WO2017096628A1 - 柔性显示模组的绑定方法 - Google Patents

柔性显示模组的绑定方法 Download PDF

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Publication number
WO2017096628A1
WO2017096628A1 PCT/CN2015/097207 CN2015097207W WO2017096628A1 WO 2017096628 A1 WO2017096628 A1 WO 2017096628A1 CN 2015097207 W CN2015097207 W CN 2015097207W WO 2017096628 A1 WO2017096628 A1 WO 2017096628A1
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WIPO (PCT)
Prior art keywords
flexible display
display panel
binding
flexible
substrate
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PCT/CN2015/097207
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English (en)
French (fr)
Inventor
朱剑磊
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深圳市柔宇科技有限公司
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Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201580073407.XA priority Critical patent/CN107209407B/zh
Priority to EP15910102.1A priority patent/EP3388888A4/en
Priority to JP2018515244A priority patent/JP2018531411A/ja
Priority to KR1020177033798A priority patent/KR101925743B1/ko
Priority to PCT/CN2015/097207 priority patent/WO2017096628A1/zh
Priority to US15/580,738 priority patent/US10115931B2/en
Publication of WO2017096628A1 publication Critical patent/WO2017096628A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
    • G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the technical field of flexible display modules, and in particular to a binding method of a flexible display module.
  • the flexible display module mainly comprises a flexible display panel and a corresponding driving circuit.
  • the external driving chip needs to be connected through the conductive medium on the flexible display panel.
  • This process is generally called bonding.
  • the conductive medium used for the connection in the bonding process is generally an ACF (Anisotropic Conductive Film), which is characterized in that it is electrically conductive only in the direction of the pressure, and is not in other directions without being subjected to pressure. Turn on.
  • ACF Application Function
  • the flexible display panel is easily deformed due to the high temperature hot pressing environment in the binding process, which may result in inaccurate binding alignment, which seriously affects the quality of the product. .
  • the industry usually firstly presses the flexible display panel on the rigid carrier board through the colloid, and then binds it, and finally uses the laser scanning method to peel off the flexible display panel from the rigid carrier board.
  • a new problem arises when peeling off the flexible display panel: since the temperature of the pressing process in the bonding process is mostly between 150 degrees and 200 degrees, the existing colloid generated between the flexible display panel and the rigid carrier plate is generated. The effect is that the solidification state of the colloid located in the binding region changes, and subsequent use of laser peeling is difficult.
  • Embodiments of the present invention provide a binding method for a flexible display module with high yield.
  • a binding method for a flexible display module includes:
  • the first binding zone and the second binding zone are pressed at a second temperature.
  • the preparing the flexible display panel having the first binding area comprises:
  • the flexible substrate is peeled off from the glass substrate by a laser.
  • the preparing the display layer on the flexible substrate comprises:
  • a light-emitting layer is evaporated on each of the display regions, and a protective layer is formed on the light-emitting layer.
  • the surface of the flexible intermediate display panel facing the flexible display panel facing away from the first binding region comprises:
  • a side of the intermediate substrate coated with the colloid is attached to a surface of the flexible display panel facing away from the first binding region.
  • the colloid is a hydrosol.
  • the intermediate substrate is a rigid substrate, and the flexible display panel is flattened and adhered to the intermediate substrate.
  • the peeling off the flexible display panel comprises:
  • the gripping member is grasped and the flexible display panel is gradually peeled off from the intermediate substrate.
  • the adhesive force of the strong adhesive is greater than the adhesive force of the colloid.
  • the number of the gripping members is one, the gripping member is attached to a corner of the periphery of the flexible display panel; or the number of the gripping members is at least two, and the gripping member is attached Attached to the soft The same side of the perimeter of the display panel.
  • the peeling off the flexible display panel comprises:
  • the rolling member is rolled to gradually peel the flexible display panel from the intermediate substrate.
  • the flexible display panel is fastened to the intermediate substrate by fitting, so that the first binding area is kept flat, thereby The problem that the alignment is difficult due to the dimensional extension inherent in the flexible display panel does not occur, and the first binding zone and the second binding zone can be effectively guaranteed when the pre-compression is performed on the basis.
  • the alignment is accurate.
  • the flexible display panel is peeled off from the intermediate substrate. Since the pre-compression is a low temperature process, the flexible display panel can be easily peeled off from the intermediate substrate to avoid the flexibility.
  • the flexible display panel is flattened and then pressed to form a flexible display module, and the flat display panel is maintained in a good flatness, so that the flexible display panel needs to be pressed. It can be completely adhered to the platform for pressing, so as to be evenly heated during the pressing process, further ensuring the alignment accuracy and binding quality of the first binding zone and the second binding zone. . Therefore, the flexible display module completed by the binding method of the present invention has a high yield rate.
  • FIG. 1 to FIG. 5 are schematic diagrams showing the structure of a process corresponding to each step in a binding method of a flexible display module according to the present invention.
  • an embodiment of the present invention provides a binding method for a flexible display module, which mainly includes the following steps:
  • Step 1 Preparing a flexible display panel 1 , the first surface 11 of the flexible display panel 1 is provided with a first binding zone 10 , as shown in FIG. 1 .
  • Step 2 attaching the intermediate substrate 3 on the second surface 12 of the flexible display panel 1 disposed opposite to the first surface 11 such that the first binding region remains flat, as shown in FIG. 2 .
  • Step 3 providing a driving integrated circuit 4, the driving integrated circuit 4 includes a second binding area 41, aligning the second binding area 41 with the first binding area 10, and at a first temperature
  • the first binding area 10 and the second binding area 41 are pre-compressed, as shown in FIG.
  • Step 4 peeling the flexible display panel 1 from the intermediate substrate 3 as shown in FIG.
  • Step 5 Flatten the flexible display panel 1 and press the first binding area 10 and the second binding area 41 at a second temperature, as shown in FIG. 5, to form a flexible display module.
  • the process of binding the drive integrated circuit 4 to the flexible display panel 1 is completed in this step, thereby forming a flexible display module.
  • the flexible display panel 1 is fastened to the intermediate substrate 3 by bonding, so that the first binding region 10 is kept flat, so that the inherent cause of the flexible display panel 1 does not occur.
  • the flexible display panel 1 is peeled off from the intermediate substrate 3. Since the pre-compression is performed at the first temperature, the first temperature is defined as a low temperature, including but not limited to 60.
  • the flexible display panel 1 is flattened and then pressed to form a flexible display module.
  • the flat display panel 1 is flattened, so that the flexible display panel 1 needs to be pressed.
  • the merged area can be completely adhered to the platform for pressing, so that the first binding zone 10 and the second binding zone 41 can be uniformly heated during the pressing process, further ensuring the The alignment precision and the binding quality of the first binding area 10 and the second binding area 41. Therefore, the flexible display module completed by the binding method is high in yield.
  • the flattening described in this embodiment includes, but is not limited to, opening, unfolding, pulling, etc.
  • the manner in which the flattened structure (for example, the flexible display panel 1) is flattened is achieved.
  • the preparation of the flexible display panel 1 in the step Step 1 of the binding method of the flexible display module comprises:
  • Step11 cleaning the glass substrate
  • Step 12 coating a polyimide film on one side of the glass substrate, and forming a flexible substrate after curing;
  • Step 13 preparing a display layer on the flexible substrate
  • Step 14 peeling the flexible substrate from the glass substrate with a laser to form the flexible display panel 1.
  • the flexible substrate is fast bonded to the surface of the glass substrate before laser stripping, the surface of the flexible substrate is flat, and the flexible substrate can be high quality.
  • a display layer is formed thereon to realize a high-resolution display function of the flexible display panel 1.
  • the flexible substrate is peeled off from the glass substrate between the bonding process without driving the integrated circuit, the colloid connecting the flexible substrate and the glass substrate does not undergo a change in the cured state, which is simple.
  • the flexible substrate can be smoothly peeled off by the laser irradiation process without damaging the flexible substrate and the display layer.
  • step S13 of the preparation process of the flexible display panel 1 can be further refined to:
  • Step S131 depositing a SiNx passivation layer on the surface of the flexible substrate
  • Step S132 fabricating a Thin Film Transistor (TFT) driving matrix on the SiNx passivation layer;
  • Step S133 cutting the flexible substrate to form a plurality of display areas
  • Step S134 vapor-depositing the light-emitting layer on each of the display regions, and forming a protective layer on the light-emitting layer.
  • the illuminating layer may be an electronic ink display layer, so that the display layer has ultra-low power consumption, which is beneficial to reducing energy consumption of the flexible display module.
  • the flexible display panel and the intermediate substrate may be adhered by the colloid 2, that is, the colloid may be uniformly applied to the intermediate substrate, and then A side of the intermediate substrate coated with the colloid is attached to a surface of the flexible display panel facing away from the first binding region.
  • the pre-compression is a low temperature process (the pre-compression temperature is generally at Between 60° and 90°), so the connection is flexible
  • the pre-compression temperature is generally at Between 60° and 90°
  • the connection is flexible
  • the curing state of the colloid 2 between the display panel 1 and the intermediate substrate 3 does not change, and the flexible display panel 1 can be easily peeled off from the intermediate substrate 3 to avoid the generation of the flexible display panel 1
  • the flexible substrate, the electronic device, and the circuit inside are damaged by increasing the amount of laser irradiation and time.
  • the colloid 2 used is a colloid capable of achieving a transitional sticking function.
  • the colloid 2 is a hydrosol.
  • the intermediate substrate 3 is a rigid substrate, and the flexible display panel 1 is flattened and adhered to the rigid substrate, thereby keeping the first binding region 10 flat and can be effectively protected.
  • the rigid substrate is preferably a glass substrate.
  • step 3 of the binding method of the flexible display module first attaching each of the binding surface of the first binding area 10 or the binding surface of the second binding area 41
  • the anisotropic conductive film (ACF) is then subjected to alignment and pre-compression of the first binding region 10 and the second binding region 41.
  • the anisotropic conductive film is used to realize electrical connection between the first binding region 10 and the second binding region 41.
  • the grabbing member may be attached to the periphery of the flexible display panel 1 by a strong adhesive, and then passed through The flexible display panel 1 is gradually peeled off from the intermediate substrate 3 by grasping the gripping member.
  • the strong adhesive does not specifically refer to a certain adhesive as long as the adhesive force thereof is greater than the adhesive force of the colloid 2, and the flexible display panel 1 can be The intermediate substrate 3 may be peeled off.
  • the periphery of the flexible display panel 1 is a peripheral area of the display area of the flexible display panel 1. These peripheral areas are usually cut off after the flexible display module is prepared, so the grasping parts will eventually The separation from the flexible display panel 1 does not affect the use of the flexible display panel 1.
  • only one of the gripping members may be disposed and attached to one of the periphery of the flexible display panel 1; at least two of the gripping members may be simultaneously disposed and attached to the flexible display The same side of the periphery of the panel 1.
  • the number of the gripping members and the attachment position can be flexibly set according to the size and shape of the flexible display panel 1.
  • a corner or a side of the periphery of the flexible display panel 1 may be applied by a strong adhesive. Attached to the rolling member, the rolling member is then rolled to gradually peel the flexible display panel from the intermediate substrate.
  • the strong adhesive does not specifically refer to a certain adhesive as long as the adhesive force thereof is greater than the adhesive force of the colloid 2, and the flexible display panel 1 can be
  • the intermediate substrate 3 may be peeled off.
  • the periphery of the flexible display panel 1 is a peripheral area of the display area of the flexible display panel 1. These peripheral areas are usually cut off after the flexible display module is prepared, so that the rolling elements will eventually be separated.
  • the flexible display panel 1 does not affect the use of the flexible display panel 1.
  • step 5 of the binding method of the flexible display module when the flexible display panel 1 is flattened, a sheet may be applied to the four corners of the flexible display panel 1.
  • the pressing force F tensions the flexible display panel 1 in the direction in which the arrow is directed (that is, in a direction away from the center of the flexible display panel 1).
  • the flat display panel 1 that is flattened maintains a good flatness, so that the area on the flexible display panel 1 that needs to be pressed can be completely adhered to the platform for pressing, so that the first A binding zone 10 and the second binding zone 41 can be uniformly heated during the pressing process, further ensuring the alignment precision and binding of the first binding zone 10 and the second binding zone 41. quality.

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Abstract

一种柔性显示模组的绑定方法，包括：制备具有第一绑定区（10）的柔性显示面板（1）；贴合中间基板（3）至柔性显示面板（1）的背离第一绑定区（10）的表面（12）；对位驱动集成电路（4）的第二绑定区（41）与第一绑定区（10）；在第一温度下，预压合第一绑定区（10）与第二绑定区（41）；剥离柔性显示面板（1）；展平柔性显示面板（1）；在第二温度下，压合第一绑定区（10）与第二绑定区（41），形成柔性显示模组。通过柔性显示模组的绑定方法形成的柔性显示模组良品率高。

Description

柔性显示模组的绑定方法 技术领域
本发明涉及柔性显示模组技术领域，特别涉及一种柔性显示模组的绑定方法。
背景技术
随着显示技术的发展，柔性显示模组将得到越来越多的应用。现今柔性显示模组主要包括柔性显示面板和对应的驱动电路，当柔性显示面板制作完成后，需要在柔性显示面板上通过导电介质连接外部驱动芯片，这个过程一般称之为绑定(bonding)。绑定工艺中用于实现连接的导电介质一般为ACF(Anisotropic Conductive Film，各向异性导电膜)，其特点是只在受到压力的方向上实现电性导通，在没有受到压力的其他方向不导通。然而如果直接在柔性显示面板上进行绑定，由于绑定工艺中的高温热压环境，容易使柔性显示面板发生变形，也就会导致出现绑定对位不准的现象，严重影响产品的质量。
为解决上述问题，业内人士通常先将柔性显示面板通过胶体贴合在刚性承载板上，然后再进行绑定，最后采用激光扫描的方法将柔性显示面板从刚性承载板上剥离下来。但是在剥离柔性显示面板时出现了新的问题：由于绑定工艺中本压的温度大多在150度～200度之间，会对现有设置在柔性显示面板和刚性承载板之间的胶体产生影响，使得位于绑定区域的胶体的固化状态发生变化，在后续使用激光剥离产生困难。此时需要加大激光量以促进胶体分解，但是加大激光照射量和时间会使得柔性显示面板的柔性基板发生碳化和形变，产生大量微粒，甚至影响柔性显示面板上的TFT(Thin Film Transistor，薄膜晶体管)器件和电路的性能，最终导致柔性显示模组的良品率偏低。
发明内容
本发明的实施例提供了一种良品率高的柔性显示模组的绑定方法。
为了实现上述目的，本发明实施方式采用如下技术方案：
提供一种柔性显示模组的绑定方法，所述绑定方法包括：
制备具有第一绑定区的柔性显示面板；
贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面；
对位驱动集成电路的第二绑定区与所述第一绑定区；
在第一温度下，预压合所述第一绑定区与所述第二绑定区；
剥离所述柔性显示面板；
展平所述柔性显示面板；
在第二温度下，压合所述第一绑定区与所述第二绑定区。
优选的，所述制备具有第一绑定区的柔性显示面板包括：
清洗玻璃基板；
在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
在所述柔性基板上制备显示层；
利用激光将所述柔性基板自所述玻璃基板上剥离。
优选的，所述在所述柔性基板上制备显示层包括：
在所述柔性基板表面沉积SiNx钝化层；
在所述SiNx钝化层上制作薄膜晶体管驱动矩阵；
切割所述柔性基板，以形成多个显示区；
在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
优选的，所述贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面包括：
均匀涂覆胶体至所述中间基板；
贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。
优选的，所述胶体为水溶胶。
优选的，所述中间基板为刚性基板，所述柔性显示面板被展平后与所述中间基板相贴合。
优选的，所述剥离所述柔性显示面板包括：
通过强力粘结剂贴附抓取件至所述柔性显示面板的周边；
抓住所述抓取件、并逐渐将所述柔性显示面板从所述中间基板上剥离。
优选的，所述强力粘结剂的粘结力大于所述胶体的粘结力。
优选的，所述抓取件的数量为一个，所述抓取件贴附在所述柔性显示面板的周边的一角；或者所述抓取件的数量为至少两个，所述抓取件贴附在所述柔 性显示面板的周边的同一侧。
优选的，所述剥离所述柔性显示面板包括：
通过强力粘结剂贴附所述柔性显示面板周边的一角或者一侧边至滚动件；
滚动所述滚动件以逐渐自所述中间基板上剥离所述柔性显示面板。
相较于现有技术，通过本发明所述绑定方法制备柔性显示模组时：所述柔性显示面板通过贴合紧固在所述中间基板，使得所述第一绑定区保持平整，从而不会出现所述柔性显示面板固有的因尺寸延展而导致对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区与所述第二绑定区的对位精确。完成预压合后，即将所述柔性显示面板自所述中间基板上剥离，由于预压合是低温工艺，因此所述柔性显示面板可以容易地自所述中间基板上剥离，避免产生所述柔性显示面板内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板后进行压合，以形成柔性显示模组，被展平的所述柔性显示面板保持有良好的平整度，因此所述柔性显示面板上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，从而在本压过程中均匀受热，进一步保障了所述第一绑定区与所述第二绑定区的对位精度和绑定质量。因此，通过本发明所述绑定方法绑定完成的所述柔性显示模组良品率高。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1至图5为本发明柔性显示模组的绑定方法中各个步骤对应的制程的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图5，本发明实施例提供一种柔性显示模组的绑定方法，主要包括如下步骤：
Step1：制备柔性显示面板1，所述柔性显示面板1的第一表面11上设置有第一绑定区10，如图1所示。
Step2：在所述柔性显示面板1的相对于所述第一表面11设置的第二表面12上贴合中间基板3，使得所述第一绑定区保持平整，如图2所示。
Step3：提供驱动集成电路4，所述驱动集成电路4包括有第二绑定区41，将所述第二绑定区41与所述第一绑定区10对位，并在第一温度下预压合所述第一绑定区10与所述第二绑定区41，如图3所示。
Step4：将所述柔性显示面板1自所述中间基板3上剥离，如图4所示。
Step5：展平所述柔性显示面板1，并在第二温度下压合所述第一绑定区10与所述第二绑定区41，如图5所示，以形成柔性显示模组。在此步骤中完成了将所述驱动集成电路4绑定至所述柔性显示面板1的过程，从而形成柔性显示模组。
在本实施例中，所述柔性显示面板1通过贴合紧固在所述中间基板3上，使所述第一绑定区10保持平整，从而不会出现所述柔性显示面板1固有的因尺寸延展而导致对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区10与所述第二绑定区41的对位精确。完成预压合后，即将所述柔性显示面板1自所述中间基板3上剥离，由于预压合是在第一温度下进行的，定义所述第一温度为低温温度，包括但不限于60°至90°范围内的温度，因此所述柔性显示面板1可以容易地自所述中间基板3上剥离，避免产生所述柔性显示面板1内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板1后进行压合，以形成柔性显示模组，被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区41可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区41的对位精度和绑定质量。因此，通过上述绑定方法绑定完成的所述柔性显示模组良品率高。
应当理解的是，本实施例所述展平，包括但不限于以张开、展开、拉开等 方式使被展平的结构(例如所述柔性显示面板1)实现平整状态。
进一步的，所述柔性显示模组的绑定方法的步骤Step1中的所述柔性显示面板1的制备包括：
Step11：清洗玻璃基板；
Step12：在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
Step13：在所述柔性基板上制备显示层；
Step14：利用激光将所述柔性基板自所述玻璃基板上剥离，以形成柔性显示面板1。
在上述柔性显示面板1的制备过程中，由于所述柔性基板在激光剥离之前是紧固结合在所述玻璃基板表面上的，因此所述柔性基板表面平整，可以高质量地在所述柔性基板上形成显示层，实现所述柔性显示面板1的高分辨率显示功能。同时，由于所述柔性基板在未进行驱动集成电路的绑定工序之间即从所述玻璃基板上剥离，因此连接所述柔性基板和玻璃基板的胶体并不会发生固化状态的变化，简单的激光照射过程即可顺利地剥离所述柔性基板，并且不会损坏所述柔性基板及所述显示层。
进一步的，所述柔性显示面板1的制备过程的步骤S13可以进一步细化为：
步骤S131：在所述柔性基板表面沉积SiNx钝化层；
步骤S132：在所述SiNx钝化层上制作薄膜晶体管(Thin Film Transistor，TFT)驱动矩阵；
步骤S133：切割所述柔性基板，以形成多个显示区；
步骤S134：在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
优选的，所述发光层可以是电子墨水显示层，以使所述显示层具有超低耗电量，有利于降低所述柔性显示模组的能耗。
进一步的，在所述柔性显示模组的绑定方法的步骤Step2中，可以通过胶体2贴合所述柔性显示面板与所述中间基板，也即可以均匀涂覆胶体至所述中间基板，然后贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。在所述柔性显示模组的绑定方法中，由于在完成预压合后即将所述柔性显示面板1自所述中间基板3上剥离，且预压合是低温工艺(预压合温度一般处于60°到90°范围之间)，因此连接在所述柔性显 示面板1和所述中间基板3之间的所述胶体2的固化状态不会发生变化，所述柔性显示面板1可以容易地自所述中间基板3上剥离，避免产生所述柔性显示面板1内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。
进一步的，采用的所述胶体2是一种可实现过渡性粘贴功能的胶体。优选的，所述胶体2为水溶胶。
进一步的，所述中间基板3为刚性基板，所述柔性显示面板1被展平后与所述刚性基板相贴合，由此使得所述第一绑定区10保持平整，能够有效保障在此基础上进行预压合时，所述第一绑定区10与所述第二绑定区41的对位精确。所述刚性基板优选玻璃基板。
进一步的，所述柔性显示模组的绑定方法的步骤Step3中，首先在所述第一绑定区10的绑定表面或者在所述第二绑定区41的绑定表面上贴附各向异性导电膜(Anisotropic Conductive Film，ACF)，然后再进行所述第一绑定区10和所述第二绑定区41的对位和预压合。所述各向异性导电膜用以实现所述第一绑定区10和所述第二绑定区41的电连接。
作为本发明的一种优选实施例，在所述柔性显示模组的绑定方法的步骤Step4中，可以先通过强力粘结剂在所述柔性显示面板1的周边贴附抓取件，然后通过抓住所述抓取件逐渐将所述柔性显示面板1从所述中间基板3上剥离。应当理解的是，所述强力粘结剂并不特指某一种粘结剂，只要其的粘结力比所述胶体2的粘结力大，能够将所述柔性显示面板1从所述中间基板3上剥离即可。所述柔性显示面板1的周边，是所述柔性显示面板1的显示区的周边区域，这些周边区域在所述柔性显示模组制备完成后通常会被切割掉，因此所述抓取件最终会脱离所述柔性显示面板1，不会对所述柔性显示面板1的使用造成影响。
优选的，可以仅设置一个所述抓取件，并贴附在所述柔性显示面板1的周边的一处；也可以同时设置至少两个所述抓取件，并贴附在所述柔性显示面板1的周边的同一侧。所述抓取件的数量以及贴附位置可以依据所述柔性显示面板1的大小和形状灵活设定。
作为本发明的另一种优选实施例，在所述柔性显示模组的绑定方法的步骤Step4中，可以通过强力粘结剂将所述柔性显示面板1周边的一角或者一侧边 贴附在滚动件上，然后滚动所述滚动件以逐渐将所述柔性显示面板从所述中间基板上剥离。应当理解的是，所述强力粘结剂并不特指某一种粘结剂，只要其的粘结力比所述胶体2的粘结力大，能够将所述柔性显示面板1从所述中间基板3上剥离即可。所述柔性显示面板1的周边，是所述柔性显示面板1的显示区的周边区域，这些周边区域在所述柔性显示模组制备完成后通常会被切割掉，因此所述滚动件最终会脱离所述柔性显示面板1，不会对所述柔性显示面板1的使用造成影响。
优选的，在所述柔性显示模组的绑定方法的步骤Step5中，如图5所示，展平所述柔性显示面板1时，可以在所述柔性显示面板1的四个角上施加张紧力F，按照箭头指向的方向(也即背离所述柔性显示面板1中心的方向)张紧所述柔性显示面板1。被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区41可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区41的对位精度和绑定质量。
以上对本发明实施例所提供的所述柔性显示模组的绑定方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (10)

  1. 一种柔性显示模组的绑定方法，其特征在于，所述绑定方法包括：
    制备具有第一绑定区的柔性显示面板；
    贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面；
    对位驱动集成电路的第二绑定区与所述第一绑定区；
    在第一温度下，预压合所述第一绑定区与所述第二绑定区；
    剥离所述柔性显示面板；
    展平所述柔性显示面板；
    在第二温度下，压合所述第一绑定区与所述第二绑定区。
  2. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述制备具有第一绑定区的柔性显示面板包括：
    清洗玻璃基板；
    在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
    在所述柔性基板上制备显示层；
    利用激光将所述柔性基板自所述玻璃基板上剥离。
  3. 如权利要求2所述的柔性显示模组的绑定方法，其特征在于，所述在所述柔性基板上制备显示层包括：
    在所述柔性基板表面沉积SiNx钝化层；
    在所述SiNx钝化层上制作薄膜晶体管驱动矩阵；
    切割所述柔性基板，以形成多个显示区；
    在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
  4. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面包括：
    均匀涂覆胶体至所述中间基板；
    贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。
  5. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述胶体为水溶胶。
  6. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述中 间基板为刚性基板，所述柔性显示面板被展平后与所述中间基板相贴合。
  7. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述剥离所述柔性显示面板包括：
    通过强力粘结剂贴附抓取件至所述柔性显示面板的周边；
    抓住所述抓取件、并逐渐将所述柔性显示面板从所述中间基板上剥离。
  8. 如权利要求7所述的柔性显示模组的绑定方法，其特征在于，所述强力粘结剂的粘结力大于所述胶体的粘结力。
  9. 如权利要求7所述的柔性显示模组的绑定方法，其特征在于，所述抓取件的数量为一个，所述抓取件贴附在所述柔性显示面板的周边的一角；或者所述抓取件的数量为至少两个，所述抓取件贴附在所述柔性显示面板的周边的同一侧。
  10. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述剥离所述柔性显示面板包括：
    通过强力粘结剂贴附所述柔性显示面板周边的一角或者一侧边至滚动件；
    滚动所述滚动件以逐渐自所述中间基板上剥离所述柔性显示面板。
PCT/CN2015/097207 2015-12-11 2015-12-11 柔性显示模组的绑定方法 WO2017096628A1 (zh)

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US10115931B2 (en) 2018-10-30
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