WO2017199701A1 - Module and sensor device - Google Patents

Module and sensor device Download PDF

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Publication number
WO2017199701A1
WO2017199701A1 PCT/JP2017/016242 JP2017016242W WO2017199701A1 WO 2017199701 A1 WO2017199701 A1 WO 2017199701A1 JP 2017016242 W JP2017016242 W JP 2017016242W WO 2017199701 A1 WO2017199701 A1 WO 2017199701A1
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WO
WIPO (PCT)
Prior art keywords
electronic circuit
pin header
pad
mold body
module
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PCT/JP2017/016242
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French (fr)
Japanese (ja)
Inventor
圭吾 鍵本
直宏 西脇
順哉 若林
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株式会社東海理化電機製作所
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Publication of WO2017199701A1 publication Critical patent/WO2017199701A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details

Definitions

  • the present invention relates to a module and a sensor device.
  • a magnetic sensor element an IC (Integrated Circuit) that is wire-bonded to the magnetic sensor element, amplifies the output of the magnetic sensor element, performs a predetermined process, and outputs the magnetic sensor element; and a magnet that applies a magnetic bias to the magnetic sensor element
  • IC Integrated Circuit
  • a magnetic sensor element and an IC are arranged in a frame.
  • the magnetic sensor module has leads that are wire-bonded to the IC, and the magnetic sensor element, IC, magnet, frame, and leads are sealed with a sealing resin.
  • a structure for positioning with a mold Is required for the magnetic sensor module.
  • this positioning structure is such that a part of the frame or the like protrudes from the magnetic sensor module, a gap may be formed between the secondary mold body and liquid such as water may enter the interior.
  • An object of the present invention is to provide a module and a sensor device that do not require components used only for positioning and can suppress an increase in the number of components.
  • a module includes an electronic circuit that performs a predetermined process, a base on which the electronic circuit is disposed, and a pad that is bent at one end and bonded to the pad.
  • the pin header used for positioning in the secondary molding with the other end serving as a connector terminal, and the electronic circuit, the substrate and the pin header so that the connector terminal is exposed.
  • a primary mold body obtained by resin-sealing the end portion.
  • a module and a sensor device that do not require components used only for positioning and suppress an increase in the number of components.
  • FIG. 1A and 1B are explanatory views showing a sensor module according to an embodiment, wherein FIG. 1A is a top view and FIG. 1B is a side view.
  • FIG. 2A is a side view showing a pin header of the sensor module according to the embodiment.
  • FIG. 2B is a perspective view showing an anchor portion of the pin header.
  • the module according to the embodiment is joined to an electronic circuit that performs a predetermined process, a base body on which the electronic circuit is disposed, and a pad that is bent at one end and provided on the base body, and is connected via the pad.
  • FIGS. 1A and 1B are explanatory views showing a sensor module according to an embodiment, wherein FIG. 1A is a top view and FIG. 1B is a side view.
  • FIG. 2A is a side view showing a pin header of the sensor module according to the embodiment, and
  • FIG. 2B is a perspective view showing an anchor portion of the pin header.
  • a short dotted line shown in FIGS. 1A and 1B shows an example of a schematic shape of the primary mold body 7.
  • a long dotted line indicates an example of the outline of the secondary mold body 90.
  • the ratio between figures may be different from the actual ratio.
  • the module of this embodiment is the sensor module 1 provided with the sensor element 30 which measures a physical quantity as shown in (a) and (b) of FIG. 1 as an example.
  • this sensor module 1 is mounted in a vehicle as an example, it is not limited to this.
  • the sensor module 1 is bonded to an electronic circuit 3 that performs a predetermined process, a substrate 2 as a base on which the electronic circuit 3 is disposed, and a pad 4 that is bent at one end and provided on the substrate 2.
  • the pin header 5 is electrically connected to the electronic circuit 3 through the pad 4 and the other end thereof becomes the connector terminal 93, and one end of the electronic circuit 3, the substrate 2, and the pin header 5 so that the connector terminal 93 is exposed.
  • a primary mold body 7 obtained by resin-sealing the part.
  • the sensor module 1 is further subjected to secondary molding and disposed as a sensor device 9 in the vehicle. As shown in FIGS. 1A and 1B, the sensor device 9 is formed by sealing the sensor module 1 with a resin so that a connector portion 92 from which the connector terminal 93 is exposed is formed. A next mold body 90 is provided.
  • the substrate 2 has a plate shape.
  • the substrate 2 is, for example, a printed wiring board.
  • the substrate 2 has an electronic circuit 3 formed on the surface 20.
  • the substrate 2 also has a plurality of pads 4 that are electrically connected to the electronic circuit 3.
  • the pad 4 has, for example, a rectangular shape.
  • the pad 4 is formed using a conductive material such as gold or copper.
  • the pad 4 of this embodiment is formed by copper plating as an example.
  • the electronic circuit 3 includes a sensor element 30 and a plurality of electronic components 31 as illustrated in FIG.
  • the sensor element 30 is a sensor that converts a detected physical quantity into an electrical quantity.
  • this sensor is a magnetic sensor that converts a change in magnetic field accompanying the approach of a detection target into an electrical quantity.
  • the detection target is an operation unit such as a brake lever.
  • the sensor element 30 has a detection surface 300 as shown in FIG.
  • the sensor element 30 is positioned with reference to the center 301 of the detection surface 300, for example.
  • the electronic component 31 is, for example, a resistor or a capacitor.
  • the electronic circuit 3 is configured to amplify a signal output from the sensor element 30 and output it to an electronic device electrically connected via the pad 4 and the pin header 5 as a predetermined process.
  • the predetermined process may include a correction process, an analog / digital conversion process, and the like as an example.
  • pin header 5 (Configuration of pin header 5)
  • a plurality of pin headers 5 are arranged at equal intervals.
  • the pin header 5 is connected to a connector at a connection destination.
  • Pin header 5 is, for example, as shown in FIGS. 2A and 2B, the anchor portion having a base 50 of the connector terminal 93, a bent portion 51, a width W 2 than the width W 1 in the transverse direction of the base portion 50 52.
  • the pin header 5 is formed in a quadrangular prism shape using, for example, a copper alloy.
  • the pin header 5 may be nickel-plated on the surface, and a metal such as gold or tin or an alloy containing these metals may be plated on the nickel plating.
  • the pitch of the pin header 5 is in accordance with the standard of the connector at the connection destination.
  • the base 50 is sealed by the primary mold body 7 and the secondary mold body 90 on the bent portion 51 side. Further, the base 50 has a connector terminal 93 at a portion exposed from the secondary mold body 90.
  • the bent portion 51 is formed by bending one end portion of the base portion 50.
  • An anchor portion 52 is formed at the tip of the bent portion 51.
  • the anchor part 52 has the convex part 53 which protrudes from the both sides
  • the bent portion 51 becomes a resistance and is primary compared to the case where only the anchor portion 52 is used. It is difficult for the connector terminal 93 to come off from the mold body 7 and the secondary mold body 90. Accordingly, in the sensor device 9, for example, peeling of the connector terminal 93 from the pad 4 and poor conduction between the pad 4 and the connector terminal 93 due to insertion / removal of the mating connector are suppressed.
  • the bonding between the pad 4 and the anchor portion 52 is performed by an adhesive 6 as an example.
  • the pad 4 and the anchor portion 52 may be joined by welding or soldering.
  • the primary mold body 7 covers and integrally forms the substrate 2, the electronic circuit 3, and the pin header 5 by molding with a sealing resin.
  • the primary mold body 7 is obtained by curing a thermosetting molding material in which, for example, a PPS (Poly Phenylene Sulfide) resin or an epoxy resin is a main component and a silica filler is added.
  • a PPS Poly Phenylene Sulfide
  • an epoxy resin is used as the thermosetting molding material.
  • the primary mold body 7 mainly protects the sensor element 30 and the like from environments such as light, heat, and humidity.
  • the sensor device 9 is formed by further performing secondary molding on the sensor module 1 formed by performing primary molding. By this secondary molding, a secondary mold body 90 is formed.
  • the secondary mold body 90 includes a main body 91 that covers the primary mold body 7 and a connector portion 92 that has a cylindrical shape and exposes the connector terminals 93 inside the cylinder.
  • the secondary mold body 90 is obtained by curing a thermosetting molding material containing, for example, a PPS resin or an epoxy resin.
  • the secondary mold body 90 of this embodiment uses an epoxy resin as a thermosetting molding material.
  • the secondary mold body 90 is formed by positioning the mold and the sensor module 1 and then pouring the sealing resin into the mold and curing the poured sealing resin.
  • This positioning accuracy is mainly related to the detection accuracy and the connection with the mating connector.
  • the primary mold body 7 covers the sensor element 30. Since the sensor element 30 is thus covered, in the secondary molding, for example, the sensor module 1 can be set at a predetermined position of the mold while confirming the position of the sensor element 30 by imaging with a camera. Can not. Further, when a lead frame or the like protruding from the primary mold body 7 is provided only for positioning, a gap is generated between the secondary mold body 90 and the lead frame, and liquid or the like can enter the inside of the primary mold body 7. There is sex.
  • the distance L to the end surface 500 of the pin header 5 and the center 301 of the sensor element 30 can be measured directly, and the exact distance L can be obtained. Therefore, in the secondary molding, by positioning the mold with respect to the pin header 5 of the sensor module 1, the positional deviation between the sensor element 30 and the secondary mold body 90 can be reduced as compared with the case where this configuration is not adopted. Can be suppressed.
  • the sensor module 1 Since the sensor module 1 according to the present embodiment does not require a component used only for positioning, an increase in the number of components can be suppressed.
  • the sensor module 1 is used for positioning the pin header 5 with a mold during secondary molding. Therefore, since the sensor module 1 does not require a component for positioning, an increase in the number of parts can be suppressed as compared with the case where it is necessary.
  • the sensor module 1 does not require a component only for positioning, it is not necessary to change the structure in order to employ this component.
  • the sensor module 1 joins the pin header 5 to the pad 4 of the substrate 2, there is nickel plating or the like for improving the joining of the wire as compared with the case of using a lead frame that is electrically connected by the pad and the wire. There is no need and the manufacturing cost can be reduced.
  • the pin header 5 is joined to the pad 4 of the substrate 2, so that disconnection of the pin header 5 due to insertion / removal of the mating connector and poor conduction with the pad 4 are suppressed.
  • the bent portion 51 of the pin header 5 becomes a resistance, and the disconnection of the pin header 5 from the primary mold body 7 and the secondary mold body 90 and the poor conduction with the pad 4 are suppressed. .
  • the sensor device 9 does not perform positioning with the mold by a member that is used only for positioning that protrudes from the sensor module 1, no gap is generated in places other than the connector terminal 93, and entry of liquid or the like can be suppressed. .

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)

Abstract

A sensor module 1 has: an electronic circuit 3 for performing pre-set processing; a substrate 2 on which the electronic circuit 3 is disposed; a pin header 5, one end part of which is folded and joined to a pad 4 provided to the substrate 2 and is electrically connected to the electronic circuit 3 via the pad 4, and the other end part of which is a connector terminal 93; and a primary mold body 7 obtained by resin-sealing the electronic circuit 3, the substrate 2, and the one-end part of the pin header 5 so that the connector terminal 93 is exposed.

Description

モジュール及びセンサ装置Module and sensor device
本発明は、モジュール及びセンサ装置に関する。 The present invention relates to a module and a sensor device.
磁気センサ素子と、磁気センサ素子とワイヤボンディングされ、磁気センサ素子の出力を増幅して所定の処理を施して出力するＩＣ（Integrated Circuit）と、磁気センサ素子に磁気バイアスをかける磁石と、を備えた磁気センサモジュールが知られている（例えば、特許文献１参照。）。 A magnetic sensor element, an IC (Integrated Circuit) that is wire-bonded to the magnetic sensor element, amplifies the output of the magnetic sensor element, performs a predetermined process, and outputs the magnetic sensor element; and a magnet that applies a magnetic bias to the magnetic sensor element A magnetic sensor module is known (for example, see Patent Document 1).
特許文献１に開示された磁気センサモジュールは、磁気センサ素子とＩＣがフレームに配置されている。また磁気センサモジュールは、ＩＣとワイヤボンディングされるリードを有し、磁気センサ素子、ＩＣ、磁石、フレーム及びリードが封止樹脂によって封止されている。 In the magnetic sensor module disclosed in Patent Document 1, a magnetic sensor element and an IC are arranged in a frame. The magnetic sensor module has leads that are wire-bonded to the IC, and the magnetic sensor element, IC, magnet, frame, and leads are sealed with a sealing resin.
特開２０１４－５２２６７号公報JP 2014-52267 A
特許文献１に開示された磁気センサモジュールのような一次モールド成形がなされた磁気センサモジュールに対して、さらに二次モールド成形を行って二次モールド体を形成した場合、金型との位置決めの構造が磁気センサモジュールに必要となる。この位置決めの構造が、一例として、磁気センサモジュールからフレームなどの一部を突出させるものである場合、二次モールド体との間に隙間が形成され、水などの液体が内部に侵入する可能性が有る。 When a secondary mold body is formed by further performing secondary molding on a magnetic sensor module that has been subjected to primary molding such as the magnetic sensor module disclosed in Patent Document 1, a structure for positioning with a mold Is required for the magnetic sensor module. As an example, when this positioning structure is such that a part of the frame or the like protrudes from the magnetic sensor module, a gap may be formed between the secondary mold body and liquid such as water may enter the interior. There is.
本発明の目的は、位置決めのみに使用する構成部品が必要なく、部品点数の増加を抑制することができるモジュール及びセンサ装置を提供することにある。 An object of the present invention is to provide a module and a sensor device that do not require components used only for positioning and can suppress an increase in the number of components.
本発明の一実施形態によるモジュールは、予め定められた処理を行う電子回路と、電子回路が配置された基体と、一方端部が折り曲げられて基体に設けられたパッドと接合されると共にパッドを介して電子回路と電気的に接続され、また他方端部がコネクタ端子となって二次モールドの際の位置決めに使用されるピンヘッダと、コネクタ端子が露出するように、電子回路、基体及びピンヘッダの一方端部を樹脂封止して得られた一次モールド体と、を有する。 A module according to an embodiment of the present invention includes an electronic circuit that performs a predetermined process, a base on which the electronic circuit is disposed, and a pad that is bent at one end and bonded to the pad. The pin header used for positioning in the secondary molding with the other end serving as a connector terminal, and the electronic circuit, the substrate and the pin header so that the connector terminal is exposed. And a primary mold body obtained by resin-sealing the end portion.
本発明の一実施形態によれば、位置決めのみに使用する構成部品が必要なく、部品点数の増加を抑制するモジュール及びセンサ装置を提供することができる。 According to one embodiment of the present invention, it is possible to provide a module and a sensor device that do not require components used only for positioning and suppress an increase in the number of components.
図１は、実施形態に係るセンサモジュールを示す説明図であり、（ａ）は上面図、（ｂ）は側面図である。1A and 1B are explanatory views showing a sensor module according to an embodiment, wherein FIG. 1A is a top view and FIG. 1B is a side view. 図２Ａは、実施形態に係るセンサモジュールのピンヘッダを示す側面図である。FIG. 2A is a side view showing a pin header of the sensor module according to the embodiment. 図２Ｂは、ピンヘッダのアンカー部を示す斜視図である。FIG. 2B is a perspective view showing an anchor portion of the pin header.
（実施形態の要約）
実施形態に係るモジュールは、予め定められた処理を行う電子回路と、電子回路が配置された基体と、一方端部が折り曲げられて基体に設けられたパッドと接合されると共にパッドを介して電子回路と電気的に接続され、他方端部がコネクタ端子となるピンヘッダと、コネクタ端子が露出するように、電子回路、基体及びピンヘッダの一方端部を樹脂封止して得られた一次モールド体と、を有している。 (Summary of Embodiment)
The module according to the embodiment is joined to an electronic circuit that performs a predetermined process, a base body on which the electronic circuit is disposed, and a pad that is bent at one end and provided on the base body, and is connected via the pad. A pin header electrically connected to the circuit, the other end being a connector terminal, and a primary molded body obtained by resin-sealing one end of the electronic circuit, the base and the pin header so that the connector terminal is exposed; ,have.
[実施形態]
（センサモジュール１の概要）
図１は、実施形態に係るセンサモジュールを示す説明図であり、（ａ）は上面図、（ｂ）は側面図である。図２Ａは、実施形態に係るセンサモジュールのピンヘッダを示す側面図であり、図２Ｂは、ピンヘッダのアンカー部を示す斜視図である。図１の（ａ）及び（ｂ）に示す間隔の短い点線は、一次モールド体７の概形の一例を示している。また間隔の長い点線は、二次モールド体９０の概形の一例を示している。なお、以下に記載する実施形態に係る各図において、図形間の比率は、実際の比率とは異なる場合がある。 [Embodiment]
(Outline of sensor module 1)
1A and 1B are explanatory views showing a sensor module according to an embodiment, wherein FIG. 1A is a top view and FIG. 1B is a side view. FIG. 2A is a side view showing a pin header of the sensor module according to the embodiment, and FIG. 2B is a perspective view showing an anchor portion of the pin header. A short dotted line shown in FIGS. 1A and 1B shows an example of a schematic shape of the primary mold body 7. A long dotted line indicates an example of the outline of the secondary mold body 90. In each figure according to the embodiments described below, the ratio between figures may be different from the actual ratio.
本実施形態のモジュールは、一例として、図１の（ａ）及び（ｂ）に示すように、物理量を測定するセンサ素子３０を備えたセンサモジュール１である。このセンサモジュール１は、一例として、車両に搭載されるがこれに限定されない。 The module of this embodiment is the sensor module 1 provided with the sensor element 30 which measures a physical quantity as shown in (a) and (b) of FIG. 1 as an example. Although this sensor module 1 is mounted in a vehicle as an example, it is not limited to this.
センサモジュール１は、予め定められた処理を行う電子回路３と、電子回路３が配置された基体としての基板２と、一方端部が折り曲げられて基板２に設けられたパッド４と接合されると共にパッド４を介して電子回路３と電気的に接続され、他方端部がコネクタ端子９３となるピンヘッダ５と、コネクタ端子９３が露出するように、電子回路３、基板２及びピンヘッダ５の一方端部を樹脂封止して得られた一次モールド体７と、を有している。 The sensor module 1 is bonded to an electronic circuit 3 that performs a predetermined process, a substrate 2 as a base on which the electronic circuit 3 is disposed, and a pad 4 that is bent at one end and provided on the substrate 2. In addition, the pin header 5 is electrically connected to the electronic circuit 3 through the pad 4 and the other end thereof becomes the connector terminal 93, and one end of the electronic circuit 3, the substrate 2, and the pin header 5 so that the connector terminal 93 is exposed. And a primary mold body 7 obtained by resin-sealing the part.
センサモジュール１は、さらに二次モールド成形がなされてセンサ装置９として車両に配置される。このセンサ装置９は、図１の（ａ）及び（ｂ）に示すように、コネクタ端子９３が露出するコネクタ部９２が形成されるように、センサモジュール１を樹脂封止して形成された二次モールド体９０を有している。 The sensor module 1 is further subjected to secondary molding and disposed as a sensor device 9 in the vehicle. As shown in FIGS. 1A and 1B, the sensor device 9 is formed by sealing the sensor module 1 with a resin so that a connector portion 92 from which the connector terminal 93 is exposed is formed. A next mold body 90 is provided.
（基板２の構成）
基板２は、一例として、板形状を有している。この基板２は、例えば、プリント配線基板である。この基板２は、電子回路３が表面２０に形成されている。また基板２は、電子回路３に電気的に接続される複数のパッド４を有している。 (Configuration of substrate 2)
As an example, the substrate 2 has a plate shape. The substrate 2 is, for example, a printed wiring board. The substrate 2 has an electronic circuit 3 formed on the surface 20. The substrate 2 also has a plurality of pads 4 that are electrically connected to the electronic circuit 3.
このパッド４は、例えば、矩形状を有している。このパッド４は、例えば、金、銅などの導電性を有する材料を用いて形成されている。本実施形態のパッド４は、一例として、銅メッキによって形成されている。 The pad 4 has, for example, a rectangular shape. The pad 4 is formed using a conductive material such as gold or copper. The pad 4 of this embodiment is formed by copper plating as an example.
（電子回路３の構成）
電子回路３は、一例として、図１の（ａ）に示すように、センサ素子３０と、複数の電子部品３１と、を有している。 (Configuration of electronic circuit 3)
As an example, the electronic circuit 3 includes a sensor element 30 and a plurality of electronic components 31 as illustrated in FIG.
センサ素子３０は、一例として、検出した物理量を電気的な量に変換するセンサである。このセンサは、一例として、検出対象の接近に伴う磁場の変化を電気的な量に変換する磁気センサである。この検出対象は、一例として、ブレーキレバーなどの操作部である。 As an example, the sensor element 30 is a sensor that converts a detected physical quantity into an electrical quantity. As an example, this sensor is a magnetic sensor that converts a change in magnetic field accompanying the approach of a detection target into an electrical quantity. As an example, the detection target is an operation unit such as a brake lever.
センサ素子３０は、例えば、図１の（ａ）に示すように、検出面３００を有している。センサ素子３０は、例えば、この検出面３００の中心３０１を基準として位置決めがなされる。電子部品３１は、一例として、抵抗やコンデンサなどである。 For example, the sensor element 30 has a detection surface 300 as shown in FIG. The sensor element 30 is positioned with reference to the center 301 of the detection surface 300, for example. The electronic component 31 is, for example, a resistor or a capacitor.
この電子回路３は、例えば、予め定められた処理として、センサ素子３０から出力された信号を増幅してパッド４及びピンヘッダ５を介して電気的に接続された電子機器に出力するように構成されている。なお予め定められた処理は、一例として、補正処理やアナログ・デジタル変換処理などを含んでいても良い。 For example, the electronic circuit 3 is configured to amplify a signal output from the sensor element 30 and output it to an electronic device electrically connected via the pad 4 and the pin header 5 as a predetermined process. ing. The predetermined process may include a correction process, an analog / digital conversion process, and the like as an example.
（ピンヘッダ５の構成）
センサモジュール１は、例えば、図１の（ａ）に示すように、複数のピンヘッダ５が等間隔に並んで配置されている。このピンヘッダ５は、接続先のコネクタに接続されるものである。 (Configuration of pin header 5)
In the sensor module 1, for example, as shown in FIG. 1A, a plurality of pin headers 5 are arranged at equal intervals. The pin header 5 is connected to a connector at a connection destination.
ピンヘッダ５は、例えば、図２Ａ及び２Ｂに示すように、コネクタ端子９３となる基部５０と、折曲部５１と、基部５０の短手方向の幅Ｗ１よりも広い幅Ｗ２を有するアンカー部５２と、を有している。 Pin header 5 is, for example, as shown in FIGS. 2A and 2B, the anchor portion having a base 50 of the connector terminal 93, a bent portion 51, a width W 2 than the width W 1 in the transverse direction of the base portion 50 52.
ピンヘッダ５は、例えば、銅の合金などを用いて四角柱形状に形成されている。なおピンヘッダ５は、一例として、表面にニッケルメッキを施し、そのニッケルメッキの上に、金、錫などの金属やそれら金属を含む合金などのメッキが施されても良い。ピンヘッダ５のピッチは、接続先のコネクタの規格に応じている。 The pin header 5 is formed in a quadrangular prism shape using, for example, a copper alloy. As an example, the pin header 5 may be nickel-plated on the surface, and a metal such as gold or tin or an alloy containing these metals may be plated on the nickel plating. The pitch of the pin header 5 is in accordance with the standard of the connector at the connection destination.
基部５０は、折曲部５１側が一次モールド体７及び二次モールド体９０によって封止されている。また基部５０は、二次モールド体９０から露出する部分がコネクタ端子９３となっている。 The base 50 is sealed by the primary mold body 7 and the secondary mold body 90 on the bent portion 51 side. Further, the base 50 has a connector terminal 93 at a portion exposed from the secondary mold body 90.
折曲部５１は、基部５０の一方端部を折り曲げて形成されている。この折曲部５１の先端には、アンカー部５２が形成されている。 The bent portion 51 is formed by bending one end portion of the base portion 50. An anchor portion 52 is formed at the tip of the bent portion 51.
アンカー部５２は、図２Ａ及び２Ｂに示すように、折曲部５１の両側面から突出する凸部５３を有している。この凸部５３によってアンカー部５２の幅Ｗ２は、基部５０の幅Ｗ１よりも広くなっている。従ってアンカー部５２は、凸部がない場合と比べて、パッド４との接触面積が広いので、基板２との接合力が大きくなっている。 The anchor part 52 has the convex part 53 which protrudes from the both sides | surfaces of the bending part 51, as shown to FIG. 2A and 2B. Due to the convex portion 53, the width W 2 of the anchor portion 52 is wider than the width W 1 of the base portion 50. Therefore, since the anchor portion 52 has a larger contact area with the pad 4 than in the case where there is no convex portion, the bonding force with the substrate 2 is increased.
またセンサモジュール１は、折曲部５１が形成されているので、図２Ｂに示す矢印方向に力が働いても、この折曲部５１が抵抗となり、アンカー部５２のみの場合と比べて、一次モールド体７及び二次モールド体９０からコネクタ端子９３が抜け難い。従ってセンサ装置９は、例えば、相手側コネクタの抜き差しに伴う、パッド４からのコネクタ端子９３の剥がれやパッド４とコネクタ端子９３との導通不良が抑制される。 Since the sensor module 1 is formed with the bent portion 51, even when a force is applied in the direction of the arrow shown in FIG. 2B, the bent portion 51 becomes a resistance and is primary compared to the case where only the anchor portion 52 is used. It is difficult for the connector terminal 93 to come off from the mold body 7 and the secondary mold body 90. Accordingly, in the sensor device 9, for example, peeling of the connector terminal 93 from the pad 4 and poor conduction between the pad 4 and the connector terminal 93 due to insertion / removal of the mating connector are suppressed.
このパッド４とアンカー部５２の接合は、一例として、接着剤６によって行われる。なお変形例としてパッド４とアンカー部５２の接合は、溶接や半田による接合であっても良い。 The bonding between the pad 4 and the anchor portion 52 is performed by an adhesive 6 as an example. As a modification, the pad 4 and the anchor portion 52 may be joined by welding or soldering.
（一次モールド体７の構成）
一次モールド体７は、封止樹脂によるモールド成形によって基板２、電子回路３及びピンヘッダ５の一部を覆って一体とするものである。この一次モールド体７は、例えば、ＰＰＳ（Poly Phenylene Sulfide）樹脂やエポキシ樹脂を主成分に、シリカ充填材などを加えた熱硬化性成形材料が硬化したものである。本実施形態では、熱硬化性成形材料としてエポキシ樹脂が使用されている。一次モールド体７は、例えば、主にセンサ素子３０などを光、熱及び湿度などの環境から保護している。 (Configuration of primary mold body 7)
The primary mold body 7 covers and integrally forms the substrate 2, the electronic circuit 3, and the pin header 5 by molding with a sealing resin. The primary mold body 7 is obtained by curing a thermosetting molding material in which, for example, a PPS (Poly Phenylene Sulfide) resin or an epoxy resin is a main component and a silica filler is added. In this embodiment, an epoxy resin is used as the thermosetting molding material. For example, the primary mold body 7 mainly protects the sensor element 30 and the like from environments such as light, heat, and humidity.
（センサ装置９の構成）
センサ装置９は、一次モールド成形を行って形成されたセンサモジュール１に対して、さらに二次モールド成形を行って形成されている。この二次モールド成形により、二次モールド体９０が形成される。 (Configuration of sensor device 9)
The sensor device 9 is formed by further performing secondary molding on the sensor module 1 formed by performing primary molding. By this secondary molding, a secondary mold body 90 is formed.
この二次モールド体９０は、一次モールド体７を覆う本体９１と、筒形状を有し、筒の内部にコネクタ端子９３が露出するコネクタ部９２と、を有している。 The secondary mold body 90 includes a main body 91 that covers the primary mold body 7 and a connector portion 92 that has a cylindrical shape and exposes the connector terminals 93 inside the cylinder.
二次モールド体９０は、例えば、ＰＰＳ樹脂やエポキシ樹脂などを含む熱硬化性成形材料が硬化したものである。本実施形態の二次モールド体９０は、熱硬化性成形材料としてエポキシ樹脂が使用されている。 The secondary mold body 90 is obtained by curing a thermosetting molding material containing, for example, a PPS resin or an epoxy resin. The secondary mold body 90 of this embodiment uses an epoxy resin as a thermosetting molding material.
ここで二次モールド体９０の形成は、金型とセンサモジュール１の位置決めを行った後、封止樹脂を金型に流し込み、流し込んだ封止樹脂を硬化させて行われる。この位置決めの精度は、主に検出精度及び相手側コネクタとの接続に関係する。 Here, the secondary mold body 90 is formed by positioning the mold and the sensor module 1 and then pouring the sealing resin into the mold and curing the poured sealing resin. This positioning accuracy is mainly related to the detection accuracy and the connection with the mating connector.
センサモジュール１は、一次モールド体７がセンサ素子３０を覆っている。このようにセンサ素子３０が覆われているので、二次モールド成形では、例えば、カメラによる撮像によってセンサ素子３０の位置を確認しながらセンサモジュール１を金型の決められた位置にセットすることができない。また位置決めのためだけに一次モールド体７から突出するリードフレームなどを設けた場合、二次モールド体９０とリードフレームとの間に隙間が生じ、液体などが一次モールド体７の内部に侵入する可能性がある。 In the sensor module 1, the primary mold body 7 covers the sensor element 30. Since the sensor element 30 is thus covered, in the secondary molding, for example, the sensor module 1 can be set at a predetermined position of the mold while confirming the position of the sensor element 30 by imaging with a camera. Can not. Further, when a lead frame or the like protruding from the primary mold body 7 is provided only for positioning, a gap is generated between the secondary mold body 90 and the lead frame, and liquid or the like can enter the inside of the primary mold body 7. There is sex.
またセンサモジュール１と二次モールド成形に用いる金型との位置がずれている場合、センサ素子３０と二次モールド体９０の相対的な位置がずれるので、検出対象とセンサ素子３０の相対的な位置がずれて検出精度が低下する可能性がある。 In addition, when the position of the sensor module 1 and the mold used for the secondary molding is shifted, the relative positions of the sensor element 30 and the secondary mold body 90 are shifted. There is a possibility that the detection accuracy is lowered due to the displacement.
さらにコネクタ端子９３とコネクタ部９２との相対的な位置がずれた場合、相手側コネクタがコネクタ部９２に接続できない可能性がある。 Furthermore, when the relative position of the connector terminal 93 and the connector part 92 shift | deviates, the other party connector may be unable to connect to the connector part 92. FIG.
本実施形態では、ピンヘッダ５が基板２に接合されるので、ピンヘッダ５の端面５００とセンサ素子３０の中心３０１までの距離Ｌを直接測定することができ、正確な距離Ｌを得ることができる。従って二次モールド成形において、センサモジュール１のピンヘッダ５を基準として金型との位置決めを行うことで、この構成を採用しない場合と比べて、センサ素子３０と二次モールド体９０との位置ずれを抑制することができる。 In this embodiment, since the pin header 5 is joined to the board | substrate 2, the distance L to the end surface 500 of the pin header 5 and the center 301 of the sensor element 30 can be measured directly, and the exact distance L can be obtained. Therefore, in the secondary molding, by positioning the mold with respect to the pin header 5 of the sensor module 1, the positional deviation between the sensor element 30 and the secondary mold body 90 can be reduced as compared with the case where this configuration is not adopted. Can be suppressed.
（実施形態の効果）
本実施形態に係るセンサモジュール１は、位置決めのみに使用する構成部品が必要ないので、部品点数の増加を抑制することができる。センサモジュール１は、ピンヘッダ５が二次モールド成形時の金型との位置決めに利用される。従ってセンサモジュール１は、位置決めのための構成部品が必要ないので、必要である場合と比べて、部品点数の増加を抑制することができる。 (Effect of embodiment)
Since the sensor module 1 according to the present embodiment does not require a component used only for positioning, an increase in the number of components can be suppressed. The sensor module 1 is used for positioning the pin header 5 with a mold during secondary molding. Therefore, since the sensor module 1 does not require a component for positioning, an increase in the number of parts can be suppressed as compared with the case where it is necessary.
センサモジュール１は、位置決めのみの構成部品を必要としないので、この構成部品を採用するために構造を変更する必要がない。 Since the sensor module 1 does not require a component only for positioning, it is not necessary to change the structure in order to employ this component.
センサモジュール１は、ピンヘッダ５を基板２のパッド４に接合するので、パッドとワイヤによって電気的な接続がなされるリードフレームを用いる場合と比べて、ワイヤの接合を良くするためのニッケルメッキなどが必要なく、製造コストを抑制することができる。またセンサモジュール１は、ピンヘッダ５が基板２のパッド４に接合されるので、相手側コネクタの抜き差しによるピンヘッダ５の抜けやパッド４との導通不良が抑制される。 Since the sensor module 1 joins the pin header 5 to the pad 4 of the substrate 2, there is nickel plating or the like for improving the joining of the wire as compared with the case of using a lead frame that is electrically connected by the pad and the wire. There is no need and the manufacturing cost can be reduced. In the sensor module 1, the pin header 5 is joined to the pad 4 of the substrate 2, so that disconnection of the pin header 5 due to insertion / removal of the mating connector and poor conduction with the pad 4 are suppressed.
センサ装置９は、相手側コネクタの抜き差しにおいて、ピンヘッダ５の折曲部５１が抵抗となり、一次モールド体７及び二次モールド体９０からのピンヘッダ５の抜けやパッド４との導通不良が抑制される。 In the sensor device 9, when the mating connector is inserted and removed, the bent portion 51 of the pin header 5 becomes a resistance, and the disconnection of the pin header 5 from the primary mold body 7 and the secondary mold body 90 and the poor conduction with the pad 4 are suppressed. .
センサ装置９は、センサモジュール１から突出する位置決めのみに用いられる部材によって金型との位置決めを行わないので、コネクタ端子９３以外の場所で隙間が生じず、液体などの侵入を抑制することができる。 Since the sensor device 9 does not perform positioning with the mold by a member that is used only for positioning that protrudes from the sensor module 1, no gap is generated in places other than the connector terminal 93, and entry of liquid or the like can be suppressed. .
以上、本発明の実施形態及び変形例を説明したが、この実施形態及び変形例は、一例に過ぎず、請求の範囲に係る発明を限定するものではない。この新規な実施形態及び変形例は、その他の様々な形態で実施されることが可能であり、本発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更などを行うことができる。また、この実施形態及び変形例の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない。さらに、この実施形態及び変形例は、発明の範囲及び要旨に含まれると共に、請求の範囲に記載された発明とその均等の範囲に含まれる。 As mentioned above, although embodiment and the modification of this invention were described, this embodiment and the modification are only examples, and do not limit the invention which concerns on a claim. The novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the gist of the present invention. In addition, not all the combinations of features described in this embodiment and the modified examples are essential to the means for solving the problems of the invention. Further, the embodiments and the modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.
１　センサモジュール
２　基板
３　電子回路
４　パッド
５　ピンヘッダ
６　接着剤
７　一次モールド体
９　センサ装置
２０　表面
３１　電子部品
５０　基部
５１　折曲部
５２　アンカー部
９０　二次モールド体
９３　コネクタ端子 DESCRIPTION OF SYMBOLS 1 Sensor module 2 Board | substrate 3 Electronic circuit 4 Pad 5 Pin header 6 Adhesive 7 Primary mold body 9 Sensor apparatus 20 Surface 31 Electronic component 50 Base 51 Bending part 52 Anchor part 90 Secondary mold body 93 Connector terminal

Claims (7)

  1. 予め定められた処理を行う電子回路と、
    前記電子回路が配置された基体と、
    一方端部が折り曲げられて前記基体に設けられたパッドと接合されると共に前記パッドを介して前記電子回路と電気的に接続され、また他方端部がコネクタ端子となって二次モールドの際の位置決めに使用されるピンヘッダと、
    前記コネクタ端子が露出するように、前記電子回路、前記基体及び前記ピンヘッダの一方端部を樹脂封止して得られた一次モールド体と、を有するモジュール。     An electronic circuit for performing a predetermined process;
    A substrate on which the electronic circuit is disposed;
    One end is bent and joined to a pad provided on the base and electrically connected to the electronic circuit through the pad, and the other end serves as a connector terminal during secondary molding. A pin header used for positioning;
    A module having a primary mold body obtained by resin sealing one end of the electronic circuit, the base, and the pin header so that the connector terminal is exposed.
  2. 前記ピンヘッダは、前記コネクタ端子となる基部と、前記基部の短手方向の幅よりも広い幅を有するアンカー部と、を有し、
    前記アンカー部は、前記パッドと接合される、請求項１に記載のモジュール。     The pin header has a base portion to be the connector terminal, and an anchor portion having a width wider than a width in a short direction of the base portion,
    The module according to claim 1, wherein the anchor portion is joined to the pad.
  3. 前記電子回路は、物理量を測定するセンサ素子を有し、
    前記コネクタ端子が露出するコネクタ部が形成されるように、請求項１又は２に記載のモジュールを樹脂封止して形成された二次モールド体を有するセンサ装置。     The electronic circuit has a sensor element for measuring a physical quantity,
    The sensor apparatus which has a secondary mold body formed by resin-sealing the module of Claim 1 or 2 so that the connector part which the said connector terminal exposes may be formed.
  4. 前記ピンヘッダは、前記電子回路が配置される前記基体の表面と同一表面上で前記パッドと接合される、請求項１に記載のモジュール。 The module according to claim 1, wherein the pin header is bonded to the pad on the same surface as the surface of the base on which the electronic circuit is disposed.
  5. 前記ピンヘッダは、前記電子回路が配置される前記基体の表面と異なる表面上で前記パッドと接合される、請求項１に記載のモジュール。 The module according to claim 1, wherein the pin header is bonded to the pad on a surface different from a surface of the base on which the electronic circuit is disposed.
  6. 前記ピンヘッダは、導電性接着剤によって前記パッドと接合される、請求項１に記載のモジュール。 The module of claim 1, wherein the pin header is joined to the pad by a conductive adhesive.
  7. 前記ピンヘッダは、長手方向に直交する方向において矩形状の断面を有する、請求項１に記載のモジュール。
          The module according to claim 1, wherein the pin header has a rectangular cross section in a direction orthogonal to the longitudinal direction.
PCT/JP2017/016242 2016-05-17 2017-04-24 Module and sensor device WO2017199701A1 (en)

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JP2006071654A (en) * 2005-11-30 2006-03-16 Aisin Seiki Co Ltd Rotation angle detector, and holding method for electronic component

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064001A (en) * 2000-08-22 2002-02-28 Matsushita Electric Ind Co Ltd Resistor element, variable resistor using the same, and method of manufacturing the same
JP2002181909A (en) * 2000-12-12 2002-06-26 Teikoku Tsushin Kogyo Co Ltd Method of manufacturing magnetic sensor
JP2003142177A (en) * 2001-11-07 2003-05-16 Alps Electric Co Ltd Electrical part and manufacturing method therefor
JP2003174266A (en) * 2001-12-07 2003-06-20 Teikoku Tsushin Kogyo Co Ltd Case for electronic component with external terminal and manufacturing method thereof
JP2006071654A (en) * 2005-11-30 2006-03-16 Aisin Seiki Co Ltd Rotation angle detector, and holding method for electronic component

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