WO2017008443A1 - 通讯设备金属外壳以及其制备方法 - Google Patents

通讯设备金属外壳以及其制备方法 Download PDF

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Publication number
WO2017008443A1
WO2017008443A1 PCT/CN2015/098292 CN2015098292W WO2017008443A1 WO 2017008443 A1 WO2017008443 A1 WO 2017008443A1 CN 2015098292 W CN2015098292 W CN 2015098292W WO 2017008443 A1 WO2017008443 A1 WO 2017008443A1
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WIPO (PCT)
Prior art keywords
communication device
metal substrate
metal
groove
metal casing
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PCT/CN2015/098292
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English (en)
French (fr)
Inventor
廖重重
陈梁
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比亚迪股份有限公司
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Publication date
Application filed by 比亚迪股份有限公司 filed Critical 比亚迪股份有限公司
Publication of WO2017008443A1 publication Critical patent/WO2017008443A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present invention relates to the field of materials, and in particular, to a metal casing for a communication device and a method of manufacturing the same.
  • the mobile phone antenna is a device for receiving signals on a mobile phone.
  • the antenna of the smart phone is mostly an internal antenna, which requires that the mobile phone case cannot shield the signal.
  • a mobile phone with a plastic case does not have the above problems.
  • the metal case has a more beautiful texture, wear resistance and scratch resistance, the metal case gradually replaces the plastic case for use in a communication device such as a mobile phone.
  • how to solve the signal shielding problem is one of the keys to its design and manufacture.
  • metal mobile phones use antenna slot and injection molding to solve the problem of signal shielding of the fuselage, such as the upper and lower antenna slots of HTC ONE, and the side antenna slots of iphone5/5s.
  • the above prior art all prevents the shielding of the signal by filling the antenna slot with plastic, but it causes certain damage to the overall structure of the metal mobile phone body, which affects the overall cleanliness and continuity of the appearance.
  • the plastic visible in the outer casing destroys the overall metallic texture of the fuselage.
  • the object of the present invention is to overcome the above problems in the prior art, and to provide a metal casing for a communication device and a preparation method thereof.
  • the metal casing of the communication device provided by the invention has a slit (ie, an antenna slot) which is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • the present invention provides a metal casing for a communication device, wherein the metal casing of the communication device includes a metal substrate and a decorative layer; the decorative layer covers an outer surface of the metal substrate; and the metal substrate The inner surface is provided with a groove, and a bottom of the groove is provided with a slit penetrating the metal substrate.
  • the invention provides a metal housing for a communication device.
  • the metal casing comprises: a metal substrate, the inner surface of the metal substrate is provided with a groove, a bottom of the groove is provided with a slit penetrating the metal substrate; and a decorative layer The decorative layer covers an outer surface of the metal substrate.
  • the invention also provides a method for preparing a metal casing of a communication device, wherein the method comprises the following steps:
  • the metal casing of the communication device obtained by the method of the invention has a slit for the communication signal to pass through to realize a normal communication function.
  • the metal casing of the communication device provided by the invention has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • a decorative layer on the surface of the metal substrate by one or more of electrophoresis, general anodizing, porcelain anodizing, hard anodizing, micro-arc oxidation, and spraying, and further filling the slit with a filling It can significantly improve its hardness, wear resistance, shock resistance and corrosion resistance.
  • Figure 1 is a schematic cross-sectional view showing a process of preparing a metal casing of a communication device of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a metal casing of a communication device according to an embodiment of the present invention.
  • the invention proposes a metal housing for a communication device.
  • the metal casing comprises: a metal substrate 1 and a decorative layer 6.
  • the inner surface of the metal substrate 1 is provided with a groove 3, and the bottom of the groove 3 is provided with a slit 8 penetrating the metal substrate 1.
  • the metal housing of the communication device comprises a metal substrate 1 and a decorative layer 6; the decorative layer 6 covers the outer surface of the metal substrate 1; the inner surface of the metal substrate 1 is provided with a recess 3,
  • the bottom of the groove is provided with a slit 8 penetrating the metal substrate. Therefore, the metal casing can realize the communication of the communication signal by using the slit 8, and avoid the problem that the outer casing of the metal casing is filled with plastic and the overall appearance of the casing is not beautiful, and the metal casing is not continuous.
  • the communication device may be, for example, a mobile phone, a tablet computer, a notebook computer, a Bluetooth headset, or the like.
  • the metal housing of the communication device is a metal casing of a mobile phone.
  • the inner surface of the metal casing is defined as a surface facing the interior of the communication device when it is used in a communication device, also referred to as a lower surface.
  • the outer surface of the metal casing is defined as the surface of the metal casing facing the outside when it is used in a communication device, and also becomes the upper surface.
  • the inner and outer surfaces (upper and lower surfaces) of the metal substrate for preparing the metal outer casing are also applicable to the above definition.
  • the metal casing may have a plurality of grooves 3 for better communication of communication signals.
  • the inner surface of the plurality of grooves can be provided with the slits 8.
  • a plurality of slits 8 can be formed in the same groove 3.
  • the specific number and corresponding relationship of the slit 8 and the groove 3 are not particularly limited, and those skilled in the art can set the above parameters according to the specific conditions of the signal transmission of the communication device, as long as the groove 3 is disposed on the inner surface of the metal substrate 1.
  • the slit 8 is opened at the bottom of the groove 3 and penetrates the metal substrate 1 at the bottom of the groove 3.
  • the metal casing of the communication device of the present invention may obviously have a plurality of slits.
  • the groove and the slit are connected to each other for ensuring signal transmission between the antenna and the outside, and realizing communication.
  • the groove may have a depth of 0.22-0.5 mm, and in some embodiments of the invention, the groove has a depth of 0.22-0.4. In some embodiments of the invention, the groove has a depth of 0.22-0.3.
  • the grooves may have a width of 2-5 mm, and in some embodiments of the invention, the grooves have a width of 3-4 mm.
  • the grooves may have a length of 10-100 mm, and in some embodiments of the invention, the grooves have a length of 10-60 mm.
  • the depth of the slit is 0.08-0.15 mm.
  • the depth of the slit is 0.08-0.12 mm. In some embodiments of the invention, the depth of the slit It is 0.08-0.1mm.
  • the slit may have a width of 30 to 60 ⁇ m, and in some embodiments of the invention, the slit has a width of 40 to 50 ⁇ m.
  • the slit may have a length of 10-100 mm; in some embodiments of the invention, the slit has a length of 10-60 mm. Additionally, in some embodiments of the invention, the length of the slit is the same as the length of the groove.
  • the inventors have found that when the size of the above-mentioned groove and the slit is too large, the overall mechanical strength of the metal substrate 1 is affected, so that the metal casing is easily deformed, broken, etc. during use; When the size of the slot and the slit is too small, it is easy to adversely affect the signal transmission of the communication device.
  • the inventors have found through extensive use that when the size of the grooves and slits are within the above range, signal transmission of most current communication devices can be ensured, and the metal casing can maintain reliable mechanical strength.
  • FIG. 2 a cross-sectional view of a metal casing according to an embodiment of the present invention is shown.
  • the horizontal direction is the groove and the width of the slit
  • the vertical direction along the figure is a groove and a slit.
  • the depth, the slit and the length of the groove are not shown in FIG.
  • the number of the grooves and the slits is not particularly limited as long as communication can be realized, for example, 1 to 200. In some embodiments of the present invention, the number of the grooves and the slits is 5-50. In addition, when there are a plurality of grooves and slits, the spacing between adjacent two grooves may be 2-5 mm. In some embodiments of the invention, the spacing between adjacent two grooves It is 2-3mm.
  • the material of the metal substrate may be various metals commonly used in communication equipment in the art, such as aluminum alloy, stainless steel, magnesium alloy or titanium alloy, etc.
  • the metal substrate is made of an aluminum alloy.
  • the thickness of the metal substrate is not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the metal substrate may have a thickness of 0.3-0.6 mm.
  • the metal substrate has a thickness of 0.3-0.5 mm; in some embodiments of the invention, the metal base The thickness of the material is 0.3-0.4 mm. Therefore, the metal substrate can be ensured to have a certain mechanical strength, and the current communication equipment can meet the requirement that the thickness of the outer casing tends to be slim.
  • the decorative layer 6 covers the outer surface of the metal substrate 1. Specifically, a decorative layer 6 is formed on the outer surface of the metal substrate 1.
  • the decorative layer 6 may cover the entire outer surface of the metal substrate 1, or may cover a part of the outer surface of the metal substrate 1.
  • the decorative layer 6 covers the slit 8 so that the slit 8 is not visible on the outer surface of the metal substrate, thereby making the metal casing more aesthetically pleasing. That is to say, the metal housing of the communication device also has a decorative layer on the outer surface of the metal substrate, the decorative layer covering the slit.
  • the decorative layer may be a decorative layer formed by one or more of electrophoresis, general anodization, hard anodization, micro-arc oxidation, and spray coating.
  • a person skilled in the art can select a method of forming the decorative layer 6 within the above range according to the specific material of the metal substrate 1.
  • the thickness of the decorative layer is not particularly limited and may be a conventional thickness in the art.
  • the decorative layer may have a thickness of 15 to 35 ⁇ m. In some embodiments of the invention, the thickness of the decorative layer is 25-35 ⁇ m.
  • the metal housing of the communication device may further comprise a protective layer 4.
  • the protective layer 4 covers a region other than the slit 8 on the inner surface of the metal substrate 1.
  • the communication device metal housing further includes a protective layer 4 that covers an area of the inner surface of the metal substrate other than the slit. Thereby, the inner surface of the metal substrate 1 can be protected by the protective layer 4, so that the overall mechanical properties of the metal casing can be enhanced.
  • the protective layer may be a protective layer formed by electrophoresis and/or spray coating.
  • the thickness of the protective layer is not particularly limited.
  • the protective layer may have a thickness of 5 to 25 ⁇ m.
  • the protective layer has a thickness of 5 to 15 ⁇ m. The inventors have found through extensive experiments that when the thickness of the protective layer is within the above range, the metal substrate 1 can be provided with effective additional protection without affecting the transmission of communication signals.
  • the metal housing of the communication device may further comprise a filler member 9. That is, in some embodiments of the invention, the communication device metal housing further includes a filler member, the filler member being located in the recess and the slit. Thereby, the overall mechanical properties of the metal casing can be improved by the filler member, and the mechanical strength drop due to the thinness of the metal substrate can be alleviated in the groove and the slit.
  • the filler member 9 described above is formed of a UV curable glue.
  • the filler is a filler formed by UV glue curing.
  • the UV glue is, for example, a 3211 model UV glue purchased from Loctite Corporation.
  • the metal housing of the communication device includes a metal substrate 1, a decorative layer 6, a protective layer 4, and a filler member 9; the decorative layer 6 is covered
  • the outer surface of the metal substrate 1; the inner surface of the metal substrate 1 is provided with a groove 3; the bottom of the groove is provided with a slit 8 penetrating the metal substrate; the protective layer 4 covers the A region other than the slit 8 of the inner surface of the metal substrate 1; the filler member 9 is located in the groove 3 and the slit 8.
  • the invention provides a method of making a metal casing for a communication device. According to an embodiment of the invention, the method comprises:
  • a first protective layer is formed on the surface of the metal substrate.
  • the thickness of the metal substrate to be used is not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the metal substrate may have a thickness of 0.3-0.6 mm.
  • the metal substrate has a thickness of 0.3-0.5 mm.
  • the metal base The thickness of the material is 0.3-0.4 mm.
  • the material of the metal substrate can be various metals commonly used in communication equipment in the field, for example, aluminum alloy Gold, stainless steel, magnesium alloy or titanium alloy, etc.; In some embodiments of the invention, the metal substrate is made of an aluminum alloy.
  • the first protective layer 2 is formed on both the inner surface and the outer surface of the metal substrate 1.
  • the first protective layer is a UV ink layer. That is, as shown in (a) of FIG. 1, the metal substrate obtained by the step 1) has a structure in which a first protective layer (UV ink layer) 2 is formed on the upper and lower surfaces of the metal substrate 1.
  • the method of forming a UV ink layer on the surface of the metal substrate may employ various methods and conditions commonly used in the art. For example, it may be baked at 70-90 degrees Celsius after spraying the UV ink on the surface of the metal substrate. minute.
  • the above UV inks may use various UV inks commonly used in the art, and may be, for example, a 5680 series UV ink.
  • the thickness of the ink layer formed by the above method is not particularly limited and may be a conventional thickness in the art, for example, the thickness may be 10 to 30 ⁇ m, and in some embodiments of the present invention, the ink layer is The thickness is 15-25 ⁇ m.
  • the step is for opening the groove on an inner surface of the metal substrate, as described above, the groove penetrating the first protective layer and a part of the metal
  • the groove of the substrate that is, the groove penetrates the first protective layer but does not completely penetrate the metal substrate, thereby forming a groove on the inner surface of the metal substrate.
  • the method of forming the groove is not particularly limited, and may be a method conventionally used in the art.
  • the UV ink layer formed in the step 1) is exposed by ultraviolet light exposure, thereby exposing and developing more than one substrate tape on the outer surface of the metal substrate.
  • the recess is then formed by etching a metal substrate of the region. It should be noted that the number of the above-mentioned substrate strips is determined by the number of grooves to be formed, and those skilled in the art can adjust the number of the above-mentioned substrate strips according to actual conditions.
  • the substrate strip may have a width of from 2 to 5 mm. In some embodiments of the invention, the substrate strip has a width of from 3 to 4 mm. In some embodiments of the invention, the length of the substrate strip is 10-100 mm, and in some embodiments of the invention, the length of the substrate strip is 10-60 mm. When the plurality of substrate strips are multiple, the spacing between adjacent two substrate strips is 2-5 mm. In some embodiments of the invention, the spacing between adjacent two substrate strips is 2- 3mm.
  • the groove is formed on the outer surface of the metal substrate by the step 2), that is, the metal of the substrate region of the metal is etched by the etching, and the substrate of the metal substrate is The belt region forms a groove.
  • the thickness of the metal substrate thickness of the substrate strip region is such as 0.08-0.15 mm by etching; in some embodiments of the invention, the substrate strip is etched The thickness of the metal substrate of the region is from 0.08 to 0.12 mm; in some embodiments of the invention, the substrate is stripped by etching The thickness of the metal substrate of the domain is 0.08-0.1 mm.
  • the etching comprises an acid etchant etch and an alkaline etchant etch.
  • the acidic etching solution is a mixed solution of ferric chloride, hydrochloric acid and water.
  • the ferric chloride may be from 550 to 600 g and the hydrochloric acid may be from 30 to 50 g with respect to 100 g of water.
  • the conditions for etching the above acidic etching solution include a temperature of 10-35 degrees Celsius and a time of 8-10 minutes.
  • the alkaline etchant is a solution containing 50-60 g/L sodium hydroxide, 50-60 g/L sodium carbonate, and 50-60 g/L sodium nitrate.
  • the conditions for etching the alkaline etching solution include a temperature of 35-45 degrees Celsius and a time of 20-40 minutes.
  • the metal substrate obtained by the above step 2) has a structure in which the inner surface of the metal substrate 1 is provided with the groove 3, and the groove 3 of the metal substrate 1 is not The surface is covered with a first protective layer (UV ink layer) 2.
  • a first protective layer UV ink layer
  • the first protective layer is removed, and a second protective layer is formed on the inner surface of the metal substrate.
  • the first protective layer is first removed to obtain a metal substrate having the recess.
  • the structure of the metal substrate after removing the first protective layer is as shown in (c) of FIG.
  • the method for removing the first protective layer may be various methods conventional in the art.
  • the metal substrate having the first protective layer may be immersed in the paint stripper for 10-20 minutes at a temperature of 10-35 degrees Celsius, the paint stripper
  • the paint stripper For example, it can be a paint remover of SH-665 model purchased from Dongguan Sihui Surface Treatment Technology Co., Ltd.
  • the shield for shielding the outer surface of the metal substrate
  • various shields commonly used in the art can be employed.
  • the shield can be, for example, an insulating tape.
  • the insulating tape can be purchased from Shenzhen Ximeng Te Electronics Co., Ltd.
  • the method of forming the second protective layer is not particularly limited, and in some embodiments of the present invention, in this step, the second protective layer is formed by electrophoresis and/or spraying.
  • the conditions for the electrophoresis may include: a temperature of 29-31 degrees Celsius, an electrophoresis voltage of 120-140 V, a pH of 7-9, and a time of 1-3 min.
  • the electrophoresis liquid of the electrophoresis may be a matte containing Japanese Shimizu Co., Ltd. Electrophoresis liquid of varnish (WNO-1) and varnish (NNO-4) of Japan Shimizu Co., Ltd., including matte lacquer (WNO-1) of Japan Shimizu Co., Ltd.
  • the electrophoretic fluid may have a solids content of from 8 to 15% by weight. In some embodiments of the invention, the electrophoretic fluid has a solids content of 13% by weight.
  • the spraying means spraying one or more layers of an organic or inorganic coating on the surface of the metal substrate, and the coating thickness can be controlled to be 10-25 ⁇ m.
  • the sprayed coating can be, for example, an epoxy resin.
  • the thickness of the second protective layer formed by the above method may be 5 to 25 ⁇ m, and in some embodiments of the present invention, the thickness of the second protective layer formed by the above method is 5 to 15 ⁇ m.
  • the metal substrate obtained by the above step 3) has a structure in which the outer surface of the metal substrate 1 is shielded with a shield member 5, and the inner surface of the metal substrate 1 is formed with a second surface.
  • Protective layer 4 As shown in (d) of FIG. 1, the metal substrate obtained by the above step 3) has a structure in which the outer surface of the metal substrate 1 is shielded with a shield member 5, and the inner surface of the metal substrate 1 is formed with a second surface.
  • Protective layer 4 4
  • this step a decorative layer is formed on the outer surface of the metal substrate. That is, this step is for forming a decorative layer on the outer surface of the metal substrate obtained in the step 3).
  • the shielding member of the outer surface of the metal substrate is first removed, and then a decorative layer is formed on the outer surface of the metal substrate.
  • the decorative layer can be carried out by conventional methods and conditions in the art, for example, by one or more of electrophoresis, general anodizing, porcelain anodizing, hard anodizing, micro-arc oxidation, and spraying.
  • the surface forms a decorative layer.
  • the decorative layer may have a thickness of 15 to 35 ⁇ m.
  • the conditions for the electrophoresis may include a temperature of 28-32 degrees Celsius, a voltage of 140-200 V, a time of 1-3 min, and a pH of 7-9.
  • the electrophoresis liquid of the electrophoresis may be an electrophoretic liquid containing a matt lacquer (WNO-1) of Nippon Seisakusho Co., Ltd. and a varnish (NNO-4) of Nippon Seisakusho Co., Ltd., wherein the matte of Japan Shimizu Co., Ltd.
  • the weight ratio of the lacquer (WNO-1) and the varnish (NNO-4) of Japan Shimizu Co., Ltd. may be 0-4:1.
  • the matte lacquer of Japan Shimizu Co., Ltd. WNO- 1
  • the weight ratio of the varnish (NNO-4) of Japan Shimizu Co., Ltd. is 7:3.
  • the electrophoretic fluid may have a solids content of from 8 to 15% by weight. In some embodiments of the invention, the electrophoretic fluid has a solids content of 13% by weight.
  • the thickness of the decorative layer formed by the above electrophoresis method is usually 25 to 35 ⁇ m.
  • the conditions for the ordinary anodization may include an anode voltage of 13-17 V, a temperature of 17-21 degrees Celsius, and an oxidation time of 30-60 min. Further, the anodizing solution is 180-200 g/L sulfuric acid. The thickness of the decorative layer formed by the above anodizing method is usually 15 to 25 ⁇ m.
  • the conditions for the hard anodization may include a current density of 4 A/dm 2 , a time of 30 to 60 minutes, a temperature of 5 to 10 degrees Celsius, an electrolyte of 180 to 200 g/L of sulfuric acid, and 5 to 15 g/L of oxalic acid.
  • the thickness of the decorative layer formed by the above hard anodization method is usually 25 to 45 ⁇ m.
  • the conditions for the anodizing of the ceramic may include a voltage of 80-120 V, an oxidation time of 30-60 min, and an oxidation temperature of 30-50 degrees Celsius.
  • the porcelain anolyte is 40-50 g/L of potassium oxalate, 1-4 g/L of oxalic acid, 6-10 g/L of boric acid, and 0.5-2 g/L of citric acid.
  • the thickness of the decorative layer formed by the above-described ceramic anodizing method is usually 15 to 30 ⁇ m.
  • the conditions for the micro-arc oxidation may include an oxidation temperature of 20 to 30 degrees Celsius, an oxidation forward voltage of 400 to 600 V, and an oxidation time of 40 to 100 minutes.
  • the composition of the micro-arc oxidation electrolyte is: 0.02-0.05 mol/L sodium silicate and 0.03-0.07 mol/L sodium hydroxide.
  • the thickness of the decorative layer formed by the above micro-arc oxidation method is usually 15 to 40 ⁇ m.
  • the spraying means spraying one or more layers of an organic or inorganic coating on the surface of the metal substrate, and the coating thickness can be controlled to be 10-50 ⁇ m.
  • the sprayed coating can be, for example, an epoxy resin.
  • the metal substrate is pretreated to clean the surface and improve the surface before the decorative layer is formed on the surface of the metal substrate. luster.
  • the method of pre-processing is performed using the following steps:
  • the metal substrate is alkali-etched in an alkali etching solution for 1-2 min, and then washed twice with deionized water;
  • the alkaline etching solution is a 15-20 g/L sodium hydroxide solution; in some embodiments of the invention, the light-emitting liquid is a 200-300 ml/L nitric acid solution; in some of the present invention
  • the chemical polishing liquid is a solution containing 650-750 ml/L phosphoric acid and 350-250 ml/L sulfuric acid.
  • the metal substrate obtained by the above step 4) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a recess 3 And the inner surface of the metal substrate 1 is formed with the second protective layer 4.
  • a slit penetrating the metal substrate is formed at the bottom of the groove.
  • a slit penetrating the metal substrate may be formed at the bottom of the groove by a method conventional in the art.
  • the step of forming a slit penetrating the metal substrate at the bottom of the groove includes:
  • the exposed metal substrate is etched with an alkaline etching solution to form a slit.
  • an opening is formed by a laser on the second protective layer at the bottom of the groove.
  • the conditions under which the laser forms an opening may be: power 70%, light travel speed 3000 mm/s, frequency 80 KHz.
  • the length of the opening formed in the recess is the same as the length of the recess.
  • the opening may have a width of 30-60 ⁇ m; preferably 30-40 ⁇ m.
  • the metal substrate obtained by the above step (1) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove. 3.
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4 having an opening 7 at the bottom of the recess 3.
  • the alkaline etching solution is a solution containing 50-60 g/L sodium hydroxide, 50-60 g/L sodium carbonate, and 50-60 g/L sodium nitrate, and the alkaline liquid etching conditions include: The temperature is 35-45 degrees Celsius and the time is 10-20 minutes.
  • the metal substrate obtained by the above step (2) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove. 3.
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3.
  • the method may further include:
  • a filler is formed in the groove and the slit to alleviate a decrease in mechanical properties due to the thinner metal substrate at the groove and the slit.
  • the filler described above may be formed of a UV curable adhesive (also known as UV glue). That is, in some embodiments of the present invention, the method for preparing the metal casing of the communication device of the present invention further includes the step of: filling the groove and the slit with UV glue and curing.
  • the second protective layer may or may not be removed before the grooves and the slits are filled with UV glue.
  • the UV glue may be various UV glues commonly used in the art, such as the 3211 model UV glue purchased from Loctite Corporation.
  • the curing method of the UV glue may be carried out by a conventional method in the art, for example, exposure to ultraviolet light.
  • the conditions under which the ultraviolet light is exposed are well known in the art and are not described herein.
  • the metal substrate obtained by the above step 6) has a structure in which the outer surface of the metal substrate 1 is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a recess 3
  • the inner surface of the metal substrate 1 is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is opened at the bottom of the groove 3, and the groove 3 and the slit 8 have a filling member 9 therein (that is, Filler 9 is filled).
  • the above method for preparing a metal casing includes the following steps:
  • the appearance of the metal casing prepared by the method can maintain the texture and consistency of the metal, and has a certain mechanical strength, and can ensure the smooth transmission of various communication signals.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • Spray 5680 series UV ink on the surface of the metal substrate purchased in Shenzhen Wanjiayuan Jinghua Technology Co., Ltd., the same below
  • bake at 80 degrees Celsius for 25 minutes then perform UV exposure (exposure condition is 2 min, The light intensity was 800 mJ/cm 2 )
  • two 2 mm wide substrate strips were formed, wherein the length of the substrate strip was 75 mm, and the spacing between adjacent two substrate strips was 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • an alkaline etching solution is further etched.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid, and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 minutes;
  • the etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline etching solution was etched under the conditions of a temperature of 40 ° C and a time of 33 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 2 mm, the thickness of the metal substrate in the groove region is about 0.08 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 2mm.
  • the outer surface of the metal substrate is shielded with an insulating tape (purchased from Shenzhen Ximeng Electronics Co., Ltd., the same below), and a protective layer having a thickness of 10 ⁇ m is formed on the inner surface of the metal substrate by electrophoresis.
  • the conditions for electrophoresis were a voltage of 140 V, a time of 1 min, a temperature of 30 degrees Celsius, and a pH of 7.8.
  • the alkaline etching solution was a solution containing 50 g/L sodium hydroxide, 50 g/L sodium carbonate, and 50 g/L sodium nitrate, and the alkaline liquid etching conditions included a temperature of 40 degrees Celsius and a time of 12 minutes.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • a metal substrate of 15mm x 80mm After spraying 5680 series UV ink on the surface of the metal substrate, and then baking at 80 degrees Celsius for 25 minutes, ultraviolet exposure (exposure condition: time 2 min, light intensity: 800 mJ/cm 2 ) was formed to form two 3 mm wide substrate strips. Wherein the length of the substrate strip is 75 mm and the spacing between adjacent two substrate strips is 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 hours;
  • the etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline etching solution was etched under the conditions of a temperature of 40 ° C and a time of 27 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 3 mm, the thickness of the metal substrate in the groove region is about 0.12 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 3mm.
  • the temperature was 30 degrees Celsius and the pH was 7.8.
  • An insulating tape for removing the outer surface of the metal substrate was obtained, and a decorative layer having a thickness of 20 ⁇ m was obtained by ordinary anodization.
  • the general anodizing conditions are: the anode voltage is 15V, the temperature is 19 degrees Celsius, and the oxidation time is 50 minutes. Further, the anodizing solution was 190 g/L of sulfuric acid.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Aluminum alloy purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm
  • a metal substrate of 15mm x 80mm After spraying 5680 series UV ink on the surface of the metal substrate, and then baking at 80 degrees Celsius for 25 minutes, ultraviolet exposure (exposure condition: time 2 min, light intensity: 800 mJ/cm 2 ) was formed to form two 5 mm wide substrate strips. Wherein the length of the substrate strip is 75 mm and the spacing between adjacent two substrate strips is 3 mm. Further, the thickness of the formed UV ink layer was 20 ⁇ m.
  • the acidic etching solution is a mixed solution of 550 g of ferric chloride, 30 g of hydrochloric acid and 100 g of water, and the acidic etching solution is etched under the conditions of a temperature of 30 degrees Celsius and a time of 10 minutes;
  • the etching solution is a solution containing 50 g/L sodium hydroxide, 50 g/L sodium carbonate, and 50 g/L sodium nitrate, and the conditions of the alkaline etching solution etching
  • the temperature is 40 degrees Celsius and the time is 24 minutes.
  • a metal substrate having a groove formed on the inner surface of the metal substrate wherein the width of the groove is about 5 mm, the thickness of the metal substrate in the groove region is about 0.15 mm, and the length of the groove is 75mm, the spacing between adjacent grooves is 3mm.
  • the temperature was 30 degrees Celsius and the pH was 7.8.
  • the insulating tape of the outer surface of the metal substrate was removed, and a decorative layer having a thickness of 35 ⁇ m was obtained by porcelain anodization.
  • the condition of porcelain anodization is a voltage of 100V, an oxidation time of 50 minutes, and an oxidation temperature of 40 degrees Celsius.
  • the porcelain anolyte was 15 g/L of potassium oxalate, 9 g/L of oxalic acid, 8 g/L of boric acid, and 1 g/L of citric acid.
  • the alkaline etching solution was a solution containing 50 g/L of sodium hydroxide, 50 g/L of sodium carbonate, and 50 g/L of sodium nitrate, and the alkaline liquid was etched under conditions of a temperature of 40 degrees Celsius and a time of 20 minutes.
  • the groove and the slit of the metal substrate are filled with glue (purchased by Loctite Corporation's Model 3211 UV glue), and then cured under ultraviolet light irradiation intensity of 800 mJ/cm 2 , thereby obtaining Communication equipment metal casing.
  • glue purchased by Loctite Corporation's Model 3211 UV glue
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 20 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 30 minutes.
  • the composition of the micro-arc oxidation electrolyte is: 0.03 mol / L sodium silicate and 0.05 mol / L hydrogen Sodium oxide.
  • the metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 30 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 40 minutes.
  • the composition of the micro-arc oxidation electrolyte was: 0.03 mol/L sodium silicate and 0.05 mol/L sodium hydroxide. The metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • Example 1 The procedure of Example 1 was followed except that in step 5), a decorative layer having a thickness of 25 ⁇ m was obtained by micro-arc oxidation.
  • the conditions of micro-arc oxidation are: oxidation temperature is 30 degrees Celsius, oxidation forward voltage is 600V, and oxidation time is 35 minutes.
  • the composition of the micro-arc oxidation electrolyte was: 0.03 mol/L sodium silicate and 0.05 mol/L sodium hydroxide. The metal casing of the communication device is similarly obtained.
  • the structure of the metal casing of the communication device prepared as described above is as shown in (h) of FIG. 1 : the outer surface of the metal casing of the communication device is covered with a decorative layer 6, and the inner surface of the metal substrate 1 is provided with a groove 3, and the metal substrate 1 is The inner surface is formed with a second protective layer 4, and a slit 8 penetrating the metal substrate 1 is formed at the bottom of the groove 3, and the filling member 9 is provided in the groove 3 and the slit 8.
  • the metal casing of the communication device has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform in appearance.
  • the metal casing of the communication device obtained by the method of the present invention has a slit (ie, an antenna slot) that is invisible in appearance, and the metal casing is neat, smooth, and uniform.
  • a decorative layer is formed on the surface of the metal substrate by one or more of electrophoresis, general anodizing, porcelain anodizing, micro-arc oxidation, and spraying, and a filler is filled in the slit to significantly increase the hardness thereof. , wear resistance, shock resistance and corrosion resistance.

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Abstract

提供了通讯设备金属外壳以及其制备方法。该通讯设备金属外壳包括：金属底材(1)，所述金属底材(1)的内表面开设有凹槽(3)，所述凹槽(3)的底部开设有贯穿所述金属底材(1)的狭缝(8)；以及装饰层(6)，所述装饰层(6)覆盖所述金属底材(1)外表面。

Description

通讯设备金属外壳以及其制备方法 技术领域
本发明涉及材料领域，具体地，本发明涉及通讯设备金属外壳以及其制备方法。
背景技术
手机天线是手机上用于接收信号的设备，目前智能手机的天线多为内置天线，这就要求手机外壳不能对信号起屏蔽作用。具有塑料外壳的手机不存在以上问题，然而由于金属外壳具有更加美观的质感、耐磨耐刮等性能，金属外壳逐渐替代塑料外壳应用于手机等通讯设备中。对于正在兴起的金属机身手机，如何解决信号屏蔽问题是其设计制造的关键之一。
目前，金属手机多采用开天线槽并注塑的方法解决其机身信号屏蔽的问题，如HTC ONE的上下两条天线槽，iphone5/5s的侧边天线槽等。上述现有技术均通过在天线槽中填充塑料来防止信号的屏蔽，但是对金属手机机身整体结构造成了一定破坏，影响了其外观整体的整洁性及连续性。同时外壳可见的塑胶破坏了机身的整体金属质感。
发明内容
本发明的目的在于克服上述现有技术中存在的问题，提供一种通讯设备金属外壳及其制备方法。本发明提供的通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
为了实现上述目的，本发明提供一种通讯设备金属外壳，其中，所述通讯设备金属外壳包括金属底材和装饰层；所述装饰层覆盖所述金属底材外表面；所述金属底材的内表面开设有凹槽，所述凹槽的底部开设有贯穿所述金属底材的狭缝。
在本发明的一个方面，本发明提出了一种通讯设备金属外壳。根据本发明的实施例，该金属外壳包括：金属底材，所述金属底材的内表面开设有凹槽，所述凹槽的底部开设有贯穿所述金属底材的狭缝；以及装饰层，所述装饰层覆盖所述金属底材外表面。由此，可以在保持金属外壳整体金属质感不受影响的同时，实现通讯的功能。
本发明还提供一种通讯设备金属外壳的制备方法，其中，该方法包括以下步骤：
1)在金属底材表面形成第一保护层；2)在所述金属底材的内表面侧形成贯穿所述第一保护层和部分金属底材的凹槽；3)除去所述第一保护层，并在所述金属底材的内表面形成第二保护层；4)在所述金属底材外表面形成装饰层；以及5)在所述凹槽底部形成贯穿所述金属底材的狭缝。由此，可以获得具有整体金属质感并且可以实现通讯的金属外壳。
换句话说，上述方法可以通过下列步骤实现：
1)在金属底材表面形成第一保护层的步骤；
2)在金属底材的内表面侧形成贯穿所述第一保护层和部分金属底材的凹槽的步骤；
3)除去所述第一保护层，并在所述金属底材的内表面形成第二保护层的步骤；
4)在所述金属底材外表面形成装饰层的步骤；
5)在所述凹槽底部形成贯穿金属底材的狭缝的步骤。
通过本发明的方法得到的通讯设备金属外壳具有狭缝，可供通讯信号穿过，实现正常的通讯功能。并且，本发明提供的通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。并且，通过电泳、普通阳极氧化、瓷质阳极氧化、硬质阳极氧化、微弧氧化和喷涂中的一种或多种在金属底材的表面形成装饰层，进而，在狭缝内填有填充件，能够显著提高其硬度、耐磨、抗震及耐蚀性能。
本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1是本发明的通讯设备金属外壳的制备过程的截面示意图。
图2是本发明一种实施方式的通讯设备金属外壳的截面示意图。
附图标记说明
1  金属底材
2  第一保护层
3  凹槽
4  第二保护层
5  遮蔽件
6  装饰层
7  开口
8  狭缝
9  填充件
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
需要说明的是，在本发明的各个方面中所描述的特征和效果可以互相适用，在此不再赘述。
在本发明的第一方面，本发明提出了一种通讯设备金属外壳。根据本发明的实施例，参考图2，该金属外壳包括：金属底材1以及装饰层6。其中，金属底材1的内表面开设有凹槽3，凹槽3的底部开设有贯穿金属底材1的狭缝8。换句话说，该通讯设备金属外壳包括金属底材1和装饰层6；所述装饰层6覆盖所述金属底材1外表面；所述金属底材1的内表面开设有凹槽3，所述凹槽的底部开设有贯穿所述金属底材的狭缝8。由此，该金属外壳可以利用狭缝8实现通讯信号的传导，并且避免了金属外壳天线槽填充塑料而造成的外壳整体不美观、金属壳体没有连续性等问题。
在本发明中，所述通讯设备例如可以为：手机、平板电脑、笔记本电脑、蓝牙耳机等。在本发明的一些实施例中，所述通讯设备金属外壳为手机金属外壳。
在本发明中，所述金属外壳的内表面定义为将其用于通讯设备中时，金属外壳朝向通讯设备内部的表面，也称为下表面。可以理解的是，金属外壳的外表面定义为将其用于通讯设备中时，金属外壳朝向外界的表面，也成为上表面。另外，用于制备金属外壳的金属底材的内外表面(上下表面)也适用于上述定义。
下面对根据本发明实施例的金属外壳的各个部分进行详细描述。
根据本发明的实施例，该金属外壳可以具有多条凹槽3，以便更好地实现通讯信号的传输。本领域技术人员能够理解的是，多条凹槽的内表面均可以开设狭缝8，此外，同一条凹槽3内还可以开设多条狭缝8。狭缝8以及凹槽3的具体数量以及对应关系不受特别限制，本领域技术人员可以根据通讯设备信号传输的具体情况对上述参数进行设置，只要凹槽3设置在金属底材1的内表面，并且狭缝8开设在凹槽3的底部并贯穿凹槽3底部的金属底材1即可。另外，需要指出的是，虽然在图2中示意地仅表示了两条狭缝，但本发明的通讯设备金属外壳显然可以具有多条狭缝。
在本发明中，凹槽和狭缝相互连通，用于保证天线与外界的信号传输，实现通讯。对于上述凹槽，该凹槽的深度可以为0.22-0.5mm，在本发明的一些实施例中，该凹槽的深度为0.22-0.4。在本发明的一些实施例中，该凹槽的深度为0.22-0.3。上述凹槽的宽度可以为2-5mm，在本发明的一些实施例中，上述凹槽的宽度为3-4mm。上述凹槽的长度可以为10-100mm，在本发明的一些实施例中，上述凹槽的长度为10-60mm。对于上述狭缝，该狭缝的深度为0.08-0.15mm，在本发明的一些实施例中，该狭缝的深度为0.08-0.12mm，在本发明的一些实施例中，该狭缝的深度为0.08-0.1mm。上述狭缝的宽度可以为30-60μm，在本发明的一些实施例中，上述狭缝的宽度为40-50μm。上述狭缝的长度可以为10-100mm；在本发明的一些实施例中，上述狭缝的长度为10-60mm。 另外，在本发明的一些实施例中，所述狭缝的长度与所述的凹槽的长度相同。关于上述凹槽以及狭缝的长度、深度以及宽度的具体参数，本领域技术人员可以根据通讯设备信号传输的具体情况进行选择。发明人发现，当上述凹槽以及狭缝的尺寸过大时，会对该金属底材1的整体力学强度造成影响，使得金属外壳容易在使用过程中发生变形、断裂等问题；而当上述凹槽以及狭缝的尺寸过小时，则易对通讯设备的信号传输造成不利影响。发明人经过大量使用发现，当凹槽以及狭缝的尺寸为上述范围内时，可以保证实现目前大多数通讯设备的信号传输，并且金属外壳能够保持可靠的力学强度。
需要说明的是，图2中显示的是根据本发明实施例的金属外壳的截面图，沿图中水平方向为凹槽以及狭缝的宽度，沿图中竖直方向的为凹槽以及狭缝的深度，狭缝以及凹槽的长度在图2中未示出。
另外，凹槽和狭缝的条数没有特别的限定，只要能够实现通讯即可，例如可以为1-200条，在本发明的一些实施例中，所述凹槽和狭缝的条数为5-50条。此外，当所述凹槽和狭缝为多条时，相邻两条凹槽之间的间距可以为2-5mm，在本发明的一些实施例中，相邻两条凹槽之间的间距为2-3mm。
在本发明中，所述金属底材的材质可以为本领域通常用于通讯设备的各种金属，例如可以为铝合金、不锈钢、镁合金或钛合金等；在本发明的一些实施例中，所述金属底材的材质为铝合金。
所述金属底材的厚度没有特别的限定，本领域技术人员可以根据具体的通讯设备适当地进行选择。例如所述金属底材的厚度可以为0.3-0.6mm，在本发明的一些实施例中，所述金属底材的厚度为0.3-0.5mm；在本发明的一些实施例中，所述金属底材的厚度为0.3-0.4mm。由此，可以在保证该金属底材具有一定的力学强度的同时，满足目前通讯设备对于外壳厚度趋于纤薄的要求。
根据本发明，装饰层6覆盖金属底材1的外表面。具体地，在金属底材1的外表面形成有装饰层6。装饰层6可以覆盖金属底材1的全部外表面，也可以覆盖金属底材1外表面的一部分。根据本发明的实施例，装饰层6覆盖狭缝8，以便使狭缝8在金属底材外表面不可见，进而可以使该金属外壳更加美观。也即是说，所述通讯设备金属外壳还具有位于金属底材外表面的装饰层，所述装饰层覆盖所述狭缝。
作为上述装饰层可以为通过电泳、普通阳极氧化、硬质阳极氧化、微弧氧化和喷涂中的一种或多种形成的装饰层。本领域技术人员可以根据金属底材1的具体材质在上述范围内选择形成装饰层6的方法。
根据本发明，对所述装饰层的厚度没有特别的限定，可以为本领域的常规厚度。例如所述装饰层的厚度可以为15-35μm，在本发明的一些实施例中，所述装饰层的厚度为 25-35μm。由此，可以在覆盖狭缝8的同时，保持金属外壳具有金属底材1的金属质感。
根据本发明，该通讯设备金属外壳可以进一步包括保护层4。保护层4覆盖金属底材1内表面除狭缝8以外的区域。换句话说，在本发明的一些实施例中，所述通讯设备金属外壳还包括保护层4，所述保护层覆盖所述金属底材内表面的除狭缝以外的区域。由此，可以利用保护层4对金属底材1的内表面进行保护，从而可以增强该金属外壳的整体力学性能。
在本发明中，作为上述保护层可以为通过电泳和/或喷涂形成的保护层。对所述保护层的厚度没有特别的限定，例如所述保护层的厚度可以为5-25μm，在本发明的一些实施例中，所述保护层的厚度为5-15μm。发明人经过大量实验发现，当保护层的厚度处于上述范围内时，可以为金属底材1提供有效的额外保护，并且不会影响通讯信号的传输。
此外，参考图1h，该通讯设备金属外壳还可以进一步包括填充件9。也即是说，在本发明的一些实施例中，所述通讯设备金属外壳还包括填充件，所述填充件位于所述凹槽和所述狭缝中。由此，可以利用填充件提高该金属外壳的整体力学性能，缓解凹槽以及狭缝处由于金属底材的厚度偏薄而造成的力学强度下降。
根据本发明的实施例，上述填充件9是由紫外光固化胶形成的。换句话说，在本发明的一些实施例中，所述填充件是通过UV胶水固化形成的填充件。所述UV胶水例如为购于乐泰公司的3211型号的UV胶水。
如图1中的(h)所示，在本发明的一个实施例中，所述通讯设备金属外壳包括金属底材1、装饰层6、保护层4和填充件9；所述装饰层6覆盖所述金属底材1外表面；所述金属底材1的内表面开设有凹槽3；所述凹槽的底部开设有贯穿所述金属底材的狭缝8；所述保护层4覆盖所述金属底材1内表面的除狭缝8以外的区域；所述填充件9位于所述凹槽3和所述狭缝8中。
在本发明的另一方面，本发明提出了一种制备通讯设备金属外壳的方法。根据本发明的实施例，该方法包括：
1)形成第一保护层
根据本发明的实施例，在该步骤中，在金属底材的表面形成第一保护层。在本发明中，对于所使用的金属底材的厚度没有特别的限定，本领域技术人员可以根据具体的通讯设备适当地进行选择。例如所述金属底材的厚度可以为0.3-0.6mm，在本发明的一些实施例中，所述金属底材的厚度为0.3-0.5mm，在本发明的一些实施例中，所述金属底材的厚度为0.3-0.4mm。
所述金属底材的材质可以为本领域通常用于通讯设备的各种金属，例如可以为铝合 金、不锈钢、镁合金或钛合金等；在本发明的一些实施例中，所述金属底材的材质为铝合金。
根据本发明的实施例，在该步骤中，在金属底材1的内表面以及外表面均形成有第一保护层2。在本步骤中，在本发明的一些实施例中，所述第一保护层为UV油墨层。也就是说，如图1中的(a)所示，通过步骤1)得到的金属底材的结构为：在金属底材1的上下表面形成有第一保护层(UV油墨层)2。
在金属底材表面形成UV油墨层的方法可以采用本领域常用的各种方法和条件，例如可以在位于所述金属底材表面上喷涂UV油墨后，在70-90摄氏度下烘烤20-30分钟。
上述UV油墨可以使用本领域常用的各种UV油墨，例如可以为5680系UV油墨。
在本发明中，通过上述方法形成的油墨层的厚度没有特别的限定，可以为本领域的常规厚度，例如该厚度可以为10-30μm，在本发明的一些实施例中，所述油墨层的厚度为15-25μm。
2)形成凹槽
根据本发明的实施例，参考图1(b)，本步骤用于在所述金属底材的内表面开设所述凹槽，如上所述，该凹槽贯穿所述第一保护层和部分金属底材的凹槽，也即，所述凹槽贯穿所述第一保护层但不完全贯穿所述金属底材，由此在金属底材内表面开设凹槽。
在本发明中，只要是能够在金属底材内表面开设所述凹槽的方法即可，对于开设凹槽的方法没有特别的限定，可以是本领域常规使用的方法。在本发明的一些实施例中，在该步骤中，通过紫外光曝光对步骤1)中形成的UV油墨层进行曝光，从而在金属底材的外表面曝光显影出1条以上的底材带，以便暴露底材带处的金属底材，然后通过蚀刻该区域的金属底材形成所述凹槽。需要说明的是，上述底材带的数目由需要形成的凹槽的数目决定，本领域技术人员可以根据实际情况对上述底材带的数量进行调控。
上述底材带的宽度可以为2-5mm，在本发明的一些实施例中，上述底材带的宽度为3-4mm。在本发明的一些实施例中，所述底材带的长度为10-100mm，在本发明的一些实施例中，所述底材带的长度为10-60mm。在所述底材带为多条时，相邻两条底材带之间的间距为2-5mm，在本发明的一些实施例中，相邻两条底材带之间的间距为2-3mm。
在本发明中，通过步骤2)在金属底材的外表面上形成所述凹槽，也即通过所述蚀刻对所述金属的底材带区域的金属进行蚀刻，在金属底材的底材带区域形成凹槽。在本发明的一些实施例中，通过蚀刻，使得所述底材带区域的金属底材厚度的厚度为0.08-0.15mm；在本发明的一些实施例中，通过蚀刻，使得所述底材带区域的金属底材厚度的厚度为0.08-0.12mm；在本发明的一些实施例中，通过蚀刻，使得所述底材带区 域的金属底材厚度的厚度为0.08-0.1mm。
在本发明中，所述蚀刻只要能够达到上述目的即可，可以采用本领域常规的蚀刻的方法。在本发明的一些实施例中，步骤2)中，所述蚀刻包括酸性蚀刻液蚀刻和碱性蚀刻液蚀刻。
在本发明的一些实施例中，上述酸性蚀刻液为三氯化铁、盐酸和水的混合溶液。在本发明的一些实施例中，相对于100g水，所述三氯化铁可以为550-600g，盐酸可以为30-50g。另外，上述酸性蚀刻液蚀刻的条件包括：温度为10-35摄氏度，时间为8-10分钟。
在本发明的一些实施例中，上述碱性蚀刻液为含有50-60g/L氢氧化钠、50-60g/L碳酸钠和50-60g/L硝酸钠的溶液。另外，上述碱性蚀刻液蚀刻的条件包括：温度为35-45摄氏度，时间为20-40分钟。
如图1中的(b)所示，通过上述步骤2)得到的金属底材的结构为：金属底材1的内表面开设有所述凹槽3，金属底材1的凹槽3以外的表面覆盖有第一保护层(UV油墨层)2。
3)形成第二保护层
根据本发明的实施例，在该步骤中，除去第一保护层，并在金属底材的内表面形成第二保护层。
具体地，在本步骤中，先要除去所述第一保护层，得到具有所述凹槽的金属底材。除去所述第一保护层后的金属底材的结构如图1中的(c)所示。对于除去所述第一保护层的方法可以为本领域常规的各种方法。例如，在所述第一保护层为UV油墨层时，可以在温度为10-35摄氏度下，将具有第一保护层的金属底材在脱漆剂中浸泡10-20min，所述脱漆剂例如可以为购于东莞市四辉表面处理科技有限公司的SH-665型号的脱漆剂。
在除去所述第一保护层后，为了仅在所述金属底材的内表面形成第二保护层，需要在将所述金属底材的外表面使用遮蔽件进行遮蔽的条件下形成所述第二保护层。
作为将所述金属底材的外表面进行遮蔽的遮蔽件可以采用本领域的常用的各种遮蔽件。所述遮蔽件例如可以为绝缘胶带。另外，所述绝缘胶带可以购于深圳市西盟特电子有限公司。
作为形成所述第二保护层的方法没有特别的限定，在本发明的一些实施例中，在本步骤中，通过电泳和/或喷涂来形成所述第二保护层。
作为所述电泳的条件可以包括：温度为29-31摄氏度，电泳电压为120-140V，pH为7-9，时间为1-3min。另外，所述电泳的电泳液可以为含有日本清水株式会社的哑光 漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的电泳液，其中，日本清水株式会社的哑光漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的重量比可以为0-4：1，在本发明的一些实施例中，日本清水株式会社的哑光漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的重量比为7：3。另外，电泳液的固含量可以为8-15重量％，在本发明的一些实施例中，电泳液的固含量为13重量％。
所述喷涂是指在金属基材表面的喷涂一层或多层的有机或无机物涂层，涂层厚度可以控制在10-25μm。所述喷涂的涂料例如可以为环氧树脂。
在本发明中，通过上述方法形成的第二保护层的厚度可以为5-25μm，在本发明的一些实施例中，通过上述方法形成的第二保护层的厚度为5-15μm。
如图1中的(d)所示，通过上述步骤3)得到的金属底材的的结构为：金属底材1的外表面遮蔽有遮蔽件5，金属底材1的内表面形成有第二保护层4。
4)形成装饰层
根据本发明的实施例，在该步骤中，在金属底材的外表面形成装饰层。也即是说，本步骤用于在步骤3)得到的金属底材的外表面形成装饰层。
在本步骤中，先要去除所述金属底材的外表面的遮蔽件，然后在所述金属底材的外表面形成装饰层。所述装饰层可以采用本领域的常规方法和条件进行，例如可以通过电泳、普通阳极氧化、瓷质阳极氧化、硬质阳极氧化、微弧氧化和喷涂中的一种或多种在金属底材的表面形成装饰层。根据本发明，所述装饰层的厚度可以为15-35μm。
作为所述电泳的条件可以包括：温度为28-32摄氏度，电压为140-200V，时间为1-3min，pH为7-9。另外，所述电泳的电泳液可以为含有日本清水株式会社的哑光漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的电泳液，其中，日本清水株式会社的哑光漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的重量比可以为0-4：1，在本发明的一些实施例中，日本清水株式会社的哑光漆(WNO-1)和日本清水株式会社的亮光漆(NNO-4)的重量比为7：3。另外，电泳液的固含量可以为8-15重量％，在本发明的一些实施例中，电泳液的固含量为13重量％。通过上述电泳方法形成的装饰层厚度通常为25-35μm。
作为所述普通阳极氧化的条件可以包括：阳极电压为13-17V，温度为17-21摄氏度，氧化时间为30-60min。另外，阳极氧化液为180-200g/L硫酸。通过上述阳极氧化方法形成的装饰层厚度通常为15-25μm。
作为所述硬质阳极氧化的条件可以包括：电流密度为4A/dm2，时间为30-60min，温度为5-10摄氏度，电解液为180-200g/L硫酸和5-15g/L草酸。通过上述硬质阳极氧化方法形成的装饰层厚度通常为25-45μm。
作为所述瓷质阳极氧化的条件可以包括：电压为80-120V，氧化时间为30-60min，氧化温度为30-50摄氏度。另外，瓷质阳极电解液为40-50g/L草酸钛钾、1-4g/L草酸、6-10g/L硼酸以及0.5-2g/L柠檬酸。通过上述瓷质阳极氧化方法形成的装饰层厚度通常为15-30μm。
作为所述微弧氧化的条件可以包括：氧化温度为20-30摄氏度，氧化正向电压：400-600V，氧化时间40-100min。另外，微弧氧化电解液的组成为：0.02-0.05mol/L硅酸钠和0.03-0.07mol/L氢氧化钠。通过上述微弧氧化方法形成的装饰层厚度通常为15-40μm。
所述喷涂是指在金属基材表面的喷涂一层或多层的有机或无机物涂层，涂层厚度可以控制在10-50μm。所述喷涂的涂料例如可以为环氧树脂。
此外，根据本发明，在步骤4)中，在本发明的一些实施例中，在金属底材的表面形成装饰层之前，对所述金属底材进行前处理，以清洁表面脏污及提高表面光泽。
在本发明的一些实施例中，所述前处理的方法采用以下步骤进行：
(1)在50-70摄氏度下，将金属底材在碱蚀液中进行碱蚀1-2min，然后用去离子水清洗2次；
(2)在10-35摄氏度下，在出光液中出光3-5min，然后用去离子水清洗2次；
(3)在10-35摄氏度下，在化抛液中抛光10-30s，然后用去离子水清洗2次。
在本发明的一些实施例中，上述碱蚀液为15-20g/L氢氧化钠溶液；在本发明的一些实施例中，上述出光液为200-300ml/L硝酸溶液；在本发明的一些实施例中，所述化抛液为含有650-750ml/L磷酸和350-250ml/L硫酸的溶液。
如图1中的(e)所示，通过上述步骤4)得到的金属底材的结构为：金属底材1的外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，且金属底材1的内表面形成有第二保护层4。
5)形成狭缝
根据本发明的实施例，在本步骤中，在凹槽的底部形成贯穿金属底材的狭缝。在本步骤中，可以采用本领域常规的方法在所述凹槽底部形成贯穿金属底材的狭缝。在本发明的一些实施例中，本步骤在所述凹槽底部形成贯穿金属底材的狭缝的步骤包括：
(1)在所述凹槽底部的第二保护层上形成开口以暴露所述金属底材的金属；
(2)对暴露的金属底材进行碱性蚀刻液蚀刻，以形成狭缝。
需要说明的是，在本发明的一些实施例中，通过激光在所述凹槽底部的第二保护层上形成开口。激光形成开口的条件可以为：功率70％，走光速度3000mm/s，频率80KHz。
另外，在本发明的一些实施例中，在凹槽内形成的开口的长度与凹槽的长度相同。 所述开口的宽度可以为30-60μm；优选为30-40μm。
如图1中的(f)所示，通过上述步骤(1)得到的金属底材的结构为：金属底材1的外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，第二保护层在凹槽3底部具有开口7。
在上述步骤中，所述碱性蚀刻液为含有50-60g/L氢氧化钠、50-60g/L碳酸钠以及50-60g/L硝酸钠的溶液，所述碱性液蚀刻的条件包括：温度为35-45摄氏度，时间为10-20分钟。
如图1中的(g)所示，通过上述步骤(2)得到的金属底材的结构为：金属底材1的外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8。
此外，为了进一步提高利用该方法制备的金属外壳的整体力学性能，该方法还可以进一步包括：
6)形成填充件
根据本发明的实施例，在该步骤中，在凹槽以及狭缝中形成填充件，以便缓解由于凹槽和狭缝处金属底材较薄而造成的力学性能下降。上述填充件可以是由紫外光固化胶(又称为UV胶水)形成的。也即是说，在本发明的一些实施例中，本发明的通讯设备金属外壳的制备方法还包括，步骤6)：在所述凹槽和所述狭缝中填充UV胶水并固化的步骤。
根据本发明，在所述凹槽和所述狭缝中填充UV胶水之前，可以除去或不除去所述第二保护层。
所述UV胶水可以为本领域常用的各种UV胶水，所述UV胶水例如为购于乐泰公司的3211型号的UV胶水。另外，所述UV胶水的固化方法可以采用本领域常规方法进行，例如可以为紫外光曝光。所述紫外光曝光的条件为本领域所公知，在此不在累述。
如图1中的(h)所示，通过上述步骤6)得到的金属底材的结构为：金属底材1的外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9(也即被填充件9填充)。
综上所述，上述制备金属外壳的方法包括以下步骤：
1)在金属底材表面形成第一保护层的步骤；
2)在金属底材的内表面侧形成贯穿所述第一保护层和部分金属底材的凹槽的步骤；
3)除去所述第一保护层，并在所述金属底材的内表面形成第二保护层的步骤；
4)在所述金属底材外表面形成装饰层的步骤；
5)在所述凹槽底部形成贯穿金属底材的狭缝的步骤。
利用该方法制备的金属外壳外观能够保持金属的质感以及一致性，并且具有一定的力学强度，同时可以保证各类通讯信号的顺利传输。
以下将通过实施例对本发明进行详细描述。但本发明并不仅限于下述实施例。另外，如无特殊说明，未具体记载条件或者步骤的方法均为常规方法，所采用的试剂和材料均可从商业途径获得。
实施例1
1)将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属底材。在金属底材表面喷涂5680系UV油墨(购于深圳万佳原精化科技股份有限公司，以下相同)后，然后在80摄氏度下烘烤25分钟后，进行紫外曝光(曝光条件为时间2min，光强度为800mJ/cm2)，形成2条2mm宽的底材带，其中，所述底材带的长度为75mm，相邻两条底材带之间的间距为3mm。另外，形成的UV油墨层的厚度为20μm。
2)将步骤1)得到的金属底材进行酸性蚀刻液蚀刻后，再进行碱性蚀刻液蚀刻。其中，所述酸性蚀刻液为550g的三氯化铁、30g的盐酸以及100g的水的混合溶液，所述酸性蚀刻液蚀刻的条件为：温度为30摄氏度，时间为10分钟；所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠和50g/L硝酸钠的溶液，所述碱性蚀刻液蚀刻的条件为：温度为40摄氏度，时间为33分钟。由此，得到在金属底材的内表面开设有凹槽的金属底材，其中，所述凹槽的宽度为2mm左右，凹槽区域的金属底材厚度为0.08mm左右，凹槽的长度为75mm，相邻凹槽之间的间距为2mm。
3)通过在购于东莞市四辉表面处理科技有限公司的SH-665型号的脱漆剂中侵泡15min除去所述金属底材表面的油墨层。
4)用绝缘胶带(购于深圳市西盟特电子有限公司，以下相同)将所述金属底材的外表面遮蔽，并通过电泳在所述金属底材的内表面形成厚度为10μm的保护层；其中，电泳液为：日本清水株式会社的哑光漆(WNO-1)：日本清水株式会社的亮光漆(NNO-4)＝7：3(重量比，电泳液的固含量为13重量％)，电泳的条件为电压为140V，时间为1min，温度为30摄氏度，pH为7.8。
5)去除所述金属底材的外表面的绝缘胶带，并通过电泳在所述金属底材的外表面形成厚度为30μm的装饰层。其中，电泳液为：日本清水株式会社的哑光漆(WNO-1)： 日本清水株式会社的亮光漆(NNO-4)＝7：3(重量比，电泳液的固含量为13重量％)，电泳的条件为：温度为30摄氏度，电压为160V，时间为2min，pH为7.8。
6)通过激光在凹槽底部的保护层上形成30μm宽的开口以露出金属底材的金属(在凹槽内形成的开口的长度与凹槽的长度相同)；其中，激光的条件为：功率70％，走光速度3000mm/s，频率80KHz。
7)对步骤6)中所述30μm宽的开口露出的金属底材进行碱性蚀刻液蚀刻除去30μm宽的开口处残留的金属，以形成宽度为30μm的狭缝，其中，所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠以及50g/L硝酸钠的溶液，所述碱性液蚀刻的条件包括：温度为40摄氏度，时间为12分钟。
8)在所述金属底材的凹槽和狭缝中填充胶水(购于乐泰公司的3211型号的UV胶水)后在紫外光照射强度为800mJ/cm2的条件下进行固化，由此得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
实施例2
1)将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属底材。在金属底材表面喷涂5680系UV油墨后，然后在80摄氏度下烘烤25分钟后，进行紫外曝光(曝光条件为时间2min，光强度为800mJ/cm2)，形成2条3mm宽的底材带，其中，所述底材带的长度为75mm，相邻两条底材带之间的间距为3mm。另外，形成的UV油墨层的厚度为20μm。
2)将步骤1)得到的金属底材进行酸性蚀刻液蚀刻后，在进行碱性蚀刻液蚀刻。其中，所述酸性蚀刻液为550g的三氯化铁、30g的盐酸和100g的水的混合溶液，所述酸性蚀刻液蚀刻的条件为：温度为30摄氏度，时间为10钟；所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠以及50g/L硝酸钠的溶液，所述碱性蚀刻液蚀刻的条件为：温度为40摄氏度，时间为27分钟。由此，得到在金属底材的内表面开设有凹槽的金属底材，其中，所述凹槽的宽度为3mm左右，凹槽区域的金属底材厚度为0.12mm左右，凹槽的长度为75mm，相邻凹槽之间的间距为3mm。
3)通过在购于东莞市四辉表面处理科技有限公司的SH-665型号的脱漆剂中侵泡10min除去所述金属底材表面的油墨层。
4)用绝缘胶带将所述金属底材的外表面遮蔽，并通过电泳在所述金属底材的内表面形成厚度为10μm的保护层；其中，电泳液为：日本清水株式会社的哑光漆(WNO-1)：日本清水株式会社的亮光漆(NNO-4)＝7：3(重量比，电泳液的固含量为13重量％)，所述电泳的条件为电压为140V，时间为1min，温度为30摄氏度，pH为7.8。
5)去除所述金属底材的外表面的绝缘胶带，并通过普通阳极氧化得到厚度为20μm的装饰层。其中，普通阳极氧化的条件为：阳极电压为15V，温度为19摄氏度，氧化时间为50min。另外，阳极氧化液为190g/L硫酸。
6)通过激光在凹槽底部的保护层上形成50μm宽的开口以露出金属底材的金属(在凹槽内形成的开口的长度与凹槽的长度相同)；其中，激光的条件为：功率70％，走光速度3000mm/s，频率80KHz。
7)对步骤6)中所述50μm宽的开口露出的金属底材进行碱性蚀刻液蚀刻除去50μm宽的开口处残留的金属，以形成宽度为50μm的狭缝，其中，所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠以及50g/L硝酸钠的溶液，所述碱性液蚀刻的条件包括：温度为40摄氏度，时间为17分钟。
8)在所述金属底材的凹槽和狭缝中填充胶水(购于乐泰公司的3211型号的UV胶水)后在紫外光照射强度为800mJ/cm2的条件下进行固化，由此得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
实施例3
1)将铝合金(购于东莞市港祥金属材料有限公司公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属底材。在金属底材表面喷涂5680系UV油墨后，然后在80摄氏度下烘烤25分钟后，进行紫外曝光(曝光条件为时间2min，光强度为800mJ/cm2)，形成2条5mm宽的底材带，其中所述底材带的长度为75mm，相邻两条底材带之间的间距为3mm。另外，形成的UV油墨层的厚度为20μm。
2)将步骤1)得到的金属底材进行酸性蚀刻液蚀刻后，在进行碱性蚀刻液蚀刻。其中，所述酸性蚀刻液为550g的三氯化铁、30g的盐酸和100g的水的混合溶液，所述酸性蚀刻液蚀刻的条件为：温度为30摄氏度，时间为10分钟；所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠以及50g/L硝酸钠的溶液，所述碱性蚀刻液蚀刻的条件 为：温度为40摄氏度，时间为24分钟。由此，得到在金属底材的内表面开设有凹槽的金属底材，其中，所述凹槽的宽度为5mm左右，凹槽区域的金属底材厚度为0.15mm左右，凹槽的长度为75mm，相邻凹槽之间的间距为3mm。
3)通过在购于东莞市四辉表面处理科技有限公司的SH-665型号的脱漆剂中侵泡10min除去所述金属底材表面的油墨层。
4)用绝缘胶带将所述金属底材的外表面遮蔽，并通过电泳在所述金属底材的内表面形成厚度为10μm的保护层；其中，电泳液为：日本清水株式会社的哑光漆(WNO-1)：日本清水株式会社的亮光漆(NNO-4)＝7：3(重量比，电泳液的固含量为13重量％)，所述电泳的条件为电压为140V，时间为1min，温度为30摄氏度，pH为7.8。
5)去除所述金属底材的外表面的绝缘胶带，并通过瓷质阳极氧化得到厚度为35μm的装饰层。其中，瓷质阳极氧化的条件为电压为100V，氧化时间为50min，氧化温度为40摄氏度。另外，瓷质阳极电解液为15g/L草酸钛钾、9g/L草酸、8g/L硼酸以及1g/L柠檬酸。
6)通过激光在凹槽底部的保护层上形成60μm宽的开口以露出金属底材的金属(在凹槽内形成的开口的长度与凹槽的长度相同)；其中，激光的条件为：功率70％，走光速度3000mm/s，频率80KHz。
7)对步骤6)中所述60μm宽的开口露出的金属底材进行碱性蚀刻液蚀刻除去60μm宽的开口处残留的金属，以形成宽度为60μm的狭缝，其中，所述碱性蚀刻液为含有50g/L氢氧化钠、50g/L碳酸钠以及50g/L硝酸钠的溶液，所述碱性液蚀刻的条件包括：温度为40摄氏度，时间为20分钟。
8)在所述金属底材的凹槽和狭缝中填充胶水(购于乐泰公司的3211型号的UV胶水)后在紫外光照射强度为800mJ/cm2的条件下进行固化，由此得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
实施例4
按照实施例1的方法进行，不同的是，在步骤5)中，通过微弧氧化得到厚度为20μm的装饰层。其中，微弧氧化的条件为：氧化温度为30摄氏度，氧化正向电压为600V，氧化时间为30min。另外，微弧氧化电解液的组成为：0.03mol/L硅酸钠和0.05mol/L氢 氧化钠。同样地得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
实施例5
按照实施例1的方法进行，不同的是，在步骤5)中，通过微弧氧化得到厚度为30μm的装饰层。其中，微弧氧化的条件为：氧化温度为30摄氏度，氧化正向电压为600V，氧化时间为40min。另外，微弧氧化电解液的组成为：0.03mol/L硅酸钠和0.05mol/L氢氧化钠。同样地得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
实施例6
按照实施例1的方法进行，不同的是，在步骤5)中，通过微弧氧化得到厚度为25μm的装饰层。其中，微弧氧化的条件为：氧化温度为30摄氏度，氧化正向电压为600V，氧化时间为35min。另外，微弧氧化电解液的组成为：0.03mol/L硅酸钠和0.05mol/L氢氧化钠。同样地得到通讯设备金属外壳。
上述制备得到的通讯设备金属外壳的结构如图1中的(h)所示：通讯设备金属外壳外表面覆盖有装饰层6，金属底材1的内表面开设有凹槽3，金属底材1的内表面形成有第二保护层4，在凹槽3底部开设有贯穿金属底材1的狭缝8，且凹槽3和狭缝8内具有填充件9。该通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。
通过上述实施例可知，通过本发明的方法得到的通讯设备金属外壳其狭缝(即天线槽)外观不可见，金属外壳表观整洁光滑平整一致。并且，通过电泳、普通阳极氧化、瓷质阳极氧化、微弧氧化和喷涂中的一种或多种在金属底材的表面形成装饰层，在狭缝内填有填充件，能够显著提高其硬度、耐磨、抗震及耐蚀性能。
以上详细描述了本发明的一些实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
在本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本发明对各种可能的组合方式不再另行说明。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。

Claims (47)

  1. 一种通讯设备金属外壳，其特征在于，包括：
    金属底材，所述金属底材的内表面开设有凹槽，所述凹槽的底部开设有贯穿所述金属底材的狭缝；以及
    装饰层，所述装饰层覆盖所述金属底材外表面。
  2. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述凹槽的深度为0.22-0.5mm。
  3. 根据权利要求2所述的通讯设备金属外壳，其特征在于，所述凹槽的深度为0.22-0.4mm。
  4. 根据权利要求3所述的通讯设备金属外壳，其特征在于，所述凹槽的深度为0.22-0.3mm。
  5. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述凹槽的宽度为2-5mm。
  6. 根据权利要求5所述的通讯设备金属外壳，其特征在于，所述凹槽的宽度为3-4mm。
  7. 根据权利要求1所述的通讯设备金属外壳，其特征在于，所述凹槽的长度为10-100mm。
  8. 根据权利要求7所述的通讯设备金属外壳，其特征在于，所述凹槽的长度为10-60mm。
  9. 根据权利要求1-8任一项所述的通讯设备金属外壳，其特征在于，具有多条所述凹槽，相邻两条所述凹槽之间的间距为2-5mm。
  10. 根据权利要求1-9任一项所述的通讯设备金属外壳，其特征在于，所述狭缝的深度为0.08-0.15mm。
  11. 根据权利要求10所述的通讯设备金属外壳，其特征在于，所述狭缝的深度为0.08-0.12mm。
  12. 根据权利要求11所述的通讯设备金属外壳，其特征在于，所述狭缝的深度为0.08-0.1mm。
  13. 根据权利要求1-12任一项所述的通讯设备金属外壳，其特征在于，所述狭缝的宽度为30-60μm。
  14. 根据权利要求13所述的通讯设备金属外壳，其特征在于，所述狭缝的宽度为40-50μm。
  15. 根据权利要求1-14任一项所述的通讯设备金属外壳，其特征在于，所述狭缝的长度为10-100mm。
  16. 根据权利要求15所述的通讯设备金属外壳，其特征在于，所述狭缝的长度为 10-60mm。
  17. 根据权利要求1-16任一项所述的通讯设备金属外壳，其特征在于，所述装饰层的厚度为15-35μm。
  18. 根据权利要求1-17任一项所述的通讯设备金属外壳，其特征在于，所述通讯设备金属外壳进一步包括：
    保护层，所述保护层覆盖所述金属底材内表面除狭缝以外的区域。
  19. 根据权利要求18所述的通讯设备金属外壳，其特征在于，所述保护层的厚度为5-25μm。
  20. 根据权利要求1-19任一项所述的通讯设备金属外壳，其特征在于，所述金属底材是由铝合金、不锈钢、镁合金以及钛合金的至少之一形成的。
  21. 根据权利要求1-20任一项所述的通讯设备金属外壳，其特征在于，所述金属底材的厚度为0.3-0.6mm。
  22. 根据权利要求21所述的通讯设备金属外壳，其特征在于，所述金属底材的厚度为0.3-0.5mm。
  23. 根据权利要求22所述的通讯设备金属外壳，其特征在于，所述金属底材的厚度为0.3-0.4mm。
  24. 根据权利要求1-23任一项所述的通讯设备金属外壳，其特征在于，所述通讯设备金属外壳进一步包括：
    填充件，所述填充件位于所述凹槽和所述狭缝中。
  25. 根据权利要求24所述的通讯设备金属外壳，其特征在于，所述填充件是由紫外光固化胶形成的。
  26. 根据权利要求1-25任一项所述的通讯设备金属外壳，其特征在于，所述装饰层通过电泳、普通阳极氧化、瓷质阳极氧化、硬质阳极氧化、微弧氧化和喷涂中的一种或多种形成。
  27. 根据权利要求18-26任一项所述的通讯设备金属外壳，其特征在于，所述保护层通过电泳和/或喷涂形成。
  28. 一种通讯设备金属外壳的制备方法，其特征在于，该方法包括：
    1)在金属底材表面形成第一保护层；
    2)在所述金属底材的内表面形成凹槽，所述凹槽贯穿所述第一保护层和部分金属底材；
    3)除去所述第一保护层，并在所述金属底材的内表面形成第二保护层；
    4)在所述金属底材外表面形成装饰层；以及
    5)在所述凹槽底部形成贯穿所述金属底材的狭缝。
  29. 根据权利要求28所述的方法，其中，步骤1)中，所述第一保护层为UV油墨层。
  30. 根据权利要求29所述的方法，其特征在于，所述UV油墨层的厚度为10-30μm。
  31. 根据权利要求28-30任一项所述的方法，其特征在于，步骤2)中，所述凹槽是通过以下步骤形成的：
    对所述金属底材的内表面的所述UV油墨层曝光显影出至少一条底材带，通过蚀刻所述底材带区域的所述金属底材以便形成所述凹槽。
  32. 根据权利要求31所述的方法，其特征在于，通过蚀刻，使得所述底材带区域的金属底材厚度为0.08-0.15mm。
  33. 根据权利要求31或32所述的方法，其特征在于，相邻两条所述底材带之间的间距为2-5mm。
  34. 根据权利要求31所述的方法，其特征在于，所述底材带的宽度为2-5mm。
  35. 根据权利要求31所述的方法，其特征在于，所述底材带的长度为10-100mm。
  36. 根据权利要求28-35任一项所述的方法，其特征在于，步骤2)中，所述蚀刻包括酸性蚀刻液蚀刻和碱性蚀刻液蚀刻，
    其中，所述酸性蚀刻液为三氯化铁、盐酸和水的混合溶液，所述酸性蚀刻液蚀刻的条件包括：温度为10-35摄氏度，时间为8-12分钟；
    所述碱性蚀刻液为含有50-60g/L氢氧化钠、50-60g/L碳酸钠和50-60g/L硝酸钠的溶液，所述碱性蚀刻液蚀刻的条件包括：温度35-45摄氏度，时间为20-40min。
  37. 根据权利要求28-36任一项所述的方法，其特征在于，步骤3)中，形成所述第二保护层之前，预先将所述金属底材的外表面遮蔽，然后通过电泳和/或喷涂形成所述第二保护层。
  38. 根据权利要求28-37任一项所述的方法，其特征在于，所述第二保护层的厚度为5-25μm。
  39. 根据权利要求28-38任一项所述的方法，其特征在于，步骤4)中，通过电泳、普通阳极氧化、瓷质阳极氧化、硬质阳极氧化、微弧氧化和喷涂中的一种或多种形成所述装饰层。
  40. 根据权利要求28-39任一项所述的方法，其特征在于，所述装饰层的厚度为15-35μm。
  41. 根据权利要求28-40任一项所述的方法，其特征在于，步骤5)中，在所述凹槽底部形成贯穿所述金属底材的狭缝的步骤包括：
    (5-1)在所述凹槽底部的第二保护层上形成开口以暴露所述金属底材；
    (5-2)对暴露的所述金属底材进行碱性蚀刻液蚀刻，以形成所述狭缝。
  42. 根据权利要求41所述的方法，其特征在于，所述开口的宽度为30-60μm。
  43. 根据权利要求41或42所述的方法，其特征在于，通过激光在所述凹槽底部的保护层上形成所述开口。
  44. 根据权利要求41-43任一项所述的方法，其特征在于，所述碱性蚀刻液为含有50-60g/L氢氧化钠、50-60g/L碳酸钠以及50-60g/L硝酸钠的溶液，
    所述碱性液蚀刻的条件包括：温度为35-45摄氏度，时间为10-20分钟。
  45. 根据权利要求28-44任一项所述的方法，其特征在于，该方法还包括：
    6)在所述凹槽和所述狭缝中填充紫外光固化胶并固化。
  46. 根据权利要求28-45任一项所述的方法，其特征在于，所述金属底材是由铝合金、不锈钢、镁合金以及钛合金的至少之一形成的。
  47. 根据权利要求28-46任一项所述的方法，其特征在于，所述金属底材的厚度为0.3-0.6mm。
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