WO2017053714A1

WO2017053714A1 - Compact audio output electronic device with heat dissipation

Info

Publication number: WO2017053714A1
Application number: PCT/US2016/053326
Authority: WO
Inventors: Wayne Foletta
Original assignee: Polycom, Inc.
Priority date: 2015-09-25
Filing date: 2016-09-23
Publication date: 2017-03-30

Abstract

A compact audio output electronic device that includes a compact enclosure that has a cover and a base and supports a speaker. At least one heat emitting device is located within the enclosure. A bent bass port is located within the enclosure for enhancing bass frequency. The bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween. The external vent end is located at the cover and the internal vent end is positioned proximate the heat emitting device. A bidirectional air flow path is defined through the bent bass port such that heat from the heat emitting device exits at the external vent end of the bent bass port, and air flows from the internal vent end of the bent bass port toward the heat emitting device, thereby providing cooling to the at least one heat emitting device.

Description

COMPACT AUDIO OUTPUT ELECTRONIC DEVICE WITH HEAT DISSIPATION

Field of the Invention

[0001] The present invention relates to a compact audio output electronic device, such as a speakerphone, that effectively dissipates heat, without increasing the size or complexity of the audio device, or degrading the sound quality thereof.

Background of the Invention

[0002] A type of compact audio output electronic device may be a speaker, speakerphone, portable speakers with wireless links, any sealed enclosure with a speaker, or the like. A conventional speakerphone typically includes several microphones, a loudspeaker and a control module coupled to the loudspeaker and microphones. The control module may also have a keyboard and a display screen. A cable can be coupled to a network interface of the speakerphone to provide power and network connections. Some conventional audio devices may also include a straight tube member for improving the bass frequency of the sound of the audio device that is located far away from the electronics of the device.

[0003] Such audio devices are increasing in complexity and power consumption while decreasing in size. As a result, more heat is being produced by the audio device that requires dissipation. Conventional solutions to heat dissipation, such as heat sinks and fans which exchange the heat with the ambient environment, are either not effective or not practical. Fans, for example, cannot be used with a speakerphone because the noise from the fans would be picked up by the microphones and would degrade the acoustic echo canceller performance of the speakerphone. And heat sinks would not fit a compact design and may be uncomfortable to touch if too hot.

[0004] Therefore, a need exists for a compact audio electronic device, like a speakerphone, with increased power consumption that effectively dissipates heat, thereby extending the lifetime of the audio device and its components. Summary of the Invention

[0005] Accordingly, the present invention may provide a compact audio output electronic device that includes a compact enclosure that has a cover and a base and supports a speaker. At least one heat emitting device is located within the enclosure. A bent bass port is located within the enclosure for enhancing bass frequency. The bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween. The external vent end is located at the cover and the internal vent end is positioned proximate the heat emitting device. A bidirectional air flow path is defined through the bent bass port such that heat from the heat emitting device exits at the external vent end of the bent bass port, and air flows from the internal vent end of the bent bass port toward the heat emitting device, thereby providing cooling to the at least one heat emitting device. In a preferred embodiment, the compact audio output electronic device is a speakerphone.

[0006] The present invention may further provide a speakerphone that includes an enclosure that has a cover and a base and supports a speaker. At least one heat emitting device is located within the enclosure. The at least one heat emitting device is preferably a high power dissipation device. A bent bass port is coupled to the cover for enhancing bass frequency. The bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween. The external vent end aligns with an opening in the cover and the internal vent end is positioned proximate the at least one heat emitting device. A bidirectional air flow path is defined through the bent bass port such that heat from the at least one heat emitting device exits at the external vent end of the bent bass port, and air flows from the internal vent end of the bent bass port toward the at least one heat emitting device, thereby providing cooling to the at least one heat emitting device.

[0007] The present invention may also provide a speakerphone that includes an enclosure that has a cover and a base and supports a speaker. At least one high power dissipation device is located within the enclosure. The speakerphone includes means for heat dissipation that dissipates heat emitting from the at least one high power dissipation device and cools the at least one high power dissipation device by creating a bidirectional air flow path such that heat from the high power dissipation device exits the enclosure and air flows toward the high power dissipation device to provide said cooling.

[0008] Other objects, advantages and salient features of the invention will become apparent from the following detailed description, which, taken in conjunction with the annexed drawings, discloses a preferred embodiment of the present invention.

Brief Description of the Drawings

[0009] A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:

[0010] FIG. 1 is a top perspective view of a compact audio output electronic device according to an exemplary embodiment of the present invention, showing the device with its top grill removed;

[0011] FIG. 2 is a bottom perspective view of the compact audio output electronic device illustrated in FIG. 1, showing the device with its base removed;

[0012] FIG. 3 is an enlarged partial perspective view of the compact audio output electronic device illustrated in FIG. 2;

[0013] FIG. 4 is a cross-sectional view of the compact audio output electronic device according to an exemplary embodiment of the present invention; and

[0014] FIG. 5 is another cross-sectional view of the compact audio output electronic device according to an exemplary embodiment of the present invention. Detailed Description of the Exemplary Embodiments

[0015] Referring to FIGS. 1-5, the present invention relates to an audio device 100, particularly to a compact audio output electronic device, such as a speakerphone, that has improved heat dissipation and cooling without negatively impacting sound quality while also maintaining a compact design. An audio device may be considered compact when the physical volume of the electronic components thereof is a significant part of the available volume defined by the industrial design. The audio device 100 of the present invention preferably includes a bass port 110 that both enhances the bass frequency of the sound of the device and provides heat dissipation and cooling without degrading sound quality or increasing the size of the device. The high flow velocity created by the speaker bass port 110 of the present invention directs air exchange cooling towards critical sources of heat in the compact audio device 100.

[0016] The audio device or speakerphone 100 generally includes an enclosure 102, a control module 104, at least one speaker 106, and one or more microphones 108. The bass port 110 resides within the enclosure 102, preferably adjacent to the speaker 106, as best seen in Figs. 2 and 3. The enclosure 102 may include a cover 112 and a base 114 that are coupled at a perimeter thereof in a conventional manner to form the enclosure 102. The enclosure 102, including the cover 112 and the base 114, may have a generally Y-shape, as seen in Figs. 1 and 2. Alternatively, the enclosure 112 may have any desired shape that fits a compact design, such as square, rectangular, or circular.

[0017] The cover 112 of the enclosure 102 includes opposite inner and outer surfaces 118 and 120 and the base 114 likewise includes inner and outer surfaces 122 and 124, as best seen in Figs. 4 and 5. The inner surfaces 118 and 122 define an inner space 116 of the enclosure 102 that holds the electronics of the audio device 100. An ornamental grill 126 may be optionally provided over the cover 112 such that the grill 126 is spaced from the outer surface 120 of the cover 112. The cover's outer surface 120 may support a display panel 128 (FIG. 1) of the control module 104. The inner surface 118 of the cover 112 supports one or more print circuit boards 130 of the control module 104, as seen in Fig. 2. The printed circuit boards 130 and their associated circuitry and components provide audio processing for the device 100, as is known in the art. The electronic components supported by the printed circuit boards 130 may include, for example, a power supply 132 and power amplifier 134, which are high power dissipation devices. High power dissipation devices are those that dissipate more than about one watt in volume of about one cubic centimeter or less. Compared to the other electronics in the enclosure 102, the power supply 132 and/or power amplifier 134, are the highest power dissipation devices and therefore emit the most heat and require the most cooling. Other high power dissipation devices may include a DC/DC converter, display backlights, WiFi or other radio transmitters, and the like.

[0018] The speaker 106 is coupled to the cover 112 and is preferably centrally located within the enclosure 102. The bass port 110 is also coupled to the cover 112 and is preferably located proximate the heat emitting devices of the enclosure 102, particularly near the highest power dissipation devices, such as the power supply 132 or the power amplifier 134, as best seen in Figs. 2 and 3. The bass port 110 is bent such that it has a curved body 140 between an external vent end 142 and an internal vent end 144. The curved body 140 preferably has a substantially tubular structure with a curved side portion 146 and an opposite bend portion 148. As seen in Fig. 5, the bass port 110 is bent such that the bend portion 148 preferably forms around a 90 degree bend. Such curvature allows the internal vent end 144 of the bass port 110 to be directed towards the heat emitting devices in the enclosure 102, particularly the highest power dissipation devices, like the power supply 132 and power amplifier 134. The bend portion 148 may be more or less than 90 degrees as long as the internal vent end 144 points toward the highest power dissipation devices of the enclosure. The internal vent end 144 of the bass port 110 may include a flared lip 150 at its end, as seen in Fig. 5. The external vent end 142 corresponds and aligns with a vent opening 152 in the cover 112. The external vent end 142 and the vent opening 152 are spaced from the grill 126, thereby allowing air to escape the enclosure 102.

[0019] The bass port 110 is oriented such that the external vent end 142 is elevated with respect to the internal vent end 144 to create convection air flow through the port 110. In a preferred embodiment, the external vent end 142 is located at the highest point of the enclosure 102. The bent bass port 110 is designed and positioned to create a thermal venting bidirectional air flow path, as illustrated by the arrows in Figs. 4 and 5, through the curved body 140 thereof such that heat from the heat emitting devices, particularly the highest heat emitting devices, like the power supply 132 or amplifier 134, exits at the external vent end 142 of the bass port 110, and air flows from the internal vent end 144 towards the power supply 132 or amplifier 134. The inner surface 154 of the curved body 140 is preferably smooth to prevent premature air turbulence in the air flow through the port 110.

[0020] The bent shape and the location of the base port 110 proximate the high power dissipation devices in the enclosure 102 creates this bidirectional air flow, as described above, at little or no bass port audio output, which is the audio signal frequency content centered around the resonant frequency of the bass port 110. The high air flow velocity of the bass port 110 provides air exchange cooling towards the highest sources of heat in the compact enclosure 102, thereby cooling the audio device 100. This lowers the electronic system operating temperatures of the device 100, thereby extending the lifetime of the audio device and it components for a more long-term reliable audio device.

[0021] The length and inner diameter of the body 140 of the bass port 110 are preferably defined by Helmholtz's equation for a resonator as determined by the enclosure's 102 air volume. An enclosure having both volume and one or more openings will have a point of resonance described by the Helmholtz resonator effects. In bass-reflex speaker systems, at and near resonance, the opening generates sound radiation which is approximately in-phase with the front radiation, and hence, adds to the total bass output. Whereas above resonance, the speaker system behaves as a sealed enclosure with little or no output from the ports. That is, the resonance of enclosure 102, which is open to the atmosphere through vent opening 152, and which includes the bass port 110 of selected length and inner diameter define a Helmholtz resonator, and will resonate acoustically at a selected frequency which is a function, among other factors, of the volume of the enclosure, the mass of the air in the enclosure, and the dimensions of the opening 152. Thus, the sound radiates to the outside of the enclosure 102 to a resonance frequency of the port 110 according to the Helmholtz resonance effect.

[0022] While a particular embodiment has been chosen to illustrate the invention, it will be understood by those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention as defined in the appended claims.

Claims

WHAT IS CLAIMED IS:

1. A compact audio output electronic device, comprising:

a compact enclosure having a cover and a base, said compact enclosure supporting a speaker;

at least one heat emitting device located within said enclosure; and

a bent bass port located within said enclosure for enhancing bass frequency, said bent bass port having an external vent end and an opposite internal vent end, and a curved body therebetween, said external vent end being located at said cover and said internal vent end being positioned proximate said at least one heat emitting device,

wherein a bidirectional air flow path is defined through said bent bass port such that heat from said at least one heat emitting device exits at said external vent end of said bent bass port, and air flows from said internal vent end of said bent bass port toward said at least one heat emitting device, thereby providing cooling to said at least one heat emitting device.

2. A compact audio output electronic device according to claim 1, wherein

said at least one heat emitting device is the highest power dissipation device within said enclosure.

3. A compact audio output electronic device according to claim 2, wherein

said highest power dissipation device is a power supply.

4. A compact audio output electronic device according to claim 1, wherein

said external vent end corresponds with an opening in said cover at a highest point of said enclosure.

5. A compact audio output electronic device according to claim 1, wherein said bent bass port has a length and an inner diameter that define a Helmholtz resonator.

6. A compact audio output electronic device according to claim 1, wherein

said curved body of said bent bass port has a substantially tubular structure with a curved side portion and an opposite bend portion.

7. A compact audio output electronic device according to claim 1, wherein

said bent bass port includes a bend portion that is about a ninety degree bend.

8. A compact audio output electronic device according to claim 1, wherein

said internal vent end includes a flared lip generally facing said at least one heat emitting device.

9. A compact audio output electronic device according to claim 1, wherein

said external vent end is coupled to said cover.

10. A compact audio output electronic device according to claim 1, wherein

said bent bass port includes an inner surface, said inner surface is substantially smooth.

11. A compact audio output electronic device according to claim 1, further comprising a grill covering said enclosure; and

said external vent end of said bent bass port being spaced from said grill.

12. A compact audio output electronic device according to claim 1, wherein said speaker is generally centrally located in said enclosure; and

said bent bass port is located near said speaker.

13. A speakerphone, comprising:

an enclosure having a cover and a base, said enclosure supporting a speaker;

at least one heat emitting device located within said enclosure, said at least one heat emitting device being a high power dissipation device; and

a bent bass port coupled to said cover for enhancing bass frequency, said bent bass port having an external vent end and an opposite internal vent end, and a curved body therebetween, said external vent end aligning with an opening in said cover and said internal vent end being positioned proximate said at least one heat emitting device,

14. A speakerphone according to claim 13, wherein

said high power dissipation device is the highest power dissipation device within said enclosure.

15. A speakerphone according to claim 14, wherein

said highest power dissipation device is a power supply.

16. A speakerphone according to claim 13, wherein

17. A speakerphone according to claim 13, wherein

said bent bass port has a length and an inner diameter that define a Helmholtz resonator.

18. A speakerphone according to claim 13, wherein

said bent bass port includes a bend portion that is about a ninety degree bend.

19. A speakerphone, comprising:

an enclosure having a cover and a base, said enclosure supporting a speaker;

at least one high power dissipation device located within said enclosure; and means for heat dissipation, said means for heat dissipation dissipating heat emitting from said at least one high power dissipation device and cooling said at least one high power dissipation device by creating a bidirectional air flow path such that heat from said high power dissipation device exits said enclosure and air flows toward said high power dissipation device to provide said cooling.

20. A speakerphone according to claim 19, wherein

said at least one high power dissipating device is the highest power dissipation device within said enclosure.

21. A speakerphone according to claim 20, wherein

said means for heat dissipation includes a bent bass port coupled to said cover of said enclosure for enhancing bass frequency, said bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween, said external vent end aligns with an opening in said cover and said internal vent end is positioned proximate said high power dissipating device.

22. A speakerphone according to claim 21, wherein

said bent bass port includes a bend portion that is about a ninety degree bend.