WO2017005138A1 - 热超导散热器及其制造方法 - Google Patents

热超导散热器及其制造方法 Download PDF

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Publication number
WO2017005138A1
WO2017005138A1 PCT/CN2016/088096 CN2016088096W WO2017005138A1 WO 2017005138 A1 WO2017005138 A1 WO 2017005138A1 CN 2016088096 W CN2016088096 W CN 2016088096W WO 2017005138 A1 WO2017005138 A1 WO 2017005138A1
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WO
WIPO (PCT)
Prior art keywords
superconducting heat
thermal superconducting
pipe
thermal
heat sink
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Application number
PCT/CN2016/088096
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English (en)
French (fr)
Inventor
仝爱星
斯正明
Original Assignee
浙江嘉熙光电设备制造有限公司
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Application filed by 浙江嘉熙光电设备制造有限公司 filed Critical 浙江嘉熙光电设备制造有限公司
Priority to US15/739,989 priority Critical patent/US10727149B2/en
Publication of WO2017005138A1 publication Critical patent/WO2017005138A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F28F3/14—Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits

Definitions

  • the invention relates to a heat sink for high-power electronic device heat dissipation, in particular to a heat superconducting heat sink and a manufacturing method thereof.
  • the current common heat dissipation methods are forced air cooling and liquid cooling.
  • high-power SVG static var generator
  • MVD medium-high voltage inverter
  • UPS uninterruptible power supply
  • PCS power converter
  • other power modules use forced air cooling to dissipate heat; wind power converters
  • the heat dissipation of power modules such as high-speed rail converters uses liquid cooling.
  • the air-cooled heat sink is usually an aluminum extruded heat sink, a blade heat sink, and a blade heat sink provided with a plurality of aluminum heat sinks on the aluminum alloy substrate. Since the thermal conductivity of aluminum and aluminum alloy is within 220 W/m.K, the fins of the heat sink have relatively low efficiency and poor thermal diffusion performance, which cannot meet the heat dissipation requirements of high heat flow density high power modules.
  • Liquid-cooled radiators are usually composed of endothermic cold plates, circulation pumps, liquid storage tanks, heat exchangers, connecting pipes and valves.
  • the system is complex, bulky, expensive, corrosive and fouling and antifreeze, and the system There are multiple connectors in the middle, which are easy to leak and cause system safety problems.
  • an object of the present invention is to provide a thermal superconducting heat sink and a manufacturing method thereof, which are used to solve the problem that the heat sink of the prior art air cooling radiator has low efficiency and cannot satisfy the dispersal.
  • the problem of heat demand and the system of liquid-cooled radiators are complicated, costly and have safety risks, so as to greatly improve the fin efficiency and heat dissipation capacity of the air-cooled radiator to meet the heat dissipation requirements of high-power modules.
  • the present invention provides a thermal superconducting heat sink comprising: a plurality of partitions and a plurality of thermal superconducting heat dissipating fins;
  • the spacer is alternately arranged with the thermal superconducting heat dissipating fins, and an end surface of the spacer is flush with an end surface of the thermal superconducting heat dissipating fin to form a mounting surface suitable for mounting a power device ;
  • the thermal superconducting heat dissipating fins are fixedly coupled to the spacer.
  • the thermal superconducting heat dissipating fin comprises two sheets which are combined by a rolling process, and the two sheets are connected to each other by an inflation process.
  • a closed pipe having a certain structural shape, and a surface of the two plates is formed with a convex structure corresponding to the closed pipe; the closed pipe is filled with a heat transfer medium.
  • the partition comprises a side partition and an intermediate partition between the side partitions; the side partition is adjacent to the middle partition a groove is formed on one side of the plate and on both sides of the intermediate partition, and the shape of the groove matches the shape of the convex structure of the heat-superconducting heat-dissipating fin between the partition; A raised structure of thermal superconducting fins between the spacers is located within the trench.
  • the closed duct has a hexagonal honeycomb shape, a crisscross network, a plurality of U-shaped, rhombic structures, a triangular structure, and a ring in series. Shape structure, or any combination of any one or more.
  • a part of the closed duct is located between the partitions, and the closed duct between the partitions includes a first straight edge sub-pipe and a second straight
  • the first straight edge sub-pipe is distributed along the length direction of the heat superconducting heat dissipating fins, and the second straight side sub-pipe is perpendicularly connected to both ends of the first straight side sub-pipe.
  • the closed duct between the partitions further includes an arc sub-pipe, the first straight sub-pipe and the second straight sub-pipe Connected via the curved sub-pipes.
  • the thermal superconducting heat dissipating fins are plate-like phase change suppression heat pipes or plate-like pulsating heat pipes.
  • the material of the thermal superconducting heat dissipating fin and the separator is copper, a copper alloy, aluminum or an aluminum alloy or any combination of any one or more.
  • the thermal superconducting heat dissipating fin and the separator are subjected to a pressing process, a thermal conductive adhesive bonding process, a brazing welding process, a press bonding and a thermal conductive adhesive.
  • the knot combination process, the press-fit and braze combination process or the mechanical press-fit and friction stir-welding combination process are fixedly connected.
  • the invention also provides a method for manufacturing a thermal superconducting heat sink, the manufacturing method comprising:
  • Forming a thermal superconducting heat dissipating fin by using an inflation process to form a closed pipe that communicates with each other and has a certain structural shape inside the thermal superconducting heat dissipating fin, and forms a surface on the surface of the thermal superconducting heat dissipating fin a convex structure corresponding to the closed pipe;
  • the spacers are spaced apart from the thermal superconducting heat dissipating fins, and an end surface of the thermal superconducting heat dissipating fins is flush with an end surface of the spacer;
  • the thermal superconducting heat dissipating fins are fixedly coupled to the separator.
  • the specific method for manufacturing the thermal superconducting heat dissipating fin by the inflation process is:
  • the composite sheet is subjected to softening annealing, and after cooling to room temperature, the process hole is drilled to the graphite layer at a position corresponding to the graphite line of the sheet;
  • a heat transfer medium is injected into the pipe through the process hole, and the process hole is sealed.
  • the separator includes a side partition and an intermediate partition between the side partitions; Before the thermal superconducting heat dissipating fins are arranged at intervals, the method further comprises: a side of the side partition plate adjacent to the intermediate partition plate and a side of the intermediate partition plate and a convex portion between the partition plate a step of matching the shape of the structure; the groove is adapted to receive the raised structure when the spacer is spaced from the thermal superconducting heat dissipating fin.
  • the closed duct has a hexagonal honeycomb shape, a crisscross network, a plurality of U-shaped, rhombic structures, and a triangular structure in series. , a toroidal structure, or any combination of any of the above.
  • a part of the closed duct is located between the partitions, and the closed duct between the partitions includes a first straight edge sub-pipe and a second straight edge sub-pipe; the first straight edge sub-pipe is distributed along a length direction of the thermal superconducting fin, and the second straight sub-pipe is perpendicular to both ends of the first straight sub-pipe connection.
  • the closed duct between the partitions further includes a curved sub-pipe, the first straight sub-pipe and the second straight
  • the edge sub-pipes are connected via the arcuate sub-pipes.
  • the thermal superconducting heat dissipating fin is a plate-like phase change suppression heat pipe or a plate-like pulsating heat pipe.
  • the press bonding process, the thermal conductive adhesive bonding process, the brazing welding process, the press bonding and the thermal conductive adhesive bonding process, the press bonding and the brazing combination securely connects the thermal superconducting fins to the baffle.
  • thermal superconducting heat sink of the present invention As described above, the thermal superconducting heat sink of the present invention and the method of manufacturing the same have the following beneficial effects:
  • the thermal superconducting heat sink has a faster heat conduction rate, higher fin efficiency, and the fin efficiency of the thermal superconducting heat sink is up to 90%. The above, and hardly change with the increase of the height of the heat sink and the increase of the wind speed, greatly improving the heat dissipation capability of the heat sink and the application range;
  • the separator and the thermal superconducting heat dissipating fin are alternately arranged, and one end of the thermal superconducting fin is flush with the mounting surface of the heat sink, and part of the heat generated by the power device mounted on the mounting surface can pass.
  • the baffle is conducted to the heat superconducting heat dissipating fins, and the other part is directly transmitted to the heat superconducting heat dissipating fins, and the two conductive modes are combined, so that the heat dissipating efficiency of the heat sink is greatly improved;
  • the thermal superconducting heat sink of the invention is convenient and flexible to manufacture, has low cost, large heat dissipation capability, light weight and small volume, and can replace the heat pipe radiator and part of the water cooling radiator, and is particularly suitable for heat dissipation requirements of electronic devices with high power and high heat flux density. With broad market prospects and huge economic value.
  • Embodiment 1 is a schematic structural view of a thermal superconducting heat sink provided in Embodiment 1 of the present invention.
  • Embodiment 2 is a perspective view showing the structure of a thermal superconducting heat sink provided in Embodiment 1 of the present invention.
  • FIG. 3 is a schematic view showing the assembly of a three-dimensional structure of a thermal superconducting heat sink according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic structural view of a pipeline of a thermal superconducting heat dissipating fin in a thermal superconducting heat sink provided in Embodiment 1 of the present invention.
  • Figure 5 is a schematic cross-sectional view of the Figure 2 along the AA direction.
  • Fig. 6 is an enlarged schematic view showing a region B in Fig. 3.
  • FIG. 7 is a schematic structural view of an intermediate partition in a thermal superconducting heat sink according to Embodiment 1 of the present invention.
  • Figure 8 is a schematic cross-sectional view of the Figure 5 along the BB direction.
  • FIG. 9 is a schematic structural view of a side spacer in a thermal superconducting heat sink according to Embodiment 1 of the present invention.
  • Figure 10 is a schematic cross-sectional view of the Figure 7 along the CC direction.
  • FIG. 11 is a schematic structural view of a duct of a thermal superconducting heat dissipating fin in a thermal superconducting heat sink provided in Embodiment 2 of the present invention.
  • FIG. 12 is a schematic structural view of a duct of a thermal superconducting heat dissipating fin in a thermal superconducting heat sink provided in Embodiment 3 of the present invention.
  • FIG. 13 is a schematic structural view showing a duct of a heat superconducting heat dissipating fin in a thermal superconducting heat sink provided in Embodiment 4 of the present invention.
  • FIG. 14 is a flow chart showing a method of manufacturing a thermal superconducting heat sink according to Embodiment 5 of the present invention.
  • FIG. 14 it should be noted that the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention in a schematic manner, although only the components related to the present invention are shown in the drawings instead of being implemented according to actual implementation. When the number, shape and size of the components are drawn, the type, number and proportion of each component in the actual implementation may be a random change, and the component layout pattern may also be more complicated.
  • the present invention provides a thermal superconducting heat sink comprising: a plurality of partitions and a plurality of thermal superconducting heat dissipating fins 1;
  • the spacers are alternately arranged with the thermal superconducting heat dissipating fins 1, and an end surface of the spacer is flush with an end surface of the thermal superconducting heat dissipating fins 1 to form a power device.
  • the thermal superconducting heat dissipating fin 1 is fixedly connected to the partition.
  • the thermal superconducting heat dissipating fin 1 comprises two sheets 11 which are combined by a rolling process, and the two sheets 11 are blown by The expanding process forms a closed pipe 12 having a certain structural shape that is connected to each other, and the surface of the two plates 11 is formed with a convex structure 13 corresponding to the closed pipe 12; the closed pipe 12 is filled with heat transfer Working fluid 14.
  • the heat transfer medium 14 is a fluid.
  • the heat transfer medium 14 is a gas or a liquid or a mixture of a liquid and a gas. More preferably, in the embodiment, the heat transfer medium 14 is a mixture of liquid and gas.
  • the thermal superconducting heat dissipating fin 1 may be a plate-like phase change suppression heat pipe or a plate-like pulsating heat pipe.
  • the thermal superconducting heat sink has a faster heat transfer rate, higher fin efficiency, and fin efficiency of the heat sink. Influenced by the height of the heat sink, the heat dissipation capability of the heat sink is greatly improved; the partition plate and the heat superconducting heat radiating fin 1 are alternately arranged, and one end of the heat superconducting heat radiating fin 1 and the heat sink.
  • the mounting surface is flush, and a part of the heat generated by the power device 4 mounted on the mounting surface can be conducted to the thermal superconducting heat dissipating fin 1 through the separator, and the other portion is directly conducted to the thermal superconducting heat sink.
  • the partition plate includes a side partition 3 and an intermediate partition 2 between the side partitions 3; the side partition 3 is adjacent to one side of the intermediate partition 2 and both sides of the intermediate partition 2 are provided with a groove 22, the shape of the groove 22 and the shape of the convex structure 13 between the partitions Matching; a raised structure 13 between the spacers is located within the trench 22.
  • the groove 22 is shaped to match the shape of the raised structure 13 between the spacers, such that when the spacers are spaced from the superconducting heat dissipating fins 1
  • the two can be closely fitted, and the combination of the two is better after pressing, the thermal conductivity is better, and the mechanical strength is relatively high.
  • the depth of the trench 22 (ie, the dimension perpendicular to the surface direction of the spacer) is smaller than the thickness of the spacer (ie, the substrate 21 in FIGS. 7 to 10); the shape of the trench 22 is The depth is matched with the partial convex structure shape and the protruding height of the thermal superconducting heat radiating fin 1.
  • the closed duct 12 has a hexagonal honeycomb shape.
  • the hexagonal portion in Fig. 4 is a non-pipe portion 15, and the structure surrounding the hexagons and communicating with each other is the closed duct 12.
  • the closed duct 12 is located between the partitions; in FIG. 4, a portion below the broken line is a portion where the thermal superconducting heat radiating fin 1 is combined with the partition, that is, below the broken line
  • the closed duct 12 is a closed duct between the partitions; the closed duct 12 between the partitions includes a first straight side sub duct 16 and a second straight side sub duct 17;
  • the first straight edge sub-pipe 16 is distributed along the length direction of the thermal superconducting heat dissipating fin 1
  • the second straight edge sub-pipe 17 is located at the first Both ends of the straight edge sub-pipe 16 are perpendicularly connected to both ends of the first straight side sub-pipe.
  • the plane of the corresponding thermal superconducting heat dissipating fin 1 in FIG. 4 corresponds to the plane in the left-view direction in FIG. 1
  • the length direction of the thermal superconducting heat dissipating fin 1 corresponds to FIG. 1 .
  • the length direction of the second edge sub-pipe 17 corresponds to the height direction of the thermal superconducting heat dissipating fins 1, that is, the direction perpendicular to the surface of the heat sink substrate in FIG.
  • the closed duct 12 between the partitions further includes a curved sub-duct 18 that is located in the first straight sub-pipe 16 and the second straight sub-pipe 17 Between the first straight edge sub-pipe 16 and the second straight side sub-pipe 17 are connected via the arc sub-pipe 18.
  • the closed ducts 12 located between the partition plates are arranged as straight-sided ducts, that is, the closed ducts 12 located at the bottom and bottom ends of the heat-superconducting fins 1 are arranged in a straight shape, which is convenient. Opening the mold to the groove 22 on both sides of the separator, and such a design makes the heat-superconducting heat-dissipating fin 1 and the separator easy to cooperate, and the process is easy to realize, and the groove 22 can be made
  • the convex structure 13 is tightly combined, and the bonding and thermal conductivity of the two are relatively good after pressing, and the mechanical strength is relatively high.
  • the material of the thermal superconducting fins 1 and the separator should be a material having better thermal conductivity; preferably, in the embodiment, the material of the thermal superconducting fins 1 and the The material of the separator may be copper, copper alloy, aluminum or aluminum alloy or any combination of any one or more.
  • the material of the thermal superconducting heat dissipating fin 1 may be the same as or different from the material of the separator; preferably, in the embodiment, the material of the thermal superconducting heat dissipating fin 1 and the separator The materials are the same.
  • the thermal superconducting heat dissipating fin 1 and the baffle may be combined by a pressing process, a thermal adhesive bonding process, a brazing welding process, a press bonding and a thermal bonding adhesive bonding process, a press bonding and a brazing combination.
  • the process is either a mechanical press and a friction stir welding process to achieve a fixed connection.
  • the thermal superconducting heat dissipating fins 1 and the baffle are pressed together by a pressing process; the thermal superconducting heat dissipating fins 1 and the baffles are pressed by a pressing process.
  • the working principle of the thermal superconducting heat sink of the present invention is: using the rapid thermal conductivity of the thermal superconducting heat dissipating fins 1, the heat generated during the operation of the power device fixed on the plane of the heat sink substrate is partially conducted through the baffle.
  • the heat-conducting fins 1 are directly transferred to the heat-conducting fins 1 , and the heat transfer medium 14 in the closed duct 12 inside the heat-conducting fins 1 heats up It is rapidly conducted to the entire surface of the thermal superconducting heat dissipating fin 1 and then carried away by the air flow flowing through the gap of the thermal superconducting heat dissipating fin 1.
  • the thermal superconducting heat dissipating fin 1 has a fast heat transfer rate and a uniform temperature, and the fin The sheet efficiency is high, and the fin efficiency of the thermal superconducting fins 1 does not change with the height of the heat superconducting fins, which greatly improves the heat dissipating capability of the heat sink.
  • the present invention further provides a thermal superconducting heat sink.
  • the structure of the thermal superconducting heat sink in this embodiment is substantially the same as that of the thermal superconducting heat sink described in the first embodiment. The difference is that in the embodiment, the closed duct 12 in the thermal superconducting heat dissipating fin 1 has a shape of a crisscross network.
  • Each of the quadrangles in Fig. 11 is a non-pipe portion 15, and the structure surrounding each of the quadrilaterals and communicating with each other is the closed duct 12.
  • thermal superconducting heat sink in this embodiment are the same as those of the thermal superconducting heat sink described in the first embodiment. For details, refer to the first embodiment, and no further details are provided herein.
  • the embodiment further provides a thermal superconducting heat sink.
  • the structure of the thermal superconducting heat sink in this embodiment is substantially the same as that of the thermal superconducting heat sink described in the first embodiment.
  • the difference between the two is that, in the embodiment, the shape of the closed duct 12 in the thermal superconducting heat dissipating fins 1 is a plurality of U-shaped ends in series, that is, in the embodiment, the closed duct 12
  • the shape is a shape formed by a plurality of U-shapes through a head-to-tail connection. The portion below the broken line in Fig.
  • the closed conduit 12 is the portion where the thermal superconducting heat dissipating fin 1 is combined with the spacer, that is, the portion located between the spacers, and the interconnected U-shaped structure in the figure is the
  • the closed conduit 12, the portion between the closed conduits 12, is the non-duct portion 15.
  • the length direction of the broken line is the longitudinal direction of the thermal superconducting heat dissipating fin 1 , and the two ends of the broken line correspond to both ends of the thermal superconducting heat dissipating fin 1 , and the thermal superconducting fin
  • the U-shaped tubes at the ends of the sheet 1 are connected by pipes located between the partitions to achieve closed communication of the entire closed conduit 12.
  • thermal superconducting heat sink in this embodiment are the same as those of the thermal superconducting heat sink described in the first embodiment. For details, refer to the first embodiment, and no further details are provided herein.
  • the embodiment further provides a thermal superconducting heat sink.
  • the structure of the thermal superconducting heat sink in this embodiment is substantially the same as that of the thermal superconducting heat sink described in the third embodiment. The difference between the two is that: in this embodiment, the U-shaped pipes located at the two ends of the thermal superconducting heat dissipating fins 1 are connected by a pipe located at the top of the thermal superconducting heat dissipating fins 1 to realize the entire sealing.
  • the closed communication of the duct 12, that is, the shape of the closed duct 12 in this embodiment is equivalent to the shape of the closed duct 12 described in the third embodiment rotated by 180°.
  • thermal superconducting heat sink in this embodiment are the same as those of the thermal superconducting heat sink described in the first embodiment. For details, refer to the first embodiment, and no further details are provided herein.
  • the shape of the closed duct 12 is without being limited thereto, in addition to the above three examples, the shape of the closed duct 12 may also be a rhombic structure, a triangular structure, a toroidal structure, or any combination of any one or more of them.
  • the present invention also provides a method for manufacturing a thermal superconducting heat sink, the manufacturing method comprising:
  • S1 manufacturing a thermal superconducting heat dissipating fin by an inflation process to form a closed pipe that communicates with each other and has a certain structural shape inside the thermal superconducting heat dissipating fin, and is on the surface of the thermal superconducting heat dissipating fin Forming a convex structure corresponding to the closed pipe;
  • step S1 manufacturing the thermal superconducting heat dissipating fins by using an inflation process to form closed pipes having interconnected structures and having a certain structural shape inside the thermal superconducting fins, and A convex structure corresponding to the closed duct is formed on a surface of the heat superconducting heat radiating fin.
  • a specific method of manufacturing a thermal superconducting heat dissipating fin using an inflation process is as follows:
  • S11 providing two pieces of shear-formed sheets having the same thickness, and roughening and blowing the two pieces of sheets;
  • the shape of the closed duct is a hexagonal honeycomb shape, a crisscross network or a plurality of U-shaped, rhombic structures, triangular structures, circular structures, or any combination of any one or more of them in series. That is, the shape of the closed pipe may be a hexagonal honeycomb shape, a crisscross network, a plurality of U-shaped, rhombic structures, a triangular structure, a circular ring structure, a hexagonal honeycomb shape and a crisscrossing structure.
  • the thermal superconducting heat dissipating fins are plate-like phase change suppression heat pipes or plate-like pulsating heat pipes.
  • Step S2 is performed, referring to step S2 in FIG. 14, a plurality of spacers are provided, the spacers are spaced apart from the thermal superconducting heat dissipating fins, and one end surface of the thermal superconducting heat dissipating fins is provided. It is flush with one end surface of the separator.
  • the spacer includes a side spacer and an intermediate spacer between the side spacers; before the spacer is spaced from the thermal superconducting heat dissipating fins, a step of the side partition plate adjacent to one side of the intermediate partition and the two sides of the intermediate partition plate forming a groove matching the shape of the convex structure between the partition plates;
  • the slot is adapted to receive a raised structure between the spacers when the spacers are spaced from the thermal superconducting heat dissipating fins.
  • the closed duct is located between the partitions, and the closed duct between the partitions includes a first straight edge sub-pipe and a second straight side sub-pipe; the first straight edge sub-pipe along The thermal superconducting heat dissipating fins are longitudinally distributed, and the second straight side sub-pipes are vertically connected to both ends of the first straight-sided sub-pipe.
  • the closed duct between the partitions further includes a curved sub-pipe, the first straight sub-pipe and the second straight sub-pipe being connected via the arc-shaped sub-pipe.
  • the material of the thermal superconducting heat dissipating fin and the separator should be a material having better thermal conductivity; preferably, in the embodiment, the material of the thermal superconducting heat dissipating fin and the separator
  • the material may be copper, copper alloy, aluminum or aluminum alloy or any combination of any one or more.
  • the material of the thermal superconducting heat dissipating fins may be the same as or different from the material of the separator; preferably, in the embodiment, the material of the thermal superconducting heat dissipating fins is the same as the material of the separator. .
  • Step S3 is performed to refer to step S3 in FIG. 14 to securely connect the thermal superconducting heat dissipating fins to the partition plate.
  • the press-bonding process, the thermal conductive adhesive bonding process, the brazing welding process, the press-bonding and thermal-adhesive bonding process, the press-fit and braze combination process, or the mechanical press-fit and friction stir-welding combination process The thermal superconducting heat dissipating fins are fixedly coupled to the spacer.
  • the thermal superconducting heat dissipating fins are fixedly connected to the baffle by a pressing process; the thermal superconducting heat dissipating fins are fixedly connected to the baffles without using other
  • the material is fixedly connected, which can effectively reduce the thermal resistance of the heat sink, thereby improving the heat dissipation efficiency of the heat sink.
  • the present invention provides a thermal superconducting heat sink and a manufacturing method thereof, which replaces a conventional heat sink in the prior art by using a heat superconducting heat dissipating fin, so that the thermal superconducting heat sink has a faster heat conduction rate.
  • the fin efficiency is higher, the fin efficiency of the heat sink is not affected by the height of the heat sink, and the heat dissipation capability of the heat sink is greatly improved; the separator and the heat superconducting heat radiating fin are alternately arranged, and the heat superconducting heat radiating fin One end of the piece is flush with the mounting surface of the heat sink, and part of the heat generated by the power device mounted on the mounting surface can be conducted to the thermal superconducting heat dissipating fin through the baffle, and the other part is directly transmitted to the thermal superconducting heat dissipating fin.
  • the combination of the two conduction modes makes the heat dissipation efficiency of the heat sink greatly improved;
  • the thermal superconducting heat sink of the invention is convenient and flexible to manufacture, has low cost, large heat dissipation capability, light weight, small volume, and can replace the heat pipe radiator and part of the water cooling
  • the heat sink is especially suitable for the heat dissipation of electronic devices with high power and high heat flux density, and has broad market prospects and great economic value.

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Abstract

提供一种热超导散热器及其制造方法，热超导散热器包括若干个隔板及若干个热超导散热翅片（1）；隔板与热超导散热翅片（1）交替排布，且隔板的一端面与热超导散热翅片（1）的一端面相平齐，共同构成适于安装功率器件的安装面；热超导散热翅片（1）与隔板固定连接。采用热超导散热翅片（1）替代现有技术中的常规散热片，使得热超导散热器导热速率更快、翅片效率更高、散热片的翅片效率不受高度影响，提高了散热器的散热能力；热超导散热器制造方便灵活，成本低，散热能力大，重量轻、体积小。

Description

热超导散热器及其制造方法 技术领域
本发明涉及一种大功率电子器件散热用散热器，特别是涉及一种热超导散热器及其制造方法。
背景技术
由于电力电子技术的飞速发展，IGBT(绝缘栅双极型晶体管)、二极管、晶闸管等大功率元器件的集成度越来越高，功率密度也越来越大，工作时产生的热量也越来越大。为了保证功率器件的正常工作，必须及时有效地将热量散掉。因为若不能及时快速将功率器件产生的热散除，会导致功率器件中的芯片温度升高，轻则造成效能降低，缩短使用寿命，重则会导致功率器件的失效和芯片的烧毁炸管。因此解决大功率器件散热问题一直是困扰大功率器件封装厂商和使用厂商的核心问题之一。
目前通用的散热方式是强制风冷散热和液冷散热。比如大功率SVG(静止无功发生器)、MVD(中高压变频器)、UPS(不间断电源)、PCS(功率变换器)等功率模块的散热采用强制风冷散热方式；风电变流器、高铁驱动变流器等功率模块的散热则采用液冷散热方式。
风冷散热器通常为铝合金基板上设置有多个铝散热片的铝挤型散热器、插片散热器、和铲片散热器。由于铝和铝合金的导热系数在220W/m.K以内，散热片的翅片效率比较低，热扩散性能差，已不能满足高热流密度大功率模块的散热需求。
液冷散热器通常由吸热冷板、循环泵、储液槽、热交换器、连接管道和阀门等组成，***复杂、体积大、价格高、有腐蚀和结垢和防冻等问题，并且***中有多个连接头，容易漏液，造成***安全问题。
因此，急需开发一种既能满足高热流密度、大功率模块散热需求，又高效可靠、体积小、性价比高、可代替液冷散热的通用性高效散热器。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种热超导散热器及其制造方法，用于解决现有技术中风冷散热器存在的散热片效率低，不能满足散 热需求的问题及液冷散热器存在的***复杂，成本高及有安全风险等问题，以大幅提高风冷散热器的翅片效率和散热能力，满足大功率模块的散热需求。
为实现上述目的及其他相关目的，本发明提供一种热超导散热器，所述热超导散热器包括：若干个隔板及若干个热超导散热翅片；其中
所述隔板与所述热超导散热翅片交替排布，且所述隔板的一端面与所述热超导散热翅片的一端面相平齐，共同构成适于安装功率器件的安装面；
所述热超导散热翅片与所述隔板固定连接。
作为本发明的热超导散热器的一种优选方案，所述热超导散热翅片包括两块通过辊压工艺复合在一起的板材，所述两块板材之间通过吹胀工艺形成相互连通的具有一定结构形状的封闭管道，且所述两块板材的表面形成有与所述封闭管道相对应的凸起结构；所述封闭管道内填充有传热工质。
作为本发明的热超导散热器的一种优选方案，所述隔板包括侧边隔板及位于所述侧边隔板之间的中间隔板；所述侧边隔板靠近所述中间隔板的一侧及所述中间隔板的两侧均设有沟槽，所述沟槽的形状与所述热超导散热翅片位于隔板之间的凸起结构的形状相匹配；所述热超导散热翅片位于隔板之间的凸起结构位于所述沟槽内。
作为本发明的热超导散热器的一种优选方案，所述封闭管道的形状为六边形蜂窝状、纵横交错的网状、首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、或其中任一种以上任意组合。
作为本发明的热超导散热器的一种优选方案，部分所述封闭管道位于所述隔板之间，位于所述隔板之间所述封闭管道包括第一直边子管道及第二直边子管道；所述第一直边子管道沿所述热超导散热翅片的长度方向分布，所述第二直边子管道与所述第一直边子管道的两端垂直连接。
作为本发明的热超导散热器的一种优选方案，位于所述隔板之间所述封闭管道还包括弧形子管道，所述第一直边子管道及所述第二直边子管道经由所述弧形子管道相连接。
作为本发明的热超导散热器的一种优选方案，所述热超导散热翅片为板状相变抑制热管或板状脉动热管。
作为本发明的热超导散热器的一种优选方案，所述热超导散热翅片及所述隔板的材料为铜、铜合金、铝或铝合金或其中任一种以上的任意组合。
作为本发明的热超导散热器的一种优选方案，所述热超导散热翅片与所述隔板通过压合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺固定连接。
本发明还提供一种热超导散热器的制造方法，所述制造方法包括：
采用吹胀工艺制造热超导散热翅片，以在所述热超导散热翅片内部形成有相互连通且具有一定结构形状的封闭管道，并在所述热超导散热翅片表面形成与所述封闭管道相对应的凸起结构；
提供若干个隔板，将所述隔板与所述热超导散热翅片间隔排布，并使所述热超导散热翅片的一端面与所述隔板的一端面相平齐；
将所述热超导散热翅片与所述隔板固定连接。
作为本发明的热超导散热器的制造方法的一种优选方案，采用吹胀工艺制造热超导散热翅片的具体方法为：
提供两块剪切成型且具有相同厚度的板材，将所述两块板材一面打毛并吹干净；
采用石墨印刷法在至少一所述板材的打毛面上形成相互连通的具有一定形状的石墨线路，所述石墨线路定义出所述封闭管道的形状；
将所述两块板材的打毛面贴合并三边对齐，沿边铆合；
将铆合在一起的所述两块板材加热至一定温度并维持一段时间后进行热轧加工以形成复合板材；
将所述复合板材进行软化退火，待冷却至室温后在所述板材对应石墨线路的位置钻工艺孔至石墨层；
经所述工艺孔向所述复合板材内充入高压流体至所述复合板材膨胀，在所述复合板材两表面形成所述凸起结构的同时在所述复合板材内部形成相互连通且具有一定形状的管道；
经所述工艺孔向所述管道内注入传热工质，并密封所述工艺孔。
作为本发明的热超导散热器的制造方法的一种优选方案，所述隔板包括侧边隔板及位于所述侧边隔板之间的中间隔板；在将所述隔板与所述热超导散热翅片间隔排布之前，还包括在所述侧边隔板靠近所述中间隔板的一侧及所述中间隔板的两侧开设与位于所述隔板之间的凸起结构的形状相匹配的沟槽的步骤；所述沟槽适于在所述隔板与所述热超导散热翅片间隔排布时容纳所述凸起结构。
作为本发明的热超导散热器的制造方法的一种优选方案，所述封闭管道的形状为六边形蜂窝状、纵横交错的网状、首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、或其中任一种以上结构的任意组合。
作为本发明的热超导散热器的制造方法的一种优选方案，部分所述封闭管道位于所述隔板之间，位于所述隔板之间所述封闭管道包括第一直边子管道及第二直边子管道；所述第一直边子管道沿所述热超导散热翅片的长度方向分布，所述第二直边子管道与所述第一直边子管道的两端垂直连接。
作为本发明的热超导散热器的制造方法的一种优选方案，位于所述隔板之间所述封闭管道还包括弧形子管道，所述第一直边子管道及所述第二直边子管道经由所述弧形子管道相连接。
作为本发明的热超导散热器的制造方法的一种优选方案，所述热超导散热翅片为板状相变抑制热管或板状脉动热管。
作为本发明的热超导散热器的制造方法的一种优选方案，通过压合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺将所述热超导散热翅片与所述隔板固定连接。
如上所述，本发明的热超导散热器及其制造方法，具有以下有益效果：
1.采用热超导散热翅片替代现有技术中的常规散热片，使得所述热超导散热器导热速率更快、翅片效率更高、热超导散热片的翅片效率高达90％以上，且几乎不随散热片的高度增加和风速的增大而变化，大大提高了散热器的散热能力以及应用范围；
2.将隔板与热超导散热翅片交替排布，且热超导散热翅片的一端与散热器的安装面相平齐，安装于安装面上的功率器件工作时产生的热量一部分可以通过隔板传导给热超导散热翅片，另一部分直接传导给热超导散热翅片，两种传导方式相结合，使得散热器的散热效率大大提高；
3.本发明的热超导散热器制造方便灵活，成本低，散热能力大，重量轻、体积小，可替代热管散热器和部分水冷散热器，尤其适合大功率高热流密度的电子器件散热需求，具有广阔的市场前景和巨大的经济价值。
附图说明
图1显示为本发明实施例一中提供的热超导散热器的结构示意图。
图2显示为本发明实施例一中提供的热超导散热器的立体结构示意图。
图3显示为本发明实施例一中提供的热超导散热器的立体结构组装示意图。
图4显示为本发明实施例一中提供的热超导散热器中的热超导散热翅片的管路结构示意图。
图5显示为图2沿AA方向的截面结构示意图。
图6显示为图3中B区域的放大示意图。
图7显示为本发明实施例一中提供的热超导散热器中的中间隔板的结构示意图。
图8显示为图5沿BB方向的截面结构示意图。
图9显示为本发明实施例一中提供的热超导散热器中的侧边隔板的结构示意图。
图10显示为图7沿CC方向的截面结构示意图。
图11显示为本发明实施例二中提供的热超导散热器中的热超导散热翅片的管道结构示意图。
图12显示为本发明实施例三中提供的热超导散热器中的热超导散热翅片的管道结构示意图。
图13显示为本发明实施例四中提供的热超导散热器中的热超导散热翅片的管道结构示意图。
图14显示为本发明实施例五中提供的热超导散热器的制造方法的流程图。
元件标号说明
1      热超导散热翅片
11     板材
12     封闭管道
13     凸起结构
14     传热工质
15     非管道部分
16     第一直边子管道
17     第二直边子管道
18     弧形子管道
2      中间隔板
21     基材
22     沟槽
3      侧边隔板
4      功率器件
具体实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。
请参阅图1至图14需要说明的是，本实施例中所提供的图示仅以示意方式说明本发明的基本构想，虽图示中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
实施例一
请参阅图1至图10，本发明提供一种热超导散热器，所述热超导散热器包括：若干个隔板及若干个热超导散热翅片1；其中
所述隔板与所述热超导散热翅片1交替排布，且所述隔板的一端面与所述热超导散热翅片1的一端面相平齐，共同构成适于安装功率器件的安装面；所述隔板及位于所述隔板之间的所述热超导散热翅片1共同构成所述热超导散热器的基板；
所述热超导散热翅片1与所述隔板固定连接。
作为示例，请结合图1至图3参阅图4至图6，所述热超导散热翅片1包括两块通过辊压工艺复合在一起的板材11，所述两块板材11之间通过吹胀工艺形成相互连通的具有一定结构形状的封闭管道12，且所述两块板材11的表面形成有与所述封闭管道12相对应的凸起结构13；所述封闭管道12内填充有传热工质14。
作为示例，所述传热工质14为流体，优选地，所述传热工质14为气体或液体或液体与气体的混合物，更为优选地，本实施例中，所述传热工质14为液体与气体混合物。
作为示例，所述热超导散热翅片1可以为板状相变抑制热管或板状脉动热管。
通过采用所述热超导散热翅片1替代现有技术中的常规散热片，使得所述热超导散热器具有更快的导热速率、更高的翅片效率、散热片的翅片效率不受散热片的高度影响，大大提高了散热器的散热能力；将所述隔板与所述热超导散热翅片1交替排布，且所述热超导散热翅片1的一端与散热器的安装面相平齐，安装于安装面上的所述功率器件4工作时产生的热量一部分可以通过隔板传导给所述热超导散热翅片1，另一部分直接传导给所述热超导散热翅片1，两种传导方式相结合，使得散热器的散热效率大大提高。
作为示例，请结合图1至图3参阅图7至图10，所述隔板包括侧边隔板3及位于所述侧边隔板3之间的中间隔板2；所述侧边隔板3靠近所述中间隔板2的一侧及所述中间隔板2的两侧均设有沟槽22，所述沟槽22的形状与位于所述隔板之间的凸起结构13的形状相匹配；位于所述隔板之间的凸起结构13位于所述沟槽22内。将所述沟槽22的形状设计为与位于所述隔板之间的凸起结构13的形状相匹配，在将所述隔板与所述超导热散热翅片1进行间隔排布时使得二者能够紧密贴合，压合后二者的结合比较好，导热性比较好，机械强度比较高。
作为示例，所述沟槽22的深度(即垂直所述隔板表面方向的尺寸)小于所述隔板(即图7至图10中基材21)的厚度；所述沟槽22的形状与深度且与热超导散热翅片1部分凸出结构形状和凸出高度相匹配。
作为示例，请结合图1至图3参阅图4，所述封闭管道12的形状为六边形蜂窝状。图4中六边形部分为非管道部分15，环绕各六边形周围并相互连通的结构即为所述封闭管道12。
作为示例，所述封闭管道12位于所述隔板之间；图4中，虚线以下的部分即为所述热超导散热翅片1与所述隔板结合的部分，即位于所述虚线以下的所述封闭管道12即为位于所述隔板之间的封闭管道；位于所述隔板之间所述封闭管道12包括第一直边子管道16及第二直边子管道17；所述第一直边子管道16沿所述热超导散热翅片1的长度方向分布，所述第二直边子管道17位于所述第一 直边子管道16的两端，且与所述第一直边子管道的两端垂直连接。
需要说明的是，图4中对应的所述热超导散热翅片1的平面对应于图1中左视方向的平面，所述热超导散热翅片1的长度方向即对应图1中所述隔板的长度方向。所述第二边子管道17的长度方向对应为所述热超导散热翅片1的高度方向，即图1中垂直于所述散热器基板表面的方向。
作为示例，位于所述隔板之间所述封闭管道12还包括弧形子管道18，所述弧形子管道18位于所述第一直边子管道16与所述第二直边子管道17之间，所述第一直边子管道16及所述第二直边子管道17经由所述弧形子管道18相连接。
将位于所述隔板之间的所述封闭管道12设置为直边形管道，亦即将位于所述热超导散热翅片1底部及底部两端的所述封闭管道12设置为直边形，便于开模具加工所述隔板两侧的所述沟槽22，且这样的设计使得所述热超导散热翅片1与所述隔板配合方便，工艺容易实现，可以使得所述沟槽22与所述凸起结构13紧密结合，压合后二者的结合性、导热性均比较好，且机械强度比较高。
作为示例，所述热超导散热翅片1及所述隔板的材料应为导热性较好的材料；优选地，本实施例中，所述热超导散热翅片1的材料及所述隔板的材料均可以为铜、铜合金、铝或铝合金或其中任一种以上的任意组合。所述热超导散热翅片1的材料与所述隔板的材料可以相同，也可以不同；优选地，本实施例中，所述热超导散热翅片1的材料与所述隔板的材料相同。
作为示例，所述热超导散热翅片1与所述隔板可以通过压合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺实现固定连接。优选地，本实施例中，所述热超导散热翅片1与所述隔板通过压合工艺压合在一起；所述热超导散热翅片1与所述隔板通过压合工艺压合在一起，不需要借助其他材料进行固定连接，可以有效地降低散热器的热阻，进而提高散热器的散热效率。
本发明的热超导散热器的工作原理为：利用热超导散热翅片1的快速导热特性，将固定在散热器基板平面上的功率器件工作时产生的热量，一部分通过所述隔板传导给所述热超导散热翅片1，另一部分直接传导给所述热超导散热翅片1，所述热超导散热翅片1内部所述封闭管道12中的传热工质14将热量快速传导至整个所述热超导散热翅片1表面，再由流经所述热超导散热翅片1间隙的空气流带走。在整个散热过程中，所述热超导散热翅片1的导热速率快，温度均匀，翅 片效率高，且所述热超导散热翅片1的翅片效率不随热超导散热翅片的高度而变化，大大提高了散热器的散热能力。
实施例二
请参阅图11，本发明还提供一种热超导散热器，本实施例中的所述热超导散热器的结构与实施例一中所述的热超导散热器的结构大致相同，二者的不同点在于：本实施例中，所述热超导散热翅片1内的所述封闭管道12的形状为纵横交错的网状。图11中各四边形即为非管道部分15，围绕每个所述四边形四中并相互连通的结构即为所述封闭管道12。
本实施例中的所述热超导散热器的其他结构及特征均与实施例一中所述的热超导散热器的结构及特征相同，具体请参阅实施例一，这里不再累述。
实施例三
请参阅图12，本实施例还提供一种热超导散热器，本实施例中的所述热超导散热器的结构与实施例一中所述的热超导散热器的结构大致相同，二者的不同点在于：本实施例中，所述热超导散热翅片1内的所述封闭管道12的形状为首尾串联的多个U形，即本实施例中，所述封闭管道12的形状为由多个U形通过首尾连接形成的形状。图12中虚线以下的部分即为所述热超导散热翅片1与所述隔板相结合部分，即位于所述隔板之间的部分，图中各相互连接U形结构即为所述封闭管道12，位于所述封闭管道12之间的部分即为非管道部分15。虚线的长度方向即为所述热超导散热翅片1的长度方向，所述虚线的两端对应的即为所述热超导散热翅片1的两端，位于所述热超导散热翅片1两端的U形管道通过位于所述隔板之间的管道相连接，以实现整个所述封闭管道12的封闭连通。
本实施例中的所述热超导散热器的其他结构及特征均与实施例一中所述的热超导散热器的结构及特征相同，具体请参阅实施例一，这里不再累述。
实施例四
请参阅图13，本实施例还提供一种热超导散热器，本实施例中的所述热超导散热器的结构与实施例三中所述的热超导散热器的结构大致相同，二者的不同点在于：本实施例中，位于所述热超导散热翅片1两端的U形管道通过位于所述热超导散热翅片1顶部的管道相连接，以实现整个所述封闭管道12的封闭连通，即本实施例中的所述封闭管道12的形状相当于实施例三中所述的封闭管道12的形状旋转了180°。
本实施例中的所述热超导散热器的其他结构及特征均与实施例一中所述的热超导散热器的结构及特征相同，具体请参阅实施例一，这里不再累述。
需要说明的是，上述实施例对于所述封闭管道12的形状仅列举了六边形蜂窝状、纵横交错的网状及首尾串联的多个U形三种示例，然而所述封闭管道12的形状并不限于此，除了上述三种示例，所述封闭管道12的形状还可以是菱形结构、三角形结构、圆环形结构或其中任一种以上结构的任意组合。
实施例五
请参阅图14，本发明还提供一种热超导散热器的制造方法，所述制造方法包括：
S 1：采用吹胀工艺制造热超导散热翅片，以在所述热超导散热翅片内部形成有相互连通且具有一定结构形状的封闭管道，并在所述热超导散热翅片表面形成与所述封闭管道相对应的凸起结构；
S2：提供若干个隔板，将所述隔板与所述热超导散热翅片间隔排布，并使所述热超导散热翅片的一端面与所述隔板的一端面相平齐；
S3：将所述热超导散热翅片与所述隔板固定连接。
执行S1步骤，请参阅图14中的S1步骤，采用吹胀工艺制造热超导散热翅片，以在所述热超导散热翅片内部形成有相互连通且具有一定结构形状的封闭管道，并在所述热超导散热翅片表面形成与所述封闭管道相对应的凸起结构。
作为示例，采用吹胀工艺制造热超导散热翅片的具体方法为：
S11：提供两块剪切成型且具有相同厚度的板材，将所述两块板材一面打毛并吹干净；
S12：采用石墨印刷法在至少一所述板材的打毛面上形成相互连通的具有一定形状的石墨线路，所述石墨线路定义出所述封闭管道的形状；
S13：将所述两块板材的打毛面贴合并三边对齐，沿边铆合；
S14：将铆合在一起的所述两块板材加热至一定温度并维持一段时间后进行热轧加工以形成复合板材；
S15：将所述复合板材进行软化退火，待冷却至室温后在所述板材对应石墨线路的位置钻工艺孔至石墨层；
S16：经所述工艺孔向所述复合板材内充入高压流体至所述复合板材膨胀，在所述复合板材两表面形成所述凸起结构的同时在所述复合板材内部形成相互 连通且具有一定形状的管道；
S17：经所述工艺孔向所述管道内注入传热工质，并密封所述工艺孔。
作为示例，所述封闭管道的形状为六边形蜂窝状、纵横交错的网状或首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、或其中任一种以上的任意组合；即所述封闭管道的形状可以为六边形蜂窝状、纵横交错的网状、首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、六边形蜂窝状与纵横交错的网状的组合、六边形蜂窝状结构与圆环形结构及纵横交错的网状结构的组合等。
作为示例，所述热超导散热翅片为板状相变抑制热管或板状脉动热管。
执行S2步骤，请参阅图14中的S2步骤，提供若干个隔板，将所述隔板与所述热超导散热翅片间隔排布，并使所述热超导散热翅片的一端面与所述隔板的一端面相平齐。
作为示例，所述隔板包括侧边隔板及位于所述侧边隔板之间的中间隔板；在将所述隔板与所述热超导散热翅片间隔排布之前，还包括在所述侧边隔板靠近所述中间隔板的一侧及所述中间隔板的两侧开设与位于所述隔板之间的凸起结构的形状相匹配的沟槽的步骤；所述沟槽适于在所述隔板与所述热超导散热翅片间隔排布时容纳位于所述隔板之间的凸起结构。
作为示例，所述封闭管道位于所述隔板之间，位于所述隔板之间所述封闭管道包括第一直边子管道及第二直边子管道；所述第一直边子管道沿所述热超导散热翅片的长度方向分布，所述第二直边子管道与所述第一直边子管道的两端垂直连接。
作为示例，位于所述隔板之间所述封闭管道还包括弧形子管道，所述第一直边子管道及所述第二直边子管道经由所述弧形子管道相连接。
作为示例，所述热超导散热翅片及所述隔板的材料应为导热性较好的材料；优选地，本实施例中，所述热超导散热翅片的材料及所述隔板的材料均可以为铜、铜合金、铝或铝合金或其中任一种以上的任意组合。所述热超导散热翅片的材料与所述隔板的材料可以相同，也可以不同；优选地，本实施例中，所述热超导散热翅片的材料与所述隔板的材料相同。
执行S3步骤，请参阅图14中的S3步骤，将所述热超导散热翅片与所述隔板固定连接。
作为示例，通过压合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺将所述热超导散热翅片与所述隔板固定连接。优选地，本实施例中，通过压合工艺将所述热超导散热翅片与所述隔板固定连接；将所述热超导散热翅片与所述隔板固定连接，不需要借助其他材料进行固定连接，可以有效地降低散热器的热阻，进而提高散热器的散热效率。
综上所述，本发明提供一种热超导散热器及其制造方法，通过采用热超导散热翅片替代现有技术中的常规散热片，使得所述热超导散热器导热速率更快、翅片效率更高、散热片的翅片效率不受散热片的高度影响，大大提高了散热器的散热能力；将隔板与热超导散热翅片交替排布，且热超导散热翅片的一端与散热器的安装面相平齐，安装于安装面上的功率器件工作时产生的热量一部分可以通过隔板传导给热超导散热翅片，另一部分直接传导给热超导散热翅片，两种传导方式相结合，使得散热器的散热效率大大提高；本发明的热超导散热器制造方便灵活，成本低，散热能力大，重量轻、体积小，可替代热管散热器和部分水冷散热器，尤其适合大功率高热流密度的电子器件散热需求，具有广阔的市场前景和巨大的经济价值。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (17)

  1. 一种热超导散热器，其特征在于，所述热超导散热器包括：若干个隔板及若干个热超导散热翅片；其中
    所述隔板与所述热超导散热翅片交替排布，且所述隔板的一端面与所述热超导散热翅片的一端面相平齐，共同构成适于安装功率器件的安装面；
    所述热超导散热翅片与所述隔板固定连接。
  2. 根据权利要求1所述的热超导散热器，其特征在于：所述热超导散热翅片包括两块通过辊压工艺复合在一起的板材，所述两块板材之间通过吹胀工艺形成相互连通的具有一定结构形状的封闭管道，且所述两块板材的表面形成有与所述封闭管道相对应的凸起结构；所述封闭管道内填充有传热工质。
  3. 根据权利1要求所述的热超导散热器，其特征在于：所述隔板包括侧边隔板及位于所述侧边隔板之间的中间隔板；
    所述侧边隔板靠近所述中间隔板的一侧及所述中间隔板的两侧均设有沟槽，所述沟槽的形状与所述热超导散热翅片位于隔板之间的凸起结构的形状相匹配；
    所述热超导散热翅片位于隔板之间的凸起结构位于所述沟槽内。
  4. 根据权利2要求所述的热超导散热器，其特征在于：所述封闭管道的形状为六边形蜂窝状、纵横交错的网状、首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、或其中任一种以上任意组合。
  5. 根据权利2要求所述的热超导散热器，其特征在于：部分所述封闭管道位于所述隔板之间，位于所述隔板之间所述封闭管道包括第一直边子管道及第二直边子管道；所述第一直边子管道沿所述热超导散热翅片的长度方向分布，所述第二直边子管道与所述第一直边子管道的两端垂直连接。
  6. 根据权利5要求所述的热超导散热器，其特征在于：位于所述隔板之间所述 封闭管道还包括弧形子管道，所述第一直边子管道及所述第二直边子管道经由所述弧形子管道相连接。
  7. 根据权利1要求所述的热超导散热器，其特征在于：所述热超导散热翅片为板状相变抑制热管或板状脉动热管。
  8. 根据权利要求1所述的热超导散热器，其特征在于：所述热超导散热翅片及所述隔板的材料为铜、铜合金、铝或铝合金或其中任一种以上的任意组合。
  9. 根据权利1要求所述的热超导散热器，其特征在于：所述热超导散热翅片与所述隔板通过压合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺固定连接。
  10. 一种热超导散热器的制造方法，其特征在于，所述制造方法包括：
    采用吹胀工艺制造热超导散热翅片，以在所述热超导散热翅片内部形成有相互连通且具有一定结构形状的封闭管道，并在所述热超导散热翅片表面形成与所述封闭管道相对应的凸起结构；
    提供若干个隔板，将所述隔板与所述热超导散热翅片间隔排布，并使所述热超导散热翅片的一端面与所述隔板的一端面相平齐；
    将所述热超导散热翅片与所述隔板固定连接。
  11. 根据权利要求10所述的热超导散热器的制造方法，其特征在于：采用吹胀工艺制造热超导散热翅片的具体方法为：
    提供两块剪切成型且具有相同厚度的板材，将所述两块板材一面打毛并吹干净；
    采用石墨印刷法在至少一所述板材的打毛面上形成相互连通的具有一定形状的石墨线路，所述石墨线路定义出所述封闭管道的形状；
    将所述两块板材的打毛面贴合并三边对齐，沿边铆合；
    将铆合在一起的所述两块板材加热至一定温度并维持一段时间后进行热轧加工以形成复合板材；
    将所述复合板材进行软化退火，待冷却至室温后在所述板材对应石墨线路的位置钻工艺孔至石墨层；
    经所述工艺孔向所述复合板材内充入高压流体至所述复合板材膨胀，在所述复合板材两表面形成所述凸起结构的同时在所述复合板材内部形成相互连通且具有一定形状的管道；
    经所述工艺孔向所述管道内注入传热工质，并密封所述工艺孔。
  12. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：所述隔板包括侧边隔板及位于所述侧边隔板之间的中间隔板；
    在将所述隔板与所述热超导散热翅片间隔排布之前，还包括在所述侧边隔板靠近所述中间隔板的一侧及所述中间隔板的两侧开设与位于所述隔板之间的凸起结构的形状相匹配的沟槽的步骤；所述沟槽适于在所述隔板与所述热超导散热翅片间隔排布时容纳所述凸起结构。
  13. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：所述封闭管道的形状为六边形蜂窝状、纵横交错的网状、首尾串联的多个U形、菱形结构、三角形结构、圆环形结构、或其中的任一种以上的任意组合。
  14. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：部分所述封闭管道位于所述隔板之间，位于所述隔板之间所述封闭管道包括第一直边子管道及第二直边子管道；所述第一直边子管道沿所述热超导散热翅片的长度方向分布，所述第二直边子管道与所述第一直边子管道的两端垂直连接。
  15. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：所述热超导散热片位于隔板之间所述封闭管道还包括弧形子管道，所述第一直边子管道及所述第二直边子管道经由所述弧形子管道相连接。
  16. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：所述热超导散热翅片为板状相变抑制热管或板状脉动热管。
  17. 根据权利10要求所述的热超导散热器的制造方法，其特征在于：通过压 合工艺、导热胶粘结工艺、钎焊焊接工艺、压合与导热胶粘结组合工艺、压合与钎焊组合工艺或是机械压合与摩擦搅拌焊组合工艺将所述热超导散热翅片与所述隔板固定连接。
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