WO2017020390A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
WO2017020390A1
WO2017020390A1 PCT/CN2015/088810 CN2015088810W WO2017020390A1 WO 2017020390 A1 WO2017020390 A1 WO 2017020390A1 CN 2015088810 W CN2015088810 W CN 2015088810W WO 2017020390 A1 WO2017020390 A1 WO 2017020390A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
dissipating device
mounting hole
superconducting
Prior art date
Application number
PCT/CN2015/088810
Other languages
French (fr)
Chinese (zh)
Inventor
林琼榕
Original Assignee
特能传热科技（中山）有限公司
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Publication of WO2017020390A1 publication Critical patent/WO2017020390A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section

Definitions

  • the invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of an LED lamp.
  • LED lamps are favored by people because of their low energy consumption and long service life.
  • LED lamps generate a large amount of heat during use, and must be dissipated in time to effectively ensure the use of LED lamps. Lifetime, otherwise it will lead to a significant reduction in the life of the LED lamp.
  • an object of the present invention is to provide a heat sink having a simple structure and a good heat dissipation effect.
  • a heat dissipating device includes a heat conducting plate for mounting a heat source, wherein the heat conducting plate is provided with a plurality of superconducting heat pipes, each of which has a heat sink disposed thereon, the heat sink comprising a longitudinal length greater than A laterally wide fin body is provided at a central portion of the fin body with a mounting hole extending in a longitudinal direction thereof, and the superconducting heat pipe is inserted into the mounting hole.
  • the superconducting heat pipe has a substantially U-shape, and one end of the superconducting heat pipe passes through the side wall of the heat conducting plate and extends into the inner portion of the heat conducting plate.
  • the superconducting heat pipe has a substantially "L" shape, and one end of the superheat pipe passes through the side wall of the heat conducting plate and extends into the inner wall of the heat conducting plate.
  • the heat sink is integrally formed by extruding aluminum, and the mounting hole is a circumferentially closed through hole.
  • the heat sink is formed by stamping and bending a piece, and the mounting hole is a circumferentially notched through hole.
  • thermal conductive cement is disposed between the superconducting heat pipe and the mounting hole.
  • a thermally conductive solder is disposed between the superconducting heat pipe and the mounting hole.
  • the heat conducting plate is provided with at least one fixing frame for locking the spacing between two adjacent fins
  • the fixing frame is provided with a plurality of fixing holes respectively corresponding to the plurality of fins.
  • a positioning piece that can be inserted into the fixing hole is disposed at an outer peripheral edge of the fin body of each fin corresponding to the fixing hole.
  • the positioning piece is inserted into and passed through the fixing hole and bent to form a bent portion that can be engaged with the fixing hole.
  • the invention has the beneficial effects that since the heat source installed on the heat conducting plate works heat by using a heat conducting plate as a carrier for mounting the heat source, the heat conducting plate can quickly transfer heat to the heat sink through the super heat pipe, and
  • the invention adopts a heat sink having a longitudinal length greater than a lateral width thereof, and a central portion of the heat sink is provided with a mounting hole extending along a longitudinal direction thereof, and the super heat pipe is inserted into the mounting hole, so heat is taken from one end of the super heat pipe.
  • the heat is also transferred from the middle of the heat sink to the outer edges of the heat sink and transmitted to the respective positions of the heat sink, so that the heat can be quickly radiated out through the entire surface of the heat sink, greatly improving
  • the heat dissipation capability of the heat dissipating device of the present invention can well meet the heat dissipation requirements of the heat dissipating device.
  • the present invention provides a fixing frame for locking the spacing between two adjacent fins on the heat conducting plate. , can prevent adjacent two heat sinks from approaching or close to each other, ensuring that there are two adjacent heat sinks between Sufficient clearance to remove heat from the upper surface of the fin in the air, and thus can ensure the cooling effect of the cooling device of the present invention.
  • FIG. 1 is a schematic view showing the appearance of a first preferred embodiment of the present invention
  • Figure 2 is a schematic view showing the appearance of another angle of the first preferred embodiment of the present invention.
  • FIG. 3 is a schematic view showing the assembly of a heat sink and a superconducting heat pipe in a first preferred embodiment of the present invention
  • FIG. 4 is a schematic exploded view showing the structure of a heat sink and a superconducting heat pipe according to a first preferred embodiment of the present invention
  • Figure 5 is a partial view of a heat sink used in the first preferred embodiment of the present invention.
  • Figure 6 is a schematic view showing the appearance of a second preferred embodiment of the present invention.
  • Figure 7 is a partial view of a heat sink used in a second preferred embodiment of the present invention.
  • Figure 8 is a schematic view showing the appearance of a third preferred embodiment of the present invention.
  • Figure 9 is a perspective view showing the appearance of another angle of the third preferred embodiment of the present invention.
  • Figure 10 is a partial view of a superconducting heat pipe used in a third preferred embodiment of the present invention.
  • Figure 11 is a schematic view showing the appearance of a fourth preferred embodiment of the present invention.
  • Figure 12 is a schematic structural view showing a mounting frame in a fifth preferred embodiment of the present invention.
  • Figure 13 is a structural schematic view showing another angle at which the fixing frame is mounted in the fifth preferred embodiment of the present invention.
  • Figure 14 is a view showing the parts of the fixing frame in the fifth preferred embodiment of the present invention.
  • Figure 15 is a view showing the parts of a heat sink in a fifth preferred embodiment of the present invention.
  • Figure 16 is an enlarged schematic view of a portion A in Figure 13;
  • Figure 17 is an enlarged schematic view of the portion B in Figure 14.
  • a first preferred embodiment of the heat sink of the present invention comprising a heat conducting disk 10 for mounting a heat source.
  • the heat conducting disk 10 is preferentially processed into a disk shape, and the heat conducting disk 10 is provided with a plurality of
  • the superconducting heat pipe 20 has a substantially U-shape, and one end of the superheat pipe 20 passes through the side wall of the heat conducting plate 10 and extends into the interior of the heat conducting plate 10.
  • Each of the superconducting heat pipes 20 is provided with a heat sink 30.
  • the heat sink 30 includes a heat sink body 300 having a longitudinal length greater than a lateral width thereof, and a central portion of the heat sink body 300 is disposed along a longitudinal direction thereof.
  • the mounting hole 301 is inserted into the mounting hole 301.
  • the heat sink 30 is preferably made of aluminum material; further, in order to make the super
  • the heat pipe 20 can better transfer heat to the heat sink 30.
  • the super heat pipe 20 and the mounting hole 301 have an interference fit, since the super heat pipe 20 and the mounting hole 301 are Surplus fit, so super heat pipe 2 0 is in direct contact with the mounting hole 301, so heat can be directly transmitted to the heat sink 30 without passing through air to accelerate the heat transfer speed; of course, between the super heat pipe 20 and the mounting hole 301
  • a thermal conductive cement may be provided to transfer heat from the superconducting heat pipe 20 to the heat sink 30 through the thermal conductive cement.
  • the heat transfer between the superconducting heat pipe 20 and the mounting hole 301 can also be performed by providing heat-conductive solder, and the same can be achieved for rapid heat transfer.
  • the present invention uses a heat conducting plate 10 as a carrier for mounting a heat source, when the heat source mounted on the heat conducting disk 10 is heated, the heat conducting disk 10 can quickly transfer heat to the heat sink 30 through the super heat conducting tube 20, and
  • the invention adopts a heat sink 30 whose longitudinal length is greater than its lateral width, and a central portion of the heat sink 30 is provided with a mounting hole 301 extending in a longitudinal direction thereof, and the super heat pipe 20 is inserted into the mounting hole 301, so the heat is super During the transfer of one end of the heat pipe 20 to the other end thereof, heat is also rapidly transferred from the central portion of the heat sink 30 to the outer edges of both sides thereof and transmitted to the respective positions of the heat sink 30, so that heat can quickly pass through the entire heat sink 30.
  • the surface is emitted outward, which greatly improves the heat dissipation capability of the heat sink of the present invention, and thus can well meet the heat dissipation requirements of the heat sink.
  • the heat sink 30 is integrally formed by extruding aluminum, and the mounting hole 301 is a circumferentially closed through hole.
  • the sheet is a metal sheet, and more preferably, the sheet is an aluminum sheet. Of course, the sheet is a copper sheet or other metal sheet.
  • a third preferred embodiment of the heat dissipating device of the present invention is different from the first preferred embodiment in that the superconducting heat pipe 20 has a substantially "L" shape and a superconducting heat pipe. One end of the 20 passes through the side wall of the thermal pad 10 and extends into the inner wall of the thermal pad 10.
  • a fourth preferred embodiment of the heat sink of the present invention is different from the third preferred embodiment in that the heat sink 30 is formed by stamping and bending a piece, and the mounting hole 301 is a A notched through hole in the circumference.
  • a fifth preferred embodiment of the heat sink of the present invention is different from the fourth preferred embodiment in that at least one of the two adjacent heat shields 10 is provided for locking adjacent ones
  • the heat conducting plate 10 is provided with two fixing frames 40, and one of the fixing frames 40 is fixed to the heat conducting plate by a plurality of fixed mounting rods 50.
  • the fixing frame 40 is connected to the other fixing frame 40 through a plurality of fixing links 42.
  • the two fixing frames 40 are respectively disposed on two sides of the heat sink 30, and the fixing frame 40 is disposed on the fixing frame 40.
  • a plurality of fixing holes 41 respectively corresponding to the plurality of fins 30 are provided, and the outer peripheral edge of the fin body 300 of each fin 30 is provided with a positioning piece that can be inserted into the fixing hole 41 at a position corresponding to the fixing hole 41. 31.
  • the present invention can prevent the adjacent two heat sinks 30 from approaching or adhering to each other by providing the fixing frame 40 for locking the spacing between the adjacent two heat sinks 30 on the heat conducting plate 10, thereby ensuring the adjacent two. There is a sufficient gap between the block fins 30 to facilitate the removal of heat from the surface of the fins 30, thereby ensuring the heat dissipation effect of the heat sink of the present invention.
  • the positioning piece 31 is inserted and passed through the fixing hole 41, and then bent to form a bend which can be engaged with the fixing hole 41. Part 32.
  • the positioning piece 31 can be prevented from coming out of the fixing hole 41, so that the relative positions of the heat sink 30 and the fixing frame 40 are not changed, thereby ensuring the adjacent two pieces.
  • the spacing between the fins 30 is fixed to facilitate heat dissipation, and the heat dissipation effect of the heat sink of the present invention is ensured.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Disclosed is a heat dissipation device. The heat dissipation device comprises a heat conducting disc (10) used for mounting a heat source. Several superconductive tubes (20) are disposed on the heat conducting disc (10), and a heat dissipation fin (30) is disposed on each superconductive tube (20). Each heat dissipation fin (30) comprises a heat dissipation fin body (300) whose longitudinal length is longer than the transverse width, an mounting hole (301) extending in the longitudinal direction of the heat dissipation fin body (300) is formed in the middle of the heat dissipation fin body (300), and the superconductive tube (20) is mounted in the mounting hole (301) in a penetrating mode. Therefore, in the process in which heat is transmitted from one end of the superconductive tube (20) to the other end of the superconductive tube (20), the heat is also quickly transmitted from the middle of the heat dissipation fin (30) to the edges of the two sides of the heat dissipation fin (30) and to every position of the heat dissipation fin (30). Therefore, the heat can be quickly dissipated outwards through the whole surface of each heat dissipation fin (30), and the heat dissipation capability of the heat dissipation device is improved greatly. In this way, the heat dissipation requirement of people for the heat dissipation device can be well met.

Description

一种散热装置  Heat sink
技术领域Technical field
本发明涉及一种散热装置，特别是一种用于LED灯散热的散热装置。The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of an LED lamp.
背景技术Background technique
众所周知，LED灯由于其能耗低，使用寿命长而受到人们的青睐，但是LED灯在使用过程中会产生大量的热量，必须将该些热量及时地散发出去，才能有效地保证LED灯的使用寿命，否则会导致LED灯的使用寿命大大地减少。As is known to all, LED lamps are favored by people because of their low energy consumption and long service life. However, LED lamps generate a large amount of heat during use, and must be dissipated in time to effectively ensure the use of LED lamps. Lifetime, otherwise it will lead to a significant reduction in the life of the LED lamp.
现有大功率的LED灯绝大部分都配备有散热装置，该些散热装置虽然能够将该些LED灯工作时产生的一部分热量及时散发出去，但是散热效果依然不够理想，不能及时地将该些LED灯工作时产生的热量全部散发出去，因此该些散热装置的散热效果依然未能满足人们的需求。Most of the existing high-power LED lamps are equipped with heat-dissipating devices. Although these heat-dissipating devices can dissipate some of the heat generated by the LED lamps in time, the heat-dissipating effect is still not ideal, and the heat-dissipating effects cannot be timely. The heat generated by the operation of the LED lamp is completely dissipated, so the heat dissipation effect of the heat sinks still fails to meet the needs of people.
发明内容Summary of the invention
为了解决上述问题，本发明的目的在于提供一种结构简单，同时散热效果好的散热装置。In order to solve the above problems, an object of the present invention is to provide a heat sink having a simple structure and a good heat dissipation effect.
本发明为解决其技术问题而采用的技术方案是：The technical solution adopted by the present invention to solve the technical problem thereof is:
一种散热装置，包括一用于安装热源的导热盘，所述导热盘上设置有若干根超导热管，每根超导热管上均设置有一散热片，所述散热片包括一纵向长度大于其横向宽度的散热片主体，该散热片主体的中部处设置有一沿其纵向方向延伸的安装孔，所述超导热管穿装于所述安装孔中。A heat dissipating device includes a heat conducting plate for mounting a heat source, wherein the heat conducting plate is provided with a plurality of superconducting heat pipes, each of which has a heat sink disposed thereon, the heat sink comprising a longitudinal length greater than A laterally wide fin body is provided at a central portion of the fin body with a mounting hole extending in a longitudinal direction thereof, and the superconducting heat pipe is inserted into the mounting hole.
作为上述技术方案的改进，所述超导热管的外形大致呈“一”字形，超导热管的一端穿过所述导热盘的侧壁并延伸进导热盘的内部。As an improvement of the above technical solution, the superconducting heat pipe has a substantially U-shape, and one end of the superconducting heat pipe passes through the side wall of the heat conducting plate and extends into the inner portion of the heat conducting plate.
作为上述技术方案的进一步改进，所述超导热管的外形大致呈“L”形，超导热管的一端穿过所述导热盘的侧壁并延伸进导热盘的内壁。As a further improvement of the above technical solution, the superconducting heat pipe has a substantially "L" shape, and one end of the superheat pipe passes through the side wall of the heat conducting plate and extends into the inner wall of the heat conducting plate.
在本发明中，所述散热片通过挤压铝一体成型，所述安装孔为一圆周完整闭合的通孔。In the present invention, the heat sink is integrally formed by extruding aluminum, and the mounting hole is a circumferentially closed through hole.
优选地，所述散热片由一片体经冲压弯折成型，所述安装孔为一圆周带缺口的通孔。Preferably, the heat sink is formed by stamping and bending a piece, and the mounting hole is a circumferentially notched through hole.
进一步，所述超导热管与所述安装孔之间为过盈配合。Further, an interference fit is formed between the superconducting heat pipe and the mounting hole.
再进一步，所述超导热管与所述安装孔之间设置有导热胶泥。Further, a thermal conductive cement is disposed between the superconducting heat pipe and the mounting hole.
在本发明中，所述超导热管与所述安装孔之间设置有导热的焊锡。In the present invention, a thermally conductive solder is disposed between the superconducting heat pipe and the mounting hole.
进一步，所述导热盘上至少设置有一个用于锁定相邻的两块散热片之间的间距的固定架，所述固定架上开设有若干个分别与若干块散热片相对应的固定孔，每块散热片的散热片主体外周缘对应所述固定孔的位置上设置有能够***该固定孔的定位片。Further, the heat conducting plate is provided with at least one fixing frame for locking the spacing between two adjacent fins, and the fixing frame is provided with a plurality of fixing holes respectively corresponding to the plurality of fins. A positioning piece that can be inserted into the fixing hole is disposed at an outer peripheral edge of the fin body of each fin corresponding to the fixing hole.
再进一步，所述定位片***并穿过所述固定孔后弯折形成一能够与所述固定孔相卡接的弯折部。Further, the positioning piece is inserted into and passed through the fixing hole and bent to form a bent portion that can be engaged with the fixing hole.
本发明的有益效果是：由于本发明通过采用一导热盘作为安装热源的载体，安装于导热盘上的热源工作发热时，导热盘通过超导热管可以快速地将热量传递至散热片上，同时由于本发明采用纵向长度大于其横向宽度的散热片，而且散热片的中部处设置有沿其纵向方向延伸的安装孔，超导热管穿装于所述安装孔中，因此热量从超导热管的一端传递其另一端的过程中，热量也同时从散热片的中部迅速地向其两边外缘传递并传递至散热片的各个位置，因此热量可以迅速地通过散热片的整个表面往外散发，大大地提升了本发明的散热装置的散热能力，因此可以很好地满足人们对散热装置的散热要求；另外本发明通过在导热盘上设置有用于锁定相邻的两块散热片之间的间距的固定架，可以防止相邻的两块散热片相互靠近或紧贴，保证相邻的两块散热片之间具有足够的间隙以便于空气从散热片的表面上带走热量，进而可以保证本发明的散热装置的散热效果。The invention has the beneficial effects that since the heat source installed on the heat conducting plate works heat by using a heat conducting plate as a carrier for mounting the heat source, the heat conducting plate can quickly transfer heat to the heat sink through the super heat pipe, and The invention adopts a heat sink having a longitudinal length greater than a lateral width thereof, and a central portion of the heat sink is provided with a mounting hole extending along a longitudinal direction thereof, and the super heat pipe is inserted into the mounting hole, so heat is taken from one end of the super heat pipe. In the process of transferring the other end, the heat is also transferred from the middle of the heat sink to the outer edges of the heat sink and transmitted to the respective positions of the heat sink, so that the heat can be quickly radiated out through the entire surface of the heat sink, greatly improving The heat dissipation capability of the heat dissipating device of the present invention can well meet the heat dissipation requirements of the heat dissipating device. In addition, the present invention provides a fixing frame for locking the spacing between two adjacent fins on the heat conducting plate. , can prevent adjacent two heat sinks from approaching or close to each other, ensuring that there are two adjacent heat sinks between Sufficient clearance to remove heat from the upper surface of the fin in the air, and thus can ensure the cooling effect of the cooling device of the present invention.
附图说明DRAWINGS
下面结合附图和具体实施方式对本发明作进一步详细的说明。The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
图1是本发明第一优选实施例的外观结构示意图；1 is a schematic view showing the appearance of a first preferred embodiment of the present invention;
图2是本发明第一优选实施例的另一个角度的外观结构示意图；Figure 2 is a schematic view showing the appearance of another angle of the first preferred embodiment of the present invention;
图3是本发明第一优选实施例中散热片与超导热管的装配示意图；3 is a schematic view showing the assembly of a heat sink and a superconducting heat pipe in a first preferred embodiment of the present invention;
图4是本发明第一优选实施例中散热片与超导热管的结构分解示意图；4 is a schematic exploded view showing the structure of a heat sink and a superconducting heat pipe according to a first preferred embodiment of the present invention;
图5是本发明第一优选实施例中采用的散热片的零件图；Figure 5 is a partial view of a heat sink used in the first preferred embodiment of the present invention;
图6是本发明第二优选实施例的外观结构示意图；Figure 6 is a schematic view showing the appearance of a second preferred embodiment of the present invention;
图7是本发明第二优选实施例中采用的散热片的零件图；Figure 7 is a partial view of a heat sink used in a second preferred embodiment of the present invention;
图8中本发明第三优选实施例的外观结构示意图；Figure 8 is a schematic view showing the appearance of a third preferred embodiment of the present invention;
图9是本发明第三优选实施例的另一个角度的外观结构示意图；Figure 9 is a perspective view showing the appearance of another angle of the third preferred embodiment of the present invention;
图10是本发明第三优选实施例中采用的超导热管的零件图；Figure 10 is a partial view of a superconducting heat pipe used in a third preferred embodiment of the present invention;
图11是本发明第四优选实施例的外观结构示意图；Figure 11 is a schematic view showing the appearance of a fourth preferred embodiment of the present invention;
图12是本发明第五优选实施例中安装了固定架时的结构示意图；Figure 12 is a schematic structural view showing a mounting frame in a fifth preferred embodiment of the present invention;
图13是本发明第五优选实施例中安装了固定架的另一个角度的结构示意图；Figure 13 is a structural schematic view showing another angle at which the fixing frame is mounted in the fifth preferred embodiment of the present invention;
图14是本发明第五优选实施例中固定架的零件图；Figure 14 is a view showing the parts of the fixing frame in the fifth preferred embodiment of the present invention;
图15是本发明第五优选实施例中散热片的零件图；Figure 15 is a view showing the parts of a heat sink in a fifth preferred embodiment of the present invention;
图16是图13中A处的放大示意图；Figure 16 is an enlarged schematic view of a portion A in Figure 13;
图17是图14中B处的放大示意图。Figure 17 is an enlarged schematic view of the portion B in Figure 14.
具体实施方式detailed description
参照图1至图 5，本发明的散热装置的第一优选实施例，包括一用于安装热源的导热盘10，在本发明中，上述导热盘10优先加工成圆盘形状，所述导热盘10上设置有若干根超导热管20，在本实施例中，上述超导热管20的外形大致呈“一”字形，超导热管20的一端穿过所述导热盘10的侧壁并延伸进导热盘10的内部，每根超导热管20上均设置有一散热片30，所述散热片30包括一纵向长度大于其横向宽度的散热片主体300，该散热片主体300的中部处设置有一沿其纵向方向延伸的安装孔301，所述超导热管20穿装于所述安装孔301中，为了使散热片30的散热效果更好，优选地，所述散热片30采用铝材料制成；进一步，为了使得超导热管20可以更好地将热量传递给散热片30，优选地，所述超导热管20与所述安装孔301之间为过盈配合，由于超导热管20与安装孔301之间为过盈配合，因此超导热管20与安装孔301之间为直接相接触，因此热量可以直接传递至散热片30上而不需要通过空气传递，加快热量传递速度；当然所述超导热管20与所述安装孔301之间也可以设置有导热胶泥，通过导热胶泥将热量从超导热管20上传递至散热片30上。在本发明中，所述超导热管20与所述安装孔301之间也可以通过设置导热的焊锡来进行传递热量，同样可以达到快速传递热量的目的。Refer to Figure 1 to Figure 5. A first preferred embodiment of the heat sink of the present invention comprising a heat conducting disk 10 for mounting a heat source. In the present invention, the heat conducting disk 10 is preferentially processed into a disk shape, and the heat conducting disk 10 is provided with a plurality of In the present embodiment, the superconducting heat pipe 20 has a substantially U-shape, and one end of the superheat pipe 20 passes through the side wall of the heat conducting plate 10 and extends into the interior of the heat conducting plate 10. Each of the superconducting heat pipes 20 is provided with a heat sink 30. The heat sink 30 includes a heat sink body 300 having a longitudinal length greater than a lateral width thereof, and a central portion of the heat sink body 300 is disposed along a longitudinal direction thereof. The mounting hole 301 is inserted into the mounting hole 301. In order to better dissipate the heat sink 30, the heat sink 30 is preferably made of aluminum material; further, in order to make the super The heat pipe 20 can better transfer heat to the heat sink 30. Preferably, the super heat pipe 20 and the mounting hole 301 have an interference fit, since the super heat pipe 20 and the mounting hole 301 are Surplus fit, so super heat pipe 2 0 is in direct contact with the mounting hole 301, so heat can be directly transmitted to the heat sink 30 without passing through air to accelerate the heat transfer speed; of course, between the super heat pipe 20 and the mounting hole 301 A thermal conductive cement may be provided to transfer heat from the superconducting heat pipe 20 to the heat sink 30 through the thermal conductive cement. In the present invention, the heat transfer between the superconducting heat pipe 20 and the mounting hole 301 can also be performed by providing heat-conductive solder, and the same can be achieved for rapid heat transfer.
由于本发明通过采用一导热盘10作为安装热源的载体，安装于导热盘10上的热源工作发热时，导热盘10通过超导热管20可以快速地将热量传递至散热片30上，同时由于本发明采用纵向长度大于其横向宽度的散热片30，而且散热片30的中部处设置有沿其纵向方向延伸的安装孔301，超导热管20穿装于所述安装孔301中，因此热量从超导热管20的一端传递其另一端的过程中，热量也从散热片30的中部迅速地向其两边外缘传递并传递至散热片30的各个位置，因此热量可以迅速地通过散热片30的整个表面往外散发，大大地提升了本发明的散热装置的散热能力，因此可以很好地满足人们对散热装置的散热要求。Since the present invention uses a heat conducting plate 10 as a carrier for mounting a heat source, when the heat source mounted on the heat conducting disk 10 is heated, the heat conducting disk 10 can quickly transfer heat to the heat sink 30 through the super heat conducting tube 20, and The invention adopts a heat sink 30 whose longitudinal length is greater than its lateral width, and a central portion of the heat sink 30 is provided with a mounting hole 301 extending in a longitudinal direction thereof, and the super heat pipe 20 is inserted into the mounting hole 301, so the heat is super During the transfer of one end of the heat pipe 20 to the other end thereof, heat is also rapidly transferred from the central portion of the heat sink 30 to the outer edges of both sides thereof and transmitted to the respective positions of the heat sink 30, so that heat can quickly pass through the entire heat sink 30. The surface is emitted outward, which greatly improves the heat dissipation capability of the heat sink of the present invention, and thus can well meet the heat dissipation requirements of the heat sink.
为了便于散热片30的生产加工，优选地，所述散热片30通过挤压铝一体成型，所述安装孔301为一圆周完整闭合的通孔。In order to facilitate the production process of the heat sink 30, preferably, the heat sink 30 is integrally formed by extruding aluminum, and the mounting hole 301 is a circumferentially closed through hole.
参照图6和图 7，本发明的散热装置的第二优选实施例，其与第一优选实施例的不同之处在于，所述散热片30由一片体经冲压弯折成型，所述安装孔301为一圆周带缺口的通孔，优选地，所述片体为金属片体，进一步优选，所述片体为铝片，当然所述片体为铜片或者其他金属片也是可以的。Refer to Figure 6 and Figure 7. A second preferred embodiment of the heat sink of the present invention, which differs from the first preferred embodiment in that the heat sink 30 is formed by stamping and bending a piece of the body, and the mounting hole 301 is a circumferential band Preferably, the sheet is a metal sheet, and more preferably, the sheet is an aluminum sheet. Of course, the sheet is a copper sheet or other metal sheet.
参照图8至图10，本发明的散热装置的第三优选实施例，其与第一优选实施例的不同之处在于，所述超导热管20的外形大致呈“L”形，超导热管20的一端穿过所述导热盘10的侧壁并延伸进导热盘10的内壁。8 to 10, a third preferred embodiment of the heat dissipating device of the present invention is different from the first preferred embodiment in that the superconducting heat pipe 20 has a substantially "L" shape and a superconducting heat pipe. One end of the 20 passes through the side wall of the thermal pad 10 and extends into the inner wall of the thermal pad 10.
参照图11，本发明的散热装置的第四优选实施例，其与第三优选实施例的不同之处在于，所述散热片30由一片体经冲压弯折成型，所述安装孔301为一圆周带缺口的通孔。Referring to FIG. 11, a fourth preferred embodiment of the heat sink of the present invention is different from the third preferred embodiment in that the heat sink 30 is formed by stamping and bending a piece, and the mounting hole 301 is a A notched through hole in the circumference.
参照图12至图17，本发明的散热装置的第五优选实施例，其与第四优选实施例的不同之处在于，所述导热盘10上至少设置有一个用于锁定相邻的两块散热片30之间的间距的固定架40，在本实施例中，所述导热盘10上设置有两个固定架40，其中一个固定架40通过若干根固定安装杆50固定于所述导热盘10上，同时该固定架40还通过若干根固定连杆42与另外一个固定架40相连接，上述的两个固定架40分别设置于所述散热片30的两侧，所述固定架40上开设有若干个分别与若干块散热片30相对应的固定孔41，每块散热片30的散热片主体300外周缘对应所述固定孔41的位置上设置有能够***该固定孔41的定位片31。Referring to Figures 12 to 17, a fifth preferred embodiment of the heat sink of the present invention is different from the fourth preferred embodiment in that at least one of the two adjacent heat shields 10 is provided for locking adjacent ones In the present embodiment, the heat conducting plate 10 is provided with two fixing frames 40, and one of the fixing frames 40 is fixed to the heat conducting plate by a plurality of fixed mounting rods 50. 10, at the same time, the fixing frame 40 is connected to the other fixing frame 40 through a plurality of fixing links 42. The two fixing frames 40 are respectively disposed on two sides of the heat sink 30, and the fixing frame 40 is disposed on the fixing frame 40. A plurality of fixing holes 41 respectively corresponding to the plurality of fins 30 are provided, and the outer peripheral edge of the fin body 300 of each fin 30 is provided with a positioning piece that can be inserted into the fixing hole 41 at a position corresponding to the fixing hole 41. 31.
本发明通过在导热盘10上设置有用于锁定相邻的两块散热片30之间的间距的固定架40，可以防止相邻的两块散热片30相互靠近或紧贴，保证相邻的两块散热片30之间具有足够的间隙以便于空气从散热片30的表面上带走热量，进而可以保证本发明的散热装置的散热效果。The present invention can prevent the adjacent two heat sinks 30 from approaching or adhering to each other by providing the fixing frame 40 for locking the spacing between the adjacent two heat sinks 30 on the heat conducting plate 10, thereby ensuring the adjacent two. There is a sufficient gap between the block fins 30 to facilitate the removal of heat from the surface of the fins 30, thereby ensuring the heat dissipation effect of the heat sink of the present invention.
在这里，为了防止定位孔31从固定孔41中脱出，优选地，所述定位片31***并穿过所述固定孔41后弯折形成一能够与所述固定孔41相卡接的弯折部32。通过上述的弯折部32与固定孔41相卡接，可防止定位片31从固定孔41中脱出，因此散热片30与固定架40的相对位置不会发生变化，进而保证相邻的两块散热片30之间的间距固定不变，以便于散热，保证了本发明的散热装置的散热效果。Here, in order to prevent the positioning hole 31 from coming out of the fixing hole 41, preferably, the positioning piece 31 is inserted and passed through the fixing hole 41, and then bent to form a bend which can be engaged with the fixing hole 41. Part 32. By the above-mentioned bending portion 32 being engaged with the fixing hole 41, the positioning piece 31 can be prevented from coming out of the fixing hole 41, so that the relative positions of the heat sink 30 and the fixing frame 40 are not changed, thereby ensuring the adjacent two pieces. The spacing between the fins 30 is fixed to facilitate heat dissipation, and the heat dissipation effect of the heat sink of the present invention is ensured.
以上所述仅为本发明的优先实施方式，只要以基本相同手段实现本发明目的的技术方案都属于本发明的保护范围之内。The above is only a preferred embodiment of the present invention, and any technical solution that achieves the object of the present invention by substantially the same means is within the scope of the present invention.

Claims (10)

  1. 一种散热装置，其特征在于：包括一用于安装热源的导热盘（10），所述导热盘（10）上设置有若干根超导热管（20），每根超导热管（20）上均设置有一散热片（30），所述散热片（30）包括一纵向长度大于其横向宽度的散热片主体（300），该散热片主体（300）的中部处设置有一沿其纵向方向延伸的安装孔（301），所述超导热管（20）穿装于所述安装孔（301）中。 A heat dissipating device, comprising: a heat conducting plate (10) for mounting a heat source, wherein the heat conducting plate (10) is provided with a plurality of superconducting tubes (20), each superconducting tube (20) A heat sink (30) is disposed, the heat sink (30) includes a heat sink body (300) having a longitudinal length greater than a lateral width thereof, and a central portion of the heat sink body (300) is disposed along a longitudinal direction thereof. A mounting hole (301) is installed in the mounting hole (301).
  2. 根据权利要求1所述的一种散热装置，其特征在于：所述超导热管（20）的外形大致呈“一”字形，超导热管（20）的一端穿过所述导热盘（10）的侧壁并延伸进导热盘（10）的内部。The heat dissipating device according to claim 1, wherein the superconducting heat pipe (20) has a substantially U-shape, and one end of the superconducting heat pipe (20) passes through the heat conducting plate (10). The side walls extend into the interior of the thermal pad (10).
  3. 根据权利要求1所述的一种散热装置，其特征在于：所述超导热管（20）的外形大致呈“L”形，超导热管（20）的一端穿过所述导热盘（10）的侧壁并延伸进导热盘（10）的内壁。The heat dissipating device according to claim 1, wherein the superconducting heat pipe (20) has an outer shape of an "L" shape, and one end of the superheat pipe (20) passes through the heat conducting plate (10). The side wall extends into the inner wall of the thermal pad (10).
  4. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述散热片（30）通过挤压铝一体成型，所述安装孔（301）为一圆周完整闭合的通孔。A heat dissipating device according to claim 1 or 2 or 3, characterized in that the fin (30) is integrally formed by extruding aluminum, and the mounting hole (301) is a circumferentially closed through hole.
  5. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述散热片（30）由一片体经冲压弯折成型，所述安装孔（301）为一圆周带缺口的通孔。A heat dissipating device according to claim 1 or 2 or 3, wherein the heat sink (30) is formed by stamping and bending a piece, and the mounting hole (301) is a circumferentially notched through hole. hole.
  6. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述超导热管（20）与所述安装孔（301）之间为过盈配合。A heat dissipating device according to claim 1 or 2 or 3, characterized in that an interference fit is provided between the superconducting heat pipe (20) and the mounting hole (301).
  7. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述超导热管（20）与所述安装孔（301）之间设置有导热胶泥。A heat dissipating device according to claim 1 or 2 or 3, characterized in that a thermal conductive cement is arranged between the superconducting heat pipe (20) and the mounting hole (301).
  8. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述超导热管（20）与所述安装孔（301）之间设置有导热的焊锡。A heat dissipating device according to claim 1 or 2 or 3, characterized in that a heat-conductive solder is disposed between the superconducting heat pipe (20) and the mounting hole (301).
  9. 根据权利要求1或2或3所述的一种散热装置，其特征在于：所述导热盘（10）上至少设置有一个用于锁定相邻的两块散热片（30）之间的间距的固定架（40），所述固定架（40）上开设有若干个分别与若干块散热片（30）相对应的固定孔（41），每块散热片（30）的散热片主体（300）外周缘对应所述固定孔（41）的位置上设置有能够***该固定孔（41）的定位片（31）。A heat dissipating device according to claim 1 or 2 or 3, characterized in that the heat conducting plate (10) is provided with at least one space for locking the spacing between two adjacent fins (30). a fixing frame (40), the fixing frame (40) is provided with a plurality of fixing holes (41) respectively corresponding to the plurality of fins (30), and the fin body (300) of each fin (30) A positioning piece (31) into which the fixing hole (41) can be inserted is provided at a position of the outer peripheral edge corresponding to the fixing hole (41).
  10. 根据权利要求9所述的一种散热装置，其特征在于：所述定位片（31）***并穿过所述固定孔（41）后弯折形成一能够与所述固定孔（41）相卡接的弯折部（32）。A heat dissipating device according to claim 9, wherein the positioning piece (31) is inserted into and passed through the fixing hole (41), and is bent to form a card which can be engaged with the fixing hole (41). Connected bends (32).
PCT/CN2015/088810 2015-03-30 2015-09-02 Heat dissipation device WO2017020390A1 (en)

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