WO2016173231A1 - 换热装置及具有该换热装置的半导体制冷设备 - Google Patents

换热装置及具有该换热装置的半导体制冷设备 Download PDF

Info

Publication number
WO2016173231A1
WO2016173231A1 PCT/CN2015/093660 CN2015093660W WO2016173231A1 WO 2016173231 A1 WO2016173231 A1 WO 2016173231A1 CN 2015093660 W CN2015093660 W CN 2015093660W WO 2016173231 A1 WO2016173231 A1 WO 2016173231A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat exchange
transfer substrate
heat transfer
exchange device
Prior art date
Application number
PCT/CN2015/093660
Other languages
English (en)
French (fr)
Inventor
王定远
唐林强
高希成
张立臣
肖长亮
李鹏
Original Assignee
青岛海尔智能技术研发有限公司
青岛海尔特种电冰柜有限公司
青岛海尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海尔智能技术研发有限公司, 青岛海尔特种电冰柜有限公司, 青岛海尔股份有限公司 filed Critical 青岛海尔智能技术研发有限公司
Publication of WO2016173231A1 publication Critical patent/WO2016173231A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid

Definitions

  • the present invention relates to heat exchange technology, and more particularly to a heat exchange device and a semiconductor refrigeration device having the same.
  • semiconductor refrigeration equipment has been widely used due to its superior performance, such as semiconductor refrigeration refrigerators, semiconductor refrigeration freezers, and the like.
  • the semiconductor refrigeration equipment utilizes the automatic variable pressure and variable current control technology of the semiconductor refrigeration chip to realize the cooling, and realizes heat dissipation through the heat pipe and the conduction technology, and does not require the refrigerant working medium and the mechanical moving parts. Therefore, semiconductor refrigeration equipment does not have a series of problems in the application of traditional mechanical refrigeration equipment such as working fluid pollution and mechanical vibration.
  • a heat dissipation method in the prior art is to dispose a heat dissipation substrate on the hot end of the semiconductor refrigeration chip for heat dissipation, and a plurality of heat pipes are embedded in the heat dissipation substrate, and the ends of the plurality of heat pipes are disposed in the heat exchange fins to Natural heat dissipation through the heat exchange fins.
  • a further object of the first aspect of the invention is to increase the heat exchange efficiency of the heat exchange device.
  • Still another object of the first aspect of the present invention is to improve the uniformity of heat exchange of the heat exchange device.
  • a heat exchange device comprising:
  • a heat transfer substrate having a heat exchange surface thermally coupled to the heat source to receive heat from the heat source
  • At least one heat pipe having an intermediate section thermally coupled to the heat transfer substrate and two end sections respectively extending from both ends of the intermediate section along a length of the heat transfer substrate;
  • a fan is disposed on the heat transfer substrate to drive the airflow toward the heat exchange fins.
  • a spacing between adjacent ones of the plurality of heat exchange fins is greater than a predetermined minimum spacing threshold.
  • a venting hole is formed in the sheet body of each of the heat exchange fins, and the venting holes of the adjacent two heat exchange fins are opposite to each other.
  • the plurality of heat exchange fins are distributed at two ends of the heat transfer substrate to form two independent heat exchange fin modules, and the fan is configured to face the two heat exchange fins simultaneously The module module blows airflow.
  • the heat exchange device further includes:
  • At least one other heat transfer substrate, the heat transfer substrate and the at least one other heat transfer substrate are juxtaposed and spaced apart in a space between the two heat exchange fin modules, the heat transfer substrate and the One of the fans is disposed on at least one of the other heat transfer substrates.
  • At least one of the heat pipes is disposed on the heat transfer substrate and the at least one other heat transfer substrate, and the heat pipes in the heat transfer substrate and the at least one other heat transfer substrate share the plurality of heat pipes Heat exchange fins.
  • the at least one other heat transfer substrate comprises one of the other heat transfer substrates
  • One of the end sections of at least one of the heat pipes of the heat transfer substrate is located between two end sections of at least one of the other heat transfer substrates; at least one of the other heat transfer substrates One of the end sections of the heat pipe is located between the two end sections of at least one of the heat transfer substrates.
  • each heat exchange fin module is divided into upper and lower portions, and the heat pipe end portions penetrating in each portion are arranged to be arranged at equal intervals along the length direction of the heat exchange fins.
  • the fan includes an axial fan for driving airflow toward the heat exchange fins and a casing fixed to the heat transfer substrate to accommodate the axial fan.
  • a semiconductor refrigeration apparatus comprising:
  • a cabinet having a storage compartment for storing articles therein;
  • a semiconductor refrigerating sheet having a cold end thermally coupled to the storage compartment to provide a cooling capacity to the storage compartment;
  • the heat exchange surface of the heat transfer substrate is thermally connected to the hot end of the semiconductor refrigeration chip to dissipate heat generated by the hot end.
  • the heat exchange device of the present invention can blow airflow to the heat exchange fins located at the end of the heat transfer substrate by providing a fan on the heat transfer substrate, increasing the air flow of the heat exchange fins and increasing the air flowing through the heat exchange fins.
  • the flow rate is used to force the convection heat exchange between the air and the heat exchange fins to improve the heat exchange efficiency of the heat exchange device.
  • the heat exchange capacity of the heat exchange device is small, the natural heat exchange can be performed only by the heat exchange fins, so that the heat exchange device can flexibly select the heat exchange mode and improve the working performance.
  • the venting holes are formed in the sheet of the heat exchange fin, and the venting holes of the adjacent two heat exchange fins are opposite each other, so that the air can pass through the heat exchange fins.
  • the circulation of the ventilating holes enhances the heat exchange capacity of the heat exchange fins, thereby improving the heat exchange efficiency of the heat exchange device.
  • the spacing between adjacent two heat exchange fins is greater than a predetermined minimum spacing threshold, which ensures sufficient contact between each heat exchange fin and the air, further enhancing the exchange
  • the heat exchange capacity of the heat fins improves the heat exchange efficiency of the heat exchange device.
  • a plurality of heat exchange fins are distributed at both ends of the heat transfer substrate, and two independent heat exchange fin modules are formed, so that heat in the heat transfer substrate can pass
  • the heat pipe is evenly distributed to the two heat exchange fin modules, which improves the uniformity of heat exchange of the heat exchange device.
  • FIG. 1 is a schematic structural view of a heat exchange device according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a heat transfer substrate of a heat exchange device according to an embodiment of the present invention
  • Figure 3 is a schematic structural view of a heat exchange device according to another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a heat pipe of a heat exchange device according to an embodiment of the present invention.
  • the heat exchange device 100 includes a heat transfer substrate 11, at least one heat pipe, and a plurality of heat exchange fins 30.
  • the heat transfer substrate 11 has a heat exchange surface that is thermally coupled to a heat source to receive heat from the heat source.
  • the heat pipes each have an intermediate section connected to the heat transfer substrate 11 and two end sections each extending from the both ends of the intermediate section along the length direction of the heat transfer substrate 11.
  • a plurality of heat exchange fins 30 are disposed on the end section of the heat pipe to disperse The heat transferred from the intermediate section to the end section.
  • the heat transfer substrate 11 is further provided with a fan 112 to drive the airflow toward the plurality of heat exchange fins 30, thereby forcibly convective heat exchange between the air and the plurality of heat exchange fins 30, thereby improving heat exchange efficiency.
  • the heat exchange device 100 in the embodiment of the present invention can increase the air flow amount of the heat exchange fins 30 and increase the air flow rate flowing through the heat exchange fins 30 by the fan 112 to force the air and the heat exchange fins 30.
  • the convective heat transfer improves the heat exchange efficiency of the heat exchange device 100.
  • the heat exchange amount of the heat exchange device 100 is small, the natural heat exchange can be performed only by the heat exchange fins 30, so that the heat exchange device 100 can flexibly select the heat exchange mode and improve the work performance.
  • the venting holes 31 are formed in the sheets of each of the heat exchange fins 30, and the venting holes of the adjacent two heat exchange fins 30 are opposed to each other.
  • a plurality of vent holes 31 may be formed in each of the heat exchange fins 30, and the vent holes at the same position of the adjacent two heat exchange fins 30 are opposed to each other. That is to say, the vent holes of the plurality of heat exchange fins 30 at the same position are located on the same straight line, so that the air flows through the vent holes of the plurality of heat exchange fins 30, and the heat exchange capability of the heat exchange fins 30 is enhanced. Thereby, the heat exchange efficiency of the heat exchange device 100 is improved.
  • the heat exchange fins 30 may extend along the width direction of the heat transfer substrate 11 and be in a plane perpendicular to the heat exchange surface of the heat transfer substrate 11, so that the vent holes in the plurality of heat exchange fins 30 are located along the pass.
  • the heat substrate 11 is in a longitudinal direction and parallel to the heat exchange surface, so that the fan disposed on the heat transfer substrate 11 blows airflow along the vent hole 31 to the heat exchange fins 30, thereby increasing the flow velocity of the airflow, facilitating air and air. Forced convection heat transfer between the heat exchange fins 30.
  • the spacing between adjacent ones of the plurality of heat exchange fins is greater than a predetermined minimum spacing threshold. That is, two of the plurality of heat exchange fins 30 are disposed at a distance apart to form a predetermined gap between the adjacent two heat exchange fins.
  • the predetermined minimum spacing threshold is preferably 10 to 20 mm.
  • FIG. 2 is a schematic structural view of a heat transfer substrate of a heat exchange device according to an embodiment of the present invention.
  • the structure and working principle of the fan 112 and the other fan 122 are the same.
  • the fan 112 is disposed on the surface 111 of the heat transfer substrate 11 facing away from the heat exchange surface thereof.
  • the fan 112 may include an axial flow fan 1121 for driving the airflow toward the heat exchange fins 30 and a casing 1122 fixed to the heat transfer substrate 11 to accommodate the axial flow fan 1121, and the casing 1122 is fastened by screws or the like.
  • the piece is secured to a leg 114 that projects from the surface 111.
  • At least one of the through holes 113 extending through the width direction thereof may be disposed in the heat transfer substrate 11, and at least a portion of the intermediate portion of the at least one heat pipe is embedded in the through hole 113.
  • the heat exchange device 100 includes a plurality of heat pipes, and the heat transfer substrate 11 A plurality of perforations extending through the width direction thereof may be provided therein for a plurality of heat pipes to be embedded therein. In some embodiments of the invention, the plurality of perforations may be disposed adjacent to one another.
  • the plurality of perforations are arranged at equal intervals, on the one hand, the heat pipes can be conveniently arranged, and on the other hand, the heat in the heat transfer substrate 11 can be uniformly transmitted to the plurality of heat pipes.
  • the size of the perforations can be matched to the outer diameter of the heat pipe to bring the outer surface of the heat pipe into intimate contact with the heat transfer substrate located in the perforation after the heat pipe is embedded in the perforation, thereby enabling efficient heat transfer.
  • the heat transfer substrate 11 may include two combined portions, which are an upper substrate 11a having a surface 111 and a lower substrate 11b having a heat exchange surface, respectively.
  • the two opposite surfaces of the upper substrate 11a and the lower substrate 11b are respectively provided with correspondingly sized grooves.
  • the grooves on the opposite surfaces of the two are combined to form heat.
  • a card slot extending through the width direction of the heat transfer substrate 11 may be formed on the heat exchange surface of the heat transfer substrate 11 to allow the heat pipe to be embedded therein.
  • the card slot is sized such that the heat pipe can be snap-fitted therein by an external force and the heat pipe is kept from being automatically disengaged from the card slot.
  • a plurality of heat exchange fins 30 are distributed at both ends of the heat transfer substrate 11 to form two independent heat exchange fin modules, thereby increasing the exchange.
  • the array area of the heat fins ensures effective natural heat dissipation.
  • the heat exchange device 100 includes at least two heat pipes, whereby at least two heat pipes embedded in the heat transfer substrate 11 can be divided into two groups extending along the longitudinal direction of the heat transfer substrate 11 toward the ends of the heat transfer substrate 11 respectively. Heat pipe.
  • the end sections of each set of heat pipes are disposed in the heat exchange fin modules located at the respective ends of the heat transfer substrate 11, thereby facilitating the arrangement and installation of at least two heat pipes, and also making full use of the two exchanges Heat exchange space between the heat fin modules.
  • At least two heat pipes can be interlaced and disposed in a heat exchange space between the two heat exchange fin modules, and the heat exchange space is filled in an irregular or regular form, thereby effectively utilizing the heat exchange. Space increases heat transfer and reduces the number of heat pipes.
  • the heat exchange device 100 further includes at least one other heat transfer substrate, and the heat transfer substrate 11 and the at least one other heat transfer substrate are juxtaposed and spaced apart at the two heat exchange fins.
  • a fan is disposed on the heat transfer substrate 11 and at least one other heat transfer substrate.
  • at least one heat pipe is disposed on the heat transfer substrate 11 and the at least one other heat transfer substrate, and the heat transfer substrate 11 and the heat pipes in the at least one other heat transfer substrate share the plurality of heat exchange fins 30.
  • the heat exchange device 100 further includes one other heat transfer substrate 12, and the other heat transfer substrate 12 is provided with other fans 122.
  • the other heat transfer substrate 12 and the heat transfer substrate 11 are aligned in the longitudinal direction and the width direction.
  • the heat transfer substrate 11 and the other heat transfer substrates 12 are arranged side by side in the width direction of the heat transfer substrate 11 at a predetermined distance.
  • At least one end section of the heat pipe embedded in the heat transfer substrate 11 is located between at least two end sections of the heat pipe embedded in the other heat transfer substrate 12. That is, the heat pipe embedded in the heat transfer substrate 11 and at least a portion of the heat pipes embedded in the other heat transfer substrate 12 are interleaved and disposed in a heat exchange space between the two heat exchange fin modules.
  • the heat transfer substrate 11 is provided with a first heat pipe 21, and the other heat transfer substrate 12 is provided with a second heat pipe 22.
  • the end section 212 of the first heat pipe 21 is located between the end section 222 of the second heat pipe 22 and the other end section 223, and the end section 222 of the second heat pipe 22 is located at the end zone of the first heat pipe 21. Between the segment 212 and the other end segment 213.
  • each heat exchange fin module is divided into upper and lower portions, and the end portions of the heat pipes passing through each portion are disposed along the heat exchange fins.
  • the length directions are arranged at equal intervals. That is to say, the end portion of the heat pipe can divide each portion of each heat exchange fin module into equal length portions along its length direction, so that the heat of the end portion of the heat pipe is uniformly transmitted to the heat exchange tube.
  • Hot fins That is, the heat received by the heat exchange fins is more uniform, which facilitates more uniform heat exchange and improves heat exchange efficiency.
  • the upper part of the heat exchange fins of the two heat exchange fin modules are located at the left and right ends of the heat transfer substrate 11, and the lower heat exchange fins of the two heat exchange fin modules are located on the other heat transfer substrate 12 Left and right ends.
  • the first heat pipe 21 and the second heat pipe 22 may each have a substantially U shape such that the two end sections of each heat pipe extend in parallel from the opposite ends of the middle section thereof in the same direction.
  • the two end sections of each heat pipe are disposed in the same heat exchange fin module.
  • the end section 212 and the other end section 213 of the first heat pipe 21 are directed from the opposite ends of the intermediate section 211 toward the same end of the heat transfer substrate 11 along the length of the heat transfer substrate 11.
  • the right end of the state shown in Figure 1 extends such that both the end section 212 and the other end section 213 are threaded into the heat exchange fin module at the end.
  • the first heat pipe 21 and the second heat pipe 22 may each be substantially Z-shaped. That is, the two end sections of each heat pipe are respectively extended from the two ends of the intermediate section along the length direction of the heat transfer substrate 11 toward the two different ends of the heat transfer substrate 11, thereby making each heat pipe Two end sections are respectively disposed at both ends of the heat transfer substrate 11 In the two heat exchange fin modules.
  • the first heat pipe 21 may be substantially U-shaped
  • the second heat pipe 22 may be substantially Z-shaped
  • the first heat pipe 21 and the second heat pipe 22 are interleaved.
  • the intermediate section 211 of the first heat pipe 21 has a first linear subsection 2111 and a second straight line which are sequentially connected in the width direction of the heat transfer substrate.
  • the first linear subsection 2111, the second linear subsection 2112, and the third linear subsection 2113 may be located on the same straight line, or may be located on different straight lines, or may be adjacent two sub-segments.
  • the segments are located on two straight lines with a certain angle.
  • the lengths of the first linear subsection 2111, the second linear subsection 2112, and the third linear subsection 2113 may be equal or unequal.
  • the present invention also provides a semiconductor refrigeration apparatus including a case, a semiconductor refrigerating sheet, and a heat exchange device 100.
  • a storage compartment for storing items is defined within the cabinet.
  • the cold end of the semiconductor refrigerating sheet is thermally coupled to the storage compartment to provide refrigeration for the storage compartment.
  • the heat exchange surface of the heat transfer substrate 11 of the heat exchange device 100 is thermally connected to the hot end of the semiconductor refrigerating sheet to dissipate the heat generated by the hot end.
  • the cold end of the semiconductor refrigerating sheet may abut against the inner or outer wall of the storage compartment, and the hot end of the semiconductor refrigerating sheet may abut the heat exchange surface of the heat transfer substrate 11.
  • the side of the heat transfer substrate 11 facing the heat exchange surface is provided with a screw fixing hole for fixing the hot end of the semiconductor refrigerating sheet to ensure reliable thermal connection of the hot end to the heat exchange device 100.
  • the heat exchange device 100 may be a heat sink device. In other embodiments of the present invention, the heat exchanger device 100 may also be a heat sink device.
  • the semiconductor refrigeration device involved in the embodiments of the present invention may be a refrigerator, a freezer, a refrigerated refrigerating can or other device that uses a semiconductor refrigeration sheet for cooling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种换热装置（100）及具有换热装置（100）的半导体制冷设备。换热装置（100）包括传热基板（11，12）、至少一根热管（21，22）和多个换热翅片（30）。热管（21，22）具有与传热基板（11，12）热连接的中间区段（211）和两个分别由中间区段（211）的两端沿该传热基板（11，12）的长度方向延伸的端部区段（212，213）。多个换热翅片（30）设置在热管（21，22）的端部区段（212，213）上，以散发从中间区段（211）向端部区段（212，213）传送的热量。传热基板（11，12）上设置有风机（112，122），以驱使气流朝向换热翅片（30）流动，从而将换热翅片（30）与空气之间的强制对流换热和换热翅片（30）的自然换热结合在一起，提高换热装置（100）换热的效率。还提供一种半导体制冷设备，包括限定有储物间室的箱体、半导体制冷片和与半导体制冷片的热端热连接的换热装置（100）。

Description

换热装置及具有该换热装置的半导体制冷设备 技术领域
本发明涉及换热技术，特别是涉及一种换热装置及具有该换热装置的半导体制冷设备。
背景技术
近年来，半导体制冷设备由于其优越的性能而被广泛应用，例如半导体制冷冰箱、半导体制冷冰柜等。半导体制冷设备利用半导体制冷片的自动变压变流控制技术实现制冷，同时通过热管及传导技术实现散热，无需制冷工质和机械运动部件。因此，半导体制冷设备在应用过程中没有工质污染和机械振动等传统机械制冷设备在应用上的一系列问题。
然而，半导体制冷片的冷端产生冷量的同时，其热端会产生大量的热量。为了保证半导体制冷片可靠持续地进行工作，需要及时散发其热端产生的热量。现有技术中的一种散热方式为在半导体制冷片的热端设置一散热基板进行散热，散热基板中嵌设有多根热管，多根热管的端部穿设在换热翅片中，以通过换热翅片进行自然散热。然而，当半导体制冷片的功率较大时，仅适用换热翅片不足以有效地散发半导体制冷片热端产生的热量，从而影响半导体制冷片的正常工作。
发明内容
本发明第一方面的一个目的旨在克服现有换热装置的至少一个缺陷，提供一种换热装置，其能够根据需要实现换热翅片的自然换热和/或强制对流换热，从而提高换热装置的工作性能。
本发明第一方面的一个进一步的目的是要提高换热装置的换热效率。
本发明第一方面的又一个进一步的目的是要提高换热装置换热的均匀性。
本发明第二方面的一个目的是提供一种具有换热装置的半导体制冷设备。
根据本发明的第一方面，提供了一种换热装置，包括：
传热基板，具有与热源热连接的换热面，以从所述热源接收热量；
至少一根热管，具有与所述传热基板热连接的中间区段和两个分别由所述中间区段的两端沿所述传热基板的长度方向延伸的端部区段；以及
多个换热翅片，设置在所述热管的端部区段上，以散发从所述中间区段向所述端部区段传送的热量；其中
所述传热基板上设置有风机，以驱使气流朝向所述换热翅片流动。
可选地，所述多个换热翅片中的相邻两个换热翅片之间的间距大于一预定的最小间距阈值。
可选地，每个所述换热翅片的片体中均形成有通风孔，且相邻两个换热翅片的通风孔正向相对。
可选地，所述多个换热翅片分布在所述传热基板的两端，以形成两个独立的换热翅片模组，所述风机配置成同时朝向所述两个换热翅片模组吹送气流。
可选地，所述换热装置还包括：
至少一个其他传热基板，所述传热基板和所述至少一个其他传热基板并列且间隔设置在位于所述两个换热翅片模组之间的空间内，所述传热基板和所述至少一个其他传热基板上均设置有一个所述风机。
可选地，所述传热基板和所述至少一个其他传热基板上均设置至少一根所述热管，且所述传热基板和所述至少一个其他传热基板中的热管共用所述多个换热翅片。
可选地，所述至少一个其他传热基板包括一个所述其他传热基板；且
所述传热基板的至少一个所述热管的其中一个端部区段位于该其他传热基板中的至少一根热管的两个端部区段之间；该其他传热基板的至少一个所述热管的其中一个端部区段位于所述传热基板中的至少一根热管的两个端部区段之间。
可选地，每个换热翅片模组分为上下两个部分，穿设在每个部分中的热管端部区段配置成沿所述换热翅片的长度方向以等间距间隔排列。
可选地，所述风机包括用于驱动气流朝所述换热翅片流动的轴流风扇和固定在所述传热基板上以容纳所述轴流风扇的机壳。
根据本发明的第二方面，还提供了一种半导体制冷设备，包括：
箱体，其内限定有用于储存物品的储物间室；
半导体制冷片，其冷端与所述储物间室热连接，以为所述储物间室提供冷量；以及
以上任一所述的换热装置，其传热基板的换热面与所述半导体制冷片的热端热连接，以散发所述热端产生的热量。
本发明的换热装置由于在传热基板上设置风机，可向位于传热基板端部的换热翅片吹送气流，增加换热翅片的空气流动量和提高流经换热翅片的空气流速，以使空气与换热翅片之间进行强制对流换热，提高换热装置的换热效率。当换热装置的换热量较小时，可仅通过换热翅片进行自然换热，从而换热装置能够灵活选择换热方式，提高其工作性能。
进一步地，由于本发明的换热装置中，换热翅片的片体中均形成有通风孔，且相邻两个换热翅片的通风孔正向相对，可使空气通过换热翅片的通风孔流通，增强了换热翅片的换热能力，从而提高换热装置的换热效率。
进一步地，由于本发明的换热装置中，相邻两个换热翅片之间的间距大于一预定的最小间距阈值，可保证每个换热翅片与空气的充分接触，进一步增强了换热翅片的换热能力，提高了换热装置的换热效率。
进一步地，由于本发明的换热装置中，多个换热翅片分布在传热基板的两端，形成了两个独立的换热翅片模组，从而可使传热基板中的热量通过热管均匀地散发至两个换热翅片模组中，提高了换热装置换热的均匀性。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的换热装置的示意性结构图；
图2是根据本发明一个实施例的换热装置的传热基板的示意性结构图；
图3是根据本发明另一个实施例的换热装置的示意性结构图；
图4是根据本发明一个实施例的换热装置的热管的示意性结构图。
具体实施方式
图1是根据本发明一个实施例的换热装置的示意性结构图。如图1所示，换热装置100包括：传热基板11、至少一根热管和多个换热翅片30。传热基板11具有与热源热连接的换热面，以从热源接受热量。热管均具有与传热基板11连接的中间区段和两个分别由中间区段的两端沿传热基板11的长度方向延伸的端部区段。多个换热翅片30设置在热管的端部区段上，以散 发从中间区段向端部区段传送的热量。特别地，传热基板11上还设置有风机112，以驱使气流朝向多个换热翅片30流动，从而使空气与多个换热翅片30发生强制对流换热，提高换热效率。本发明实施例中的换热装置100能够通过风机112增加换热翅片30的空气流动量和提高流经换热翅片30的空气流速，以使空气与换热翅片30之间进行强制对流换热，提高换热装置100的换热效率。当换热装置100的换热量较小时，可仅通过换热翅片30进行自然换热，从而换热装置100能够灵活选择换热方式，提高其工作性能。
在本发明的一些实施例中，每个换热翅片30的片体中均形成有通风孔31，且相邻两个换热翅片30的通风孔正向相对。每个换热翅片30中可形成有多个通风孔31，相邻两个换热翅片30的位于同一位置的通风孔正向相对。也就是说，多个换热翅片30的位于同一位置的通风孔位于同一直线上，以便于空气通过多个换热翅片30的通风孔流通，增强换热翅片30的换热能力，从而提高换热装置100的换热效率。
进一步地，换热翅片30可沿传热基板11的宽度方向延伸，且其所在平面于传热基板11的换热面垂直，从而使得多个换热翅片30中的通风孔位于沿传热基板11长度方向上的、且与换热面平行的直线上，以便于设置在传热基板11上的风机沿通风孔31向换热翅片30吹送气流，提高气流的流速，便于空气与换热翅片30之间进行强制对流换热。
在本发明的一些实施例中，多个换热翅片中的相邻两个换热翅片之间的间距大于一预定的最小间距阈值。也就是说，多个换热翅片30中的相邻两个换热翅片间隔一定距离设置，以在相邻两个换热翅片之间形成预定间隙。该预定的最小间距阈值优选为10～20mm。
图2是根据本发明一个实施例的换热装置的传热基板的示意性结构图。风机112和其他风机122结构及工作原理相同，以风机112为例，如图2所示，风机112设置在传热基板11的背离其换热面的表面111上。具体地，风机112可包括用于驱动气流朝向换热翅片30流动的轴流风扇1121和固定在传热基板11上以容纳轴流风扇1121的机壳1122，机壳1122通过螺钉等紧固件固定在由表面111凸出的支脚114上。
在本发明的一些实施例中，如图2所示，传热基板11内可设有至少一个贯穿其宽度方向的穿孔113，至少一根热管的至少部分中间区段嵌设在穿孔113中。在本发明实施例中，换热装置100包括多根热管，传热基板11 内可设有多个贯穿其宽度方向的穿孔，以供多根热管嵌设其中。在本发明的一些实施例中，该多个穿孔可相邻设置。在更优选的实施例中，该多个穿孔以等间距间隔排列，一方面可方便布置热管，另一方面，可使传热基板11中的热量均匀地传递至多根热管。穿孔的大小可与热管的外径相匹配，以在热管嵌设在穿孔中后，使热管的外表面与位于穿孔内的传热基板紧密接触，从而使实现热量的有效传递。
进一步地，如图2所示，传热基板11可包括组合而成的两部分，分别为具有表面111的上基板11a和具有换热面的下基板11b。上基板11a和下基板11b的两个相对的表面分别开设有尺寸相当的凹槽，当上基板11a和下基板11b相互紧贴组合时，位于两者相对表面上的凹槽组合形成可供热管的中间区段穿过的穿孔113。
本领域技术人员应理解，在本发明其他的实施例中，还可在传热基板11的换热面上开设贯穿传热基板11宽度方向的卡装槽，以供热管嵌设于其中。卡装槽的尺寸配置成使得热管可在外力作用下卡装嵌入其中，并保持该热管，避免其自动脱离卡装槽。
在本发明的一些实施例中，如图1所示，多个换热翅片30分布在传热基板11的两端，以形成两个独立的换热翅片模组，从而增大了换热翅片的阵列面积，保证有效的自然散热。换热装置100包括至少两根热管，由此，嵌设在传热基板11中的至少两根热管可分为沿传热基板11长度方向上的分别朝向传热基板11两端延伸的两组热管。每组热管的端部区段均穿设在位于传热基板11的相应端部的换热翅片模组中，从而便于至少两根热管的布置和安装，同时也充分利用了位于两个换热翅片模组之间的换热空间。进一步地，至少两根热管可在位于两个换热翅片模组之间的换热空间内交错穿插设置，以不规则或规则的形式布满该换热空间，从而有效利用了该换热空间，提高了换热效果，减少了热管数量。
在本发明的一些实施例中，如图1所示，换热装置100还包括至少一个其他传热基板，传热基板11和至少一个其他传热基板并列且间隔设置在位于两个换热翅片模组之间的空间内，传热基板11和至少一个其他传热基板上均设置有一个风机。进一步地，传热基板11和至少一个其他传热基板上均设置至少一根热管，且传热基板11和至少一个其他传热基板中的热管共用多个换热翅片30。
进一步地，本发明实施例中，换热装置100还包括一个其他传热基板12，其他传热基板12上设置有其他风机122。其他传热基板12与传热基板11的长度方向、宽度方向均一致。传热基板11和其他传热基板12沿传热基板11的宽度方向并列且间隔一定距离设置。嵌设在传热基板11中的热管的至少一个端部区段位于嵌设在其他传热基板12中的热管的至少两个端部区段之间。也就是说，嵌设在传热基板11中的热管和嵌设在其他传热基板12中的至少部分热管在位于两个换热翅片模组之间的换热空间内交错穿插设置。具体地，传热基板11中设置有第一热管21，其他传热基板12中设置有第二热管22。第一热管21的端部区段212位于第二热管22的端部区段222和另一端部区段223之间，第二热管22的端部区段222位于第一热管21的端部区段212和另一端部区段213之间。
图3是根据本发明另一个实施例的换热装置的示意性结构图。如图3所示，在本发明一些实施例中，每个换热翅片模组分为上下两个部分，穿设在每个部分中的热管端部区段配置成沿换热翅片的长度方向以等间距间隔排列。也就是说，热管端部区段可将每个换热翅片模组中的每个部分沿其长度方向分割为等长的若干部分，以使热管端部区段的热量均匀地传递至换热翅片。也就是使换热翅片接受到的热量更加均匀，便于其更加均匀地换热，提高换热效率。具体地，两个换热翅片模组的上部分换热翅片位于传热基板11的左右两端，两个换热翅片模组的下部分换热翅片位于其他传热基板12的左右两端。
图4是根据本发明一个实施例的换热装置的热管的示意性结构图。结合图1和图4，第一热管21和第二热管22可均大致呈U形，以使每根热管的两个端部区段由其中间区段的两端朝同一方向平行延伸，进而使得每根热管的两个端部区段均穿设在同一个换热翅片模组中。结合图1和图4，第一热管21的端部区段212和另一个端部区段213由其中间区段211的两端沿传热基板11的长度方向朝传热基板11的同一端(图1中所示状态的右端)延伸，从而端部区段212和另一个端部区段213均穿设在位于该端的换热翅片模组中。本领域技术人员应理解，在本发明其他的实施例中，第一热管21和第二热管22还可均大致呈Z形。也即是，每根热管的两个端部区段分别由其中间区段的两端沿传热基板11的长度方向朝传热基板11的两个不同端部延伸，从而使每根热管的两个端部区段分别穿设在位于传热基板11两端 的两个换热翅片模组中。当然，在本发明的又一些其他的实施例中，第一热管21可大致呈U形，第二热管22可大致呈Z形，第一热管21和第二热管22交错穿插设置。
具体地，以第一热管21为例，如图3所示，第一热管21的中间区段211具有沿传热基板的宽度方向依次连接的第一直线型子区段2111、第二直线型子区段2112和第三直线型子区段2113。第一直线型子区段2111、第二直线型子区段2112和第三直线型子区段2113可位于同一条直线上，也可分别位于不同的直线上，还可以为相邻两个子区段位于具有一定夹角的两条直线上。第一直线型子区段2111、第二直线型子区段2112和第三直线型子区段2113的长度可相等，也可不相等。
本发明还提供一种半导体制冷设备，包括箱体、半导体制冷片和换热装置100。箱体内限定有用于储存物品的储物间室。半导体制冷片的冷端与储物间室热连接，以为该储物间室提供冷量。换热装置100的传热基板11的换热面与半导体制冷片的热端热连接，以散发该热端产生的热量。
在本发明的一些实施例中，半导体制冷片的冷端可紧贴储物间室的内壁或外壁，半导体制冷片的热端可紧贴传热基板11的换热面。传热基板11朝向换热面的一侧设置有螺丝固定孔，用于固定半导体制冷片的热端，保证该热端与换热装置100的可靠热连接。在本发明实施例中，换热装置100可为散热装置，在本发明其他的实施例中，换热装置100还可为散冷装置。
本领域技术人员应理解，本发明实施例中涉及的半导体制冷设备可以为冰箱、冰柜、冷冻冷藏罐或其他利用半导体制冷片进行制冷的设备。
本领域技术人员还应理解，在没有特别说明的情况下，本发明所称的“上”、“下”、“左”、“右”、“前”和“后”均是以安装在半导体制冷设备中的换热装置100的正常使用状态为基准而言的。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种换热装置，包括：
    传热基板，具有与热源热连接的换热面，以从所述热源接收热量；
    至少一根热管，具有与所述传热基板热连接的中间区段和两个分别由所述中间区段的两端沿所述传热基板的长度方向延伸的端部区段；以及
    多个换热翅片，设置在所述热管的端部区段上，以散发从所述中间区段向所述端部区段传送的热量；其中
    所述传热基板上设置有风机，以驱使气流朝向所述换热翅片流动。
  2. 根据权利要求1所述的换热装置，其中
    所述多个换热翅片中的相邻两个换热翅片之间的间距大于一预定的最小间距阈值。
  3. 根据权利要求1所述的换热装置，其中
    每个所述换热翅片的片体中均形成有通风孔，且相邻两个换热翅片的通风孔正向相对。
  4. 根据权利要求1所述的换热装置，其中
    所述多个换热翅片分布在所述传热基板的两端，以形成两个独立的换热翅片模组，所述风机配置成同时朝向所述两个换热翅片模组吹送气流。
  5. 根据权利要求4所述的换热装置，还包括：
    至少一个其他传热基板，所述传热基板和所述至少一个其他传热基板并列且间隔设置在位于所述两个换热翅片模组之间的空间内，所述传热基板和所述至少一个其他传热基板上均设置有一个所述风机。
  6. 根据权利要求5所述的换热装置，其中
    所述传热基板和所述至少一个其他传热基板上均设置至少一根所述热管，且所述传热基板和所述至少一个其他传热基板中的热管共用所述多个换热翅片。
  7. 根据权利要求6所述的换热装置，其中
    所述至少一个其他传热基板包括一个所述其他传热基板；且
    所述传热基板的至少一个所述热管的其中一个端部区段位于该其他传热基板中的至少一根热管的两个端部区段之间；该其他传热基板的至少一个所述热管的其中一个端部区段位于所述传热基板中的至少一根热管的两个端部区段之间。
  8. 根据权利要求7所述的换热装置，其中
    每个换热翅片模组分为上下两个部分，穿设在每个部分中的热管端部区段配置成沿所述换热翅片的长度方向以等间距间隔排列。
  9. 根据权利要求1所述的换热装置，其中
    所述风机包括用于驱动气流朝所述换热翅片流动的轴流风扇和固定在所述传热基板上以容纳所述轴流风扇的机壳。
  10. 一种半导体制冷设备，包括：
    箱体，其内限定有用于储存物品的储物间室；
    半导体制冷片，其冷端与所述储物间室热连接，以为所述储物间室提供冷量；以及
    如权利要求1-9中任一项所述的换热装置，其传热基板的换热面与所述半导体制冷片的热端热连接，以散发所述热端产生的热量。
PCT/CN2015/093660 2015-04-30 2015-11-03 换热装置及具有该换热装置的半导体制冷设备 WO2016173231A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510219598.8A CN106197099A (zh) 2015-04-30 2015-04-30 换热装置及具有该换热装置的半导体制冷设备
CN201510219598.8 2015-04-30

Publications (1)

Publication Number Publication Date
WO2016173231A1 true WO2016173231A1 (zh) 2016-11-03

Family

ID=57198926

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/093660 WO2016173231A1 (zh) 2015-04-30 2015-11-03 换热装置及具有该换热装置的半导体制冷设备

Country Status (2)

Country Link
CN (1) CN106197099A (zh)
WO (1) WO2016173231A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107172854B (zh) * 2017-05-17 2019-04-02 南京林业大学 基于板翅式热管散热器的车载集成控制器冷却***
CN111326649B (zh) * 2018-12-17 2024-01-19 青岛海尔智能技术研发有限公司 翅片散热器及制冷柜机
CN110749123A (zh) * 2019-10-10 2020-02-04 青岛海尔智能技术研发有限公司 散热器和制冷设备
CN110749122A (zh) * 2019-10-10 2020-02-04 青岛海尔智能技术研发有限公司 散热器和制冷设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
CN204134455U (zh) * 2014-07-24 2015-02-04 青岛海尔洗衣机有限公司 除湿装置
US20150075184A1 (en) * 2013-09-16 2015-03-19 Phononic Devices, Inc. Enhanced heat transport systems for cooling chambers and surfaces
CN204612555U (zh) * 2015-04-30 2015-09-02 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4929325B2 (ja) * 2009-08-27 2012-05-09 株式会社日立製作所 電力変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
US20150075184A1 (en) * 2013-09-16 2015-03-19 Phononic Devices, Inc. Enhanced heat transport systems for cooling chambers and surfaces
CN204134455U (zh) * 2014-07-24 2015-02-04 青岛海尔洗衣机有限公司 除湿装置
CN204612555U (zh) * 2015-04-30 2015-09-02 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备

Also Published As

Publication number Publication date
CN106197099A (zh) 2016-12-07

Similar Documents

Publication Publication Date Title
TWI650522B (zh) 冷媒式散熱裝置
JP6138093B2 (ja) サーバ冷却システム及びその冷却方法
WO2016173231A1 (zh) 换热装置及具有该换热装置的半导体制冷设备
US10925183B2 (en) 3D extended cooling mechanism for integrated server
CN107027274A (zh) 一种机柜半导体冷却装置
US10634434B2 (en) Arrangement for cooling a closed cabinet
WO2017128659A1 (zh) 具有热交换的装置
WO2016095589A1 (zh) 半导体制冷冰箱
CN109189184B (zh) 一种大数据主机箱
CN105258382A (zh) 换热装置及具有该换热装置的半导体制冷冰箱
CN204612555U (zh) 换热装置及具有该换热装置的半导体制冷设备
WO2016123995A1 (zh) 半导体制冷冰箱
CN107764113A (zh) 换热装置及具有该换热装置的半导体制冷设备
WO2016192298A1 (zh) 传冷装置及具有该传冷装置的半导体制冷箱
CN205537254U (zh) 换热装置及具有该换热装置的半导体制冷冰箱
CN105466261A (zh) 换热装置及具有该换热装置的半导体制冷冰箱
CN215370320U (zh) 一种散热风扇结构
CN112099607B (zh) 一种基于大数据云计算设备的散热装置
US20070044948A1 (en) Water-cooled cooler for CPU of PC
US20210041180A1 (en) Thermosiphon heat exchanger
CN204694129U (zh) 换热装置及具有该换热装置的半导体制冷设备
CN105485969B (zh) 换热装置及具有该换热装置的半导体制冷冰箱
CN105466100B (zh) 换热装置及具有该换热装置的半导体制冷冰箱
TWM522328U (zh) 製冷裝置
CN111366018B (zh) 半导体制冷用散热组件及半导体制冷设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15890606

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15890606

Country of ref document: EP

Kind code of ref document: A1