WO2017169914A1 - 感放射線樹脂組成物及び電子部品 - Google Patents
感放射線樹脂組成物及び電子部品 Download PDFInfo
- Publication number
- WO2017169914A1 WO2017169914A1 PCT/JP2017/010961 JP2017010961W WO2017169914A1 WO 2017169914 A1 WO2017169914 A1 WO 2017169914A1 JP 2017010961 W JP2017010961 W JP 2017010961W WO 2017169914 A1 WO2017169914 A1 WO 2017169914A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ene
- group
- hept
- radiation
- resin composition
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 112
- 239000011342 resin composition Substances 0.000 title claims abstract description 87
- 150000001875 compounds Chemical class 0.000 claims abstract description 121
- 239000004593 Epoxy Substances 0.000 claims abstract description 80
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 46
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 45
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 20
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 12
- -1 methylol groups Chemical group 0.000 claims description 91
- 229920005989 resin Polymers 0.000 claims description 79
- 239000011347 resin Substances 0.000 claims description 79
- 125000004849 alkoxymethyl group Chemical group 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- 125000002723 alicyclic group Chemical group 0.000 claims description 8
- 239000010408 film Substances 0.000 description 83
- 239000000178 monomer Substances 0.000 description 43
- 238000000034 method Methods 0.000 description 31
- WLTSXAIICPDFKI-UHFFFAOYSA-N 3-dodecene Chemical compound CCCCCCCCC=CCC WLTSXAIICPDFKI-UHFFFAOYSA-N 0.000 description 30
- 239000000126 substance Substances 0.000 description 25
- 239000003431 cross linking reagent Substances 0.000 description 19
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 19
- 230000035939 shock Effects 0.000 description 19
- 125000000217 alkyl group Chemical group 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- PHCKFVVLVZFFLU-UHFFFAOYSA-N dodec-4-ene Chemical compound CCCCCCCC=CCCC PHCKFVVLVZFFLU-UHFFFAOYSA-N 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 238000011161 development Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000002798 polar solvent Substances 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000005984 hydrogenation reaction Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- JFUOAGBSDGCVES-UHFFFAOYSA-N 3-but-2-enyl-4-methylpyrrolidine-2,5-dione Chemical compound CC=CCC1C(C)C(=O)NC1=O JFUOAGBSDGCVES-UHFFFAOYSA-N 0.000 description 4
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 4
- 125000005462 imide group Chemical group 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- MKUWVMRNQOOSAT-UHFFFAOYSA-N methylvinylmethanol Natural products CC(O)C=C MKUWVMRNQOOSAT-UHFFFAOYSA-N 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000007142 ring opening reaction Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 4
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 3
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical group COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 3
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- JFNLZVQOOSMTJK-UHFFFAOYSA-N norbornene Chemical compound C1C2CCC1C=C2 JFNLZVQOOSMTJK-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 2
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 2
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 2
- WIMJCWOUYMSHBO-UHFFFAOYSA-N 3-hept-4-enyl-4-propylpyrrolidine-2,5-dione Chemical compound CCCC1C(CCCC=CCC)C(NC1=O)=O WIMJCWOUYMSHBO-UHFFFAOYSA-N 0.000 description 2
- HNVRRHSXBLFLIG-UHFFFAOYSA-N 3-hydroxy-3-methylbut-1-ene Chemical compound CC(C)(O)C=C HNVRRHSXBLFLIG-UHFFFAOYSA-N 0.000 description 2
- RHLVCLIPMVJYKS-UHFFFAOYSA-N 3-octanone Chemical compound CCCCCC(=O)CC RHLVCLIPMVJYKS-UHFFFAOYSA-N 0.000 description 2
- RBAJWLRQWAFRSP-UHFFFAOYSA-N 4-(2-propylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CCC)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCC RBAJWLRQWAFRSP-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- RLOMPKBYKIOKJC-UHFFFAOYSA-N 4-tridecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 RLOMPKBYKIOKJC-UHFFFAOYSA-N 0.000 description 2
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 2
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004093 cyano group Chemical class *C#N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000004185 ester group Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- CPJRRXSHAYUTGL-UHFFFAOYSA-N isopentenyl alcohol Chemical compound CC(=C)CCO CPJRRXSHAYUTGL-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- ASUAYTHWZCLXAN-UHFFFAOYSA-N prenol Chemical compound CC(C)=CCO ASUAYTHWZCLXAN-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- GAONUEUNHBLHPP-UHFFFAOYSA-N stk246934 Chemical compound O=C1C2C(C=C3)CC3C2C(=O)N1C1=CC=CC=C1 GAONUEUNHBLHPP-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- JBVMSEMQJGGOFR-FNORWQNLSA-N (4e)-4-methylhexa-1,4-diene Chemical compound C\C=C(/C)CC=C JBVMSEMQJGGOFR-FNORWQNLSA-N 0.000 description 1
- WNHHRXSVKWWRJY-UHFFFAOYSA-N (5-methyl-5-bicyclo[2.2.1]hept-2-enyl)methanol Chemical compound C1C2C(C)(CO)CC1C=C2 WNHHRXSVKWWRJY-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 239000001714 (E)-hex-2-en-1-ol Substances 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- VEIIEWOTAHXGKS-UHFFFAOYSA-N 1-phenylethenol Chemical compound OC(=C)C1=CC=CC=C1 VEIIEWOTAHXGKS-UHFFFAOYSA-N 0.000 description 1
- LEOHSWVNTUYBCE-UHFFFAOYSA-N 2,2,2-trifluoroethyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C)(C(=O)OCC(F)(F)F)CC1C=C2 LEOHSWVNTUYBCE-UHFFFAOYSA-N 0.000 description 1
- JCEBJANJSMTYJD-UHFFFAOYSA-N 2,2,2-trifluoroethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC(F)(F)F)CC1C=C2 JCEBJANJSMTYJD-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 1
- VRMKFAFIVOVETG-UHFFFAOYSA-N 2,6-bis(methoxymethyl)-4-methylphenol Chemical compound COCC1=CC(C)=CC(COC)=C1O VRMKFAFIVOVETG-UHFFFAOYSA-N 0.000 description 1
- XLXYTPFIEKIXSN-UHFFFAOYSA-N 2-(2-ethylbutyl)-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CC)C1=O XLXYTPFIEKIXSN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- MEJFVBUCFBLTKO-UHFFFAOYSA-N 2-(4-bicyclo[2.2.1]hept-2-enyl)ethanol Chemical compound C1CC2C=CC1(CCO)C2 MEJFVBUCFBLTKO-UHFFFAOYSA-N 0.000 description 1
- ZWLMSPFIEMHRIM-UHFFFAOYSA-N 2-(5-bicyclo[2.2.1]hept-2-enyl)-1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound C1C2C(C(O)(C(F)(F)F)C(F)(F)F)CC1C=C2 ZWLMSPFIEMHRIM-UHFFFAOYSA-N 0.000 description 1
- YZRMOQASKCPNAH-UHFFFAOYSA-N 2-(carboxymethyl)bicyclo[2.2.1]hept-5-ene-3-carboxylic acid Chemical compound C1C2C=CC1C(CC(=O)O)C2C(O)=O YZRMOQASKCPNAH-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- AJRZFZKKKGRKLQ-UHFFFAOYSA-N 2-(hydroxymethyl)bicyclo[2.2.1]hept-5-ene-3-carboxylic acid Chemical compound C1C2C=CC1C(CO)C2C(O)=O AJRZFZKKKGRKLQ-UHFFFAOYSA-N 0.000 description 1
- WCASXYBKJHWFMY-NSCUHMNNSA-N 2-Buten-1-ol Chemical compound C\C=C\CO WCASXYBKJHWFMY-NSCUHMNNSA-N 0.000 description 1
- ZCHHRLHTBGRGOT-SNAWJCMRSA-N 2-Hexen-1-ol Natural products CCC\C=C\CO ZCHHRLHTBGRGOT-SNAWJCMRSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- BZAZNULYLRVMSW-UHFFFAOYSA-N 2-Methyl-2-buten-3-ol Natural products CC(C)=C(C)O BZAZNULYLRVMSW-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-M 2-Methyl-2-butenoic acid Natural products C\C=C(\C)C([O-])=O UIERETOOQGIECD-ARJAWSKDSA-M 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PQDNPXPHODJEKV-UHFFFAOYSA-N 2-[(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)methyl]propanedioic acid Chemical compound OC(=O)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)C(=O)O PQDNPXPHODJEKV-UHFFFAOYSA-N 0.000 description 1
- ZSYBUHKRLXNWLP-UHFFFAOYSA-N 2-[2-(1-bicyclo[2.2.1]hept-2-enyl)acetyl]oxy-1H-naphthalene-2-carboxylic acid Chemical compound OC(=O)C1(CC2=CC=CC=C2C=C1)OC(=O)CC12CCC(C=C1)C2 ZSYBUHKRLXNWLP-UHFFFAOYSA-N 0.000 description 1
- KBQUYCFJACYUIX-UHFFFAOYSA-N 2-[2-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)ethyl]propanedioic acid Chemical compound OC(=O)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)C(=O)O KBQUYCFJACYUIX-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- MYVFYVDFTPQNBY-UHFFFAOYSA-N 2-butyl-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CCCC)C1=O MYVFYVDFTPQNBY-UHFFFAOYSA-N 0.000 description 1
- ZCHHRLHTBGRGOT-UHFFFAOYSA-N 2-hexen-1-ol Chemical compound CCCC=CCO ZCHHRLHTBGRGOT-UHFFFAOYSA-N 0.000 description 1
- PHSXOZKMZYKHLY-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCO)CC1C=C2 PHSXOZKMZYKHLY-UHFFFAOYSA-N 0.000 description 1
- WHRYLXXHLFPFNZ-UHFFFAOYSA-N 2-methyl-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(C)C1=O WHRYLXXHLFPFNZ-UHFFFAOYSA-N 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- BYDRTKVGBRTTIT-UHFFFAOYSA-N 2-methylprop-2-en-1-ol Chemical compound CC(=C)CO BYDRTKVGBRTTIT-UHFFFAOYSA-N 0.000 description 1
- LEVZZYOVVQKGOM-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n-pentakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(N(COC)COC)=NC(N(COC)COC)=N1 LEVZZYOVVQKGOM-UHFFFAOYSA-N 0.000 description 1
- FLYHFZHMELHCRY-UHFFFAOYSA-N 2-n,2-n,4-n,6-n-tetrakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(NCOC)=NC(N(COC)COC)=N1 FLYHFZHMELHCRY-UHFFFAOYSA-N 0.000 description 1
- CZFJRMBYCKMYHU-UHFFFAOYSA-N 2-n,4-n,6-n-tris(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(NCOC)=NC(NCOC)=N1 CZFJRMBYCKMYHU-UHFFFAOYSA-N 0.000 description 1
- DULUPJGRJYHDLJ-UHFFFAOYSA-N 2-n,4-n-bis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(N)=NC(NCOC)=N1 DULUPJGRJYHDLJ-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- JFWJMICCQJMARP-UHFFFAOYSA-N 2-propoxynaphtho[2,3-b]oxirene Chemical compound C1=CC=C2C(OCCC)=C(O3)C3=CC2=C1 JFWJMICCQJMARP-UHFFFAOYSA-N 0.000 description 1
- DTLHHLXHGYDYAW-UHFFFAOYSA-N 2-propylpropane-1,2,3-triol Chemical compound CCCC(O)(CO)CO DTLHHLXHGYDYAW-UHFFFAOYSA-N 0.000 description 1
- WYYQKWASBLTRIW-UHFFFAOYSA-N 2-trimethoxysilylbenzoic acid Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1C(O)=O WYYQKWASBLTRIW-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- FYZAGOMIGJDFNE-UHFFFAOYSA-N 3-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)-2-phenylpropanoic acid Chemical compound OC(=O)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)C1=CC=CC=C1 FYZAGOMIGJDFNE-UHFFFAOYSA-N 0.000 description 1
- ZSPTYLOMNJNZNG-UHFFFAOYSA-N 3-Buten-1-ol Chemical compound OCCC=C ZSPTYLOMNJNZNG-UHFFFAOYSA-N 0.000 description 1
- NSPPRYXGGYQMPY-UHFFFAOYSA-N 3-Methylbuten-2-ol-1 Natural products CC(C)C(O)=C NSPPRYXGGYQMPY-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- ABRQMTGILBWGOI-UHFFFAOYSA-N 3-hept-4-enyl-4-propyloxolane-2,5-dione Chemical compound CCCC1C(CCCC=CCC)C(=O)OC1=O ABRQMTGILBWGOI-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- FQKKBQRXKBNPEW-UHFFFAOYSA-N 3-tricyclo[5.2.1.02,6]deca-4,8-dienylmethanol Chemical compound C1C2C3C(CO)C=CC3C1C=C2 FQKKBQRXKBNPEW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- GPIUUMROPXDNRH-UHFFFAOYSA-N 3647-74-3 Chemical compound C1C2C3C(=O)NC(=O)C3C1C=C2 GPIUUMROPXDNRH-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- CMJCWFKZHGHDNW-UHFFFAOYSA-N 4-(2-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC CMJCWFKZHGHDNW-UHFFFAOYSA-N 0.000 description 1
- QVVNNKZXILVKSQ-UHFFFAOYSA-N 4-(2-methylbutyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CC QVVNNKZXILVKSQ-UHFFFAOYSA-N 0.000 description 1
- GPIZMZGBOPYEFG-UHFFFAOYSA-N 4-(2-methylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC GPIZMZGBOPYEFG-UHFFFAOYSA-N 0.000 description 1
- XVNWPSBUDSYSPF-UHFFFAOYSA-N 4-(2-methylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CCCCC(C)CN1C(=O)C2C3CC(C=C3)C2C1=O XVNWPSBUDSYSPF-UHFFFAOYSA-N 0.000 description 1
- DKIHIDZXAAYMRP-UHFFFAOYSA-N 4-(2-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCCC DKIHIDZXAAYMRP-UHFFFAOYSA-N 0.000 description 1
- ABYLFIWJNQVLEU-UHFFFAOYSA-N 4-(2-methyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC ABYLFIWJNQVLEU-UHFFFAOYSA-N 0.000 description 1
- WTTOVGGVLUMVGF-UHFFFAOYSA-N 4-(2-propylpentyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCC WTTOVGGVLUMVGF-UHFFFAOYSA-N 0.000 description 1
- NSKDPULTYYBMOB-UHFFFAOYSA-N 4-(3-ethylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC NSKDPULTYYBMOB-UHFFFAOYSA-N 0.000 description 1
- MLUFSDJPPXGHJS-UHFFFAOYSA-N 4-(3-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC MLUFSDJPPXGHJS-UHFFFAOYSA-N 0.000 description 1
- SWINLNKPVRNQKU-UHFFFAOYSA-N 4-(3-methylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC SWINLNKPVRNQKU-UHFFFAOYSA-N 0.000 description 1
- PLOOZRWPXCQWLG-UHFFFAOYSA-N 4-(3-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC PLOOZRWPXCQWLG-UHFFFAOYSA-N 0.000 description 1
- VVMWMWSLCQVFLM-UHFFFAOYSA-N 4-(3-methyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC VVMWMWSLCQVFLM-UHFFFAOYSA-N 0.000 description 1
- HINDSULEOFNHEL-UHFFFAOYSA-N 4-(3-propylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC HINDSULEOFNHEL-UHFFFAOYSA-N 0.000 description 1
- HJMMPZPVDNIHLX-UHFFFAOYSA-N 4-(4-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC HJMMPZPVDNIHLX-UHFFFAOYSA-N 0.000 description 1
- QYHFGPGOSLYVIB-UHFFFAOYSA-N 4-(4-methylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC QYHFGPGOSLYVIB-UHFFFAOYSA-N 0.000 description 1
- CZGCPAYJJYAUOL-UHFFFAOYSA-N 4-(5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1=CC(O)=CC=C1C1C(C=C2)CC2C1 CZGCPAYJJYAUOL-UHFFFAOYSA-N 0.000 description 1
- DLLSVQVOYYQPNY-UHFFFAOYSA-N 4-(5-methyl-5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1C(C=C2)CC2C1(C)C1=CC=C(O)C=C1 DLLSVQVOYYQPNY-UHFFFAOYSA-N 0.000 description 1
- WVBUFQVRTAAVGH-UHFFFAOYSA-N 4-(5-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC WVBUFQVRTAAVGH-UHFFFAOYSA-N 0.000 description 1
- FIGVNZUQNIUGPD-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxy-3-methylphenyl)ethyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C(C)(C=2C=C(C)C(O)=CC=2)C=2C=C(C)C(O)=CC=2)=C1 FIGVNZUQNIUGPD-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- ZRIRUWWYQXWRNY-UHFFFAOYSA-N 4-[2-[4-hydroxy-3,5-bis(hydroxymethyl)phenyl]propan-2-yl]-2,6-bis(hydroxymethyl)phenol Chemical compound C=1C(CO)=C(O)C(CO)=CC=1C(C)(C)C1=CC(CO)=C(O)C(CO)=C1 ZRIRUWWYQXWRNY-UHFFFAOYSA-N 0.000 description 1
- CJBUQOXMWGPKGP-UHFFFAOYSA-N 4-[3,3-bis(4-hydroxy-2,5-dimethylphenyl)-1-phenylpropyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(CC(C=2C(=CC(O)=C(C)C=2)C)C=2C(=CC(O)=C(C)C=2)C)C=2C=CC=CC=2)=C1C CJBUQOXMWGPKGP-UHFFFAOYSA-N 0.000 description 1
- DOMBBFBDIIXIKP-UHFFFAOYSA-N 4-[[4-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-2-(hydroxymethyl)-6-methylphenol Chemical compound OCC1=C(O)C(C)=CC(CC=2C=C(CO)C(O)=C(C)C=2)=C1 DOMBBFBDIIXIKP-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- PSBZHRVZVAQBNS-UHFFFAOYSA-N 4-decan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 PSBZHRVZVAQBNS-UHFFFAOYSA-N 0.000 description 1
- GQZWYWSJOOGEMG-UHFFFAOYSA-N 4-decan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 GQZWYWSJOOGEMG-UHFFFAOYSA-N 0.000 description 1
- ULJAQZCVBREZBM-UHFFFAOYSA-N 4-dodecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 ULJAQZCVBREZBM-UHFFFAOYSA-N 0.000 description 1
- OPMUAJRVOWSBTP-UHFFFAOYSA-N 4-ethyl-1-hexene Chemical compound CCC(CC)CC=C OPMUAJRVOWSBTP-UHFFFAOYSA-N 0.000 description 1
- KZJOWXTTXLYUIU-UHFFFAOYSA-N 4-hexadecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KZJOWXTTXLYUIU-UHFFFAOYSA-N 0.000 description 1
- HWCRRWJQBDTOBJ-UHFFFAOYSA-N 4-hexan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 HWCRRWJQBDTOBJ-UHFFFAOYSA-N 0.000 description 1
- NHYDATXTNUFKBQ-UHFFFAOYSA-N 4-hexan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCC)N1C(=O)C2C3C=CC(C2C1=O)C3 NHYDATXTNUFKBQ-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- DWPMBDKQFRROGO-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-en-5-ol Chemical compound C1C2CC(O)C1(C)C=C2 DWPMBDKQFRROGO-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- LOFHPLKGPULNQP-UHFFFAOYSA-N 4-methylpent-4-en-1-ol Chemical compound CC(=C)CCCO LOFHPLKGPULNQP-UHFFFAOYSA-N 0.000 description 1
- KMRUSNXCFCQYQT-UHFFFAOYSA-N 4-nonan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KMRUSNXCFCQYQT-UHFFFAOYSA-N 0.000 description 1
- KIEUXOQJDQXOBT-UHFFFAOYSA-N 4-nonan-4-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KIEUXOQJDQXOBT-UHFFFAOYSA-N 0.000 description 1
- VVAWKJLGEMNVRZ-UHFFFAOYSA-N 4-nonan-5-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CCC)C(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 VVAWKJLGEMNVRZ-UHFFFAOYSA-N 0.000 description 1
- INFNBXDBZIXTFM-UHFFFAOYSA-N 4-octan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 INFNBXDBZIXTFM-UHFFFAOYSA-N 0.000 description 1
- YBRGYSWRJLVQDM-UHFFFAOYSA-N 4-octan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C1=CC2CC1C1C2C(=O)N(C(CC)CCCCC)C1=O YBRGYSWRJLVQDM-UHFFFAOYSA-N 0.000 description 1
- VOPVZNGZEHESJM-UHFFFAOYSA-N 4-octan-4-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 VOPVZNGZEHESJM-UHFFFAOYSA-N 0.000 description 1
- QQPIBBMHRAVLLM-UHFFFAOYSA-N 4-pentadecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 QQPIBBMHRAVLLM-UHFFFAOYSA-N 0.000 description 1
- ZMFDZBUPZYNJKC-UHFFFAOYSA-N 4-pentan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCC)N1C(=O)C2C3C=CC(C2C1=O)C3 ZMFDZBUPZYNJKC-UHFFFAOYSA-N 0.000 description 1
- RQGOXSVAQXFULZ-UHFFFAOYSA-N 4-propyl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CCC)C1=O RQGOXSVAQXFULZ-UHFFFAOYSA-N 0.000 description 1
- SHDBJOYDLRRTRA-UHFFFAOYSA-N 4-tert-butyl-2,6-bis(methoxymethyl)phenol Chemical compound COCC1=CC(C(C)(C)C)=CC(COC)=C1O SHDBJOYDLRRTRA-UHFFFAOYSA-N 0.000 description 1
- SBNZNTVKMMJAPP-UHFFFAOYSA-N 4-undecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 SBNZNTVKMMJAPP-UHFFFAOYSA-N 0.000 description 1
- FVGZTLTUKDGALJ-UHFFFAOYSA-N 5-(2-cyclohexyloxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1CCCCC1 FVGZTLTUKDGALJ-UHFFFAOYSA-N 0.000 description 1
- UGWKKYZTZPIIEE-UHFFFAOYSA-N 5-(2-ethoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCC)(C(O)=O)CC1C=C2 UGWKKYZTZPIIEE-UHFFFAOYSA-N 0.000 description 1
- WVEJJHFWQOXHMD-UHFFFAOYSA-N 5-(2-hexoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCCCCC)(C(O)=O)CC1C=C2 WVEJJHFWQOXHMD-UHFFFAOYSA-N 0.000 description 1
- DWLJZAPLOBUYFF-UHFFFAOYSA-N 5-(2-methoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OC)(C(O)=O)CC1C=C2 DWLJZAPLOBUYFF-UHFFFAOYSA-N 0.000 description 1
- DMMFRQYGTQAUDN-UHFFFAOYSA-N 5-(2-oxo-2-pentoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCCCC)(C(O)=O)CC1C=C2 DMMFRQYGTQAUDN-UHFFFAOYSA-N 0.000 description 1
- WVUIAMCXSQNTDG-UHFFFAOYSA-N 5-(2-oxo-2-phenoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1=CC=CC=C1 WVUIAMCXSQNTDG-UHFFFAOYSA-N 0.000 description 1
- YOPJLKWCZXKVFZ-UHFFFAOYSA-N 5-(2-oxo-2-propoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCC)(C(O)=O)CC1C=C2 YOPJLKWCZXKVFZ-UHFFFAOYSA-N 0.000 description 1
- YZGFGXBZXHCJPU-UHFFFAOYSA-N 5-(carboxymethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)O)(C(O)=O)CC1C=C2 YZGFGXBZXHCJPU-UHFFFAOYSA-N 0.000 description 1
- UVFFMASFIIKUOD-UHFFFAOYSA-N 5-(chloromethyl)bicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCl)CC1C=C2 UVFFMASFIIKUOD-UHFFFAOYSA-N 0.000 description 1
- XTBDKGVIIRTLAY-UHFFFAOYSA-N 5-[2-oxo-2-(2-phenylphenoxy)ethyl]bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 XTBDKGVIIRTLAY-UHFFFAOYSA-N 0.000 description 1
- DRWRVXAXXGJZIO-UHFFFAOYSA-N 5-bicyclo[2.2.1]hept-2-enyl acetate Chemical compound C1C2C(OC(=O)C)CC1C=C2 DRWRVXAXXGJZIO-UHFFFAOYSA-N 0.000 description 1
- JHPLUQZQEHCSIP-UHFFFAOYSA-N 5-bicyclo[2.2.1]hept-2-enylmethyl acetate Chemical compound C1C2C(COC(=O)C)CC1C=C2 JHPLUQZQEHCSIP-UHFFFAOYSA-N 0.000 description 1
- YSWATWCBYRBYBO-UHFFFAOYSA-N 5-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCC)CC1C=C2 YSWATWCBYRBYBO-UHFFFAOYSA-N 0.000 description 1
- PSCJIEZOAFAQRM-UHFFFAOYSA-N 5-chlorobicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(Cl)CC1C=C2 PSCJIEZOAFAQRM-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- YLSRLICOTNISRM-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene-5-carbonitrile Chemical compound C1C2C(C)(C#N)CC1C=C2 YLSRLICOTNISRM-UHFFFAOYSA-N 0.000 description 1
- JIHFJSOMLKXSSQ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C)(C(O)=O)CC1C=C2 JIHFJSOMLKXSSQ-UHFFFAOYSA-N 0.000 description 1
- VSQLAQKFRFTMNS-UHFFFAOYSA-N 5-methylhexa-1,4-diene Chemical compound CC(C)=CCC=C VSQLAQKFRFTMNS-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- SIRXYHBXRXZGJQ-UHFFFAOYSA-N 6814-80-8 Chemical compound C1C2C3C(O)C=CC3C1C=C2 SIRXYHBXRXZGJQ-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- YECWYVHKYFQNBG-UHFFFAOYSA-N C(C)C(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3.CC(CCCN3C(=O)C1C2C=CC(C1C3=O)C2)CCCC Chemical compound C(C)C(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3.CC(CCCN3C(=O)C1C2C=CC(C1C3=O)C2)CCCC YECWYVHKYFQNBG-UHFFFAOYSA-N 0.000 description 1
- VWMKUZYJGUVNJX-UHFFFAOYSA-L C(C1=CC=CC=C1)=[Ru](Cl)Cl.C1(=C(C(=CC(=C1)C)C)N1C(N(CC1)C1=C(C=C(C=C1C)C)C)=C1C(CCCC1)P(C1CCCCC1)C1CCCCC1)C Chemical compound C(C1=CC=CC=C1)=[Ru](Cl)Cl.C1(=C(C(=CC(=C1)C)C)N1C(N(CC1)C1=C(C=C(C=C1C)C)C)=C1C(CCCC1)P(C1CCCCC1)C1CCCCC1)C VWMKUZYJGUVNJX-UHFFFAOYSA-L 0.000 description 1
- CLJIBHYYSDHPOU-UHFFFAOYSA-N C1=CC2CC1C1C2C(=O)N(CC(CC)CCCCC)C1=O Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CCCCC)C1=O CLJIBHYYSDHPOU-UHFFFAOYSA-N 0.000 description 1
- NYSFUWJAVUDRIT-UHFFFAOYSA-N CC(C)(CO)O.C(C(C)O)O Chemical class CC(C)(CO)O.C(C(C)O)O NYSFUWJAVUDRIT-UHFFFAOYSA-N 0.000 description 1
- OEIKAJZLTCHQOT-UHFFFAOYSA-N CC(CCCN1C(=O)C2=C3CCC(C2C1=O)C3)CCCCC Chemical compound CC(CCCN1C(=O)C2=C3CCC(C2C1=O)C3)CCCCC OEIKAJZLTCHQOT-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- HCNNPFPPLDNQMO-UHFFFAOYSA-N OC1=C(C=CC=C1)CC(C(=O)O)N1C(=O)C2C3C=CC(C2C1=O)C3 Chemical compound OC1=C(C=CC=C1)CC(C(=O)O)N1C(=O)C2C3C=CC(C2C1=O)C3 HCNNPFPPLDNQMO-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- IGHHPVIMEQGKNE-UHFFFAOYSA-N [3-(hydroxymethyl)-2-bicyclo[2.2.1]hept-5-enyl]methanol Chemical compound C1C2C=CC1C(CO)C2CO IGHHPVIMEQGKNE-UHFFFAOYSA-N 0.000 description 1
- KXETVEDTUWAYHA-UHFFFAOYSA-N ac1l7sbv Chemical compound C1=CC2CC1C1C2C(=O)N(CC(=O)O)C1=O KXETVEDTUWAYHA-UHFFFAOYSA-N 0.000 description 1
- JAWZRFZAOPGTPT-UHFFFAOYSA-N ac1mdjjn Chemical compound C1=CC2CC1C1C2C(=O)N(CCCCCC(=O)O)C1=O JAWZRFZAOPGTPT-UHFFFAOYSA-N 0.000 description 1
- WXAMJXJYUHAUQT-UHFFFAOYSA-N ac1mffmi Chemical compound O=C1C2C(C=C3)CC3C2C(=O)N1C1CCCCC1 WXAMJXJYUHAUQT-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MKOSBHNWXFSHSW-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-en-5-ol Chemical compound C1C2C(O)CC1C=C2 MKOSBHNWXFSHSW-UHFFFAOYSA-N 0.000 description 1
- BMAXQTDMWYDIJX-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carbonitrile Chemical compound C1C2C(C#N)CC1C=C2 BMAXQTDMWYDIJX-UHFFFAOYSA-N 0.000 description 1
- FYGUSUBEMUKACF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C(=O)O)CC1C=C2 FYGUSUBEMUKACF-UHFFFAOYSA-N 0.000 description 1
- DJNPQHBMESQZIP-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarbonitrile Chemical compound C1C2C=CC1C(C#N)C2C#N DJNPQHBMESQZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000005997 bromomethyl group Chemical group 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- ABDSKYPMIZRTDX-UHFFFAOYSA-N butyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCCC)(C)CC1C=C2 ABDSKYPMIZRTDX-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- RFIHUFUZAHTZOQ-UHFFFAOYSA-N butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCCC)CC1C=C2 RFIHUFUZAHTZOQ-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- HDNAENGLYCLHFK-UHFFFAOYSA-N cis-endo-n-ethyl-5-norbornene-2,3-dicarboximide Chemical compound C1=CC2CC1C1C2C(=O)N(CC)C1=O HDNAENGLYCLHFK-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- GNQDOFSOPLSHLF-UHFFFAOYSA-N cyclohexyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C(C=C2)CC2C1(C)C(=O)OC1CCCCC1 GNQDOFSOPLSHLF-UHFFFAOYSA-N 0.000 description 1
- MSPIWBYBMMBCEX-UHFFFAOYSA-N cyclohexyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C(C=C2)CC2C1C(=O)OC1CCCCC1 MSPIWBYBMMBCEX-UHFFFAOYSA-N 0.000 description 1
- 125000006547 cyclononyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- HIPQYVJOMHDTRF-UHFFFAOYSA-N deca-2,7-diene Chemical compound CCC=CCCCC=CC HIPQYVJOMHDTRF-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- CSYSRRCOBYEGPI-UHFFFAOYSA-N diazo(sulfonyl)methane Chemical class [N-]=[N+]=C=S(=O)=O CSYSRRCOBYEGPI-UHFFFAOYSA-N 0.000 description 1
- 125000004772 dichloromethyl group Chemical group [H]C(Cl)(Cl)* 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical compound C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- GNGHYFMQCBTLSA-UHFFFAOYSA-N ethyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)(C)CC1C=C2 GNGHYFMQCBTLSA-UHFFFAOYSA-N 0.000 description 1
- FCCGTJAGEHZPBF-UHFFFAOYSA-N ethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)CC1C=C2 FCCGTJAGEHZPBF-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical class CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 1
- IHZKNQZATVICQG-UHFFFAOYSA-N ethyl tricyclo[5.2.1.02,6 ]deca-8-ene-2-carboxylate Chemical compound C1=CC2CC1C1(C(=O)OCC)C2CCC1 IHZKNQZATVICQG-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000000457 gamma-lactone group Chemical group 0.000 description 1
- WCASXYBKJHWFMY-UHFFFAOYSA-N gamma-methylallyl alcohol Natural products CC=CCO WCASXYBKJHWFMY-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000006343 heptafluoro propyl group Chemical group 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- ORTFAQDWJHRMNX-UHFFFAOYSA-N hydroxidooxidocarbon(.) Chemical group O[C]=O ORTFAQDWJHRMNX-UHFFFAOYSA-N 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005649 metathesis reaction Methods 0.000 description 1
- AEBDJCUTXUYLDC-UHFFFAOYSA-N methyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC)(C)CC1C=C2 AEBDJCUTXUYLDC-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- ARLYLDLNVQPCQY-UHFFFAOYSA-N methyl tricyclo[5.2.1.02,6]dec-8-ene-2-carboxylate Chemical compound COC(=O)C12C3C=CC(C2CCC1)C3 ARLYLDLNVQPCQY-UHFFFAOYSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- VJKBQUJCCYLNCM-UHFFFAOYSA-N n-octyl-5-norbornene-2,3-dicarboximide Chemical compound C1=CC2CC1C1C2C(=O)N(C(CC)CCCC)C1=O VJKBQUJCCYLNCM-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- YWXLSHOWXZUMSR-UHFFFAOYSA-N octan-4-one Chemical compound CCCCC(=O)CCC YWXLSHOWXZUMSR-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002896 organic halogen compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- LQAVWYMTUMSFBE-UHFFFAOYSA-N pent-4-en-1-ol Chemical compound OCCCC=C LQAVWYMTUMSFBE-UHFFFAOYSA-N 0.000 description 1
- WNBDFALPKHFDJO-UHFFFAOYSA-N pentadec-3-ene Chemical compound CCCCCCCCCCCC=CCC WNBDFALPKHFDJO-UHFFFAOYSA-N 0.000 description 1
- OHVKVVAUWQFKQY-UHFFFAOYSA-N pentadeca-2,7,9,11-tetraene Chemical compound CCCC=CC=CC=CCCCC=CC OHVKVVAUWQFKQY-UHFFFAOYSA-N 0.000 description 1
- LTBKJTHWKYUMTA-UHFFFAOYSA-N pentadeca-3,10-diene Chemical compound CCCCC=CCCCCCC=CCC LTBKJTHWKYUMTA-UHFFFAOYSA-N 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000005003 perfluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 125000005008 perfluoropentyl group Chemical group FC(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000037048 polymerization activity Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 125000001749 primary amide group Chemical group 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LKKVMVMKNLULSL-UHFFFAOYSA-N propyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCC)CC1C=C2 LKKVMVMKNLULSL-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QMTZQLNTTKDRKC-UHFFFAOYSA-N propyl tricyclo[5.2.1.02,6]dec-8-ene-2-carboxylate Chemical compound C(CC)OC(=O)C12C3C=CC(C2CCC1)C3 QMTZQLNTTKDRKC-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003156 secondary amide group Chemical group 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- WUNGPAHZQWNPEL-UHFFFAOYSA-N st50032131 Chemical compound C1=CC2CC1C1C2C(=O)N(CCO)C1=O WUNGPAHZQWNPEL-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- PVJHFVMRMWVWAX-UHFFFAOYSA-N tetradeca-2,7,9,11-tetraene Chemical compound CCC=CC=CC=CCCCC=CC PVJHFVMRMWVWAX-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- YOKZJDRCZXTECO-UHFFFAOYSA-N tricyclo[5.2.1.02,6]deca-3,8-diene-2-carboxylic acid Chemical compound C1=CC2CC1C1(C(=O)O)C2CC=C1 YOKZJDRCZXTECO-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
Definitions
- the present invention relates to a radiation-sensitive resin composition and an electronic component including a resin film made of the radiation-sensitive resin composition. More specifically, the present invention relates to a low elastic modulus, which suppresses the occurrence of warpage, and provides thermal shock resistance and development. The present invention relates to a radiation-sensitive resin composition capable of providing a resin film having excellent properties, and an electronic component including a resin film made of the radiation-sensitive resin composition.
- Various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrixes and other electronic parts have surface protective films, element surfaces and wiring to prevent their deterioration and damage
- Various resin films are provided as a flattening film for flattening, an interlayer insulating film for insulating between wirings arranged in layers, and the like.
- thermosetting resin materials such as epoxy resins have been widely used as resin materials for forming these resin films.
- resin materials for forming these resin films.
- development of new resin materials excellent in electrical characteristics such as low dielectric properties has been demanded for these resin materials.
- Patent Document 1 discloses that the binder resin (A), the radiation sensitive compound (B), the epoxy equivalent is 450 or less, the softening point is 30 ° C. or less, and the tetrafunctional or less.
- a radiation-sensitive resin composition containing an epoxy-based crosslinking agent (C) and an aralkylphenol resin (D) is disclosed.
- the radiation-sensitive resin composition described in Patent Document 1 although a resin film having excellent electrical characteristics such as low dielectric properties and excellent developability can be formed, the resulting resin film has an elastic modulus. In some cases, warping may occur due to curing when the resin film is formed. Therefore, improvement has been desired from the viewpoint of improving reliability.
- the present invention provides a radiation-sensitive resin composition having a low elastic modulus, thereby suppressing the occurrence of warpage, and capable of providing a resin film excellent in thermal shock resistance and developability, and a resin film comprising the radiation-sensitive resin composition It aims at providing an electronic component provided with.
- the present inventors have obtained a resin composition obtained by blending a specific bifunctional epoxy compound and a radiation sensitive compound with a cyclic olefin polymer having a protic polar group.
- the inventors have found that the above object can be achieved, and have completed the present invention.
- R 1 is a linear or branched alkylene group having 1 to 15 carbon atoms, and k is an integer of 1 to 20
- Radiation resin composition [3] The radiation-sensitive resin composition according to [1] or [2], wherein the epoxy equivalent of the epoxy compound (B) is 100 to 1000, [4] The radiation-sensitive resin composition according to any one of [1] to [3], wherein the epoxy compound (B) has a softening point of 40 ° C. or lower.
- a radiation-sensitive resin composition that has a low elastic modulus, thereby suppressing the occurrence of warpage, and can provide a resin film excellent in thermal shock resistance and developability, and the radiation-sensitive resin composition.
- An electronic component including a resin film can be provided.
- the radiation sensitive resin composition of the present invention comprises a cyclic olefin polymer (A) having a protic polar group, a bifunctional epoxy compound (B) represented by the general formula (1) described later, and a radiation sensitive compound (C ).
- cyclic olefin polymer (A) having a protic polar group used in the present invention is a polymer of one or more cyclic olefin monomers. Or a copolymer of one or more cyclic olefin monomers and a monomer copolymerizable therewith, and in the present invention, in order to form the cyclic olefin polymer (A).
- the monomer it is preferable to use a cyclic olefin monomer (a) having at least a protic polar group.
- the protic polar group means a group containing an atom in which a hydrogen atom is directly bonded to an atom belonging to Group 15 or Group 16 of the Periodic Table.
- atoms belonging to Group 15 or Group 16 of the periodic table atoms belonging to Group 1 or 2 of Group 15 or Group 16 of the Periodic Table are preferable, and more preferably oxygen atom, nitrogen atom or sulfur An atom, particularly preferably an oxygen atom.
- protic polar groups include polar groups having oxygen atoms such as hydroxyl groups, carboxy groups (hydroxycarbonyl groups), sulfonic acid groups, phosphoric acid groups; primary amino groups, secondary amino groups A polar group having a nitrogen atom such as a primary amide group or a secondary amide group (imide group); a polar group having a sulfur atom such as a thiol group; Among these, those having an oxygen atom are preferable, and a carboxy group is more preferable.
- the number of protic polar groups bonded to the cyclic olefin resin having a protic polar group is not particularly limited, and different types of protic polar groups may be included.
- cyclic olefin monomer (a) having a protic polar group examples include 2-hydroxycarbonylbicyclo [2.2.1] hept- 5-ene, 2-methyl-2-hydroxycarbonylbicyclo [2.2.1] hept-5-ene, 2-carboxymethyl-2-hydroxycarbonylbicyclo [2.2.1] hept-5-ene, 2 -Hydroxycarbonyl-2-methoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-ethoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxy Carbonyl-2-propoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-butoxycarbonyl Tyrbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-pentyloxycarbonylmethyl bicyclo [2.
- dodec-9-ene 4-hydroxymethyltetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4,5-dihydroxymethyltetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4- (hydroxyethoxycarbonyl) tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4- (hydroxyethoxycarbonyl) tetracyclo [6.2.1.1 3,6 .
- the content ratio of the units of the monomer (a) in the cyclic olefin polymer (A) is preferably 10 to 90 mol%, preferably 20 to 80 mol%, more preferably based on all monomer units. Is 30 to 70 mol%. If the content ratio of the monomer (a) unit is too small, a dissolution residue may be generated during development. If it is too much, the cyclic olefin polymer (A) has insufficient solubility in the polar solvent. There is a risk of becoming.
- the cyclic olefin polymer (A) used in the present invention is obtained by copolymerizing a cyclic olefin monomer (a) having a protic polar group and a monomer (b) copolymerizable therewith. It may be a copolymer.
- copolymerizable monomers include cyclic olefin monomers (b1) having polar groups other than protic polar groups, cyclic olefin monomers having no polar groups (b2), and cyclic olefins.
- Monomer (b3) hereinafter referred to as “monomer (b1)”, “monomer (b2)”, “monomer (b3)” as appropriate).
- Examples of the cyclic olefin monomer (b1) having a polar group other than the protic polar group include N-substituted imide groups, ester groups, cyano groups, acid anhydride groups, and cyclic olefins having a halogen atom.
- Examples of the cyclic olefin having an N-substituted imide group include a monomer represented by the following general formula (2) or a monomer represented by the following general formula (3).
- R 2 represents a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or an aryl group.
- N represents an integer of 1 to 2.
- R 3 is a divalent alkylene group having 1 to 3 carbon atoms
- R 4 is a monovalent alkyl group having 1 to 10 carbon atoms, or a monovalent alkyl group having 1 to 10 carbon atoms. Represents a halogenated alkyl group.
- R 2 is an alkyl group or aryl group having 1 to 16 carbon atoms.
- the alkyl group include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, linear alkyl groups such as n-pentadecyl group and n-hexadecyl group; cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl
- Alkyl group 2-propyl group, 2-butyl group, 2-methyl-1-propyl group, 2-methyl-2-propyl group, 1-methylbutyl group, 2-methylbutyl group, 1-methylpentyl group, 1- And branched alkyl groups such as ethylbutyl group, 2-methylhexyl group, 2-ethylhexyl group, 4-methylheptyl group, 1-methylnonyl group, 1-methyltridecyl group and 1-methyltetradecyl group.
- Specific examples of the aryl group include a benzyl group.
- an alkyl group and an aryl group having 6 to 14 carbon atoms are preferable and an alkyl group and an aryl group having 6 to 10 carbon atoms are more preferable because of excellent heat resistance and solubility in a polar solvent.
- the carbon number is 4 or less, the solubility in a polar solvent is poor, when the carbon number is 17 or more, the heat resistance is poor, and when the resin film is patterned, the pattern is lost by melting with heat. There is a problem.
- the monomer represented by the general formula (2) include bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-phenyl-bicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-methylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-ethylbicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-propylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-butylbicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-cyclohexylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-adamantylbicyclo [2.2 .1] Hept-5-ene-2,3-di Ruboxyimide, N- (1-methylmethyl
- dodec-9-ene-4,5-dicarboximide N- (2,4-dimethoxyphenyl) -tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene-4,5-dicarboximide and the like. These may be used alone or in combination of two or more.
- R 3 is a divalent alkylene group having 1 to 3 carbon atoms.
- the divalent alkylene group having 1 to 3 carbon atoms include a methylene group, an ethylene group, a propylene group, and An isopropylene group is mentioned. Among these, a methylene group and an ethylene group are preferable because of good polymerization activity.
- R 4 is a monovalent alkyl group having 1 to 10 carbon atoms or a monovalent halogenated alkyl group having 1 to 10 carbon atoms.
- Examples of the monovalent alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, butyl group, sec-butyl group, tert-butyl group, hexyl group, and cyclohexyl group. .
- Examples of the monovalent halogenated alkyl group having 1 to 10 carbon atoms include a fluoromethyl group, a chloromethyl group, a bromomethyl group, a difluoromethyl group, a dichloromethyl group, a difluoromethyl group, a trifluoromethyl group, a trichloromethyl group, Examples include 2,2,2-trifluoroethyl group, pentafluoroethyl group, heptafluoropropyl group, perfluorobutyl group, and perfluoropentyl group. Among these, because of excellent solubility in polar solvents, as is R 4, a methyl group and an ethyl group are preferred.
- the monomers represented by the above general formulas (2) and (3) can be obtained, for example, by an imidation reaction between a corresponding amine and 5-norbornene-2,3-dicarboxylic acid anhydride. .
- the obtained monomer can be efficiently isolated by separating and purifying the reaction solution of the imidization reaction by a known method.
- Examples of the cyclic olefin having an ester group include 2-acetoxybicyclo [2.2.1] hept-5-ene, 2-acetoxymethylbicyclo [2.2.1] hept-5-ene, and 2-methoxycarbonyl.
- cyclic olefin having a cyano group for example, 4-cyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4-cyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4,5-dicyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 2-cyanobicyclo [2.2.1] hept-5-ene, 2-methyl-2-cyanobicyclo [2.2.1] hept-5-ene, 2 , 3-dicyanobicyclo [2.2.1] hept-5-ene, and the like.
- cyclic olefin having an acid anhydride group examples include, for example, tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene-4,5-dicarboxylic anhydride, bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic anhydride, 2-carboxymethyl-2- Hydroxycarbonylbicyclo [2.2.1] hept-5-ene anhydride, and the like.
- Examples of the cyclic olefin having a halogen atom include 2-chlorobicyclo [2.2.1] hept-5-ene, 2-chloromethylbicyclo [2.2.1] hept-5-ene, 2- (chlorophenyl). ) Bicyclo [2.2.1] hept-5-ene, 4-chlorotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4-chlorotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene and the like.
- These monomers (b1) may be used alone or in combination of two or more.
- cyclic olefin monomer (b2) having no polar group examples include bicyclo [2.2.1] hept-2-ene (also referred to as “norbornene”), 5-ethyl-bicyclo [2.2.1]. Hept-2-ene, 5-butyl-bicyclo [2.2.1] hept-2-ene, 5-ethylidene-bicyclo [2.2.1] hept-2-ene, 5-methylidene-bicyclo [2.
- hept-2-ene 5-vinyl-bicyclo [2.2.1] hept-2-ene, tricyclo [5.2.1.0 2,6 ] deca-3,8-diene (conventional name: dicyclopentadiene), tetracyclo [10.2.1.0 2,11. 0 4,9 ] pentadeca-4,6,8,13-tetraene, tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-4-ene (also referred to as “tetracyclododecene”), 9-methyl-tetracyclo [6.2.1.1 3,6 .
- dodec-4-ene pentacyclo [9.2.1.1 3,9 . 0 2,10 . 0 4,8 ] pentadeca-5,12-diene, cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cycloheptene, cyclooctene, cyclooctadiene, indene, 3a, 5,6,7a-tetrahydro-4,7-methano-1H -Indene, 9-phenyl-tetracyclo [6.2.1.1 3,6 . 0 2,7] dodeca-4-ene, tetracyclo [9.2.1.0 2,10.
- the monomer (b3) other than the cyclic olefin include ethylene; propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3- Ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, ⁇ -olefins having 2 to 20 carbon atoms such as 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene; Non-conjugated dienes such as hexadiene, 1,5-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexa
- the cyclic olefin monomer (b1) having a polar group other than the protic polar group is preferable from the viewpoint that the effect of the present invention becomes more remarkable.
- a cyclic olefin having an N-substituted imide group is particularly preferred.
- the content ratio of the copolymerizable monomer (b) unit in the cyclic olefin polymer (A) is preferably 10 to 90 mol%, more preferably 20 to 80%, based on all monomer units.
- the mol% is more preferably 30 to 70 mol%. If the content ratio of the copolymerizable monomer (b) unit is too small, the solubility of the cyclic olefin polymer (A) in the polar solvent may be insufficient. May be insufficient, or a dissolution residue may be generated during development.
- a cyclic olefin polymer (A) by introduce
- the polymer having no protic polar group is obtained by polymerizing at least one of the above-described monomers (b1) and (b2) and an optional combination of the monomer (b3) as necessary. be able to.
- a compound having a protic polar group and a reactive carbon-carbon unsaturated bond in one molecule is usually used.
- Specific examples of such compounds include acrylic acid, methacrylic acid, angelic acid, tiglic acid, oleic acid, elaidic acid, erucic acid, brassic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, atropaic acid.
- Unsaturated carboxylic acids such as acid and cinnamic acid; allyl alcohol, methyl vinyl methanol, crotyl alcohol, methallyl alcohol, 1-phenylethen-1-ol, 2-propen-1-ol, 3-butene-1- All, 3-buten-2-ol, 3-methyl-3-buten-1-ol, 3-methyl-2-buten-1-ol, 2-methyl-3-buten-2-ol, 2-methyl- Unsatisfactory such as 3-buten-1-ol, 4-penten-1-ol, 4-methyl-4-penten-1-ol, 2-hexen-1-ol Alcohol; and the like.
- the modification reaction of the polymer using these modifiers may be performed according to a conventional method, and is usually performed in the presence of a radical generator.
- the cyclic olefin polymer (A) used in the present invention may be a ring-opening polymer obtained by ring-opening polymerization of the above-mentioned monomer, or an addition polymer obtained by addition polymerization of the above-mentioned monomer. Although it may be a polymer, it is preferably a ring-opening polymer from the viewpoint that the effect of the present invention becomes more remarkable.
- the ring-opening polymer comprises a ring-opening metathesis polymerization of a cyclic olefin monomer having a protic polar group (a) and a copolymerizable monomer (b) used as necessary in the presence of a metathesis reaction catalyst.
- a cyclic olefin monomer having a protic polar group
- b copolymerizable monomer used as necessary in the presence of a metathesis reaction catalyst.
- As the production method for example, methods described in [0039] to [0079] of International Publication No. 2010/110323 can be used.
- the cyclic olefin polymer (A) used in the present invention is a ring-opening polymer
- a hydrogenation reaction is further performed, and a hydrogenation in which a carbon-carbon double bond contained in the main chain is hydrogenated is performed. It is preferable to use a product.
- the ratio of hydrogenated carbon-carbon double bonds (hydrogenation rate) is usually 50% or more, and 70% from the viewpoint of heat resistance. Preferably, it is 90% or more, more preferably 95% or more.
- the weight average molecular weight (Mw) of the cyclic olefin polymer (A) used in the present invention is usually 1,000 to 1,000,000, preferably 1,500 to 100,000, more preferably 2,000. It is in the range of ⁇ 30,000.
- the molecular weight distribution of the cyclic olefin polymer (A) is usually 4 or less, preferably 3 or less, more preferably 2.5 or less, as a weight average molecular weight / number average molecular weight (Mw / Mn) ratio.
- the weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the cyclic olefin polymer (A) are determined as polystyrene equivalent values by gel permeation chromatography (GPC) using a solvent such as tetrahydrofuran as an eluent. Value.
- the radiation-sensitive resin composition of the present invention includes a bifunctional epoxy compound (B) represented by the following general formula (1) (hereinafter referred to as “bifunctional linear epoxy” as appropriate). (Abbreviated as “compound (B)”).
- the bifunctional linear epoxy compound (B) acts as a crosslinking agent for the cyclic olefin polymer (A) in the radiation-sensitive resin composition of the present invention, and has a linear structure in the case of a resin film. The effect of lowering the elastic modulus is exhibited, whereby the occurrence of warpage of the resin film obtained using the radiation-sensitive resin composition of the present invention can be effectively and effectively prevented.
- R 1 is a linear or branched alkylene group having 1 to 15 carbon atoms, preferably a linear or branched alkylene group having 2 to 10 carbon atoms. A linear or branched alkylene group having 3 to 8 carbon atoms is preferred. R 1 may be a linear alkylene group or a branched alkylene group, but may be a linear alkylene group from the viewpoint of a greater effect of reducing the elastic modulus. preferable. K is an integer of 1 to 20, preferably an integer of 1 to 18, more preferably an integer of 2 to 15.
- a compound represented by the general formula (4) (polytetramethylene glycol diglycidyl ether) can be suitably used.
- k is an integer of 1 to 20, preferably an integer of 1 to 18, and more preferably an integer of 2 to 15.
- the bifunctional linear epoxy compound (B) has an epoxy equivalent in the range of 100 to 1000 from the viewpoint that the elastic modulus of the resin film obtained using the radiation-sensitive resin composition of the present invention can be further reduced. Some are preferable, more preferably 200 to 800, and still more preferably 300 to 600.
- the epoxy equivalent of the bifunctional linear epoxy compound (B) can be measured, for example, according to JIS K 7236 “How to determine epoxy equivalent of epoxy resin”.
- a softening point is 40 degrees C or less from a viewpoint that the elasticity modulus of the resin film obtained using the radiation sensitive resin composition of this invention can be made lower. Some are preferred, and those below 25 ° C. are particularly preferred. That is, the bifunctional linear epoxy compound (B) is preferably a liquid at normal temperature (25 ° C.). The softening point of the bifunctional linear epoxy compound (B) can be measured, for example, according to JIS K 2207.
- the content of the bifunctional linear epoxy compound (B) in the radiation-sensitive resin composition of the present invention is preferably 8 to 150 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A).
- the bifunctional linear epoxy compound (B) is 100% by weight.
- the content of the chain epoxy compound (B) is more preferably 20 parts by weight or more, and further preferably 25 parts by weight or more.
- ) Content is preferably 100 parts by weight or less, and more preferably 70 parts by weight or less.
- the radiation sensitive resin composition of this invention contains a radiation sensitive compound (C) in addition to a cyclic olefin polymer (A) and a bifunctional linear epoxy compound (B).
- the radiation sensitive compound (C) is a compound capable of causing a chemical reaction by irradiation with radiation such as ultraviolet rays or electron beams.
- the resin film obtained by using the radiation-sensitive resin composition of the present invention has a low elastic modulus, thereby suppressing the occurrence of warpage, and having excellent thermal shock resistance and developability. It is something that can be done.
- the radiation sensitive compound (C) is preferably one capable of controlling the alkali solubility of the resin film formed from the radiation sensitive resin composition, and it is particularly preferable to use a photoacid generator.
- a radiation sensitive compound (C) include azide compounds such as acetophenone compounds, triarylsulfonium salts, quinonediazide compounds, and the like, preferably azide compounds, and particularly preferably quinonediazide compounds.
- quinonediazide compound for example, an ester compound of a quinonediazidesulfonic acid halide and a compound having a phenolic hydroxyl group can be used.
- the quinone diazide sulfonic acid halide include 1,2-naphthoquinone diazide-5-sulfonic acid chloride, 1,2-naphthoquinone diazide-4-sulfonic acid chloride, 1,2-benzoquinone diazide-5-sulfonic acid chloride, and the like. Can be mentioned.
- Representative examples of the compound having a phenolic hydroxyl group include 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane, 4,4 ′-[1- [4- [1 -[4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol and the like.
- phenolic hydroxyl group examples include 2,3,4-trihydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone, 2-bis (4-hydroxyphenyl) propane, tris (4- Hydroxyphenyl) methane, 1,1,1-tris (4-hydroxy-3-methylphenyl) ethane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, novolak resin oligomer, phenolic hydroxyl group Examples thereof include oligomers obtained by copolymerizing one or more compounds and dicyclopentadiene.
- photoacid generators include onium salts, halogenated organic compounds, ⁇ , ⁇ ′-bis (sulfonyl) diazomethane compounds, ⁇ -carbonyl- ⁇ ′-sulfonyldiazomethane compounds, sulfone compounds, Known compounds such as organic acid ester compounds, organic acid amide compounds, and organic acid imide compounds can be used. These radiation-sensitive compounds can be used alone or in combination of two or more.
- the content of the radiation sensitive compound (C) in the radiation sensitive resin composition of the present invention is preferably 10 to 100 parts by weight, more preferably 15 to 100 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A). 70 parts by weight, more preferably 25 to 50 parts by weight.
- the radiation sensitive resin composition of this invention may further contain crosslinking agents other than the bifunctional linear epoxy compound (B) mentioned above.
- a crosslinking agent any one that forms a crosslinked structure between crosslinking agent molecules by heating or one that reacts with the cyclic olefin polymer (A) to form a crosslinked structure between resin molecules may be used.
- compounds containing two or more alkoxymethyl groups or methylol groups in the molecule are preferable.
- epoxy group-containing crosslinking agent other than the bifunctional linear epoxy compound (B) include, for example, an epoxy compound having a dicyclopentadiene skeleton (trade name “HP-7200”, manufactured by DIC Corporation), 2, 2 -1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of bis (hydroxymethyl) 1-butanol (15-functional alicyclic epoxy resin having cyclohexane skeleton and terminal epoxy group, trade name “EHPE3150” Manufactured by Daicel Chemical Industries, Ltd.), epoxidized 3-cyclohexene-1,2-dicarboxylate bis (3-cyclohexenylmethyl) modified ⁇ -caprolactone (aliphatic cyclic trifunctional epoxy resin, trade name “Epolide GT301”, Daicel Chemical Industries, Ltd.), epoxidized butanetetracarboxylic acid tetrakis (3-cyclohe Senylmethyl) modified ⁇ -caprolact
- Bisphenol A type epoxy compounds (trade names “jER 825”, “jER 827”, “jER 828”, “jER YL980”, manufactured by Mitsubishi Chemical Corporation, trade names “EPICLON 840”, “EPICLON 850”, manufactured by DIC), Bisphenol F type epoxy compounds (trade names “jER 806”, “jER 807”, “jER YL983U”, manufactured by Mitsubishi Chemical Corporation, trade names “EPICLON 830”, “EPICLON 835”, manufactured by DIC), hydrogenated bisphenol A type Epoxy compounds (trade names “jER YX8000”, “jER YX8034” manufactured by Mitsubishi Chemical Co., Ltd., product name “ST-3000” manufactured by Nippon Steel & Sumikin Co., Ltd., product name “Licar Resin HBE-100” manufactured by Nippon Steel Chemical Co., Ltd.
- Polyfunctional epoxy compound having a naphthalene skeleton (trade name “HP-4032D”, manufactured by DIC), dicyclopentadiene dimethanol diglycidyl ether (trade names “Adeka Resin EP-4000L”, “Adeka Resin EP-4088L”, manufactured by ADEKA ), Glycidylamine type epoxy resin (product) “Product name“ jER630 ”, manufactured by Mitsubishi Chemical Corporation, product names“ TETRAD-C ”,“ TETRAD-X ”, manufactured by Mitsubishi Gas Chemical Company, Inc.), chain alkyl polyfunctional epoxy compound (trade name“ SR-TMP ”, Sakamoto) Yakuhin Kogyo Co., Ltd.), multifunctional epoxy polybutadiene (trade name “Epolide PB3600”, Daicel Chemical Industries, trade name “Epolide PB4700”, Daicel Chemical Industries), glycerin glycidyl polyether compound (trade name “SR-”) GLG ", manufactured by Sakamoto Pharmaceutical Co., Ltd.), diglycer
- the compound containing two or more alkoxymethyl groups in the molecule is not particularly limited as long as the compound has two or more alkoxymethyl groups.
- a phenol compound in which two or more alkoxymethyl groups are directly bonded to an aromatic ring for example, 2,6-dimethoxymethyl-4-t-butylphenol, 2,6-dimethoxymethyl-p-cresol and other dimethoxymethyl-substituted phenol compounds, 3,3 ′, 5,5′-tetramethoxymethyl-4,4 ′ -Tetradihydroxybiphenyl (for example, trade name “TMOM-BP”, manufactured by Honshu Chemical Industry Co., Ltd.), 1,1-bis [3,5-di (methoxymethyl) -4-hydroxyphenyl] -1-phenylethane Hexanes such as methoxymethyl-substituted biphenyl compounds, 4, 4 ', 4' '-(ethylidene) trisphenol Methoxymethyl-substituted compounds
- the compound containing two or more methylol groups in the molecule is not particularly limited as long as it is a compound containing two or more methylol groups.
- a phenol compound in which two or more methylol groups are directly bonded to an aromatic ring 2, 4 -2,4-dihydroxymethyl-6-methylphenol, 2,6-bis (hydroxymethyl) -p-cresol, 4-tertiary-2,6-bis (hydroxymethyl) phenol, bis (2-hydroxy-3 -Hydroxymethyl-5-methylphenyl) methane (trade name “DM-BIPC-F”, manufactured by Asahi Organic Chemicals Co., Ltd.), bis (4-hydroxy-3-hydroxymethyl-5-methylphenyl) methane (trade name “DM -BIOC-F ", manufactured by Asahi Organic Materials Co., Ltd.), 2,2-bis (4-hydroxy-3,5-dihydroxymethylphenyl) propane (trade name” TM -BIP-A ", manufactured by Asahi Organic Materials Co., Ltd.).
- a melamine compound in which an amino group is substituted with two or more alkoxymethyl groups as a compound containing two or more alkoxymethyl groups in the molecule, for example, N, N′-dimethoxymethylmelamine, N, N ′, N ′ '-Trimethoxymethylmelamine, N, N, N', N ''-tetramethoxymethylmelamine, N, N, N ', N', N ''-pentamethoxymethylmelamine, N, N, N ', N Examples include ', N ′′, N ′′ -hexamethoxymethylmelamine (for example, “Nicarak MW-390LM”, “Nicarac MW-100LM”, manufactured by Sanwa Chemical Co., Ltd.), or polymers thereof.
- urea compound substituted with two or more alkoxymethyl groups as a compound containing two or more alkoxymethyl groups in the molecule, “Nicalak MX270”, manufactured by Sanwa Chemical Co., Ltd., “Nicarak MX280”, manufactured by Sanwa Chemical Co., Ltd. , Nicalac MX290 ”, manufactured by Sanwa Chemical Co., Ltd., and the like.
- Compounds containing two or more alkoxymethyl groups or methylol groups in the molecule can be used alone or in combination of two or more.
- N, N, N ′, N ′, N ′′, N ′′ -hexamethoxymethylmelamine is preferable from the viewpoint of high reactivity.
- the content of the crosslinking agent other than the bifunctional linear epoxy compound (B) in the radiation sensitive resin composition of the present invention is preferably 1 to 80 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A). More preferred is 5 to 75 parts by weight, still more preferred is 10 to 70 parts by weight.
- the radiation-sensitive resin composition of the present invention may further contain a silane coupling agent in addition to the above-described components.
- a silane coupling agent is used in order to improve the adhesiveness of the resin film obtained using the radiation sensitive resin composition of this invention.
- silane coupling agent Although it does not specifically limit as a silane coupling agent, for example, what has reactive functional groups, such as an amino group, a carboxyl group, a methacryloyl group, an isocyanate group, an epoxy group, etc. are mentioned.
- silane coupling agent examples include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-phenyl-3-amino.
- silane coupling agents can be used alone or in combination of two or more.
- ⁇ -glycidoxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane are preferable, and ⁇ -glycidoxypropyltrimethoxysilane is more preferable.
- the content of the silane coupling agent in the radiation sensitive resin composition of the present invention is preferably 0.01 to 100 parts by weight, more preferably 0.1 to 100 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A). 50 parts by weight, more preferably 0.5 to 20 parts by weight.
- the radiation-sensitive resin composition of the present invention may further contain a solvent.
- the solvent is not particularly limited, and is known as a resin composition solvent such as acetone, methyl ethyl ketone, cyclopentanone, 2-hexanone, 3-hexanone, 2-heptanone, 3-heptanone, 4-heptanone, 2- Linear ketones such as octanone, 3-octanone and 4-octanone; alcohols such as n-propyl alcohol, isopropyl alcohol, n-butyl alcohol and cyclohexanol; ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether and dioxane Alcohol alcohols such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; propyl formate, butyl formate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate Esters such as
- solvents may be used alone or in combination of two or more.
- the content of the solvent is preferably in the range of 10 to 10,000 parts by weight, more preferably 50 to 5000 parts by weight, and further preferably 100 to 1000 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A).
- a solvent will be normally removed after resin film formation.
- the radiation-sensitive resin composition of the present invention has an acidic group or a heat-latent acidic group-containing compound, a surfactant, an antioxidant, and a sensitizer as long as the effects of the present invention are not inhibited.
- Other stabilizers such as a light stabilizer, an antifoaming agent, a pigment, a dye, and a filler;
- surfactants, sensitizers, light stabilizers can be used.
- those described in JP2011-75609A can be used.
- the preparation method of the radiation sensitive resin composition of this invention is not specifically limited, What is necessary is just to mix each component which comprises a radiation sensitive resin composition by a well-known method.
- the mixing method is not particularly limited, but it is preferable to mix a solution or dispersion obtained by dissolving or dispersing each component constituting the radiation-sensitive resin composition in a solvent. Thereby, a radiation sensitive resin composition is obtained with the form of a solution or a dispersion liquid.
- a method for dissolving or dispersing each component constituting the glaze sensitive resin composition in a solvent may follow a conventional method. Specifically, stirring using a stirrer and a magnetic stirrer, a high-speed homogenizer, a disper, a planetary stirrer, a twin-screw stirrer, a ball mill, a three-roll, etc. can be used. Further, after each component is dissolved or dispersed in a solvent, it may be filtered using, for example, a filter having a pore size of about 0.5 ⁇ m.
- the solid content concentration of the radiation-sensitive resin composition of the present invention is usually 1 to 70% by weight, preferably 5 to 60% by weight, more preferably 10 to 50% by weight. If the solid content concentration is within this range, dissolution stability, coating properties, film thickness uniformity of the formed resin film, flatness, and the like can be highly balanced.
- the electronic component of the present invention has a resin film made of the above-described radiation-sensitive resin composition of the present invention.
- the electronic component of the present invention is not particularly limited, but the resin film made of the radiation-sensitive resin composition of the present invention has a low elastic modulus, which suppresses the occurrence of warpage, and further provides thermal shock resistance and developability. Since it is excellent, an electronic component manufactured by the wafer level package technology is suitable.
- the resin film made of the radiation sensitive resin composition of the present invention is used. More preferably, it is used for forming an interlayer insulating film for insulating between wirings arranged in layers.
- the method for forming the resin film is not particularly limited, and for example, a coating method, a film lamination method, or the like can be used.
- the coating method is, for example, a method of removing a solvent by applying a resin composition and then drying by heating.
- the method for applying the resin composition include a spray method, a spin coating method, a roll coating method, a die coating method, a doctor blade method, a spin coating method, a slit coating method, a bar coating method, a screen printing method, and an ink jet method.
- Various methods can be employed.
- the heating and drying conditions vary depending on the type and mixing ratio of each component, but are usually 30 to 150 ° C., preferably 60 to 120 ° C., usually 0.5 to 90 minutes, preferably 1 to 60 minutes, and more. Preferably, it may be performed in 1 to 30 minutes.
- the radiation-sensitive resin composition is applied onto a B-stage film-forming substrate such as a resin film or a metal film, and then the solvent is removed by heat drying to obtain a B-stage film.
- a B-stage film-forming substrate such as a resin film or a metal film
- the heating and drying conditions can be appropriately selected according to the type and mixing ratio of each component, but the heating temperature is usually 30 to 150 ° C., and the heating time is usually 0.5 to 90 minutes.
- Film lamination can be performed using a pressure laminator, a press, a vacuum laminator, a vacuum press, a roll laminator or the like.
- the thickness of the resin film is not particularly limited and may be appropriately set depending on the application, but is preferably 0.1 to 100 ⁇ m, more preferably 0.5 to 50 ⁇ m, and further preferably 0.5 to 30 ⁇ m. is there.
- the resin film thus formed is patterned in a predetermined pattern.
- the radiation sensitive resin composition of the present invention is used to form a resin film before patterning, and the resin film before patterning is irradiated with actinic radiation to form a latent image pattern. And then exposing the pattern to a resin film having a latent image pattern by bringing a developer into contact therewith.
- the actinic radiation it is possible to activate the radiation sensitive compound (C) contained in the radiation sensitive resin composition and change the alkali solubility of the radiation sensitive resin composition containing the radiation sensitive compound (C). If it does not specifically limit.
- ultraviolet rays ultraviolet rays having a single wavelength such as g-line or i-line, light rays such as KrF excimer laser light and ArF excimer laser light; particle beams such as electron beams;
- a method for selectively irradiating these actinic radiations in a pattern to form a latent image pattern a conventional method may be used.
- ultraviolet, g-line, i-line, KrF excimer is used by a reduction projection exposure apparatus or the like.
- a method of irradiating a light beam such as laser light or ArF excimer laser light through a desired mask pattern, a method of drawing with a particle beam such as an electron beam, or the like can be used.
- the active radiation When light is used as the active radiation, it may be single wavelength light or mixed wavelength light. Irradiation conditions are appropriately selected according to the active radiation to be used. For example, when a light beam having a wavelength of 200 to 450 nm is used, the irradiation amount is usually 10 to 5,000 mJ / cm 2 , preferably 50 to 1, The range is 500 mJ / cm 2 and is determined according to the irradiation time and illuminance. After irradiation with actinic radiation in this manner, the resin film is heat-treated at a temperature of about 60 to 130 ° C. for about 1 to 2 minutes as necessary.
- an aqueous solution of an alkaline compound is usually used.
- an alkaline compound for example, an alkali metal salt, an amine, or an ammonium salt can be used.
- the alkaline compound may be an inorganic compound or an organic compound.
- alkali metal salts such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate and sodium metasilicate; ammonia water; primary amines such as ethylamine and n-propylamine; diethylamine Secondary amines such as di-n-propylamine; tertiary amines such as triethylamine and methyldiethylamine; quaternary ammonium salts such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide and choline Alcohol alcohols such as dimethylethanolamine and triethanolamine; pyrrole, piperidine, 1,8-diazabicyclo [5.4.0] undec-7-ene, 1,5-diazabicyclo [4.3.0] nona-5 -En, N-Me Cyclic amines such as Rupiroridon; and the like.
- alkaline compounds can be
- aqueous medium of the alkaline aqueous solution water; water-soluble organic solvents such as methanol and ethanol can be used.
- the alkaline aqueous solution may have a surfactant added in an appropriate amount.
- a paddle method, a spray method, a dipping method, or the like is used as a method of bringing the developer into contact with the resin film having the latent image pattern.
- the development is usually appropriately selected in the range of 0 to 100 ° C., preferably 5 to 55 ° C., more preferably 10 to 30 ° C., and usually 30 to 180 seconds.
- the resin film on which the target pattern is formed in this manner can be rinsed with a rinsing liquid in order to remove the development residue, if necessary. After the rinse treatment, the remaining rinse liquid is removed with compressed air or compressed nitrogen. Furthermore, if necessary, in order to deactivate the radiation-sensitive compound (C) contained in the radiation-sensitive resin composition, the entire surface of the electronic component can be irradiated with actinic radiation. For irradiation with actinic radiation, the method exemplified in the formation of the latent image pattern can be used.
- the resin film may be heated simultaneously with irradiation or after irradiation. Examples of the heating method include a method of heating an electronic component in a hot plate or an oven. The temperature is usually in the range of 80 to 300 ° C, preferably 100 to 200 ° C.
- the resin film is cured by performing a crosslinking reaction.
- Such crosslinking depends on the type of crosslinking agent other than the bifunctional linear epoxy compound (B) contained in the radiation-sensitive resin composition and the bifunctional linear epoxy compound (B) used as necessary.
- the method may be selected as appropriate, but is usually performed by heating.
- the heating method can be performed using, for example, a hot plate or an oven.
- the heating temperature is usually 150 to 250 ° C., and the heating time is appropriately selected depending on the area and thickness of the resin film, the equipment used, and the like.
- the oven is usually run for 5 to 120 minutes. When used, it is usually in the range of 30 to 150 minutes.
- Heating may be performed in an inert gas atmosphere as necessary.
- Any inert gas may be used as long as it does not contain oxygen and does not oxidize the resin film.
- Examples thereof include nitrogen, argon, helium, neon, xenon, and krypton.
- nitrogen and argon are preferable, and nitrogen is particularly preferable.
- an inert gas having an oxygen content of 0.1% by volume or less, preferably 0.01% by volume or less, particularly nitrogen is suitable.
- These inert gases can be used alone or in combination of two or more. In this way, an electronic component having a patterned resin film can be manufactured.
- a radiation sensitive resin composition produced in each example and each comparative example was spin-coated on a silicon wafer on which an aluminum thin film was formed to a thickness of 100 nm, and then 120 ° C. using a hot plate. And then cured under a nitrogen atmosphere at 230 ° C. for 60 minutes to form a 10 ⁇ m-thick resin film to obtain a laminate. And after cutting the obtained laminated body into a predetermined
- the test piece (10 mm x 50 mm) was cut out, and the tensile elasticity modulus was measured by performing a tensile test with the following procedures about this test piece.
- the tensile elasticity of the test piece was obtained by performing a tensile test using an autograph (manufactured by Shimadzu Corporation, AGS-5kNG) under the conditions of a distance between chucks of 20 mm, a tensile speed of 10 mm / min, and a measurement temperature of 23 ° C.
- the rate (GPa) was measured.
- five test pieces were cut out from each of the resin films, and the average value measured for each test piece was evaluated according to the following criteria.
- the tensile elasticity modulus is so preferable.
- the radiation sensitive resin composition prepared in each example and each comparative example was spin-coated and then heated at 120 ° C. for 2 minutes. Then, a sample for evaluation was obtained by forming a resin film having a thickness of 10 ⁇ m by curing under a nitrogen atmosphere at 230 ° C. for 60 minutes. The obtained sample for evaluation was subjected to a thermal shock test using a thermal shock tester (manufactured by Tabai Especs) at -55 ° C / 30 minutes and 150 ° C / 30 minutes as one cycle to obtain a resin film.
- a thermal shock tester manufactured by Tabai Especs
- a radiation sensitive resin composition produced in each example and each comparative example was spin coated on a silicon wafer, and then prebaked at 120 ° C. for 2 minutes using a hot plate to form a resin film having a thickness of 10 ⁇ m.
- exposure was performed at 400 mJ / cm 2 using a high-pressure mercury lamp that emits light with wavelengths of g-line (436 nm), h-line (405 nm), and i-line (365 nm). Then, the exposed sample was immersed in a 2.38% tetramethylammonium hydroxide aqueous solution (alkaline developer) at 23 ° C.
- a resin film that is not dissolved or does not swell is preferable because it can be determined that it has excellent developability as a positive type resin film, and generation of residues during development can be effectively suppressed.
- the test piece was obtained by heat-processing at 180 degreeC for 60 minute (s).
- the test piece obtained was floated in a solder bath with a soldering temperature of 260 ° C. for 10 seconds and left at room temperature for 30 seconds, and then a test for checking the presence or absence of copper plating layer swelling was confirmed.
- the solder heat resistance was evaluated according to the following criteria. It can be determined that the higher the number of repetitions of the test until the swelling of the copper plating layer is confirmed, the better the solder heat resistance.
- AA The above test was repeated 15 times, but no blistering of the copper plating layer was confirmed after the 15th test.
- A The number of repetitions of the test until the swelling of the copper plating layer was confirmed was 10 times or more and 14 times or less.
- B The number of repetitions of the test until the swelling of the copper plating layer was confirmed was 7 times or more and 9 times or less.
- C The number of repetitions of the test until the swelling of the copper plating layer was confirmed was less than 7 times.
- the polymerization reaction liquid was obtained by charging into a pressure-resistant reactor and making it react at 80 degreeC for 4 hours, stirring.
- the obtained polymerization reaction liquid was put in an autoclave and stirred for 5 hours at 150 ° C. under a hydrogen pressure of 4 MPa to perform a hydrogenation reaction, thereby obtaining a polymer solution containing the cyclic olefin polymer (A-1). .
- the resulting cyclic olefin polymer (A-1) had a polymerization conversion rate of 99.7%, a polystyrene-equivalent weight average molecular weight of 7,150, a number average molecular weight of 4,690, a molecular weight distribution of 1.52, and a hydrogenation rate. was 99.7%.
- the solid content concentration of the obtained polymer solution of the cyclic olefin polymer (A-1) was 34.4% by weight.
- Example 1 As the cyclic olefin polymer (A) having a protic polar group, 291 parts of the polymer solution of the cyclic olefin polymer (A-1) obtained in Synthesis Example 1 (100 parts as the cyclic olefin polymer (A-1)) ) As a bifunctional linear epoxy compound (B), a bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 440, softening point of 25 ° C.
- Example 2 In Example 1, the radiation sensitivity was changed in the same manner as in Example 1 except that the blending amount of the bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation) was changed from 10 parts to 30 parts. A resin composition was prepared and similarly measured and evaluated. The results are shown in Table 1.
- the bifunctional linear epoxy compound trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation
- Example 3 In Example 1, the radiation sensitivity was changed in the same manner as in Example 1 except that the blending amount of the bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation) was changed from 10 parts to 50 parts. A resin composition was prepared and similarly measured and evaluated. The results are shown in Table 1.
- the bifunctional linear epoxy compound trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation
- Example 4 In Example 1, the radiation sensitivity was changed in the same manner as in Example 1 except that the blending amount of the bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation) was changed from 10 parts to 80 parts. A resin composition was prepared and similarly measured and evaluated. The results are shown in Table 1.
- the bifunctional linear epoxy compound trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation
- Example 5 In Example 3, epoxidized butanetetracarboxylic acid tetrakis (3-cyclohexenylmethyl) modified ⁇ -caprolactone (trade name “Epolide GT401”, Daicel Chemical Industries, Ltd.) as a crosslinking agent other than the bifunctional linear epoxy compound (B).
- a radiation-sensitive resin composition was prepared in the same manner as in Example 3 except that 20 parts of an aliphatic cyclic tetrafunctional epoxy resin, epoxy equivalent: 220, liquid at room temperature) was further added. Measurement and evaluation were performed. The results are shown in Table 1.
- Example 6 In Example 1, the radiation sensitivity was changed in the same manner as in Example 1 except that the blending amount of the bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation) was changed from 10 parts to 130 parts. A resin composition was prepared and similarly measured and evaluated. The results are shown in Table 1.
- the bifunctional linear epoxy compound trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation
- Example 1 instead of 10 parts of a bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation), 50 parts of an epoxy compound having a naphthalene skeleton (trade name “Epicron HP4700, manufactured by DIC Corporation”) Except for the use, a radiation-sensitive resin composition was prepared and measured and evaluated in the same manner as in Example 1. Table 1 shows the results.
- Example 2 instead of 10 parts of a bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation), a long-chain bisphenol A type epoxy resin (trade name “EXA-4850-1000”, DIC Corporation) (Product made) Except having used 50 parts, it carried out similarly to Example 1, and prepared the radiation sensitive resin composition, and measured and evaluated similarly. The results are shown in Table 1.
- a bifunctional linear epoxy compound trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation
- EXA-4850-1000 trade name “EXA-4850-1000”
- Example 3 instead of 10 parts of a bifunctional linear epoxy compound (trade name “jER YX7400”, manufactured by Mitsubishi Chemical Corporation), epoxidized butanetetracarboxylic acid tetrakis (3-cyclohexenylmethyl) modified ⁇ -caprolactone (product) Radiation sensitive resin in the same manner as in Example 1 except that 50 parts of the name “Epolide GT401”, manufactured by Daicel Chemical Industries, Ltd., aliphatic cyclic tetrafunctional epoxy resin, epoxy equivalent: 220, liquid at room temperature) were used. A composition was prepared and similarly measured and evaluated. The results are shown in Table 1.
- jER YX7400 epoxidized butanetetracarboxylic acid tetrakis (3-cyclohexenylmethyl) modified ⁇ -caprolactone (product) Radiation sensitive resin in the same manner as in Example 1 except that 50 parts of the name “Epolide GT401”, manufactured by Daicel Chemical Industries, Ltd., aliphatic cycl
- Example 3 instead of 291 parts of the polymer solution of the cyclic olefin polymer (A-1) obtained in Synthesis Example 1 (100 parts as the cyclic olefin polymer (A-1)), an acrylic polymer (commercial product) Example 3 except that 100 parts of a diethylene glycol ethyl methyl ether solution of the name “Marcalinker CMM” (manufactured by Maruzen Petrochemical Co., Ltd., a copolymer of p-hydroxystyrene and methyl methacrylate) was used as the acrylic polymer. Then, a radiation sensitive resin composition was prepared, and similarly measured and evaluated. The results are shown in Table 1.
- the resin film obtained by using the radiation-sensitive resin composition has a low elastic modulus, thereby suppressing the occurrence of warpage, and excellent in thermal shock resistance and developability ( Examples 1 to 6).
- Examples 2 to 5 in which the content of the bifunctional epoxy compound (B) represented by the general formula (1) is in a specific range have a low elastic modulus, particularly excellent thermal shock resistance, It was also excellent in solder heat resistance.
- the resulting resin film has a high elastic modulus or is heat resistant.
- the results were inferior to either impact properties or developability (Comparative Examples 1 to 3).
- an acrylic polymer was used instead of the cyclic olefin polymer (A) having a protic polar group, the resulting resin film was inferior in thermal shock resistance and developability (Comparative Example). 4).
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
Abstract
Description
〔1〕プロトン性極性基を有する環状オレフィン重合体(A)、下記一般式(1)で表される2官能のエポキシ化合物(B)、及び感放射線化合物(C)を含有する感放射線樹脂組成物、
〔2〕前記エポキシ化合物(B)の含有量が、前記プロトン性極性基を有する環状オレフィン重合体(A)100重量部に対して、8~150重量部である前記〔1〕に記載の感放射線樹脂組成物、
〔3〕前記エポキシ化合物(B)のエポキシ当量が100~1000である前記〔1〕又は〔2〕に記載の感放射線樹脂組成物、
〔4〕前記エポキシ化合物(B)の軟化点が40℃以下である前記〔1〕~〔3〕のいずれかに記載の感放射線樹脂組成物、
〔5〕分子内にアルコキシメチル基またはメチロール基を2以上含む化合物をさらに含有する前記〔1〕~〔4〕のいずれかに記載の感放射線樹脂組成物、
〔6〕脂環構造を有するエポキシ化合物をさらに含有する前記〔1〕~〔5〕のいずれかに記載の感放射線樹脂組成物、
〔7〕シランカップリング剤をさらに含有する前記〔1〕~〔6〕のいずれかに記載の感放射線樹脂組成物、
〔8〕前記〔1〕~〔7〕のいずれかに記載の感放射線樹脂組成物からなる樹脂膜を備える電子部品、
が提供される。
本発明で用いるプロトン性極性基を有する環状オレフィン重合体(A)(以下、単に「環状オレフィン重合体(A)」とする。)としては、1又は2以上の環状オレフィン単量体の重合体、又は、1又は2以上の環状オレフィン単量体と、これと共重合可能な単量体との共重合体が挙げられるが、本発明においては、環状オレフィン重合体(A)を形成するための単量体として、少なくともプロトン性極性基を有する環状オレフィン単量体(a)を用いることが好ましい。
本発明において、プロトン性極性基を有する環状オレフィン樹脂に結合しているプロトン性極性基の数に特に限定はなく、また、相異なる種類のプロトン性極性基が含まれていてもよい。
これら単量体(b2)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
これら単量体(b3)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
プロトン性極性基を有しない重合体は、上述した単量体(b1)及び(b2)のうち少なくとも一種と、必要に応じて単量体(b3)とを任意に組み合わせて重合することによって得ることができる。
このような化合物の具体例としては、アクリル酸、メタクリル酸、アンゲリカ酸、チグリン酸、オレイン酸、エライジン酸、エルカ酸、ブラシジン酸、マレイン酸、フマル酸、シトラコン酸、メサコン酸、イタコン酸、アトロパ酸、ケイ皮酸等の不飽和カルボン酸;アリルアルコール、メチルビニルメタノール、クロチルアルコール、メタリルアルコール、1-フェニルエテン-1-オール、2-プロペン-1-オール、3-ブテン-1-オール、3-ブテン-2-オール、3-メチル-3-ブテン-1-オール、3-メチル-2-ブテン-1-オール、2-メチル-3-ブテン-2-オール、2-メチル-3-ブテン-1-オール、4-ペンテン-1-オール、4-メチル-4-ぺンテン-1-オール、2-ヘキセン-1-オール等の不飽和アルコール;等が挙げられる。
これら変性剤を用いた重合体の変性反応は、常法に従えばよく、通常、ラジカル発生剤の存在下で行われる。
また、環状オレフィン重合体(A)の分子量分布は、重量平均分子量/数平均分子量(Mw/Mn)比で、通常、4以下、好ましくは3以下、より好ましくは2.5以下である。
環状オレフィン重合体(A)の重量平均分子量(Mw)や分子量分布(Mw/Mn)は、テトラヒドロフラン等の溶媒を溶離液としたゲル・パーミエーション・クロマトグラフィー(GPC)により、ポリスチレン換算値として求められる値である。
本発明の感放射線樹脂組成物は、環状オレフィン重合体(A)に加えて、下記一般式(1)で表される2官能のエポキシ化合物(B)(以下、適宜、「2官能直鎖エポキシ化合物(B)」と略記する。)を含有する。
2官能直鎖エポキシ化合物(B)は、本発明の感放射線樹脂組成物において、環状オレフィン重合体(A)の架橋剤として作用するとともに、その直鎖状の構造により、樹脂膜とした場合における弾性率を低下させる効果を奏するものであり、これにより、本発明の感放射線樹脂組成物を用いて得られる樹脂膜の反りの発生を有効に効果的に防止できるものである。
また、本発明の感放射線樹脂組成物は、環状オレフィン重合体(A)及び2官能直鎖エポキシ化合物(B)に加えて、感放射線化合物(C)を含有する。感放射線化合物(C)は、紫外線や電子線等の放射線の照射により、化学反応を引き起こすことのできる化合物である。
これらの感放射線化合物は、それぞれ単独で、又は2種以上を組み合わせて用いることができる。
また、本発明の感放射線樹脂組成物は、上述した2官能直鎖エポキシ化合物(B)以外の架橋剤をさらに含有していてもよい。このような架橋剤としては、加熱により架橋剤分子間に架橋構造を形成するものや、環状オレフィン重合体(A)と反応して樹脂分子間に架橋構造を形成するものであればよいが、例えば、2官能直鎖エポキシ化合物(B)以外のエポキシ基含有架橋剤や、オキセタン基含有架橋剤、イソシアネート基含有架橋剤、ブロックイソシアネート基含有架橋剤、オキサゾリン基含有架橋剤、マレイミド基含有架橋剤、(メタ)アクリレート基含有架橋剤、分子内にアルコキシメチル基またはメチロール基を2以上含む化合物などが挙げられる。これらの中でも、分子内にアルコキシメチル基またはメチロール基を2以上含む化合物が好ましい。2官能直鎖エポキシ化合物(B)以外の架橋剤をさらに含有させることで、得られる樹脂膜の耐熱衝撃性をより高めることができる。
これら、2官能直鎖エポキシ化合物(B)以外のエポキシ基含有架橋剤のなかでも、脂環構造を有するエポキシ化合物、すなわち、脂環式エポキシ化合物が好ましい。脂環構造を有するエポキシ化合物を使用することで、得られる樹脂膜の耐熱衝撃性の向上効果をより顕著なものとすることができる。
分子内に2つ以上のアルコキシメチル基、またはメチロール基を含む化合物は、それぞれ単独で、又は2種以上を組み合わせて用いることができる。
これらのなかでも、反応性が高いという点より、N,N,N’,N’,N’’,N’’-ヘキサメトキシメチルメラミンが好ましい。
混合の方法は特に限定されないが、感放射線樹脂組成物を構成する各成分を溶剤に溶解又は分散して得られる溶液又は分散液を混合するのが好ましい。これにより、感放射線樹脂組成物は、溶液又は分散液の形態で得られる。
本発明の電子部品は、上述した本発明の感放射線樹脂組成物からなる樹脂膜を有する。
潜像パターンを有する樹脂膜に現像液を接触させる方法としては、例えば、パドル法、スプレー法、ディッピング法等の方法が用いられる。現像は、通常、0~100℃、好ましくは5~55℃、より好ましくは10~30℃の範囲で、通常、30~180秒間の範囲で適宜選択される。
さらに、必要に応じて、感放射線樹脂組成物に含有させた感放射線化合物(C)を失活させるために、電子部品全面に、活性放射線を照射することもできる。活性放射線の照射には、上記潜像パターンの形成に例示した方法を利用できる。照射と同時に、又は照射後に樹脂膜を加熱してもよい。加熱方法としては、例えば、電子部品をホットプレートやオーブン内で加熱する方法が挙げられる。温度は、通常、80~300℃、好ましくは100~200℃の範囲である。
このようにして、パターン化された樹脂膜を備える電子部品を製造することができる。
なお、各特性の定義及び評価方法は、以下のとおりである。
スパッタリング装置を用いて、アルミニウム薄膜が100nmの膜厚で形成されたシリコンウエハ上に、各実施例及び各比較例において作製した感放射線樹脂組成物をスピンコートしたのち、ホットプレートを用いて120℃で2分間加熱し、次いで、窒素雰囲気下、230℃で60分間の条件で硬化させることで、膜厚10μmの樹脂膜を形成させ、積層体を得た。そして、得られた積層体を、所定の大きさに切断した後、アルミニウム薄膜を0.1mol/Lの塩酸水溶液にて溶解させて剥離させ、剥離したフィルムを乾燥させることで樹脂膜を得た。そして、得られた樹脂膜について、試験片(10mm×50mm)を切り出して、この試験片について以下の手順で引張試験を行うことで、引張弾性率を測定した。すなわち、オートグラフ(株式会社島津製作所製、AGS-5kNG)を用いて、チャック間距離20mm、引張速度10mm/分、測定温度23℃の条件にて引張試験を行うことで、試験片の引張弾性率(GPa)を測定した。なお、両特性ともに、上記各樹脂膜からそれぞれ5つの試験片を切り出し、各試験片について測定した値の平均値を以下の基準で評価した。なお、引張弾性率が低いほど、硬化後の反りの発生が抑制できるため、好ましい。
A:引張弾性率が2GPa未満
B:引張弾性率が2GPa以上、2.2GPa未満
C:引張弾性率が2.2GPa以上
シリコンウエハ上にパターン状の銅配線を有する熱衝撃用の評価基板の上に、各実施例及び各比較例において作製した感放射線樹脂組成物をスピンコートしたのち、120℃で2分間加熱して、次いで、窒素雰囲気下で230℃で60分間の条件で硬化させることにより、膜厚10μmの樹脂膜を形成することで、評価用サンプルを得た。そして、得られた評価用サンプルについて、熱衝撃試験器(タバイエスペックス社製)を用いて、-55℃/30分及び150℃/30分を1サイクルとして、熱衝撃試験を行い、樹脂膜にクラックが発生するまでのサイクル数を確認し、以下の基準にて、耐熱衝撃性を評価した。
AA:2000サイクル経過後もクラックの発生なし。
A:1500サイクル経過後にはクラックが発生しなかったが、2000サイクル到達前にクラックが発生。
B:1000サイクル経過後にはクラックが発生しなかったが、1500サイクル到達前にクラックが発生。
C:1000サイクル到達前にクラックが発生。
シリコンウエハ上に、各実施例及び各比較例において作製した感放射線樹脂組成物をスピンコートした後、ホットプレートを用いて120℃で2分間プリベークして、厚さ10μmの樹脂膜を形成した。次いで、g線(436nm)、h線(405nm)、及びi線(365nm)の波長の光を発する高圧水銀ランプを用い、400mJ/cm2にて露光を行った。そして、露光後の試料を23℃の2.38%テトラメチルアンモニウムヒドロキシド水溶液(アルカリ現像液)にて3分間浸漬した後、超純水で30秒間リンスを行い、現像後の試料の表面状態を目視にて観察し、以下の基準にて現像性の評価を行った。樹脂膜の不溶解、あるいは膨潤が発生しないものが、ポジ型の樹脂膜としての現像性に優れると判断でき、しかも、現像時の残渣の発生が有効に抑えられるため、好ましい。
A:樹脂膜が完全に溶解していた。
B:樹脂膜が一部だけ溶解していた。
C:樹脂膜が全く溶解していない、あるいは、膨潤していた。
スパッタリング装置を用いて、50nm厚のチタン膜上に、銅を100nmの膜厚で形成されたシリコンウエハ上に、各実施例及び各比較例において作製した感放射線樹脂組成物をスピンコートしたのち、120℃で2分間加熱して、次いで、窒素雰囲気下230℃で60分間の条件で硬化させることにより、膜厚10μmの樹脂膜を形成することで、積層体を得た。このようにして得られた積層体の樹脂膜上に、スパッタリング法により銅箔膜を形成し、次いで、めっき浴として硫酸銅を含んだ酸性水溶液を用いた電気めっきにより、銅めっき層を厚さ10μmにて形成した後、180℃で60分間加熱処理をすることで、試験片を得た。そして、得られた試験片をはんだ温度260℃のハンダ浴に10秒間浮かべ、室温にて30秒間放置した後に、銅めっき層のふくれの有無を確認する試験を、銅めっき層のふくれが確認されるまで繰り返して行い、以下の基準にしたがって、はんだ耐熱性を評価した。銅めっき層のふくれが確認されるまでの試験の繰り返し回数が多いほど、はんだ耐熱性に優れると判断できる。
AA:上記試験を15回繰り返し行ったが、15回目の試験後も、銅めっき層のふくれが確認されなかった。
A:銅めっき層のふくれが確認されるまでの試験の繰り返し回数が、10回以上、14回以下であった。
B:銅めっき層のふくれが確認されるまでの試験の繰り返し回数が、7回以上、9回以下であった。
C:銅めっき層のふくれが確認されるまでの試験の繰り返し回数が、7回未満であった。
<環状オレフィン重合体(A-1)の調製>
N-フェニル-ビシクロ[2.2.1]ヘプト-5-エン-2,3-ジカルボキシイミド(NBPI)40モル%、及び4-ヒドロキシカルボニルテトラシクロ[6.2.1.13,6.02,7]ドデカ-9-エン(TCDC)60モル%からなる単量体混合物100部、1,5-ヘキサジエン2.0部、(1,3-ジメシチルイミダゾリン-2-イリデン)(トリシクロヘキシルホスフィン)ベンジリデンルテニウムジクロリド(Org.Lett.,第1巻,953頁,1999年 に記載された方法で合成した)0.02部、及びジエチレングリコールエチルメチルエーテル200部を、窒素置換したガラス製耐圧反応器に仕込み、攪拌しつつ80℃にて4時間反応させて重合反応液を得た。
プロトン性極性基を有する環状オレフィン重合体(A)として、合成例1で得られた環状オレフィン重合体(A-1)の重合体溶液291部(環状オレフィン重合体(A-1)として100部)、2官能直鎖エポキシ化合物(B)として、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製、エポキシ当量:440、軟化点25℃以下(常温で液体)、上記一般式(1)において、R1=-C4H8-、k=約10である化合物)10部、感放射線化合物(C)として、4,4’-[1-[4-[1-[4-ヒドロキシフェニル]-1-メチルエチル]フェニル]エチリデン]ビスフェノール(1モル)と1,2-ナフトキノンジアジド-5-スルホン酸クロライド(2.0モル)との縮合物(商品名「TS200」、東洋合成社製)30部、2官能直鎖エポキシ化合物(B)以外の架橋剤として、N,N,N’,N’,N’’,N’’-ヘキサメトキシメチルメラミン(商品名「ニカラックMW-100LM」、三和ケミカル社製)10部、シランカップリング剤として、γ-グリシドキシプロピルトリメトキシシラン(商品名「Z6040」、東レ・ダウコーニング社製)2部、及び、溶剤として、ジエチレングリコールエチルメチルエーテル160部を混合し、溶解させた後、孔径0.45μmのポリテトラフルオロエチレン製フィルターでろ過して感放射線樹脂組成物を調製した。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)の配合量を10部から、30部に変更した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)の配合量を10部から、50部に変更した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)の配合量を10部から、80部に変更した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例3において、2官能直鎖エポキシ化合物(B)以外の架橋剤としての、エポキシ化ブタンテトラカルボン酸テトラキス(3-シクロヘキセニルメチル)修飾ε-カプロラクトン(商品名「エポリードGT401」、ダイセル化学工業社製、脂肪族環状4官能性のエポキシ樹脂、エポキシ当量:220、常温で液状)20部をさらに配合した以外は、実施例3と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)の配合量を10部から、130部に変更した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)10部に代えて、ナフタレン骨格を有するエポキシ化合物(商品名「エピクロンHP4700、DIC社製)50部を使用した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)10部に代えて、長鎖ビスフェノールA型エポキシ樹脂(商品名「EXA-4850-1000」、DIC社製)50部を使用した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、2官能直鎖エポキシ化合物(商品名「jER YX7400」、三菱化学社製)10部に代えて、エポキシ化ブタンテトラカルボン酸テトラキス(3-シクロヘキセニルメチル)修飾ε-カプロラクトン(商品名「エポリードGT401」、ダイセル化学工業社製、脂肪族環状4官能性のエポキシ樹脂、エポキシ当量:220、常温で液状)50部を使用した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例3において、合成例1で得られた環状オレフィン重合体(A-1)の重合体溶液291部(環状オレフィン重合体(A-1)として100部)に代えて、アクリル重合体(商品名「マルカリンカーCMM」、丸善石油化学社製、p-ヒドロキシスチレンとメチルメタクリレートとの共重合体)のジエチレングリコールエチルメチルエーテル溶液を、アクリル重合体として100部使用した以外は、実施例3と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
また、プロトン性極性基を有する環状オレフィン重合体(A)の代わりに、アクリル重合体を使用した場合には、得られる樹脂膜は、耐熱衝撃性及び現像性に劣るものであった(比較例4)。
Claims (8)
- 前記エポキシ化合物(B)の含有量が、前記プロトン性極性基を有する環状オレフィン重合体(A)100重量部に対して、8~150重量部である請求項1に記載の感放射線樹脂組成物。
- 前記エポキシ化合物(B)のエポキシ当量が100~1000である請求項1又は2に記載の感放射線樹脂組成物。
- 前記エポキシ化合物(B)の軟化点が40℃以下である請求項1~3のいずれかに記載の感放射線樹脂組成物。
- 分子内にアルコキシメチル基またはメチロール基を2以上含む化合物をさらに含有する請求項1~4のいずれかに記載の感放射線樹脂組成物。
- 脂環構造を有するエポキシ化合物をさらに含有する請求項1~5のいずれかに記載の感放射線樹脂組成物。
- シランカップリング剤をさらに含有する請求項1~6のいずれかに記載の感放射線樹脂組成物。
- 請求項1~7のいずれかに記載の感放射線樹脂組成物からなる樹脂膜を備える電子部品。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187027289A KR102301534B1 (ko) | 2016-03-28 | 2017-03-17 | 감방사선 수지 조성물 및 전자 부품 |
US16/084,676 US20190079396A1 (en) | 2016-03-28 | 2017-03-17 | Radiation sensitive resin composition and electronic component |
CN201780018544.2A CN108885398B (zh) | 2016-03-28 | 2017-03-17 | 放射线敏感性树脂组合物和电子部件 |
EP17774455.4A EP3438746A4 (en) | 2016-03-28 | 2017-03-17 | RADIATION SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT |
JP2018509057A JP6819674B2 (ja) | 2016-03-28 | 2017-03-17 | 感放射線樹脂組成物及び電子部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-063916 | 2016-03-28 | ||
JP2016063916 | 2016-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017169914A1 true WO2017169914A1 (ja) | 2017-10-05 |
Family
ID=59964320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/010961 WO2017169914A1 (ja) | 2016-03-28 | 2017-03-17 | 感放射線樹脂組成物及び電子部品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190079396A1 (ja) |
EP (1) | EP3438746A4 (ja) |
JP (1) | JP6819674B2 (ja) |
KR (1) | KR102301534B1 (ja) |
CN (1) | CN108885398B (ja) |
TW (1) | TWI715748B (ja) |
WO (1) | WO2017169914A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220029569A (ko) * | 2019-06-28 | 2022-03-08 | 니폰 제온 가부시키가이샤 | 수지 조성물, 전자 부품, 및 수지막의 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013187279A (ja) * | 2012-03-07 | 2013-09-19 | Nippon Zeon Co Ltd | 平坦化膜及びそれを備える電子部品 |
JP2013186225A (ja) * | 2012-03-07 | 2013-09-19 | Nippon Zeon Co Ltd | ネガ型感光性樹脂組成物及び電子部品 |
WO2015163276A1 (ja) * | 2014-04-22 | 2015-10-29 | 日本ゼオン株式会社 | 感放射線性樹脂組成物、樹脂膜、および電子部品 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1806208A (zh) * | 2003-06-13 | 2006-07-19 | 帝斯曼知识产权资产管理有限公司 | 可光固化树脂组合物 |
WO2005096100A1 (ja) * | 2004-03-31 | 2005-10-13 | Zeon Corporation | 感放射線組成物、積層体及びその製造方法並びに電子部品 |
JP2007078812A (ja) * | 2005-09-12 | 2007-03-29 | Sumitomo Bakelite Co Ltd | 感光性樹脂組成物、それを用いた半導体装置、表示素子 |
JP5778038B2 (ja) * | 2010-06-28 | 2015-09-16 | 株式会社Adeka | 硬化性樹脂組成物 |
WO2012053052A1 (ja) * | 2010-10-19 | 2012-04-26 | 住友ベークライト株式会社 | 感光性樹脂組成物および半導体装置 |
KR101846978B1 (ko) * | 2011-01-27 | 2018-04-09 | 도레이 카부시키가이샤 | 섬유 강화 복합 재료 rtm 성형용 에폭시 수지 조성물, 섬유 강화 복합 재료 및 그 제조 방법 |
JP2013130816A (ja) * | 2011-12-22 | 2013-07-04 | Nippon Zeon Co Ltd | 永久膜用樹脂組成物及び電子部品 |
US9454078B2 (en) * | 2012-09-25 | 2016-09-27 | Toray Industries, Inc. | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
KR20150079844A (ko) * | 2012-10-31 | 2015-07-08 | 주식회사 다이셀 | 방사선 경화성 조성물, 접착제, 및 편광판 |
JP2015072336A (ja) * | 2013-10-02 | 2015-04-16 | Jnc株式会社 | 感光性組成物及びそれを用いた表示素子 |
JP6219250B2 (ja) * | 2013-12-13 | 2017-10-25 | 株式会社ダイセル | ポリオルガノシルセスキオキサン、ハードコートフィルム、接着シート、及び積層物 |
EP3121652B1 (en) * | 2014-03-20 | 2019-09-04 | Zeon Corporation | Radiation-sensitive resin composition and electronic component |
KR102381904B1 (ko) * | 2014-03-20 | 2022-03-31 | 제온 코포레이션 | 감방사선 수지 조성물 및 전자 부품 |
JP6259107B2 (ja) * | 2014-08-29 | 2018-01-10 | 富士フイルム株式会社 | インクジェット用記録媒体及びその製造方法、印刷物及びその製造方法、装飾ガラス、並びに、ロール |
US20190031803A1 (en) * | 2016-03-23 | 2019-01-31 | Zeon Corporation | Resin composition, resin film, and electronic device |
-
2017
- 2017-03-17 KR KR1020187027289A patent/KR102301534B1/ko active IP Right Grant
- 2017-03-17 CN CN201780018544.2A patent/CN108885398B/zh active Active
- 2017-03-17 US US16/084,676 patent/US20190079396A1/en not_active Abandoned
- 2017-03-17 WO PCT/JP2017/010961 patent/WO2017169914A1/ja active Application Filing
- 2017-03-17 EP EP17774455.4A patent/EP3438746A4/en not_active Withdrawn
- 2017-03-17 JP JP2018509057A patent/JP6819674B2/ja active Active
- 2017-03-20 TW TW106109111A patent/TWI715748B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013187279A (ja) * | 2012-03-07 | 2013-09-19 | Nippon Zeon Co Ltd | 平坦化膜及びそれを備える電子部品 |
JP2013186225A (ja) * | 2012-03-07 | 2013-09-19 | Nippon Zeon Co Ltd | ネガ型感光性樹脂組成物及び電子部品 |
WO2015163276A1 (ja) * | 2014-04-22 | 2015-10-29 | 日本ゼオン株式会社 | 感放射線性樹脂組成物、樹脂膜、および電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3438746A4 * |
Also Published As
Publication number | Publication date |
---|---|
TWI715748B (zh) | 2021-01-11 |
JP6819674B2 (ja) | 2021-01-27 |
KR102301534B1 (ko) | 2021-09-10 |
EP3438746A1 (en) | 2019-02-06 |
CN108885398B (zh) | 2022-11-29 |
CN108885398A (zh) | 2018-11-23 |
JPWO2017169914A1 (ja) | 2019-02-07 |
TW201802593A (zh) | 2018-01-16 |
KR20180128913A (ko) | 2018-12-04 |
US20190079396A1 (en) | 2019-03-14 |
EP3438746A4 (en) | 2019-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6471745B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
CN110366704B (zh) | 放射线敏感性树脂组合物和电子部件 | |
JP6524996B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
CN107922742B (zh) | 树脂组合物 | |
WO2018012534A1 (ja) | 赤外発光led | |
JP6844115B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JPWO2017038620A1 (ja) | 樹脂組成物 | |
JP6665627B2 (ja) | 樹脂組成物及び電子部品 | |
JP6819674B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JP6825217B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
WO2019188432A1 (ja) | 樹脂組成物及び電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2018509057 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20187027289 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2017774455 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2017774455 Country of ref document: EP Effective date: 20181029 |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17774455 Country of ref document: EP Kind code of ref document: A1 |