WO2017209356A1 - Bidirectional conductive pin, bidirectional conductive pattern module and method for preparing same by means of high-precision processing technology - Google Patents

Bidirectional conductive pin, bidirectional conductive pattern module and method for preparing same by means of high-precision processing technology Download PDF

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Publication number
WO2017209356A1
WO2017209356A1 PCT/KR2016/012202 KR2016012202W WO2017209356A1 WO 2017209356 A1 WO2017209356 A1 WO 2017209356A1 KR 2016012202 W KR2016012202 W KR 2016012202W WO 2017209356 A1 WO2017209356 A1 WO 2017209356A1
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WO
WIPO (PCT)
Prior art keywords
pattern
contact portion
pin
lower contact
upper contact
Prior art date
Application number
PCT/KR2016/012202
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French (fr)
Korean (ko)
Inventor
문해중
이지형
이은주
Original Assignee
주식회사 이노글로벌
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Priority claimed from KR1020160134777A external-priority patent/KR20170137591A/en
Application filed by 주식회사 이노글로벌 filed Critical 주식회사 이노글로벌
Publication of WO2017209356A1 publication Critical patent/WO2017209356A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module using ultra-precision processing technology, and a manufacturing method thereof, and more particularly, to a bidirectional conductive pin and bidirectional conductive material, which can compensate for the disadvantages of a pogo-pin type semiconductor test socket. It relates to a pattern module and a method of manufacturing the same.
  • the semiconductor device After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor.
  • the positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device.
  • the semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.
  • the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated.
  • 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.
  • a conventional semiconductor test socket 100 includes a housing 110 having a through hole 111 formed in a vertical direction at a position corresponding to a terminal 131 of a semiconductor device 130; Pogo-pin 120 mounted in the through hole 111 of the housing 110 to electrically connect the terminal 131 of the semiconductor device 130 and the pad 141 of the test device 140. Is done.
  • the configuration of the pogo-pin (120) (pogo-pin) (120) is used as a pogo-pin (Pogo-pin) body, the barrel 124 having a cylindrical shape with an empty inside, and formed on the lower side of the barrel 124
  • the semiconductor device may be connected to a contact tip 123, a spring 122 connected to the contact tip 123 inside the barrel 124 and contracting and expanding a motion, and a spring 122 connected to the contact tip 123.
  • 130 is composed of a contact pin 121 to perform the vertical movement in accordance with the contact.
  • the spring 122 is contracted and expanded while absorbing the mechanical shock transmitted to the contact pin 121 and the contact tip 123, the terminal 131 of the semiconductor device 130 and the pad of the test device 140 141 is electrically connected to check whether there is an electrical defect.
  • the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.
  • the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.
  • the limited technology forms a perforated pattern in a vertical direction on a silicon main body made of an elastic silicon material, and then conductive powder inside the perforated pattern. It is a PCR socket type semiconductor test socket that fills the conductive pattern to form a conductive pattern.
  • the PCR-type semiconductor test socket also has a problem due to structural limitations of the PCR-type semiconductor test socket, such as a problem of shortening of life due to separation of conductive powder filled therein.
  • the present invention has been made to solve the above problems, to compensate for the shortcomings of the pogo-pin type and PCR-type semiconductor test socket, bi-directional conductivity that can replace the pogo-pin type semiconductor test socket
  • An object of the present invention is to provide a pin, a bidirectional conductive pattern module, and a method of manufacturing the same.
  • the bidirectional conductive pin in accordance with the present invention, the pin body of the insulating material, and the pin module is provided inside the pin body so that the upper and lower portions are respectively exposed to the upper surface and the lower surface of the pin body; ;
  • the pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body.
  • Each connecting portion is connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction, and connects the upper contact portion and the lower contact portion in the form of winding along the circumferential direction. Is achieved.
  • the object in the bidirectional conductive pattern module according to another embodiment of the present invention, includes an insulating body made of an insulating material and a plurality of pin modules arranged to be spaced apart from each other along the horizontal direction inside the insulating body.
  • Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body.
  • a lower contact portion exposed downward and at least one connection portion electrically connecting the upper contact portion and the lower contact portion inside the insulating body;
  • Each of the connecting portions may be connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction, and connect the upper contact portion and the lower contact portion in the form of winding along the circumferential direction. Is also achieved.
  • the above object is, according to another embodiment of the present invention, in the method of manufacturing a bidirectional conductive pattern module, (a) by patterning a thin plate having conductivity, and a plurality of upper contact patterns spaced apart from each other in the horizontal direction, and up and down A base having a plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the horizontal direction and spaced apart from each other in the horizontal direction, and at least one connection pattern connecting the upper contact patterns and the lower contact patterns at mutually corresponding positions; Forming a pattern; (b) plating the base pattern; and (c) rolling the upper and lower directions in an axial direction such that each of the upper contact pattern and each of the lower contact patterns has a cylindrical shape in an up and down direction.
  • the one upper contact portion and one lower contact portion corresponding to each other in the circumferential direction It may be connected to a different position so as to be patterned to connect the upper contact and the lower contact in the form of winding in the circumferential direction.
  • connection pattern may be formed diagonally between the upper contact pattern and the lower contact pattern to connect the upper contact pattern and the lower contact pattern corresponding to each other.
  • the upper contact pattern and the lower contact pattern corresponding to each other in the step (c) may be formed around the same axis in an up and down direction so that the upper contact part and the lower contact part are formed at a position corresponding to the up and down direction.
  • the upper contact pattern and the lower contact pattern corresponding to each other in the step (a) are formed to be deflected in the horizontal direction about the same axis;
  • the upper contact pattern and the lower contact pattern may be rolled in the same axial direction from opposite sides about the same axis to form the upper contact part and the lower contact part, respectively.
  • connection pattern may be connected to the connection pattern at a predetermined distance from the edge region opposite to the same axis of the upper contact pattern and the lower contact pattern.
  • One bidirectional conductive pin is also achieved by a method of manufacturing a bidirectional conductive pin, characterized in that consisting of one upper contact portion and one lower contact portion and a connecting portion connecting them.
  • the pin body of the insulating material, and the inside and the pin body so that the upper and lower portions are exposed to the upper surface and the lower surface of the pin body, respectively A pin module provided;
  • the pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body.
  • the exposed lower contact portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and electrically connects the upper contact portion and the intermediate support portion inside the pin body.
  • At least one first connecting portion and at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the pin body;
  • Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction;
  • Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction.
  • the insulating main body of the insulating material and a plurality of pin modules arranged in a state spaced apart from each other in the horizontal direction inside the insulating main body Includes;
  • Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body.
  • the lower contact portion exposed to the lower portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and the upper contact portion and the intermediate support portion inside the insulating body are electrically At least one first connecting portion connecting to the at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body;
  • Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction;
  • Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction. It is also achieved by the module.
  • the insulating main body of the insulating material and a plurality of pin modules arranged in a state spaced apart from each other along the horizontal direction inside the insulating main body It includes;
  • Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body.
  • the lower contact portion exposed to the lower portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and the upper contact portion and the intermediate support portion inside the insulating body are electrically At least one first connecting portion connecting to the at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body;
  • the first connection part is also achieved by the bidirectional conductive pattern module, wherein the upper contact part and the intermediate support part are connected in the vertical direction, and the second connection part connects the lower contact part and the intermediate support part in the vertical direction.
  • the connecting portion has a form wound in the circumferential direction in the vertical direction
  • the elasticity has a restoring force so that one bidirectional conductive pin can be implemented in the vertical direction.
  • the manufacturing method can be simplified and the manufacturing cost can be significantly reduced.
  • a semiconductor test in which a plurality of conductive patterns are formed in a horizontal direction and a depth direction by manufacturing a bidirectional conductive pattern module having a plurality of bidirectional conductive pins formed in a horizontal direction by simultaneously manufacturing a plurality of patterns in the horizontal direction and placing them in a depth direction. It is also possible to manufacture a socket for use.
  • 1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket
  • 4 to 8 are views for explaining the manufacturing method of the bidirectional conductive pattern module according to an embodiment of the present invention.
  • FIG. 9 is a view showing a bidirectional conductive pin according to an embodiment of the present invention.
  • FIGS. 10 to 13 are views showing various examples of the base pattern according to the present invention.
  • the present invention provides a bidirectional conductive pin, comprising: a pin body made of an insulating material, and a pin module provided inside the pin body such that upper and lower portions thereof are exposed to upper and lower surfaces of the pin body, respectively;
  • the pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body.
  • Each of the connecting portions may be connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction to connect the upper contact portion and the lower contact portion in a winding manner along the circumferential direction.
  • FIG. 4 to 8 are views for explaining the manufacturing method of the bidirectional conductive pattern module 100 according to an embodiment of the present invention.
  • a thin plate of conductive material for example, a metal thin plate is prepared, and the metal thin plate is patterned to form a base pattern 110a as shown in FIG. 4.
  • the metal thin plate may be provided with a material having conductivity, but the conductivity may be formed through a plating process to be described later, and the conductivity of the metal thin plate may not be essential.
  • the material of the metal sheet may be shaped as copper or a copper alloy, for example BeCu.
  • an etching method or a stamping method is applied as an example of the metal thin plate patterning method.
  • the base pattern 110a formed through the patterning process of the thin metal plate may include a plurality of upper contact patterns 11a, a plurality of lower contact patterns 12a, and corresponding upper contact patterns 11a. ) And a connection pattern 13a connecting the lower contact pattern 12a to each other.
  • FIG. 5 is a diagram illustrating an example of one upper contact pattern 11a, a lower contact pattern 12a, and a connection portion 13 connecting the upper contact pattern 11a and the lower contact pattern 12a. As shown in FIGS. 4 and 5, one or more connection patterns 13a connecting one upper contact pattern 11a and one lower contact pattern 12a may be formed. As an example, the connection pattern 13a connects the upper contact patterns 11a and the lower contact patterns 12a one by one.
  • the plurality of upper contact patterns 11a are formed to be spaced apart from each other in the horizontal direction.
  • the plurality of lower contact patterns 12a are formed to be spaced apart from each other in the horizontal direction while being spaced apart from the upper contact pattern 11a in the vertical direction.
  • the upper contact pattern 11a and the lower contact pattern 11a and the lower contact pattern 12a that is, the upper contact pattern 11a and the lower part connected by the connection pattern 13a, respectively.
  • the contact patterns 12a are formed to be deflected from each other in a horizontal direction about an axis to be described later.
  • each of the upper contact patterns 11a may have a base pattern 110a such that subsequent operations using the plurality of upper contact patterns 11a, the plurality of lower contact patterns 12a, and the connection pattern 13a may be simultaneously performed. And an upper support pattern 121 connected to the upper connection pattern 123, and a lower support pattern 122 connected to each of the lower contact patterns 12a and the lower connection pattern 124.
  • the plating process is performed to improve the conductivity of the base pattern 110a.
  • the nickel plating and gold plating are sequentially performed.
  • each upper contact pattern 11a and each lower contact pattern 12a have a cylindrical shape in the vertical direction (see T in FIG. 4).
  • a plurality of upper contact portions 11, a plurality of lower contact portions 12, and a connecting portion 13 connecting the upper contact portion 11 and the lower contact portion 12 corresponding to each other are formed.
  • connection part 13 is formed in a shape in which the connection pattern 13a is wound along the circumferential direction when the upper contact pattern 11a and the lower contact pattern 12a are curled.
  • connection pattern 13a is wound along the circumferential direction when the upper contact pattern 11a and the lower contact pattern 12a are curled.
  • one upper contact portion 11, one lower contact portion 12, and a connection portion 13 connecting the same form one pin module 10.
  • the upper contact pattern 11a and the lower contact pattern 12a corresponding to each other are formed to be deflected in the horizontal direction, and the connection pattern 13a is formed in the diagonal direction
  • the upper contact pattern 11a is curled from the left to the axis T direction around the axis T in the up and down direction
  • the lower contact pattern 12a is rolled from the right to the axis T direction from the right, so that the upper contact part 11 and the lower contact part It is taken as an example that (12) is formed.
  • the connecting portion 13 is connected to the upper contact portion 11 and the lower contact portion 12 in a circumferential direction at different positions, and the upper contact portion 11 and the lower contact portion 12 are wound in the circumferential direction. Will be connected.
  • the edge region opposite to the axis T of the upper contact pattern 11a and the lower contact pattern 12a may be connected to the connection pattern 13a at a constant spacing K. Can be.
  • the connecting patterns 13a on both sides of the edge contact each other. It is not formed and can be maintained at a predetermined interval.
  • the process of rolling the upper contact pattern 11a and the lower contact pattern 12a into a cylindrical shape is performed by using a fine mold.
  • the upper contact portion 11 may be formed by pressing both sides inward in the horizontal direction.
  • the upper contact portion 11 when the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 are formed, as shown in FIG. 7, the upper surface of each upper contact portion 11 and each lower contact portion 12.
  • the insulating body 110 is formed such that the lower surface of the bottom surface is exposed in the upper direction and the lower direction.
  • the base pattern 110a illustrated in FIG. 6 may be installed in a mold, and then the insulating body 110 may be formed by injecting and curing the liquid silicon. Through this, the upper surface of the upper contact portion 11 and the lower surface of the lower contact portion 12 are exposed to the outside of the insulating body 110, the remaining portion of the upper contact portion 11, of the lower contact portion 12 The remaining part and the connection part 13 are positioned inside the insulating body 110.
  • the upper connection pattern 123 and the lower connection pattern 124 are formed by laser cutting along the cutting lines C1 and C2 shown in FIG. 7.
  • the bidirectional conductive pattern module 100 as shown in FIG. 8 can be manufactured.
  • a plurality of pin modules 10 are formed in the insulating body 110 in a state in which they are spaced apart from each other in the horizontal direction.
  • one pin module 10 includes an upper contact portion 11, a lower contact portion 12, and a connection portion 13.
  • the configuration of the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 constituting the pin module 10 is as described above.
  • the semiconductor test socket having the plurality of conductive patterns in the horizontal direction and the depth direction can be configured.
  • FIGS. 10 to 13 illustrate examples of various types of base patterns 110a.
  • the technical idea according to the present invention is as described above, and various modifications and other modifications of the base pattern 110a illustrated in FIGS. 10 to 13 are also included in the technical idea of the present invention. That is, those skilled in the art will be able to manufacture the base pattern 110a according to various modifications within the scope of the technical idea of the present invention in addition to the embodiments illustrated in the present invention.
  • 14A is a diagram showing an example of a base pattern for manufacturing a bidirectional conductive pin according to another embodiment of the present invention.
  • the base pattern includes an upper contact pattern 11a ', a lower contact pattern 12a', an intermediate support pattern 15a ', a first connection pattern 13a', and a first pattern. 2 connection pattern 13a ''.
  • the upper contact pattern 11a ', the lower contact pattern 12a', the intermediate support pattern 15a ', the first connection pattern 13a', and the second connection pattern 13a '' are the embodiments described above. As can be formed through the patterning of the conductive thin plate, the detailed description thereof will be omitted.
  • a plate-shaped intermediate support pattern 15a ' is formed between the upper contact pattern 11a' and the lower contact pattern 12a ', and the intermediate support pattern 15a' and the upper portion are formed.
  • the first connection pattern 13a ' connects the contact pattern 11a' in the diagonal direction
  • the second support pattern 13a '' connects the intermediate support pattern 15a 'and the lower contact pattern 12a' in the diagonal direction. This will connect.
  • the base pattern is rolled around the same vertical axis, and thus the pin modules 11 ', 12', 13 ', 13' ', and 15' are formed, and the upper contact portion (
  • the insulating body 14 is formed of an insulating material, for example, silicon, between 11 ') and the lower contact portion 11', the bidirectional conductive pin 10 'as shown in FIG. It becomes possible to form.
  • the bidirectional conductive pin 10 ' is provided inside the pin body 14' such that the pin body 14 'of the insulating material and the upper and lower portions thereof are exposed to the upper and lower surfaces of the pin body 14', respectively.
  • the pin modules 11 ', 12', 13 ', 13' ', 15' are the upper contact portion 11 ', the upper part of which is exposed to the upper part of the pin body 14', and the lower part of the pin body 14 '. It includes a lower contact portion 12 'exposed to the bottom of the).
  • the pin modules 11 ', 12', 13 ', 13' ', 15' will include an intermediate support 15 'positioned between the upper contact 11' and the lower contact 12 ', The first connector 13 'electrically connects the upper contact 11' and the intermediate support 15 ', and the second connector 13' 'connects the lower contact 12' and the intermediate support 15 '. Electrical connection.
  • first connecting portion 13 ' is connected to the upper contact portion 11' and the intermediate support portion 15 'at different positions in the circumferential direction, as in the above-described embodiment, and the second connecting portion 13' '.
  • the lower contact 12 'and the intermediate support 15' are connected to mutually different positions in the circumferential direction.
  • a bidirectional conductive pattern module (not shown) including a bidirectional conductive pin 10 ′ according to the embodiment shown in FIG. 14 may also be formed through the same manufacturing process as in the above-described embodiment, and thus bidirectional In the manufacturing of the conductive pattern module, it may be possible to manufacture the bidirectional conductive pin 10 ′.
  • 15 and 16 are diagrams for describing the bidirectional conductive pin 200 according to still another embodiment of the present invention.
  • 15A is a diagram illustrating an example of a base pattern 200a for manufacturing the bidirectional conductive pin 200 according to another embodiment of the present invention.
  • the base pattern includes an upper contact pattern 210a, a lower contact pattern 220a, an intermediate support pattern 231a, a first connection pattern 232a, and a second connection pattern ( 233a).
  • the upper contact pattern 210a, the lower contact pattern 220a, the intermediate support pattern 231a, the first connection pattern 232a, and the second connection pattern 233a are the same as in the above-described embodiment. It can be formed through the patterning bar, the detailed description thereof will be omitted.
  • a plate-shaped intermediate support pattern 231a is formed between the upper contact pattern 210a and the lower contact pattern 231a, and the intermediate support pattern 231a and the upper contact pattern 210a are formed.
  • the first connection pattern 232a and the second connection pattern 233a are formed in a vertical direction. That is, the first connection pattern 232a connects the upper contact pattern 210a and the intermediate support pattern 231a in the vertical direction, and the second connection pattern 233a connects the lower contact pattern 210a and the intermediate contact pattern 220a. ) In the vertical direction.
  • the first connection pattern 232a and the second connection pattern 233a form the first connection part 232 and the second connection part 233
  • the first connection pattern 232a and the second connection pattern 233a are formed.
  • the first connection portion 232 connects the upper contact portion 210 and the intermediate support portion 231 in the vertical direction
  • the second connection portion 233 connects the lower contact portion 220 and the intermediate support portion 231 in the vertical direction.
  • the intermediate support pattern 231a is formed in the horizontal direction as illustrated in FIG. 15A, the intermediate support pattern 231a may be provided to have a Z shape as illustrated in FIG. 16. Of course it can.
  • the pin modules 210, 220, 231, 232, and 233 are formed, and an insulating property is formed between the upper contact portion 210 and the lower contact portion 220.
  • the insulating body 240 is formed of a material, for example, a silicon material, the bidirectional conductive pin 200 as shown in FIG. 15B can be formed.
  • a bidirectional conductive pattern module (not shown) including a bidirectional conductive pin 200 according to the embodiment shown in FIG. 15 may also be formed through the same manufacturing process as in the above-described embodiment, and thereby bidirectional conductive It will be possible to manufacture the bidirectional conductive pin 200 in the manufacturing process of the pattern module.
  • connection part 13a connection pattern
  • pin body 100 bidirectional conductive pattern module
  • insulating body 110a base pattern
  • the present invention can be applied to the inspection of the electrical performance or burn-in test in the manufacturing process of semiconductor devices, printed circuit boards, LCD displays and the like.

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method for preparing same. A bidirectional conductive pin, according to the present invention, comprises: a pin body formed from an insulating material; and a pin module provided inside the pin body such that the upper part and the lower part are exposed on the upper surface and the lower surface of the pin body, respectively. The pin module comprises: an upper contact portion which is cylindrical and of which the upper part is exposed on the upper part of the pin body; a lower contact portion which is cylindrical and of which the lower part is exposed on the lower part of the pin body; and at least one connecting portion which is for electrically connecting the upper contact portion and the lower contact portion inside the pin body. The connecting portion is connected to the upper contact portion and the lower contact portion at positions differing from each other in the circumferential direction and connects the upper contact portion and the lower contact portion in a wound form along the circumferential direction. Therefore, conductive thin metal plates are patterned, upper contact portion and lower contact portion are formed by winding the patterns by means of molding and the like, and connecting portions are wound in the circumferential direction and have a resilient restoring force in the vertical direction, and thus a vertical bidirectional conductive pin can be produced.

Description

초정밀 가공 기술을 이용한 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법Bi-directional conductive pins, bi-directional conductive pattern modules using ultra-precision processing technology and manufacturing method thereof
본 발명은 초정밀 가공 기술을 이용한 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법에 관한 것으로서, 보다 상세하게는 포고-핀 타입의 반도체 테스트 소켓이 갖는 단점을 보완할 수 있는 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법에 관한 것이다.The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module using ultra-precision processing technology, and a manufacturing method thereof, and more particularly, to a bidirectional conductive pin and bidirectional conductive material, which can compensate for the disadvantages of a pogo-pin type semiconductor test socket. It relates to a pattern module and a method of manufacturing the same.
반도체 소자는 제조 과정을 거친 후 전기적 성능의 양불을 판단하기 위한 검사를 수행하게 된다. 반도체 소자의 양불 검사는 반도체 소자의 단자와 전기적으로 접촉될 수 있도록 형성된 반도체 테스트 소켓(또는 콘텍터 또는 커넥터)을 반도체 소자와 검사회로기판 사이에 삽입한 상태에서 검사가 수행된다. 그리고, 반도체 테스트 소켓은 반도체 소자의 최종 양불 검사 외에도 반도체 소자의 제조 과정 중 번-인(Burn-In) 테스트 과정에서도 사용되고 있다.After the semiconductor device is manufactured, the semiconductor device performs a test to determine whether the electrical performance is poor. The positive test of the semiconductor device is performed by inserting a semiconductor test socket (or a contactor or a connector) formed between the semiconductor device and the test circuit board so as to be in electrical contact with a terminal of the semiconductor device. The semiconductor test socket is also used in a burn-in test process during the manufacturing process of the semiconductor device, in addition to the final positive inspection of the semiconductor device.
반도체 소자의 집적화 기술의 발달과 소형화 추세에 따라 반도체 소자의 단자 즉, 리드의 크기 및 간격도 미세화되는 추세이고, 그에 따라 테스트 소켓의 도전 패턴 상호간의 간격도 미세하게 형성하는 방법이 요구되고 있다.With the development and miniaturization of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads, are also miniaturized. Accordingly, there is a demand for a method of forming minute spacing between conductive patterns of test sockets.
그런데, 기존의 포고-핀(Pogo-pin) 타입의 반도체 테스트 소켓으로는 집적화되는 반도체 소자를 테스트하기 위한 반도체 테스트 소켓을 제작하는데 한계가 있었다. 도 1 내지 도 3은 한국공개특허 제10-2011-0065047호에 개시된 종래의 포고-핀(Pogo-pin) 타입의 반도체 테스트 소켓의 예를 나타낸 도면이다.However, the conventional Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing a semiconductor device to be integrated. 1 to 3 are diagrams showing an example of a conventional Pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.
도 1 내지 도 3을 참조하여 설명하면 기존이 반도체 테스트 소켓(100)은 반도체 디바이스(130)의 단자(131)와 대응되는 위치에 상하방향으로 관통공(111)이 형성된 하우징(110)과, 하우징(110)의 관통공(111) 내에 장착되어 반도체 디바이스(130)의 단자(131) 및 테스트 장치(140)의 패드(141)를 전기적으로 연결시키는 포고-핀(Pogo-pin)(120)으로 이루어진다.1 to 3, a conventional semiconductor test socket 100 includes a housing 110 having a through hole 111 formed in a vertical direction at a position corresponding to a terminal 131 of a semiconductor device 130; Pogo-pin 120 mounted in the through hole 111 of the housing 110 to electrically connect the terminal 131 of the semiconductor device 130 and the pad 141 of the test device 140. Is done.
포고-핀(Pogo-pin)(120)의 구성은, 포고-핀(Pogo-pin) 본체로 사용되며 내부가 비어있는 원통형 형태를 가지는 배럴(124)과, 배럴(124)의 하측에 형성되는 접촉팁(123)과, 배럴(124) 내부에서 접촉팁(123)과 연결되어 수축과 팽창 운동을 하는 스프링(122) 및 접촉팁(123)과 연결된 스프링(122) 반대편에 연결되어 반도체 디바이스(130)와의 접촉에 따라 상하운동을 수행하는 접촉핀(121)으로 구성된다.The configuration of the pogo-pin (120) (pogo-pin) (120) is used as a pogo-pin (Pogo-pin) body, the barrel 124 having a cylindrical shape with an empty inside, and formed on the lower side of the barrel 124 The semiconductor device may be connected to a contact tip 123, a spring 122 connected to the contact tip 123 inside the barrel 124 and contracting and expanding a motion, and a spring 122 connected to the contact tip 123. 130 is composed of a contact pin 121 to perform the vertical movement in accordance with the contact.
이때, 스프링(122)은 수축 및 팽창을 하면서 접촉핀(121)과 접촉팁(123)에 전달되는 기계적인 충격을 흡수하면서 반도체 디바이스(130)의 단자(131)와 테스트 장치(140)의 패드(141)를 전기적으로 접속시켜 전기적인 불량여부를 검사하게 한다.At this time, the spring 122 is contracted and expanded while absorbing the mechanical shock transmitted to the contact pin 121 and the contact tip 123, the terminal 131 of the semiconductor device 130 and the pad of the test device 140 141 is electrically connected to check whether there is an electrical defect.
그런데, 상기와 같은 기존의 포고-핀(Pogo-pin) 타입의 반도체 테스트 소켓은 상하 방향으로의 탄성을 유지하기 위해 물리적인 스프링을 사용하게 되고, 배럴 내부에 스프링과 핀을 삽입하고, 배럴을 다시 하우징의 관통공 내부에 삽입하여야 하므로 그 공정이 복잡할 뿐만 아니라 공정의 복잡성으로 인해 제조 가격이 상승하는 문제가 있다.However, the conventional Pogo-pin type semiconductor test socket as described above uses a physical spring to maintain elasticity in the vertical direction, inserts the spring and the pin into the barrel, and Since the process has to be inserted into the through-hole of the housing again, the process is complicated and the manufacturing cost increases due to the complexity of the process.
뿐만 아니라, 상하 방향으로 탄성을 갖는 전기적 접촉 구조의 구현을 위한 물리적인 구성 자체가 미세 피치를 구현하는데 한계가 있으며, 근래에 집적화된 반도체 소자에는 적용하는데 이미 한계치까지 도달해 있는 실정이다.In addition, the physical configuration itself for the implementation of the electrical contact structure having elasticity in the vertical direction has a limit to implement the fine pitch, and the situation has already reached the limit to apply to the integrated semiconductor device in recent years.
포고-핀(Pogo-pin) 타입의 반도체 소자의 한계를 극복하고자 제한된 기술이, 탄성 재질의 실리콘 소재로 제작되는 실리콘 본체 상에 수직 방향으로 타공 패턴을 형성한 후, 타공된 패턴 내부에 도전성 분말을 충진하여 도전 패턴을 형성하는 PCR 소켓 타입의 반도체 테스트 소켓이다.In order to overcome the limitations of the pogo-pin type semiconductor device, the limited technology forms a perforated pattern in a vertical direction on a silicon main body made of an elastic silicon material, and then conductive powder inside the perforated pattern. It is a PCR socket type semiconductor test socket that fills the conductive pattern to form a conductive pattern.
그러나, PCR 타입의 반도체 테스트 소켓은 내부에 충진되는 도전성 분말의 이탈로 인한 수명의 단축 문제 등과 같이 PCR 타입의 반도체 테스트 소켓의 구조적 한계로 인해 갖는 문제점 또한 가지고 있다.However, the PCR-type semiconductor test socket also has a problem due to structural limitations of the PCR-type semiconductor test socket, such as a problem of shortening of life due to separation of conductive powder filled therein.
따라서, 미세 피치의 구현이 가능하면서도 높이의 제한이나 PCR 타입의 반도체 테스트 소켓과 같은 다른 방식의 반도체 테스트 소켓이 갖는 문제점을 해소할 후 있는 다른 형태의 반도체 테스트 소켓의 개발이 요구되고 있다.Accordingly, there is a need for development of other types of semiconductor test sockets capable of realizing fine pitches, but also to solve the problems of height limitations and other types of semiconductor test sockets such as PCR type semiconductor test sockets.
이에, 본 발명은 상기와 같은 문제점을 해소하기 위해 안출된 것으로서, 포고-핀 타입과 PCR 타입의 반도체 테스트 소켓이 갖는 단점을 보완하여, 포고-핀 타입의 반도체 테스트 소켓을 대체할 수 있는 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법을 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, to compensate for the shortcomings of the pogo-pin type and PCR-type semiconductor test socket, bi-directional conductivity that can replace the pogo-pin type semiconductor test socket An object of the present invention is to provide a pin, a bidirectional conductive pattern module, and a method of manufacturing the same.
상기 목적은 본 발명에 따라, 양방향 도전성 핀에 있어서, 절연성 재질의 핀 본체와, 상부 및 하부가 각각 상기 핀 본체의 상부 표면 및 하부 표면에 노출되도록 상기 핀 본체 내부에 마련되는 핀 모듈을 포함하고; 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 핀 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 핀 본체의 하부로 노출되는 하부 접촉부와, 상기 핀 본체의 내부에서 상기 상부 접촉부와 상기 하부 접척부를 전기적으로 연결하는 적어도 하나의 연결부를 포함하며; 각각의 상기 연결부는 상기 상부 접촉부와 상기 하부 접촉부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 것을 특징으로 하는 양방향 도전성 핀에 의해서 달성된다.According to the present invention, the bidirectional conductive pin, in accordance with the present invention, the pin body of the insulating material, and the pin module is provided inside the pin body so that the upper and lower portions are respectively exposed to the upper surface and the lower surface of the pin body; ; The pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body. An exposed lower contact portion and at least one connecting portion electrically connecting the upper contact portion and the lower contact portion inside the pin body; Each connecting portion is connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction, and connects the upper contact portion and the lower contact portion in the form of winding along the circumferential direction. Is achieved.
한편, 상기 목적은 본 발명의 다른 실시 형태에 따라 양방향 도전성 패턴 모듈에 있어서, 절연성 재질의 절연성 본체와, 상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며; 각각의 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와, 상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 하부 접척부를 전기적으로 연결하는 적어도 하나의 연결부를 포함하며; 각각의 상기 연결부는 상기 상부 접촉부와 상기 하부 접촉부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈에 의해서도 달성된다.In the bidirectional conductive pattern module according to another embodiment of the present invention, the object includes an insulating body made of an insulating material and a plurality of pin modules arranged to be spaced apart from each other along the horizontal direction inside the insulating body. To; Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body. A lower contact portion exposed downward and at least one connection portion electrically connecting the upper contact portion and the lower contact portion inside the insulating body; Each of the connecting portions may be connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction, and connect the upper contact portion and the lower contact portion in the form of winding along the circumferential direction. Is also achieved.
한편, 상기 목적은 본 발명의 또 다른 실시 형태에 따라, 양방향 도전성 패턴 모듈의 제조방법에 있어서, (a) 도전성을 갖는 박판을 패터닝하여, 가로 방향을 상호 이격된 복수의 상부 접촉 패턴과, 상하 방향으로 복수의 상기 상부 접촉 패턴과 이격되고 상기 가로 방향으로 상호 이격된 복수의 하부 접촉 패턴과, 상호 대응하는 위치의 상기 상부 접촉 패턴과 상기 하부 접촉 패턴을 연결하는 적어도 하나의 연결 패턴을 갖는 베이스 패턴을 형성하는 단계와, (b) 상기 베이스 패턴을 도금하는 단계와, (c) 각각의 상기 상부 접촉 패턴과 각각의 상기 하부 접촉 패턴이 상하 방향으로 원통 형상을 갖도록 상하 방향을 축으로 말아 복수의 상부 접촉부, 복수의 하부 접촉부 및 상호 대응하는 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 연결부를 형성하는 단계와 - 상기 연결부는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴이 말릴 때 상기 연결 패턴이 원주 방향을 따라 감기는 형태로 변형되어 형성됨, (d) 복수의 상기 상부 접촉부의 상부 표면과, 복수의 상기 하부 접촉부의 하부 표면이 각각 상부 방향 및 하부 방향으로 노출된 상태로 상기 연결부가 내부에 수용되도록 절연성 본체를 형성하는 단계를 포함하는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법에 의해서도 달성된다.On the other hand, the above object is, according to another embodiment of the present invention, in the method of manufacturing a bidirectional conductive pattern module, (a) by patterning a thin plate having conductivity, and a plurality of upper contact patterns spaced apart from each other in the horizontal direction, and up and down A base having a plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the horizontal direction and spaced apart from each other in the horizontal direction, and at least one connection pattern connecting the upper contact patterns and the lower contact patterns at mutually corresponding positions; Forming a pattern; (b) plating the base pattern; and (c) rolling the upper and lower directions in an axial direction such that each of the upper contact pattern and each of the lower contact patterns has a cylindrical shape in an up and down direction. An upper contact portion, a plurality of lower contact portions, and a connection portion connecting the upper contact portion and the lower contact portion corresponding to each other; And the connecting portion is formed by deforming the connecting pattern in a circumferential direction when the upper contact pattern and the lower contact pattern are curled, (d) a plurality of upper surfaces of the upper contact portion, and It is also achieved by a method of manufacturing a bidirectional conductive pattern module comprising the step of forming an insulating body so that the connecting portion is received therein with the lower surfaces of the lower contact portions exposed in the upper and lower directions, respectively.
여기서, 상기 (a) 단계에서 상기 연결부는 상기 (c) 단계에서 복수의 상기 상부 접촉부 및 복수의 상기 하부 접촉부가 형성될 때, 상호 대응하는 하나의 상기 상부 접촉부와 하나의 상기 하부 접촉부에 원주 방향으로 상이한 위치에 연결되어, 원주 방향으로 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하도록 패터닝될 수 있다.Here, in the step (a), when the plurality of the upper contact portion and the plurality of the lower contact portion are formed in the step (c), the one upper contact portion and one lower contact portion corresponding to each other in the circumferential direction It may be connected to a different position so as to be patterned to connect the upper contact and the lower contact in the form of winding in the circumferential direction.
또한, 상기 (a) 단계에서 상기 연결 패턴은 상기 상부 접촉 패턴과 상기 하부 접촉 패턴 사이에서 대각선 방향으로 형성되어 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴을 연결할 수 있다.In addition, in the step (a), the connection pattern may be formed diagonally between the upper contact pattern and the lower contact pattern to connect the upper contact pattern and the lower contact pattern corresponding to each other.
그리고, 상기 (c) 단계에서 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴은 상하 방향으로 동일 축을 중심으로 말려 상하 방향으로 대응하는 위치에 상기 상부 접촉부와 상기 하부 접촉부가 형성될 수 있다.In addition, the upper contact pattern and the lower contact pattern corresponding to each other in the step (c) may be formed around the same axis in an up and down direction so that the upper contact part and the lower contact part are formed at a position corresponding to the up and down direction.
또한, 상기 (a) 단계에서 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴은 상기 동일 축을 중심으로 상기 가로 방향으로 편향되게 형성되고; 상기 (c) 단계에서 상기 상부 접촉 패턴 및 상기 하부 접촉 패턴은 상기 동일 축을 중심으로 반대 측으로부터 상기 동일 축 방향으로 말려와 각각 상기 상부 접촉부 및 상기 하부 접촉부를 형성할 수 있다.In addition, the upper contact pattern and the lower contact pattern corresponding to each other in the step (a) are formed to be deflected in the horizontal direction about the same axis; In the step (c), the upper contact pattern and the lower contact pattern may be rolled in the same axial direction from opposite sides about the same axis to form the upper contact part and the lower contact part, respectively.
그리고, 상기 (a) 단계에서 상기 상부 접촉 패턴과 상기 하부 접촉 패턴의 상기 동일 축의 반대측 가장자리 영역으로부터 일정 간격을 두고 상기 연결 패턴과 연결될 수 있다.In addition, in the step (a), the connection pattern may be connected to the connection pattern at a predetermined distance from the edge region opposite to the same axis of the upper contact pattern and the lower contact pattern.
한편, 상기 목적은 본 발명의 다른 실시 형태에 따라, 상기의 양방향 도전성 패턴 모듈의 제조방법에 따라 양방향 도전성 패턴 모듈을 제조하는 단계와, 상기 양방향 도전성 패턴 모듈의 절연성 본체를 상하 방향으로 절단하여 복수의 양방향 도전성 핀을 형성하는 단계를 포함하며; 하나의 상기 양방향 도전성 핀은 하나의 상부 접촉부 및 하나의 하부 접촉부와 이를 연결하는 연결부로 구성되는 것을 특징으로 하는 양방향 도전성 핀의 제조방법에 의해서도 달성된다.On the other hand, according to another embodiment of the present invention, the step of manufacturing the bidirectional conductive pattern module according to the manufacturing method of the bidirectional conductive pattern module, and by cutting the insulating main body of the bidirectional conductive pattern module in the vertical direction a plurality of Forming a bidirectional conductive pin of; One bidirectional conductive pin is also achieved by a method of manufacturing a bidirectional conductive pin, characterized in that consisting of one upper contact portion and one lower contact portion and a connecting portion connecting them.
한편, 상기 목적은 본 발명의 또 다른 실시 형태에 따라, 양방향 도전성 핀에 있어서, 절연성 재질의 핀 본체와, 상부 및 하부가 각각 상기 핀 본체의 상부 표면 및 하부 표면에 노출되도록 상기 핀 본체 내부에 마련되는 핀 모듈을 포함하고; 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 핀 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 핀 본체의 하부로 노출되는 하부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와, 상기 핀 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와, 상기 핀 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며; 각각의 상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 중간 지지부를 연결하고; 각각의 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 하부 접촉부와 상기 중간 지지부를 연결하는 것을 특징으로 하는 양방향 도전성 핀에 의해서도 달성된다.On the other hand, according to another embodiment of the present invention, in the bi-directional conductive pin, the pin body of the insulating material, and the inside and the pin body so that the upper and lower portions are exposed to the upper surface and the lower surface of the pin body, respectively A pin module provided; The pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body. The exposed lower contact portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and electrically connects the upper contact portion and the intermediate support portion inside the pin body. At least one first connecting portion and at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the pin body; Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction; Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction. It is also achieved by
한편, 상기 목적은 본 발명의 다른 실시 형태에 따라, 양방향 도전성 패턴 모듈에 있어서, 절연성 재질의 절연성 본체와, 상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며; 각각의 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와, 상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와, 상기 절연성 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며; 각각의 상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 중간 지지부를 연결하고; 각각의 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 하부 접촉부와 상기 중간 지지부를 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈에 의해서도 달성된다.On the other hand, according to another embodiment of the present invention, in the bidirectional conductive pattern module, the insulating main body of the insulating material and a plurality of pin modules arranged in a state spaced apart from each other in the horizontal direction inside the insulating main body Includes; Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body. The lower contact portion exposed to the lower portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and the upper contact portion and the intermediate support portion inside the insulating body are electrically At least one first connecting portion connecting to the at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body; Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction; Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction. It is also achieved by the module.
한편, 상기 목적은 본 발명의 또 다른 실시 형태에 따라, 양방향 도전성 패턴 모듈에 있어서, 절연성 재질의 절연성 본체와, 상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며; 각각의 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와, 상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와, 상기 절연성 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며; 상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부를 수직 방향으로 연결하고, 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부를 수직 방향으로 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈에 의해서도 달성된다.On the other hand, according to another embodiment of the present invention, in the bidirectional conductive pattern module, the insulating main body of the insulating material and a plurality of pin modules arranged in a state spaced apart from each other along the horizontal direction inside the insulating main body It includes; Each of the pin modules may be formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion of which an upper portion is exposed to an upper portion of the insulating body, and a thin conductive plate formed into a cylindrical shape, and a lower portion of the insulating body. The lower contact portion exposed to the lower portion, the conductive thin plate is rolled into a cylindrical shape, the intermediate support portion located between the upper contact portion and the lower contact portion, and the upper contact portion and the intermediate support portion inside the insulating body are electrically At least one first connecting portion connecting to the at least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body; The first connection part is also achieved by the bidirectional conductive pattern module, wherein the upper contact part and the intermediate support part are connected in the vertical direction, and the second connection part connects the lower contact part and the intermediate support part in the vertical direction.
상기와 같은 구성에 따라 본 발명에 따르면, 도전성을 갖는 금속 박판을 패터닝하고, 금형 등의 방법을 패턴을 말아 상부 접촉부 및 하부 접촉부를 형성하고, 연결부가 원주 방향으로 감기는 형태를 가져 상하 방향으로 탄성적으로 복원력을 가지게 되어 상하 방향으로 하나의 양방향 도전성 핀이 구현 가능하게 된다.According to the present invention according to the configuration as described above, by patterning a metal thin plate with conductivity, and rolled the pattern using a method such as a mold to form an upper contact portion and a lower contact portion, the connecting portion has a form wound in the circumferential direction in the vertical direction The elasticity has a restoring force so that one bidirectional conductive pin can be implemented in the vertical direction.
또한, 금속 박판을 에칭이나 스탬핑 방법을 이용해 가공하고, 금형 등으로 원통 형상으로 말아 제조함으로써, 그 제조방법이 간소화될 뿐만 아니라 제조비용 또한 현저히 감소시킬 수 있게 된다.In addition, by processing the thin metal sheet using an etching or stamping method, and rolled into a cylindrical shape with a metal mold or the like, the manufacturing method can be simplified and the manufacturing cost can be significantly reduced.
또한, 가로 방향으로 복수개의 패턴을 동시에 제조하여 가로 방향으로 복수의 양방향 도전성 핀이 형성된 양방향 도전성 패턴 모듈을 제조하고, 이들을 깊이 방향으로 배치시킴으로서 가로 방향과 깊이 방향으로 복수개의 도전 패턴이 형성된 반도체 테스트용 소켓의 제조도 가능하게 된다.In addition, a semiconductor test in which a plurality of conductive patterns are formed in a horizontal direction and a depth direction by manufacturing a bidirectional conductive pattern module having a plurality of bidirectional conductive pins formed in a horizontal direction by simultaneously manufacturing a plurality of patterns in the horizontal direction and placing them in a depth direction. It is also possible to manufacture a socket for use.
도 1 내지 도 3은 종래의 포고-핀(Pogo-pin) 타입의 반도체 테스트 소켓을 설명하기 위한 도면이고,1 to 3 are diagrams for explaining a conventional Pogo-pin type semiconductor test socket,
도 4 내지 도 8은 본 발명의 실시예에 따른 양방향 도전성 패턴 모듈의 제조방법을 설명하기 위한 도면이고,4 to 8 are views for explaining the manufacturing method of the bidirectional conductive pattern module according to an embodiment of the present invention,
도 9는 본 발명의 실시예에 따른 양방향 도전성 핀을 나타낸 도면이고,9 is a view showing a bidirectional conductive pin according to an embodiment of the present invention,
도 10 내지 도 13은 본 발명에 따른 베이스 패턴의 다양한 예를 나타낸 도면이다.10 to 13 are views showing various examples of the base pattern according to the present invention.
본 발명은 양방향 도전성 핀에 있어서, 절연성 재질의 핀 본체와, 상부 및 하부가 각각 상기 핀 본체의 상부 표면 및 하부 표면에 노출되도록 상기 핀 본체 내부에 마련되는 핀 모듈을 포함하고; 상기 핀 모듈은 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 핀 본체의 상부로 노출되는 상부 접촉부와, 도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 핀 본체의 하부로 노출되는 하부 접촉부와, 상기 핀 본체의 내부에서 상기 상부 접촉부와 상기 하부 접척부를 전기적으로 연결하는 적어도 하나의 연결부를 포함하며; 각각의 상기 연결부는 상기 상부 접촉부와 상기 하부 접촉부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 것을 특징으로 한다.The present invention provides a bidirectional conductive pin, comprising: a pin body made of an insulating material, and a pin module provided inside the pin body such that upper and lower portions thereof are exposed to upper and lower surfaces of the pin body, respectively; The pin module is formed by rolling a conductive thin plate into a cylindrical shape, an upper contact portion having an upper portion exposed to an upper portion of the pin body, and a thin plate having a conductive roll formed into a cylindrical shape, and a lower portion of the pin module below the pin body. An exposed lower contact portion and at least one connecting portion electrically connecting the upper contact portion and the lower contact portion inside the pin body; Each of the connecting portions may be connected to the upper contact portion and the lower contact portion at different positions in the circumferential direction to connect the upper contact portion and the lower contact portion in a winding manner along the circumferential direction.
이하에서는 첨부된 도면을 참조하여 본 발명에 따른 실시예들을 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;
도 4 내지 도 8은 본 발명의 실시예에 따른 양방향 도전성 패턴 모듈(100)의 제조방법을 설명하기 위한 도면이다. 도 4 내지 도 8을 참조하여 설명하면, 도전성을 갖는 재질의 박판, 예를 들어 금속 박판을 준비하고, 금속 박판을 패터닝 처리하여, 도 4에 도시된 바와 같은 베이스 패턴(110a)을 형성한다. 여기서, 금속 박판은 도전성을 갖는 재질로 마련될 수 있으나, 후술할 도금 과정을 통해 도전성이 형성될 수 있는 바, 금속 박판의 도전성은 필수가 아닐 수 있다. 금속 박판의 재질은 구리 또는 구리 합금, 예를 들어 BeCu로 형설될 수 있다. 또한, 본 발명에서는 금속 박판의 패터닝 방법으로 에칭 방법이나 스탬핑 방법이 적용되는 것을 예로 한다.4 to 8 are views for explaining the manufacturing method of the bidirectional conductive pattern module 100 according to an embodiment of the present invention. 4 to 8, a thin plate of conductive material, for example, a metal thin plate is prepared, and the metal thin plate is patterned to form a base pattern 110a as shown in FIG. 4. Here, the metal thin plate may be provided with a material having conductivity, but the conductivity may be formed through a plating process to be described later, and the conductivity of the metal thin plate may not be essential. The material of the metal sheet may be shaped as copper or a copper alloy, for example BeCu. In the present invention, an etching method or a stamping method is applied as an example of the metal thin plate patterning method.
도 4를 참조하여 설명하면, 금속 박판의 패터닝 처리를 통해 형성되는 베이스 패턴(110a)은 복수의 상부 접촉 패턴(11a), 복수의 하부 접촉 패턴(12a), 그리고 상호 대응하는 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)을 연결하는 연결 패턴(13a)을 포함한다. 도 5는 하나의 상부 접촉 패턴(11a), 하부 접촉 패턴(12a) 및 이를 연결하는 연결부(13)의 예를 도시한 도면이다. 도 4 및 도 5에 도시된 바와 같이, 하나씩의 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)을 연결하는 연결 패턴(13a)은 하나 또는 그 이상으로 형성될 수 있으며, 도 4에서는 3개의 연결 패턴(13a)이 하나씩의 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)을 연결하는 것을 예로 하고 있다.Referring to FIG. 4, the base pattern 110a formed through the patterning process of the thin metal plate may include a plurality of upper contact patterns 11a, a plurality of lower contact patterns 12a, and corresponding upper contact patterns 11a. ) And a connection pattern 13a connecting the lower contact pattern 12a to each other. FIG. 5 is a diagram illustrating an example of one upper contact pattern 11a, a lower contact pattern 12a, and a connection portion 13 connecting the upper contact pattern 11a and the lower contact pattern 12a. As shown in FIGS. 4 and 5, one or more connection patterns 13a connecting one upper contact pattern 11a and one lower contact pattern 12a may be formed. As an example, the connection pattern 13a connects the upper contact patterns 11a and the lower contact patterns 12a one by one.
복수의 상부 접촉 패턴(11a)은 가로 방향으로 상호 이격되도록 형성된다. 그리고, 복수의 하부 접촉 패턴(12a)은 상부 접촉 패턴(11a)으로부터 상하 방향으로 이격된 상태에서 상호간에 가로 방향으로 이격되도록 형성된다. The plurality of upper contact patterns 11a are formed to be spaced apart from each other in the horizontal direction. The plurality of lower contact patterns 12a are formed to be spaced apart from each other in the horizontal direction while being spaced apart from the upper contact pattern 11a in the vertical direction.
본 발명에서는, 도 4 및 도 5에 도시된 바와 같이, 상호 대응하는 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a), 즉 연결 패턴(13a)에 의해 연결되는 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)은 후술할 축을 중심으로 가로 방향으로 서로 편향된 상태로 형성되는 것을 예로 한다.In the present invention, as shown in Figures 4 and 5, the upper contact pattern 11a and the lower contact pattern 11a and the lower contact pattern 12a, that is, the upper contact pattern 11a and the lower part connected by the connection pattern 13a, respectively. For example, the contact patterns 12a are formed to be deflected from each other in a horizontal direction about an axis to be described later.
여기서, 베이스 패턴(110a)은 복수의 상부 접촉 패턴(11a), 복수의 하부 접촉 패턴(12a), 그리고 연결 패턴(13a)을 이용한 이후의 작업이 동시에 이루어질 수 있도록 각각의 상부 접촉 패턴(11a)과 상부 연결 패턴(123)으로 연결되는 상부 지지 패턴(121)과, 각각의 하부 접촉 패턴(12a)과 하부 연결 패턴(124)으로 연결되는 하부 지지 패턴(122)을 포함할 수 있다.Here, each of the upper contact patterns 11a may have a base pattern 110a such that subsequent operations using the plurality of upper contact patterns 11a, the plurality of lower contact patterns 12a, and the connection pattern 13a may be simultaneously performed. And an upper support pattern 121 connected to the upper connection pattern 123, and a lower support pattern 122 connected to each of the lower contact patterns 12a and the lower connection pattern 124.
상기와 같이 베이스 패턴(110a)의 제조가 완료되면, 베이스 패턴(110a)의 도전성 향상을 위해, 도금 과정이 진행된다. 본 발명에서는 니켈 도금과 금 도금을 순차적으로 진행하는 것을 예로 한다.When the manufacturing of the base pattern 110a is completed as described above, the plating process is performed to improve the conductivity of the base pattern 110a. In the present invention, the nickel plating and gold plating are sequentially performed.
도금 과정이 완료되면, 도 6에 도시된 바와 같이, 각각의 상부 접촉 패턴(11a)과 각각의 하부 접촉 패턴(12a)이 상하 방향으로 원통 형상을 갖도록 상하 방향을 축(도 4의 T 참조)으로 하여 말아 복수의 상부 접촉부(11), 복수의 하부 접촉부(12) 및 상호 대응하는 상부 접촉부(11)와 하부 접촉부(12)를 연결하는 연결부(13)를 형성하게 된다.When the plating process is completed, as shown in FIG. 6, the upper and lower directions are oriented so that each upper contact pattern 11a and each lower contact pattern 12a have a cylindrical shape in the vertical direction (see T in FIG. 4). As a result, a plurality of upper contact portions 11, a plurality of lower contact portions 12, and a connecting portion 13 connecting the upper contact portion 11 and the lower contact portion 12 corresponding to each other are formed.
또한, 연결부(13)는 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)이 말릴 때 연결 패턴(13a)이 원주 방향을 따라 감기는 형태로 변형되어 형성된다. 이 때, 하나의 상부 접촉부(11), 하나의 하부 접촉부(12) 및 이를 연결하는 연결부(13)가 하나의 핀 모듈(10)을 형성하게 된다.In addition, the connection part 13 is formed in a shape in which the connection pattern 13a is wound along the circumferential direction when the upper contact pattern 11a and the lower contact pattern 12a are curled. In this case, one upper contact portion 11, one lower contact portion 12, and a connection portion 13 connecting the same form one pin module 10.
본 발명에서는, 도 5에 도시된 바와 같이, 상호 대응하는 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)이 가로 방향으로 편향되게 형성되고, 연결 패턴(13a)이 대각선 방향으로 형성된 상태에서, 상하 방향으로의 축(T)를 중심으로 상부 접촉 패턴(11a)이 좌측에서 축(T) 방향으로 말리고, 하부 접촉 패턴(12a)이 우측에서 축 T 방향으로 말려 상부 접촉부(11) 및 하부 접촉부(12)가 형성되는 것을 예로 한다.In the present invention, as shown in Fig. 5, while the upper contact pattern 11a and the lower contact pattern 12a corresponding to each other are formed to be deflected in the horizontal direction, and the connection pattern 13a is formed in the diagonal direction, The upper contact pattern 11a is curled from the left to the axis T direction around the axis T in the up and down direction, and the lower contact pattern 12a is rolled from the right to the axis T direction from the right, so that the upper contact part 11 and the lower contact part It is taken as an example that (12) is formed.
이 경우, 연결부(13)는 상부 접촉부(11)와 하부 접촉부(12)에 원주 방향으로 상이한 위치에 연결된 상태로, 원주 방향을 따라 감기는 형태로 상부 접촉부(11)와 하부 접촉부(12)를 연결하게 된다.In this case, the connecting portion 13 is connected to the upper contact portion 11 and the lower contact portion 12 in a circumferential direction at different positions, and the upper contact portion 11 and the lower contact portion 12 are wound in the circumferential direction. Will be connected.
또한, 도 5에 도시된 바와 같이, 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)의 축(T)의 반대측 가장자리 영역은 일정한 이격 간격(K)을 두고 연결 패턴(13a)과 연결되도록 마련될 수 있다. 이를 통해, 상부 접촉 패턴(11a)과 하부 접촉 패턴(12a)이 원통 형상으로 말려 상부 접촉부(11)와 하부 접촉부(12)를 형성할 때 양측 가장자리 측의 연결 패턴(13a)이 서로 맞닿는 형태로 형성되지 않고 일정 간격 이격된 상태를 유지할 수 있게 된다.In addition, as shown in FIG. 5, the edge region opposite to the axis T of the upper contact pattern 11a and the lower contact pattern 12a may be connected to the connection pattern 13a at a constant spacing K. Can be. As a result, when the upper contact pattern 11a and the lower contact pattern 12a are rolled into a cylindrical shape to form the upper contact portion 11 and the lower contact portion 12, the connecting patterns 13a on both sides of the edge contact each other. It is not formed and can be maintained at a predetermined interval.
본 발명에서는 상부 접촉 패턴(11a) 및 하부 접촉 패턴(12a)을 원통 형상으로 마는 공정을 미세 금형을 통해 수행하는 것을 예로 한다. 예를 들어 상부 접촉 패턴(11a)의 중앙 부문을 일차적으로 가압하여 변형한 후, 가로 방향으로 양측을 내측으로 가압하여 원형 형태의 상부 접촉부(11)를 형성할 수 있다.In the present invention, for example, the process of rolling the upper contact pattern 11a and the lower contact pattern 12a into a cylindrical shape is performed by using a fine mold. For example, after the center portion of the upper contact pattern 11a is primarily pressed and deformed, the upper contact portion 11 may be formed by pressing both sides inward in the horizontal direction.
상기와 같이, 상부 접촉부(11), 하부 접촉부(12) 및 연결부(13)가 형성되면, 도 7에 도시된 바와 같이, 각각의 상부 접촉부(11)의 상부 표면과, 각각의 하부 접촉부(12)의 하부 표면이 상부 방향 및 하부 방향으로 노출된 상태가 되도록 절연성 본체(110)을 형성한다.As described above, when the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 are formed, as shown in FIG. 7, the upper surface of each upper contact portion 11 and each lower contact portion 12. The insulating body 110 is formed such that the lower surface of the bottom surface is exposed in the upper direction and the lower direction.
일 예로, 도 6에 도시된 베이스 패턴(110a)을 금형에 설치한 후, 액상의 실리콘을 주입한 후 경화시켜 절연성 본체(110)을 형성할 수 있다. 이를 통해, 상부 접촉부(11)의 상부 표면과 하부 접촉부(12)의 하부 표면은 절연성 본체(110)의 외부로 노출된 상태가 되고, 상부 접촉부(11)의 나머지 부분, 하부 접촉부(12)의 나머지 부분, 그리고 연결부(13)는 절연성 본체(110)의 내부에 위치하게 된다.For example, the base pattern 110a illustrated in FIG. 6 may be installed in a mold, and then the insulating body 110 may be formed by injecting and curing the liquid silicon. Through this, the upper surface of the upper contact portion 11 and the lower surface of the lower contact portion 12 are exposed to the outside of the insulating body 110, the remaining portion of the upper contact portion 11, of the lower contact portion 12 The remaining part and the connection part 13 are positioned inside the insulating body 110.
상기와 같은 과정을 통해, 절연성 본체(110)이 완성되면, 도 7에 도시된 절취선(C1, C2)을 따라 레이저 커팅 등의 방법을 통해 상부 연결 패턴(123)과 하부 연결 패턴(124)을 절단하게 되면, 도 8에 도시된 바와 같은 양방향 도전성 패턴 모듈(100)이 제조 가능하게 된다.Through the above process, when the insulating main body 110 is completed, the upper connection pattern 123 and the lower connection pattern 124 are formed by laser cutting along the cutting lines C1 and C2 shown in FIG. 7. When cut, the bidirectional conductive pattern module 100 as shown in FIG. 8 can be manufactured.
도 8을 참조하여 설명하면, 양방향 도전성 패턴 모듈(100)은 절연성 본체(110)의 내부에 가로 방향으로 상호 이격된 상태로 복수의 핀 모듈(10)이 형성된다. 이 때, 하나의 핀 모듈(10)은 상부 접촉부(11)와, 하부 접촉부(12), 그리고 연결부(13)를 포함하게 된다. 여기서, 핀 모듈(10)을 구성하는 상부 접촉부(11), 하부 접촉부(12) 및 연결부(13)의 구성은 상술한 바와 같다.Referring to FIG. 8, in the bidirectional conductive pattern module 100, a plurality of pin modules 10 are formed in the insulating body 110 in a state in which they are spaced apart from each other in the horizontal direction. In this case, one pin module 10 includes an upper contact portion 11, a lower contact portion 12, and a connection portion 13. Here, the configuration of the upper contact portion 11, the lower contact portion 12 and the connecting portion 13 constituting the pin module 10 is as described above.
그리고, 복수의 양방향 도전성 패턴 모듈(100)을 깊이 방향으로 배열시키게 되면, 가로 방향과 깊이 방향으로 복수의 도전 패턴을 갖는 반도체 테스트용 소켓을 구성할 수 있게 된다.When the plurality of bidirectional conductive pattern modules 100 are arranged in the depth direction, the semiconductor test socket having the plurality of conductive patterns in the horizontal direction and the depth direction can be configured.
또한, 도 8에 도시된 절취선(C3)을 따라 레이저 커팅 등의 방법으로 절단하게 되면, 도 9에 도시된 바와 같은 하나의 양방향 도전성 핀(1)의 제조가 가능하게 되며, 이와 같은 하나의 양방향 도전성 핀(1)은 기존의 포고 핀을 대체할 수 있게 된다. 이 때, 절연성 본체(110)에서 절취되고 남은 부분이 하나의 양방향 도전성 핀(1)의 핀 본체(14)를 형성하고, 핀 본체(14)의 내부에 하나의 핀 모듈(10)이 형성된다.In addition, when cutting by a method such as laser cutting along the cutting line (C3) shown in Figure 8, it is possible to manufacture one bidirectional conductive pin 1 as shown in Figure 9, such one bidirectional The conductive pin 1 can replace the existing pogo pin. At this time, the remaining portion cut out of the insulating main body 110 forms the pin main body 14 of the one-way bidirectional conductive pin 1, and one pin module 10 is formed inside the pin main body 14. .
도 10 내지 도 13은 다양한 형태의 베이스 패턴(110a)의 예를 나타낸 도면이다. 본 발명에 따른 기술적 사상은 상술한 바와 같으며, 도 10 내지 도 13에 도시된 베이스 패턴(110a)의 다양한 변형 예와 다른 변형 예도 본 발명의 기술적 사상에 포함된다. 즉, 당업자라면 본 발명에서 예시한 실시예들 외에 본 발명의 기술적 사상의 범위 내에서 다양한 변형 예에 따라 베이스 패턴(110a)의 제조가 가능할 것이다.10 to 13 illustrate examples of various types of base patterns 110a. The technical idea according to the present invention is as described above, and various modifications and other modifications of the base pattern 110a illustrated in FIGS. 10 to 13 are also included in the technical idea of the present invention. That is, those skilled in the art will be able to manufacture the base pattern 110a according to various modifications within the scope of the technical idea of the present invention in addition to the embodiments illustrated in the present invention.
도 14는 본 발명의 다른 실시 형태에 따른 양방향 도전성 핀을 설명하기 위한 도면이다. 도 14의 (a)는 본 발명의 다른 실시 형태에 따른 양방향 도전성 핀의 제조를 위한 베이스 패턴의 예를 나타낸 도면이다.It is a figure for demonstrating the bidirectional conductive pin which concerns on other embodiment of this invention. 14A is a diagram showing an example of a base pattern for manufacturing a bidirectional conductive pin according to another embodiment of the present invention.
도 14의 (a)를 참조하여 설명하면, 베이스 패턴은 상부 접촉 패턴(11a'), 하부 접촉 패턴(12a'), 중간 지지 패턴(15a'), 제1 연결 패턴(13a'), 및 제2 연결 패턴(13a'')을 포함한다. 여기서, 상부 접촉 패턴(11a'), 하부 접촉 패턴(12a'), 중간 지지 패턴(15a'), 제1 연결 패턴(13a'), 및 제2 연결 패턴(13a'')은 상술한 실시예에서와 마찬가지로 도전성 박판의 패터닝을 통해 형성될 수 있는 바, 그 상세한 설명은 생략한다.Referring to FIG. 14A, the base pattern includes an upper contact pattern 11a ', a lower contact pattern 12a', an intermediate support pattern 15a ', a first connection pattern 13a', and a first pattern. 2 connection pattern 13a ''. Here, the upper contact pattern 11a ', the lower contact pattern 12a', the intermediate support pattern 15a ', the first connection pattern 13a', and the second connection pattern 13a '' are the embodiments described above. As can be formed through the patterning of the conductive thin plate, the detailed description thereof will be omitted.
여기서, 전술한 실시예들과는 상이하게, 상부 접촉 패턴(11a')와 하부 접촉 패턴(12a') 사이에 판 형상의 중간 지지 패턴(15a')이 형성되고, 중간 지지 패턴(15a')과 상부 접촉 패턴(11a')을 대각선 방향으로 제1 연결 패턴(13a')이 연결하고, 중간 지지 패턴(15a')과 하부 접촉 패턴(12a')을 대각선 방향으로 제2 연결 패턴(13a'')이 연결하게 된다.Here, unlike the above-described embodiments, a plate-shaped intermediate support pattern 15a 'is formed between the upper contact pattern 11a' and the lower contact pattern 12a ', and the intermediate support pattern 15a' and the upper portion are formed. The first connection pattern 13a 'connects the contact pattern 11a' in the diagonal direction, and the second support pattern 13a '' connects the intermediate support pattern 15a 'and the lower contact pattern 12a' in the diagonal direction. This will connect.
상기와 같은 베이스 패턴을 상술한 실시예에서와 마찬가지로, 동일한 상하 방향으로의 축을 중심으로 말게 되면 핀 모듈(11',12',13',13'',15')이 형성되고, 상부 접촉부(11')와 하부 접촉부(11') 사이에 절연성 재질, 예를 들어 실리콘 재질로 절연성 본체(14)를 형성하게 되면, 도 14의 (b)에 도시된 바와 같은 양방향 도전성 핀(10')이 형성 가능하게 된다.As in the above-described embodiment, the base pattern is rolled around the same vertical axis, and thus the pin modules 11 ', 12', 13 ', 13' ', and 15' are formed, and the upper contact portion ( When the insulating body 14 is formed of an insulating material, for example, silicon, between 11 ') and the lower contact portion 11', the bidirectional conductive pin 10 'as shown in FIG. It becomes possible to form.
즉, 양방향 도전성 핀(10')은 절연성 재질의 핀 본체(14')와, 상부 및 하부가 각각 핀 본체(14')의 상부 표면 및 하부 표면으로 노출되도록 핀 본체(14') 내부에 마련되는 핀 모듈(11',12',13',13'',15')을 포함하게 된다.That is, the bidirectional conductive pin 10 'is provided inside the pin body 14' such that the pin body 14 'of the insulating material and the upper and lower portions thereof are exposed to the upper and lower surfaces of the pin body 14', respectively. Pin modules 11 ', 12', 13 ', 13 ", and 15'.
이 때, 핀 모듈(11',12',13',13'',15')은 상부가 핀 본체(14')의 상부로 노출되는 상부 접촉부(11'), 하부가 핀 본체(14')의 하부로 노출되는 하부 접촉부(12')를 포함하게 된다. 또한, 핀 모듈(11',12',13',13'',15')은 상부 접촉부(11')와 하부 접촉부(12') 사이에 위치하는 중간 지지부(15')를 포함하게 되며, 제1 연결부(13')가 상부 접촉부(11') 및 중간 지지부(15')를 전기적으로 연결하고, 제2 연결부(13'')가 하부 접촉부(12')와 중간 지지부(15')를 전기적으로 연결하게 된다.At this time, the pin modules 11 ', 12', 13 ', 13' ', 15' are the upper contact portion 11 ', the upper part of which is exposed to the upper part of the pin body 14', and the lower part of the pin body 14 '. It includes a lower contact portion 12 'exposed to the bottom of the). In addition, the pin modules 11 ', 12', 13 ', 13' ', 15' will include an intermediate support 15 'positioned between the upper contact 11' and the lower contact 12 ', The first connector 13 'electrically connects the upper contact 11' and the intermediate support 15 ', and the second connector 13' 'connects the lower contact 12' and the intermediate support 15 '. Electrical connection.
여기서, 제1 연결부(13')는 전술한 실시예에서와 마찬가지로, 상부 접촉부(11')와 중간 지지부(15')에 원주 방향으로 상호 상이한 위치에서 연결되고, 제2 연결부(13'')도 하부 접촉부(12')와 중간 지지부(15')에 원주 방향으로 상호 상이한 위치에 연결된다.Here, the first connecting portion 13 'is connected to the upper contact portion 11' and the intermediate support portion 15 'at different positions in the circumferential direction, as in the above-described embodiment, and the second connecting portion 13' '. The lower contact 12 'and the intermediate support 15' are connected to mutually different positions in the circumferential direction.
한편, 도 14에 도시된 실시예에 따른 양방향 도전성 핀(10')을 포함하는 양방향 도전성 패턴 모듈(미도시)도 전술한 실시예에서와 마찬가지로 동일한 제작 과정을 통해 형성될 수 있으며, 이를 통해 양방향 도전성 패턴 모듈의 제조 과정에서 양방향 도전성 핀(10')의 제조도 가능할 것이다.Meanwhile, a bidirectional conductive pattern module (not shown) including a bidirectional conductive pin 10 ′ according to the embodiment shown in FIG. 14 may also be formed through the same manufacturing process as in the above-described embodiment, and thus bidirectional In the manufacturing of the conductive pattern module, it may be possible to manufacture the bidirectional conductive pin 10 ′.
한편, 도 15 및 도 16은 본 발명의 또 다른 실시 형태에 따른 양방향 도전성 핀(200)을 설명하기 위한 도면이다. 도 15의 (a)는 본 발명의 다른 실시 형태에 따른 양방향 도전성 핀(200)의 제조를 위한 베이스 패턴(200a)의 예를 나타낸 도면이다.15 and 16 are diagrams for describing the bidirectional conductive pin 200 according to still another embodiment of the present invention. 15A is a diagram illustrating an example of a base pattern 200a for manufacturing the bidirectional conductive pin 200 according to another embodiment of the present invention.
도 15의 (a)를 참조하여 설명하면, 베이스 패턴은 상부 접촉 패턴(210a), 하부 접촉 패턴(220a), 중간 지지 패턴(231a), 제1 연결 패턴(232a), 및 제2 연결 패턴(233a)을 포함한다. 여기서, 상부 접촉 패턴(210a), 하부 접촉 패턴(220a), 중간 지지 패턴(231a), 제1 연결 패턴(232a), 및 제2 연결 패턴(233a)은 상술한 실시예에서와 마찬가지로 도전성 박판의 패터닝을 통해 형성될 수 있는 바, 그 상세한 설명은 생략한다.Referring to FIG. 15A, the base pattern includes an upper contact pattern 210a, a lower contact pattern 220a, an intermediate support pattern 231a, a first connection pattern 232a, and a second connection pattern ( 233a). Here, the upper contact pattern 210a, the lower contact pattern 220a, the intermediate support pattern 231a, the first connection pattern 232a, and the second connection pattern 233a are the same as in the above-described embodiment. It can be formed through the patterning bar, the detailed description thereof will be omitted.
여기서, 전술한 실시예들과는 상이하게, 상부 접촉 패턴(210a)와 하부 접촉 패턴(231a) 사이에 판 형상의 중간 지지 패턴(231a)이 형성되고, 중간 지지 패턴(231a)과 상부 접촉 패턴(210a)을 제1 연결 패턴(232a)이 연결하고, 중간 지지 패턴(231a)과 하부 접촉 패턴(233a)을 제2 연결 패턴(233a)이 연결하게 된다.Here, unlike the above-described embodiments, a plate-shaped intermediate support pattern 231a is formed between the upper contact pattern 210a and the lower contact pattern 231a, and the intermediate support pattern 231a and the upper contact pattern 210a are formed. ) Is connected to the first connection pattern 232a, and the second support pattern 233a connects the intermediate support pattern 231a and the lower contact pattern 233a.
도 15에 도시된 실시예에서는 제1 연결 패턴(232a) 및 제2 연결 패턴(233a)는 수직 방향으로 형성된다. 즉, 제1 연결 패턴(232a)은 상부 접촉 패턴(210a)와 중간 지지 패턴(231a)을 수직 방향으로 연결하고, 제2 연결 패턴(233a)은 하부 접촉 패턴(210a)과 중간 접촉 패턴(220a)를 수직 방향으로 연결한다.In the embodiment shown in FIG. 15, the first connection pattern 232a and the second connection pattern 233a are formed in a vertical direction. That is, the first connection pattern 232a connects the upper contact pattern 210a and the intermediate support pattern 231a in the vertical direction, and the second connection pattern 233a connects the lower contact pattern 210a and the intermediate contact pattern 220a. ) In the vertical direction.
이에 따라, 도 15의 (b)에 도시된 바와 같이, 제1 연결 패턴(232a)과 제2 연결 패턴(233a)이 제1 연결부(232) 및 제2 연결부(233)를 형성하게 되면, 제1 연결부(232)는 상부 접촉부(210)와 중간 지지부(231)를 수직 방향으로 연결하고, 제2 연결부(233)는 하부 접촉부(220)와 중간 지지부(231)를 수직 방향으로 연결하게 된다.Accordingly, as shown in FIG. 15B, when the first connection pattern 232a and the second connection pattern 233a form the first connection part 232 and the second connection part 233, the first connection pattern 232a and the second connection pattern 233a are formed. The first connection portion 232 connects the upper contact portion 210 and the intermediate support portion 231 in the vertical direction, and the second connection portion 233 connects the lower contact portion 220 and the intermediate support portion 231 in the vertical direction.
여기서, 본 발명에서는 중간 지지 패턴(231a)이, 도 15의 (a)에 도시된 바와 같이, 수평 방향으로 형성되는 것을 예로 하고 있으나, 도 16에 도시된 바와 같이, Z 자 형상을 갖도록 마련될 수 있음은 물론이다.Here, although the intermediate support pattern 231a is formed in the horizontal direction as illustrated in FIG. 15A, the intermediate support pattern 231a may be provided to have a Z shape as illustrated in FIG. 16. Of course it can.
상기와 같은 베이스 패턴(200a)을 상술한 실시예에서와 마찬가지로, 동일한 상하 방향으로의 축을 중심으로 말게 되면 핀 모듈(210,220,231,232,233)이 형성되고, 상부 접촉부(210)와 하부 접촉부(220) 사이에 절연성 재질, 예를 들어 실리콘 재질로 절연성 본체(240)를 형성하게 되면, 도 15의 (b)에 도시된 바와 같은 양방향 도전성 핀(200)이 형성 가능하게 된다.When the base pattern 200a is rolled around the same vertical axis as in the above-described embodiment, the pin modules 210, 220, 231, 232, and 233 are formed, and an insulating property is formed between the upper contact portion 210 and the lower contact portion 220. When the insulating body 240 is formed of a material, for example, a silicon material, the bidirectional conductive pin 200 as shown in FIG. 15B can be formed.
한편, 도 15에 도시된 실시예에 따른 양방향 도전성 핀(200)을 포함하는 양방향 도전성 패턴 모듈(미도시)도 전술한 실시예에서와 마찬가지로 동일한 제작 과정을 통해 형성될 수 있으며, 이를 통해 양방향 도전성 패턴 모듈의 제조 과정에서 양방향 도전성 핀(200)의 제조도 가능할 것이다.Meanwhile, a bidirectional conductive pattern module (not shown) including a bidirectional conductive pin 200 according to the embodiment shown in FIG. 15 may also be formed through the same manufacturing process as in the above-described embodiment, and thereby bidirectional conductive It will be possible to manufacture the bidirectional conductive pin 200 in the manufacturing process of the pattern module.
비록 본 발명의 몇몇 실시예들이 도시되고 설명되었지만, 본 발명이 속하는 기술분야의 통상의 지식을 가진 당업자라면 본 발명의 원칙이나 정신에서 벗어나지 않으면서 본 실시예를 변형할 수 있음을 알 수 있을 것이다. 발명의 범위는 첨부된 청구항과 그 균등물에 의해 정해질 것이다.Although some embodiments of the invention have been shown and described, it will be apparent to those skilled in the art that modifications may be made to the embodiment without departing from the spirit or spirit of the invention. . It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.
[부호의 설명][Description of the code]
1 : 양방향 도전성 핀 10 : 핀 모듈1: bidirectional conductive pin 10: pin module
11 : 상부 접촉부 11a : 상부 접촉 패턴11: upper contact 11a: upper contact pattern
12 : 하부 접촉부 12a : 하부 접촉 패턴12: lower contact portion 12a: lower contact pattern
13 : 연결부 13a : 연결 패턴13 connection part 13a: connection pattern
14 : 핀 본체 100 : 양방향 도전성 패턴 모듈14: pin body 100: bidirectional conductive pattern module
110 : 절연성 본체 110a : 베이스 패턴110: insulating body 110a: base pattern
121 : 상부 지지 패턴 122 : 하부 지지 패턴121: upper support pattern 122: lower support pattern
123 : 상부 연결 패턴 124 : 하부 연결 패턴123: upper connection pattern 124: lower connection pattern
본 발명은 반도체 소자, 인쇄회로기판, LCD 디스플레이 등의 제조 과정에서 전기적 성능의 양불 검사나 번-인(Burn-In) 테스트 과정에 적용될 수 있다.The present invention can be applied to the inspection of the electrical performance or burn-in test in the manufacturing process of semiconductor devices, printed circuit boards, LCD displays and the like.

Claims (12)

  1. 양방향 도전성 핀에 있어서,In the bidirectional conductive pin,
    절연성 재질의 핀 본체와,Pin body of insulating material,
    상부 및 하부가 각각 상기 핀 본체의 상부 표면 및 하부 표면에 노출되도록 상기 핀 본체 내부에 마련되는 핀 모듈을 포함하고;A pin module provided inside the pin body such that upper and lower portions are respectively exposed to the upper and lower surfaces of the pin body;
    상기 핀 모듈은The pin module
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 핀 본체의 상부로 노출되는 상부 접촉부와,An upper contact portion having a conductive thin plate formed into a cylindrical shape and having an upper portion exposed to an upper portion of the pin body;
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 핀 본체의 하부로 노출되는 하부 접촉부와,A lower contact portion having a conductive thin plate formed into a cylindrical shape and having a lower portion exposed to the lower portion of the pin body;
    상기 핀 본체의 내부에서 상기 상부 접촉부와 상기 하부 접척부를 전기적으로 연결하는 적어도 하나의 연결부를 포함하며;At least one connecting portion electrically connecting the upper contact portion and the lower contact portion inside the pin body;
    각각의 상기 연결부는 상기 상부 접촉부와 상기 하부 접촉부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 것을 특징으로 하는 양방향 도전성 핀.Each connecting portion is connected to the upper contact portion and the lower contact portion in the circumferential direction mutually different, connecting the upper contact portion and the lower contact portion in the form of winding along the circumferential direction.
  2. 양방향 도전성 패턴 모듈에 있어서,In the bidirectional conductive pattern module,
    절연성 재질의 절연성 본체와,An insulating body made of insulating material,
    상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며;A plurality of pin modules arranged in the insulating body and spaced apart from each other along a horizontal direction;
    각각의 상기 핀 모듈은Each pin module
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와,An upper contact portion having a conductive thin plate formed into a cylindrical shape and having an upper portion exposed to an upper portion of the insulating body,
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와,A lower contact portion having a conductive thin plate formed into a cylindrical shape and having a lower portion exposed to a lower portion of the insulating body,
    상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 하부 접척부를 전기적으로 연결하는 적어도 하나의 연결부를 포함하며;At least one connecting portion electrically connecting the upper contact portion and the lower contact portion inside the insulating body;
    각각의 상기 연결부는 상기 상부 접촉부와 상기 하부 접촉부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈.Wherein each of the connection parts is connected to the upper contact part and the lower contact part at different positions in the circumferential direction, and connects the upper contact part and the lower contact part to be wound along the circumferential direction.
  3. 양방향 도전성 패턴 모듈의 제조방법에 있어서,In the manufacturing method of the bidirectional conductive pattern module,
    (a) 도전성을 갖는 박판을 패터닝하여, 가로 방향을 상호 이격된 복수의 상부 접촉 패턴과, 상하 방향으로 복수의 상기 상부 접촉 패턴과 이격되고 상기 가로 방향으로 상호 이격된 복수의 하부 접촉 패턴과, 상호 대응하는 위치의 상기 상부 접촉 패턴과 상기 하부 접촉 패턴을 연결하는 적어도 하나의 연결 패턴을 갖는 베이스 패턴을 형성하는 단계와,a plurality of upper contact patterns spaced apart from each other in the horizontal direction, a plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the vertical direction, and spaced apart from each other in the horizontal direction by patterning a thin plate having conductivity; Forming a base pattern having at least one connection pattern connecting the upper contact pattern and the lower contact pattern at corresponding positions;
    (b) 상기 베이스 패턴을 도금하는 단계와,(b) plating the base pattern;
    (c) 각각의 상기 상부 접촉 패턴과 각각의 상기 하부 접촉 패턴이 상하 방향으로 원통 형상을 갖도록 상하 방향을 축으로 말아 복수의 상부 접촉부, 복수의 하부 접촉부 및 상호 대응하는 상기 상부 접촉부와 상기 하부 접촉부를 연결하는 연결부를 형성하는 단계와 - 상기 연결부는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴이 말릴 때 상기 연결 패턴이 원주 방향을 따라 감기는 형태로 변형되어 형성됨,(c) a plurality of upper contact portions, a plurality of lower contact portions, and the corresponding upper contact portion and the lower contact portion, respectively, being rolled up and down in an axial direction such that each of the upper contact pattern and each of the lower contact patterns has a cylindrical shape in an up and down direction; Forming a connecting part connecting the connecting part, wherein the connecting part is formed in a shape in which the connecting pattern is wound along the circumferential direction when the upper contact pattern and the lower contact pattern are dried.
    (d) 복수의 상기 상부 접촉부의 상부 표면과, 복수의 상기 하부 접촉부의 하부 표면이 각각 상부 방향 및 하부 방향으로 노출된 상태로 상기 연결부가 내부에 수용되도록 절연성 본체를 형성하는 단계를 포함하는 것을 특징으로 하는 양방향 도전성 패턴 모듈.(d) forming an insulating body such that the upper surface of the plurality of upper contacts and the lower surface of the lower contact of the plurality of lower contact portions are respectively exposed in the upper direction and the lower direction so that the connecting portion is accommodated therein. A bidirectional conductive pattern module, characterized in that.
  4. 제3항에 있어서,The method of claim 3,
    상기 (a) 단계에서 상기 연결부는 상기 (c) 단계에서 복수의 상기 상부 접촉부 및 복수의 상기 하부 접촉부가 형성될 때, 상호 대응하는 하나의 상기 상부 접촉부와 하나의 상기 하부 접촉부에 원주 방향으로 상이한 위치에 연결되어, 원주 방향으로 따라 감기는 형태로 상기 상부 접촉부와 상기 하부 접촉부를 연결하도록 패터닝되는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법.In the step (a), when the plurality of the upper contact part and the plurality of the lower contact part are formed in the step (c), the one upper contact part and the one lower contact part which are mutually different from each other in the circumferential direction Connected to a position, and patterned to connect the upper contact portion and the lower contact portion in a form wound along the circumferential direction.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 (a) 단계에서 상기 연결 패턴은 상기 상부 접촉 패턴과 상기 하부 접촉 패턴 사이에서 대각선 방향으로 형성되어 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴을 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법.In the step (a), the connection pattern is formed in a diagonal direction between the upper contact pattern and the lower contact pattern to connect the upper contact pattern and the lower contact pattern corresponding to each other of the bidirectional conductive pattern module Manufacturing method.
  6. 제3항에 있어서,The method of claim 3,
    상기 (c) 단계에서 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴은 상하 방향으로 동일 축을 중심으로 말려 상하 방향으로 대응하는 위치에 상기 상부 접촉부와 상기 하부 접촉부가 형성되는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법.The upper contact pattern and the lower contact pattern corresponding to each other in the step (c) are rolled about the same axis in the vertical direction to form the upper contact portion and the lower contact portion at positions corresponding to the vertical direction. Method of manufacturing a pattern module.
  7. 제6항에 있어서,The method of claim 6,
    상기 (a) 단계에서 상호 대응하는 상기 상부 접촉 패턴과 상기 하부 접촉 패턴은 상기 동일 축을 중심으로 상기 가로 방향으로 편향되게 형성되고;The upper contact pattern and the lower contact pattern corresponding to each other in the step (a) are formed to be deflected in the horizontal direction about the same axis;
    상기 (c) 단계에서 상기 상부 접촉 패턴 및 상기 하부 접촉 패턴은 상기 동일 축을 중심으로 반대 측으로부터 상기 동일 축 방향으로 말려와 각각 상기 상부 접촉부 및 상기 하부 접촉부를 형성하는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법.In the step (c), the upper contact pattern and the lower contact pattern are rolled in the same axial direction from opposite sides about the same axis to form the upper contact part and the lower contact part, respectively. Manufacturing method.
  8. 제6항에 있어서,The method of claim 6,
    상기 (a) 단계에서 상기 상부 접촉 패턴과 상기 하부 접촉 패턴의 상기 동일 축의 반대측 가장자리 영역으로부터 일정 간격을 두고 상기 연결 패턴과 연결되는 것을 특징으로 하는 양방향 도전성 패턴 모듈의 제조방법.The method of manufacturing the bidirectional conductive pattern module, characterized in that in step (a) is connected to the connection pattern at a predetermined distance from the opposite edge region of the same axis of the upper contact pattern and the lower contact pattern.
  9. 양방향 도전성 핀의 제조방법에 있어서,In the manufacturing method of the bidirectional conductive pin,
    제3항 내지 제8항 중 어느 한 항에 따라 양방향 도전성 패턴 모듈을 제조하는 단계와,Manufacturing a bidirectional conductive pattern module according to any one of claims 3 to 8;
    상기 양방향 도전성 패턴 모듈의 절연성 본체를 상하 방향으로 절단하여 복수의 양방향 도전성 핀을 형성하는 단계를 포함하며;Cutting the insulating body of the bidirectional conductive pattern module in a vertical direction to form a plurality of bidirectional conductive pins;
    하나의 상기 양방향 도전성 핀은 하나의 상부 접촉부 및 하나의 하부 접촉부와 이를 연결하는 연결부로 구성되는 것을 특징으로 하는 양방향 도전성 핀의 제조방법.One bidirectional conductive pin is a method of manufacturing a bidirectional conductive pin, characterized in that consisting of one upper contact portion and one lower contact portion and a connection connecting it.
  10. 양방향 도전성 핀에 있어서,In the bidirectional conductive pin,
    절연성 재질의 핀 본체와,Pin body of insulating material,
    상부 및 하부가 각각 상기 핀 본체의 상부 표면 및 하부 표면에 노출되도록 상기 핀 본체 내부에 마련되는 핀 모듈을 포함하고;A pin module provided inside the pin body such that upper and lower portions are respectively exposed to the upper and lower surfaces of the pin body;
    상기 핀 모듈은The pin module
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 핀 본체의 상부로 노출되는 상부 접촉부와,An upper contact portion having a conductive thin plate formed into a cylindrical shape and having an upper portion exposed to an upper portion of the pin body;
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 핀 본체의 하부로 노출되는 하부 접촉부와,A lower contact portion having a conductive thin plate formed into a cylindrical shape and having a lower portion exposed to the lower portion of the pin body;
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와,A conductive thin plate is formed to be rolled into a cylindrical shape, and an intermediate support portion located between the upper contact portion and the lower contact portion,
    상기 핀 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와,At least one first connection part electrically connecting the upper contact part and the intermediate support part in the pin body;
    상기 핀 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며;At least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the pin body;
    각각의 상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 중간 지지부를 연결하고;Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction;
    각각의 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 하부 접촉부와 상기 중간 지지부를 연결하는 것을 특징으로 하는 양방향 도전성 핀.Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction. .
  11. 양방향 도전성 패턴 모듈에 있어서,In the bidirectional conductive pattern module,
    절연성 재질의 절연성 본체와,An insulating body made of insulating material,
    상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며;A plurality of pin modules arranged in the insulating body and spaced apart from each other along a horizontal direction;
    각각의 상기 핀 모듈은Each pin module
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와,An upper contact portion having a conductive thin plate formed into a cylindrical shape and having an upper portion exposed to an upper portion of the insulating body,
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와,A lower contact portion having a conductive thin plate formed into a cylindrical shape and having a lower portion exposed to a lower portion of the insulating body,
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와,A conductive thin plate is formed to be rolled into a cylindrical shape, and an intermediate support portion located between the upper contact portion and the lower contact portion,
    상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와,At least one first connection part electrically connecting the upper contact part and the intermediate support part inside the insulating body;
    상기 절연성 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며;At least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body;
    각각의 상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 상부 접촉부와 상기 중간 지지부를 연결하고;Each of the first connecting portions connected to the upper contact portion and the intermediate support portion at different positions in the circumferential direction to connect the upper contact portion and the intermediate support portion in a circumferential direction;
    각각의 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부에 원주 방향으로 상호 상이한 위치에서 연결되어, 원주 방향을 따라 감기는 형태로 상기 하부 접촉부와 상기 중간 지지부를 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈.Each of the second connecting portions is connected to the lower contact portion and the intermediate support portion at mutually different positions in the circumferential direction, and connects the lower contact portion and the intermediate support portion in the form of winding along the circumferential direction. module.
  12. 양방향 도전성 패턴 모듈에 있어서,In the bidirectional conductive pattern module,
    절연성 재질의 절연성 본체와,An insulating body made of insulating material,
    상기 절연성 본체의 내부에 가로 방향을 따라 상호 이격된 상태로 배열되는 복수의 핀 모듈을 포함하며;A plurality of pin modules arranged in the insulating body and spaced apart from each other along a horizontal direction;
    각각의 상기 핀 모듈은Each pin module
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상부가 상기 절연성 본체의 상부로 노출되는 상부 접촉부와,An upper contact portion having a conductive thin plate formed into a cylindrical shape and having an upper portion exposed to an upper portion of the insulating body,
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 하부가 상기 절연성 본체의 하부로 노출되는 하부 접촉부와,A lower contact portion having a conductive thin plate formed into a cylindrical shape and having a lower portion exposed to a lower portion of the insulating body,
    도전성을 갖는 박판이 원통 형상으로 말려 형성되고, 상기 상부 접촉부와 상기 하부 접촉부 사이에 위치하는 중간 지지부와,A conductive thin plate is formed to be rolled into a cylindrical shape, and an intermediate support portion located between the upper contact portion and the lower contact portion,
    상기 절연성 본체의 내부에서 상기 상부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제1 연결부와,At least one first connection part electrically connecting the upper contact part and the intermediate support part inside the insulating body;
    상기 절연성 본체의 내부에서 상기 하부 접촉부와 상기 중간 지지부를 전기적으로 연결하는 적어도 하나의 제2 연결부를 포함하며;At least one second connecting portion electrically connecting the lower contact portion and the intermediate support portion inside the insulating body;
    상기 제1 연결부는 상기 상부 접촉부와 상기 중간 지지부를 수직 방향으로 연결하고, 상기 제2 연결부는 상기 하부 접촉부와 상기 중간 지지부를 수직 방향으로 연결하는 것을 특징으로 하는 양방향 도전성 패턴 모듈.And the first connection part connects the upper contact part and the intermediate support part in a vertical direction, and the second connection part connects the lower contact part and the intermediate support part in a vertical direction.
PCT/KR2016/012202 2016-05-30 2016-10-28 Bidirectional conductive pin, bidirectional conductive pattern module and method for preparing same by means of high-precision processing technology WO2017209356A1 (en)

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KR20160066228 2016-06-02
KR1020160134777A KR20170137591A (en) 2016-06-02 2016-10-18 By-directional electrically conductive, by-directional electrically conductive pattern module and manufacturing method thereof
KR10-2016-0134777 2016-10-18

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Publication number Priority date Publication date Assignee Title
JP2006266869A (en) * 2005-03-24 2006-10-05 Enplas Corp Contact pin and socket for electrical component
KR20100054099A (en) * 2008-11-13 2010-05-24 니혼덴산리드가부시키가이샤 Inspection probe
KR101330999B1 (en) * 2011-12-05 2013-11-20 (주)아이윈 Plungers interconnected pogo pin and manufacturing method of it
KR101373642B1 (en) * 2012-10-23 2014-03-12 (주)아이윈 Spring probe pin made of rubber, and manufacturing method thereof
KR101416266B1 (en) * 2014-05-23 2014-08-07 주식회사 엔에스티 Connector for testing semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006266869A (en) * 2005-03-24 2006-10-05 Enplas Corp Contact pin and socket for electrical component
KR20100054099A (en) * 2008-11-13 2010-05-24 니혼덴산리드가부시키가이샤 Inspection probe
KR101330999B1 (en) * 2011-12-05 2013-11-20 (주)아이윈 Plungers interconnected pogo pin and manufacturing method of it
KR101373642B1 (en) * 2012-10-23 2014-03-12 (주)아이윈 Spring probe pin made of rubber, and manufacturing method thereof
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