WO2016192926A1 - Thermal compression apparatus comprising a spring element with variably adjustable prestressing, and method for connecting electrical components to a substrate using the thermal compression apparatus - Google Patents

Thermal compression apparatus comprising a spring element with variably adjustable prestressing, and method for connecting electrical components to a substrate using the thermal compression apparatus Download PDF

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Publication number
WO2016192926A1
WO2016192926A1 PCT/EP2016/060165 EP2016060165W WO2016192926A1 WO 2016192926 A1 WO2016192926 A1 WO 2016192926A1 EP 2016060165 W EP2016060165 W EP 2016060165W WO 2016192926 A1 WO2016192926 A1 WO 2016192926A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electrical component
support surface
spring
spring element
Prior art date
Application number
PCT/EP2016/060165
Other languages
German (de)
French (fr)
Inventor
Dieter Bergmann
Hans-Peter Monser
Original Assignee
Muehlbauer GmbH & Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH & Co. KG filed Critical Muehlbauer GmbH & Co. KG
Priority to EP16721787.6A priority Critical patent/EP3304582A1/en
Publication of WO2016192926A1 publication Critical patent/WO2016192926A1/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Definitions

  • THERMOCOMPRESSION DEVICE COMPRISING A SPRING ELEMENT WITH A VARIABLE ADJUSTABLE PRESENCE AND METHOD FOR CONNECTING ELECTRICAL COMPONENTS TO A SUBSTRATE USING THE THERMOCOMPRESSION DEVICE
  • thermocompression device and a method for connecting electrical components to a substrate are described.
  • a pressing element is described which presses an electrical component against the substrate for the duration of a curing process.
  • thermocompression methods are used to mechanically and electrically conductively connect electrical components to a substrate. Such methods are used in particular to connect semiconductor chips in flip-chip design to a substrate.
  • Thermo-compression describes a bonding process in which components are connected by a temporary application of force and heat.
  • Thermo-compression devices for connecting electrical components to a substrate are known in the prior art.
  • TMA Tag Module Assembly
  • DE 10 2012 012 879 B3 discloses a device in which the components to be processed rest on a heated support surface and are pressed against them by means of a pressure belt. On the pressure belt while a force is exerted by means of a magnet.
  • heat stamping units For introducing a force and heat input to the components to be connected, the use of heat stamping units is also known.
  • EP 2 506 295 A2 and JPH-0 3225842 (A) disclose devices in which a substrate and a plurality of semiconductor chips arranged thereon rest on a holding plate and are connected by means of a heating stamp unit. On the one hand, a force is exerted on the components to be connected by the heating stamp unit, so that they are pressed against the retaining plate.
  • heat is supplied by a heat source included in the heating die in order to cure an adhesive applied between the substrate and the semiconductor chips.
  • thermoset layer For the production of electronic assemblies with a thermoset layer by US 2009/0291524 AI and WO 2010/095311 AI further thermocompression onsvorraumen with Schustkov units disclosed.
  • the assemblies to be produced consist of a substrate with semiconductor chips arranged thereon, over which the thermoset layer extends.
  • the heat stamp unit causes the components of the electronic assembly to be exposed to a force and heat, so that the substrate and the semiconductor chips are interconnected by the thermoset layer disposed thereon.
  • WO 00/41219 Al discloses a device for connecting to a sub ⁇ strat components arranged with the substrate, the apparatus comprising a Aufsetzstation for placing a plurality of electronic components on the substrate and one of them separated Nachpressstation for connecting the components to the substrate ,
  • the repressing station comprises an upper tool with a plurality of plungers, which are displaceably mounted in the direction of a support surface for the substrate, and which are provided as thermodes.
  • the plungers are adapted to exert a contact pressure on one component.
  • the apparatus further comprises a liquid chamber for hydrostatic distribution of a loading force on the individual plungers.
  • the liquid chamber extends along the plunger backs and is sealed to the plungers by means of a flexible membrane.
  • the plungers are pressed against the diaphragm under the bias of springs, so that the plungers are biased in the direction of a starting position.
  • thermocompression device for the electrically conductive connection of electronic components arranged on one another.
  • the device comprises a leaf spring which exerts a contact pressure on the components arranged on a support surface by means of a contact pressure means.
  • the leaf spring is at its respective end portions with the contact pressure in contact.
  • thermocompression device and a method for connecting electrical components to a substrate according to the independent claims are proposed.
  • the thermocompression device for connecting electrical components to a substrate comprises a lower tool and an upper tool, which are movable toward and away from each other.
  • the lower tool is provided with a first heat source and a support surface for placing the substrate with at least one electrical component disposed thereon.
  • the upper tool comprises a contact pressure element with at least one spring element.
  • the at least one spring element is configured to be elastically deformed during a relative movement between the upper tool and the lower tool and thereby exert a force on a substrate located between the contact pressure element and the contact surface with at least one electrical component disposed thereon, about the at least one electrical component Press component for the duration of a curing process against the substrate to be arranged on the support surface.
  • the first heat source is adapted to the substrate to be arranged between the support surface and the pressure element with the at least one electrical - -
  • the described device comprises a less complex structure, which requires considerably fewer components than known devices. Accordingly, the present device can be made much cheaper. This less complex structure further allows the proposed device to be easily adapted to different components to be processed and thus the processing of different components and the production of different modules are easily feasible.
  • the present disclosure relates to an apparatus and method for connecting electrical components to a substrate.
  • the electrical components can be provided in the form of semiconductor chips, RFID chips, Hi-Q LEDs, etc. Further, the electrical components may be formed flat and have on one side, which is to be arranged on the substrate, electrical contacts.
  • the electrical contacts may, for example, be provided as contact surfaces, in particular in the form of "bumps", and be arranged to be electrically conductively connected to contacts arranged on the substrate.
  • the contacts located on the substrate may be formed as a metal layer.
  • the substrate may contain one or more of the following materials: paper, polyvinyl chloride (PVC), polyethylene (PE), polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile-butadiene-styrene copolymer ( ABS), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or derivatives thereof.
  • PVC polyvinyl chloride
  • PE polyethylene
  • PET polyethylene terephthalate
  • PET glycol-modified polyethylene terephthalate
  • PEN polyethylene naphthalate
  • ABS acrylonitrile-butadiene-styrene copolymer
  • PVB polyvinyl butyral
  • PMMA polymethyl me
  • a connecting means is applied between the electrical components and the substrate.
  • the connecting means is preferably provided as a thermally curable adhesive, in particular as a liquid adhesive.
  • the adhesive may be electrically conductive and configured to mechanically and electrically conductively connect the electrical components and the substrate.
  • a separating layer can be arranged above the substrate with the electrical components arranged thereon. This can prevent the at least one spring element from coming into contact with the connection means during the curing process.
  • the lower tool of the provided device comprises the support surface and the first heat source.
  • the support surface is formed as a plane plane.
  • the support surface may be provided with a curved surface.
  • the first heat source may be configured to permanently heat the support surface of the lower tool.
  • the first heat source may be formed as a heating rail.
  • the upper tool and the lower tool are movable toward one another and away from one another.
  • the upper tool and the lower tool can continue to be movable relative to each other in a longitudinal direction of the device.
  • the device may for this purpose comprise a drive unit which is adapted to move the upper tool and / or the lower tool in a vertical direction relative to each other.
  • the device may further comprise a further drive unit for moving the upper train and / or the lower tool in a horizontal direction relative to one another.
  • the upper tool may comprise a second heat source, which is adapted to continue to supply heat to be arranged between the support surface and the on ⁇ press element substrate with the at least one electrical component to the between the substrate and the at least one electrical component To harden applied bonding agent.
  • a respective heat source in the lower tool and the upper tool allows a uniform supply of heat to the connecting means applied between the substrate and the electrical component. In particular, this can ensure a leveled temperature profile along the components to be processed. As a result, higher quality results can be achieved.
  • the second heat source may be provided as a heat radiator.
  • the heat radiator can be arranged above the contact pressure element and have a defined distance from it. Furthermore, the distance between the heat ⁇ radiator and the contact pressure in the operation of the device essentially so - -
  • the second heat source may be adapted to supply heat to the pressing member by means of heat conduction, i. touching.
  • the second heat source in the form of a heating resistor, e.g. as a heating wire, etc., formed and arranged in or on the contact pressure element.
  • the provided device has at least one spring element, which is included in the contact pressure element.
  • the at least one spring element can be configured to exert a force on one or more electrical components arranged on the substrate.
  • the at least one spring element can be configured to exert a force on one or more electrical components arranged on the substrate.
  • Pressing element on a plurality of spring elements which are each associated with an arranged on the substrate electrical component.
  • the plurality of spring elements may be configured to exert a respective force on the electrical component associated with the respective spring element.
  • the upper tool can have a clamping unit for clamping the at least one spring element.
  • the clamping unit may further be adapted to bias the spring element, wherein the bias voltage can be variably adjusted.
  • the at least one spring element is preferably designed as a leaf spring, in particular as a strip-shaped leaf spring.
  • the leaf spring may be formed flat and have an upper and a lower side surface, wherein the lower side surface opposite to the support surface of the lower tool may be arranged.
  • the leaf spring may comprise a metallic material.
  • the leaf spring may be provided in the form of a stainless steel sheet.
  • the thickness of the leaf spring may be 1 mm and smaller.
  • the leaf spring an adhesive protective layer to prevent adhesion of the components to be processed by the device to the leaf spring.
  • the leaf spring may be thermally conductive and configured to supply heat introduced by the second heat source to between the substrate and the substrate
  • the pressing element may have a plurality of leaf springs.
  • the plurality of leaf springs may be connected to each other, wherein the leaf springs are preferably interconnected at a first end.
  • the pressing element provided from a plurality of leaf springs is preferably formed in one piece and provided in the form of a spring comb. As a result, a simple replacement of the pressing element can be ensured, whereby the device for processing different modules can be easily converted.
  • the plurality of leaf springs of the pressing element can be arranged substantially parallel to one another. Furthermore, the width of the plurality of leaf springs and / or the distances therebetween may be the same or different.
  • the contact pressure element can be provided with recesses extending transversely to the longitudinal direction, which represent the defined distances between the leaf springs.
  • the clamping unit can be set up to bias the at least one leaf spring so that the leaf spring has a curvature extending in the direction of the bearing surface.
  • the curvature of the leaf spring may extend in an opposite direction.
  • a non-metallic, metallic, textile or plastic strip may be arranged as a separating strip between the substrate and the components and the spring element in order to prevent the spring element from becoming soiled - -
  • This separation tape can be moved with the upper tool, then it is z. B. attached to the upper tool. But it can also be arranged stationary, z. B. on the upper tool.
  • the clamping unit may comprise a first and a second bearing, wherein the first bearing is adapted to fix the at least one leaf spring at the first end. Furthermore, the at least one leaf spring may rest against the second bearing at a second end opposite the first end.
  • the first bearing may be pivotally mounted about a pivot axis and fixed relative thereto in a plurality of positions. Thereby, the bias of the at least one leaf spring can be variably adjusted.
  • a method for connecting electrical components to a substrate of the initially specified type comprises placing the substrate with at least one electrical component arranged thereon on a support surface of a lower tool, wherein a connecting means is applied between the substrate and the at least one electrical component. Furthermore, a successive Zubeggi the lower tool and an upper tool.
  • the upper tool comprises a contact pressure element with at least one spring element. The relative movement of the lower tool and the upper tool elastically deforms the at least one spring element, whereby a force is applied to the substrate arranged between the bearing surface and the contact pressure element with the at least one electrical component. This force causes the at least one electrical component to be pressed against the substrate arranged on the support surface.
  • the method comprises a step of supplying heat to the substrate arranged between the support surface and the pressing element with the at least one electrical component. As a result, hardening of the bonding agent applied between the substrate and the at least one electrical component takes place.
  • the method may further comprise the following steps:
  • connection means is arranged between the at least one electrical component and the substrate
  • the method may include a step of adjusting the force to be applied to the electrical component.
  • the force can be adjusted depending on the bias and dimensioning of the at least one Federeiements.
  • the force can be adjusted depending on the relative movement between the upper tool and the lower tool. This can be done by the
  • Relative movement induced elastic deformation of the at least one spring element can be varied.
  • FIG. 1 shows a side view of a first embodiment of a device for connecting electrical components to a substrate.
  • FIG. 2 shows a front view of a second embodiment of the device.
  • FIG. 3 shows a perspective view of the second embodiment of the invention
  • FIG. 4 shows a perspective view of the second embodiment of FIG.
  • FIG. 5 shows a plan view of an embodiment of a contact pressure element.
  • FIG. 6 shows a perspective view of a further embodiment of the invention
  • the thermocompression device 10 comprises a lower tool 12 with a first heat source and a support surface 14.
  • the first heat source may be provided in the form of one or more heating rails, which are electrically operated.
  • the support surface 14 is formed as a flat surface on which a substrate 16 abuts.
  • electrically conductive contact surfaces 18 are provided.
  • a connecting means 20 was applied to the substrate 16.
  • the connecting means 20 is liquid and thermally cured.
  • an electrical component 22, in this case a semiconductor chip with a flip-chip design was applied to the substrate 16 and the liquid connection means 20.
  • the electrical component 22 has electrically conductive contacts 24, which are in contact with the electrically conductive contact surfaces 18 of the substrate 16.
  • the contacts 24 may for example have the form of metallic contact feet or so-called "bumps".
  • the thermocompression device 10 further comprises an upper tool 26 with a second heat source 28 and a pressing member 30.
  • the second heat source 28 is formed as a heat radiator, which is arranged above the pressing member 30.
  • the upper tool 26 is configured to be moved up and down in the vertical direction, so that the upper tool 26 is movable relative to the lower tool 12.
  • the lower tool 12 is movable relative to the upper tool 26 in the vertical direction.
  • the lower tool 12 may further be movable relative to the upper tool 26 in the horizontal direction.
  • the pressing member 30 comprises a spring element, which is formed in the form of a strip-shaped leaf spring 32 having a bottom and a top.
  • the pressing element 30 may comprise a plurality of leaf springs 32, which are each associated with an electrical component 22.
  • the leaf spring 32 has an arcuate shape and is curved in the direction of the electrical component 22. The underside of the leaf spring 32 abuts in sections at the top of the electrical component 22.
  • the upper tool 26 further comprises a clamping unit 34 having a first and a second bearing 36, 38 by means of which the leaf spring 32 is clamped in the upper tool 26.
  • the leaf spring 32 is at a first end by the first bearing -
  • the first bearing 36 is pivotally mounted about a pivot axis and fixed relative to this in a variety of positions, as indicated by the arrow B shown in FIG.
  • the bias of the leaf spring 32 can be variably adjusted.
  • the underside of the leaf spring 32 is partially against the second bearing 38.
  • the second bearing 38 may be provided such that the upper side or the upper side and the lower side of the leaf spring 32 abuts in portions on it.
  • a first state of the device 10 in which the leaf spring 32 is elastically deformed by a done in a previous step lowering the upper tool 26.
  • a force F acts on the electrical component 22 and this presses against the laid on the support surface 14 substrate 16 for the duration of a curing process.
  • heat is also supplied by the first heat source and the heat radiator 28 to cure the bonding agent 20 applied between the electrical component 22 and the substrate 16. Consequently, in the first state, a simultaneous application of a force input by the leaf spring 32 and a heat input by the first heat source and the heat radiator 28 takes place.
  • the contact surfaces 24 of the electrical component 22 are electrically conductively in contact with the contact surfaces 18 of the substrate 16, so that after the hardening process has elapsed, the electrical component 22 is mechanically and electrically conductively connected to the substrate 16 is.
  • FIGS. 2 to 4 show a second embodiment of the device 10a for simultaneously connecting a plurality of electrical components 22 to the substrate 16.
  • the pressing element 30a shown comprises three strip-shaped leaf springs 32a, which are arranged substantially parallel to each other.
  • the plurality of leaf springs 32a are connected to each other at the first end, so that the pressing member - -
  • FIGS. 2 and 3 show the first state of the device 10a, in which the electrical components 22 are pressed by means of the leaf springs 32a of the pressing element 30a against the substrate 16 arranged on the support surface 14 for the duration of the curing process.
  • the leaf springs 32a have no elastic deformation induced by a relative movement between the upper tool 26 and the lower tool 12.
  • dashed lines 40 in FIG. 4 which show the shape of the clamped leaf springs 32a in the first state, the leaf springs 32a in the second state have a more pronounced curvature toward the substation train 12.
  • Fig. 5 is a plan view of a further embodiment of a pressing member 30b is shown.
  • the pressing member 30b is integrally formed and has a plurality of leaf springs 32b.
  • the pressing member 30b may be formed of a stainless steel sheet having a thickness of 1 mm, for example, and manufactured by a laser cutting method.
  • the pressing element 30c comprises a plurality of leaf springs 32c, which are connected to each other at a first end via a web extending transversely to the leaf springs 32c.
  • the bridge is just formed.
  • the leaf springs 32c have an arcuate shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Thermal compression apparatus for connecting electrical components (22) to a substrate (16), comprising a top tool (26) and a bottom tool (12) with a first heat source and a support surface (14) for supporting the substrate (16) which has at least one electrical component (22) arranged on it. The top tool (26) comprises a press-on element (30) with at least one spring element (32), preferably a strip-like leaf spring. The at least one spring element (32) is designed to be elastically deformed in the event of a relative movement between the top tool (26) and the bottom tool (12) and as a result to exert a force (F) on a substrate (16) which is located between the press-on element (30) and the support surface (14) and has at least one electrical component (22) arranged on it, in order to press the at least one electrical component (22) against the substrate (16), which is to be arranged on the support surface (14), for the duration of a curing process. The top tool (26) can comprise a second heat source (28) (for example a radiant heater or a heating resistor which is arranged in or on the press-on element (30)). The first heat source and the optional second heat source (28) are designed to supply heat to the substrate (16) which is to be arranged between the support surface (14) and the press-on element (30) and has the at least one electrical component (22), in order to cure a connecting means (20) which is fitted between the substrate (16) and the at least one electrical component (22).

Description

THERMOKOMPRESSIONSVORRICHTUNG MIT EINEM FEDERELEMENT MIT VARIABEL EINSTELLBARER VORSPANNUNG UND VERFAHREN ZUM VERBINDEN VON ELEKTRISCHEN BAUTEILEN MIT EINEM SUBSTRAT UNTER VERWENDUNG DER THERMOKOMPRESSIONSVORRICHTUNG  THERMOCOMPRESSION DEVICE COMPRISING A SPRING ELEMENT WITH A VARIABLE ADJUSTABLE PRESENCE AND METHOD FOR CONNECTING ELECTRICAL COMPONENTS TO A SUBSTRATE USING THE THERMOCOMPRESSION DEVICE
Hintergrund background
Es wird eine Thermokompressionsvorrichtung und ein Verfahren zum Verbinden elektrischer Bauteile mit einem Substrat beschrieben. Insbesondere wird ein Anpresselement beschrieben, das ein elektrisches Bauteil für die Dauer eines Aushärtevorgangs gegen das Substrat presst. A thermocompression device and a method for connecting electrical components to a substrate are described. In particular, a pressing element is described which presses an electrical component against the substrate for the duration of a curing process.
Bei der Herstellung von Chipkarten oder RFID(Radio-Frequence-Identification)- Eti ketten werden Thermokompressionsverfahren verwendet, um elektrische Bauteile mechanisch und elektrisch leitend mit einem Substrat zu verbinden. Derartige Verfahren werden insbesondere verwendet, um Halbleiterchips im Flip-Chip-Design mit einem Substrat zu verbinden. In the production of smart cards or RFID (Radio Frequency Identification) - Eti chains thermocompression methods are used to mechanically and electrically conductively connect electrical components to a substrate. Such methods are used in particular to connect semiconductor chips in flip-chip design to a substrate.
Stand der Technik State of the art
Die Thermokompression beschreibt ein Verbindungsverfahren, bei dem Komponenten durch einen vorübergehenden Kraft- und Wärmeeintrag miteinander verbunden werden. Aus dem Stand der Technik sind Thermokompressionsvorrichtungen zum Verbinden von elektrischen Bauteilen mit einem Substrat bekannt. Thermo-compression describes a bonding process in which components are connected by a temporary application of force and heat. Thermo-compression devices for connecting electrical components to a substrate are known in the prior art.
Derartige Vorrichtungen sind beispielsweise durch Tag Module Assembly (TMA) Lines offenbart, in welchen ein Substrat mit darauf angeordneten elektrischen Bauteilen kontinuierlich zwischen zwei andrückenden Heizschienen bewegt wird. Dabei können Relativbewegung zwischen den zu verbindenden Komponenten und den Heizschienen auftreten, die jedoch Auswirkungen auf die Positionierungsgenauigkeit haben können. Deshalb wird ein derartiger Aufbau zur Herstellung von Erzeugnissen mit größeren Positionstoleranzen verwendet. Such devices are disclosed, for example, by Tag Module Assembly (TMA) Lines in which a substrate having electrical components mounted thereon is continuously moved between two pressing heater rails. In this case, relative movement between the components to be connected and the heating rails may occur, which may, however, have an effect on the positioning accuracy. Therefore, such a construction is used for the production of products with larger positional tolerances.
Ferner offenbart die DE 10 2012 012 879 B3 eine Vorrichtung, bei der die zu verarbeitenden Komponenten auf einer beheizten Auflagefläche aufliegen und mittels eines Druckbands gegen diese gepresst werden. Auf das Druckband wird dabei mittels eines Magneten eine Kraft ausgeübt. Zum Einbringen eines Kraft- und Wärmeeintrags auf die zu verbindenden Komponenten ist weiterhin die Verwendung von Heizstempel-Einheiten bekannt. Beispielsweise sind durch die EP 2 506 295 A2 und die JPH-03225842 (A) Vorrichtungen offenbart, bei denen ein Substrat und mehrere darauf angeordnete Halbleiterchips auf einer Halteplatte aufliegen und mittels einer Heizstempel-Einheit verbunden werden. Durch die Heizstempel-Einheit wird zum einen eine Kraft auf die zu verbindenden Komponenten ausgeübt, sodass diese gegen die Halteplatte gepresst werden. Zum anderen erfolgt durch eine in dem Heizstempel umfasste Wärmequelle eine Wärmezufuhr, um einen zwischen dem Substrat und den Halbleiterchips aufgetragenen Klebstoff auszuhärten. Furthermore, DE 10 2012 012 879 B3 discloses a device in which the components to be processed rest on a heated support surface and are pressed against them by means of a pressure belt. On the pressure belt while a force is exerted by means of a magnet. For introducing a force and heat input to the components to be connected, the use of heat stamping units is also known. For example, EP 2 506 295 A2 and JPH-0 3225842 (A) disclose devices in which a substrate and a plurality of semiconductor chips arranged thereon rest on a holding plate and are connected by means of a heating stamp unit. On the one hand, a force is exerted on the components to be connected by the heating stamp unit, so that they are pressed against the retaining plate. On the other hand, heat is supplied by a heat source included in the heating die in order to cure an adhesive applied between the substrate and the semiconductor chips.
Zur Herstellung von elektronischen Baugruppen mit einer Duroplastschicht sind durch die US 2009/0291524 AI und die WO 2010/095311 AI weiterhin Thermokompressi- onsvorrichtungen mit Heizstempel-Einheiten offenbart. Die herzustellenden Baugruppen bestehen aus einem Substrat mit darauf angeordneten Halbleiterchips, über welche sich die Duroplastschicht erstreckt. Die Heizstempel-Einheit bewirkt, dass die Komponenten der elektronischen Baugruppe einer Kraft- und Wärmeeinwirkung ausgesetzt sind, sodass das Substrat und die Halbleiterchips durch die darauf angeordnete Duroplastschicht miteinander verbunden werden. For the production of electronic assemblies with a thermoset layer by US 2009/0291524 AI and WO 2010/095311 AI further thermocompression onsvorrichtungen with Heizstempel units disclosed. The assemblies to be produced consist of a substrate with semiconductor chips arranged thereon, over which the thermoset layer extends. The heat stamp unit causes the components of the electronic assembly to be exposed to a force and heat, so that the substrate and the semiconductor chips are interconnected by the thermoset layer disposed thereon.
Die Bereitstellung von Heizstempel-Einheiten hat jedoch Auswirkungen auf den konstruktiven Aufwand und die Kosten derartiger Thermokompressionsvorrichtungen. The provision of heat stamp units, however, has an impact on the design effort and cost of such thermocompression devices.
Die WO 00/41219 AI offenbart eine Vorrichtung zum Verbinden von auf einem Sub¬ strat angeordneten Bauteilen mit dem Substrat, wobei die Vorrichtung eine Aufsetzstation zum Platzieren einer Mehrzahl elektronischer Bauteile auf dem Substrat und eine davon separierte Nachpressstation zum Verbinden der Bauteile mit dem Substrat aufweist. Die Nachpressstation umfasst ein Oberwerkzeug mit einer Mehrzahl von in Richtung einer Auflagefläche für das Substrat verschiebbar gelagerten Stößeln, die als Thermoden bereitgestellt sind. Die Stößel sind dazu eingerichtet, eine Anpresskraft auf jeweils ein Bauteil auszuüben. Um unterschiedliche Höhen der zu behandelnden Bauteile auf dem Substrat auszugleichen, umfasst die Vorrichtung ferner eine Flüssigkeitskammer zur hydrostatischen Verteilung einer Beaufschlagungskraft auf die einzelnen Stößel. Die Flüssigkeitskammer erstreckt sich entlang der Stößelrückseiten und ist mittels einer flexiblen Membran gegenüber den Stößeln abgedichtet. Aus Sicherheitsgründen, werden die Stößel unter der Vorspannung von Federn gegen die Membran gepresst, sodass die Stößel in Richtung einer Ausgangslage vorgespannt sind. - - WO 00/41219 Al discloses a device for connecting to a sub ¬ strat components arranged with the substrate, the apparatus comprising a Aufsetzstation for placing a plurality of electronic components on the substrate and one of them separated Nachpressstation for connecting the components to the substrate , The repressing station comprises an upper tool with a plurality of plungers, which are displaceably mounted in the direction of a support surface for the substrate, and which are provided as thermodes. The plungers are adapted to exert a contact pressure on one component. In order to equalize different heights of the components to be treated on the substrate, the apparatus further comprises a liquid chamber for hydrostatic distribution of a loading force on the individual plungers. The liquid chamber extends along the plunger backs and is sealed to the plungers by means of a flexible membrane. For safety reasons, the plungers are pressed against the diaphragm under the bias of springs, so that the plungers are biased in the direction of a starting position. - -
Die US 6,015,081 A offenbart eine Thermokompressionsvorrichtung zum elektrisch leitenden Verbinden von aufeinander angeordneten elektronischen Bauteilen. Um eine gleichmäßige Anpresskraft zwischen den Bauteilen zu gewährleisten, umfasst die Vorrichtung eine Blattfeder, die mittels eines Anpressmittels eine Anpresskraft auf die auf einer Auflagefläche angeordneten Bauteile ausübt. Die Blattfeder ist dabei an ihren jeweiligen Endabschnitten mit dem Anpressmittel im Kontakt. US 6,015,081 A discloses a thermocompression device for the electrically conductive connection of electronic components arranged on one another. In order to ensure a uniform contact force between the components, the device comprises a leaf spring which exerts a contact pressure on the components arranged on a support surface by means of a contact pressure means. The leaf spring is at its respective end portions with the contact pressure in contact.
Zugrundeliegendes Problem Underlying problem
Hieraus ergibt sich die Aufgabe, eine Vorrichtung und ein Verfahren bereitzustellen, die ein aufwands- und kostenreduziertes Verbinden von elektrischen Bauteilen mit einem Substrat sicherstellen. Die bereitzustellende Vorrichtung und das Verfahren sollen weiterhin eine aufwandsreduzierte Konfigurierbarkeit aufweisen, um eine einfache Verarbeitung unterschiedlicher elektrischer Bauteile zu ermöglichen. This results in the task of providing a device and a method which ensure an effort and cost-reduced joining of electrical components to a substrate. The device to be provided and the method should continue to have a reduced cost configurability in order to allow easy processing of different electrical components.
Vorgeschlagene Lösung Suggested solution
Zur Lösung dieser Aufgabe werden eine Thermokompressionsvorrichtung und ein Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat gemäß den unabhängigen Ansprüchen vorgeschlagen. To achieve this object, a thermocompression device and a method for connecting electrical components to a substrate according to the independent claims are proposed.
Die Thermokompressionsvorrichtung zum Verbinden elektrischer Bauteile mit einem Substrat umfasst ein Unterwerkzeug und ein Oberwerkzeug, die aufeinander zu und voneinander weg bewegbar sind. Das Unterwerkzeug ist mit einer ersten Wärmequelle und einer Auflagefläche zum Auflegen des Substrats mit zumindest einem darauf angeordneten elektrischen Bauteil bereitgestellt. Das Oberwerkzeug umfasst ein Anpresselement mit zumindest einem Federelement. Das zumindest eine Federelement ist dazu eingerichtet, bei einer Relativbewegung zwischen dem Oberwerkzeug und dem Unterwerkzeug elastisch verformt zu werden und dadurch eine Kraft auf ein sich zwischen dem Anpresselement und der Auflagefläche befindliches Substrat mit zumindest einem darauf angeordneten elektrischen Bauteil auszuüben, um das zumindest eine elektrische Bauteil für die Dauer eines Aushärtevorgangs gegen das auf der Auflagefläche anzuordnende Substrat zu pressen. Weiterhin ist die erste Wärmequelle dazu eingerichtet, dem zwischen der Auflagenfläche und dem Anpresselement anzuordnenden Substrat mit dem zumindest einen elektrischen - - The thermocompression device for connecting electrical components to a substrate comprises a lower tool and an upper tool, which are movable toward and away from each other. The lower tool is provided with a first heat source and a support surface for placing the substrate with at least one electrical component disposed thereon. The upper tool comprises a contact pressure element with at least one spring element. The at least one spring element is configured to be elastically deformed during a relative movement between the upper tool and the lower tool and thereby exert a force on a substrate located between the contact pressure element and the contact surface with at least one electrical component disposed thereon, about the at least one electrical component Press component for the duration of a curing process against the substrate to be arranged on the support surface. Furthermore, the first heat source is adapted to the substrate to be arranged between the support surface and the pressure element with the at least one electrical - -
Bauteil Wärme zuzuführen, um ein zwischen dem Substrat und dem zumindest einen elektrischen Bauteil aufgebrachtes Verbindungsmittel auszuhärten. Heat to supply component to harden a bonding agent applied between the substrate and the at least one electrical component.
Die beschriebene Vorrichtung umfasst einen weniger komplexen Aufbau, der im Vergleich zu bekannten Vorrichtungen mit wesentlich weniger Komponenten auskommt. Entsprechend kann die vorliegende Vorrichtung wesentlich kostengünstiger hergestellt werden. Dieser weniger komplexe Aufbau ermöglicht weiterhin, dass die vorgeschlagene Vorrichtung an unterschiedliche zu verarbeitende Komponenten einfach angepasst werden kann und dadurch die Verarbeitung unterschiedlicher Bauteile sowie die Herstellung unterschiedlicher Baugruppen einfach realisierbar sind. The described device comprises a less complex structure, which requires considerably fewer components than known devices. Accordingly, the present device can be made much cheaper. This less complex structure further allows the proposed device to be easily adapted to different components to be processed and thus the processing of different components and the production of different modules are easily feasible.
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Die vorliegende Offenbarung betrifft eine Vorrichtung und ein Verfahren zum Verbinden elektrischer Bauteile mit einem Substrat. Die elektrischen Bauteile können dabei in Form von Halbleiterchips, RFID-Chips, Hi-Q-LED's, etc. bereitgestellt sein. Ferner können die elektrischen Bauteile flach ausgebildet sein und an einer Seite, welche auf dem Substrat anzuordnen ist, elektrische Kontakte aufweisen. Die elektrischen Kontakte können beispielsweise als Kontaktflächen, insbesondere in Form von „Bumps" bereitgestellt und dazu eingerichtet sein, mit auf dem Substrat angeordneten Kontakten elektrisch leitfähig verbunden zu werden. Die auf dem Substrat befindlichen Kontakte können als Metallschicht ausgebildet sein. The present disclosure relates to an apparatus and method for connecting electrical components to a substrate. The electrical components can be provided in the form of semiconductor chips, RFID chips, Hi-Q LEDs, etc. Further, the electrical components may be formed flat and have on one side, which is to be arranged on the substrate, electrical contacts. The electrical contacts may, for example, be provided as contact surfaces, in particular in the form of "bumps", and be arranged to be electrically conductively connected to contacts arranged on the substrate The contacts located on the substrate may be formed as a metal layer.
Weiterhin kann das Substrat eines oder mehrere Materialien der Gruppe Papier, Polyvinylchlorid (PVC), Polyethylen (PE), Polyethylenterephthalat (PET) oder Glykol- modifiziertes Polyethylenterephthalat (PETG), Polyethylennaphthalat (PEN), Acryl- nitril-Butadien-Styrol-Copolymerisat (ABS), Polyvinylbutyral (PVB), Polymethylmethac- rylat (PMMA), Polyimid (PI), Polyvinylalkohol (PVA), Polystyrol (PS), Polyvinylphenol (PVP), Polypropylen (PP), Polycarbonat (PC) oder deren Derivate enthalten. Furthermore, the substrate may contain one or more of the following materials: paper, polyvinyl chloride (PVC), polyethylene (PE), polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile-butadiene-styrene copolymer ( ABS), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or derivatives thereof.
Zum Verbinden der elektrischen Bauteile mit dem Substrat ist weiterhin vorgesehen, dass zwischen den elektrischen Bauteilen und dem Substrat ein Verbindungsmittel aufgetragen ist. Das Verbindungsmittel ist bevorzugt als thermisch aushärtbarer Klebstoff, insbesondere als flüssiger Klebstoff bereitgestellt. Ferner kann der Klebstoff elektrisch leitend und dazu eingerichtet sein, die elektrischen Bauteile und das Substrat mechanisch und elektrisch leitend miteinander zu verbinden. In einer weiteren Variante kann über dem Substrat mit den darauf angeordneten elektrischen Bauteilen eine Trennschicht angeordnet sein. Dadurch kann verhindert werden, dass das zumindest eine Federelement während des Aushärtevorgangs mit dem Verbindungsmittel in Kontakt tritt. For connecting the electrical components to the substrate is further provided that a connecting means is applied between the electrical components and the substrate. The connecting means is preferably provided as a thermally curable adhesive, in particular as a liquid adhesive. Furthermore, the adhesive may be electrically conductive and configured to mechanically and electrically conductively connect the electrical components and the substrate. In a further variant, a separating layer can be arranged above the substrate with the electrical components arranged thereon. This can prevent the at least one spring element from coming into contact with the connection means during the curing process.
Das Unterwerkzeug der bereitgestellten Vorrichtung umfasst die Auflagefläche und die erste Wärmequelle. In einer bevorzugten Ausführungsform ist die Auflagefläche als plane Ebene ausgebildet. Weiterhin kann die Auflagefläche mit einer gekrümmten Oberfläche versehen sein. Die erste Wärmequelle kann dazu eingerichtet sein, die Auflagefläche des Unterwerkzeugs permanent zu beheizen. Hierzu kann die erste Wärmequelle als Heizschiene ausgebildet sein. The lower tool of the provided device comprises the support surface and the first heat source. In a preferred embodiment, the support surface is formed as a plane plane. Furthermore, the support surface may be provided with a curved surface. The first heat source may be configured to permanently heat the support surface of the lower tool. For this purpose, the first heat source may be formed as a heating rail.
In der hier vorgeschlagenen Vorrichtung sind das Oberwerkzeug und das Unterwerkzeug aufeinander zu- und voneinander weg bewegbar. In einer Weiterentwicklung der Vorrichtung können das Oberwerkzeug und das Unterwerkzeug weiterhin in einer Längsrichtung der Vorrichtung relativ zueinander bewegbar sein. Dadurch kann das Anordnen und Entfernen der zu verarbeitenden Komponenten auf und von der Auflagefläche vereinfacht werden. Die Vorrichtung kann hierzu eine Antriebseinheit umfassen, die dazu eingerichtet ist das Oberwerkzeug und/oder das Unterwerkzeug in einer vertikalen Richtung relativ zueinander zu bewegen. Ferne kann die Vorrichtung eine weitere Antriebseinheit aufweisen, um das Oberwerkezug und/oder das Unterwerkzeug in einer horizontalen Richtung relativ zueinander zu bewegen. In the device proposed here, the upper tool and the lower tool are movable toward one another and away from one another. In a further development of the device, the upper tool and the lower tool can continue to be movable relative to each other in a longitudinal direction of the device. As a result, the arrangement and removal of the components to be processed on and from the support surface can be simplified. The device may for this purpose comprise a drive unit which is adapted to move the upper tool and / or the lower tool in a vertical direction relative to each other. The device may further comprise a further drive unit for moving the upper train and / or the lower tool in a horizontal direction relative to one another.
In einer Variante der Vorrichtung kann das Oberwerkzeug eine zweite Wärmequelle umfassen, die dazu eingerichtet ist, dem zwischen der Auflagenfläche und dem An¬ presselement anzuordnenden Substrat mit dem zumindest einen elektrischen Bauteil weiterhin Wärme zuzuführen, um das zwischen dem Substrat und dem zumindest einen elektrischen Bauteil aufgebrachte Verbindungsmittel auszuhärten. Die Verwendung jeweils einer Wärmequelle in dem Unterwerkzeug und dem Oberwerkzeug ermöglicht eine gleichmäßige Wärmezufuhr zu dem zwischen dem Substrat und dem elektrischen Bauteil aufgetragenen Verbindungsmittel. Insbesondere kann dadurch ein nivelliertes Temperaturprofil entlang der zu verarbeitenden Komponenten sichergestellt werden. Dadurch lassen sich qualitativ hochwertigere Ergebnisse erzielen. In a variant of the device, the upper tool may comprise a second heat source, which is adapted to continue to supply heat to be arranged between the support surface and the on ¬ press element substrate with the at least one electrical component to the between the substrate and the at least one electrical component To harden applied bonding agent. The use of a respective heat source in the lower tool and the upper tool allows a uniform supply of heat to the connecting means applied between the substrate and the electrical component. In particular, this can ensure a leveled temperature profile along the components to be processed. As a result, higher quality results can be achieved.
Die zweite Wärmequelle kann als Wärmestrahler bereitgestellt sein. Der Wärmestrahler kann oberhalb des Anpresselements angeordnet sein und einen definierten Abstand zu diesem aufweisen. Weiterhin kann der Abstand zwischen dem Wärme¬ strahler und dem Anpresselement im Betrieb der Vorrichtung im Wesentlichen so - - The second heat source may be provided as a heat radiator. The heat radiator can be arranged above the contact pressure element and have a defined distance from it. Furthermore, the distance between the heat ¬ radiator and the contact pressure in the operation of the device essentially so - -
konstant gehalten werden, dass der durch den Wärmestrahler in das zumindest eine Federelement eingebrachte Wärmestrom konstant ist. Weiterhin vorteilhaft ist, dass durch die Verwendung eines Wärmestrahlers die Wärmezufuhr insbesondere mittels Wärmestrahlung übertragen wird. Entsprechend kann der Aufbau der Vorrichtung vereinfacht werden. Alternativ kann die zweite Wärmequelle dazu eingerichtet sein, eine Wärmezufuhr zu dem Anpresselement mittels Wärmeleitung, d.h. berührend einzubringen. Hierzu kann die zweite Wärmequelle in Form eines Heizwiderstands, z.B. als Heizdraht, etc., ausgebildet und in oder an dem Anpresselement angeordnet sein. be kept constant that the introduced by the heat radiator in the at least one spring element heat flow is constant. It is also advantageous that the heat supply is transmitted in particular by means of heat radiation through the use of a heat radiator. Accordingly, the structure of the device can be simplified. Alternatively, the second heat source may be adapted to supply heat to the pressing member by means of heat conduction, i. touching. For this purpose, the second heat source in the form of a heating resistor, e.g. as a heating wire, etc., formed and arranged in or on the contact pressure element.
Die bereitgestellte Vorrichtung weist zumindest ein Federelement auf, welches in dem Anpresselement umfasst ist. Das zumindest eine Federelement kann dazu eingerichtet ist, eine Kraft auf ein oder mehrere auf dem Substrat angeordnete elektrische Bauteile auszuüben. In einer bevorzugten Ausführungsform weist das The provided device has at least one spring element, which is included in the contact pressure element. The at least one spring element can be configured to exert a force on one or more electrical components arranged on the substrate. In a preferred embodiment, the
Anpresselement mehrere Federelemente auf, welche jeweils einem auf dem Substrat angeordneten elektrischen Bauteil zugeordnet sind. Die mehreren Federelemente können dazu eingerichtet sein, jeweils eine Kraft auf das dem jeweiligen Federelement zugeordnete elektrische Bauteil auszuüben. Diese Anordnung hat den Vorteil, dass gleichzeitig mehrere unterschiedliche elektrische Bauteile mit dem Substrat verbunden werden können. Weiterhin lassen sich dadurch unterschiedliche und sehr kleine Bauteilabstände zwischen den auf dem Substrat anzuordnenden elektrischen Bauteilen erzielen. Pressing element on a plurality of spring elements, which are each associated with an arranged on the substrate electrical component. The plurality of spring elements may be configured to exert a respective force on the electrical component associated with the respective spring element. This arrangement has the advantage that several different electrical components can be connected to the substrate at the same time. Furthermore, this makes it possible to achieve different and very small component spacings between the electrical components to be arranged on the substrate.
In einer Weiterentwicklung der Vorrichtung kann das Oberwerkzeug eine Einspanneinheit zum Einspannen des zumindest einen Federelements aufweisen. Die Einspanneinheit kann ferner dazu eingerichtet sein, das Federelement vorzuspannen, wobei die Vorspannung variabel eingestellt werden kann. In a further development of the device, the upper tool can have a clamping unit for clamping the at least one spring element. The clamping unit may further be adapted to bias the spring element, wherein the bias voltage can be variably adjusted.
Das zumindest eine Federelement ist bevorzugt als Blattfeder, insbesondere als streifenförmige Blattfeder ausgebildet. Hierbei kann die Blattfeder flach ausgebildet sein und eine obere und eine untere Seitenfläche aufweisen, wobei die unter Seitenfläche gegenüberliegend zur Auflagefläche des Unterwerkzeugs angeordnet sein kann. Die Verwendung von Blattfedern ermöglicht einen einfachen und robusten Aufbau des Anpresselements. The at least one spring element is preferably designed as a leaf spring, in particular as a strip-shaped leaf spring. Here, the leaf spring may be formed flat and have an upper and a lower side surface, wherein the lower side surface opposite to the support surface of the lower tool may be arranged. The use of leaf springs allows a simple and robust construction of the contact pressure element.
Die Blattfeder kann ein metallisches Material aufweisen. Beispielsweise kann die Blattfeder in Form eines Edelstahlblechs bereitgestellt sein. Weiterhin kann die Dicke der Blattfeder 1 mm und kleiner sein. In einer Weiterentwicklung kann die Blattfeder eine Klebstoffschutzschicht aufweisen, um ein Anhaften der durch die Vorrichtung zu verarbeitenden Komponenten an der Blattfeder zu verhindern. Ferner kann die Blattfeder thermisch leitfähig und dazu eingerichtet sein, eine durch die zweite Wärmequelle eingebrachte Wärmezufuhr auf das zwischen dem Substrat und dem The leaf spring may comprise a metallic material. For example, the leaf spring may be provided in the form of a stainless steel sheet. Furthermore, the thickness of the leaf spring may be 1 mm and smaller. In a further development, the leaf spring an adhesive protective layer to prevent adhesion of the components to be processed by the device to the leaf spring. Further, the leaf spring may be thermally conductive and configured to supply heat introduced by the second heat source to between the substrate and the substrate
zumindest einen elektrischen Bauteil aufgebrachte Verbindungsmittel zu übertragen. to transfer at least one electrical component applied connecting means.
Das Anpresselement kann mehrere Blattfedern aufweisen. Die mehreren Blattfedern können miteinander verbunden sein, wobei die Blattfedern bevorzugt an einem ersten Ende miteinander verbunden sind. Das aus mehreren Blattfedern bereitgestellte Anpresselement ist vorzugsweise einstückig ausgebildet und in Form eines Federkamms bereitgestellt. Dadurch kann ein einfacher Austausch des Anpresselements sichergestellt werden, wodurch die Vorrichtung zur Verarbeitung unterschiedlicher Baugruppen einfach umgerüstet werden kann. The pressing element may have a plurality of leaf springs. The plurality of leaf springs may be connected to each other, wherein the leaf springs are preferably interconnected at a first end. The pressing element provided from a plurality of leaf springs is preferably formed in one piece and provided in the form of a spring comb. As a result, a simple replacement of the pressing element can be ensured, whereby the device for processing different modules can be easily converted.
Die mehreren Blattfedern des Anpresselements können im Wesentlichen parallel zueinander angeordnet sein. Weiterhin kann/können die Breite der mehreren Blattfedern und/oder die Abstände zwischen denselben gleich oder unterschiedlich ausgebildet sein. Die Ausgestaltung der mehreren Blattfedern, insbesondere deren The plurality of leaf springs of the pressing element can be arranged substantially parallel to one another. Furthermore, the width of the plurality of leaf springs and / or the distances therebetween may be the same or different. The embodiment of the plurality of leaf springs, in particular their
Dimensionierung und Abstände zueinander, kann in Abhängigkeit der zu verbindenden Komponenten erfolgen. Ein derartiger Aufbau hat den Vorteil, dass die Vorrichtung einfach konfiguriert werden kann und dadurch unterschiedliche Bauteile mit unterschiedlichen Bauteilabständen aufwandsreduziert verarbeitet werden können. Dimensioning and distances to each other, can be done depending on the components to be connected. Such a structure has the advantage that the device can be easily configured and thereby different components with different component distances can be processed with reduced costs.
Weiterhin vorteilhaft ist, dass durch einen derartigen Aufbau der Grad der Verformung des Anpresselements während des Betriebs der Vorrichtung reduziert werden kann. Dies kann dadurch erreicht werden, dass das Anpresselement mit sich quer zur Längsrichtung erstreckenden Ausnehmungen versehen sein kann, die die definierten Abstände zwischen den Blattfedern darstellen. Furthermore, it is advantageous that can be reduced during operation of the device by such a structure, the degree of deformation of the pressing member. This can be achieved in that the contact pressure element can be provided with recesses extending transversely to the longitudinal direction, which represent the defined distances between the leaf springs.
In einer Weiterentwicklung kann die Einspanneinheit dazu eingerichtet sein, die zumindest eine Blattfeder bogenförmig so vorzuspannen, dass die Blattfeder eine sich in Richtung der Auflagefläche erstreckende Krümmung aufweist. In einer alternativen Ausführungsform der Vorrichtung kann sich die Krümmung der Blattfeder in eine entgegengesetzte Richtung erstrecken. In a further development, the clamping unit can be set up to bias the at least one leaf spring so that the leaf spring has a curvature extending in the direction of the bearing surface. In an alternative embodiment of the device, the curvature of the leaf spring may extend in an opposite direction.
In einer weiteren Ausgestaltung kann zwischen dem Substrat zu den Bauteilen und dem Federelement ein nicht-metallisches, metallisches, textiles oder Kunststoffband als Trennband angeordnet sein, um das Federelement vor Verschmutzungen durch - - In a further embodiment, a non-metallic, metallic, textile or plastic strip may be arranged as a separating strip between the substrate and the components and the spring element in order to prevent the spring element from becoming soiled - -
Klebstoff zu schützen. Dieses Trennband kann mit dem Oberwerkzeug mitbewegt werden, dann ist es z. B. am Oberwerkzeug befestigt. Es kann aber auch ortsfest angeordnet sein, z. B. am Oberwerkzeug. To protect adhesive. This separation tape can be moved with the upper tool, then it is z. B. attached to the upper tool. But it can also be arranged stationary, z. B. on the upper tool.
Ferner kann die Einspanneinheit ein erstes und ein zweites Lager umfassen, wobei das erste Lager dazu eingerichtet ist, die zumindest eine Blattfeder an dem ersten Ende zu fixieren. Weiterhin kann die zumindest eine Blattfeder an einem dem ersten Ende entgegengesetzten zweiten Ende an dem zweiten Lager anliegen. Das erste Lager kann um eine Schwenkachse schwenkbar gelagert sein und relativ zu dieser in einer Vielzahl von Positionen fixiert werden. Dadurch kann die Vorspannung der zumindest einen Blattfeder variabel eingestellt werden. Furthermore, the clamping unit may comprise a first and a second bearing, wherein the first bearing is adapted to fix the at least one leaf spring at the first end. Furthermore, the at least one leaf spring may rest against the second bearing at a second end opposite the first end. The first bearing may be pivotally mounted about a pivot axis and fixed relative thereto in a plurality of positions. Thereby, the bias of the at least one leaf spring can be variably adjusted.
Weiterhin wird ein Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat der eingangs spezifizierten Art vorgeschlagen. Das Verfahren umfasst ein Auflegen des Substrats mit zumindest einem darauf angeordneten elektrischen Bauteil auf eine Auflagefläche eines Unterwerkzeugs, wobei zwischen dem Substrat und dem zumindest einen elektrischen Bauteil ein Verbindungsmittel aufgetragen ist. Weiterhin erfolgt ein aufeinander Zubewegen des Unterwerkzeugs und eines Oberwerkzeugs. Das Oberwerkzeug umfasst ein Anpresselement mit zumindest einem Federelement. Durch die Relativbewegung des Unterwerkzeugs und des Oberwerkzeugs erfolgt ein elastisches Verformen des zumindest einen Federelements, wodurch eine Kraft auf das zwischen der Auflagefläche und dem Anpresselement angeordnete Substrat mit dem zumindest einen elektrischen Bauteil aufgebracht wird. Diese Kraft bewirkt, dass das zumindest eine elektrische Bauteil gegen das auf der Auflagefläche angeordnete Substrat gepresst wird. Weiterhin umfasst das Verfahren einen Schritt des Zuführens von Wärme zu dem zwischen der Auflagefläche und dem Anpresselement angeordneten Substrat mit dem zumindest einen elektrischen Bauteil. Dadurch erfolgt ein Aushärten des zwischen dem Substrat und dem zumindest einen elektrischen Bauteil aufgetragenen Verbindungsmittels. Furthermore, a method for connecting electrical components to a substrate of the initially specified type is proposed. The method comprises placing the substrate with at least one electrical component arranged thereon on a support surface of a lower tool, wherein a connecting means is applied between the substrate and the at least one electrical component. Furthermore, a successive Zubewegen the lower tool and an upper tool. The upper tool comprises a contact pressure element with at least one spring element. The relative movement of the lower tool and the upper tool elastically deforms the at least one spring element, whereby a force is applied to the substrate arranged between the bearing surface and the contact pressure element with the at least one electrical component. This force causes the at least one electrical component to be pressed against the substrate arranged on the support surface. Furthermore, the method comprises a step of supplying heat to the substrate arranged between the support surface and the pressing element with the at least one electrical component. As a result, hardening of the bonding agent applied between the substrate and the at least one electrical component takes place.
In einer Weiterentwicklung kann das Verfahren ferner folgende Schritte aufweisen: In a further development, the method may further comprise the following steps:
- Einstellen einer Vorspannung des zumindest einen Federelements des Anpresselements mittels einer Einspanneinheit;  - Setting a bias of the at least one spring element of the pressing by means of a clamping unit;
- Aufbringen des Verbindungsmittels auf das Substrat und/oder das zumindest eine elektrische Bauteil;  Applying the bonding agent to the substrate and / or the at least one electrical component;
- Aufbringen des zumindest einen elektrischen Bauteils auf das Substrat, sodass das Verbindungsmittel zwischen dem zumindest einen elektrischen Bauteil und dem Substrat angeordnet ist; - - Applying the at least one electrical component to the substrate so that the connection means is arranged between the at least one electrical component and the substrate; - -
- voneinander Wegbewegen des Unterwerkzeugs und des Oberwerkzeugs; und- Moving away from each other of the lower tool and the upper tool; and
- Fördern des Substrats mit dem zumindest einen darauf angeordneten elektrischen Bauteil von der Auflagefläche. - Feeding the substrate with the at least one electrical component disposed thereon from the support surface.
Femer kann das Verfahren einen Schritt zum Einstellen der auf das elektrische Bauteil auszuübenden Kraft aufweisen. Die Kraft kann in Abhängigkeit der Vorspannung und Dimensionierung des zumindest einen Federeiements eingestellt werden. Weiterhin kann die Kraft in Abhängigkeit der Relativbewegung zwischen dem Oberwerkzeug und dem Unterwerkzeug eingestellt werden. Hierzu kann die durch die Furthermore, the method may include a step of adjusting the force to be applied to the electrical component. The force can be adjusted depending on the bias and dimensioning of the at least one Federeiements. Furthermore, the force can be adjusted depending on the relative movement between the upper tool and the lower tool. This can be done by the
Relativbewegung induzierte elastische Verformung des zumindest einen Federelements variiert werden. Relative movement induced elastic deformation of the at least one spring element can be varied.
Kurzbeschreibunci der Zeichnungen Brief description of the drawings
Weitere Ziele, Merkmale, Vorteile und Anwendungsmöglichkeiten ergeben sich aus der nachfolgenden Beschreibung von nicht einschränkend zu verstehenden Ausführungsbeispielen und den zugehörigen Zeichnungen. Other objects, features, advantages and applications will become apparent from the following description of non-limiting embodiments to be understood and the accompanying drawings.
Figur 1 zeigt eine Seitenansicht einer ersten Ausführungsform einer Vorrichtung zum Verbinden von elektrischen Bauteilen mit einem Substrat. FIG. 1 shows a side view of a first embodiment of a device for connecting electrical components to a substrate.
Figur 2 zeigt eine Frontansicht einer zweiten Ausführungsform der Vorrichtung. FIG. 2 shows a front view of a second embodiment of the device.
Figur 3 zeigt eine perspektivische Sicht auf die zweite Ausführungsform der FIG. 3 shows a perspective view of the second embodiment of the invention
Vorrichtung, welche sich in einem ersten Zustand befindet.  Device which is in a first state.
Figur 4 zeigt eine perspektivische Sicht auf die zweite Ausführungsform der FIG. 4 shows a perspective view of the second embodiment of FIG
Vorrichtung, welche sich in einem zweiten Zustand befindet.  Device which is in a second state.
Figur 5 zeigt eine Draufsicht auf eine Ausführungsform eines Anpresselements. FIG. 5 shows a plan view of an embodiment of a contact pressure element.
Figur 6 zeigt eine perspektivische Sicht auf eine weitere Ausführungsform des FIG. 6 shows a perspective view of a further embodiment of the invention
Anpresselements.  Pressed member.
Detaillierte Beschreibung der Zeichnungen Detailed description of the drawings
Fig. 1 zeigt den schematischen Aufbau einer ersten Ausführungsform einer Thermo- kompressionsvorrichtung 10 zum Verbinden von elektrischen Bauteilen mit einem Substrat. Die Thermokompressionsvorrichtung 10 umfasst ein Unterwerkzeug 12 mit einer ersten Wärmequelle und einer Auflagefläche 14. Die erste Wärmequelle kann in Form einer oder mehrerer Heizschienen vorgesehen sein, die elektrisch betrieben werden. Die Auflagefläche 14 ist als plane Fläche ausgebildet, auf der ein Substrat 16 anliegt. Auf dem Substrat 16 sind elektrisch leitende Kontaktflächen 18 vorgesehen. In einem vorhergehenden Bearbeitungsschritt wurde ein Verbindungsmittel 20 auf das Substrat 16 aufgebracht. Das Verbindungsmittel 20 ist flüssig und härtet thermisch aus. In einem weiteren vorhergehenden Bearbeitungsschritt wurde ein elektrisches Bauteil 22, hier ein Halbleiterchip mit einem Flip-Chip-Design, auf das Substrat 16 und das flüssige Verbindungsmittel 20 aufgebracht. Auf der unteren Seite weist das elektrische Bauteil 22 elektrisch leitende Kontakte 24 auf, welche in Kontakt mit den elektrisch leitenden Kontaktflächen 18 des Substrats 16 stehen. Die Kontakte 24 können beispielsweise die Form von metallischen Kontaktfüßen oder sogenannten "Bumps" aufweisen. 1 shows the schematic structure of a first embodiment of a thermal compression device 10 for connecting electrical components to a Substrate. The thermocompression device 10 comprises a lower tool 12 with a first heat source and a support surface 14. The first heat source may be provided in the form of one or more heating rails, which are electrically operated. The support surface 14 is formed as a flat surface on which a substrate 16 abuts. On the substrate 16 electrically conductive contact surfaces 18 are provided. In a preceding processing step, a connecting means 20 was applied to the substrate 16. The connecting means 20 is liquid and thermally cured. In a further preceding processing step, an electrical component 22, in this case a semiconductor chip with a flip-chip design, was applied to the substrate 16 and the liquid connection means 20. On the lower side, the electrical component 22 has electrically conductive contacts 24, which are in contact with the electrically conductive contact surfaces 18 of the substrate 16. The contacts 24 may for example have the form of metallic contact feet or so-called "bumps".
Die Thermokompressionsvorrichtung 10 umfasst weiterhin ein Oberwerkzeug 26 mit einer zweiten Wärmequelle 28 und einem Anpresselement 30. Die zweite Wärmequelle 28 ist als Wärmestrahler ausgebildet, welcher oberhalb des Anpresselements 30 angeordnet ist. The thermocompression device 10 further comprises an upper tool 26 with a second heat source 28 and a pressing member 30. The second heat source 28 is formed as a heat radiator, which is arranged above the pressing member 30.
Wie durch den in Fig. 1 gezeigten Pfeil A dargestellt, ist das Oberwerkzeug 26 dazu eingerichtet, in vertikaler Richtung auf und ab bewegt zu werden, sodass das Oberwerkzeug 26 relativ zu dem Unterwerkzeug 12 bewegbar ist. In einer alternativen Ausführungsform kann vorgesehen sein, dass das Unterwerkzeug 12 relativ zu dem Oberwerkzeug 26 in vertikaler Richtung bewegbar ist. Das Unterwerkzeug 12 kann weiterhin relativ zu dem Oberwerkzeug 26 in horizontaler Richtung bewegbar sein. As shown by the arrow A shown in FIG. 1, the upper tool 26 is configured to be moved up and down in the vertical direction, so that the upper tool 26 is movable relative to the lower tool 12. In an alternative embodiment it can be provided that the lower tool 12 is movable relative to the upper tool 26 in the vertical direction. The lower tool 12 may further be movable relative to the upper tool 26 in the horizontal direction.
Das Anpresselement 30 umfasst ein Federelement, welches in Form einer streifenförmigen Blattfeder 32 mit einer Unterseite und einer Oberseite ausgebildet ist. In einer weiteren Variante der Vorrichtung kann das Anpresselement 30 mehrere Blattfedern 32 umfassen, die jeweils einem elektrischen Bauteil 22 zugeordnet sind. Die Blattfeder 32 weist eine bogenförmige Form auf und ist in Richtung des elektrischen Bauteils 22 gekrümmt. Die Unterseite der Blattfeder 32 liegt abschnittsweise an der Oberseite des elektrischen Bauteils 22 an. The pressing member 30 comprises a spring element, which is formed in the form of a strip-shaped leaf spring 32 having a bottom and a top. In a further variant of the device, the pressing element 30 may comprise a plurality of leaf springs 32, which are each associated with an electrical component 22. The leaf spring 32 has an arcuate shape and is curved in the direction of the electrical component 22. The underside of the leaf spring 32 abuts in sections at the top of the electrical component 22.
Das Oberwerkzeug 26 umfasst weiterhin eine Einspanneinheit 34 mit einem ersten und einem zweiten Lager 36, 38 mittels derer die Blattfeder 32 in dem Oberwerkzeug 26 eingespannt ist. Die Blattfeder 32 ist an einem ersten Ende durch das erste Lager - The upper tool 26 further comprises a clamping unit 34 having a first and a second bearing 36, 38 by means of which the leaf spring 32 is clamped in the upper tool 26. The leaf spring 32 is at a first end by the first bearing -
fixiert. Das erste Lager 36 ist schwenkbar um eine Schwenkachse gelagert und relativ zu dieser in einer Vielzahl von Positionen fixierbar, wie durch den in der Fig. 1 dargestellten Pfeil B angedeutet. Durch das Einstellen der Position des ersten Lagers 36 um die Schwenkachse kann die Vorspannung der Blattfeder 32 variabel eingestellt werden. An einem zweiten Ende der Blattfeder 32, welches entgegengesetzt zu dem ersten Ende angeordnet ist, liegt die Unterseite der Blattfeder 32 abschnittsweise an dem zweiten Lager 38 an. In einer Weiterentwicklung der Vorrichtung kann das zweite Lager 38 derart bereitgestellt sein, dass die Oberseite oder die Oberseite und die Unterseite der Blattfeder 32 abschnittsweise an diesem anliegt/anliegen. fixed. The first bearing 36 is pivotally mounted about a pivot axis and fixed relative to this in a variety of positions, as indicated by the arrow B shown in FIG. By adjusting the position of the first bearing 36 about the pivot axis, the bias of the leaf spring 32 can be variably adjusted. At a second end of the leaf spring 32, which is arranged opposite to the first end, the underside of the leaf spring 32 is partially against the second bearing 38. In a further development of the device, the second bearing 38 may be provided such that the upper side or the upper side and the lower side of the leaf spring 32 abuts in portions on it.
In Fig. 1 ist ein erster Zustand der Vorrichtung 10 gezeigt, in welchem die Blattfeder 32 durch ein in einem vorherigen Schritt erfolgtes Absenken des Oberwerkzeugs 26 elastisch verformt ist. Durch diese elastische Verformung der Blattfeder 32 resultiert eine Kraft F, welche auf das elektrische Bauteil 22 wirkt und dieses gegen das auf der Auflagefläche 14 aufgelegte Substrat 16 für die Dauer eines Aushärtevorgangs presst. In dem ersten Zustand erfolgt weiterhin eine Wärmezufuhr durch die erste Wärmequelle und den Wärmestrahler 28, um das zwischen dem elektrischen Bauteil 22 und dem Substrat 16 aufgetragene Verbindungsmittel 20 auszuhärten. Folglich findet in dem ersten Zustand ein gleichzeitiges Aufbringen eines Krafteintrags durch die Blattfeder 32 und eines Wärmeeintrags durch die erste Wärmequelle und den Wärmestrahler 28 statt. Dadurch kann sichergestellt werden, dass während des Aushärtens des Verbindungsmittels 20 die Kontaktflächen 24 des elektrischen Bauteils 22 mit den Kontaktflächen 18 des Substrats 16 elektrisch leitend in Kontakt stehen, sodass nach Ablauf des Aushärtevorgangs das elektrische Bauteil 22 mit dem Substrat 16 mechanisch und elektrisch leitend verbunden ist. In Fig. 1, a first state of the device 10 is shown, in which the leaf spring 32 is elastically deformed by a done in a previous step lowering the upper tool 26. By this elastic deformation of the leaf spring 32 results in a force F, which acts on the electrical component 22 and this presses against the laid on the support surface 14 substrate 16 for the duration of a curing process. In the first state, heat is also supplied by the first heat source and the heat radiator 28 to cure the bonding agent 20 applied between the electrical component 22 and the substrate 16. Consequently, in the first state, a simultaneous application of a force input by the leaf spring 32 and a heat input by the first heat source and the heat radiator 28 takes place. As a result, it can be ensured that, during curing of the connecting means 20, the contact surfaces 24 of the electrical component 22 are electrically conductively in contact with the contact surfaces 18 of the substrate 16, so that after the hardening process has elapsed, the electrical component 22 is mechanically and electrically conductively connected to the substrate 16 is.
Bei den im Folgenden beschriebenen weiteren Ausführungsformen der Vorrichtung werden für gleichartige bzw. gleich wirkende Komponenten die gleichen Bezugszeichen wie bei der vorstehend beschriebenen Ausführungsform verwendet. Die Komponenten, die in den weiteren Ausführungsformen nicht erneut beschrieben sind, stimmen in ihren Merkmalen mit den Komponenten der ersten Ausführungsform überein. In the further embodiments of the device described below, the same reference numerals as in the embodiment described above are used for the same or equivalent components. The components, which are not described again in the other embodiments, correspond in their features to the components of the first embodiment.
In Fig. 2 bis 4 ist eine zweite Ausführungsform der Vorrichtung 10a zum gleichzeitigen Verbinden von mehreren elektrischen Bauteilen 22 mit dem Substrat 16 gezeigt. Das gezeigte Anpresselement 30a umfasst drei streifenförmige Blattfedern 32a, welche im Wesentlichen parallel zueinander angeordnet sind. Die mehreren Blattfedern 32a sind an dem ersten Ende miteinander verbunden, sodass das Anpresselement - - FIGS. 2 to 4 show a second embodiment of the device 10a for simultaneously connecting a plurality of electrical components 22 to the substrate 16. The pressing element 30a shown comprises three strip-shaped leaf springs 32a, which are arranged substantially parallel to each other. The plurality of leaf springs 32a are connected to each other at the first end, so that the pressing member - -
30a in Form eines Federkamms ausgebildet ist. Entsprechend der Anzahl der Blattfedern 32a sind auf dem Substrat 16 drei elektrische Bauteile 22 angeordnet, welche jeweils einer Blattfeder 32a zugeordnet und unterhalb dieser angeordnet sind. Die Vorrichtung 10a ermöglicht somit, dass in einem Verfahrensschritt gleichzeitig mehrere elektrische Bauteile 22 mit dem Substrat 16 verbunden werden. In Fig. 2 und 3 ist der erste Zustand der Vorrichtung 10a gezeigt, in welchem die elektrischen Bauteile 22 mittels der Blattfedern 32a des Anpresselements 30a gegen das auf der Auflagefläche 14 angeordnete Substrat 16 für die Dauer des Aushärtevorgangs ge- presst werden. 30a is formed in the form of a spring comb. Corresponding to the number of leaf springs 32a, three electrical components 22 are arranged on the substrate 16, which are each assigned to a leaf spring 32a and arranged below it. The device 10a thus enables several electrical components 22 to be connected to the substrate 16 simultaneously in one method step. FIGS. 2 and 3 show the first state of the device 10a, in which the electrical components 22 are pressed by means of the leaf springs 32a of the pressing element 30a against the substrate 16 arranged on the support surface 14 for the duration of the curing process.
Fig. 4 zeigt die Vorrichtung 10a in einem zweiten Zustand, in dem das Oberwerkzeug 26 relativ zu dem Unterwerkzeug 12 einen in vertikaler Richtung größeren Abstand aufweist. Die Unterseite der Blattfedern 32a liegt nicht auf der Oberseite der den Blattfedern 32a zugeordneten elektrischen Bauteile 22 an. Auf die elektrischen Bauteile 22 wird kein Krafteintrag mittels der Blattfedern 32a ausgeübt. Im Vergleich zu dem ersten Zustand der Vorrichtung 10a weisen die Blattfedern 32a keine durch eine Relativbewegend zwischen dem Oberwerkzeug 26 und dem Unterwerkzeug 12 induzierte elastische Verformung auf. Wie durch gestrichelte Linien 40 in Fig. 4 angedeutet, welche die Form der eingespannten Blattfedern 32a in dem ersten Zustand zeigen, weisen die Blattfedern 32a in dem zweiten Zustand eine stärker ausgeprägte Krümmung in Richtung des Unterwerkezugs 12 auf. 4 shows the device 10a in a second state, in which the upper tool 26 has a greater vertical distance in relation to the lower tool 12. The underside of the leaf springs 32a does not abut on the upper side of the electrical components 22 associated with the leaf springs 32a. No force is applied to the electrical components 22 by means of the leaf springs 32a. Compared to the first state of the device 10a, the leaf springs 32a have no elastic deformation induced by a relative movement between the upper tool 26 and the lower tool 12. As indicated by dashed lines 40 in FIG. 4, which show the shape of the clamped leaf springs 32a in the first state, the leaf springs 32a in the second state have a more pronounced curvature toward the substation train 12.
In Fig. 5 ist eine Draufsicht auf eine weitere Ausführungsform eines Anpresselements 30b gezeigt. Das Anpresselement 30b ist einstückig ausgebildet und weist eine Vielzahl von Blattfedern 32b auf. Die Breite der Blattfedern 32b und die Abstände zwi¬ schen diesen sind gleich ausgebildet. Das Anpresselement 30b kann beispielsweise aus einem Edelstahlblech mit einer Dicke von 1 mm ausgebildet und mittels eines Laserschneideverfahrens hergestellt sein. In Fig. 5 is a plan view of a further embodiment of a pressing member 30b is shown. The pressing member 30b is integrally formed and has a plurality of leaf springs 32b. The width of the leaf springs 32b and the distances Zvi ¬ exploiting that are identical. The pressing member 30b may be formed of a stainless steel sheet having a thickness of 1 mm, for example, and manufactured by a laser cutting method.
Eine weitere Ausführungsform des Anpresselements 30c ist in Fig. 5 gezeigt. Das Anpresselement 30c umfasst mehrere Blattfedern 32c, welche an einem ersten Ende über einen zu den Blattfedern 32c quer verlaufenden Steg miteinander verbunden sind. Der Steg ist dabei eben ausgebildet. Die Blattfedern 32c weisen eine bogenförmige Form auf. Another embodiment of the pressing member 30c is shown in FIG. The pressing element 30c comprises a plurality of leaf springs 32c, which are connected to each other at a first end via a web extending transversely to the leaf springs 32c. The bridge is just formed. The leaf springs 32c have an arcuate shape.

Claims

Ansprüche claims
1. Thermokompressionsvorrichtung (10; 10a) zum Verbinden elektrischer Bauteile (22) mit einem Substrat (16), umfassend: A thermocompression device (10, 10a) for connecting electrical components (22) to a substrate (16), comprising:
ein Unterwerkzeug (12) mit einer ersten Wärmequelle und einer Auflagefläche (14) zum Auflegen des Substrats (16) mit zumindest einem darauf angeordneten elektrischen Bauteil (22);  a lower tool (12) having a first heat source and a support surface (14) for placing the substrate (16) with at least one electrical component (22) disposed thereon;
ein Oberwerkzeug (26) mit einem Anpresselement (30; 30a; 30b; 30c), wobei das Unterwerkzeug (12) und das Oberwerkzeug (26) aufeinander zu und voneinander weg bewegbar sind, wobei  an upper tool (26) having a pressure element (30; 30a; 30b; 30c), wherein the lower tool (12) and the upper tool (26) are movable towards and away from each other, wherein
das Anpresselement (30; 30a; 30b; 30c) zumindest ein Federelement (32; 32a; 32b; 32c) aufweist, das dazu eingerichtet ist, bei einer Relativbewegung zwischen dem Oberwerkzeug (26) und dem Unterwerkzeug (12) elastisch verformt zu werden und dadurch eine Kraft (F) auf ein sich zwischen dem Federelement (32; 32a; 32b; 32c) und der Auflagefläche (14) befindliches Substrat (16) mit zumindest einem darauf angeordneten elektrischen Bauteil (22) auszuüben, um das zumindest eine elektrische Bauteil (22) für die Dauer eines Aushärtevorgangs gegen das auf der Auflagefläche (14) anzuordnende Substrat (16) zu pressen, und wobei  the pressing element (30; 30a; 30b; 30c) has at least one spring element (32; 32a; 32b; 32c) which is adapted to be elastically deformed during a relative movement between the upper tool (26) and the lower tool (12) and thereby exerting a force (F) on a substrate (16) located between the spring element (32; 32a; 32b; 32c) and the support surface (14) with at least one electrical component (22) arranged thereon, around the at least one electrical component (22) for the duration of a curing operation against the on the support surface (14) to be arranged substrate (16) to press, and wherein
die erste Wärmequelle dazu eingerichtet ist, dem zwischen der Auflagefläche (14) und dem Federelement (32; 32a; 32b; 32c) anzuordnenden Substrat (16) mit dem zumindest einen elektrischen Bauteil (22) Wärme zuzuführen, um ein zwischen dem Substrat (16) und dem zumindest einen elektrischen Bauteil (22) aufgebrachtes Verbindungsmittel (22) auszuhärten,  the first heat source is adapted to supply heat to the substrate (16) to be arranged between the support surface (14) and the spring element (32; 32a; 32b; 32c) with the at least one electrical component (22) in order to generate a heat between the substrate (16 ) and the at least one electrical component (22) applied bonding agent (22) to harden,
dadurch gekennzeichnet, dass  characterized in that
die Thermokompressionsvorrichtung (10; 10a) ferner eine Einspanneinheit (34) zum Einspannen des zumindest einen Federelements (32; 32a; 32b; 32c) um- fasst, wobei das zumindest eine Federelement (32; 32a; 32b; 32c) mittels der Einspanneinheit (34) vorgespannt ist, und wobei die Einspanneinheit dazu eingerichtet ist, die Vorspannung des zumindest einen Federelements (32; 32a; 32b; 32c) variabel einzustellen.  the thermocompression device (10; 10a) further comprises a clamping unit (34) for clamping the at least one spring element (32; 32a; 32b; 32c), wherein the at least one spring element (32; 32a; 32b; 34) is biased, and wherein the clamping unit is adapted to adjust the bias of the at least one spring element (32; 32a; 32b; 32c) variably.
2. Thermokompressionsvorrichtung (10; 10a) nach Anspruch 1, bei der das Oberwerkzeug (26) ferner umfasst: The thermocompression device (10; 10a) of claim 1, wherein the upper tool (26) further comprises:
eine zweite Wärmequelle (28), die dazu eingerichtet ist, dem zwischen der Auflagefläche (14) und dem Anpresselement (30; 30a; 30b; 30c) anzuordnenden Substrat (16) mit dem zumindest einen elektrischen Bauteil (22) Wärme zuzuführen, um das zwischen dem Substrat (16) und dem zumindest einen elektrischen Bauteil (22) aufgebrachte Verbindungsmittel (22) auszuhärten. a second heat source (28) which is adapted to supply heat to the substrate (16) to be arranged between the support surface (14) and the pressure element (30; 30a; 30b; 30c) with the at least one electrical component (22), to cure the bonding agent (22) applied between the substrate (16) and the at least one electrical component (22).
3. Thermokompressionsvorrichtung (10; 10a) nach einem der Ansprüche 1 bis 2, bei der das zumindest eine Federelement eine streifenförmige Blattfeder (32; 32a; 32b; 32c) ist. A thermocompression device (10; 10a) according to any one of claims 1 to 2, wherein the at least one spring element is a strip-shaped leaf spring (32; 32a; 32b; 32c).
4. Thermokompressionsvorrichtung (10; 10a) nach Anspruch 3, wobei die zumindest eine Blattfeder (32; 32a; 32b; 32c) mittels der Einspanneinheit (34) bogenförmig vorgespannt ist. A thermocompression device (10; 10a) according to claim 3, wherein said at least one leaf spring (32; 32a; 32b; 32c) is arcuately biased by said clamping unit (34).
5. Thermokompressionsvorrichtung (10; 10a) nach Anspruch 3 oder 4, bei der die Einspanneinheit (34) ein erstes Lager (36) und ein zweites Lager (38) umfasst, wobei das erste Lager (36) dazu eingerichtet ist, die zumindest eine Blattfeder (32; 32a; 32b; 32c) an einem ersten Ende der zumindest einen Blattfeder (32; 32a; 32b; 32c) zu fixieren, und wobei die zumindest eine Blattfeder (32; 32a; 32b; 32c) an einem dem ersten Ende entgegensetzten zweiten Ende an dem zweiten Lager (38) anliegt. The thermocompression device (10; 10a) according to claim 3 or 4, wherein the clamping unit (34) comprises a first bearing (36) and a second bearing (38), the first bearing (36) being adapted to receive the at least one And at least one leaf spring (32; 32a; 32b; 32c) at a first end of the at least one leaf spring (32; 32a; 32b; 32c) opposite second end abuts the second bearing (38).
6. Thermokompressionsvorrichtung (10; 10a) nach Anspruch 5, bei der das erste Lager (36) um eine Schwenkachse schwenkbar gelagert und relativ zur Schwenkachse so fixierbar ist, dass die Vorspannung der zumindest einen Blattfeder (32; 32a; 32b; 32c) einstellbar ist. 6. The thermocompression device (10; 10a) according to claim 5, wherein the first bearing (36) is pivotally mounted about a pivot axis and fixed relative to the pivot axis so that the bias of the at least one leaf spring (32; 32a; 32b; 32c) adjustable is.
7. Thermokompressionsvorrichtung (10a) nach einem der Ansprüche 3 bis 6, bei der das Anpresselement (30a; 30b; 30c) mehrere Blattfedern (32a; 32b; 32c) mit einem definierten Abstand zueinander aufweist, wobei 7. thermocompression device (10a) according to one of claims 3 to 6, wherein the pressing member (30a, 30b, 30c) a plurality of leaf springs (32a, 32b, 32c) having a defined distance from each other, wherein
das Anpresselement (30a; 30b; 30c) in Form eines Federkamms ausgebildet ist, und/oder  the pressing element (30a; 30b; 30c) is designed in the form of a spring comb, and / or
die mehreren Blattfedern (32a; 32b; 32c) im Wesentlichen parallel zueinander angeordnet sind, und/oder  the plurality of leaf springs (32a; 32b; 32c) are arranged substantially parallel to one another, and / or
die Breite der mehreren Blattfedern (32a; 32b; 32c) und/oder die Abstände zwischen denselben gleich oder unterschiedlich ausgebildet ist/sind, und/oder  the width of the plurality of leaf springs (32a; 32b; 32c) and / or the distances therebetween are the same or different, and / or
die mehreren Blattfedern (32a; 32b; 32c) an dem ersten Ende miteinander verbunden sind, und/oder  the plurality of leaf springs (32a; 32b; 32c) are connected together at the first end, and / or
das Anpresselement (30a; 30b; 30c) mit den mehreren Blattfedern (32a; 32b; 32c) einstückig ausgebildet ist, und/oder jede der mehreren Blattfedern (32a; 32b; 32c) jeweils einem von einer Vielzahl von auf dem Substrat (16) anzuordnenden elektrischen Bauteilen (22) zugeordnet ist. the pressure element (30a; 30b; 30c) is integrally formed with the plurality of leaf springs (32a; 32b; 32c), and / or each of the plurality of leaf springs (32a; 32b; 32c) is associated with each of a plurality of electrical components (22) to be arranged on the substrate (16).
8. Thermokompressionsvorrichtung (10; 10a) nach einem der Ansprüche 3 bis 7, bei dem die zumindest eine Blattfeder (32; 32a; 32b; 32c) thermisch leitfähig und dazu eingereicht ist, einen durch die zweite Wärmequelle (28) eingebrachten Wärmeeintrag auf das zwischen dem Substrat (16) und dem zumindest einen elektrischen Bauteil (22) aufgebrachte Verbindungsmittel (20) zu übertragen. A thermocompression device (10; 10a) according to any one of claims 3 to 7, wherein the at least one leaf spring (32; 32a; 32b; 32c) is thermally conductive and is submitted to applying heat introduced by the second heat source (28) to the first heat source transfer between the substrate (16) and the at least one electrical component (22) applied connecting means (20).
9. Thermokompressionsvorrichtung (10; 10a) nach einem der Ansprüche 3 bis Anspruch 8, bei der die zweite Wärmequelle (28) als Wärmestrahler ausgebildet und oberhalb des Anpresselements (30; 30a; 30b; 30c) angeordnet ist, wobei A thermocompression device (10; 10a) according to any one of claims 3 to claim 8, wherein the second heat source (28) is formed as a heat radiator and disposed above the pressing member (30; 30a; 30b; 30c)
der Abstand zwischen dem Wärmestrahler und dem Anpresselement (30; 30a; 30b; 30c) im Wesentlichen so konstant ist, dass der durch den Wärmestrahler in die zumindest eine Blattfeder (32; 32a; 32b; 32c) eingebrachte Wärmestrom konstant ist.  the distance between the heat radiator and the pressing element (30; 30a; 30b; 30c) is substantially constant so that the heat flow introduced by the heat radiator into the at least one leaf spring (32; 32a; 32b; 32c) is constant.
10. Verfahren zum Verbinden von elektrischen Bauteilen (22) mit einem Substrat (16), mit den Schritten: 10. A method of connecting electrical components (22) to a substrate (16), comprising the steps of:
Auflegen des Substrats (16) mit zumindest einem darauf angeordneten elektrischen Bauteil (22) auf eine Aufiagefläche (14) eines Unterwerkzeugs (12), wobei zwischen dem Substrat (16) und dem zumindest einen elektrischen Bauteil (22) ein Verbindungsmittel (20) aufgetragen ist;  Laying the substrate (16) with at least one electrical component (22) arranged thereon on a bearing surface (14) of a lower tool (12), wherein a connecting means (20) is applied between the substrate (16) and the at least one electrical component (22) is;
Aufeinander Zubewegen des Unterwerkzeugs (12) und eines Oberwerkzeugs (26), wobei das Oberwerkzeug (26) ein Anpresselement (30; 30a; 30b; 30c) mit zumindest einem Federelement (32; 32a; 32b; 32c) umfasst, und dadurch elastisches Verformen des zumindest einen Federelements (32; 32a; 32b; 32c), wodurch eine Kraft (F) auf das zwischen der Auflagefläche (14) und dem Federelement (32; 32a; 32b; 32c) angeordnete Substrat (16) mit dem zumindest einen elektrischen Bauteil (22) aufgebracht wird, die bewirkt, dass das zumindest eine elektrische Bauteil (22) gegen das auf der Auflagefläche (14) angeordnete Substrat (16) gepresst wird;  The lower tool (26) comprising a pressing member (30; 30a; 30b; 30c) with at least one spring member (32; 32a; 32b; 32c) and thereby resiliently deforming of the at least one spring element (32; 32a; 32b; 32c), whereby a force (F) is applied to the substrate (16) arranged between the support surface (14) and the spring element (32; 32a; 32b; 32c) with the at least one electrical element Component (22) is applied, which causes the at least one electrical component (22) is pressed against the arranged on the support surface (14) substrate (16);
Zuführen von Wärme zu dem zwischen der Auflagefläche (14) und dem Federelement (32; 32a; 32b; 32c) angeordneten Substrat (16) mit dem zumindest einen elektrischen Bauteil (22) und dadurch Aushärten des zwischen dem Substrat (16) und dem zumindest einen elektrischen Bauteil (22) aufgetragenen Verbindungsmittels (20); und Einstellen einer Vorspannung des zumindest einen Federelements (32; 32a; 32b; 32c) des Anpresselements (30; 30a; 30b; 30c) mittels einer Einspanneinheit (34), wobei die Vorspannung des zumindest einen Federelements (32; 32a; 32b; 32c) mit der Einspanneinheit variabel einzustellen ist. Supplying heat to the substrate (16) disposed between the support surface (14) and the spring element (32; 32a; 32b; 32c) with the at least one electrical component (22) and thereby curing between the substrate (16) and the at least one an electrical component (22) applied connecting means (20); and Adjusting a pretensioning of the at least one spring element (32; 32a; 32b; 32c) of the pressing element (30; 30a; 30b; 30c) by means of a clamping unit (34), wherein the bias of the at least one spring element (32; 32a; 32b; 32c) is to be set variably with the clamping unit.
11. Verfahren nach Anspruch 10, ferner umfassend die Schritte: 11. The method of claim 10, further comprising the steps of:
Aufbringen des Verbindungsmittels (20) auf das Substrat (16) und/oder das zumindest eine elektrische Bauteil (22);  Applying the bonding agent (20) to the substrate (16) and / or the at least one electrical component (22);
Aufbringen des zumindest einen elektrischen Bauteils (22) auf das Substrat Applying the at least one electrical component (22) to the substrate
(16), sodass das Verbindungsmittel (20) zwischen dem zumindest einen elektrischen(16), so that the connecting means (20) between the at least one electrical
Bauteil (22) und dem Substrat (16) angeordnet ist; Component (22) and the substrate (16) is arranged;
Voneinander Wegbewegen des Unterwerkzeugs (12) und des Oberwerkzeugs Moving away from each other of the lower tool (12) and the upper tool
(26); und (26); and
Fördern des Substrats (16) mit dem zumindest einen darauf angeordneten elektrischen Bauteil (22) von der Auflagefläche (14).  Conveying the substrate (16) with the at least one electrical component (22) arranged thereon from the support surface (14).
PCT/EP2016/060165 2015-05-29 2016-05-06 Thermal compression apparatus comprising a spring element with variably adjustable prestressing, and method for connecting electrical components to a substrate using the thermal compression apparatus WO2016192926A1 (en)

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