WO2016150298A1 - Novel metallized film for capacitor - Google Patents
Novel metallized film for capacitor Download PDFInfo
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- WO2016150298A1 WO2016150298A1 PCT/CN2016/075765 CN2016075765W WO2016150298A1 WO 2016150298 A1 WO2016150298 A1 WO 2016150298A1 CN 2016075765 W CN2016075765 W CN 2016075765W WO 2016150298 A1 WO2016150298 A1 WO 2016150298A1
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- 239000011104 metalized film Substances 0.000 title claims abstract description 23
- 239000003990 capacitor Substances 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 239000010408 film Substances 0.000 claims abstract description 30
- 229910000611 Zinc aluminium Inorganic materials 0.000 claims abstract description 10
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 claims abstract description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 239000011701 zinc Substances 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 230000008719 thickening Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/015—Special provisions for self-healing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
Definitions
- the utility model relates to the technical field of capacitors, in particular to a metalized film for a novel capacitor.
- the existing metallized film capacitors a metal layer is uniformly evaporated on the surface of the base film, and the edge is thickened again, and the following defects are found: (1) The product with high withstand voltage is thin due to the coating, and is subjected to ripple. The current capacity is insufficient, and the product is easily oxidized during use, resulting in a decrease in product capacity and loss; (2) A product with strong ripple current capability, because of the relatively thick coating layer and poor self-healing ability, resulting in low product withstand voltage.
- the existing metallized film capacitors cannot have both the withstand voltage and the ability to withstand ripple current, and there is an inverse ratio phenomenon. The higher the withstand voltage, the worse the ability to withstand ripple current; the reverse, the better.
- the existing high-pressure product coating is generally zinc-aluminum, the square resistance is generally above 30 ⁇ , the coating is thin, and it is easily oxidized, resulting in premature failure of the product.
- the purpose of the utility model is to overcome the above deficiencies, and relates to a novel metallized film for manufacturing a capacitor, so that the product has the advantages of high withstand voltage, strong resistance to ripple current, and difficulty in oxidation.
- a metalized film for a novel capacitor comprising a base film and a metal layer, wherein a metal layer is evaporated on the base film, and the metal layer is an aluminum layer, a zinc layer or a zinc aluminum alloy.
- a layer, a blank area of the uncoated metal layer is provided at one end of the base film in the width direction, the blank area has a width of 2-4 mm, and the metal layer is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is the edge thickening zone, the width is 3 ⁇ 10mm, the square resistance is 3-8 ⁇ ; the area 2 is the low square resistance zone, the width is 1/4 ⁇ 1/2 of the total length of the base film, and the square resistance is 4-20 ⁇ . ; Area 3 is a high resistance zone with a square resistance greater than 10 ⁇ ; and on a metallized film, the area 3 square resistance ⁇ area 2 square resistance ⁇ area 1 square resistance, the square resistance value is stepped.
- the self-healing capacity and withstand voltage level of the capacitor core wound out of this structure are mainly determined by the high resistance zone of zone 3, and the zone 3 is made of pure aluminum vapor deposition, with thin coating, high square resistance and self-healing ability. Will be stronger, the pressure will be higher;
- the regions 1 and 2 are generally zinc-aluminum metal layers with a relatively small thickness of the square-resistance, while the conventional vapor-deposited films with the same pressure-resistant grade are generally thinner and have a thinner plating.
- the zinc-aluminum metal layer, zinc metal is easily oxidized in humid air, so the higher the square resistance, the thinner the coating is, so the step-type evaporation method has an advantage in oxidation resistance;
- Figure 1 is a schematic view of the structure of the present invention
- Figure 2 is a cutaway view of the utility model
- Figure 1-2 shows a specific embodiment of a novel metallized film for a capacitor of the present invention:
- the base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1.
- the metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal.
- the blank area 3 of the layer 2 has a width of 2 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 3 mm and a square resistance value.
- region 2 is a low square resistance region, the width is 1/4 to 1/2 of the total length of the base film 1 , the square resistance value is 4 ⁇ ; the region 3 is a high square resistance region, and the square resistance value is 11 ⁇ ;
- the area 3 square resistance ⁇ area 2 square resistance ⁇ area 1 square resistance the square resistance value is stepped.
- the base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1.
- the metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal.
- the blank area 3 of the layer 2 has a width of 3 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 5 mm and a square resistance value.
- the area 3 square resistance ⁇ area 2 square resistance ⁇ area 1 square resistance, the square resistance value shows a step shape.
- the base film 1 and the metal layer 2 are included, and the metal layer 2 is vapor-deposited on the base film 1, and the metal layer 2 is an aluminum layer and zinc. a layer or a zinc-aluminum alloy layer, a blank region 3 of the unplated metal layer 2 is provided at one end of the base film 1 in the width direction, and the width of the blank region 3 is 3.5 mm, and the metal layer 2 is composed of the region 1 and the region according to the square resistance value.
- the base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1.
- the metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal.
- the blank area 3 of the layer 2 has a width of 4 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 10 mm and a square resistance value.
- the utility model has the advantages that the capacitor has good self-healing property, high withstand voltage, strong ripple current resistance, strong anti-oxidation capability, small loss, strong pulse current resistance and small capacity change.
- the present invention is not limited to the above embodiments, and all the manners in which the similar structures and methods of the present invention are used to achieve the object of the present invention are within the scope of the present invention.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Abstract
A novel metallized film for a capacitor, comprising a base film and a metal layer. The metal layer is evaporated on the base film 1; the metal layer is an aluminium layer, a zinc layer or a zinc-aluminium alloy layer; a blank region on which the metal layer is not plated is arranged on an end edge in the width direction of the base film 1; and the metal layer is composed of a region 1, a region 2 and a region 3 according to sheet resistance values, wherein the region 1 is an edge-thickened region, the region 2 is a low sheet resistance region, the region 3 is a high sheet resistance region, and the regions are on a metallized film, the sheet resistance of the region 2 being less than or equal to the sheet resistance of the region 3 and being greater than or equal to the sheet resistance of the region 1, and the sheet resistance values being step-shaped. The novel metallized film for a capacitor has the advantages of a high withstanding voltage and a powerful ripple current bearing capability.
Description
本实用新型涉及电容器技术领域，特别涉及一种新型电容器用金属化薄膜。The utility model relates to the technical field of capacitors, in particular to a metalized film for a novel capacitor.
现有金属化薄膜电容器，在基膜表面均匀蒸镀一层金属层，边缘处加厚再度一层，存在以下不足之处：(1)耐压高的产品，由于镀层比较薄，承受纹波电流能力不足，且产品在使用过程中容易氧化造成产品容量下降、损耗上升；(2)承受纹波电流能力强的产品，由于镀层比较厚，自愈能力差，造成产品耐压低。现有金属化薄膜电容器在耐压上与承受纹波电流能力上不能兼得，且存在反比现象,耐压越高，承受纹波电流能力越差；反之，越好。同时现有耐压高的产品镀层一般为锌铝，方阻一般在30Ω以上，镀层薄，极易氧化，造成产品提前失效。In the existing metallized film capacitors, a metal layer is uniformly evaporated on the surface of the base film, and the edge is thickened again, and the following defects are found: (1) The product with high withstand voltage is thin due to the coating, and is subjected to ripple. The current capacity is insufficient, and the product is easily oxidized during use, resulting in a decrease in product capacity and loss; (2) A product with strong ripple current capability, because of the relatively thick coating layer and poor self-healing ability, resulting in low product withstand voltage. The existing metallized film capacitors cannot have both the withstand voltage and the ability to withstand ripple current, and there is an inverse ratio phenomenon. The higher the withstand voltage, the worse the ability to withstand ripple current; the reverse, the better. At the same time, the existing high-pressure product coating is generally zinc-aluminum, the square resistance is generally above 30Ω, the coating is thin, and it is easily oxidized, resulting in premature failure of the product.
发明内容：Summary of the invention:
本实用新型的目的是为了克服以上的不足，涉及一种用于制作电容器的新型金属化薄膜，从而使产品同时具有耐压高、承受纹波电流能力强，且不易氧化等优点。The purpose of the utility model is to overcome the above deficiencies, and relates to a novel metallized film for manufacturing a capacitor, so that the product has the advantages of high withstand voltage, strong resistance to ripple current, and difficulty in oxidation.
本实用新型的目的通过以下技术方案来实现：一种新型电容器用金属化薄膜，包括基膜和金属层，在基膜上蒸镀有金属层，金属层为铝层、锌层或锌铝合金层，基膜的宽度方向的一端边设有未镀金属层的空白区，所述空白区的宽度为2-4mm，金属层根据方阻值大小由区域1、区域2和区域3组成，区域1为边缘加厚区，宽度为3～10mm，方阻值为3-8Ω；区域2为低方阻区，宽度为基膜总长的1/4～1/2，方阻值为4-20Ω；区域3为高方阻区，方阻值大于10
Ω；且在一张金属化薄膜上，区域3方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。The object of the utility model is achieved by the following technical solutions: a metalized film for a novel capacitor, comprising a base film and a metal layer, wherein a metal layer is evaporated on the base film, and the metal layer is an aluminum layer, a zinc layer or a zinc aluminum alloy. a layer, a blank area of the uncoated metal layer is provided at one end of the base film in the width direction, the blank area has a width of 2-4 mm, and the metal layer is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is the edge thickening zone, the width is 3~10mm, the square resistance is 3-8Ω; the area 2 is the low square resistance zone, the width is 1/4~1/2 of the total length of the base film, and the square resistance is 4-20Ω. ; Area 3 is a high resistance zone with a square resistance greater than 10
Ω; and on a metallized film, the area 3 square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value is stepped.
本实用新型与现有技术相比具有的优点：The utility model has advantages compared with the prior art:
1、此阶梯式蒸镀方式，边缘加厚区2-1比常规蒸镀方式的加厚区更宽，方阻更低，所以在电极引出上等效串联电阻小，产品的损耗小；1. This step type vapor deposition method, the edge thickening zone 2-1 is wider than the thickening zone of the conventional vapor deposition method, and the square resistance is lower, so the equivalent series resistance is small on the electrode lead-out, and the loss of the product is small;
2、此种结构卷绕出来的电容芯子，其自愈能力、耐压水平主要由区域3高方阻区决定，区域3的采用纯铝蒸镀，镀层薄，方阻高，自愈能力将更强，耐压将更高；2. The self-healing capacity and withstand voltage level of the capacitor core wound out of this structure are mainly determined by the high resistance zone of zone 3, and the zone 3 is made of pure aluminum vapor deposition, with thin coating, high square resistance and self-healing ability. Will be stronger, the pressure will be higher;
3、此阶梯式蒸镀方式，区域1，区域2镀层均加厚，金属镀层在整体上电阻表现得比常规蒸镀方式要小，因此产品在承受同样的纹波电流的情况下，发热将更小，温升将更低，故此种结构承受纹波电流能力将更强；3. This step type evaporation method, the area 1 and the area 2 plating are thickened, and the metal plating layer has a smaller electrical resistance than the conventional vapor deposition method, so the product will withstand the same ripple current, and the heat will be Smaller, the temperature rise will be lower, so the structure will withstand the ripple current capability will be stronger;
4、此阶梯式蒸镀方式，区域1与区域2为一般为方阻较小镀层较厚的锌铝金属层，而常规蒸镀方式同样耐压等级的薄膜一般为方阻较高镀层较薄的锌铝金属层，锌金属在潮湿的空气中极易氧化，因此方阻越高镀层越薄体现的越明显，故此阶梯式蒸镀方式在抗氧化能力上更有优势；4. In this step-type evaporation method, the regions 1 and 2 are generally zinc-aluminum metal layers with a relatively small thickness of the square-resistance, while the conventional vapor-deposited films with the same pressure-resistant grade are generally thinner and have a thinner plating. The zinc-aluminum metal layer, zinc metal is easily oxidized in humid air, so the higher the square resistance, the thinner the coating is, so the step-type evaporation method has an advantage in oxidation resistance;
图1是本实用新型的结构示意图；Figure 1 is a schematic view of the structure of the present invention;
图2是本实用新型的切面图；Figure 2 is a cutaway view of the utility model;
图中标号：1-基膜、2-金属层、3-空白区、2-1-区域1、2-2-区域2、2-3-区域3。Reference numerals in the figure: 1-base film, 2-metal layer, 3-space area, 2-1-1 area 1, 2-2- area 2, 2-3-area 3.
为了加深对本实用新型的理解，下面将结合实施例和附图对本实用新型作
进一步详述，该实施例仅用于解释本实用新型，并不构成对本实用新型保护范围的限定。In order to deepen the understanding of the present invention, the present invention will be described below with reference to the embodiments and the accompanying drawings.
The embodiments are only used to explain the present invention, and are not intended to limit the scope of the present invention.
如图1-2示出了本实用新型一种新型电容器用金属化薄膜的具体实施方式：Figure 1-2 shows a specific embodiment of a novel metallized film for a capacitor of the present invention:
实施例1Example 1
包括基膜1和金属层2，在基膜1上蒸镀有金属层2，金属层2为铝层、锌层或锌铝合金层，基膜1的宽度方向的一端边设有未镀金属层2的空白区3，空白区3的宽度为2mm，金属层2根据方阻值大小由区域1、区域2和区域3组成，区域1为边缘加厚区，宽度为3mm，方阻值为3Ω；区域2为低方阻区，宽度为基膜1总长的1/4～1/2，方阻值为是4Ω；区域3为高方阻区，方阻值为11Ω；且在一张金属化薄膜上，区域3方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。The base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1. The metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal. The blank area 3 of the layer 2 has a width of 2 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 3 mm and a square resistance value. 3 Ω; region 2 is a low square resistance region, the width is 1/4 to 1/2 of the total length of the base film 1 , the square resistance value is 4 Ω; the region 3 is a high square resistance region, and the square resistance value is 11 Ω; On the metallized film, the area 3 square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value is stepped.
实施例2Example 2
包括基膜1和金属层2，在基膜1上蒸镀有金属层2，金属层2为铝层、锌层或锌铝合金层，基膜1的宽度方向的一端边设有未镀金属层2的空白区3，空白区3的宽度为3mm，金属层2根据方阻值大小由区域1、区域2和区域3组成，区域1为边缘加厚区，宽度为5mm，方阻值为4.5Ω；区域2为低方阻区，宽度为基膜1总长的1/4～1/2，方阻值为是10Ω；区域3为高方阻区，方阻值为20Ω；且在一张金属化薄膜上，区域3方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。The base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1. The metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal. The blank area 3 of the layer 2 has a width of 3 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 5 mm and a square resistance value. 4.5 Ω; region 2 is a low square resistance region, the width is 1/4 to 1/2 of the total length of the base film 1 and the square resistance value is 10 Ω; the region 3 is a high square resistance region, and the square resistance value is 20 Ω; On the metallized film, the area 3 square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value shows a step shape.
实施例3Example 3
包括基膜1和金属层2，在基膜1上蒸镀有金属层2，金属层2为铝层、锌
层或锌铝合金层，基膜1的宽度方向的一端边设有未镀金属层2的空白区3，空白区3的宽度为3.5mm，金属层2根据方阻值大小由区域1、区域2和区域3组成，区域1为边缘加厚区，宽度为7.5mm，方阻值为6Ω；区域2为低方阻区，宽度为基膜1总长的1/4～1/2，方阻值为是15Ω；区域3为高方阻区，方阻值为30Ω；且在一张金属化薄膜上，区域3方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。The base film 1 and the metal layer 2 are included, and the metal layer 2 is vapor-deposited on the base film 1, and the metal layer 2 is an aluminum layer and zinc.
a layer or a zinc-aluminum alloy layer, a blank region 3 of the unplated metal layer 2 is provided at one end of the base film 1 in the width direction, and the width of the blank region 3 is 3.5 mm, and the metal layer 2 is composed of the region 1 and the region according to the square resistance value. 2 and area 3 composition, area 1 is edge thickening area, width is 7.5mm, square resistance is 6Ω; area 2 is low square resistance area, width is 1/4~1/2 of the total length of base film 1, square resistance The value is 15Ω; the area 3 is a high square resistance zone, and the square resistance is 30Ω; and on a metallized film, the area 3 square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value is stepped .
实施例4Example 4
包括基膜1和金属层2，在基膜1上蒸镀有金属层2，金属层2为铝层、锌层或锌铝合金层，基膜1的宽度方向的一端边设有未镀金属层2的空白区3，空白区3的宽度为4mm，金属层2根据方阻值大小由区域1、区域2和区域3组成，区域1为边缘加厚区，宽度为10mm，方阻值为8Ω；区域2为低方阻区，宽度为基膜1总长的1/4～1/2，方阻值为是20Ω；区域3为高方阻区，方阻值为50Ω；且在一张金属化薄膜上，区域3方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。The base film 1 and the metal layer 2 are formed, and the metal layer 2 is vapor-deposited on the base film 1. The metal layer 2 is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer, and one end side of the base film 1 in the width direction is provided with an unplated metal. The blank area 3 of the layer 2 has a width of 4 mm, and the metal layer 2 is composed of the area 1, the area 2 and the area 3 according to the square resistance value, and the area 1 is an edge thickening area with a width of 10 mm and a square resistance value. 8 Ω; region 2 is a low square resistance region, the width is 1/4 to 1/2 of the total length of the base film 1 and the square resistance value is 20 Ω; the region 3 is a high square resistance region, and the square resistance value is 50 Ω; On the metallized film, the area 3 square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value is stepped.
本实用新型使电容器同时具有自愈性好，耐压高，承受纹波电流能力强，抗氧化能力强，损耗小，承受脉冲电流能力强，容量变化小等优点。The utility model has the advantages that the capacitor has good self-healing property, high withstand voltage, strong ripple current resistance, strong anti-oxidation capability, small loss, strong pulse current resistance and small capacity change.
申请人又一声明，本实用新型通过上述实施例来说明本实用新型的实现方法及装置结构，但本实用新型并不局限于上述实施方式，即不意味着本实用新型必须依赖上述方法及结构才能实施。所属技术领域的技术人员应该明了，对本实用新型的任何改进，对本实用新型所选用实现方法等效替换及步骤的添加、具体方式的选择等，均落在本实用新型的保护范围和公开的范围之内。The applicant further clarifies the implementation method and device structure of the present invention through the above embodiments, but the present invention is not limited to the above embodiments, that is, the present invention does not mean that the present invention must rely on the above method and structure. Can be implemented. It should be apparent to those skilled in the art that any improvement of the present invention, the equivalent replacement of the implementation method selected by the present invention, the addition of steps, the selection of specific methods, etc., fall within the scope of protection and the scope of the present disclosure. within.
本实用新型并不限于上述实施方式，凡采用和本实用新型相似结构及其方法来实现本实用新型目的的所有方式，均在本实用新型的保护范围之内。
The present invention is not limited to the above embodiments, and all the manners in which the similar structures and methods of the present invention are used to achieve the object of the present invention are within the scope of the present invention.
Claims (7)
- 一种新型电容器用金属化薄膜，包括基膜(1)和金属层(2)，其特征在于：在所述基膜(1)上蒸镀有金属层(2)，金属层(2)为铝层、锌层或锌铝合金层。A novel metallized film for capacitors, comprising a base film (1) and a metal layer (2), characterized in that a metal layer (2) is evaporated on the base film (1), and the metal layer (2) is Aluminum layer, zinc layer or zinc-aluminum alloy layer.
- 根据权利要求1所述一种新型电容器用金属化薄膜，其特征在于：所述基膜(1)的宽度方向的一端边设有未镀金属层(2)的空白区(3)，所述空白区(3)的宽度为2-4mm。A metallized film for a capacitor according to claim 1, wherein a blank region (3) of the unplated metal layer (2) is provided at one end of the base film (1) in the width direction, The width of the blank area (3) is 2-4 mm.
- 根据权利要求2所述一种新型电容器用金属化薄膜，其特征在于：金属层(2)根据方阻值大小由区域1(2-1)、区域2(2-2)和区域3(2-3)组成，所述区域1(2-1)为边缘加厚区，宽度为3～10mm，方阻值为3-8Ω；所述区域2(2-2)为低方阻区，宽度为基膜(1)总长的1/4～1/2，方阻值为是4-20Ω；所述区域3(2-3)为高方阻区，方阻值大于10Ω；且在一张金属化薄膜上，所述区域3(2-3)方阻≥区域2方阻≥区域1方阻，方阻值呈现出阶梯状。A metallized film for a capacitor according to claim 2, wherein the metal layer (2) is composed of a region 1 (2-1), a region 2 (2-2), and a region 3 (2) according to a square resistance value. -3) Composition, the region 1 (2-1) is an edge thickened region, the width is 3 to 10 mm, and the square resistance value is 3-8 Ω; the region 2 (2-2) is a low square resistance region, and the width It is 1/4 to 1/2 of the total length of the base film (1), and the square resistance is 4-20 Ω; the region 3 (2-3) is a high square resistance region, and the square resistance value is greater than 10 Ω; On the metallized film, the square 3 (2-3) square resistance ≥ area 2 square resistance ≥ area 1 square resistance, the square resistance value is stepped.
- 根据权利要求2所述一种新型电容器用金属化薄膜，其特征在于：所述空白区(3)的宽度为2mm。A metallized film for a capacitor according to claim 2, wherein the blank area (3) has a width of 2 mm.
- 根据权利要求3所述一种新型电容器用金属化薄膜，其特征在于：所述边缘加厚区的方阻值为4Ω。A metallized film for a capacitor according to claim 3, wherein the edge thickening region has a square resistance of 4 Ω.
- 根据权利要求3所述一种新型电容器用金属化薄膜，其特征在于：所述区域3(2-3)为高方阻区，方阻值为10-50Ω。A metallized film for a capacitor according to claim 3, wherein said region 3 (2-3) is a high square resistance region and has a square resistance value of 10 - 50 Ω.
- 根据权利要求6所述一种新型电容器用金属化薄膜，其特征在于：所述区域3(2-3)为高方阻区，方阻值为30Ω。 A metallized film for a capacitor according to claim 6, wherein said region 3 (2-3) is a high square resistance region and has a square resistance value of 30 Ω.
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| CN104681275A (en) * | 2015-03-20 | 2015-06-03 | 南通新三能电子有限公司 | Novel metallized film for capacitor |
| CN110289165A (en) * | 2019-07-23 | 2019-09-27 | 安徽纽艾新能源技术有限公司 | A kind of explosion-proof metallized polypropylene film of high voltage |
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| CN104681275A (en) * | 2015-03-20 | 2015-06-03 | 南通新三能电子有限公司 | Novel metallized film for capacitor |
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| CN201829351U (en) * | 2010-10-30 | 2011-05-11 | 安徽铜峰电子股份有限公司 | Ultrahigh square-resistance metallized film |
| CN104143434A (en) * | 2014-08-06 | 2014-11-12 | 安徽源光电器有限公司 | Small novel capacitor with gradient plating |
| CN104252969A (en) * | 2014-09-28 | 2014-12-31 | 宁国市裕华电器有限公司 | Trapezoidal evaporation metalizing polypropylene film capacitor |
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| US6407905B1 (en) * | 1998-08-07 | 2002-06-18 | Abb Corporate Research Ltd. | Electronic components |
| CN203434000U (en) * | 2013-07-15 | 2014-02-12 | 南通江森电子科技有限公司 | Trapezoid zinc thickened high-square-resistance aluminum film |
| CN103578754A (en) * | 2013-10-15 | 2014-02-12 | 铜陵其利电子材料有限公司 | Aluminum zinc metallized film with gradually-changing sheet resistance and for capacitor |
| CN104681275A (en) * | 2015-03-20 | 2015-06-03 | 南通新三能电子有限公司 | Novel metallized film for capacitor |
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| US20200294716A1 (en) * | 2018-02-05 | 2020-09-17 | Murata Manufacturing Co., Ltd. | Film capacitor |
| US11664161B2 (en) * | 2018-02-05 | 2023-05-30 | Murata Manufacturing Co., Ltd. | Film capacitor |
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