WO2017162456A1

WO2017162456A1 - Method for 2d/3d inspection of an object such as a wafer

Info

Publication number: WO2017162456A1
Application number: PCT/EP2017/055774
Authority: WO
Inventors: Gilles Fresquet; Alain Courteville; Philippe Gastaldo
Original assignee: Unity Semiconductor
Priority date: 2016-03-25
Filing date: 2017-03-13
Publication date: 2017-09-28
Also published as: TW201800718A; EP3228979B1; US20170276544A1; CN108885095A; EP3228978B1; KR20180122434A; KR20180124087A; TW201802434A; US20170276615A1; CN109073368A; KR20180124085A; US10240977B2; WO2017162457A1; WO2017162454A1; CN109073368B; EP3222964B1; US9739600B1; EP3228979A1; US10082425B2; CN109073367B

Abstract

The present invention concerns a method for inspecting the surface of an object (10) such as a wafer comprising tridimensional structures (11), using a confocal chromatic device with a plurality of optical measurement channels (24) and a chromatic lens (13) allowing optical wavelengths of a broadband light source (19) to be focused at different axial distances defining a chromatic measurement range, the method comprising a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object (10) within the chromatic measurement range at a plurality of measurement points (15) on the object (10) by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels (24) in a confocal configuration.

Description

« Method for 2D/3D inspection of an object such as a wafer »

Field of the invention

The invention relates to a method for inspecting an object such as a wafer, and more particularly for inspecting an object comprising structures such as bumps or micro-bumps.

The field of the invention is, but not limited to, 2D-3D inspection and metrology for semiconductor industry.

Background of the invention

Tridimensional structures such as bumps, micro-bumps, solder bumps, copper pilar, copper nails, Re-Distribution Layers (RDL), Under Bump metallization (UBM), metal patterns are more and more widely used for interconnections and other application in the semiconductor industry. With the evolution of the IC packaging, the critical dimensions of these structures tend to decrease and their density on wafers or chips tend to increase. In the same time there is a need for inspection systems capable of inspecting all of these structures at high speed during production, as a few defects are sufficient to render corresponding ICs defective.

Chromatic confocal technique is a well-known technique for tridimensional (3D) surface mapping or profilometry, in particular for semiconductor applications.

The technique relies on the use of a chromatic lens with an enhanced chromatism, whose focal length depends strongly on the optical wavelength. Each wavelength of the light crossing such lens is focused at a different distance, or in a different focal plane.

The chromatic lens is embedded in a confocal set-up with source and detection pinholes (usually made by optical fibers core) placed at the confocal planes of the chromatic lens to reject out-of-focus lens. When a reflecting surface is placed in front of the chromatic lens, only the light with the wavelength whose focal plane corresponds to the position of the surface is transmitted by the detection pinhole.

Detection is made by a spectrometer, which comprises usually a dispersing element and a linear or matrix sensor (CCD or CMOS) to acquire the intensity spectrum of the light. The height (or distance) of the surface relative to the chromatic lens is obtained by analyzing the intensity spectrum of the detected light.

Such set-up al lows measu ring distances on a sing le point at the time. So inspecting a full wafer surface by scanning al l the surface may be very time- consuming . Actually, the factor limiting the measurement speed is the readout time of the linear sensor for acq uiring the intensity spectrum .

Acquisition speed can be improved by providing several measurement channels in paral lel .

We know for instance the document US 2015/0260504 which d iscloses an implementation of a confocal chromatic device in which several measurement channels are provided throug h a chromatic lens with several optical fibers. The sensor allows measuring d istance or height at several points on the surface of the object simultaneously.

However, even if the acq uisition rate is improved, the time for inspecting a full wafer surface remains very long .

Another issue when measuring or inspecting patterned wafers is the accurate local ization of the measurement points relative to the existing structures. That issue is usual ly solved by using a 2D (bidimensional) inspection or imag ing system such as a camera .

We know for instance the document US 6,934,019 which describes an inspection system based on a chromatic confocal sensor which comprises also an imaging camera . The measurements require two steps : first acq uiring an image of the wafer with the camera and computing a map of the locations of the structures to be measured ; and second performing the height measurements.

However, the switching between the camera and the chromatic sensor is time consuming and the need for mechanical d isplacements to position either the camera or the chromatic confocal sensor above the structures to be measured may impact the positioning accuracy for the height measurement.

It is an object of the invention to provide a method allowing fast and accurate 2D (bid imensional or in-plane imag ing ) inspection of an object such as a wafer.

It is also an object of the invention to provide a method al lowing fast and accurate 3D (tridimensional height measurements) inspection of an object such as a wafer. It is also an object of the invention to provide a method allowing providing simultaneously or at least during a same scan and with minimized positioning uncertainty an intensity image (2D) and accurate height measurements (3D) on an object such as a wafer with patterns or structures.

It is also an object of the invention to provide a method allowing accurate locating of height measurement positions, and/or accurate positioning of height measurement probes relative to structures or patterns on an object such as a wafer.

It is also an object of the invention to provide a method allowing characterizing or inspecting structures (in 2D and/or in 3D) of an object such as a wafer in position and shape.

It is also an object of the invention to provide a method for inspecting bumps, trenches and other patterned structures on an object such as a wafer.

Summary of the invention

Such objects are accomplished through a method for inspecting the surface of an object such as a wafer comprising tridimensional structures, using a confocal chromatic device with a plurality of optical measurement channels and a chromatic lens allowing optical wavelengths of a broadband light source to be focused at different axial distances defining a chromatic measurement range, characterized in that it comprises a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object within the chromatic measurement range at a plurality of measurement points on the object by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels in a confocal configuration.

The intensity information may thus correspond to pixel elements of an image of the objet acquired with a depth of focus extending over the chromatic measurement range, thus well beyond the depth of focus achieved for a single wavelength.

According to some modes of realization, the method may comprise:

- providing a chromatic lens with an extended axial chromatism;

- illuminating the object through the chromatic lens with a plurality of optical wavelengths being focused at different axial distances; - collecting the light reflected by the object through the chromatic lens at a plurality of measurement points using a plurality of optical measurement channels with collection apertures;

- measuring a total intensity of the light collected by at least one of the optical measurement channels for obtaining an intensity information.

According to some modes of implementation, the method of the invention may further comprise a step of measuring a spectral information of the light collected by an optical measurement channel for obtaining an axial distance information within the chromatic measurement range.

According to some modes of implementation, the method of the invention may further comprise a step of locating a structure on the surface of the object using intensity information.

According to some modes of implementation, the method of the invention may further comprise steps of:

- identifying a measurement point of interest using intensity information;

- obtaining an axial distance information at said point of interest.

According to some modes of implementation, the method of the invention may further comprise at least one of the following steps:

- identifying a measurement point of interest relative to a structure;

- identifying a measurement point of interest relative to a structure corresponding to a summit of said structure.

The method of the invention may further comprise a step of deducing a height information of said structure.

According to some modes of implementation, the method of the invention may further comprise a step of moving relatively the object and the chromatic lens to position an optical measurement channel so as to obtain an axial distance information on a previously identified measurement point of interest.

According to some modes of implementation, the method of the invention may further comprise a step of moving relatively the object and the chromatic lens along a pre-defined scan trajectory, and for a scan position :

- obtaining an intensity information; and/or

- obtaining an axial distance information on a measurement point of interest previously identified. The movement along the scan trajectory may be done continuously, with the measurement being acq uired "on-the-flight" at the scan positions. The movement along the scan trajectory may also be done step-by-step, with a stop at the scan positions.

The intensity information provides elements or pixels of a 2D representation correspond ing to an image of the surface of the object. As it wil l be explained later, it may be obtained at a hig h acq uisition rate with a hig h resol ution thanks to the extended depth of focus of the acqu isition device. The extended depth of focus allows in particular to image in good q uality structures or patterns of the surface of the object extend ing in altitude or depth .

Such intensity image may be used for locating specific patterns or structures on the surface of the object, and thus locating accu rately measurement points of interest where a depth or d istance information shall be measured . So, the depth measurements which are much slower are done only at the relevant points of interest.

Of course, the intensity information and the axial d istance/depth information may also be acq uired in a systematic manner on a same or a d ifferent sampl ing pattern (correspond ing for instance to a sampl ing g rid ) of measurement points at the surface of the object, so as to provide a 2D intensity image and a 3D altitude map of that surface . In particular:

- The intensity information and the axial d istance/depth information may be acqu ired accord ing to d ifferent sampl ing patterns so as to provide a 3D altitude map with a spatial resolution coarser than the spatial resolution of the 2D intensity image;

- The axial d istance/depth information may be acqu ired accord ing to a sampl ing pattern wh ich is a subset of the sampl ing pattern used for acq uiring the intensity information .

Accord ing to some modes of implementation, the method of the invention may comprise at least one of the fol lowing steps :

- chang ing a spacing of measurement points;

- chang ing a spacing of measu rement points by chang ing a scal ing factor between a spatial repartition of collection apertures of the optical measurement channels and the measurement points using a mag nifying lens. The spacing of measurement points may thus be adjusted by a magnifying lens or any other means, such as for instance by physically moving collection apertures of optical measurement channels relative to the chromatic lens.

- adjusting a spacing of measurement points taking into account a spatial repartition of structures on the object;

- adjusting a spacing of measurement points so as to substantially match a spacing of structures on the object.

The spacing of the structures may for instance be a center-to-center spacing, or a side-to side spacing.

The method of the invention may further comprise a step of:

- obtaining an information on the spacing of structures using a-priori knowledge on the object (or a description information of the object);

- obtaining an information on the spacing of structures using intensity information and/or axial distance information previously obtained .

- obtaining an intensity information and/or an axial distance information at a plurality of measurement points with a first spacing of said measurement points, for locating sub-elements on the surface of the object;

- obtaining an intensity information and/or an axial distance information at a plurality of measurement points with a second spacing of said measurement points finer than the first spacing on a sub-element.

According to some modes of implementation, the method of the invention may further comprise steps of positioning relatively the object and the chromatic lens along an axial direction using an intensity information and/or an axial distance information.

Such positioning along the axial direction may be done for positioning the surface of the object within the measurement range of the chromatic lens.

It may be done:

- Using a axial distance information which provides directly a distance measurement or an out-of-range information (no measurements); - Using an intensity information. That solution has the advantage of allowing a high acquisition speed for positioning the object within the measurement range of the chromatic lens. Due to the confocal characteristic of the optical arrangement, a significant intensity is measured only when an interface of the object is present within the measurement range. Of course, once positioned in range, an axial distance information may be used for a fine adjustment.

- building an intensity image by combining intensity information obtained in a region of interest of the object; and/or

- building a height map by combining axial distance information obtained in a region of interest of the object.

According to some modes of implementation, the method of the invention may further comprise a step of comparing obtained axial distance information with reference value(s).

According to some modes of implementation, the method of the invention may be implemented for inspecting tridimensional structures of at least one of the following type: bumps, micro-bumps, solder bumps, copper pilar, copper nails, Re-Distribution Layers (RDL), metal patterns.

The method of the invention may be carried out with any chromatic confocal device with compatible features.

The method of the invention may also be carried out with a confocal chromatic device for inspecting the surface of an object such as a wafer, comprising :

- a chromatic lens with an extended axial chromatism;

- a light source for illuminating the object through the chromatic lens with a plurality of optical wavelengths being focused at different axial distances;

- a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through the chromatic lens at a plurality of measurement points; wherein the plurality of optical measurement channels comprise optical measurement channels with an intensity detector for measuring a total intensity of the collected light.

The chromatic lens may comprise any kind of chromatic lens or lens assembly having a suitable chromatic aberration over a field of view, such as for instance:

- a single lens or lens assembly shared between the optical measurement channels;

- a plurality of lenses or microlenses each used by only one or several optical measurement channels;

- holographic elements;

- diffractive lens or microlens elements.

The chromatic lens may comprise at least a lens made with a dispersive material, and any other lenses required for providing the necessary optical arrangement. Such lens may be designed according to well-known techniques so as to provide a strong chromatic aberration, allowing different optical wavelengths crossing the lens to be focused at different distances, and that over a lateral field of view.

The confocal chromatic device of the invention thus comprise several optical measurement channels. Each optical measurement channel is sensitive to the light reflected at a specific measurement point in a plane perpendicular to the optical axis of the chromatic lens, and along a range of axial distances or heights (in a direction substantially parallel to the optical axis of the lens) corresponding to the planes of focalization of the different optical wavelengths crossing the chromatic lens. That range of axial distances allowing measurement may be defined as the measurement range of the device.

In other words, the measurement points correspond to the conjugate points of the collection apertures, or, more precisely, to the projection of the conjugate points of the collection apertures for the different wavelengths on a plane perpendicular to the optical axis of the chromatic lens. These collection apertures operate as pinholes allowing rejecting out-of-focus light, according to a classical confocal detection scheme.

The light source may comprise any kind of light source capable of emitting light at a plurality of wavelengths covering a spectral range for which the chromatism of the chromatic lens is efficiently usable. It may comprise for instance light-emitting d iodes ( LED), thermal light sources such as halogen lamps, or gas-d ischarge lamps. It may also comprise a tunable laser, a wh ite laser or a supercontinuum photonic source . The light source may generate light with wavelengths within for instance a range of 400-700 nm (visible range) al lowing inspection of surfaces and/or transparent layers in the visible range. Alternatively, the light source may generate l ig ht with wavelengths above 1 micron in the infrared range, allowing for instance inspections throug h layers of sil icon or other materials transparent in the infrared .

The light source may comprise a single light source shared between all the optical measurement channels, or a plu ral ity of l ig ht sources each shared between several optical measurement channels, or a light source per optical measurement channel .

Intensity detectors may comprise any photodetector measuring an intensity of light, or a global intensity of l ig ht over a spectral range.

Accord ing to some modes of real ization, intensity detectors may comprise :

- Separate or d iscrete intensity detectors for each optical measurement chan nel, such as for instance phototransistors, photod iodes or avalanche photod iodes; and/or

- Intensity detectors shared between a pl uralities of optical measurement chan nel . Such intensity detectors may comprise for instance photodiode arrays, line or matrix CCD or CMOS in which intensity measurements of d ifferent optical measurement channels are done on d ifferent pixels.

The intensity detectors provides a global intensity of light at the measurement point. So they provide a 2D image information of the object.

The 2 D measurements benefit from an extended depth of focus, because of the chromatic confocal set-up . The image wh ich is obtained by these means is in focus or well-focused over the whole measurement range of the device, because it is done mostly using the wavelength focused on the surface of the object, whatever position that surface may have in the measurement range.

So the available depth of focus for the imag ing is determined by the extent of the chromatic aberration of the chromatic lens. It is thus much larger than the depth of focus which would be available with a classical achromatic lens, and which correspond to the depth of focus available for a single wavelength with the chromatic lens. Accord ing to some modes of real ization of the invention, the plu ral ity optical of measurement channels may further comprise at least one optical measurement channel with a spectral detector for measuring a spectral information of the col lected l ig ht and deducing an axial d istance information .

Such spectral detector(s) may comprise any detector capable of provid ing an information relative to an intensity of light in function of optical wavelengths, such as for instance :

- Spectrometer type devices with a dispersing element such as a grating or a d iffraction array and a sensor capable of col lecting a lig ht intensity for the d ifferent wavelengths, such as for instance a l ine CCD, CMOS or a photod iode array;

- Devices with color filters in front of a line or matrix detector, al lowing a detection selective in wavelength with different detector areas.

Spectral detector may also comprise detectors shared between several optical measurement channels, such as line or matrix CCD or CMOS. In that case, intensity spectra of d ifferent optical measurement channels are col lected on d ifferent areas or pixels of the detector.

The axial d istance information may be ded uced from the intensity spectrum by identifying the peak(s) in the spectrum or the wavelengths which are the most reflected, and which are representative of the location of the correspond ing interfaces of an object in the measurement range. Of course, in presence of a transparent object with several detectable layers, several peaks representative of optical d istances to several interfaces may be identified .

So, the spectral detectors provide an axial d istance, or a heig ht information at the measurement point. They thus provide a 3D information which is the usual purpose of the chromatic confocal sensors.

The invention thus allows doing a sensor with 2D-3D inspection capabil ities in a single measurement head . The measurement points for the 2D and 3D inspection are in a fixed , stable and wel l known spatial relationship.

2D total intensity measurement can be done much faster than 3D axial d istance measurements, because their only limitation in terms of acquisition rate relate to the integ ration time or bandwidth of the detector. In the other hand, 3D axial measu rement rates are l imited at least by the integration time and readout time of spectrometer sensors. As consequence, 2 D measurement may be done at acquisitions rates 10 times or even much faster than 3D measurements. For instance 2D measurement may be done at acquisition rates of several tens of kilohertz (for instance 50 KHz to 100 KHz), whereas 3D measurements may be done only at acquisition rates of a few kilohertz.

So, the device of the invention is particularly well adapted for high speed inspection, because it allows for instance:

- fast 2D inspection with an extended depth of focus, allowing for instance inspection of the surface of an object with extended tridimensional structures (such as bumps, pillars, nails, ...) with an optimal lateral resolution at any measurement points without refocusing; and/or

- fast 2D inspection of the surface of a structured object, and on-the- flight 3D measurement at selected points of interest.

According to some modes of realization, the optical measurement channels may comprise optical waveguides, or planar optical waveguides.

According to some modes of realization, the optical measurement channels may comprise optical fibers.

According to some modes of realization, the broadband light source may be conveyed through illumination apertures arranged in a confocal configuration relative to the chromatic lens and the collection apertures.

The device of the invention may then comprise a beam splitter inserted between the chromatic lens and, respectively, the illumination apertures and the collection apertures. The beam splitter may be preferably inserted in a part where the propagating beams are collimated, for instance using collimating lenses. Or course, the collection apertures and the illumination apertures shall be arranged so that a collection aperture and an illumination aperture are both conjugate points of a same measurement point, through the beam splitter and the chromatic lens.

According to some modes of realization, the optical measurement channels may comprise illumination optical fibers, an end of which being used as illumination apertures.

These illumination optical fibers may comprise multimode, or single mode fibers. They may be arranged or grouped in bundles. They may have an end corresponding to the illumination apertures positioned in a mount piece with for instance v-grooves for accurate positioning. According to some modes of realization, the device of the invention may comprise collection apertures comprising, for instance:

- pinholes, like through holes in a mask or a wall;

- an entrance slit, corresponding to a through aperture elongated on one direction, which materializes several collection apertures for several optical measurement channels arranged in line;

- pixels or detection elements of a detector.

According to some modes of realization, the optical measurement channels may comprise collection optical fibers, an end of which being used as collection apertures.

These collection fibers may comprise multimode, or single mode fibers. They may be arranged or grouped in bundles. They may have an end corresponding to the collection apertures positioned in a mount piece with for instance v-grooves for accurate positioning.

According to some modes of realization, the broadband light source may be conveyed by the collection optical fibers.

The optical measurement channels may then comprise a coupler or a fiber coupler for directing the light of the light source to the collection aperture, and directing the light collected back by the collection aperture towards a detector.

According to some modes of realization, the device of the invention may comprise at least one optical routing element allowing doing at least one of the following:

- Using an intensity detector and a spectral detector to do measurements simultaneously or sequentially on one optical measurement channel;

- Selectively using an intensity detector and/or a spectral detector with a plurality of optical measurement channels.

Such optical routing element may comprise for instance:

- A coupler for splitting the light collected on an optical measurement channel between an intensity detector and a spectral detector. In that case, total intensity and spectral information may be obtained on a same optical measurement channel in parallel (in a synchronous or asynchronous way), or sequentially;

- An optical switch for directing the light collected on an optical measurement channel towards either an intensity detector or a spectral detector. In that case, total intensity and spectral information may be obtained on a same optical measurement channel seq uential ly;

- An optical multiplexer, comprising for instance several optical switches, for selectively connecting intensity detector(s) and/or spectral detector(s) to several measurement channels, so as for instance to share such intensity detector(s) and/or spectral detector(s) between several optical measurement channels, or to select intensity detector(s) and/or spectral detector(s) to connect to one optical measurement channel .

Accord ing to some modes of real ization, the device of the invention may further comprise a mag nifying lens positioned between the col lection apertures and the chromatic lens, and arranged for introducing a variable or changeable scal ing factor between the spatial repartition of the col lection apertures and the measurement points.

The mag nifying lens may comprise any kind of lens or lens assembly. It may be essential ly achromatic for the used wavelengths (or achromatic for the wavelengths of the light source used in detectors) .

The device may of course comprise other lenses placed between the collection apertures and the mag nifying lens, and/or other lenses placed between the magnifying lens and the chromatic lens.

Several config urations are possible.

Accord ing to some modes of real ization, the device of the invention may comprise a mag nifying lens and a chromatic lens arranged so that to provide an intermed iate conjugate focal plane which is simultaneously :

- A conjugate focal plane of the plane with the collection apertures for a lens assembly comprising the mag nifying lens; and

- A conjugate focal plane of the plane with the measurement points for a lens assembly comprising the ch romatic lens.

Accord ing to some modes of real ization, the intermediate conjugate focal plane may be :

- At a finite d istance; or

- At a finite d istance and positioned between the magn ifying lens and the chromatic lens.

It may then form a real image plane of the col lection apertures.

Accord ing to some modes of real ization, the intermediate conjugate focal plane may be at infinite distance, correspond ing to col limated beams. Accord ing to some modes of real ization, the device of the invention may comprise a coll imating lens positioned between the collection apertures and the magnifying lens.

Such coll imating lens may for instance be uses with a beam spl itter as previously explained . It may be arranged with the col lection apertures positioned in its focal plane, so as to provide to the magnifying lens col l imated beams.

The device of the invention may then comprise a magnifying lens with an afocal lens arrangement.

Such afocal lens arrangement has an infinite effective focal length . It may be done for instance with two converging lenses positioned so that their spacing corresponds to the sum of their focal lengths (or their intermediate focal planes are at the same position) .

In all cases, the plane with the measurement points is an image plane (or a conjugate plane) of the plane with the col lection apertures by the whole optical assembly comprising the mag nifying lens and the chromatic lens. Or in other words the measurement points are respective images of the collection apertures by that whole optical assembly. Such images are formed with a lateral mag nification factor which depend on the mag nification lens (for a given or particular chromatic lens of course) . So, chang ing the mag nification factor provided by the mag nifying lens al lows chang ing the spatial repartition of the measu rement points by a scal ing factor without changing the chromatic lens.

Of course, the scaling factor or the magnification factor may correspond to a mag nification (absolute val ue hig her than one), a red uction (absolute value lower than one) or a unity mag nification (absol ute value eq ual to 1 ) .

The use of the mag nifying lens allows chang ing the spatial repartition of the measurement points, continuously and/or by d iscrete steps, without chang ing the chromatic lens and thus without chang ing sig nificantly the measurement range defined by the chromatic d ispersion of that chromatic lens.

In addition, by taking care of provid ing mag nifying lenses arrangements which allow positioning the intermed iate conjugate focal plane at the same position along the optical axis relative to the chromatic lens (or at infinity), the chromatic lens is always used in similar conditions. According to some modes of real ization, the device of the invention may comprise a mag nifying lens of a zoom type allowing introducing a variable mag nification .

The mag nifying lens may comprise for instance a zoom lens, or a mag nifying lens or lens assembly of a zoom type .

Such magnifying lens (of a zoom type) may comprise :

- At least one lens movable (along the optical axis) and al lowing varying a magnification ;

- A lens arrangement allowing varying the mag nification between the plane of the col lection apertures and an intermediate conjugate focal plane at finite d istance;

- An afocal zoom arrangement allowing modifying the width of col limated beams, for operating with an intermediate conjugate focal plane at infinite d istance.

The device of the invention may further comprise a mechanical mount allowing changing at least one of the following :

- a magnifying lens,

- a combination of magnifying lens and chromatic lens.

The mechanical mount may comprise for instance a turret or a linear stage for chang ing a magnifying lens.

It may allow combining several mag nifying lenses with d ifferent mag nification with one chromatic lens. For instance, it may hold several mag nifying lenses on a moving stage (such as a turret or a l inear stage) so as to be able to position any of them between the collection apertures and the chromatic lens.

Of course, the mechanical mount may al low chang ing mag nifying lenses, at least some of which being magnifying lens of a zoom type.

As previously said , the device of the invention may comprise a mechanical mount allowing chang ing a combination of mag nifying lens and chromatic lens, such as :

- Several mag nifying lenses with several chromatic lens;

- One magnifying lens with several chromatic lenses.

Accord ing to some modes of real ization, the device of the invention may further comprise collection apertures respectively arranged along a first line and a second line substantially paral lel to the first line, the first line comprising collection apertures of optical measurement channels with an intensity detector, the second line comprising collection apertures of optical measurement channels with a spectral detector.

Such configuration allows for instance acquiring 3D spectral information with optical measurement channels of the second line on measurement points of interest selected using 2D total intensity information acquitted at higher rate using optical measurement channels of the first line, during a monotonous relative displacement of the object relative to the chromatic lens.

According to some modes of realization, the device of the invention may further comprise mechanical displacement stages for moving relatively the object and the chromatic lens.

The mechanical displacement stages may comprise translation plates and/or rotation plates.

Description of the drawings

The methods according to embodiments of the present invention may be better understood with reference to the drawings, which are given for illustrative purposes only and are not meant to be limiting. Other aspects, goals and advantages of the invention shall be apparent from the descriptions given hereunder.

- Fig. 1 illustrates a first mode of realization of confocal chromatic device for carrying out the method of the invention;

- Fig. 2 illustrates a second mode of realization of confocal chromatic device for carrying out the method of the invention;

- Fig. 3 illustrates a first mode of realization of measurement head with a magnifying lens;

- Fig. 4 illustrates a second mode of realization of measurement head with a magnifying lens;

- Fig. 5 illustrates a third mode of realization of measurement head with a magnifying lens;

- Fig. 6 illustrates a fourth mode of realization of measurement head with a magnifying lens;

- Fig. 7 illustrates a mode of realization of measurement head providing measurement points arranged in lines;

- Fig. 8 illustrates a flow chart of the method of the invention.

Detailed description of the invention It is wel l understood that the embod iments described hereinafter are in no way limitative. Variants of the invention can in particular be envisaged comprising only a selection of the features described below in isolation from the other described featu res, if th is selection of features is sufficient to confer a technical advantage or to d ifferentiate the invention with respect to the state of the prior art. This selection comprises at least one preferred functional feature without structural details, or with only one part of the structural details if this part alone is sufficient to confer a technical advantage or to d ifferentiate the invention with respect to the state of the prior art.

In particular, al l the described variants and embod iments can be combined if there is no objection to this combination from a techn ical point of view.

In the fig ures, the elements common to several figures retain the same references.

With reference to Fig . 1 and Fig . 2, we wil l describe a confocal ch romatic device for carrying out the method of the invention . Fig . 1 and Fig . 2 ill ustrates several variant of implementation of some subparts of the device, which may of cou rse be combined .

The confocal chromatic device comprises a measu rement head 12 with a chromatic lens 13. Such lens is desig ned accord ing to well-known techn iq ues so as to provide a strong chromatic aberration, allowing d ifferent optical wavelengths crossing the lens to be focused at d ifferent axial d istances (that is d istances along the optical axis of the lens, or along the Z axis as shown in Fig . 1 and Fig . 2) .

Of course, the chromatic lens 13 may comprise a single lens as ill ustrated in Fig . 1 and Fig . 2, or an arrangement of several ind ividual lenses forming a chromatic lens assembly according to well-known techniq ues.

The confocal chromatic device further comprises several optical measurement channels 24.

Each optical measurement channel 24 comprises a collection optical fiber

17 for conveying the light to and from the measurement head 12 and the chromatic lens 13. In the mode of realization presented, these col lection optical fibers 17 comprise multimode fibers arranged as a bundle. The collection fibers 17 have an end 14 positioned in the measurement head 12, which constitutes a collection aperture 14 of the confocal detection set-up . These collection apertures 14 are located in a collection plane (correspond ing to an X-Y plane in Fig . 1 and Fig . 2) relative to the chromatic lens 13.

Each optical measurement channel 24 allows doing measurements on a measurement point 15 located in an object plane (correspond ing to an X-Y plane) which is a conjugate plane of the collection plane for the chromatic lens 13. So, the measurement points 15 correspond to images of the collection apertures 14 by the chromatic lens 13, or, more precisely and because of the chromatic d ispersion, projections of the images of the collection apertures 14 for the various wavelengths in the object plane. So the spatial repartition of the measurement points 15 in the object plane is determined by the spatial arrangement of the collection apertures 14 in the collection plane.

The optical measurement channels 24 are il luminated by a broad band light source 19. In the modes of real ization presented, that light source 19 may comprise a thermal source (halogen for instance) or a LED source generating light with wavelengths within for instance a range of 400-700 nm (visible range) .

In the mode of real ization il lustrated in Fig . 1 , the light of the light source 19 is injected in optical fibers and conveyed throug h optical couplers 18 to the col lection apertures 14. The couplers 18 may comprise fiber couplers, or couplers made with other technolog ies such as for instance planar optics waveg uides. They may be done with d istinct components for each optical measurement channel 24, or, in particular when using planar waveg uide technologies, with components comprising several couplers 18 for several measurement channels 24.

In the mode of real ization il lustrated in Fig . 2, the light of the light source is conveyed by il l umination optical fibers 27 to the measurement head 12. The measurement head 12 comprises a beam spl itter 26 such as a beam spl itter cube which d irects the l ig ht issued from the ill umination optical fibers 27 throug h their ill umination aperture 28 (their end) towards the chromatic lens 13, and which allows coupling the l ig ht reflected back by the object 10 to the collection apertures 14 of the collection optical fibers 17. Two coll imating lenses 29 are respectively arranged in front of the il lumination apertures 28 and the col lection apertures 14 to ensure that the beams crossing the beam spl itter 26 are essential ly col limated . Of course the chromatic lens 13 is arranged accordingly.

The il lumination apertures 28 and the collection apertures 14 are spatially arranged so as to form respectively pairs of conjugate points with a measurement point 15. For that, two similar coll imating lenses 29 are used and a same spatial repartition is done for the il lumination apertures 28 and the col lection apertures 14.

The light of the l ig ht source 19 is focuses by the chromatic lens 13 so that d ifferent wavelengths are focused at d ifferent axial positions on the measurement points 15, thus defining a measurement range .

The l ight reflected at the measurement points 15 by an object of interest 10 positioned in the measurement range is coupled back in the collection apertures 14. Thanks to the confocal arrangement of the set-up, only the lig ht actually focused on an interface of the object 10 is coupled back in the col lection apertures 14, and the light reflected by the object 10 out-of-focus is not coupled back. In add ition, thanks to the chromatic d ispersion of the chromatic lens 13 :

- The light focused on an interface (or a surface) of the object 10 correspond essential ly to a single wavelength or g roup of wavelength for which the focal length of the chromatic lens 13 corresponds to the axial optical d istance to that interface along the optical axis of the lens (correspond ing to the Z axis) . So by analyzing the intensity spectrum of the reflected light, the axial d istance to the interfaces may be measured . That measurement mode, which corresponds to a classical use of the chromatic confocal technique, may be called profilometry mode or 3D detection mode;

- The light collected after reflection on an interface (or a surface) of an object 10 located anywhere within the measurement range does not include any sig nificant defocused light but only light focuses on that interface or surface. So it provides an intensity information with a lateral resol ution in the object plane (X-Y) correspond ing to the spot size at focus. And such lateral resol ution is achieved for interfaces or surfaces located within the whole measuring range. So, by analyzing the total intensity of the reflected l ight, the set-up allows imag ing interfaces or surfaces of the object 10 with a hig h lateral resol ution over an extended depth of focus. This measurement mode has thus the advantage of al lowing intensity imag ing of surfaces of structures 11 of a sign ificant height (as shown in Fig . 1 or Fig . 2) with an optimal lateral resol ution in a 2D (bidimensional) detection mode.

Accord ing to some modes of real ization, the device of the invention comprises only optical measurement channels 24 with an intensity detector 20 for measuring a total intensity of the collected l ig ht. In that case the device of the invention is devoted to fast 2D inspection (intensity imag ing ) with an extended depth of focus.

Accord ing to some modes of real ization, the device of the invention comprises optical measurement channels 24 with (or coupled with) an intensity detector 20 and/or a spectral detector 21 for respectively acq uiring data in 2D detection mode (intensity imag ing ) and/or 3D detection mode (profilometry) .

In both cases, the light coupled back in the collection apertures 14 is transferred to these intensity detectors 20 and/or spectral detectors 21 by the collection optical fibers 17 and , in the mode of real ization of Fig . 1 , by the couplers 18.

Several arrangements of intensity detectors 20 and spectral detectors 21 within or in relation with the optical measurement channels 24 are possible. The device of the invention may notably comprise :

- Optical measurement channels 24 which comprise only an intensity detector 20 or a spectral detector 21. In that case, these optical measurement chan nels 24 are ded icated to an intensity (2 D) measurement or an axial distance (3D) measu rement at the corresponding measurement point 15;

- Optical measurement channels 24 which comprise an intensity detector

20 and a spectral detector 21. These optical measurement channels 24 further comprise a branching element 23 such as a coupler 23 or a switch 23 as il lustrated in Fig . 1 , for d irecting the l ig ht coupled back in the collection apertures 14 simultaneously or sequential ly towards the intensity detector 20 and the spectral detector 21. In that case, these optical measurement channels 24 allow doing intensity measurements (2D) and axial d istance measurements (3D) at the corresponding measurement point 15;

- An optical multiplexer 25 with for instance an array of optical switches 25 as il lustrated in Fig . 2 operating as in interconnection array and allowing interconnecting a pl ural ity of optical measurement chan nels 24 with a plural ity of intensity detectors 20 and/or spectral detectors 21 in a reconfigurable way. In that case, these optical measurement channels 24 may be configured on demand for doing an intensity (2D) measurement and/or an axial distance (3D) measurement at the corresponding measurement point 15.

The spectral detectors 21 as illustrated in the modes of realization of Fig .

1 and Fig . 2 comprise :

- An entrance pupil, corresponding for instance to an end of a collection optical fiber 17, and a first lens for collimating the incoming light issued from the entrance pupil;

- A dispersing element such as a diffraction array or a grating for dispersing angularly the different wavelengths of the incoming light;

- A second lens and a linear detector such as a line CDD for re-imaging the dispersed light so that different wavelengths are focused on different pixels of the sensor. The intensity spectrum of the light is obtained by collecting the information on the pixels of the sensor. An interface of the object 10 present in the measurement range gives rise to a peak in the intensity spectrum around the wavelength focused at the corresponding axial position . So the intensity spectrum is analyzed to obtain an axial distance information, or the position of the interfaces or the surface of the object 10 within the measurement range.

The spectral detectors 21 of the different measurement channels 24 mays be completely distinct, or, as illustrated in Fig . 2, they may share some elements such as the detector. For instance, several spectral detectors 21 may share a same line or matrix sensor, the information of each spectral detectors 21 being collected on a separate set of pixels of the shared detector. In the same way, several spectral detectors 21 may share a same dispersing element.

The intensity detectors 20 comprise point detectors such as photodiodes which measure the whole intensity of the light over the full spectrum .

The intensity detectors 20 of the different measurement channels 24 mays be distinct (using for instance individual photodiodes), or, as illustrated in Fig . 2, they may share some elements such as the detector. For instance, several intensity detectors 20 may share a same photodiode array, or a same line or matrix sensor (CCD or CMOS), the information of each intensity detectors 20 being collected on a separate pixel, set of pixel or photodiode. In a variant of the mode of real ization of Fig . 2, the col lection apertures 14 may be arranged d irectly at the level of the intensity detectors 20 or the spectral detectors 21. In that case the measurement channels 24 comprise no collection optical fibers 17 and of course no optical multiplexer 25. For instance, the device of the invention may comprise :

- Intensity detectors 20 positioned with the sensing element or sensing surface of their detector located in the collection plane with the col lection apertures 14, which is a conjugate focal plane of the object plane with the measurement points 15. The collection apertures 14 are then material ized d irectly by the limited size of the sensing element (for instance when using a photod iode) or by the limited size of the pixels when using for instance a line or matrix CCD;

- Intensity detectors 20 positioned with the sensing element or sensing surface of their detector located behind a pinhole mask or an entrance slit materializing the collection apertures 14 and positioned in the col lection plane. An entrance slit may be used to material ize a series of col lection apertures 14 arranged in line, facing for instance a line or matrix sensor shared between several intensity detectors 20;

- Spectral detectors 21 positioned with their entrance pupil correspond ing to the col lection apertures 14 positioned in the col lection plane.

These entrance pupils mays be shaped as pinhole. They may also correspond to an entrance slit material izing the entrance pupils of a series of spectral detectors 21 sharing for instance a same d ispersing element and a matrix detector.

The device of the invention further comprises a computer or a microcontroller 22 for control and data processing .

For allowing inspection of an object 10 such as a wafer, the device of the invention further comprises a holder for holding the object 10 (for instance a wafer chuck) and a mechanical d isplacement stage 16 for moving relatively the measurement head 12 and the object 10. In the mode of realization presented , the mechanical d isplacement stage 16 may comprise translation plates for linear d isplacements along the X, Y, and Z axis, and a rotation stage for rotating the object 10 (the wafer) in the X-Y plane.

Of course the measurement head 12 may be d istinct from the parts of the device hold ing the light source 19 and the detectors 20, 21 , or the whole system, including the measurement head 12, may be done as a single assembly.

With reference to Fig. 3 - Fig. 6, we will now describe some modes of realization of device of the invention allowing adjusting or varying the spatial separation of the measurement points 15 without mechanically moving the collection apertures 14.

Such mode of realization may be advantageous for instance for inspecting an object 10 with periodic structures 11. By adjusting the spatial separation of the measurement points 15 to matches the period of the structures 11, parallel 2D and/or 3D inspection of these structures 11 at optimal speed may be performed .

According to these mode of realization, the measurement head 12 further comprise a magnifying lens 31 or a magnifying lens assembly 31 inserted between the collection apertures 14 and the chromatic lens 13. The magnifying lens 31 is preferably an achromatic lens arrangement.

Fig . 3 illustrates a mode of realization in which the magnifying lens 31 is arranged so as to image the collection apertures 14 in an intermediate conjugate focal plane 32 along the optical axis 35 with a first magnification factor G". If the collection apertures 14 are separated by a distance d in the plane perpendicular to the optical axis 35, their image 33 by the magnifying lens 31 is separated by a distance d"=G"d. The chromatic lens 13 is arranged so that the intermediate conjugate focal plane 32 is also a conjugate focal plane of the object plane with the measurement points 15. So, by assuming a second magnification factor G' for the chromatic lens 13 between the intermediate conjugate focal plane 32 and the plane of the measurement points 15, we obtain measurement points 15 separated by a distance d'= Gd, where G=G'G" is the magnification factor G corresponding to the global magnification factor of the combination of magnifying lens 31 and chromatic lens 13. Of course, in all modes of realization presented, the magnification factor G may correspond to a magnification, a reduction, or a unity magnification.

It is to be noted that the lateral size of the measurement points 15, corresponding to the lateral resolution of these measurement points 15, is also changed by the magnification factor, but the ratio between the separation distance d' and the lateral resolution at the measurement points 15 is preserved, which is the most important for the quality of the sampling .

Fig . 4 illustrates a mode of realization in which the magnifying lens 31 is arranged so that the collection apertures 14 are located in its entrance focal plane. In that case, the intermediate conjugate focal plane is at infinity and the magnification factor G is determined by the ratio of the focal lengths of the magnifying lens 31 and the chromatic lens 13. Of course the chromatic lens 13 is arranged to operate in such configuration.

Fig . 5 and Fig . 6 illustrate modes of realization of measurement head 12 with a magnifying lens 31 which are compatibles with the presence of a bulk beam splitter 26 as described in the modes of realizations of device illustrated in Fig . 2. Of course, these modes of realization may also be used with the modes of realization of device illustrated in Fig. 1, without beam splitter 26 but using a collimating lens 29 arranged so as to have the collection apertures 14 in its focal plane.

In case of use of a beam splitter 26, the magnifying lens 31 is placed between the beam splitter 26 and the chromatic lens 13, so as to have a same magnification factor G applied to the collection apertures 14 and the illumination apertures 28.

In the mode of realization of Fig. 5, the magnifying lens 31 is arranged

(in combination with the collimating lens 29) so as to image the collection apertures 14 in an intermediate conjugate focal plane 32 with a first magnification factor G". In that case, the first magnification factor G" it determined by the ratio of the focal lengths of the magnifying lens 31 and the collimating lens 29. As previously, by assuming a second magnification factor G' for the chromatic lens 13 between the intermediate conjugate focal plane 32 and the plane of the measurement points 15, the (global) magnification factor G for the combination of magnifying lens 31 and chromatic lens 13 corresponds to G=G'G".

It is to be noted that, without beam splitter 26, the mode of realization of Fig . 5 is may be similar to the mode of realization of Fig . 4 if the collimating lens 29 is part of the magnifying lens assembly 31.

In the mode of realization of Fig. 6, the magnifying lens 31 comprises is an afocal lens arrangement, with for instance two lenses having their intermediate focal planes superposed . In that case, the intermediate conjugate focal plane (between the magnifying lens 31 and the chromatic lens 13) is at infinity. The magnification factor G may be determined as being the product G=G'G" of:

- a first magnification factor G' corresponding to the ratio of the focal lengths of the chromatic lens 13 and the collimating lens 29; and

- a second magnification factor G" corresponding to the ratio of the respective focal lengths of the lenses of the afocal lens pair comprised in the magnifying lens system 31.

It is to be noted that in the mode of realization of Fig. 6, the magnifying lens 31 has an infinite effective focal length, or in other words entrance and exit conjugate focal planes placed at infinity. That configuration has the advantage that the accuracy of the positioning of the magnifying lens 31 along the optical axis 35 is not critical for the performance.

As previously explained, a purpose of the magnifying lens 31 is provide an capability to vary the magnification factor G of the optical set-up, either continuously or within a discrete set of values.

Several practical implementation are possible.

According to some modes of realization, the magnifying lens 31 comprises a zoom arrangement for varying continuously the magnification factor G over a range.

For instance, in the mode of realization of Fig. 6, the magnifying lens 31 may comprise an afocal zoom arrangement. According to a well-known configuration, such afocal arrangement may comprise two converging lenses of equal focal length, and a diverging lens with an absolute focal length less than half that of the converging lenses placed between the converging lenses. Such arrangement allows varying the magnification by moving the diverging lens and one of the converging lenses along the optical axis 35 in a particular non-linear relationship.

According to some modes of realization, the measurement head 12 comprises a mechanical mount 34 to change the magnifying lens 31.

The measurement head 12 may comprise for instance a turret 34 or a linear stage 34 holding several magnifying lens 31 and allowing to change the magnifying lens 31 inserted between the collection apertures 14 and the chromatic lens 13 by a translational or rotational movement. In that case, the different magnifying lenses 31 are arranged so that, once in place, the plane with the collection apertures 14 is conjugate of the object plane with the measurement points 15 by the whole optical system, comprising the magnifying lens 31 and the chromatic lens 13. If at least one of the conjugate focal planes of the magnifying lens 31 (that is the entrance plane towards the collection apertures 14 and/or the intermediate conjugate focal plane 32) is at a finite distance, which is the case for the modes of realization of Fig . 3, Fig . 4 or Fig . 5, the different magnifying lenses need to be positioned accurately along the optical axis 35. If both conjugate planes of the magnifying lens 31 are at infinite distance, which is the case for the mode of realization of Fig . 6, the requirements in terms of positioning along the optical axis 35 are relaxed .

The measurement head 12 may also comprise a turret or a linear stage holding several chromatic lenses 13 to be used with one fixed magnifying lens 31 or several interchangeable magnifying lenses 31.

The modes of realization of Fig . 1 - Fig . 6 show devices with a few measurement channels 24 for sake of clarity. Of course, in practice a device of the invention may comprise much more measurement channels 24, in the order of hundred or more.

The spatial repartition of the collection apertures 14 in the measurement head 12 and the repartition of the intensity detectors 20 and the spectral detectors 21 among the optical measurement channels 24 may be of any kind, depending on the applications.

With reference to Fig . 7, we will now describe a mode of realization of device optimized for allowing high-speed inspection a surface of an object such as a wafer 10 with structures 11 such as bumps or micro-bumps 11.

The optical measurement channels 24 are provided with collection fibers

17 whose end forming the collection apertures 14 are arranged in two parallel rows positioned in a mounting piece 43 (for instance with grooved elements for accurately positioning the fiber ends) .

A first row 41 comprises collection fibers 17 of measurement channels 24 connected to intensity detectors 20.

A second row 42 comprises collection fibers 17 of measurement channels 24 connected to spectral detectors 21.

The first row 41 and the second row 42 may have a same number of collection apertures 14 as illustrated in Fig . 4, or a different number, possibly with a different spacing . The second row 42 may even have a single collection apertures 14 connected to a sing le spectral detector 21.

Of course, the spatial repartition of the measurement points 15 may be adjusted using a magn ifying lens 31 as described in relation with Fig . 3 - Fig . 6.

The main purpose of that specific arrangement, as it wil l be described later, is to provide a device which allows acquiring intensity information prior to axial d istance information in a same scan .

Of course, other repartitions are possible. In particular, the collection apertures 14 may be arranged in one row 41. And these collection apertures 14 may optical ly connected to :

- Only intensity detectors 20; or

- Intensity detectors 20 or, for one or several collection apertu res located at the center of the row 41 , spectral detectors 21 .

With reference to Fig . 8, we wil l now describe a method for inspecting a surface of an object in 2D and 3D modes.

General ly speaking , the method of the invention comprises steps of:

- Acq uiring an intensity information with several measurement channels 24 on several measurement points 15 at the surface of the objet 10 (step

51 ) ;

- Locating points of interests for axial d istances measurements using said intensity information and possibly intensity information and/or axial d istance information acq uired during preceding steps (step 52) ;

- Positioning collection apertures 14 of at least one measurement channel 24 with a spectral detector 21 over a point of interest (step 53) ;

- Acq uiring at least one axial d istance information (step 54);

- repeating the process over the surface of the object 10 and computing the results (step 55) .

The computation may comprise for instance at least one of the following :

Building a heig ht map, build ing an intensity map, locating structures in the X- Y plane, comparing height or in-plane dimensions of the structures with expected val ues, issu ing pass/fail data .

Optional ly, the method may comprise a step of adjusting the spatial repartition of the collection apertures 14 using a mag nifying lens 31 (step 50) . That adjustment may be done using a-priori knowledge on the object, or using intensity information and/or axial distance information previously obtained . It may be done once at the beginning of the measurements or several times during the measurement process.

By using the set-up of the invention described in relation with Fig . 7, the method of the invention allows in particular doing a very high-speed inspection of a surface of a wafer 10 with structures 11 such as bumps or micro-bumps 11 arranged in a periodic fashion .

In a first step, the measurement head 12 and the wafer 10 are arranged so that the rows 41, 42 of collection apertures 14 are aligned with the structures 11. Optionally the magnification is adjusted with the magnifying lens 31 so that the distance between the measurement points 15 matches the spacing of the structures (with for instance one measurement point 15 on the top of the structure and one measurement point between two structures as illustrated on Fig . 7) .

Then the measurement head is moved in a direction of displacement 44 preferably perpendicular to the rows 41, 42 of collection fibers. For each displacement step :

- An intensity information is acquired with the collection apertures 14 of the first row 41. It is combined with the previously acquired intensity information to build an intensity map;

- The intensity map is processed to locate the newly appearing structures 11 along in the X-Y plane. The next points of interest for axial distances measurements, corresponding for instance to summits of structures 11 are computed accordingly;

- If measurement points 15 corresponding to the collection apertures 14 of the second row 42 are positioned on previously identified points of interest, corresponding axial distance information is acquired . Newly acquired axial information is then combined with the previously acquired axial information to build a height map.

The process is repeated over the whole area of interest of the wafer and the data is computed for providing for instance at least one of the following : a height map, an intensity map, location of structures in the X-Y plane, comparison of height or in-plane dimensions of the structures with expected values, pass/fail data. As previously, the mag nification may be adjusted with the mag nifying lens 31 using a-priori knowledge on the object or intensity information and/or axial d istance information previously obtained once at the beginning of the measurements or several times d uring the measurement process between d isplacement steps.

The devices and the methods of the invention may advantageously be uses for several kind of applications. It may be used for instance for inspecting :

- an object 10 such as a wafer;

- an object 10 such as a wafer on carrier or g lass carrier, or wafer elements such as d ies on a carrier;

- an object 10 such as a wafer on frame, or wafer elements such as d ies on a frame;

In particular, for the inspection of an object 10 made of several compound elements such as dies on carrier or frame, the method of the invention may comprise steps of:

- performing inspection steps as previously described with a hig h mag nification lead ing to a coarse spatial resol ution (and hig h speed) for locating on the surface of the carrier or frame, in the X-Y plane and possibly also in height Z, the compound elements (or d ies) ; and

- performing inspection steps as previously described with a low mag nification lead ing to fine spatial resolution for inspecting at least some of the compound elements (or dies), looking for instance on solder bumps on these compounds elements.

While this invention has been described in conjunction with a number of embodiments, it is evident that many alternatives, modifications and variations wou ld be or are apparent to those of ord inary skil l in the appl icable arts. Accord ing ly, it is intended to embrace al l such alternatives, modifications, eq uivalents and variations that are within the spirit and scope of this invention .

Claims

1. Method for inspecting the surface of an object (10) such as a wafer comprising tridimensional structures (11), using a confocal chromatic device with a plurality of optical measurement channels (24) and a chromatic lens (13) allowing optical wavelengths of a broadband light source (19) to be focused at different axial distances defining a chromatic measurement range, characterized in that it comprises a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object (10) within the chromatic measurement range at a plurality of measurement points (15) on the object (10) by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels (24) in a confocal configuration.

2. The method of claim 1, further comprising a step of measuring a spectral information of the light collected by an optical measurement channel (24) for obtaining an axial distance information within the chromatic measurement range.

3. The method of claim 1 or 2, further comprising a step of locating a structure (11) on the surface of the object (10) using intensity information.

4. The method of claim 2 or 3, further comprising steps of:

- identifying a measurement point of interest using intensity information;

- obtaining an axial distance information at said point of interest.

5. The method of claim 4, further comprising at least one of the following steps:

- identifying a measurement point of interest relative to a structure (11);

- identifying a measurement point of interest relative to a structure (11) corresponding to a summit of said structure (11).

6. The method of claim 5, further comprising a step of deducing a height information of said structure (11).

7. The method of claim 4 to 6, further comprising a step of moving relatively the object (10) and the chromatic lens (13) to position an optical measurement channel (24) so as to obtain an axial distance information on a previously identified measurement point of interest.

8. The method of any of claims 4 to 7, comprising a step of moving relatively the object (10) and the chromatic lens (13) along a pre-defined scan trajectory, and for a scan position:

- obtaining an intensity information; and/or

- obtaining an axial distance information on a measurement point of interest previously identified.

9. The method of any of claims 2 to 8, further comprising at least one of the following steps:

- changing a spacing of measurement points (15);

- changing a spacing of measurement points (15) by changing a scaling factor between a spatial repartition of collection apertures (14) of the optical measurement channels (24) and the measurement points (15) using a magnifying lens (31).

10. The method of claim 9, further comprising at least one of the following steps:

- adjusting a spacing of measurement points (15) taking into account a spatial repartition of structures (11) on the object (10);

- adjusting a spacing of measurement points (15) so as to substantially match a spacing of structures (11) on the object (10)

11. The method of claim 9 or 10, further comprising at least one of the following steps:

- obtaining an information on the spacing of structures (11) using a- priori knowledge on the object (10);

- obtaining an information on the spacing of structures (11) using intensity information and/or axial distance information previously obtained.

12. The method of any of claims 9 to 11, further comprising steps of: - obtaining an intensity information and/or an axial distance information at a plurality of measurement points (15) with a first spacing of said measurement points (15), for locating sub-elements on the surface of the object (10);

- obtaining an intensity information and/or an axial distance information at a plurality of measurement points (15) with a second spacing of said measurement points (15) finer than the first spacing on a sub-element.

13. The method of any of the preceding claims, further comprising steps of:

- building an intensity image by combining intensity information obtained in a region of interest of the object (10); and/or

- building a height map by combining axial distance information obtained in a region of interest of the object (10).

14. The method of any of claims 2 to 13, further comprising a step of comparing obtained axial distance information with reference value(s).

15. The method of any of the preceding claims, which is implemented for inspecting tridimensional structures (11) of at least one of the following type: bumps, micro-bumps, solder bumps, copper pillars, copper nails, Re- Distribution Layers (RDL), metal patterns.