WO2017145229A1 - レーザー光源装置およびレーザー光源装置の製造方法 - Google Patents
レーザー光源装置およびレーザー光源装置の製造方法 Download PDFInfo
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- WO2017145229A1 WO2017145229A1 PCT/JP2016/055030 JP2016055030W WO2017145229A1 WO 2017145229 A1 WO2017145229 A1 WO 2017145229A1 JP 2016055030 W JP2016055030 W JP 2016055030W WO 2017145229 A1 WO2017145229 A1 WO 2017145229A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
- G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0972—Prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Definitions
- the technology disclosed in the present specification relates to, for example, a laser light source device including a semiconductor laser element and a method of manufacturing a laser light source device including a semiconductor laser element.
- a light source using a halogen lamp or a metal halide lamp is used as a light source included in a display device such as a projector.
- laser light sources having characteristics such as long life, low power consumption, high luminance, and high color purity are actively applied to display devices.
- Optical equipment such as large projectors used in digital cinemas, etc., increase output by adding a laser light source to obtain the required light output.
- Optical equipment such as large projectors used in digital cinemas, etc.
- increase output by adding a laser light source to obtain the required light output.
- disadvantages such as an increase in the size of the apparatus and an increase in cost. Therefore, it is desired to increase the light output of the laser light source alone or reduce the component cost.
- a semiconductor laser element having a plurality of light emitting points as exemplified in Patent Document 1 that is, a multi-beam A structure is disclosed in which an emitter semiconductor laser element is mounted and the emitted light of the multi-emitter semiconductor laser element is made substantially parallel using a microlens.
- the semiconductor laser element and the microlens are installed on the same plane of a substrate such as a stem, so the divergence angle of the emitted light of the semiconductor laser element is large, so the fast axis direction (y-axis direction) of the emitted light The lower half of the component hits a substrate such as a stem that holds the semiconductor laser. Then, the light output is lost.
- the semiconductor laser element is arranged on the stem via a holding member such as a block or a submount, and a microlens for making the emitted light substantially parallel. Is arranged on the side of the block. By arranging in this way, all of the emitted light is input to the microlens and further becomes a substantially parallel light.
- the technology disclosed in the specification of the present application has been made in order to solve the problems as described above, and the light output from the semiconductor laser element is ensured while ensuring the degree of freedom of arrangement of the semiconductor laser element.
- the present invention relates to a laser light source device capable of suppressing loss and a method for manufacturing the laser light source device.
- One aspect of the technology disclosed in the present specification includes a semiconductor laser element and an optical element provided on an optical axis of emitted light emitted from the semiconductor laser element, and the optical element includes the semiconductor laser.
- a part of the luminous flux of the emitted light that is not separated in the fast axis direction emitted from the element is separated from the other part in the fast axis direction.
- a semiconductor laser element is prepared, an optical element is provided on an optical axis of emitted light emitted from the semiconductor laser element, and the optical element is A part of the luminous flux of the emitted light emitted from the semiconductor laser element that is not separated in the fast axis direction is separated from the other part in the fast axis direction, and the optical element has one lens that is the semiconductor It is a structure in which two lens parts divided in the optical axis direction of the laser element and the direction orthogonal to the optical axis direction of the semiconductor laser element are combined, and is arranged on the side close to the semiconductor laser element before division.
- One of the lens units is a first lens unit, and the lens unit disposed on the side far from the semiconductor laser element before the division is the second lens unit and the third lens unit.
- a surface along the optical axis of the semiconductor laser element of the first lens unit is processed into a first inclined surface that is inclined with respect to the optical axis of the semiconductor laser element;
- a part of the surface formed by the division along the optical axis of the semiconductor laser element is processed into a second inclined surface parallel to the first inclined surface, and the first inclined surface is
- the first lens unit is disposed at a position approaching the optical axis of the semiconductor laser element as the distance from the semiconductor laser element increases, and the semiconductor laser element is more on the optical axis of the semiconductor laser element than the first lens unit.
- One aspect of the technology disclosed in the present specification includes a semiconductor laser element and an optical element provided on an optical axis of emitted light emitted from the semiconductor laser element, and the optical element includes the semiconductor laser.
- a part of the luminous flux of the outgoing light emitted from the element and not separated in the fast axis direction is separated from the other part in the fast axis direction. According to such a configuration, it is possible to suppress the loss of light output from the semiconductor laser element while ensuring the degree of freedom of arrangement of the semiconductor laser element.
- a semiconductor laser element is prepared, an optical element is provided on an optical axis of emitted light emitted from the semiconductor laser element, and the optical element is A part of the luminous flux of the emitted light emitted from the semiconductor laser element that is not separated in the fast axis direction is separated from the other part in the fast axis direction, and the optical element has one lens that is the semiconductor It is a structure in which two lens parts divided in the optical axis direction of the laser element and the direction orthogonal to the optical axis direction of the semiconductor laser element are combined, and is arranged on the side close to the semiconductor laser element before division.
- One of the lens units is a first lens unit, and the lens unit disposed on the side far from the semiconductor laser element before the division is the second lens unit and the third lens unit.
- a surface along the optical axis of the semiconductor laser element of the first lens unit is processed into a first inclined surface that is inclined with respect to the optical axis of the semiconductor laser element;
- a part of the surface formed by the division along the optical axis of the semiconductor laser element is processed into a second inclined surface parallel to the first inclined surface, and the first inclined surface is
- the first lens unit is disposed at a position approaching the optical axis of the semiconductor laser element as the distance from the semiconductor laser element increases, and the semiconductor laser element is more on the optical axis of the semiconductor laser element than the first lens unit.
- the third lens portion Disposing the third lens portion at a position away from the surface of the third lens portion along the optical axis of the semiconductor laser element and opposite to the surface formed by the division; and Of the second lens Wherein along the optical axis of the semiconductor laser element, and the surface formed by the division at a position adjacent the opposite surface, arranging the second lens unit. According to such a configuration, it is possible to suppress the loss of light output from the semiconductor laser element while ensuring the degree of freedom of arrangement of the semiconductor laser element.
- FIG. 1 is a diagram schematically illustrating a configuration for realizing the laser light source device according to the present embodiment.
- the laser light source device includes a stem 1, a semiconductor laser element 2 mounted on the stem 1 and having at least one light emitting point, a semiconductor laser element mounted on the stem 1, and the semiconductor laser element. And an optical element 3 that converts the emitted light of 2 into substantially parallel light.
- the stem 1 is formed in a plate shape, for example, a stem base of a metal material in which a surface of a material having high thermal conductivity such as Cu is plated with Au and a metallized pattern.
- the stem 1 serves to fix the semiconductor laser element 2 and the optical element 3 and to release heat generated in the semiconductor laser element 2 to a cooling member (not shown here) below the stem 1.
- the semiconductor laser element 2 is a laser diode in which at least one light emitting point is disposed on the end face of a semiconductor chip containing, for example, GaAs or AlGaN. Laser light is emitted from each light emitting point in the semiconductor laser element 2 along an optical axis that is perpendicular to the chip end surface and parallel to the chip main surface.
- the optical element 3 includes a micro lens 3A, a micro lens 3B, and a micro lens 3C.
- the optical element 3 has a function of converting laser light into substantially parallel light.
- the optical element 3 may have a prism function.
- the optical element 3 is disposed on the optical axis of the emitted light emitted from the semiconductor laser element 2. Further, the optical element 3 separates a part of the luminous flux of the emitted light emitted from the semiconductor laser element 2 and not separated in the fast axis direction from the other part in the fast axis direction. As the separation method, for example, reflection or refraction is assumed.
- AuSn solder having excellent reliability and thermal conductivity is used as the solder used for joining.
- FIG. 2 is a diagram illustrating an optical path of emitted light in the fast axis direction of the laser light source device.
- the spread angle (full angle) of the light emitted from the semiconductor laser element 2 is about 80 °. Therefore, usually, when the semiconductor laser element 2 is directly installed on the stem 1, the lower half component of the emitted light hits the stem 1 and the light output is lost.
- the laser light source apparatus is provided with a trapezoidal microlens 3 ⁇ / b> A near the light emitting point of the semiconductor laser element 2.
- the lower half component of the light emitted from the semiconductor laser element 2 in the fast axis direction that is the vertical direction in FIG. 2, that is, the emitted light 11 is reflected by the trapezoidal microlens 3A.
- the surface 100 is reflected to the opposite side of the direction in which the stem 1 is arranged. In other words, the outgoing light 11 having a component spreading toward the stem 1 side is converted into light having a component spreading toward the opposite side to the stem 1 side.
- the reflecting surface 100 is an inclined surface that approaches the optical axis of the semiconductor laser element 2 as it is separated from the semiconductor laser element 2.
- the reflecting surface 100 illustrated in FIG. 2 is in contact with the stem 1 at the end close to the semiconductor laser element 2. Further, the reflecting surface 100 does not contact the stem 1 at the end portion on the side far from the semiconductor laser element 2.
- a microlens 3B provided on the upper surface of the stem 1 and a microlens 3C provided on the upper surface of the microlens 3B are arranged behind the optical path of the trapezoidal microlens 3A.
- the emitted light 11 reflected by the reflecting surface 100 is further reflected by the reflecting surface 101 of the microlens 3C, and is substantially parallel light on the optical action surface 102 for making the microlens 3C substantially parallel.
- the reflective surface 101 is a surface parallel to the reflective surface 100.
- the upper half component of the light emitted from the semiconductor laser element 2 in the fast axis direction that is, the emitted light 10 is converted into substantially parallel light on the optical action surface 103 for making the light parallel in the microlens 3B.
- FIGS. 3, 4, and 5 are diagrams illustrating the configuration of the optical element 3.
- the configuration of the optical element 3 that combines the microlens 3A, the microlens 3B, and the microlens 3C illustrated in FIGS. 1 and 2 will be described with reference to FIGS. 3, 4, and 5.
- one microlens is cut at the position of the dotted line. Specifically, one microlens is respectively arranged in the optical axis direction (z-axis direction) of the semiconductor laser element 2 and in the direction orthogonal to the optical axis direction of the semiconductor laser element 2 (y-axis direction in FIG. 3). Divide into two. Further, the surface of the portion A along the optical axis of the semiconductor laser element 2 is cut while being inclined with respect to the optical axis of the semiconductor laser element 2. Thereby, the reflective surface 100 is formed. Then, a part of the surface of the portion C along the optical axis of the semiconductor laser element 2 and formed by division is cut while being inclined with respect to the optical axis of the semiconductor laser element 2. Thereby, the reflective surface 101 is formed. Then, as illustrated in FIG. 4, the cut part A, the part B, and the part C are separated.
- the optical element 3 can be configured by combining the cut portion A, the portion B, and the portion C.
- the portion A is disposed at a position where the reflecting surface 100 approaches the optical axis of the semiconductor laser element 2 as the distance from the semiconductor laser element 2 increases.
- the part B is arranged at a position farther from the semiconductor laser element 2 than the part A.
- the portion C is arranged at a position where the surface opposite to the formed surface is adjacent.
- an epoxy adhesive can be used for bonding when the microlens 3A, the microlens 3B, and the microlens 3C are combined.
- an epoxy adhesive can be used for bonding when the microlens 3A, the microlens 3B, and the microlens 3C are combined.
- an epoxy resin When an epoxy resin is used, it can be bonded by being temporarily cured by ultraviolet irradiation immediately after bonding and then thermally cured through a heat treatment step.
- the submount 4 may install the submount 4 between the stem 1 and the semiconductor laser element 2 as needed.
- the submount has an electrical insulation function and a heat transfer function.
- FIG. 6 and 7 are diagrams illustrating the structure of the submount 4.
- the submount 4 includes a flat electrical insulator 4A, a plurality of metallized patterns 4B formed on the surface of the electrical insulator 4A, and a metallized pattern 4C. And a metallized pattern 4D formed over the entire back surface of the electrical insulator 4A.
- the electrical insulator 4A for example, SiC or AlN having a high thermal conductivity is used.
- the metallized pattern 4B and the semiconductor laser element 2 in the submount 4 are joined using solder.
- the metallized pattern 4C of the submount 4 and each drive electrode of the semiconductor laser element 2 are electrically connected by using, for example, ultrasonic vibration pressure bonding using a conductive wire 5 such as Au.
- the metallized pattern 4D is not formed for the purpose of power feeding.
- the metallized pattern 4D may be generated by a difference between the linear expansion coefficient of the electrical insulator 4A and the linear expansion coefficient of the metallized pattern 4B, or a difference between the linear expansion coefficient of the electrical insulator 4A and the linear expansion coefficient of the metallized pattern 4C. It is provided to suppress the warping of the mount.
- the installation surface of the semiconductor laser element 2 and the installation surface of the optical element 3 are not coplanar.
- the thickness of the submount 4 is, for example, 300 ⁇ m or more and 600 ⁇ m or less. Therefore, in order to make all the emitted light in the fast axis direction of the semiconductor laser element 2 substantially parallel, it is necessary to provide a structure like the optical element 3 as well.
- the laser light source device includes the semiconductor laser element 2 and the optical element 3.
- the optical element 3 is provided on the optical axis of the emitted light emitted from the semiconductor laser element 2.
- the optical element 3 separates a part of the luminous flux of the emitted light emitted from the semiconductor laser element 2 and not separated in the fast axis direction from the other part in the fast axis direction.
- the emitted light emitted from the semiconductor laser element has a component that spreads in the fast axis direction.
- first emitted light light having a component that spreads in the first direction in the fast axis direction.
- second emitted light light having a component that spreads in the second direction, which is the direction opposite to the first direction in the fast axis direction.
- the emitted light 11 corresponds to the first emitted light.
- the emitted light 10 corresponds to the second emitted light.
- the optical element 3 converts the emitted light 11 into light having a component that spreads in the second direction in the fast axis direction.
- the outgoing light 11 having a component spreading in the first direction out of the outgoing light having a component spreading in the fast axis direction emitted from the semiconductor laser element 2 is opposite to the first direction.
- the optical element 3 emits light parallel to each other by refracting the outgoing light 10 and the converted outgoing light 11. According to such a configuration, the emitted light having a component that spreads in the fast axis direction emitted from the semiconductor laser element 2 can be converted into parallel light and emitted.
- the optical element 3 has an inclined surface that approaches the optical axis of the semiconductor laser element 2 as it moves away from the semiconductor laser element 2.
- the reflective surface 100 corresponds to an inclined surface. According to such a configuration, the emitted light 11 having a component that spreads toward the stem 1 side can be reflected to the side opposite to the stem 1 side. Therefore, it is possible to suppress the loss of light output due to the emission light 11 hitting the stem 1.
- the laser light source device includes a flat plate member.
- the stem 1 corresponds to a flat plate member.
- the optical element 3 is provided on the upper surface of the stem 1.
- Outgoing light 11 is light having a component that spreads toward the stem 1 in the fast axis direction out of the outgoing light from the semiconductor laser element 2.
- the emitted light 10 is light having a component that spreads out of the emitted light from the semiconductor laser element 2 on the side opposite to the stem 1 side in the fast axis direction.
- the optical element 3 converts the emitted light 11 into light having a component that spreads on the side opposite to the stem 1 side with respect to the optical axis.
- the outgoing light 11 having a component spreading toward the stem 1 side out of the outgoing light having a component spreading in the fast axis direction emitted from the semiconductor laser element 2 is directed to the side opposite to the stem 1 side. It can be converted into light having a spreading component. Therefore, it is possible to suppress the loss of light output due to the emission light 11 hitting the stem 1.
- the optical element 3 reflects the emitted light 11 to the side opposite to the stem 1 side.
- the outgoing light 11 having a component spreading toward the stem 1 side out of the outgoing light having a component spreading in the fast axis direction emitted from the semiconductor laser element 2 is directed to the side opposite to the stem 1 side. Can be reflected. Therefore, it is possible to suppress the loss of light output due to the emission light 11 hitting the stem 1.
- the semiconductor laser element 2 is provided on the upper surface of the stem 1. According to such a configuration, loss of light output from the semiconductor laser element 2 can be suppressed without requiring a member such as a block or a submount for holding the semiconductor laser element 2. Specifically, even when the semiconductor laser element 2 and the optical element 3 are arranged on the same plane, the loss of light having a component spreading toward the stem 1 side in the fast axis direction of the semiconductor laser element 2 is suppressed. can do. Moreover, since the number of parts which comprise an apparatus is not increased, manufacturing cost can be suppressed. In addition, the manufacturing process can be simplified.
- the semiconductor laser element 2 when the semiconductor laser element 2 is cooled by disposing a cooling device or the like on the lower surface of the stem 1, the thermal resistance until reaching the semiconductor laser element 2 can be reduced. Therefore, the light output characteristics can be improved. In addition, the reliability of the apparatus can be maintained.
- the laser light source device includes the submount 4 provided on the upper surface of the stem 1.
- the semiconductor laser element 2 is provided on the upper surface of the submount 4.
- the installation surface of the semiconductor laser element 2 and the installation surface of the optical element 3 are not coplanar.
- the optical element 3 appropriately separates the emitted light emitted from the semiconductor laser element 2 in the fast axis direction, so that, for example, the light output by hitting an obstacle or the like. Can be prevented from occurring.
- the thickness of the submount 4 can be assumed to be, for example, 300 ⁇ m or more and 600 ⁇ m or less, the heat dissipation of the semiconductor laser element 2 can be maintained.
- the optical element 3 has a structure in which one disassembled lens is combined. According to such a configuration, since only one microlens is used for manufacturing the optical element 3, it is possible to suppress the component cost.
- the optical element 3 has a function of making the laser light substantially parallel or a prism function. According to such a configuration, the emitted light having a component that spreads in the fast axis direction emitted from the semiconductor laser element 2 can be converted into parallel light and emitted.
- the semiconductor laser element 2 is prepared in the method of manufacturing the laser light source device.
- An optical element 3 is provided on the optical axis of the emitted light emitted from the semiconductor laser element 2.
- the optical element 3 separates a part of the luminous flux of the emitted light emitted from the semiconductor laser element 2 and not separated in the fast axis direction from the other part in the fast axis direction.
- the optical element 3 has a structure in which a lens portion in which one lens is divided into two in a direction perpendicular to the optical axis direction of the semiconductor laser element 2 and the optical axis direction of the semiconductor laser element 2 is combined.
- one of the lens units arranged on the side close to the semiconductor laser element 2 before the division is defined as a first lens unit.
- the lens portions arranged on the side far from the semiconductor laser element 2 before the division are referred to as a second lens portion and a third lens portion.
- the part A corresponds to the first lens part.
- Part B corresponds to the third lens part.
- Part C corresponds to the second lens part.
- the surface of the portion A along the optical axis of the semiconductor laser element 2 is processed into a first inclined surface that is inclined with respect to the optical axis of the semiconductor laser element 2.
- the reflective surface 100 corresponds to the first inclined surface.
- a part of the surface of the portion C along the optical axis of the semiconductor laser element 2 and formed by the division is processed into a second inclined surface parallel to the reflecting surface 100.
- the reflective surface 101 corresponds to the second inclined surface.
- the portion A is disposed at a position where the reflecting surface 100 approaches the optical axis of the semiconductor laser element 2 as the distance from the semiconductor laser element 2 increases.
- the part B is arranged at a position farther from the semiconductor laser element 2 than the part A.
- the portion C is arranged at a position where the surface opposite to the formed surface is adjacent.
- loss of light output from the semiconductor laser element 2 can be suppressed while ensuring the degree of freedom of arrangement of the semiconductor laser element 2.
- the component cost can be suppressed since only one microlens is used to manufacture the optical element 3, the component cost can be suppressed.
- each component is a conceptual unit, and one component consists of a plurality of structures, one component corresponds to a part of the structure, and a plurality of components. And the case where the components are provided in one structure.
- each component includes structures having other structures or shapes as long as they exhibit the same function.
- the material when a material name or the like is described without being particularly specified, the material contains other additives, for example, an alloy or the like unless a contradiction arises. Shall be included.
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Abstract
Description
以下、本実施の形態に関するレーザー光源装置、および、レーザー光源装置の製造方法について説明する。
図1は、本実施の形態に関するレーザー光源装置を実現するための構成を概略的に例示する図である。図1に例示されるように、レーザー光源装置は、ステム1と、ステム1に搭載され、かつ、少なくとも1つの発光点を有する半導体レーザー素子2と、ステム1に搭載され、かつ、半導体レーザー素子2の出射光を略平行光化する光学素子3とを備える。
以下に、以上に記載された実施の形態によって生じる効果を例示する。なお、以下では、以上に記載された実施の形態に例示された具体的な構成に基づいて当該効果が記載されるが、同様の効果が生じる範囲で、本願明細書に例示される他の具体的な構成と置き換えられてもよい。
以上に記載された実施の形態では、それぞれの構成要素の材質、材料、寸法、形状、相対的配置関係または実施の条件などについても記載する場合があるが、これらはすべての局面において例示であって、本願明細書に記載されたものに限られることはないものとする。
Claims (11)
- 半導体レーザー素子(2)と、
前記半導体レーザー素子(2)から出射された出射光の光軸上に設けられる光学素子(3)とを備え、
前記光学素子(3)は、前記半導体レーザー素子(2)から出射されたファスト軸方向において分離されていない前記出射光の光束のうちの一部を、他の一部からファスト軸方向において分離する、
レーザー光源装置。 - 前記半導体レーザー素子から出射された前記出射光は、ファスト軸方向に広がる成分を有し、
前記半導体レーザー素子(2)からの前記出射光のうちの、ファスト軸方向における第1の方向に広がる成分を有する光を第1の出射光(11)とし、
前記半導体レーザー素子(2)からの前記出射光のうちの、ファスト軸方向における前記第1の方向とは反対側の方向である第2の方向に広がる成分を有する光を第2の出射光(10)とし、
前記光学素子(3)は、前記第1の出射光(11)を、ファスト軸方向における前記第2の方向に広がる成分を有する光に変換する、
請求項1に記載のレーザー光源装置。 - 前記光学素子(3)は、前記第2の出射光(10)、および、変換した前記第1の出射光(11)を屈折させることによって、互いに平行な光を出射させる、
請求項2に記載のレーザー光源装置。 - 前記光学素子(3)は、前記半導体レーザー素子(2)から離れるにつれて前記半導体レーザー素子(2)の光軸に近づく傾斜面(100)を有する、
請求項1から請求項3のうちのいずれか1項に記載のレーザー光源装置。 - 平板状の平板部材(1)をさらに備え、
前記光学素子(3)は、前記平板部材(1)の上面に設けられ、
前記第1の出射光(11)は、前記半導体レーザー素子(2)からの前記出射光のうちの、ファスト軸方向における前記平板部材(1)側に広がる成分を有する光であり、
前記第2の出射光(10)は、前記半導体レーザー素子(2)からの前記出射光のうちの、ファスト軸方向における前記平板部材(1)側とは反対側に広がる成分を有する光であり、
前記光学素子(3)は、前記第1の出射光(11)を、光軸に対して前記平板部材(1)側とは反対側に広がる成分を有する光に変換する、
請求項2または請求項3に記載のレーザー光源装置。 - 前記光学素子(3)は、前記第1の出射光(11)を、前記平板部材(1)側とは反対側へ反射させる、
請求項5に記載のレーザー光源装置。 - 前記半導体レーザー素子(2)は、前記平板部材(1)の上面に設けられる、
請求項5または請求項6に記載のレーザー光源装置。 - 前記平板部材(1)の上面に設けられるサブマウント(4)をさらに備え、
前記半導体レーザー素子(2)は、前記サブマウント(4)の上面に設けられる、
請求項5または請求項6に記載のレーザー光源装置。 - 前記光学素子(3)は、
1つのレンズが前記半導体レーザー素子(2)の光軸方向および前記半導体レーザー素子(2)の光軸方向に直交する方向にそれぞれ2つに分割されたレンズ部が組み合わされた構造であり、
分割前に前記半導体レーザー素子(2)に近い側に配置されたレンズ部のうちの1つを第1のレンズ部とし、
分割前に前記半導体レーザー素子(2)から遠い側に配置されたレンズ部を第2のレンズ部および第3のレンズ部とし、
第1のレンズ部の前記半導体レーザー素子(2)の光軸に沿う面は、前記半導体レーザー素子(2)の光軸に対して傾斜する第1の傾斜面(100)に加工され、
第2のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面の一部は、前記第1の傾斜面(100)に平行な第2の傾斜面(101)に加工され、
前記第1の傾斜面(100)が、前記半導体レーザー素子(2)から離れるにつれて前記半導体レーザー素子(2)の光軸に近づく位置に、前記第1のレンズ部が配置され、
前記半導体レーザー素子(2)の光軸上において、前記第1のレンズ部よりも前記半導体レーザー素子(2)から離れる位置に、前記第3のレンズ部が配置され、
前記第3のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面とは反対側の面と、前記第2のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面とは反対側の面とが隣接する位置に、前記第2のレンズ部が配置される、
請求項1から請求項8のうちのいずれか1項に記載のレーザー光源装置。 - 前記光学素子(3)は、レーザー光を略平行光化する機能、または、プリズム機能を有する、
請求項1から請求項9のうちのいずれか1項に記載のレーザー光源装置。 - 半導体レーザー素子(2)を用意し、
前記半導体レーザー素子(2)から出射された出射光の光軸上に、光学素子(3)を設け、
前記光学素子(3)は、前記半導体レーザー素子(2)から出射されたファスト軸方向において分離されていない前記出射光の光束のうちの一部を、他の一部からファスト軸方向において分離し、
前記光学素子(3)は、
1つのレンズが前記半導体レーザー素子(2)の光軸方向および前記半導体レーザー素子(2)の光軸方向に直交する方向にそれぞれ2つに分割されたレンズ部が組み合わされた構造であり、
分割前に前記半導体レーザー素子(2)に近い側に配置されたレンズ部のうちの1つを第1のレンズ部とし、
分割前に前記半導体レーザー素子(2)から遠い側に配置されたレンズ部を第2のレンズ部および第3のレンズ部とし、
第1のレンズ部の前記半導体レーザー素子(2)の光軸に沿う面を、前記半導体レーザー素子(2)の光軸に対して傾斜する第1の傾斜面(100)に加工し、
第2のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面の一部を、前記第1の傾斜面(100)に平行な第2の傾斜面(101)に加工し、
前記第1の傾斜面(100)が、前記半導体レーザー素子(2)から離れるにつれて前記半導体レーザー素子(2)の光軸に近づく位置に、前記第1のレンズ部を配置し、
前記半導体レーザー素子(2)の光軸上において、前記第1のレンズ部よりも前記半導体レーザー素子(2)から離れる位置に、前記第3のレンズ部を配置し、
前記第3のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面とは反対側の面と、前記第2のレンズ部の、前記半導体レーザー素子(2)の光軸に沿い、かつ、分割によって形成された面とは反対側の面とが隣接する位置に、前記第2のレンズ部を配置する、
レーザー光源装置の製造方法。
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JP2018501419A JP6552710B2 (ja) | 2016-02-22 | 2016-02-22 | レーザー光源装置およびレーザー光源装置の製造方法 |
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CN201680081691.XA CN108701955B (zh) | 2016-02-22 | 2016-02-22 | 激光光源装置及激光光源装置的制造方法 |
EP16891388.7A EP3422495A4 (en) | 2016-02-22 | 2016-02-22 | LASER LIGHT SOURCE APPARATUS AND METHOD FOR PRODUCING A LASER LIGHT SOURCE DEVICE |
PCT/JP2016/055030 WO2017145229A1 (ja) | 2016-02-22 | 2016-02-22 | レーザー光源装置およびレーザー光源装置の製造方法 |
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CA3013292C (en) | 2020-12-22 |
JP6552710B2 (ja) | 2019-07-31 |
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CN108701955A (zh) | 2018-10-23 |
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EP3422495A1 (en) | 2019-01-02 |
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