WO2017217174A1 - Ceramic electronic component - Google Patents

Ceramic electronic component Download PDF

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Publication number
WO2017217174A1
WO2017217174A1 PCT/JP2017/018459 JP2017018459W WO2017217174A1 WO 2017217174 A1 WO2017217174 A1 WO 2017217174A1 JP 2017018459 W JP2017018459 W JP 2017018459W WO 2017217174 A1 WO2017217174 A1 WO 2017217174A1
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WO
WIPO (PCT)
Prior art keywords
layer
ceramic
surface electrode
component
electronic component
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Application number
PCT/JP2017/018459
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French (fr)
Japanese (ja)
Inventor
佳丈 山上
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2018523600A priority Critical patent/JP6773114B2/en
Publication of WO2017217174A1 publication Critical patent/WO2017217174A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a ceramic electronic component.
  • Examples of the ceramic electronic component having a surface electrode on the surface of the electronic component main body include a multilayer ceramic electronic component such as a multilayer ceramic substrate.
  • a coating called a framing layer is used to prevent deterioration of the high-frequency characteristics of the surface electrode, to prevent stress deterioration of the surface electrode and to prevent deterioration of resistance to plating erosion, that is, to improve the reliability of the surface electrode.
  • a ceramic layer is provided on the outer periphery of the surface electrode (see Patent Document 1).
  • the coated ceramic layer is provided on a ceramic layer (hereinafter referred to as a base ceramic layer) of the electronic component body in addition to the outer peripheral portion of the surface electrode.
  • the coated ceramic layer is formed by placing a ceramic green sheet for forming a coated ceramic layer on a predetermined location and firing, or by applying a ceramic paste for forming a coated ceramic layer to a predetermined location and firing.
  • the sinterability of the ceramic green sheet or the ceramic paste is different between the surface electrode and the base ceramic layer, there is a problem that the strength of the coated ceramic layer obtained after firing is different. Specifically, the strength of the coated ceramic layer on the surface electrode is lower than the strength of the coated ceramic layer on the base ceramic layer, and as a result, the coated ceramic layer formed by firing peels from the surface electrode. There was a problem.
  • the present invention has been made to solve the above-described problem, and has a high bonding strength between a coated ceramic layer and a surface electrode, and can prevent peeling of the coated ceramic layer from the surface electrode.
  • the purpose is to provide.
  • the cause of the difference in the strength of the coated ceramic layer obtained after firing is considered to be due to the difference in sinterability of the base ceramic layer, the surface electrode, and the coated ceramic layer. Since the base ceramic layer and the coated ceramic layer are ceramics, the sinterability is similar to each other, and problems such as peeling are unlikely to occur in the coated ceramic layer formed on the base ceramic layer. It is done. On the other hand, when the surface electrode and the coated ceramic layer are compared, the coated ceramic layer has a ceramic-rich composition, whereas the surface electrode has a metal-rich composition. The sinterability is considered to be different from each other. That is, the present inventor thought that the bonding strength between the surface electrode and the coated ceramic layer was lowered due to the difference in sinterability between the surface electrode and the coated ceramic layer, which might cause peeling.
  • the present inventor has provided an anchor layer having a property intermediate between the surface electrode and the coated ceramic layer between the coated ceramic layer on the surface electrode and the surface electrode, thereby forming the coated ceramic formed on the surface electrode.
  • the present inventors have found that the bonding strength of the layers can be improved to prevent peeling of the coated ceramic layer.
  • the ceramic electronic component of the present invention includes an electronic component main body having a base ceramic layer on the surface, a surface electrode provided on the surface of the electronic component main body, and a coated ceramic layer covering the outer periphery of the surface electrode.
  • an anchor layer including both a metal component and a ceramic component is provided between the outer peripheral portion of the surface electrode and the coated ceramic layer.
  • the ceramic electronic component of the present invention is provided with an anchor layer having both a metal component and a ceramic component on the outer peripheral portion of the surface electrode, so that the bonding strength between the coated ceramic layer and the anchor layer is improved. It becomes higher than the bonding strength with the electrode. As a result, when the ceramic electronic component is fired, the coated ceramic layer is difficult to peel off.
  • the bonding strength between the coated ceramic layer and the anchor layer is high, the surface electrode and the coated ceramic layer before forming the plated layer are formed even if the plated layer is formed after the coated ceramic layer is formed. During this period, the plating solution is less likely to enter, so that the risk of abnormal deposition decreases.
  • the ceramic component of the anchor layer is sintered with the coated ceramic layer in the vicinity of the boundary between the anchor layer and the coated ceramic layer. Further, in the vicinity of the boundary between the anchor layer and the surface electrode, the metal component of the anchor layer is sintered with the surface electrode. That is, since only one of the metal component or ceramic component in the anchor layer preferentially undergoes a sintering reaction near each boundary, the boundary between the anchor layer and the coated ceramic layer and the boundary between the anchor layer and the surface electrode Thus, a physical anchor structure is formed, and the anchor layer, the covering ceramic layer, the anchor layer, and the surface electrode are firmly bonded.
  • the anchor layer contains both the metal component and the ceramic component, even if the original sintering start temperature of the metal component in the anchor layer is exceeded, the sintering start temperature of the ceramic component in the anchor layer is reached. Until it does not start sintering. Therefore, the low melting point component (also referred to as a liquid phase component) in the coated ceramic layer is melted first, and sintering proceeds while entering the anchor layer. At this time, sintering proceeds while the liquid phase component penetrates into the anchor layer, so that a physical anchor structure is formed near the boundary between the coated ceramic layer and the anchor layer, and the coated ceramic layer and the anchor layer are strong. To be joined.
  • the low melting point component also referred to as a liquid phase component
  • the anchor layer is preferably provided only between the outer peripheral portion of the surface electrode and the coated ceramic layer. If the anchor layer is provided only between the outer peripheral portion of the surface electrode and the coated ceramic layer, the surface electrode is exposed in the portion of the surface electrode where the coated ceramic layer is not provided. The plating property of the surface electrode does not deteriorate. Accordingly, it is possible to suppress a decrease in the plateability of the surface electrode while maintaining the bonding strength of the coated ceramic layer.
  • the metal component and the ceramic component constituting the anchor layer include the same components as the metal component constituting the surface electrode and the ceramic component constituting the coated ceramic layer, respectively. . If the metal component constituting the anchor layer contains the same component as the metal component constituting the surface electrode, the reactivity between the anchor layer and the surface electrode is improved, and the bonding strength is improved. Moreover, when the ceramic component which comprises an anchor layer contains the same component as the ceramic component which comprises a covering ceramic layer, the reactivity of an anchor layer and a covering ceramic layer will improve, and joint strength will improve.
  • the metal component and the ceramic component constituting the anchor layer contain the same components as the metal component constituting the surface electrode and the ceramic component constituting the coated ceramic layer, respectively, the bonding strength between the surface electrode and the coated ceramic layer is obtained. Is improved, and peeling can be further suppressed.
  • the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component constituting the anchor layer is preferably 10% or more and 90% or less.
  • the anchor layer is sufficient for both the surface electrode and the coated ceramic layer. It will have a sufficient bonding strength.
  • the joining strength between a coating ceramic layer and a surface electrode is high, and the ceramic electronic component which can prevent peeling of the coating ceramic layer from a surface electrode can be provided.
  • FIG. 1 is a cross-sectional view schematically showing an example of the ceramic electronic component of the present invention.
  • 2A to 2B are cross-sectional views schematically showing an example of a method for manufacturing the ceramic electronic component 1 shown in FIG.
  • FIG. 3 is a cross-sectional view schematically showing another example of the ceramic electronic component of the present invention.
  • the ceramic electronic component of the present invention will be described.
  • the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
  • a combination of two or more of the individual desirable configurations of the present invention described below is also the present invention.
  • the ceramic electronic component is a multilayer ceramic electronic component such as a multilayer ceramic substrate, that is, a case where the electronic component body has a multilayer structure in which a plurality of ceramic layers are stacked will be described.
  • the present invention is not limited to the multilayer ceramic electronic component, and is applicable to various ceramic electronic components in which the electronic component body has a base ceramic layer on the surface and the surface electrode is provided on the surface of the electronic component body. Is possible.
  • FIG. 1 is a cross-sectional view schematically showing an example of the ceramic electronic component of the present invention.
  • the ceramic electronic component 1 includes an electronic component body 10 having a base ceramic layer 11 on the surface, and a surface electrode 20 provided on the surface of the electronic component body 10. And a coated ceramic layer 40 that covers the outer periphery of the surface electrode 20.
  • An anchor layer 30 is provided between the outer peripheral portion of the surface electrode 20 (a region indicated by a double-headed arrow W1 in FIG. 1) and the coated ceramic layer 40.
  • the outer peripheral portion of the surface electrode 20 is covered with a covering ceramic layer 40.
  • region which is not an outer peripheral part among the surface electrodes 20 be a center part (area
  • the electronic component body 10 has a laminated structure in which a plurality of base ceramic layers 11 are laminated. Inside the electronic component body 10, an internal conductor film 12 as an internal wiring conductor and a via-hole conductor are provided. 13 is provided. The internal conductor film 12 is electrically connected to the via hole conductor 13, and the via hole conductor 13 is electrically connected to the surface electrode 20.
  • the surface electrode is covered with the covering ceramic layer. That's it.
  • the base ceramic layer constituting the electronic component body preferably contains a low-temperature sintered ceramic material.
  • the low-temperature sintered ceramic material means a material that can be sintered at a temperature of 1000 ° C. or less and can be co-fired with Ag or Cu among ceramic materials.
  • Examples of the low-temperature sintered ceramic material contained in the base ceramic layer include a glass composite low-temperature sintered ceramic material obtained by mixing borosilicate glass with a ceramic material such as quartz, alumina, and forsterite, ZnO—MgO— Crystallized glass-based low-temperature sintered ceramic materials using Al 2 O 3 —SiO 2 -based crystallized glass, BaO—Al 2 O 3 —SiO 2 -based ceramic materials and Al 2 O 3 —CaO—SiO 2 —MgO— Non-glass type low temperature sintered ceramic materials using B 2 O 3 type ceramic materials and the like can be mentioned.
  • a glass composite low-temperature sintered ceramic material obtained by mixing borosilicate glass with a ceramic material such as quartz, alumina, and forsterite
  • ZnO—MgO— Crystallized glass-based low-temperature sintered ceramic materials using Al 2 O 3 —SiO 2 -based crystallized glass BaO—Al 2 O 3
  • the internal wiring conductor (internal conductor film and via hole conductor) provided inside the electronic component main body contains a conductive component.
  • a conductive component contained in the internal wiring conductor for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and one of these metals are the main components. And the like.
  • the internal wiring conductor preferably contains Au, Ag, or Cu as the conductive component, and more preferably contains Ag or Cu. Since Au, Ag, and Cu have low resistance, they are particularly suitable when the ceramic electronic component is used for high frequency.
  • the surface electrode provided on the surface of the electronic component main body is for connection with other electronic components such as a wiring board or a mounted component.
  • the surface electrode and other electronic components are connected by soldering or the like.
  • the surface electrode As a conductive component contained in the surface electrode, for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and one of these metals are the main components. An alloy etc. are mentioned.
  • the surface electrode preferably contains the same conductive component as the internal wiring conductor. Specifically, the surface electrode preferably contains Au, Ag, or Cu, and more preferably contains Ag or Cu.
  • the width of the outer peripheral portion of the surface electrode (the length represented by W1 in FIG. 1) is not particularly limited, but is preferably 40 ⁇ m or more and 100 ⁇ m or less.
  • the surface electrode may have a single-layer structure or a multilayer structure, but preferably has a multilayer structure.
  • the surface electrode may have a single-layer structure or a multilayer structure, but preferably has a multilayer structure.
  • the surface electrode consists only of a sintered layer.
  • the sintered layer is formed by co-firing a conductive paste with a base ceramic layer, an anchor layer, and a coated ceramic layer.
  • the sintered layer constituting the surface electrode contains a conductive component.
  • the sintered layer may further contain a metal oxide in order to increase the bonding strength with the electronic component body.
  • the sintered layer has a multilayer structure, the first sintered layer provided on the upper surface of the base ceramic layer located on the surface of the electronic component main body and the second sintered layer provided on the upper surface of the first sintered layer. More preferably, it has at least a two-layer structure including a binder.
  • the conductive component contained in the first sintered layer for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru and one of these metals are mainly used. Examples include alloys as components.
  • the first sintered layer preferably contains the same conductive component as that of the internal wiring conductor. Specifically, the first sintered layer preferably contains Au, Ag, or Cu as the conductive component, and may contain Ag or Cu. More preferred.
  • Examples of the metal oxide contained in the first sintered layer include those containing at least one metal element selected from the group consisting of Al, Zr, Ti, Si, and Mg. 1 type may be sufficient as the said metal oxide, and 2 or more types may be sufficient as it. Among these, those containing at least one metal element selected from the group consisting of Al, Zr and Ti are preferable, and metal oxides containing Al are more preferable.
  • the content of the metal oxide in the first sintered layer is not particularly limited, it is preferably larger than the content of the metal oxide in the second sintered layer.
  • the content of the metal oxide in the first sintered layer is preferably 1% by weight or more, and more preferably 3% by weight or more.
  • the content of the metal oxide in the first sintered layer is preferably less than 10% by weight, and more preferably less than 5% by weight.
  • the metal particles constituting the conductive component and the metal oxide particles may be present in a dispersed state, and the metal oxide is present around the metal particles. Although it may be coated, it is preferable that a metal oxide is coated around the metal particles. When the metal oxide is coated around the metal particles, the bonding strength with the electronic component main body can be increased even if the metal oxide content is low.
  • the shape of the first sintered layer in plan view is not particularly limited, and examples thereof include a quadrilateral including a rectangle, a polygon other than a quadrangle, a circle, and an ellipse.
  • the second sintered layer constituting the surface electrode contains a conductive component.
  • the conductive component contained in the second sintered layer is preferably the same as the conductive component contained in the first sintered layer.
  • the second sintered layer may contain the same metal oxide as the metal oxide contained in the first sintered layer, but when the content of the metal oxide increases, the upper surface of the second sintered layer Plating is difficult to adhere to. Therefore, the second sintered layer preferably contains less metal oxide than the first sintered layer, and more preferably does not substantially contain the metal oxide.
  • the second sintered layer contains a metal oxide
  • the content of the metal oxide in the first sintered layer is 1 wt% or more and less than 10 wt%
  • the metal in the second sintered layer The oxide content is preferably less than 1% by weight. Further, when the content of the metal oxide in the first sintered layer is 3% by weight or more and less than 5% by weight, the content of the metal oxide in the second sintered layer is less than 3% by weight. It is preferable.
  • the area of the upper surface of the second sintered layer is preferably substantially the same as the area of the upper surface of the first sintered layer. That is, it is preferable that the planar view shape of the second sintered layer is substantially the same as the planar view shape of the first sintered layer.
  • the number of the sintered layers is not limited to two, and other layers are provided between the first sintered layer provided on the upper surface of the base ceramic layer and the second sintered layer provided with the plating layer on the upper surface.
  • a sintered layer may be provided.
  • the anchor layer is a layer having both a metal component and a ceramic component, and a paste material containing the metal component and the ceramic component is formed on the upper surface of the surface electrode or the upper surface of the conductive paste film that becomes the surface electrode, and fired. It is obtained by doing.
  • the metal component which comprises an anchor layer is not specifically limited, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and 1 type of these metals are made into a main component. An alloy etc. are mentioned, It is preferable that the same component as the metal component which comprises a surface electrode is included, and it is more preferable that the metal component which comprises an anchor layer and the metal component which comprises a surface electrode are the same.
  • the metal component constituting the anchor layer preferably includes the same component as the metal component constituting the outermost sintered layer (side closer to the anchor layer). More preferably, the metal component constituting the layer and the metal component constituting the outermost sintered layer (side closer to the anchor layer) are the same.
  • the ceramic component constituting the anchor layer is not particularly limited, but preferably contains the same component as the ceramic component constituting the coated ceramic layer, and the ceramic component constituting the anchor layer and the ceramic component constituting the coated ceramic layer are the same. It is more preferable that Since the anchor layer has both a metal component and a ceramic component, good bonding strength can be maintained even when bonded to either the surface electrode or the coated ceramic layer.
  • the ratio of the metal component and the ceramic component constituting the anchor layer is not particularly limited, but the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component is preferably 5% or more and 95% or less. % Or more and 90% or less, more preferably 40% or more and 60% or less. When the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component is 5% or more and 95% or less, the anchor layer can be bonded to the surface electrode and the coated ceramic layer.
  • the metal component and ceramic component constituting the anchor layer may be dispersed in the anchor layer, or the ceramic component may cover the periphery of the metal component.
  • an anchor layer is not specifically limited, It is preferable that they are 5 micrometers or more and 10 micrometers or less.
  • the anchor layer may be formed over the entire area of the surface electrode, but is preferably formed only on the outer periphery of the surface electrode. That is, the anchor layer is preferably not provided in the center portion of the surface electrode, but only between the outer peripheral portion of the surface electrode and the coated ceramic layer. In the case where a plating layer is further formed on the surface electrode, if the anchor layer is provided at the center of the surface electrode, the plating property is lowered.
  • covers the outer peripheral part of a surface electrode is provided on the base-material ceramic layer located on the surface of an electronic component main body, and a surface electrode. Since the anchor layer described above is disposed on the surface electrode, the coated ceramic layer provided on the surface electrode is provided on the surface electrode via the anchor layer.
  • the coated ceramic layer preferably contains a low temperature sintered ceramic material.
  • the low-temperature sintered ceramic material contained in the coated ceramic layer may be the same as or different from the low-temperature sintered ceramic material contained in the base ceramic layer, but is contained in the base ceramic layer. It is preferably the same as the low temperature sintered ceramic material.
  • the thickness of the coated ceramic layer formed on the anchor layer is not particularly limited, but is preferably 2 ⁇ m or more and 20 ⁇ m or less.
  • the coated ceramic layer obtained from the area of the outer peripheral portion where the coated ceramic layer is formed and the volume of the coated ceramic layer existing in the outer peripheral portion Is the thickness of the coated ceramic layer formed on the anchor layer.
  • a plating layer may be further formed on the surface of the surface electrode.
  • the plating layer is formed by performing electrolytic plating or electroless plating on the surface electrode. Since the plating layer is usually formed after forming the sintered layer, the anchor layer, and the coated ceramic layer, the plated layer is not covered with the coated ceramic layer.
  • the plating layer is preferably made of Au, Ag, Ni, Pd, Cu, Sn, or an alloy containing these metals.
  • the plating layer is a Ni / Au plating layer in which the first layer from the surface electrode side is Ni, the second layer is Au, a first layer from the surface electrode side is Ni, a Ni / Sn plating layer in which the second layer is Sn,
  • a plating layer comprising a plurality of layers such as a Ni / Pd / Au plating layer in which the first layer from the surface electrode side is Ni, the second layer is Pd, and the third layer is Au may be used.
  • the thickness of the plating layer is not particularly limited, but is preferably 1 ⁇ m or more and 10 ⁇ m or less.
  • the ceramic electronic component 1 shown in FIG. 1 is preferably manufactured as follows.
  • 2A to 2B are cross-sectional views schematically showing an example of a method for manufacturing the ceramic electronic component 1 shown in FIG.
  • the unsintered laminated body 100 shown in FIG. 2A is produced.
  • a plurality of base ceramic green sheets 111 are prepared.
  • the base ceramic green sheet 111 becomes the base ceramic layer 11 after firing.
  • the base ceramic green sheet is obtained by forming a slurry containing a ceramic raw material powder such as a low-temperature sintered ceramic material, an organic binder and a solvent into a sheet shape by a doctor blade method or the like.
  • the slurry may contain various additives such as a dispersant and a plasticizer.
  • organic binder contained in the slurry for example, butyral resin (polyvinyl butyral), acrylic resin, methacrylic resin, or the like can be used.
  • solvent for example, alcohol such as toluene and isopropyl alcohol can be used.
  • plasticizer for example, di-n-butyl phthalate can be used.
  • a through hole for the via-hole conductor 13 is formed in the specific base ceramic green sheet 111.
  • a conductive paste body 113 to be the via-hole conductor 13 is formed.
  • the conductive paste film 112 to be the internal conductor film 12 is formed on the specific base ceramic green sheet 111 by using a conductive paste having the same composition as the conductive paste, for example, by a method such as screen printing. .
  • a conductive paste film 120 to be the surface electrode 20 is formed by firing on the base ceramic green sheet 111 disposed on the surface after lamination.
  • the conductive paste film 120 to be the surface electrode 20 by firing can be formed by a method such as screen printing using a conductive paste containing Ag or Cu as a conductive component, for example.
  • the conductive paste film 120 to be the surface electrode 20 by firing may be formed after the base ceramic green sheets 111 are laminated and before firing.
  • a conductive paste film to be the second sintered layer is formed on the conductive paste film to be the first sintered layer by a method such as screen printing. can do.
  • Anchor layer paste film 130 to be the anchor layer 30 is formed only on the outer peripheral portion of the conductive paste film 120 to be the surface electrode 20 by firing.
  • Anchor layer paste film 130 is, for example, an anchor layer paste in which a powder of a ceramic raw material such as a low-temperature sintered ceramic material and a powder containing Ag or Cu as a conductive component are dispersed in a mixture of an organic binder and a solvent, Alternatively, it can be formed by a method such as screen printing using an anchor layer paste in which ceramic coated metal particles having a ceramic coating applied to the surface of Ag or Cu as a conductive component are dispersed in a mixture of an organic binder and a solvent. it can.
  • a coated ceramic green sheet 140 is prepared.
  • the coated ceramic green sheet 140 becomes the coated ceramic layer 40 after firing.
  • the coated ceramic green sheet is obtained by forming a slurry containing a ceramic raw material powder such as a low-temperature sintered ceramic material, an organic binder, and a solvent into a sheet shape by a doctor blade method or the like.
  • the slurry may contain various additives such as a dispersant and a plasticizer.
  • the slurry for producing a base-material ceramic green sheet can also be used as a slurry for producing a covering ceramic green sheet.
  • the base ceramic green sheet 111 on which the conductive paste body 113 to be the via-hole conductor 13 or the conductive paste film 112 to be the internal conductor film 12 is formed, and the conductive paste to be the surface electrode 20 by firing.
  • the base ceramic green sheet 111 on which the film 120 is formed and the coated ceramic green sheet 140 are stacked and pressed to produce the unsintered stacked body 100.
  • the coated ceramic green sheet 140 is disposed on the base ceramic green sheet 111 disposed on the surface after lamination and on the anchor layer paste film 130 to be the anchor layer 30.
  • the paste-like composition is formed on the base ceramic green sheet 111 positioned on the surface of the unsintered laminate 100 and on the anchor layer paste film 130 to be the anchor layer 30.
  • the unsintered laminated body 100 can also be produced by applying to the substrate.
  • the paste-like composition may be applied on the base ceramic green sheet 111 before lamination and on the anchor layer paste film 130 to be the anchor layer 30.
  • the unsintered laminate 100 is fired.
  • the electronic component body 10 having the base ceramic layer 11 on the surface, the surface electrode 20 provided on the surface of the base ceramic layer 11, and the outer periphery of the surface electrode 20 are covered.
  • the ceramic electronic component 1 which is a laminated body including the coated ceramic layer 40 and the anchor layer 30 provided between the surface electrode 20 and the coated ceramic layer 40 is obtained.
  • the surface electrode can also be formed by forming a conductive paste film on the surface of the sintered electronic component body and firing it.
  • the anchor layer can also be formed by forming an anchor layer paste film on the surface of the sintered surface electrode and firing it.
  • the coated ceramic layer can also be formed by disposing a coated ceramic green sheet on the anchor layer after sintering and firing the coated ceramic green sheet.
  • Forming the surface electrode, the anchor layer and the coated ceramic layer by firing at the same time as the electronic component body is advantageous for improving the efficiency and cost of the manufacturing process, and joining the electronic component body and the surface electrode.
  • the strength, the bonding strength between the surface electrode and the anchor layer, the bonding strength between the anchor layer and the coated ceramic layer, and the bonding strength between the electronic component main body and the coated ceramic layer can be increased.
  • the base ceramic layer constituting the electronic component body preferably contains a low-temperature sintered ceramic material as described above.
  • a constrained green sheet mainly composed of a metal oxide (Al 2 O 3 or the like) that does not substantially sinter at the sintering temperature of the unsintered laminate 100 is prepared. You may bake the unsintered laminated body 100 in the state which has arrange
  • a metal oxide Al 2 O 3 or the like
  • an anchor layer is disposed between the outer peripheral portion of the surface electrode and the coated ceramic layer.
  • FIG. 3 is a cross-sectional view schematically showing another example of the ceramic electronic component of the present invention.
  • the anchor layer 30 is not formed over the entire surface electrode 20, and is provided only between the outer peripheral portion of the surface electrode 20 and the covering ceramic layer 40. Therefore, in the case where a plating layer is formed on the surface electrode 20, the plating property does not deteriorate.
  • the surface electrode provided on the surface of the base ceramic layer and the coated ceramic layer covering the outer periphery of the surface electrode are provided, and the anchor layer is disposed on the surface electrode.
  • Ceramic electronic components 1-1 to 1-2 were produced.
  • the ceramic electronic component 1-1 has the anchor layer disposed on the entire surface electrode, and is the same as the ceramic electronic component 1-1 except that the anchor layer is disposed only between the outer periphery of the surface electrode and the coated ceramic layer.
  • the ceramic electronic component 1-2 was obtained.
  • a ceramic electronic component 1-3 in which the covering ceramic layer was directly disposed on the outer peripheral portion of the surface electrode without arranging the anchor layer was obtained.
  • the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component constituting the anchor layer is 10% or more and 90% or less in the ceramic electronic components 1-1 and 1-4 to 1-7. It was confirmed that the non-defective product rate was ⁇ (good) or higher, and peeling of the coated ceramic layer was further suppressed.
  • ceramic electronic components 1-1 and 1-6 to 1-7 when the metal component of the anchor layer and the metal component of the surface electrode are the same, and the ceramic component of the anchor layer and the coated ceramic layer It was confirmed that peeling of the coated ceramic layer was further suppressed when the ceramic component was the same.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

This ceramic electronic component is provided with: an electronic component main body which has a base ceramic layer in the surface; a surface electrode which is provided on the surface of the electronic component main body; and a covering ceramic layer which covers the outer peripheral part of the surface electrode. This ceramic electronic component is characterized in that an anchor layer, which contains both a metal component and a ceramic component, is provided between the outer peripheral part of the surface electrode and the covering ceramic layer.

Description

セラミック電子部品Ceramic electronic components
本発明は、セラミック電子部品に関する。 The present invention relates to a ceramic electronic component.
電子部品本体の表面に表面電極が設けられたセラミック電子部品として、例えば、多層セラミック基板のような積層型セラミック電子部品が挙げられる。 Examples of the ceramic electronic component having a surface electrode on the surface of the electronic component main body include a multilayer ceramic electronic component such as a multilayer ceramic substrate.
このようなセラミック電子部品においては、表面電極の高周波特性の劣化防止、表面電極が受ける応力緩和やめっき侵食への耐性劣化防止、すなわち表面電極の信頼性を高めるために、いわゆるフレーミング層と呼ばれる被覆セラミック層を表面電極の外周部に設けることが行われている（特許文献１参照）。 In such ceramic electronic components, a coating called a framing layer is used to prevent deterioration of the high-frequency characteristics of the surface electrode, to prevent stress deterioration of the surface electrode and to prevent deterioration of resistance to plating erosion, that is, to improve the reliability of the surface electrode. A ceramic layer is provided on the outer periphery of the surface electrode (see Patent Document 1).
特開２０１２－１８６２６９号公報JP 2012-186269 A
上記被覆セラミック層は、表面電極の外周部に加えて、電子部品本体のセラミック層（以下、基材セラミック層という）上にも設けられる。
通常、被覆セラミック層は、被覆セラミック層形成用のセラミックグリーンシートを所定箇所に載置して焼成するか、又は、被覆セラミック層形成用のセラミックペーストを所定箇所に塗布して焼成することにより形成され、電子部品本体及び表面電極を得るための焼成と同時に焼成することによって形成されることが好ましいとされている。 The coated ceramic layer is provided on a ceramic layer (hereinafter referred to as a base ceramic layer) of the electronic component body in addition to the outer peripheral portion of the surface electrode.
Normally, the coated ceramic layer is formed by placing a ceramic green sheet for forming a coated ceramic layer on a predetermined location and firing, or by applying a ceramic paste for forming a coated ceramic layer to a predetermined location and firing. In addition, it is preferable that it is formed by firing at the same time as firing for obtaining the electronic component main body and the surface electrode.
しかし、表面電極上と基材セラミック層上とでは、セラミックグリーンシート又はセラミックペーストの焼結性が異なるため、焼成後に得られる被覆セラミック層の強度に差が生じるという問題があった。具体的には、表面電極上の被覆セラミック層の強度が基材セラミック層上の被覆セラミック層の強度よりも低くなり、その結果、焼成により形成された被覆セラミック層が表面電極から剥離してしまうという問題があった。 However, since the sinterability of the ceramic green sheet or the ceramic paste is different between the surface electrode and the base ceramic layer, there is a problem that the strength of the coated ceramic layer obtained after firing is different. Specifically, the strength of the coated ceramic layer on the surface electrode is lower than the strength of the coated ceramic layer on the base ceramic layer, and as a result, the coated ceramic layer formed by firing peels from the surface electrode. There was a problem.
本発明は上記の問題を解決するためになされたものであり、被覆セラミック層と表面電極との間の接合強度が高く、表面電極からの被覆セラミック層の剥離を防止することができるセラミック電子部品を提供することを目的とする。 The present invention has been made to solve the above-described problem, and has a high bonding strength between a coated ceramic layer and a surface electrode, and can prevent peeling of the coated ceramic layer from the surface electrode. The purpose is to provide.
焼成後に得られる被覆セラミック層の強度に差が生じる原因は、基材セラミック層、表面電極及び被覆セラミック層の焼結性の違いに起因すると考えられる。
基材セラミック層と被覆セラミック層は互いにセラミック同士であるから、焼結性は互いに類似しており、基材セラミック層上に形成された被覆セラミック層には剥離等の問題は発生しにくいと考えられる。一方、表面電極と被覆セラミック層とを対比すると、被覆セラミック層がセラミックリッチの組成であるのに対して、表面電極が金属リッチの組成となっていることから、表面電極と被覆セラミック層とでは焼結性が互いに異なると考えられる。すなわち、本発明者は、表面電極と被覆セラミック層の焼結性の違いによって、表面電極と被覆セラミック層との接合強度が低下し、剥離の原因になっているのではないかと考えた。 The cause of the difference in the strength of the coated ceramic layer obtained after firing is considered to be due to the difference in sinterability of the base ceramic layer, the surface electrode, and the coated ceramic layer.
Since the base ceramic layer and the coated ceramic layer are ceramics, the sinterability is similar to each other, and problems such as peeling are unlikely to occur in the coated ceramic layer formed on the base ceramic layer. It is done. On the other hand, when the surface electrode and the coated ceramic layer are compared, the coated ceramic layer has a ceramic-rich composition, whereas the surface electrode has a metal-rich composition. The sinterability is considered to be different from each other. That is, the present inventor thought that the bonding strength between the surface electrode and the coated ceramic layer was lowered due to the difference in sinterability between the surface electrode and the coated ceramic layer, which might cause peeling.
そこで、本発明者は、表面電極上の被覆セラミック層と表面電極の間に、表面電極と被覆セラミック層との中間の性質を有するアンカー層を設けることによって、表面電極上に形成された被覆セラミック層の接合強度を向上させて、被覆セラミック層の剥離を防止することができることを見出し、本発明を完成した。 In view of this, the present inventor has provided an anchor layer having a property intermediate between the surface electrode and the coated ceramic layer between the coated ceramic layer on the surface electrode and the surface electrode, thereby forming the coated ceramic formed on the surface electrode. The present inventors have found that the bonding strength of the layers can be improved to prevent peeling of the coated ceramic layer.
本発明のセラミック電子部品は、表面に基材セラミック層を有する電子部品本体と、上記電子部品本体の表面に設けられた表面電極と、上記表面電極の外周部を被覆する被覆セラミック層とを備えるセラミック電子部品であって、上記表面電極の外周部と上記被覆セラミック層の間に、金属成分及びセラミック成分を共に含むアンカー層が設けられていることを特徴とする。 The ceramic electronic component of the present invention includes an electronic component main body having a base ceramic layer on the surface, a surface electrode provided on the surface of the electronic component main body, and a coated ceramic layer covering the outer periphery of the surface electrode. In the ceramic electronic component, an anchor layer including both a metal component and a ceramic component is provided between the outer peripheral portion of the surface electrode and the coated ceramic layer.
本発明のセラミック電子部品は、表面電極の外周部に金属成分とセラミック成分とを共に有するアンカー層が設けられていることにより、被覆セラミック層とアンカー層との接合強度が、被覆セラミック層と表面電極との接合強度よりも高くなる。その結果、セラミック電子部品を焼成した際に、被覆セラミック層が剥離しにくくなる。 The ceramic electronic component of the present invention is provided with an anchor layer having both a metal component and a ceramic component on the outer peripheral portion of the surface electrode, so that the bonding strength between the coated ceramic layer and the anchor layer is improved. It becomes higher than the bonding strength with the electrode. As a result, when the ceramic electronic component is fired, the coated ceramic layer is difficult to peel off.
また、被覆セラミック層とアンカー層との間の接合強度が高いと、被覆セラミック層を形成した後にめっき層を形成する場合であっても、めっき層を形成する前の表面電極と被覆セラミック層との間にめっき液が侵入しにくくなるため、異常析出のリスクが低下する。 Further, if the bonding strength between the coated ceramic layer and the anchor layer is high, the surface electrode and the coated ceramic layer before forming the plated layer are formed even if the plated layer is formed after the coated ceramic layer is formed. During this period, the plating solution is less likely to enter, so that the risk of abnormal deposition decreases.
アンカー層は、金属成分とセラミック成分とを共に含んでいるため、アンカー層と被覆セラミック層の境界付近においては、アンカー層のセラミック成分が被覆セラミック層と焼結する。また、アンカー層と表面電極の境界付近においては、アンカー層の金属成分が表面電極と焼結する。すなわち、それぞれの境界付近において、アンカー層中の金属成分又はセラミック成分のうち片方だけが優先的に焼結反応を起こすため、アンカー層と被覆セラミック層の境界付近及びアンカー層と表面電極の境界付近において物理的なアンカー構造が形成され、アンカー層及び被覆セラミック層並びにアンカー層及び表面電極が強固に接合されることとなる。
また、アンカー層は、金属成分とセラミック成分とを共に含んでいるため、アンカー層中の金属成分の本来の焼結開始温度を超えても、アンカー層中のセラミック成分の焼結開始温度に達するまでは焼結が始まらない。そのため、被覆セラミック層中の低融点成分（液相成分ともいう）が先に溶融し、アンカー層に浸入しながら焼結が進行する。このとき、液相成分がアンカー層に浸入しながら焼結が進行することで、被覆セラミック層とアンカー層の境界付近で物理的なアンカー構造を形成して、被覆セラミック層とアンカー層とが強固に接合される。 Since the anchor layer contains both the metal component and the ceramic component, the ceramic component of the anchor layer is sintered with the coated ceramic layer in the vicinity of the boundary between the anchor layer and the coated ceramic layer. Further, in the vicinity of the boundary between the anchor layer and the surface electrode, the metal component of the anchor layer is sintered with the surface electrode. That is, since only one of the metal component or ceramic component in the anchor layer preferentially undergoes a sintering reaction near each boundary, the boundary between the anchor layer and the coated ceramic layer and the boundary between the anchor layer and the surface electrode Thus, a physical anchor structure is formed, and the anchor layer, the covering ceramic layer, the anchor layer, and the surface electrode are firmly bonded.
In addition, since the anchor layer contains both the metal component and the ceramic component, even if the original sintering start temperature of the metal component in the anchor layer is exceeded, the sintering start temperature of the ceramic component in the anchor layer is reached. Until it does not start sintering. Therefore, the low melting point component (also referred to as a liquid phase component) in the coated ceramic layer is melted first, and sintering proceeds while entering the anchor layer. At this time, sintering proceeds while the liquid phase component penetrates into the anchor layer, so that a physical anchor structure is formed near the boundary between the coated ceramic layer and the anchor layer, and the coated ceramic layer and the anchor layer are strong. To be joined.
本発明のセラミック電子部品において、上記アンカー層は、上記表面電極の外周部と上記被覆セラミック層の間のみに設けられていることが好ましい。
アンカー層が、表面電極の外周部と被覆セラミック層の間にのみに設けられていると、表面電極のうち被覆セラミック層が設けられていない箇所は、表面電極が露出していることとなるため、表面電極のめっき付性が低下することがない。従って、被覆セラミック層の接合強度を保ったまま、表面電極のめっき付性の低下を抑制することができる。 In the ceramic electronic component of the present invention, the anchor layer is preferably provided only between the outer peripheral portion of the surface electrode and the coated ceramic layer.
If the anchor layer is provided only between the outer peripheral portion of the surface electrode and the coated ceramic layer, the surface electrode is exposed in the portion of the surface electrode where the coated ceramic layer is not provided. The plating property of the surface electrode does not deteriorate. Accordingly, it is possible to suppress a decrease in the plateability of the surface electrode while maintaining the bonding strength of the coated ceramic layer.
本発明のセラミック電子部品において、上記アンカー層を構成する金属成分及びセラミック成分は、それぞれ、上記表面電極を構成する金属成分及び上記被覆セラミック層を構成するセラミック成分と同一の成分を含むことが好ましい。
アンカー層を構成する金属成分が表面電極を構成する金属成分と同一の成分を含んでいると、アンカー層と表面電極との反応性が向上し、接合強度が向上する。また、アンカー層を構成するセラミック成分が被覆セラミック層を構成するセラミック成分と同一の成分を含んでいると、アンカー層と被覆セラミック層との反応性が向上し、接合強度が向上する。従って、アンカー層を構成する金属成分及びセラミック成分が、それぞれ、表面電極を構成する金属成分及び被覆セラミック層を構成するセラミック成分と同一の成分を含むと、表面電極と被覆セラミック層との接合強度が向上し、剥離をさらに抑制できる。 In the ceramic electronic component of the present invention, it is preferable that the metal component and the ceramic component constituting the anchor layer include the same components as the metal component constituting the surface electrode and the ceramic component constituting the coated ceramic layer, respectively. .
If the metal component constituting the anchor layer contains the same component as the metal component constituting the surface electrode, the reactivity between the anchor layer and the surface electrode is improved, and the bonding strength is improved. Moreover, when the ceramic component which comprises an anchor layer contains the same component as the ceramic component which comprises a covering ceramic layer, the reactivity of an anchor layer and a covering ceramic layer will improve, and joint strength will improve. Therefore, if the metal component and the ceramic component constituting the anchor layer contain the same components as the metal component constituting the surface electrode and the ceramic component constituting the coated ceramic layer, respectively, the bonding strength between the surface electrode and the coated ceramic layer is obtained. Is improved, and peeling can be further suppressed.
本発明のセラミック電子部品において、上記アンカー層を構成する金属成分とセラミック成分との合計体積に対する金属成分の体積の割合は、１０％以上、９０％以下であることが好ましい。
アンカー層を構成する金属成分とセラミック成分との合計体積に対する金属成分の体積の割合が、１０％以上、９０％以下であると、アンカー層が表面電極及び被覆セラミック層のどちらに対しても充分な接合強度を有することとなる。 In the ceramic electronic component of the present invention, the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component constituting the anchor layer is preferably 10% or more and 90% or less.
When the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component constituting the anchor layer is 10% or more and 90% or less, the anchor layer is sufficient for both the surface electrode and the coated ceramic layer. It will have a sufficient bonding strength.
本発明によれば、被覆セラミック層と表面電極との間の接合強度が高く、表面電極からの被覆セラミック層の剥離を防止することができるセラミック電子部品を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the joining strength between a coating ceramic layer and a surface electrode is high, and the ceramic electronic component which can prevent peeling of the coating ceramic layer from a surface electrode can be provided.
図１は、本発明のセラミック電子部品の一例を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing an example of the ceramic electronic component of the present invention. 図２Ａ～図２Ｂは、図１に示すセラミック電子部品１の製造方法の一例を模式的に示す断面図である。2A to 2B are cross-sectional views schematically showing an example of a method for manufacturing the ceramic electronic component 1 shown in FIG. 図３は、本発明のセラミック電子部品の別の一例を模式的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing another example of the ceramic electronic component of the present invention.
以下、本発明のセラミック電子部品について説明する。
しかしながら、本発明は、以下の構成に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。
以下において記載する本発明の個々の望ましい構成を２つ以上組み合わせたものもまた本発明である。 Hereinafter, the ceramic electronic component of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
A combination of two or more of the individual desirable configurations of the present invention described below is also the present invention.
以下の実施形態では、セラミック電子部品が、多層セラミック基板等の積層型セラミック電子部品である場合、すなわち、電子部品本体が、複数のセラミック層が積層された積層構造を有する場合について説明する。しかし、本発明は、積層型セラミック電子部品に限らず、電子部品本体が表面に基材セラミック層を有し、電子部品本体の表面に表面電極が設けられた種々のセラミック電子部品に対して適用することが可能である。 In the following embodiments, a case where the ceramic electronic component is a multilayer ceramic electronic component such as a multilayer ceramic substrate, that is, a case where the electronic component body has a multilayer structure in which a plurality of ceramic layers are stacked will be described. However, the present invention is not limited to the multilayer ceramic electronic component, and is applicable to various ceramic electronic components in which the electronic component body has a base ceramic layer on the surface and the surface electrode is provided on the surface of the electronic component body. Is possible.
図１は、本発明のセラミック電子部品の一例を模式的に示す断面図である。
図１には全体的な構成が示されていないが、セラミック電子部品１は、表面に基材セラミック層１１を有する電子部品本体１０と、電子部品本体１０の表面に設けられた表面電極２０と、表面電極２０の外周部を被覆する被覆セラミック層４０とを備えている。
そして、アンカー層３０が、表面電極２０の外周部（図１中、両矢印Ｗ１で示す領域）と被覆セラミック層４０の間に設けられている。図１に示すように、表面電極２０の外周部は被覆セラミック層４０により被覆されている。なお、表面電極２０のうち、外周部ではない領域を中央部（図１中、両矢印Ｗ２で示す領域）とする。 FIG. 1 is a cross-sectional view schematically showing an example of the ceramic electronic component of the present invention.
Although the overall configuration is not shown in FIG. 1, the ceramic electronic component 1 includes an electronic component body 10 having a base ceramic layer 11 on the surface, and a surface electrode 20 provided on the surface of the electronic component body 10. And a coated ceramic layer 40 that covers the outer periphery of the surface electrode 20.
An anchor layer 30 is provided between the outer peripheral portion of the surface electrode 20 (a region indicated by a double-headed arrow W1 in FIG. 1) and the coated ceramic layer 40. As shown in FIG. 1, the outer peripheral portion of the surface electrode 20 is covered with a covering ceramic layer 40. In addition, let the area | region which is not an outer peripheral part among the surface electrodes 20 be a center part (area | region shown with the double arrow W2 in FIG. 1).
図１では、電子部品本体１０は、複数の基材セラミック層１１が積層された積層構造を有しており、電子部品本体１０の内部には、内部配線導体としての内部導体膜１２及びビアホール導体１３が設けられている。内部導体膜１２はビアホール導体１３と電気的に接続されており、ビアホール導体１３は表面電極２０と電気的に接続されている。 In FIG. 1, the electronic component body 10 has a laminated structure in which a plurality of base ceramic layers 11 are laminated. Inside the electronic component body 10, an internal conductor film 12 as an internal wiring conductor and a via-hole conductor are provided. 13 is provided. The internal conductor film 12 is electrically connected to the via hole conductor 13, and the via hole conductor 13 is electrically connected to the surface electrode 20.
本明細書において、表面電極の上面にアンカー層が配置され、アンカー層を介して表面電極上に被覆セラミック層が配置されている場合であっても、表面電極が被覆セラミック層で被覆されているという。 In this specification, even when the anchor layer is disposed on the upper surface of the surface electrode and the covering ceramic layer is disposed on the surface electrode via the anchor layer, the surface electrode is covered with the covering ceramic layer. That's it.
電子部品本体を構成する基材セラミック層は、低温焼結セラミック材料を含有することが好ましい。
低温焼結セラミック材料とは、セラミック材料のうち、１０００℃以下の温度で焼結可能であり、ＡｇやＣｕとの同時焼成が可能である材料を意味する。 The base ceramic layer constituting the electronic component body preferably contains a low-temperature sintered ceramic material.
The low-temperature sintered ceramic material means a material that can be sintered at a temperature of 1000 ° C. or less and can be co-fired with Ag or Cu among ceramic materials.
基材セラミック層に含有される低温焼結セラミック材料としては、例えば、クオーツやアルミナ、フォルステライト等のセラミック材料にホウ珪酸ガラスを混合してなるガラス複合系低温焼結セラミック材料、ＺｎＯ－ＭｇＯ－Ａｌ２Ｏ３－ＳｉＯ２系の結晶化ガラスを用いた結晶化ガラス系低温焼結セラミック材料、ＢａＯ－Ａｌ２Ｏ３－ＳｉＯ２系セラミック材料やＡｌ２Ｏ３－ＣａＯ－ＳｉＯ２－ＭｇＯ－Ｂ２Ｏ３系セラミック材料等を用いた非ガラス系低温焼結セラミック材料等が挙げられる。 Examples of the low-temperature sintered ceramic material contained in the base ceramic layer include a glass composite low-temperature sintered ceramic material obtained by mixing borosilicate glass with a ceramic material such as quartz, alumina, and forsterite, ZnO—MgO— Crystallized glass-based low-temperature sintered ceramic materials using Al 2 O 3 —SiO 2 -based crystallized glass, BaO—Al 2 O 3 —SiO 2 -based ceramic materials and Al 2 O 3 —CaO—SiO 2 —MgO— Non-glass type low temperature sintered ceramic materials using B 2 O 3 type ceramic materials and the like can be mentioned.
電子部品本体の内部に設けられる内部配線導体（内部導体膜及びビアホール導体）は、導電成分を含有する。内部配線導体に含有される導電成分としては、例えば、Ａｕ、Ａｇ、Ｃｕ、Ｐｔ、Ｔａ、Ｗ、Ｎｉ、Ｆｅ、Ｃｒ、Ｍｏ、Ｔｉ、Ｐｄ、Ｒｕ及びこれらの金属の１種を主成分とする合金等が挙げられる。内部配線導体は、導電成分として、Ａｕ、Ａｇ又はＣｕを含有することが好ましく、Ａｇ又はＣｕを含有することがより好ましい。Ａｕ、Ａｇ及びＣｕは低抵抗であるため、特に、セラミック電子部品が高周波用途である場合に適している。 The internal wiring conductor (internal conductor film and via hole conductor) provided inside the electronic component main body contains a conductive component. As the conductive component contained in the internal wiring conductor, for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and one of these metals are the main components. And the like. The internal wiring conductor preferably contains Au, Ag, or Cu as the conductive component, and more preferably contains Ag or Cu. Since Au, Ag, and Cu have low resistance, they are particularly suitable when the ceramic electronic component is used for high frequency.
電子部品本体の表面に設けられた表面電極は、配線基板又は搭載部品のような他の電子部品と接続されるためのものである。表面電極と他の電子部品とは、半田付け等によって接続される。 The surface electrode provided on the surface of the electronic component main body is for connection with other electronic components such as a wiring board or a mounted component. The surface electrode and other electronic components are connected by soldering or the like.
表面電極に含有される導電成分としては、例えば、Ａｕ、Ａｇ、Ｃｕ、Ｐｔ、Ｔａ、Ｗ、Ｎｉ、Ｆｅ、Ｃｒ、Ｍｏ、Ｔｉ、Ｐｄ、Ｒｕ及びこれらの金属の１種を主成分とする合金等が挙げられる。表面電極は、内部配線導体と同じ導電成分を含有することが好ましく、具体的には、導電成分として、Ａｕ、Ａｇ又はＣｕを含有することが好ましく、Ａｇ又はＣｕを含有することがより好ましい。 As a conductive component contained in the surface electrode, for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and one of these metals are the main components. An alloy etc. are mentioned. The surface electrode preferably contains the same conductive component as the internal wiring conductor. Specifically, the surface electrode preferably contains Au, Ag, or Cu, and more preferably contains Ag or Cu.
表面電極の外周部の幅（図１中、Ｗ１で表される長さ）は特に限定されないが、４０μｍ以上、１００μｍ以下であることが好ましい。 The width of the outer peripheral portion of the surface electrode (the length represented by W1 in FIG. 1) is not particularly limited, but is preferably 40 μm or more and 100 μm or less.
表面電極は、１層構造を有していてもよいし、複層構造を有していてもよいが、複層構造を有していることが好ましい。
表面電極が１層構造を有する場合、焼結層のみからなることが好ましい。
焼結層は、導電性ペーストを基材セラミック層、アンカー層、被覆セラミック層と同時焼成させることによって形成されたものである。 The surface electrode may have a single-layer structure or a multilayer structure, but preferably has a multilayer structure.
When the surface electrode has a single-layer structure, it is preferable that the surface electrode consists only of a sintered layer.
The sintered layer is formed by co-firing a conductive paste with a base ceramic layer, an anchor layer, and a coated ceramic layer.
以下、表面電極の焼結層について説明する。
表面電極を構成する焼結層は、導電成分を含有する。焼結層には、電子部品本体との接合強度を高くするため、金属酸化物をさらに含有してもよい。
焼結層を複層構造とする場合、電子部品本体の表面に位置する基材セラミック層の上面に設けられた第１焼結層と、第１焼結層の上面に設けられた第２焼結層とを含む少なくとも２層構造を有していることがより好ましい。 Hereinafter, the sintered layer of the surface electrode will be described.
The sintered layer constituting the surface electrode contains a conductive component. The sintered layer may further contain a metal oxide in order to increase the bonding strength with the electronic component body.
When the sintered layer has a multilayer structure, the first sintered layer provided on the upper surface of the base ceramic layer located on the surface of the electronic component main body and the second sintered layer provided on the upper surface of the first sintered layer. More preferably, it has at least a two-layer structure including a binder.
第１焼結層に含有される導電成分としては、例えば、Ａｕ、Ａｇ、Ｃｕ、Ｐｔ、Ｔａ、Ｗ、Ｎｉ、Ｆｅ、Ｃｒ、Ｍｏ、Ｔｉ、Ｐｄ、Ｒｕ及びこれらの金属の１種を主成分とする合金等が挙げられる。第１焼結層は、内部配線導体と同じ導電成分を含有することが好ましく、具体的には、導電成分として、Ａｕ、Ａｇ又はＣｕを含有することが好ましく、Ａｇ又はＣｕを含有することがより好ましい。 As the conductive component contained in the first sintered layer, for example, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru and one of these metals are mainly used. Examples include alloys as components. The first sintered layer preferably contains the same conductive component as that of the internal wiring conductor. Specifically, the first sintered layer preferably contains Au, Ag, or Cu as the conductive component, and may contain Ag or Cu. More preferred.
第１焼結層に含有される金属酸化物としては、例えば、Ａｌ、Ｚｒ、Ｔｉ、Ｓｉ及び、Ｍｇからなる群より選択される少なくとも１種の金属元素を含むものが挙げられる。上記金属酸化物は、１種でもよく、２種以上でもよい。これらの中では、Ａｌ、Ｚｒ及びＴｉからなる群より選択される少なくとも１種の金属元素を含むものが好ましく、Ａｌを含む金属酸化物がより好ましい。 Examples of the metal oxide contained in the first sintered layer include those containing at least one metal element selected from the group consisting of Al, Zr, Ti, Si, and Mg. 1 type may be sufficient as the said metal oxide, and 2 or more types may be sufficient as it. Among these, those containing at least one metal element selected from the group consisting of Al, Zr and Ti are preferable, and metal oxides containing Al are more preferable.
第１焼結層中の金属酸化物の含有量は特に限定されないが、第２焼結層中の金属酸化物の含有量よりも多いことが好ましい。具体的には、第１焼結層中の金属酸化物の含有量は、１重量％以上が好ましく、３重量％以上がより好ましい。一方、第１焼結層中の金属酸化物の含有量は、１０重量％未満が好ましく、５重量％未満がより好ましい。 Although the content of the metal oxide in the first sintered layer is not particularly limited, it is preferably larger than the content of the metal oxide in the second sintered layer. Specifically, the content of the metal oxide in the first sintered layer is preferably 1% by weight or more, and more preferably 3% by weight or more. On the other hand, the content of the metal oxide in the first sintered layer is preferably less than 10% by weight, and more preferably less than 5% by weight.
第１焼結層が金属酸化物を含有する場合、導電成分を構成する金属の粒子と金属酸化物の粒子とが分散して存在していてもよく、金属の粒子の周囲に金属酸化物が被覆されていてもよいが、金属の粒子の周囲に金属酸化物が被覆されていることが好ましい。金属の粒子の周囲に金属酸化物が被覆されている場合、金属酸化物の含有量が少なくても、電子部品本体との接合強度を高くすることができる。 When the first sintered layer contains a metal oxide, the metal particles constituting the conductive component and the metal oxide particles may be present in a dispersed state, and the metal oxide is present around the metal particles. Although it may be coated, it is preferable that a metal oxide is coated around the metal particles. When the metal oxide is coated around the metal particles, the bonding strength with the electronic component main body can be increased even if the metal oxide content is low.
第１焼結層の平面視形状は特に限定されず、例えば、矩形をはじめとする四角形のほか、四角形以外の多角形、円形、楕円形等が挙げられる。 The shape of the first sintered layer in plan view is not particularly limited, and examples thereof include a quadrilateral including a rectangle, a polygon other than a quadrangle, a circle, and an ellipse.
表面電極を構成する第２焼結層は、導電成分を含有する。第２焼結層に含有される導電成分は、第１焼結層に含有される導電成分と同じであることが好ましい。 The second sintered layer constituting the surface electrode contains a conductive component. The conductive component contained in the second sintered layer is preferably the same as the conductive component contained in the first sintered layer.
第２焼結層は、第１焼結層に含有される金属酸化物と同じ金属酸化物を含有していてもよいが、金属酸化物の含有量が多くなると、第２焼結層の上面にめっきが付着しにくくなる。そのため、第２焼結層は、第１焼結層よりも少ない金属酸化物を含有することが好ましく、上記金属酸化物を実質的に含有しないことがより好ましい。第２焼結層が金属酸化物を含有する場合において、第１焼結層中の金属酸化物の含有量が１重量％以上１０重量％未満であるときは、第２焼結層中の金属酸化物の含有量は、１重量％未満であることが好ましい。また、第１焼結層中の金属酸化物の含有量が３重量％以上５重量％未満であるときは、第２焼結層中の金属酸化物の含有量は、３重量％未満であることが好ましい。 The second sintered layer may contain the same metal oxide as the metal oxide contained in the first sintered layer, but when the content of the metal oxide increases, the upper surface of the second sintered layer Plating is difficult to adhere to. Therefore, the second sintered layer preferably contains less metal oxide than the first sintered layer, and more preferably does not substantially contain the metal oxide. When the second sintered layer contains a metal oxide, when the content of the metal oxide in the first sintered layer is 1 wt% or more and less than 10 wt%, the metal in the second sintered layer The oxide content is preferably less than 1% by weight. Further, when the content of the metal oxide in the first sintered layer is 3% by weight or more and less than 5% by weight, the content of the metal oxide in the second sintered layer is less than 3% by weight. It is preferable.
第２焼結層の上面の面積は、第１焼結層の上面の面積と実質的に同じであることが好ましい。すなわち、第２焼結層の平面視形状は、第１焼結層の平面視形状と実質的に同じであることが好ましい。 The area of the upper surface of the second sintered layer is preferably substantially the same as the area of the upper surface of the first sintered layer. That is, it is preferable that the planar view shape of the second sintered layer is substantially the same as the planar view shape of the first sintered layer.
なお、焼結層の数は２層に限定されず、基材セラミック層の上面に設けられた第１焼結層と、上面にめっき層が設けられる第２焼結層との間に他の焼結層が設けられていてもよい。 Note that the number of the sintered layers is not limited to two, and other layers are provided between the first sintered layer provided on the upper surface of the base ceramic layer and the second sintered layer provided with the plating layer on the upper surface. A sintered layer may be provided.
続いて、表面電極上に設けられるアンカー層について説明する。
アンカー層は、金属成分とセラミック成分とを共に有する層であり、金属成分とセラミック成分とを含むペースト材料を表面電極の上面、又は、表面電極となる導電性ペースト膜の上面に形成し、焼成することで得られる。 Next, the anchor layer provided on the surface electrode will be described.
The anchor layer is a layer having both a metal component and a ceramic component, and a paste material containing the metal component and the ceramic component is formed on the upper surface of the surface electrode or the upper surface of the conductive paste film that becomes the surface electrode, and fired. It is obtained by doing.
アンカー層を構成する金属成分は特に限定されないが、Ａｕ、Ａｇ、Ｃｕ、Ｐｔ、Ｔａ、Ｗ、Ｎｉ、Ｆｅ、Ｃｒ、Ｍｏ、Ｔｉ、Ｐｄ、Ｒｕ及びこれらの金属の１種を主成分とする合金等が挙げられ、表面電極を構成する金属成分と同一の成分を含むことが好ましく、アンカー層を構成する金属成分と表面電極を構成する金属成分とが同一であることがより好ましい。なお、表面電極が複層構造である場合、アンカー層を構成する金属成分は、最も外側（アンカー層に近い側）の焼結層を構成する金属成分と同一の成分を含むことが好ましく、アンカー層を構成する金属成分と最も外側（アンカー層に近い側）の焼結層を構成する金属成分とが同一であることがより好ましい。 Although the metal component which comprises an anchor layer is not specifically limited, Au, Ag, Cu, Pt, Ta, W, Ni, Fe, Cr, Mo, Ti, Pd, Ru, and 1 type of these metals are made into a main component. An alloy etc. are mentioned, It is preferable that the same component as the metal component which comprises a surface electrode is included, and it is more preferable that the metal component which comprises an anchor layer and the metal component which comprises a surface electrode are the same. When the surface electrode has a multilayer structure, the metal component constituting the anchor layer preferably includes the same component as the metal component constituting the outermost sintered layer (side closer to the anchor layer). More preferably, the metal component constituting the layer and the metal component constituting the outermost sintered layer (side closer to the anchor layer) are the same.
アンカー層を構成するセラミック成分は特に限定されないが、被覆セラミック層を構成するセラミック成分と同一の成分を含むことが好ましく、アンカー層を構成するセラミック成分と被覆セラミック層を構成するセラミック成分とが同一であることがより好ましい。
アンカー層は金属成分とセラミック成分とを共に有するから、表面電極及び被覆セラミック層のいずれと接合した場合であっても、良好な接合強度を保つことができる。 The ceramic component constituting the anchor layer is not particularly limited, but preferably contains the same component as the ceramic component constituting the coated ceramic layer, and the ceramic component constituting the anchor layer and the ceramic component constituting the coated ceramic layer are the same. It is more preferable that
Since the anchor layer has both a metal component and a ceramic component, good bonding strength can be maintained even when bonded to either the surface electrode or the coated ceramic layer.
アンカー層を構成する金属成分とセラミック成分との割合は特に限定されないが、金属成分とセラミック成分との合計体積に対する金属成分の体積の割合が５％以上、９５％以下であることが好ましく、１０％以上、９０％以下であることがより好ましく、４０％以上、６０％以下であることがさらに好ましい。
金属成分とセラミック成分との合計体積に対する金属成分の体積の割合が５％以上、９５％以下であると、アンカー層を表面電極及び被覆セラミック層に接合することができる。 The ratio of the metal component and the ceramic component constituting the anchor layer is not particularly limited, but the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component is preferably 5% or more and 95% or less. % Or more and 90% or less, more preferably 40% or more and 60% or less.
When the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component is 5% or more and 95% or less, the anchor layer can be bonded to the surface electrode and the coated ceramic layer.
アンカー層を構成する金属成分及びセラミック成分は、アンカー層中でそれぞれ分散して存在していてもよく、金属成分の周囲をセラミック成分が覆う形態であってもよい。 The metal component and ceramic component constituting the anchor layer may be dispersed in the anchor layer, or the ceramic component may cover the periphery of the metal component.
アンカー層の厚みは特に限定されないが、５μｍ以上、１０μｍ以下であることが好ましい。 Although the thickness of an anchor layer is not specifically limited, It is preferable that they are 5 micrometers or more and 10 micrometers or less.
アンカー層は表面電極上の全域に形成されていてもよいが、表面電極の外周部のみに形成されていることが好ましい。すなわち、アンカー層は、表面電極の中央部には設けられず、表面電極の外周部と被覆セラミック層の間のみに設けられていることが好ましい。
表面電極上にさらにめっき層を形成する場合、表面電極の中央部にアンカー層が設けられているとめっき付性が低下する。 The anchor layer may be formed over the entire area of the surface electrode, but is preferably formed only on the outer periphery of the surface electrode. That is, the anchor layer is preferably not provided in the center portion of the surface electrode, but only between the outer peripheral portion of the surface electrode and the coated ceramic layer.
In the case where a plating layer is further formed on the surface electrode, if the anchor layer is provided at the center of the surface electrode, the plating property is lowered.
表面電極の外周部を被覆する被覆セラミック層は、電子部品本体の表面に位置する基材セラミック層上と表面電極上とに設けられている。表面電極上には上述したアンカー層が配置されているため、表面電極上に設けられた被覆セラミック層は、アンカー層を介して表面電極上に設けられている。 The coating ceramic layer which coat | covers the outer peripheral part of a surface electrode is provided on the base-material ceramic layer located on the surface of an electronic component main body, and a surface electrode. Since the anchor layer described above is disposed on the surface electrode, the coated ceramic layer provided on the surface electrode is provided on the surface electrode via the anchor layer.
被覆セラミック層は、低温焼結セラミック材料を含有することが好ましい。この場合、被覆セラミック層に含有される低温焼結セラミック材料は、基材セラミック層に含有される低温焼結セラミック材料と同一であっても異なっていてもよいが、基材セラミック層に含有される低温焼結セラミック材料と同一であることが好ましい。 The coated ceramic layer preferably contains a low temperature sintered ceramic material. In this case, the low-temperature sintered ceramic material contained in the coated ceramic layer may be the same as or different from the low-temperature sintered ceramic material contained in the base ceramic layer, but is contained in the base ceramic layer. It is preferably the same as the low temperature sintered ceramic material.
アンカー層上に形成された被覆セラミック層の厚みは特に限定されないが、２μｍ以上、２０μｍ以下であることが好ましい。
なお、アンカー層上に形成された被覆セラミック層の厚みが変動している場合、被覆セラミック層が形成された外周部の面積と、外周部に存在する被覆セラミック層の体積から求めた被覆セラミック層の平均厚みを、アンカー層上に形成された被覆セラミック層の厚みとする。 The thickness of the coated ceramic layer formed on the anchor layer is not particularly limited, but is preferably 2 μm or more and 20 μm or less.
When the thickness of the coated ceramic layer formed on the anchor layer varies, the coated ceramic layer obtained from the area of the outer peripheral portion where the coated ceramic layer is formed and the volume of the coated ceramic layer existing in the outer peripheral portion Is the thickness of the coated ceramic layer formed on the anchor layer.
表面電極の表面にはさらに、めっき層が形成されていてもよい。
めっき層は、表面電極上に電解めっき又は無電解めっきを施すことによって形成されるものである。めっき層は、通常、焼結層、アンカー層及び被覆セラミック層を形成した後に形成されるため、めっき層は被覆セラミック層によって被覆されていない。 A plating layer may be further formed on the surface of the surface electrode.
The plating layer is formed by performing electrolytic plating or electroless plating on the surface electrode. Since the plating layer is usually formed after forming the sintered layer, the anchor layer, and the coated ceramic layer, the plated layer is not covered with the coated ceramic layer.
めっき層は、Ａｕ、Ａｇ、Ｎｉ、Ｐｄ、Ｃｕ、Ｓｎ又はこれらの金属を含む合金からなることが好ましい。めっき層は、表面電極側から１層目がＮｉ、２層目がＡｕであるＮｉ／Ａｕめっき層、表面電極側から１層目がＮｉ、２層目がＳｎであるＮｉ／Ｓｎめっき層、表面電極側から１層目がＮｉ、２層目がＰｄ、３層目がＡｕであるＮｉ／Ｐｄ／Ａｕめっき層等の複数層からなるめっき層であってもよい。 The plating layer is preferably made of Au, Ag, Ni, Pd, Cu, Sn, or an alloy containing these metals. The plating layer is a Ni / Au plating layer in which the first layer from the surface electrode side is Ni, the second layer is Au, a first layer from the surface electrode side is Ni, a Ni / Sn plating layer in which the second layer is Sn, A plating layer comprising a plurality of layers such as a Ni / Pd / Au plating layer in which the first layer from the surface electrode side is Ni, the second layer is Pd, and the third layer is Au may be used.
めっき層の厚みは特に限定されないが、１μｍ以上、１０μｍ以下であることが好ましい。 The thickness of the plating layer is not particularly limited, but is preferably 1 μm or more and 10 μm or less.
図１に示すセラミック電子部品１は、好ましくは以下のように製造される。
図２Ａ～図２Ｂは、図１に示すセラミック電子部品１の製造方法の一例を模式的に示す断面図である。 The ceramic electronic component 1 shown in FIG. 1 is preferably manufactured as follows.
2A to 2B are cross-sectional views schematically showing an example of a method for manufacturing the ceramic electronic component 1 shown in FIG.
まず、図２Ａに示す未焼結の積層体１００を作製する。
未焼結の積層体１００を作製するため、複数の基材セラミックグリーンシート１１１を準備する。基材セラミックグリーンシート１１１は、焼成後に基材セラミック層１１となるものである。 First, the unsintered laminated body 100 shown in FIG. 2A is produced.
In order to produce the unsintered laminated body 100, a plurality of base ceramic green sheets 111 are prepared. The base ceramic green sheet 111 becomes the base ceramic layer 11 after firing.
基材セラミックグリーンシートは、例えば低温焼結セラミック材料のようなセラミック原料の粉末と、有機バインダと溶剤とを含有するスラリーを、ドクターブレード法等によってシート状に成形したものである。上記スラリーには、分散剤、可塑剤等の種々の添加剤が含有されていてもよい。 The base ceramic green sheet is obtained by forming a slurry containing a ceramic raw material powder such as a low-temperature sintered ceramic material, an organic binder and a solvent into a sheet shape by a doctor blade method or the like. The slurry may contain various additives such as a dispersant and a plasticizer.
上記スラリーに含有される有機バインダとしては、例えば、ブチラール樹脂（ポリビニルブチラール）、アクリル樹脂、メタクリル樹脂等を用いることができる。溶剤としては、例えば、トルエン、イソプロピルアルコール等のアルコール等を用いることができる。可塑剤としては、例えば、ジ－ｎ－ブチルフタレート等を用いることができる。 As the organic binder contained in the slurry, for example, butyral resin (polyvinyl butyral), acrylic resin, methacrylic resin, or the like can be used. As the solvent, for example, alcohol such as toluene and isopropyl alcohol can be used. As the plasticizer, for example, di-n-butyl phthalate can be used.
次に、特定の基材セラミックグリーンシート１１１に、ビアホール導体１３のための貫通孔を形成する。該貫通孔に、例えばＡｇ又はＣｕを導電成分として含有する導電性ペーストを充填することにより、ビアホール導体１３となるべき導電性ペースト体１１３を形成する。 Next, a through hole for the via-hole conductor 13 is formed in the specific base ceramic green sheet 111. By filling the through hole with a conductive paste containing, for example, Ag or Cu as a conductive component, a conductive paste body 113 to be the via-hole conductor 13 is formed.
また、上記導電性ペーストと同じ組成の導電性ペーストを用いて、例えばスクリーン印刷等の方法によって、特定の基材セラミックグリーンシート１１１に、内部導体膜１２となるべき導電性ペースト膜１１２を形成する。 Further, the conductive paste film 112 to be the internal conductor film 12 is formed on the specific base ceramic green sheet 111 by using a conductive paste having the same composition as the conductive paste, for example, by a method such as screen printing. .
さらに、積層後に表面に配置される基材セラミックグリーンシート１１１上に、焼成により表面電極２０となるべき導電性ペースト膜１２０を形成する。焼成により表面電極２０となるべき導電性ペースト膜１２０は、例えばＡｇ又はＣｕを導電成分として含有する導電性ペーストを用いて、スクリーン印刷等の方法によって形成することができる。なお焼成により表面電極２０となるべき導電性ペースト膜１２０は、基材セラミックグリーンシート１１１を積層した後、焼成する前に形成してもよい。 Further, a conductive paste film 120 to be the surface electrode 20 is formed by firing on the base ceramic green sheet 111 disposed on the surface after lamination. The conductive paste film 120 to be the surface electrode 20 by firing can be formed by a method such as screen printing using a conductive paste containing Ag or Cu as a conductive component, for example. The conductive paste film 120 to be the surface electrode 20 by firing may be formed after the base ceramic green sheets 111 are laminated and before firing.
なお、表面電極を複層構造とする場合には、第１焼結層となるべき導電性ペースト膜上に、第２焼結層となるべき導電性ペースト膜を、スクリーン印刷等の方法によって形成することができる。 If the surface electrode has a multilayer structure, a conductive paste film to be the second sintered layer is formed on the conductive paste film to be the first sintered layer by a method such as screen printing. can do.
その後、焼成により表面電極２０となるべき導電性ペースト膜１２０の外周部にのみ、アンカー層３０となるアンカー層ペースト膜１３０を形成する。アンカー層ペースト膜１３０は、例えば低温焼結セラミック材料のようなセラミック原料の粉末と、導電成分としてＡｇ又はＣｕを含有する粉末とを、有機バインダと溶剤との混合物に分散させたアンカー層ペースト、又は、導電成分であるＡｇ又はＣｕの表面にセラミックコートを施したセラミックコート金属粒子を有機バインダと溶剤との混合物に分散させたアンカー層ペーストを用いて、スクリーン印刷等の方法によって形成することができる。 Thereafter, an anchor layer paste film 130 to be the anchor layer 30 is formed only on the outer peripheral portion of the conductive paste film 120 to be the surface electrode 20 by firing. Anchor layer paste film 130 is, for example, an anchor layer paste in which a powder of a ceramic raw material such as a low-temperature sintered ceramic material and a powder containing Ag or Cu as a conductive component are dispersed in a mixture of an organic binder and a solvent, Alternatively, it can be formed by a method such as screen printing using an anchor layer paste in which ceramic coated metal particles having a ceramic coating applied to the surface of Ag or Cu as a conductive component are dispersed in a mixture of an organic binder and a solvent. it can.
別途、被覆セラミックグリーンシート１４０を準備する。被覆セラミックグリーンシート１４０は、焼成後に被覆セラミック層４０となるものである。 Separately, a coated ceramic green sheet 140 is prepared. The coated ceramic green sheet 140 becomes the coated ceramic layer 40 after firing.
被覆セラミックグリーンシートは、例えば低温焼結セラミック材料のようなセラミック原料の粉末と、有機バインダと溶剤とを含有するスラリーを、ドクターブレード法等によってシート状に成形したものである。上記スラリーには、分散剤、可塑剤等の種々の添加剤が含有されていてもよい。なお、被覆セラミックグリーンシートを作製するためのスラリーとして、基材セラミックグリーンシートを作製するためのスラリーを使用することもできる。  The coated ceramic green sheet is obtained by forming a slurry containing a ceramic raw material powder such as a low-temperature sintered ceramic material, an organic binder, and a solvent into a sheet shape by a doctor blade method or the like. The slurry may contain various additives such as a dispersant and a plasticizer. In addition, the slurry for producing a base-material ceramic green sheet can also be used as a slurry for producing a covering ceramic green sheet.
続いて、ビアホール導体１３となるべき導電性ペースト体１１３又は内部導体膜１２となるべき導電性ペースト膜１１２が形成された基材セラミックグリーンシート１１１と、焼成により表面電極２０となるべき導電性ペースト膜１２０が形成された基材セラミックグリーンシート１１１と、被覆セラミックグリーンシート１４０とを積層し、圧着することにより、未焼結の積層体１００を作製する。被覆セラミックグリーンシート１４０は、積層後に表面に配置される基材セラミックグリーンシート１１１上とアンカー層３０となるべきアンカー層ペースト膜１３０上とに配置する。 Subsequently, the base ceramic green sheet 111 on which the conductive paste body 113 to be the via-hole conductor 13 or the conductive paste film 112 to be the internal conductor film 12 is formed, and the conductive paste to be the surface electrode 20 by firing. The base ceramic green sheet 111 on which the film 120 is formed and the coated ceramic green sheet 140 are stacked and pressed to produce the unsintered stacked body 100. The coated ceramic green sheet 140 is disposed on the base ceramic green sheet 111 disposed on the surface after lamination and on the anchor layer paste film 130 to be the anchor layer 30.
なお、被覆セラミックグリーンシート１４０に代えて、ペースト状組成物を、未焼結の積層体１００の表面に位置する基材セラミックグリーンシート１１１上とアンカー層３０となるべきアンカー層ペースト膜１３０上とに塗布することによっても、未焼結の積層体１００を作製することができる。この場合、積層する前の基材セラミックグリーンシート１１１上とアンカー層３０となるべきアンカー層ペースト膜１３０上とにペースト状組成物を塗布してもよい。 In place of the coated ceramic green sheet 140, the paste-like composition is formed on the base ceramic green sheet 111 positioned on the surface of the unsintered laminate 100 and on the anchor layer paste film 130 to be the anchor layer 30. The unsintered laminated body 100 can also be produced by applying to the substrate. In this case, the paste-like composition may be applied on the base ceramic green sheet 111 before lamination and on the anchor layer paste film 130 to be the anchor layer 30.
その後、未焼結の積層体１００を焼成する。これによって、図２Ｂに示すように、表面に基材セラミック層１１を有する電子部品本体１０と、基材セラミック層１１の表面に設けられた表面電極２０と、表面電極２０の外周部を被覆する被覆セラミック層４０と、表面電極２０と被覆セラミック層４０の間に設けられたアンカー層３０とを備える積層体であるセラミック電子部品１が得られる。 Thereafter, the unsintered laminate 100 is fired. As a result, as shown in FIG. 2B, the electronic component body 10 having the base ceramic layer 11 on the surface, the surface electrode 20 provided on the surface of the base ceramic layer 11, and the outer periphery of the surface electrode 20 are covered. The ceramic electronic component 1 which is a laminated body including the coated ceramic layer 40 and the anchor layer 30 provided between the surface electrode 20 and the coated ceramic layer 40 is obtained.
なお、表面電極は、焼結後の電子部品本体の表面に導電性ペースト膜を形成し、焼成することによっても形成することができる。アンカー層は、焼結後の表面電極の表面にアンカー層ペースト膜を形成し、焼成することによっても形成することができる。また、被覆セラミック層は、焼結後のアンカー層上に被覆セラミックグリーンシートを配置し、この被覆セラミックグリーンシートを焼成することによっても形成することができる。ただし、電子部品本体を得るための焼成によって、表面電極、アンカー層及び被覆セラミック層を電子部品本体と同時に焼成してセラミック電子部品を得ることが好ましい。表面電極、アンカー層及び被覆セラミック層を電子部品本体と同時に焼成して形成する方が、製造工程の効率化及び低コスト化にとって有利であり、また、電子部品本体と表面電極との間の接合強度、表面電極とアンカー層との接合強度、アンカー層と被覆セラミック層の接合強度、及び、電子部品本体と被覆セラミック層との間の接合強度を高くすることができる。表面電極、アンカー層及び被覆セラミック層を同時焼成によって形成する場合には、電子部品本体を構成する基材セラミック層は、上述したように低温焼結セラミック材料を含有することが好ましい。 The surface electrode can also be formed by forming a conductive paste film on the surface of the sintered electronic component body and firing it. The anchor layer can also be formed by forming an anchor layer paste film on the surface of the sintered surface electrode and firing it. The coated ceramic layer can also be formed by disposing a coated ceramic green sheet on the anchor layer after sintering and firing the coated ceramic green sheet. However, it is preferable to obtain a ceramic electronic component by firing the surface electrode, the anchor layer, and the coated ceramic layer simultaneously with the electronic component body by firing to obtain the electronic component body. Forming the surface electrode, the anchor layer and the coated ceramic layer by firing at the same time as the electronic component body is advantageous for improving the efficiency and cost of the manufacturing process, and joining the electronic component body and the surface electrode. The strength, the bonding strength between the surface electrode and the anchor layer, the bonding strength between the anchor layer and the coated ceramic layer, and the bonding strength between the electronic component main body and the coated ceramic layer can be increased. When the surface electrode, the anchor layer, and the coated ceramic layer are formed by simultaneous firing, the base ceramic layer constituting the electronic component body preferably contains a low-temperature sintered ceramic material as described above.
また、未焼結の積層体１００の焼結温度では実質的に焼結しない金属酸化物（Ａｌ２Ｏ３等）を主成分とする拘束グリーンシートを準備し、未焼結の積層体１００の最表面に拘束グリーンシートを配置した状態で未焼結の積層体１００を焼成してもよい。この場合、拘束グリーンシートは、焼成時において実質的に焼結しないので収縮が生じず、積層体に対して主面方向での収縮を抑制するように作用する。 Further, a constrained green sheet mainly composed of a metal oxide (Al 2 O 3 or the like) that does not substantially sinter at the sintering temperature of the unsintered laminate 100 is prepared. You may bake the unsintered laminated body 100 in the state which has arrange | positioned the restraint green sheet on the outermost surface. In this case, the constrained green sheet does not sinter substantially at the time of firing, so that the shrinkage does not occur, and acts to suppress the shrinkage in the main surface direction with respect to the laminate.
本発明のセラミック電子部品では、表面電極の外周部と被覆セラミック層の間にアンカー層が配置されている。その結果、表面電極上の被覆セラミック層の焼結性が向上し、被覆セラミック層と表面電極との間の接合強度が高くなるため、セラミック電子部品を焼成した場合に、被覆セラミック層が表面電極から剥離しにくくなる。 In the ceramic electronic component of the present invention, an anchor layer is disposed between the outer peripheral portion of the surface electrode and the coated ceramic layer. As a result, the sinterability of the coated ceramic layer on the surface electrode is improved, and the bonding strength between the coated ceramic layer and the surface electrode is increased. Therefore, when the ceramic electronic component is fired, the coated ceramic layer is It becomes difficult to peel from.
図３は、本発明のセラミック電子部品の別の一例を模式的に示す断面図である。
図３に示すセラミック電子部品２では、アンカー層３０が表面電極２０上の全域に形成されておらず、表面電極２０の外周部と被覆セラミック層４０の間のみに設けられている。そのため、表面電極２０上にめっき層を形成する場合において、めっき付性が低下することがない。 FIG. 3 is a cross-sectional view schematically showing another example of the ceramic electronic component of the present invention.
In the ceramic electronic component 2 shown in FIG. 3, the anchor layer 30 is not formed over the entire surface electrode 20, and is provided only between the outer peripheral portion of the surface electrode 20 and the covering ceramic layer 40. Therefore, in the case where a plating layer is formed on the surface electrode 20, the plating property does not deteriorate.
以下、本発明のセラミック電子部品をより具体的に開示した実施例を示す。なお、本発明は、これらの実施例のみに限定されるものではない。 Examples in which the ceramic electronic component of the present invention is disclosed more specifically will be described below. In addition, this invention is not limited only to these Examples.
［アンカー層による効果の確認］
図２Ａ及び図２Ｂで説明した方法により、基材セラミック層の表面に設けられた表面電極と、上記表面電極の外周部を被覆する被覆セラミック層とを備え、上記表面電極上にアンカー層が配置されたセラミック電子部品１－１～１－２を作製した。
表面電極上の全域にアンカー層を配置したものをセラミック電子部品１－１とし、表面電極の外周部と被覆セラミック層の間のみにアンカー層を配置した以外は全てセラミック電子部品１－１と同様としたものをセラミック電子部品１－２とした。また、アンカー層を配置せず、表面電極の外周部に直接被覆セラミック層を配置したものをセラミック電子部品１－３とした。
それぞれ１０００個のセラミック電子部品について、焼成後のセラミック電子部品の断面を観察し、被覆セラミック層が表面電極から剥離しているかどうかを目視で判定し、剥離が発生していないものの割合（良品率）を判定した。良品率が９０％以上のものを◎（優：剥離が極めて起こりにくい）、８０％以上９０％未満のものを○（良：剥離が起こりにくい）、６０％以上８０％未満のものを△（可：多少剥離がみられる）、６０％未満のものを×（不良：剥離が起こりやすい）として評価した。結果を表１に示す。 [Confirmation of effect by anchor layer]
2A and 2B, the surface electrode provided on the surface of the base ceramic layer and the coated ceramic layer covering the outer periphery of the surface electrode are provided, and the anchor layer is disposed on the surface electrode. Ceramic electronic components 1-1 to 1-2 were produced.
The ceramic electronic component 1-1 has the anchor layer disposed on the entire surface electrode, and is the same as the ceramic electronic component 1-1 except that the anchor layer is disposed only between the outer periphery of the surface electrode and the coated ceramic layer. The ceramic electronic component 1-2 was obtained. In addition, a ceramic electronic component 1-3 in which the covering ceramic layer was directly disposed on the outer peripheral portion of the surface electrode without arranging the anchor layer was obtained.
For each 1000 ceramic electronic components, observe the cross-section of the fired ceramic electronic component, visually determine whether the coated ceramic layer is peeled off from the surface electrode, and the percentage of products that do not peel (non-defective product rate) ). A product with a non-defective product ratio of 90% or more is excellent (excellent: peeling is hardly caused), 80% or more is less than 90% is good (good: peeling is hardly caused), and 60% or more is less than 80%. Yes: Some peeling was observed), and less than 60% was evaluated as x (defect: easy to peel). The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
表１より、表面電極上にアンカー層を配置することにより、被覆セラミック層の剥離を大幅に抑制することができ、被覆セラミック層と表面電極との間の接合強度を高められたことが確認された。
また、アンカー層は表面電極上の全域に設けることは必須ではなく、表面電極の外周部と被覆セラミック層の間にのみアンカー層を設けることで充分な効果を発揮することが確認された。 From Table 1, it was confirmed that by disposing the anchor layer on the surface electrode, peeling of the coated ceramic layer can be significantly suppressed, and the bonding strength between the coated ceramic layer and the surface electrode can be increased. It was.
In addition, it is not essential to provide the anchor layer over the entire area of the surface electrode, and it has been confirmed that a sufficient effect can be obtained by providing the anchor layer only between the outer peripheral portion of the surface electrode and the coated ceramic layer.
［アンカー層の組成による効果の確認］
セラミック電子部品１－１から、表面電極及びアンカー層の組成を変更したセラミック電子部品１－４～１－９を作製し、［アンカー層による効果の確認］と同様の方法で、良品率を評価した。
表面電極、アンカー層及び被覆セラミック層の組成並びに良品率の評価結果を表２に示す。 [Confirmation of effect of anchor layer composition]
Fabricate ceramic electronic components 1-4 to 1-9 with different surface electrode and anchor layer compositions from ceramic electronic component 1-1, and evaluate the yield rate by the same method as [Confirmation of effect by anchor layer] did.
Table 2 shows the composition of the surface electrode, the anchor layer and the coated ceramic layer, and the evaluation results of the yield rate.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
表２より、アンカー層を構成する金属成分とセラミック成分との合計体積に対する金属成分の体積の割合が１０％以上、９０％以下であるセラミック電子部品１－１及び１－４～１－７では、良品率が○（良）以上であり、被覆セラミック層の剥離がより抑制されることが確認された。また、セラミック電子部品１－１及び１－６～１－７の対比により、アンカー層の金属成分と表面電極の金属成分とが同一である場合、及び、アンカー層のセラミック成分と被覆セラミック層のセラミック成分とが同一である場合に、被覆セラミック層の剥離がより抑制されることが確認された。 From Table 2, the ratio of the volume of the metal component to the total volume of the metal component and the ceramic component constituting the anchor layer is 10% or more and 90% or less in the ceramic electronic components 1-1 and 1-4 to 1-7. It was confirmed that the non-defective product rate was ◯ (good) or higher, and peeling of the coated ceramic layer was further suppressed. In addition, by comparing ceramic electronic components 1-1 and 1-6 to 1-7, when the metal component of the anchor layer and the metal component of the surface electrode are the same, and the ceramic component of the anchor layer and the coated ceramic layer It was confirmed that peeling of the coated ceramic layer was further suppressed when the ceramic component was the same.
１、２　セラミック電子部品
１０　電子部品本体
１１　基材セラミック層
２０　表面電極
３０　アンカー層
４０　被覆セラミック層
Ｗ１　表面電極の外周部
Ｗ２　表面電極の中央部
  DESCRIPTION OF SYMBOLS 1, 2 Ceramic electronic component 10 Electronic component main body 11 Base material ceramic layer 20 Surface electrode 30 Anchor layer 40 Covering ceramic layer W1 Outer peripheral part W2 of surface electrode Center part of surface electrode

Claims (4)

  1. 表面に基材セラミック層を有する電子部品本体と、前記電子部品本体の表面に設けられた表面電極と、前記表面電極の外周部を被覆する被覆セラミック層とを備えるセラミック電子部品であって、
    前記表面電極の外周部と前記被覆セラミック層の間に、金属成分及びセラミック成分を共に含むアンカー層が設けられていることを特徴とするセラミック電子部品。     A ceramic electronic component comprising an electronic component body having a base ceramic layer on a surface, a surface electrode provided on the surface of the electronic component body, and a coated ceramic layer covering an outer peripheral portion of the surface electrode,
    A ceramic electronic component, wherein an anchor layer including both a metal component and a ceramic component is provided between an outer peripheral portion of the surface electrode and the coated ceramic layer.
  2. 前記アンカー層は、前記表面電極の外周部と前記被覆セラミック層の間のみに設けられている請求項１に記載のセラミック電子部品。 The ceramic electronic component according to claim 1, wherein the anchor layer is provided only between an outer peripheral portion of the surface electrode and the coated ceramic layer.
  3. 前記アンカー層を構成する金属成分及びセラミック成分は、それぞれ、前記表面電極を構成する金属成分及び前記被覆セラミック層を構成するセラミック成分と同一の成分を含む請求項１又は２に記載のセラミック電子部品。 3. The ceramic electronic component according to claim 1, wherein the metal component and the ceramic component constituting the anchor layer include the same component as the metal component constituting the surface electrode and the ceramic component constituting the covering ceramic layer, respectively. .
  4. 前記アンカー層を構成する金属成分とセラミック成分との合計体積に対する金属成分の体積の割合は、１０％以上、９０％以下である請求項１～３のいずれかに記載のセラミック電子部品。 The ceramic electronic component according to any one of claims 1 to 3, wherein a ratio of a volume of the metal component to a total volume of the metal component and the ceramic component constituting the anchor layer is 10% or more and 90% or less.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173222A (en) * 2004-12-14 2006-06-29 Ngk Spark Plug Co Ltd Wiring board
JP2012186269A (en) * 2011-03-04 2012-09-27 Murata Mfg Co Ltd Ceramic multilayer substrate
JP2014232767A (en) * 2013-05-28 2014-12-11 京セラ株式会社 Wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173222A (en) * 2004-12-14 2006-06-29 Ngk Spark Plug Co Ltd Wiring board
JP2012186269A (en) * 2011-03-04 2012-09-27 Murata Mfg Co Ltd Ceramic multilayer substrate
JP2014232767A (en) * 2013-05-28 2014-12-11 京セラ株式会社 Wiring board

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