WO2016167628A3 - Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same - Google Patents

Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same Download PDF

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Publication number
WO2016167628A3
WO2016167628A3 PCT/KR2016/004010 KR2016004010W WO2016167628A3 WO 2016167628 A3 WO2016167628 A3 WO 2016167628A3 KR 2016004010 W KR2016004010 W KR 2016004010W WO 2016167628 A3 WO2016167628 A3 WO 2016167628A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal passage
present
manufacturing same
same
package structure
Prior art date
Application number
PCT/KR2016/004010
Other languages
French (fr)
Korean (ko)
Other versions
WO2016167628A2 (en
Inventor
이영수
차승진
Original Assignee
주식회사 엘리텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘리텍 filed Critical 주식회사 엘리텍
Publication of WO2016167628A2 publication Critical patent/WO2016167628A2/en
Publication of WO2016167628A3 publication Critical patent/WO2016167628A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a metal printed circuit board (PCB), which can improve the heat radiating performance of an electronic component, such as a light emitting diode (LED) chip, and a method for manufacturing the same. In addition, the present invention provides an LED package structure, which has an LED chip packaged on a metal PCB, and a method for manufacturing the same. The metal PCB according to the present invention comprises: a metal base having a thermal passage protruding from the surface thereof; an insulating layer formed on the surface of the metal base and fitted thereto such that the thermal passage extends through the same; first and second conductor patterns formed on the insulating surface at an interval from each other such that the thermal passage extends through the same; a pair of first and second lands formed on the surfaces of the first and second conductor patterns, respectively, to be adjacent to the thermal passage; and a cover layer formed on the surfaces of the first and second conductor patterns such that the thermal passage and the pair of first and second lands are exposed. The LED package structure according to the present invention comprises an LED chip packaged on a thermal passage and on a pair of first and second lands such that heat can be transferred to a metal base through the thermal passage. The present invention is advantageous in that the heat radiating performance of the LED chip can be improved, and the simple configuration and easy manufacturing can reduce the manufacturing cost.
PCT/KR2016/004010 2015-04-16 2016-04-18 Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same WO2016167628A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0054062 2015-04-16
KR1020150054062A KR101768908B1 (en) 2015-04-16 2015-04-16 Metal printed circuit board and method for manufacturing same and light emitting diode package structure and method for manufacturing same

Publications (2)

Publication Number Publication Date
WO2016167628A2 WO2016167628A2 (en) 2016-10-20
WO2016167628A3 true WO2016167628A3 (en) 2016-12-29

Family

ID=57126862

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/004010 WO2016167628A2 (en) 2015-04-16 2016-04-18 Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same

Country Status (2)

Country Link
KR (1) KR101768908B1 (en)
WO (1) WO2016167628A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102112327B1 (en) 2018-12-04 2020-05-18 주식회사 엠디엠 Method for manufacturing electronic circuit on a surface of three-dimensional structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110060074A (en) * 2009-11-30 2011-06-08 삼성엘이디 주식회사 Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
KR20120001460A (en) * 2010-06-29 2012-01-04 삼성엘이디 주식회사 Light emitting module and head ramp module using the same
KR20130105107A (en) * 2012-03-16 2013-09-25 아이스파이프 주식회사 Led module and method for manufacturing the same
KR101322868B1 (en) * 2012-09-20 2013-10-28 강병수 Metal pcb useful for mounting led package and method for fabricating the same
JP2014120529A (en) * 2012-12-13 2014-06-30 Denki Kagaku Kogyo Kk Circuit board, led module and led package, and method of manufacturing circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110060074A (en) * 2009-11-30 2011-06-08 삼성엘이디 주식회사 Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
KR20120001460A (en) * 2010-06-29 2012-01-04 삼성엘이디 주식회사 Light emitting module and head ramp module using the same
KR20130105107A (en) * 2012-03-16 2013-09-25 아이스파이프 주식회사 Led module and method for manufacturing the same
KR101322868B1 (en) * 2012-09-20 2013-10-28 강병수 Metal pcb useful for mounting led package and method for fabricating the same
JP2014120529A (en) * 2012-12-13 2014-06-30 Denki Kagaku Kogyo Kk Circuit board, led module and led package, and method of manufacturing circuit board

Also Published As

Publication number Publication date
WO2016167628A2 (en) 2016-10-20
KR101768908B1 (en) 2017-08-30
KR20160123684A (en) 2016-10-26

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