WO2017118084A1 - Conveying apparatus, conveying method, and evaporation device - Google Patents

Conveying apparatus, conveying method, and evaporation device Download PDF

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Publication number
WO2017118084A1
WO2017118084A1 PCT/CN2016/098977 CN2016098977W WO2017118084A1 WO 2017118084 A1 WO2017118084 A1 WO 2017118084A1 CN 2016098977 W CN2016098977 W CN 2016098977W WO 2017118084 A1 WO2017118084 A1 WO 2017118084A1
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WIPO (PCT)
Prior art keywords
substrate
conveying apparatus
carrier
slidable member
fixing
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PCT/CN2016/098977
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French (fr)
Chinese (zh)
Inventor
邹清华
郭书鹏
胡长奇
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京东方科技集团股份有限公司
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Priority to US15/540,545 priority Critical patent/US10354901B2/en
Publication of WO2017118084A1 publication Critical patent/WO2017118084A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • the present invention relates to the field of display, and in particular to a conveying device, a conveying method, and a vapor deposition device.
  • an evaporation apparatus generally uses a continuous transfer type (inline type) and an eight-claw type (cluster type).
  • the eight-claw type vapor deposition apparatus generally uses a mechanical arm to transport a glass substrate into each cavity, and after being aligned with a mask, vapor deposition is performed.
  • the substrate is fixed by the transport device, and after being aligned with the mask, the OLED device is formed on the substrate by passing the temperature above the heating source filled with different materials at a constant speed.
  • the use of continuous transfer type evaporation equipment has the advantage of saving equipment space and reducing tact time.
  • the continuous transport design how to carry and transport the substrate to align with the mask and then enter the vapor deposition chamber is a difficult problem. Due to factors such as the weight of the large-sized substrate and its own shape variable (bending amount), it is generally carried in an upright manner. This inevitably requires that the linear heating source is also upright, thereby increasing the difficulty of controlling the linear uniformity of the organic material during the evaporation process.
  • the coated surface of the substrate is disposed obliquely upward, the coated surface of the substrate is more likely to deposit particles, thereby increasing the probability of defects caused by the particles and reducing the yield of the product.
  • the large-size vapor deposition apparatus also adopts a transfer mode in which the TFT (thin film transistor) surface (ie, the plating surface) of the substrate is downward.
  • the substrate is generally fixed to the transport device by electrostatic or adhesive means.
  • the electrostatic type of fixing is liable to damage the TFT of the substrate.
  • the adhesive type the stickiness of the stickies is not easily controlled, and the stickiness is too small to cause the substrate to fall, and if the stickiness is too large, the subsequent separation is difficult. Further, when the viscous material is heated by vapor deposition, problems such as viscous change and viscous aging may occur.
  • the embodiments of the present invention are directed to solving one or more of the above technical problems or other technical problems.
  • the embodiment of the invention provides a conveying device, comprising:
  • a fixing mechanism for mechanically fixing the substrate to the carrier mechanism.
  • the conveying device can reduce damage to the conveyed substrate and facilitate the picking up and separation of the substrate.
  • the conveying device further comprises a lifting mechanism, the bearing mechanism is provided with a perforation, and the lifting mechanism controls the lifting and lowering of the substrate by passing through the perforation.
  • the perforations are uniformly disposed on the carrying mechanism.
  • the lifting mechanism includes a lifting pin corresponding to each of the perforations.
  • the conveying device further includes a driver for driving the lifting mechanism to elevate and lower.
  • the securing mechanism includes a slidable member disposed at an edge of the carrier mechanism and configured to secure the substrate.
  • the fixing mechanism comprises two sets of slidable members, and each set of slidable members comprises two oppositely disposed two slidable members.
  • the slidable member is made of a metal material.
  • the slidable member is provided with a groove structure, and an edge portion of the substrate is fixed by being embedded in the groove structure
  • an elastic lubricating layer is disposed in the groove structure.
  • the slidable member is detachably mounted on the carrying mechanism.
  • the cross-sectional shape of the slidable member perpendicular to the extending direction thereof is a concave shape or an L shape.
  • the carrying mechanism is provided with a protrusion at a position for carrying the substrate, the protrusion is located in a region outside the through hole, and the protrusion is used when the substrate is placed at The carrier portion is suspended on the edge portion of the substrate.
  • the lower surface of the groove structure is flush with the upper surface of the protrusion.
  • a lower surface of the groove structure is flush with a lower surface of the slidable member, an upper surface of the groove structure is higher than an upper surface of the protrusion, and a height between the two The difference is greater than or equal to the thickness of the substrate.
  • Embodiments of the present invention also provide an evaporation apparatus including the above-described conveying apparatus.
  • the embodiment of the invention further provides a transport method, including:
  • the substrate is mechanically fixed to the carrier by a securing mechanism.
  • placing the substrate on the carrying mechanism comprises:
  • the lowering mechanism is controlled to descend, and the substrate is lowered to place the substrate on the carrier mechanism.
  • the method further includes:
  • the coating surface of the substrate is controlled upward by controlling the supporting mechanism, releasing the fixing mechanism to the substrate, and controlling the lifting mechanism to rise, thereby Separated from the carrier mechanism.
  • the substrate is mechanically fixed to the support mechanism by the fixing mechanism, and the damage to the substrate can be reduced and the reliability of the substrate can be improved, compared with the electrostatic type and the adhesive type. And facilitate the access and separation of the substrate.
  • FIG. 1 is a schematic view of a conveying device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of a slidable member provided by an embodiment of the present invention.
  • FIG. 3 is a schematic view of another slidable member provided by an embodiment of the present invention.
  • FIG. 10 is a flowchart of a transport method according to an embodiment of the present invention.
  • the embodiment of the invention provides a conveying device, which comprises:
  • a fixing mechanism for mechanically fixing the substrate to the carrier mechanism.
  • the substrate is mechanically fixed to the support mechanism by the fixing mechanism, and the damage to the substrate can be reduced and the reliability of the substrate can be improved as compared with the electrostatic type and the adhesive type. And facilitate the access and separation of the substrate.
  • the fixing mechanism mechanically fixes the substrate.
  • the fixing mechanism is a mechanical fixing structure such as a buckle or an elastic clip, and the fixing mechanism is used to press the substrate against the supporting mechanism to achieve fixing.
  • the conveying device in order to facilitate the access and separation of the substrate, further includes a lifting mechanism, and the bearing mechanism is provided with a perforation.
  • the lifting mechanism controls the lifting of the substrate by passing through the perforations to facilitate placement of the substrate on the carrier structure and separation of the substrate from the carrier mechanism.
  • the securing mechanism secures the substrate to the carrier mechanism by mechanical attachment.
  • a slidable member is provided at an edge position of the carrying mechanism.
  • the slidable member is provided with a groove structure, and the substrate can be fixed to the supporting mechanism by embedding the edge portion of the substrate into the groove structure.
  • FIG. 1 is a schematic diagram of a conveying device according to an embodiment of the present invention.
  • the conveying device includes a bearing mechanism, a lifting mechanism, and a fixing mechanism.
  • the carrying mechanism 100 is used to carry a substrate on which a plurality of through holes 110 are uniformly disposed.
  • the lifting mechanism includes a lifting pin 210 corresponding to each of the perforations 110.
  • the lifting pin 210 controls the substrate lifting by passing through the perforations 110, thereby enabling the substrate to be placed on the carrier mechanism or to separate the substrate from the carrier mechanism.
  • a securing mechanism is used to secure the substrate to the carrier mechanism 100.
  • the securing mechanism includes two sets of slidable members.
  • Each set of slidable members includes two oppositely disposed two slidable members, one of which includes a slidable member 310 and a slidable member 330, and the other of which includes a slidable member 320 and a slidable member 340.
  • Each of the edges of the rectangular substrate can be fixed by the above two sets of slidable members such that the periphery of the substrate is fixed by the slidable member.
  • the edge portion of the substrate is embedded in the groove structure to enable the substrate to be fixed to the carrier mechanism.
  • the cross-sectional shape of the slidable member perpendicular to its extending direction is a concave shape as shown in FIG.
  • the cross-sectional shape is an L-shape as shown in Fig. 3, that is, the lower surface of the groove structure 311 is flush with the lower surface of the slidable member.
  • the edge portion of the substrate can be fixed to the carrier mechanism 100 by being embedded in the groove structure 311 of the slidable member.
  • a projection 120 is further provided at a position where the carrier mechanism is used to carry the substrate.
  • the protrusion 120 is located outside the perforation 110.
  • Openings corresponding to the perforations 100 are provided between the projections 120.
  • the shape and size of the opening are the same as the shape and size of the perforation 110.
  • the embodiment of the present invention does not limit the size and shape of the opening portion as long as the opening portion does not affect the passage of the lifting needle 210 of the lifting mechanism.
  • the area of the protrusion 120 is smaller than the area of the substrate to be carried, and the lower surface of the groove structure 311 in the slidable member is located on the same level as the upper surface of the protrusion 120.
  • the edge portion of the substrate is suspended by the protrusions 120 when the substrate is placed on the carrier mechanism 100, thereby facilitating the embedding of the edge portion of the substrate into the groove structure of the slidable member.
  • the above substrate is a display substrate.
  • the AA area (display area) of the substrate is placed at the raised position, and the edge area outside the AA area is suspended at the edge of the protrusion.
  • the slidable member is made of a metal material, for example, made of a metal having a good strength, so that the micro-deformation of the groove structure does not affect the fixing and alignment of the substrate.
  • an elastic lubricating layer is further disposed in the groove structure of the slidable member.
  • an organic coating is placed within the trench structure to prevent the trench structure from rubbing the substrate to cause the substrate to form microcracks and break.
  • the slidable member is detachably mounted on the carrying mechanism, so that substrates of different thicknesses can be transported.
  • the fixing mechanism employs a mechanical substrate fixing method.
  • the same action and time are applied to each substrate, eliminating the difference between the sheets of different substrate fixing methods.
  • the adhesive fixing method the sorption and separation time necessary for the adhesion type is saved, and the tact time is saved.
  • the conveying device further includes a driver for driving the lifting mechanism to move up and down, and the lifting and lowering mechanism is controlled by the driver to lift and lower, so that the substrate can be picked up and separated.
  • Embodiments of the present invention also provide an evaporation apparatus including the above-described conveying apparatus.
  • the vapor deposition apparatus has a continuous transfer type configuration.
  • the present invention also provides a method for transporting by using the above-mentioned transport device, comprising:
  • the substrate is placed on its carrying mechanism.
  • the substrate is placed on its carrying mechanism.
  • the above-described transfer method of the present invention is used, for example, in an evaporation process, and after mechanically fixing the substrate to the support mechanism by a fixing mechanism, the method further includes:
  • the above transfer method is used, for example, in an evaporation process of an array substrate, and the method includes:
  • the slidable member has a concave cross-sectional shape and is slidable in a direction perpendicular to the sides of the substrate in a plane parallel to the substrate.
  • the technical features in the above embodiments may be combined with each other as long as the technical features do not contradict each other.
  • the protrusion 120 shown in FIG. 2 is the same as that shown in FIG.
  • the slidable member 310 is combined.
  • the upper surface of the groove structure 311 in the slidable member 310 is higher than the upper surface of the protrusion 120, and the height difference between the two is greater than or equal to the thickness of the substrate to be carried, so that the groove structure 311 accommodates the edge portion of the substrate.
  • the substrate is fixed to the carrier mechanism 100.
  • the substrate When the substrate is placed on the carrier mechanism 100, the substrate is carried by the protrusion 120 in the AA region, the edge region outside the AA region is suspended at the edge of the protrusion 120, and the substrate is carried by the upper surface of the groove structure 311 in the edge region. Limit. That is, the substrate carried on the carrier mechanism 100 is sandwiched between the upper surface of the groove structure 311 and the upper surface of the protrusion 120.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A conveying apparatus, a conveying method, and an evaporation device. The conveying apparatus comprises: a carrying mechanism (100) used for carrying a substrate; and a fixing mechanism used for mechanically fixing the substrate on the carrying mechanism. Compared with electrostatic and adhesive fixation modes, by mechanically fixing the substrate on the carrying mechanism using the fixing mechanism, damage to the substrate is reduced, fixation reliability of the substrate is improved, and convenience in taking and separation of the substrate is achieved.

Description

搬送装置、搬送方法及蒸镀设备Transfer device, transfer method, and evaporation device 技术领域Technical field
本发明涉及显示领域，尤其涉及一种搬送装置、搬送方法及蒸镀设备。The present invention relates to the field of display, and in particular to a conveying device, a conveying method, and a vapor deposition device.
背景技术Background technique
目前，有机发光二极管(OLED)的主流制备工艺是蒸镀技术，蒸镀设备一般使用连续搬送式(inline式)和八爪式(cluster式)的构造。八爪式的蒸镀设备一般使用机械手臂搬送玻璃基板进入各个腔体，待与掩膜板(mask)进行对位后，再进行蒸镀。连续搬送式则是利用搬送装置固定基板，待与掩膜板对位后，匀速经过各个填装有不同材料的加热源的上方，从而在基板上形成OLED器件。At present, the mainstream preparation process of an organic light emitting diode (OLED) is an evaporation technique, and an evaporation apparatus generally uses a continuous transfer type (inline type) and an eight-claw type (cluster type). The eight-claw type vapor deposition apparatus generally uses a mechanical arm to transport a glass substrate into each cavity, and after being aligned with a mask, vapor deposition is performed. In the continuous transport mode, the substrate is fixed by the transport device, and after being aligned with the mask, the OLED device is formed on the substrate by passing the temperature above the heating source filled with different materials at a constant speed.
相比八爪式的构造，使用连续搬送式的蒸镀设备具有节省设备空间和减少生产时间(tact time)的优势。但是在连续搬送式设计中，如何承载和搬送基板，使其与掩膜板对位，再进入蒸镀腔体，是一个难度较大的问题。由于大尺寸基板的重量和自身的形变量(bending量)等因素，一般采用直立式方式搬送。这势必要求线性加热源也是直立式，从而增加了控制线性加热源保持蒸镀过程中有机材料膜厚均一性的难度。而且在采用直立式的搬送过程中，由于基板的镀膜面呈斜向上设置，使基板的镀膜面更容易沉积颗粒(particle)，从而增加了颗粒导致的不良几率，降低了产品的良率。Compared to the eight-claw configuration, the use of continuous transfer type evaporation equipment has the advantage of saving equipment space and reducing tact time. However, in the continuous transport design, how to carry and transport the substrate to align with the mask and then enter the vapor deposition chamber is a difficult problem. Due to factors such as the weight of the large-sized substrate and its own shape variable (bending amount), it is generally carried in an upright manner. This inevitably requires that the linear heating source is also upright, thereby increasing the difficulty of controlling the linear uniformity of the organic material during the evaporation process. Moreover, in the vertical transfer process, since the coated surface of the substrate is disposed obliquely upward, the coated surface of the substrate is more likely to deposit particles, thereby increasing the probability of defects caused by the particles and reducing the yield of the product.
为了避免上述问题，在连续搬送式的设计中，大尺寸蒸镀设备也采用使基板的TFT(薄膜晶体管)面(即镀膜面)向下的传送方式。为了克服大尺寸基板的重量和自身的形变量等因素，一般采用静电式或者粘附式等方式将基板固定在搬送装置上。但是，静电式的固定方式容易对基板的TFT造成损伤。而对于粘附式，粘性物的粘性大小不易被控制，粘性过小容易导致基板掉落，粘性过大则导致后续的分离困难。并且粘性物在蒸镀受热时会发生粘性变化、粘性物老化等问题。In order to avoid the above problem, in the continuous transfer type design, the large-size vapor deposition apparatus also adopts a transfer mode in which the TFT (thin film transistor) surface (ie, the plating surface) of the substrate is downward. In order to overcome the weight of the large-sized substrate and its own shape and the like, the substrate is generally fixed to the transport device by electrostatic or adhesive means. However, the electrostatic type of fixing is liable to damage the TFT of the substrate. For the adhesive type, the stickiness of the stickies is not easily controlled, and the stickiness is too small to cause the substrate to fall, and if the stickiness is too large, the subsequent separation is difficult. Further, when the viscous material is heated by vapor deposition, problems such as viscous change and viscous aging may occur.
发明内容Summary of the invention
本发明实施例旨在解决一个或多个上述技术问题或者其它技术问题。The embodiments of the present invention are directed to solving one or more of the above technical problems or other technical problems.
本发明实施例提供了一种搬送装置，包括： The embodiment of the invention provides a conveying device, comprising:
承载机构，用于承载基板；以及a carrier mechanism for carrying the substrate;
固定机构，用于以机械方式将所述基板固定在所述承载机构上。a fixing mechanism for mechanically fixing the substrate to the carrier mechanism.
在此实施例中，该搬送装置能够减小对所搬送基板造成的损伤，且便于基板的接取和分离。In this embodiment, the conveying device can reduce damage to the conveyed substrate and facilitate the picking up and separation of the substrate.
在本发明实施例中，该搬送装置还包括升降机构，所述承载机构上设置有穿孔，所述升降机构通过穿过所述穿孔控制所述基板升降。In an embodiment of the invention, the conveying device further comprises a lifting mechanism, the bearing mechanism is provided with a perforation, and the lifting mechanism controls the lifting and lowering of the substrate by passing through the perforation.
在本发明实施例中，所述穿孔均匀设置在所述承载机构上。In an embodiment of the invention, the perforations are uniformly disposed on the carrying mechanism.
在本发明实施例中，所述升降机构包括与每一个所述穿孔一一对应的升降针。In an embodiment of the invention, the lifting mechanism includes a lifting pin corresponding to each of the perforations.
在本发明实施例中，该搬送装置还包括驱动所述升降机构升降的驱动器。In the embodiment of the invention, the conveying device further includes a driver for driving the lifting mechanism to elevate and lower.
在本发明实施例中，所述固定机构包括可滑动件，其设置在所述承载机构边缘位置上并且配置成固定所述基板。In an embodiment of the invention, the securing mechanism includes a slidable member disposed at an edge of the carrier mechanism and configured to secure the substrate.
在本发明实施例中，所述固定机构包括两组可滑动件，每一组可滑动件包括两个相对设置的两个可滑动件。In an embodiment of the invention, the fixing mechanism comprises two sets of slidable members, and each set of slidable members comprises two oppositely disposed two slidable members.
在本发明实施例中，所述可滑动件采用金属材料制成。In an embodiment of the invention, the slidable member is made of a metal material.
在本发明实施例中，所述可滑动件设置有槽结构，并且所述基板的边缘部分通过嵌入所述槽结构被固定In an embodiment of the invention, the slidable member is provided with a groove structure, and an edge portion of the substrate is fixed by being embedded in the groove structure
在本发明实施例中，所述槽结构内设置有弹性润滑层。In an embodiment of the invention, an elastic lubricating layer is disposed in the groove structure.
在本发明实施例中，所述可滑动件可拆卸的安装在所述承载机构上。In an embodiment of the invention, the slidable member is detachably mounted on the carrying mechanism.
在本发明实施例中，所述可滑动件的与其延伸方向垂直的横截面形状为凹字形或L字形。In the embodiment of the present invention, the cross-sectional shape of the slidable member perpendicular to the extending direction thereof is a concave shape or an L shape.
在本发明实施例中，所述承载机构用于承载所述基板的位置上设置有凸起，所述凸起位于所述穿孔之外的区域，并且所述凸起用于当所述基板放置在所述承载机构上时使所述基板的边缘部分悬空。In the embodiment of the present invention, the carrying mechanism is provided with a protrusion at a position for carrying the substrate, the protrusion is located in a region outside the through hole, and the protrusion is used when the substrate is placed at The carrier portion is suspended on the edge portion of the substrate.
在本发明实施例中，所述槽结构的下表面与所述凸起的上表面齐平。In an embodiment of the invention, the lower surface of the groove structure is flush with the upper surface of the protrusion.
在本发明实施例中，所述槽结构的下表面与所述可滑动件的下表面齐平，所述槽结构的上表面高于所述凸起的上表面，并且二者之间的高度差大于或等于所述基板的厚度。In an embodiment of the invention, a lower surface of the groove structure is flush with a lower surface of the slidable member, an upper surface of the groove structure is higher than an upper surface of the protrusion, and a height between the two The difference is greater than or equal to the thickness of the substrate.
本发明实施例还提供了一种蒸镀设备，包括上述的搬送装置。Embodiments of the present invention also provide an evaporation apparatus including the above-described conveying apparatus.
本发明实施例还提供了一种搬送方法，包括：The embodiment of the invention further provides a transport method, including:
将基板放置在承载机构上；以及 Placing the substrate on the carrier; and
通过固定机构将所述基板以机械方式固定在所述承载机构上。The substrate is mechanically fixed to the carrier by a securing mechanism.
在本发明实施例中，将基板放置在承载机构上包括：In the embodiment of the invention, placing the substrate on the carrying mechanism comprises:
控制升降机构穿过所述承载机构的穿孔，并升至预设位置；Controlling the lifting mechanism to pass through the perforation of the carrying mechanism and raising it to a preset position;
将所述基板放置在所述升降机构上；以及Placing the substrate on the lifting mechanism;
控制所述升降机构下降，使所述基板下降从而使所述基板放置在所述承载机构上。The lowering mechanism is controlled to descend, and the substrate is lowered to place the substrate on the carrier mechanism.
在本发明实施例中，通过固定机构将所述基板以机械方式固定在所述承载机构上之后还包括：In the embodiment of the present invention, after the substrate is mechanically fixed on the supporting mechanism by a fixing mechanism, the method further includes:
控制所述承载机构翻转，使所述基板的镀膜面朝下；以及Controlling the carrier mechanism to flip such that the coated side of the substrate faces downward;
在对所述镀膜面蒸镀后通过控制所述承载机构使所述基板的镀膜面朝上，解除所述固定机构对所述基板的固定，并控制所述升降机构上升，从而将所述基板与所述承载机构分离。After vaporizing the coated surface, the coating surface of the substrate is controlled upward by controlling the supporting mechanism, releasing the fixing mechanism to the substrate, and controlling the lifting mechanism to rise, thereby Separated from the carrier mechanism.
本发明提供的搬送装置，通过固定机构将基板以机械方式固定在承载机构上，与静电式和粘附式的固定方式相比，能够减小对基板造成的损伤，提高基板固定的可靠性，并且便于基板的接取和分离。According to the transport device of the present invention, the substrate is mechanically fixed to the support mechanism by the fixing mechanism, and the damage to the substrate can be reduced and the reliability of the substrate can be improved, compared with the electrostatic type and the adhesive type. And facilitate the access and separation of the substrate.
附图说明DRAWINGS
图1是本发明实施方式提供的一种搬送装置的示意图；1 is a schematic view of a conveying device according to an embodiment of the present invention;
图2是本发明实施方式提供的一种可滑动件的示意图；2 is a schematic view of a slidable member provided by an embodiment of the present invention;
图3是本发明实施方式提供的另一种可滑动件的示意图；3 is a schematic view of another slidable member provided by an embodiment of the present invention;
图4、5、6、7、8、9是本发明实施方式提供的搬送装置搬送基板的示意图；以及4, 5, 6, 7, 8, and 9 are schematic views of a transfer device transporting a substrate according to an embodiment of the present invention;
图10是本发明实施方式提供的一种搬送方法的流程图。FIG. 10 is a flowchart of a transport method according to an embodiment of the present invention.
具体实施方式detailed description
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。The specific embodiments of the present invention are further described in detail below with reference to the drawings and embodiments. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
本发明实施方式提供了一种搬送装置，该搬送装置包括：The embodiment of the invention provides a conveying device, which comprises:
承载机构，用于承载基板；a carrier mechanism for carrying the substrate;
固定机构，用于以机械方式将所述基板固定在所述承载机构上。a fixing mechanism for mechanically fixing the substrate to the carrier mechanism.
本发明实施方式提供的搬送装置，通过固定机构将基板以机械方式固定在承载机构上，与静电式和粘附式的固定方式相比，能够减小对基板造成的损伤，提高基板固定的可靠性，并且便于基板的接取和分离。 According to the transport device provided by the embodiment of the present invention, the substrate is mechanically fixed to the support mechanism by the fixing mechanism, and the damage to the substrate can be reduced and the reliability of the substrate can be improved as compared with the electrostatic type and the adhesive type. And facilitate the access and separation of the substrate.
本发明中，固定机构以机械方式将基板固定，例如，该固定机构为卡扣、弹性夹等机械固定结构，通过该固定机构将基板紧压在承载机构上从而实现固定。In the present invention, the fixing mechanism mechanically fixes the substrate. For example, the fixing mechanism is a mechanical fixing structure such as a buckle or an elastic clip, and the fixing mechanism is used to press the substrate against the supporting mechanism to achieve fixing.
在本发明实施例方式中，为了便于基板的接取和分离，上述搬送装置还包括升降机构，并在承载机构设置有穿孔。升降机构通过穿过穿孔控制所述基板升降，从而便于将基板放置在承载结构上以及将基板与承载机构分离。In the embodiment of the present invention, in order to facilitate the access and separation of the substrate, the conveying device further includes a lifting mechanism, and the bearing mechanism is provided with a perforation. The lifting mechanism controls the lifting of the substrate by passing through the perforations to facilitate placement of the substrate on the carrier structure and separation of the substrate from the carrier mechanism.
本发明的实施例中，固定机构通过机械式的固定方式将基板固定在承载机构上。例如，在承载机构的边缘位置上设置可滑动件。可滑动件上设置有槽结构，通过使基板的边缘部分嵌入槽结构从而能够将基板固定在承载机构上。In an embodiment of the invention, the securing mechanism secures the substrate to the carrier mechanism by mechanical attachment. For example, a slidable member is provided at an edge position of the carrying mechanism. The slidable member is provided with a groove structure, and the substrate can be fixed to the supporting mechanism by embedding the edge portion of the substrate into the groove structure.
参见图1，图1是本发明实施方式提供的一种搬送装置的示意图，该搬送装置包括承载机构、升降机构以及固定机构。Referring to FIG. 1 , FIG. 1 is a schematic diagram of a conveying device according to an embodiment of the present invention. The conveying device includes a bearing mechanism, a lifting mechanism, and a fixing mechanism.
承载机构100用于承载基板，其上均匀设置有多个穿孔110。The carrying mechanism 100 is used to carry a substrate on which a plurality of through holes 110 are uniformly disposed.
升降机构包括与每一个穿孔110一一对应的升降针(pin)210，升降针210通过穿过穿孔110从而控制基板升降，从而能够将基板放置在承载机构上或将基板与承载机构分离。The lifting mechanism includes a lifting pin 210 corresponding to each of the perforations 110. The lifting pin 210 controls the substrate lifting by passing through the perforations 110, thereby enabling the substrate to be placed on the carrier mechanism or to separate the substrate from the carrier mechanism.
固定机构用于将基板固定在承载机构100上。该固定机构包括两组可滑动件。每一组可滑动件包括两个相对设置的两个可滑动件，其中一组包括可滑动件310和可滑动件330，另一组包括可滑动件320和可滑动件340。通过上述两组可滑动件能够将矩形状基板的各边缘均进行固定使得基板的四周均被可滑动件固定。通过在可滑动件上设置槽结构，使基板的边缘部分嵌入该槽结构从而能够将基板固定在承载机构上。在后续进行翻转动作使基板的镀膜面朝下时，不会因为大尺寸基板的重量和自身的形变量等因素，导致基板脱落或者与掩膜板对位异常。A securing mechanism is used to secure the substrate to the carrier mechanism 100. The securing mechanism includes two sets of slidable members. Each set of slidable members includes two oppositely disposed two slidable members, one of which includes a slidable member 310 and a slidable member 330, and the other of which includes a slidable member 320 and a slidable member 340. Each of the edges of the rectangular substrate can be fixed by the above two sets of slidable members such that the periphery of the substrate is fixed by the slidable member. By providing a groove structure on the slidable member, the edge portion of the substrate is embedded in the groove structure to enable the substrate to be fixed to the carrier mechanism. When the flipping operation is performed subsequently, the plating surface of the substrate faces downward, the substrate does not fall off or the alignment with the mask is abnormal due to factors such as the weight of the large-sized substrate and its own shape variable.
可滑动件的与其延伸方向垂直的横截面形状为如图2所示的凹字形。可替换地，该横截面形状为如图3所示的L字形，即槽结构311的下表面与可滑动件的下表面齐平。通过将基板的边缘部分嵌入到可滑动件的槽结构311内从而能够将其固定在承载机构100上。The cross-sectional shape of the slidable member perpendicular to its extending direction is a concave shape as shown in FIG. Alternatively, the cross-sectional shape is an L-shape as shown in Fig. 3, that is, the lower surface of the groove structure 311 is flush with the lower surface of the slidable member. The edge portion of the substrate can be fixed to the carrier mechanism 100 by being embedded in the groove structure 311 of the slidable member.
例如，对于图2所示的可滑动件310，在承载机构用于承载基板的位置上还设置凸起120。凸起120位于穿孔110之外的区域。换言之， 凸起120之间设置有与穿孔100一一对应的开口部。在示例性实施例中，开口部的形状和尺寸与穿孔110的形状和尺寸相同。本发明实施例不对开口部的尺寸和形状进行任何限定，只要该开口部不影响升降机构的升降针210穿过即可。凸起120的面积小于待承载基板的面积，并使可滑动件中槽结构311的下表面与凸起120的上表面位于同一水平面上。当基板放置在承载机构100上时通过凸起120使基板的边缘部分悬空，从而便于基板的边缘部分嵌入到可滑动件的槽结构内。例如，上述基板为显示基板。当该基板放置在承载机构上时，使基板的AA区(显示区域)落于凸起的位置，而位于AA区外的边缘区域悬空于凸起的边缘。For example, for the slidable member 310 shown in FIG. 2, a projection 120 is further provided at a position where the carrier mechanism is used to carry the substrate. The protrusion 120 is located outside the perforation 110. In other words, Openings corresponding to the perforations 100 are provided between the projections 120. In an exemplary embodiment, the shape and size of the opening are the same as the shape and size of the perforation 110. The embodiment of the present invention does not limit the size and shape of the opening portion as long as the opening portion does not affect the passage of the lifting needle 210 of the lifting mechanism. The area of the protrusion 120 is smaller than the area of the substrate to be carried, and the lower surface of the groove structure 311 in the slidable member is located on the same level as the upper surface of the protrusion 120. The edge portion of the substrate is suspended by the protrusions 120 when the substrate is placed on the carrier mechanism 100, thereby facilitating the embedding of the edge portion of the substrate into the groove structure of the slidable member. For example, the above substrate is a display substrate. When the substrate is placed on the carrier mechanism, the AA area (display area) of the substrate is placed at the raised position, and the edge area outside the AA area is suspended at the edge of the protrusion.
在本发明实施例方式中，上述可滑动件采用金属材料制成，例如采用强度较好的金属制成，使得当槽结构发生的微形变时不会影响到基板的固定和对位。In the embodiment of the present invention, the slidable member is made of a metal material, for example, made of a metal having a good strength, so that the micro-deformation of the groove structure does not affect the fixing and alignment of the substrate.
在本发明实施例方式中，在可滑动件的槽结构内还设置弹性润滑层。例如，在槽结构内设置一层有机涂层，从而防止槽结构摩擦基板使基板形成微裂纹而破碎。In an embodiment of the invention, an elastic lubricating layer is further disposed in the groove structure of the slidable member. For example, an organic coating is placed within the trench structure to prevent the trench structure from rubbing the substrate to cause the substrate to form microcracks and break.
在本发明实施例方式中，所述可滑动件可拆卸的安装在所述承载机构上，从而能够搬送不同厚度的基板。In the embodiment of the invention, the slidable member is detachably mounted on the carrying mechanism, so that substrates of different thicknesses can be transported.
本发明实施方式提供的上述搬送装置，固定机构采用机械式的基板固定方式。在具体的生产线中，对每一个基板都是同样的动作和时间，消除了不同基板固定方式的片间差异。并且相对于粘附式的固定方式，节省粘附式必须的吸着和分离时间，节省了生产时间(tact time)。In the above-described conveying device according to the embodiment of the present invention, the fixing mechanism employs a mechanical substrate fixing method. In a specific production line, the same action and time are applied to each substrate, eliminating the difference between the sheets of different substrate fixing methods. And with respect to the adhesive fixing method, the sorption and separation time necessary for the adhesion type is saved, and the tact time is saved.
在本发明实施例方式中，搬送装置还包括驱动所述升降机构升降的驱动器，通过驱动器控制升降机构升降，从而能够完成基板的接取和分离。In the embodiment of the present invention, the conveying device further includes a driver for driving the lifting mechanism to move up and down, and the lifting and lowering mechanism is controlled by the driver to lift and lower, so that the substrate can be picked up and separated.
本发明实施方式还提供了一种蒸镀设备，包括上述的搬送装置。例如，该蒸镀设备为连续搬送式的构造。Embodiments of the present invention also provide an evaporation apparatus including the above-described conveying apparatus. For example, the vapor deposition apparatus has a continuous transfer type configuration.
此外，本发明还提供了一种采用上述搬送装置进行搬送的方法，包括：In addition, the present invention also provides a method for transporting by using the above-mentioned transport device, comprising:
S1：将基板放置在承载机构上；以及S1: placing the substrate on the carrier mechanism;
S2：通过固定机构将所述基板以机械方式固定在所述承载机构上。S2: mechanically fixing the substrate to the supporting mechanism by a fixing mechanism.
例如，对于图1所示的搬送装置，将基板放置在其承载机构上包 括：For example, for the transport device shown in Figure 1, the substrate is placed on its carrying mechanism. include:
S11：控制所述升降机构穿过所述承载机构的穿孔，并升至预设位置；S11: controlling the lifting mechanism to pass through the through hole of the bearing mechanism, and rising to a preset position;
S12：将所述基板放置在所述升降机构上；以及S12: placing the substrate on the lifting mechanism;
S13：控制所述升降机构下降，使所述基板下降从而使所述基板放置在所述承载机构上。S13: controlling the lifting mechanism to descend, lowering the substrate to place the substrate on the supporting mechanism.
本发明上述的搬送方法例如被用于蒸镀工艺，通过固定机构将基板以机械方式固定在承载机构上之后还包括：The above-described transfer method of the present invention is used, for example, in an evaporation process, and after mechanically fixing the substrate to the support mechanism by a fixing mechanism, the method further includes:
S14：控制所述承载机构翻转，使所述基板的镀膜面朝下；以及S14: controlling the carrying mechanism to flip so that the coating surface of the substrate faces downward;
S15：在对所述镀膜面蒸镀后通过控制所述承载机构使所述基板的镀膜面朝上，解除所述固定机构对所述基板的固定，并控制所述升降机构上升，从而将所述基板与所述承载机构分离。S15: after vapor deposition on the plating surface, control the loading mechanism to face the plating surface of the substrate, release the fixing mechanism to the substrate, and control the lifting mechanism to rise, thereby The substrate is separated from the carrier mechanism.
例如，上述搬送方法例如被用于阵列基板的蒸镀工艺，该方法包括：For example, the above transfer method is used, for example, in an evaporation process of an array substrate, and the method includes:
S21：如图4所示，首先控制升降针210穿过承载机构100的穿孔110，并从初始位置升至预设位置；S21: as shown in FIG. 4, firstly, the lifting pin 210 is controlled to pass through the through hole 110 of the carrying mechanism 100, and is raised from the initial position to the preset position;
S22：通过机械手臂将基板400放置在升降针210的顶端，机械手臂收回，基板400如图5所示放置与升降针210上；S22: placing the substrate 400 on the top end of the lifting pin 210 by a robot arm, retracting the robot arm, and placing the substrate 400 on the lifting pin 210 as shown in FIG. 5;
S23：升降针210下降至初始位置，使基板400置于承载机构100的表面上，如图6和图7所示；S23: the lifting pin 210 is lowered to the initial position, so that the substrate 400 is placed on the surface of the supporting mechanism 100, as shown in FIG. 6 and FIG. 7;
S24：控制固定机构中的各可滑动件从解锁位置滑动至锁定位置(Lock位置)，从而如图8和图9所示将基板400固定在承载机构上；S24: controlling each slidable member in the fixing mechanism to slide from the unlocking position to the locking position (Lock position), thereby fixing the substrate 400 to the supporting mechanism as shown in FIGS. 8 and 9;
S25：待基板400固定完成后，基板与承载机构共同由电机进行传送，进行下一步的翻转及蒸镀等工艺；以及S25: after the substrate 400 is fixed, the substrate and the supporting mechanism are jointly transferred by the motor, and the next step of turning and vapor deposition is performed;
S26：在经过蒸镀工艺后，通过控制承载机构使基板的镀膜面朝上，控制固定机构中的可滑动件从锁定位置滑动至解锁位置，从而解除固定机构对基板的固定，然后控制升降机构上升至预设位置，从而将基板与承载机构分离，再通过机械手臂将蒸镀后的基板进行转移。S26: after the evaporation process, the plated surface of the substrate is faced upward by the control bearing mechanism, and the slidable member in the control fixing mechanism is slid from the locking position to the unlocking position, thereby releasing the fixing mechanism to the fixing of the substrate, and then controlling the lifting mechanism The substrate is lifted to a predetermined position to separate the substrate from the carrier mechanism, and the vapor-deposited substrate is transferred by a robot arm.
在图7、8和9所示的实施例中，可滑动件具有凹字形的横截面形状，并且在平行于基板的平面内，沿着与基板的边垂直的方向上是可滑动的。这同样适用于具有L字形的横截面形状的可滑动件。In the embodiment shown in Figures 7, 8, and 9, the slidable member has a concave cross-sectional shape and is slidable in a direction perpendicular to the sides of the substrate in a plane parallel to the substrate. The same applies to a slidable member having an L-shaped cross-sectional shape.
应指出，上述各实施例中的技术特征可以相互组合，只要这些技术特征不相互矛盾即可。作为例子，图2所示的凸起120与图3所示的 可滑动件310结合。例如，可滑动件310中槽结构311的上表面高于凸起120的上表面，并且二者之间的高度差大于或等于待承载基板的厚度，使得该槽结构311容纳基板的边缘部分而将基板固定在承载机构100上。当基板放置在承载机构100上时，基板在AA区由凸起120承载，在AA区外的边缘区域悬空于凸起120的边缘，并且在该边缘区域由槽结构311的上表面对基板进行限位。即，承载在承载机构100上的基板被夹持在槽结构311的上表面与凸起120的上表面之间。It should be noted that the technical features in the above embodiments may be combined with each other as long as the technical features do not contradict each other. As an example, the protrusion 120 shown in FIG. 2 is the same as that shown in FIG. The slidable member 310 is combined. For example, the upper surface of the groove structure 311 in the slidable member 310 is higher than the upper surface of the protrusion 120, and the height difference between the two is greater than or equal to the thickness of the substrate to be carried, so that the groove structure 311 accommodates the edge portion of the substrate. The substrate is fixed to the carrier mechanism 100. When the substrate is placed on the carrier mechanism 100, the substrate is carried by the protrusion 120 in the AA region, the edge region outside the AA region is suspended at the edge of the protrusion 120, and the substrate is carried by the upper surface of the groove structure 311 in the edge region. Limit. That is, the substrate carried on the carrier mechanism 100 is sandwiched between the upper surface of the groove structure 311 and the upper surface of the protrusion 120.
以上实施方式仅用于说明本发明，而并非对本发明的限制，有关技术领域的普通技术人员，在不脱离本发明的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明的范畴，本发明的专利保护范围应由权利要求限定。 The above embodiments are merely illustrative of the present invention and are not intended to be limiting of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. Equivalent technical solutions are also within the scope of the invention, and the scope of the invention is defined by the claims.

Claims (19)

  1. 一种搬送装置，包括：A conveying device comprising:
    承载机构，用于承载基板；以及a carrier mechanism for carrying the substrate;
    固定机构，用于以机械方式将所述基板固定在所述承载机构上。a fixing mechanism for mechanically fixing the substrate to the carrier mechanism.
  2. 根据权利要求1所述的搬送装置，还包括升降机构，所述承载机构上设置有穿孔，所述升降机构通过穿过所述穿孔控制所述基板升降。The conveying apparatus according to claim 1, further comprising an elevating mechanism provided with a perforation, said elevating mechanism controlling said substrate to elevate by passing through said perforation.
  3. 根据权利要求2所述的搬送装置，其中所述穿孔均匀设置在所述承载机构上。The conveying apparatus according to claim 2, wherein said perforations are uniformly disposed on said carrying mechanism.
  4. 根据权利要求3所述的搬送装置，其中所述升降机构包括与每一个所述穿孔一一对应的升降针。The conveying apparatus according to claim 3, wherein said elevating mechanism comprises a lifting pin in one-to-one correspondence with each of said perforations.
  5. 根据权利要求2-4中任意一项所述的搬送装置，还包括驱动所述升降机构升降的驱动器。The conveying apparatus according to any one of claims 2 to 4, further comprising a driver for driving the lifting mechanism to move up and down.
  6. 根据权利要求2所述的搬送装置，其中所述固定机构包括可滑动件，其设置在所述承载机构边缘位置上并且配置成固定所述基板。The conveying apparatus according to claim 2, wherein said fixing mechanism includes a slidable member disposed at an edge position of said carrier mechanism and configured to fix said substrate.
  7. 根据权利要求6所述的搬送装置，其中所述固定机构包括两组可滑动件，每一组可滑动件包括两个相对设置的两个可滑动件。The conveying apparatus according to claim 6, wherein said fixing mechanism comprises two sets of slidable members, and each set of slidable members comprises two oppositely disposed slidable members.
  8. 根据权利要求6所述的搬送装置，其中所述可滑动件采用金属材料制成。The conveying apparatus according to claim 6, wherein said slidable member is made of a metal material.
  9. 根据权利要求6所述的搬送装置，其中所述可滑动件设置有槽结构，并且所述基板的边缘部分通过嵌入所述槽结构被固定。The conveying apparatus according to claim 6, wherein the slidable member is provided with a groove structure, and an edge portion of the substrate is fixed by being embedded in the groove structure.
  10. 根据权利要求9所述的搬送装置，其中所述槽结构内设置有弹性润滑层。The conveying apparatus according to claim 9, wherein an elastic lubricating layer is provided in said groove structure.
  11. 根据权利要求6所述的搬送装置，其中所述可滑动件可拆卸的安装在所述承载机构上。The conveying apparatus according to claim 6, wherein said slidable member is detachably mounted on said carrying mechanism.
  12. 根据权利要求9所述的搬送装置，其中所述可滑动件的与其延伸方向垂直的横截面形状为凹字形或L字形。The conveying apparatus according to claim 9, wherein a cross-sectional shape of said slidable member perpendicular to an extending direction thereof is a concave shape or an L shape.
  13. 根据权利要求9所述的搬送装置，其中所述承载机构用于承载所述基板的位置上设置有凸起，所述凸起位于所述穿孔之外的区域，并且所述凸起用于当所述基板放置在所述承载机构上时使所述基板的边缘部分悬空。 A conveying apparatus according to claim 9, wherein said carrying mechanism is provided with a projection at a position for carrying said substrate, said projection being located outside said perforation, and said projection is used for The edge portion of the substrate is suspended when the substrate is placed on the carrier mechanism.
  14. 根据权利要求13所述的搬送装置，其中所述槽结构的下表面与所述凸起的上表面齐平。The conveying apparatus according to claim 13, wherein a lower surface of said groove structure is flush with an upper surface of said projection.
  15. 根据权利要求13所述的搬送装置，其中所述槽结构的下表面与所述可滑动件的下表面齐平，所述槽结构的上表面高于所述凸起的上表面，并且二者之间的高度差大于或等于所述基板的厚度。The conveying apparatus according to claim 13, wherein a lower surface of said groove structure is flush with a lower surface of said slidable member, an upper surface of said groove structure is higher than an upper surface of said projection, and both The height difference between the two is greater than or equal to the thickness of the substrate.
  16. 一种蒸镀设备，包括根据权利要求1-15中任意一项所述的搬送装置。An evaporation apparatus comprising the conveying apparatus according to any one of claims 1-15.
  17. 一种搬送方法，包括：A method of transport, including:
    将基板放置在承载机构上；以及Placing the substrate on the carrier; and
    通过固定机构将所述基板以机械方式固定在所述承载机构上。The substrate is mechanically fixed to the carrier by a securing mechanism.
  18. 根据权利要求17所述的搬送方法，其中将基板放置在承载机构上包括：The transport method according to claim 17, wherein the placing the substrate on the carrying mechanism comprises:
    控制升降机构穿过所述承载机构的穿孔，并升至预设位置；Controlling the lifting mechanism to pass through the perforation of the carrying mechanism and raising it to a preset position;
    将所述基板放置在所述升降机构上；以及Placing the substrate on the lifting mechanism;
    控制所述升降机构下降，使所述基板下降从而使所述基板放置在所述承载机构上。The lowering mechanism is controlled to descend, and the substrate is lowered to place the substrate on the carrier mechanism.
  19. 根据权利要求18所述的搬送的方法，其中通过固定机构将所述基板以机械方式固定在所述承载机构上之后还包括：The method of transporting according to claim 18, wherein after the substrate is mechanically fixed to the carrier mechanism by a fixing mechanism, the method further comprises:
    控制所述承载机构翻转，使所述基板的镀膜面朝下；以及Controlling the carrier mechanism to flip such that the coated side of the substrate faces downward;
    在对所述镀膜面蒸镀后通过控制所述承载机构使所述基板的镀膜面朝上，解除所述固定机构对所述基板的固定，并控制所述升降机构上升，从而将所述基板与所述承载机构分离。 After vaporizing the coated surface, the coating surface of the substrate is controlled upward by controlling the supporting mechanism, releasing the fixing mechanism to the substrate, and controlling the lifting mechanism to rise, thereby Separated from the carrier mechanism.
PCT/CN2016/098977 2016-01-06 2016-09-14 Conveying apparatus, conveying method, and evaporation device WO2017118084A1 (en)

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