WO2017137420A3 - Sintering device comprising a cooling device in an upper die - Google Patents

Sintering device comprising a cooling device in an upper die Download PDF

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Publication number
WO2017137420A3
WO2017137420A3 PCT/EP2017/052714 EP2017052714W WO2017137420A3 WO 2017137420 A3 WO2017137420 A3 WO 2017137420A3 EP 2017052714 W EP2017052714 W EP 2017052714W WO 2017137420 A3 WO2017137420 A3 WO 2017137420A3
Authority
WO
WIPO (PCT)
Prior art keywords
sintering
upper die
workpiece
die
cooling device
Prior art date
Application number
PCT/EP2017/052714
Other languages
German (de)
French (fr)
Other versions
WO2017137420A2 (en
Inventor
Christoph Ötzel
Holger Ulrich
Dr. Frank OSTERWALD
Original Assignee
Pink Gmbh Thermosysteme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pink Gmbh Thermosysteme filed Critical Pink Gmbh Thermosysteme
Publication of WO2017137420A2 publication Critical patent/WO2017137420A2/en
Publication of WO2017137420A3 publication Critical patent/WO2017137420A3/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/003—Apparatus, e.g. furnaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/061—Cushion plates
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    • B30B15/34—Heating or cooling presses or parts thereof
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)

Abstract

The invention relates to a sintering device (10) for producing a workpiece (30) from at least one component by means of pressure sintering. The sintering device has an upper die (12) and a lower die (14), between which the at least one component is held. The upper die (12) and the lower die (14) can be shifted relative to one another, in order to exert a press force on the workpiece (30) to be sintered. At least one heating device (18a, 18b) for heating the workpiece to be sintered (30) is provided. According to the invention, the sintering device (10) also has at least one cooling device (22a) in the upper die (12), which actively maintains the sintering device (10) at a more constant temperature. The hotter lower die (14) heats the upper die (12) undesirably during the sintering press process and this would lead to the overheating of the upper sintering die (12) without the active, controlled cooling device (22a). In addition, without the cooling device (22a), the maintenance of a constant temperature cannot be guaranteed during short sintering cycle processes. A cooling device (22b) can also be provided in the lower die (14). The workpiece (30) can comprise an electronic assembly having at least one electronic component (36), at least one interconnect device (32) and a joining material (34) that bonds the component (36) and the interconnect device (36), the bond being produced by pressure sintering of the joining material (34).
PCT/EP2017/052714 2016-02-08 2017-02-08 Sintering device WO2017137420A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016102162.8A DE102016102162A1 (en) 2016-02-08 2016-02-08 sintering apparatus
DE102016102162.8 2016-02-08

Publications (2)

Publication Number Publication Date
WO2017137420A2 WO2017137420A2 (en) 2017-08-17
WO2017137420A3 true WO2017137420A3 (en) 2017-10-05

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DE (1) DE102016102162A1 (en)
WO (1) WO2017137420A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3709342A1 (en) 2019-03-12 2020-09-16 Infineon Technologies AG Arrangement and method for joining at least two joining members using a foil on a carrier element interposed between the upper one of the joining members and a pressure exerting part
CN112071775A (en) * 2020-08-14 2020-12-11 深圳第三代半导体研究院 Sintering equipment for packaging power device
CN112038263A (en) * 2020-08-14 2020-12-04 深圳第三代半导体研究院 Clamp for packaging power device
CN112053973A (en) * 2020-08-25 2020-12-08 深圳第三代半导体研究院 Clamp system for packaging power device
TW202330132A (en) * 2021-10-14 2023-08-01 德商平克塞莫系統有限公司 Multifunctional sintering or diffusion soldering device and press tool
DE102021126718A1 (en) * 2021-10-14 2023-04-20 Pink Gmbh Thermosysteme SINTERING DEVICE FOR CONNECTING COMPONENTS OF AT LEAST AN ELECTRONIC ASSEMBLY
CN115394689B (en) * 2022-09-05 2023-09-01 江苏富乐华功率半导体研究院有限公司 Hot-pressing sintering device for power semiconductor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6041996A (en) * 1996-11-22 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part
JP2002322502A (en) * 2001-04-24 2002-11-08 Sumitomo Heavy Ind Ltd Electric pressure sintering device and punch temperature control method therefor
JP2003183708A (en) * 2001-12-11 2003-07-03 Sumitomo Coal Mining Co Ltd Cooling device for current-carrying electrode and assembly of current-carrying electrode and cooling device
US20050098610A1 (en) * 2001-06-27 2005-05-12 Shunji Onobori Apparatus and method for mounting electronic components
DE60033331T2 (en) * 1999-03-31 2007-10-31 Sps Syntex Inc., Kawasaki Method and apparatus for automatic electrical sintering
EP2506295A2 (en) * 2011-03-28 2012-10-03 Apic Yamada Corporation Bonding apparatus and bonding method
WO2014135151A2 (en) * 2013-03-04 2014-09-12 Danfoss Silicon Power Gmbh Device for low-temperature pressure sintering, method for low-temperature pressure sintering and power electronics assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192394A (en) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc Press working method for inorganic substrate and press device therefor
DE102004010399A1 (en) * 2004-03-03 2005-09-22 Atv Technologie Gmbh Metallic components e.g. copper bumps, and semiconductor substrate connecting device, has pressing equipment with supporting plate and press die with plate including mounting ring that holds pressing mat

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6041996A (en) * 1996-11-22 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part
DE60033331T2 (en) * 1999-03-31 2007-10-31 Sps Syntex Inc., Kawasaki Method and apparatus for automatic electrical sintering
JP2002322502A (en) * 2001-04-24 2002-11-08 Sumitomo Heavy Ind Ltd Electric pressure sintering device and punch temperature control method therefor
US20050098610A1 (en) * 2001-06-27 2005-05-12 Shunji Onobori Apparatus and method for mounting electronic components
JP2003183708A (en) * 2001-12-11 2003-07-03 Sumitomo Coal Mining Co Ltd Cooling device for current-carrying electrode and assembly of current-carrying electrode and cooling device
EP2506295A2 (en) * 2011-03-28 2012-10-03 Apic Yamada Corporation Bonding apparatus and bonding method
WO2014135151A2 (en) * 2013-03-04 2014-09-12 Danfoss Silicon Power Gmbh Device for low-temperature pressure sintering, method for low-temperature pressure sintering and power electronics assembly

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DE102016102162A1 (en) 2017-08-10
WO2017137420A2 (en) 2017-08-17

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