WO2017062697A3 - 2-dimensional thermal conductive materials and their use - Google Patents

2-dimensional thermal conductive materials and their use Download PDF

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Publication number
WO2017062697A3
WO2017062697A3 PCT/US2016/055873 US2016055873W WO2017062697A3 WO 2017062697 A3 WO2017062697 A3 WO 2017062697A3 US 2016055873 W US2016055873 W US 2016055873W WO 2017062697 A3 WO2017062697 A3 WO 2017062697A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal
thermal conductive
conductive materials
dimensional thermal
fillers
Prior art date
Application number
PCT/US2016/055873
Other languages
French (fr)
Other versions
WO2017062697A2 (en
Inventor
Hiroyuki Fukushima
Thomas RITCH
Jessica RUSSELL
Liya Wang
Original Assignee
Hiroyuki Fukushima
Ritch Thomas
Russell Jessica
Liya Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/285,967 external-priority patent/US10568544B2/en
Application filed by Hiroyuki Fukushima, Ritch Thomas, Russell Jessica, Liya Wang filed Critical Hiroyuki Fukushima
Priority to CN201680070947.7A priority Critical patent/CN108368418B/en
Priority to KR1020187012791A priority patent/KR20180116229A/en
Publication of WO2017062697A2 publication Critical patent/WO2017062697A2/en
Publication of WO2017062697A3 publication Critical patent/WO2017062697A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Abstract

The development and manufacture of thermal interface materials including, among other forms, greases, pastes, gels, adhesives, pads, sheets, solders and phase change materials, with good through-piano thermal conductivity for thermal interface applications. The good through-plane thermal conductivity is achieved, through the formation of a conductive network by the use of thermal conductive material- coated fillers, combinations of thermal conductive material-coated fillers and uncoated fillers.
PCT/US2016/055873 2015-10-09 2016-10-07 2-dimensional thermal conductive materials and their use WO2017062697A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680070947.7A CN108368418B (en) 2015-10-09 2016-10-07 Two-dimensional heat conducting material and use thereof
KR1020187012791A KR20180116229A (en) 2015-10-09 2016-10-07 Two-dimensional thermally conductive materials and their uses

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562284797P 2015-10-09 2015-10-09
US62/284,797 2015-10-09
US15/285,967 US10568544B2 (en) 2015-10-09 2016-10-05 2-dimensional thermal conductive materials and their use
US15/285,967 2016-10-05

Publications (2)

Publication Number Publication Date
WO2017062697A2 WO2017062697A2 (en) 2017-04-13
WO2017062697A3 true WO2017062697A3 (en) 2018-02-08

Family

ID=58488569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/055873 WO2017062697A2 (en) 2015-10-09 2016-10-07 2-dimensional thermal conductive materials and their use

Country Status (1)

Country Link
WO (1) WO2017062697A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774360B (en) * 2021-05-07 2022-08-11 大陸商河南烯力新材料科技有限公司 Heat disspation structure and electronic device
CN115475743B (en) * 2022-10-28 2023-05-23 江苏萃隆精密铜管股份有限公司 Condenser tube manufacturing process of condenser

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010048172A1 (en) * 2000-01-11 2001-12-06 Smith Lyle James Polymer composition with boron nitride coated carbon flakes
US20080118736A1 (en) * 2006-05-16 2008-05-22 Board Of Trustees Of Michigan State University Conductive composite compositions with fillers
US20080291634A1 (en) * 2007-05-22 2008-11-27 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
US20090008779A1 (en) * 2003-08-25 2009-01-08 Ephraim Suhir Composite Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20110308782A1 (en) * 2009-03-02 2011-12-22 Honeywell International Inc. Thermal interface material and method of making and using the same
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
US20140085813A1 (en) * 2012-09-27 2014-03-27 Liquidcool Solutions Film or composite that includes a nanomaterial
US20140120399A1 (en) * 2012-10-25 2014-05-01 The Regents Of The University Of California Graphene based thermal interface materials and methods of manufacturing the same
US20150014577A1 (en) * 2012-05-09 2015-01-15 Laird Technologies, Inc. Polymer matrices functionalized with carbon-coating species for enhanced thermal conductivity
US20150148459A1 (en) * 2012-06-05 2015-05-28 Stratasys, Inc Graphene coated substrates and resulting composites

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010048172A1 (en) * 2000-01-11 2001-12-06 Smith Lyle James Polymer composition with boron nitride coated carbon flakes
US20090008779A1 (en) * 2003-08-25 2009-01-08 Ephraim Suhir Composite Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
US20080118736A1 (en) * 2006-05-16 2008-05-22 Board Of Trustees Of Michigan State University Conductive composite compositions with fillers
US20080291634A1 (en) * 2007-05-22 2008-11-27 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
US20110308782A1 (en) * 2009-03-02 2011-12-22 Honeywell International Inc. Thermal interface material and method of making and using the same
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
US20150014577A1 (en) * 2012-05-09 2015-01-15 Laird Technologies, Inc. Polymer matrices functionalized with carbon-coating species for enhanced thermal conductivity
US20150148459A1 (en) * 2012-06-05 2015-05-28 Stratasys, Inc Graphene coated substrates and resulting composites
US20140085813A1 (en) * 2012-09-27 2014-03-27 Liquidcool Solutions Film or composite that includes a nanomaterial
US20140120399A1 (en) * 2012-10-25 2014-05-01 The Regents Of The University Of California Graphene based thermal interface materials and methods of manufacturing the same

Also Published As

Publication number Publication date
WO2017062697A2 (en) 2017-04-13

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