WO2017211082A1 - 一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法 - Google Patents

一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法 Download PDF

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Publication number
WO2017211082A1
WO2017211082A1 PCT/CN2017/070456 CN2017070456W WO2017211082A1 WO 2017211082 A1 WO2017211082 A1 WO 2017211082A1 CN 2017070456 W CN2017070456 W CN 2017070456W WO 2017211082 A1 WO2017211082 A1 WO 2017211082A1
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WIPO (PCT)
Prior art keywords
workpiece
magnetic field
polishing pad
double
magnet
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PCT/CN2017/070456
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English (en)
French (fr)
Inventor
潘继生
阎秋生
李卫华
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广东工业大学
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Application filed by 广东工业大学 filed Critical 广东工业大学
Priority to US15/555,073 priority Critical patent/US20180243877A1/en
Publication of WO2017211082A1 publication Critical patent/WO2017211082A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/102—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using an alternating magnetic field
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing

Definitions

  • the invention relates to a double-side polishing device and a method for controlling the rigidity of a polishing pad by a cluster dynamic magnetic field, and is particularly suitable for planar planarization processing of an optoelectronic/microelectronic semiconductor substrate and an optical component, and belongs to the technical field of ultra-precision machining.
  • Microelectronics and optoelectronics represented by integrated circuit (IC) and optoelectronic device manufacturing, are at the heart of the electronic information industry and the most competitive and fastest-growing industry in the world today.
  • Single crystal silicon (Si), single crystal germanium (Ge), gallium arsenide (GaAs), single crystal silicon carbide (SiC), and sapphire (Al 2 O 3 ) are used as substrate materials for integrated power electronic devices and optoelectronic devices. It is required to have ultra-flat, ultra-smooth (roughness Ra up to 0.3nm or less), defect-free and damage-free surface, and the processing quality directly determines the application value and the performance of the device.
  • optical lenses and mirrors as one of the core components of optical devices, have to achieve good optical performance, and the surface precision needs to be ultra-smooth (roughness Ra reaches 1 nm or less), and the surface accuracy is also improved. High requirements (shape accuracy up to 0.5 microns).
  • the planarization processing of optical planar components and semiconductor substrates mainly uses conventional grinding, end face precision grinding, ultra-precision polishing, chemical mechanical polishing, and magnetorheological polishing.
  • Magnetorheological Finishing is a new type of optical surface proposed by KORDONSKI and its collaborators in the 1990s by combining electromagnetics, fluid dynamics, analytical chemistry, and processing technology.
  • the processing method has the advantages of good polishing effect, no secondary surface damage, and is not suitable for traditional surface polishing, etc., and has developed into a revolutionary optical surface processing method, especially suitable for ultra-precision machining of axisymmetric aspherical surfaces. Widely used in large optical components, semiconductor wafers, LED substrates, liquid crystal display panels, etc. The final processing steps.
  • the planar workpiece is processed by the magnetorheological polishing method, it is mainly used in various types of magnetorheological machines developed by QED Company of the United States.
  • the principle is to place the workpiece on a circular arc-shaped polishing disc, the surface of the workpiece and the polishing disc.
  • a concave gap is formed between the polishing disc, and an electromagnet magnetic pole or a permanent magnet magnetic pole having a magnetic induction intensity is arranged to form a high-intensity gradient magnetic field at the concave gap, and the magnetorheological fluid moves to the workpiece and the polishing disc with the polishing disc.
  • the flexible raised "stained ribbon" formed near the gap removes the surface material of the workpiece by "polishing the ribbon".
  • BEMRF ball end magnetorheological processing
  • MRAFF magnetorheological abrasive flow processing
  • MCF magnetic composite fluid polishing
  • the embodiment of the invention provides a double-sided polishing device and a method for controlling the rigidity of a polishing pad by a cluster dynamic magnetic field, and the whole process of rough polishing to fine polishing of the workpiece is realized by adjusting the rigidity of the flexible polishing pad, and the workpiece is different in the traditional processing process.
  • the relative speed between the position and the polishing pad is inconsistent, causing uneven processing of the workpiece.
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field comprises: a variable stiffness cluster magnetron polishing pad generating mechanism, a workpiece quick clamping mechanism and a workpiece motion driving mechanism;
  • the variable stiffness cluster magnetron polishing pad generating mechanism includes a first magnetic field generating block and a second magnetic field generating block disposed symmetrically; the first magnetic field generating block and the second magnetic field generating block respectively include: a housing and a yaw main axis , eccentric camshaft, magnet mount, permanent magnet and motor;
  • One end of the permanent magnet is mounted on the magnet mount with an even array of holes, and the other end is mounted in the end face of the eccentric camshaft; the large end of the yaw main shaft is connected to the eccentric camshaft, and the shaft end of the yaw spindle is fixed to the shell On the body; the motor is fixed on the housing, and the bias is driven by the transmission structure Spindle spindle rotation;
  • the first magnetic field generating block and the second magnetic field generating block move forward and backward toward each other under the driving of the opposite moving mechanism;
  • the workpiece quick clamping mechanism comprises a working slot, a clamping plate, a connecting rod, a hinge plate, a fixed hinge, a square magnet, an electric soft iron block, a circular cast iron and a strip permanent magnet;
  • the working slot is disposed between the first magnetic field generating block and the second magnetic field generating block, wherein a working space for accommodating the workpiece is formed in the middle portion; a clamping plate is disposed at both ends of the working groove, and the outside of the clamping plate
  • the side surface is movably connected to the inner wall of the working slot by two parallel connecting rods; the working groove inner wall, the clamping plate and the two corresponding connecting rods form a parallelogram; between the two ends of the clamping plate Engaging the workpiece into the processing space for the annular structure, one end of the clamping plate is movably connected to one end of the hinge plate, and the other end of the hinge plate is connected to one end of the fixing hinge by a living hinge;
  • the other end of the hinge is fixedly connected with the square protective sleeve on which the square magnet is mounted; two electric soft iron blocks are disposed at two ends of the working groove, and are matched with two square magnets; the electric soft iron block Connecting a rectangular parallelepiped having a cylindrical
  • the workpiece motion driving mechanism comprises a support block, a beam, a horizontal linear motor, a vertical beam and a vertical linear motor; the support block is symmetrically located above the base of the double-sided polishing device, and the horizontal linear motor with the beam mounted above is fixed at the two ends of the support Above the block, a vertical beam is fixedly mounted on both ends of the beam, and a vertical linear motor is mounted on the vertical beam, and the left and right sides of the working groove are fixed on the vertical linear motor.
  • the opposite moving mechanism comprises: a translational linear motor, a precision double-sided rack and two precision single-sided racks;
  • the translational linear motor is mounted above the base, and a parallel double-sided rack with a symmetrical structure is mounted on the translational linear motor, and two sides of the precision double-sided rack are respectively meshed with two precision single-sided racks;
  • the precision single-faced teeth are mounted on the base through linear guides in the front-rear direction, and are respectively disposed on both sides of the precision double-sided rack;
  • the housings of the first magnetic field generating block and the second magnetic field generating block are respectively connected to the precision double-sided rack and the two precision single-sided racks.
  • the transmission structure comprises a small pulley, a large pulley, a small flat key, a large flat key and a V-belt;
  • the small pulley and the large pulley are respectively fixed to the motor shaft of the motor and the yaw main shaft through a small flat key and a large flat key, and the small pulley and the large pulley are connected by the V-belt.
  • the magnetic field strength of the permanent magnet is between 1000 Gs and 5500 Gs
  • the magnetic field strength of the square magnet is between 200 Gs and 1200 Gs
  • the magnetic field strength of the strip permanent magnet is between 2000 Gs and 4000 Gs, which is installed in the same
  • the cylindrical permanent magnets of the magnet mount are distributed adjacent to each other, and the cylindrical permanent magnets mounted on the different magnet mounts correspond to each other and are close to the short magnetic poles.
  • the workpiece quick clamping mechanism further includes a circular cage for placing the workpiece, and a left gear and a right gear disposed around the cage and intermeshing with the arc edge of the cage, Upper gear and lower gear;
  • the left gear, the right gear, the upper gear and the lower gear are mounted in the working slot, wherein the left gear and the right gear are symmetrically mounted, and the upper gear and the lower gear are symmetrically mounted;
  • At least one of the left gear, the right gear, the upper gear, and the lower gear is coupled to the stepping motor.
  • the double-sided polishing method for the rigidity of the cluster dynamic magnetic field control polishing pad provided by the embodiment of the invention is applied to the above-mentioned double-sided polishing device for controlling the rigidity of the polishing pad of the dynamic magnetic field, comprising:
  • Step 1 According to the size and material properties of the workpiece, select the permanent magnet of the corresponding magnetic field strength, and adjust the position of the strip permanent magnet so that the magnetic pole direction of the strip permanent magnet is perpendicular to the square magnet;
  • Step 2 placing the workpiece in the working slot and separating the edge of the workpiece between the splints, adjusting the position of the strip-shaped permanent magnet so that the magnetic pole direction of the strip-shaped permanent magnet is in the same direction as the magnetic pole of the square magnet, and the electric soft iron block is in the shape of the strip. Rapid magnetization under the action of a magnet generates a suction force to attract the square magnet, thereby clamping the workpiece by pulling the clamp plate by the interaction of the hinge plate, the clamp plate, the fixed hinge and the connecting rod;
  • the three kinds of abrasives are micron-sized abrasives with a concentration of 3% to 8%, submicron abrasives with a concentration of 3% to 10%, a nano-scale abrasive having a concentration of 2% to 10%, and a submicron carbonyl iron powder having a concentration of 5% to 20% and a micron-sized carbonyl iron powder having a concentration of 5% to 25% at a concentration of 5% to 25%, and a concentration of 3% to 15% of the dispersant and the concentration of 1% to 6% of the rust inhibitor, fully stirred and then vibrated by ultrasonic for 5 to 30 minutes, and then selectively added to the chemical reaction with the workpiece at a concentration of 1% to 10% a chemical liquid, selectively adding a catalyst capable of promoting a reaction speed between the workpiece and the chemical liquid, and then shaking the ultrasonic wave
  • Step 4 Pour the magnetorheological fluid into the working tank to diffuse the magnetorheological fluid over the workpiece, and adjust the distance between the end surface of the magnet mounting seat and the front and rear sides of the working slot by the opposite moving mechanism to be 0.5 mm to 10 mm.
  • the rheological liquid rapidly solidifies into a flexible polishing pad under the action of the permanent magnet forming the array, and the magnetic poles are staggered and symmetrical to realize the pressure balance of the polishing pad on the workpiece;
  • Step 5 Start the motor and drive the yaw axis to eccentrically swing around the eccentricity of the spindle.
  • the eccentric oscillation of the yaw spindle forces the eccentric camshafts to rotate synchronously with the cylindrical permanent magnets, so that the static magnetic lines of the cylindrical permanent magnet end face are converted into dynamic magnetic lines of force.
  • Step 6 Starting the horizontal linear motor and the vertical linear motor to drive the working slot and the workpiece to move, so that the workpiece and the flexible polishing pad formed by the magnetorheological fluid form a relative movement of the plane of the predetermined trajectory, and the flexible polishing pad formed by the magnetorheological fluid is simultaneously Mechanical removal of both surface materials of the workpiece and the corrosion layer;
  • Step 7 During the processing, the distance between the end faces of the magnet mounting seat and the front and rear sides of the working slot is gradually increased by the opposite moving mechanism, so that the rigidity of the flexible polishing pad formed by the magnetorheological fluid is further reduced, and the application to the workpiece is reduced. Force, complete the roughing of the workpiece to the whole process of finishing;
  • Step 8 Stop the horizontal linear motor, the vertical linear motor and the motor, and adjust the position of the strip permanent magnet so that the magnetic pole direction of the strip permanent magnet is opposite to the magnetic pole direction of the square magnet, and the workpiece is released and taken out.
  • the workpiece is a glass substrate, a single crystal SiC substrate, a single crystal Si substrate, a sapphire substrate, a polycrystalline semiconductor substrate, a ceramic substrate or a metal substrate.
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field first realizes the characteristics of the magnetization of the soft magnetic material, the fast demagnetization property, and the extremely weak magnetic field between the strip permanent magnets and the extremely strong magnetic field at both ends.
  • the invention innovatively uses a phase-shifting mechanism to control the distance between the magnetic field generating blocks on both sides and the workpiece, and when the magnetorheological fluid enters the working tank, the viscoelasticity is formed, which is equal in bilateral pressure and constrains and aggregates the abrasive behavior.
  • Magnetorheological effect polishing pad to ensure the stability of the workpiece double-sided polishing pad
  • Performing and innovatively oscillating the main shaft by the eccentric cam structure, and the swing of the eccentric main shaft realizes a plurality of eccentric cam shaft rotations having the same eccentricity, thereby achieving breakthrough rotation of the permanent magnets arranged in a plurality of closely arranged arrays.
  • the static magnetic lines of force on the magnetic pole face are transformed into interactive dynamic magnetic lines, and the dynamic magnetic lines promote the dynamic distribution of the flexible polishing pad formed by the magnetorheological fluid to reduce the rigidity of the flexible polishing pad and promote the recovery of the performance of the flexible polishing pad;
  • variable stiffness cluster magnetron polishing pad Through the process of symmetrical adjustment of the variable stiffness cluster magnetron polishing pad, the distance between the end face of the mechanism and the surface of the workpiece can be well realized.
  • the whole process of rough polishing to fine polishing of the workpiece can be completed in one process; horizontal and vertical lines are adopted.
  • the way of motor combination realizes the complex motion track of the workpiece, avoiding the important problem that the relative speed between the different positions of the workpiece and the polishing pad is inconsistent in the traditional machining process, resulting in uneven machining of the workpiece;
  • the double-sided polishing device of the cluster dynamic magnetic field control polishing pad stiffness of the invention is suitable for ordinary magnetorheological double-sided polishing and magnetic flow change mechanical double-side polishing, and the required magnetorheological fluid only needs to be filled to one pole. In a small closed work area, the cost of consumables is greatly saved. It can be seen that the surface obtained by the invention has good surface consistency, high processing efficiency, no surface and sub-surface damage, and low cost, and is very suitable for planar high-efficiency ultra-smooth uniform polishing of large-diameter optical components.
  • FIG. 1 is a front elevational view of a double-sided polishing apparatus for controlling the stiffness of a polishing pad by a cluster dynamic magnetic field according to an embodiment of the present invention
  • Figure 2 is a schematic view showing the structure of the A-A cross section of the top view of Figure 1;
  • FIG. 3 is a schematic cross-sectional view of a B-B cross-sectional view of the top view of FIG. 1;
  • FIG. 4 is a left side view of a double-sided polishing apparatus for controlling the rigidity of a polishing pad in a cluster dynamic magnetic field according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram of a square workpiece clamping of a double-sided polishing apparatus for cluster dynamic magnetic field control polishing pad stiffness according to an embodiment of the present invention
  • FIG. 6 is a schematic diagram of a circular workpiece clamping device of a double-sided polishing apparatus for cluster dynamic magnetic field control polishing pad stiffness according to an embodiment of the invention.
  • the embodiment of the invention provides a double-sided polishing device and a method for controlling the rigidity of a polishing pad by a cluster dynamic magnetic field, and the whole process of rough polishing to fine polishing of the workpiece is realized by adjusting the rigidity of the flexible polishing pad, and is used for solving the workpiece in the traditional machining process.
  • the relative speeds between the different positions and the polishing pad are inconsistent, resulting in uneven processing of the workpiece.
  • a double-sided polishing device for controlling the rigidity of a polishing pad by a cluster dynamic magnetic field is characterized by comprising a variable stiffness cluster magnetron polishing pad generating mechanism, a workpiece quick clamping mechanism and a workpiece motion driving mechanism.
  • Variable stiffness cluster magnetron polishing pad generating mechanism includes base (1), screw two (12), linear guide (14), screw three (15), precision single-sided rack (16), gear (17), gear Shaft (18), deep groove bearing (19), precision double-sided rack (21), connecting plate one (63), connecting plate two (64), slot type end cover (9), housing (11), screw Four (28), spindle eccentricity (29), rolling bearing (30), V-belt (31), small pulley (32), motor shaft (33), small flat key (34), bearing cover (35), Housing plate (36), screw five (37), screw six (38), magnet mount (46), cylindrical permanent magnet (47), screw seven (48), spacer (49), nut (50 ), eccentric camshaft (51), camshaft eccentricity (52), large pulley (53), yaw spindle (54), large flat key (55), sealing ring (56), bearing end cap (57), Radial thrust bearing (58), motor (60), screw eight (61), protective cover (62), screw nine (65), A groove ball bearing (66), where
  • the translational linear motor (20) is mounted directly above the base (1) by a screw nine (65), and a symmetrical structure is mounted on the translational linear motor (20).
  • the precision double-sided rack (21), the two sides of the precision double-sided rack (21) are respectively meshed with two gears (17) fixed to the gear shaft (18) by deep groove bearings (19), and the linear guides (14) are parallel Symmetrically arranged on both sides of the translational linear motor (20), and fixed to the base (1) by screws three (15), the precision single-sided rack (16) arranged above the linear guide (14) is just with the gear (17) Engagement, as shown in Fig.
  • one end of the cylindrical permanent magnet (47) is mounted in the cylindrical bore of the end face of the eccentric camshaft (51) by an interference fit, and the magnet mount (46) having an even array of holes passes through the screw seven ( 48) Fixed to the bearing plate (36) Upper, the eccentric camshaft (51) is fixed to the bearing seat plate (36) by a radial thrust bearing (58), a spacer (49), a nut (50), a bearing cover (35) and a screw five (37).
  • the large end of the yaw main shaft (54) is connected to the eccentric cam shaft (51) through the deep groove ball bearing (66), and the shaft end of the yaw main shaft (54) is connected to the casing (11) through the rolling bearing (30) and passed through the screw four ( 28) and a bearing end cover (57) is fixed to the housing (11), the housing (11) is fixed to the bearing seat plate (36) by a screw six (38), and a connecting plate is passed under a housing (11) (63) is connected with the upper side of the precision single-sided rack (16), and the other housing (11) is connected with the upper side of the precision double-sided rack (21) through the connecting plate 2 (64), and the motor (60) passes the screw eight ( 61) fixed on the upper side of the casing (11), the small pulley (32) and the large pulley (53) are fixed to the motor shaft (33) and the yaw main shaft through the small flat key (34) and the large flat key (55), respectively.
  • the workpiece quick clamping mechanism includes a working slot (10), a square magnet (39), and a hinge plate (40) ), splint (41), protective sleeve (43), fixed hinge (44), connecting rod (45), electric soft iron block (23), circular cast iron (24), strip permanent magnet (25), yellow Copper (26), rotating handle (8), wherein one end of the connecting rod (45) is fixed to the inner wall of the working slot (10) by a living hinge, and the other end of the connecting rod (45) is linked to the side of the clamping plate (41) through a living hinge, the working slot (10)
  • the inner wall, the splint (41) and the two connecting rods (45) form a parallelogram, and the two sets of parallelograms are symmetrically arranged on both sides of the inner wall of the working groove (10), and one end of the clamping plate (41) passes through the living hinge and the hinge
  • the workpiece motion driving mechanism includes a base (1), a support block (2), a horizontal linear motor (3), a beam (4), a rib (5), and a screw (6).
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field is characterized in that the magnet mounting seat (46) of the variable stiffness cluster magnetron polishing pad generating mechanism is symmetrically arranged on the front and rear sides of the working groove (10), through the flat
  • the linear motor (20) can synchronously adjust the distance between the end faces of the magnet mounting seat (46) and the front and rear sides of the working slot (10) to ensure that the distance between the two magnet mounting seats (46) to the working slot (10) is consistent.
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field is characterized in that there is a spindle eccentricity (29) at the axial end bearing position of the yaw main shaft (54), and a small end bearing position of the eccentric cam shaft (51) There is a camshaft eccentricity (52), the spindle eccentricity (29) and the camshaft eccentricity (52) are equal, and the motor (60) works through the small pulley (32), the large pulley (53) and the V.
  • the belt (31) drives the yaw main shaft (54) to eccentrically swing around the spindle eccentricity (29), and the eccentric oscillation of the yaw main shaft (54) forces the eccentric cam shafts (51) to rotate synchronously with the cylindrical permanent magnets (47).
  • the static magnetic lines of force at the end faces of the cylindrical permanent magnets (47) are converted into dynamic magnetic lines of force.
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field is characterized in that the magnetic field strength of the cylindrical permanent magnet (47) is between 1000 Gs and 5500 Gs, and the magnetic field strength of the square magnet (39) is between 200 Gs and 1200 Gs.
  • the magnetic field strength of the strip-shaped permanent magnet (25) is between 2000 Gs and 4000 Gs, and is distributed between the adjacent permanent magnets (47) of the same magnet mount (46), and is mounted on different magnet mounts.
  • the cylindrical permanent magnets (47) of (46) correspond to each other and are close to the short magnetic poles.
  • the trough end cover (9) is a non-magnetic material such as stainless steel, magnesium alloy and ceramic, and the working groove (10), the hinge plate (40), the splint (41), the fixed hinge (44), the connecting rod (45) And the grooved end cap (9) is made of stainless steel.
  • the parameters of the left gear (69), the right gear (70), the upper gear (71), and the lower gear (72) are the same, and the left gear (69) ) the distance from the right gear (70) is exactly equal to the upper gear when the slot end cover (9) is installed (71)
  • the distance from the lower gear (72), the left gear (69), the right gear (70), the upper gear (71), and the lower gear (72) are just engaged with the cage (59).
  • the stepping motor (73) When the stepping motor (73) is working, it can drive the upper gear (71) to rotate, and the upper gear (71) drives the cage (59) to rotate. At the same time, the cage (59) drives the left gear (69) and the right gear.
  • the clamping plate (41) is an arc-shaped elongated structure as shown in FIGS. 5 and 6, due to the cage (59) and the workpiece ( 68)
  • the splint (41) may be blocked, so that the splint (41) is designed as an arc-shaped strip structure, which ensures that the splint (41) has a minimum area to ensure effective effect on the cage (59) and the workpiece (68).
  • the portion that is clamped and the workpiece (68) is clamped is processed by magnetorheological fluid.
  • the bottom of the working groove (10) has a large slope toward the right side, and the lower right corner has a threaded through hole that cooperates with the bolt (74).
  • the double-side polishing step of the double-sided polishing device for controlling the rigidity of the polishing pad using the cluster dynamic magnetic field is performed by double-sided polishing the square TFT-LCD glass substrate having a size of 100 mm ⁇ 100 mm:
  • a double-sided polishing device with a cluster dynamic magnetic field control polishing pad stiffness matching the workpiece size is selected, and a cylindrical shape with a diameter of 10 mm and a magnetic field strength of 3800 Gs is selected.
  • the magnet (47) is mounted in a double-sided polishing apparatus for controlling the rigidity of the polishing pad of the cluster dynamic magnetic field, and the rotating handle (8) is rotated so that the magnetic pole direction of the strip-shaped permanent magnet (25) is perpendicular to the square magnet (39), and the shape of the workpiece is prepared and a circular cage with a suitable thickness;
  • the cage (59) is made of acid-resistant and alkali-resistant plastic, the thickness of the cage (59) is about 2/3 of the thickness of the workpiece, and the modulus is the same as that of the left gear (69);
  • the TFT-LCD glass substrate is fixed by a holder (59) and placed in a matching hole in the middle of the circular holder, and placed between the clamping plates (41) in the working groove (10).
  • the cage (59) under gravity with the left gear (69), the right gear (70) and the lower gear (72) Engage, rotate the rotating handle (8) so that the magnetic pole direction of the strip-shaped permanent magnet (25) coincides with the magnetic pole direction of the square magnet (39), and the arched electric soft iron block (23) acts on the strip-shaped permanent magnet (25)
  • the rapid magnetization generates a suction-collecting square magnet (39), thereby generating a clamping force by pulling down the clamping plate (41) by the interaction of the hinge plate (40), the clamping plate (41), the fixed hinge (44), and the connecting rod (45). Clamping the TFT-LCD glass substrate and the fixed holder (59);
  • the translational linear motor (20) can also be adjusted to adjust the distance between the end face of the magnet mounting seat (46) and the front and rear sides of the working slot (10) to 10 mm, and the bolt (74) is loosened.
  • the magnetorheological fluid (42) exits the working tank (10).
  • the present embodiment is a double-side polishing method for a single-crystal silicon substrate having a diameter of 100 mm
  • the polishing method of the double-side polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field includes the following step:
  • a double-sided polishing device with a cluster dynamic magnetic field control polishing pad stiffness matching the workpiece size is selected, and a cylindrical shape with a diameter of 15 mm and a magnetic field strength of 4200 Gs is selected.
  • the magnet (47) is mounted in a double-sided polishing apparatus for controlling the rigidity of the polishing pad of the cluster dynamic magnetic field, and the rotating handle (8) is rotated so that the magnetic pole direction of the strip-shaped permanent magnet (25) is perpendicular to the square magnet (39), and the shape of the workpiece is prepared and a circular cage with a suitable thickness;
  • the cage (59) is made of acid and alkali corrosion resistant plastic, the thickness of the cage (59) is about 2/3 of the thickness of the workpiece, and the modulus is the same as that of the left gear (69);
  • the single crystal silicon substrate is fixed by a holder (59) and placed in a matching hole in the middle of the circular holder, and placed between the clamping plates (41) in the working groove (10).
  • the cage (59) is meshed with the left gear (69), the right gear (70) and the lower gear (72) under the action of gravity, and the rotating handle (8) is rotated to make the magnetic pole direction and the square shape of the strip permanent magnet (25)
  • the magnets (39) have the same magnetic pole direction, and the arched electric soft iron block (23) is rapidly magnetized by the strip-shaped permanent magnets (25) to generate a suction-collecting square magnet (39), thereby passing through the hinge plate (40) and the splint (41).
  • fixed hinge (44) the interaction of the connecting rod (45) pulls down the clamping plate (41) to generate a clamping force to clamp the single crystal silicon substrate and the fixed cage (59);
  • a sub-micron carbonyl iron powder having a concentration of 5% and a concentration of 3% are added to the deionized water.
  • the distance between the end face of the magnet mounting seat (46) and the front and rear sides of the working slot (10) is gradually increased from 1 mm to 5 mm by starting the translational linear motor (20), and the magnetorheological fluid is promoted.
  • the formed flexible polishing pad gradually decreases in rigidity, reduces the force applied to the workpiece (68), and completes the rough processing of the single crystal silicon substrate to the entire finishing process;
  • the translational linear motor (20) can also be adjusted to adjust the distance between the end face of the magnet mount (46) and the front and rear sides of the working slot (10) to 10 mm, and the bolt (74) is loosened.
  • the magnetorheological fluid (42) exits the working tank (10).
  • the present embodiment is a double-side polishing method for a single-crystal SiC substrate having a diameter of 100 mm
  • the polishing method of the double-side polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field includes the following step:
  • a double-sided polishing device with a cluster dynamic magnetic field control polishing pad stiffness matching the workpiece size is selected, and a cylindrical shape with a diameter of 15 mm and a magnetic field strength of 5200 Gs is selected.
  • the magnet (47) is mounted in a double-sided polishing apparatus for controlling the rigidity of the polishing pad of the cluster dynamic magnetic field, and the rotating handle (8) is rotated so that the magnetic pole direction of the strip-shaped permanent magnet (25) is perpendicular to the square magnet (39), and the shape of the workpiece is prepared and a circular cage with a suitable thickness;
  • the cage (59) is made of acid-resistant and alkali-resistant plastic, the thickness of the cage (59) is about 2/3 of the thickness of the workpiece, and the modulus is the same as that of the left gear (69);
  • the single crystal SiC substrate is fixed by a holder (59) and placed in a matching hole in the middle of the circular holder, and placed between the plates (41) in the working groove (10).
  • the cage (59) is meshed with the left gear (69), the right gear (70) and the lower gear (72) under the action of gravity, and the rotating handle (8) is rotated to make the magnetic pole direction and the square shape of the strip permanent magnet (25)
  • the magnets (39) have the same magnetic pole direction, and the arched electric soft iron block (23) is rapidly magnetized by the strip-shaped permanent magnets (25) to generate a suction-collecting square magnet (39), thereby passing through the hinge plate (40) and the splint (41).
  • the fixed hinge (44), the connecting rod (45) interaction pull-down clamping plate (41) generates clamping force to clamp the single crystal SiC substrate and the fixed cage (59);
  • the distance between the end faces of the magnet mounting seat (46) and the front and rear sides of the working slot (10) is gradually increased from 0.5 mm to 5 mm in 60 minutes by starting the translational linear motor (20), thereby promoting magnetorheological flow.
  • the flexible polishing pad formed by the liquid (42) gradually decreases in rigidity, reduces the force applied to the workpiece (68), and completes the rough processing of the single crystal SiC substrate to the entire finishing process;
  • the present embodiment is a double-side polishing of an electronic ceramic substrate having a diameter of 100 mm
  • the method for polishing the double-side polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field comprises the following steps:
  • variable-stiffness cluster magnetron waterfall double-sided polishing device matching the workpiece size is designed, and a cylindrical shape with a diameter of 15 mm and a magnetic field strength of 4200 Gs is selected.
  • the magnet (47) is mounted in a variable-stiffness cluster magnetron cascade flow double-side polishing device, and the rotating handle (8) is rotated so that the magnetic pole direction of the strip-shaped permanent magnet (25) is perpendicular to the square magnet (39), and the shape of the workpiece is prepared and a circular cage with a suitable thickness;
  • an epoxy resin is used to make a cage (59), the thickness of the cage (59) is about 2/3 of the thickness of the workpiece, and the modulus is the same as that of the left gear (69);
  • the electronic ceramic substrate is fixed by a holder (59) and placed in a matching hole in the middle of the circular holder, and placed between the clamping plates (41) in the working groove (10).
  • the cage (59) is meshed with the left gear (69), the right gear (70) and the lower gear (72) by gravity, and the rotating handle (8) is rotated to make the magnetic pole direction of the strip permanent magnet (25) and the square magnet (39)
  • the magnetic poles are in the same direction, and the arc-shaped electric soft iron block (23) is magnetized rapidly under the action of the strip-shaped permanent magnets (25) to generate a suction-collecting square magnet (39), thereby passing through the hinge plate (40) and the splint (41).
  • the interaction of the fixed hinge (44) and the connecting rod (45) pulls down the clamping plate (41) to generate a clamping force to clamp the electronic ceramic substrate and the fixed holder (59);
  • the distance between the end face of the magnet mounting seat (46) and the front and rear sides of the working slot (10) is gradually increased from 1.2 mm to 7 mm in 30 minutes by starting the translational linear motor (20), which promotes magnetorheological change.
  • the flexible polishing pad formed by the liquid (42) gradually decreases in rigidity, reduces the force applied to the workpiece (68), and completes the roughing process of the electronic ceramic substrate to the entire finishing process;
  • the double-sided polishing device for controlling the rigidity of the polishing pad by the cluster dynamic magnetic field of the present invention firstly utilizes the magnetization of the soft magnetic material, the characteristics of the demagnetization fast, and the intermediate magnetic field of the strip permanent magnet is extremely weak.
  • the extremely strong magnetic field at both ends realizes the rapid clamping of the workpiece in the closed space by the parallelogram clamping mechanism with the weak magnetic pole as the primer.
  • the invention innovatively adopts the magnetic pole staggered symmetrical structure to realize the polishing pad to the workpiece.
  • the pressure is balanced, and the yaw main shaft swing is realized by the eccentric cam structure, and the eccentric main shaft swing realizes the rotation of the eccentric cam shafts having the same eccentricity, thereby achieving the breakthrough of the plurality of tight arrays of the permanent magnets in synchronous rotation.
  • the static magnetic field lines of the magnetic pole surface are transformed into interactive dynamic magnetic lines, and the dynamic magnetic lines promote the dynamic distribution of the flexible polishing pad formed by the magnetorheological fluid to reduce the rigidity of the flexible polishing pad and promote the recovery of the performance of the flexible polishing pad;
  • the variable stiffness cluster magnetron polishing pad generates the distance between the end face of the mechanism and the surface of the workpiece, which can realize the whole process of rough polishing to fine polishing on both sides of the workpiece in one process.
  • the workpiece is realized by the combination of horizontal and vertical linear motors. Complex motion trajectory, avoiding the traditional machining process The relative speed between the different positions and the polishing pad is inconsistent, which causes an important problem of uneven processing of the workpiece.
  • the double-sided polishing device for controlling the rigidity of the polishing pad of the cluster dynamic magnetic field of the present invention is suitable for ordinary magnetorheological double-sided polishing and magnetic Flow change mechanical double-sided polishing, the required magnetorheological fluid only needs to be filled into a very small closed working area, which greatly saves the cost of consumables. It can be seen that the surface obtained by the invention has good surface consistency, high processing efficiency, no surface and sub-surface damage, and low cost, and is very suitable for planar high-efficiency ultra-smooth uniform polishing of large-diameter optical components.

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Abstract

一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法，通过调节柔性抛光垫刚度实现工件双面粗抛光到精抛光的全过程，并解决传统加工过程中工件不同位置与抛光垫之间的相对速度不一致而造成工件加工不均匀的问题。所述集群动态磁场控制抛光垫刚度的双面抛光装置包括：可变刚度集群磁控抛光垫发生机构，该机构包括对称设置的第一磁场发生块和第二磁场发生块；所述第一磁场发生块和第二磁场发生块均包括：壳体（11）、偏摆主轴（54）、偏心凸轮轴（51）、磁铁安装座（46）、永磁铁（47）和电机（60）；所述工件快速装夹机构包括工作槽（10）、夹板（41）、连杆（45）、铰板（40）、固定铰（44）、方形磁铁（39）、电工软铁块（23）、圆环形铸铁（24）和条形永磁铁（25）；所述工件运动驱动机构包括支撑块（2）、横梁（4）、水平直线电机（3）、垂直梁（22）和垂直直线电机（7）。

Description

一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法
本申请要求于2016年06月08日提交中国专利局、申请号为201610406771.X、发明名称为“一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法，特别适合于光电子/微电子半导体基片及光学元件的平面平坦化加工，属于超精密加工技术领域。
背景技术
以集成电路(IC)和光电子器件制造为代表的微电子和光电子制造是电子信息产业的核心，也是当今世界竞争最激烈、发展最迅速的产业。单晶硅(Si)、单晶锗(Ge)、砷化镓(GaAs)、单晶碳化硅(SiC)和蓝宝石(Al2O3)等作为集成电力电子器件和光电子器件的衬底材料，要求具有超平坦、超光滑(粗糙度Ra达到0.3nm以下)、无缺陷和无损伤表面，加工质量直接决定着其应用价值的高低和器件性能的优劣。同样，在光学领域，光学透镜和反射镜等作为光学器件的核心元件之一，要达到良好的光学性能，其表面精度需要达到超光滑程度(粗糙度Ra达到1nm以下)，面形精度也有较高的要求(形状精度达到0.5微米以下)。
目前，对光学平面元件和半导体基片的平坦化加工，主要还是采用传统的研磨、端面精密磨削、超精密抛光、化学机械抛光和磁流变抛光等。其中，磁流变抛光技术(Magnetorheological finishing,MRF)是20世纪90年代由KORDONSKI及其合作者将电磁学、流体动力学、分析化学、加工工艺学等相结合而提出的一种新型的光学表面加工方法，具有抛光效果好、不产生次表面损伤、适合复杂表面加工等传统抛光所不具备的优点，已发展成为一种革命性光学表面加工方法，特别适合轴对称非球面的超精密加工，广泛应用于大型光学元件、半导体晶片、LED基板、液晶显示面板等 的最后加工工序。但目前采用磁流变抛光方法对平面工件进行加工时，主要以美国QED公司研制的各种型号磁流变机床，其原理是把工件置于一圆弧形抛光盘上方，工件表面与抛光盘之间形成的凹形间隙，抛光盘下方布置一个磁感应强度可调的电磁铁磁极或者永磁体磁极使凹形间隙处形成高强度梯度磁场，磁流变液随抛光盘运动到工件与抛光盘形成的空隙附近时形成的柔性凸起“抛光缎带”，通过“抛光缎带”去除工件表面材料。在此基础上，国外学者还研发了球头磁流变加工技术(BEMRF，ball end magnetorheological finishing)、磁流变磨料流加工(MRAFF，magnetorheological abrasive flow finishing)和磁性复合流体抛光(MCF,magnetic compound fluid slurry polishing)等新技术，对光电晶体基片的超精密加工均取得了很好的加工效果。但上述方法均通过“抛光缎带”去除工件表面材料，“抛光缎带”与工件表面属于“斑点”局部接触，在加工平面工件时只能靠控制“斑点”沿工件表面按一定规律轨迹扫描才能实现整个表面的加工，轨迹扫描过程需要大量的时间，造成效率低、加工形状精度不易保证，而且目前的磁流变抛光加工报道仅局限于对工件进行单面加工。
发明内容
本发明实施例提供了一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法，通过调节柔性抛光垫刚度实现工件双面粗抛光到精抛光的全过程，同时解决传统加工过程中工件不同位置与抛光垫之间的相对速度不一致而造成工件加工不均匀的问题。
本发明实施例提供的一种集群动态磁场控制抛光垫刚度的双面抛光装置，包括：可变刚度集群磁控抛光垫发生机构、工件快速装夹机构和工件运动驱动机构；
所述可变刚度集群磁控抛光垫发生机构包括对称设置的第一磁场发生块和第二磁场发生块；所述第一磁场发生块和第二磁场发生块均包括：壳体、偏摆主轴、偏心凸轮轴、磁铁安装座、永磁铁和电机；
偶数个永磁铁一端安装在具有偶数阵列孔的磁铁安装座上，另一端安装于偏心凸轮轴的端面内；偏摆主轴的大端与偏心凸轮轴连接，偏摆主轴的轴端连接固定在壳体上；电机固定在壳体上，通过传动结构带动所述偏 摆主轴转动；
所述第一磁场发生块和第二磁场发生块在所述相向移动机构的带动下前后相向运动；
所述工件快速装夹机构包括工作槽、夹板、连杆、铰板、固定铰、方形磁铁、电工软铁块、圆环形铸铁和条形永磁铁；
所述工作槽设置于所述第一磁场发生块和第二磁场发生块之间，其中部形成一容置工件的加工空间；所述工作槽的两端均设有夹板，所述夹板的外侧面通过两条平行设置的连杆与所述工作槽的内壁活动连接；所述工作槽内壁、所述夹板和两条对应的所述连杆之间组成平行四边形；所述夹板两端面之间为圆环状结构伸入所述加工空间内夹持住所述工件，所述夹板一端与铰板的一端活动连接，所述铰板的另一端通过活动铰链与固定铰的一端连接；所述固定铰的另一端与安装有所述方形磁铁的方形防护套固定连接；两块电工软铁块设置在所述工作槽的两端，与两个所述方形磁铁匹配设置；所述电工软铁块通过黄铜连接一中间具有圆柱孔的长方体，圆柱孔内安装有所述圆环形铸铁，所述条形永磁铁安装于所述圆环形铸铁内；
所述工件运动驱动机构包括支撑块、横梁、水平直线电机、垂直梁和垂直直线电机；支撑块对称位于所述双面抛光装置的底座上方，上方安装有横梁的水平直线电机两端固定于支撑块的上方，所述横梁两端固定安装有垂直梁，所述垂直梁上安装有垂直直线电机，所述工作槽左右两侧面固定在所述垂直直线电机上。
可选地，所述相向移动机构包括：平动直线电机、精密双面齿条和两个精密单面齿条；
所述平动直线电机安装在所述底座上方，平动直线电机上安装有对称结构的精密双面齿条，精密双面齿条两侧分别通过齿轮与两个精密单面齿条啮合；两个所述精密单面齿通过前后方向的直线导轨安装于底座上，并分别布置于所述精密双面齿条的两侧；
所述第一磁场发生块和第二磁场发生块的壳体分别与所述精密双面齿条和两个所述精密单面齿条的连接。
可选地，所述传动结构包括小带轮、大带轮、小平键、大平键和V型带；
所述小带轮和大带轮分别通过小平键和大平键固定于所述电机的电机轴和所述偏摆主轴上，小带轮和大带轮之间通过所述V型带连接。
可选地，偏摆主轴的轴端轴承位置存在着主轴偏心距，偏心凸轮轴的小端轴承位置存在着凸轮轴偏心距，所述主轴偏心距和凸轮轴偏心距的数值相等，偏心方向相反。
可选地，所述永磁铁的磁场强度在1000Gs～5500Gs之间，方形磁铁的磁场强度在200Gs～1200Gs之间，条形永磁铁的磁场强度在2000Gs～4000Gs之间，安装于同一个所述磁铁安装座的圆柱形永磁铁相邻之间异极分布，安装在不同所述磁铁安装座的圆柱形永磁铁两两互相对应，且接近短磁极异向。
可选地，所述工件快速装夹机构还包括用于放置工件的圆形保持架，以及设置在所述保持架周围并与所述保持架的圆弧边相互啮合的左齿轮、右齿轮、上齿轮和下齿轮；
所述左齿轮、右齿轮、上齿轮和下齿轮安装在所述工作槽内，其中，所述左齿轮和所述右齿轮对称安装，所述上齿轮和所述下齿轮对称安装；
所述左齿轮、右齿轮、上齿轮和下齿轮中至少一个与步进电机连接。
本发明实施例提供的一种集群动态磁场控制抛光垫刚度的双面抛光方法，应用于上述的集群动态磁场控制抛光垫刚度的双面抛光装置，包括：
步骤一、根据工件的尺寸和材料性能，选取相应磁场强度的所述永磁铁，并调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁垂直；
步骤二、将工件放置于工作槽内并使工件边缘除于夹板之间，调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁磁极方向一致，电工软铁块在条形永磁铁作用下迅速磁化产生吸力吸紧方形磁铁，从而通过铰板、夹板、固定铰、连杆的相互作用下拉动夹板产生夹紧力夹紧所述工件；
步骤三、通过在去离子水中加入如下三种磨料中的至少两种磨料，三种磨料分别是浓度为3％～8％的微米级磨料、浓度为3％～10％的亚微米级磨料、浓度为2％～10％的纳米级磨料，及去离子水中加入浓度为5％～20％的亚微级羰基铁粉及浓度为5％～25％的微米级羰基铁粉，及加入浓度为3％～15％的分散剂和浓度为1％～6％的防锈剂，充分搅拌后通过超声波震动5～30分钟，然后选择性加入能与工件发生化学反应的浓度为1％～10％ 的化学液体，选择性加入能促成工件与化学液体反应速度的催化剂，再通过超声波震动2～10分钟，形成磁流变液；
步骤四、将所述磁流变液倒入工作槽内使磁流变液漫过工件，通过所述相向移动机构调节磁铁安装座端面到工作槽前后两侧的距离为0.5mm～10mm，磁流变液在形成阵列的所述永磁铁的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件的压力平衡；
步骤五、启动电机，带动偏摆主轴绕主轴偏心距偏心摆动，偏摆主轴的偏心摆动迫使各偏心凸轮轴与圆柱形永磁铁一起同步转动，使圆柱形永磁铁端面的静态磁力线转变为动态磁力线；
步骤六、启动水平直线电机和垂直直线电机带动工作槽和工件运动，使工件与磁流变液形成的柔性抛光垫形成预设轨迹的平面相对运动，磁流变液形成的柔性抛光垫同时对工件的两表面材料以及腐蚀层进行机械去除；
步骤七、在加工过程中通过所述相向移动机构调节磁铁安装座端面到工作槽前后两侧的距离逐渐变大，促使磁流变液形成的柔性抛光垫刚度进一步逐渐降低，降低施加于工件的作用力，完成工件粗加工到精加工全过程；
步骤八、停止所述水平直线电机、垂直直线电机和所述电机，调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁磁极方向相反，释放并取出工件。
可选地，所述工件为玻璃基板、单晶SiC基片、单晶Si基片、蓝宝石基片、多晶半导体基片、陶瓷基片或金属基片。
从以上技术方案可以看出，本发明实施例具有以下优点：
本发明集群动态磁场控制抛光垫刚度的双面抛光装置，首先通过巧妙地应用软磁性材料的磁化、退磁快的特性和条形永久磁铁中间磁场极弱而两端磁场极强的特性，实现了具有弱磁极作为引子的平行四边形装夹机构在密闭空间内对工件的快速装夹；
其次本发明创新地采用相向移动机构控制两侧磁场发生块与工件之间的距离相等，磁流变液进入到工作槽内时，形成双边压力均等且对磨粒行为约束和聚集作用的粘弹性磁流变效应抛光垫，保证工件双面抛光垫稳定 进行，并且创新地通过偏心凸轮结构实现偏摆主轴摆动，而偏心主轴的摆动实现了众多具有相同偏心距的偏心凸轮轴旋转，从而突破性地实现了众多紧密阵列排布的永磁铁在同步转动而使磁极端面的静态磁力线转变为交互的动态磁力线，动态磁力线促使磁流变液形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫性能的恢复；
加工过程中通过对称调节可变刚度集群磁控抛光垫发生机构端面与工件表面的距离，能很好地实现一次加工即可完成工件双面粗抛光到精抛光的全过程；采用水平和垂直直线电机组合的方式实现工件的复杂运动轨迹，避免了传统加工过程中工件不同位置与抛光垫之间的相对速度不一致而造成工件加工不均匀的重要问题；
同时，本发明的集群动态磁场控制抛光垫刚度的双面抛光装置适用于普通的磁流变双面抛光和磁流变化学机械双面抛光，所需的磁流变液只需填充到一个极小的密闭工作区域中，大大节省了耗材的成本。可见，采用本发明所获得的工件表面一致性好，加工效率高，而且无表面和亚表面损伤，而且成本低，非常适合大直径光学元件的平面高效率超光滑均匀抛光加工。
附图说明
图1为本发明实施例中一种集群动态磁场控制抛光垫刚度的双面抛光装置的正视图；
图2为图1俯视图的中A-A剖面结构示意图；
图3为图1俯视图的中B-B剖面结构示意图；
图4为本发明实施例中一种集群动态磁场控制抛光垫刚度的双面抛光装置的左视图；
图5为本发明实施例中一种集群动态磁场控制抛光垫刚度的双面抛光装置的正方形工件装夹示意图；
图6为为本发明实施例中一种集群动态磁场控制抛光垫刚度的双面抛光装置的圆形工件装夹示意图。
具体实施方式
本发明实施例提供了一种集群动态磁场控制抛光垫刚度的双面抛光装置及方法，通过调节柔性抛光垫刚度实现工件双面粗抛光到精抛光的全过程，用于解决传统加工过程中工件不同位置与抛光垫之间的相对速度不一致而造成工件加工不均匀的问题。
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例1：
如图1和图2所示，一种集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于包括可变刚度集群磁控抛光垫发生机构、工件快速装夹机构和工件运动驱动机构，可变刚度集群磁控抛光垫发生机构包括有底座(1)、螺钉二(12)、直线导轨(14)、螺钉三(15)、精密单面齿条(16)、齿轮(17)、齿轮轴(18)、深沟轴承(19)、精密双面齿条(21)、连接板一(63)、连接板二(64)、槽型端盖(9)、壳体(11)、螺钉四(28)、主轴偏心距(29)、滚动轴承(30)、V型带(31)、小带轮(32)、电机轴(33)、小平键(34)、轴承盖板(35)、轴承座板(36)、螺钉五(37)、螺钉六(38)、磁铁安装座(46)、圆柱形的永磁铁(47)、螺钉七(48)、隔套(49)、螺母(50)、偏心凸轮轴(51)、凸轮轴偏心距(52)、大带轮(53)、偏摆主轴(54)、大平键(55)、密封圈(56)、轴承端盖(57)、径向推力轴承(58)、电机(60)、螺钉八(61)、保护盖(62)、螺钉九(65)、深沟球轴承(66)，其中，如图3所示，平动直线电机(20)通过螺钉九(65)安装在底座(1)正上方，平动直线电机(20)上安装有对称结构的精密双面齿条(21)，精密双面齿条(21)两侧分别与两个通过深沟轴承(19)固定于齿轮轴(18)的齿轮(17)啮合，直线导轨(14)平行对称布置于平动直线电机(20)两侧，并通过螺钉三(15)固定于底座(1)上方，布置于直线导轨(14)上方的精密单面齿条(16)刚好与齿轮(17)啮合，如图2所示，圆柱形永磁铁(47)一端通过过盈配合安装于偏心凸轮轴(51)的端面圆柱孔内，具有偶数阵列孔的磁铁安装座(46)通过螺钉七(48)固定在轴承座板(36) 上，偏心凸轮轴(51)通过径向推力轴承(58)、隔套(49)、螺母(50)、轴承盖板(35)和螺钉五(37)固定在轴承座板(36)上，偏摆主轴(54)大端通过深沟球轴承(66)与偏心凸轮轴(51)连接，偏摆主轴(54)轴端通过滚动轴承(30)与壳体(11)连接并通过螺钉四(28)和轴承端盖(57)固定于壳体(11)上，壳体(11)通过螺钉六(38)固定于轴承座板(36)上，一个壳体(11)下方通过连接板一(63)与精密单面齿条(16)上方进行连接，另一壳体(11)通过连接板二(64)与精密双面齿条(21)上方链接，电机(60)通过螺钉八(61)固定在壳体(11)上侧面，小带轮(32)和大带轮(53)分别通过小平键(34)和大平键(55)固定于电机轴(33)和偏摆主轴(54)上，小带轮(32)和大带轮(53)之间通过V型带(31)连接，保护盖(62)通过螺钉二(12)固定在壳体(11)上，左齿轮(69)和右齿轮(70)对称安装在工作槽(10)内部左右两侧、上齿轮(71)安装在槽型端盖(9)内部正下侧并与步进电机(73)联接，下齿轮(72)安装在工作槽(10)内部下侧；工件快速装夹机构包括有工作槽(10)、方形磁铁(39)、铰板(40)、夹板(41)、防护套(43)、固定铰(44)、连杆(45)，电工软铁块(23)、圆环形铸铁(24)、条形永磁铁(25)、黄铜(26)、旋转把手(8)，其中连杆(45)一端通过活动铰链固定于工作槽(10)内壁，连杆(45)另一端通过活动铰链与夹板(41)侧面链接，工作槽(10)内壁、夹板(41)和两条连杆(45)之间组成平行四边形，两套平行四边形分别对称布置于工作槽(10)内壁两侧，夹板(41)一端通过活动铰链与铰板(40)联接，铰板(40)的另一端通过活动铰链与固定铰(44)链接，固定铰(44)另一端与方形防护套(43)焊接在一起，防护套(43)内安装有方形磁铁(39)，两块拱形电工软铁块(23)通过黄铜(26)连接一中间具有圆柱孔的长方体，圆柱孔内安装有圆环形铸铁(24)，安装有旋转把手(8)的条形永磁铁(25)安装于圆环形铸铁(24)内，电工软铁块(23)的平面固定于工作槽(10)的两端上侧；
如图1和图4所示，工件运动驱动机构包括有底座(1)、支撑块(2)、水平直线电机(3)、横梁(4)、肋板(5)、螺钉一(6)、垂直直线电机(7)、工作槽(10)、垂直梁(22)、螺钉十(67)，其中支撑块(2)对称位于底座(1)上方，上方安装有横梁(4)的水平直线电机(3)两端通过螺钉十 (67)固定于支撑块(2)上方，横梁(4)两端通过通过肋板(5)焊接固定有垂直梁(22)，垂直梁(22)上安装有垂直直线电机(7)，工作槽(10)左右两侧面固定在垂直直线电机(7)上。
所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于可变刚度集群磁控抛光垫发生机构的磁铁安装座(46)对称布置于工作槽(10)前后两侧，通过平动直线电机(20)可以同步调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离，保证两个磁铁安装座(46)到工作槽(10)的距离保持一致。
所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于偏摆主轴(54)的轴端轴承位置存在着主轴偏心距(29)，偏心凸轮轴(51)的小端轴承位置存在着凸轮轴偏心距(52)，主轴偏心距(29)和凸轮轴偏心距(52)的数值相等，电机(60)工作时通过小带轮(32)、大带轮(53)和V型带(31)带动偏摆主轴(54)绕主轴偏心距(29)偏心摆动，偏摆主轴(54)的偏心摆动迫使各偏心凸轮轴(51)与圆柱形永磁铁(47)一起同步转动，使圆柱形永磁铁(47)端面的静态磁力线转变为动态磁力线。
所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于圆柱形永磁铁(47)的磁场强度在1000Gs～5500Gs之间，方形磁铁(39)的磁场强度在200Gs～1200Gs之间，条形永磁铁(25)的磁场强度在2000Gs～4000Gs之间，安装于同一个磁铁安装座(46)的圆柱形永磁铁(47)相邻之间异极分布，安装在不同磁铁安装座(46)的圆柱形永磁铁(47)两两互相对应，且接近短磁极异向。
本实施例的集群动态磁场控制抛光垫刚度的双面抛光装置中，该工作槽(10)、铰板(40)、夹板(41)、固定铰(44)、连杆(45)、壳体(11)、轴承盖板(35)、轴承座板(36)、磁铁安装座(46)、隔套(49)、螺母(50)、偏心凸轮轴(51)、偏摆主轴(54)、槽型端盖(9)为不锈钢、镁铝合金和陶瓷等非导磁性材料，且工作槽(10)、铰板(40)、夹板(41)、固定铰(44)、连杆(45)、和槽型端盖(9)具有采用不锈钢材料制作。
本实施例的集群动态磁场控制抛光垫刚度的双面抛光装置中，左齿轮(69)、右齿轮(70)、上齿轮(71)、下齿轮(72)的参数相同，且左齿轮(69)与右齿轮(70)之间的距离刚好等于槽型端盖(9)安装好时上齿轮 (71)与下齿轮(72)的距离，左齿轮(69)、右齿轮(70)、上齿轮(71)、下齿轮(72)刚好能与保持架(59)相啮合。当步进电机(73)工作时，能带动上齿轮(71)转动，上齿轮(71)带动保持架(59)转动，与此同时，保持架(59)带动左齿轮(69)、右齿轮(70)和下齿轮(72)转动，从而在保持架(59)转动的同时带动工件(68)转动，实现了工件的自旋转运动，从而能使夹板(41)遮挡的部分也能被加工到，实现工件(68)的均等加工。
本实施例的集群动态磁场控制抛光垫刚度的双面抛光装置中，夹板(41)为可以为如图5和图6所示的圆弧状长条结构，由于保持架(59)和工件(68)可能会阻挡夹板(41)，因而将夹板(41)设计成圆弧状的长条结构，可以保证夹板(41)采用最小的面积保证对保持架(59)和工件(68)的有效夹紧，并且使工件(68)被夹紧之外的部分被磁流变液加工。
本实施例的集群动态磁场控制抛光垫刚度的双面抛光装置中，工作槽(10)下底面向右边具有较大的斜度，右下角具有与螺栓(74)配合的螺纹通孔。
实施例2：
采用所述的集群动态磁场控制抛光垫刚度的双面抛光装置的抛光方法对对尺寸为100mm×100mm的正方形TFT-LCD玻璃基板进行双面抛光垫步骤为：
1)根据TFT-LCD玻璃基板的尺寸和材料性能，设计与工件尺寸相匹配的集群动态磁场控制抛光垫刚度的双面抛光装置，选择直径为10mm高度为15mm、磁场强度为3800Gs的圆柱形永磁铁(47)安装于集群动态磁场控制抛光垫刚度的双面抛光装置内，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)垂直，制备与工件形状和厚度相适应的圆形保持架；
2)根据TFT-LCD玻璃基板的形状，选用耐酸碱腐蚀塑料制作保持架(59)，保持架(59)厚度约为工件厚度2/3，且模数与左齿轮(69)相同；
3)如图5所示，将TFT-LCD玻璃基板通过保持架(59)固定并放置于圆形保持架中间匹配的孔内，并放置于工作槽(10)内的夹板(41)之间，使保持架(59)在重力作用下与左齿轮(69)、右齿轮(70)和下齿轮 (72)啮合，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向一致，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生吸力吸紧方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下拉动夹板(41)产生夹紧力夹紧TFT-LCD玻璃基板和固定保持架(59)；
4)通过在去离子水中加入浓度为4％的微米级氧化铝磨料和浓度为3％的亚微米级氧化铝磨料，去离子水中加入浓度为8％的亚微级羰基铁粉及浓度为5％的微米级羰基铁粉，及加入浓度为5％的分散剂和浓度为2％的防锈剂，充分搅拌后通过超声波震动15分钟，然后加入能与TFT-LCD玻璃基板发生化学反应的浓度为3％的黄水，再通过超声波震动5分钟，形成磁流变液(42)；
5)将磁流变液(42)倒入工作槽(10)内使磁流变液漫过工件(68)，盖上槽型端盖(9)，启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为2mm，磁流变液(42)在阵列圆柱形永磁铁(47)的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件(68)的压力平衡；
6)开启步进电机(73)驱动上齿轮(71)转动并带动固定保持架(59)和工件(68)旋转，同时驱动电机(60)工作，在小带轮(32)、大带轮(53)和V型带(31)的作用下带动偏摆主轴(54)绕主轴偏心距(29)偏心摆动，偏摆主轴(54)的偏心摆动迫使各偏心凸轮轴(51)与圆柱形永磁铁(47)一起同步转动，使圆柱形永磁铁(47)端面的静态磁力线转变为动态磁力线，动态磁力线促使磁流变液(42)形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫性能的恢复磨料更新自锐；
7)盖上槽型端盖使上齿轮与圆形保持架啮合，启动步进电机带动圆形保持架和工件旋转，启动水平直线电机(3)和垂直直线电机(7)带动工作槽(10)和工件(68)实现阿基米德平面运动，从而TFT-LCD玻璃基板与磁流变液(42)形成的柔性抛光垫形成一个复杂的类瀑布流运动，TFT-LCD玻璃基板表面材料在黄水作用下迅速腐蚀，磁流变液(42)形成的柔性抛光垫实现对腐蚀层和TFT-LCD玻璃基板表面材料的机械去除；
8)加工过程中通过启动平动直线电机(20)调节磁铁安装座(46)端 面到工作槽(10)前后两侧的距离在60分钟内从2mm逐渐变大到10mm，促使磁流变液(42)形成的柔性抛光垫刚度逐渐降低，降低施加于工件(68)的作用力，完成TFT-LCD玻璃基板粗加工到精加工全过程；
9)停止水平直线电机(3)和垂直直线电机(7)，停止电机(60)和所述步进电机，取下槽型端盖，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向相反，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生排斥力推动方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下推动夹板(41)打开而释放TFT-LCD玻璃基板，取出加工完成的TFT-LCD玻璃基板。
10)在完成加工后，还可以启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为10mm，松开螺栓(74)，将已完成加工的磁流变液(42)排出工作槽(10)。
实施例3：
本实施例与实施例2的区别是：本实施例是对直径为100mm的单晶硅基片进行双面抛光，本发明集群动态磁场控制抛光垫刚度的双面抛光装置的抛光方法，包括如下步骤：
1)根据单晶硅基片的尺寸和材料性能，设计与工件尺寸相匹配的集群动态磁场控制抛光垫刚度的双面抛光装置，选择直径为15mm高度为15mm、磁场强度为4200Gs的圆柱形永磁铁(47)安装于集群动态磁场控制抛光垫刚度的双面抛光装置内，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)垂直，制备与工件形状和厚度相适应的圆形保持架；
2)根据单晶硅基片的形状，选用耐酸碱腐蚀塑料制作保持架(59)，保持架(59)厚度约为工件厚度2/3，且模数与左齿轮(69)相同；
3)如图6所示，将单晶硅基片通过保持架(59)固定并放置于圆形保持架中间匹配的孔内，并放置于工作槽(10)内的夹板(41)之间，使保持架(59)在重力作用下与左齿轮(69)、右齿轮(70)和下齿轮(72)啮合，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向一致，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生吸力吸紧方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰 (44)、连杆(45)的相互作用下拉动夹板(41)产生夹紧力夹紧单晶硅基片和固定保持架(59)；
4)通过在去离子水中加入浓度为3％的微米级氧化铈磨料和浓度为2％的纳米级金刚石磨料，去离子水中加入浓度为5％的亚微级羰基铁粉及浓度为3％的微米级羰基铁粉，及加入浓度为4％的分散剂和浓度为2％的防锈剂，充分搅拌后通过超声波震动10分钟，然后加入能与单晶硅基片发生化学反应的浓度为2％的酸性溶液，再通过超声波震动5分钟，形成磁流变液(42)；
5)将磁流变液(42)倒入工作槽(10)内使磁流变液漫过工件(68)，盖上槽型端盖(9)，启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为1mm，磁流变液(42)在阵列圆柱形永磁铁(47)的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件(68)的压力平衡；
6)开启步进电机(73)驱动上齿轮(71)转动并带动固定保持架(59)和工件(68)旋转，同时驱动电机(60)工作，在小带轮(32)、大带轮(53)和V型带(31)的作用下带动偏摆主轴(54)绕主轴偏心距(29)偏心摆动，偏摆主轴(54)的偏心摆动迫使各偏心凸轮轴(51)与圆柱形永磁铁(47)一起同步转动，使圆柱形永磁铁(47)端面的静态磁力线转变为动态磁力线，动态磁力线促使磁流变液(42)形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫性能的恢复和磨料更新自锐；
7)盖上槽型端盖使上齿轮与圆形保持架啮合，启动步进电机带动圆形保持架和工件旋转，启动水平直线电机(3)和垂直直线电机(7)带动工作槽(10)和工件(68)实现精密螺旋型平面运动，从而单晶硅基片与磁流变液(42)形成的柔性抛光垫形成一个复杂的类瀑布流运动，单晶硅基片表面材料在酸性溶液作用下迅速腐蚀，磁流变液(42)形成的柔性抛光垫实现对腐蚀层和单晶硅基片表面材料的机械去除；
8)加工过程中通过启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离在30分钟内从1mm逐渐变大到5mm，促使磁流变液(42)形成的柔性抛光垫刚度逐渐降低，降低施加于工件(68)的作用力，完成单晶硅基片粗加工到精加工全过程；
9)停止水平直线电机(3)和垂直直线电机(7)，停止电机(60)和所述步进电机，取下槽型端盖，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向相反，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生排斥力推动方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下推动夹板(41)打开而释放单晶硅基片，取出加工完成的单晶硅基片。
10)在加工完成后，还可以启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为10mm，松开螺栓(74)，将已完成加工的磁流变液(42)排出工作槽(10)。
实施例4：
本实施例与实施例2的区别是：本实施例是对直径为100mm的单晶SiC基片进行双面抛光，本发明集群动态磁场控制抛光垫刚度的双面抛光装置的抛光方法，包括如下步骤：
1)根据单晶SiC基片的尺寸和材料性能，设计与工件尺寸相匹配的集群动态磁场控制抛光垫刚度的双面抛光装置，选择直径为15mm高度为20mm、磁场强度为5200Gs的圆柱形永磁铁(47)安装于集群动态磁场控制抛光垫刚度的双面抛光装置内，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)垂直，制备与工件形状和厚度相适应的圆形保持架；
2)根据单晶SiC基片的形状，选用耐酸碱腐蚀塑料制作保持架(59)，保持架(59)厚度约为工件厚度2/3，且模数与左齿轮(69)相同；
3)如图6所示，将单晶SiC基片通过保持架(59)固定并放置于圆形保持架中间匹配的孔内，并放置于工作槽(10)内的夹板(41)之间，使保持架(59)在重力作用下与左齿轮(69)、右齿轮(70)和下齿轮(72)啮合，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向一致，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生吸力吸紧方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下拉动夹板(41)产生夹紧力夹紧单晶SiC基片和固定保持架(59)；
4)通过在去离子水中加入浓度为5％的微米级金刚石磨料和浓度为3％ 的纳米级金刚石磨料，去离子水中加入浓度为5％的亚微级羰基铁粉及浓度为2％的微米级羰基铁粉，及加入浓度为3％的分散剂和浓度为2％的防锈剂，充分搅拌后通过超声波震动10分钟，然后加入能与单晶SiC基片发生芬顿反应的三价铁离子，再通过超声波震动2分钟，形成磁流变液(42)；
5)上紧螺栓(74)，将磁流变液(42)倒入工作槽(10)内使磁流变液漫过工件(68)，盖上槽型端盖(9)，启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为0.5mm，磁流变液(42)在阵列圆柱形永磁铁(47)的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件(68)的压力平衡；
6)开启步进电机(73)驱动上齿轮(71)转动并带动固定保持架(59)和工件(68)旋转，同时驱动电机(60)工作，在小带轮(32)、大带轮(53)和V型带(31)的作用下带动偏摆主轴(54)绕主轴偏心距(29)偏心摆动，偏摆主轴(54)的偏心摆动迫使各偏心凸轮轴(51)与圆柱形永磁铁(47)一起同步转动，使圆柱形永磁铁(47)端面的静态磁力线转变为动态磁力线，动态磁力线促使磁流变液(42)形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫性能的恢复和磨料更新自锐；
7)盖上槽型端盖使上齿轮与圆形保持架啮合，启动步进电机带动圆形保持架和工件旋转，启动水平直线电机(3)和垂直直线电机(7)带动工作槽(10)和工件(68)实现预设轨迹的平面相对运动，从而单晶SiC基片与磁流变液(42)形成的柔性抛光垫形成一个复杂的类瀑布流运动，单晶SiC基片表面材料在三价铁离子的芬顿作用下迅速腐蚀，磁流变液(42)形成的柔性抛光垫实现对腐蚀层和单晶SiC基片表面材料的机械去除；
8)加工过程中通过启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离在60分钟内从0.5mm逐渐变大到5mm，促使磁流变液(42)形成的柔性抛光垫刚度逐渐降低，降低施加于工件(68)的作用力，完成单晶SiC基片粗加工到精加工全过程；
9)停止水平直线电机(3)和垂直直线电机(7)，停止电机(60)和所述步进电机，取下槽型端盖，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向相反，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生排斥力推动方形磁铁(39)，从而通过铰 板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下推动夹板(41)打开而释放单晶SiC基片，取出加工完成的单晶SiC基片。
10)在加工完成后，启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为10mm，松开螺栓(74)，将已完成加工的磁流变液(42)排出工作槽(10)。
实施例5：
本实施例与实施例2的区别是：本实施例是对直径为100mm的电子陶瓷基片进行双面抛光，该集群动态磁场控制抛光垫刚度的双面抛光装置的抛光方法，包括如下步骤：
1)根据电子陶瓷基片的尺寸和材料性能，设计与工件尺寸相匹配的可变刚度集群磁控瀑布流双面抛光装置，选择直径为15mm高度为15mm、磁场强度为4200Gs的的圆柱形永磁铁(47)安装于可变刚度集群磁控瀑布流双面抛光装置内，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)垂直，制备与工件形状和厚度相适应的圆形保持架；
2)根据电子陶瓷基片的形状，选用环氧树脂制作保持架(59)，保持架(59)厚度约为工件厚度2/3，且模数与左齿轮(69)相同；
3)如图6所示，将电子陶瓷基片通过保持架(59)固定并放置于圆形保持架中间匹配的孔内，并放置于工作槽(10)内的夹板(41)之间，使保持架(59)在重力作用下与左齿轮(69)、右齿轮(70)和下齿轮(72)啮合，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向一致，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生吸力吸紧方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下拉动夹板(41)产生夹紧力夹紧电子陶瓷基片和固定保持架(59)；
4)通过在去离子水中加入浓度为3％的微米碳化硅磨料和浓度为2％的纳米级碳化硅磨料，去离子水中加入浓度为5％的亚微级羰基铁粉及浓度为3％的微米级羰基铁粉，及加入浓度为4％的分散剂和浓度为2％的防锈剂，充分搅拌后通过超声波震动10分钟，形成磁流变液(42)；
5)上紧螺栓(74)，将磁流变液(42)倒入工作槽(10)内使磁流变液漫过工件(68)，盖上槽型端盖(9)，启动平动直线电机(20)调节磁铁 安装座(46)端面到工作槽(10)前后两侧的距离为1.2mm，磁流变液(42)在阵列圆柱形永磁铁(47)的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件(68)的压力平衡；
6)开启步进电机(73)驱动上齿轮(71)转动并带动固定保持架(59)和工件(68)旋转，同时驱动电机(60)工作，在小带轮(32)、大带轮(53)和V型带(31)的作用下带动偏摆主轴(54)绕主轴偏心距(29)偏心摆动，偏摆主轴(54)的偏心摆动迫使各偏心凸轮轴(51)与圆柱形永磁铁(47)一起同步转动，使圆柱形永磁铁(47)端面的静态磁力线转变为动态磁力线，动态磁力线促使磁流变液(42)形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫的性能恢复和磨料更新自锐；
7)盖上槽型端盖使上齿轮与圆形保持架啮合，启动步进电机带动圆形保持架和工件旋转，启动水平直线电机(3)和垂直直线电机(7)带动工作槽(10)和工件(68)实现精密螺旋型平面运动，从而电子陶瓷基片与磁流变液(42)形成的柔性抛光垫形成一个复杂的类瀑布流运动，磁流变液(42)形成的柔性抛光垫实现对电子陶瓷基片表面材料的机械去除；
8)加工过程中通过启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离在30分钟内从1.2mm逐渐变大到7mm，促使磁流变液(42)形成的柔性抛光垫刚度逐渐降低，降低施加于工件(68)的作用力，完成电子陶瓷基片粗加工到精加工全过程；
9)停止水平直线电机(3)和垂直直线电机(7)，停止电机(60)并停止步进电机(73)，打开上槽型端盖(9)，转动旋转把手(8)使条形永磁铁(25)的磁极方向与方形磁铁(39)磁极方向相反，拱形电工软铁块(23)在条形永磁铁(25)作用下迅速磁化产生排斥力推动方形磁铁(39)，从而通过铰板(40)、夹板(41)、固定铰(44)、连杆(45)的相互作用下推动夹板(41)打开而释放电子陶瓷基片，取出加工完成的电子陶瓷基片。
10)启动平动直线电机(20)调节磁铁安装座(46)端面到工作槽(10)前后两侧的距离为10mm，松开螺栓(74)，将已完成加工的磁流变液(42)排出工作槽(10)。
本发明的集群动态磁场控制抛光垫刚度的双面抛光装置，首先通过巧妙地应用软磁性材料的磁化、退磁快的特性和条形永久磁铁中间磁场极弱 而两端磁场极强的特性，实现了具有弱磁极作为引子的平行四边形装夹机构在密闭空间内对工件的快速装夹；其次本发明创新地采用磁极交错对称的结构实现抛光垫对工件的压力平衡，并且通过偏心凸轮结构实现偏摆主轴摆动，而偏心主轴的摆动实现了众多具有相同偏心距的偏心凸轮轴旋转，从而突破性地实现了众多紧密阵列排布的永磁铁在同步转动而使磁极端面的静态磁力线转变为交互的动态磁力线，动态磁力线促使磁流变液形成的柔性抛光垫动态分布而降低柔性抛光垫的刚度并促使柔性抛光垫性能的恢复；加工过程中通过对称调节可变刚度集群磁控抛光垫发生机构端面与工件表面的距离，能很好地实现一次加工即可完成工件双面粗抛光到精抛光的全过程；采用水平和垂直直线电机组合的方式实现工件的复杂运动轨迹，避免了传统加工过程中工件不同位置与抛光垫之间的相对速度不一致而造成工件加工不均匀的重要问题；同时，本发明的集群动态磁场控制抛光垫刚度的双面抛光装置适用于普通的磁流变双面抛光和磁流变化学机械双面抛光，所需的磁流变液只需填充到一个极小的密闭工作区域中，大大节省了耗材的成本。可见，采用本发明所获得的工件表面一致性好，加工效率高，而且无表面和亚表面损伤，而且成本低，非常适合大直径光学元件的平面高效率超光滑均匀抛光加工。
以上对本发明所提供的一种集群动态磁场控制抛光垫刚度的双面抛光装置和方法进行了详细介绍，对于本领域的一般技术人员，依据本发明实施例的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (8)

  1. 一种集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，包括：可变刚度集群磁控抛光垫发生机构、工件快速装夹机构和工件运动驱动机构；
    所述可变刚度集群磁控抛光垫发生机构包括对称设置的第一磁场发生块和第二磁场发生块；所述第一磁场发生块和第二磁场发生块均包括：壳体、偏摆主轴、偏心凸轮轴、磁铁安装座、永磁铁和电机；
    偶数个永磁铁一端安装在具有偶数阵列孔的磁铁安装座上，另一端安装于偏心凸轮轴的端面内；偏摆主轴的大端与偏心凸轮轴连接，偏摆主轴的轴端连接固定在壳体上；电机固定在壳体上，通过传动结构带动所述偏摆主轴转动；
    所述第一磁场发生块和第二磁场发生块在相向移动机构的带动下前后相向运动；
    所述工件快速装夹机构包括工作槽、夹板、连杆、铰板、固定铰、方形磁铁、电工软铁块、圆环形铸铁和条形永磁铁；
    所述工作槽设置于所述第一磁场发生块和第二磁场发生块之间，其中部形成一容置工件的加工空间；所述工作槽的两端均设有夹板，所述夹板的外侧面通过两条平行设置的连杆与所述工作槽的内壁活动连接；所述工作槽内壁、所述夹板和两条对应的所述连杆之间组成平行四边形；所述夹板两端面之间为圆环状结构伸入所述加工空间内夹持住所述工件，所述夹板一端与铰板的一端活动连接，所述铰板的另一端通过活动铰链与固定铰的一端连接；所述固定铰的另一端与安装有所述方形磁铁的方形防护套固定连接；两块电工软铁块设置在所述工作槽的两端，与两个所述方形磁铁匹配设置；所述电工软铁块通过黄铜连接一中间具有圆柱孔的长方体，圆柱孔内安装有所述圆环形铸铁，所述条形永磁铁安装于所述圆环形铸铁内；
    所述工件运动驱动机构包括支撑块、横梁、水平直线电机、垂直梁和垂直直线电机；支撑块对称位于所述双面抛光装置的底座上方，上方安装有横梁的水平直线电机两端固定于支撑块的上方，所述横梁两端固定安装有垂直梁，所述垂直梁上安装有垂直直线电机，所述工作槽左右两侧面固定在所述垂直直线电机上。
  2. 根据权利要求1所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，所述相向移动机构包括：平动直线电机、精密双面齿条和两个精密单面齿条；
    所述平动直线电机安装在所述底座上方，平动直线电机上安装有对称结构的精密双面齿条，精密双面齿条两侧分别通过齿轮与两个精密单面齿条啮合；两个所述精密单面齿通过前后方向的直线导轨安装于底座上，并分别布置于所述精密双面齿条的两侧；
    所述第一磁场发生块和第二磁场发生块的壳体分别与所述精密双面齿条和两个所述精密单面齿条连接。
  3. 根据权利要求1所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，所述传动结构包括小带轮、大带轮、小平键、大平键和V型带；
    所述小带轮和大带轮分别通过小平键和大平键固定于所述电机的电机轴和所述偏摆主轴上，小带轮和大带轮之间通过所述V型带连接。
  4. 根据权利要求1所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，偏摆主轴的轴端轴承位置存在着主轴偏心距，偏心凸轮轴的小端轴承位置存在着凸轮轴偏心距，所述主轴偏心距和凸轮轴偏心距的数值相等，偏心方向相反。
  5. 根据权利要求1所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，所述永磁铁的磁场强度在1000Gs～5500Gs之间，方形磁铁的磁场强度在200Gs～1200Gs之间，条形永磁铁的磁场强度在2000Gs～4000Gs之间，安装于同一个所述磁铁安装座的圆柱形永磁铁相邻之间异极分布，安装在不同所述磁铁安装座的圆柱形永磁铁两两互相对应，且接近短磁极异向。
  6. 根据权利要求1所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，所述工件快速装夹机构还包括用于放置工件的圆形保持架，以及设置在所述保持架周围并与所述保持架的圆弧边相互啮合的左齿轮、右齿轮、上齿轮和下齿轮；
    所述左齿轮、右齿轮、上齿轮和下齿轮安装在所述工作槽内，其中，所述左齿轮和所述右齿轮对称安装，所述上齿轮和所述下齿轮对称安装；
    所述左齿轮、右齿轮、上齿轮和下齿轮中至少一个与步进电机连接。
  7. 一种集群动态磁场控制抛光垫刚度的双面抛光方法，应用于如权利要求1至6中任一项所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，包括：
    步骤一、根据工件的尺寸和材料性能，选取相应磁场强度的所述永磁铁，并调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁垂直；
    步骤二、将工件放置于工作槽内并使工件边缘除于夹板之间，调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁磁极方向一致，电工软铁块在条形永磁铁作用下迅速磁化产生吸力吸紧方形磁铁，从而通过铰板、夹板、固定铰、连杆的相互作用下拉动夹板产生夹紧力夹紧所述工件；
    步骤三、通过在去离子水中加入如下三种磨料中的至少两种磨料，三种磨料分别是浓度为3％～8％的微米级磨料、浓度为3％～10％的亚微米级磨料、浓度为2％～10％的纳米级磨料，及去离子水中加入浓度为5％～20％的亚微级羰基铁粉及浓度为5％～25％的微米级羰基铁粉，及加入浓度为3％～15％的分散剂和浓度为1％～6％的防锈剂，充分搅拌后通过超声波震动5～30分钟，然后选择性加入能与工件发生化学反应的浓度为1％～10％的化学液体，选择性加入能促成工件与化学液体反应速度的催化剂，再通过超声波震动2～10分钟，形成磁流变液；
    步骤四、将所述磁流变液倒入工作槽内使磁流变液漫过工件，通过所述相向移动机构调节磁铁安装座端面到工作槽前后两侧的距离为0.5mm～10mm，磁流变液在形成阵列的所述永磁铁的作用下迅速固化为柔性抛光垫，磁极交错对称的结构实现抛光垫对工件的压力平衡；
    步骤五、启动电机，带动偏摆主轴绕主轴偏心距偏心摆动，偏摆主轴的偏心摆动迫使各偏心凸轮轴与圆柱形永磁铁一起同步转动，使圆柱形永磁铁端面的静态磁力线转变为动态磁力线；
    步骤六、启动水平直线电机和垂直直线电机带动工作槽和工件运动，使工件与磁流变液形成的柔性抛光垫形成预设轨迹的平面相对运动，磁流变液形成的柔性抛光垫同时对工件的两表面材料以及腐蚀层进行机械去除；
    步骤七、在加工过程中通过所述相向移动机构调节磁铁安装座端面到 工作槽前后两侧的距离逐渐变大，促使磁流变液形成的柔性抛光垫刚度进一步逐渐降低，降低施加于工件的作用力，完成工件粗加工到精加工全过程；
    步骤八、停止所述水平直线电机、垂直直线电机和所述电机，调节条形永磁铁的位置使条形永磁铁的磁极方向与方形磁铁磁极方向相反，释放并取出工件。
  8. 根据权利要求7所述的集群动态磁场控制抛光垫刚度的双面抛光装置，其特征在于，所述工件为玻璃基板、单晶SiC基片、单晶Si基片、蓝宝石基片、多晶半导体基片、陶瓷基片或金属基片。
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