WO2017118385A1 - Three-layer sub-rack, single board and heat dissipation system - Google Patents

Three-layer sub-rack, single board and heat dissipation system Download PDF

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Publication number
WO2017118385A1
WO2017118385A1 PCT/CN2017/070169 CN2017070169W WO2017118385A1 WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1 CN 2017070169 W CN2017070169 W CN 2017070169W WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1
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WO
WIPO (PCT)
Prior art keywords
subrack
board
heat dissipation
layer
veneer
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PCT/CN2017/070169
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French (fr)
Chinese (zh)
Inventor
叶兵
关童童
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中兴通讯股份有限公司
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Publication of WO2017118385A1 publication Critical patent/WO2017118385A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection

Definitions

  • the embodiments of the present invention relate to the field of communications, and in particular, to a three-layer subrack, a single board, and a heat dissipation system.
  • FIG. 1 a common single-sided three-layer heat dissipation air channel design is shown, in which a plurality of service boards are vertically inserted in the upper and lower layers, and a plurality of cross boards are inserted horizontally in the middle layer, the upper service boards are inserted, and the lower service boards are inverted.
  • the upper and lower backplane high-speed connectors of the upper and lower layers are as close as possible to the cross-board, and the upper, middle and lower sub-frame air passages are relatively independent and do not affect each other.
  • the sub-rack structure of the single-sided three-layer heat dissipation air duct is shown.
  • the upper and lower layers of the sub-frame are completely separated from the middle layer by the partition plate, so that the three-layer air passage of the sub-frame is relatively independent and does not affect each other;
  • the heat dissipation condition of the single board is good, because there is a 2U air supply hole between the upper layer, the lower layer and the middle layer of the subrack, the backplane of the service board and the cross board is connected at a high speed. Relatively more than 2U of space distance, for reducing backplane routing, reducing link loss is not good.
  • the embodiments of the present invention provide a three-layer subrack, a single board, and a heat dissipation system, so as to at least solve the problem of large link loss caused by the long trace of the backplane of the related technology board.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and the upper subrack 30 and the middle subrack 31.
  • the lower layer of the heat dissipation air holes 34 has a height of 0 to 1 U.
  • the upper subrack 30 is used for fixing the first single board, wherein the first board fixed on the upper subrack 30
  • the first board has a first air-filling hole having a height of 2 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board
  • a board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
  • the upper subrack 30 is used for fixing the first single board, wherein the first one fixed on the upper subrack 30 is
  • the first board has a first air-filling hole having a height of 1 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second layer is fixed on the lower subrack 32.
  • the single board has a second air-filling hole having a height of 2 U, and the second air-filling hole is disposed on a side of the second board adjacent to the middle layer sub-frame 31, and the second single board is second.
  • a board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second frame is fixed on the lower subrack 32.
  • the veneer has a second air-filling hole having a height of 1 U, the second air-filling hole is disposed on a side of the second veneer adjacent to the middle sub-frame 31, and the second veneer A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
  • the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.
  • a board for the above-mentioned three-layer subrack, which includes a device area 40 and a single board connector 41, and the board further includes: a supplemental air hole, wherein The air-filling hole is disposed on a lower side of the device region 40, and the height of the air-filling hole is 2U to 1U; the single-board connector 41 is connected to the device region 40, and is disposed on the air supply The hole and/or the right side of the device region 40.
  • the height of the air filling hole is 2U.
  • the air filling hole has a height of 1 U.
  • a heat dissipation system comprising: the above three-layer subrack, and the first single board and/or the second single board, wherein the first The veneer and/or the second veneer are the veneers described above.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31.
  • a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U,
  • the problem of large link loss caused by the long trace of the backplane of the board shortens the backplane trace of the board and reduces link loss.
  • FIG. 1 is a schematic structural view of a heat dissipation air passage based on a single-sided subrack according to the related art
  • FIG. 2 is a schematic structural view of a single-sided subrack according to the related art
  • FIG. 3 is a schematic structural view of a three-layer subrack according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a single board according to an embodiment of the present invention.
  • FIG. 5 is a first schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention
  • FIG. 6 is a second schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention
  • FIG. 7 is a schematic structural view 1 of a heat dissipation air passage based on a double-sided subrack according to an alternative embodiment of the present invention
  • FIG. 8 is a second schematic diagram of a heat dissipation air passage structure based on a double-sided subrack according to an alternative embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a three-layer subrack according to an embodiment of the present invention.
  • the three-layer subrack includes: an upper subrack 30 and a middle layer. a subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, among them,
  • the height of the upper heat dissipation air holes 33 is 0 to 1 U, and/or the height of the lower heat dissipation air holes 34 is 0 to 1 U.
  • the above-mentioned three-layer subrack solves the problem of large link loss caused by the long trace of the backplane of the board, shortens the backplane trace of the board, and reduces link loss.
  • the total height of the subrack is still a subrack of the same height of the related art, for example, a 42U subrack.
  • the upper heat dissipation air hole 33 or the lower heat dissipation air hole 34 is lowered in height, and accordingly, the upper subrack 30 or the lower subrack 32 is increased in height.
  • the increased height of the upper subrack 30 or the lower subrack 32 can be used to set the air supply holes of the single board, thereby ensuring that the overall heat dissipation effect of the subrack remains substantially unchanged.
  • the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 2 U in height.
  • the air hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle subrack 31. One side.
  • the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 1 U in height.
  • a wind hole the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle layer One side of the frame 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 2 U.
  • the air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 1 U.
  • the air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31.
  • the three-layer subrack described above may be a single-sided subrack or a double-sided subrack.
  • a single board applied to the above three-layer subrack is also provided in this embodiment.
  • 4 is a schematic structural diagram of a single board according to an embodiment of the present invention. As shown in FIG. 4, the board includes: a device area 40 and a single board connector 41. The board further includes: a wind filling hole 42 The hole 42 is disposed on the lower side of the device region 40, and the height of the air-filling hole 42 is 2U to 1U; the single-plate connector 41 is connected to the device region 40 and disposed on the right side of the air-filling hole 42 and/or the device region 40.
  • the board provided in this embodiment solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss.
  • the heat dissipation performance of the subrack solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss.
  • the height of the air filling hole 42 is 2U.
  • the height of the air filling hole 42 is 1U.
  • a heat dissipation system is further provided in the embodiment, comprising: the above three-layer subrack, and the first veneer inserted into the upper subrack 30 and/or the second veneer inserted into the lower subrack 32, wherein A single board and/or a second board is a single board applied to the above three-layer subrack.
  • An alternative embodiment of the present invention provides a heat dissipation air channel, which can be applied to data exchange devices of optical communication technologies such as OTN and PTN.
  • a data communication device based on an optical communication technology such as an OTN or a PTN generally includes a plurality of service boards (a single board) and a plurality of cross boards.
  • the service board establishes a data link with the cross board through a high-speed interconnect line on the backplane.
  • the belt-shaped sub-frame structure is used to form a special heat dissipation air channel, which can ensure the high-speed trace length of the back board as much as possible under the premise of good heat dissipation of the board, reduce link loss, and make the device have relatively good signal characteristics and Cross capacity.
  • an alternative embodiment of the present invention provides a heat dissipation air channel scheme to reduce the spatial distance between the service board and the cross board on a related basis, which is advantageous for shortening the high-speed line length of the back board and reducing the link. loss.
  • FIG. 5 Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved.
  • Figure The guide rails of the service board slots shown in the figure extend 1U to the cross-board area, so that the service board size is relatively increased by 1U.
  • a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane.
  • High-speed trace length is beneficial for reducing losses.
  • the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original.
  • a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot, but the air duct is physically completely isolated, and the lower back board high speed connector is very close to the cross board, and the subrack upper and lower layers
  • the distance between the space and the middle layer is reduced to 0, which shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss.
  • the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original.
  • a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane.
  • High-speed trace length is beneficial for reducing losses.
  • the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
  • a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot position, and the high speed connector of the lower back board is very close to the cross board, and the space distance between the upper and lower layers of the subrack is relatively small.
  • the original reduction to 0 shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss.
  • the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
  • the foregoing solution used in the optional embodiment of the present invention adopts the method of optimizing the subrack structure to implement the improvement of the related air duct structure, and reduces the relative spatial distance between the service board and the cross board compared with the related art.
  • the length of the high-speed trace of the backplane is shortened, which is beneficial to reduce transmission loss.
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein. Perform the steps shown or described, or separate them into individual integrated circuit modules, or make multiple modules or steps into a single The integrated circuit module is implemented. Thus, the invention is not limited to any specific combination of hardware and software.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31.
  • a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U,
  • the problem of large link loss caused by the long trace of the backplane of the board is solved.
  • the backplane trace of the board is shortened and the link loss is reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Provided are a three-layer sub-rack, a single board, and a heat dissipation system. The three-layer sub-rack comprises an upper-layer sub-rack 30, a middle-layer sub-rack 31, and a lower-layer sub-rack 32, an upper-layer heat dissipation vent 33 provided between the upper-layer sub-rack 30 and the middle-layer sub-rack 31, and a lower-layer heat dissipation vent 34 provided between the middle-layer sub-rack 31 and the lower-layer sub-rack 32. The height of the upper-layer heat dissipation vent 33 is 0 to 1U and /or the height of the lower-layer heat dissipation vent 34 is 0 to 1U. The embodiments of the present invention solve the problem of a high link loss caused by long wiring on a backplate of a single board, shorten the wiring of the backplate of the single board, and reduce the link loss.

Description

三层子架、单板及散热***Three-layer subrack, single board and cooling system 技术领域Technical field
本发明实施例涉及通信领域，具体而言，涉及一种三层子架、单板及散热***。The embodiments of the present invention relate to the field of communications, and in particular, to a three-layer subrack, a single board, and a heat dissipation system.
背景技术Background technique
随着光通信技术的迅猛发展，市场对基于此技术的数据交换设备的交叉容量要求越来越高，业界对于这种大容量的需求在子架结构上采用腰带型设计，与此相关也形成了各种各样的风道设计。With the rapid development of optical communication technology, the cross-capacity requirements of the data exchange equipment based on this technology are getting higher and higher. The industry needs to adopt a belt type design on the sub-frame structure for this large-capacity structure. A variety of air duct designs.
参照图1，展示了一种常见的单面三层的散热风道设计，上下层竖插若干块业务板，中层横插若干块交叉板，上层业务板正插，下层业务板倒插，使得上下层的下背板高速连接器尽量靠近交叉板，上、中、下三层子架风道相对独立，互不影响。子架上层风道由交叉板上侧2U(1U＝44.45毫米)风抽进冷风，通过机柜顶端排出热风；子架下层风道由机柜底端抽进冷风，从交叉板下侧2U风孔排出热风；子架中层由交叉板右侧与机柜侧边缝隙间抽进冷风，从交叉板左侧排出热风。Referring to FIG. 1 , a common single-sided three-layer heat dissipation air channel design is shown, in which a plurality of service boards are vertically inserted in the upper and lower layers, and a plurality of cross boards are inserted horizontally in the middle layer, the upper service boards are inserted, and the lower service boards are inverted. The upper and lower backplane high-speed connectors of the upper and lower layers are as close as possible to the cross-board, and the upper, middle and lower sub-frame air passages are relatively independent and do not affect each other. The upper air duct of the subrack is drawn into the cold air by the wind on the side of the cross plate 2U (1U=44.45 mm), and the hot air is discharged through the top of the cabinet; the lower air duct of the subrack is drawn into the cold air from the bottom end of the cabinet, and is discharged from the 2U air hole at the lower side of the cross plate. Hot air; the middle layer of the sub-rack is drawn into the cold air from the gap between the right side of the cross plate and the side edge of the cabinet, and the hot air is discharged from the left side of the cross plate.
参照图2，展示了上述单面三层散热风道的子架结构，子架的上下层与中层通过隔板完全隔离，使子架的三层风道相对独立，互不影响；子架上层的下导轨与子架下层的上导轨与子架中框的隔板之间各有2U的补风孔设计，用以构成子架的上下层的风道。Referring to FIG. 2, the sub-rack structure of the single-sided three-layer heat dissipation air duct is shown. The upper and lower layers of the sub-frame are completely separated from the middle layer by the partition plate, so that the three-layer air passage of the sub-frame is relatively independent and does not affect each other; There are 2U air-filling holes between the lower rail and the upper rail of the lower sub-frame and the partition of the sub-frame of the sub-frame to form the air passage of the upper and lower layers of the sub-frame.
受限于这种子架结构设计，虽然单板散热条件良好，但是因为子架上层、下层与中层之间存在2U的补风孔设计，使得业务板与交叉板建立链路的背板高速走线相对多走了2U的空间距离，对于减小背板走线，降低链路损耗不利。Due to the design of the subrack structure, although the heat dissipation condition of the single board is good, because there is a 2U air supply hole between the upper layer, the lower layer and the middle layer of the subrack, the backplane of the service board and the cross board is connected at a high speed. Relatively more than 2U of space distance, for reducing backplane routing, reducing link loss is not good.
发明内容Summary of the invention
本发明实施例提供了一种三层子架、单板及散热***，以至少解决相关技术单板的背板走线长造成的链路损耗大的问题。The embodiments of the present invention provide a three-layer subrack, a single board, and a heat dissipation system, so as to at least solve the problem of large link loss caused by the long trace of the backplane of the related technology board.
根据本发明实施例的一个方面，提供了一种三层子架，包括上层子架30、中层子架31、下层子架32、设置在所述上层子架30和所述中层子架31之间的上层散热风孔33，以及设置在所述中层子架31和所述下层子架32之间的下层散热风孔34，所述上层散热风孔33的高度为0至1U，和/或，所述下层散热风孔34的高度为0至1U。According to an aspect of an embodiment of the present invention, a three-layer subrack is provided, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and the upper subrack 30 and the middle subrack 31. An upper heat dissipation air hole 33, and a lower heat dissipation air hole 34 disposed between the middle layer subrack 31 and the lower layer subrack 32, the upper heat dissipation air hole 33 having a height of 0 to 1 U, and/or The lower layer of the heat dissipation air holes 34 has a height of 0 to 1 U.
可选地，在所述上层散热风孔33的高度为0的情况下，所述上层子架30用于固定第一单板，其中，固定在所述上层子架30上的所述第一单板具有高度为2U的第一补风孔，所述第一补风孔设置在所述第一单板上靠近所述中层子架31的一侧，所述第一单板的第一单板连接器41也设置在所述第一单板上靠近所述中层子架31的一侧。 Optionally, in a case where the height of the upper heat dissipation air hole 33 is 0, the upper subrack 30 is used for fixing the first single board, wherein the first board fixed on the upper subrack 30 The first board has a first air-filling hole having a height of 2 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
可选地，在所述上层散热风孔33的高度为1U的情况下，所述上层子架30用于固定第一单板，其中，固定在所述上层子架30上的所述第一单板具有高度为1U的第一补风孔，所述第一补风孔设置在所述第一单板上靠近所述中层子架31的一侧，所述第一单板的第一单板连接器41也设置在所述第一单板上靠近所述中层子架31的一侧。Optionally, in a case where the height of the upper heat dissipation air hole 33 is 1U, the upper subrack 30 is used for fixing the first single board, wherein the first one fixed on the upper subrack 30 is The first board has a first air-filling hole having a height of 1 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
可选地，在所述下层散热风孔34的高度为0的情况下，所述下层子架32用于固定第二单板，其中，固定在所述下层子架32上的所述第二单板具有高度为2U的第二补风孔，所述第二补风孔设置在所述第二单板上靠近所述中层子架31的一侧，所述第二单板的第二单板连接器41也设置在所述第二单板上靠近所述中层子架31的一侧。Optionally, in a case where the height of the lower layer heat dissipation vent 34 is 0, the lower subrack 32 is used to fix the second veneer, wherein the second layer is fixed on the lower subrack 32. The single board has a second air-filling hole having a height of 2 U, and the second air-filling hole is disposed on a side of the second board adjacent to the middle layer sub-frame 31, and the second single board is second. A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
可选地，在所述下层散热风孔34的高度为1U的情况下，所述下层子架32用于固定第二单板，其中，固定在所述下层子架32上的所述第二单板具有高度为1U的第二补风孔，所述第二补风孔设置在所述第二单板上靠近所述中层子架31的一侧，所述第二单板的第二单板连接器41也设置在所述第二单板上靠近所述中层子架31的一侧。Optionally, in a case where the height of the lower layer heat dissipation vent 34 is 1 U, the lower subrack 32 is used to fix the second veneer, wherein the second frame is fixed on the lower subrack 32. The veneer has a second air-filling hole having a height of 1 U, the second air-filling hole is disposed on a side of the second veneer adjacent to the middle sub-frame 31, and the second veneer A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
可选地，所述三层子架为单面子架或者双面子架。Optionally, the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.
根据本发明实施例的另一个方面，提供了一种应用于上述的三层子架的单板，包括器件区40和单板连接器41，所述单板还包括：补风孔，其中，所述补风孔设置在所述器件区40的下侧，所述补风孔的高度为2U至1U；所述单板连接器41与所述器件区40连接，并设置在所述补风孔和/或所述器件区40的右侧。According to another aspect of the present invention, a board is provided for the above-mentioned three-layer subrack, which includes a device area 40 and a single board connector 41, and the board further includes: a supplemental air hole, wherein The air-filling hole is disposed on a lower side of the device region 40, and the height of the air-filling hole is 2U to 1U; the single-board connector 41 is connected to the device region 40, and is disposed on the air supply The hole and/or the right side of the device region 40.
可选地，所述补风孔的高度为2U。Optionally, the height of the air filling hole is 2U.
可选地，所述补风孔的高度为1U。Optionally, the air filling hole has a height of 1 U.
根据本发明实施例的另一个方面，还提供了一种散热***，包括：上述的三层子架，以及所述第一单板和/或所述第二单板，其中，所述第一单板和/或所述第二单板为上述的单板。According to another aspect of the present invention, a heat dissipation system is further provided, comprising: the above three-layer subrack, and the first single board and/or the second single board, wherein the first The veneer and/or the second veneer are the veneers described above.
通过本发明实施例，采用一种三层子架，包括上层子架30、中层子架31、下层子架32、设置在上层子架30和中层子架31之间的上层散热风孔33，以及设置在中层子架31和下层子架32之间的下层散热风孔34，上层散热风孔33的高度为0至1U，和/或，下层散热风孔34的高度为0至1U，解决了单板的背板走线长造成的链路损耗大的问题，缩短了单板的背板走线，降低了链路损耗。According to the embodiment of the present invention, a three-layer subrack is adopted, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31. And a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U, The problem of large link loss caused by the long trace of the backplane of the board shortens the backplane trace of the board and reduces link loss.
附图说明DRAWINGS
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：The drawings described herein are intended to provide a further understanding of the invention, and are intended to be a part of the invention. In the drawing:
图1是根据相关技术的基于单面子架的散热风道结构示意图；1 is a schematic structural view of a heat dissipation air passage based on a single-sided subrack according to the related art;
图2是根据相关技术的单面子架的结构示意图； 2 is a schematic structural view of a single-sided subrack according to the related art;
图3是根据本发明实施例的三层子架的结构示意图；3 is a schematic structural view of a three-layer subrack according to an embodiment of the present invention;
图4是根据本发明实施例的单板的结构示意图；4 is a schematic structural diagram of a single board according to an embodiment of the present invention;
图5是根据本发明可选实施例的基于单面子架的散热风道结构示意图一；FIG. 5 is a first schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention; FIG.
图6是根据本发明可选实施例的基于单面子架的散热风道结构示意图二；6 is a second schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention;
图7是根据本发明可选实施例的基于双面子架的散热风道结构示意图一；7 is a schematic structural view 1 of a heat dissipation air passage based on a double-sided subrack according to an alternative embodiment of the present invention;
图8是根据本发明可选实施例的基于双面子架的散热风道结构示意图二。FIG. 8 is a second schematic diagram of a heat dissipation air passage structure based on a double-sided subrack according to an alternative embodiment of the present invention.
具体实施方式detailed description
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。The invention will be described in detail below with reference to the drawings in conjunction with the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。It is to be understood that the terms "first", "second" and the like in the specification and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a particular order or order.
在本实施例中提供了一种三层子架，图3是根据本发明实施例的三层子架的结构示意图，如图3所示，该三层子架包括：上层子架30、中层子架31、下层子架32、设置在上层子架30和中层子架31之间的上层散热风孔33，以及设置在中层子架31和下层子架32之间的下层散热风孔34，其中，In this embodiment, a three-layer subrack is provided. FIG. 3 is a schematic structural diagram of a three-layer subrack according to an embodiment of the present invention. As shown in FIG. 3, the three-layer subrack includes: an upper subrack 30 and a middle layer. a subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, among them,
上层散热风孔33的高度为0至1U，和/或，下层散热风孔34的高度为0至1U。The height of the upper heat dissipation air holes 33 is 0 to 1 U, and/or the height of the lower heat dissipation air holes 34 is 0 to 1 U.
通过上述三层子架，在将上层散热风孔33的高度由2U降低为1U或者0之后，则可以缩短上层子架30上单板的背板走线长度；在将下层散热风孔3424的高度由2U降低为1U或者0之后，则可以缩短下层子架32上单板的的背板走线长度。可见，通过上述三层子架，解决了单板的背板走线长造成的链路损耗大的问题，缩短了单板的背板走线，降低了链路损耗。Through the above three-layer subrack, after the height of the upper heat dissipation air hole 33 is reduced from 2U to 1U or 0, the length of the backplane trace of the single board on the upper subrack 30 can be shortened; in the lower layer heat dissipation air hole 3424 After the height is reduced from 2U to 1U or 0, the length of the backplane of the single board on the lower subrack 32 can be shortened. It can be seen that the above-mentioned three-layer subrack solves the problem of large link loss caused by the long trace of the backplane of the board, shortens the backplane trace of the board, and reduces link loss.
在具体实施中，子架的总高度仍然采用相关技术相同高度的子架，例如，42U子架。上层散热风孔33或者下层散热风孔34降低了高度，相应的，上层子架30或者下层子架32则增加了高度。上层子架30或者下层子架32增加的高度可以用来设置单板的补风孔，从而可以保证子架的整体散热效果保持基本不变。In a specific implementation, the total height of the subrack is still a subrack of the same height of the related art, for example, a 42U subrack. The upper heat dissipation air hole 33 or the lower heat dissipation air hole 34 is lowered in height, and accordingly, the upper subrack 30 or the lower subrack 32 is increased in height. The increased height of the upper subrack 30 or the lower subrack 32 can be used to set the air supply holes of the single board, thereby ensuring that the overall heat dissipation effect of the subrack remains substantially unchanged.
例如，在上层散热风孔33的高度为0的情况下，上层子架30用于固定第一单板，其中，固定在上层子架30上的第一单板具有高度为2U的第一补风孔，第一补风孔设置在第一单板上靠近中层子架31的一侧，第一单板的第一单板连接器41也设置在第一单板上靠近中层子架31的一侧。For example, in a case where the height of the upper heat dissipation air hole 33 is 0, the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 2 U in height. The air hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle subrack 31. One side.
例如，在上层散热风孔33的高度为1U的情况下，上层子架30用于固定第一单板，其中，固定在上层子架30上的第一单板具有高度为1U的第一补风孔，第一补风孔设置在第一单板上靠近中层子架31的一侧，第一单板的第一单板连接器41也设置在第一单板上靠近中层子 架31的一侧。For example, in a case where the height of the upper heat dissipation air vent 33 is 1 U, the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 1 U in height. a wind hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle layer One side of the frame 31.
例如，在下层散热风孔34的高度为0的情况下，下层子架32用于固定第二单板，其中，固定在下层子架32上的第二单板具有高度为2U的第二补风孔，第二补风孔设置在第二单板上靠近中层子架31的一侧，第二单板的第二单板连接器41也设置在第二单板上靠近中层子架31的一侧。For example, in a case where the height of the lower layer heat dissipation vent 34 is 0, the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 2 U. The air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31. One side.
例如，在下层散热风孔34的高度为1U的情况下，下层子架32用于固定第二单板，其中，固定在下层子架32上的第二单板具有高度为1U的第二补风孔，第二补风孔设置在第二单板上靠近中层子架31的一侧，第二单板的第二单板连接器41也设置在第二单板上靠近中层子架31的一侧。For example, in a case where the height of the lower heat dissipation air vent 34 is 1 U, the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 1 U. The air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31. One side.
可选地，上述的三层子架可以为单面子架或者双面子架。Optionally, the three-layer subrack described above may be a single-sided subrack or a double-sided subrack.
在本实施例中还提供了一种应用于上述的三层子架的单板。图4是根据本发明实施例的单板的结构示意图，如图4所示，该单板包括：器件区40和单板连接器41，单板还包括：补风孔42，其中，补风孔42设置在器件区40的下侧，补风孔42的高度为2U至1U；单板连接器41与器件区40连接，并设置在补风孔42和/或器件区40的右侧。A single board applied to the above three-layer subrack is also provided in this embodiment. 4 is a schematic structural diagram of a single board according to an embodiment of the present invention. As shown in FIG. 4, the board includes: a device area 40 and a single board connector 41. The board further includes: a wind filling hole 42 The hole 42 is disposed on the lower side of the device region 40, and the height of the air-filling hole 42 is 2U to 1U; the single-plate connector 41 is connected to the device region 40 and disposed on the right side of the air-filling hole 42 and/or the device region 40.
采用本实施例提供的单板，在解决了单板的背板走线长造成的链路损耗大的问题，缩短了单板的背板走线，降低了链路损耗的前提下，还保证了子架的散热性能。The board provided in this embodiment solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss. The heat dissipation performance of the subrack.
可选地，补风孔42的高度为2U。Optionally, the height of the air filling hole 42 is 2U.
可选地，补风孔42的高度为1U。Optionally, the height of the air filling hole 42 is 1U.
在本实施例中还提供了一种散热***，包括：上述的三层子架，以及***上层子架30的第一单板和/或***下层子架32的第二单板，其中，第一单板和/或第二单板为应用于上述的三层子架的单板。A heat dissipation system is further provided in the embodiment, comprising: the above three-layer subrack, and the first veneer inserted into the upper subrack 30 and/or the second veneer inserted into the lower subrack 32, wherein A single board and/or a second board is a single board applied to the above three-layer subrack.
为了使本发明实施例的描述更加清楚，下面结合可选实施例进行描述和说明。In order to make the description of the embodiments of the present invention more clear, the following description and description are made in conjunction with the exemplary embodiments.
本发明可选实施例提供了一种散热风道，该散热风道可以应用于OTN、PTN等光通信技术的数据交换设备。An alternative embodiment of the present invention provides a heat dissipation air channel, which can be applied to data exchange devices of optical communication technologies such as OTN and PTN.
基于OTN、PTN等光通信技术的数据通信设备，一般包含若干业务板(一种单板)和若干交叉板，业务板通过背板上的高速互连线建立与交叉板的数据链路，通过使用腰带型子架结构形成特殊的散热风道，可以保证单板具有良好散热的前提下尽可能地减小背板高速走线长度，降低链路损耗，使设备具有相对较好的信号特征及交叉容量。A data communication device based on an optical communication technology such as an OTN or a PTN generally includes a plurality of service boards (a single board) and a plurality of cross boards. The service board establishes a data link with the cross board through a high-speed interconnect line on the backplane. The belt-shaped sub-frame structure is used to form a special heat dissipation air channel, which can ensure the high-speed trace length of the back board as much as possible under the premise of good heat dissipation of the board, reduce link loss, and make the device have relatively good signal characteristics and Cross capacity.
为了解决上述问题，本发明可选实施例提出了一种散热风道方案，以在相关基础上减小业务板与交叉板之间的空间距离，利于缩短背板高速走线长度，降低链路损耗。In order to solve the above problem, an alternative embodiment of the present invention provides a heat dissipation air channel scheme to reduce the spatial distance between the service board and the cross board on a related basis, which is advantageous for shortening the high-speed line length of the back board and reducing the link. loss.
参照图5所示。与图1所示相关技术方案的单面子架散热风道设计相比，在子架结构上，其他尺寸与结构不做改变，针对子架上层及下层槽位高度及业务板面板部分进行改进。将图 中所示业务板槽位的导轨向交叉板区域延伸1U，这样业务板尺寸相对增大1U。同时在业务板面板上部留出1U的补风孔，这样业务板下背板高速连接器相对更靠近交叉板，子架上下层与中层之间的空间距离较原来减少了1U，缩短了背板高速走线长度，对于降低损耗有益。较之原来子架结构，虽然上下层的进风孔区域高度减小到了1U，但同时单板面板上增加了1U的补风孔，散热效果与原先相比，并没有实质的降低。Refer to Figure 5. Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved. Figure The guide rails of the service board slots shown in the figure extend 1U to the cross-board area, so that the service board size is relatively increased by 1U. At the same time, a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane. High-speed trace length is beneficial for reducing losses. Compared with the original sub-frame structure, although the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original.
参照图6所示。与图1所示相关技术方案的单面子架散热风道设计相比，在子架结构上，其他尺寸与结构不做改变，针对子架上层及下层槽位高度及业务板面板部分进行改进。将图中所示业务板槽位的导轨向交叉板区域延伸2U，这样业务板尺寸相对增大2U。同时在业务板面板上部留出2U的补风孔，这样业务板与交叉板在槽位上直接相连，但风道物理上完全隔离，下背板高速连接器非常靠近交叉板，子架上下层与中层之间的空间距离较原来减少为0，缩短了背板高速走线长度，对于降低损耗非常有益。较之原来子架结构，虽然上下层的进风孔区域被去除，但同时单板面板上增加了2U的补风孔，散热效果与原先相比，不会有实质的降低。Refer to Figure 6. Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 2U, so that the service board size is increased by 2U. At the same time, a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot, but the air duct is physically completely isolated, and the lower back board high speed connector is very close to the cross board, and the subrack upper and lower layers The distance between the space and the middle layer is reduced to 0, which shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss. Compared with the original subrack structure, although the air inlet hole area of the upper and lower layers is removed, at the same time, the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original.
参照图7所示。与图1所示相关技术方案的单面子架散热风道设计相比，扩展为双面子架结构，其他基本尺寸与结构不做改变，针对双面子架上层及下层槽位高度及业务板面板部分进行改进。将图中所示业务板槽位的导轨向交叉板区域延伸1U，这样业务板尺寸相对增大1U。同时在业务板面板上部留出1U的补风孔，这样业务板下背板高速连接器相对更靠近交叉板，子架上下层与中层之间的空间距离较原来减少了1U，缩短了背板高速走线长度，对于降低损耗有益。较之原来子架结构，虽然上下层的进风孔区域高度减小到了1U，但同时单板面板上增加了1U的补风孔，散热效果与原先相比，并没有实质的降低。扩展后双面子架前后两面风道各自独立。Refer to Figure 7. Compared with the one-sided sub-frame heat dissipation air channel design shown in FIG. 1 , the expansion is a double-sided sub-rack structure, and other basic dimensions and structures are not changed, and the upper and lower slot heights and service boards of the double-sided sub-frame are The panel section is improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 1U, so that the service board size is increased by 1U. At the same time, a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane. High-speed trace length is beneficial for reducing losses. Compared with the original sub-frame structure, although the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
参照图8所示。与图1所示相关技术方案的单面子架散热风道设计相比，扩展为双面子架结构，其他基本尺寸与结构不做改变，也是针对双面子架上层及下层槽位高度及业务板面板部分进行改进。将图中所示业务板槽位的导轨向交叉板区域延伸2U，这样业务板尺寸相对增大2U。同时在业务板面板上部留出2U的补风孔，这样业务板与交叉板在槽位上直接相连，下背板高速连接器非常靠近交叉板，子架上下层与中层之间的空间距离较原来减少为0，缩短了背板高速走线长度，对于降低损耗非常有益。较之原来子架结构，虽然上下层的进风孔区域被去除，但同时单板面板上增加了2U的补风孔，散热效果与原先相比，不会有实质的降低。扩展后双面子架前后两面风道各自独立。Refer to Figure 8. Compared with the single-sided sub-rack heat dissipation air channel design shown in FIG. 1 , the expansion is a double-sided sub-frame structure, and other basic dimensions and structures are not changed, and the height and service of the upper and lower slots of the double-sided sub-frame are also The panel panel section was improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 2U, so that the service board size is increased by 2U. At the same time, a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot position, and the high speed connector of the lower back board is very close to the cross board, and the space distance between the upper and lower layers of the subrack is relatively small. The original reduction to 0 shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss. Compared with the original subrack structure, although the air inlet hole area of the upper and lower layers is removed, at the same time, the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
本发明可选实施例所使用的上述方案，采用了优化子架结构的方式，实现对相关风道结构的改进，与相关技术相比，减小了业务板与交叉板之间的相对空间距离，缩短了背板高速走线的长度，有利于降低传输损耗。The foregoing solution used in the optional embodiment of the present invention adopts the method of optimizing the subrack structure to implement the improvement of the related air duct structure, and reduces the relative spatial distance between the service board and the cross board compared with the related art. The length of the high-speed trace of the backplane is shortened, which is beneficial to reduce transmission loss.
显然，本领域的技术人员应该明白，上述的本发明的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个 集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。It will be apparent to those skilled in the art that the various modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein. Perform the steps shown or described, or separate them into individual integrated circuit modules, or make multiple modules or steps into a single The integrated circuit module is implemented. Thus, the invention is not limited to any specific combination of hardware and software.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.
工业实用性Industrial applicability
在本发明实施例中，采用一种三层子架，包括上层子架30、中层子架31、下层子架32、设置在上层子架30和中层子架31之间的上层散热风孔33，以及设置在中层子架31和下层子架32之间的下层散热风孔34，上层散热风孔33的高度为0至1U，和/或，下层散热风孔34的高度为0至1U，解决了单板的背板走线长造成的链路损耗大的问题，缩短了单板的背板走线，降低了链路损耗。 In the embodiment of the present invention, a three-layer subrack is adopted, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31. And a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U, The problem of large link loss caused by the long trace of the backplane of the board is solved. The backplane trace of the board is shortened and the link loss is reduced.

Claims (10)

  1. 一种三层子架，包括上层子架30、中层子架31、下层子架32、设置在所述上层子架30和所述中层子架31之间的上层散热风孔33，以及设置在所述中层子架31和所述下层子架32之间的下层散热风孔34，A three-layer subrack includes an upper subrack 30, a middle subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower layer air vent 34 between the middle subrack 31 and the lower subrack 32,
    所述上层散热风孔33的高度为0至1U，和/或，所述下层散热风孔34的高度为0至1U。The height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U.
  2. 根据权利要求1所述的三层子架，其中，在所述上层散热风孔33的高度为0的情况下，所述上层子架30用于固定第一单板，其中，固定在所述上层子架30上的所述第一单板具有高度为2U的第一补风孔，所述第一补风孔设置在所述第一单板上靠近所述中层子架31的一侧，所述第一单板的第一单板连接器41也设置在所述第一单板上靠近所述中层子架31的一侧。The three-layer subrack according to claim 1, wherein the upper subrack 30 is used for fixing the first veneer in a case where the height of the upper heat dissipation air hole 33 is 0, wherein the The first veneer on the upper subrack 30 has a first air supply hole having a height of 2 U, and the first air supply hole is disposed on a side of the first veneer adjacent to the middle subrack 31. The first single board connector 41 of the first board is also disposed on a side of the first board adjacent to the middle layer subrack 31.
  3. 根据权利要求1所述的三层子架，其中，在所述上层散热风孔33的高度为1U的情况下，所述上层子架30用于固定第一单板，其中，固定在所述上层子架30上的所述第一单板具有高度为1U的第一补风孔，所述第一补风孔设置在所述第一单板上靠近所述中层子架31的一侧，所述第一单板的第一单板连接器41也设置在所述第一单板上靠近所述中层子架31的一侧。The three-layer subrack according to claim 1, wherein the upper subrack 30 is used for fixing the first veneer in a case where the height of the upper heat dissipation air hole 33 is 1 U, wherein the The first veneer on the upper subrack 30 has a first air supply hole having a height of 1 U, and the first air supply hole is disposed on a side of the first veneer adjacent to the middle subrack 31. The first single board connector 41 of the first board is also disposed on a side of the first board adjacent to the middle layer subrack 31.
  4. 根据权利要求1所述的三层子架，其中，在所述下层散热风孔34的高度为0的情况下，所述下层子架32用于固定第二单板，其中，固定在所述下层子架32上的所述第二单板具有高度为2U的第二补风孔，所述第二补风孔设置在所述第二单板上靠近所述中层子架31的一侧，所述第二单板的第二单板连接器41也设置在所述第二单板上靠近所述中层子架31的一侧。The three-layer subrack according to claim 1, wherein the lower subrack 32 is used for fixing the second veneer in a case where the height of the lower heat dissipation vent 34 is 0, wherein the The second veneer on the lower subrack 32 has a second air supply hole having a height of 2 U, and the second air supply hole is disposed on a side of the second veneer adjacent to the middle subrack 31. The second board connector 41 of the second board is also disposed on a side of the second board adjacent to the middle subrack 31.
  5. 根据权利要求1所述的三层子架，其中，在所述下层散热风孔34的高度为1U的情况下，所述下层子架32用于固定第二单板，其中，固定在所述下层子架32上的所述第二单板具有高度为1U的第二补风孔，所述第二补风孔设置在所述第二单板上靠近所述中层子架31的一侧，所述第二单板的第二单板连接器41也设置在所述第二单板上靠近所述中层子架31的一侧。The three-layer subrack according to claim 1, wherein the lower subrack 32 is used for fixing the second veneer in the case where the height of the lower heat dissipation vent 34 is 1 U, wherein the The second veneer on the lower subrack 32 has a second air supply hole having a height of 1 U, and the second air supply hole is disposed on a side of the second veneer adjacent to the middle subrack 31. The second board connector 41 of the second board is also disposed on a side of the second board adjacent to the middle subrack 31.
  6. 根据权利要求1至5中任一项所述的三层子架，其中，所述三层子架为单面子架或者双面子架。The three-layer subrack according to any one of claims 1 to 5, wherein the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.
  7. 一种应用于权利要求1至6中任一项所述的三层子架的单板，包括器件区40和单板连接器41，所述单板还包括：补风孔，其中，A board for a three-layer sub-rack according to any one of claims 1 to 6, comprising a device area 40 and a single-board connector 41, the board further comprising: a wind-filling hole, wherein
    所述补风孔设置在所述器件区40的下侧，所述补风孔的高度为2U至1U；The air filling hole is disposed on a lower side of the device region 40, and the height of the air filling hole is 2U to 1U;
    所述单板连接器41与所述器件区40连接，并设置在所述补风孔和/或所述器件区40的右侧。The single board connector 41 is connected to the device region 40 and disposed on the right side of the air supply hole and/or the device region 40.
  8. 根据权利要求7所述的单板，其中，所述补风孔的高度为2U。 The veneer according to claim 7, wherein the air filling hole has a height of 2 U.
  9. 根据权利要求7所述的单板，其中，所述补风孔的高度为1U。The veneer according to claim 7, wherein the air filling hole has a height of 1 U.
  10. 一种散热***，包括：如权利要求1至6中任一项所述的三层子架，以及所述第一单板和/或所述第二单板，其中，所述第一单板和/或所述第二单板为如权利要求7至9中任一项所述的单板。 A heat dissipation system comprising: the three-layer subrack according to any one of claims 1 to 6, and the first veneer and/or the second veneer, wherein the first veneer And/or the second veneer is a veneer according to any one of claims 7 to 9.
PCT/CN2017/070169 2016-01-06 2017-01-04 Three-layer sub-rack, single board and heat dissipation system WO2017118385A1 (en)

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