WO2016204053A1 - 高周波フロントエンド回路 - Google Patents
高周波フロントエンド回路 Download PDFInfo
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- WO2016204053A1 WO2016204053A1 PCT/JP2016/067160 JP2016067160W WO2016204053A1 WO 2016204053 A1 WO2016204053 A1 WO 2016204053A1 JP 2016067160 W JP2016067160 W JP 2016067160W WO 2016204053 A1 WO2016204053 A1 WO 2016204053A1
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- 230000005540 biological transmission Effects 0.000 claims description 49
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- 238000010586 diagram Methods 0.000 description 8
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- 230000002238 attenuated effect Effects 0.000 description 3
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/403—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/56—Modifications of input or output impedances, not otherwise provided for
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0138—Electrical filters or coupling circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/50—Circuits using different frequencies for the two directions of communication
- H04B1/52—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/14—Two-way operation using the same type of signal, i.e. duplex
- H04L5/1461—Suppression of signals in the return path, i.e. bidirectional control circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/111—Indexing scheme relating to amplifiers the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/387—A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B2001/0408—Circuits with power amplifiers
Definitions
- This relates to a high-frequency front-end circuit that amplifies and transmits high-frequency signals of multiple types of communication bands.
- Multi-band compatible means that a plurality of communication bands having different use frequency bands can be transmitted and received.
- Patent Document 1 describes a multiband amplifier.
- a plurality of trap filters are connected to the output terminal of the transistor.
- the resonance frequency of each trap filter is set for each communication band.
- the plurality of trap filters are selected by the switch according to the communication band to be transmitted / received. Accordingly, any one of the plurality of trap filters is connected to the output terminal of the transistor.
- the high-frequency front-end circuit using the configuration shown in Patent Document 1 must be provided with a switch for each communication band, which increases the size. Further, in the high-frequency front-end circuit using the configuration shown in Patent Document 1, the characteristics deteriorate due to the influence of the high-frequency characteristics of the switch.
- An object of the present invention is to form a multiband high-frequency front-end circuit having excellent high-frequency characteristics in a small size.
- the high frequency front end circuit of the present invention includes a multiband amplifier, a communication band selection circuit, and a high frequency processing circuit.
- the multiband amplifier amplifies high-frequency signals in a plurality of communication bands including a first communication band and a second communication band that does not overlap the first communication band.
- the communication band selection circuit is connected to the output terminal of the multiband amplifier via a first connection line.
- the communication band selection circuit includes a communication band selection switch.
- the high frequency processing circuit is connected to the first connection line and the ground potential.
- the high frequency processing circuit includes a first passive circuit and a first switch. One end of the first passive circuit is connected to the first connection line via the second connection line, and the other end is connected to the ground potential. The first switch switches the connection state between the first terminal connected to the second connection line and the second terminal connected to the ground potential to open or conductive.
- the high frequency processing circuit when the first switch is open, the high frequency processing circuit functions as a circuit in which the first switch does not exist at a high frequency.
- the switch When a circuit without a switch is selected, no reflection or loss is caused by the switch. Further, the frequency characteristic of the impedance of the high frequency processing circuit is switched by the conduction / opening of the first switch.
- the first switch and the communication band selection switch are built in a single switch element.
- the shape of the circuit module becomes smaller than that in which the first switch and the communication band selection switch are separate.
- the high-frequency front-end circuit of the present invention preferably includes a second passive circuit provided between the second connection lines so as to be connected to the first connection line and the first passive circuit.
- the range of impedance that can be realized by the high-frequency processing circuit can be expanded.
- the high frequency front end circuit of the present invention may have the following configuration.
- the high frequency front end circuit further includes a second switch.
- the second switch switches the connection state between the third terminal connected to the second connection line connecting the second passive circuit and the first connection line and the fourth terminal connected to the ground potential to open or conductive. .
- This configuration can handle more communication bands.
- the first switch, the second switch, and the communication band selection switch are built in a single switch element.
- the circuit module of the high-frequency front-end circuit that can handle more communication bands becomes smaller.
- the high-frequency processing circuit has a stop band that can be changed according to the switching state of the first switch, and the high frequency within the frequency band of the first or second communication band is determined by the stop band.
- the signal may be attenuated.
- This configuration can further improve the high frequency characteristics.
- the high-frequency processing circuit includes an LC series resonance circuit, and the resonance frequency of the LC series resonance circuit is arranged in the stop band.
- This configuration can further improve the high frequency characteristics.
- the high frequency front end circuit of the present invention may have the following configuration.
- the high frequency front end circuit further includes a first branching circuit and a second branching circuit.
- the first demultiplexing circuit includes a first transmission filter and a first reception filter that are connected to the communication band selection circuit and transmit a high-frequency signal of the first communication band.
- the second demultiplexing circuit includes a second transmission filter and a second reception filter that transmit a high-frequency signal of the second communication band.
- the high frequency front end circuit further includes a control circuit.
- the control circuit sets the connection state of the first switch so that the stop band includes the pass band of the first reception filter when the communication band selection circuit is opened with the first branching circuit and is electrically connected to the second branching circuit. select.
- the control circuit is configured to connect the first switch so that the stop band does not include the pass band of the first reception filter when the communication band selection circuit is electrically connected to the first demultiplexing circuit and is released from the second demultiplexing circuit. Select.
- a demultiplexing circuit for demultiplexing a transmission signal and a reception signal is provided for a plurality of communication bands. And in this structure, the high frequency characteristic with respect to each communication band is improved.
- a multi-band high-frequency front-end circuit having excellent high-frequency characteristics can be realized in a small size.
- FIG. 1 is a circuit diagram of a high-frequency front end circuit according to a first embodiment of the present invention. It is a circuit diagram of the high frequency front end circuit concerning a 2nd embodiment of the present invention. It is a circuit diagram of the high frequency front end circuit concerning a 3rd embodiment of the present invention. It is a circuit diagram of the high frequency front end circuit concerning the 4th embodiment of the present invention.
- FIG. 1 is a circuit diagram of a high-frequency front-end circuit according to the first embodiment of the present invention.
- the high frequency front end circuit 10 includes a communication band selection circuit 11, a high frequency processing circuit 12, and a multiband amplifier 20.
- the multiband amplifier 20 is an amplifier that amplifies a plurality of communication bands. Specifically, the multiband amplifier 20 amplifies transmission signals (high frequency signals) of a plurality of communication bands. The frequency bands of the plurality of communication bands are different.
- the multiband amplifier 20 is described with one circuit symbol in FIG. 1, but actually, even if it is a combination of a highband amplifier and a lowband amplifier, a high output amplifier and a low output amplifier. Or a combination thereof.
- the input end of the multiband amplifier 20 is connected to the transmission signal input terminal Ptx of the high frequency front end circuit 10.
- the communication band selection circuit 11 includes a transmission-side switch 31, duplexers 41, 42, 43, 44, and 45, an antenna-side switch 50, and individual matching circuits 61, 62, 63, 64, and 65.
- the transmission side switch 31 includes a common terminal P 00 and selected terminals P 01 , P 02 , P 03 , P 04 , P 05 .
- the transmission-side switch 31 constituting the communication band selection switch uses any one of the selected terminals P 01 , P 02 , P 03 , P 04 , and P 05 according to the band selection signal from the control circuit as a common terminal P 00.
- the common terminal P 00 is connected to the output terminal of the multiband amplifier 20 via the common matching circuit 60.
- the common matching circuit 60 is a circuit that performs impedance matching on transmission signals of all communication bands (for example, communication bands A, B, C, D, and E) used in the high-frequency front-end circuit 10.
- the common matching circuit 60 is realized by a circuit using passive elements such as inductors and capacitors.
- the antenna-side switch 50 constituting the communication band selection circuit 11 includes a common terminal P 50 and selected terminals P 51 , P 52 , P 53 , P 54 , and P 55 .
- the antenna-side switch 50 connects any one of the selected terminals P 51 , P 52 , P 53 , P 54 , and P 55 to the common terminal P 50 according to the band selection signal from the control circuit.
- the common terminal P 50 is connected to the antenna terminal Pan of the high-frequency front end circuit 10.
- the selected terminal P 51 of the antenna side switch 50 is selected together with the selected terminal P 01 of the transmission side switch 31.
- the selected terminal P 52 of the antenna side switch 50 is selected together with the selected terminal P 02 of the transmission side switch 31.
- the selected terminal P 53 of the antenna side switch 50 is selected together with the selected terminal P 03 of the transmission side switch 31.
- the selected terminal P 54 of the antenna side switch 50 is selected together with the selected terminal P 04 of the transmission side switch 31.
- the selected terminal P 55 of the antenna side switch 50 is selected together with the selected terminal P 05 of the transmission side switch 31.
- the transmission filter of the duplexer 41 that demultiplexes the transmission signal and the reception signal is connected between the selected terminal P 01 and the selected terminal P 51 .
- the individual matching circuit 61 is connected between the selected terminal P 01 and the transmission filter.
- the individual matching circuit 61 is a circuit that performs impedance matching on the transmission signal of the communication band A.
- the individual matching circuit 61 is realized by a circuit using passive elements such as inductors and capacitors. For the frequency band of the transmission signal of the communication band A, the impedance of the transmission signal input terminal Ptx viewed from the antenna terminal Pan side is matched (matched) by the common matching circuit 60 and the individual matching circuit 61.
- the reception filter of the duplexer 41 is connected between the selected terminal P 51 and the reception signal output terminal Prx 1 of the high frequency front end circuit 10.
- the transmission filter of the duplexer 42 is connected between the selected terminal P 02 and the selected terminal P 52 .
- the individual matching circuit 62 is connected between the selected terminal P02 and the transmission filter.
- the individual matching circuit 62 is a circuit that performs impedance matching on the transmission signal of the communication band B.
- the individual matching circuit 62 is realized by a circuit using passive elements such as inductors and capacitors. For the frequency band of the transmission signal of the communication band B, the impedance when the antenna terminal Pan side is viewed from the transmission signal input terminal Ptx is matched (matched) by the common matching circuit 60 and the individual matching circuit 62.
- the reception filter of the duplexer 42 is connected between the selected terminal P 52 and the reception signal output terminal Prx 2 of the high frequency front end circuit 10.
- the transmission filter of the duplexer 43 is connected between the selected terminal P 03 and the selected terminal P 53 .
- the individual matching circuit 63 is connected between the selected terminal P 03 and the transmission filter.
- the individual matching circuit 63 is a circuit that performs impedance matching on the transmission signal of the communication band C.
- the individual matching circuit 63 is realized by a circuit using passive elements such as inductors and capacitors. For the frequency band of the transmission signal of the communication band C, the impedance of the transmission signal input terminal Ptx viewed from the antenna terminal Pan side is matched (matched) by the common matching circuit 60 and the individual matching circuit 63.
- the reception filter of the duplexer 43 is connected between the selected terminal P 53 and the reception signal output terminal Prx 3 of the high frequency front end circuit 10.
- the transmission filter of the duplexer 44 is connected between the selected terminal P 04 and the selected terminal P 54 .
- the individual matching circuit 64 is connected between the selected terminal P 04 and the transmission filter.
- the individual matching circuit 64 is a circuit that performs impedance matching on the transmission signal of the communication band D.
- the individual matching circuit 64 is realized by a circuit using passive elements such as inductors and capacitors. For the frequency band of the transmission signal in the communication band D, the impedance of the transmission signal input terminal Ptx viewed from the antenna terminal Pan side is matched (matched) by the common matching circuit 60 and the individual matching circuit 64.
- the reception filter of the duplexer 44 is connected between the selected terminal P 54 and the reception signal output terminal Prx 4 of the high frequency front end circuit 10.
- the transmission filter of the duplexer 45 is connected between the selected terminal P 05 and the selected terminal P 55 .
- the individual matching circuit 64 is connected between the selected terminal P05 and the transmission filter.
- the individual matching circuit 65 is a circuit that performs impedance matching on the transmission signal of the communication band E.
- the individual matching circuit 65 is realized by a circuit using passive elements such as inductors and capacitors. For the frequency band of the transmission signal of the communication band E, the impedance of the transmission signal input terminal Ptx viewed from the antenna terminal Pan side is matched (matched) by the common matching circuit 60 and the individual matching circuit 65.
- the reception filter of the duplexer 45 is connected between the selected terminal P 55 and the reception signal output terminal Prx 5 of the high frequency front end circuit 10.
- the output terminal of the multiband amplifier 20 and the communication band selection circuit 11 are connected via a first connection line.
- the high frequency processing circuit 12 is connected to the first connection line and the ground potential.
- the high frequency processing circuit 12 includes passive elements 71 and 72, a capacitor 73, and an impedance selection switch 32.
- the impedance selection switch 32 constitutes the “first switch” of the present invention.
- the capacitor 73 and the passive element 71 constitute the “first passive circuit” of the present invention.
- the passive element 72 constitutes the “second passive circuit” of the present invention.
- the passive elements 71 and 72 and the capacitor 73 are connected in series in this order.
- the passive element 71 is connected to the ground potential, and one end of the capacitor 73 is connected to the first connection line.
- the passive elements 71 and 72 are inductors. Therefore, the series circuit is an LC series resonance circuit having one end connected to the ground potential.
- the high frequency processing circuit 12 functions as a trap filter having a stop band formed by the resonance frequency of the LC series resonance circuit. If setting is made so that the target frequency band is included in the stop band of the high-frequency processing circuit 12, the high-frequency processing circuit 12 functions as a trap filter having the stop band in the target frequency band.
- the resonance frequency of this series circuit substantially matches the frequency of the received signal of the target communication band (for example, communication band A).
- a trap filter composed of an LC series resonance circuit having one end connected to the ground potential can form a relatively wide stop band, so that not only a single communication band but also reception signals of a plurality of communication bands can be obtained. Are preferable. If it has a sufficient attenuation function in terms of specifications that can attenuate the signal power by 10 dB or more with respect to the frequency of the received signal in the target communication band, a plurality of communication bands can be set as the target communication band. Good.
- Impedance selection switch 32 has a first terminal P 11 and the second terminal P 12.
- the first terminal P 11 is connected to a line (conductor) in which the passive element 71 and the passive element 72 are connected in the second connection line that connects the first connection line and the passive element 71.
- the second terminal P 12 is connected to the ground potential.
- the high frequency processing circuit 12 is configured by a series circuit of passive elements 71 and 72 and a capacitor 73.
- the high frequency processing circuit 12 is configured by a series circuit of a passive element 72 and a capacitor 73.
- This series circuit functions as a trap filter for the target frequency band.
- the resonance frequency of this series circuit substantially matches the frequency of the received signal in the target communication band (for example, communication band B).
- the target communication band is not limited to one, and if there is a sufficient trap function in the specifications for the frequency of the received signals of a plurality of communication bands, the communication band for the plurality of communication bands is targeted. You only have to set it.
- a series circuit is desirable because an LC series circuit having a resonance frequency composed of the passive element 72 as an inductor and a capacitor 73 can be obtained.
- the resonance frequency when the impedance selection switch 32 is open and the resonance frequency when the impedance selection switch 32 is conductive are set to be different. For example, it is assumed that one is close to the reception frequency band of communication bands A, B, and C, and the other is close to the reception frequency band of communication bands D and E.
- the resonance frequency when the impedance selection switch 32 is conductive is determined based on the frequency of the received signals of the communication bands A, B, and C.
- the resonance frequency when the impedance selection switch 32 is open is determined based on the frequency of the received signals of the communication bands D and E.
- the impedance selection switch 32 of the high-frequency processing circuit 12 is selected by the control circuit to be opened. Thereby, the harmonics of the transmission signal close to or overlapping the reception frequency band are attenuated, and the high frequency characteristics of the high frequency front end circuit 10 are improved. Note that the high frequency characteristics are based on insertion loss, isolation between transmission and reception, reception sensitivity, and the like.
- the impedance selection switch 32 of the high-frequency processing circuit 12 is selected by the control circuit to be opened. Thereby, the harmonics of the transmission signal close to or overlapping the reception frequency band are attenuated, and the high frequency characteristics of the high frequency front end circuit 10 are improved. At this time, the high-frequency processing circuit 12 does not transmit a high-frequency signal to the open impedance selection switch 32. Therefore, there is no loss due to the switch, and a more excellent high-frequency characteristic can be realized.
- the first communication band (high band side communication band) including the communication bands A, B, and C whose reception frequencies are close and the communication bands D and E including the communication bands D and E lower than the first communication band and close to the reception frequency.
- the impedance selection switch 32 is opened.
- a configuration in which the stop band of the high-frequency processing circuit 12 is overlapped with the reception frequency of the first communication band is preferable.
- the impedance selection switch 32 is conductive, a configuration in which the stop band of the high-frequency processing circuit 12 does not overlap with the second communication band but overlaps with the second or third harmonic of the transmission frequency of the first communication band is preferable. .
- the configuration of the present embodiment it is possible to suppress the switch from affecting the high-frequency processing in all communication bands. Therefore, the high frequency characteristics of the high frequency front end circuit 10 are improved. At this time, a communication band that is easily affected by the frequency band of the received signal is set to a mode in which the impedance selection switch 32 is opened. Thereby, the high-frequency front end circuit 10 having further excellent high-frequency characteristics can be realized.
- the number of switches can be reduced as compared with the conventional configuration, and the high-frequency front-end circuit 10 can be formed in a small size.
- the passive element 71 when the passive element 71 is an inductor, it is possible to realize a more excellent high-frequency characteristic for a low-band communication signal. However, by using the passive element 71 as a capacitor, it is possible to realize better high frequency characteristics for high-band communication signals.
- the passive elements 71 and 72 may be passive circuits including a circuit in which a plurality of passive elements are combined. Further, the passive elements 71 and 72 may be mounted components, or may be realized by a conductor pattern formed in a multilayer body that realizes the high-frequency front-end circuit 10.
- the transmission side switch 31 and the impedance selection switch 32 may be separate, they may be integrated as shown in FIG. That is, the transmission side switch 31 and the impedance selection switch 32 may be realized by the switch IC 30 that is a single switch element. In this case, the input terminal for the band selection signal can be shared, and the high-frequency front end circuit 10 can be further reduced in size.
- FIG. 2 is a circuit diagram of a high-frequency front-end circuit according to the second embodiment of the present invention.
- the high frequency front end circuit 10A differs from the high frequency front end circuit 10 according to the first embodiment in the configuration of the high frequency processing circuit 12A.
- Other configurations are the same as those of the high-frequency front-end circuit 10.
- the high frequency processing circuit 12A differs from the high frequency processing circuit 12 according to the first embodiment in the configuration of the impedance selection switch 32A.
- the impedance selection switch 32A includes a first terminal P 11 , a second terminal P 12 , a third terminal P 21 , and a fourth terminal P 22 .
- the first terminal P 11 is connected to a line (conductor) in which the passive element 71 and the passive element 72 are connected in the second connection line that connects the first connection line and the passive element 71.
- the second terminal P 12 is connected to the ground potential.
- the portion composed of the third terminal P 21 and the fourth terminal P 22 constitutes the “second switch” of the present invention.
- the third terminal P 21 is connected to the line (conductor) of the passive element 72 and the capacitor 73 in the second connecting line is connected.
- Fourth terminal P 22 is connected to a ground potential.
- a switch a first terminal P 11 and a second terminal P 12, and the switch and the third terminal P 21 and a fourth terminal P 22, or both are open, and either one the other in an open-conductive
- the switch is controlled by a control circuit so that
- the types of circuit configurations that can be realized by the high-frequency processing circuit 12A can be increased. At this time, no switch is used in one type of circuit configuration. As a result, the high frequency front end circuit 10A can obtain the same effects as the high frequency front end circuit 10 shown in the first embodiment. Further, since the selection types of the circuit configuration of the high-frequency processing circuit 12A can be increased, (A) it is possible to cope with more communication bands, and (B) it is possible to realize more excellent high-frequency characteristics and the like. Obtainable.
- FIG. 3 is a circuit diagram of a high-frequency front-end circuit according to the third embodiment of the present invention.
- the high frequency front end circuit 10B differs from the high frequency front end circuit 10A according to the second embodiment in the configuration of the high frequency processing circuit 12B.
- Other configurations are the same as those of the high-frequency front-end circuit 10A.
- the high frequency processing circuit 12B differs from the high frequency processing circuit 12A according to the second embodiment in the configuration of the impedance selection switch 32B.
- Impedance selection switch 32B is provided with a fifth terminal P 30, sixth terminal P 31, and, the seventh terminal P 32.
- One of the sixth terminal P 31 and the seventh terminal P 32 is selectively connected to the fifth terminal P 30 in accordance with the band selection signal described above.
- Fifth terminal P 30 is connected to the ground potential.
- Sixth terminal P 31 is connected to a line and the passive element 71 and the passive element 72 in the second connecting line that connects the first connecting lines and the passive element 71 is connected (conductor).
- Seventh terminal P 32 is connected to the line (conductor) of the passive element 72 and the capacitor 73 in the second connecting line is connected.
- the high frequency front end circuit 10B can obtain the same effects as the high frequency front end circuit 10A shown in the second embodiment. Moreover, the number of terminals of the impedance selection switch 32B can be three, and the number of terminals can be made smaller than that of the four impedance selection switches 32A. As a result, the high-frequency front end circuit 10B can be further reduced in size.
- FIG. 4 is a circuit diagram of a high-frequency front end circuit according to the fourth embodiment of the present invention.
- the high frequency front end circuit 10C is different from the high frequency front end circuit 10 according to the first embodiment in the configuration of the high frequency processing circuit 12C.
- Other configurations are the same as those of the high-frequency front-end circuit 10.
- the high frequency processing circuit 12C is obtained by adding a passive element 84 to the high frequency processing circuit 12 according to the first embodiment.
- Passive element 84 is connected between the second terminal P 12 and the ground potential.
- the passive element 84 is different from the passive element 71.
- the passive element 71 is an inductor
- the passive element 84 is a capacitor.
- the passive element 71 and the passive element 84 have different element values even if the types of elements are the same.
- Such a configuration makes it easier to set the resonance frequency of the high-frequency processing circuit 12C to a desired value more reliably. As a result, the high-frequency front-end circuit 10C having further excellent high-frequency characteristics can be realized.
- the configuration of the high-frequency processing circuit 12C according to the fourth embodiment can be applied to the configuration of the high-frequency processing circuits 12A and 12B according to the second and third embodiments.
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Abstract
Description
11:通信バンド選択回路
12,12A,12B,12C:高周波処理回路
20:マルチバンド増幅器
30:スイッチIC
31:送信側スイッチ
32,32A,32B:インピーダンス選択スイッチ
41,42,43,44,45:デュプレクサ
50:アンテナ側スイッチ
60:共通整合回路
61,62,63,64,65:個別整合回路
71,72,84:受動素子
73:キャパシタ
P00:共通端子
P01,P02,P03,P04,P05:被選択端子
P11:第1端子
P12:第2端子
P21:第3端子
P22:第4端子
P30:第5端子
P31:第6端子
P32:第7端子
P50:共通端子
P51,P52,P53,P54,P55:被選択端子
Pan:アンテナ端子
Prx1,Prx2,Prx3,Prx4,Prx5:受信信号出力端子
Ptx:送信信号入力端子
Claims (8)
- 第1の通信バンドと、前記第1の通信バンドと周波数帯域が重ならない第2の通信バンドとを含む複数の通信バンドの高周波信号を増幅するマルチバンド増幅器と、
前記マルチバンド増幅器の出力端に第1接続ラインを介して接続された通信バンド選択回路と、
前記第1接続ラインと接地電位とに接続された高周波処理回路と、を備え、
前記通信バンド選択回路は、通信バンド選択スイッチを含み、
前記高周波処理回路は、
一端が前記第1接続ラインに第2接続ラインを介して接続され、他端が前記接地電位に接続された第1受動回路と、
前記第2接続ラインに接続された第1端子と、前記接地電位に接続された第2端子との接続状態を開放または導通に切り替える第1スイッチと、を備える、
高周波フロントエンド回路。 - 前記第1スイッチと前記通信バンド選択スイッチは、単体のスイッチ素子に内蔵されている、
請求項1に記載の高周波フロントエンド回路。 - 前記第1接続ラインと前記第1受動回路とに接続するように、前記第2接続ライン間に設けられた第2受動回路を備える、
請求項1または請求項2に記載の高周波フロントエンド回路。 - 前記第2受動回路と前記第1接続ラインとを接続する前記第2接続ラインに接続された第3端子と、前記接地電位に接続された第4端子との接続状態を開放または導通に切り替える第2スイッチと、をさらに備える、
請求項3に記載の高周波フロントエンド回路。 - 前記第1スイッチ、前記第2スイッチ、前記通信バンド選択スイッチは、単体のスイッチ素子に内蔵されている、
請求項4に記載の高周波フロントエンド回路。 - 前記高周波処理回路は、前記第1スイッチの切り替え状態によって変更可能な阻止帯域を有し、
前記阻止帯域によって、前記第1または第2の通信バンドの周波数帯域内の高周波信号を減衰させる、
請求項1乃至請求項5のいずれか1項に記載の高周波フロントエンド回路。 - 前記高周波処理回路は、LC直列共振回路を含んでおり、
前記阻止帯域内に、前記LC直列共振回路の共振周波数が配置されている、
請求項6に記載の高周波フロントエンド回路。 - 前記通信バンド選択回路に接続される、前記第1の通信バンドの高周波信号を伝送する第1送信フィルタと第1受信フィルタとを有する第1分波回路と、前記第2の通信バンドの高周波信号を伝送する第2送信フィルタと第2受信フィルタとを有する第2分波回路と、をさらに備え、
前記通信バンド選択回路が前記第1分波回路と開放され、前記第2分波回路と導通されるとき、前記阻止帯域が前記第1受信フィルタの通過帯域を含むように前記第1スイッチの接続状態を選択し、前記通信バンド選択回路が前記第1分波回路と導通され、前記第2分波回路と開放されるとき、前記阻止帯域が前記第1受信フィルタの通過帯域を含まないように前記第1スイッチの接続状態を選択する制御回路をさらに備える、
請求項6または請求項7に記載の高周波フロントエンド回路。
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