WO2017154304A1 - Substrate transfer method and substrate transfer device - Google Patents

Substrate transfer method and substrate transfer device Download PDF

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Publication number
WO2017154304A1
WO2017154304A1 PCT/JP2016/087443 JP2016087443W WO2017154304A1 WO 2017154304 A1 WO2017154304 A1 WO 2017154304A1 JP 2016087443 W JP2016087443 W JP 2016087443W WO 2017154304 A1 WO2017154304 A1 WO 2017154304A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
substrate
tape
wafer
ring frame
Prior art date
Application number
PCT/JP2016/087443
Other languages
French (fr)
Japanese (ja)
Inventor
孝夫 松下
山本　雅之
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020187024601A priority Critical patent/KR20180123018A/en
Priority to CN201680083263.0A priority patent/CN108713247B/en
Publication of WO2017154304A1 publication Critical patent/WO2017154304A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Definitions

  • the present invention provides a substrate transfer method in which a desired process is applied to various substrates such as semiconductor wafers, circuit boards, and LEDs (Light Emitting Diodes) adhered and held on a ring frame via an adhesive tape, and then transferred to a new adhesive tape.
  • the present invention relates to a method and a substrate transfer apparatus.
  • a general semiconductor wafer (hereinafter simply referred to as a “wafer”) is protected by attaching a protective tape to the surface after circuit patterns of many elements are formed on the surface.
  • the wafer whose surface is protected is ground or polished from the back surface in a back grinding process to a desired thickness.
  • the protective tape is peeled from the thinned wafer and conveyed to the dicing process, the wafer is bonded and held to the ring frame via a supporting adhesive tape (dicing tape) in order to reinforce the wafer.
  • ⁇ Wafer bonded and held on the ring frame has different processing steps depending on the semiconductor chip to be manufactured. For example, when a semiconductor chip is miniaturized, a laser dicing process is performed. At this time, if the dicing is performed from the surface on which the circuit pattern is formed, the circuit is damaged due to the influence of heat. Therefore, it is necessary to perform a half cut from the back surface before the back grinding process. When each chip is mounted at a desired position after breaking the half-cut wafer, the adhesive tape and the protective tape on the surface are peeled off because the chip is sucked and transported by the collet from the chip surface.
  • the adhesive tape is re-applied from the back side of the peeled wafer such as the adhesive tape, and bonded and held on a new ring frame, and then the wafer is broken. That is, it is necessary to transfer the wafer again to a new ring frame before breaking.
  • the adhesive tape to be used is soft, the conventional method can function effectively.
  • a hard (for example, PET) adhesive tape is used to give rigidity to the wafer, it is difficult to elastically deform, so that a sufficient gap can be earned even if the ring frame and the wafer are moved relatively apart. Can not. That is, there is a problem that the adhesion between the adhesive tapes cannot be avoided.
  • the present invention has been made in view of such circumstances, and a main object of the present invention is to provide a substrate transfer method and a substrate transfer apparatus capable of accurately transferring a substrate to a new adhesive tape.
  • the present invention has the following configuration. That is, the present invention is a substrate transfer method for transferring a substrate adhered and held in a ring frame to a second adhesive tape via a supporting first adhesive tape, from the first adhesive tape side.
  • a holding step of holding the ring frame and the substrate with a holding member, a tape cutting step of cutting the first adhesive tape along the outer shape of the substrate held by the holding member, and the cut out first A tape recovery step for recovering the adhesive tape, and a transfer step for transferring the second adhesive tape from the non-holding surface side of the substrate after the tape recovery step.
  • the first adhesive tape is cut along the outer shape of the held substrate, and the cut out first adhesive tape is recovered. Therefore, regardless of the characteristics of the adhesive tape such as altitude and adhesive strength, the portion of the first adhesive tape that protrudes from the outer diameter of the substrate and exposes the adhesive surface is recovered. Therefore, the adhesive surfaces of the first adhesive tape and the second adhesive tape are bonded to each other when transferring from the first adhesive tape to the second adhesive tape without being influenced by the characteristics of the adhesive tape. It can avoid suitably.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut so that a length of a portion of the first adhesive tape protruding from an outer diameter of the substrate is equal to or less than a thickness of the substrate. preferable. According to this method, even when the portion protruding outward from the outer diameter of the substrate is deformed at the edge of the wafer, the contact between the first adhesive tape and the second adhesive tape is surely avoided. it can. Therefore, when transferring from the first pressure-sensitive adhesive tape to the second pressure-sensitive adhesive tape, it is possible to more reliably avoid adhesion of the pressure-sensitive adhesive surfaces of the first pressure-sensitive adhesive tape and the second pressure-sensitive adhesive tape. It can be improved.
  • the substrate may be transferred to the second adhesive tape by holding the substrate on a holding member smaller than the diameter of the substrate.
  • the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it can avoid more reliably that the 1st adhesive tape and the 2nd adhesive tape adhere in a transfer process. Further, by downsizing the holding member, it is possible to avoid an increase in the size of the substrate transfer apparatus.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut using a cutter blade.
  • the first adhesive tape may be cut using a laser.
  • the first adhesive tape can be suitably cut along the outer shape of the substrate, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process.
  • the tape collecting step it is preferable to collect the cut-out first adhesive tape that is bonded to the ring frame together with the ring frame.
  • the cut out first adhesive tape can be recovered by holding and recovering the ring frame that is more difficult to deform. Therefore, the cut out first adhesive tape can be collected more easily and reliably.
  • the transfer step it is preferable to perform transfer by superimposing a new ring frame on which the second adhesive tape has been applied in advance on the substrate and attaching the second adhesive tape from the non-holding surface side of the substrate.
  • the second adhesive tape is affixed to the ring frame in advance, the process and time for transferring the substrate can be shortened. Therefore, the transfer efficiency of the substrate can be improved.
  • the present invention has the following configuration in order to achieve such an object.
  • a substrate transfer apparatus for transferring a substrate bonded and held in a ring frame to a second adhesive tape via a supporting first adhesive tape, A substrate holding part for holding the substrate via the first adhesive tape; A frame holding unit for holding the ring frame; A tape cutting unit for cutting the first adhesive tape along the outer shape of the substrate held by the substrate holding unit; A tape collecting unit for collecting the first adhesive tape cut out by the tape cutting unit; After the cut out first adhesive tape is collected, a transfer mechanism for attaching and transferring the second adhesive tape from the non-holding surface side of the substrate; It is provided with.
  • the substrate transfer method and the substrate transfer apparatus of the present invention even when the substrate is bonded and held to the frame via the adhesive tape that is hard and hardly elastically deformed, the substrate is transferred again to a new adhesive tape. Sometimes, the adhesive surfaces of both adhesive tapes can be accurately avoided.
  • FIG. 1 It is a top view which shows the basic composition of a board
  • (A) is sectional drawing which shows the structure of the mount frame before and behind transcription
  • (b) is a perspective view of a mount frame. It is a front view of a tape cutting mechanism. It is a top view of a tape sticking mechanism. It is a front view of a tape cutting mechanism. It is a front view of a reversing unit. It is a figure explaining operation
  • (A) is a flowchart explaining operation
  • (b) is the schematic explaining the structure of the mount frame in each step. It is a front view explaining the structure of the mount frame in step S1.
  • (A) is a figure which shows the structure when cut
  • (b) is a figure which shows the structure after cut
  • (A) is a figure which shows the structure at the time of sticking adhesive tape T2
  • (b) is a figure which shows the structure after sticking adhesive tape T2. It is a front view explaining the structure of the mount frame in step S6. It is a figure explaining the structure which performs the transfer which concerns on a prior art example.
  • (A) is a figure which shows the structure which deform
  • (b) is a figure which shows the structure which inserts an adhesion preventing material. It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification.
  • (A) is a front view explaining the structure of a tape peeling mechanism
  • (b) is a perspective view explaining the state which peels an adhesive tape. It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification.
  • (A) is a front view explaining the structure which makes a cutter contact a wafer holding part, and cut
  • (b) is the state which cut
  • FIG. 1 shows a plan view of the basic configuration of a substrate transfer apparatus 1 according to the present invention.
  • the substrate transfer apparatus 1 includes a wafer W from a mount frame MF1 in which an adhesive tape T1 is attached to one surface of a semiconductor wafer W (hereinafter simply referred to as “wafer W”).
  • the wafer W is transferred to a mount frame MF2 having an adhesive tape T2 attached to the other surface.
  • the mount frame MF1 is manufactured by sticking an adhesive tape T1 to one surface of the wafer W and the ring frame f.
  • the mount frame MF2 is manufactured by attaching an adhesive tape T2 to the other surface of the wafer W and the ring frame f.
  • the ring frame f in the mount frame MF1 is denoted by reference numeral f1
  • the ring frame f in the mount frame MF2 is denoted by reference numeral f2 to distinguish between them.
  • the adhesive tape T1 and the adhesive tape T2 used in this embodiment are made of a tape mainly made of PET (Polyethylene Terephthalate) in order to give the wafer W rigidity.
  • PET Polyethylene Terephthalate
  • the material of the adhesive tape T1 and the adhesive tape T2 is not limited to PET, and other known materials may be used.
  • the substrate transfer apparatus 1 includes a mount frame storage unit 3, a first transport mechanism 5, a holding table 7, a tape cutting mechanism 9, a ring frame supply unit 11, and a tape application.
  • a mechanism 13, a tape cutting mechanism 15, a reversing unit 19, an ultraviolet irradiation mechanism 21, a tape peeling mechanism 23, and a mount frame collection unit 25 are provided.
  • the x direction in FIG. 1 is the left-right direction and the z direction is the up-down direction.
  • the lower side of FIG. 1 is referred to as “front side”, and the upper side of FIG. That is, the mount frame collection unit 25 is disposed on the back side of the mount frame storage unit 3 in the substrate transfer apparatus 1 shown in FIG.
  • the mount frame storage unit 3 is provided with a storage unit (not shown) that stores a mount frame MF1 manufactured by attaching an adhesive tape T1 to one surface of the wafer W and the ring frame f1.
  • the storage unit includes a vertical rail connected and fixed to the apparatus frame, and a lifting platform that is screwed up and down by a motor along the vertical rail. Therefore, the mount frame storage unit 3 is configured to place the mount frame MF on the lifting platform and move it up and down by pitch feed.
  • the ring frame supply unit 11 and the mount frame collection unit 25 have the same configuration as the mount frame supply unit 3.
  • the first transport mechanism 5 transports the mount frame MF1 stored in the mount frame storage unit 3 to the holding table 7 disposed at the cutting position S. Further, as will be described later, the first transport mechanism 5 also has a function of transporting the ring frame f1 separated from the wafer W to the mount frame storage unit 3 after the adhesive tape T1 is cut out by the tape cutting mechanism 9. That is, the ring frame f1 and the adhesive tape T1 separated from the wafer W are collected in the mount frame storage unit 3 by the first transport mechanism 5.
  • the first transport mechanism 5 corresponds to the tape collecting unit in the present invention.
  • the adhesive tape T1 corresponds to the first adhesive tape in the present invention.
  • the holding table 7 mounts and holds the mount frame MF1, and is configured to be able to reciprocate between the cutting position S and the transfer position R shown in FIG.
  • the holding table 7 includes an annular frame holding portion 29 that holds the ring frame f and a circular wafer holding portion 31 that holds the wafer W.
  • the wafer holder 31 corresponds to the substrate holder in the present invention.
  • the frame holding unit 29 corresponds to the frame holding unit in the present invention.
  • An adsorption hole for adsorbing and holding the ring frame f is formed on the holding surface of the frame holding unit 29.
  • a suction hole for sucking and holding the wafer W is formed on the holding surface of the wafer holder 31. From the viewpoint of more suitably performing the cutting of the adhesive tape T1, it is preferable that the diameter of the wafer holder 31 is equal to or less than the diameter of the wafer W.
  • the tape cutting mechanism 9 is disposed above the holding table 7, and includes a frame 33, a movable table 35, a support arm 37, And a cutter unit 39.
  • the movable table 35 can be moved up and down along the frame 33.
  • the support arm 37 is provided at the lower end of the arm that is cantilevered from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.
  • the cutter unit 39 is connected to the movable table 35 via the support arm 37.
  • the cutter unit 39 is mounted with a cutter 41 with a cutting edge facing downward via a cutter holder.
  • the cutter unit 39 is configured so that the turning radius can be adjusted via the support arm 37.
  • the cutter 41 cuts the adhesive tape T1 attached to the mount frame MF1 along the outer shape of the wafer W.
  • the tape cutting mechanism 9 corresponds to a tape cutting unit in the present invention.
  • the ring frame supply unit 11 includes a frame transport unit F that transports a new ring frame f2 to the transfer position R.
  • the tape applying mechanism 13 when the holding table 7 is located at the transfer position R, the tape applying mechanism 13 is disposed above the holding table 7, and includes a tape supply unit 43, an applying roller 45, and a peeling roller 49. And a tape recovery unit 51.
  • the tape supply unit 43 is loaded with a wide adhesive tape T2 wound in a roll.
  • the affixing roller 45 affixes the adhesive tape T2 over the upper surfaces of the wafer W carried into the transfer position R and the ring frame f2 newly supplied from the ring frame supply unit 11.
  • the wafer W is transferred to the adhesive tape T2 by the tape applying mechanism 13, and the mount frame MF2 is produced.
  • the tape sticking mechanism 13 corresponds to the transfer mechanism in the present invention.
  • the adhesive tape corresponds to the second adhesive tape in the present invention.
  • the tape cutting mechanism 15 is arranged above the holding table 7 when the holding table 7 is located at the transfer position R, similarly to the tape applying mechanism 13. As shown in FIG. 5, the tape cutting mechanism 15 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.
  • the support shaft 55 is capable of moving up and down along the frame 53, and rotates around an axis in the z direction.
  • a plurality of support arms 57 extend in the radial direction about the support shaft 55.
  • the cutter 59 is provided at the tip of the support arm 57a, and cuts the adhered adhesive tape T2 along the ring frame f.
  • the pressing roller 61 is provided at the tip of the support arm 57b and presses while rolling the tape cutting portion on the ring frame f2.
  • the reversing unit 19 is cantilevered on a lifting platform 65 that can be moved up and down along a vertically fixed vertical rail 63 and a receiving frame 69 that can be rotated around a horizontal support shaft r by a rotary actuator 67.
  • the chuck claws 71 are mounted on the base and the tip of the receiving frame 69 so as to be rotatable around the support shaft s.
  • the reversing unit 19 After receiving the mount frame MF2, the reversing unit 19 reverses the mount frame MF2 so that the adhesive tape T2 is on the lower side of the wafer W and the adhesive tape T1 is on the upper side of the wafer W.
  • the ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 positioned on the upper side of the wafer W with ultraviolet rays. Since the adhesive tape T1 is an ultraviolet curable tape, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the tape peeling mechanism 23 peels and collects the adhesive tape T1 from the wafer W.
  • the mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off.
  • the substrate transfer apparatus 1 further includes a wafer storage unit 91, a wafer transfer mechanism 93, and a wafer alignment unit 95.
  • the wafer storage unit 91 stores the wafers W in a stacked manner.
  • the wafer transfer mechanism 93 transfers the wafer W stored in the wafer storage unit 91 to the wafer alignment unit 95.
  • the wafer alignment unit 95 aligns the transferred wafer W.
  • mount frame MF1 is already manufactured and stored in the mount frame storage portion 3
  • the substrate transfer apparatus 1 uses the wafer W to mount the mount frame MF1. It can also be used as a wafer mount device to be manufactured.
  • FIG. 7A is a flowchart showing the operation of the substrate transfer apparatus 1.
  • FIG. 7B is a diagram showing a schematic configuration of the mount frame MF in each step.
  • the surface where the circuit pattern is formed on the wafer W will be described as the surface.
  • the mounting frame MF1 has an adhesive tape T1 attached to the surface of the wafer W.
  • the adhesive layer of the adhesive tape T1 uses an ultraviolet curable adhesive.
  • Step S1 holding the mount frame
  • the mount frame storage unit 3 stores and stores a mount frame MF1 that is manufactured by adhering the adhesive tape T1 to the surface of the wafer W.
  • the first transport mechanism 5 holds the upper surface of the mount frame MF1 by suction and moves from the position indicated by the dotted line to the position indicated by the solid line as shown in FIG.
  • the first transport mechanism 5 places the mount frame MF1 on the holding table 7 located at the cutting position S with the surface to which the adhesive tape T1 is attached facing down. After placing the mount frame MF1, the first transport mechanism 5 moves to a retracted position (a left position indicated by a dotted line as an example). After the mount frame MF1 is mounted, the frame holding unit 29 sucks and holds the ring frame f1, and the wafer holding unit 31 sucks and holds the wafer W. A series of steps in step S1 corresponds to a holding step in the present invention.
  • Step S2 cutting adhesive tape T1
  • the tape cutting mechanism 9 operates and the cutting of the adhesive tape T1 is started. That is, when the tape cutting mechanism 9 is operated, the cutter unit 39 is lowered to a predetermined height and the cutter 41 is pierced into the adhesive tape T1 as shown in FIG. In this state, the adhesive tape T1 is cut along the outer shape of the wafer W. In this embodiment, since the adhesive tape T1 is cut while the cutter 41 is in contact with the outer diameter of the wafer W, the adhesive tape T1 is cut out to the same size as the wafer W.
  • step S2 corresponds to a tape cutting step in the present invention.
  • Step S3 selection of ring frame f1
  • the frame f1 is collected by the first transport mechanism. That is, the first transport mechanism 5 moves from the retracted position to the cutting position S as shown in FIG. The first transport mechanism 5 descends to a predetermined height above the mount frame MF1, and holds the upper surface of the ring frame f1 by suction. The first transport mechanism 5 holding the ring frame f1 by suction is raised again and moved to the left side to store the ring frame f1 in the mount frame storage unit 3.
  • step S2 since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 in a portion separated from the wafer W) is moved together with the ring frame f1 to the first transport mechanism. 5 is collected.
  • the exposed adhesive tape T1 includes an exposed portion P. Therefore, since the exposed portion P of the adhesive tape T1 is collected along with the ring frame f1, it is possible to avoid exposing the adhesive surface of the adhesive tape T1 on the holding table 7 by the processes of Step S2 and Step S3.
  • the series of steps in step S3 corresponds to the tape collecting step in the present invention.
  • Step S4 supply of ring frame f2
  • the holding table 7 moves from the cutting position S to the transfer position R while holding the wafer W by suction.
  • the frame transport unit F sucks and holds the upper surface of the ring frame f2 stored in the ring frame supply unit 11 and moves to the transfer position R.
  • the frame transport unit F places the ring frame f2 on the ring frame holding unit 29 located at the transfer position R.
  • the frame transport unit F moves to the retracted position after placing the ring frame f2.
  • the frame holding unit 29 sucks and holds the ring frame f2.
  • the supply of the ring frame f2 is completed when the ring frame f2 is sucked and held.
  • Step S5 (Affixing adhesive tape T2) After supplying the ring frame f2 to the wafer W, the tape sticking mechanism 13 is activated to start sticking the adhesive tape T2. That is, when the tape sticking mechanism 13 is operated, the sticking roller 45 is lowered to a predetermined height and rolls from right to left in the figure as shown in FIG. As the sticking roller 45 rolls, the adhesive tape T2 loaded in the tape supply unit 43 is stuck over the upper surfaces of the wafer W and the ring frame f2 (FIG. 12B).
  • step S5 the exposed portion P of the adhesive tape T1 has already been separated from the wafer W and recovered and removed at the time of starting step S5. Therefore, since the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W, it is ensured that the adhesive tape T1 adheres between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 when the adhesive tape T2 is applied. To be avoided.
  • the wafer W is transferred from the adhesive tape T1 to a new adhesive tape T2. That is, a new mount frame MF2 is produced by transfer.
  • a series of steps in step S5 corresponds to a transfer step in the present invention.
  • Step S6 cutting the adhesive tape T2 After adhering the adhesive tape T2 to the wafer W and the ring frame f2, the tape cutting mechanism 15 operates to start cutting the adhesive tape T2. That is, as shown in FIG. 13, when the tape cutting mechanism 15 is operated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 is pierced by the adhesive tape T2. In this state, the support shaft 55 is rotated around the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f2.
  • the part where the adhesive tape T2 is cut on the ring frame f2 is pressed by the rolling pressing roller 61. Thereafter, the peeling roller 49 provided in the tape applying mechanism 13 is rolled from the right to the left in the figure, and the unnecessary adhesive tape T2 left outside the cutting line is peeled from the ring frame f2. The peeled unnecessary adhesive tape T2 is wound and collected by the tape collecting unit 51.
  • Step S7 (mount frame inversion)
  • the mount frame MF2 is transported to the reversing unit 19 by a second transport mechanism (not shown).
  • the reversing unit 19 holds the mount frame MF2 with chuck claws 71 provided on the receiving frame 69, and rotates the receiving frame 69 around the horizontal support shaft r.
  • the mount frame MF2 is inverted from the state where the adhesive tape T2 is set to the upper side to the state where the adhesive tape T1 is set to the upper side.
  • Step S8 (Peeling of adhesive tape T1) After inverting the mount frame MF2, the peeling of the adhesive tape T1 attached to the surface of the wafer W is started.
  • the ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 of the mount frame MF2 with ultraviolet rays. Since the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the mount frame MF2 after being irradiated with ultraviolet rays is transported to the tape peeling mechanism 23 by a third transport mechanism (not shown).
  • the tape peeling mechanism 23 peels and collects the adhesive tape T1 located on the upper surface side of the wafer W from the wafer W (see FIGS. 7B and S8).
  • the mount frame MF2 from which the adhesive tape T1 has been peeled is transported to the mount frame collection unit 25 by a fourth transport mechanism (not shown).
  • the mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off. Through the series of operations described above, transfer is performed from the mount frame MF1 configured by adhering the adhesive tape T1 to the surface of the wafer W to the mount frame MF2 configured by adhering the adhesive tape T2 to the back surface of the wafer W. All steps are completed.
  • the substrate transfer apparatus 1 includes a tape cutting mechanism 9 and a first transport mechanism 5.
  • the tape cutting mechanism 9 cuts the adhesive tape T1 of the mount frame MF1 held on the holding table 7 along the outer shape of the wafer W.
  • the adhesive tape T ⁇ b> 1 that protrudes outward from one surface of the wafer W, that is, the exposed portion P, is separated from the wafer W.
  • the separated exposed portion P is collected by the first transport mechanism 5 together with the ring frame f1 and stored in the mount frame storage portion 3.
  • the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W when the adhesive tape T2 is attached to the other surface of the wafer. Therefore, when the adhesive tape T2 is attached to the ring frame f2 and the wafer W, it is possible to reliably avoid contact between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2. Therefore, the operation of transferring the wafer to a new adhesive tape can be performed with higher accuracy.
  • the adhesive tape T1 is deformed so as to be separated from the adhesive tape T2, or the adhesive tape T1 is exposed as shown in FIG. 14 (b).
  • a method of inserting a non-tacky adhesion preventing material B into the part P has been used.
  • the adhesive tape T1 it is necessary to deform the adhesive tape T1 in the conventional method shown in FIG. For this reason, when a material that is hard and hardly elastically deformed, such as PET (Polyethylene Terephthalate), is used as the adhesive tape T1, it is difficult to apply the conventional method. Moreover, even if the distance between the exposed portion P and the adhesive tape T2 is increased, the exposed portion P is in a state of protruding outside the wafer W, so that it is possible to reliably avoid the adhesion between the exposed portion P and the adhesive tape T2. Have difficulty.
  • PET Polyethylene Terephthalate
  • the adhesive tape T1 is cut along the outer shape of the wafer W to avoid adhesion between the adhesive tapes. That is, in the configuration according to the embodiment, it is not necessary to deform the adhesive tape when transferring the wafer W. Therefore, even if the adhesive tape is a hard material that is difficult to elastically deform, adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided.
  • the substrate transfer apparatus 1 it is not necessary to newly use an adhesion preventing material. Therefore, even when the adhesive force of the adhesive tape is strong, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided while avoiding damage to the wafer W. Therefore, in the substrate transfer apparatus 1 according to the embodiment, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided without being influenced by the characteristics of the adhesive tape such as hardness and adhesive force. Further, in the holding table 7 according to the embodiment, since the wafer holding unit 31 can be made smaller than the diameter of the wafer W, it is possible to avoid an increase in the size of the substrate transfer apparatus 1.
  • the present invention is not limited to the above embodiment, and can be modified as follows.
  • the process according to step S8 is not limited to the configuration using the ultraviolet irradiation mechanism 21. That is, the adhesive tape T1 may be peeled by a method using a peeling adhesive tape and a peeling member without irradiating the mount frame MF2 with ultraviolet rays.
  • the tape peeling mechanism 23 includes a movable base 81 that holds the mount frame MF2 and a guide that guides the roll-off peeling tape Q as shown in FIG. A roller 83, a knife-edge-shaped peeling member 85, and a winding shaft 87 for collecting the peeling tape Q are provided.
  • the peeling tape Q is guided to the peeling member 85 by the guide roller 83, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87. That is, the release tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W with respect to the mount frame MF2 held on the movable table 81. And the movable stand 81 is moved to the middle right of Fig.15 (a) in the state which affixed the peeling tape Q to adhesive tape T1.
  • the peeling tape Q is turned back at the tip of the peeling member 85, so that the adhesive tape T1 is integrated with the peeling tape Q and the surface of the wafer W. Is peeled off.
  • the method using the peeling tape Q as shown in FIG. 15A and the method using the ultraviolet irradiation mechanism 21 may be used in combination.
  • the cut-off portion of the adhesive tape T1 is collected together with the ring frame f1 in step S3.
  • the present invention is not limited to this. That is, a configuration may be adopted in which the cut-out portion of the adhesive tape T1 is peeled off from the ring frame f1, and only the cut-out portion of the adhesive tape T1 is recovered.
  • the adhesive tape T2 can be pasted over the ring frame f1 and the other surface of the wafer W in step S6 without newly using the ring frame f2. Accordingly, since the ring frame f2 and the ring frame supply unit 11 can be omitted, it is possible to avoid an increase in the size of the substrate transfer apparatus 1 and to reduce the cost.
  • the adhesive tape T2 is attached to the upper surface of the ring frame f2 and the wafer W in step S6, but transferred to the adhesive tape T2.
  • the configuration to be performed is not limited to this. That is, the ring frame f2 with the adhesive tape T2 attached in advance may be supplied to the wafer W carried into the transfer position R, and the adhesive tape T2 may be attached to the upper surface of the wafer W.
  • the tape cutting mechanism 9 is configured to use the cutter 41, but may be configured to cut the adhesive tape with a laser instead of the cutter blade.
  • the semiconductor wafer has been described as an example of the substrate.
  • the apparatus can be applied to substrates of various shapes and sizes such as LED substrates and circuit boards.
  • the shape of the adhesive tape T1 cut in the tape cutting step is changed according to the outer shape of the substrate to be applied.
  • the substrate support frame to be used is not limited to the wafer ring frame f, and a square frame or the like corresponding to the shape of the substrate to be used can also be used.
  • a rectangular frame for example, a plurality of rectangular substrates can be bonded and held with an adhesive tape, and dead space can be reduced. As a result, work efficiency can be improved.
  • the transfer source ring frame f and the transfer destination new ring frame f have the same shape.
  • frames having different shapes may be used in combination.
  • a pre-cut type adhesive tape T2 previously cut into a ring frame shape may be attached to the ring frame f2.
  • step S2 the cutter 41 is cut while being in contact with the outer shape of the wafer while being held by the wafer holder 31 smaller than the diameter of the wafer W.
  • the tape cutting process according to step S2 is not limited to the configuration in which such an adhesive tape T1 is cut out to the same size as the wafer W. That is, as shown in FIG. 16A, the adhesive tape T1 may be cut while the cutter 41 is in contact with the outer shape of the wafer holder 31 while being held by the wafer holder 31 larger than the diameter of the wafer W. .
  • the adhesive tape T1 is cut out so as to have a larger size than the diameter of the wafer W in step S2.
  • the size of the cut out adhesive tape T1 is adjusted to a size that can reliably avoid the adhesion between the adhesive tape T1 and the adhesive tape T2 in the transfer process according to step S5.
  • the length k of the portion of the adhesive tape T1 cut out that protrudes outside the wafer W is equal to or less than the thickness G of the wafer W. preferable.
  • the cutter 41 is not brought into contact with either the outer diameter of the wafer W or the outer diameter of the wafer holding unit 31.
  • a configuration in which the adhesive tape T1 is cut out to be slightly wider than the wafer W may be employed.
  • the difference between the radius Tr of the removed adhesive tape T1 and the radius Wr of the wafer W is preferably equal to or less than the thickness G of the wafer W.
  • the adhesive tape T1 is deformed so as to be bent at the end of the wafer W from the position indicated by the dotted line to the position indicated by the solid line in the transfer process. Even if it is a case, it can avoid reliably that adhesive tape T1 and adhesive tape T2 contact. Therefore, adhesion between the pressure-sensitive adhesive tapes in the transfer process can be avoided more reliably, so that the accuracy of transfer to the pressure-sensitive adhesive tape T2 can be further improved.
  • the radius D of the wafer holder 31 is smaller than the radius Tr of the cut adhesive tape T1.
  • the cutter 41 can be cut so as to penetrate the adhesive tape T1, the adhesive tape T1 can be more suitably cut.
  • “cutting the adhesive tape along the outer shape of the wafer” in the tape cutting step means not only the case where the adhesive tape T1 is cut to the same size as the wafer W. The case where the adhesive tape T1 is cut to a size wider than the outer shape of the wafer W to the extent that the adhesion between the adhesive tape T1 and the adhesive tape T2 can be surely avoided in the transfer step is also included.

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Abstract

In this invention, a mounting frame MF1 is held with an adhesive tape T1 placed thereunder, the adhesive tape T1 is cut away by following the external shape of a wafer W, and the cut-away adhesive tape T1 is recovered. The wafer W is supplied with a new ring frame f2, and a new adhesive tape T2 is adhered over the upper surfaces of the wafer W and the ring frame. Since the adhesive tape T1 in the excess portion on the outer side of the wafer W has been separated from the wafer W and recovered, adhesion between the adhesive tape T1 and the adhesive tape T2 during transfer can be avoided with certainty.

Description

基板転写方法および基板転写装置Substrate transfer method and substrate transfer apparatus
　本発明は、粘着テープを介してリングフレームに接着保持した半導体ウエハ、回路基板、ＬＥＤ（Light Emitting Diode）などの各種基板に所望の処理を施した後に、新たな粘着テープに転写し直す基板転写方法および基板転写装置に関する。 The present invention provides a substrate transfer method in which a desired process is applied to various substrates such as semiconductor wafers, circuit boards, and LEDs (Light Emitting Diodes) adhered and held on a ring frame via an adhesive tape, and then transferred to a new adhesive tape. The present invention relates to a method and a substrate transfer apparatus.
　基板として半導体ウエハを例にとると、以下のような処理が施されている。一般的な半導体ウエハ（以下、単に「ウエハ」という）は、その表面に多数の素子の回路パターンを形成された後、その表面に保護テープを貼り付けて保護する。表面が保護されたウエハをバックグラインド工程において裏面から研削あるいは研磨加工して所望の厚さにする。薄型化されたウエハから保護テープを剥離してダイシング工程に搬送する前に、ウエハを補強するために、支持用の粘着テープ（ダイシングテープ）を介してウエハをリングフレームに接着保持する。 Taking a semiconductor wafer as an example of a substrate, the following processing is performed. A general semiconductor wafer (hereinafter simply referred to as a “wafer”) is protected by attaching a protective tape to the surface after circuit patterns of many elements are formed on the surface. The wafer whose surface is protected is ground or polished from the back surface in a back grinding process to a desired thickness. Before the protective tape is peeled from the thinned wafer and conveyed to the dicing process, the wafer is bonded and held to the ring frame via a supporting adhesive tape (dicing tape) in order to reinforce the wafer.
　リングフレームに接着保持されるウエハは、製造する半導体チップに応じて加工工程が異なる。例えば、半導体チップを微細化する場合、レーザダイシング処理を行う。このとき、回路パターンの形成された表面からダイシングすると、熱の影響を受けて回路が破損するので、バックグラインド処理前に裏面からハーフカットを行う必要がある。ハーフカットされたウエハをブレイキングした後に各チップを所望の位置にマウントする際、チップ表面からコレットで吸着して搬送するので、表面の粘着テープおよび保護テープを剥離する。この粘着テープなどの剥離されたウエハの裏面側から粘着テープを貼り直して新たなリングフレームに接着保持した上でウエハをブレイキングする。つまり、ブレイキング前にウエハを新しいリングフレームに転写し直す必要がある。 ¡Wafer bonded and held on the ring frame has different processing steps depending on the semiconductor chip to be manufactured. For example, when a semiconductor chip is miniaturized, a laser dicing process is performed. At this time, if the dicing is performed from the surface on which the circuit pattern is formed, the circuit is damaged due to the influence of heat. Therefore, it is necessary to perform a half cut from the back surface before the back grinding process. When each chip is mounted at a desired position after breaking the half-cut wafer, the adhesive tape and the protective tape on the surface are peeled off because the chip is sucked and transported by the collet from the chip surface. The adhesive tape is re-applied from the back side of the peeled wafer such as the adhesive tape, and bonded and held on a new ring frame, and then the wafer is broken. That is, it is necessary to transfer the wafer again to a new ring frame before breaking.
　当該転写時に、リングフレームとウエハとの間で露出する粘着テープの粘着面と新たに貼り付ける粘着テープの粘着面とが接着しないように、リングフレームとウエハを相対的に離反移動させて粘着テープを弾性変形させることにより厚み方向にギャップを稼いでいる（特許文献１，２を参照）。また、２つの粘着テープ同士が粘着することを回避するための他の従来例として、露出する粘着テープの粘着面同士の間に非粘着性の接着防止板を挿入する方法も用いられている（特許文献３を参照）。
特開２０１１－２９４３４号公報 特開２００７－２２０６９３号公報 特開２０１２－２４４０１３号公報 At the time of the transfer, the ring frame and the wafer are relatively moved apart so that the adhesive surface of the adhesive tape exposed between the ring frame and the wafer does not adhere to the adhesive surface of the adhesive tape to be newly attached. The gap is earned in the thickness direction by elastically deforming (see Patent Documents 1 and 2). In addition, as another conventional example for avoiding adhesion between two adhesive tapes, a method of inserting a non-adhesive adhesion preventing plate between the adhesive surfaces of the exposed adhesive tape is also used ( (See Patent Document 3).
JP 2011-29434 A JP 2007-220893 A JP 2012-244013 A
　しかしながら、上記従来方法では次のような問題がある。 However, the conventional method has the following problems.
　すなわち、使用する粘着テープが柔らかい場合には、従来方法を有効に機能させることできる。しかしながら、ウエハに剛性を持たせるために硬質（例えばＰＥＴ）の粘着テープを利用した場合、弾性変形しづらいので、リングフレームとウエハを相対的に離反移動させようとしてもギャップを十分に稼ぐことができない。つまり、粘着テープ同士の接着を回避しきれないといった問題がある。 That is, when the adhesive tape to be used is soft, the conventional method can function effectively. However, when a hard (for example, PET) adhesive tape is used to give rigidity to the wafer, it is difficult to elastically deform, so that a sufficient gap can be earned even if the ring frame and the wafer are moved relatively apart. Can not. That is, there is a problem that the adhesion between the adhesive tapes cannot be avoided.
　また、接着防止板を粘着面同士の間に挿入する方法については、粘着力が強い粘着テープを用いた場合、接着防止板と粘着テープとを解離させる際に強い力を要する。そのため、接着した状態の粘着テープを分離する際に過度の引っ張り力がウエハに作用するので、ウエハを破損させるといった問題が懸念される。 Also, as to the method of inserting the adhesion preventing plate between the adhesive surfaces, when an adhesive tape having a strong adhesive force is used, a strong force is required to dissociate the adhesion preventing plate and the adhesive tape. Therefore, an excessive tensile force acts on the wafer when separating the adhesive tape in the bonded state, and there is a concern that the wafer may be damaged.
　本発明はこのような事情に鑑みてなされたものであって、新しい粘着テープに基板を精度よく転写することのできる基板転写方法および基板転写装置を提供することを主たる目的とする。 The present invention has been made in view of such circumstances, and a main object of the present invention is to provide a substrate transfer method and a substrate transfer apparatus capable of accurately transferring a substrate to a new adhesive tape.
　この発明は、このような目的を達成するために、次のような構成をとる。
　すなわち、本発明は、支持用の第１の粘着テープを介してリングフレーム内に接着保持された基板を第２の粘着テープに転写する基板転写方法であって、前記第１の粘着テープ側から前記リングフレームおよび前記基板を保持部材で保持する保持工程と、前記保持部材で保持された前記基板の外形に沿って前記第１の粘着テープを切断するテープ切断工程と、切り抜かれた前記第１の粘着テープを回収するテープ回収工程と、前記テープ回収工程の後に、前記基板の非保持面側から前記第２の粘着テープを貼り付けて転写を行う転写工程と、を備えたことを特徴とする。 In order to achieve such an object, the present invention has the following configuration.
That is, the present invention is a substrate transfer method for transferring a substrate adhered and held in a ring frame to a second adhesive tape via a supporting first adhesive tape, from the first adhesive tape side. A holding step of holding the ring frame and the substrate with a holding member, a tape cutting step of cutting the first adhesive tape along the outer shape of the substrate held by the holding member, and the cut out first A tape recovery step for recovering the adhesive tape, and a transfer step for transferring the second adhesive tape from the non-holding surface side of the substrate after the tape recovery step. To do.
　（作用・効果）　この方法によれば、保持された基板の外形に沿って第１の粘着テープを切断し、切り抜かれた第１の粘着テープを回収する。そのため、高度や粘着力などの粘着テープにおける特性に依らず、第１の粘着テープのうち、基板の外径からはみ出して粘着面が露出している部分が回収される。従って、粘着テープの特性に左右されることなく、第１の粘着テープから第２の粘着テープへ転写する際に、第１の粘着テープと第２の粘着テープの粘着面同士が接着することを好適に回避できる。 (Action / Effect) According to this method, the first adhesive tape is cut along the outer shape of the held substrate, and the cut out first adhesive tape is recovered. Therefore, regardless of the characteristics of the adhesive tape such as altitude and adhesive strength, the portion of the first adhesive tape that protrudes from the outer diameter of the substrate and exposes the adhesive surface is recovered. Therefore, the adhesive surfaces of the first adhesive tape and the second adhesive tape are bonded to each other when transferring from the first adhesive tape to the second adhesive tape without being influenced by the characteristics of the adhesive tape. It can avoid suitably.
　なお、上記転写過程において、新しい粘着テープへの基板の転写として、例えば次のように実施することができる。 In the above transfer process, the substrate can be transferred to a new adhesive tape as follows, for example.
　前記テープ切断工程において、前記第１の粘着テープが前記基板の外径からはみ出ている部分の長さは前記基板の厚さ以下となるように、前記第１の粘着テープは切断されることが好ましい。この方法によれば、基板の外径から外側にはみ出している部分がウエハの端で変形した場合であっても、第１の粘着テープと第２の粘着テープとが接触することを確実に回避できる。従って、第１の粘着テープから第２の粘着テープへ転写する際に、第１の粘着テープと第２の粘着テープの粘着面同士が接着することをより確実に回避できるので、転写の精度をより向上できる。 In the tape cutting step, the first adhesive tape may be cut so that a length of a portion of the first adhesive tape protruding from an outer diameter of the substrate is equal to or less than a thickness of the substrate. preferable. According to this method, even when the portion protruding outward from the outer diameter of the substrate is deformed at the edge of the wafer, the contact between the first adhesive tape and the second adhesive tape is surely avoided. it can. Therefore, when transferring from the first pressure-sensitive adhesive tape to the second pressure-sensitive adhesive tape, it is possible to more reliably avoid adhesion of the pressure-sensitive adhesive surfaces of the first pressure-sensitive adhesive tape and the second pressure-sensitive adhesive tape. It can be improved.
　基板の直径より小さい保持部材に前記基板を保持させて、第２の粘着テープに基板を転写してもよい。この方法によれば、テープ切断工程において第１の粘着テープを貫通するように切断できるので、より確実に第１の粘着テープを基板の外形に沿って切断できる。従って、転写工程において第１の粘着テープと第２の粘着テープとが接着することをより確実に回避できる。また、保持部材を小型化することにより、基板転写装置の大型化を回避できる。 The substrate may be transferred to the second adhesive tape by holding the substrate on a holding member smaller than the diameter of the substrate. According to this method, since the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it can avoid more reliably that the 1st adhesive tape and the 2nd adhesive tape adhere in a transfer process. Further, by downsizing the holding member, it is possible to avoid an increase in the size of the substrate transfer apparatus.
　なお、上記転写過程において、新しい粘着テープへの基板の転写として、例えば次のように実施することができる。 In the above transfer process, the substrate can be transferred to a new adhesive tape as follows, for example.
　第１に、テープ切断工程において、カッタ刃を用いて第１の粘着テープを切断してもよい。 First, in the tape cutting step, the first adhesive tape may be cut using a cutter blade.
　第２に、テープ切断工程において、レーザを用いて第１の粘着テープを切断してもよい。 Second, in the tape cutting step, the first adhesive tape may be cut using a laser.
　この方法によれば、第１の粘着テープを好適に基板の外形に沿って切断できるので、転写工程において第１の粘着テープと第２の粘着テープとが接着することをより確実に回避できる。 According to this method, since the first adhesive tape can be suitably cut along the outer shape of the substrate, it is possible to more reliably avoid the adhesion of the first adhesive tape and the second adhesive tape in the transfer process.
　また、テープ回収工程において、リングフレームに接着している状態の切り抜かれた第１の粘着テープをリングフレームとともに回収することが好ましい。 In the tape collecting step, it is preferable to collect the cut-out first adhesive tape that is bonded to the ring frame together with the ring frame.
　この方法によれば、より変形しにくいリングフレームを保持して回収することにより、切り抜かれた第１の粘着テープを回収できる。したがって、切り抜かれた第１の粘着テープをより容易かつ確実に回収することができる。 According to this method, the cut out first adhesive tape can be recovered by holding and recovering the ring frame that is more difficult to deform. Therefore, the cut out first adhesive tape can be collected more easily and reliably.
　また、転写工程において、第２の粘着テープを予め貼り付けた新たなリングフレームを基板に重ね合わせ、基板の非保持面側から第２の粘着テープを貼り付けて転写を行うことが好ましい。 Also, in the transfer step, it is preferable to perform transfer by superimposing a new ring frame on which the second adhesive tape has been applied in advance on the substrate and attaching the second adhesive tape from the non-holding surface side of the substrate.
　この方法によれば、予めリングフレームに第２の粘着テープが貼り付けられているので、基板の転写に工程および時間を短縮できる。そのため、基板の転写効率を向上できる。 According to this method, since the second adhesive tape is affixed to the ring frame in advance, the process and time for transferring the substrate can be shortened. Therefore, the transfer efficiency of the substrate can be improved.
　また、この発明は、このような目的を達成するために、次のような構成をとる。 Also, the present invention has the following configuration in order to achieve such an object.
　すなわち、支持用の第１の粘着テープを介してリングフレーム内に接着保持された基板を第２の粘着テープに転写する基板転写装置であって、
　前記第１の粘着テープを介して前記基板を保持する基板保持部と、
　前記リングフレームを保持するフレーム保持部と、
　前記基板保持部で保持された前記基板の外形に沿って前記第１の粘着テープを切断するテープ切断部と、
　前記テープ切断部によって切り抜かれた前記第１の粘着テープを回収するテープ回収部と、
　前記切り抜かれた前記第１の粘着テープが回収された後、前記基板の非保持面側から前記第２の粘着テープを貼り付けて転写を行う転写機構と、
　を備えたことを特徴とする。 That is, a substrate transfer apparatus for transferring a substrate bonded and held in a ring frame to a second adhesive tape via a supporting first adhesive tape,
A substrate holding part for holding the substrate via the first adhesive tape;
A frame holding unit for holding the ring frame;
A tape cutting unit for cutting the first adhesive tape along the outer shape of the substrate held by the substrate holding unit;
A tape collecting unit for collecting the first adhesive tape cut out by the tape cutting unit;
After the cut out first adhesive tape is collected, a transfer mechanism for attaching and transferring the second adhesive tape from the non-holding surface side of the substrate;
It is provided with.
　（作用・効果）　この構成によれば、上記方法を好適に実施することができる。 (Action / Effect) According to this configuration, the above method can be suitably implemented.
　本発明の基板転写方法および基板転写装置によれば、硬質で弾性変形しづらい粘着テープを介してフレームに基板が接着保持されている場合であっても、新たな粘着テープに基板を転写し直すときに、両粘着テープの粘着面同士が接着するのを精度よく回避することができる。 According to the substrate transfer method and the substrate transfer apparatus of the present invention, even when the substrate is bonded and held to the frame via the adhesive tape that is hard and hardly elastically deformed, the substrate is transferred again to a new adhesive tape. Sometimes, the adhesive surfaces of both adhesive tapes can be accurately avoided.
基板転写装置の基本構成を示す平面図である。It is a top view which shows the basic composition of a board | substrate transfer apparatus. マウントフレームの構成を説明する図である。（ａ）は転写前後におけるマウントフレームの構成を示す断面図であり、（ｂ）はマウントフレームの斜視図である。It is a figure explaining the structure of a mount frame. (A) is sectional drawing which shows the structure of the mount frame before and behind transcription | transfer, (b) is a perspective view of a mount frame. テープ切断機構の正面図である。It is a front view of a tape cutting mechanism. テープ貼り付け機構の平面図である。It is a top view of a tape sticking mechanism. テープ切断機構の正面図である。It is a front view of a tape cutting mechanism. 反転ユニットの正面図である。It is a front view of a reversing unit. 基板転写装置の動作を説明する図である。（ａ）は動作を説明するフローチャートであり、（ｂ）は各ステップにおけるマウントフレームの構成を説明する概略図である。It is a figure explaining operation | movement of a board | substrate transfer apparatus. (A) is a flowchart explaining operation | movement, (b) is the schematic explaining the structure of the mount frame in each step. ステップＳ１におけるマウントフレームの構成を説明する正面図である。It is a front view explaining the structure of the mount frame in step S1. ステップＳ２におけるマウントフレームの構成を説明する正面図である。（ａ）は粘着テープＴ１を切断する時の構成を示す図であり、（ｂ）は粘着テープＴ１を切断した後の構成を示す図である。It is a front view explaining the structure of the mount frame in step S2. (A) is a figure which shows the structure when cut | disconnecting adhesive tape T1, (b) is a figure which shows the structure after cut | disconnecting adhesive tape T1. ステップＳ３におけるマウントフレームの構成を説明する正面図である。It is a front view explaining the structure of the mount frame in step S3. ステップＳ４におけるマウントフレームの構成を説明する正面図である。It is a front view explaining the structure of the mount frame in step S4. ステップＳ５におけるマウントフレームの構成を説明する正面図である。（ａ）は粘着テープＴ２を貼り付ける時の構成を示す図であり、（ｂ）は粘着テープＴ２を貼り付けた後の構成を示す図である。It is a front view explaining the structure of the mount frame in step S5. (A) is a figure which shows the structure at the time of sticking adhesive tape T2, (b) is a figure which shows the structure after sticking adhesive tape T2. ステップＳ６におけるマウントフレームの構成を説明する正面図である。It is a front view explaining the structure of the mount frame in step S6. 従来例に係る転写を行う構成を説明する図である。（ａ）は粘着テープを変形させる構成を示す図であり、（ｂ）は接着防止材を挿入する構成を示す図である。It is a figure explaining the structure which performs the transfer which concerns on a prior art example. (A) is a figure which shows the structure which deform | transforms an adhesive tape, (b) is a figure which shows the structure which inserts an adhesion preventing material. 変形例に係るテープ剥離機構の構成を説明する図である。（ａ）はテープ剥離機構の構成を説明する正面図であり、（ｂ）は粘着テープを剥離する状態を説明する斜視図である。It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification. (A) is a front view explaining the structure of a tape peeling mechanism, (b) is a perspective view explaining the state which peels an adhesive tape. 変形例に係るテープ剥離機構の構成を説明する図である。（ａ）はカッタをウエハ保持部に接触させて粘着テープを切断する構成を説明する正面図であり、（ｂ）はカッタをウエハおよびウエハ保持部に接触させずに粘着テープを切断する状態を説明する正面図であり、（ｃ）ははみ出し部分がウエハの厚さより短い構成の効果を説明する断面図である。It is a figure explaining the structure of the tape peeling mechanism which concerns on a modification. (A) is a front view explaining the structure which makes a cutter contact a wafer holding part, and cut | disconnects an adhesive tape, (b) is the state which cut | disconnects an adhesive tape, without making a cutter contact a wafer and a wafer holding part. It is a front view to explain, (c) is a cross-sectional view for explaining the effect of the configuration in which the protruding portion is shorter than the thickness of the wafer.
　以下、図面を参照して本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
＜全体構成の説明＞
　図１に、本発明に係る基板転写装置１の基本構成の平面図が示されている。 <Description of overall configuration>
FIG. 1 shows a plan view of the basic configuration of a substrate transfer apparatus 1 according to the present invention.
　この基板転写装置１は、図２（ａ）に示すように、半導体ウエハＷ（以下、単に「ウエハＷ」という）の一方の面に粘着テープＴ１が貼付けられたマウントフレームＭＦ１から、当該ウエハＷの他方の面に粘着テープＴ２が貼付けられたマウントフレームＭＦ２へとウエハＷを転写するものである。 As shown in FIG. 2A, the substrate transfer apparatus 1 includes a wafer W from a mount frame MF1 in which an adhesive tape T1 is attached to one surface of a semiconductor wafer W (hereinafter simply referred to as “wafer W”). The wafer W is transferred to a mount frame MF2 having an adhesive tape T2 attached to the other surface.
　マウントフレームＭＦ１は図２（ｂ）に示すように、ウエハＷの一方の面とリングフレームｆとに粘着テープＴ１を貼付けて製作される。マウントフレームＭＦ２はウエハＷの他方の面とリングフレームｆとに粘着テープＴ２を貼り付けて製作される。なお本実施例において、マウントフレームＭＦ１におけるリングフレームｆには符号ｆ１を付し、マウントフレームＭＦ２におけるリングフレームｆには符号ｆ２を付して両者を区別する。 As shown in FIG. 2B, the mount frame MF1 is manufactured by sticking an adhesive tape T1 to one surface of the wafer W and the ring frame f. The mount frame MF2 is manufactured by attaching an adhesive tape T2 to the other surface of the wafer W and the ring frame f. In this embodiment, the ring frame f in the mount frame MF1 is denoted by reference numeral f1, and the ring frame f in the mount frame MF2 is denoted by reference numeral f2 to distinguish between them.
　なお、本実施例で使用されている粘着テープＴ１および粘着テープＴ２は、ウエハＷに剛性を持たせるために、ＰＥＴ（Polyethylene Terephthalate）を主原料とするテープが用いるものとする。但し、粘着テープＴ１および粘着テープＴ２の材料としてはＰＥＴに限定されるものではなく、他の公知の材料を用いてよい。 Note that the adhesive tape T1 and the adhesive tape T2 used in this embodiment are made of a tape mainly made of PET (Polyethylene Terephthalate) in order to give the wafer W rigidity. However, the material of the adhesive tape T1 and the adhesive tape T2 is not limited to PET, and other known materials may be used.
　本発明に係る基板転写装置１は図１に示すように、マウントフレーム収納部３と、第１搬送機構５と、保持テーブル７と、テープ切断機構９と、リングフレーム供給部１１と、テープ貼付機構１３と、テープ切断機構１５と、反転ユニット１９と、紫外線照射機構２１と、テープ剥離機構２３と、マウントフレーム回収部２５とを備えている。なお、以後の説明において、図１におけるｘ方向を左右方向、ｚ方向を上下方向とする。ｙ方向については図１の下側を「手前側」とし、図１の上側を「奥側」とする。すなわち、マウントフレーム回収部２５は、図１に示す基板転写装置１においてマウントフレーム収納部３より奥側に配置されている。 As shown in FIG. 1, the substrate transfer apparatus 1 according to the present invention includes a mount frame storage unit 3, a first transport mechanism 5, a holding table 7, a tape cutting mechanism 9, a ring frame supply unit 11, and a tape application. A mechanism 13, a tape cutting mechanism 15, a reversing unit 19, an ultraviolet irradiation mechanism 21, a tape peeling mechanism 23, and a mount frame collection unit 25 are provided. In the following description, the x direction in FIG. 1 is the left-right direction and the z direction is the up-down direction. For the y direction, the lower side of FIG. 1 is referred to as “front side”, and the upper side of FIG. That is, the mount frame collection unit 25 is disposed on the back side of the mount frame storage unit 3 in the substrate transfer apparatus 1 shown in FIG.
　マウントフレーム収納部３は、ウエハＷの一方の面とリングフレームｆ１とに粘着テープＴ１を貼付けて製作されるマウントフレームＭＦ１を収納する、図示しない収納部が配備されている。この収納部は、装置フレームに連結固定された縦レールと、この縦レールに沿ってモータでネジ送り昇降される昇降台が備えられている。したがって、マウントフレーム収納部３は、マウントフレームＭＦを昇降台に載置してピッチ送り昇降するよう構成されている。また、リングフレーム供給部１１およびマウントフレーム回収部２５もマウントフレーム供給部３と同様の構成になっている。 The mount frame storage unit 3 is provided with a storage unit (not shown) that stores a mount frame MF1 manufactured by attaching an adhesive tape T1 to one surface of the wafer W and the ring frame f1. The storage unit includes a vertical rail connected and fixed to the apparatus frame, and a lifting platform that is screwed up and down by a motor along the vertical rail. Therefore, the mount frame storage unit 3 is configured to place the mount frame MF on the lifting platform and move it up and down by pitch feed. In addition, the ring frame supply unit 11 and the mount frame collection unit 25 have the same configuration as the mount frame supply unit 3.
　第１搬送機構５は、マウントフレーム収納部３に収納されているマウントフレームＭＦ１を、切断位置Ｓに配置されている保持テーブル７へと搬送する。また、第１搬送機構５は後述するように、テープ切断機構９によって粘着テープＴ１が切り抜かれ、ウエハＷから分離したリングフレームｆ１をマウントフレーム収納部３に搬送する機能も有する。すなわちウエハＷから分離したリングフレームｆ１および粘着テープＴ１は、第１搬送機構５によってマウントフレーム収納部３に回収される。第１搬送機構５は、本発明におけるテープ回収部に相当する。粘着テープＴ１は、本発明における第１の粘着テープに相当する。 The first transport mechanism 5 transports the mount frame MF1 stored in the mount frame storage unit 3 to the holding table 7 disposed at the cutting position S. Further, as will be described later, the first transport mechanism 5 also has a function of transporting the ring frame f1 separated from the wafer W to the mount frame storage unit 3 after the adhesive tape T1 is cut out by the tape cutting mechanism 9. That is, the ring frame f1 and the adhesive tape T1 separated from the wafer W are collected in the mount frame storage unit 3 by the first transport mechanism 5. The first transport mechanism 5 corresponds to the tape collecting unit in the present invention. The adhesive tape T1 corresponds to the first adhesive tape in the present invention.
　保持テーブル７はマウントフレームＭＦ１を載置保持するものであり、図１に示されている切断位置Ｓと転写位置Ｒとの間を往復移動することが可能となるように構成されている。保持テーブル７は図３ないし図５に示すように、リングフレームｆを保持する環状のフレーム保持部２９と、ウエハＷを保持する円形のウエハ保持部３１を備えている。ウエハ保持部３１は、本発明における基板保持部に相当する。フレーム保持部２９は、本発明におけるフレーム保持部に相当する。 The holding table 7 mounts and holds the mount frame MF1, and is configured to be able to reciprocate between the cutting position S and the transfer position R shown in FIG. As shown in FIGS. 3 to 5, the holding table 7 includes an annular frame holding portion 29 that holds the ring frame f and a circular wafer holding portion 31 that holds the wafer W. The wafer holder 31 corresponds to the substrate holder in the present invention. The frame holding unit 29 corresponds to the frame holding unit in the present invention.
　フレーム保持部２９の保持面には、リングフレームｆを吸着保持する吸着孔が形成されている。ウエハ保持部３１の保持面には、ウエハＷを吸着保持する吸着孔が形成されている。粘着テープＴ１の切断をより好適に実行するという観点から、ウエハ保持部３１の径はウエハＷの直径以下であることが好ましい。 An adsorption hole for adsorbing and holding the ring frame f is formed on the holding surface of the frame holding unit 29. A suction hole for sucking and holding the wafer W is formed on the holding surface of the wafer holder 31. From the viewpoint of more suitably performing the cutting of the adhesive tape T1, it is preferable that the diameter of the wafer holder 31 is equal to or less than the diameter of the wafer W.
　テープ切断機構９は図３に示すように、切断位置Ｓに保持テーブル７が位置する場合において、保持テーブル７の上方に配置されており、フレーム３３と、可動台３５と、支持アーム３７と、カッタユニット３９とを備えている。可動台３５は、フレーム３３に沿って昇降移動を可能とする。支持アーム３７は、可動台３５から片持ち支持されたアームの先端下部に設けられており、ウエハＷの径方向に伸縮するように構成されている。 As shown in FIG. 3, when the holding table 7 is located at the cutting position S, the tape cutting mechanism 9 is disposed above the holding table 7, and includes a frame 33, a movable table 35, a support arm 37, And a cutter unit 39. The movable table 35 can be moved up and down along the frame 33. The support arm 37 is provided at the lower end of the arm that is cantilevered from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.
　カッタユニット３９は支持アーム３７を介して可動台３５に接続されている。カッタユニット３９には、刃先を下向きにしたカッタ４１がカッタホルダを介して装着されている。カッタユニット３９は、支持アーム３７を介して旋回半径を調整可能となるように構成されている。カッタ４１は、マウントフレームＭＦ１に貼付けられている粘着テープＴ１を、ウエハＷの外形に沿って切断する。テープ切断機構９は、本発明におけるテープ切断部に相当する。リングフレーム供給部１１は、新たなリングフレームｆ２を転写位置Ｒへ搬送するフレーム搬送部Ｆを備えている。 The cutter unit 39 is connected to the movable table 35 via the support arm 37. The cutter unit 39 is mounted with a cutter 41 with a cutting edge facing downward via a cutter holder. The cutter unit 39 is configured so that the turning radius can be adjusted via the support arm 37. The cutter 41 cuts the adhesive tape T1 attached to the mount frame MF1 along the outer shape of the wafer W. The tape cutting mechanism 9 corresponds to a tape cutting unit in the present invention. The ring frame supply unit 11 includes a frame transport unit F that transports a new ring frame f2 to the transfer position R.
　テープ貼付機構１３は図４に示すように、転写位置Ｒに保持テーブル７が位置する場合において、保持テーブル７の上方に配置されており、テープ供給部４３と、貼付ローラ４５と、剥離ローラ４９と、テープ回収部５１とを備えている。テープ供給部４３は、ロール巻きした幅広の粘着テープＴ２を装填する。貼付ローラ４５は、転写位置Ｒに搬入されているウエハＷと、リングフレーム供給部１１から新たに供給されたリングフレームｆ２との上面にわたって、粘着テープＴ２を貼付ける。 As shown in FIG. 4, when the holding table 7 is located at the transfer position R, the tape applying mechanism 13 is disposed above the holding table 7, and includes a tape supply unit 43, an applying roller 45, and a peeling roller 49. And a tape recovery unit 51. The tape supply unit 43 is loaded with a wide adhesive tape T2 wound in a roll. The affixing roller 45 affixes the adhesive tape T2 over the upper surfaces of the wafer W carried into the transfer position R and the ring frame f2 newly supplied from the ring frame supply unit 11.
　テープ貼付機構１３によってウエハＷは粘着テープＴ２に転写され、マウントフレームＭＦ２が作製される。テープ貼付機構１３は、本発明における転写機構に相当する。粘着テープは、本発明における第２の粘着テープに相当する。 The wafer W is transferred to the adhesive tape T2 by the tape applying mechanism 13, and the mount frame MF2 is produced. The tape sticking mechanism 13 corresponds to the transfer mechanism in the present invention. The adhesive tape corresponds to the second adhesive tape in the present invention.
　テープ切断機構１５はテープ貼付機構１３と同様に、転写位置Ｒに保持テーブル７が位置する場合において、保持テーブル７の上方に配置されている。テープ切断機構１５は図５に示すように、フレーム５３と、支軸５５と、支持アーム５７と、カッタ５９と、押圧ローラ６１とを備えている。 The tape cutting mechanism 15 is arranged above the holding table 7 when the holding table 7 is located at the transfer position R, similarly to the tape applying mechanism 13. As shown in FIG. 5, the tape cutting mechanism 15 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.
　支軸５５は、フレーム５３に沿って昇降移動を可能としており、ｚ方向の軸回りに回転する。支持アーム５７は、支軸５５を中心に径方向に複数本延伸している。カッタ５９は支持アーム５７ａの先端に設けられており、貼付けられた粘着テープＴ２をリングフレームｆに沿って切断する。押圧ローラ６１は支持アーム５７ｂの先端に設けられており、リングフレームｆ２上のテープ切断部位を転動しながら押圧する。 The support shaft 55 is capable of moving up and down along the frame 53, and rotates around an axis in the z direction. A plurality of support arms 57 extend in the radial direction about the support shaft 55. The cutter 59 is provided at the tip of the support arm 57a, and cuts the adhered adhesive tape T2 along the ring frame f. The pressing roller 61 is provided at the tip of the support arm 57b and presses while rolling the tape cutting portion on the ring frame f2.
　反転ユニット１９は図６に示すように、立設固定された縦レール６３に沿って昇降可能な昇降台６５に、回転アクチュエータ６７によって水平支軸ｒ周りに回動可能な受け枠６９が片持ち状に装着されるとともに、受け枠６９の基部と先端部にチャック爪７１がそれぞれ支軸ｓ周りに回動可能に装備されている。 As shown in FIG. 6, the reversing unit 19 is cantilevered on a lifting platform 65 that can be moved up and down along a vertically fixed vertical rail 63 and a receiving frame 69 that can be rotated around a horizontal support shaft r by a rotary actuator 67. The chuck claws 71 are mounted on the base and the tip of the receiving frame 69 so as to be rotatable around the support shaft s.
　反転ユニット１９は、マウントフレームＭＦ２を受け取った後、粘着テープＴ２がウエハＷの下側となり、粘着テープＴ１がウエハＷの上側となるようにマウントフレームＭＦ２を反転させる。紫外線照射機構２１は、ウエハＷの上側に位置する粘着テープＴ１に対して紫外線を照射する。粘着テープＴ１は紫外線硬化性のテープであるので、紫外線照射によって粘着テープＴ１の粘着力は低下する。テープ剥離機構２３は、粘着テープＴ１をウエハＷから剥離して回収する。マウントフレーム回収部２５は、粘着テープＴ１が剥離されたマウントフレームＭＦ２を回収・収納する。 After receiving the mount frame MF2, the reversing unit 19 reverses the mount frame MF2 so that the adhesive tape T2 is on the lower side of the wafer W and the adhesive tape T1 is on the upper side of the wafer W. The ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 positioned on the upper side of the wafer W with ultraviolet rays. Since the adhesive tape T1 is an ultraviolet curable tape, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays. The tape peeling mechanism 23 peels and collects the adhesive tape T1 from the wafer W. The mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off.
　また、基板転写装置１は図１に示すように、さらにウエハ収納部９１と、ウエハ搬送機構９３と、ウエハアライメント部９５とを備えている。ウエハ収納部９１はウエハＷを積層収納する。ウエハ搬送機構９３はウエハ収納部９１に収納されているウエハＷをウエハアライメント部９５へ搬送する。ウエハアライメント部９５は、搬送されたウエハＷの位置合わせを行う。 Further, as shown in FIG. 1, the substrate transfer apparatus 1 further includes a wafer storage unit 91, a wafer transfer mechanism 93, and a wafer alignment unit 95. The wafer storage unit 91 stores the wafers W in a stacked manner. The wafer transfer mechanism 93 transfers the wafer W stored in the wafer storage unit 91 to the wafer alignment unit 95. The wafer alignment unit 95 aligns the transferred wafer W.
　これらの構成はウエハＷとリングフレームの一方の面にわたって粘着テープを貼り付けてマウントフレームを作製するために用いられる。本実施例では既にマウントフレームＭＦ１が作製されてマウントフレーム収納部３に収納されている場合を例にとって説明するが、本実施例に係る基板転写装置１は、ウエハＷを用いてマウントフレームＭＦ１を作製する、ウエハマウント装置としても用いることができる。 These configurations are used for producing a mount frame by attaching an adhesive tape over one surface of the wafer W and the ring frame. In this embodiment, the case where the mount frame MF1 is already manufactured and stored in the mount frame storage portion 3 will be described as an example. However, the substrate transfer apparatus 1 according to this embodiment uses the wafer W to mount the mount frame MF1. It can also be used as a wafer mount device to be manufactured.
＜動作の説明＞
　次に、実施例に係る基板転写装置１を用いて、所望の処理が施されたマウントフレームＭＦ１から、新しいマウントフレームＭＦ２にウエハＷを転写する動作について説明する。図７（ａ）は基板転写装置１の動作を示すフローチャートである。図７（ｂ）は各ステップにおけるマウントフレームＭＦの概略構成を示す図である。 <Description of operation>
Next, an operation of transferring the wafer W from the mount frame MF1 subjected to a desired process to the new mount frame MF2 using the substrate transfer apparatus 1 according to the embodiment will be described. FIG. 7A is a flowchart showing the operation of the substrate transfer apparatus 1. FIG. 7B is a diagram showing a schematic configuration of the mount frame MF in each step.
　なお、ウエハＷにおいて回路パターンが形成されている面を表面として説明する。また本実施例において、マウントフレームＭＦ１はウエハＷの表面に粘着テープＴ１が貼り付けられているものとする。さらに本実施例において、粘着テープＴ１の粘着層は、紫外線硬化性の粘着剤を用いるものとする。 In addition, the surface where the circuit pattern is formed on the wafer W will be described as the surface. In this embodiment, it is assumed that the mounting frame MF1 has an adhesive tape T1 attached to the surface of the wafer W. Furthermore, in this embodiment, the adhesive layer of the adhesive tape T1 uses an ultraviolet curable adhesive.
　ステップＳ１（マウントフレームの保持）
　マウントフレーム収納部３には、粘着テープＴ１がウエハＷの表面に貼り付けられて作製されるマウントフレームＭＦ１が積層収納されている。第１搬送機構５はマウントフレームＭＦ１の上面を吸着保持して、図８に示すように、点線で示す位置から実線で示す位置へと移動する。 Step S1 (holding the mount frame)
The mount frame storage unit 3 stores and stores a mount frame MF1 that is manufactured by adhering the adhesive tape T1 to the surface of the wafer W. The first transport mechanism 5 holds the upper surface of the mount frame MF1 by suction and moves from the position indicated by the dotted line to the position indicated by the solid line as shown in FIG.
　そして第１搬送機構５は、粘着テープＴ１が貼付されている面を下側にして、切断位置Ｓに位置している保持テーブル７にマウントフレームＭＦ１を載置する。第１搬送機構５はマウントフレームＭＦ１を載置した後、待避位置（一例として点線で示す左側の位置）に移動する。マウントフレームＭＦ１が載置された後、フレーム保持部２９はリングフレームｆ１を吸着保持し、ウエハ保持部３１はウエハＷを吸着保持する。ステップＳ１における一連の工程は、本発明における保持工程に相当する。 Then, the first transport mechanism 5 places the mount frame MF1 on the holding table 7 located at the cutting position S with the surface to which the adhesive tape T1 is attached facing down. After placing the mount frame MF1, the first transport mechanism 5 moves to a retracted position (a left position indicated by a dotted line as an example). After the mount frame MF1 is mounted, the frame holding unit 29 sucks and holds the ring frame f1, and the wafer holding unit 31 sucks and holds the wafer W. A series of steps in step S1 corresponds to a holding step in the present invention.
　ステップＳ２（粘着テープＴ１の切断）
　マウントフレームＭＦ１が吸着保持された後、テープ切断機構９が作動し、粘着テープＴ１の切断が開始される。すなわちテープ切断機構９が作動することによって、図９（ａ）に示すように、カッタユニット３９が所定の高さまで下降してカッタ４１が粘着テープＴ１に突き刺される。その状態で、ウエハＷの外形に沿って粘着テープＴ１を切断する。本実施例では、カッタ４１をウエハＷの外径に接触させながら粘着テープＴ１を切断しているので、粘着テープＴ１はウエハＷと同一の大きさに切り抜かれる。 Step S2 (cutting adhesive tape T1)
After the mount frame MF1 is sucked and held, the tape cutting mechanism 9 operates and the cutting of the adhesive tape T1 is started. That is, when the tape cutting mechanism 9 is operated, the cutter unit 39 is lowered to a predetermined height and the cutter 41 is pierced into the adhesive tape T1 as shown in FIG. In this state, the adhesive tape T1 is cut along the outer shape of the wafer W. In this embodiment, since the adhesive tape T1 is cut while the cutter 41 is in contact with the outer diameter of the wafer W, the adhesive tape T1 is cut out to the same size as the wafer W.
　粘着テープＴ１の切断が完了すると、カッタユニット３９は上昇して点線で示す待機位置に戻る。粘着テープＴ１をウエハＷの外形に沿って切断することにより、図９（ｂ）に示すように、粘着テープＴ１のうち粘着面が露出している部分（露出部Ｐ）がウエハＷから分離される。ステップＳ２における一連の工程は、本発明におけるテープ切断工程に相当する。 When the cutting of the adhesive tape T1 is completed, the cutter unit 39 rises and returns to the standby position indicated by the dotted line. By cutting the adhesive tape T1 along the outer shape of the wafer W, as shown in FIG. 9B, the portion of the adhesive tape T1 where the adhesive surface is exposed (exposed portion P) is separated from the wafer W. The A series of steps in step S2 corresponds to a tape cutting step in the present invention.
　ステップＳ３（リングフレームｆ１の回収）
　粘着テープＴ１の切断が完了した後、第１搬送機構によるフレームｆ１の回収を行う。すなわち、第１搬送機構５は図１０に示すように、待避位置から切断位置Ｓへ移動する。そして第１搬送機構５はマウントフレームＭＦ１の上方において、所定の高さまで下降してリングフレームｆ１の上面を吸着保持する。リングフレームｆ１を吸着保持した第１搬送機構５は再度上昇し、左側へ移動してリングフレームｆ１をマウントフレーム収納部３に収納させる。 Step S3 (collection of ring frame f1)
After the cutting of the adhesive tape T1 is completed, the frame f1 is collected by the first transport mechanism. That is, the first transport mechanism 5 moves from the retracted position to the cutting position S as shown in FIG. The first transport mechanism 5 descends to a predetermined height above the mount frame MF1, and holds the upper surface of the ring frame f1 by suction. The first transport mechanism 5 holding the ring frame f1 by suction is raised again and moved to the left side to store the ring frame f1 in the mount frame storage unit 3.
　ステップＳ２において、粘着テープＴ１はウエハＷの外形に沿って切断されているので、切り抜かれた粘着テープＴ１（ウエハＷから分離された部分の粘着テープＴ１）は、リングフレームｆ１とともに第１搬送機構５によって回収される。切り抜かれた粘着テープＴ１には露出部Ｐが含まれている。従って、粘着テープＴ１の露出部Ｐはリングフレームｆ１に伴って回収されるので、ステップＳ２およびステップＳ３の工程により、保持テーブル７の上で粘着テープＴ１の粘着面が露出することを回避できる。ステップＳ３における一連の工程は、本発明におけるテープ回収工程に相当する。 In step S2, since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 in a portion separated from the wafer W) is moved together with the ring frame f1 to the first transport mechanism. 5 is collected. The exposed adhesive tape T1 includes an exposed portion P. Therefore, since the exposed portion P of the adhesive tape T1 is collected along with the ring frame f1, it is possible to avoid exposing the adhesive surface of the adhesive tape T1 on the holding table 7 by the processes of Step S2 and Step S3. The series of steps in step S3 corresponds to the tape collecting step in the present invention.
　ステップＳ４（リングフレームｆ２の供給）
　リングフレームｆ１および切り抜かれた粘着テープＴ１の回収を完了した後、新しいリングフレームｆ２の供給を行う。すなわち保持テーブル７はウエハＷを吸着保持した状態で、切断位置Ｓから転写位置Ｒへと移動する。フレーム搬送部Ｆは、リングフレーム供給部１１に収納されているリングフレームｆ２の上面を吸着保持し、転写位置Ｒへと移動する。 Step S4 (supply of ring frame f2)
After the collection of the ring frame f1 and the cut adhesive tape T1 is completed, a new ring frame f2 is supplied. In other words, the holding table 7 moves from the cutting position S to the transfer position R while holding the wafer W by suction. The frame transport unit F sucks and holds the upper surface of the ring frame f2 stored in the ring frame supply unit 11 and moves to the transfer position R.
　そしてフレーム搬送部Ｆは、転写位置Ｒに位置しているリングフレーム保持部２９にリングフレームｆ２を載置する。フレーム搬送部Ｆはリングフレームｆ２を載置した後、待避位置へ移動する。リングフレームｆ２が載置された後、フレーム保持部２９はリングフレームｆ２を吸着保持する。リングフレームｆ２が吸着保持されることにより、リングフレームｆ２の供給は完了する。 The frame transport unit F places the ring frame f2 on the ring frame holding unit 29 located at the transfer position R. The frame transport unit F moves to the retracted position after placing the ring frame f2. After the ring frame f2 is placed, the frame holding unit 29 sucks and holds the ring frame f2. The supply of the ring frame f2 is completed when the ring frame f2 is sucked and held.
　ステップＳ５（粘着テープＴ２の貼付け）
　ウエハＷにリングフレームｆ２を供給した後、テープ貼付機構１３が作動し、粘着テープＴ２の貼付けを開始する。すなわちテープ貼付機構１３が作動することによって、図１２（ａ）に示すように、貼付ローラ４５が所定の高さまで下降して図における右から左へ転動する。貼付ローラ４５が転動することによって、テープ供給部４３に装填されている粘着テープＴ２は、ウエハＷおよびリングフレームｆ２の上面にわたって貼付けられる（図１２（ｂ））。 Step S5 (Affixing adhesive tape T2)
After supplying the ring frame f2 to the wafer W, the tape sticking mechanism 13 is activated to start sticking the adhesive tape T2. That is, when the tape sticking mechanism 13 is operated, the sticking roller 45 is lowered to a predetermined height and rolls from right to left in the figure as shown in FIG. As the sticking roller 45 rolls, the adhesive tape T2 loaded in the tape supply unit 43 is stuck over the upper surfaces of the wafer W and the ring frame f2 (FIG. 12B).
　なお、ステップＳ５を開始する時点において、粘着テープＴ１の露出部Ｐは既にウエハＷから分離され、回収除去されている。そのため、粘着テープＴ１は粘着面がウエハＷの外側にはみ出ていないので、粘着テープＴ２を貼付ける際に、粘着テープＴ１の粘着面と粘着テープＴ２の粘着面との間で接着することを確実に回避される。粘着テープＴ２が貼付けられることにより、ウエハＷは粘着テープＴ１から新しい粘着テープＴ２へ転写される。すなわち転写によって新たなマウントフレームＭＦ２が作製される。ステップＳ５における一連の工程は、本発明における転写工程に相当する。 It should be noted that the exposed portion P of the adhesive tape T1 has already been separated from the wafer W and recovered and removed at the time of starting step S5. Therefore, since the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W, it is ensured that the adhesive tape T1 adheres between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2 when the adhesive tape T2 is applied. To be avoided. By sticking the adhesive tape T2, the wafer W is transferred from the adhesive tape T1 to a new adhesive tape T2. That is, a new mount frame MF2 is produced by transfer. A series of steps in step S5 corresponds to a transfer step in the present invention.
　ステップＳ６（粘着テープＴ２の切断）
　ウエハＷおよびリングフレームｆ２に粘着テープＴ２を貼付けた後、テープ切断機構１５が作動し、粘着テープＴ２の切断が開始される。すなわち図１３に示すように、テープ切断機構１５が作動することによって、支軸５５は所定の高さまで下降し、カッタ５９が粘着テープＴ２に突き刺される。この状態で支軸５５をｚ方向の軸回りに回転させ、粘着テープＴ２をリングフレームｆ２に沿って円形に切断する。 Step S6 (cutting the adhesive tape T2)
After adhering the adhesive tape T2 to the wafer W and the ring frame f2, the tape cutting mechanism 15 operates to start cutting the adhesive tape T2. That is, as shown in FIG. 13, when the tape cutting mechanism 15 is operated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 is pierced by the adhesive tape T2. In this state, the support shaft 55 is rotated around the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f2.
　リングフレームｆ２上で粘着テープＴ２が切断された部位は、転動する押圧ローラ６１によって押圧される。その後、テープ貼付機構１３に設けられている剥離ローラ４９を図の右から左に転動させて、切断線の外側に残された不要な粘着テープＴ２をリングフレームｆ２から剥離する。剥離された不要な粘着テープＴ２は、テープ回収部５１によって巻き取り回収される。 The part where the adhesive tape T2 is cut on the ring frame f2 is pressed by the rolling pressing roller 61. Thereafter, the peeling roller 49 provided in the tape applying mechanism 13 is rolled from the right to the left in the figure, and the unnecessary adhesive tape T2 left outside the cutting line is peeled from the ring frame f2. The peeled unnecessary adhesive tape T2 is wound and collected by the tape collecting unit 51.
　ステップＳ７（マウントフレームの反転）
　粘着テープＴ２の貼付けおよび切断が完了した後、マウントフレームＭＦ２は図示しない第２搬送機構によって、反転ユニット１９へ搬送される。反転ユニット１９は受け枠６９に設けられているチャック爪７１でマウントフレームＭＦ２を保持し、受け枠６９を水平支軸ｒ周りに回動する。受け枠６９の回動によって、マウントフレームＭＦ２は粘着テープＴ２を上側にした状態から、粘着テープＴ１を上側にした状態へ反転する。 Step S7 (mount frame inversion)
After the attachment and cutting of the adhesive tape T2 are completed, the mount frame MF2 is transported to the reversing unit 19 by a second transport mechanism (not shown). The reversing unit 19 holds the mount frame MF2 with chuck claws 71 provided on the receiving frame 69, and rotates the receiving frame 69 around the horizontal support shaft r. By the rotation of the receiving frame 69, the mount frame MF2 is inverted from the state where the adhesive tape T2 is set to the upper side to the state where the adhesive tape T1 is set to the upper side.
　ステップＳ８（粘着テープＴ１の剥離）
　マウントフレームＭＦ２を反転させた後、ウエハＷの表面に貼付けられている粘着テープＴ１の剥離を開始する。紫外線照射機構２１は、マウントフレームＭＦ２の粘着テープＴ１に対して紫外線を照射する。粘着テープＴ１の接着層は紫外線硬化性の粘着剤で構成されるので、紫外線の照射によって粘着テープＴ１の粘着力は低減する。 Step S8 (Peeling of adhesive tape T1)
After inverting the mount frame MF2, the peeling of the adhesive tape T1 attached to the surface of the wafer W is started. The ultraviolet irradiation mechanism 21 irradiates the adhesive tape T1 of the mount frame MF2 with ultraviolet rays. Since the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
　紫外線が照射された後のマウントフレームＭＦ２は、図示しない第３搬送機構によってテープ剥離機構２３へ搬送される。テープ剥離機構２３は、ウエハＷの上面側に位置する粘着テープＴ１をウエハＷから剥離して回収する（図７（ｂ）、Ｓ８を参照）。粘着テープＴ１が剥離された後のマウントフレームＭＦ２は、図示しない第４搬送機構によってマウントフレーム回収部２５へ搬送される。 The mount frame MF2 after being irradiated with ultraviolet rays is transported to the tape peeling mechanism 23 by a third transport mechanism (not shown). The tape peeling mechanism 23 peels and collects the adhesive tape T1 located on the upper surface side of the wafer W from the wafer W (see FIGS. 7B and S8). The mount frame MF2 from which the adhesive tape T1 has been peeled is transported to the mount frame collection unit 25 by a fourth transport mechanism (not shown).
　マウントフレーム回収部２５は、粘着テープＴ１が剥離されたマウントフレームＭＦ２を回収・収納する。以上の一連の動作により、ウエハＷの表面に粘着テープＴ１が貼り付けられて構成されるマウントフレームＭＦ１から、ウエハＷの裏面に粘着テープＴ２が貼り付けられて構成されるマウントフレームＭＦ２へ転写させる工程が全て完了する。 The mount frame collection unit 25 collects and stores the mount frame MF2 from which the adhesive tape T1 has been peeled off. Through the series of operations described above, transfer is performed from the mount frame MF1 configured by adhering the adhesive tape T1 to the surface of the wafer W to the mount frame MF2 configured by adhering the adhesive tape T2 to the back surface of the wafer W. All steps are completed.
　以上で一巡の基本動作が終了し、以後同じ動作が繰り返される。 This completes the basic operation of the circuit, and the same operation is repeated thereafter.
　＜実施例の構成による効果＞
　実施例に係る基板転写装置１は、テープ切断機構９と第１搬送機構５とを備えている。テープ切断機構９は、保持テーブル７に保持されているマウントフレームＭＦ１の粘着テープＴ１を、ウエハＷの外形に沿って切断する。ウエハＷの外形に沿って粘着テープＴ１を切断することにより、ウエハＷの一方の面から外側にはみ出ている粘着テープＴ１すなわち露出部Ｐは、ウエハＷから分離される。そして分離された露出部Ｐはリングフレームｆ１とともに第１搬送機構５によって回収され、マウントフレーム収納部３へ収納される。 <Effects of Configuration of Example>
The substrate transfer apparatus 1 according to the embodiment includes a tape cutting mechanism 9 and a first transport mechanism 5. The tape cutting mechanism 9 cuts the adhesive tape T1 of the mount frame MF1 held on the holding table 7 along the outer shape of the wafer W. By cutting the adhesive tape T <b> 1 along the outer shape of the wafer W, the adhesive tape T <b> 1 that protrudes outward from one surface of the wafer W, that is, the exposed portion P, is separated from the wafer W. The separated exposed portion P is collected by the first transport mechanism 5 together with the ring frame f1 and stored in the mount frame storage portion 3.
　粘着テープＴ１の露出部ＰがウエハＷから分離されているので、ウエハの他方の面に粘着テープＴ２を貼り付ける際に、粘着テープＴ１の粘着面がウエハＷの外側にはみ出ることがない。従って、粘着テープＴ２をリングフレームｆ２およびウエハＷへ貼り付ける際に、粘着テープＴ１の粘着面と粘着テープＴ２の粘着面とが接触することを確実に回避できる。従って、よりウエハを新しい粘着テープへ転写させる操作を、より高い精度で行うことが可能となる。 Since the exposed portion P of the adhesive tape T1 is separated from the wafer W, the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W when the adhesive tape T2 is attached to the other surface of the wafer. Therefore, when the adhesive tape T2 is attached to the ring frame f2 and the wafer W, it is possible to reliably avoid contact between the adhesive surface of the adhesive tape T1 and the adhesive surface of the adhesive tape T2. Therefore, the operation of transferring the wafer to a new adhesive tape can be performed with higher accuracy.
　従来の基板転写方法では、図１４（ａ）に示すように、粘着テープＴ１を、粘着テープＴ２から離反するように変形させる方法や、図１４（ｂ）に示すように、粘着テープＴ１の露出部Ｐに非粘着性の接着防止材Ｂを挿入させる方法が用いられていた。 In the conventional substrate transfer method, as shown in FIG. 14 (a), the adhesive tape T1 is deformed so as to be separated from the adhesive tape T2, or the adhesive tape T1 is exposed as shown in FIG. 14 (b). A method of inserting a non-tacky adhesion preventing material B into the part P has been used.
　しかしながら、図１４（ａ）に示す従来方法では粘着テープＴ１を変形させる必要がある。そのため、粘着テープＴ１として硬質で弾性変形しづらい材料、例えばＰＥＴ（Polyethylene Terephthalate）を用いる場合、当該従来方法を適用することは困難である。また、露出部Ｐと粘着テープＴ２との距離を長くしても露出部ＰはウエハＷの外側にはみ出た状態であるので、露出部Ｐと粘着テープＴ２との接着を確実に回避することは困難である。 However, it is necessary to deform the adhesive tape T1 in the conventional method shown in FIG. For this reason, when a material that is hard and hardly elastically deformed, such as PET (Polyethylene Terephthalate), is used as the adhesive tape T1, it is difficult to apply the conventional method. Moreover, even if the distance between the exposed portion P and the adhesive tape T2 is increased, the exposed portion P is in a state of protruding outside the wafer W, so that it is possible to reliably avoid the adhesion between the exposed portion P and the adhesive tape T2. Have difficulty.
　そして図１４（ｂ）に示す従来方法では、粘着テープＴ１または粘着テープＴ２の粘着力によっては、接着防止材と当該粘着テープとを解離させる際に強い力を要する。そのため、接着した状態の粘着テープを剥離する際に過度の引っ張り力がウエハＷに作用するので、ウエハＷが破損する可能性がある。また、リングフレームｆとウエハＷの大きさの差が小さい場合、接着防止材を露出部Ｐに挿入する際に高い精度のアライメントが要求される。このように従来の方法では、粘着テープＴ１と粘着テープＴ２との接着を回避する確実性が、粘着テープの特性によって左右される。 In the conventional method shown in FIG. 14 (b), depending on the adhesive strength of the adhesive tape T1 or the adhesive tape T2, a strong force is required to dissociate the adhesion preventing material and the adhesive tape. Therefore, when the adhesive tape in the bonded state is peeled off, an excessive tensile force acts on the wafer W, so that the wafer W may be damaged. Further, when the difference in size between the ring frame f and the wafer W is small, high-precision alignment is required when the adhesion preventing material is inserted into the exposed portion P. Thus, in the conventional method, the certainty of avoiding the adhesion between the adhesive tape T1 and the adhesive tape T2 depends on the characteristics of the adhesive tape.
　一方で、実施例に係る基板転写装置１では、ウエハＷの外形に沿って粘着テープＴ１を切断することによって粘着テープ同士の接着を回避する。すなわち、実施例に係る構成では、ウエハＷを転写させる際に粘着テープを変形させる必要がない。そのため、粘着テープが硬質で弾性変形しづらい材料であっても、粘着テープＴ１と粘着テープＴ２との接着を確実に回避できる。 On the other hand, in the substrate transfer apparatus 1 according to the embodiment, the adhesive tape T1 is cut along the outer shape of the wafer W to avoid adhesion between the adhesive tapes. That is, in the configuration according to the embodiment, it is not necessary to deform the adhesive tape when transferring the wafer W. Therefore, even if the adhesive tape is a hard material that is difficult to elastically deform, adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided.
　さらに実施例に係る基板転写装置１では、新たに接着防止材を用いる必要もない。従って、粘着テープの粘着力が強い場合であっても、ウエハＷの損傷を回避しつつ、粘着テープＴ１と粘着テープＴ２との接着をも確実に回避できる。従って、実施例に係る基板転写装置１では、硬度や粘着力といった粘着テープの特性に左右されることなく、粘着テープＴ１と粘着テープＴ２との接着を確実に回避できる。また実施例に係る保持テーブル７ではウエハ保持部３１をウエハＷの径より小さくできるので、基板転写装置１の大型化を回避することが可能となる。 Furthermore, in the substrate transfer apparatus 1 according to the embodiment, it is not necessary to newly use an adhesion preventing material. Therefore, even when the adhesive force of the adhesive tape is strong, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided while avoiding damage to the wafer W. Therefore, in the substrate transfer apparatus 1 according to the embodiment, the adhesion between the adhesive tape T1 and the adhesive tape T2 can be reliably avoided without being influenced by the characteristics of the adhesive tape such as hardness and adhesive force. Further, in the holding table 7 according to the embodiment, since the wafer holding unit 31 can be made smaller than the diameter of the wafer W, it is possible to avoid an increase in the size of the substrate transfer apparatus 1.
　本発明は、上記実施形態に限られることはなく、下記のように変形実施することができる。 The present invention is not limited to the above embodiment, and can be modified as follows.
　（１）上述した実施例において、ステップＳ８に係る工程は、紫外線照射機構２１を用いる構成に限られない。すなわちマウントフレームＭＦ２に紫外線を照射することなく、剥離用の粘着テープおよび剥離部材を用いる方式によって粘着テープＴ１を剥離してもよい。このような変形例（１）に係る構成において、テープ剥離機構２３は図１５（ａ）に示すように、マウントフレームＭＦ２を保持する可動台８１と、ロール巻きされた剥離テープＱを案内する案内ローラ８３と、ナイフエッジ状の剥離部材８５と、剥離テープＱを回収する巻き取り軸８７とを備えている。 (1) In the embodiment described above, the process according to step S8 is not limited to the configuration using the ultraviolet irradiation mechanism 21. That is, the adhesive tape T1 may be peeled by a method using a peeling adhesive tape and a peeling member without irradiating the mount frame MF2 with ultraviolet rays. In the configuration according to the modification (1), the tape peeling mechanism 23 includes a movable base 81 that holds the mount frame MF2 and a guide that guides the roll-off peeling tape Q as shown in FIG. A roller 83, a knife-edge-shaped peeling member 85, and a winding shaft 87 for collecting the peeling tape Q are provided.
　剥離テープＱは案内ローラ８３によって剥離部材８５へ案内され、剥離部材８５において折り返し反転した後、巻き取り軸８７によって巻き取り回収される。すなわち、可動台８１に保持されているマウントフレームＭＦ２に対して、ウエハＷの表面に貼り付けられている粘着テープＴ１に剥離テープＱを貼り付ける。そして粘着テープＴ１に剥離テープＱを貼り付けた状態で、可動台８１を図１５（ａ）の中右方に移動させる。 The peeling tape Q is guided to the peeling member 85 by the guide roller 83, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87. That is, the release tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W with respect to the mount frame MF2 held on the movable table 81. And the movable stand 81 is moved to the middle right of Fig.15 (a) in the state which affixed the peeling tape Q to adhesive tape T1.
　可動台８１を移動させることにより、図１５（ｂ）に示すように、剥離テープＱが剥離部材８５の先端で折り返し走行するので、粘着テープＴ１は剥離テープＱと一体となってウエハＷの表面から剥離される。なお、図１５（ａ）のような剥離テープＱを用いる方式と、紫外線照射機構２１を用いる方式とを併用してもよい。
　（２）上述した実施例および変形例ではステップＳ３において、切り抜かれた部分の粘着テープＴ１をリングフレームｆ１とともに回収する構成であったがこれに限られない。すなわち、切り抜かれた部分の粘着テープＴ１をリングフレームｆ１から剥離し、切り抜かれた部分の粘着テープＴ１のみを回収する構成であってもよい。 By moving the movable table 81, as shown in FIG. 15 (b), the peeling tape Q is turned back at the tip of the peeling member 85, so that the adhesive tape T1 is integrated with the peeling tape Q and the surface of the wafer W. Is peeled off. Note that the method using the peeling tape Q as shown in FIG. 15A and the method using the ultraviolet irradiation mechanism 21 may be used in combination.
(2) In the above-described embodiment and modification, the cut-off portion of the adhesive tape T1 is collected together with the ring frame f1 in step S3. However, the present invention is not limited to this. That is, a configuration may be adopted in which the cut-out portion of the adhesive tape T1 is peeled off from the ring frame f1, and only the cut-out portion of the adhesive tape T1 is recovered.
　このような変形例（２）に係る構成では、新たにリングフレームｆ２を用いることなく、ステップＳ６においてリングフレームｆ１とウエハＷの他方の面とにわたって粘着テープＴ２を貼り付けることができる。従って、リングフレームｆ２およびリングフレーム供給部１１を省略できるので、基板転写装置１の大型化を回避できるとともに、コストを低下させることも可能となる。 In the configuration according to the modification (2), the adhesive tape T2 can be pasted over the ring frame f1 and the other surface of the wafer W in step S6 without newly using the ring frame f2. Accordingly, since the ring frame f2 and the ring frame supply unit 11 can be omitted, it is possible to avoid an increase in the size of the substrate transfer apparatus 1 and to reduce the cost.
　（３）上述した実施例および変形例では、ステップＳ５において新しいリングフレームｆ２を供給した後、ステップＳ６において粘着テープＴ２をリングフレームｆ２とウエハＷとの上面に貼付けたが、粘着テープＴ２に転写する構成はこれに限られない。すなわち、転写位置Ｒに搬入されたウエハＷに対して、粘着テープＴ２が予め貼り付けられたリングフレームｆ２を供給し、粘着テープＴ２をウエハＷの上面に貼り付ける構成であってもよい。 (3) In the above-described embodiment and modification, after supplying a new ring frame f2 in step S5, the adhesive tape T2 is attached to the upper surface of the ring frame f2 and the wafer W in step S6, but transferred to the adhesive tape T2. The configuration to be performed is not limited to this. That is, the ring frame f2 with the adhesive tape T2 attached in advance may be supplied to the wafer W carried into the transfer position R, and the adhesive tape T2 may be attached to the upper surface of the wafer W.
　（４）上述した実施例および変形例において、テープ切断機構９はカッタ４１を用いる構成としたが、カッタ刃の代わりにレーザによって粘着テープを切断する構成であってもよい。 (4) In the above-described embodiments and modifications, the tape cutting mechanism 9 is configured to use the cutter 41, but may be configured to cut the adhesive tape with a laser instead of the cutter blade.
　（５）上記実施例および変形例では、基板として半導体ウエハを例にとって説明したが、当該装置は、ＬＥＤ用の基板や回路基板など種々の形状およびサイズの基板に適用することが可能である。この場合、テープ切断工程において切断される粘着テープＴ１の形状は、適用される基板の外形に応じて変更される。 (5) In the above-described embodiments and modifications, the semiconductor wafer has been described as an example of the substrate. However, the apparatus can be applied to substrates of various shapes and sizes such as LED substrates and circuit boards. In this case, the shape of the adhesive tape T1 cut in the tape cutting step is changed according to the outer shape of the substrate to be applied.
　したがって、使用する基板支持用のフレームは、ウエハ用のリングフレームｆに限定されず、使用する基板の形状に応じた四角形などのフレームを利用することも可能である。四角形のフレームであれば、例えば複数個の四角形の基板を粘着テープにより接着保持することができ、デッドスペースを削減可能となる。その結果、作業効率を高めることができる。 Therefore, the substrate support frame to be used is not limited to the wafer ring frame f, and a square frame or the like corresponding to the shape of the substrate to be used can also be used. In the case of a rectangular frame, for example, a plurality of rectangular substrates can be bonded and held with an adhesive tape, and dead space can be reduced. As a result, work efficiency can be improved.
　（６）上記実施例では、転写元のリングフレームｆと転写先の新しいリングフレームｆに同一形状のものを利用していたが、異なる形状のフレームを組み合わせて使用してもよい。 (6) In the above embodiment, the transfer source ring frame f and the transfer destination new ring frame f have the same shape. However, frames having different shapes may be used in combination.
　（７）上記実施例および変形例において、予めリングフレーム形状に切断されたプリカットタイプの粘着テープＴ２をリングフレームｆ２に貼り付けてもよい。 (7) In the above-described embodiments and modifications, a pre-cut type adhesive tape T2 previously cut into a ring frame shape may be attached to the ring frame f2.
　（８）上記実施例および変形例ではステップＳ２において、ウエハＷの直径より小さいウエハ保持部３１で保持した状態で、カッタ４１をウエハの外形に接触させながら切断している。しかし、ステップＳ２に係るテープ切断工程は、このような粘着テープＴ１をウエハＷと同一の大きさに切り抜く構成に限られない。すなわち図１６（ａ）に示すように、ウエハＷの直径より大きいウエハ保持部３１で保持した状態で、カッタ４１をウエハ保持部３１の外形に接触させながら、粘着テープＴ１を切断してもよい。 (8) In the above-described embodiment and modification, in step S2, the cutter 41 is cut while being in contact with the outer shape of the wafer while being held by the wafer holder 31 smaller than the diameter of the wafer W. However, the tape cutting process according to step S2 is not limited to the configuration in which such an adhesive tape T1 is cut out to the same size as the wafer W. That is, as shown in FIG. 16A, the adhesive tape T1 may be cut while the cutter 41 is in contact with the outer shape of the wafer holder 31 while being held by the wafer holder 31 larger than the diameter of the wafer W. .
　このような変形例（８）に係る構成では、ステップＳ２において、粘着テープＴ１はウエハＷの直径と比べて広い大きさとなるように切り抜かれる。切り抜かれた粘着テープＴ１の大きさは、ステップＳ５に係る転写工程において、粘着テープＴ１と粘着テープＴ２との接着を確実に回避できる程度の大きさとなるように調整される。図１６（ａ）に示すように、テープ切断工程後において、切り抜かれた粘着テープＴ１のうちウエハＷの外側にはみ出ている部分の長さｋは、ウエハＷの厚さＧ以下であることが好ましい。 In the configuration according to the modification (8), the adhesive tape T1 is cut out so as to have a larger size than the diameter of the wafer W in step S2. The size of the cut out adhesive tape T1 is adjusted to a size that can reliably avoid the adhesion between the adhesive tape T1 and the adhesive tape T2 in the transfer process according to step S5. As shown in FIG. 16A, after the tape cutting step, the length k of the portion of the adhesive tape T1 cut out that protrudes outside the wafer W is equal to or less than the thickness G of the wafer W. preferable.
　（９）また変形例（８）に係る他の構成として図１６（ｂ）に示すように、カッタ４１をウエハＷの外径およびウエハ保持部３１の外径のいずれにも接触させることなく、粘着テープＴ１をウエハＷよりやや広い大きさに切り抜く構成であってもよい。このような変形例（９）では変形例（８）と同様に、テープ切断工程後において、略円形に切り抜かれた粘着テープＴ１のうちウエハＷの外側にはみ出ている部分の長さｋ（切り抜かれた粘着テープＴ１の半径ＴｒとウエハＷの半径Ｗｒとの差）は、ウエハＷの厚さＧ以下であることが好ましい。 (9) Further, as shown in FIG. 16B as another configuration according to the modified example (8), the cutter 41 is not brought into contact with either the outer diameter of the wafer W or the outer diameter of the wafer holding unit 31. A configuration in which the adhesive tape T1 is cut out to be slightly wider than the wafer W may be employed. In the modified example (9), similarly to the modified example (8), the length k (cut) of the portion of the adhesive tape T1 cut out in a substantially circular shape that protrudes outside the wafer W after the tape cutting step. The difference between the radius Tr of the removed adhesive tape T1 and the radius Wr of the wafer W is preferably equal to or less than the thickness G of the wafer W.
　長さｋが厚さＧ以下である場合、図１６（ｃ）に示すように、転写工程において粘着テープＴ１がウエハＷの端で、点線で示す位置から実線で示す位置へと折れ曲がるように変形した場合であっても、粘着テープＴ１と粘着テープＴ２とが接触することを確実に回避できる。従って、転写工程における粘着テープ同士の接着をより確実に回避できるので、粘着テープＴ２への転写の精度をより向上できる。 When the length k is equal to or less than the thickness G, as shown in FIG. 16C, the adhesive tape T1 is deformed so as to be bent at the end of the wafer W from the position indicated by the dotted line to the position indicated by the solid line in the transfer process. Even if it is a case, it can avoid reliably that adhesive tape T1 and adhesive tape T2 contact. Therefore, adhesion between the pressure-sensitive adhesive tapes in the transfer process can be avoided more reliably, so that the accuracy of transfer to the pressure-sensitive adhesive tape T2 can be further improved.
　また変形例（９）に係る構成において、ウエハ保持部３１の半径Ｄは切り抜かれた粘着テープＴ１の半径Ｔｒより小さいことが好ましい。この場合、カッタ４１は粘着テープＴ１を貫通するように切断できるので、より好適に粘着テープＴ１を切断できる。本発明に係る各実施例および変形例において、テープ切断工程における「ウエハの外形に沿って粘着テープを切断する」とは、粘着テープＴ１をウエハＷと同一の大きさに切断する場合のみならず、転写工程において粘着テープＴ１と粘着テープＴ２との接着を確実に回避できる程度に、ウエハＷの外形より広い大きさに粘着テープＴ１を切断する場合をも含むものとする。 In the configuration according to the modified example (9), it is preferable that the radius D of the wafer holder 31 is smaller than the radius Tr of the cut adhesive tape T1. In this case, since the cutter 41 can be cut so as to penetrate the adhesive tape T1, the adhesive tape T1 can be more suitably cut. In each of the embodiments and modifications according to the present invention, “cutting the adhesive tape along the outer shape of the wafer” in the tape cutting step means not only the case where the adhesive tape T1 is cut to the same size as the wafer W. The case where the adhesive tape T1 is cut to a size wider than the outer shape of the wafer W to the extent that the adhesion between the adhesive tape T1 and the adhesive tape T2 can be surely avoided in the transfer step is also included.
　　１　　…　基板転写装置
　　３　　…　マウントフレーム収納部
　　５　　…　第１搬送機構（テープ回収部）
　　７　　…　保持テーブル
　　９　　…　テープ切断機構（テープ切断部）
　１１　　…　リングフレーム供給部
　１３　　…　テープ貼付機構（転写機構）
　１５　　…　テープ切断機構
　１９　　…　反転ユニット
　２１　　…　紫外線照射機構
　２３　　…　テープ剥離機構
　２５　　…　マウントフレーム回収部
　２９　　…　フレーム保持部
　３１　　…　ウエハ保持部（基板保持部）
　ｆ１，ｆ２　　　…　リングフレーム
　Ｔ１　　…　粘着テープ（第１の粘着テープ）
　Ｔ２　　…　粘着テープ（第２の粘着テープ）
　ＭＦ１，ＭＦ２　…　マウントフレーム
　　Ｗ　…　半導体ウエハ DESCRIPTION OF SYMBOLS 1 ... Board | substrate transfer apparatus 3 ... Mount frame accommodating part 5 ... 1st conveyance mechanism (tape collection | recovery part)
7 ... Holding table 9 ... Tape cutting mechanism (tape cutting part)
11 ... Ring frame supply unit 13 ... Tape sticking mechanism (transfer mechanism)
DESCRIPTION OF SYMBOLS 15 ... Tape cutting mechanism 19 ... Inversion unit 21 ... Ultraviolet irradiation mechanism 23 ... Tape peeling mechanism 25 ... Mount frame collection | recovery part 29 ... Frame holding part 31 ... Wafer holding part (substrate holding part)
f1, f2 ... ring frame T1 ... adhesive tape (first adhesive tape)
T2 ... Adhesive tape (second adhesive tape)
MF1, MF2 ... Mount frame W ... Semiconductor wafer

Claims (8)

  1. 　支持用の第１の粘着テープを介してリングフレーム内に接着保持された基板を第２の粘着テープに転写する基板転写方法であって、
    　前記第１の粘着テープ側から前記リングフレームおよび前記基板を保持部材で保持する保持工程と、
    　前記保持部材で保持された前記基板の外形に沿って前記第１の粘着テープを切断するテープ切断工程と、
    　切り抜かれた前記第１の粘着テープを回収するテープ回収工程と、
    　前記テープ回収工程の後に、前記基板の非保持面側から前記第２の粘着テープを貼り付けて転写を行う転写工程と、
    　を備えたことを特徴とする基板転写方法。     A substrate transfer method for transferring a substrate adhered and held in a ring frame to a second adhesive tape via a first adhesive tape for support,
    A holding step of holding the ring frame and the substrate with a holding member from the first adhesive tape side;
    A tape cutting step of cutting the first adhesive tape along the outer shape of the substrate held by the holding member;
    A tape recovery step of recovering the cut out first adhesive tape;
    After the tape recovery step, a transfer step of transferring by attaching the second adhesive tape from the non-holding surface side of the substrate;
    A substrate transfer method comprising:
  2. 　請求項１に記載の基板転写方法において、
    　前記テープ切断工程において、前記第１の粘着テープが前記基板の外形から外側にはみ出ている部分の長さは前記基板の厚さ以下となるように、前記第１の粘着テープは切断されることを特徴とする基板転写方法。     The substrate transfer method according to claim 1,
    In the tape cutting step, the first adhesive tape is cut such that the length of the portion where the first adhesive tape protrudes outward from the outer shape of the substrate is equal to or less than the thickness of the substrate. A substrate transfer method characterized by the above.
  3. 　請求項１または請求項２に記載の基板転写方法において、
    　前記保持部材は、前記基板の直径より小さいことを特徴とする基板転写方法。     In the substrate transfer method according to claim 1 or 2,
    The substrate transfer method, wherein the holding member is smaller than the diameter of the substrate.
  4. 　請求項１ないし請求項３のいずれかに記載の基板転写方法において、
    　前記テープ切断工程において、カッタ刃を用いて前記第１の粘着テープを切断する基板転写方法。     The substrate transfer method according to any one of claims 1 to 3,
    A substrate transfer method for cutting the first adhesive tape using a cutter blade in the tape cutting step.
  5. 　請求項１ないし請求項３のいずれかに記載の基板転写方法において、
    　前記テープ切断工程において、レーザを用いて前記第１の粘着テープを切断する基板転写方法。     The substrate transfer method according to any one of claims 1 to 3,
    A substrate transfer method for cutting the first adhesive tape using a laser in the tape cutting step.
  6. 　請求項１ないし請求項５のいずれかに記載の基板転写方法において、
    　前記テープ回収工程において、前記リングフレームに接着している状態の前記切り抜かれた第１の粘着テープを前記リングフレームとともに回収する基板転写方法。     The substrate transfer method according to any one of claims 1 to 5,
    In the tape collecting step, a substrate transfer method for collecting the cut out first adhesive tape in a state of being bonded to the ring frame together with the ring frame.
  7. 　請求項１ないし請求項６のいずれかに記載の基板転写方法において、
    　前記転写工程において、前記第２の粘着テープを予め貼り付けた新たなリングフレームを前記基板に重ね合わせ、前記基板の非保持面側から前記第２の粘着テープを貼り付けて転写を行う基板転写方法。     The substrate transfer method according to any one of claims 1 to 6,
    Substrate transfer in which, in the transfer step, a new ring frame to which the second adhesive tape has been applied in advance is superimposed on the substrate, and the second adhesive tape is applied from the non-holding surface side of the substrate to perform transfer. Method.
  8. 　支持用の第１の粘着テープを介してリングフレーム内に接着保持された基板を第２の粘着テープに転写する基板転写装置であって、
    　前記第１の粘着テープを介して前記基板を保持する基板保持部と、
    　前記リングフレームを保持するフレーム保持部と、
    　前記基板保持部で保持された前記基板の外形に沿って前記第１の粘着テープを切断するテープ切断部と、
    　前記テープ切断部によって切り抜かれた前記第１の粘着テープを回収するテープ回収部と、
    　前記切り抜かれた前記第１の粘着テープが回収された後、前記基板の非保持面側から前記第２の粘着テープを貼り付けて転写を行う転写機構と、
    　を備えたことを特徴とする基板転写装置。     A substrate transfer device for transferring a substrate adhered and held in a ring frame to a second adhesive tape via a first adhesive tape for support,
    A substrate holding part for holding the substrate via the first adhesive tape;
    A frame holding unit for holding the ring frame;
    A tape cutting unit for cutting the first adhesive tape along the outer shape of the substrate held by the substrate holding unit;
    A tape collecting unit for collecting the first adhesive tape cut out by the tape cutting unit;
    After the cut out first adhesive tape is collected, a transfer mechanism for attaching and transferring the second adhesive tape from the non-holding surface side of the substrate;
    A substrate transfer apparatus comprising:
PCT/JP2016/087443 2016-03-07 2016-12-15 Substrate transfer method and substrate transfer device WO2017154304A1 (en)

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