 2 b that constitutes a part of the inner ring 2 A base ring in which the outer ring 3 and the inner ring 2 are formed by fixing the upper inner ring 2a with a bolt or the like on the lower inner ring 2b of the base ring as shown in FIG. There may be. Although FIG. 4 illustrates the base ring including the lower inner ring 2b, the base ring may include the upper inner ring 2a, and the lower inner ring 2b may be fixed to the base ring with a bolt.
また、ドレッサー1は、図2のように、両面研磨装置の上定盤と下定盤にそれぞれ貼り付けられた研磨布をドレッシングするためのダイヤモンド砥粒6を固着したダイヤプレート5を具備し、このダイヤプレート5は、内リング2と外リング3との間に配置される。また、ダイヤプレート5は、内リング2の外周部と外リング3の内周部によって側面を保持されており、厚さが内リング2と外リング3よりも厚い。
As shown in FIG. 2, the dresser 1 includes a diamond plate 5 to which diamond abrasive grains 6 for dressing a polishing cloth attached to an upper surface plate and a lower surface plate of a double-side polishing apparatus are fixed. The diamond plate 5 is disposed between the inner ring 2 and the outer ring 3. The side surface of the diamond plate 5 is held by the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3, and the thickness is larger than that of the inner ring 2 and the outer ring 3.
ダイヤプレート5を図1のように複数設置する場合、ダイヤモンド砥粒6が固着してある面(図2では上面)がすべて同じ方向となるようにダイヤプレート5を配置しても良いし、ダイヤモンド砥粒6が固着してある面が上面となるダイヤプレート5とダイヤモンド砥粒6が固着してある面が下面となるダイヤプレート5とを、交互に並べて配置してもよい。なお、図2では、ダイヤモンド砥粒6がダイヤプレート5の上面にのみ固着されているが、本発明のドレッサー1は、ダイヤモンド砥粒6がダイヤプレート5の上面と下面の両面に固着されていてもよい。
When a plurality of diamond plates 5 are installed as shown in FIG. 1, the diamond plates 5 may be arranged so that the surfaces (upper surfaces in FIG. 2) to which the diamond abrasive grains 6 are fixed are all in the same direction. The diamond plate 5 whose upper surface is the surface to which the abrasive grains 6 are fixed and the diamond plate 5 whose lower surface is the surface to which the diamond abrasive grains 6 are fixed may be arranged alternately. In FIG. 2, the diamond abrasive grains 6 are fixed only on the upper surface of the diamond plate 5. However, in the dresser 1 of the present invention, the diamond abrasive grains 6 are fixed on both the upper and lower surfaces of the diamond plate 5. Also good.
さらに、本発明のドレッサー1では、ダイヤプレート5が、内リング2の外周部と外リング3の内周部に、ダイヤプレート5の厚さ方向に非固定で保持されているため、ダイヤプレート5がその厚さ方向に浮動可能である。
Furthermore, in the dresser 1 of the present invention, the diamond plate 5 is held in the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 in an unfixed manner in the thickness direction of the diamond plate 5. Can float in the thickness direction.
このような構成は、より具体的には、内リング2の外周部、内リング2の外周部に対向するダイヤプレート5の側面、外リング3の内周部、及び、外リング3の内周部に対向するダイヤプレート5の側面が凹形状又は凸形状のいずれかの形状を有し、凹形状に対して凸形状がダイヤプレート5の厚さ方向に遊びを有するように噛合していることで、内リング2の外周部と外リング3の内周部によって、ダイヤプレート5が厚さ方向に浮動可能なように保持された構成とすることができる。このような構成の一例について、図2を参照して、より具体的に説明する。
More specifically, such a configuration includes the outer periphery of the inner ring 2, the side surface of the diamond plate 5 facing the outer periphery of the inner ring 2, the inner periphery of the outer ring 3, and the inner periphery of the outer ring 3. The side surface of the diamond plate 5 facing the portion has either a concave shape or a convex shape, and the convex shape meshes with the concave shape so that there is play in the thickness direction of the diamond plate 5. Thus, the diamond plate 5 can be held by the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 so as to float in the thickness direction. An example of such a configuration will be described more specifically with reference to FIG.
図2の場合、ダイヤプレート5より厚さが薄い内リング2の外周部が凹形状であり、内リング2の外周部に対向するダイヤプレート5の側面が凸形状である。そしてこれらの凹凸が、ダイヤプレート5の厚さ方向に遊びを有するように噛合している。同様に、ダイヤプレート5より厚さが薄い外リング3の内周部が凸形状であり、外リング3の内周部に対向するダイヤプレート5の側面が凹形状であり、これらの凹凸がダイヤプレート5の厚さ方向に遊びを有するように噛合している。これらの構成によってダイヤプレート5をその厚さ方向に浮動可能な状態にできる。なお、本発明では、内リング2の外周部とこれに対向するダイヤプレート5の側面のいずれか一方が凹形状で、他方が凸形状であればよく、図2の態様のみに限定されることはない。これは、外リング3の内周部とこれに対向するダイヤプレート5の側面の関係についても同様である。例えば、内リング2の外周部が凸形状で、これに対向するダイヤプレート5の側面が凹形状であってもよく、外リング3の内周部が凹形状で、これに対向するダイヤプレート5の側面が凸形状であってよい。
In the case of FIG. 2, the outer peripheral portion of the inner ring 2 that is thinner than the diamond plate 5 has a concave shape, and the side surface of the diamond plate 5 that faces the outer peripheral portion of the inner ring 2 has a convex shape. These irregularities mesh with each other so as to have play in the thickness direction of the diamond plate 5. Similarly, the inner peripheral portion of the outer ring 3 that is thinner than the diamond plate 5 has a convex shape, and the side surface of the diamond plate 5 facing the inner peripheral portion of the outer ring 3 has a concave shape. The plates 5 are engaged so as to have play in the thickness direction. With these configurations, the diamond plate 5 can float in the thickness direction. In the present invention, any one of the outer peripheral portion of the inner ring 2 and the side surface of the diamond plate 5 facing the inner ring 2 may be a concave shape, and the other may be a convex shape, and is limited to the embodiment shown in FIG. There is no. The same applies to the relationship between the inner peripheral portion of the outer ring 3 and the side surface of the diamond plate 5 facing the inner ring portion. For example, the outer peripheral portion of the inner ring 2 may have a convex shape, and the side surface of the diamond plate 5 facing this may be concave, and the inner peripheral portion of the outer ring 3 may have a concave shape, and the diamond plate 5 facing this. The side surface may be convex.
このように、内外のリング2、3によって、ダイヤプレート5が側面を保持されたドレッサー1であれば、ダイヤプレート5のダイヤモンド砥粒6を固着したドレス面が内外のリング2、3の厚さ精度の影響を受けないため、従来のようなダイヤプレートの支持部材(ベース部など)によるドレス面の面精度の悪化が起きない。また、浮動可能なダイヤプレート5はドレッシングの際に、両面研磨装置の研磨布表面の形状に追従して動くことができる。そのため、ドレッシングの効率向上(研磨布の厚さ変化量の向上)及び均一な荒さでドレッシングが可能である。また、従来のように支持部材上にダイヤプレートを貼り付けたものではないため、歪みを抑えるために内外のリング2、3の厚さを厚くする必要がない。従って、ドレッサー1が軽量となり、取り扱いやすいものとなる。
In this way, if the dresser 1 is such that the side face of the diamond plate 5 is held by the inner and outer rings 2 and 3, the dress surface to which the diamond abrasive grains 6 of the diamond plate 5 are fixed is the thickness of the inner and outer rings 2 and 3. Since it is not affected by accuracy, the surface accuracy of the dress surface is not deteriorated by the support member (base portion or the like) of the diamond plate as in the prior art. Further, the floatable diamond plate 5 can move following the shape of the polishing cloth surface of the double-side polishing apparatus during dressing. Therefore, dressing can be performed with improved dressing efficiency (improvement in the thickness variation of the polishing cloth) and uniform roughness. Further, since the diamond plate is not pasted on the support member as in the prior art, it is not necessary to increase the thickness of the inner and outer rings 2 and 3 in order to suppress distortion. Therefore, the dresser 1 becomes light and easy to handle.
また、本発明のドレッサー1は、ダイヤプレート5が、ステンレス鋼板上にダイヤモンドを電着した、図1のような複数の扇形部材から成ることが好ましく、複数の扇形部材のそれぞれが内リング2と外リング3との間に設置されることで、リング状に配置されたものであることが好ましい。ここで、本発明における「扇形」とは、図1に示すように、リング形状のダイヤプレート5を外周方向で分割したような形状であることを意味する。すなわち、複数の扇形部材を組み合わせることでリング形状のダイヤプレート5を形成できる。ダイヤプレート5が、複数の扇形部材に分割されたものであれば、1つ1つの扇形部材の面積を小さくできる。面積の小さい扇形部材は、ダイヤモンド砥粒の電着処理によるステンレス鋼板の応力変化量も小さく、平坦度が高いため、ドレス面の面精度が高いドレッサー1となる。また、本発明のドレッサー1は、ダイヤプレートの交換が容易な構造であるため、例えば、扇形部材のダイヤモンド砥粒に不具合が見つかった場合などに、問題のある扇形部材のみ外して容易に交換可能である。
Further, in the dresser 1 of the present invention, the diamond plate 5 is preferably composed of a plurality of fan-shaped members as shown in FIG. 1 in which diamond is electrodeposited on a stainless steel plate. It is preferable that the ring is disposed between the outer ring 3 and the outer ring 3. Here, the “fan shape” in the present invention means a shape obtained by dividing the ring-shaped diamond plate 5 in the outer peripheral direction as shown in FIG. That is, the ring-shaped diamond plate 5 can be formed by combining a plurality of fan-shaped members. If the diamond plate 5 is divided into a plurality of sector members, the area of each sector member can be reduced. The fan-shaped member having a small area also has a small amount of stress change of the stainless steel plate due to the electrodeposition treatment of the diamond abrasive grains, and has a high flatness, so that the dresser 1 has high surface accuracy of the dress surface. In addition, since the dresser 1 of the present invention has a structure in which the diamond plate can be easily exchanged, for example, when a defect is found in the diamond abrasive grains of the sector member, only the problematic sector member can be removed and easily replaced. It is.
また、特に、ダイヤプレート5の平坦度及び平行度は0.02mm以下であることが好ましい。これによって、ドレッシングの効率のさらなる向上及びより均一なドレッシングが可能なドレッサー1となる。
In particular, the flatness and parallelism of the diamond plate 5 are preferably 0.02 mm or less. As a result, the dresser 1 is capable of further improving dressing efficiency and more uniform dressing.
また、内リング2及び外リング3が、ステンレス鋼又は樹脂からなるものであってもよい。内リング及び外リングがSUS製であればドレッサーの強度がより高くなる。また、内リング及び外リングが樹脂製であればより低コストで金属汚染もないとともに、より軽量なドレッサーとなる。
Further, the inner ring 2 and the outer ring 3 may be made of stainless steel or resin. If the inner ring and the outer ring are made of SUS, the strength of the dresser will be higher. In addition, if the inner ring and the outer ring are made of resin, the cost is lower and there is no metal contamination, and the dresser is lighter.
また、本発明のドレッサー1において、外リング3が、外周面に外歯7が周設されたものであり、外歯7をサンギヤとインターナルギヤとに噛合できるものであることが好ましい。例えば、図6のような遊星運動方式の両面研磨装置100は、保持孔に半導体ウェーハWを保持したキャリア103を、サンギヤ101とインターナルギヤ102との間で自公転させることで、半導体ウェーハWの表裏両面を同時に研磨可能な構成を有している。ドレッサー1の外リング3の外歯7がサンギヤ101とインターナルギヤ102とに噛合できるものであれば、サンギヤ101とインターナルギヤ102によって自公転させることで容易に研磨布の全面をドレッシング可能なドレッサーとなる。
Further, in the dresser 1 of the present invention, it is preferable that the outer ring 3 has outer teeth 7 around the outer peripheral surface, and the outer teeth 7 can mesh with the sun gear and the internal gear. For example, the planetary motion type double-side polishing apparatus 100 as shown in FIG. 6 causes the carrier 103 holding the semiconductor wafer W in the holding hole to revolve between the sun gear 101 and the internal gear 102, thereby causing the semiconductor wafer W to rotate. The front and back surfaces can be polished simultaneously. If the outer teeth 7 of the outer ring 3 of the dresser 1 can mesh with the sun gear 101 and the internal gear 102, the entire surface of the polishing cloth can be easily dressed by revolving with the sun gear 101 and the internal gear 102. Become a dresser.
上記の図1、2のような本発明のドレッサー1は、例えば、以下のようにして作製できる。図5は、図1の線分A-A’における断面図である。まず、図1、2のようなドレッサー1を作製する場合、図3、4のように、外リング3、連結部4、下内リング2bが一体となったベースリングと、上内リング2aと、ダイヤプレート5とを準備すればよい。また、ダイヤプレート5としては、扇形の板上にダイヤモンド砥粒を電着した複数の扇形部材を準備できる。なお、ダイヤモンド砥粒を電着した扇形部材は、予め、複数の扇形部材間での厚さのばらつきが小さくなるように、厚さに応じて選別しておけば、より高精度なドレッサーを作製できる。
The dresser 1 of the present invention as shown in FIGS. 1 and 2 can be manufactured as follows, for example. FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG. First, when manufacturing the dresser 1 as shown in FIGS. 1 and 2, as shown in FIGS. 3 and 4, the base ring in which the outer ring 3, the connecting portion 4, and the lower inner ring 2b are integrated, and the upper inner ring 2a The diamond plate 5 may be prepared. Moreover, as the diamond plate 5, a plurality of sector members in which diamond abrasive grains are electrodeposited on a sector plate can be prepared. In addition, if the fan-shaped member electrodeposited with diamond abrasive grains is selected according to the thickness in advance so that the variation in thickness among the plurality of fan-shaped members is reduced, a more accurate dresser can be produced. it can.
次に、図5の(a)に示すように、ダイヤプレート5の外端を外リングの内周部に噛合する。このとき、噛合部にはダイヤプレート5の厚さ方向に遊びを有する。
Next, as shown in FIG. 5A, the outer end of the diamond plate 5 is engaged with the inner peripheral portion of the outer ring. At this time, the meshing portion has play in the thickness direction of the diamond plate 5.
次に、図5の(b)に示すように、ダイヤプレート5の内端を上内リング2aと下内リング2bとで上下から挟み込むようにして上内リング2aを取り付け、内リング2の外周部をダイヤプレート5の内端と噛合させる。このとき、噛合部にはダイヤプレート5の厚さ方向に遊びを有する。
Next, as shown in FIG. 5B, the upper inner ring 2a is attached so that the inner end of the diamond plate 5 is sandwiched from above and below by the upper inner ring 2a and the lower inner ring 2b. The portion is engaged with the inner end of the diamond plate 5. At this time, the meshing portion has play in the thickness direction of the diamond plate 5.
次に、図5の(c)に示すように、上内リング2aと下内リング2bとをボルトで留めて固定する。
Next, as shown in FIG. 5C, the upper inner ring 2a and the lower inner ring 2b are fixed with bolts.
以上のようにして、内リング2の外周部と外リング3の内周部に、ダイヤプレート5をその厚さ方向に非固定で保持して、ダイヤプレート5を厚さ方向に浮動可能としたドレッサー1を作製できる。
As described above, the diamond plate 5 is held non-fixed in the thickness direction on the outer peripheral portion of the inner ring 2 and the inner peripheral portion of the outer ring 3 so that the diamond plate 5 can float in the thickness direction. The dresser 1 can be manufactured.
次に、上記のようなドレッサー1を用いて、両面研磨装置の上下の研磨布をドレッシングする方法を説明する。ドレッシングを行うには、ドレッサー1を両面研磨装置の上定盤と下定盤との間に挟んで通常の研磨と同じように装置を稼動させれば、上下研磨布を同時にドレッシングすることができる。この際には、上記のように外リング3の外歯7を、サンギヤ及びインターナルギヤに噛合させておけば、これらのギヤによってドレッサー1は自公転運動しながら、上下の研磨布の全面をドレッシングすることができる。
Next, a method of dressing the upper and lower polishing cloths of the double-side polishing apparatus using the dresser 1 as described above will be described. In order to perform dressing, if the dresser 1 is sandwiched between the upper surface plate and the lower surface plate of the double-side polishing apparatus and the apparatus is operated in the same manner as normal polishing, the upper and lower polishing cloths can be dressed simultaneously. At this time, if the external teeth 7 of the outer ring 3 are engaged with the sun gear and the internal gear as described above, the dresser 1 rotates and revolves by these gears, and the entire surfaces of the upper and lower polishing cloths are moved. Can be dressed.
また、図2のように、ダイヤプレート5の片面にのみダイヤモンド砥粒6が固着され、ダイヤモンド砥粒6が固着してある面がすべて同じ方向となっているドレッサー1を用いる場合には、ドレッサー1を複数個下定盤の上に配置し、一部のドレッサー1をダイヤモンド砥粒6が下定盤方向に向くように設置し、残りをダイヤモンド砥粒6が上定盤方向に向くように設置してからドレッサー1を上下定盤で挟み込むことで、上下研磨布を同時にドレッシングすることができる。
In addition, as shown in FIG. 2, when using the dresser 1 in which the diamond abrasive grains 6 are fixed to only one side of the diamond plate 5 and the surfaces to which the diamond abrasive grains 6 are fixed are all in the same direction, 1 is arranged on a plurality of lower surface plates, some of the dressers 1 are installed so that the diamond abrasive grains 6 face the lower surface plate, and the rest are placed so that the diamond abrasive grains 6 face the upper surface plate direction. The upper and lower polishing cloths can be dressed simultaneously by sandwiching the dresser 1 between the upper and lower surface plates.
また、ダイヤモンド砥粒6が固着してある面が上下2方向であるドレッサー1を用いて上下研磨布を同時にドレッシングしてもよい。この場合、片面にのみダイヤモンド砥粒6を固着したダイヤプレート5を複数設置し、ダイヤモンド砥粒6が下定盤方向に向くダイヤプレート5と、ダイヤモンド砥粒6が上定盤方向に向くダイヤプレート5とを交互に設置したドレッサー1を用いてもよいし、また、ダイヤプレート5の上下の両面にダイヤモンド砥粒6を固着したドレッサー1を用いてもよい。
Alternatively, the upper and lower polishing cloths may be dressed simultaneously using the dresser 1 in which the surface on which the diamond abrasive grains 6 are fixed is in two directions. In this case, a plurality of diamond plates 5 each having diamond abrasive grains 6 fixed on only one side thereof are installed, diamond plates 6 with diamond abrasive grains 6 facing the lower surface plate, and diamond plates 5 with diamond abrasive grains 6 facing the upper surface plate direction. Or a dresser 1 in which diamond abrasive grains 6 are fixed to both upper and lower surfaces of the diamond plate 5 may be used.
以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明は実施例に限定されるものではない。
Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to the examples.
(実施例)
図6のような、両面研磨装置を用いてシリコンウェーハの研磨を行い、研磨バッチ間に、図1、2に示すような本発明のドレッサーで上下研磨布のドレッシングを行った。そして、ドレッシングの研磨布の厚さ変化量、ドレッシング後の研磨布の表面形状測定、及びドレッシング後の研磨布のSi含有量測定を行った。さらに、ドレッシング前後で、研磨したウェーハのフラットネスの変化を評価した。 (Example)
A silicon wafer was polished using a double-side polishing apparatus as shown in FIG. 6, and dressing of upper and lower polishing cloths was performed between polishing batches with the dresser of the present invention as shown in FIGS. And the thickness change amount of the polishing cloth of dressing, the surface shape measurement of the polishing cloth after dressing, and Si content measurement of the polishing cloth after dressing were performed. Furthermore, the change in flatness of the polished wafer was evaluated before and after dressing.
図6のような、両面研磨装置を用いてシリコンウェーハの研磨を行い、研磨バッチ間に、図1、2に示すような本発明のドレッサーで上下研磨布のドレッシングを行った。そして、ドレッシングの研磨布の厚さ変化量、ドレッシング後の研磨布の表面形状測定、及びドレッシング後の研磨布のSi含有量測定を行った。さらに、ドレッシング前後で、研磨したウェーハのフラットネスの変化を評価した。 (Example)
A silicon wafer was polished using a double-side polishing apparatus as shown in FIG. 6, and dressing of upper and lower polishing cloths was performed between polishing batches with the dresser of the present invention as shown in FIGS. And the thickness change amount of the polishing cloth of dressing, the surface shape measurement of the polishing cloth after dressing, and Si content measurement of the polishing cloth after dressing were performed. Furthermore, the change in flatness of the polished wafer was evaluated before and after dressing.
実施例のドレッサーは、以下のような手順で作製した。即ち、まず、下内リングと外リングとが連結部を介して一体となっているステンレス鋼製のベースリングと、ステンレス鋼製の上内リングと、ステンレス鋼板の片面にダイヤモンド砥粒を固着したダイヤプレートとを準備した。ダイヤプレートは、厚さが1cmのリング状のステンレス鋼板を、8個の扇形状に切り出し、それぞれの表面にダイヤモンド砥粒を電着させて8個の扇形部材を作製した。そして、図5に示した手順で、これらの部材を組み立てて、図1のような本発明のドレッサーを作製した。
The dresser of the example was manufactured by the following procedure. That is, first, diamond abrasive grains are fixed to one surface of a stainless steel base ring, a stainless steel upper inner ring, and a stainless steel plate, in which a lower inner ring and an outer ring are integrated via a connecting portion. A diamond plate was prepared. For the diamond plate, a ring-shaped stainless steel plate having a thickness of 1 cm was cut into eight fan shapes, and diamond abrasive grains were electrodeposited on the respective surfaces to prepare eight fan-shaped members. And these members were assembled in the procedure shown in FIG. 5, and the dresser of this invention like FIG. 1 was produced.
このドレッサーの内リングは、厚さが0.3cm、内径が62cm、外径が65cmとなった。また、外リングは、厚さが0.6cm、外径がギヤ先端74cm、ギヤ歯底73cmとなった。このドレッサーの重量は約5kgであり、後述の比較例にて用いた従来のドレッサーの約1/3の重量となった。このような手順で、4個のドレッサーを作製し、ドレッシングに用いた。
The inner ring of this dresser has a thickness of 0.3 cm, an inner diameter of 62 cm, and an outer diameter of 65 cm. The outer ring has a thickness of 0.6 cm, an outer diameter of 74 cm, and a gear tooth bottom of 73 cm. The weight of this dresser was about 5 kg, which was about 1/3 the weight of the conventional dresser used in the comparative example described later. In this procedure, four dressers were produced and used for dressing.
また、両面研磨装置としては、不二越機械工業株式会社製の両面研磨機30Bを用いた。
Moreover, as a double-side polishing apparatus, a double-side polishing machine 30B manufactured by Fujikoshi Machine Industry Co., Ltd. was used.
ドレッシングの際には、ドレッサーの外歯歯車をサンギヤ及びインターナルギヤに噛み合わせるようにして設置した。この際、2個のドレッサーはダイヤモンド砥粒が上方を向くように、残りの2個のドレッサーはダイヤモンド砥粒が下方を向くように設置した。その後、上下の定盤を回転させながら上定盤と下定盤の対向する研磨布をドレッサーに押し付けるとともに、ドレッサーをサンギヤとインターナルギヤとの間で自転公転させることで上下の研磨布を同時にドレッシングした。研磨布としては、ウレタン製研磨パッドを用いた。
When dressing, the external gear of the dresser was installed so as to mesh with the sun gear and the internal gear. At this time, the two dressers were installed so that the diamond abrasive grains face upward, and the remaining two dressers were placed so that the diamond abrasive grains face downward. Then, while rotating the upper and lower surface plates, press the polishing cloths facing the upper and lower surface plates against the dresser and simultaneously rotate the dresser between the sun gear and the internal gear to simultaneously dress the upper and lower polishing cloths. did. As the polishing cloth, a urethane polishing pad was used.
また、ドレッシングでは、上下定盤の相対回転速度がドレッサーの公転に対して1:1となるように上下定盤及びドレッサーを自公転させた。また、ドレッサーに対する荷重は、研磨時の荷重と同じとし、ドレッシング時間は60分とした。
In dressing, the upper and lower surface plates and the dresser were revolved so that the relative rotational speed of the upper and lower surface plates was 1: 1 with respect to the revolution of the dresser. The load on the dresser was the same as the load during polishing, and the dressing time was 60 minutes.
なお、直径300mmのシリコンウェーハの研磨条件として、荷重150gf/cm2、上下定盤、サンギヤ及びインターナルギヤの回転数はキャリア公転数と上定盤回転数の差、及び下定盤回転数とキャリア公転数の差がともに10rpmになるように、キャリア自転数が2.5rpmになるように設定し加工した。
As for polishing conditions for a silicon wafer having a diameter of 300 mm, the load is 150 gf / cm 2 , the rotation speed of the upper and lower surface plates, the sun gear and the internal gear is the difference between the carrier revolution number and the upper surface plate rotation number, and the lower surface plate rotation number and the carrier. Processing was performed so that the carrier rotation speed was set to 2.5 rpm so that the difference in revolution number was 10 rpm.
研磨バッチ間のドレッシング後に、上下研磨布の厚さ変化量、研磨布の表面形状測定、及びドレッシング後の研磨布のSi含有量測定を行った。なお、研磨布の厚さ変化量は、ドレッシング前後の研磨布の厚さから算出した。また、研磨布の表面形状は真直度測定機を用いて測定した。また、研磨布のSi含有量は、SEMで測定した。
After dressing between polishing batches, the amount of change in thickness of the upper and lower polishing cloths, measurement of the surface shape of the polishing cloth, and measurement of the Si content of the polishing cloth after dressing were performed. The amount of change in the thickness of the polishing pad was calculated from the thickness of the polishing pad before and after dressing. The surface shape of the polishing cloth was measured using a straightness measuring machine. Moreover, Si content of polishing cloth was measured by SEM.
その結果、図9に示すように、後述の比較例に比べて実施例のほうが研磨布の厚さの変化量が大きく、研磨布の厚さ変化量は後述の比較例よりも1割向上し、効果的なドレッシングが行われたことがわかった。なお、図9では、研磨布の厚さの変化量として、比較例の研磨布の厚さの変化量を1とした相対値を記載している。また、図10に示すように、実施例では研磨布のSi含有量が比較例よりも1割少なくなり、シリコンウェーハの研磨屑による目詰まりを、比較例よりも十分に除去できたことが分かった。なお、図10では、Si含有量として、比較例のSi含有量を1とした相対値を記載している。
As a result, as shown in FIG. 9, the amount of change in the thickness of the polishing cloth is larger in the example than in the comparative example described later, and the amount of change in the thickness of the polishing cloth is 10% higher than the comparative example described later. And found that effective dressing was done. In FIG. 9, a relative value with the amount of change in the thickness of the polishing cloth of the comparative example as 1 is shown as the amount of change in the thickness of the polishing cloth. In addition, as shown in FIG. 10, in the example, the Si content of the polishing cloth was 10% less than that of the comparative example, and it was found that clogging due to polishing scraps of the silicon wafer was sufficiently removed as compared with the comparative example. It was. In addition, in FIG. 10, the relative value which set Si content of the comparative example to 1 is described as Si content.
また、シリコンウェーハのフラットネスとして、GBIR(Global Backsurface-referenced Ideal plane/Range)及びROA(Roll Off Amount)をNanometroで測定した。その結果、図11、12に示すように、実施例では、後述の比較例と同等のフラットネスが得られた。
Further, as the flatness of the silicon wafer, GBIR (Global Backsurface-referenced ideal plane / Range) and ROA (Roll Off Amount) were measured with Nanometer. As a result, as shown in FIGS. 11 and 12, in the example, a flatness equivalent to that of a comparative example described later was obtained.
(比較例)
図7のような従来のドレッサーを用いたこと以外、実施例と同様な条件で両面研磨及びバッチ間ドレッシングを行い、実施例と同様にドレッシングの評価及び直径300mmのシリコンウェーハのフラットネスの評価を行った。比較例におけるドレッサーは、リング状のベース部に、ステンレス板上にダイヤモンドを電着した複数の扇形部材から成るダイヤプレートをリング状に8個配置したものとした。このようなドレッサーの重量は約15kgであり、実施例のドレッサーより重くなった。 (Comparative example)
Except for using the conventional dresser as shown in FIG. 7, double-side polishing and batch-to-batch dressing are performed under the same conditions as in the example. went. The dresser in the comparative example was configured such that eight diamond plates made of a plurality of fan-shaped members electrodeposited with diamond on a stainless steel plate were arranged in a ring shape on a ring-shaped base portion. The weight of such a dresser was about 15 kg, which was heavier than the dresser of the example.
図7のような従来のドレッサーを用いたこと以外、実施例と同様な条件で両面研磨及びバッチ間ドレッシングを行い、実施例と同様にドレッシングの評価及び直径300mmのシリコンウェーハのフラットネスの評価を行った。比較例におけるドレッサーは、リング状のベース部に、ステンレス板上にダイヤモンドを電着した複数の扇形部材から成るダイヤプレートをリング状に8個配置したものとした。このようなドレッサーの重量は約15kgであり、実施例のドレッサーより重くなった。 (Comparative example)
Except for using the conventional dresser as shown in FIG. 7, double-side polishing and batch-to-batch dressing are performed under the same conditions as in the example. went. The dresser in the comparative example was configured such that eight diamond plates made of a plurality of fan-shaped members electrodeposited with diamond on a stainless steel plate were arranged in a ring shape on a ring-shaped base portion. The weight of such a dresser was about 15 kg, which was heavier than the dresser of the example.
ドレッシングの評価の結果、図9のように、研磨布の厚さ変化量は実施例よりも少なく、ドレッシング効果が低い結果となった。さらに、図10のように、研磨布のSi含有量は実施例よりも多くなり、シリコンウェーハの研磨屑による目詰まりが、実施例よりも多く残ってしまい、比較例より効果的なドレッシング効果が得られていることが確認できた。
As a result of the dressing evaluation, as shown in FIG. 9, the thickness change amount of the polishing cloth was smaller than that of the example, and the dressing effect was low. Furthermore, as shown in FIG. 10, the Si content of the polishing cloth is larger than that in the example, and the clogging due to the polishing scraps of the silicon wafer remains more than in the example, and the dressing effect more effective than the comparative example is achieved. It was confirmed that it was obtained.
また、実施例と同様に、両面研磨を行った後のシリコンウェーハのフラットネスを調べたところ、図11、12のように実施例と同等のフラットネスであった。
Further, as in the example, when the flatness of the silicon wafer after double-side polishing was examined, it was the same flatness as in the example as shown in FIGS.
なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。
Note that the present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
Claims (6)
- 両面研磨装置の上定盤と下定盤にそれぞれ貼り付けられた研磨布をドレッシングするためのダイヤモンド砥粒を固着したダイヤプレートを具備するドレッサーであって、
内リングと、
該内リングよりも直径が大きく、前記内リングの外側に前記内リングと同心円状に配置され、前記内リングに連結する連結部を有する外リングと、
前記内リングと前記外リングとの間に配置され、前記内リングの外周部と前記外リングの内周部によって側面を保持され、厚さが前記内リングと前記外リングよりも厚い前記ダイヤプレートと、
を具備し、
前記ダイヤプレートが、前記内リングの外周部と前記外リングの内周部に、前記ダイヤプレートの厚さ方向に非固定で保持されたものであることで、前記ダイヤプレートの厚さ方向に浮動可能なものであることを特徴とするドレッサー。 A dresser comprising a diamond plate to which diamond abrasive grains are fixed for dressing a polishing cloth affixed to an upper surface plate and a lower surface plate of a double-side polishing apparatus,
An inner ring,
An outer ring having a diameter larger than the inner ring, concentrically arranged on the outer side of the inner ring and connected to the inner ring;
The diamond plate that is disposed between the inner ring and the outer ring, has a side surface held by the outer peripheral portion of the inner ring and the inner peripheral portion of the outer ring, and is thicker than the inner ring and the outer ring. When,
Comprising
The diamond plate is held in the outer peripheral portion of the inner ring and the inner peripheral portion of the outer ring in an unfixed manner in the thickness direction of the diamond plate, so that it floats in the thickness direction of the diamond plate. A dresser characterized by being capable. - 前記内リングの外周部、該内リングの外周部に対向する前記ダイヤプレートの側面、前記外リングの内周部、及び、該外リングの内周部に対向する前記ダイヤプレートの側面が凹形状又は凸形状のいずれかの形状を有し、前記凹形状に対して前記凸形状が前記ダイヤプレートの厚さ方向に遊びを有するように噛合していることで、前記内リングの外周部と前記外リングの内周部によって、前記ダイヤプレートが厚さ方向に浮動可能なように保持されたものであることを特徴とする請求項1に記載のドレッサー。 The outer peripheral portion of the inner ring, the side surface of the diamond plate facing the outer peripheral portion of the inner ring, the inner peripheral portion of the outer ring, and the side surface of the diamond plate facing the inner peripheral portion of the outer ring are concave. Or a convex shape, and the convex shape meshes with the concave shape so as to have play in the thickness direction of the diamond plate, and the outer peripheral portion of the inner ring and the The dresser according to claim 1, wherein the diamond plate is held by an inner peripheral portion of an outer ring so as to be floatable in a thickness direction.
- 前記ダイヤプレートが、ステンレス鋼板上にダイヤモンドを電着した複数の扇形部材から成り、該複数の扇形部材のそれぞれが前記内リングと前記外リングとの間に設置されることで、リング状に配置されたものであることを特徴とする請求項1又は請求項2に記載のドレッサー。 The diamond plate is composed of a plurality of fan-shaped members electrodeposited with diamond on a stainless steel plate, and each of the plurality of fan-shaped members is disposed between the inner ring and the outer ring to be arranged in a ring shape. The dresser according to claim 1 or 2, wherein
- 前記ダイヤプレートの平坦度及び平行度は0.02mm以下であることを特徴とする請求項1から請求項3のいずれか1項に記載のドレッサー。 The dresser according to any one of claims 1 to 3, wherein the diamond plate has a flatness and parallelism of 0.02 mm or less.
- 前記内リング及び前記外リングが、ステンレス鋼又は樹脂からなるものであることを特徴とする請求項1から請求項4のいずれか1項に記載のドレッサー。 The dresser according to any one of claims 1 to 4, wherein the inner ring and the outer ring are made of stainless steel or resin.
- 前記両面研磨装置が、保持孔に半導体ウェーハを保持したキャリアを、サンギヤとインターナルギヤとの間で自公転させることで、前記半導体ウェーハの表裏両面を同時に研磨する遊星運動方式の両面研磨装置であり、
前記外リングが、外周面に外歯が周設されたものであり、該外歯を前記サンギヤと前記インターナルギヤとに噛合できるものであることを特徴とする請求項1から請求項5のいずれか1項に記載のドレッサー。 The double-side polishing apparatus is a planetary motion type double-side polishing apparatus that simultaneously polishes both the front and back surfaces of the semiconductor wafer by revolving the carrier holding the semiconductor wafer in the holding hole between the sun gear and the internal gear. Yes,
6. The outer ring according to claim 1, wherein outer teeth are provided around an outer peripheral surface, and the outer teeth can mesh with the sun gear and the internal gear. The dresser of any one of Claims.
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JP2016169396A JP2018034257A (en) | 2016-08-31 | 2016-08-31 | dresser |
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TWI706831B (en) * | 2020-02-10 | 2020-10-11 | 富仕多科技有限公司 | Base seat used in polishing pad conditioning apparatus |
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KR102174958B1 (en) * | 2019-03-27 | 2020-11-05 | 에스케이씨 주식회사 | Polishing pad which minimizes occurence of defect and preparation method thereof |
TWI755069B (en) * | 2020-09-21 | 2022-02-11 | 合晶科技股份有限公司 | Method for dressing polish pad |
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JP2000190200A (en) * | 1998-12-25 | 2000-07-11 | Mitsubishi Materials Silicon Corp | Seasoning jig for polishing cloth |
JP2001179600A (en) * | 1999-12-20 | 2001-07-03 | Speedfam Co Ltd | Dresser |
JP2004098214A (en) * | 2002-09-09 | 2004-04-02 | Read Co Ltd | Dresser for polishing cloth and dressing method for polishing cloth using the same |
JP2014147993A (en) * | 2013-01-31 | 2014-08-21 | Shin Etsu Handotai Co Ltd | Dressing plate and method for manufacturing the same |
JP2015071224A (en) * | 2009-03-24 | 2015-04-16 | サンーゴバン アブレイシブズ,インコーポレイティド | Abrasive tool for use as chemical mechanical planarization pad conditioner |
-
2016
- 2016-08-31 JP JP2016169396A patent/JP2018034257A/en active Pending
-
2017
- 2017-08-07 WO PCT/JP2017/028633 patent/WO2018043054A1/en active Application Filing
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Patent Citations (5)
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JP2000190200A (en) * | 1998-12-25 | 2000-07-11 | Mitsubishi Materials Silicon Corp | Seasoning jig for polishing cloth |
JP2001179600A (en) * | 1999-12-20 | 2001-07-03 | Speedfam Co Ltd | Dresser |
JP2004098214A (en) * | 2002-09-09 | 2004-04-02 | Read Co Ltd | Dresser for polishing cloth and dressing method for polishing cloth using the same |
JP2015071224A (en) * | 2009-03-24 | 2015-04-16 | サンーゴバン アブレイシブズ,インコーポレイティド | Abrasive tool for use as chemical mechanical planarization pad conditioner |
JP2014147993A (en) * | 2013-01-31 | 2014-08-21 | Shin Etsu Handotai Co Ltd | Dressing plate and method for manufacturing the same |
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TWI706831B (en) * | 2020-02-10 | 2020-10-11 | 富仕多科技有限公司 | Base seat used in polishing pad conditioning apparatus |
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