WO2017170606A1 - Image acquisition device - Google Patents

Image acquisition device Download PDF

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Publication number
WO2017170606A1
WO2017170606A1 PCT/JP2017/012754 JP2017012754W WO2017170606A1 WO 2017170606 A1 WO2017170606 A1 WO 2017170606A1 JP 2017012754 W JP2017012754 W JP 2017012754W WO 2017170606 A1 WO2017170606 A1 WO 2017170606A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
protective plate
glass plate
plate
resin
Prior art date
Application number
PCT/JP2017/012754
Other languages
French (fr)
Japanese (ja)
Inventor
琢治 野村
海生 曽
Original Assignee
旭硝子株式会社
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Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2018508104A priority Critical patent/JP6729681B2/en
Publication of WO2017170606A1 publication Critical patent/WO2017170606A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/113—Anti-reflection coatings using inorganic layer materials only
    • G02B1/115—Multilayers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to an imaging device having a protective plate, an imaging lens, and a solid-state imaging device.
  • an optical device such as an imaging device for imaging a subject Is installed.
  • an image pickup apparatus includes a solid-state image pickup device such as a CCD or CMOS image sensor, a lens for condensing an image to be captured by the solid-state image pickup device, and further disposed on the subject side so that the lens, the solid-state image pickup device, etc.
  • a protective plate is provided for protecting from.
  • Patent Document 1 includes an antireflection film for suppressing light loss and improving light use efficiency on the subject side of the main surface of a plate-like substrate made of sapphire or diamond.
  • a lens cover material for an image pickup apparatus including an optical multilayer film having an infrared ray blocking function on the image pickup element side is described.
  • Patent Document 1 substrates such as sapphire and diamond are not only expensive, but the structure of the protective plate in Patent Document 1 in which an optical multilayer film, which is an inorganic film, is applied to the surface of the substrate, is not provided with a similar inorganic film on the surface.
  • the protective plate is particularly required to have a high strength in order to suppress damage that may occur when an obstacle or the like comes into contact with the surface of an imaging device mounted on a portable terminal or the like.
  • the structure is not equipped with an inorganic film to maintain the strength, the light utilization efficiency will be reduced due to the reflection that occurs at the interface with the air, and the hybrid will have other optical functions such as infrared blocking function. Can not.
  • the protective plate in the imaging apparatus there is a trade-off relationship between obtaining high strength and having an optical function for the purpose of improving light utilization efficiency.
  • an object of the present invention is to provide an imaging apparatus capable of achieving both suppression of breakage due to external contact and the like and an optical function such as high light utilization efficiency. It is another object of the present invention to provide a high-performance image pickup apparatus including a protective plate having an optical function such as high light utilization efficiency without causing a decrease in strength.
  • An image pickup apparatus includes an image pickup element, a lens that focuses light on the image pickup element, and a protection plate that is provided closer to the subject than the lens and is in contact with outside air.
  • the protection plate includes a glass plate and a glass plate. Including a resin layer provided in contact with the main surface of the substrate and an inorganic film provided on the resin layer, and the protective plate is disposed in this order from the subject side in the order of the glass plate, the resin layer, and the inorganic film.
  • the inorganic film may be a dielectric multilayer film having at least an antireflection function.
  • the protective plate may have a flexural modulus of 500 MPa or more.
  • the resin layer may be formed using at least one resin material selected from polyimide resin, epoxy resin, polycycloolefin resin, polycarbonate resin, and acrylic resin.
  • the total thickness of the glass plate and the resin layer may be 0.07 to 1.1 mm.
  • the thickness of the resin layer may be 20 to 100 ⁇ m.
  • the glass plate may be a chemically strengthened glass substrate.
  • the protective plate may be provided with a second antireflection film on the main surface of the glass plate on the subject side, and the transmittance of the protective plate with respect to light having a wavelength of 400 to 670 nm may be 96% or more.
  • the protective plate may have a reflectance of 2% or less with respect to light having a wavelength of 400 to 670 nm.
  • an antifouling film made of a material containing fluorine may be formed on the second antireflection film.
  • the protective plate may include a light shielding film that shields a part of incident light.
  • an imaging apparatus capable of achieving both suppression of breakage due to external contact and the like and an optical function such as high light utilization efficiency.
  • an optical function such as high light utilization efficiency.
  • FIG. 1 is a configuration diagram illustrating an example of an imaging apparatus according to the first embodiment.
  • FIG. 2 is an explanatory diagram of a mechanism of cracks generated from external pressure applied to the protective plate and defects on the surface of the glass plate, (a) is a schematic diagram of the protective plate of the embodiment, and (b) is not provided with a resin layer. That is, it is a schematic view of a protective plate provided with an inorganic film in contact with the main surface of the glass plate.
  • FIG. 3 is a configuration diagram illustrating another example of the protection plate of the imaging apparatus according to the second embodiment.
  • FIG. 4 is a configuration diagram illustrating an example of a protection plate of the imaging apparatus according to the third embodiment.
  • FIG. 1 is a configuration diagram illustrating an example of an imaging apparatus 10 according to the present embodiment.
  • the imaging device 10 includes a solid-state imaging device 50 such as a CCD or CMOS, a lens 40 that collects image light on the solid-state imaging device 50, and a protection plate 20 that protects the lens or the like.
  • the protective plate 20 may be provided at a position that is provided closer to the subject than the lens 40 and is in contact with the outside air. These (the solid-state imaging device 50, the lens 40, the protective plate 20, and the like) are fixed by the casing 15. Further, the lens 40 is not limited to a single lens as illustrated, and includes a plurality of lens groups.
  • the protective plate 20 includes a glass plate 21, a resin layer 22, and an inorganic film 31 from the subject side.
  • the inorganic film 31 include those that function as an antireflection film having an antireflection function that reduces reflection of light having a predetermined wavelength.
  • Another example is one that functions as a near-infrared cut filter having a near-infrared cut filter function for blocking predetermined near-infrared light.
  • the inorganic film 31 may have both of these functions.
  • the case where the inorganic film 31 is an antireflection film having an antireflection function will be described as an example.
  • the inorganic film 31 in this embodiment is referred to as the first antireflection film 31 for convenience, and the antireflection film in the second embodiment. 32 may be referred to as a second antireflection film 32.
  • FIG. 1 shows an example in which the glass plate 21, the resin layer 22, and the inorganic film 31 are arranged adjacent to each other in this order in the protective plate 20, but the inorganic film 31 is not necessarily in contact with the resin layer 22. It does not have to be. That is, another optical functional layer may be provided between the resin layer 22 and the inorganic film 31.
  • the resin layer 22 is provided in contact with the main surface of the glass plate 21 on the half subject side.
  • the glass plate 21 is not limited to a flat plate shape, and may be a curved surface having a predetermined curvature, for example, by matching with the shape of the housing of the imaging device. Further, the thickness of the glass plate 21 is not limited to a constant one, and may have a distribution.
  • the glass material used for the glass plate 21 is not particularly limited, but a material having high strength is preferable because it can be made thinner and the transmittance can be further increased.
  • a glass substrate used as the base of the glass plate 21 a chemically strengthened glass substrate is more preferable.
  • the chemically tempered glass substrate refers to a glass substrate whose strength against bending and drop impact is increased by chemical treatment.
  • the thickness of the glass plate 21 is preferably 0.05 mm or more and 1 mm or less. For example, if the thickness of the glass plate 21 is less than 0.05 mm, a desired strength may not be obtained, and if it exceeds 1 mm, the size of the image pickup device mounted on a portable terminal is reduced. There is a risk that it will be difficult to realize.
  • the thickness of the glass plate 21 0.10 mm or more is more preferable, and 0.15 mm or more is further more preferable.
  • the thickness of the glass plate 21 is more preferably 0.40 mm or less, and further preferably 0.35 mm or less.
  • Resin layer 22 is provided in contact with the main surface of glass plate 21.
  • the material used for the resin layer 22 is not particularly limited as long as it is a transparent resin material, and is an acrylic resin, epoxy resin, polyester resin, silicone resin, polycarbonate resin, polyurethane resin, polyurea resin, ethylene-acetic acid.
  • examples thereof include polyvinyl alcohol resin-modified materials such as vinyl copolymer resins and polyvinyl butyral resins, cycloolefin polymer resins, polystyrene resins, transparent fluororesins, transparent polyamide resins, transparent polyimide resins, and polyamideimide resins.
  • the resin layer 22 may be formed using at least one of these resin materials. .
  • the resin layer 22 can be produced by applying a liquid that is a material of the resin layer 22 by a spin coating method, an ink jet method, a transfer method, a screen printing method, or the like. Moreover, in order to reinforce the adhesion between the glass plate 21 and the resin layer 22, the main surface of the glass plate 21 may be subjected to a surface treatment with a silane coupling agent.
  • silane coupling agent examples include ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) -N′- ⁇ - (amino Aminosilanes such as ethyl) - ⁇ -aminopropyltriethoxysilane and ⁇ -anilinopropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane Epoxy silanes such as, vinyltrimethoxysilane, vinylsilanes such as N- ⁇ - (N-vinylbenzylaminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ -methacryloxypropyltrimethoxysi
  • the thickness of the resin layer 22 is preferably 20 ⁇ m or more and 100 ⁇ m or less.
  • the protective plate 20 may not be able to achieve high strength, and if it exceeds 100 ⁇ m, the difference in refractive index between the resin layer 22 and the inorganic film 31 may be reduced. In relation, there is a possibility that the function (for example, antireflection characteristics) as the inorganic film 31 is lowered.
  • the thickness of the resin layer 22 is more preferably 30 ⁇ m or more, and further preferably 50 ⁇ m or more. Further, the thickness of the resin layer 22 is more preferably 90 ⁇ m or less, and further preferably 80 ⁇ m or less.
  • the total thickness of the glass plate 21 and the resin layer 22 is preferably 0.07 mm or more and 1.1 mm or less.
  • the protection plate 20 may not be able to achieve high strength, and if it exceeds 1.1 mm, There is a risk that it will be difficult to reduce the size.
  • the total thickness of the glass plate 21 and the resin layer 22 is more preferably 0.10 mm or more, and further preferably 0.15 mm or more.
  • the total thickness of the glass plate 21 and the resin layer 22 is more preferably 0.40 mm or less, and further preferably 0.35 mm or less.
  • the first antireflection film 31 may be a dielectric multilayer film in which a high refractive index film having a relatively high refractive index and a low refractive index film having a low refractive index are alternately provided.
  • the first antireflection film 31 typically includes two kinds of inorganic films, for example, a TiO 2 film as a high refractive index film and a SiO 2 film as a low refractive index film.
  • the first antireflection film 31 only needs to reduce the reflectance with respect to light having a wavelength requiring high transparency, for example, visible light. Further, the first antireflection film 31 may be configured to reduce the visible light reflectance at a wavelength of 400 to 670 nm and to have, for example, a near infrared cut filter function for blocking predetermined near infrared light. .
  • FIG. 2 is a diagram schematically illustrating the mechanism of expansion and destruction of defects generated in the protective plate when the two protective plates are pressed against the glass plate 21 and pressed.
  • FIG. 2A is a schematic diagram of the protective plate 20 of the present embodiment
  • FIG. 2B does not include the resin layer 22, that is, the inorganic film 31 in contact with the main surface of the glass plate 21.
  • It is a schematic diagram of the protection board 80 provided with.
  • FIG. 2 schematically shows an expansion state in the case where the surface of the glass plate 21 has a defect 60 such as a scratch.
  • the tensile stress ⁇ c at the tip thereof greatly exceeds the original tensile stress ⁇ a of the glass plate 21.
  • the tensile stress ⁇ c may be several tens of times the tensile stress ⁇ a .
  • FIG. 2 when pressure is applied in the thickness direction (arrow direction in the figure) at the center of the surface of the glass plate 21, the protective plate is deformed so as to bend. At this time, as shown in FIG.
  • the resin layer 22 when the resin layer 22 is interposed between the first antireflection film 31 and the glass plate 21, which are generally made of an inorganic multilayer film having a tensile stress smaller than that of the glass plate 21.
  • the resin layer 22 exhibits a buffering function, and the progress of destruction from the defect 60 occurring on the glass plate surface is suppressed.
  • the protective plate 80 provided with the first antireflection film 31 in contact with the main surface of the glass plate 21 having the defect 60 on the surface, the first having no buffer function.
  • the antireflection film 31 is increased in pressure and a crack occurs in the first antireflection film 31, a crack 60a is generated from the defect 60 on the surface of the glass plate 21 starting from the crack.
  • the (destructive) strength of the entire protection plate 80 is reduced.
  • the protective plate 20 has a defect 60 formed on the surface of the glass plate 21. As a starting point, the progress of cracks can be suppressed, and high durability against external pressure, that is, high fracture strength can be obtained.
  • the protective plate 20 is preferable because the light use efficiency is enhanced by the small scattering with respect to the incident light.
  • the protection plate 20 in the image pickup apparatus of the present invention preferably has particularly high visible light utilization efficiency, and has a Haze value when a D65 light source corresponding to a standard light source defined by CIE is incident from the normal direction of the protection plate 20. It may be 1% or less. Further, the protective plate 20 has a Haze value with respect to the D65 light source of preferably 0.4% or less, and more preferably 0.1% or less.
  • FIG. 3 is a configuration diagram illustrating an example of the protection plate 20a in the imaging apparatus according to the second embodiment.
  • the protection plate 20a shown in FIG. 3 is second on the opposite side of the main surface on the resin layer 22 side of the glass plate 21, that is, on the main surface on the subject side.
  • the antireflection film 32 is provided.
  • the imaging apparatus according to the present embodiment is not particularly illustrated, it corresponds to the imaging apparatus 10 of FIG. 1 that includes a protection plate 20a instead of the protection plate 20.
  • the second antireflection film 32, the glass plate 21, the resin layer 22, and the inorganic film (first antireflection film) 31 are arranged in this order from the subject side.
  • the second antireflection film 32 only needs to reduce the visible light reflectance at a wavelength of 400 to 670 nm.
  • the second antireflection film 32 has a near infrared cut filter function for blocking predetermined near infrared light as well as reducing the visible light reflectance. It may be configured.
  • the protective plate 20a in the image pickup apparatus of the second embodiment can improve the use efficiency of visible light, in particular, by providing the antireflection film on both interfaces with the outside air.
  • the protective plate 20a can realize a transmittance of, for example, 96% or more for visible light having a wavelength of 400 to 670 nm.
  • the transmittance of visible light with a wavelength of 400 to 670 nm of the protective plate 20a is preferably 97% or more, and more preferably 98% or more.
  • the protective plate 20a can achieve a visible light reflectance of 2% or less at both interfaces having a wavelength of 400 to 670 nm incident from both sides by such a configuration.
  • the visible light reflectivity at both interfaces of wavelengths 400 to 670 nm incident from both sides of the protective plate 20a is preferably 1% or less, and more preferably 0.5% or less.
  • FIG. 4 is a configuration diagram illustrating an example of the protection plate 20b in the imaging apparatus according to the third embodiment.
  • the protection plate 20b shown in FIG. 4 includes a light shielding film 24 on the first antireflection film 31 in addition to the configuration of the protection plate 20a of the second embodiment, and the second antireflection film 32.
  • the difference is that an antifouling layer 23 is provided on the top.
  • the light shielding film 24 functions as a diaphragm, and is provided in the peripheral portion of the first antireflection film 31, and the center portion is open.
  • a material having a light shielding property can be used as the material of the light shielding film 24, a material having a light shielding property can be used.
  • FIG. 4 shows an example provided on the first antireflection film 31, the arrangement of the light shielding film 24 is not particularly limited as long as the diaphragm function can be realized.
  • the arrangement of the light-shielding film 24 for example, when the light-shielding film 24 is provided on the solid-state imaging device 50 side, an effect of further improving the light-shielding property against stray light reflected from the solid-state imaging device 50 can be expected.
  • the antifouling layer 23 is provided on the outermost part (most subject side) like the protective plate 20b, an effect of reducing dirt such as fingerprint residue from the outside can be expected.
  • the antifouling layer 23 may be called AFP (Anti-Finger-Print).
  • the antifouling layer 23 may be formed of an antifouling coating agent shown in Chemical Formula 1 below.
  • the antifouling layer 23 may have a function of preventing a fingerprint residue on the protective plate or easily wiping off the fingerprint residue.
  • the antifouling coating agent shown in Chemical Formula 1 comprises a fluorinated siloxane produced by applying a coating composition containing a fluorinated silane, wherein Rf is an all-optionally containing one or more oxygen atoms.
  • a fluorinated group; R 1 is substituted with one or more heteroatoms selected from oxygen, nitrogen or sulfur or substituted with a functional group selected from carbonyl, amide or sulfonamide, 2-16
  • R 2 is a lower alkyl group;
  • X is a halogen, a lower alkoxy group, or an acyloxy group, provided that X If the group comprises an alkoxy group, there is at least one acyloxy group or halogen group;
  • x is 0 or 1.
  • Example 1 In Example 1, a glass substrate having a thickness of 0.1 mm was prepared as the glass plate 21, and one main surface of the glass substrate was subjected to silane coupling treatment. Then, a polyimide resin solution was applied to the main surface subjected to the silane coupling treatment by a spin coating method and then dried by heating to obtain a polyimide resin layer 22 having a thickness of 23 ⁇ m. Thereafter, an inorganic film (first antireflection film) 31 was formed on the surface of the resin layer 22 by alternately laminating TiO 2 films and SiO 2 films, and the protective plate 20 was obtained. At this time, the visible light reflectance on the inorganic film 31 side was 2% or less, and the Haze value in the D65 light source was 0.4% or less.
  • first antireflection film first antireflection film
  • the breaking strength of the produced protective plate 20 was measured by a ball-on-ring (BOR) test. Specifically, the produced protective plate 20 is placed on a stainless ring jig having an opening of ⁇ 6 mm so that the upper surface is the glass substrate surface, that is, the side on which the inorganic film 31 is formed is downward. And a hard sphere having a diameter of 10 mm is brought into contact with the center of the opening. From this state, the hard sphere was loaded under the condition of a pushing speed of 1 mm / min, and the breaking load (unit: N) when the protective plate was broken was measured. The measured breaking load (unit: N) is evaluated as BOR strength [N], and the average BOR strength (10 times in this embodiment) is evaluated as surface strength [N]. At this time, the surface strength in this example was 65 [N].
  • Comparative Example 1 a protective plate 80 having the same configuration as that of Example 1 was prepared except that the resin layer 22 was not provided.
  • the surface strength of the manufactured protective plate 80 was measured in the same manner as in Example 1, it was 6 [N], and the strength was greatly reduced as compared with Example 1.
  • Reference Example 1 a sapphire glass substrate having a diameter of 7.5 mm and a thickness of 0.15 mm was prepared. And about this sapphire glass substrate, when surface strength was measured by the method similar to Example 1, surface strength was 63 [N]. Thus, it turned out that the protective plate of Example 1 can obtain surface strength equivalent to a sapphire substrate.
  • the present invention is not limited to an image sensor, and in an apparatus having a cover glass that requires an optical function such as transmitting light inside, if the purpose is to achieve both improvement of the optical function and suppression of breakage due to external pressure , Can be suitably applied.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

An image acquisition device according to the present invention is provided with: an image acquisition element; a lens that focuses light on the image acquisition element; and a protection plate that is provided closer to an object than the lens is and that is in contact with outside air. The protection plate includes: a glass plate; a resin layer that is provided in contact with a main surface of the glass plate; and an inorganic film that is provided on the resin layer. In the protection plate, the glass plate, the resin layer, and the inorganic film are arranged in this order from the object side.

Description

撮像装置Imaging device
　本発明は、保護板、撮像レンズおよび固体撮像素子を有する撮像装置に関する。 The present invention relates to an imaging device having a protective plate, an imaging lens, and a solid-state imaging device.
　デジタルスチルカメラ、デジタルビデオカメラ等の撮像機器、さらにスマートフォン等に代表される携帯端末には、画像等を表示する表示画面を有する表示装置に加え、被写体を撮像するための撮像装置等の光学装置が搭載される。このような撮像装置は、ＣＣＤやＣＭＯＳイメージセンサ等の固体撮像素子や該固体撮像素子に取り込む画像を集光させるレンズ、さらに、被写体側に配置して該レンズ、該固体撮像素子等を外圧等から保護するための保護板が設けられる。 In addition to a display device having a display screen for displaying an image or the like in an imaging device such as a digital still camera or a digital video camera, and a mobile terminal represented by a smartphone or the like, an optical device such as an imaging device for imaging a subject Is installed. Such an image pickup apparatus includes a solid-state image pickup device such as a CCD or CMOS image sensor, a lens for condensing an image to be captured by the solid-state image pickup device, and further disposed on the subject side so that the lens, the solid-state image pickup device, etc. A protective plate is provided for protecting from.
　このような保護板の一例として、特許文献１には、サファイアやダイアモンドからなる板状の基板の主面のうち被写体側に、光損失を抑えて光利用効率を高めるための反射防止膜を備え、撮像素子側に、赤外線遮断機能を持つ光学多層膜を備えた撮像装置のレンズカバー材が記載されている。 As an example of such a protection plate, Patent Document 1 includes an antireflection film for suppressing light loss and improving light use efficiency on the subject side of the main surface of a plate-like substrate made of sapphire or diamond. In addition, a lens cover material for an image pickup apparatus including an optical multilayer film having an infrared ray blocking function on the image pickup element side is described.
日本国特開２００４－２９７３９８号公報Japanese Unexamined Patent Publication No. 2004-297398
　しかし、サファイアやダイアモンド等の基板は高価であるだけでなく、無機膜である光学多層膜が基板表面に施された特許文献１の保護板の構成は、表面に同様の無機膜を備えない単板の保護板に比べて、外圧、特に押圧に対する強度が低下する問題があった。保護板は、携帯端末等に搭載される撮像装置表面に障害物等が接触して起こり得る破損を抑制するため、とくに高い強度が要求される。しかし、強度維持のために無機膜を備えない構成にすると、空気との界面で発生する反射による光利用効率の低下が発生したり、赤外線遮断機能等の他の光学機能も併せ持つハイブリッド化が実現できない。このように、撮像装置における保護板では、高い強度を得ることと、光利用効率向上を目的とした光学的機能を併せ持つこととがトレードオフの関係にあった。 However, substrates such as sapphire and diamond are not only expensive, but the structure of the protective plate in Patent Document 1 in which an optical multilayer film, which is an inorganic film, is applied to the surface of the substrate, is not provided with a similar inorganic film on the surface. Compared to the protective plate of the plate, there was a problem that the strength against external pressure, particularly pressure, was reduced. The protective plate is particularly required to have a high strength in order to suppress damage that may occur when an obstacle or the like comes into contact with the surface of an imaging device mounted on a portable terminal or the like. However, if the structure is not equipped with an inorganic film to maintain the strength, the light utilization efficiency will be reduced due to the reflection that occurs at the interface with the air, and the hybrid will have other optical functions such as infrared blocking function. Can not. As described above, in the protective plate in the imaging apparatus, there is a trade-off relationship between obtaining high strength and having an optical function for the purpose of improving light utilization efficiency.
　そこで、本発明は、外部からの接触等による破損の抑制と、高い光利用効率といった光学機能とを両立できる撮像装置を提供することを目的とする。また、本発明は、強度の低下を招くことなく、かつ、高い光利用効率が実現できる等の光学機能を併せ持つ保護板を備えた高機能の撮像装置を提供することを目的とする。 Therefore, an object of the present invention is to provide an imaging apparatus capable of achieving both suppression of breakage due to external contact and the like and an optical function such as high light utilization efficiency. It is another object of the present invention to provide a high-performance image pickup apparatus including a protective plate having an optical function such as high light utilization efficiency without causing a decrease in strength.
　本発明による撮像装置は、撮像素子と、撮像素子に光を集光するレンズと、レンズよりも被写体側に設けられ、外気と接する保護板とを備え、保護板は、ガラス板と、ガラス板の主表面に接して備えられる樹脂層と、樹脂層上に備えられる無機膜とを含み、保護板は、被写体側から、ガラス板、樹脂層、無機膜の順で配置されていることを特徴とする。 An image pickup apparatus according to the present invention includes an image pickup element, a lens that focuses light on the image pickup element, and a protection plate that is provided closer to the subject than the lens and is in contact with outside air. The protection plate includes a glass plate and a glass plate. Including a resin layer provided in contact with the main surface of the substrate and an inorganic film provided on the resin layer, and the protective plate is disposed in this order from the subject side in the order of the glass plate, the resin layer, and the inorganic film. And
　また、無機膜は、少なくとも反射防止機能を有する誘電体多層膜であってもよい。 The inorganic film may be a dielectric multilayer film having at least an antireflection function.
　また、保護板は、曲げ弾性率が５００ＭＰａ以上であってもよい。 Further, the protective plate may have a flexural modulus of 500 MPa or more.
　また、樹脂層は、ポリイミド樹脂、エポキシ樹脂、ポリシクロオレフィン樹脂、ポリカーボネート樹脂、アクリル樹脂から選ばれる少なくとも１種の樹脂材料を用いて形成されていてもよい。 The resin layer may be formed using at least one resin material selected from polyimide resin, epoxy resin, polycycloolefin resin, polycarbonate resin, and acrylic resin.
　また、ガラス板および樹脂層の合計の厚さは、０．０７～１．１ｍｍであってもよい。 Further, the total thickness of the glass plate and the resin layer may be 0.07 to 1.1 mm.
　また、樹脂層の厚さは、２０～１００μｍであってもよい。 Further, the thickness of the resin layer may be 20 to 100 μm.
　また、ガラス板は、化学強化ガラス基板であってもよい。 The glass plate may be a chemically strengthened glass substrate.
　また、保護板は、ガラス板の被写体側の主表面に第２の反射防止膜が備えられており、保護板の波長４００～６７０ｎｍの光に対する透過率が９６％以上であってもよい。 The protective plate may be provided with a second antireflection film on the main surface of the glass plate on the subject side, and the transmittance of the protective plate with respect to light having a wavelength of 400 to 670 nm may be 96% or more.
　また、保護板は、波長４００～６７０ｎｍの光に対する反射率が２％以下であってもよい。 The protective plate may have a reflectance of 2% or less with respect to light having a wavelength of 400 to 670 nm.
　また、第２の反射防止膜の上に、フッ素を含む材料による防汚膜が形成されていてもよい。 Further, an antifouling film made of a material containing fluorine may be formed on the second antireflection film.
　また、保護板は、入射する光の一部を遮蔽する遮光膜を含んでいてもよい。 Further, the protective plate may include a light shielding film that shields a part of incident light.
　本発明によれば、外部からの接触等による破損の抑制と、高い光利用効率といった光学機能とを両立できる撮像装置を提供できる。また、本発明によれば、強度の低下を招くことなく、かつ、高い光利用効率が実現できる等の光学機能を併せ持つ保護板を備えた高機能の撮像装置を実現できる。 According to the present invention, it is possible to provide an imaging apparatus capable of achieving both suppression of breakage due to external contact and the like and an optical function such as high light utilization efficiency. In addition, according to the present invention, it is possible to realize a high-performance imaging apparatus including a protective plate having an optical function such as high light utilization efficiency without causing a decrease in strength.
図１は、第１の実施形態における撮像装置の例を示す構成図である。FIG. 1 is a configuration diagram illustrating an example of an imaging apparatus according to the first embodiment. 図２は、保護板に加える外圧とガラス板表面の欠陥から発する亀裂のメカニズムの説明図であり、（ａ）は実施形態の保護板の模式図であり、（ｂ）は樹脂層を備えない、即ちガラス板の主表面に接して無機膜が備えられた保護板の模式図である。FIG. 2 is an explanatory diagram of a mechanism of cracks generated from external pressure applied to the protective plate and defects on the surface of the glass plate, (a) is a schematic diagram of the protective plate of the embodiment, and (b) is not provided with a resin layer. That is, it is a schematic view of a protective plate provided with an inorganic film in contact with the main surface of the glass plate. 図３は、第２の実施形態における撮像装置の保護板の他の例を示す構成図である。FIG. 3 is a configuration diagram illustrating another example of the protection plate of the imaging apparatus according to the second embodiment. 図４は、第３の実施形態における撮像装置の保護板の例を示す構成図である。FIG. 4 is a configuration diagram illustrating an example of a protection plate of the imaging apparatus according to the third embodiment.
　［第１の実施形態］
　図１は、本実施形態に係る撮像装置１０の例を示す構成図である。撮像装置１０は、ＣＣＤやＣＭＯＳ等の固体撮像素子５０と、固体撮像素子５０に画像光を集光させるレンズ４０と、レンズ等を保護する保護板２０とを備える。なお、保護板２０は、レンズ４０より被写体側に備えられ外気と接する位置に設けられていればよい。なお、これら（固体撮像素子５０、レンズ４０および保護板２０等）が筐体１５によって固定されている。また、レンズ４０は、図示するような単レンズに限らず、複数のレンズ群も含む。 [First Embodiment]
FIG. 1 is a configuration diagram illustrating an example of an imaging apparatus 10 according to the present embodiment. The imaging device 10 includes a solid-state imaging device 50 such as a CCD or CMOS, a lens 40 that collects image light on the solid-state imaging device 50, and a protection plate 20 that protects the lens or the like. The protective plate 20 may be provided at a position that is provided closer to the subject than the lens 40 and is in contact with the outside air. These (the solid-state imaging device 50, the lens 40, the protective plate 20, and the like) are fixed by the casing 15. Further, the lens 40 is not limited to a single lens as illustrated, and includes a plurality of lens groups.
　保護板２０は、被写体側より、ガラス板２１、樹脂層２２および無機膜３１を備える。無機膜３１の例としては、とくに所定の波長の光の反射を低減する反射防止機能を有する反射防止膜として機能するものが挙げられる。また、他の例としては、所定の近赤外光を遮断する近赤外線カットフィルタ機能を有する近赤外線カットフィルタとして機能するものが挙げられる。なお、無機膜３１は、これら両方の機能を併せ持っていてもよい。以下、無機膜３１が、反射防止機能を有する反射防止膜である場合を例に用いて説明する。その際、後述する第２の実施形態における反射防止膜３２と区別するため、便宜的に本実施形態における無機膜３１を第１の反射防止膜３１といい、第２の実施形態における反射防止膜３２を第２の反射防止膜３２という場合がある。 The protective plate 20 includes a glass plate 21, a resin layer 22, and an inorganic film 31 from the subject side. Examples of the inorganic film 31 include those that function as an antireflection film having an antireflection function that reduces reflection of light having a predetermined wavelength. Another example is one that functions as a near-infrared cut filter having a near-infrared cut filter function for blocking predetermined near-infrared light. The inorganic film 31 may have both of these functions. Hereinafter, the case where the inorganic film 31 is an antireflection film having an antireflection function will be described as an example. At that time, in order to distinguish from the antireflection film 32 in the second embodiment to be described later, the inorganic film 31 in this embodiment is referred to as the first antireflection film 31 for convenience, and the antireflection film in the second embodiment. 32 may be referred to as a second antireflection film 32.
　図１には、保護板２０において、ガラス板２１、樹脂層２２および無機膜３１がこの順に隣接して配される例が示されているが、無機膜３１は、樹脂層２２と必ずしも接していなくてもよい。即ち、樹脂層２２と無機膜３１との間に他の光学機能層が備わってもよい。なお、樹脂層２２は、ガラス板２１の半被写体側の主表面に接して備えられるものとする。 FIG. 1 shows an example in which the glass plate 21, the resin layer 22, and the inorganic film 31 are arranged adjacent to each other in this order in the protective plate 20, but the inorganic film 31 is not necessarily in contact with the resin layer 22. It does not have to be. That is, another optical functional layer may be provided between the resin layer 22 and the inorganic film 31. The resin layer 22 is provided in contact with the main surface of the glass plate 21 on the half subject side.
　ガラス板２１は、平板状に限らず、撮像機器の筐体の形状に合わせる等して、所定の曲率を有する曲面状でもよい。また、ガラス板２１の厚さは一定のものに限らず、分布を有してもよい。ガラス板２１に用いるガラス材料は、とくに限定されないが、高い強度を有する材料であればより薄くでき、透過率をより高められるので好ましい。また、ガラス板２１の基となるガラス基板としては、化学強化ガラス基板がより好ましい。なお、化学強化ガラス基板とは、化学処理によって、曲げや落下衝撃に対する強度を高くしたガラス基板のことをいう。 The glass plate 21 is not limited to a flat plate shape, and may be a curved surface having a predetermined curvature, for example, by matching with the shape of the housing of the imaging device. Further, the thickness of the glass plate 21 is not limited to a constant one, and may have a distribution. The glass material used for the glass plate 21 is not particularly limited, but a material having high strength is preferable because it can be made thinner and the transmittance can be further increased. Moreover, as a glass substrate used as the base of the glass plate 21, a chemically strengthened glass substrate is more preferable. The chemically tempered glass substrate refers to a glass substrate whose strength against bending and drop impact is increased by chemical treatment.
　ガラス板２１の厚さは、０．０５ｍｍ以上、１ｍｍ以下が好ましい。例えば、ガラス板２１の厚さが０．０５ｍｍ未満であると、所望の強度が得られないおそれがあり、また、１ｍｍ超であると、とくに携帯端末に搭載される撮像装置の場合に小型化の実現が困難となるおそれがある。なお、ガラス板２１の厚さは、０．１０ｍｍ以上がより好ましく、０．１５ｍｍ以上がさらに好ましい。また、ガラス板２１の厚さは、０．４０ｍｍ以下がより好ましく、０．３５ｍｍ以下がさらに好ましい。 The thickness of the glass plate 21 is preferably 0.05 mm or more and 1 mm or less. For example, if the thickness of the glass plate 21 is less than 0.05 mm, a desired strength may not be obtained, and if it exceeds 1 mm, the size of the image pickup device mounted on a portable terminal is reduced. There is a risk that it will be difficult to realize. In addition, as for the thickness of the glass plate 21, 0.10 mm or more is more preferable, and 0.15 mm or more is further more preferable. Moreover, the thickness of the glass plate 21 is more preferably 0.40 mm or less, and further preferably 0.35 mm or less.
　樹脂層２２は、ガラス板２１の主表面に接して備えられる。樹脂層２２に用いられる材料は、透明な樹脂材料であればとくに限定されず、アクリル系樹脂、エポキシ系樹脂、ポリエステル系樹脂、シリコーン系樹脂、ポリカーボネート樹脂、ポリウレタン樹脂、ポリウレア系樹脂、エチレン－酢酸ビニル共重合樹脂、ポリビニルブチラール樹脂等のポリビニルアルコール樹脂変性材料、シクロオレフィンポリマー樹脂、ポリスチレン系樹脂、透明なフッ素樹脂、透明なポリアミド樹脂、透明なポリイミド樹脂、ポリアミドイミド樹脂等が挙げられる。この中でもポリイミド樹脂、エポキシ樹脂、ポリシクロオレフィン樹脂、ポリカーボネート樹脂、アクリル樹脂が入手性等の観点から好ましく、例えば、樹脂層２２は、これら樹脂材料の少なくとも１種を用いて形成されていてもよい。 Resin layer 22 is provided in contact with the main surface of glass plate 21. The material used for the resin layer 22 is not particularly limited as long as it is a transparent resin material, and is an acrylic resin, epoxy resin, polyester resin, silicone resin, polycarbonate resin, polyurethane resin, polyurea resin, ethylene-acetic acid. Examples thereof include polyvinyl alcohol resin-modified materials such as vinyl copolymer resins and polyvinyl butyral resins, cycloolefin polymer resins, polystyrene resins, transparent fluororesins, transparent polyamide resins, transparent polyimide resins, and polyamideimide resins. Among these, a polyimide resin, an epoxy resin, a polycycloolefin resin, a polycarbonate resin, and an acrylic resin are preferable from the viewpoint of availability, for example, the resin layer 22 may be formed using at least one of these resin materials. .
　樹脂層２２は、樹脂層２２の材料となる液体を、スピンコート方式、インクジェット方式、転写方式、スクリーン印刷方式等により塗布することで作製できる。また、ガラス板２１と樹脂層２２との密着性を強化するために、ガラス板２１の主面にシランカップリング剤による表面処理を施すとよい。シランカップリン剤としては、例えば、γ－アミノプロピルトリエトキシシラン、Ｎ－β－（アミノエチル）－γ－アミノプロピルトリメトキシシラン、Ｎ－β－（アミノエチル）－Ｎ’－β－（アミノエチル）－γ－アミノプロピルトリエトキシシラン、γ－アニリノプロピルトリメトキシシランのようなアミノシラン類や、γ－グリシドキシプロピルトリメトキシシラン、β－（３，４－エポキシシクロヘキシル）エチルトリメトキシシランのようなエポキシシラン類、ビニルトリメトキシシラン、Ｎ－β－（Ｎ－ビニルベンジルアミノエチル）－γ－アミノプロピルトリメトキシシランのようなビニルシラン類、γ－メタクリロキシプロピルトリメトキシシラン、γ－クロロプロピルトリメトキシシラン、γ－メルカプトプロピルトリメトキシシラン等を使用できる。上記以外に、樹脂層２２がフィルム状の樹脂材料からなる場合、ガラス板２１と熱圧着させることで、ガラス板２１と樹脂層２２とを密着させてもよい。 The resin layer 22 can be produced by applying a liquid that is a material of the resin layer 22 by a spin coating method, an ink jet method, a transfer method, a screen printing method, or the like. Moreover, in order to reinforce the adhesion between the glass plate 21 and the resin layer 22, the main surface of the glass plate 21 may be subjected to a surface treatment with a silane coupling agent. Examples of the silane coupling agent include γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -N′-β- (amino Aminosilanes such as ethyl) -γ-aminopropyltriethoxysilane and γ-anilinopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane Epoxy silanes such as, vinyltrimethoxysilane, vinylsilanes such as N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-chloro Propyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane Runs can be used. In addition to the above, when the resin layer 22 is made of a film-like resin material, the glass plate 21 and the resin layer 22 may be adhered to each other by thermocompression bonding with the glass plate 21.
　樹脂層２２の厚さは、２０μｍ以上、１００μｍ以下が好ましい。例えば、樹脂層２２の厚さが２０μｍ未満であると、保護板２０が高強度を実現できなくなるおそれがあり、また、１００μｍ超であると、樹脂層２２と無機膜３１との屈折率差の関係で無機膜３１としての機能（例えば、反射防止特性）を低下させるおそれがある。なお、樹脂層２２の厚さは、３０μｍ以上がより好ましく、５０μｍ以上がさらに好ましい。また、樹脂層２２の厚さは、９０μｍ以下がより好ましく、８０μｍ以下がさらに好ましい。 The thickness of the resin layer 22 is preferably 20 μm or more and 100 μm or less. For example, if the thickness of the resin layer 22 is less than 20 μm, the protective plate 20 may not be able to achieve high strength, and if it exceeds 100 μm, the difference in refractive index between the resin layer 22 and the inorganic film 31 may be reduced. In relation, there is a possibility that the function (for example, antireflection characteristics) as the inorganic film 31 is lowered. In addition, the thickness of the resin layer 22 is more preferably 30 μm or more, and further preferably 50 μm or more. Further, the thickness of the resin layer 22 is more preferably 90 μm or less, and further preferably 80 μm or less.
　また、ガラス板２１と樹脂層２２の合計の厚さは、０．０７ｍｍ以上、１．１ｍｍ以下が好ましい。例えば、ガラス板２１と樹脂層２２の合計の厚さが０．０７ｍｍ未満であると、保護板２０が高強度を実現できなくなるおそれがあり、また、１．１ｍｍ超であると、撮像装置の小型化の実現が困難となるおそれがある。なお、ガラス板２１と樹脂層２２の合計の厚さは、０．１０ｍｍ以上がより好ましく、０．１５ｍｍ以上がさらに好ましい。また、ガラス板２１と樹脂層２２の合計の厚さは、０．４０ｍｍ以下がより好ましく、０．３５ｍｍ以下がさらに好ましい。 Further, the total thickness of the glass plate 21 and the resin layer 22 is preferably 0.07 mm or more and 1.1 mm or less. For example, if the total thickness of the glass plate 21 and the resin layer 22 is less than 0.07 mm, the protection plate 20 may not be able to achieve high strength, and if it exceeds 1.1 mm, There is a risk that it will be difficult to reduce the size. In addition, the total thickness of the glass plate 21 and the resin layer 22 is more preferably 0.10 mm or more, and further preferably 0.15 mm or more. Further, the total thickness of the glass plate 21 and the resin layer 22 is more preferably 0.40 mm or less, and further preferably 0.35 mm or less.
　第１の反射防止膜３１は、相対的に高屈折率を示す高屈折率膜と、低屈折率を示す低屈折率膜が交互に備えられた誘電体多層膜であってもよい。第１の反射防止膜３１は、典型的には２種の無機膜、例えば、高屈折率膜としてＴｉＯ２膜、低屈折率膜としてＳｉＯ２膜が挙げられる。第１の反射防止膜３１は、高透過性を必要とする波長の光、例えば、可視光に対して反射率を低減できればよい。また、第１の反射防止膜３１は、波長４００～６７０ｎｍの可視光反射率を低減させるとともに、例えば、所定の近赤外光を遮断する近赤外線カットフィルタ機能を有するように構成してもよい。 The first antireflection film 31 may be a dielectric multilayer film in which a high refractive index film having a relatively high refractive index and a low refractive index film having a low refractive index are alternately provided. The first antireflection film 31 typically includes two kinds of inorganic films, for example, a TiO 2 film as a high refractive index film and a SiO 2 film as a low refractive index film. The first antireflection film 31 only needs to reduce the reflectance with respect to light having a wavelength requiring high transparency, for example, visible light. Further, the first antireflection film 31 may be configured to reduce the visible light reflectance at a wavelength of 400 to 670 nm and to have, for example, a near infrared cut filter function for blocking predetermined near infrared light. .
　次に、本実施形態に係る撮像装置に備えられる保護板２０の強度特性について図面を用いて説明する。図２は、２種の保護板についてガラス板２１に接して加圧したときに保護板に発生する欠陥の拡張と破壊のメカニズムを模式化した図である。ここで、図２（ａ）は、本実施形態の保護板２０の模式図であり、図２（ｂ）は、樹脂層２２を備えない、即ちガラス板２１の主表面に接して無機膜３１が備えられた保護板８０の模式図である。 Next, the strength characteristics of the protective plate 20 provided in the imaging apparatus according to the present embodiment will be described with reference to the drawings. FIG. 2 is a diagram schematically illustrating the mechanism of expansion and destruction of defects generated in the protective plate when the two protective plates are pressed against the glass plate 21 and pressed. Here, FIG. 2A is a schematic diagram of the protective plate 20 of the present embodiment, and FIG. 2B does not include the resin layer 22, that is, the inorganic film 31 in contact with the main surface of the glass plate 21. It is a schematic diagram of the protection board 80 provided with.
　図２には、ガラス板２１の表面にキズ等の欠陥６０を有する場合について、その拡張の様子が模式化して示されている。ガラス板２１の表面に欠陥６０がある場合、それの先端部分における引張応力σcは、ガラス板２１本来の引張応力σaを大きく超える。例えば、引張応力σcは、引張応力σaの数十倍になる場合がある。以下では、そのような欠陥６０がある場合を考える。図２に示すように、ガラス板２１表面の中心部において、厚さ方向（図中の矢印方向）に圧力を加えると、保護板は撓むようにして変形する。このとき、図２（ａ）に示すように、一般にガラス板２１に比べて引張応力が小さい無機多層膜からなる第１の反射防止膜３１とガラス板２１との間に樹脂層２２が介在すると、樹脂層２２が緩衝機能を発して、ガラス板表面に生じる欠陥６０からの破壊進行が抑制される。 FIG. 2 schematically shows an expansion state in the case where the surface of the glass plate 21 has a defect 60 such as a scratch. When there is a defect 60 on the surface of the glass plate 21, the tensile stress σ c at the tip thereof greatly exceeds the original tensile stress σ a of the glass plate 21. For example, the tensile stress σ c may be several tens of times the tensile stress σ a . Hereinafter, a case where such a defect 60 is present will be considered. As shown in FIG. 2, when pressure is applied in the thickness direction (arrow direction in the figure) at the center of the surface of the glass plate 21, the protective plate is deformed so as to bend. At this time, as shown in FIG. 2A, when the resin layer 22 is interposed between the first antireflection film 31 and the glass plate 21, which are generally made of an inorganic multilayer film having a tensile stress smaller than that of the glass plate 21. The resin layer 22 exhibits a buffering function, and the progress of destruction from the defect 60 occurring on the glass plate surface is suppressed.
　一方、図２（ｂ）に示すように、表面に欠陥６０を有するガラス板２１主表面に第１の反射防止膜３１が接して備えられる保護板８０の場合、緩衝機能を持たない第１の反射防止膜３１が、圧力を増加して第１の反射防止膜３１に割れが生じると、その割れを起点として、ガラス板２１の表面の欠陥６０から亀裂６０ａが生じる。そして、結果的に、保護板８０全体の（破壊）強度を低下させる。このように、ガラス板２１と第１の反射防止膜３１との間に、ガラス板２１に接して樹脂層２２を備えることにより、保護板２０は、ガラス板２１の表面に形成された欠陥６０を起点とする亀裂の進行を抑制でき、外圧に対して高い耐久性、即ち、高い破壊強度が得られる。 On the other hand, as shown in FIG. 2B, in the case of the protective plate 80 provided with the first antireflection film 31 in contact with the main surface of the glass plate 21 having the defect 60 on the surface, the first having no buffer function. When the antireflection film 31 is increased in pressure and a crack occurs in the first antireflection film 31, a crack 60a is generated from the defect 60 on the surface of the glass plate 21 starting from the crack. As a result, the (destructive) strength of the entire protection plate 80 is reduced. Thus, by providing the resin layer 22 in contact with the glass plate 21 between the glass plate 21 and the first antireflection film 31, the protective plate 20 has a defect 60 formed on the surface of the glass plate 21. As a starting point, the progress of cracks can be suppressed, and high durability against external pressure, that is, high fracture strength can be obtained.
　このように、本実施形態の撮像装置１０における保護板２０の曲げ弾性率は、高いほどその破壊強度は増加するが、５００ＭＰａ以上であれば外圧に対する一定の耐久性が得られるので好ましい。また、保護板２０の曲げ弾性率は、１０００ＭＰａ以上であればより好ましく、２０００ＭＰａ以上であればさらに好ましい。 As described above, the higher the bending elastic modulus of the protective plate 20 in the imaging device 10 of the present embodiment, the greater the breaking strength. However, if it is 500 MPa or more, it is preferable because a certain durability against external pressure can be obtained. Moreover, the bending elastic modulus of the protective plate 20 is more preferably 1000 MPa or more, and further preferably 2000 MPa or more.
　また、保護板２０は、入射光に対して散乱が小さいことで、光利用効率が高められるので好ましい。本発明の撮像装置における保護板２０は、とくに可視光の利用効率が高いことが好ましく、ＣＩＥが規定する標準光源に相当するＤ６５光源が保護板２０の法線方向から入射したときのＨａｚｅ値が１％以下であればよい。また、保護板２０は、Ｄ６５光源に対するＨａｚｅ値が、０．４％以下が好ましく、０．１％以下がより好ましい。 Further, the protective plate 20 is preferable because the light use efficiency is enhanced by the small scattering with respect to the incident light. The protection plate 20 in the image pickup apparatus of the present invention preferably has particularly high visible light utilization efficiency, and has a Haze value when a D65 light source corresponding to a standard light source defined by CIE is incident from the normal direction of the protection plate 20. It may be 1% or less. Further, the protective plate 20 has a Haze value with respect to the D65 light source of preferably 0.4% or less, and more preferably 0.1% or less.
　［第２の実施形態］
　次に、第２の実施形態を説明する。以下では、本実施形態に係る撮像装置について、第１の実施形態と異なる点を中心に説明する。図３は、第２の実施形態に係る撮像装置における保護板２０ａの例を示す構成図である。図３に示す保護板２０ａは、第１の実施形態の保護板２０の構成に加えて、ガラス板２１のうち樹脂層２２側の主表面とは反対側、即ち被写体側の主表面に第２の反射防止膜３２を備えている点が異なる。なお、本実施形態に係る撮像装置はとくに図示しないが、図１の撮像装置１０において保護板２０の代わりに保護板２０ａを備えるものに相当する。なお、本実施形態の保護板２０ａの場合、被写体側から、第２の反射防止膜３２、ガラス板２１、樹脂層２２、無機膜（第１の反射防止膜）３１の順に配置される。 [Second Embodiment]
Next, a second embodiment will be described. Hereinafter, the imaging apparatus according to the present embodiment will be described focusing on differences from the first embodiment. FIG. 3 is a configuration diagram illustrating an example of the protection plate 20a in the imaging apparatus according to the second embodiment. In addition to the configuration of the protection plate 20 of the first embodiment, the protection plate 20a shown in FIG. 3 is second on the opposite side of the main surface on the resin layer 22 side of the glass plate 21, that is, on the main surface on the subject side. The difference is that the antireflection film 32 is provided. Although the imaging apparatus according to the present embodiment is not particularly illustrated, it corresponds to the imaging apparatus 10 of FIG. 1 that includes a protection plate 20a instead of the protection plate 20. In the case of the protective plate 20a of this embodiment, the second antireflection film 32, the glass plate 21, the resin layer 22, and the inorganic film (first antireflection film) 31 are arranged in this order from the subject side.
　第２の反射防止膜３２は、波長４００～６７０ｎｍの可視光反射率を低減させればよく、例えば、可視光反射率の低減とともに所定の近赤外光を遮断する近赤外線カットフィルタ機能を有する構成でもよい。 The second antireflection film 32 only needs to reduce the visible light reflectance at a wavelength of 400 to 670 nm. For example, the second antireflection film 32 has a near infrared cut filter function for blocking predetermined near infrared light as well as reducing the visible light reflectance. It may be configured.
　このように、第２の実施形態の撮像装置における保護板２０ａは、外気との両界面に反射防止膜を備えることで、とくに可視光の利用効率を高められる。このような構成により、保護板２０ａは、波長４００～６７０ｎｍの可視光に対して、例えば９６％以上の透過率を実現できる。なお、保護板２０ａの波長４００～６７０ｎｍの可視光に対する透過率は、９７％以上であれば好ましく、９８％以上であればより好ましい。また、保護板２０ａは、このような構成により、両面から入射する波長４００～６７０ｎｍの両界面における可視光反射率として、２％以下を実現できる。なお、保護板２０ａの、両面から入射する波長４００～６７０ｎｍの両界面における可視光反射率は、１％以下であれば好ましく、０．５％以下であればより好ましい。 As described above, the protective plate 20a in the image pickup apparatus of the second embodiment can improve the use efficiency of visible light, in particular, by providing the antireflection film on both interfaces with the outside air. With such a configuration, the protective plate 20a can realize a transmittance of, for example, 96% or more for visible light having a wavelength of 400 to 670 nm. The transmittance of visible light with a wavelength of 400 to 670 nm of the protective plate 20a is preferably 97% or more, and more preferably 98% or more. Further, the protective plate 20a can achieve a visible light reflectance of 2% or less at both interfaces having a wavelength of 400 to 670 nm incident from both sides by such a configuration. It should be noted that the visible light reflectivity at both interfaces of wavelengths 400 to 670 nm incident from both sides of the protective plate 20a is preferably 1% or less, and more preferably 0.5% or less.
　［第３の実施形態］
　次に、第３の実施形態を説明する。以下では、本実施形態に係る撮像装置について、第２の実施形態と異なる点を中心に説明する。図４は、第３の実施形態に係る撮像装置における保護板２０ｂの例を示す構成図である。図４に示す保護板２０ｂは、第２の実施形態の保護板２０ａの構成に加えて、第１の反射防止膜３１上に遮光膜２４を備えている点、および第２の反射防止膜３２上に防汚層２３を備えている点が異なる。 [Third Embodiment]
Next, a third embodiment will be described. Hereinafter, the imaging apparatus according to the present embodiment will be described focusing on differences from the second embodiment. FIG. 4 is a configuration diagram illustrating an example of the protection plate 20b in the imaging apparatus according to the third embodiment. The protection plate 20b shown in FIG. 4 includes a light shielding film 24 on the first antireflection film 31 in addition to the configuration of the protection plate 20a of the second embodiment, and the second antireflection film 32. The difference is that an antifouling layer 23 is provided on the top.
　遮光膜２４は、絞りとして機能し、第１の反射防止膜３１の周辺部に備えられ、中心部は開口している。遮光膜２４の材料としては、遮光性を有する材料が使用できる。なお、図４には、第１の反射防止膜３１の上に備えられる例が示されているが、遮光膜２４は、絞り機能が実現できればとくに配置の制限はない。ただし、遮光膜２４の配置としては、例えば、固体撮像素子５０側に備えられていると、固体撮像素子５０から反射される迷光に対する遮光性がより高まる効果が期待できる。 The light shielding film 24 functions as a diaphragm, and is provided in the peripheral portion of the first antireflection film 31, and the center portion is open. As the material of the light shielding film 24, a material having a light shielding property can be used. Although FIG. 4 shows an example provided on the first antireflection film 31, the arrangement of the light shielding film 24 is not particularly limited as long as the diaphragm function can be realized. However, as the arrangement of the light-shielding film 24, for example, when the light-shielding film 24 is provided on the solid-state imaging device 50 side, an effect of further improving the light-shielding property against stray light reflected from the solid-state imaging device 50 can be expected.
　また、保護板２０ｂのように、最外部（最も被写体側）に防汚層２３を有することで、外部からの指紋残り等の汚れを低減できる効果が期待できる。防汚層２３は、ＡＦＰ（Anti-Finger Print）と呼ばれるものであってもよい。例えば、防汚層２３は、以下の化１に示される防汚コーティング剤により形成されていてもよい。防汚層２３は、保護板の指紋残りを防いだり、指紋残りを簡単に拭き取ったりできる機能を有していてもよい。 Further, since the antifouling layer 23 is provided on the outermost part (most subject side) like the protective plate 20b, an effect of reducing dirt such as fingerprint residue from the outside can be expected. The antifouling layer 23 may be called AFP (Anti-Finger-Print). For example, the antifouling layer 23 may be formed of an antifouling coating agent shown in Chemical Formula 1 below. The antifouling layer 23 may have a function of preventing a fingerprint residue on the protective plate or easily wiping off the fingerprint residue.
Figure JPOXMLDOC01-appb-C000001
 　化１に示される防汚コーティング剤は、フッ素化シランを含有するコーティング組成物を適用することで生成するフッ素化シロキサンを含み、式中：Ｒfは１つ以上の酸素原子を任意に含む全フッ素化基であり；Ｒ1は１つ以上の酸素、窒素又は硫黄から選ばれるヘテロ原子で置換されるかまたはカルボニル、アミド又はスルホンアミドから選ばれる官能基で置換されるかした、２～１６個の炭素原子を含有する二価のアルキレン基、アリーレン基、またはそれらの混合物であり；Ｒ2は低級アルキル基であり；Ｘはハロゲン、低級アルコキシ基、またはアシルオキシ基であり、但し、もしＸ基がアルコキシ基を含む場合は、少なくとも１つのアシルオキシ基またはハロゲン基が存在し；ｘは０または１である。
Figure JPOXMLDOC01-appb-C000001
 The antifouling coating agent shown in Chemical Formula 1 comprises a fluorinated siloxane produced by applying a coating composition containing a fluorinated silane, wherein Rf is an all-optionally containing one or more oxygen atoms. A fluorinated group; R 1 is substituted with one or more heteroatoms selected from oxygen, nitrogen or sulfur or substituted with a functional group selected from carbonyl, amide or sulfonamide, 2-16 A divalent alkylene group containing 1 carbon atom, an arylene group, or a mixture thereof; R 2 is a lower alkyl group; X is a halogen, a lower alkoxy group, or an acyloxy group, provided that X If the group comprises an alkoxy group, there is at least one acyloxy group or halogen group; x is 0 or 1.
（実施例１）
　実施例１は、ガラス板２１として、厚さ０．１ｍｍのガラス基板を準備し、ガラス基板の一方の主表面にシランカップリング処理をした。そして、シランカップリング処理した主表面にポリイミドの樹脂溶液をスピンコート法で塗布した後、加熱乾燥し、厚さ２３μｍのポリイミドの樹脂層２２を得た。その後、樹脂層２２の表面に、ＴｉＯ２膜とＳｉＯ２膜とを交互に積層して無機膜（第１の反射防止膜）３１を形成し、保護板２０を得た。このとき、無機膜３１側における可視光反射率は２％以下であり、Ｄ６５光源におけるＨａｚｅ値は０．４％以下であった。 Example 1
In Example 1, a glass substrate having a thickness of 0.1 mm was prepared as the glass plate 21, and one main surface of the glass substrate was subjected to silane coupling treatment. Then, a polyimide resin solution was applied to the main surface subjected to the silane coupling treatment by a spin coating method and then dried by heating to obtain a polyimide resin layer 22 having a thickness of 23 μm. Thereafter, an inorganic film (first antireflection film) 31 was formed on the surface of the resin layer 22 by alternately laminating TiO 2 films and SiO 2 films, and the protective plate 20 was obtained. At this time, the visible light reflectance on the inorganic film 31 side was 2% or less, and the Haze value in the D65 light source was 0.4% or less.
　作製した保護板２０をボールオンリング（ＢＯＲ）試験により破壊強度を測定した。具体的には、φ６ｍｍの開口部を有するステンレスリングの治具上に、作製した保護板２０を、上面がガラス基板面となるように、即ち無機膜３１が形成されている側が下方にくるように載置し、開口部の中心位置に、直径１０ｍｍの剛球体を接触させる。その状態から、該剛球体を、押し速度１ｍｍ／ｍｉｎの条件下で荷重し、保護板が破壊したときの破壊荷重（単位：Ｎ）を測定した。測定された破壊荷重（単位：Ｎ）をＢＯＲ強度［Ｎ］とし、ＢＯＲ強度の平均（本実施例では１０回）を面強度［Ｎ］として評価する。このとき、本実施例における面強度は、６５［Ｎ］であった。 The breaking strength of the produced protective plate 20 was measured by a ball-on-ring (BOR) test. Specifically, the produced protective plate 20 is placed on a stainless ring jig having an opening of φ6 mm so that the upper surface is the glass substrate surface, that is, the side on which the inorganic film 31 is formed is downward. And a hard sphere having a diameter of 10 mm is brought into contact with the center of the opening. From this state, the hard sphere was loaded under the condition of a pushing speed of 1 mm / min, and the breaking load (unit: N) when the protective plate was broken was measured. The measured breaking load (unit: N) is evaluated as BOR strength [N], and the average BOR strength (10 times in this embodiment) is evaluated as surface strength [N]. At this time, the surface strength in this example was 65 [N].
（比較例１）
　比較例１は、樹脂層２２を備えない以外は実施例１と同じ構成の保護板８０を作製した。作製した保護板８０について、実施例１と同様に面強度を測定したところ、６［Ｎ］であり、実施例１と比べて大きく強度が低下した。 (Comparative Example 1)
In Comparative Example 1, a protective plate 80 having the same configuration as that of Example 1 was prepared except that the resin layer 22 was not provided. When the surface strength of the manufactured protective plate 80 was measured in the same manner as in Example 1, it was 6 [N], and the strength was greatly reduced as compared with Example 1.
（参考例１）
　参考例１は、φ７．５ｍｍ、厚さ０．１５ｍｍのサファイアガラス基板を準備した。そして、該サファイアガラス基板について、実施例１と同様の方法で面強度を測定したところ、面強度は６３［Ｎ］であった。このように、実施例１の保護板は、サファイア基板と同等の面強度が得られることがわかった。 (Reference Example 1)
In Reference Example 1, a sapphire glass substrate having a diameter of 7.5 mm and a thickness of 0.15 mm was prepared. And about this sapphire glass substrate, when surface strength was measured by the method similar to Example 1, surface strength was 63 [N]. Thus, it turned out that the protective plate of Example 1 can obtain surface strength equivalent to a sapphire substrate.
　本出願は、２０１６年３月３１日出願の日本特許出願、特願２０１６－０７１９２７に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on Japanese Patent Application No. 2016-071927 filed on Mar. 31, 2016, the contents of which are incorporated herein by reference.
　本発明は、撮像素子に限らず、内部に光を透過させるなどの光学機能を必要とするカバーガラスを有する装置において、光学機能の向上と外圧によるによる破損の抑制とを両立させる目的であれば、好適に適用可能である。 The present invention is not limited to an image sensor, and in an apparatus having a cover glass that requires an optical function such as transmitting light inside, if the purpose is to achieve both improvement of the optical function and suppression of breakage due to external pressure , Can be suitably applied.
　１０　　　　　　　　　撮像装置
　１５　　　　　　　　　筐体
　２０、８０　　　　　　保護板
　２０ａ、２０ｂ　　　　保護板
　２１　　　　　　　　　ガラス板
　２２　　　　　　　　　樹脂層
　２３　　　　　　　　　防汚層
　２４　　　　　　　　　遮光膜
　３１　　　　　　　　　無機膜（第１の反射防止膜）
　３２　　　　　　　　　第２の反射防止膜
　４０　　　　　　　　　レンズ
　５０　　　　　　　　　固体撮像素子
　６０　　　　　　　　　欠陥
　６０ａ　　　　　　　　亀裂 DESCRIPTION OF SYMBOLS 10 Imaging device 15 Case 20, 80 Protective plate 20a, 20b Protective plate 21 Glass plate 22 Resin layer 23 Antifouling layer 24 Light shielding film 31 Inorganic film (1st antireflection film)
32 Second antireflection film 40 Lens 50 Solid-state imaging device 60 Defect 60a Crack

Claims (11)

  1. 　撮像素子と、
    　前記撮像素子に光を集光するレンズと、
    　前記レンズよりも被写体側に設けられ、外気と接する保護板とを備え、
    　前記保護板は、
    　ガラス板と、前記ガラス板の主表面に接して備えられる樹脂層と、前記樹脂層上に備えられる無機膜とを含み、
    　前記保護板は、被写体側から、前記ガラス板、前記樹脂層、前記無機膜の順で配置されている
    　ことを特徴とする撮像装置。     An image sensor;
    A lens for condensing light on the image sensor;
    Provided on the subject side of the lens, and a protective plate in contact with the outside air,
    The protective plate is
    A glass plate, a resin layer provided in contact with the main surface of the glass plate, and an inorganic film provided on the resin layer,
    The imaging device, wherein the protective plate is arranged in order of the glass plate, the resin layer, and the inorganic film from the subject side.
  2. 　前記無機膜は、少なくとも反射防止機能を有する誘電体多層膜である
    　請求項１に記載の撮像装置。     The imaging device according to claim 1, wherein the inorganic film is a dielectric multilayer film having at least an antireflection function.
  3. 　前記保護板は、曲げ弾性率が５００ＭＰａ以上である
    　請求項１または請求項２に記載の撮像装置。     The imaging device according to claim 1, wherein the protective plate has a flexural modulus of 500 MPa or more.
  4. 　前記樹脂層は、ポリイミド樹脂、エポキシ樹脂、ポリシクロオレフィン樹脂、ポリカーボネート樹脂、アクリル樹脂から選ばれる少なくとも１種の樹脂材料を用いて形成されている
    　請求項１～３いずれか１項に記載の撮像装置。     The imaging according to any one of claims 1 to 3, wherein the resin layer is formed using at least one resin material selected from polyimide resin, epoxy resin, polycycloolefin resin, polycarbonate resin, and acrylic resin. apparatus.
  5. 　前記ガラス板および前記樹脂層の合計の厚さは、０．０７～１．１ｍｍである
    　請求項１～４いずれか１項に記載の撮像装置。     The imaging device according to any one of claims 1 to 4, wherein a total thickness of the glass plate and the resin layer is 0.07 to 1.1 mm.
  6. 　前記樹脂層の厚さは、２０～１００μｍである
    　請求項５に記載の撮像装置。     6. The imaging device according to claim 5, wherein the resin layer has a thickness of 20 to 100 μm.
  7. 　前記ガラス板は、化学強化ガラス基板である
    　請求項１～６いずれか１項に記載の撮像装置。     The imaging apparatus according to any one of claims 1 to 6, wherein the glass plate is a chemically strengthened glass substrate.
  8. 　前記保護板は、前記ガラス板の被写体側の表面に第２の反射防止膜が備えられており、
    　前記保護板の波長４００～６７０ｎｍの光に対する透過率が９６％以上である
    　請求項１～７いずれか１項に記載の撮像装置。     The protective plate is provided with a second antireflection film on the subject side surface of the glass plate,
    The imaging device according to any one of claims 1 to 7, wherein the protective plate has a transmittance for light having a wavelength of 400 to 670 nm of 96% or more.
  9. 　前記保護板は、波長４００～６７０ｎｍの光に対する反射率が２％以下である
    　請求項８に記載の撮像装置。     The imaging apparatus according to claim 8, wherein the protective plate has a reflectance of 2% or less with respect to light having a wavelength of 400 to 670 nm.
  10. 　前記第２の反射防止膜の上に、フッ素を含む材料による防汚膜が形成されている
    　請求項８または請求項９に記載の撮像装置。     The imaging device according to claim 8 or 9, wherein an antifouling film made of a material containing fluorine is formed on the second antireflection film.
  11. 　前記保護板は、入射する光の一部を遮蔽する遮光膜を含む
    　請求項１～１０いずれか１項に記載の撮像装置。     The imaging apparatus according to any one of claims 1 to 10, wherein the protective plate includes a light shielding film that blocks a part of incident light.
PCT/JP2017/012754 2016-03-31 2017-03-28 Image acquisition device WO2017170606A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109147595A (en) * 2018-09-30 2019-01-04 厦门天马微电子有限公司 Display device and preparation method thereof
CN116347207A (en) * 2022-12-31 2023-06-27 宜宾市天珑通讯有限公司 Automatic focusing camera structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133876A (en) * 1999-11-01 2001-05-18 Fuji Photo Film Co Ltd Image pickup device
JP2013041141A (en) * 2011-08-17 2013-02-28 Asahi Glass Co Ltd Imaging device, solid-state imaging element, lens for imaging device, and near infrared light cut-off filter
WO2016047523A1 (en) * 2014-09-26 2016-03-31 旭硝子株式会社 Optical element and imaging device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133876A (en) * 1999-11-01 2001-05-18 Fuji Photo Film Co Ltd Image pickup device
JP2013041141A (en) * 2011-08-17 2013-02-28 Asahi Glass Co Ltd Imaging device, solid-state imaging element, lens for imaging device, and near infrared light cut-off filter
WO2016047523A1 (en) * 2014-09-26 2016-03-31 旭硝子株式会社 Optical element and imaging device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109147595A (en) * 2018-09-30 2019-01-04 厦门天马微电子有限公司 Display device and preparation method thereof
CN116347207A (en) * 2022-12-31 2023-06-27 宜宾市天珑通讯有限公司 Automatic focusing camera structure

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