WO2017045341A1 - 触控结构及其制作方法、触控基板和显示装置 - Google Patents

触控结构及其制作方法、触控基板和显示装置 Download PDF

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Publication number
WO2017045341A1
WO2017045341A1 PCT/CN2016/073283 CN2016073283W WO2017045341A1 WO 2017045341 A1 WO2017045341 A1 WO 2017045341A1 CN 2016073283 W CN2016073283 W CN 2016073283W WO 2017045341 A1 WO2017045341 A1 WO 2017045341A1
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WIPO (PCT)
Prior art keywords
touch
touch electrode
signal transmission
substrate
transmission structure
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PCT/CN2016/073283
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English (en)
French (fr)
Inventor
谢晓冬
胡明
张明
王静
何敏
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US15/517,617 priority Critical patent/US10444914B2/en
Publication of WO2017045341A1 publication Critical patent/WO2017045341A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Definitions

  • At least one embodiment of the present invention provides a touch structure and a method of fabricating the same, a touch substrate, and a display device.
  • Capacitive touch screens are widely used due to their advantages of precise positioning, good touch and long life.
  • the OGS (One Glass Solution) touch screen and the On Cell touch screen are two common touch screens.
  • the OGS touch screen is formed by separately forming a touch substrate on a protective substrate disposed outside the display panel, and then bonding the touch substrate to the display panel.
  • the touch structure is disposed on a surface of the opposite substrate (for example, the color filter substrate) in the display panel away from the array substrate.
  • a yellow light process is usually used to produce a product with excellent performance, and a yellow light process inevitably uses a mask.
  • the mask has a very high precision in production and a high repetition rate, which is very expensive. If the number of masks can be used as little as possible in a product design, and the performance of the product can be satisfied, the production cost and the tact time of the single product can be greatly reduced, and the equipment can also be moved. Can be significantly improved.
  • At least one embodiment of the present invention provides a touch structure, a method of fabricating the same, a touch substrate, and a display device. By changing the process sequence, the number of masks used can be reduced.
  • At least one embodiment of the present invention provides a touch structure including a base substrate, an insulating layer disposed on the base substrate, a first touch electrode, a second touch electrode, and a first signal transmission structure .
  • the first touch electrode and the second touch electrode intersect each other; the insulating layer includes a first portion, and the first portion of the insulating layer is disposed at the intersection of the first touch electrode and the second touch electrode Positioned between the first touch electrode and the second touch electrode to edge.
  • the first signal transmission structure is electrically connected to the first touch electrode, the insulating layer further includes a second portion disposed in the same layer as the first portion, and the second portion covers the first signal transmission structure .
  • At least one embodiment of the present invention also provides a touch substrate including the touch structure described above.
  • At least one embodiment of the present invention also provides a display device including the above touch substrate.
  • At least one embodiment of the present invention further provides a method of fabricating a touch structure, comprising: forming first and second touch electrodes that intersect each other on a substrate; on the substrate Forming a first signal transmission structure, the first signal transmission structure being electrically connected to the first touch electrode; and after forming the first signal transmission structure, forming an insulating film on the substrate substrate and A patterning process is performed to form an insulating layer including the first portion and the second portion.
  • the first portion of the insulating layer is formed at a position where the first touch electrode and the second touch electrode intersect and is located at the first touch electrode and the second touch
  • the electrodes are insulated to insulate the two, and the second portion covers the first signal transmission structure.
  • 1a is a top plan view of a conductive bridge type touch structure
  • Figure 1b is a cross-sectional view taken along line BB of Figure 1a;
  • Figure 1c is a cross-sectional view taken along line CC of Figure 1a;
  • FIG. 2 is a schematic top view of a touch structure according to an embodiment of the present invention.
  • 3a to 3d are schematic cross-sectional views of a conductive bridge type touch structure along line B'B' of FIG. 2 according to an embodiment of the present invention
  • FIG. 4 is a top plan view showing a plurality of via holes in a region where a first signal transmission structure is located according to an embodiment of the present invention
  • FIG. 5 is a top plan view showing a conductive connection portion covering a first signal transmission structure according to an embodiment of the present disclosure
  • 5b is a cross-sectional view of the touch structure according to the C'C' line of FIG. 2 according to an embodiment of the present invention
  • FIG. 6 is a cross-sectional view of the non-conductive bridge touch structure along line B'B' of FIG. 2 according to an embodiment of the present invention
  • FIG. 7a and 7b are partial cross-sectional views of a display device according to an embodiment of the present invention.
  • FIG. 8a to 8e are schematic diagrams showing steps of a method for fabricating a touch structure as shown in FIG. 3d according to an embodiment of the present invention
  • FIG. 9a to 9e are schematic diagrams showing steps of a method for fabricating a touch structure as shown in FIG. 3c according to an embodiment of the present invention.
  • 10a to 10f are schematic diagrams showing steps of a method for fabricating a touch structure as shown in FIG. 3b according to an embodiment of the present invention.
  • FIG. 1a is a top plan view of a conductive bridge touch structure.
  • the touch structure includes a plurality of first touch electrodes 01 and a plurality of second touch electrodes 02 that intersect horizontally and vertically.
  • Each first touch electrode 01 Each touch electrode 02 is electrically connected to at least one wire 04 to achieve electrical connection with a touch chip (not shown in FIG. 1a).
  • the 6Mask process flow is generally used, that is, 6 masks are required.
  • Figure 1b is a schematic cross-sectional view taken along line BB of Figure 1a. As shown in FIG. 1b, the 6Mask process flow can generally include the following steps (1) to (6).
  • the black matrix layer can be obtained by a patterning process including gluing, exposure, and development.
  • the conductive layer may include a plurality of spaced-apart conductive bridges 01b.
  • the conductive layer may be a transparent conductive material such as ITO (Indium Tin Oxide) or the like.
  • the conductive layer can be obtained by a patterning process including a process of sputter coating, photoresist coating, exposure, development, etching, and photoresist stripping.
  • Step (3) A first insulating layer 03 is formed, and the first insulating layer 03 covers the conductive bridge 01b.
  • the first insulating layer 03 can be obtained by a patterning process including gluing, exposure, and development.
  • the transparent conductive layer can also be obtained by a patterning process including a process of sputter coating, photoresist coating, exposure, development, etching, and photoresist stripping.
  • Step (5) fabricating a signal transmission layer.
  • the signal transmission layer includes a plurality of wires 04 electrically connected to the first touch electrode 01 and the second touch electrode 02, respectively.
  • the first touch electrode 01 is electrically connected to the wire 04
  • the second touch electrode 02 is electrically connected to the wire 04 in a manner similar to the first touch electrode 01 .
  • the signal transmission layer can be fabricated in a similar manner to the first and second transparent conductive layers.
  • Step (6) A second insulating layer 06 is formed, and the second insulating layer 06 covers the wire 04 for protecting the wire 04.
  • the second insulating layer 06 can be fabricated in a manner similar to that of the first insulating layer 03.
  • FIG. 1c is a schematic cross-sectional view taken along line CC of Figure 1a. As shown in FIG.
  • 081 denotes a reserved portion of the conductive layer at the Bonding position, that is, the reserved portion 081 is disposed in the same layer as the above-mentioned conductive bridge 01b; 082 indicates transparent conductive The remaining portion of the layer at the Bonding position, that is, the remaining portion 082 is disposed in the same layer as the second touch electrode 02 and the sub-electrode 01a; the wire 04 is formed over the remaining portions 081 and 082, in which case the wire 04 is prone to occur. Undercut phenomenon.
  • At least one embodiment of the present invention provides a touch structure and a method for fabricating the same, a touch substrate, and a display device, by using an insulating layer between the first touch electrode and the second touch electrode to cover the first touch
  • the first signal transmission structure electrically connected to the electrodes does not need to separately provide a protective layer for the first signal transmission structure, so that the mask plate used in the step of separately providing the protective layer for the first signal transmission structure can be omitted.
  • the touch structure includes a base substrate 90 and an insulating layer 30 disposed on the base substrate 90, and the first touch The first touch electrode 10 and the second touch electrode 20 intersect each other.
  • the first touch electrode 10 extends in the lateral direction and the second touch
  • the longitudinal extension of the control electrode 20 is taken as an example for description.
  • the insulating layer 30 includes a first portion 31 disposed at a position where the first touch electrode 10 and the second touch electrode 20 intersect and is located between the first touch electrode 10 and the second touch electrode 20 to Both are insulated.
  • the first signal transmission structure 41 is electrically connected to the first touch electrode 10, and the insulating layer 30 further includes a second portion 32 disposed in the same layer as the first portion 31.
  • the second portion 32 covers the first signal transmission structure 41, that is, the second The portion 32 is disposed above the first signal transmission structure 41, and the orthographic projection on the face of the first signal transmission structure 41 overlaps with the first signal transmission structure 41.
  • the structure covered by the insulating layer 30 is indicated by a broken line, and the structure not covered by the insulating layer 30 is indicated by a solid line.
  • the first portion 31 and the second portion 32 are disposed in the same layer, which means that the first portion 31 and the second portion 32 are formed by the same film layer.
  • the first portion 31 and the second portion 32 may be formed by first forming an insulating film and then patterning the insulating film.
  • the first portion 31 and the second portion 32 may be spaced apart from each other or may be at least partially connected to each other.
  • “same layer setting" means that the same film layer is formed.
  • FIG. 3a to FIG. 3d show a plurality of first signal transmission structures 41, each of which can be electrically connected to a first touch electrode 10, and FIGS. 3a to 3d only have a first signal.
  • the transmission structure 41 is electrically connected to the first touch electrode 10 as an example for description.
  • the insulating layer 30 is used to insulate the first touch electrode 10 and the second touch electrode 20 from each other, and In order to protect the first signal transmission structure 41 from being oxidized and scratched.
  • the material of the insulating layer 30 may include an organic material such as a resin or the like, or an inorganic material such as silicon dioxide, silicon nitride, silicon oxynitride, or the like.
  • the forming material of the first signal transmission structure 41 may include a metal such as at least one of metals such as copper, aluminum, magnesium, molybdenum, zirconium, titanium, lead, or the like, or a suitable alloy thereof.
  • the first signal transmission structure 41 may include at least one of a wire and a contact pad.
  • the forming materials of the first touch electrode 10 and the second touch electrode 20 may include transparent conductive metal oxides, such as ITO (indium tin oxide), IGZO (indium gallium zinc oxide), and IZO (indium zinc oxide). At least one of the materials.
  • transparent conductive metal oxides such as ITO (indium tin oxide), IGZO (indium gallium zinc oxide), and IZO (indium zinc oxide). At least one of the materials.
  • the first touch electrode 10 may include a remote control substrate 30 directly connected to the first signal transmission structure 41 and disposed on the insulating layer 30 away from the substrate substrate 90 . a portion of one side; or a portion of the first touch electrode 10 directly electrically connected to the first signal transmission structure 41 may also be disposed on a side of the insulating layer 30 adjacent to the substrate substrate 90 and at the insulating layer 30 and the first Between the signal transmission structures 41 (as shown in FIG.
  • first touch electrode 10 directly electrically connected to the first signal transmission structure 41 may also be disposed on the side of the insulating layer 30 close to the substrate 90 And disposed between the first signal transmission structure 41 and the substrate substrate 90 (as shown in FIG. 3b).
  • the first signal transmission structure 41 may pass through the insulating layer 30.
  • the at least one via hole 30b provided in the second portion 32 is electrically connected to the first touch electrode 10. Only the first signal transmission structure 41 is electrically connected to the first touch electrode 10 through a via 30b in FIGS. 3a to 3d. 4 shows that the first signal transmission structure 41 is electrically connected to the first touch electrode (not shown in FIG. 4) through the plurality of via holes 30b. As shown in FIG.
  • the first signal transmission structure 41 includes, for example, an integrally formed contact pad 41a and a wire 41b (only a part of the wire 41b is shown in FIG. 4), and a plurality of via holes are provided in a region where the contact pad 41a is located. 30b.
  • the first signal transmission structure 41 is electrically connected to the first touch electrode 10 (or the second touch electrode 20) through the plurality of via holes 30b, so that the first touch electrode 10 (or the first The second touch electrode 20) has an overall disconnection due to peeling phenomenon at the via hole 30b. risks of.
  • the touch structure provided by the embodiment of the present invention may adopt a conductive bridge type touch structure, that is, as shown in FIG. 2 to FIG. 3d, one of the first touch electrode 10 and the second touch electrode 20 may be Including at least one conductive bridge and a plurality of sub-electrodes spaced apart from each other, the adjacent sub-electrodes are electrically connected by a conductive bridge, and the conductive bridge is disposed at a position where the first touch electrode and the second touch electrode intersect, and the first touch The other of the control electrode and the second touch electrode is disposed in the same layer as the sub-electrode but is disposed in a different layer from the conductive bridge.
  • the first touch electrode 10 includes at least one conductive bridge 12 and a plurality of sub-electrodes 11 spaced apart from each other (only one conductive bridge 12 and two sub-electrodes 11 are shown in FIGS. 3a and 3b).
  • the adjacent sub-electrodes 11 are electrically connected together through the conductive bridge 12, that is, each sub-electrode 11 is electrically connected to the conductive bridge 12 through the via 30a in the insulating layer 30; the second touch electrode 20 and the sub-electrode 11 is set in the same layer, but is set with a different layer from the conductive bridge 12.
  • 3a to 3d illustrate the first touch electrode 10 including the sub-electrode 11 and the conductive bridge 12 as an example, but the present invention is not limited to this structure.
  • the sub-electrode 11 and the conductive bridge 12 may be located on either side of the insulating layer 30 (i.e., the side facing the substrate substrate 90 and the side away from the substrate substrate 90).
  • the conductive bridge 12 is disposed between the first portion 31 of the insulating layer 30 and the base substrate 90, and the sub-electrode 11 is disposed on a side of the insulating layer 30 away from the base substrate 90.
  • the conductive bridge 12 is disposed on a side of the insulating layer 30 away from the base substrate 90, and the sub-electrode 11 is disposed between the insulating layer 30 and the base substrate 90.
  • the touch structure provided by the embodiment of the present invention may further include a second signal transmission structure 42.
  • the second signal transmission structure 42 is electrically connected to the second touch electrode 20 to implement the second touch electrode. Electrical connection to the touch chip.
  • the second signal transmission structure 42 can be disposed in the same layer as the 41 first signal transmission structure.
  • the touch structure is a conductive bridge type touch structure
  • the second touch electrode 20 is disposed in the same layer as the sub-electrode 11 of the first touch electrode 10
  • the second touch electrode 20 and the second signal transmission structure 42 are electrically connected to the first touch electrode 10 and the first signal transmission structure. 41 is electrically connected in the same manner; similarly, when the second touch electrode 20 includes a sub-electrode, the second touch electrode 20 and the second signal transmission structure 42 are electrically connected to the first touch electrode 10 and the first A signal transmission structure 41 is electrically connected in the same manner.
  • the second signal transmission structure 42 and the first signal transmission structure 41 may also be disposed in different layers according to actual conditions.
  • a second signal transmission structure electrically connected to the second touch electrode 20 can be formed while forming the second touch electrode 20 to implement electrical connection between the second touch electrode 20 and the touch chip.
  • Embodiments of the invention include, but are not limited to, such.
  • the second portion 32 of the insulating layer 30 is in direct contact with the first signal transmission structure 41.
  • the second portion 32 of the insulating layer 30 may not be in direct contact with the first signal transmission structure 41.
  • the first touch may be made.
  • a portion of the control electrode 10 that is electrically connected to the first signal transmission structure 41 covers the first signal transmission structure 41. This can more fully protect the first signal transmission structure 41 and reduce the adverse effect of the first signal transmission structure 41 due to an undercut phenomenon.
  • the second portion 32 of the insulating layer 30 may cover and be in direct contact with the portion of the first touch electrode 10.
  • the conductive bridge 12 is disposed.
  • a conductive connection portion 70 may be disposed between the second portion 32 of the insulating layer 30 and the base substrate 90.
  • the conductive connection portion 70 covers and electrically Connecting the first signal transmission structure 41, that is, the conductive connection portion 70 is disposed on a side of the first signal transmission structure 41 away from the substrate substrate 90 and in direct contact with the first signal transmission structure 41; and, the conductive connection portion 70 and the The conductive bridge 12 of the touch electrode 10 is disposed in the same layer, that is, the conductive connection portion 70 is formed by the film layer forming the conductive bridge 12.
  • FIG. 5a is a top plan view of the first signal transmission structure 41 covered by the conductive connection portion 70 in the embodiment of the present invention
  • FIG. 5b is a schematic view of the first signal transmission structure 41 in the embodiment of the present invention, which is electrically connected to the touch chip (ie, , at the location of Bonding), a schematic cross-sectional view.
  • the conductive connection portion 70 covers and electrically connects the first signal transmission structure 41, so that the first signal transmission structure 41 can be sufficiently protected, and the first signal transmission structure 41 can be prevented from being undercuted as much as possible.
  • a sub-electrode 11 forming the first touch electrode 10 may be disposed on the conductive connection portion 70. And a remaining portion of the film layer of the second touch electrode 12 (not shown).
  • the forming material of the conductive connecting portion 70 may also include a conductive metal oxide such as ITO (Indium Tin Oxide). At least one of materials such as IGZO (indium gallium zinc oxide) and IZO (indium zinc oxide).
  • ITO Indium Tin Oxide
  • IGZO indium gallium zinc oxide
  • IZO indium zinc oxide
  • the touch structure provided by the embodiment of the present invention may also adopt a non-conductive bridge type touch structure commonly used in the art, as long as the first touch electrode 10 and the second touch electrode 20 intersect each other, the insulating layer 30 is disposed.
  • the first touch electrode 10 and the second touch electrode 20 are insulated between the two.
  • one of the first touch electrode 10 and the second touch electrode 20 may be disposed between the insulating layer 30 and the base substrate 90, and the other is disposed on the insulating layer 30. Keep away from the side of the substrate substrate 90.
  • the first touch electrode 10 can be disposed on a side of the insulating layer 30 away from the substrate 90 (as shown in FIG. 6a and FIG. 6d); or the first touch electrode 10 can be disposed on the insulating layer 30.
  • a side of the substrate substrate 90 is disposed between the first signal transmission structure 41 and the substrate substrate 90 (as shown in FIG. 6b); or the first touch electrode 10 may be disposed adjacent to the insulating layer 30.
  • One side of the base substrate 90 is disposed between the insulating layer 30 and the first signal transmission structure 41 (as shown in FIG. 6c).
  • the first signal transmission structure 41 can be further protected in the following manner.
  • the first touch electrode 10 is disposed between the second portion 32 of the insulating layer 30 and the first signal transmission structure 41, and the first touch electrode 10 covers the first signal transmission structure 41.
  • the second portion 32 of the insulating layer 30 covers the portion of the first touch electrode 10 and is in direct contact with the first touch electrode 10 .
  • the first touch electrode 10 when the first touch electrode 10 is disposed on the side of the insulating layer 30 away from the substrate substrate 90, between the second portion 32 of the insulating layer 30 and the substrate substrate 90, A conductive connection portion 70 is disposed, and the conductive connection portion 70 covers and electrically connects the first signal transmission structure 41, That is, the conductive connection portion 70 is disposed on a side of the first signal transmission structure 41 away from the base substrate 90 and is in direct contact with the first signal transmission structure 41; and the conductive connection portion 70 is disposed in the same layer as the second touch electrode 20 .
  • the first touch electrode 10 and the second touch electrode 20 are located on both sides of the insulating layer 30, and the first touch electrode 10 and the second touch electrode 20 are Signals are exported in different ways.
  • the second touch electrode 10 can be in a manner as shown in, for example, FIG. 6b or FIG. 6c.
  • the two signal transmission structures (including at least one of the wires and the contact pads) are electrically connected to achieve electrical connection with the touch chip; or, for example, when the first touch electrode 10 and the first signal transmission structure 41 are in accordance with FIG. 6b or When the manner shown in FIG.
  • the second touch electrode 10 can be electrically connected to the second signal transmission structure in a manner as shown, for example, in FIG. 6a or 6d; or, for example, the second touch electrode 20 can be formed.
  • a second signal transmission structure electrically connected to the second touch electrode 20 is formed.
  • Embodiments of the invention include, but are not limited to, such.
  • the top view of the touch structure provided by the embodiment of the present invention may be similar to the case shown in FIG. 1a. Therefore, the related embodiments of the present invention are not separately provided.
  • the touch structure provided by the embodiment of the invention can be applied to the OGS touch screen or the MLOC (Multi-layer On Cell) touch screen.
  • a black matrix layer 50 may be disposed on the base substrate 90 at a position corresponding to the first signal transmission structure 41; In the control panel, it is not necessary to make a black matrix layer on the base substrate 90.
  • At least one embodiment of the present invention further provides a touch substrate comprising the touch structure provided by any of the above embodiments.
  • At least one embodiment of the present invention also provides a display device including the above touch substrate.
  • the display device may include an array substrate 1 and a counter substrate 2 (for example, a color filter substrate) disposed opposite to each other.
  • the opposite substrate 2 may be used as the touch substrate provided in any of the above embodiments.
  • the display device may include an array substrate 1 and a counter substrate 2 disposed opposite to each other, and a protective substrate 5 disposed on a side of the opposite substrate away from the array substrate.
  • Counter substrate 2 The touch control substrate can be used as the touch substrate provided by any of the above embodiments, and the touch control structure can be disposed on the side of the opposite substrate 2 away from the array substrate 1; or the protective substrate 5 can be used as the touch provided by any of the above embodiments. Substrate.
  • FIGS. 7a and 7b are the same as those in the embodiment of the above touch structure, and are not described herein again.
  • the display device may be: a liquid crystal panel, an electronic paper, an OLED (Organic Light-Emitting Diode) panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like, or any product having a display function or component.
  • OLED Organic Light-Emitting Diode
  • At least one embodiment of the present invention further provides a method of fabricating a touch structure, the method comprising: forming first and second touch electrodes intersecting each other on a substrate; forming on the substrate a first signal transmission structure, the first signal transmission structure is electrically connected to the first touch electrode; and after the first signal transmission structure is formed, an insulating film is formed on the substrate substrate and patterned to form the first The first portion is formed at a position where the first touch electrode and the second touch electrode intersect and is located between the first touch electrode and the second touch electrode to insulate the two. The two parts cover the first signal transmission structure.
  • the patterning process includes a process of forming a set pattern by using a mask, for example, including a photoresist, exposure, development, etching, etc.; however, the embodiment is not limited thereto, and the patterning process may be other capable of forming a setting.
  • a mask for example, including a photoresist, exposure, development, etching, etc.; however, the embodiment is not limited thereto, and the patterning process may be other capable of forming a setting.
  • the process of the pattern is not limited thereto, and the embodiment is not limited thereto, and the patterning process may be other capable of forming a setting. The process of the pattern.
  • the manufacturing method provided by the embodiment of the present invention does not limit the order in which the first touch electrode, the second touch electrode, and the insulating layer are formed, as long as the first touch electrode and the second touch electrode intersect and are insulated by the insulating layer. can.
  • the insulating film may be subjected to the above. Patterning to form an insulating layer and at least one via located in the second portion of the insulating layer, the first signal transmission structure being electrically connected to the first touch electrode through the at least one via.
  • the step of forming the first signal transmission structure may further include forming a second signal transmission structure, and the second signal transmission structure is electrically connected to the second touch electrode.
  • the first signal transmission structure is disposed in the same layer as the second signal transmission structure.
  • the manufacturing method may include the following steps S11 to S14, which are described in detail below in conjunction with FIGS. 8a to 8e.
  • Step S11 A first signal transmission structure 41 is formed on the base substrate 90 as shown in Fig. 8a.
  • the first signal transmission structure 41 can be obtained by a process such as sputtering, photoresist coating, exposure, development, etching, and stripping of a photoresist.
  • Step S12 forming a first conductive film 81 on the first signal transmission structure 41, as shown in FIG. 8a; patterning the first conductive film 81 to form a conductive connection portion 70 covering and electrically connecting the first signal transmission structure 41, As shown in Figure 8b.
  • the first conductive film may be formed using a conductive metal oxide.
  • the conductive connection portion 70 can be obtained by a process such as sputtering, photoresist coating, exposure, development, etching, and stripping of a photoresist.
  • the conductive connection portion 70 is formed while forming the conductive bridge 12, as shown in FIG. 8b; for the touch structure shown in FIG. 6d, a conductive connection is formed.
  • the portion 70 is also formed with a second touch electrode.
  • Step S13 An insulating film 30' is formed on the conductive connecting portion 70 as shown in Fig. 8c; thereafter, the insulating film 30' is patterned to form the insulating layer 30 as shown in Fig. 8d.
  • the insulating layer 30 includes a first portion 31 and a second portion 32, and at least one via 30b exposing at least a portion of the surface of the conductive connection portion 70 is formed in the second portion 32.
  • a plurality of via holes 3a exposing a part of the surface of the conductive bridge 12 are also formed in the insulating layer 30.
  • the insulating layer 30 may be formed by a patterning process including a process of coating, exposure, and development.
  • Step S14 forming a second conductive film 82 on the insulating layer 30, as shown in FIG. 8e, and patterning the second conductive film 82 to form at least a portion of the first touch electrode 10, as shown in FIG. 3d.
  • the second touch electrode 20 and the sub-electrode 11 of the first touch electrode 10 are formed in the step, and the sub-electrode 11 passes through the at least one via 30b and the first signal.
  • the transmission structure 41 is electrically connected, and the adjacent two sub-electrodes 11 are electrically connected to the conductive bridge 12 through the vias 30a in the insulating layer 30, thereby forming the first touch electrode 10; for the touch structure as shown in FIG. 6d
  • the first touch electrode is formed in this step.
  • the second conductive film may be formed using a conductive metal oxide.
  • the step S14 may include a process of sputter coating, photoresist coating, exposure, development, etching, and stripping of the photoresist.
  • the manufacturing method provided by at least one embodiment of the present invention may include the following steps S21 to S24, which are described in detail below in conjunction with FIGS. 9a to 9e.
  • Step S21 A first signal transmission structure 41 is formed on the base substrate 90 as shown in Fig. 9a.
  • Step S22 forming a first conductive film 81 on the first signal transmission structure 41, as shown in FIG. 9a; patterning the first conductive film 81 to form at least a portion of the first touch electrode 10, as shown in FIG. 9b.
  • the second touch electrode 20 and the sub-electrode 11 of the first touch electrode 10 are formed in this step, and the sub-electrode 11 covers and electrically connects the first signal transmission structure 41; As shown in FIG. 6c, a first touch electrode is formed in this step.
  • Step S23 forming an insulating film 30' on the at least a portion of the first touch electrode 10, as shown in FIG. 9c; thereafter, patterning the insulating film 30' to form the insulating layer 30, as shown in FIG. 9d. .
  • the insulating layer 30 covers the at least a portion of the first touch electrode 10; for the touch structure shown in FIG. 3c, the insulating layer 30 is formed with the exposed at least a portion of the first touch electrode 10 A plurality of vias 30a on a portion of the surface.
  • Step S24 forming a second conductive film 82 on the insulating layer 30 as shown in FIG. 9e; thereafter, patterning the second conductive film 82.
  • a conductive bridge 12 is formed in this step, and the conductive bridge 12 electrically connects the two adjacent sub-electrodes 11 through the via 30a of the insulating layer 30 to form the first touch electrode 10.
  • a second touch electrode is formed in this step.
  • the patterning process of each film may refer to the description in the step S11 to the step S14, and the repeated portions are not described again.
  • the manufacturing method provided by at least one embodiment of the present invention may include the following steps S31 to S34, which are described in detail below with reference to FIGS. 10a to 10f.
  • Step S31 forming a first conductive film 81 on the base substrate 90, as shown in FIG. 10a; thereafter, patterning the first conductive film 81 to form at least a portion of the first touch electrode 10, as shown in FIG. 10b. Shown.
  • the second touch electrode 20 and the sub-electrode 11 of the first touch electrode 10 are formed in this step; for the touch structure shown in FIG. 6b, in this step A first touch electrode is formed.
  • Step S32 forming a first signal transmission structure 41 on at least a portion of the first touch electrode 10, as shown in FIG. 10c.
  • Step S33 An insulating film 30' is formed on the first signal transmission structure 41 as shown in Fig. 10d; thereafter, the insulating film 30' is patterned to form the insulating layer 30 as shown in Fig. 10e.
  • the insulating layer 30 covers the at least a portion of the first touch electrode 10 and the first signal transmission structure 41; for the touch structure shown in FIG. 3b, the first touch is formed in the insulating layer 30.
  • a plurality of via holes 30a of a portion of the surface of the electrode 10 at least a part of the surface.
  • Step S34 forming a second conductive film 82 on the insulating layer 30 as shown in FIG. 10f; thereafter, patterning the second conductive film.
  • a conductive bridge 12 is formed in this step, and the conductive bridge 12 electrically connects two adjacent sub-electrodes 11 through the via 30a of the insulating layer 30 to form the first touch electrode 10.
  • a second touch electrode is formed in this step.
  • the manufacturing process of each film can refer to the description in the step S11 to the step S14, and the repeated portions are not described again.
  • the above manufacturing method is described by taking only FIG. 3b to FIG. 3d and FIG. 6b to FIG. 6d as an example.
  • the embodiments of the present invention include, but are not limited to, the present invention.
  • the first touch electrode may be continuously formed, and the second touch electrode includes a conductive bridge and a sub-electrode.
  • the touch as shown in FIG. 3b to FIG. 3d is made.
  • the pattern obtained by patterning the first conductive film and the second conductive film also changes accordingly.
  • the manufacturing method provided by the embodiment of the present invention can be used to fabricate an OGS touch screen and an MLOC touch screen.
  • the manufacturing method provided by the embodiment of the present invention may further include the step of forming a black matrix layer.
  • the manufacturing method provided by the embodiment of the present invention is a 5Mask process, which is relatively common.
  • the 6Mask process reduces a Mask process.
  • the method for forming a black matrix layer may not be included in the process of fabricating a cover-type touch screen.
  • the manufacturing method provided by the embodiment of the present invention is a 4Mask process.
  • the embodiments of the present invention include, but are not limited to, the following.
  • the touch structure and the manufacturing method thereof, the touch substrate, and the display device have the following advantages: 1. By covering with an insulating layer between the first touch electrode and the second touch electrode The first signal transmission structure can effectively protect the first signal transmission structure (for example, preventing oxidation or scratching thereof), and can also eliminate the step of separately providing an insulating layer for protecting the first signal transmission structure, thereby saving one sheet. a masking plate; 2.
  • the first signal transmission structure is made of a metal material, and the first and second touch electrodes are made of a metal oxide material, and the first signal transmission structure is expanded by using materials forming the first and second touch electrodes.
  • the method can fully protect the first signal transmission structure, and avoid the poor signal transmission caused by the undercut phenomenon of the first signal transmission structure; 3. realize the first signal transmission structure and the first touch through multiple vias
  • the electrical connection between the control electrodes can prevent the overall open circuit caused by the peeling of the first touch electrode at the via hole as compared with the manner of using one via hole.

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Abstract

一种触控结构，包括衬底基板（90）、设置于其上的绝缘层（30）、彼此相交的第一触控电极（10）和第二触控电极（20）、以及与第一触控电极（10）电连接的第一信号传输结构（41）；绝缘层（30）包括设置于第一触控电极（10）和第二触控电极（20）相交位置处且位于二者之间以将二者绝缘的第一部分（31）、和与第一部分（31）同层设置且覆盖第一信号传输结构（41）的第二部分（32）。

Description

触控结构及其制作方法、触控基板和显示装置 技术领域
本发明的至少一个实施例提供了一种触控结构及其制作方法、触控基板和显示装置。
背景技术
电容式触控屏由于具有定位精确灵敏、触摸手感好以及使用寿命长等优点，而被广泛使用。
OGS(One Glass Solution)触控屏和覆盖表面式(On cell)触控屏是两种比较常见的触控屏。OGS触控屏通过采用将触控结构设置在显示面板之外的保护基板上以单独形成触控基板，之后将触控基板与显示面板贴合在一起的方式形成。在覆盖表面式触控屏中，触控结构设置在显示面板中的对置基板(例如彩膜基板)的远离阵列基板一侧的表面上。
在OGS触控屏和覆盖表面式触控屏的制作过程中，通常使用黄光制程以制作出性能优异的产品，而黄光制程不可避免地要使用到光罩(Mask)。光罩对制作精度要求非常高，使用重复率高，其价格十分的昂贵。如果在一款产品的设计中能够尽量少地使用光罩的数量，而且又能够满足产品的性能，则可以大大降低生产成本和单件产品生产时间(tact time)等，并且设备的稼动也能得到明显的提高。
发明内容
本发明的至少一个实施例提供了一种触控结构及其制作方法、触控基板和显示装置，通过改变工艺顺序，可以减少掩膜板的使用数量。
本发明的至少一个实施例提供了一种触控结构，其包括衬底基板、设置于所述衬底基板上的绝缘层、第一触控电极、第二触控电极以及第一信号传输结构。第一触控电极、第二触控电极彼此相交；所述绝缘层包括第一部分，所述绝缘层的所述第一部分设置于所述第一触控电极和所述第二触控电极相交的位置处且位于所述第一触控电极和所述第二触控电极之间以将二者绝 缘。所述第一信号传输结构与所述第一触控电极电连接，所述绝缘层还包括与所述第一部分同层设置的第二部分，所述第二部分覆盖所述第一信号传输结构。
本发明的至少一个实施例还提供了一种触控基板，其包括以上所述的触控结构。
本发明的至少一个实施例还提供了一种显示装置，其包括上述触控基板。
本发明的至少一个实施例还提供了一种触控结构的制作方法，其包括：在衬底基板上形成彼此相交的第一触控电极和第二触控电极；在所述衬底基板上形成第一信号传输结构，所述第一信号传输结构与所述第一触控电极电连接；以及在形成所述第一信号传输结构之后，在所述衬底基板上形成绝缘薄膜并对其进行图案化处理，以形成包括第一部分和第二部分的绝缘层。在该方法中，所述绝缘层的所述第一部分形成于所述第一触控电极和所述第二触控电极相交的位置处且位于所述第一触控电极和所述第二触控电极之间以将二者绝缘，所述第二部分覆盖所述第一信号传输结构。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为一种导电桥式触控结构的俯视示意图；
图1b为沿图1a中的BB线的剖视示意图；
图1c为沿图1a中CC线的剖视示意图；
图2为本发明实施例提供的一种触控结构的俯视示意图；
图3a至图3d为本发明实施例提供的一种导电桥式触控结构沿图2中B′B′线的剖视示意图；
图4为本发明实施例提供的一种第一信号传输结构所在区域处设置有多个过孔的俯视示意图；
图5a为本发明实施例提供的一种导电连接部覆盖第一信号传输结构的俯视示意图；
图5b为本发明实施例提供的触控结构沿图2中C′C′线的剖视示意图；
图6a至图6d为本发明实施例提供的一种非导电桥式触控结构沿图2中B′B′线的剖视示意图；
图7a和图7b为本发明实施例提供的显示装置的局部剖视示意图；
图8a至图8e为本发明实施例提供的一种如图3d所示的触控结构的制作方法的各步骤的示意图；
图9a至图9e为本发明实施例提供的一种如图3c所示的触控结构的制作方法的各步骤的示意图；
图10a至图10f为本发明实施例提供的一种如图3b所示的触控结构的制作方法的各步骤的示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
在电容式触控屏中，导电桥式触控结构是一种常用的触控结构。图1a为一种导电桥式触控结构的俯视示意图。如图1a所示，该触控结构包括横纵交叉的多个第一触控电极01和多个第二触控电极02。每个第一触控电极01 和每个触控电极02都与至少一条导线04电连接，以实现与触控芯片(图1a中未示出)的电连接。通常，OGS触控屏若采用导电桥式触控结构，一般都会使用到6Mask工艺流程，即需要使用6道光罩。图1b为沿图1a中的BB线的剖面示意图。如图1b所示，该6Mask工艺流程通常可以包括以下步骤(1)至步骤(6)。
步骤(1)：在衬底基板09上制作黑矩阵层05。例如，可以通过包括涂胶、曝光和显影的图案化处理方式得到黑矩阵层。
步骤(2)：制作导电层，例如，该导电层可以包括多个间隔设置的导电桥01b。例如，该导电层可以采用透明导电材料，例如ITO(氧化铟锡)等。例如，该导电层可以通过包括溅射镀膜、涂光刻胶、曝光、显影、刻蚀和光刻胶剥离等过程的图案化处理方式得到。
步骤(3)：制作第一绝缘层03，该第一绝缘层03覆盖导电桥01b。例如，可以通过包括涂胶、曝光和显影的图案化处理方式得到第一绝缘层03。
步骤(4)：制作透明导电层，该透明导电层包括第二触控电极02以及多个间隔设置的子电极01a，相邻的子电极01a通过导电桥01b电连接在一起，以形成第一触控电极01。例如，透明导电层也可以通过包括溅射镀膜、涂光刻胶、曝光、显影、刻蚀和光刻胶剥离等过程的图案化处理方式得到。
步骤(5)：制作信号传输层，例如，信号传输层包括多条导线04，这些导线04分别与第一触控电极01和第二触控电极02电连接。图1b中仅示出第一触控电极01与导线04电连接，第二触控电极02与导线04电连接的方式与第一触控电极01类似。信号传输层的制作方式可以与制作第一、二透明导电层的方式类似。
步骤(6)：制作第二绝缘层06，第二绝缘层06覆盖导线04，用于保护导线04。第二绝缘层06的制作方式可以与第一绝缘层03的制作方式类似。
在研究中，本申请的发明人注意到：通过改变上述6Mask工艺流程的工艺顺序，可以减少掩膜板的使用数量，从而降低生产成本；并且，在6Mask工艺中，在导线04与触控芯片电连接的位置处(即，在Bonding位置处)，导线04容易发生undercut(塌陷)现象，从而导致断路。图1c为沿图1a中CC线的剖面示意图。如图1c所示，081表示导电层在Bonding位置处的保留部分，即该保留部分081与上述导电桥01b同层设置；082表示透明导电 层在Bonding位置处的保留部分，即保留部分082与上述第二触控电极02和子电极01a同层设置；导线04形成在保留部分081和082之上，在这种情况下，导线04容易发生undercut现象。
本发明的至少一个实施例提供了一种触控结构及其制作方法、触控基板和显示装置，通过利用第一触控电极和第二触控电极之间的绝缘层覆盖与第一触控电极电连接的第一信号传输结构，不需要针对第一信号传输结构单独设置保护层，从而可以省去针对第一信号传输结构单独设置保护层步骤中用到的掩膜板。
本发明的至少一个实施例提供了一种触控结构，如图2至图3d所示，该触控结构包括衬底基板90和设置于衬底基板90上的绝缘层30、第一触控电极10、第二触控电极20和第一信号传输结构41；第一触控电极10和第二触控电极20彼此相交，图2中以第一触控电极10沿横向延伸、第二触控电极20纵向延伸为例进行说明，当然，二者的方向也可以相反或者为其他方向。绝缘层30包括第一部分31，该第一部分31设置于第一触控电极10和第二触控电极20相交的位置处且位于第一触控电极10和第二触控电极20之间以将二者绝缘。第一信号传输结构41与第一触控电极10电连接，绝缘层30还包括与第一部分31同层设置的第二部分32，第二部分32覆盖第一信号传输结构41，即，第二部分32设置于第一信号传输结构41上方，并且在第一信号传输结构41所在面上的正投影与第一信号传输结构41有重叠部分。
在图2中，被绝缘层30覆盖的结构用虚线表示，未被绝缘层30覆盖的结构用实线表示。
需要说明的是，本公开中第一部分31与第二部分32同层设置，是指第一部分31与第二部分32由同一膜层形成。例如，可以通过首先形成绝缘薄膜、然后对该绝缘薄膜进行图案化处理的方式形成第一部分31和第二部分32。第一部分31和第二部分32可以彼此间隔开，也可以彼此至少部分连接。本发明的以下实施例中，“同层设置”都是指由同一膜层形成。
此外，图3a至图3d示出了多个第一信号传输结构41，每个第一信号传输结构41可以与一个第一触控电极10电连接，图3a至图3d仅以一个第一信号传输结构41与第一触控电极10电连接为例进行说明。
绝缘层30用于使第一触控电极10和第二触控电极20彼此绝缘，并且可 以保护第一信号传输结构41不被氧化、划伤。绝缘层30的材料可以包括有机材料，例如树脂等，或者包括无机材料，例如二氧化硅、氮化硅、氧氮化硅等。
例如，第一信号传输结构41的形成材料可以包括金属，例如，铜、铝、镁、钼、锆、钛、铅等金属中的至少一种或它们的适当的合金。例如，第一信号传输结构41可以包括导线和接触垫中的至少一个。
例如，第一触控电极10和第二触控电极20的形成材料可以包括透明的导电金属氧化物，例如，ITO(氧化铟锡)、IGZO(氧化铟镓锌)、IZO(氧化铟锌)等材料中的至少一种。
第一触控电极10的与第一信号传输结构41电连接的部分(如图3a和图3d所示中第一触控电极10的与第一信号传输结构41直接电连接的子电极11所示)可以设置于绝缘层30的远离衬底基板90的一侧，即，第一触控电极10可以包括与第一信号传输结构41直接电连接且设置于绝缘层30的远离衬底基板90的一侧的部分；或者第一触控电极10的与第一信号传输结构41直接电连接的部分也可以设置于绝缘层30的靠近衬底基板90的一侧并且位于绝缘层30与第一信号传输结构41之间(如图3c所示)；或者第一触控电极10的与第一信号传输结构41直接电连接的部分也可以设置于绝缘层30的靠近衬底基板90的一侧并且设置于第一信号传输结构41与衬底基板90之间(如图3b所示)。
在第一触控电极10的与第一信号传输结构41电连接的部分设置于绝缘层30的远离衬底基板90的一侧的情形中，例如，第一信号传输结构41可以通过绝缘层30的第二部分32中设置的至少一个过孔30b与第一触控电极10电连接。图3a至图3d中仅示出了第一信号传输结构41通过一个过孔30b与第一触控电极10电连接。图4示出了第一信号传输结构41通过多个过孔30b与第一触控电极(图4中未示出)电连接。如图4所示，第一信号传输结构41包括例如一体形成的接触垫41a和导线41b(图4中仅示出了导线41b的一部分)，接触垫41a所在的区域中设置有多个过孔30b。
在本发明实施例中，第一信号传输结构41通过多个过孔30b与第一触控电极10(或第二触控电极20)电连接，可以降低因第一触控电极10(或第二触控电极20)在过孔30b处出现剥离(peeling)现象而造成的整体上断路 的风险。
例如，本发明实施例提供的触控结构可以采用导电桥式触控结构，也就是说，如图2至图3d所示，第一触控电极10和第二触控电极20中的一个可以包括至少一个导电桥和彼此间隔设置的多个子电极，相邻的子电极通过一个导电桥电连接，导电桥设置在第一触控电极与第二触控电极相交的位置处，而第一触控电极和第二触控电极中的另一个与子电极同层设置但与导电桥异层设置。例如，在图3a至图3d中，第一触控电极10包括至少一个导电桥12和彼此间隔设置的多个子电极11(图3a和图3b仅示出了一个导电桥12和两个子电极11)，相邻的子电极11通过导电桥12电连接在一起，即，每个子电极11通过绝缘层30中的过孔30a与导电桥12电连接在一起；第二触控电极20与子电极11同层设置，但与导电桥12异层设置。图3a至图3d仅以第一触控电极10包括子电极11和导电桥12为例进行说明，但本发明不限于该结构。
子电极11和导电桥12可以分别位于绝缘层30的任意两侧(即，面向衬底基板90的一侧和远离衬底基板90的一侧)。例如，如图3a和图3d所示，导电桥12设置于绝缘层30的第一部分31和衬底基板90之间，子电极11设置于绝缘层30的远离衬底基板90的一侧。或者，例如，如图3b和图3c所示，导电桥12设置于绝缘层30的远离衬底基板90的一侧，子电极11设置于绝缘层30和衬底基板90之间。
例如，如图2所示，本发明实施例提供的触控结构还可以包括第二信号传输结构42，第二信号传输结构42与第二触控电极20电连接，以实现第二触控电极与触控芯片之间的电连接。例如，第二信号传输结构42可以与41第一信号传输结构同层设置。
在触控结构采用导电桥式触控结构的情形中，例如，如图3a至图3d所示，由于第二触控电极20与第一触控电极10的子电极11同层设置，在第一信号传输结构41与第二信号传输结构42同层设置的情况下，第二触控电极20与第二信号传输结构42电连接的方式可以与第一触控电极10与第一信号传输结构41电连接的方式相同；同理，当第二触控电极20包括子电极时，第二触控电极20与第二信号传输结构42电连接的方式也可以和第一触控电极10与第一信号传输结构41电连接的方式相同。
当然，根据实际情况，第二信号传输结构42与第一信号传输结构41也可以不同层设置。例如，可以在形成第二触控电极20的同时形成与第二触控电极20电连接的第二信号传输结构，以实现第二触控电极20与触控芯片之间的电连接。本发明实施例包括、但不限于此。
在图3a和图3b所示情形中，绝缘层30的第二部分32与第一信号传输结构41直接接触。在图3c和图3d所示的情形中，绝缘层30的第二部分32可以不与第一信号传输结构41直接接触。
在第一触控电极10的与第一信号传输结构41电连接的部分设置于绝缘层30的靠近衬底基板90的一侧的情况下，例如，如图3c所示，可以使第一触控电极10的与第一信号传输结构41电连接的部分覆盖第一信号传输结构41。这样可以更充分地保护第一信号传输结构41，并且降低第一信号传输结构41因发生undercut(塌陷)现象而造成的不良影响。在这种情况下，例如，绝缘层30的第二部分32可以覆盖并且与第一触控电极10的该部分直接接触。
在第一触控电极10的与第一信号传输结构41电连接的部分设置于绝缘层30的远离衬底基板90的一侧的情况下，例如，如图3d所示，在导电桥12设置于绝缘层30的第一部分31和衬底基板90之间的情形下，在绝缘层30的第二部分32与衬底基板90之间可以设置有导电连接部70，导电连接部70覆盖且电连接第一信号传输结构41，即，导电连接部70设置于第一信号传输结构41的远离衬底基板90的一侧并且与第一信号传输结构41直接接触；并且，导电连接部70与第一触控电极10的导电桥12同层设置，也就是说，利用形成导电桥12的膜层形成导电连接部70。
图5a为本发明实施例中第一信号传输结构41被导电连接部70覆盖的俯视示意图；图5b为本发明实施例中第一信号传输结构41在与触控芯片电连接的位置处(即，Bonding位置处)的剖视示意图。如图5a和图5b所示，导电连接部70覆盖且电连接第一信号传输结构41，这样可以充分地保护第一信号传输结构41，并且可以尽量防止第一信号传输结构41因发生undercut(塌陷)现象造成的不良影响；并且，由于导电连接部70与导电桥12同层设置，因此，设置导电连接部70不会增加额外的制作工艺。当然，如图5b所示，在导电连接部70之上还可以设置有形成第一触控电极10的子电极11 和第二触控电极12的膜层的保留部分(图中未标出)。
由于导电桥12通常采用导电金属氧化物等材料制作并且导电连接部70与导电桥12同层设置，因此，导电连接部70的形成材料也可以包括导电金属氧化物，例如，ITO(氧化铟锡)、IGZO(氧化铟镓锌)、IZO(氧化铟锌)等材料中的至少一种。当导电桥12采用金属制作时，导电连接部70的材料也相应地改变。与采用金属材料相比，导电桥采用导电金属氧化物可以更好地保护第一信号传输结构41不被氧化，并且保证第一信号传输结构41通过导电连接部70与第一触控电极10电连接。
以上实施例以触控结构采用导电桥式触控结构为例进行说明。当然，本发明实施例提供的触控结构也可以采用本领域常用的非导电桥式触控结构，只要在第一触控电极10和第二触控电极20相交的位置处，绝缘层30设置于第一触控电极10和第二触控电极20之间并且将二者绝缘即可。
例如，如图6a至图6d所示，第一触控电极10和第二触控电极20中的一个可以设置于绝缘层30和衬底基板90之间，且另一个设置于绝缘层30的远离衬底基板90一侧。也就是说，第一触控电极10可以设置于绝缘层30的远离衬底基板90的一侧(如图6a和图6d所示)；或者，第一触控电极10可以设置于绝缘层30的靠近衬底基板90的一侧并且设置于第一信号传输结构41与衬底基板90之间(如图6b所示)；或者，第一触控电极10可以设置于绝缘层30的靠近衬底基板90的一侧并且设置于绝缘层30与第一信号传输结构41之间(如图6c所示)。
为了更充分地保护第一信号传输结构41，并且降低第一信号传输结构41因发生undercut(塌陷)现象而造成的不良影响，例如，可以通过以下方式对第一信号传输结构41进行进一步保护。
例如，如图6c所示，第一触控电极10设置于绝缘层30的第二部分32与第一信号传输结构41之间，并且第一触控电极10覆盖第一信号传输结构41，在这种情况下，绝缘层30的第二部分32覆盖第一触控电极10的该部分并且与第一触控电极10直接接触。
或者，例如，如图6d所示，当第一触控电极10设置于绝缘层30的远离衬底基板90一侧时，在绝缘层30的第二部分32与衬底基板90之间还可以设置有导电连接部70，导电连接部70覆盖且电连接第一信号传输结构41， 即，导电连接部70设置于第一信号传输结构41的远离衬底基板90的一侧并且与第一信号传输结构41直接接触；并且，导电连接部70与第二触控电极20同层设置。
在图6a至图6d所示的触控结构中，由于第一触控电极10和第二触控电极20位于绝缘层30的两侧，第一触控电极10和第二触控电极20的信号引出方式不同。例如，当第一触控电极10与第一信号传输结构41按照图6a或图6d所示的方式电连接时，第二触控电极10可以按照例如图6b或图6c所示的方式与第二信号传输结构(包括导线和接触垫中的至少一个)电连接，以实现与触控芯片电连接；或者，例如，当第一触控电极10与第一信号传输结构41按照图6b或图6c所示的方式电连接时，第二触控电极10可以按照例如图6a或图6d所示的方式与第二信号传输结构电连接；或者，例如，可以在形成第二触控电极20的同时形成与第二触控电极20电连接的第二信号传输结构。本发明实施例包括、但不限于此。
图6a至图6d所示触控结构中，各组成部分的设置可以参考图3a至图3d所示的桥点式触控结构中的相关描述，重复之处不再赘述。
本发明实施例提供的触控结构的俯视图可以与图1a所示的情形类似，因此本发明实施例不再单独提供相关附图。
本发明实施例提供的触控结构既可以应用于OGS触控屏中，也可以应用于MLOC(Multi-layer On Cell)触控屏中。在OGS触控屏中，如图3a至图3d和图6a至图6d所示，衬底基板90上在对应第一信号传输结构41的位置处还可以设置有黑矩阵层50；在MLOC触控屏中，衬底基板90上无需制作黑矩阵层。
本发明的至少一个实施例还提供了一种触控基板，其包括上述任一实施例提供的触控结构。
本发明的至少一个实施例还提供了一种显示装置，其包括上述触控基板。
例如，如图7a所示，该显示装置可以包括相对设置的阵列基板1和对置基板2(例如，彩膜基板)，对置基板2可以作为上述任一实施例提供的触控基板。
或者，如图7b所示，该显示装置可以包括相对设置的阵列基板1和对置基板2以及设置于对置基板的远离阵列基板一侧的保护基板5。对置基板2 可以作为上述任一实施例提供的触控基板，并且上述触控结构可以设置于对置基板2的远离阵列基板1的一侧；或者，保护基板5可以作为上述任一实施例提供的触控基板。
图7a和图7b中各标记与以上触控结构的实施例中的标记相同，此处不再赘述。
例如，该显示装置可以为：液晶面板、电子纸、OLED(Organic Light-Emitting Diode)面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本发明的至少一个实施例还提供了一种触控结构的制作方法，该方法包括：在衬底基板上形成彼此相交的第一触控电极和第二触控电极；在衬底基板上形成第一信号传输结构，第一信号传输结构与第一触控电极电连接；以及在形成第一信号传输结构之后，在衬底基板上形成绝缘薄膜并对其进行图案化处理，以形成包括第一部分和第二部分的绝缘层，第一部分形成于第一触控电极和第二触控电极相交的位置处且位于第一触控电极和第二触控电极之间以将二者绝缘，第二部分覆盖第一信号传输结构。
图案化处理包括通过利用掩膜板形成设定图案的工艺，例如包括涂光刻胶、曝光、显影、刻蚀等过程；但实施方式不限于此，构图工艺还可以是其他的能够形成设定图案的工艺。
本发明实施例提供的制作方法不限定第一触控电极、第二触控电极和绝缘层的形成顺序，只要可以实现第一触控电极和第二触控电极相交且通过该绝缘层绝缘即可。
例如，当第一触控电极的与第一信号传输结构电连接的部分设置于绝缘层的远离衬底基板的一侧时，在本发明实施例提供的制作方法中，可以对绝缘薄膜进行上述图案化处理，以形成绝缘层以及位于该绝缘层的第二部分中的至少一个过孔，第一信号传输结构通过至少一个过孔与第一触控电极电连接。
例如，上述形成第一信号传输结构的步骤还可以包括形成第二信号传输结构，第二信号传输结构与第二触控电极电连接。在这种情况下，第一信号传输结构与第二信号传输结构同层设置。
例如，对于图3d和图6d所示的触控结构，本发明的至少一个实施例提 供的制作方法可以包括以下步骤S11至步骤S14，下面结合图8a至图8e详细介绍这些步骤。
步骤S11：在衬底基板90上形成第一信号传输结构41，如图8a所示。例如，可以通过溅射镀膜、涂光刻胶、曝光、显影、刻蚀和剥离光刻胶等过程得到第一信号传输结构41。
步骤S12：在第一信号传输结构41上形成第一导电薄膜81，如图8a所示；图案化第一导电薄膜81，以形成覆盖且电连接第一信号传输结构41的导电连接部70，如图8b所示。
例如，第一导电薄膜可以采用导电金属氧化物形成。例如，可以通过溅射镀膜、涂光刻胶、曝光、显影、刻蚀和剥离光刻胶等过程得到导电连接部70。
在该步骤中，对于如图3d所示的触控结构，形成导电连接部70的同时还形成有导电桥12，如图8b所示；对于如图6d所示的触控结构，形成导电连接部70的同时还形成有第二触控电极。
步骤S13：在导电连接部70上形成绝缘薄膜30′，如图8c所示；之后，对绝缘薄膜30′进行图案化处理，以形成绝缘层30，如图8d所示。
在该步骤中，绝缘层30包括第一部分31和第二部分32，第二部分32中形成有暴露出导电连接部70的至少部分表面的至少一个过孔30b。对于如图3d所示的触控结构，绝缘层30中还形成有暴露出导电桥12的部分表面的多个过孔3a。
例如，绝缘层30可以通过包括涂胶、曝光和显影等过程的图案化化处理方式形成。
步骤S14：在绝缘层30上形成第二导电薄膜82，如图8e所示，并图案化第二导电薄膜82，以形成第一触控电极10的至少一部分，如图3d所示。
对于如图3d所示的触控结构，在该步骤中形成了第二触控电极20和第一触控电极10的子电极11，子电极11通过并且上述至少一个过孔30b与第一信号传输结构41电连接，并且相邻的两个子电极11通过绝缘层30中的过孔30a与导电桥12电连接，由此形成第一触控电极10；对于如图6d所示的触控结构，在该步骤中形成了第一触控电极。
例如，第二导电薄膜可以采用导电金属氧化物形成。例如，与步骤S12 类似，该步骤S14可以包括溅射镀膜、涂光刻胶、曝光、显影、刻蚀和剥离光刻胶等过程。
例如，对于图3c和图6c所示的触控结构，本发明的至少一个实施例提供的制作方法可以包括以下步骤S21至步骤S24，下面结合图9a至图9e详细介绍这些步骤。
步骤S21：在衬底基板90上形成第一信号传输结构41，如图9a所示。
步骤S22：在第一信号传输结构41上形成第一导电薄膜81，如图9a所示；图案化第一导电薄膜81，以形成第一触控电极10的至少一部分，如图9b所示。
对于如图3c所示的触控结构，在该步骤中形成了第二触控电极20和第一触控电极10的子电极11，子电极11覆盖且电连接第一信号传输结构41；对于如图6c所示的触控结构，在该步骤中形成了第一触控电极。
步骤S23：在第一触控电极10的上述至少一部分上形成绝缘薄膜30′，如图9c所示；之后，对绝缘薄膜30′进行图案化处理，以形成绝缘层30，如图9d所示。
在该步骤中，绝缘层30覆盖第一触控电极10的上述至少一部分；对于如图3c所示的触控结构，绝缘层30中形成有暴露出第一触控电极10的上述至少一部分的部分表面的多个过孔30a。
步骤S24：在绝缘层30上形成第二导电薄膜82，如图9e所示；之后，图案化第二导电薄膜82。
对于如图3c所示的情形，在该步骤中形成了导电桥12，导电桥12通过绝缘层30的过孔30a将两个相邻的子电极11电连接，以形成第一触控电极10；对于如图6c所示的情形，在该步骤中形成了第二触控电极。
在步骤S21至步骤S24中，各薄膜的图案化工艺可参考步骤S11至步骤S14中的描述，重复之处不再赘述。
例如，对于图3b和图6b所示的触控结构，本发明的至少一个实施例提供的制作方法可以包括以下步骤S31至步骤S34，下面结合图10a至图10f详细介绍这些步骤。
步骤S31：在衬底基板90上形成第一导电薄膜81，如图10a所示；之后，图案化第一导电薄膜81，以形成第一触控电极10的至少一部分，如图10b 所示。
对于如图3b所示的触控结构，在该步骤中形成了第二触控电极20和第一触控电极10的子电极11；对于如图6b所示的触控结构，在该步骤中形成了第一触控电极。
步骤S32：在第一触控电极10的至少一部分上形成第一信号传输结构41，如图10c所示。
步骤S33：在第一信号传输结构41上形成绝缘薄膜30′，如图10d所示；之后，对绝缘薄膜30′进行图案化处理，以形成绝缘层30，如图10e所示。
在该步骤中，绝缘层30覆盖第一触控电极10的上述至少一部分和第一信号传输结构41；对于如图3b所示的触控结构，绝缘层30中形成有暴露出第一触控电极10的上述至少一部分的部分表面的多个过孔30a。
步骤S34：在绝缘层30上形成第二导电薄膜82，如图10f所示；之后，图案化第二导电薄膜。
对于如图3b所示的情形，在该步骤中形成了导电桥12，导电桥12通过绝缘层30的过孔30a将两个相邻的子电极11电连接，以形成第一触控电极10；对于如图6b所示的情形，在该步骤中形成了第二触控电极。
在步骤S31至步骤S34中，各薄膜的制作工艺可参考步骤S11至步骤S14中的描述，重复之处不再赘述。
以上制作方法仅以图3b至图3d以及图6b至图6d为例进行说明，本发明实施例包括、但不限于此。例如，对于导电桥式触控结构，也可以是第一触控电极连续形成，第二触控电极包括导电桥和子电极，在这种情况下，与制作如图3b至图3d所示的触控结构的方法相比，对第一导电薄膜和第二导电薄膜进行图案化后得到的图案也相应地变化。
当然，本发明实施例提供的制作方法，可以用于制作OGS触控屏和MLOC触控屏。当用于制作OGS触控屏时，本发明实施例提供的制作方法还可以包括形成黑矩阵层的步骤，在这种情况下，本发明实施例提供的制作方法为5Mask工艺，相对于常用的6Mask工艺减少了一个Mask工艺。当用于制作覆盖表面式触控屏时，可以不包括形成黑矩阵层的步骤，在这种情况下，本发明实施例提供的制作方法为4Mask工艺。当然，本发明实施例包括、但不限于此。
综上所述，本发明实施例提供的触控结构及其制作方法、触控基板和显示装置具有如下优点：1、通过利用第一触控电极和第二触控电极之间的绝缘层覆盖第一信号传输结构，既可以有效保护第一信号传输结构(例如防止其氧化或刮伤)，又可以省去单独设置用于保护该第一信号传输结构的绝缘层的步骤，从而节省一张掩膜板；2、由于第一信号传输结构采用金属材料制作，第一、二触控电极采用金属氧化物材料制作，通过利用形成第一、二触控电极的材料外扩第一信号传输结构的方式，可以充分地保护第一信号传输结构，尽量避免第一信号传输结构因undercut(塌陷)现象而产生的信号传输不良；3、通过多个过孔实现第一信号传输结构与第一触控电极之间的电连接，与采用一个过孔的方式相比，可以防止第一触控电极在过孔处出现剥离而造成的整体断路。
本发明实施例的附图中，各层薄膜厚度和形状不反映真实比例，目的只是示意说明本发明实施例的内容。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年9月18日递交的中国专利申请第201510597119.6号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (20)

  1. 一种触控结构，包括：
    衬底基板；
    绝缘层，设置于所述衬底基板上；
    第一触控电极和第二触控电极，设置于所述衬底基板上且彼此相交，其中，所述绝缘层包括第一部分，所述第一部分设置于所述第一触控电极和所述第二触控电极相交的位置处且位于所述第一触控电极和所述第二触控电极之间以将二者绝缘；以及
    第一信号传输结构，设置于所述衬底基板上，并且与所述第一触控电极电连接，其中，所述绝缘层还包括与所述第一部分同层设置的第二部分，所述第二部分覆盖所述第一信号传输结构。
  2. 根据权利要求1所述的触控结构，其中，
    所述第一触控电极包括与所述第一信号传输结构电连接且设置于所述绝缘层的远离所述衬底基板的一侧的部分。
  3. 根据权利要求2所述的触控结构，其中，所述绝缘层的所述第二部分中设置有至少一个过孔，所述第一信号传输结构通过所述至少一个过孔与所述第一触控电极电连接。
  4. 根据权利要求1-3中任一项所述的触控结构，其中，
    所述第一触控电极和所述第二触控电极中的一个包括至少一个导电桥和彼此间隔设置的多个子电极，相邻的所述子电极通过一个所述导电桥电连接，所述导电桥设置于在所述第一触控电极与所述第二触控电极相交的位置处；
    所述第一触控电极和所述第二触控电极中的另一个与所述多个子电极同层设置，但与所述导电桥异层设置。
  5. 根据权利要求4所述的触控结构，其中，
    所述导电桥设置于所述绝缘层的所述第一部分和所述衬底基板之间，所述触控结构还包括导电连接部，所述导电连接部覆盖且电连接所述第一信号传输结构并且与所述导电桥同层设置。
  6. 根据权利要求1-3中任一项所述的触控结构，其中，
    所述第一触控电极设置于所述绝缘层的远离所述衬底基板的一侧，所述 第二触控电极设置于所述绝缘层与所述衬底基板之间；
    所述触控结构还包括导电连接部，所述导电连接部覆盖且电连接所述第一信号传输结构并且与所述第二触控电极同层设置。
  7. 根据权利要求5或6所述的触控结构，其中，所述导电连接部与所述第一信号传输结构直接接触。
  8. 根据权利要求1所述的触控结构，其中，
    所述第一触控电极的与所述第一信号传输结构电连接的部分设置于所述绝缘层与所述衬底基板之间并且覆盖所述第一信号传输结构。
  9. 根据权利要求1-4任一项所述的触控结构，其中，所述绝缘层的所述第二部分与所述第一信号传输结构直接接触。
  10. 根据权利要求1-9中任一项所述的触控结构，其中，所述第一信号传输结构的形成材料包括金属。
  11. 根据权利要求1-10中任一项所述的触控结构，还包括第二信号传输结构，所述第二信号传输结构与所述第二触控电极电连接并且与所述第一信号传输结构同层设置。
  12. 一种触控基板，包括根据权利要求1-11任一项所述的触控结构。
  13. 一种显示装置，包括根据权利要求12所述的触控基板。
  14. 根据权利要求13所述的显示装置，其中，
    所述显示装置包括相对设置的阵列基板和对置基板，所述对置基板作为所述触控基板，并且所述触控结构设置于所述对置基板的远离所述阵列基板的一侧；或者，
    所述显示装置包括相对设置的阵列基板和对置基板、以及设置于所述对置基板的远离所述阵列基板一侧的保护基板；所述对置基板作为所述触控基板，并且所述触控结构设置于所述对置基板的远离所述阵列基板的一侧，或者，所述保护基板作为所述触控基板。
  15. 一种触控结构的制作方法，包括：
    在衬底基板上形成彼此相交的第一触控电极和第二触控电极；
    在所述衬底基板上形成第一信号传输结构，所述第一信号传输结构与所述第一触控电极电连接；以及
    在形成所述第一信号传输结构之后，在所述衬底基板上形成绝缘薄膜并 对其进行图案化处理，以形成包括第一部分和第二部分的绝缘层，其中，所述第一部分形成于所述第一触控电极和所述第二触控电极相交的位置处且位于所述第一触控电极和所述第二触控电极之间以将二者绝缘，所述第二部分覆盖所述第一信号传输结构。
  16. 根据权利要求15所述的制作方法，其中，
    对所述绝缘薄膜进行所述图案化处理，以形成所述绝缘层以及位于所述绝缘层的所述第二部分中的至少一个过孔，所述第一信号传输结构通过所述至少一个过孔与所述第一触控电极电连接。
  17. 根据权利要求15或16所述的制作方法，其中，
    在所述衬底基板上形成所述第一信号传输结构；
    在所述第一信号传输结构上形成第一导电薄膜，并图案化所述第一导电薄膜，以形成覆盖且电连接所述第一信号传输结构的导电连接部；
    在所述导电连接部上形成所述绝缘层；
    在所述绝缘层上形成第二导电薄膜，并图案化所述第二导电薄膜，以形成所述第一触控电极的至少一部分；其中，所述第一触控电极和所述第二触控电极通过所述第一导电薄膜和所述第二导电薄膜形成。
  18. 根据权利要求15所述的制作方法，其中，
    在所述衬底基板上形成所述第一信号传输结构；
    在所述第一信号传输结构上形成第一导电薄膜，并图案化所述第一导电薄膜，以形成所述第一触控电极的至少一部分；
    在所述第一触控电极的所述至少一部分上形成所述绝缘层；
    在所述绝缘层上形成第二导电薄膜，并图案化所述第二导电薄膜；
    其中，所述第一触控电极和所述第二触控电极通过所述第一导电薄膜和所述第二导电薄膜形成。
  19. 根据权利要求15所述的制作方法，其中，
    在所述衬底基板上形成第一导电薄膜，并图案化所述第一导电薄膜，以形成所述第一触控电极的至少一部分；
    在所述第一触控电极的所述至少一部分上形成所述第一信号传输结构；
    在所述第一信号传输结构上形成所述绝缘层；
    在所述绝缘层上形成第二导电薄膜，并图案化所述第二导电薄膜；其中， 所述第一触控电极和所述第二触控电极通过所述第一导电薄膜和所述第二导电薄膜形成。
  20. 根据权利要求15-19中任一项所述的制作方法，其中，形成第一信号传输结构的步骤还包括形成第二信号传输结构，所述第二信号传输结构与所述第二触控电极电连接。
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