WO2017214796A1 - 一种锡膏盒取料装置及其取料方法 - Google Patents

一种锡膏盒取料装置及其取料方法 Download PDF

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Publication number
WO2017214796A1
WO2017214796A1 PCT/CN2016/085554 CN2016085554W WO2017214796A1 WO 2017214796 A1 WO2017214796 A1 WO 2017214796A1 CN 2016085554 W CN2016085554 W CN 2016085554W WO 2017214796 A1 WO2017214796 A1 WO 2017214796A1
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Prior art keywords
solder paste
plate
fixing plate
box
paste box
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PCT/CN2016/085554
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English (en)
French (fr)
Inventor
罗艺
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深圳市兴华炜科技有限公司
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Priority to PCT/CN2016/085554 priority Critical patent/WO2017214796A1/zh
Publication of WO2017214796A1 publication Critical patent/WO2017214796A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B69/00—Unpacking of articles or materials, not otherwise provided for

Definitions

  • the invention relates to the field of solder paste printing technology, and more particularly to a solder paste box reclaiming device and a reclaiming method thereof.
  • Solder paste is a new type of solder material that comes with SMT. It is usually mixed with solder powder, flux, surfactant and thixotropic agent to form a paste mixture. It is mainly used for soldering electronic components on PCB. Printing and other fields;
  • solder paste is taken out from the solder paste box, and most of them rely on manual excavation.
  • solder paste box there are often more residues, the solder paste is seriously wasted, and the worker operates with high production intensity and cannot be automated;
  • the paste is preferentially taken out from the solder paste box and injected into other containers for automated production.
  • the solder paste residue problem is greater, the manual operation intensity is large, and additional processes and equipment are needed, which improves. Cost of production.
  • the technical problem to be solved by the present invention is to provide a solder paste box reclaiming device which is convenient for automatic material extraction, low in manual production intensity, low in solder paste residue and low in cost, in view of the above-mentioned defects of the prior art;
  • the invention also provides a solder paste box reclaiming method using the solder paste box reclaiming device.
  • a solder paste box reclaiming device comprising a solder paste box and a solder paste box fixing plate; wherein, further comprising: a squeezing device and a driving device for providing thrust to the solder paste box fixing plate; the squeezing device comprising a bottom plate a guide tube fixedly disposed on the bottom plate and a pressing plate fixed to an end portion of the guide tube facing away from the bottom end of the bottom plate; the extruding device further comprising a guide plate extending through the pressing plate in sequence a through hole of the material tube and the bottom plate.
  • the side surface of the pressing plate is provided with a sealing ring.
  • solder paste box reclaiming device of the present invention wherein the sealing ring has at least two side surfaces on the pressing plate.
  • the solder paste box reclaiming device of the present invention wherein the pressing plate side surface is provided with a first cavity for accommodating the sealing ring.
  • solder paste box reclaiming device of the present invention wherein the inner wall of the first through hole is provided with a second cavity, the second cavity is provided with a scraper; and the cylinder for driving the scraper is further included.
  • the solder paste box reclaiming device of the present invention further includes a guide frame for guiding the solder paste holder fixing plate.
  • the solder paste box reclaiming device of the present invention wherein the guide frame comprises a support plate, a guide rail disposed on the support plate, a slider slidably coupled to the guide rail, and the slider and the The slider fixing block of the solder paste holder fixing plate.
  • solder paste box reclaiming device of the present invention wherein the solder paste holder fixing plate is provided with a third cavity engaged with the bottom of the solder paste case.
  • the solder paste box reclaiming device of the present invention further includes a fixing plate for fixing the bottom plate, and the fixing plate is provided with a second through hole communicating with the first through hole.
  • a solder paste box reclaiming method is applied to the solder paste box reclaiming device, and the method is as follows: the solder paste box is fixed downwardly on the solder paste box fixing plate, and then driven by a driving device to fix the solder paste box The plate moves downwardly, and after the contact with the pressing plate, the pressing plate starts to press the solder paste in the solder paste box to make the solder paste flow out through the first through hole, and the material is taken out.
  • the invention has the beneficial effects that the solder paste box is fixed downwardly on the solder paste holder fixing plate, and then the solder paste holder fixing plate is driven downward by the driving device. After contacting the pressing plate, the pressing plate starts to squeeze the solder paste.
  • the solder paste in the box allows the solder paste to flow out through the first through hole, which completes the reclaiming, saves the worker's operation intensity, eliminates the need for additional containers, reduces the residual consumption of the solder paste, and is more convenient for automatic control; the overall structure is simple and the cost is low.
  • FIG. 1 is a schematic view showing the structure of a solder paste box take-up device according to a preferred embodiment of the present invention.
  • the solder paste box reclaiming device of the preferred embodiment of the present invention includes a solder paste box 1 and a solder paste box fixing plate 2; and further includes an extruding device 3 and a driving force for providing a thrust to the solder paste holder fixing plate 2.
  • the squeezing device 3 includes a bottom plate 30, a guiding tube 31 fixedly disposed on the bottom plate 30, and a pressing plate 32 fixed at an end portion of the guiding tube 31 facing away from the bottom end of the bottom plate 30; the squeezing device 3 further includes a squeezing device The pressure plate 32, the guide tube 31 and the first through hole 33 of the bottom plate 30; the solder paste box 1 is fixed downwardly on the solder paste holder fixing plate 2, and then the driving device 4 drives the solder paste holder fixing plate 2 to move downward.
  • the pressing plate 32 After the contact with the pressing plate 32, the pressing plate 32 starts to squeeze the solder paste in the solder paste box 1 to make the solder paste flow out through the first through hole 33, thereby completing the reclaiming, thereby saving the worker's operation strength, without additionally adding a container, and reducing the number of containers. Solder paste residual consumption, and automatic control is more convenient; the overall structure is simple and the cost is low.
  • the side surface of the pressing plate 32 is provided with a sealing ring 320 , which prevents the solder paste from sliding out from both sides of the pressing plate 32 during the pressing, thereby ensuring no residue or residual residue on the inner wall of the solder paste case 1;
  • the buffering effect avoids damage of the pressing plate 32 caused by the direct contact between the pressing plate 32 and the solder paste case 1, or the solder paste case 1 is broken, prolonging the service life of the pressing plate 32.
  • the seal ring 320 has at least two side surfaces on the pressing plate 32, which ensures that there is no residue or less residue on the inner wall of the solder paste case 1.
  • the side surface of the pressing plate 32 is provided with a first cavity 321 accommodating the seal ring 320, and the connection is made closer to prevent the seal ring 320 from being displaced.
  • the inner wall of the first through hole 33 is provided with a second cavity 330, and the second cavity 330 is provided with a scraper 331; further comprising a cylinder (not shown) for driving the scraper 331 to extrude a certain amount of tin After the paste, the scraper 331 is cut by the cylinder (not shown), which effectively controls the amount of the solder paste, saves the solder paste while controlling the finer, and facilitates automatic production.
  • the guide frame 5 guided by the solder paste holder fixing plate 2 is further guided by the guide frame 5 to effectively prevent displacement and the material recovery is more stable.
  • the guide frame 5 includes a support plate 50, a guide rail 51 disposed on the support plate 50, a slider 52 slidably coupled to the guide rail 51, and a slider fixing block connecting the slider 52 and the solder paste holder fixing plate 2. 53, simple structure and low cost.
  • the solder paste holder fixing plate 2 is provided with a third cavity 20 which is matched with the bottom of the solder paste case 1, which facilitates the assembly of the solder paste case 1 on the solder paste holder fixing plate 2, and reduces the manual operation strength.
  • the fixing plate 6 for fixing the bottom plate 30 is further provided.
  • the fixing plate 6 is provided with a second through hole 60 communicating with the first through hole 33, and the bottom plate 30 is fixed by the fixing plate 6, so that the production is more stable.
  • the invention also provides a solder paste box reclaiming method, which utilizes a solder paste box reclaiming device, and the implementation manner is as follows: the solder paste box 1 is fixed downwardly on the solder paste box fixing plate 2, and then the solder paste is driven by the driving device 4. After the cartridge fixing plate 2 is moved downward, the pressing plate 32 starts to squeeze the solder paste in the solder paste box 1 to flow the solder paste through the first through hole 33 to complete the reclaiming.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种锡膏盒取料装置，包括锡膏盒（1）和锡膏盒固定板（2）；还包括挤料装置（3）和为锡膏盒固定板（2）提供推力的驱动装置（4）；挤料装置（3）包括底板（30）、固定设置在底板（30）上的导料管（31）和固定在导料管（31）背离底板（30）一端端部的挤压板（32）；挤料装置（3）还包括依次贯穿挤压板（32）、导料管（31）和底板（30）的第一通孔（33）；锡膏盒（1）开口朝下在锡膏盒固定板（2）上固定后通过驱动装置（4）带动锡膏盒固定板（2）向下运动，与挤压板（32）接触后，挤压板（32）开始挤压锡膏盒（1）内锡膏使锡膏通过第一通孔（33）流出，完成取料，节省了工人操作强度，无需额外增加容器，减少了锡膏残留消耗，且自动化控制更为方便，整体结构简单，成本低。

Description

一种锡膏盒取料装置及其取料方法 技术领域
本发明涉及锡膏印刷技术领域，更具体地说，涉及一种锡膏盒取料装置及其取料方法。
 背景技术
锡膏是伴随SMT应运而生的一种新型焊接材料，一般由焊锡粉、助焊剂以及表面活性剂、触变剂等加以混合，形成的膏状混合物，主要用于PCB上电子元器件焊接、印刷等领域；
目前从锡膏盒内取出锡膏，大都依靠人工进行挖取，在锡膏盒内往往会存在较多残留，对锡膏浪费严重，且工人操作生产强度大，无法自动化生产；另外通过将锡膏从锡膏盒中优先取出后注入其他容器内以实现自动化生产的方式，虽然满足了自动化生产需求，但是锡膏残留问题更大，人工操作强度大且需要增加额外的工序以及设备，提高了生产成本。
 技术问题
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种自动取料方便、人工生产强度低、锡膏残留少且成本低的锡膏盒取料装置；
 技术解决方案
本发明还提供了一种利用该锡膏盒取料装置的锡膏盒取料方法。
本发明解决其技术问题所采用的技术方案是：
构造一种锡膏盒取料装置，包括锡膏盒和锡膏盒固定板；其中，还包括挤料装置和为所述锡膏盒固定板提供推力的驱动装置；所述挤料装置包括底板、固定设置在所述底板上的导料管和固定在所述导料管背离所述底板一端端部的挤压板；所述挤料装置还包括依次贯穿所述挤压板、所述导料管和所述底板的通孔。
本发明所述的锡膏盒取料装置，其中，所述挤压板侧表面设置有密封环。
本发明所述的锡膏盒取料装置，其中，所述密封环在所述挤压板侧表面至少有两个。
本发明所述的锡膏盒取料装置，其中，所述挤压板侧表面设置有容纳所述密封环的第一凹腔。
本发明所述的锡膏盒取料装置，其中，所述第一通孔内壁设置有第二凹腔，所述第二凹腔内设置有刮刀；还包括驱动所述刮刀的气缸。
本发明所述的锡膏盒取料装置，其中，还包括为所述锡膏盒固定板导向的导向架。
本发明所述的锡膏盒取料装置，其中，所述导向架包括支撑板、设置在所述支撑板上的导轨、与所述导轨滑动连接的滑块以及连接所述滑块和所述锡膏盒固定板的滑块固定块。
本发明所述的锡膏盒取料装置，其中，所述锡膏盒固定板设置有与所述锡膏盒底部配合的第三凹腔。
本发明所述的锡膏盒取料装置，其中，还包括固定所述底板的固定板，所述固定板设置有与所述第一通孔连通的第二通孔。
一种锡膏盒取料方法，应用所述锡膏盒取料装置，实现方法如下：所述锡膏盒开口朝下在所述锡膏盒固定板上固定后通过驱动装置带动锡膏盒固定板向下运动，与所述挤压板接触后，所述挤压板开始挤压所述锡膏盒内锡膏使锡膏通过所述第一通孔流出，完成取料。
 有益效果
本发明的有益效果在于：锡膏盒开口朝下在锡膏盒固定板上固定后通过驱动装置带动锡膏盒固定板向下运动，与挤压板接触后，挤压板开始挤压锡膏盒内锡膏使锡膏通过第一通孔流出，完成取料，节省了工人操作强度，无需额外增加容器，减少了锡膏残留消耗，且自动化控制更为方便；整体结构简单，成本低。
 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将结合附图及实施例对本发明作进一步说明，下面描述中的附图仅仅是本发明的部分实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图：
图1是本发明较佳实施例的锡膏盒取料装置结构示意图。
 本发明的实施方式
为了使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本发明的部分实施例，而不是全部实施例。基于本发明的实施例，本领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其他实施例，都属于本发明的保护范围。
本发明较佳实施例的锡膏盒取料装置如图1所示，包括锡膏盒1和锡膏盒固定板2；还包括挤料装置3和为锡膏盒固定板2提供推力的驱动装置4；挤料装置3包括底板30、固定设置在底板30上的导料管31和固定在导料管31背离底板30一端端部的挤压板32；挤料装置3还包括依次贯穿挤压板32、导料管31和底板30的第一通孔33；锡膏盒1开口朝下在锡膏盒固定板2上固定后通过驱动装置4带动锡膏盒固定板2向下运动，与挤压板32接触后，挤压板32开始挤压锡膏盒1内锡膏使锡膏通过第一通孔33流出，完成取料，节省了工人操作强度，无需额外增加容器，减少了锡膏残留消耗，且自动化控制更为方便；整体结构简单，成本低。
如图1所示，挤压板32侧表面设置有密封环320，挤压时防止锡膏从挤压板32两侧滑出，保障锡膏盒1内壁无残留或残留较少；同时起到缓冲效果，避免了挤压板32与锡膏盒1直接接触导致的挤压板32损坏或锡膏盒1破裂，延长了挤压板32使用寿命。
如图1所示，密封环320在挤压板32侧表面至少有两个，保障了锡膏盒1内壁无残留或残留较少。
如图1所示，挤压板32侧表面设置有容纳密封环320的第一凹腔321，连接更加紧密，防止密封环320移位。
如图1所示，第一通孔33内壁设置有第二凹腔330，第二凹腔内330设置有刮刀331；还包括驱动刮刀331的气缸（图中未显示），挤出一定分量锡膏后通过气缸（图中未显示）带动刮刀331割断，有效控制锡膏取量，节约锡膏的同时控制更加精细，便于自动化生产。
如图1所示，还包括为锡膏盒固定板2导向的导向架5，通过导向架5进行导向，有效防止移位，取料更加稳定。
如图1所示，导向架5包括支撑板50、设置在支撑板50上的导轨51、与导轨51滑动连接的滑块52以及连接滑块52和锡膏盒固定板2的滑块固定块53，结构简单，成本低。
如图1所示，锡膏盒固定板2设置有与锡膏盒1底部配合的第三凹腔20，方便了锡膏盒1在锡膏盒固定板2上的装配，降低人工操作强度。
如图1所示，还包括固定底板30的固定板6，固定板6设置有与第一通孔33连通的第二通孔60，通过固定板6对底板30进行固定，生产更加稳定。
本发明还提供了一种锡膏盒取料方法，利用锡膏盒取料装置，实现方式如下：锡膏盒1开口朝下在锡膏盒固定板2上固定后通过驱动装置4带动锡膏盒固定板2向下运动，与挤压板32接触后，挤压板32开始挤压锡膏盒1内锡膏使锡膏通过第一通孔33流出，完成取料。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (10)

  1. 一种锡膏盒取料装置，包括锡膏盒和锡膏盒固定板；其特征在于，还包括挤料装置和为所述锡膏盒固定板提供推力的驱动装置；所述挤料装置包括底板、固定设置在所述底板上的导料管和固定在所述导料管背离所述底板一端端部的挤压板；所述挤料装置还包括依次贯穿所述挤压板、所述导料管和所述底板的第一通孔。
  2. 根据权利要求1所述的锡膏盒取料装置，其特征在于，所述挤压板侧表面设置有密封环。
  3. 根据权利要求2所述的锡膏盒取料装置，其特征在于，所述密封环在所述挤压板侧表面至少有两个。
  4. 根据权利要求3所述的锡膏盒取料装置，其特征在于，所述挤压板侧表面设置有容纳所述密封环的第一凹腔。
  5. 根据权利要求1所述的锡膏盒取料装置，其特征在于，所述第一通孔内壁设置有第二凹腔，所述第二凹腔内设置有刮刀；还包括驱动所述刮刀的气缸。
  6. 根据权利要求1所述的锡膏盒取料装置，其特征在于，还包括为所述锡膏盒固定板导向的导向架。
  7. 根据权利要求6所述的锡膏盒取料装置，其特征在于，所述导向架包括支撑板、设置在所述支撑板上的导轨、与所述导轨滑动连接的滑块以及连接所述滑块和所述锡膏盒固定板的滑块固定块。
  8. 根据权利要求1所述的锡膏盒取料装置，其特征在于，所述锡膏盒固定板设置有与所述锡膏盒底部配合的第三凹腔。
  9. 根据权利要求1所述的锡膏盒取料装置，其特征在于，还包括固定所述底板的固定板，所述固定板设置有与所述第一通孔连通的第二通孔。
  10. 一种锡膏盒取料方法，利用如权利要求1-9任一项所述的锡膏盒取料装置，其特征在于，所述锡膏盒开口朝下在所述锡膏盒固定板上固定后通过驱动装置带动锡膏盒固定板向下运动，与所述挤压板接触后，所述挤压板开始挤压所述锡膏盒内锡膏使锡膏通过所述第一通孔流出，完成取料。
PCT/CN2016/085554 2016-06-13 2016-06-13 一种锡膏盒取料装置及其取料方法 WO2017214796A1 (zh)

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