WO2016136577A1 - 面発光モジュール - Google Patents
面発光モジュール Download PDFInfo
- Publication number
- WO2016136577A1 WO2016136577A1 PCT/JP2016/054675 JP2016054675W WO2016136577A1 WO 2016136577 A1 WO2016136577 A1 WO 2016136577A1 JP 2016054675 W JP2016054675 W JP 2016054675W WO 2016136577 A1 WO2016136577 A1 WO 2016136577A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealing sheet
- sealing
- opening
- light emitting
- surface light
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 204
- 230000001681 protective effect Effects 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims description 34
- 239000010408 film Substances 0.000 description 70
- 239000010410 layer Substances 0.000 description 24
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 230000004888 barrier function Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000012447 hatching Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B44/00—Circuit arrangements for operating electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
Definitions
- This invention relates to the surface emitting module provided with the sheet
- the surface light emitting element is composed of a thin planar light source such as an organic EL.
- a surface light emitting module including a surface light emitting element is disposed both indoors and outdoors, and is used in various applications such as signboards, signs, backlights, lighting, and illumination.
- the surface light emitting element needs to be protected from dust, ultraviolet rays, and wind and rain.
- a surface light emitting element is disposed between a pair of sheets and sealed so as to be sandwiched between the pair of sheets (see, for example, Patent Documents 1 and 2 below).
- the wiring member is disposed between the ends of the pair of sealing sheets (in other words, the pair of sealing sheets With a wiring member interposed between the end portions), the pair of sealing sheets are bonded to each other using an adhesive.
- a step due to the presence of the wiring member is formed at the ends of the pair of sealing sheets, and the adhesive is not affected by the step and cannot exhibit sufficient adhesion performance.
- a sealing resin is applied to a gap formed between a pair of sealing sheets and an organic EL panel or a gap formed between a pair of sealing sheets and a wiring member. By filling, the deterioration of sealing performance is prevented.
- Patent Document 2 In the electroluminescent lamp disclosed in Japanese Patent Application Laid-Open No. 01-117295 (Patent Document 2), a surface light emitting element and an electrode lead terminal are sealed with a pair of films, and a conductor (electrode pin) is formed from the outside of one film. And the insertion end of the conductor is connected to the electrode lead terminal. The outer end of the conductor protrudes outward from the film, and the surface light emitting element is supplied with power through the protruding portion.
- Patent Document 2 describes that since the entire surface light emitting device and the entire electrode lead terminal can be sealed without exposing the electrode lead terminal to the outside, high sealing performance can be obtained.
- JP 2010-244698 A Japanese Patent Laid-Open No. 01-117295
- Patent Document 1 Japanese Patent Application Laid-Open No. 2010-244698
- the ends of the pair of sealing sheets with the wiring member interposed between the ends of the pair of sealing sheets When it is going to join a part, since a clearance gap is easy to be formed between the edge part of a pair of sealing sheet by presence of a wiring member (step), it is not easy to obtain sufficient sealing performance.
- Patent Document 2 When the configuration disclosed in Japanese Patent Laid-Open No. 01-117295 (Patent Document 2) is adopted, a part of the sealing sheet is broken by insertion of the conductor (electrode pin).
- the sealing sheet may be further torn starting from the torn portion, and it is not easy to maintain a highly reliable sealing performance for a long period of time.
- This invention is made
- a surface emitting module includes a first sealing sheet having an opening, a second sealing sheet bonded to the first sealing sheet, the first sealing sheet, and the second sealing sheet.
- a surface light emitting element disposed between and sealed with the sealing sheet, and disposed between the first sealing sheet and the second sealing sheet, and electrically connected to the surface light emitting element.
- a wiring member, and the wiring member is formed on the substrate, the electrode having an exposed portion disposed so as to be exposed from the opening of the first sealing sheet, and the exposure.
- a protective film provided so as to cover at least the periphery of the exposed portion of the electrode, and the one exposed portion passes through the one opening and the one opening.
- the first sealing sheet that can be exposed Edge portion forming the opening of the out, among the surfaces of and the protective film located outside the above opening is located on a portion having a flat shape.
- a surface emitting module includes a first sealing sheet having an opening, a second sealing sheet bonded to the first sealing sheet, the first sealing sheet, and the first sealing sheet. 2 is disposed between the two sealing sheets and is sealed by them, and is disposed between the first sealing sheet and the second sealing sheet, and is electrically connected to the surface light emitting element.
- a wiring member, and the wiring member includes a substrate and an electrode formed on the substrate and having an exposed portion disposed so as to be exposed from the opening of the first sealing sheet. And the one exposed portion can be exposed through the one opening portion, and the edge portion forming the opening portion of the first sealing sheet is flat on the surface of the electrode. It is located on the part having the shape.
- FIG. 3 is a plan view showing the surface emitting module in the first embodiment. It is a top view which shows the state which the surface emitting module in Embodiment 1 decomposed
- FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3.
- FIG. 5 is a plan view for explaining the operation and effect of the surface emitting module in the first embodiment. It is a top view which shows the surface emitting module in a comparative example. It is a top view which shows the state which the surface emitting module in the comparative example decomposed
- FIG. 1 is a plan view showing the surface emitting module 100
- FIG. 2 is a plan view showing an exploded state of the surface emitting module 100
- FIG. 3 is a plan view showing a further exploded state of the surface emitting module 100.
- FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
- FIG. 5 is a plan view for explaining the operation and effect of the surface emitting module 100.
- external wiring 40 (see FIG. 1) is connected to the surface light emitting module 100, and the surface light emitting module 100 can be used in various applications such as lighting, decoration, and backlight.
- the external wiring 40 is composed of an FPC or the like, and includes contact portions 41 and 42 and a substrate 43 that holds them. Although details will be described later, the contact portions 41 and 42 are respectively connected to the power feeding portions 32R and 33L (exposed portions) of the surface emitting module 100 via a conductive adhesive (ACF) (not shown).
- ACF conductive adhesive
- the surface light emitting module 100 has a configuration in which the surface light emitting element 10 is sandwiched and sealed between a pair of sealing sheets 21 and 22 (FIGS. 1 and 2).
- the surface light emitting element 10 is illustrated using a two-dot chain line, and the sealing sheet 21 is not illustrated in FIG. 3.
- the surface light emitting module 100 includes a surface light emitting element 10 and a pair of sealing sheet 21 (first sealing sheet) and sealing sheet 22 (second sealing sheet) that sandwich the surface light emitting element 10 from above and below.
- a wiring member 30 that is electrically connected to the surface light emitting element 10 in order to supply power to the surface light emitting element 10.
- the surface light emitting element 10 is composed of an organic EL, and is disposed between the sealing sheet 21 and the sealing sheet 22.
- the surface light emitting element 10 is disposed such that the surface 10S (light emitting surface) is located on the side where the sealing sheet 21 is disposed (the front side of the sheet of FIG. 2).
- the thickness of the surface light emitting element 10 is, for example, 50 ⁇ m to 200 ⁇ m.
- the surface light emitting element 10 is preferably flexible.
- the surface light emitting element 10 of the present embodiment has a rectangular shape in plan view (see FIG. 3).
- the surface light emitting device 10 includes a transparent substrate 11, a barrier layer 12, an anode 13, a light emitting layer 14, a cathode 15, a sealing member 16, and an insulating layer 17.
- the transparent substrate 11, the barrier layer 12, the anode 13, the light emitting layer 14, the cathode 15, and the sealing member 16 are from the surface 10 ⁇ / b> S (light emitting surface) side of the surface light emitting element 10 toward the back surface side of the surface light emitting element 10. They are stacked in order.
- the transparent substrate 11 is formed from glass, thin film glass, resin film, or the like.
- the transparent substrate 11 is a member that forms the surface 10S of the surface light emitting element 10, and has a rectangular shape in plan view.
- the barrier layer 12 has transparency and is formed so as to cover the entire surface of the transparent substrate 11.
- Barrier layer 12 is made of, for example, a silicon compound such as silicon oxide or silicon nitride, a metal compound such as metal oxide or metal nitride, or a mixture thereof.
- the anode 13 is a conductive film having transparency, and is formed by depositing ITO or the like on the barrier layer 12.
- the ITO film for forming the anode 13 is divided into two regions by patterning in order to form a power feeding portion 18 (for anode) and a power feeding portion 19 (for cathode).
- the ITO film constituting the power feeding unit 19 is connected to the cathode 15.
- the light emitting layer 14 When the light emitting layer 14 is supplied with electric power, it generates light by the action of the field effect.
- the light emitting layer 14 is composed of a single layer or a plurality of stacked layers.
- the cathode 15 is made of aluminum (Al), for example, and is formed so as to cover the light emitting layer 14.
- the insulating layer 17 is provided between the cathode 15 and the anode 13. A portion of the cathode 15 opposite to the side on which the insulating layer 17 (FIG. 3) is located is connected to the ITO film constituting the power feeding portion 19.
- the sealing member 16 is made of glass, thin film glass, resin film, or the like.
- the sealing member 16 seals substantially the whole of the anode 13, the light emitting layer 14, and the cathode 15 on the transparent substrate 11 (barrier layer 12).
- a part of the ITO film formed on the barrier layer 12 is exposed from the sealing member 16 in order to form the power feeding portions 18 and 19 (locations where electrical connection is performed).
- the power feeding units 18 and 19 are located outside the sealing member 16 and are located on opposite sides of the sealing member 16 (light emitting layer 14).
- the surface light emitting element 10 configured as described above, power is supplied to the light emitting layer 14 through the wiring member 30 (details will be described later), the power supply units 18 and 19, the anode 13 and the cathode 15. Light is generated in the light emitting layer 14, and the light passes through the anode 13, the barrier layer 12 and the transparent substrate 11 and is extracted from the surface 10 ⁇ / b> S of the surface light emitting element 10.
- sealing sheets 21, 22 With reference to FIGS. 1 to 3, the pair of sealing sheet 21 and sealing sheet 22 are bonded to each other to seal the surface light emitting element 10 inside thereof.
- the sealing sheets 21 and 22 for example, resin members having a sheet shape or a film shape are used. It is preferable that the sealing sheets 21 and 22 have flexibility.
- the thickness of the sealing sheets 21 and 22 is, for example, 25 ⁇ m to 50 ⁇ m.
- sealing sheets 21 and 22 are polyethylene terephthalate, polypropylene, acrylic, polyimide, polysulfone, and the like.
- the sealing sheets 21 and 22 in addition to these materials, those on which various types of film formation have been performed in order to improve barrier properties may be used.
- the sealing sheet 21 of the sealing sheets 21 and 22 since at least the sealing sheet 21 of the sealing sheets 21 and 22 allows the light radiated
- the sealing sheet 22 may also have transparency.
- an adhesive (not shown) is provided on the inner surfaces of the sealing sheets 21 and 22.
- the adhesive for example, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin are used.
- the thickness of the adhesive is, for example, 20 ⁇ m to 50 ⁇ m.
- the sealing sheets 21 and 22 have a rectangular portion wider than the area of the surface light emitting element 10.
- a wiring member 30 (a substrate 31, electrodes 32 and 33 and a protective film 34) to be described later is disposed on the rectangular portion of the sealing sheet 22 .
- the surface light emitting element 10 is placed on the wiring member 30 (protective film 34) so that the sealing member 16 (see FIG. 4) of the surface light emitting element 10 overlaps the protective film 34 of the wiring member 30.
- the wiring member 30 includes electrodes 32 and 33, and the electrodes 32 and 33 (linear portions 32 a and 33 a) are electrically connected to the power feeding units 19 and 18 of the surface light emitting element 10, respectively.
- the sealing sheet 21 has a pair of openings 21L and 21R (FIG. 2).
- the position of the opening 21L corresponds to the position of the power feeding part 33L of the wiring member 30 and the position of the opening 34L provided in the protective film 34 of the wiring member 30 (see FIG. 1).
- the surface light emitting element 10 and the wiring member 30 are sandwiched and sealed between the pair of sealing sheets 21 and 22 from above and below, the surface light emitting element 10, the wiring member 30, and the sealing sheets 21 and 22 are overlapped.
- the power feeding unit 33L When the power feeding unit 33L, the opening 34L, and the opening 21L are viewed from a direction parallel to the direction in which the power feeding is performed (when viewed in plan), the power feeding unit 33L is located inside the opening 34L, and the power feeding unit 33L and the opening 34L. Is located inside the opening 21L.
- the position of the opening 21R corresponds to the position of the power feeding part 32R of the wiring member 30 and the position of the opening 34R provided in the protective film 34 of the wiring member 30. Specifically, when the surface light emitting element 10 and the wiring member 30 are sandwiched and sealed between the pair of sealing sheets 21 and 22 from above and below, the surface light emitting element 10, the wiring member 30, and the sealing sheets 21 and 22 are overlapped.
- the power feeding unit 32R, the opening 34R, and the opening 21R are viewed from a direction parallel to the current direction (when viewed in plan), the power feeding unit 32R is located inside the opening 34R, and the power feeding unit 32R and the opening 34R. Is located inside the opening 21R. Further details of the openings 21L and 21R will be described later.
- the wiring member 30 is electrically connected to the surface light emitting element 10 and is disposed between the sealing sheets 21 and 22.
- the wiring member 30 includes a substrate 31, electrodes 32 and 33, and a protective film 34.
- the wiring member 30 preferably has flexibility as a whole.
- the substrate 31 and the protective film 34 (coverlay) have an outer shape that is slightly smaller than the sealing sheets 21 and 22.
- the protective film 34 has a pair of openings 34L and 34R.
- the protective film 34 is provided so as to cover at least the portions located around the power feeding portions 32R and 33L (exposed portions) of the electrodes 32 and 33, protects the electrodes 32 and 33, and improves the sealing performance of the electrodes. Fulfill.
- the electrodes 32 and 33 are formed on the substrate 31 by film forming techniques such as printing, vapor deposition, plating, and sputtering.
- the thickness of the electrodes 32 and 33 is, for example, 0.1 ⁇ m to 10 ⁇ m.
- the material of the electrodes 32 and 33 is, for example, copper or nickel, or a laminate thereof. In addition to copper or nickel, or a laminate of these, gold may be plated on these surfaces.
- the electrodes 32 and 33 are not limited to film formation, and a thin metal foil such as a so-called copper foil tape is attached to the surface of the substrate 31 using a conductive adhesive (ACF: anisotropic conductive film). It may be.
- ACF anisotropic conductive film
- the electrode 32 includes a linear portion 32a that extends long so as to correspond to the position and shape of the power feeding portion 19 of the surface light emitting element 10, a rectangular portion 32b that forms a power feeding portion 32R (exposed portion) inside, and a linear portion 32a and a rectangular shape. A connecting portion 32c for connecting the portion 32b.
- the protective film 34 is disposed on the substrate 31 and the electrodes 32 and 33, the linear portion 32 a is not covered with the protective film 34.
- the power feeding portion 19 of the surface light emitting element 10 is electrically connected to the straight portion 32a of the electrode 32 through a conductive adhesive (ACF) (not shown).
- ACF conductive adhesive
- the power feeding portion 19 of the surface light emitting element 10 may be in pressure contact with the linear portion 32a of the electrode 32 without using a conductive adhesive (ACF).
- the power feeding portion 32R is a part of the electrode 32 that can be exposed through the opening 34R when the protective film 34 is disposed on the substrate 31 and the electrode 32. That is, the power feeding part 32R (exposed part) is such that the protective film 34, the surface light emitting element 10, and the sealing sheet 21 can be exposed to the outside through the opening 34R and the opening part 21R when the protective film 34, the surface light emitting element 10, and the sealing sheet 21 are sequentially disposed on the electrode 32. And is connected to the contact portion 41 of the external wiring 40 (FIG. 1).
- “exposed” is not limited to the state in which the power feeding portion 32R is actually exposed through the opening 34R and the opening 21R, and in that state, the power feeding portion 32R further has another sealing member or conductive paste. It is a concept including a state where it is covered and not exposed as necessary.
- the position of the opening 34R provided in the protective film 34 corresponds to the position of the power feeding part 32R of the wiring member 30 (electrode 32) and the position of the opening 21R provided in the sealing sheet 21 (FIG. 1). reference).
- the size of the opening 34R is smaller than the size of the opening 21R (the opening area is small).
- the size of the opening 21 ⁇ / b> R is smaller than the size of the rectangular portion 32 b of the electrode 32. Therefore, in the state in which the protective film 34, the surface light emitting element 10, and the sealing sheet 21 are sequentially disposed on the electrode 32, the edge portion of the sealing sheet 21 that forms the opening 21R is the opening 34R. It is located outside the position and is located on a portion having a flat shape on the surface of the protective film 34 (positioned on the rectangular portion 32b via the protective film 34).
- the protective film 34 (specifically, the peripheral portion of the opening 34R in the protective film 34) is disposed on the surface of the portion positioned around the power feeding portion 32R in the rectangular portion 32b (FIG. 3). .
- the peripheral part of the opening 34R in the protective film 34 is joined to the sealing sheet 21 via an adhesive (see FIG. 2). If the bonding force between the protective film 34 and the sealing sheet 21 is increased, the sealing performance of the surface emitting module 100 can be improved. Therefore, it is preferable that a portion of the rectangular portion 32b located around the power feeding portion 32R has a surface shape that is as flat as possible (having as high a flatness as possible) with little or no step.
- the electrode 33 includes a linear portion 33a that extends long so as to correspond to the position and shape of the power feeding portion 18 of the surface light emitting element 10, a rectangular portion 33b that forms a power feeding portion 33L (exposed portion) inside, and a linear portion 33a and a rectangular shape. A connecting portion 33c for connecting the portion 33b.
- the protective film 34 is disposed on the substrate 31 and the electrodes 32 and 33, the linear portion 33 a is not covered with the protective film 34.
- the power feeding portion 18 of the surface light emitting element 10 is electrically connected to the straight portion 33a of the electrode 33 via a conductive adhesive (ACF) (not shown).
- ACF conductive adhesive
- the power feeding portion 18 of the surface light emitting element 10 may be in pressure contact with the linear portion 33a of the electrode 33 without using a conductive adhesive (ACF).
- the power feeding portion 33L is a part of the electrode 33 that can be exposed through the opening 34L when the protective film 34 is disposed on the substrate 31 and the electrode 33. That is, the power feeding portion 33L (exposed portion) is such that when the protective film 34, the surface light emitting element 10, and the sealing sheet 21 are sequentially disposed on the electrode 33, the power feeding portion 33L (exposed portion) can be exposed to the outside through the opening 34L and the opening portion 21L. It is a part connected to the contact part 42 of the external wiring 40 (FIG. 1).
- “exposed” is not limited to the state in which the power feeding portion 33L is actually exposed through the opening 34L and the opening 21L, and in that state, the power feeding portion 33L can further be another sealing member or conductive paste. It is a concept including a state where it is covered and not exposed as necessary.
- the position of the opening 34L provided in the protective film 34 corresponds to the position of the power feeding part 33L of the wiring member 30 (electrode 33) and the position of the opening 21L provided in the sealing sheet 21 (FIG. 1). reference).
- the size of the opening 34L is smaller than the size of the opening 21L (the opening area is small).
- the size of the opening 21L is smaller than the size of the rectangular portion 33b of the electrode 33. Therefore, in the state where the protective film 34, the surface light emitting element 10, and the sealing sheet 21 are sequentially disposed on the electrode 33, the edge portion of the sealing sheet 21 that forms the opening 21L is the opening 34L. It is located outside the position and is located on a portion having a flat shape on the surface of the protective film 34 (positioned on the rectangular portion 33b via the protective film 34).
- the protective film 34 (specifically, the peripheral portion of the opening 34L in the protective film 34) is disposed on the surface of the portion located around the power feeding portion 33L in the rectangular portion 33b (FIG. 3). .
- the peripheral part of the opening 34L in the protective film 34 is joined to the sealing sheet 21 via an adhesive (see FIG. 2). If the bonding force between the protective film 34 and the sealing sheet 21 is increased, the sealing performance of the surface emitting module 100 can be improved. Therefore, it is preferable that a portion of the rectangular portion 33b located around the power feeding portion 33L has a surface shape that is as flat as possible (having as high a flatness as possible) with little or no step.
- the electrode 32 and the electrode 33 of the wiring member 30 extend to the same side of the surface light emitting element 10, and the power feeding portions 32R and 33L (rectangular portions 32b and 33b) are arranged adjacent to each other. ing.
- electrode 33 passes through openings 34 ⁇ / b> L and 34 ⁇ / b> R provided in protective film 34 and openings 21 ⁇ / b> L and 21 ⁇ / b> R provided in sealing sheet 21 (first sealing sheet). , 32 are respectively exposed.
- the contact portions 42 and 41 of the external wiring 40 can be electrically connected to the power feeding portions 33L and 32R, respectively.
- the external wiring 40 is not located between the end portions of the sealing sheets 21 and 22.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2010-244698
- the gap between the end portions of the sealing sheets 21 and 22 due to the presence of the external wiring 40 No step is formed, and the presence of the external wiring 40 hardly affects the sealing performance.
- the edge parts of the sealing sheets 21 and 22 can be joined appropriately, and the sealing performance by the sealing sheets 21 and 22 is obtained.
- the region RA indicated by hatching lines is located around the surface light emitting element 10, the substrate 31, or the protective film 34.
- the region RA when the sealing sheets 21 and 22 are joined, a step is generated depending on the thickness of the surface light emitting element 10, the thickness of the electrodes 32 and 33, the thickness of the protective film 34, and the like.
- the portion where the possibility that voids are formed is higher than the others.
- this region RA reaches the outer edge EE (FIG. 5) of the sealing sheets 21 and 22 and the openings 21L and 21R, moisture and the like easily enter through the reaching portions.
- the surface light emitting module 100 does not have such a configuration.
- the sealing sheet 21 when the sealing sheet 21 is bonded to the sealing sheet 22, the peripheral portions of the openings 34L and 34R in the protective film 34 are bonded to the sealing sheet 21 via an adhesive (see FIG. 2). .
- the edge part which forms the opening part 21L of the sealing sheet 21 is located outside the position of the opening 34L, and is located on the part which has a flat shape among the surfaces of the protective film 34. (Positioned on the rectangular portion 33b through the protective film 34).
- the edge part which forms the opening part 21R of the sealing sheet 21 is located outside the position of the opening 34R, and the upper part of the surface of the protective film 34 having a flat shape. (Positioned on the rectangular portion 32b through the protective film 34). Therefore, it can be said that since the sealing structure in which the region RA is confined inside by the joining of the flat surfaces can be realized, the deterioration of the sealing performance can be suppressed as compared with the conventional sealing structure.
- the surface light emitting module 100 adopts a configuration in which a conductor (electrode pin) is inserted (punctured) into a sealing sheet. Not. Compared with the case of patent document 2, possibility that a sealing sheet will be torn is low, and it is possible to continue maintaining highly reliable sealing performance over a long period of time compared with the case of patent document 2.
- the edge part which forms the opening part 21H of the sealing sheet 21 is located outside the openings 34L and 34R provided in the protective film 34 (FIG. 6). However, the edge part which forms the opening part 21H of the sealing sheet 21 is not located on the part which has a flat shape among the surfaces of the protective film 34.
- the edge part which forms the opening part 21H of the sealing sheet 21 is arrange
- the region RB indicated by hatching lines is located around the surface light emitting element 10, around the substrate 31, or around the protective film 34.
- the region RB reaches the opening 21H (see the portion surrounded by the circles P1 and P2), and moisture and the like easily enter through the reaching portion. ing.
- Embodiment 2 With reference to FIG. 10 and FIG. 11, the surface emitting module 102 in Embodiment 2 is demonstrated.
- the surface emitting module 102 includes a wiring member 30A instead of the wiring member 30 (Embodiment 1).
- the wiring member 30 ⁇ / b> A is different from the wiring member 30 in that it does not include the protective film 34.
- the power feeding part 32R in the surface light emitting module 102 is a part of the electrode 32 that can be exposed through the opening 21R when the sealing sheet 21 is disposed on the surface light emitting element 10, the substrate 31, and the electrode 32.
- the size of the opening 21 ⁇ / b> R is smaller than the size of the rectangular portion 32 b of the electrode 32.
- the edge portion forming the opening 21 ⁇ / b> R in the sealing sheet 21 has a flat shape on the surface of the rectangular portion 32 b of the electrode 32.
- the peripheral part of the power feeding part 32R is joined to the sealing sheet 21 via an adhesive.
- a portion of the rectangular portion 32b located around the power feeding portion 32R preferably has a surface shape that is as flat as possible (having the highest possible flatness) with little or no step.
- the power feeding portion 33L in the surface light emitting module 102 is a part of the electrode 33 that can be exposed through the opening portion 21L when the sealing sheet 21 is disposed on the surface light emitting element 10, the substrate 31, and the electrode 33.
- the size of the opening 21L is smaller than the size of the rectangular portion 33b of the electrode 33.
- the edge portion forming the opening 21 ⁇ / b> L of the sealing sheet 21 has a flat shape on the surface of the rectangular portion 33 b of the electrode 32.
- the peripheral portion of the power feeding portion 33L is joined to the sealing sheet 21 via an adhesive.
- a portion of the rectangular portion 33b located around the power feeding portion 33L preferably has a surface shape that is as flat as possible (having as high a flatness as possible) with little or no step.
- the region RA indicated by hatching lines is located around the surface light emitting element 10, the substrate 31, or the protective film 34.
- the region RA does not reach the outer edge EE (FIG. 11) or the openings 21L and 21R of the sealing sheets 21 and 22.
- EE FIG. 11
- the sealing sheet 21 is bonded to the sealing sheet 22
- a sealing structure that confines the region RA inside by bonding of flat surfaces can be realized. It can be said that a decrease in performance can be suppressed.
- the surface light emitting module 102 does not employ a configuration in which a conductor (electrode pin) is inserted (punctured) into a sealing sheet. Compared to the case of Patent Document 2, it is possible to maintain a highly reliable sealing performance over a long period of time.
- a surface light emitting module based on a certain aspect includes a first sealing sheet having an opening, a second sealing sheet bonded to the first sealing sheet, and the first sealing sheet. And the surface light emitting element disposed between and sealed by the second sealing sheet, and the surface light emitting element disposed between the first sealing sheet and the second sealing sheet.
- An electrically connected wiring member, and the wiring member is formed on the substrate and an electrode having an exposed portion disposed so as to be exposed from the opening of the first sealing sheet.
- a protective film having an opening corresponding to the exposed portion and provided to cover at least the periphery of the exposed portion of the electrode, and the one exposed portion includes one opening and one protective film. Can be exposed through the two openings above
- the edge part which forms the said opening part among the 1st sealing sheets is located outside the said opening, and is located on the part which has a flat shape among the surfaces of the said protective film. .
- a surface emitting module based on another aspect includes a first sealing sheet having an opening, a second sealing sheet bonded to the first sealing sheet, the first sealing sheet, and the second sealing.
- a surface light emitting element disposed between and sealed by the sheet, and a wiring member disposed between the first sealing sheet and the second sealing sheet and electrically connected to the surface light emitting element.
- the wiring member includes a substrate and an electrode formed on the substrate and having an exposed portion disposed so as to be exposed from the opening of the first sealing sheet. The two exposed portions can be exposed through the one opening portion, and the edge portion forming the opening portion of the first sealing sheet has a flat shape on the surface of the electrode. Located on the part.
- the first sealing sheet, the second sealing sheet, the surface light emitting element, and the wiring member have flexibility.
- the part which has formed the opening part of the 1st sealing sheet is joined to the part which has a flat surface shape (in other words, the part in which the level
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
(面発光モジュール100)
図1~図5を参照して、実施の形態1における面発光モジュール100について説明する。図1は、面発光モジュール100を示す平面図であり、図2は、面発光モジュール100の分解した状態を示す平面図であり、図3は、面発光モジュール100のさらに分解した状態を示す平面図であり、図4は、図3中のIV-IV線における矢視断面図である。図5は、面発光モジュール100の作用および効果を説明するための平面図である。
図1~図4(主として図3および図4)に示すように、面発光素子10は、有機ELから構成され、封止シート21と封止シート22との間に配置される。面発光素子10は、封止シート21が配置される側(図2の紙面の手前側)に表面10S(発光面)が位置するように配置される。面発光素子10の厚さは、たとえば50μm~200μmである。面発光素子10は、可撓性を有していることが好ましい。本実施の形態の面発光素子10は、平面視(図3参照)で長方形の形状を有している。
図1~図3を参照して、一対の封止シート21および封止シート22は、互いに接合されることによって面発光素子10をこれらの内側に封止する。封止シート21,22としては、たとえばシート形状またはフィルム形状を有する樹脂部材が用いられる。封止シート21,22は、可撓性を有していることが好ましい。封止シート21,22の厚みは、たとえば25μm~50μmである。
図3を参照して、配線部材30は、面発光素子10に電気接続され、封止シート21,22の間に配置される。具体的には、配線部材30は、基板31、電極32,33および保護フィルム34を含んでいる。配線部材30は、全体として可撓性を有していることが好ましい。基板31および保護フィルム34(カバーレイ)は、封止シート21,22よりも一回り小さい外形形状を有している。保護フィルム34は、一対の開口34L,34Rを有する。保護フィルム34は、電極32,33の給電部32R,33L(露出部)の少なくとも周囲に位置する部分を覆うように設けられ、電極32,33を保護し、電極の封止性能を向上させる役割を果たす。
電極32は、面発光素子10の給電部19の位置および形状に対応するように長く延びる直線部32aと、給電部32R(露出部)を内側に形成する矩形部32bと、直線部32aと矩形部32bとを接続する接続部32cとを有する。保護フィルム34を基板31および電極32,33の上に配置した際、直線部32aは保護フィルム34に覆われない。面発光素子10の給電部19は、図示しない導電性接着剤(ACF)を介して電極32の直線部32aに電気接続される。面発光素子10の給電部19は、導電性接着剤(ACF)を用いることなく、電極32の直線部32aに圧接されていてもよい。
電極33は、面発光素子10の給電部18の位置および形状に対応するように長く延びる直線部33aと、給電部33L(露出部)を内側に形成する矩形部33bと、直線部33aと矩形部33bとを接続する接続部33cとを有する。保護フィルム34を基板31および電極32,33の上に配置した際、直線部33aは保護フィルム34に覆われない。面発光素子10の給電部18は、図示しない導電性接着剤(ACF)を介して電極33の直線部33aに電気接続される。面発光素子10の給電部18は、導電性接着剤(ACF)を用いることなく、電極33の直線部33aに圧接されていてもよい。
図5を参照して、面発光モジュール100においては、保護フィルム34に設けられた開口34L,34Rおよび封止シート21(第1封止シート)に設けられた開口部21L,21Rを通して、電極33,32の給電部33L,32Rがそれぞれ露出する。外部配線40(図1)の接点部42,41を、給電部33L,32Rにそれぞれ電気接続できる。外部配線40は、封止シート21,22の端部の間には位置していない。
(面発光モジュール101)
図6~図8を参照して、比較例における面発光モジュール101について説明する。面発光モジュール101は、封止シート21に1つの開口部21Hが設けられているという点において、実施の形態1の面発光モジュール100と相違している。
図10および図11を参照して、実施の形態2における面発光モジュール102について説明する。面発光モジュール102は、配線部材30(実施の形態1)の代わりに配線部材30Aを備える。配線部材30Aは、保護フィルム34を備えていないという点で、配線部材30と相違している。
図11を参照して、面発光モジュール102においては、封止シート21(第1封止シート)に設けられた開口部21L,21Rを通して、電極33,32の給電部33L,32Rがそれぞれ露出する。外部配線40(図1)の接点部42,41を、給電部33L,32Rにそれぞれ電気接続できる。外部配線40は、封止シート21,22の端部の間には位置していない。封止シート21,22の端部同士を適切に接合でき、封止シート21,22による封止性能が得られる。
Claims (3)
- 開口部を有する第1封止シートと、
前記第1封止シートに接合される第2封止シートと、
前記第1封止シートと前記第2封止シートとの間に配置され、これらによって封止される面発光素子と、
前記第1封止シートと前記第2封止シートとの間に配置され、前記面発光素子に電気接続される配線部材と、を備え、
前記配線部材は、
基板と、
前記基板上に形成され、前記第1封止シートの前記開口部から露出可能なように配置される露出部を有する電極と、
前記露出部に対応する開口を有し、前記電極の少なくとも前記露出部の周囲を覆うように設けられた保護フィルムと、を含み、
1つの前記露出部は、1つの前記開口部および1つの前記開口を通して露出可能であり、
前記第1封止シートのうちの前記開口部を形成している縁部分は、前記開口よりも外側に位置し且つ前記保護フィルムの表面のうち、平坦な形状を有する部分の上に位置している、
面発光モジュール。 - 開口部を有する第1封止シートと、
前記第1封止シートに接合される第2封止シートと、
前記第1封止シートと前記第2封止シートとの間に配置され、これらによって封止される面発光素子と、
前記第1封止シートと前記第2封止シートとの間に配置され、前記面発光素子に電気接続される配線部材と、を備え、
前記配線部材は、
基板と、
前記基板上に形成され、前記第1封止シートの前記開口部から露出可能なように配置される露出部を有する電極と、を含み、
1つの前記露出部は、1つの前記開口部を通して露出可能であり、
前記第1封止シートのうちの前記開口部を形成している縁部分は、前記電極の表面のうち、平坦な形状を有する部分の上に位置している、
面発光モジュール。 - 前記第1封止シート、前記第2封止シート、前記面発光素子および前記配線部材は、可撓性を有している、
請求項1または2に記載の面発光モジュール。
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US15/552,542 US20180054861A1 (en) | 2015-02-26 | 2016-02-18 | Planar light-emitting module |
EP16755324.7A EP3264862A4 (en) | 2015-02-26 | 2016-02-18 | Planar light-emitting module |
JP2017502308A JPWO2016136577A1 (ja) | 2015-02-26 | 2016-02-18 | 面発光モジュール |
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WO2013051358A1 (ja) * | 2011-10-04 | 2013-04-11 | コニカミノルタホールディングス株式会社 | 有機エレクトロルミネッセンス素子、面状発光体、及び、有機エレクトロルミネッセンス素子の製造方法 |
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