WO2017024429A1 - Smt工艺的充气led灯泡 - Google Patents
Smt工艺的充气led灯泡 Download PDFInfo
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- WO2017024429A1 WO2017024429A1 PCT/CN2015/086316 CN2015086316W WO2017024429A1 WO 2017024429 A1 WO2017024429 A1 WO 2017024429A1 CN 2015086316 W CN2015086316 W CN 2015086316W WO 2017024429 A1 WO2017024429 A1 WO 2017024429A1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/02—Fastening of light sources or lamp holders with provision for adjustment, e.g. for focusing
Definitions
- the invention relates to the technical field of luminaires, in particular to an inflatable LED bulb of an SMT process.
- a general LED bulb needs to be provided with a metal heat sink, and the LED is disposed on the metal heat sink to achieve efficient heat dissipation.
- the LED bulb is cumbersome and difficult to achieve full-angle illumination.
- the LED filament can be used instead of the structure of the LED disposed on the metal heat sink, so that the LED bulb is light and can emit light at a full light angle.
- the general LED filament is easily damaged, and it is impossible to achieve a large power, such as 8W or more. If the power of the LED filament is relatively high, the light decay is likely to occur.
- An inflatable LED bulb for the SMT process comprising:
- a lamp cap mounted on the bulb and located outside the cavity;
- a filament assembly comprising an SMD or CSP packaged LED and a bendable circuit board, the LED being mounted on the circuit board using an SMT process; the circuit board being elongated, the circuit board being fixed at both ends On the support; the number of the LEDs is plural, and a plurality of the LEDs are sequentially arranged on the circuit board.
- the above-mentioned SMT process of the inflated LED bulb, SMD or CSP package LED has high reliability and strong seismic resistance.
- Individually packaged LEDs are mounted on bendable boards using SMT technology for a more reliable structure that improves yield. Since the circuit board is long and bendable, it can be bent and shaped as needed, and is not easily damaged during the processing, which reduces the processing difficulty and improves the yield of the product.
- the LED is mounted on the surface of the circuit board using SMT technology, so that the filament assembly has good heat dissipation effect, can achieve greater power, and the filament assembly is not easily damaged and light decay.
- 1 is a front elevational view of an inflated LED bulb of an SMT process in an embodiment
- FIG. 2 is a top plan view of the inflated LED bulb of the SMT process shown in FIG. 1;
- Figure 3 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 1;
- FIG. 4 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 5 is a top plan view of the inflated LED bulb of the SMT process shown in Figure 4;
- Figure 6 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 4.
- FIG. 7 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 8 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 9 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 8.
- FIG. 10 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 11 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 10;
- FIG. 12 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 13 is a cross-sectional view of the inflated LED bulb of the SMT process shown in Figure 12;
- Figure 14 is a perspective view of an inflatable LED bulb of an SMT process in still another embodiment
- Figure 15 is a cross-sectional view of the inflated LED bulb of the SMT process of Figure 14.
- an inflatable LED bulb of the SMT process will be described more fully hereinafter with reference to the associated drawings.
- a preferred embodiment of an inflatable LED bulb of the SMT process is shown in the drawings.
- the inflatable LED bulb of the SMT process can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to make the disclosure of the inflated LED bulb of the SMT process more thorough and comprehensive.
- an inflatable LED bulb 100 of an SMT process of an embodiment includes a bulb 110, a base 120, a bracket 130, and a filament assembly 140.
- a cavity 112 is opened inside the bulb 110.
- the base 120 is located outside of the cavity 112 and the base 120 is mounted on the bulb 110.
- the bracket 130 is disposed within the cavity 112, and the bracket 130 is fixedly coupled to the bulb 110.
- Filament assembly 140 includes LEDs in SMD or CSP packages 142 and bendable circuit board 144, LED 142 is mounted on circuit board 144 using SMT technology.
- SMT is Surface Mount Abbreviation for Technology refers to surface mount technology.
- SMD is an abbreviation for Surface Mounted Devices, which refers to surface mount devices.
- CSP Chip Scale
- the abbreviation of Package refers to the chip scale package.
- the circuit board 144 is elongated, and both ends of the circuit board 144 are fixed to the bracket 130.
- the number of LEDs 142 is multiple, multiple LEDs 142 are sequentially arranged on the circuit board 144.
- LED 142 in SMD or CSP packages is highly reliable and shock resistant. Individually packaged LED 142 is mounted on the bendable circuit board 144 using SMT technology, and the structure is more reliable, which can improve the yield. Since the circuit board 144 is long and bendable, it can be bent and shaped as needed, and is not easily damaged during the processing, which reduces the processing difficulty and improves the yield of the product. In addition, by bending and shaping the wiring board 144, the LED light bulb 100 can be uniformly illuminated. led The 142 is mounted on the surface of the circuit board 144 by using the SMT technology, so that the filament assembly 140 has a good heat dissipation effect, and a large power can be realized, and the filament assembly 140 is not easily damaged and light decay.
- the bulb 110 may be filled with a heat conductive gas to better dissipate the filament assembly 140 to increase the service life of the LED bulb 100.
- the heat conductive gas may include hydrogen gas, helium gas, and helium gas, and the heat conductive gas may be a mixed gas of the above two or three, or may be a mixed gas of the above three mixed gases with other gases.
- the bracket 130 includes at least two fixing plates 132, one end of the filament assembly 140 is fixedly coupled to one of the fixing plates 132, and the other end of the filament assembly 140 is fixedly coupled to the other fixing plate 132.
- the fixing plate 132 can be provided with a plurality of connecting holes 134, and the end of the filament assembly 140 is fixedly connected to the fixing plate 132 through the connecting hole 134.
- the above connection method can improve the shock resistance of the filament assembly 140 of the LED bulb 100 to extend the life of the bulb.
- the connection of the filament assembly 140 to the fixing plate 160 may also be other connections such as bonding, screwing, and the like.
- the LED is not only mounted on the circuit board 144, but also see Figure 2, Figure 3, LED The 146 can be attached to the fixed plate 160 as needed.
- the width of the circuit board 144 is 1 to 1.2 times the width of the LED 142, that is, the width of the circuit board 144 and the LED.
- the width of the 142 is equal, or the width of the circuit board 144 is slightly larger than the width of the LED 142, which saves the material of the circuit board 144 and reduces the manufacturing cost of the LED light bulb 100.
- a plurality of LEDs The 142 are arranged closely or spaced apart on the wiring board 144.
- the plurality of LEDs 142 are closely arranged on the circuit board 144, which can save the space occupied by the LED 142 of the circuit board 144 and improve the luminous efficiency.
- the inflatable LED bulb 100 of the SMT process further includes a power source 150.
- the power source 150 is located in the lamp cap 120.
- the power source 150 is electrically connected to the plurality of circuit boards 144, and the power source 150 is electrically connected to the external power source.
- the outer wall of the cap 120 may be threaded, and the connector connecting the LED bulb 100 is provided with a threaded interface, and the cap 120 is connected to the connector through a threaded interface.
- the number of the circuit boards 144 is plural, and the plurality of circuit boards 144 are each bent into a U shape, and the plurality of circuit boards 144 cross each other and the plurality of circuit boards 144 are crossed. There is a gap between them. There is a gap between the plurality of circuit boards 144 to facilitate heat dissipation. And the plurality of circuit boards 144 cross each other to enable the LEDs The 142 is evenly distributed, thereby making the light uniform.
- the circuit board 144 is a structure that can be shaped after being bent. The two ends of the U-shaped circuit board 144 are fixed on the bracket 130. The structure of the bracket 130 is simple and convenient for processing.
- the bracket 130 may also be cylindrical, and the filament assembly 140 is spirally wound around the bracket 130 (not shown). Adjusting the filament assembly 140 in a spiral shape on the bracket 130 saves space occupied by the filament assembly 140, and can make the light distribution of the LED bulb 100 more uniform.
- connection manner between the lamp cap 120 and the connector connecting the LED bulb 100 is not limited to being connected through a screw interface, and may also be connected through a snap interface or other type of standard interface, for example, as shown in FIG.
- Two bayonet pins 122 are disposed on the outer wall of the 120, and the bayonet pins 122 are used for connecting with the bayonet of the connector.
- the bulbs 110 may be provided in any shape. Referring to FIGS. 8 to 15, the caps 120 are identical in shape and size, and are all of a standard shape and size, and the bulbs 110 can be flexibly set as needed. In the embodiment shown in FIG. 8 and FIG. 9 , the bulb 110 can be substantially spherical in a large volume. In the embodiment shown in FIG. 10 and FIG. 11 , the bulb 110 can be substantially spherical in size, and the filament assembly can be arranged. 140 can be adjusted in shape and size as needed. In the embodiment shown in FIG. 12 and FIG. 13 , the bulb 110 may have a larger volume of a candle. In the embodiment shown in FIGS. 14 and 15 , the bulb 110 may have a smaller candle shape, and the filament assembly. 140 can be adjusted in shape and size as needed.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
一种SMT工艺的充气LED灯泡(100),包括泡壳(110)、灯头(120)、支架(130)和灯丝组件(140)。泡壳(110)内部开设有腔体(112)。灯头(120)安装在泡壳(110)上并位于腔体(112)之外。支架(130)固定设置在腔体(112)内。灯丝组件(140)包括SMD或CSP封装的LED(142)和可弯折的线路板(144),LED(142)使用SMT技术贴装在线路板(144)上。线路板(144)呈长条状,线路板(144)的两端固定在支架(130)上。LED(142)的数量为多个,多个LED(142)在线路板(144)上顺序排列。
Description
【技术领域】
本发明涉及灯具的技术领域,特别是涉及一种SMT工艺的充气LED灯泡。
【背景技术】
一般的LED灯泡需要设置有金属散热件,LED设置在金属散热件上实现高效散热,然而这种LED灯泡较为笨重,很难做到全光角发光。为了克服上述问题,可以用LED灯丝代替LED设置在金属散热件上的结构,使LED灯泡轻巧,且能够全光角发光。
然而一般的LED灯丝容易损坏,而且无法实现较大功率,如8W以上,若功率较大LED灯丝的温度会比较高,很容易出现光衰。
【发明内容】
基于此,有必要针对LED灯丝容易损坏和光衰的问题,提供一种SMT工艺的充气LED灯泡。
一种SMT工艺的充气LED灯泡,包括:
泡壳,内部开设有腔体;
灯头,安装在所述泡壳上并位于所述腔体之外;
支架,固定设置在所述腔体内;及
灯丝组件,包括SMD或CSP封装的LED和可弯折的线路板,所述LED使用SMT工艺贴装在所述线路板上;所述线路板呈长条状,所述线路板的两端固定在所述支架上;所述LED的数量为多个,多个所述LED在所述线路板上顺序排列。
上述SMT工艺的充气LED灯泡,SMD或CSP封装的LED可靠性高、抗震能力强。单独封装的LED使用SMT技术贴装在可弯折的线路板上,结构更加可靠,可以提高良品率。由于线路板呈长条状且可弯折,因此可根据需要进行弯曲整形,加工过程中不容易损坏,降低了加工难度,提高产品的合格率。LED使用SMT技术贴装在线路板的表面,使得灯丝组件散热效果佳,可以实现较大功率,灯丝组件不容易损坏和光衰。
【附图说明】
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他实施例的附图。
图1为一实施例中SMT工艺的充气LED灯泡的主视图;
图2为图1所示SMT工艺的充气LED灯泡的俯视图;
图3为图1所示SMT工艺的充气LED灯泡的剖面图;
图4为又一实施例中SMT工艺的充气LED灯泡的立体图;
图5为图4所示SMT工艺的充气LED灯泡的俯视图;
图6为图4所示SMT工艺的充气LED灯泡的剖面图;
图7为又一实施例中SMT工艺的充气LED灯泡的立体图;
图8为又一实施例中SMT工艺的充气LED灯泡的立体图;
图9为图8所示SMT工艺的充气LED灯泡的剖面图;
图10为又一实施例中SMT工艺的充气LED灯泡的立体图;
图11为图10所示SMT工艺的充气LED灯泡的剖面图;
图12为又一实施例中SMT工艺的充气LED灯泡的立体图;
图13为图12所示SMT工艺的充气LED灯泡的剖面图;
图14为又一实施例中SMT工艺的充气LED灯泡的立体图;
图15为图14所示SMT工艺的充气LED灯泡的剖面图。
【具体实施方式】
为了便于理解本发明,下面将参照相关附图对SMT工艺的充气LED灯泡进行更全面的描述。附图中给出了SMT工艺的充气LED灯泡的首选实施例。但是,SMT工艺的充气LED灯泡可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对SMT工艺的充气LED灯泡的公开内容更加透彻全面。
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1和图2所示,一实施方式的SMT工艺的充气LED灯泡100包括泡壳110、灯头120、支架130和灯丝组件140。泡壳110内部开设有腔体112。灯头120位于腔体112外,且灯头120安装在泡壳110上。支架130设置在腔体112内,支架130与泡壳110固定连接。灯丝组件140包括SMD或CSP封装的LED
142和可弯折的线路板144,LED 142使用SMT技术贴装在线路板144上。其中SMT为Surface Mount
Technology的缩写,是指表面贴装技术。SMD为Surface Mounted Devices的缩写,是指表面贴装器件。CSP为Chip Scale
Package的缩写,是指芯片级封装。线路板144呈长条状,线路板144的两端固定在支架130上。LED 142的数量为多个,多个LED
142在线路板144上顺序排列。
SMD或CSP封装的LED 142可靠性高、抗震能力强。单独封装的LED
142使用SMT技术贴装在可弯折的线路板144上,结构更加可靠,可以提高良品率。由于线路板144呈长条状且可弯折,因此可根据需要进行弯曲整形,加工过程中不容易损坏,降低了加工难度,提高产品的合格率。另外,通过将线路板144弯曲整形,可实现LED灯泡100均匀发光的效果。LED
142使用SMT技术贴装在线路板144的表面,使得灯丝组件140散热效果佳,可以实现较大功率,灯丝组件140不容易损坏和光衰。
在一实施例中,泡壳110内可以填充导热气体,可更好地对灯丝组件140进行散热,以提高LED灯泡100的使用寿命。导热气体可以包括氢气、氦气和氖气,导热气体可以是以上两者或三者的混合气体,也可以是以上三种混合气体同其他气体的混合气体。
在其中一个实施例中,支架130包括至少两个固定板132,灯丝组件140的一端与其中一个固定板132固定连接,灯丝组件140的另一端与另一个固定板132固定连接。在一实施例中,固定板132可以开设有多个连接孔134,灯丝组件140的端部通过连接孔134与固定板132固定连接。上述连接方式可以提高LED灯泡100的灯丝组件140的抗震能力,以延长灯泡的使用寿命。在其他实施例中,灯丝组件140与固定板160的连接方式还可以是粘结、螺钉连接等其他连接方式。LED不仅仅是贴装在线路板144上,再参见图2、图3,LED
146可根据需要贴装在固定板160上。
在其中一个实施例中,线路板144的宽度为LED 142的宽度的1~1.2倍,即线路板144的宽度与LED
142的宽度相等,或线路板144的宽度略大于LED 142的宽度,节省了线路板144的材料,降低LED灯泡100的制作成本。在一实施例中,多个LED
142在线路板144上紧密或间隔排列。其中,多个LED142在线路板144上紧密排列,可节省LED 142占用线路板144的空间,提高发光效率。
同时参见图3,在其中一个实施例中,SMT工艺的充气LED灯泡100还包括电源150,电源150位于灯头120内,电源150与多个线路板144电连接,电源150与外界电源电连接。在一实施例中,灯头120的外壁可以开设有螺纹,与连接LED灯泡100的连接座设置有螺纹接口,灯头120通过螺纹接口与连接座连接。
如图4至图6所示,在又一实施例中,线路板144的数量为多个,多个线路板144均弯折为U型,多个线路板144相互交叉且多个线路板144之间具有间隙。多个线路板144之间具有间隙,利于散热。且多个线路板144相互交叉,可以使LED
142分布均匀,进而使得发光均匀。线路板144为弯折后可定型的结构,U型的线路板144的两端固定在支架130上,支架130的结构简单,方便加工。
在另一实施例中,支架130也可以呈柱状,灯丝组件140呈螺旋状环绕在支架130上(图中未示出)。将灯丝组件140调整成螺旋状布置在支架130上,节省灯丝组件140的占用空间,可以使LED灯泡100的光分布更加均匀。
需要说明的是,灯头120与连接LED灯泡100的连接座的连接方式不限于通过螺纹接口连接,也可以通过卡合接口或其他类型的标准接口连接,例如,如图7所示,可在灯头120的外壁上设置两个卡销122,卡销122用于与连接座的卡口连接。
泡壳110可以设置成任意形状,参见图8至图15,灯头120的形状和尺寸相同,均为标准形状和尺寸,泡壳110可以根据需要灵活设置。图8、图9所示的实施例中,泡壳110可以大致呈体积较大的球状,图10、图11所示的实施例中,泡壳110可以大致呈体积较小的球状,灯丝组件140可以根据需要调整形状和大小。图12、图13所示的实施例中,泡壳110可以呈体积较大的烛形,图14、图15所示的实施例中,泡壳110可以呈体积较小的烛形,灯丝组件140可以根据需要调整形状和大小。
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。
Claims (9)
- 一种SMT工艺的充气LED灯泡,包括:泡壳,内部开设有腔体;灯头,安装在所述泡壳上并位于所述腔体之外;支架,固定设置在所述腔体内;及灯丝组件,包括SMD或CSP封装的LED和可弯折的线路板,所述LED使用SMT工艺贴装在所述线路板上;所述线路板呈长条状,所述线路板的两端固定在所述支架上;所述LED的数量为多个,多个所述LED在所述线路板上顺序排列。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,所述泡壳内填充有导热气体。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,所述支架包括至少两个固定板,所述灯丝组件的一端与其中一个固定板固定连接,所述灯丝组件的另一端与另一个固定板固定连接。
- 根据权利要求3所述的SMT工艺的充气LED灯泡,其特征在于,所述固定板开设有多个连接孔,所述灯丝组件的端部通过所述连接孔与所述固定板固定连接。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,所述线路板的数量为多个,多个所述线路板均弯折为U型,多个所述线路板相互交叉且多个所述线路板之间具有间隙。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,所述支架呈柱状,所述灯丝组件呈螺旋状环绕在所述支架上。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,所述线路板的宽度为所述LED的宽度的1~1.2倍。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,多个所述LED在所述线路板上紧密或间隔排列。
- 根据权利要求1所述的SMT工艺的充气LED灯泡,其特征在于,还包括电源,所述电源位于所述灯头内,所述电源与所述线路板电连接。
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