WO2016167628A3 - Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same - Google Patents
Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same Download PDFInfo
- Publication number
- WO2016167628A3 WO2016167628A3 PCT/KR2016/004010 KR2016004010W WO2016167628A3 WO 2016167628 A3 WO2016167628 A3 WO 2016167628A3 KR 2016004010 W KR2016004010 W KR 2016004010W WO 2016167628 A3 WO2016167628 A3 WO 2016167628A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal passage
- present
- manufacturing same
- same
- package structure
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 4
- 239000004020 conductor Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a metal printed circuit board (PCB), which can improve the heat radiating performance of an electronic component, such as a light emitting diode (LED) chip, and a method for manufacturing the same. In addition, the present invention provides an LED package structure, which has an LED chip packaged on a metal PCB, and a method for manufacturing the same. The metal PCB according to the present invention comprises: a metal base having a thermal passage protruding from the surface thereof; an insulating layer formed on the surface of the metal base and fitted thereto such that the thermal passage extends through the same; first and second conductor patterns formed on the insulating surface at an interval from each other such that the thermal passage extends through the same; a pair of first and second lands formed on the surfaces of the first and second conductor patterns, respectively, to be adjacent to the thermal passage; and a cover layer formed on the surfaces of the first and second conductor patterns such that the thermal passage and the pair of first and second lands are exposed. The LED package structure according to the present invention comprises an LED chip packaged on a thermal passage and on a pair of first and second lands such that heat can be transferred to a metal base through the thermal passage. The present invention is advantageous in that the heat radiating performance of the LED chip can be improved, and the simple configuration and easy manufacturing can reduce the manufacturing cost.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0054062 | 2015-04-16 | ||
KR1020150054062A KR101768908B1 (en) | 2015-04-16 | 2015-04-16 | Metal printed circuit board and method for manufacturing same and light emitting diode package structure and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2016167628A2 WO2016167628A2 (en) | 2016-10-20 |
WO2016167628A3 true WO2016167628A3 (en) | 2016-12-29 |
Family
ID=57126862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2016/004010 WO2016167628A2 (en) | 2015-04-16 | 2016-04-18 | Metal printed circuit board, method for manufacturing same, led package structure, and method for manufacturing same |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101768908B1 (en) |
WO (1) | WO2016167628A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102112327B1 (en) | 2018-12-04 | 2020-05-18 | 주식회사 엠디엠 | Method for manufacturing electronic circuit on a surface of three-dimensional structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110060074A (en) * | 2009-11-30 | 2011-06-08 | 삼성엘이디 주식회사 | Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
KR20120001460A (en) * | 2010-06-29 | 2012-01-04 | 삼성엘이디 주식회사 | Light emitting module and head ramp module using the same |
KR20130105107A (en) * | 2012-03-16 | 2013-09-25 | 아이스파이프 주식회사 | Led module and method for manufacturing the same |
KR101322868B1 (en) * | 2012-09-20 | 2013-10-28 | 강병수 | Metal pcb useful for mounting led package and method for fabricating the same |
JP2014120529A (en) * | 2012-12-13 | 2014-06-30 | Denki Kagaku Kogyo Kk | Circuit board, led module and led package, and method of manufacturing circuit board |
-
2015
- 2015-04-16 KR KR1020150054062A patent/KR101768908B1/en active IP Right Grant
-
2016
- 2016-04-18 WO PCT/KR2016/004010 patent/WO2016167628A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110060074A (en) * | 2009-11-30 | 2011-06-08 | 삼성엘이디 주식회사 | Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
KR20120001460A (en) * | 2010-06-29 | 2012-01-04 | 삼성엘이디 주식회사 | Light emitting module and head ramp module using the same |
KR20130105107A (en) * | 2012-03-16 | 2013-09-25 | 아이스파이프 주식회사 | Led module and method for manufacturing the same |
KR101322868B1 (en) * | 2012-09-20 | 2013-10-28 | 강병수 | Metal pcb useful for mounting led package and method for fabricating the same |
JP2014120529A (en) * | 2012-12-13 | 2014-06-30 | Denki Kagaku Kogyo Kk | Circuit board, led module and led package, and method of manufacturing circuit board |
Also Published As
Publication number | Publication date |
---|---|
WO2016167628A2 (en) | 2016-10-20 |
KR101768908B1 (en) | 2017-08-30 |
KR20160123684A (en) | 2016-10-26 |
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