WO2016148429A1 - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
WO2016148429A1
WO2016148429A1 PCT/KR2016/002327 KR2016002327W WO2016148429A1 WO 2016148429 A1 WO2016148429 A1 WO 2016148429A1 KR 2016002327 W KR2016002327 W KR 2016002327W WO 2016148429 A1 WO2016148429 A1 WO 2016148429A1
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WO
WIPO (PCT)
Prior art keywords
signal line
dielectric layer
ground
layer
side ground
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Application number
PCT/KR2016/002327
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French (fr)
Korean (ko)
Inventor
김상필
김대호
이동형
조병훈
이다연
구황섭
김현제
정희석
Original Assignee
주식회사 기가레인
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Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to CN201690000582.6U priority Critical patent/CN208190991U/en
Publication of WO2016148429A1 publication Critical patent/WO2016148429A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Definitions

  • the present invention relates to a flexible circuit board.
  • Wireless terminal devices such as mobile phones, are equipped with RF (Radio Frequency) signal lines.
  • RF Radio Frequency
  • Conventional RF signal lines are installed in the form of coaxial cables.
  • space utilization in wireless terminal devices is reduced.
  • flexible circuit boards are generally used.
  • impedance matching may be performed by reducing the area of the ground to increase the reduced impedance again.
  • the flexible printed circuit board should be mounted at a proper distance from the main board, the sub board, and the battery in order to prevent the impedance change. Therefore, the flexible circuit board has a problem of decreasing the space utilization, which is considered as the greatest advantage. exist.
  • the impedance matching may be located close to the main board, the sub-board, and the battery, but even in this case, if the shape or position of the main board, the sub-board, the battery is changed, the flexibility for impedance matching There is a disadvantage that the shape of the circuit board must also be changed.
  • the conventional flexible printed circuit board has the same thickness in the longitudinal direction, and as the ground area increases, bending durability decreases.
  • the present invention improves bending durability, minimizes loss of signal lines and incoming signals from outside, and does not have to change its shape for impedance matching because there is no impedance change regardless of the position disposed inside the wireless terminal device.
  • the purpose is to provide a flexible circuit board.
  • the flexible circuit board of the present invention includes a first substrate portion and a second substrate portion extending from the first substrate portion and having a thickness thinner than that of the first substrate portion so as to bend. .
  • the first substrate unit may include a first ground layer; A first dielectric layer stacked on the first ground layer; A side ground spaced apart from each other by a predetermined interval so as to prevent an external signal from flowing into the signal line and having one surface coupled to the first dielectric layer; A second dielectric layer facing the first dielectric layer with the side ground interposed therebetween; And a second ground layer stacked on the second dielectric layer, wherein the second substrate portion includes at least one of the first ground layer, the side ground, the second dielectric layer, and the second ground layer. It is characterized by.
  • the side ground includes a first side ground whose surface is in contact with the first dielectric layer, and a second side ground whose surface is in contact with the second dielectric layer, wherein the first side ground and the second side ground
  • the other surface is characterized in that each is bonded via a bonding sheet.
  • the second substrate part may include a first ground layer, a first dielectric layer, a first side ground, and a signal line.
  • One surface of the signal line is coupled to the first dielectric layer, and the other surface thereof is exposed to the air layer facing each other at a predetermined interval from the second dielectric layer.
  • the first side ground may be formed in a length direction of the signal line to prevent a signal from flowing from the outside.
  • the second substrate portion may include a first dielectric layer, a first side ground, and a signal line.
  • the signal line includes a first signal line and a second signal line extending from the first signal line, wherein an area of the second signal line is larger than an area of the first signal line.
  • the second signal line may be divided into two or more branches.
  • Matching grooves corresponding to the shape of the second signal line are formed in the first ground layer.
  • the second substrate unit may include a first ground layer, a first dielectric layer, and a signal line.
  • the signal line may include an inner signal line provided on a bottom surface of the first dielectric layer and an outer signal line provided on an upper surface of the first dielectric layer, and the inner signal line and the outer signal line may be electrically connected through a via hole. It is done.
  • the first ground layer and the first dielectric layer may be formed in different shapes so that the outer signal line is formed on the same layer as the first ground layer.
  • the inner signal line may include a first signal line and a second signal line extending from the first signal line and having a width greater than that of the first signal line.
  • the outer signal line is characterized in that divided into two or more.
  • Matching grooves corresponding to the outer signal lines may be formed in the first ground layer.
  • the impedance does not change even if placed in any space inside the wireless terminal device.
  • FIG. 3 is a block diagram of an embodiment of the present invention.
  • 4A is a diagram showing a summary of a first embodiment of the present invention.
  • 4B is a diagram showing another essential part of the first embodiment of the present invention.
  • FIG. 5 is a configuration diagram of a second embodiment of the present invention.
  • 6A is a diagram showing a summary of a second embodiment of the present invention.
  • 6B is a diagram showing another essential part of the second embodiment of the present invention.
  • FIG. 7 is a configuration diagram of a third embodiment of the present invention.
  • FIG. 8A is a diagram showing a summary of a third embodiment of the present invention.
  • 8B is a diagram showing another essential part of the third embodiment of the present invention.
  • the flexible circuit board of the present invention includes a first substrate part 100 and a second substrate part 200.
  • the second substrate part 200 extends from the first substrate part 100 and is formed to have a thickness thinner than that of the first substrate part 100 so as to bend.
  • the flexible circuit board of the present invention may include a first ground layer 300, a first dielectric layer 400 stacked on the first ground layer 300, and an external signal.
  • the side ground 700 and the side ground which are spaced apart at a predetermined interval with the signal line 900 interposed therebetween, so that one side is coupled to the first dielectric layer 400 so as to prevent the inflow into the signal line 900.
  • the second dielectric layer 600 facing the first dielectric layer 400 with the 700 interposed therebetween, and the second ground layer 800 stacked on the second dielectric layer 600.
  • the side ground 700 includes a first side ground 710 whose surface is in contact with the first dielectric layer 400, and a second side ground 720 whose surface is in contact with the second dielectric layer 600.
  • the other surfaces of the first side ground 710 and the second side ground 720 are coupled to each other via the bonding sheet 500.
  • the second substrate portion 200 is formed to extend from the first substrate portion 100, the thickness of which is thinner than the thickness of the first substrate portion 100, the first substrate portion ( 100 is a side ground 700 and a second dielectric layer 600 including a first ground layer 300, a first dielectric layer 400, a first side ground 710, and a second side ground 720. And a second ground layer 800, and the second substrate part 200 includes the first ground layer 300, the side ground 700, the second dielectric layer 600, and the second ground layer 800. It is characterized in that any one or more are omitted and its thickness is made thinner than the first substrate portion.
  • Figure 3 is a view showing a first embodiment of the present invention
  • Figure 4 (a) and Figure 4 (b) is a view showing the main and other main parts of the first embodiment of the present invention.
  • the second substrate part 200 includes a first ground layer 300, a first dielectric layer 400, a first side ground 710, and a signal line 900.
  • the second substrate part 200 has a thickness of the first substrate part 200. Compared to the substrate portion 100, the thickness is improved, and bending durability is improved.
  • one surface of the signal line 900 of the flexible circuit board of the present invention is coupled to the first dielectric layer 400, and the other surface thereof is exposed to the air layer facing each other at a predetermined interval from the second dielectric layer 600. It is preferable that the first side ground 710 is formed to have a length corresponding to the length of the signal line 900 so as to prevent the signal from flowing from the outside.
  • the signal line 900 of the flexible circuit board of the present invention is exposed to air having a low dielectric constant, the surrounding capacitance is lowered, thereby minimizing signal loss.
  • the pair of side grounds 700 To suppress external signal influx.
  • the signal line 900 is provided on any one of the first dielectric layer 400 and the second dielectric layer 600 having a shape corresponding thereto, and the signal line 900 is interposed therebetween.
  • one of the first dielectric layer 400 and the second dielectric layer 600 is selected to combine the signal lines 900, and the first dielectric layer 400 and the second dielectric layer 600 are combined.
  • ) Are positioned to face each other, but when the first dielectric layer 400 and the second dielectric layer 600 are coupled through a pair of side grounds 700 with the signal line 900 therebetween, the first The dielectric layer 400, the second dielectric layer 600, and the pair of side grounds 700 are formed in an empty space, and the empty space is filled with air, and the signal line 900 is exposed to the air. will be.
  • the side ground 700 includes a first side ground 710 whose surface is in contact with the first dielectric layer 400, and a second side ground 720 whose surface is in contact with the second dielectric layer 600.
  • the first ground layer 300 and the second ground layer 800 are stacked on one surface of each of the first dielectric layer 400 and the second dielectric layer 600, and the first side ground 710 and the second side ground, respectively.
  • Each other surface 720 may be coupled via the bonding sheet 500.
  • the first side ground 710 and the second side ground 720 not only prevent external signals from entering, but also strengthen the electrical connection between the first ground layer 300 and the second ground layer 800. Do it.
  • the bonding sheet 500 together with the first side ground 710 and the second side ground 720 forms an empty space in which the air is filled in the flexible circuit board, and the first side ground 710 and the second side ground.
  • the film 720 is attached to the first dielectric layer 400 and the second dielectric layer 600.
  • the first ground layer 300, the second ground layer 800, the first side ground 710, the second side ground 720, the bonding sheet 500, the first dielectric layer 400, and the second Via holes VH are formed through the dielectric layer 600 in the vertical direction, and conductors are filled in the via holes VH so that the first ground layer 300, the second ground layer 800, and the first side ground 710, the second side ground 720 is electrically connected.
  • the first side ground 710 may be formed on the same layer as the signal line 900.
  • the first side ground 710 is attached to one surface of the bonding sheet 500
  • the second side ground 720 is attached to the other surface of the bonding sheet 500.
  • the capacitance between the signal line 900 and the second ground layer 800 is farther away. There is an advantage that can be lowered.
  • Fig. 5 is a structural diagram of a second embodiment of the present invention
  • Figs. 6 (a) and 6 (b) are diagrams showing the main parts and other main parts of the second embodiment of the present invention, respectively.
  • the second substrate part 200 includes a first dielectric layer 400, a first side ground 710, and a signal line 900.
  • the signal line 900 includes a first signal line 900a and a second signal line 900b extending from the first signal line 900a, and the area of the second signal line 900b is the first signal. It is characterized in that it is larger than the area of the line (900a), that is, the signal transmission amount is increased when the width of the first signal line (900a) to extend the area of the second signal line (900b).
  • the signal line 900 It is preferable to branch the signal line 900 to two or more second signal lines 900b.
  • the high frequency signal is transmitted along the edge of the signal line 900.
  • the second signal line 900b is divided into two or more, the area of the edge of the signal line 900 increases, so that the amount of high frequency signal transmission also increases. There is this.
  • FIGS. 8 (a) and 8 (b) are diagrams showing main and other main parts of the third embodiment of the present invention, respectively.
  • the second substrate part 200 includes a first ground layer 300, a first dielectric layer 400, and a signal line 900.
  • the signal line 900 includes an inner signal line 910 provided on a bottom surface of the first dielectric layer 400 and an outer signal line 920 provided on an upper surface of the first dielectric layer 400.
  • the 910 and the outer signal line 920 are electrically connected to each other through the via hole VH. Therefore, when the second substrate 200 is bent, when the inner signal line 910 interferes with the peripheral components, the signal line may be changed into the outer signal line 920.
  • the outer signal line 920 is formed in a shape different from that of the first dielectric layer 400 so that the outer signal line 920 is formed on the same layer as the first ground layer 300, and the inner signal line 910 is formed of the first signal line ( 900a and a second signal line 900b extending from the first signal line 900a and having a width greater than that of the first signal line 900a.
  • the second signal line 900b of the outer signal line 920 is divided into two or more, the high frequency signal transmission amount is increased, and the reason is as described above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A flexible printed circuit board is introduced. The flexible printed circuit board according to the present invention comprises: a first substrate; and a second substrate which is extended from the first substrate and which has a thinner thickness than the first substrate so as to be capable of bending.

Description

연성회로기판Flexible Circuit Board
본 발명은 연성회로기판에 관한 것이다.The present invention relates to a flexible circuit board.
핸드폰 등 무선단말기기에는 RF(Radio Frequency) 신호선로가 구비되는데, 종래 RF 신호선로는 동축 케이블 형태로 장착되었는바, 동축 케이블 형태로 장착되는 경우 무선단말기기 내에서 공간 활용성이 저하되기 때문에 근래 들어 연성회로기판이 사용되는 것이 일반적이다.Wireless terminal devices, such as mobile phones, are equipped with RF (Radio Frequency) signal lines. Conventional RF signal lines are installed in the form of coaxial cables. When installed in the form of coaxial cables, space utilization in wireless terminal devices is reduced. For example, flexible circuit boards are generally used.
종래 연성회로기판은 신호라인의 면적을 증가시킴으로써 신호 전송 시 손실되는 신호를 보완, 필요한 신호양을 확보했었다.Conventional flexible circuit boards have increased the area of the signal line to compensate for the signals lost during signal transmission to secure the required signal amount.
한편 신호라인 면적이 증가하면 임피던스가 감소하게 되므로, 감소된 임피던스를 다시 증가시키기 위해 그라운드의 면적을 감소시키는 방식으로 임피던스 매칭이 이루어지기도 한다.On the other hand, since the impedance decreases as the signal line area increases, impedance matching may be performed by reducing the area of the ground to increase the reduced impedance again.
그러나, 그라운드의 면적이 감소된 부분에 전도체가 접촉되거나, 근접하여 배치되면 전도체가 그라운드와 전기적으로 연결됨으로써 그라운드 전체 면적이 증가하는 효과가 발생하게 되는바, 임피던스가 감소되는 것은 물론, 감소된 그라운드 부분에 대응되는 신호라인이 전도체에 직접 노출됨으로써 신호 전송 시 손실되는 신호양이 증가하는 문제점이 존재한다.However, when the conductor is in contact with or close to the part where the area of the ground is reduced, the conductor is electrically connected to the ground, thereby increasing the total area of the ground, which reduces the impedance as well as reduces the ground. Since the signal line corresponding to the portion is directly exposed to the conductor, there is a problem that the amount of signal lost during signal transmission increases.
따라서, 연성회로기판은 임피던스 변화 발생을 방지하기 위해 메인보드, 서브보드, 배터리와 적절히 이격된 위치에 장착되어야 하는바, 이로 인해 연성회로기판 적용 시 최대 장점으로 꼽히는 공간활용성이 저하되는 문제점이 존재한다.Therefore, the flexible printed circuit board should be mounted at a proper distance from the main board, the sub board, and the battery in order to prevent the impedance change. Therefore, the flexible circuit board has a problem of decreasing the space utilization, which is considered as the greatest advantage. exist.
물론, 임피던스 매칭을 통하여 메인보드, 서브보드, 배터리와 근접한 위치에 배치할 수도 있지만, 이러한 경우라 하더라도 메인보드, 서브보드, 배터리 중 어느 하나의 형상 또는 위치가 변경되는 경우, 임피던스 매칭을 위해 연성회로기판의 형상 또한 변경되어야 하는 단점이 존재한다.Of course, the impedance matching may be located close to the main board, the sub-board, and the battery, but even in this case, if the shape or position of the main board, the sub-board, the battery is changed, the flexibility for impedance matching There is a disadvantage that the shape of the circuit board must also be changed.
한편 종래 연성회로기판은 길이 방향으로 그 두께가 동일한바, 그라운드 면적이 증가하면 할수록 벤딩 내구성이 저하되는 문제점이 존재한다. Meanwhile, the conventional flexible printed circuit board has the same thickness in the longitudinal direction, and as the ground area increases, bending durability decreases.
본 발명은 벤딩 내구성을 개선하고, 신호라인의 손실 및 외부로부터 유입되는 신호를 최소화하며, 무선단말기기 내부에 배치되는 위치와 관계없이 임피던스 변화가 없어 임피던스 매칭을 위해 별도로 그 형상을 변경할 필요가 없는 연성회로기판을 제공하는데 그 목적이 있다.The present invention improves bending durability, minimizes loss of signal lines and incoming signals from outside, and does not have to change its shape for impedance matching because there is no impedance change regardless of the position disposed inside the wireless terminal device. The purpose is to provide a flexible circuit board.
이러한 목적을 달성하기 위한 본 발명의 연성회로기판은 제1기판부 및 상기 제1기판부에서 연장 형성되고, 벤딩(bending) 가능하도록 상기 제1기판부보다 얇은 두께로 형성된 제2기판부를 포함한다.In order to achieve the above object, the flexible circuit board of the present invention includes a first substrate portion and a second substrate portion extending from the first substrate portion and having a thickness thinner than that of the first substrate portion so as to bend. .
상기 제1기판부는, 제1그라운드 레이어; 상기 제1그라운드 레이어에 적층된 제1유전체 레이어; 외부 신호가 신호라인으로 유입되는 것을 방지할 수 있도록 상기 신호라인을 사이에 두고 일정 간격 이격되어 그 일면이 상기 제1유전체 레이어에 결합되는 측면 그라운드; 상기 측면 그라운드를 사이에 두고 상기 제1유전체 레이어와 마주보는 제2유전체 레이어; 상기 제2유전체 레이어에 적층된 제2그라운드 레이어를 포함하고, 상기 제2기판부는, 상기 제1그라운드 레이어, 상기 측면 그라운드, 상기 제2유전체 레이어, 상기 제2그라운드 레이어 중 어느 하나 이상이 생략된 것을 특징으로 한다.The first substrate unit may include a first ground layer; A first dielectric layer stacked on the first ground layer; A side ground spaced apart from each other by a predetermined interval so as to prevent an external signal from flowing into the signal line and having one surface coupled to the first dielectric layer; A second dielectric layer facing the first dielectric layer with the side ground interposed therebetween; And a second ground layer stacked on the second dielectric layer, wherein the second substrate portion includes at least one of the first ground layer, the side ground, the second dielectric layer, and the second ground layer. It is characterized by.
상기 측면 그라운드는, 그 일면이 상기 제1유전체 레이어에 접하는 제1측면 그라운드와, 그 일면이 상기 제2유전체 레이어에 접하는 제2측면 그라운드를 포함하고, 상기 제1측면 그라운드 및 제2측면 그라운드의 타면은 각각 본딩시트를 매개로 결합되는 것을 특징으로 한다.The side ground includes a first side ground whose surface is in contact with the first dielectric layer, and a second side ground whose surface is in contact with the second dielectric layer, wherein the first side ground and the second side ground The other surface is characterized in that each is bonded via a bonding sheet.
상기 제2기판부는, 제1그라운드 레이어, 제1유전체 레이어, 제1측면 그라운드 및 신호라인으로 구성된 것을 특징으로 한다.The second substrate part may include a first ground layer, a first dielectric layer, a first side ground, and a signal line.
상기 신호라인의 일면은 상기 제1유전체 레이어에 결합되고, 그 타면은 상기 제2유전체 레이어와 일정 간격 이격되어 마주보며 공기층에 노출되는 것을 특징으로 한다.One surface of the signal line is coupled to the first dielectric layer, and the other surface thereof is exposed to the air layer facing each other at a predetermined interval from the second dielectric layer.
상기 제1측면 그라운드는 외부로부터 신호가 유입되는 것을 방지할 수 있도록 상기 신호라인의 길이 방향으로 형성된 것을 특징으로 한다.The first side ground may be formed in a length direction of the signal line to prevent a signal from flowing from the outside.
상기 제2기판부는, 제1유전체 레이어, 제1측면 그라운드 및 신호라인으로 구성된 것을 특징으로 한다.The second substrate portion may include a first dielectric layer, a first side ground, and a signal line.
상기 신호라인은, 제1신호라인과, 상기 제1신호라인에서 연장된 제2신호라인은 포함하고, 상기 제2신호라인의 면적은 상기 제1신호라인의 면적보다 넓은 것을 특징으로 한다.The signal line includes a first signal line and a second signal line extending from the first signal line, wherein an area of the second signal line is larger than an area of the first signal line.
상기 제2신호라인은 두 개 이상으로 분기된 것을 특징으로 한다.The second signal line may be divided into two or more branches.
상기 제1그라운드 레이어에는 상기 제2신호라인의 형상과 대응되는 매칭홈이 형성된 것을 특징으로 한다.Matching grooves corresponding to the shape of the second signal line are formed in the first ground layer.
상기 제2기판부는, 제1그라운드 레이어, 제1유전체 레이어 및 신호라인으로 구성된 것을 특징으로 한다.The second substrate unit may include a first ground layer, a first dielectric layer, and a signal line.
상기 신호라인은, 상기 제1유전체 레이어의 저면에 설치된 내측 신호라인과 상기 제1유전체 레이어 상면에 설치된 외측 신호라인을 포함하고, 상기 내측 신호라인과 외측 신호라인은 비아홀을 통해 전기적으로 연결된 것을 특징으로 한다.The signal line may include an inner signal line provided on a bottom surface of the first dielectric layer and an outer signal line provided on an upper surface of the first dielectric layer, and the inner signal line and the outer signal line may be electrically connected through a via hole. It is done.
상기 외측 신호라인이 상기 제1그라운드 레이어와 동일 층에 형성될 수 있도록 상기 제1그라운드 레이어와 상기 제1유전체 레이어는 상이한 형상으로 형성된 것을 특징으로 한다.The first ground layer and the first dielectric layer may be formed in different shapes so that the outer signal line is formed on the same layer as the first ground layer.
상기 내측 신호라인은 제1신호라인과, 상기 제1신호라인에서 연장되며 그 폭이 상기 제1신호라인보다 큰 제2신호라인을 포함하는 것을 특징으로 한다. The inner signal line may include a first signal line and a second signal line extending from the first signal line and having a width greater than that of the first signal line.
상기 외측 신호라인은 두 개 이상으로 분기된 것을 특징으로 한다.The outer signal line is characterized in that divided into two or more.
상기 제1그라운드 레이어에는 상기 외측 신호라인에 대응되는 매칭홈이 형성된 것을 특징으로 한다.Matching grooves corresponding to the outer signal lines may be formed in the first ground layer.
본 발명에 따르면 아래와 같은 다양한 효과를 구현할 수 있게 된다.According to the present invention it is possible to implement various effects as follows.
첫째, 벤딩 내구성이 개선되는 이점이 있다.First, there is an advantage that the bending durability is improved.
둘째, 무선단말기기 내부 어느 공간에 배치되더라도 임피던스가 변화하지 않는 이점이 있다.Second, the impedance does not change even if placed in any space inside the wireless terminal device.
셋째, 임피던스 매칭 없이도 메인보드, 서브보드, 배터리와 근접한 곳에 배치할 수 있기 때문에, 임피던스 매칭을 위한 연성회로기판 형상을 변경할 필요가 없는 이점이 있다.Third, since it can be placed in close proximity to the main board, sub-board, and the battery without impedance matching, there is no need to change the shape of the flexible circuit board for impedance matching.
넷째, 신호라인 손실양을 최소화할 수 있는 이점이 있다.Fourth, there is an advantage that can minimize the amount of signal line loss.
다섯째, 외부신호가 유입되는 것을 방지할 수 있는 이점이 있다.Fifth, there is an advantage that can prevent the external signal from flowing.
도 1은 본 발명의 구성도,1 is a block diagram of the present invention,
도 2는 본 발명의 사용 상태도,2 is a use state diagram of the present invention,
도 3은 본 발명의 일 실시예의 구성도,3 is a block diagram of an embodiment of the present invention,
도 4a는 본 발명의 제1실시예의 일요부를 나타낸 도면, 4A is a diagram showing a summary of a first embodiment of the present invention;
도 4b는 본 발명의 제1실시예의 다른 일요부를 나타낸 도면,4B is a diagram showing another essential part of the first embodiment of the present invention;
도 5는 본 발명의 제2실시예의 구성도,5 is a configuration diagram of a second embodiment of the present invention;
도 6a는 본 발명의 제2실시예의 일요부를 나타낸 도면, 6A is a diagram showing a summary of a second embodiment of the present invention;
도 6b는 본 발명의 제2실시예의 다른 일요부를 나타낸 도면,6B is a diagram showing another essential part of the second embodiment of the present invention;
도 7은 본 발명의 제3실시예의 구성도,7 is a configuration diagram of a third embodiment of the present invention;
도 8a는 본 발명의 제3실시예의 일요부를 나타낸 도면, 8A is a diagram showing a summary of a third embodiment of the present invention;
도 8b는 본 발명의 제3실시예의 다른 일요부를 나타낸 도면이다.8B is a diagram showing another essential part of the third embodiment of the present invention.
본 발명의 목적, 특정한 장점들 및 신규한 특징들은 첨부된 도면들과 연관되는 이하의 상세한 설명과 실시예로부터 더욱 명백해질 것이다. 본 명세서에서 각 도면의 구성요소들에 참조번호를 부가함에 있어서, 동일한 구성 요소들에 한해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 번호를 가지도록 하고 있음에 유의하여야 한다. 또한, 제1, 제2 등의 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되어서는 안 된다. 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다. 또한, 본 발명을 설명함에 있어서, 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명은 생략한다.The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and examples associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.
이하, 첨부된 도면을 참조하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1 및 도 2에 도시된 바와 같이, 본 발명의 연성회로기판은 제1기판부(100) 및 제2기판부(200)를 포함한다.As shown in FIGS. 1 and 2, the flexible circuit board of the present invention includes a first substrate part 100 and a second substrate part 200.
제2기판부(200)는 제1기판부(100)에서 연장 형성되고, 벤딩(bending) 가능하도록 제1기판부(100)보다 얇은 두께로 형성된 것을 특징으로 한다.The second substrate part 200 extends from the first substrate part 100 and is formed to have a thickness thinner than that of the first substrate part 100 so as to bend.
이하에서는 본 발명의 연성회로기판을 더 상세히 설명한다.Hereinafter, the flexible circuit board of the present invention will be described in more detail.
도 3, 도 5 및 도 7에 도시된 바와 같이, 본 발명의 연성회로기판은, 제1그라운드 레이어(300), 제1그라운드 레이어(300)에 적층된 제1유전체 레이어(400), 외부 신호가 신호라인(900)으로 유입되는 것을 방지할 수 있도록 신호라인(900)을 사이에 두고 일정 간격 이격되어 그 일면이 상기 제1유전체 레이어(400)에 결합되는 측면 그라운드(700), 측면 그라운드(700)를 사이에 두고 상기 제1유전체 레이어(400)와 마주보는 제2유전체 레이어(600), 제2유전체 레이어(600)에 적층된 제2그라운드 레이어(800)를 포함한다.As shown in FIGS. 3, 5, and 7, the flexible circuit board of the present invention may include a first ground layer 300, a first dielectric layer 400 stacked on the first ground layer 300, and an external signal. The side ground 700 and the side ground, which are spaced apart at a predetermined interval with the signal line 900 interposed therebetween, so that one side is coupled to the first dielectric layer 400 so as to prevent the inflow into the signal line 900. The second dielectric layer 600 facing the first dielectric layer 400 with the 700 interposed therebetween, and the second ground layer 800 stacked on the second dielectric layer 600.
측면 그라운드(700)는, 그 일면이 상기 제1유전체 레이어(400)에 접하는 제1측면 그라운드(710)와, 그 일면이 제2유전체 레이어(600)에 접하는 제2측면 그라운드(720)를 포함하고, 제1측면 그라운드(710) 및 제2측면 그라운드(720)의 타면은 각각 본딩시트(500)를 매개로 결합된다.The side ground 700 includes a first side ground 710 whose surface is in contact with the first dielectric layer 400, and a second side ground 720 whose surface is in contact with the second dielectric layer 600. In addition, the other surfaces of the first side ground 710 and the second side ground 720 are coupled to each other via the bonding sheet 500.
상술한 바와 같이, 제2기판부(200)는 제1기판부(100)에서 연장 형성되며, 그 두께가 제1기판부(100)의 두께보다 얇은 것을 특징으로 하는바, 제1기판부(100)는 제1그라운드 레이어(300), 제1유전체 레이어(400), 제1측면 그라운드(710) 및 제2측면 그라운드(720)를 포함하는 측면 그라운드(700), 제2유전체 레이어(600), 제2그라운드 레이어(800)를 포함하고, 제2기판부(200)는 제1그라운드 레이어(300), 측면 그라운드(700), 제2유전체 레이어(600), 제2그라운드 레이어(800) 중 어느 하나 이상을 생략하여 그 두께를 제1기판부보다 얇게 형성한 것을 특징으로 한다.As described above, the second substrate portion 200 is formed to extend from the first substrate portion 100, the thickness of which is thinner than the thickness of the first substrate portion 100, the first substrate portion ( 100 is a side ground 700 and a second dielectric layer 600 including a first ground layer 300, a first dielectric layer 400, a first side ground 710, and a second side ground 720. And a second ground layer 800, and the second substrate part 200 includes the first ground layer 300, the side ground 700, the second dielectric layer 600, and the second ground layer 800. It is characterized in that any one or more are omitted and its thickness is made thinner than the first substrate portion.
도 3은 본 발명의 제1실시예를 나타낸 도면이고, 도 4(a) 및 도 4(b)는 본 발명의 제1실시예의 일요부 및 다른 요부를 나타낸 도면이다.Figure 3 is a view showing a first embodiment of the present invention, Figure 4 (a) and Figure 4 (b) is a view showing the main and other main parts of the first embodiment of the present invention.
본 발명의 제1실시예에서 제2기판부(200)는 제1그라운드 레이어(300), 제1유전체 레이어(400), 제1측면 그라운드(710) 및 신호라인(900)으로 구성된다.In the first embodiment of the present invention, the second substrate part 200 includes a first ground layer 300, a first dielectric layer 400, a first side ground 710, and a signal line 900.
따라서, 제2기판부(200)는 제1기판부(100)의 제2유전체 레이어(600), 제2측면 그라운드(720) 및 제2그라운드 레이어(800)가 생략되므로, 그 두께가 제1기판부(100)에 비하여 얇아져 벤딩 내구성이 개선된다.Therefore, since the second dielectric layer 600, the second side ground 720, and the second ground layer 800 of the first substrate part 100 are omitted, the second substrate part 200 has a thickness of the first substrate part 200. Compared to the substrate portion 100, the thickness is improved, and bending durability is improved.
한편, 본 발명의 연성회로기판의 신호라인(900)의 일면은 제1유전체 레이어(400)에 결합되고, 그 타면은 상기 제2유전체 레이어(600)와 일정 간격 이격되어 마주보며 공기층에 노출되는 것을 특징으로 하는바, 제1측면 그라운드(710)는 외부로부터 신호가 유입되는 것을 방지할 수 있도록 신호라인(900)의 길이에 대응되는 길이로 형성되는 것이 바람직하다.Meanwhile, one surface of the signal line 900 of the flexible circuit board of the present invention is coupled to the first dielectric layer 400, and the other surface thereof is exposed to the air layer facing each other at a predetermined interval from the second dielectric layer 600. It is preferable that the first side ground 710 is formed to have a length corresponding to the length of the signal line 900 so as to prevent the signal from flowing from the outside.
본 발명의 연성회로기판의 신호라인(900)은 유전율이 낮은 공기에 노출되기 때문에, 주변의 캐패시턴스가 낮아져 신호 손실을 최소화할 수 있게 된다.Since the signal line 900 of the flexible circuit board of the present invention is exposed to air having a low dielectric constant, the surrounding capacitance is lowered, thereby minimizing signal loss.
또한, 신호라인(900)이 유전율이 낮은 공기에 노출되어 주변 캐패시턴스가 낮아지면 외부로부터 신호가 유입되어 신호라인(900)의 신호 손실을 유발하게 되는바, 본 발명에서는 한 쌍의 측면 그라운드(700)를 이용하여 외부 신호 유입을 억제하였다.In addition, when the signal line 900 is exposed to air having a low dielectric constant and the peripheral capacitance is low, a signal is introduced from the outside to cause a signal loss of the signal line 900. In the present invention, the pair of side grounds 700 ) To suppress external signal influx.
즉, 제1유전체 레이어(400) 및 이와 대응되는 형상을 갖는 제2유전체 레이어(600) 중 어느 하나에 신호라인(900)을 설치하고, 신호라인(900)을 사이에 두고, 이 신호라인(900)과 각각 일정 간격 이격된 위치에 한 쌍의 측면 그라운드(700)를 설치함으로써 외부로부터 신호가 유입되는 것을 방지한 것이다.That is, the signal line 900 is provided on any one of the first dielectric layer 400 and the second dielectric layer 600 having a shape corresponding thereto, and the signal line 900 is interposed therebetween. By installing a pair of side ground 700 in a position spaced apart from each other at a predetermined distance from 900 to prevent the flow of signals from the outside.
더 상세하게 설명하면, 제1유전체 레이어(400) 및 제2유전체 레이어(600) 중 어느 하나를 선택하여 신호라인(900)을 결합하고, 제1유전체 레이어(400) 및 제2유전체 레이어(600)를 서로 마주보게 위치시키되, 신호라인(900)을 사이에 두고 한 쌍의 측면 그라운드(700)를 매개로 제1유전체 레이어(400) 및 제2유전체 레이어(600)를 결합하게 되면, 제1유전체 레이어(400), 제2유전체 레이어(600), 한 쌍의 측면 그라운드(700)에 의해 빈 공간에 형성되며, 이러한 빈 공간에는 공기가 채워지는바, 신호라인(900)은 공기에 노출되는 것이다.In more detail, one of the first dielectric layer 400 and the second dielectric layer 600 is selected to combine the signal lines 900, and the first dielectric layer 400 and the second dielectric layer 600 are combined. ) Are positioned to face each other, but when the first dielectric layer 400 and the second dielectric layer 600 are coupled through a pair of side grounds 700 with the signal line 900 therebetween, the first The dielectric layer 400, the second dielectric layer 600, and the pair of side grounds 700 are formed in an empty space, and the empty space is filled with air, and the signal line 900 is exposed to the air. will be.
측면 그라운드(700)는, 그 일면이 제1유전체 레이어(400)에 접하는 제1측면 그라운드(710)와, 그 일면이 제2유전체 레이어(600)에 접하는 제2측면 그라운드(720)를 포함하고, 제1유전체 레이어(400) 및 제2유전체 레이어(600) 일면에는 각각 제1그라운드 레이어(300) 및 제2그라운드 레이어(800)가 적층되며, 제1측면 그라운드(710) 및 제2측면 그라운드(720) 각각의 타면은 본딩시트(500)를 매개로 결합될 수 있다.The side ground 700 includes a first side ground 710 whose surface is in contact with the first dielectric layer 400, and a second side ground 720 whose surface is in contact with the second dielectric layer 600. The first ground layer 300 and the second ground layer 800 are stacked on one surface of each of the first dielectric layer 400 and the second dielectric layer 600, and the first side ground 710 and the second side ground, respectively. Each other surface 720 may be coupled via the bonding sheet 500.
제1측면 그라운드(710) 및 제2측면 그라운드(720)는 외부 신호가 유입되는 것을 방지하는 기능은 물론, 제1그라운드 레이어(300) 및 제2그라운드 레이어(800)의 전기적 연결을 강화하는 기능을 한다.The first side ground 710 and the second side ground 720 not only prevent external signals from entering, but also strengthen the electrical connection between the first ground layer 300 and the second ground layer 800. Do it.
본딩시트(500)는 제1측면 그라운드(710) 및 제2측면 그라운드(720)와 함께 연성회로기판 내부에 공기가 채워지는 빈 공간을 형성하며, 제1측면 그라운드(710) 및 제2측면 그라운드(720)를 제1유전체 레이어(400) 및 제2유전체 레이어(600)에 부착시키는 기능을 한다.The bonding sheet 500 together with the first side ground 710 and the second side ground 720 forms an empty space in which the air is filled in the flexible circuit board, and the first side ground 710 and the second side ground. The film 720 is attached to the first dielectric layer 400 and the second dielectric layer 600.
한편, 제1그라운드 레이어(300), 제2그라운드 레이어(800), 제1측면 그라운드(710), 제2측면 그라운드(720), 본딩시트(500), 제1유전체 레이어(400), 제2유전체 레이어(600)에는 비아홀(VH)이 수직 방향으로 관통 형성되는바, 이러한 비아홀(VH)에는 전도체가 충진되어 제1그라운드 레이어(300), 제2그라운드 레이어(800), 제1측면 그라운드(710), 제2측면 그라운드(720)를 전기적으로 연결하게 된다.Meanwhile, the first ground layer 300, the second ground layer 800, the first side ground 710, the second side ground 720, the bonding sheet 500, the first dielectric layer 400, and the second Via holes VH are formed through the dielectric layer 600 in the vertical direction, and conductors are filled in the via holes VH so that the first ground layer 300, the second ground layer 800, and the first side ground 710, the second side ground 720 is electrically connected.
측면 그라운드(700)를 제1측면 그라운드(710) 및 제2측면 그라운드(720)를 이용하여 2단으로 형성하는 경우, 제1측면 그라운드(710)가 신호라인(900)과 동일한 층에 형성될 수 있도록 제1측면 그라운드(710)는 본딩시트(500)의 일면에 부착하고, 제2측면 그라운드(720)는 본딩시트(500)의 타면에 부착한다.When the side ground 700 is formed in two stages using the first side ground 710 and the second side ground 720, the first side ground 710 may be formed on the same layer as the signal line 900. The first side ground 710 is attached to one surface of the bonding sheet 500, and the second side ground 720 is attached to the other surface of the bonding sheet 500.
즉, 측면 그라운드(700)를 제1측면 그라운드(710)와 제2측면 그라운드(720)로 구성하는 경우, 신호라인(900)과 제2그라운드 레이어(800) 사이의 간격이 멀어지기 때문에 캐패시턴스를 더 낮출 수 있는 이점이 있다.That is, when the side ground 700 is formed of the first side ground 710 and the second side ground 720, the capacitance between the signal line 900 and the second ground layer 800 is farther away. There is an advantage that can be lowered.
도 5는 본 발명의 제2실시예의 구성도이고, 도 6(a) 및 도 6(b)는 각각 본 발명의 제2실시예의 일요부 및 다른 요부를 나타낸 도면이다.Fig. 5 is a structural diagram of a second embodiment of the present invention, and Figs. 6 (a) and 6 (b) are diagrams showing the main parts and other main parts of the second embodiment of the present invention, respectively.
이하에서는 본 발명의 제2실시예를 설명하되, 제1실시예와 동일 구성에 대하여는 상술한 설명으로 갈음하고, 상이한 구성을 중심으로 설명한다.Hereinafter, a second embodiment of the present invention will be described, but the same configuration as that of the first embodiment will be replaced with the above description, with a focus on different configurations.
본 발명의 제2실시예의 제2기판부(200)는, 제1유전체 레이어(400), 제1측면 그라운드(710) 및 신호라인(900)으로 구성된다.The second substrate part 200 according to the second embodiment of the present invention includes a first dielectric layer 400, a first side ground 710, and a signal line 900.
신호라인(900)은, 제1신호라인(900a)과, 제1신호라인(900a)에서 연장된 제2신호라인(900b)은 포함하고, 제2신호라인(900b)의 면적은 제1신호라인(900a)의 면적보다 넓은 것을 특징으로 하는바, 즉, 제1신호라인(900a)의 일단에서 그 폭을 확장하여 제2신호라인(900b)의 면적을 넓히는 경우 신호 전송량이 증가된다.The signal line 900 includes a first signal line 900a and a second signal line 900b extending from the first signal line 900a, and the area of the second signal line 900b is the first signal. It is characterized in that it is larger than the area of the line (900a), that is, the signal transmission amount is increased when the width of the first signal line (900a) to extend the area of the second signal line (900b).
신호라인(900) 중 제2신호라인(900b)을 두 개 이상으로 분기하는 것이 바람직하다. 통상 고주파 신호는 신호라인(900)의 가장자리를 따라 전송되는데, 제2신호라인(900b)을 두 개 이상으로 분기하는 경우 신호라인(900) 가장자리 면적이 증가하므로, 고주파 신호 전송량 역시 증가하게 되는 이점이 있다.It is preferable to branch the signal line 900 to two or more second signal lines 900b. In general, the high frequency signal is transmitted along the edge of the signal line 900. When the second signal line 900b is divided into two or more, the area of the edge of the signal line 900 increases, so that the amount of high frequency signal transmission also increases. There is this.
한편, 제1그라운드 레이어(300)에는 상기 제2신호라인(900b)의 형상과 대응되는 매칭홈(H)을 형성하는 것이 바람직하며, 제2그라운드 레이어(800)는 제1그라운드 레이어(300)의 형상과 대응되는 형성으로 형성하는 것이 바람직하다.Meanwhile, it is preferable to form a matching groove H corresponding to the shape of the second signal line 900b in the first ground layer 300, and the second ground layer 800 is formed in the first ground layer 300. It is preferable to form by formation corresponding to the shape of.
도 7은 본 발명의 제3실시예의 구성도이고, 도 8(a) 및 도 8(b)는 각각 본 발명의 제3실시예의 일요부 및 다른 요부를 나타낸 도면이다.7 is a configuration diagram of the third embodiment of the present invention, and FIGS. 8 (a) and 8 (b) are diagrams showing main and other main parts of the third embodiment of the present invention, respectively.
이하에서는 본 발명의 제3실시예를 설명하되, 제1실시예와 동일 구성에 대하여는 상술한 설명으로 갈음하고, 상이한 구성을 중심으로 설명한다.Hereinafter, a third embodiment of the present invention will be described, but the same configuration as that of the first embodiment will be replaced with the above description, with a focus on different configurations.
본 발명의 제3실시예에서, 제2기판부(200)는, 제1그라운드 레이어(300), 제1유전체 레이어(400) 및 신호라인(900)으로 구성된다.In the third embodiment of the present invention, the second substrate part 200 includes a first ground layer 300, a first dielectric layer 400, and a signal line 900.
신호라인(900)은, 상기 제1유전체 레이어(400)의 저면에 설치된 내측 신호라인(910)과 제1유전체 레이어(400) 상면에 설치된 외측 신호라인(920)을 포함하고, 내측 신호라인(910)과 외측 신호라인(920)은 비아홀(VH)을 통해 전기적으로 연결된다. 따라서, 제2기판부(200)가 벤딩되는 경우 내측 신호라인(910)이 주변 부품에 간섭을 받는 경우 외측 신호라인(920)으로 신호라인을 변경할 수 있게 된다.The signal line 900 includes an inner signal line 910 provided on a bottom surface of the first dielectric layer 400 and an outer signal line 920 provided on an upper surface of the first dielectric layer 400. The 910 and the outer signal line 920 are electrically connected to each other through the via hole VH. Therefore, when the second substrate 200 is bent, when the inner signal line 910 interferes with the peripheral components, the signal line may be changed into the outer signal line 920.
한편, 외측 신호라인(920)은 제1그라운드 레이어(300)와 동일 층에 형성될 수 있도록 제1유전체 레이어(400)와 상이한 형상으로 형성되며, 내측 신호라인(910)은 제1신호라인(900a)과, 이 제1신호라인(900a)에서 연장되며 그 폭이 상기 제1신호라인(900a)보다 큰 제2신호라인(900b)을 포함하는 것이 바람직하다.Meanwhile, the outer signal line 920 is formed in a shape different from that of the first dielectric layer 400 so that the outer signal line 920 is formed on the same layer as the first ground layer 300, and the inner signal line 910 is formed of the first signal line ( 900a and a second signal line 900b extending from the first signal line 900a and having a width greater than that of the first signal line 900a.
외측 신호라인(920)의 제2신호라인(900b)을 두 개 이상으로 분기하면 고주파 신호 전송량이 증가하게 되는바, 그 이유는 상술한 바와 같다.If the second signal line 900b of the outer signal line 920 is divided into two or more, the high frequency signal transmission amount is increased, and the reason is as described above.
이상 본 발명을 구체적인 실시예를 통하여 상세히 설명하였으나, 이는 본 발명을 구체적으로 설명하기 위한 것으로, 본 발명에 따른 연성회로기판에 한정되지 않으며, 본 발명의 기술적 사상 내에서 당해 분야의 통상의 지식을 가진 자에 의해 그 변형이나 개량이 가능함은 명백하다고 할 것이다.Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and is not limited to the flexible circuit board according to the present invention, and the general knowledge in the art within the technical spirit of the present invention. It is obvious that modifications and improvements are possible by those who have them.
본 발명의 단순한 변형 내지 변경은 모두 본 발명의 영역에 속하는 것으로 본 발명의 구체적인 보호 범위는 첨부된 특허청구범위에 의하여 명확해질 것이다.All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

Claims (16)

  1. 제1기판부 및First substrate section and
    상기 제1기판부에서 연장 형성되고, 벤딩(bending) 가능하도록 상기 제1기판부보다 얇은 두께로 형성된 제2기판부를 포함하는 연성회로기판.And a second substrate portion extending from the first substrate portion and having a thickness thinner than the first substrate portion so as to bend.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 제1기판부는,The first substrate portion,
    제1그라운드 레이어;A first ground layer;
    상기 제1그라운드 레이어에 적층된 제1유전체 레이어; A first dielectric layer stacked on the first ground layer;
    외부 신호가 신호라인으로 유입되는 것을 방지할 수 있도록 상기 신호라인을 사이에 두고 일정 간격 이격되어 그 일면이 상기 제1유전체 레이어에 결합되는 측면 그라운드;A side ground spaced apart from each other by a predetermined interval so as to prevent an external signal from flowing into the signal line and having one surface coupled to the first dielectric layer;
    상기 측면 그라운드를 사이에 두고 상기 제1유전체 레이어와 마주보는 제2유전체 레이어;A second dielectric layer facing the first dielectric layer with the side ground interposed therebetween;
    상기 제2유전체 레이어에 적층된 제2그라운드 레이어를 포함하고,A second ground layer stacked on the second dielectric layer,
    상기 제2기판부는, 상기 제1그라운드 레이어, 상기 측면 그라운드, 상기 제2유전체 레이어, 상기 제2그라운드 레이어 중 어느 하나 이상이 생략된 것을 특징으로 하는, 연성회로기판.The second substrate unit, wherein at least one of the first ground layer, the side ground, the second dielectric layer, the second ground layer is omitted.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 측면 그라운드는,The side ground is
    그 일면이 상기 제1유전체 레이어에 접하는 제1측면 그라운드와, 그 일면이 상기 제2유전체 레이어에 접하는 제2측면 그라운드를 포함하고,One side thereof includes a first side ground in contact with the first dielectric layer, and one side thereof includes a second side ground in contact with the second dielectric layer,
    상기 제1측면 그라운드 및 제2측면 그라운드의 타면은 각각 본딩시트를 매개로 결합되는 것을 특징으로 하는, 연성회로기판.The other side of the first side ground and the second side ground, respectively, characterized in that coupled to the bonding sheet via a flexible circuit board.
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 제2기판부는, 제1그라운드 레이어, 제1유전체 레이어, 제1측면 그라운드 및 신호라인으로 구성된 것을 특징으로 하는, 연성회로기판.And the second substrate portion includes a first ground layer, a first dielectric layer, a first side ground, and a signal line.
  5. 청구항 4에 있어서,The method according to claim 4,
    상기 신호라인의 일면은 상기 제1유전체 레이어에 결합되고, 그 타면은 상기 제2유전체 레이어와 일정 간격 이격되어 마주보며 공기층에 노출되는 것을 특징으로 하는, 연성회로기판.One surface of the signal line is coupled to the first dielectric layer, the other surface of the flexible circuit board, characterized in that exposed to the air layer facing each other spaced apart from the second dielectric layer.
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 제1측면 그라운드는 외부로부터 신호가 유입되는 것을 방지할 수 있도록 상기 신호라인의 길이 방향으로 형성된 것을 특징으로 하는, 연성회로기판.The first side ground is formed in the longitudinal direction of the signal line to prevent a signal from flowing from the outside, the flexible circuit board.
  7. 청구항 3에 있어서,The method according to claim 3,
    상기 제2기판부는, 제1유전체 레이어, 제1측면 그라운드 및 신호라인으로 구성된 것을 특징으로 하는, 연성회로기판.And said second substrate portion comprises a first dielectric layer, a first side ground, and a signal line.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 신호라인은, 제1신호라인과, 상기 제1신호라인에서 연장된 제2신호라인은 포함하고,The signal line includes a first signal line and a second signal line extending from the first signal line.
    상기 제2신호라인의 면적은 상기 제1신호라인의 면적보다 넓은 것을 특징으로 하는, 연성회로기판.And the area of the second signal line is wider than the area of the first signal line.
  9. 청구항 8에 있어서,The method according to claim 8,
    상기 제2신호라인은 두 개 이상으로 분기된 것을 특징으로 하는, 연성회로기판.And at least two second signal lines.
  10. 청구항 8 또는 청구항 9에 있어서,The method according to claim 8 or 9,
    상기 제1그라운드 레이어에는 상기 제2신호라인의 형상과 대응되는 매칭홈이 형성된 것을 특징으로 하는, 연성회로기판.And a matching groove corresponding to the shape of the second signal line is formed in the first ground layer.
  11. 청구항 3에 있어서,The method according to claim 3,
    상기 제2기판부는, 제1그라운드 레이어, 제1유전체 레이어 및 신호라인으로 구성된 것을 특징으로 하는, 연성회로기판.And said second substrate portion comprises a first ground layer, a first dielectric layer, and a signal line.
  12. 청구항 11에 있어서,The method according to claim 11,
    상기 신호라인은, 상기 제1유전체 레이어의 저면에 설치된 내측 신호라인과 상기 제1유전체 레이어 상면에 설치된 외측 신호라인을 포함하고, 상기 내측 신호라인과 외측 신호라인은 비아홀을 통해 전기적으로 연결된 것을 특징으로 하는, 연성회로기판.The signal line may include an inner signal line provided on a bottom surface of the first dielectric layer and an outer signal line provided on an upper surface of the first dielectric layer, and the inner signal line and the outer signal line may be electrically connected through a via hole. Flexible circuit board.
  13. 청구항 12에 있어서,The method according to claim 12,
    상기 외측 신호라인이 상기 제1그라운드 레이어와 동일 층에 형성될 수 있도록 상기 제1그라운드 레이어와 상기 제1유전체 레이어는 상이한 형상으로 형성된 것을 특징으로 하는, 연성회로기판. The first circuit layer and the first dielectric layer is formed in a different shape so that the outer signal line is formed on the same layer as the first ground layer, the flexible circuit board.
  14. 청구항 13에 있어서,The method according to claim 13,
    상기 내측 신호라인은 제1신호라인과, 상기 제1신호라인에서 연장되며 그 폭이 상기 제1신호라인보다 큰 제2신호라인을 포함하는 것을 특징으로 하는, 연성회로기판.And the inner signal line includes a first signal line and a second signal line extending from the first signal line and having a width greater than that of the first signal line.
  15. 청구항 14에 있어서,The method according to claim 14,
    상기 외측 신호라인은 두 개 이상으로 분기된 것을 특징으로 하는, 연성회로기판.The outer signal line is divided into two or more, the flexible circuit board.
  16. 청구항 14 또는 청구항 15에 있어서,The method according to claim 14 or 15,
    상기 제1그라운드 레이어에는 상기 외측 신호라인에 대응되는 매칭홈이 형성된 것을 특징으로 하는, 연성회로기판.And a matching groove corresponding to the outer signal line is formed in the first ground layer.
PCT/KR2016/002327 2015-03-18 2016-03-09 Flexible printed circuit board WO2016148429A1 (en)

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CN111083869A (en) * 2019-12-16 2020-04-28 精电(河源)显示技术有限公司 Flexible circuit board of display screen

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