WO2018004138A1 - Couvercle de capteur d'empreinte digitale, dispositif de détection d'empreinte digitale et dispositif tactile le comprenant - Google Patents

Couvercle de capteur d'empreinte digitale, dispositif de détection d'empreinte digitale et dispositif tactile le comprenant Download PDF

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Publication number
WO2018004138A1
WO2018004138A1 PCT/KR2017/005868 KR2017005868W WO2018004138A1 WO 2018004138 A1 WO2018004138 A1 WO 2018004138A1 KR 2017005868 W KR2017005868 W KR 2017005868W WO 2018004138 A1 WO2018004138 A1 WO 2018004138A1
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WO
WIPO (PCT)
Prior art keywords
layer
disposed
substrate
groove
fingerprint sensor
Prior art date
Application number
PCT/KR2017/005868
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English (en)
Korean (ko)
Inventor
최용재
박성규
이규린
이호민
허재학
권도엽
김민환
한은정
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160083723A external-priority patent/KR20180003928A/ko
Priority claimed from KR1020160086413A external-priority patent/KR20180005995A/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to CN201790001131.9U priority Critical patent/CN209265407U/zh
Publication of WO2018004138A1 publication Critical patent/WO2018004138A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches

Definitions

  • Embodiments relate to a fingerprint sensor cover, a fingerprint sensing device, and a touch device including the same.
  • the fingerprint sensor is a sensor that detects a human fingerprint, and is widely used to determine whether a door lock or the like has recently been widely applied, as well as whether to turn on or off the power of an electronic device. It is becoming.
  • the fingerprint sensor may be classified into an ultrasonic method, an infrared method, and a capacitive method according to its operation principle.
  • the fingerprint sensor When the fingerprint sensor is applied to the touch window, the fingerprint sensor may be disposed on one surface of the fingerprint sensor cover.
  • a groove may be formed in one region of the fingerprint sensor cover, and a fingerprint sensor may be inserted into the groove.
  • the decor layer having a color so that the fingerprint sensor disposed in the groove or the wiring electrode disposed at the periphery of the groove is not visible.
  • a separate deco layer having a metal texture for recognizing the fingerprint sensing region is required.
  • the fingerprint sensor disposed on the substrate may be inclined or may not be disposed at a uniform height, thereby reducing the reliability of the fingerprint sensing device.
  • Embodiments provide a fingerprint sensor cover, a fingerprint sensing device, and a touch device including the same having improved visibility and reliability.
  • Fingerprint sensor cover is a substrate; A groove formed in an area for recognizing a fingerprint of the substrate; An inclined surface and a bottom surface formed in the groove; A first decor layer disposed on the bottom surface; A resin layer disposed to face the inclined surface; And a second deco layer disposed on the outside of the resin layer and the groove, wherein the resin layer is disposed between the inclined surface and the second deco layer, and the resin layer is disposed on one surface of the substrate.
  • the area decreases toward the bottom.
  • Fingerprint sensing device includes a substrate; A groove formed in an area for recognizing a fingerprint of the substrate; An inclined surface and a bottom surface formed in the groove; A first decor layer disposed on the bottom surface; A resin layer disposed to face the inclined surface; A second decor layer disposed on the outside of the resin layer and the groove; And a fingerprint sensor module disposed on the first decor layer.
  • a touch device includes a substrate including an effective area and an invalid area; A groove formed in the invalid area; An inclined surface and a bottom surface formed in the groove; A first decor layer disposed on the bottom surface; A resin layer disposed to face the inclined surface; A second decor layer disposed on the outside of the resin layer and the groove; And a fingerprint sensor module disposed on the first decor layer, and including a touch electrode and a display panel disposed on the effective area.
  • the first decor layer may be disposed on the bottom surface of the groove
  • the resin layer may be disposed on the inclined surface of the groove
  • the second decor layer may be disposed on the exterior of the resin layer and the groove.
  • first decor layer and the second decor layer may be disposed parallel to each other, overlapping up and down, it is possible to prevent the problem that light may leak.
  • resin layer is disposed on the inclined surface, it is possible to solve the problem that the decor layer is hardly formed on the inclined surface.
  • one side of the resin layer may be formed at an angle perpendicular to and similar to one surface of the substrate, thereby improving the yield of formation of the third decor layer disposed between the first decor layer and the second decor layer. have.
  • the third decor layer may be seen to have a uniform thickness regardless of the angle of viewing the fingerprint sensor cover, thereby improving visibility.
  • the resin layer may be transparent.
  • the resin layer may have a refractive index corresponding to or similar to that of the substrate. Accordingly, the uniformity of the appearance of the inner region of the groove and the peripheral region of the groove can be improved.
  • the appearance quality of the fingerprint sensing device including the fingerprint sensor cover and the touch window can be improved.
  • the substrate may include a groove, and the resin layer and the fingerprint sensor module may be sequentially disposed in the groove. Accordingly, malfunctions and defects of the fingerprint sensor due to the thickness of the fingerprint sensing device can be reduced.
  • the thickness of the substrate is reduced, and the distance between the finger and the fingerprint sensor is reduced, thereby improving the reliability of the fingerprint sensor.
  • the fingerprint sensor module is disposed inside the groove, since the force due to an external impact can be distributed, the reliability of the fingerprint sensing device and the display device including the same can be improved.
  • the fingerprint sensing device may include a plurality of beads dispersed in the resin layer and the resin layer between the bottom surface of the groove and the fingerprint sensor module. Accordingly, the resin layer may be disposed in a uniform thickness by the beads. That is, the resin layer may be disposed at a uniform thickness between the bottom surface and the fingerprint sensor module, the height of the upper surface of the fingerprint sensor module disposed on the resin layer may be uniform, the fingerprint sensing device and this The reliability of the display device may be improved.
  • FIG. 1 and 2 are plan views illustrating a fingerprint sensor cover according to an embodiment.
  • FIG. 3 and 4 are cross-sectional views of a first embodiment taken along the line AA ′ of FIG. 1.
  • 6A and 6B are cross-sectional views illustrating an enlarged area 'A' of FIG. 2.
  • 9 to 12 are cross-sectional views of a fingerprint sensing device according to a first embodiment.
  • FIG. 13 is a cross-sectional view for describing a method of manufacturing the fingerprint sensing device of FIG. 9.
  • FIG 14 is a plan view of a touch window to which the fingerprint sensor cover according to the first embodiment is applied.
  • 15 to 17 are views illustrating a touch device in which a touch window to which a fingerprint sensor cover is applied and a display panel are coupled according to the first embodiment.
  • 18 to 21 are cross-sectional views of a second exemplary embodiment taken along the line AA ′ of FIG. 1.
  • FIG. 23 is a sectional view according to Comparative Example 2.
  • FIG. 24 is a sectional view showing a comparative example 3.
  • FIG. 25 is a diagram illustrating a manufacturing process of a fingerprint sensing device according to FIGS. 18 and 19.
  • 26 to 28 are cross-sectional views of a fingerprint sensor module according to a second embodiment.
  • 29 to 31 are views illustrating a display device in which a touch window to which a fingerprint sensor device according to the second embodiment is applied and a display panel are combined.
  • FIG. 32 is a diagram illustrating an example of a touch device apparatus to which a touch device according to an embodiment is applied.
  • each layer, region, pattern, or structure may be “on” or “under” the substrate, each layer, region, pad, or pattern.
  • Substrate formed in includes all formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.
  • each layer (film), region, pattern, or structure may be modified for clarity and convenience of description, and thus do not necessarily reflect the actual size.
  • the fingerprint sensor cover may include a substrate 100.
  • the substrate 100 may be rigid or flexible.
  • the substrate 100 may include glass.
  • the substrate 100 may include at least one of silicon oxide, aluminum oxide, or sodium oxide.
  • the substrate 100 may include chemically strengthened / semi-hardened glass such as soda lime glass or aluminosilicate glass.
  • the substrate 100 may be curved while having a partially curved surface. That is, the substrate 100 may be partially curved and partially curved.
  • an end of the substrate 100 may have a curved surface, or may have a curved surface or a surface including a random curvature.
  • the substrate 100 may be a flexible glass plate having flexible characteristics.
  • the substrate 100 may be a curved or bent substrate. That is, the fingerprint sensor cover including the substrate 100 may also be formed to have a flexible, curved or bent characteristic. For this reason, the fingerprint sensor cover according to the embodiment is easy to carry and can be changed in various designs.
  • an effective area AA and an invalid area UA may be defined in the substrate 100.
  • the invalid area UA may be disposed to surround the effective area AA.
  • the non-effective area UA surrounds the first side, the second side, the third side, and the fourth side positioned at the edge of the effective area AA, but the embodiment is not limited thereto.
  • the non-effective area UA may include partially enclosing at least two or more sides of the first side, the second side, the third side, or the fourth side positioned at the edge of the effective area AA.
  • an area of the effective area AA may be larger than that of the ineffective area UA.
  • a display may be displayed in the effective area AA, and a display may not be displayed in the non-effective area UA disposed around the effective area AA.
  • a plurality of sensing electrodes may be disposed on the effective area AA.
  • the effective area AA may include a first sensing electrode and a second sensing electrode extending in different directions.
  • the first sensing electrode and the second sensing electrode may extend in different directions without being in contact with each other.
  • a plurality of wiring electrodes may be disposed on the invalid area UA.
  • a first wiring electrode connected to the first sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed on the non-effective area UA.
  • At least one of the effective area AA and the invalid area UA may detect a position of an input device (for example, a finger or a stylus pen).
  • an input device for example, a finger or a stylus pen
  • a difference in capacitance occurs in a portion where the input device contacts, and a portion where such a difference occurs may be detected as a contact position.
  • software such as an application may be driven.
  • the substrate 100 may include a fingerprint sensing area FA.
  • An area of the fingerprint sensing area FA may be smaller than an area of the invalid area UA.
  • the location of the fingerprint sensing area FA may overlap with the location of the invalid area UA. That is, the fingerprint sensing area FA may be one area of the invalid area UA.
  • the fingerprint sensing area FA may be located on the invalid area UA. For example, when a finger contacts the fingerprint sensing area FA of the ineffective area UA of the substrate 100, the lock mode may be released according to the fingerprint recognition.
  • the fingerprint sensing area FA may be an area for recognizing a fingerprint of a finger.
  • the fingerprint sensing area FA may be disposed below or above the substrate 100.
  • the substrate 100 may be formed in a rectangular shape including a long side and a short side, and the fingerprint sensing area FA may be closer to the short side than the long side.
  • an area of the fingerprint sensing area FA may be smaller than that of the substrate 100.
  • the area of the fingerprint sensing area FA may be about 0.5% to about 5% of the total area of the substrate.
  • the substrate 100 may include a groove H.
  • Grooves H may be formed on the ineffective region UA of the substrate 100.
  • the groove H may be disposed in a portion of the ineffective area UA of the cover substrate 100.
  • the groove H may be disposed below or above the ineffective area UA of the cover substrate 100.
  • a groove H may be formed on the fingerprint sensing area FA of the substrate 100.
  • the groove H is disposed in the lower bezel area of the cover substrate 100, the embodiment is not limited thereto, and the groove H is disposed in the upper bezel area of the cover substrate 100. Of course it can be.
  • the groove H may have various shapes such as a polygonal shape or a circular shape. Although the shape of the groove H is illustrated as being rectangular in shape, the embodiment is not limited thereto and may be rounded polygonal shape or circular shape.
  • a deco layer 400 may be disposed on the substrate 100.
  • the deco layer 400 may be disposed on the ineffective area UA.
  • the decor layer 400 may include a first decor layer 410, a second decor layer 420, and a third decor layer 430.
  • the first decor layer 410 and the third decor layer 430 may be disposed in the fingerprint sensing area FA.
  • the first decor layer 410 and the third decor layer 430 may be disposed in an inner region of the fingerprint sensing area FA.
  • the third decor layer 430 may be disposed surrounding the first decor layer 410.
  • the first deco layer 410 may have a quadrangular shape
  • the third deco layer 430 may have a quadrangular ring shape corresponding to an edge shape of the first deco layer 410.
  • the embodiment is not limited thereto, and the first deco layer 410 may have a rounded quadrangle and the third deco layer 430 may have a rounded quadrangular ring shape.
  • the first deco layer 410 may be circular, and the third deco layer 430 may have a circular ring shape.
  • the second decor layer 420 may be disposed in the ineffective area UA located outside the fingerprint sensing area FA.
  • the substrate 100 according to the first embodiment may include a groove H.
  • the substrate 100 according to the embodiment may include the groove H in the ineffective area UA.
  • the substrate 100 according to the embodiment may include the groove H in the fingerprint sensing area FA.
  • the substrate 100 may include one surface 100a and the other surface 100b facing the one surface 100a, and the groove H may be formed on one surface 100a of the substrate 100. .
  • the groove H may include inclined surfaces S1 and S2 disposed to face each other and a bottom surface B connecting the inclined surfaces.
  • the bottom surface B of the groove H may be disposed in parallel with one surface 100a of the substrate 100.
  • the bottom surface B of the groove H may be disposed in parallel with the other surface 100b of the substrate 100.
  • Parallel here is not only completely parallel, of course, may include a difference of 1 ⁇ m or less.
  • the distance between the fingerprint sensor and the finger in the fingerprint sensing area FA may be uniform, thereby improving the detection performance of the fingerprint sensor.
  • the first inclined surface S1 and the second inclined surface S2 disposed to face each other may be disposed around the bottom surface B.
  • the bottom surface B may be disposed between the first inclined surface S1 and the second inclined surface S2.
  • the inclined surfaces S1 and S2 may be disposed between the one surface 100a and the bottom surface B of the substrate.
  • the separation distance between the first inclined surface S1 and the second inclined surface S2 may be reduced toward the inside of the groove H. From the first connection region P1 between the one surface 100a of the substrate and the first inclined surface S1 toward the second connection region P2 between the bottom surface B and the first inclined surface S1. As a result, the separation distance between the first inclined surface S1 and the second inclined surface S2 may be reduced. Accordingly, one surface 100a of the substrate, the inclined surfaces S1 and S2, and the bottom surface B may be connected.
  • the cross-sectional shape of the groove H may be trapezoidal.
  • the first connection area P1 and the second connection area P2 may be connected at an angle or rounded.
  • the first connection area P1 and the second connection area P2 may be connected at an angle.
  • the first connection region P1 may be connected at an angle, and the second connection region P2 may be connected while being rounded.
  • both the first connection area P1 and the second connection area P2 may be connected while being rounded.
  • the first connection area P1 may be connected in a round shape, and the second connection area P2 may be connected at an angle.
  • the first inclined surface S1 and the second inclined surface S2 may have inclination angles corresponding to each other.
  • the first inclined surface S1 may be inclined at one surface 100a of the substrate 100 and a first inclination angle ⁇ 1
  • the second inclined surface S2 may be inclined at the surface of the substrate 100. It may be inclined at one surface 100a and the first inclination angle ⁇ 1.
  • the first inclination angle ⁇ 1 may be 40 degrees to 46 degrees.
  • the first inclination angle ⁇ 1 may be between 42 and 44 degrees.
  • the first inclination angle ⁇ 1 may be measured between the imaginary surface extending from the one surface 100a of the substrate 100 and the inclined surface of the groove.
  • One surface 100a of the substrate 100 may have a step in a region where a groove is formed.
  • the substrate 100 may not have a uniform thickness. That is, the thickness of the substrate 100 in the region where the groove is formed and the region where the groove is not formed may be different from each other.
  • the thickness T1 of the substrate 100 may be smaller than the thickness T2 of the substrate 100 in the region where the groove is not formed.
  • the thickness T1 of the substrate 100 including the groove in the ineffective area UA may be smaller than the thickness T2 of the substrate 100 in the effective area AA.
  • the thickness T1 of the substrate 100 including the groove in the non-effective area UA may be smaller than the thickness T2 of the substrate 100 including the groove in the non-effective area UA.
  • the thickness T1 of the substrate 100 in the region where the groove is formed may mean that it is measured at the bottom surface B of the groove. That is, the thickness T1 of the substrate 100 in the region where the groove is formed may be the shortest distance from the bottom surface of the groove to the other surface of the substrate.
  • the thickness T1 of the substrate 100 may be about 50 ⁇ m to about 300 ⁇ m.
  • the thickness T1 of the substrate 100 in the region where the groove is disposed may be about 100 ⁇ m to about 300 ⁇ m.
  • the thickness T1 of the substrate may be about 150 ⁇ m to about 300 ⁇ m.
  • the strength of the substrate 100 may decrease.
  • the thickness T1 of the substrate 100 exceeds about 300 ⁇ m in the region where the groove is formed, as the thickness of the substrate 100 increases, up to the touch surface of the fingerprint sensor and the cover substrate. The sensing distance of the fingerprint sensor may be degraded by increasing the distance of.
  • the thickness T2 of the substrate 100 may be about 300 ⁇ m to about 1000 ⁇ m.
  • the thickness T2 of the substrate 100 may be about 300 ⁇ m to about 700 ⁇ m.
  • the thickness T2 of the cover substrate 100 may be about 300 ⁇ m to about 500 ⁇ m.
  • the thickness T2 of the substrate 100 is less than about 300 ⁇ m in the region where the groove is not formed, the strength of the substrate 100 may be lowered and cracks may be generated when a sensing electrode or the like is formed on the cover substrate.
  • the thickness T2 of the substrate 100 exceeds about 1000 ⁇ m in the region where the groove is not formed, the overall thickness of the fingerprint sensor cover is thick due to the thickness of the substrate 100. Can lose.
  • the other surface 100b opposite to the one surface 100a of the substrate 100 may not include a groove. That is, the other surface 100b of the substrate 100 may not have a step.
  • the other surface 100b of the substrate 100 may be flat.
  • the other surface 100b of the substrate 100 may be a surface on which a user's finger is in contact. That is, since the finger contacts the other surface 100b of the substrate 100, the sense of unity between the effective area and the invalid area may be improved.
  • the width W1 of the bottom surface B of the groove may be different from the width W2 at the ends of the inclined surfaces S1 and S2 at which the groove starts.
  • W1 is a first connection region P1 between one surface 100a of the substrate and the first inclined surface S1 and a third connection region between one surface 100a of the substrate and the second inclined surface S2. It may be smaller than the width W2 between (P3). Accordingly, the fingerprint sensor module may be seated on the bottom surface B of the groove.
  • the fingerprint sensor cover according to the embodiment may include the substrate 100, the resin layer 300, and the decor layer 400.
  • the fingerprint sensor cover according to the embodiment may include the substrate 100 including the grooves H, the resin layer 300 and the decor layer 400 disposed on the region where the grooves H are formed. have.
  • the first decor layer 410 may be disposed on the bottom surface B of the groove H.
  • the first decor layer 410 may directly contact the bottom surface B of the groove H. Accordingly, the first decor layer 410 may have a planar shape.
  • the first deco layer 410 may have a thickness of 2 ⁇ m to 8 ⁇ m.
  • the first deco layer 410 may have a thickness of 4 ⁇ m to 8 ⁇ m.
  • the first deco layer 410 may have a thickness of 7 ⁇ m to 8 ⁇ m.
  • the first decor layer 410 may be formed by coating a material having a predetermined color so that the fingerprint sensor disposed on the ineffective area UA is not visible from the outside.
  • the first deco layer 410 may have a color suitable for a desired appearance.
  • the first deco layer 410 may include black or white pigments and may represent black or white color.
  • the first decor layer 410 may implement a variety of color using a film, it can prevent the film removal.
  • the width W3 of the first decor layer 410 may correspond to or different from the width W1 of the bottom surface B of the groove.
  • the width W3 of the first decor layer 410 may be smaller than the width W1 of the bottom surface B of the groove.
  • the width W3 of the first decor layer 410 may correspond to the width W1 of the bottom surface B of the groove.
  • the width W3 of the first decor layer 410 may be greater than the width W1 of the bottom surface B of the groove.
  • the resin layer 300 may be disposed on the inclined surfaces S1 and S2 of the groove H.
  • the inclined surfaces S1 and S2 of the groove H may directly contact the resin layer 300. Accordingly, one side surface 302 of the resin layer 300 may be inclined at an inclination angle corresponding to the first inclination angle ⁇ 1.
  • the other side surface of the resin layer 300 may have a second inclination angle ⁇ 2 different from the first inclination angle ⁇ 1. That is, one side 301 of the resin layer 300 may be inclined at one surface 100a of the substrate 100 and a second inclination angle ⁇ 2. In this case, the first inclination angle ⁇ 1 may be smaller than the second inclination angle ⁇ 2.
  • the second inclination angle ⁇ 2 may be 85 degrees to 95 degrees.
  • the second inclination angle ⁇ 2 may be 88 degrees to 92 degrees.
  • the second inclination angle ⁇ 2 is an inclination angle formed by an imaginary surface extending from the one surface 100a of the substrate 100 and one side of the resin layer 300 filled in the groove H. Can be.
  • one side 301 of the resin layer 300 may be disposed on the bottom surface B of the groove H while having an angle perpendicular to or similar to the bottom surface B.
  • the resin layer 300 may contact an edge region of the first decor layer 410.
  • the resin layer 300 may contact at least one of an upper surface and a side surface of the first decor layer 410.
  • the resin layer 300 may contact the upper surface and the side surface of the first decor layer 410.
  • the resin layer 300 may cover the top and side surfaces of the first decor layer 410.
  • the resin layer 300 may be disposed on the bottom surface of the groove H while surrounding one region of the side surface and the upper surface of the first decor layer 410.
  • the resin layer 300 may be disposed on one side of the inclined surfaces S1 and S2, the bottom surface B, and the side and top surfaces of the first decor layer 410.
  • the resin layer 300 may be disposed to face an inclined surface of the groove H.
  • the resin layer 300 may be disposed in contact with the side surface of the first decor layer 410 and in direct contact with the inclined surface of the groove H.
  • the resin layer 300 may contact the side surface of the first decor layer 410 and the inclined surface of the groove H, and may be disposed on a substrate.
  • the area of the resin layer 300 may gradually decrease from one surface of the substrate toward the bottom of the groove.
  • the resin layer 300 may be disposed to face the inclined surface of the groove H.
  • the resin layer 300 may be disposed in direct contact with the inclined surface of the groove (H).
  • the resin layer 300 may contact the top surface of the first decor layer 410 and may be disposed on the bottom surface of the groove H.
  • the resin layer 300 may be disposed on one region of the inclined surfaces S1 and S2 and the upper surface of the first decor layer 410. In this case, the area of the resin layer 300 may gradually decrease from one surface of the substrate toward the bottom of the groove.
  • One surface of the resin layer and the outer surface of the groove may be disposed on the same plane. That is, the height of the resin layer may be the same as the height of the groove.
  • one surface 303 of the resin layer 300 may be disposed on a plane corresponding to one surface 100a of the substrate 100. Accordingly, the second decor layer 420 extending from the outer surface of the groove to one surface of the resin layer may be arranged in a planar shape.
  • the print quality of the decor layer may be improved regardless of the angle of the groove inclined surface.
  • the resin layer may be filled in the inclined surface of the groove, to form a third decor layer perpendicular to and similar to one surface of the substrate, and to form a planar second decor layer.
  • the resin layer 300 may have a thickness of 10 ⁇ m to 40 ⁇ m.
  • the thickness of the resin layer 300 may be 10 ⁇ m to 30 ⁇ m.
  • the thickness of the resin layer 300 may be measured in the depth direction of the groove.
  • the resin layer 300 may include at least one of an epoxy compound, an acrylic compound, and a silicon compound.
  • the resin layer 300 may include a resin.
  • the resin layer 300 may include a photocurable resin or a thermosetting resin.
  • the resin layer 300 may include at least one of an epoxy resin, an acrylic resin, and a silicone resin.
  • the resin layer 300 may have a refractive index corresponding to or similar to that of the substrate 100.
  • the refractive index of the resin layer 300 may be 1.3 to 1.7.
  • the refractive index of the glass substrate may be 1.5.
  • the refractive index of the substrate may be the same as the refractive index of the resin layer.
  • the substrate 100 and the resin layer 300 may be transparent.
  • the fingerprint sensor cover according to the embodiment may improve visibility by arranging the transparent resin layer 300 having a refractive index corresponding to or similar to that of the glass substrate 100 on the glass substrate 100.
  • the resin layer may be disposed between the inclined surface and the second decor layer 420.
  • the resin layer may be disposed between the inclined surface and the third decor layer 430.
  • One side of the resin layer contacts the third decor layer 430, the other side facing the one side contacts the inclined surface, and one surface of the resin layer contacts the second decor layer 420.
  • the other surface opposite to one surface of the resin layer may contact the first decor layer 410.
  • the second decor layer 420 may be disposed on the outer side of the resin layer and the groove.
  • the second decor layer 420 may be disposed on one surface 100a of the substrate 100, one surface 303 of the resin layer 300, and one surface of the second decor layer 420.
  • the second decor layer 420 may extend from one surface 100a of the substrate 100 to be disposed on one surface 303 of the resin layer 300 and one surface of the second decor layer 420.
  • one surface 100a of the substrate 100, one surface 303 of the resin layer 300, and one surface of the third decor layer 430 may be disposed on the same plane. Accordingly, the second decor layer 420 may have a planar shape.
  • the first and second decor layers according to the embodiment may be arranged in a plane, respectively, to prevent the film removal of the first and second decor layers, it is possible to improve the appearance quality.
  • the second decor layer 420 may be disposed in parallel with the first decor layer 410.
  • One end of the second decor layer 420 may be disposed in an area corresponding to one end of the third decor layer 430.
  • one end of the second decor layer 420 may be disposed on the bottom surface B of the groove H.
  • the second decor layer 420 may overlap with the first decor layer 410 up and down.
  • the second decor layer 420 may be disposed on an area corresponding to the first decor layer 410 up and down.
  • the second decor layer 420 may overlap the first decor layer 410 on the bottom surface of the groove.
  • overlapping does not mean contacting, but may mean occupying the same space up and down. Accordingly, it is possible to reduce the heterogeneity of the region where the groove is formed and the region where the groove is not formed.
  • first decor layer and the second decor layer are overlapped up and down, it is possible to prevent a problem that light may leak.
  • the second decor layer 420 may have a thickness of 2 ⁇ m to 8 ⁇ m.
  • the second decor layer 420 may have a thickness of 4 ⁇ m to 8 ⁇ m.
  • the second deco layer 420 may have a thickness of 7 ⁇ m to 8 ⁇ m.
  • the second decor layer 420 may be formed by coating a material having a predetermined color so that the wiring electrode, the printed circuit board, and the like disposed on the ineffective area UA are not visible from the outside.
  • the second decor layer may have a color.
  • the second deco layer 420 may have a color corresponding to the first deco layer 410 or may have a different color.
  • the second decor layer may include a material corresponding to the first decor layer.
  • a third decor layer may be disposed between the first decor layer and the second decor layer.
  • a third decor layer 430 may be disposed on the first decor layer 410.
  • the third decor layer 430 may be in contact with the side surface 301 of the resin layer 300 and disposed on the first decor layer 410. Accordingly, the third decor layer 430 may be disposed on the bottom surface B of the groove H at an angle perpendicular to or similar to the first decor layer 410.
  • the third decor layer 430 may be disposed to cover at least a portion of the first decor layer 410 or the second decor layer 420.
  • the third decor layer 430 may be disposed while covering a part of the second decor layer 420 while covering all or part of the first decor layer 410.
  • the third decor layer 430 may overlap the second decor layer 420 on the resin layer 300.
  • one end of the third deco layer 430 may contact the first deco layer 410, and the other end of the third deco layer 430 may contact the second deco layer 420. have.
  • one end of the third deco layer 430 may have a vertical inclination angle at a position contacting the first deco layer 410, and the other end of the third deco layer 430 may be the second end. It may have a vertical inclination angle at the position in contact with the decor layer 420.
  • the third deco layer 430 may be disposed at an outer region of the fingerprint sensor so that a user may easily recognize the position of the support door sensing area FA.
  • the third decor layer may include a material different from the first and second decor layers.
  • the third decor layer may have a different color from the first and second decor layers.
  • the third decor layer may exhibit a different texture or gloss than the first and second decor layers.
  • the third decor layer 430 may include a plurality of oxide layers 431a, 431b, and 431c and at least one metal layer 432 disposed between the plurality of oxide layers.
  • the plurality of oxide layers may include a first oxide layer 431a, a second oxide layer 431b, and a third oxide layer 431c.
  • one metal layer 432 may be disposed between the second oxide layer 431b and the third oxide layer 431c.
  • the embodiment is not limited thereto, and the metal layer 432 may be disposed between the first oxide layer 431a and the second oxide layer 431b.
  • the first oxide layer 431a may be disposed on the resin layer 300
  • the second oxide layer 431b may be disposed on the first oxide layer 431a
  • the metal layer 432 may be disposed on the resin layer 300.
  • the third oxide layer 431c may be disposed on the metal layer 432.
  • the plurality of oxide layers may include a first oxide layer 431a, a second oxide layer 431b, and a third oxide layer 431c.
  • two metal layers 432a and b may be disposed between the plurality of oxide layers, respectively.
  • the first metal layer 432a may be disposed between the first oxide layer 431a and the second oxide layer 431b
  • the second metal layer 432b may be disposed between the second oxide layer 431b and the It may be disposed between the third oxide layer 431c.
  • the first oxide layer 431a may be disposed on the resin layer 300, the first metal layer 432a may be disposed on the first oxide layer 431a, and the second oxide layer may be disposed on the resin layer 300.
  • 431b may be disposed on the first metal layer 432a
  • the second metal layer 432b may be disposed on the second oxide layer 431b
  • the third oxide layer 431c may be disposed on the first metal layer 432a. It may be disposed on the second metal layer 432b.
  • the first oxide layer 431a, the second oxide layer 431b, and the third oxide layer 431c may include materials corresponding to each other or different materials.
  • the first oxide layer 431a, the second oxide layer 431b, and the third oxide layer 431c may be TiO 2 (titanium dioxide), SiO 2 (silicon dioxide), or Al 2 O 3, respectively.
  • aluminum oxide HfO 2 (hafnium oxide), ZnO (zinc oxide), MgO (magnesium oxide), Ce 2 O 3 (cesium oxide), In 2 O 3 (indium oxide), indium tin oxide (ITO) and BaTiO At least one of 3 (barium titanate).
  • the first oxide layer 431a, the second oxide layer 431b, and the third oxide layer 431c may have thicknesses corresponding to each other or may have different thicknesses.
  • the first oxide layer 431a, the second oxide layer 431b, and the third oxide layer 431c may have a thickness of several nm to several tens of nm, respectively.
  • the first metal layer 432a and the second metal layer 432b may include materials corresponding to each other, or may include different materials.
  • each of the one metal layer 432 or the two metal layers 432a and b may be In (indium), Sn (tin), Al (aluminum), Ag (silver), Ni (nickel), Cr. (chromium), Pt (platinum), Mo (molybdenum), Cu (copper) and Au (gold) may include at least one or alloys thereof.
  • the first metal layer 432a and the second metal layer 432b may have thicknesses corresponding to each other or may have different thicknesses.
  • the thickness of the metal layer 432 may be 10 nm to 50 nm.
  • the thickness of the first metal layer 432a and the second metal layer 432b may be 10 nm to 50 nm.
  • the thickness of the metal layer 432 is less than 10 nm, the effect of the metal texture may be small, and appearance defects may occur.
  • the thickness of the metal layer 432 is greater than 50 nm, noise may occur, and thus the sensing efficiency of the fingerprint sensor may decrease.
  • the first oxide layer (431a) and the third oxide layer (431c) is the second oxide layer (431b), and including the TiO 2 each include SiO 2, wherein The metal layer 432 may include Sn.
  • the first oxide layer 431a and the third oxide layer 431c each include TiO 2
  • the second oxide layer 431b includes SiO 2
  • the first metal layer 432a may include In
  • the second metal layer 432b may include Sn.
  • the fingerprint sensor cover includes a substrate 100 including a groove, a first decor layer 410 disposed on a bottom surface of the groove, and a first resin layer disposed on an inclined surface of the groove ( 310, a third deco layer 430 disposed on the first deco layer 410 and in contact with one side of the resin layer, extending from one surface of the substrate, onto the resin layer and the third deco layer.
  • the second decor layer 420 may be disposed.
  • One surface 100a of the substrate 100 may be a surface on which the fingerprint sensor module 200 is disposed.
  • the other surface 100b of the substrate 100 may be a surface to which an input device such as a finger contacts.
  • the fingerprint sensor module 200 When an input device such as a finger contacts the other surface 100b of the substrate 100, the fingerprint sensor module 200 is disposed in the groove H formed on one surface 100a of the substrate 100. An operation according to the contact of the input device may be performed.
  • the fingerprint sensor module 200 may be disposed on the bottom surface of the groove.
  • the fingerprint sensor module 200 may be disposed on the first deco layer 410.
  • the fingerprint sensor module 200 may be directly disposed on the first decor layer 410.
  • the fingerprint sensor module 200 may be spaced apart from the first decor layer 410 by a predetermined distance D.
  • the predetermined distance may correspond to the thickness of the second resin layer 320.
  • the second resin layer 320 positioned between the first decor layer 410 and the fingerprint sensor module 200 may have a planar shape.
  • the first decor layer 410 may be disposed between the bottom surface B of the groove H and the fingerprint sensor module 200. Since the first decor layer 410 has a planar shape, the sensing efficiency of the fingerprint sensor module 200 may be improved.
  • the width W3 of the first decor layer 410 may be greater than the width W4 of the fingerprint sensor module 200. Accordingly, the first decor layer 410 may prevent the fingerprint sensor from being recognized from the outside.
  • the third deco layer 430 may be spaced apart from the fingerprint sensor module 200 and disposed outside the fingerprint sensor module 200. Accordingly, the user can easily recognize the fingerprint sensing area.
  • the second resin layer 320 may be disposed while filling a groove between the fingerprint sensor module 200 and the third decor layer 430. Accordingly, the second resin layer 320 may fix the fingerprint sensor module 200.
  • the second resin layer 320 may be disposed at a height corresponding to the one surface 100a of the substrate 100 or may be disposed at different heights.
  • the second resin layer 320 may be disposed at a height corresponding to the one surface 100a of the substrate 100.
  • the second resin layer 320 may be disposed at a height greater than one surface 100a of the substrate 100.
  • the second resin layer 320 may be disposed at a height lower than that of one surface 100a of the substrate 100.
  • the fingerprint sensor module 200 may have various structures.
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a fingerprint sensor chip 220, a printed circuit board 230, a wire 240, and a molding part 250.
  • the fingerprint sensor chip 220 may be disposed on the fingerprint sensor 210, and the printed circuit board 230 may be sequentially disposed on the fingerprint sensor chip 220.
  • the fingerprint sensor 210, the fingerprint sensor chip 220, the printed circuit board 230, the wire 240, and the molding part 250 included in the fingerprint sensor module 200 are all inside the groove. Can be placed in.
  • the fingerprint sensor module 200 may be disposed on the bottom surface of the groove. That is, the space formed by the groove formed in the substrate 100 may accommodate the fingerprint sensor module 200. The space formed by the groove formed in the substrate 100 may be for accommodating one side and both side surfaces of the fingerprint sensor module 200.
  • the fingerprint sensor 210 may include a fingerprint sensor electrode.
  • the fingerprint sensor 210 may be connected to the printed circuit board 230 by a wire 240.
  • the fingerprint sensor 210 may be connected to the printed circuit board 230 by a wire bonding method.
  • the fingerprint sensor chip 220 may be connected to the printed circuit board 230 by a wire 240.
  • the fingerprint sensor chip 220 may be connected to the printed circuit board 230 by a wire bonding method.
  • the fingerprint sensor 210 may transmit the fingerprint signal detected through the fingerprint sensor electrode to the printed circuit board 230 through the wire 240, and the printed circuit board 230 may be connected to the wire ( It may be transmitted to the fingerprint sensor chip 220 through the 240.
  • the printed circuit board 230 may have a two-layer structure connected to via holes.
  • the embodiment is not limited thereto, and the printed circuit board 530 may have a single layer structure.
  • the molding part 250 may include an epoxy mold compound.
  • the molding part 250 prevents damage due to oxidation of the fingerprint sensor 210, the fingerprint sensor chip 220, the printed circuit board 230, and the wire 240, and the like due to external impact. can do.
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a printed circuit board 230, and a support layer 260.
  • the printed circuit board 230 may be disposed on the fingerprint sensor 210, and the support layer 260 may be sequentially disposed on the printed circuit board 230.
  • the fingerprint sensor 210, the printed circuit board 230, and the support layer 260 included in the fingerprint sensor module 200 may all be disposed inside the groove.
  • the fingerprint sensor module 200 may be disposed on the bottom surface of the groove.
  • a portion of the printed circuit board 230 may be disposed in an area corresponding to the groove, and the other portion may be disposed outside the fingerprint sensing area.
  • the printed circuit board 230 may extend to an outer region of the groove in order to transmit a signal received from the fingerprint sensor 210.
  • the support layer 260 may be a metal.
  • the support layer 260 may be stainless steel (SUS).
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a printed circuit board 230, and a fingerprint sensor chip 220.
  • the fingerprint sensor module 200 may be disposed inside the groove.
  • the fingerprint sensor 210 included in the fingerprint sensor module 200 may be disposed in the groove.
  • the fingerprint sensor 210 may have a thickness lower than the depth of the groove. In addition, the fingerprint sensor 210 may have a thickness lower than that of the resin layer 300.
  • one surface of the fingerprint sensor 210 may contact the first decor layer 410, and the other surface opposite to the one surface of the fingerprint sensor 210 may be wrapped by the resin layer 300. .
  • an area in which the second decor layer 420 may be disposed in a plane may be enlarged, thereby improving appearance quality of the decor layer.
  • One end of the printed circuit board 230 may be connected to the other surface of the fingerprint sensor 210.
  • the other end of the printed circuit board 230 may extend to the outside of the groove.
  • the other end of the printed circuit board 230 may be connected to the fingerprint sensor chip 220 in the outer region of the groove.
  • the groove H may be formed on one surface of the substrate 100.
  • the groove H may be formed by etching.
  • a groove having an inclined surface and a flat bottom surface may be formed on one surface of the glass substrate by chemical etching or physical etching.
  • the first decor layer 410 may be disposed on the bottom surface of the groove.
  • the first decor layer 410 may be formed through printing.
  • the first decor layer 410 may be disposed on the bottom surface of the groove through pad printing, thereby improving process efficiency.
  • the resin layer 300 may be disposed on the inclined surface of the groove.
  • the resin layer 300 may have an angle perpendicular to or perpendicular to the first decor layer 310.
  • the resin layer 300 may be filled only in the peripheral region of the bottom surface where the inclined surface of the groove is located.
  • the inclination angle of 40 degrees to 46 degrees of the inclined surface of the groove may be different from the inclination angle of the cavity of 85 degrees to 95 degrees.
  • the third decor layer 430 may be formed on one side of the resin layer 300 located inside the cavity.
  • the third deco layer 430 may not be directly disposed on the inclined surface of the groove, thereby preventing a problem that the third deco layer 430 is hard to be formed on the inclined surface of the groove. That is, since the third decor layer 430 may be formed in a plane, process efficiency may be improved.
  • the second decor layer 420 may be disposed on one surface of the substrate 100 and one surface of the resin layer 300.
  • a planar region in which the second decor layer 420 may be disposed may be enlarged.
  • the outer quality of the decor layer may be improved.
  • the third decor layer 430 may be disposed on one side of the resin layer 300. to be.
  • the resin layer 300 may be disposed in the cavity of the groove.
  • the resin layer 300 may have adhesiveness. Accordingly, separation of the fingerprint sensor module 200 may be prevented.
  • the resin layer 300 may seal the fingerprint sensor module 200 to improve reliability of the fingerprint sensing device.
  • the resin layer 300 since the resin layer 300 includes resin, the resin layer 300 may have fluidity, so that the resin layer 300 may fill a gap between the groove and the fingerprint sensor module 200.
  • first resin layer 310 and the second resin layer 320 may be disposed in a different position, the process order disposed.
  • the first resin layer 310 may be disposed on the inclined surface of the groove, and the second resin layer 310 may be disposed on the bottom surface of the groove. Meanwhile, the first resin layer 310 and the second resin layer 320 may include a corresponding material.
  • the fingerprint sensing device As the fingerprint sensor module 200 is impregnated on the second resin layer 320, the fingerprint sensing device according to the embodiment may be manufactured.
  • the fingerprint sensor cover according to the first embodiment and the fingerprint sensor device according to the embodiment solve the problem of detachment or separation of the decor layer 400 generated when the decor layer 400 is formed on the surface including the step. can do.
  • the decor layer 400 may be easily disposed in a planar shape. Accordingly, process efficiency can be improved.
  • the decor layer 400 may be disposed on a plane having no step, it may exhibit a uniform color. Accordingly, the fingerprint sensor cover according to the embodiment and the fingerprint sensor device according to the embodiment may improve visibility.
  • the third decor layer 430 observed from the other surface of the substrate 100 may be recognized as a plane.
  • an area in which the second deco layer 420 may be arranged in a planar shape may be enlarged, and the first deco layer 410 and the As the second decor layer 420 may overlap, the fingerprint sensor cover and the fingerprint sensing device having an excellent appearance having a uniform feeling in and around the fingerprint sensing region may be provided.
  • the decor layer can prevent the leakage of light.
  • a transparent resin resin layer can be arrange
  • a touch electrode and a fingerprint sensor module may be disposed on the substrate 100.
  • the touch electrode and the fingerprint sensor module may be disposed on one surface of the substrate 100.
  • the touch electrodes may be disposed on an effective area of the substrate 100, and the fingerprint sensing device may be disposed on an invalid area of the substrate 100.
  • the display may be displayed in the effective area, and the display may not be displayed in the invalid area disposed around the valid area.
  • the touch window according to the embodiment is disposed on the effective area of the substrate 100, and includes a first sensing electrode 510 extending in one direction and a second sensing electrode 520 extending in a direction different from the one direction. It may include.
  • the unit electrodes of the first sensing electrode 510 may be connected to each other, and the unit electrodes of the second sensing electrode 520 may be spaced apart from each other.
  • the second sensing electrodes 520 may include a bridge electrode 530 that connects the unit electrodes to each other.
  • the bridge electrodes 530 intersect with an area where the unit electrodes of the first sensing electrode 510 are connected to each other, and an insulating layer is formed between the first sensing electrode 510 and the bridge electrode 530.
  • the 530 may be disposed to prevent the first sensing electrode 510 and the second sensing electrode 520 from being electrically connected to each other.
  • the first wiring electrode 610 and the second wiring electrode 620 may be disposed on the invalid area UA.
  • the first wiring electrode 610 connected to the first sensing electrode 510 and the second wiring electrode 620 connected to the second sensing electrode 520 are disposed in the invalid area UA. Can be arranged.
  • a deco layer 400 may be disposed on the ineffective area UA to prevent the wiring electrodes from being visually recognized from the outside.
  • another type of touch window may include a substrate and a first substrate, and may include a first sensing electrode on the substrate and a second sensing electrode on the first substrate.
  • a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the substrate, and one surface extending in a direction different from the one direction on one surface of the first substrate.
  • a second sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed.
  • the sensing electrode may not be disposed on the substrate, and the sensing electrode may be disposed only on both surfaces of the first substrate.
  • a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the first substrate, and extending in a direction different from the one direction on the other surface of the first substrate.
  • a second sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed.
  • the touch window according to another type may include a substrate, a first substrate, and a second substrate, and may include a first sensing electrode on the first substrate and a second sensing electrode on the second substrate.
  • a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the first substrate, and extending in a direction different from the one direction on one surface of the second substrate.
  • a second sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed.
  • the touch window may include a substrate, a first sensing electrode, and a second sensing electrode on the substrate.
  • the first sensing electrode and the second sensing electrode may be disposed on the same surface of the substrate.
  • the first sensing electrode and the second sensing electrode may be spaced apart from each other on the same side of the substrate.
  • the display device may further include a first wiring electrode connected to the first sensing electrode and a second wiring electrode connected to the second sensing electrode, wherein the first wiring electrode is disposed on an effective area and an invalid area of the substrate.
  • the second wiring electrode may be disposed on an ineffective region of the substrate.
  • the touch window according to the above-described embodiments may be applied to the touch device in combination with the display panel.
  • the touch window may be coupled to the display panel by an adhesive layer.
  • the touch device may include a touch window disposed on the display panel 800.
  • the touch device may be formed by combining the substrate 100 and the display panel 800.
  • the substrate 100 and the display panel 800 may be adhered to each other through an adhesive layer 700.
  • the substrate 100 and the display panel 800 may be laminated to each other through an adhesive layer 700 including optically clear adhesives OCA and OCR.
  • the planar area of the substrate 100 may be larger than the planar area of the display panel 800.
  • the length of the substrate 100 measured in a cross section of one direction may be greater than the length of the display panel 800. That is, the substrate 100 may include an overlapping portion overlapping the display panel 800 and a non-overlapping portion not overlapping the display panel 900.
  • the display panel 800 may be disposed on the effective area AA of the substrate.
  • the display panel 800 may be disposed only on the effective area AA of the substrate. That is, the display panel 800 may overlap the effective area AA of the substrate.
  • the display panel 800 may be non-overlapping with the ineffective area UA of the substrate.
  • the display panel 800 may be non-overlapping with the fingerprint sensing area FA. That is, the display panel 800 disposed on the effective area AA of the substrate may be spaced apart from the fingerprint sensor module 200 disposed in the fingerprint sensing area FA of the substrate.
  • the fingerprint sensor module 200 may be disposed on the non-overlapping portion of the substrate.
  • the display panel 800 and the fingerprint sensor module 200 may be disposed on the same surface of the substrate 100, and the display panel 800 may be alternately disposed with the fingerprint sensor module 200. Can be.
  • the display panel 800 may include a first 'substrate 810 and a second' substrate 820.
  • the display panel 800 When the display panel 800 is a liquid crystal display panel, the display panel 800 includes a first 'substrate 810 including a thin film transistor (TFT) and a pixel electrode and a second filter including color filter layers.
  • the substrate 820 may be formed in a bonded structure with the liquid crystal layer interposed therebetween.
  • the display panel 800 includes a thin film transistor, a color filter, and a black matrix formed on the first 'substrate 810, and the second' substrate 820 has the liquid crystal layer interposed therebetween.
  • a liquid crystal display panel having a color filter on transistor (COT) structure That is, a thin film transistor may be formed on the first 'substrate 810, a protective film may be formed on the thin film transistor, and a color filter layer may be formed on the protective film.
  • a pixel electrode in contact with the thin film transistor is formed on the first 'substrate 810.
  • the black matrix may be omitted in order to improve the aperture ratio and simplify the mask process, and the common electrode may be formed to serve as the black matrix.
  • the display device may further include a backlight unit that provides light from the back of the display panel 800.
  • the display panel 800 When the display panel 800 is an organic light emitting display panel, the display panel 800 includes a self-light emitting device that does not require a separate light source.
  • a thin film transistor is formed on the first ′ substrate 910, and an organic light emitting diode is formed in contact with the thin film transistor.
  • the organic light emitting diode may include an anode, a cathode, and an organic light emitting layer formed between the anode and the cathode.
  • the organic light emitting device may further include a second 'substrate 820 serving as an encapsulation substrate for encapsulation.
  • the touch device may include a touch window integrally formed with the display panel 800. That is, the substrate supporting at least one sensing electrode may be omitted.
  • At least one sensing electrode may be disposed on at least one surface of the display panel 800. That is, at least one sensing electrode may be formed on at least one surface of the first 'substrate 810 or the second' substrate 820.
  • At least one sensing electrode may be formed on the upper surface of the substrate disposed above.
  • a first sensing electrode 510 may be disposed on one surface of the substrate 100.
  • a first wire connected to the first sensing electrode 510 may be disposed.
  • a second sensing electrode 520 may be disposed on one surface of the display panel 800.
  • a second wiring connected to the second sensing electrode 520 may be disposed.
  • An adhesive layer 700 may be disposed between the substrate 100 and the display panel 800 so that the substrate and the display panel 800 are laminated to each other.
  • a polarizer may be further included below the substrate 100.
  • the polarizing plate may be a linear polarizing plate or an external light reflection preventing polarizing plate.
  • the polarizer may be a linear polarizer.
  • the polarizing plate may be an anti-reflection polarizing plate.
  • the touch device according to the embodiment may omit at least one substrate supporting the sensing electrode. For this reason, a thin and light touch device can be formed.
  • the touch device may include a touch window integrally formed with the display panel 900. That is, the substrate supporting at least one sensing electrode may be omitted.
  • a sensing electrode disposed in an effective area and serving as a sensor for sensing a touch and a wiring for applying an electrical signal to the sensing electrode may be formed inside the display panel.
  • at least one sensing electrode or at least one wiring may be formed inside the display panel.
  • the display panel includes a first 'substrate 810 and a second' substrate 820.
  • at least one sensing electrode of the first sensing electrode 510 and the second sensing electrode 520 is disposed between the first 'substrate 810 and the second' substrate 820. That is, at least one sensing electrode may be disposed on at least one surface of the first 'substrate 810 or the second' substrate 820.
  • a first sensing electrode 510 may be disposed on one surface of the substrate 100.
  • a first wire connected to the first sensing electrode 510 may be disposed.
  • a second sensing electrode 520 and a second wiring may be formed between the first 'substrate 810 and the second' substrate 820. That is, the second sensing electrode 520 and the second wiring may be disposed inside the display panel, and the first sensing electrode 510 and the first wiring may be disposed outside the display panel.
  • the second sensing electrode 520 and the second wiring may be disposed on an upper surface of the first 'substrate 810 or a rear surface of the second' substrate 820.
  • a polarizer may be further included below the substrate 100.
  • the sensing electrode when the display panel is a liquid crystal display panel, when the second sensing electrode is formed on the upper surface of the first 'substrate 810, the sensing electrode may be formed with a thin film transistor (TFT) or a pixel electrode. have.
  • TFT thin film transistor
  • a color filter layer may be formed on the sensing electrode, or a sensing electrode may be formed on the color filter layer.
  • the display panel is an organic light emitting display panel
  • the second sensing electrode 520 when the second sensing electrode 520 is formed on an upper surface of the first 'substrate 810, the second sensing electrode is formed together with a thin film transistor or an organic light emitting diode. Can be.
  • the touch device according to the embodiment may omit at least one substrate supporting the sensing electrode. For this reason, a thin and light touch device can be formed.
  • the sensing electrode and the wiring may be formed together with the elements formed on the display panel to simplify the process and reduce the cost.
  • FIG. 18 to 21 are cross-sectional views of a second exemplary embodiment taken along the line AA ′ of FIG. 1.
  • the same components as those in the first embodiment are denoted by the same reference numerals, and descriptions identical to those in the first embodiment will be omitted.
  • the substrate 100, the fingerprint sensor module 200, the resin layer 300, the beads 350, and the decor layer 400 of the fingerprint sensing device according to the second embodiment will be described.
  • the fingerprint sensing device includes a substrate 100, a resin layer 300 disposed on the substrate 100, beads 350 dispersed in the resin layer 300, and the resin layer 300. And a fingerprint sensor module 200 disposed on the plurality of beads 350. That is, the resin layer 300 and the fingerprint sensor module 200 having the beads 350 dispersed thereon may be sequentially disposed on the substrate 100.
  • the substrate 100 may include a groove on one surface of one surface 100a and the other surface 100b.
  • the substrate 100 may include a groove only on one surface of one surface 100a and the other surface 100b.
  • the strength of the substrate may decrease. Therefore, as the groove is included in only one surface of one surface and the other surface of the substrate, the distance between the fingerprint and the fingerprint sensor module can be reduced and the strength of the substrate can be secured.
  • One surface 100a of the substrate 100 may include a groove.
  • one surface 100a of the substrate 100 may have a step in an area where a groove is formed.
  • the other surface 100b opposite to the one surface 100a of the substrate 100 may not include a groove. That is, the other surface 100b of the substrate 100 may not have a step.
  • the other surface 100b of the substrate 100 may be flat.
  • the other surface 100b opposite to the one surface 100a of the substrate 100 may be a surface to which a user's finger is in contact. That is, since the finger contacts the other surface 100b opposite to the one surface 100a of the substrate 100, the sense of unity between the effective area and the invalid area may be improved.
  • the substrate 100 may not have a uniform thickness. That is, the thickness of the substrate 100 in the region where the groove is formed and the region where the groove is not formed may be different from each other.
  • the groove of the substrate 100 may be disposed in the ineffective area UA.
  • the groove of the substrate 100 may be disposed only in the ineffective area UA. Accordingly, the thickness of one of the effective area AA and the non-effective area UA in which the groove is not formed may be uniform. Meanwhile, a thickness of another area different from the one area including the groove in the non-effective area UA may be different from a thickness of the one of the effective area and the non-effective area. That is, the thickness may be partially different in the region where the groove is located among the ineffective regions.
  • the thickness T3 of the groove may be about 150 ⁇ m to about 700 ⁇ m.
  • the thickness T3 of the groove may be about 150 ⁇ m to about 400 ⁇ m.
  • the thickness T3 of the groove may be about 250 ⁇ m to about 350 ⁇ m.
  • the distance between the fingerprint sensor module disposed in the ineffective area and the touch surface of the substrate may be increased, thereby reducing sensing characteristics of the fingerprint sensing device.
  • the strength of the substrate may decrease due to the difference in the thickness of the substrate between the effective region and the ineffective region.
  • the fingerprint sensor module 200 may be disposed on the ineffective area UA of the substrate 100.
  • the fingerprint sensor module 200 may be disposed on one area of the ineffective area UA of the substrate 100.
  • the fingerprint sensor module 200 may be disposed on one surface corresponding to one surface of the substrate 100 including a groove.
  • the fingerprint sensor module 200 may be disposed in the groove. That is, the space formed by the groove formed in the substrate 100 may accommodate the fingerprint sensor module 200.
  • the space formed by the groove formed in the substrate 100 may be for accommodating one side and both side surfaces of the fingerprint sensor module 200.
  • the width W4 of the fingerprint sensor module 200 may be smaller than the width W1 of the bottom surface of the groove.
  • the width W4 of the fingerprint sensor module 200 may mean a length from one side to the other side opposite to the one side. Accordingly, the fingerprint sensor module 200 may be inserted into the groove.
  • the height of the upper surface of the fingerprint sensor module may be greater than the height of one surface of the substrate in the region where the groove is not formed.
  • the height of the upper surface of the fingerprint sensor module 200 is greater than the height of one surface 100a of the substrate 100, so that the upper surface of the fingerprint sensor module may protrude.
  • the thickness T4 of the fingerprint sensor module 200 may be 700 ⁇ m or less.
  • the thickness T4 of the fingerprint sensor module 200 may be 100 ⁇ m to 600 ⁇ m.
  • the thickness T4 of the fingerprint sensor module 200 may be 100 ⁇ m to 550 ⁇ m.
  • the thickness T4 of the fingerprint sensor module 200 When the thickness T4 of the fingerprint sensor module 200 is less than about 100 ⁇ m, the durability of the fingerprint sensor module 200 may be degraded and the fingerprint sensor module 200 may be damaged by an external impact, thereby reducing reliability. Can be. In addition, when the thickness T4 of the fingerprint sensor module 200 exceeds about 700 ⁇ m, the thickness of the fingerprint sensing device may increase.
  • the fingerprint sensor module 200 is disposed inside the groove of the ineffective area UA having a smaller thickness than the effective area AA, the overall thickness of the fingerprint sensing device may be reduced. Therefore, when a fingerprint or the like is contacted on the other surface of the substrate 100 to generate a signal, the distance from which the signal is moved to the fingerprint sensor can be reduced, so that the sensitivity according to the contact of the fingerprint can be improved, thereby improving performance of the fingerprint sensing device. Can improve.
  • the resin layer 300 may be disposed on the ineffective area UA of the substrate 100.
  • the resin layer 300 may be disposed on one region of the ineffective region UA of the substrate 100.
  • the resin layer 300 may be disposed on one surface corresponding to one surface of the substrate 100 including the groove.
  • the resin layer 300 may be disposed in the groove.
  • the resin layer 300 may be disposed between the inside of the groove and the fingerprint sensor module 200.
  • the resin layer 300 may be disposed between the bottom surface of the groove and the fingerprint sensor module. In addition, the resin layer 300 may be disposed between the inclined surface of the groove and the side surface of the fingerprint sensor module. In addition, the resin layer 300 may be disposed both between the bottom surface of the groove and the fingerprint sensor module, and between the inclined surface of the groove and the side surface of the fingerprint sensor module.
  • the width W5 of the resin layer 300 may correspond to the width W1 of the groove or may be larger than the width W1 of the groove. Accordingly, the resin layer 300 may be entirely filled on the inclined surface and the bottom surface of the groove.
  • the width W5 of the resin layer 300 may mean that measured on the one surface (100a) of the substrate 100.
  • the height of the top surface of the resin layer 300 may be lower than the height of the top surface of the fingerprint sensor module 200.
  • the resin layer 300 may contact the bottom surface and both side surfaces of the fingerprint sensor module 200. That is, the resin layer 300 may be filled in the cavity between the fingerprint sensor module 200 and the groove. Accordingly, the resin layer 300 may be a support layer for fixing the fingerprint sensor module 200 to be stably received in the groove.
  • the height of the upper surface of the resin layer 300 may be greater than the height of one surface 100a of the substrate 100. That is, the thickness of the resin layer 300 may correspond to the thickness T3 of the groove or may be larger than the thickness T3 of the groove. Accordingly, the resin layer 300 may cover the entire area of the substrate where the groove is disposed.
  • the beads 350 may be disposed on the ineffective area UA of the substrate 100.
  • the bead 350 may be partially disposed in the ineffective area UA of the substrate 100.
  • the bead 350 may be disposed on one surface corresponding to one surface of the substrate 100 including the groove.
  • the bead 350 may be disposed in the groove.
  • the resin layer 300 may include a plurality of beads 350. That is, the beads 350 may be dispersed in the resin layer 300. The plurality of beads 350 may be uniformly dispersed in the resin layer 300.
  • the plurality of beads 350 may be spaced apart from each other.
  • the separation distance of the plurality of beads 350 may correspond to or be similar to each other.
  • the separation distance between any of the plurality of beads 350 and the second bead adjacent to the first bead may correspond to or be similar to the separation distance from the third bead adjacent to the second bead. Can be.
  • the plurality of beads 350 may be disposed between the bottom surface of the groove and the bottom surface of the fingerprint sensor module 200.
  • the plurality of beads 350 dispersed in the resin layer 300 may be included in an amount of 0.001 to 1% by volume with respect to the resin layer 300.
  • the plurality of beads 350 dispersed in the resin layer 300 may be included in an amount of 0.01 to 1% by volume with respect to the resin layer 300.
  • the plurality of beads 350 dispersed in the resin layer 300 may be included in an amount of 0.01 to 0.5% by volume with respect to the resin layer 300.
  • the fingerprint sensor module 200 may be supported so as not to be inclined. Accordingly, the separation distance between the finger and the fingerprint sensor module may correspond regardless of the position, thereby solving the problem caused by the fingerprint recognition error. That is, the reliability of the fingerprint sensing device including the fingerprint sensor module according to the embodiment may be improved.
  • the plurality of beads 350 may be in contact with any one of the bottom surface and the bottom surface of the fingerprint sensor module 200, respectively.
  • the plurality of beads 350 may be in contact with the bottom surface and the fingerprint sensor module 200, respectively.
  • the bottom surface of the first bead may contact the bottom surface of the groove, and the top surface of the first bead may contact the bottom surface of the fingerprint sensor module 200.
  • the bottom surface of the second bead may be in direct contact with the bottom surface of the groove, and the top surface of the second bead may be in direct contact with the bottom surface of the fingerprint sensor module 200.
  • the bottom surface of the groove and the bottom surface of the fingerprint sensor module may be spaced apart by the bead 350.
  • the diameter of the bead 350 may correspond to the separation distance between the bottom surface of the groove and the bottom surface of the fingerprint sensor module.
  • the bead 350 may prevent a decrease in manufacturing yield and a decrease in reliability of the fingerprint sensing device due to the inclination of the fingerprint sensor.
  • Parallel is not only completely parallel, of course, may include a difference of 1 ⁇ m or less. That is, the plurality of beads 350 may support the fingerprint sensor module 200 disposed on the bead 350.
  • the fingerprint sensor module 200 may be disposed in the groove without being inclined by the plurality of beads 350.
  • the size of the bead 350 may correspond to the separation distance between the bottom surface and the fingerprint sensor module 200. That is, only the beads 350 spaced apart from each other may be disposed between the bottom surface and the fingerprint sensor module 200.
  • the plurality of beads may not be in contact with each other, and thus the distance between the fingerprint sensor and the finger may be uniform regardless of the position.
  • the bottom surface and the bottom surface of the fingerprint sensor module 200 may be disposed in parallel to each other. Accordingly, the distance between the fingerprint sensor and the finger may be uniform regardless of the position.
  • the beads 350 may be spherical particles.
  • the plurality of beads 350 may have a corresponding shape. Since the plurality of beads are spherical, they may be evenly dispersed in the resin layer 300.
  • the average diameter of the beads 350 may include 10 to 100 ⁇ m.
  • the average diameter of the beads 350 may include 10 to 70 ⁇ m.
  • the average diameter of the beads 350 may include 10 to 50 ⁇ m.
  • the plurality of beads 350 may have a corresponding average diameter.
  • the average diameter of the bead 350 may be selected within the range of 10 to 100 ⁇ m in consideration of the distance between the fingerprint sensor and the finger and the supporting effect of the fingerprint sensor.
  • the average diameter of the bead 350 When the average diameter of the bead 350 is included in the 10 to 100 ⁇ m, it can be supported so as not to tilt the fingerprint sensor module 200. Accordingly, the separation distance between the finger and the fingerprint sensor module may correspond regardless of the position, thereby solving the problem due to the fingerprint recognition error. That is, the fingerprint sensing device including the fingerprint sensor module and the display device including the same may have improved reliability.
  • 10 to 500 beads may be included between the bottom surface and the fingerprint sensor module 200.
  • 50 to 300 beads may be included between the bottom surface and the fingerprint sensor module 200.
  • 10 to 100 beads may be included between the bottom surface and the fingerprint sensor module 200.
  • 10 to 50 beads may be included between the bottom surface and the fingerprint sensor module 200.
  • the average diameter of the beads 350 is 10 to 100 ⁇ m, 10 to 500 beads may be included between the bottom surface and the bottom surface of the fingerprint sensor module 200.
  • the fingerprint sensor module 200 may be tilted. Accordingly, the separation distance between the finger and the fingerprint sensor module may vary depending on the location, and an error in fingerprint recognition may occur. That is, the reliability of the fingerprint sensing device including the fingerprint sensor module may be degraded.
  • FIG. 22 is a sectional view of a fingerprint sensing device according to Comparative Example 1.
  • FIG. Comparative Example 1 is a cross-sectional view of a fingerprint sensing device in which a resin layer including no beads is disposed between a bottom surface and a fingerprint sensor module.
  • the fingerprint sensor module 200 may be tilted in the impregnation process.
  • the fingerprint sensor module 200 may be inclined according to the center of gravity of the fingerprint sensor module 200. Accordingly, the distance d1 between the fingerprint sensor module and the bottom surface may be different from the distance d1 at the first end and the distance d2 at the second end. Accordingly, when a finger is positioned on an area corresponding to the first end and an area corresponding to the second end, an error of fingerprint recognition may occur.
  • FIG. 23 is a sectional view of a fingerprint sensing device according to Comparative Example 2.
  • Comparative Example 2 is a cross-sectional view of a fingerprint sensing device in which a resin layer including less than ten beads is disposed between a bottom surface and a fingerprint sensor module.
  • the fingerprint sensor module 200 may be tilted in the impregnation process.
  • the fingerprint sensor module 200 may be inclined. Accordingly, the fingerprint sensor module and the bottom surface may have a separation distance d3 from the first end, and the fingerprint sensor module and the bottom surface may contact each other at the second end. Accordingly, when a finger is positioned on an area corresponding to the first end and an area corresponding to the second end, an error of fingerprint recognition may occur.
  • the fingerprint sensor module 200 may be tilted. Accordingly, the separation distance between the finger and the fingerprint sensor module may vary depending on the location, and an error in fingerprint recognition may occur. That is, the reliability of the fingerprint sensing device including the fingerprint sensor module may be degraded.
  • FIG. 24 is a sectional view of a fingerprint sensing device according to Comparative Example 3.
  • FIG. 24 is a sectional view of a fingerprint sensing device according to Comparative Example 3.
  • Comparative Example 3 is a cross-sectional view of a fingerprint sensing device in which a resin layer including more than 500 beads is disposed between a bottom surface and a fingerprint sensor module.
  • the fingerprint sensor module 200 may be tilted in the impregnation process.
  • the fingerprint sensor module 200 may be inclined. Accordingly, the distance d4 between the fingerprint sensor module and the bottom surface may be different from the distance d4 at the first end and the distance d5 at the second end. Accordingly, when a finger is positioned on an area corresponding to the first end and an area corresponding to the second end, an error of fingerprint recognition may occur.
  • the bead 350 may include at least one of an epoxy compound, an acrylic compound, and a silicon compound.
  • the bead 350 may include a resin.
  • the bead 350 may include a photocurable resin or a thermosetting resin.
  • the bead 350 may include at least one of an epoxy resin, an acrylic resin, and a silicone resin.
  • the bead 350 may include a compound corresponding to the resin layer 300.
  • the bead 350 may include a compound having a composition corresponding to the resin layer 300.
  • the bead 350 may have a dielectric constant corresponding to the resin layer 300. Accordingly, the reliability of the display device including the fingerprint sensor according to the embodiment can be improved.
  • the dielectric constant of the bead 350 and the resin layer 300 is different, a problem may occur in which a fingerprint sensor is misidentified as a signal in a region where the bead 350 is located. That is, the display device according to the embodiment disperses the bead 350 having the same composition and the same dielectric constant as the resin layer 300 in the resin layer 300, thereby supporting the fingerprint sensor module while maintaining the fingerprint signal. Misunderstanding can be prevented.
  • the groove of the substrate 100 may include an inclined surface and a bottom surface.
  • an inclination angle formed with the other surface 100b of the substrate 100 may decrease as the groove goes from the outer area OA of the groove to the center area CA of the groove.
  • the outer area OA of the groove and the center area CA of the groove may be disposed at different inclination angles with respect to the other surface 100b of the substrate 100.
  • the outer area OA of the groove may include an inclined surface.
  • the inclination angle of the inclined surface may be 15 degrees to 70 degrees.
  • the inclination angle of the inclined surface may be 30 degrees to 60 degrees.
  • the inclination angle of the inclined surface may be 35 degrees to 55 degrees.
  • the groove When the inclination angle of the inclined surface is less than 15 degrees, as the width W1 of the bottom surface of the groove is increased, the groove may not be disposed in the ineffective area UA. That is, one end of the groove may be formed in the effective area AA. Alternatively, when the inclination angle of the inclined surface is less than 15 degrees, the display area may be reduced as the bezel area is enlarged.
  • the dispersion of force may be reduced by reducing the specific surface area against external impact. That is, when the inclination angle of the inclined surface is greater than 70 degrees, since the force applied to the unit region is increased, the rigidity of the substrate may be reduced.
  • the outer area OA of the groove may include a first inclined surface 101 and a second inclined surface 102.
  • the first inclined surface 101 may mean a surface on which an inclined surface is started adjacent to one surface of the substrate, and the second inclined surface 102 may mean an inclined surface adjacent to a central area CA of the groove. That is, the first inclined surface 101 may refer to an inclined surface that is located outside the second inclined surface 102.
  • the first inclined surface 101 may have a larger inclination angle formed with the other surface 100b of the substrate 100 than the second inclined surface 102.
  • the first sub first inclination angle ⁇ 1a of the first inclined surface 101 may be greater than the second sub first inclination angle ⁇ 1b of the second inclined surface 102.
  • the first inclined surface 101 and the second inclined surface 102 are taken as an example. However, since the inclined angle gradually decreases toward the central area CA, the third inclined surface and the second inclined surface 102 are formed. Of course, it may include several inclined surfaces, such as four inclined surfaces.
  • the central area CA of the groove may include a plane.
  • the central area CA of the groove may include a substantially plane close to the plane.
  • the central area CA of the groove may be disposed at an angle of about 0 degrees to about 2 degrees with respect to the other surface 100b of the substrate 100.
  • the center area CA of the groove may be disposed at an angle of about 0 degrees to about 1 degree with respect to the other surface 100b of the substrate 100.
  • the center area CA of the groove may be disposed at an angle of about 0 degrees to about 0.5 degrees with respect to the other surface 100b of the substrate 100.
  • the center area CA of the groove may be disposed in parallel with the other surface 100b of the substrate 100.
  • the fingerprint sensor 500 may be disposed at a position corresponding to the inside of the groove.
  • the fingerprint sensor 500 may be disposed in an area corresponding to the central area CA of the groove.
  • the distance between the touch surface of the finger and the fingerprint sensor is constant, thereby preventing malfunction or failure of fingerprint recognition, thereby improving reliability of fingerprint recognition.
  • the groove may include a central area CA and an outer area OA surrounding the central area CA.
  • the outer region OA may include an inclined surface.
  • the inclination angle of the inclined surface may be 38 degrees to 48 degrees.
  • the inclination angle of the inclined surface may be 40 degrees to 46 degrees.
  • the inclination angle of the inclined surface may be 42 degrees to 44 degrees.
  • the inclined surface may be disposed at a different inclination angle from the bottom surface of the groove.
  • the inclination angle of the inclined surface disposed in the outer region OA may have a predetermined angle.
  • the width W1 of the bottom surface of the groove may be smaller than the width W3 of the decor layer 400.
  • the width W4 of the fingerprint sensor module 200 may also be smaller than the width of the decor layer 400.
  • the central area CA of the groove and the fingerprint sensor may be disposed to face each other with the decor layer 400 therebetween.
  • the central area CA of the groove and the fingerprint sensor module may be arranged in parallel with each other at an angle of 0 degrees.
  • the deco layer 400 may directly contact the inclined surface and the bottom surface of the groove. Accordingly, the deco layer 400 is disposed inside the groove, and the resin layer 300 having a plurality of beads dispersed on the deco layer 400 is disposed, and the beads 350 and the resin layer ( The fingerprint sensor module 200 may be disposed on the 300. Accordingly, the decor layer 400 may prevent the fingerprint sensor module 200 from being visually recognized. In addition, the strength reduction of the substrate 100 may be compensated for, thereby improving reliability of the fingerprint sensing device including the fingerprint sensor module.
  • a method of manufacturing a fingerprint sensing device according to an embodiment will be described with reference to FIG. 25.
  • the resin layer 300 in which the plurality of beads 350 are dispersed may be disposed in a groove of the substrate 100.
  • the beads 350 may be solid particles, and the resin layer 300 may be a liquid phase. That is, the beads 350 and the resin layer 300 may be materials of different phases having compositions corresponding to each other.
  • the fingerprint sensor module 200 may be disposed on the resin layer 300 in which the plurality of beads 350 are dispersed.
  • the fingerprint sensor module 200 may be disposed by an impregnation process on the resin layer 300 in which the plurality of beads 350 are dispersed.
  • spherical beads having a size corresponding to a separation distance between a bottom surface of the groove and a bottom surface of the fingerprint sensor may be disposed. Accordingly, even when the fingerprint sensor is disposed on the resin having fluidity, the fingerprint sensor may not be inclined, so that the reliability of the fingerprint sensing device may be improved.
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a fingerprint sensor chip 220, a printed circuit board 230, a wire 240, and a molding part 250.
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a printed circuit board 230, and a support layer 260.
  • the fingerprint sensor module 200 may include a fingerprint sensor 210, a printed circuit board 230, and a fingerprint sensor chip 220.
  • 29 to 31 are views illustrating a display device in which a touch window to which a fingerprint sensor device according to the second embodiment is applied and a display panel are combined.
  • the decor layer 400 may be entirely disposed on the ineffective area UA.
  • the resin layer 300 including the bead 350 and the fingerprint sensor module 200 may be disposed on the decor layer.
  • the decor layer 400 may be one layer extending from the ineffective area UA to the fingerprint sensing area FA.
  • the decor layer 400 may include a first decor layer 410 disposed in the fingerprint sensing area FA, a third decor layer 430, and a second decor layer disposed in the ineffective area UA. 420 may all be included.
  • the substrate 100 may include a groove, and the first decor layer 410 may be disposed on a bottom surface formed in the groove.
  • the first resin layer 310 may be disposed on the inclined surface formed in the groove.
  • the second decor layer 420 may be disposed on one surface of the first resin layer 310 and the outer surface of the groove.
  • the first resin layer 310 may contact the third decor layer 430.
  • the first resin layer 310 may not include beads.
  • the first resin layer 310 is for arranging the inclined surface of the groove to a surface having an angle close to the bottom surface of the groove, beads may not be required.
  • the second resin layer 320 may contact the third decor layer 430.
  • the second resin layer 320 may include a plurality of beads 350.
  • the second resin layer 320 may be disposed on the first decor layer 410.
  • the plurality of beads 350 included in the second resin layer 320 may be configured to maintain a constant distance between the first decor layer 410 and the fingerprint sensor module 200. That is, in the second embodiment, the separation distance between the first decor layer 410 and the fingerprint sensor module 200 may correspond to the size of the bead. Accordingly, the second embodiment can provide a fingerprint sensing device having excellent appearance and excellent reliability of fingerprint sensing.
  • a mobile terminal is shown as an example of a touch device apparatus.
  • the mobile terminal may include an effective area AA and an invalid area UA.
  • the effective area AA may detect a touch signal by a touch of a finger or the like, and a command icon pattern part and a logo may be formed in the invalid area.
  • the fingerprint sensing area FA may be easily recognized by the user by the metal ring MR, thereby improving convenience of the user.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

L'invention concerne un couvercle de capteur d'empreinte digitale selon un mode de réalisation comprenant : un substrat; une rainure formée dans une zone du substrat pour reconnaître une empreinte digitale; une surface inclinée et une surface inférieure formée à l'intérieur de la rainure; une première couche décorative disposée sur la surface inférieure; une couche de résine agencée pour faire face à la surface inclinée; et une seconde couche décorative disposée sur la partie externe de la rainure et la couche de résine, la couche de résine étant disposée entre la surface inclinée et la seconde couche décorative, et la surface de la couche de résine diminue d'une surface du substrat vers le fond de la rainure. l'invention concerne également un dispositif de détection d'empreinte digitale selon un mode de réalisation comprend : un substrat; une rainure formée dans une zone du substrat pour reconnaître une empreinte digitale; une surface inclinée et une surface inférieure formée à l'intérieur de la rainure; une première couche décorative disposée sur la surface inférieure; une couche de résine agencée pour faire face à la surface inclinée; une seconde couche décorative disposée sur la partie externe de la rainure et la couche de résine; et un module de capteur d'empreinte digitale disposé sur la première couche décorative. Un dispositif tactile selon un mode de réalisation comprend : un substrat comprenant une zone efficace et une zone non efficace; une rainure formée dans la zone non efficace; une surface inclinée et une surface inférieure formées à l'intérieur de la rainure; une première couche décorative disposée sur la surface inférieure; une couche de résine agencée pour faire face à la surface inclinée; une seconde couche décorative disposée sur la partie externe de la rainure et la couche de résine; et un module de capteur d'empreinte digitale disposé sur la première couche décorative, le dispositif tactile comprenant une électrode tactile et un panneau d'affichage agencés dans la zone efficace.
PCT/KR2017/005868 2016-07-01 2017-06-05 Couvercle de capteur d'empreinte digitale, dispositif de détection d'empreinte digitale et dispositif tactile le comprenant WO2018004138A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790001131.9U CN209265407U (zh) 2016-07-01 2017-06-05 指纹传感器盖、指纹感测装置及包括其的触摸装置

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KR1020160083723A KR20180003928A (ko) 2016-07-01 2016-07-01 지문센싱 장치 및 이를 포함하는 디스플레이 장치
KR10-2016-0083723 2016-07-01
KR10-2016-0086413 2016-07-07
KR1020160086413A KR20180005995A (ko) 2016-07-07 2016-07-07 지문센서 커버, 지문센싱 장치, 및 이를 포함하는 터치 윈도우

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TWI677720B (zh) * 2018-10-04 2019-11-21 大陸商廣州印芯半導體技術有限公司 光學影像感測裝置
WO2021077406A1 (fr) * 2019-10-25 2021-04-29 深圳市汇顶科技股份有限公司 Appareil de reconnaissance d'empreintes digitales et dispositif électronique
US20220058359A1 (en) * 2020-08-24 2022-02-24 Elan Microelectronics Corporation Patterned fingerprint sensing module and manufacturing method thereof

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KR20160071352A (ko) * 2014-12-11 2016-06-21 크루셜텍 (주) 전자기기 커버윈도우 일체형 지문센서 모듈 조립체

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KR20130046387A (ko) * 2011-10-27 2013-05-07 벌리더티 센서스 인코포레이티드 전자 디바이스 패키지들 및 방법들
KR20150034511A (ko) * 2013-09-26 2015-04-03 크루셜텍 (주) 모바일 장치용 지문센서 모듈
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Publication number Priority date Publication date Assignee Title
TWI677720B (zh) * 2018-10-04 2019-11-21 大陸商廣州印芯半導體技術有限公司 光學影像感測裝置
WO2021077406A1 (fr) * 2019-10-25 2021-04-29 深圳市汇顶科技股份有限公司 Appareil de reconnaissance d'empreintes digitales et dispositif électronique
US20220058359A1 (en) * 2020-08-24 2022-02-24 Elan Microelectronics Corporation Patterned fingerprint sensing module and manufacturing method thereof

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