WO2018023487A1 - Led device with high luminous efficiency - Google Patents

Led device with high luminous efficiency Download PDF

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Publication number
WO2018023487A1
WO2018023487A1 PCT/CN2016/093052 CN2016093052W WO2018023487A1 WO 2018023487 A1 WO2018023487 A1 WO 2018023487A1 CN 2016093052 W CN2016093052 W CN 2016093052W WO 2018023487 A1 WO2018023487 A1 WO 2018023487A1
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Prior art keywords
led device
luminous efficiency
pin
light guiding
light
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PCT/CN2016/093052
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French (fr)
Chinese (zh)
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袁志贤
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袁志贤
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Priority to PCT/CN2016/093052 priority Critical patent/WO2018023487A1/en
Publication of WO2018023487A1 publication Critical patent/WO2018023487A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers

Definitions

  • the utility model relates to an LED device, in particular to an LED device with high luminous efficiency.
  • the LED device Since the LED device has the power-saving characteristics of low current and low voltage driving, it has become one of the most important light sources nowadays, and its usage rate is also very wide.
  • the general LED device comprises a transparent substrate and a lead extending from the substrate, wherein the substrate is encapsulated by a high transparency epoxy resin, and one of the pins is provided with a semiconductor chip. When the semiconductor chip emits light, light will diverge through the surface of the transparent substrate.
  • the current luminous efficiency of general LED devices tends to be poor.
  • the luminous efficiency of an LED device is generally referred to as the external quantum efficiency of the component, which is the product of the internal quantum efficiency of the component and the extraction efficiency of the component.
  • the internal quantum efficiency is the photoelectric conversion efficiency of the component itself, which is mainly related to the impurity, defect and epitaxial composition of the component material.
  • the extraction efficiency of the component refers to the number of photons actually generated outside the component after the photons generated inside the component are refracted, absorbed by the material, and reflected. Therefore, the factors affecting the efficiency of component extraction include the absorption of the component material itself.
  • the product of the above two efficiencies is the illuminating effect of the entire component, that is, the external quantum efficiency of the component.
  • the method is generally to improve the quality of epitaxial and change the structure of epitaxial, so that the electrical energy is not easily converted into thermal energy.
  • the internal quantum efficiency of this kind is close to the theoretical limit, in other words. Increase The internal quantum efficiency has reached the limit and can no longer be improved. In this case, the external quantum efficiency of the component can only be improved by the extraction efficiency of the lifting component.
  • the most common way to extract the efficiency of the lifting element is to change the geometry of the semiconductor chip inside the LED so that the light can be refracted after passing through the reflective surface of the chip.
  • this method is only suitable for easy cutting.
  • On the quaternary red light-emitting diode chip it has a relatively high degree of difficulty for a light-emitting diode chip having a high hardness [such as a GaN series of a sapphire substrate].
  • the technical problem to be solved by the embodiments of the present invention is to provide an LED device with high luminous efficiency.
  • the utility model provides an LED device with high luminous efficiency, comprising a transparent substrate, a first pin and a second pin, wherein the first and second pins are disposed on a transparent substrate and are arranged on a transparent substrate.
  • the first pin is provided with a semiconductor chip, the semiconductor chip is electrically connected to the second pin through a wire;
  • the light guiding surface of the transparent substrate is provided with a light guiding member, and the light guiding member comprises A number of inclined light guiding surfaces.
  • the plurality of inclined light guiding surfaces are equal angle cutting.
  • the semiconductor chip is electrically connected to the second pin through a gold wire.
  • the light guiding member is disposed on a surface of the transparent substrate.
  • the light guiding member is disposed at an end of the transparent substrate.
  • the above LED device with high luminous efficiency can make the LED device focus and emit light at a specific angle by providing a light guiding member composed of a plurality of inclined light guiding surfaces cut at equal angles, thereby improving the luminous efficiency of the LED device.
  • FIG. 1 is a schematic structural view of a preferred embodiment of an LED device having high luminous efficiency of the present invention.
  • FIG. 2 is a schematic view of the light output of the LED device shown in FIG. 1.
  • FIG. 2 is a schematic view of the light output of the LED device shown in FIG. 1.
  • first, second, and the like are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a “first” element may also be referred to as a “second” element without departing from the teachings of the invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of an LED device with high luminous efficiency.
  • the preferred embodiment of the LED device includes a transparent substrate 11 , a first pin 12 and a second pin 13 , wherein the first pin 12 and the second pin 13 are both disposed on the substrate 11 and from the substrate 11 . Extend out.
  • a semiconductor chip 14 is disposed on the first pin 12, and the semiconductor chip 14 is electrically connected to the second pin 13 through a gold wire 15. When the current flows, the semiconductor chip 14 can emit light and emit light through the transparent substrate 11.
  • the light guiding surface 112 of the transparent substrate 11 is provided with a light guiding member 112, and the light guiding member 112 includes a plurality of inclined light guiding surfaces 113 cut at equal angles.
  • the light of the LED device 1 is concentrated and refracted by the angle of the inclined surface of the light guiding surface 113, so that the light is refracted at an angle perpendicular to the light guiding surface 113 to form an emitting light source of a specific angle.
  • each light guiding member 112 is inclined at a specific angle, so that the light can be effectively guided to be concentrated and reflected in a direction perpendicular to the light guiding surface 113, so that the light of the LED device 1 can be effectively controlled.
  • the axes illuminate in the same direction or in the opposite direction.
  • the light guide 112 is disposed at an end of the transparent substrate 11 . In other embodiments, the light guide 112 can be disposed at any position on the surface of the transparent substrate 11, and the light guide 112 can still function to guide and collect light.
  • the LED device with high luminous efficiency can make the LED device focus and emit light at a specific angle by providing a light guiding member 112 composed of a plurality of inclined light guiding surfaces 113 cut at equal angles, thereby improving the LED device. Luminous efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

An LED device with a high luminous efficiency, comprises a transparent base (11), a first pin (12) and a second pin (13), wherein both the first and second pins (12, 13) are provided on the transparent base (11) and extend from the same, the first pin (12) is provided with a semiconductor chip (14) which is conducted with the second pin (13) through a wire (15), and a light guide member (112) is disposed on a light emitting surface (111) of the transparent base (11), the light guide member (112) comprising a plurality of inclined light guide surfaces (113). The LED device has a high luminous efficiency.

Description

具有高发光效率的LED设备LED device with high luminous efficiency 技术领域Technical field
本实用新型涉及一种LED设备，特别涉及一种具有高发光效率的LED设备。The utility model relates to an LED device, in particular to an LED device with high luminous efficiency.
背景技术Background technique
由于LED设备具有低电流低电压驱动的省电特性，因此其成为现在最为重视的光源之一，其使用率亦十分广泛。现在一般的LED设备均包括透明基体及设于基体上延伸而出的引脚，其中该基体为高透明度的环氧树脂封装而成，而且，其中一个接脚上设有半导体芯片。当该半导体芯片发光时，光线将通过透明基体的表面发散而出。然而，目前一般的LED设备的发光效率往往不佳。Since the LED device has the power-saving characteristics of low current and low voltage driving, it has become one of the most important light sources nowadays, and its usage rate is also very wide. Nowadays, the general LED device comprises a transparent substrate and a lead extending from the substrate, wherein the substrate is encapsulated by a high transparency epoxy resin, and one of the pins is provided with a semiconductor chip. When the semiconductor chip emits light, light will diverge through the surface of the transparent substrate. However, the current luminous efficiency of general LED devices tends to be poor.
LED设备的发光效率一般称为元件的外部量子效率，其为元件内部量子效率及元件的取出效率的乘积。其中，内部量子效率即是元件本身的光电转换效率，其主要与元件材料的杂质、缺陷及元件的磊晶组成结构息息相关。元件的取出效率则是指元件内部产生的光子在经过了折射、材料的吸收、反射后实际上在元件外部所量得之光子数目，因此影响元件取出效率的因素包括了元件材料本身的吸收、元件的几何结构、元件及封装材料的折射率差及元件结构的散射特性等等。The luminous efficiency of an LED device is generally referred to as the external quantum efficiency of the component, which is the product of the internal quantum efficiency of the component and the extraction efficiency of the component. Among them, the internal quantum efficiency is the photoelectric conversion efficiency of the component itself, which is mainly related to the impurity, defect and epitaxial composition of the component material. The extraction efficiency of the component refers to the number of photons actually generated outside the component after the photons generated inside the component are refracted, absorbed by the material, and reflected. Therefore, the factors affecting the efficiency of component extraction include the absorption of the component material itself. The geometry of the component, the refractive index difference of the component and the encapsulation material, and the scattering characteristics of the component structure, and the like.
而上述两种效率的乘积即是整个元件的发光效果，亦即是元件的外部量子效率。以往元件的发展大多集中在提升内部量子效率，其方法一般是提高磊晶的质量及改变磊晶的结构，使电能不易转换成热能，然而，该种提升内部量子效率已接近理论的极限，换言之，提升 内部量子效率已到达极限无法再提升，既然如此，仅能转由提升元件的取出效率来提升元件的外部量子效率。The product of the above two efficiencies is the illuminating effect of the entire component, that is, the external quantum efficiency of the component. In the past, the development of components mostly focused on improving the internal quantum efficiency. The method is generally to improve the quality of epitaxial and change the structure of epitaxial, so that the electrical energy is not easily converted into thermal energy. However, the internal quantum efficiency of this kind is close to the theoretical limit, in other words. Increase The internal quantum efficiency has reached the limit and can no longer be improved. In this case, the external quantum efficiency of the component can only be improved by the extraction efficiency of the lifting component.
目前最为常见的提升元件的取出效率的方式，大多是改变发光二极管内部的半导体芯片的几何形状，使光得以穿过芯片的反射面后予以折射，然而，这种方法仅适用于易切割加工的四元红光发光二极管芯片上，对于硬度较高的发光二极管芯片[例如蓝宝石(Sapphire)基板之GaN系列]，具有相当高的困难度。At present, the most common way to extract the efficiency of the lifting element is to change the geometry of the semiconductor chip inside the LED so that the light can be refracted after passing through the reflective surface of the chip. However, this method is only suitable for easy cutting. On the quaternary red light-emitting diode chip, it has a relatively high degree of difficulty for a light-emitting diode chip having a high hardness [such as a GaN series of a sapphire substrate].
实用新型内容Utility model content
本实用新型实施例所要解决的技术问题在于提供了一种具有高发光效率的LED设备。The technical problem to be solved by the embodiments of the present invention is to provide an LED device with high luminous efficiency.
本实用新型提供了一种具有高发光效率的LED设备，包括透明基体、第一引脚及第二引脚，其中所述第一及第二引脚均设置于透明基体上且从透明基体上延伸而出，所述第一引脚上设置有半导体芯片，所述半导体芯片通过导线与第二引脚导通；所述透明基体的出光面上设置有导光件，所述导光件包括若干倾斜导光面。The utility model provides an LED device with high luminous efficiency, comprising a transparent substrate, a first pin and a second pin, wherein the first and second pins are disposed on a transparent substrate and are arranged on a transparent substrate. Extendingly, the first pin is provided with a semiconductor chip, the semiconductor chip is electrically connected to the second pin through a wire; the light guiding surface of the transparent substrate is provided with a light guiding member, and the light guiding member comprises A number of inclined light guiding surfaces.
其中，所述若干倾斜导光面为等角度切割。Wherein, the plurality of inclined light guiding surfaces are equal angle cutting.
其中，所述半导体芯片通过金线与第二引脚导通。Wherein, the semiconductor chip is electrically connected to the second pin through a gold wire.
其中，所述导光件设置于透明基体的表面。Wherein, the light guiding member is disposed on a surface of the transparent substrate.
其中，所述导光件设置于透明基体的端部。Wherein, the light guiding member is disposed at an end of the transparent substrate.
上述具有高发光效率的LED设备通过设置由若干以等角度切割的倾斜导光面所组成的导光件可以使得LED设备得以特定角度集中亮度发光，进而可以提升LED设备的发光效率。The above LED device with high luminous efficiency can make the LED device focus and emit light at a specific angle by providing a light guiding member composed of a plurality of inclined light guiding surfaces cut at equal angles, thereby improving the luminous efficiency of the LED device.
附图说明 DRAWINGS
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图；In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description It is only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to the drawings without any creative work;
图1是本实用新型具有高发光效率的LED设备的较佳实施方式的结构示意图。1 is a schematic structural view of a preferred embodiment of an LED device having high luminous efficiency of the present invention.
图2是图1中所示的LED设备的出光示意图。FIG. 2 is a schematic view of the light output of the LED device shown in FIG. 1. FIG.
具体实施方式detailed description
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
首先，在对实施例进行描述之前，有必要对本文中出现的一些术语进行解释。例如：First, it is necessary to explain some of the terms appearing in this article before describing the embodiments. E.g:
本文中若出现使用“第一”、“第二”等术语来描述各种元件，但是这些元件不应当由这些术语所限制。这些术语仅用来区分一个元件和另一个元件。因此，“第一”元件也可以被称为“第二”元件而不偏离本实用新型的教导。The terms "first", "second", and the like are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a "first" element may also be referred to as a "second" element without departing from the teachings of the invention.
另外，应当理解的是，当提及一元件“连接”或者“联接”到另一元件时，其可以直接地连接或直接地联接到另一元件或者也可以存在中间元件。相反地，当提及一元件“直接地连接”或“直接地联接” 到另一元件时，则不存在中间元件。In addition, it is to be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or directly coupled to the other element or the intermediate element. Conversely, when referring to an element "directly connected" or "directly connected" When it comes to another component, there is no intermediate component.
在本文中出现的各种术语仅仅用于描述具体的实施方式的目的而无意作为对本实用新型的限定。除非上下文另外清楚地指出，则单数形式意图也包括复数形式。The various terms appearing herein are merely used to describe the specific embodiments and are not intended to limit the invention. Unless the context clearly indicates otherwise, the singular forms are intended to include the plural.
当在本说明书中使用术语“包括”和/或“包括有”时，这些术语指明了所述特征、整体、步骤、操作、元件和/或部件的存在，但是也不排除一个以上其他特征、整体、步骤、操作、元件、部件和/或其群组的存在和/或附加。When the terms "include" and/or "include" are used in the specification, the terms are used to indicate the presence of the features, integers, steps, operations, components and/or components, but do not exclude one or more other features, The existence and/or addition of the whole, steps, operations, elements, components and/or groups thereof.
关于实施例：About the embodiment:
请参考图1所示，其为本实用新型具有高发光效率的LED设备的较佳实施方式的结构示意图。所述LED设备的较佳实施方式包括透明基体11、第一引脚12及第二引脚13，其中所述第一引脚12及第二引脚13均设置于基体11上且从基体11上延伸而出。所述第一引脚12上设置有半导体芯片14，所述半导体芯片14通过金线15与第二引脚13导通。当电流流通时，所述半导体芯片14即可发光，并通过透明基体11射出光线。Please refer to FIG. 1 , which is a schematic structural view of a preferred embodiment of an LED device with high luminous efficiency. The preferred embodiment of the LED device includes a transparent substrate 11 , a first pin 12 and a second pin 13 , wherein the first pin 12 and the second pin 13 are both disposed on the substrate 11 and from the substrate 11 . Extend out. A semiconductor chip 14 is disposed on the first pin 12, and the semiconductor chip 14 is electrically connected to the second pin 13 through a gold wire 15. When the current flows, the semiconductor chip 14 can emit light and emit light through the transparent substrate 11.
所述透明基体11的出光面111上设置有导光件112，所述导光件112包括若干以等角度切割的倾斜导光面113。本实施方式中，通过导光面113的倾斜面角度予以聚集及折射LED设备1的光线，使得光线以与导光面113垂直的角度折射而出，形成特定角度的发射光源。The light guiding surface 112 of the transparent substrate 11 is provided with a light guiding member 112, and the light guiding member 112 includes a plurality of inclined light guiding surfaces 113 cut at equal angles. In the present embodiment, the light of the LED device 1 is concentrated and refracted by the angle of the inclined surface of the light guiding surface 113, so that the light is refracted at an angle perpendicular to the light guiding surface 113 to form an emitting light source of a specific angle.
请继续参考图2所示，通电时，所述半导体芯片14发亮，使得光线通过透明基体11的出光面111而发散。由于出光面111上设有导光件112，所以光线将通过导光件112的导光面113反射而出。由 于每一导光件112的导光面113呈特定的角度倾斜，因此可有效的引导光线以与导光面113垂直的方向集中反射，如此，即可有效的控制LED设备1的光线以视轴的同向或者反向而发光。Referring to FIG. 2, when the power is turned on, the semiconductor chip 14 is illuminated, so that the light is diverged through the light-emitting surface 111 of the transparent substrate 11. Since the light guiding member 112 is disposed on the light emitting surface 111, the light is reflected by the light guiding surface 113 of the light guiding member 112. By The light guiding surface 113 of each light guiding member 112 is inclined at a specific angle, so that the light can be effectively guided to be concentrated and reflected in a direction perpendicular to the light guiding surface 113, so that the light of the LED device 1 can be effectively controlled. The axes illuminate in the same direction or in the opposite direction.
本实施方式中，所述导光件112设置于透明基体11的端部。其他实施方式中，所述导光件112可设置于透明基体11的表面上的任何位置，此时所述导光件112仍能起到引导及聚集光线的功能。In the embodiment, the light guide 112 is disposed at an end of the transparent substrate 11 . In other embodiments, the light guide 112 can be disposed at any position on the surface of the transparent substrate 11, and the light guide 112 can still function to guide and collect light.
本实用新型所述的具有高发光效率的LED设备通过设置由若干以等角度切割的倾斜导光面113组成的导光件112可以使得LED设备得以特定角度集中亮度发光，进而可以提升LED设备的发光效率。The LED device with high luminous efficiency according to the present invention can make the LED device focus and emit light at a specific angle by providing a light guiding member 112 composed of a plurality of inclined light guiding surfaces 113 cut at equal angles, thereby improving the LED device. Luminous efficiency.
以上仅为本实用新型的实施方式，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。 The above is only the embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other related The technical field is equally included in the scope of patent protection of the present invention.

Claims (5)

  1. 一种具有高发光效率的LED设备，其特征在于：所述LED设备包括透明基体、第一引脚及第二引脚，其中所述第一及第二引脚均设置于透明基体上且从透明基体上延伸而出，所述第一引脚上设置有半导体芯片，所述半导体芯片通过导线与第二引脚导通；所述透明基体的出光面上设置有导光件，所述导光件包括若干倾斜导光面。An LED device with high luminous efficiency, characterized in that the LED device comprises a transparent substrate, a first pin and a second pin, wherein the first and second pins are disposed on a transparent substrate and Extending on the transparent substrate, the first pin is provided with a semiconductor chip, the semiconductor chip is electrically connected to the second pin through a wire; the light guiding surface of the transparent substrate is provided with a light guiding member, the guiding The light member includes a plurality of inclined light guiding surfaces.
  2. 如权利要求1所述的具有高发光效率的LED设备，其特征在于：所述若干倾斜导光面为等角度切割。The LED device with high luminous efficiency according to claim 1, wherein the plurality of inclined light guiding surfaces are equiangularly cut.
  3. 如权利要求1所述的具有高发光效率的LED设备，其特征在于：所述半导体芯片通过金线与第二引脚导通。The LED device with high luminous efficiency according to claim 1, wherein said semiconductor chip is electrically connected to said second pin through a gold wire.
  4. 如权利要求1所述的具有高发光效率的LED设备，其特征在于：所述导光件设置于透明基体的表面。The LED device with high luminous efficiency according to claim 1, wherein the light guiding member is disposed on a surface of the transparent substrate.
  5. 如权利要求4所述的具有高发光效率的LED设备，其特征在于：所述导光件设置于透明基体的端部。 The LED device with high luminous efficiency according to claim 4, wherein the light guiding member is disposed at an end of the transparent substrate.
PCT/CN2016/093052 2016-08-03 2016-08-03 Led device with high luminous efficiency WO2018023487A1 (en)

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Citations (6)

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CN201044244Y (en) * 2007-04-02 2008-04-02 亚帝欧光电股份有限公司 Structure improvement of light emitting diode
CN101241960A (en) * 2007-02-08 2008-08-13 台达电子工业股份有限公司 LED package and its making method
US20080272384A1 (en) * 2007-05-04 2008-11-06 Ado Optronics Corporation Light emitting diode
US20090121252A1 (en) * 2007-11-14 2009-05-14 Hung-Tsung Hsu Method for manufacturing flip-chip light emitting diode package
CN106090635A (en) * 2016-08-03 2016-11-09 袁志贤 There is the LED device of high-luminous-efficiency
CN205842228U (en) * 2016-08-03 2016-12-28 袁志贤 There is the LED device of high-luminous-efficiency

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101241960A (en) * 2007-02-08 2008-08-13 台达电子工业股份有限公司 LED package and its making method
CN201044244Y (en) * 2007-04-02 2008-04-02 亚帝欧光电股份有限公司 Structure improvement of light emitting diode
US20080272384A1 (en) * 2007-05-04 2008-11-06 Ado Optronics Corporation Light emitting diode
US20090121252A1 (en) * 2007-11-14 2009-05-14 Hung-Tsung Hsu Method for manufacturing flip-chip light emitting diode package
CN106090635A (en) * 2016-08-03 2016-11-09 袁志贤 There is the LED device of high-luminous-efficiency
CN205842228U (en) * 2016-08-03 2016-12-28 袁志贤 There is the LED device of high-luminous-efficiency

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