WO2016128090A1 - Système de transducteurs acoustiques - Google Patents

Système de transducteurs acoustiques Download PDF

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Publication number
WO2016128090A1
WO2016128090A1 PCT/EP2015/079360 EP2015079360W WO2016128090A1 WO 2016128090 A1 WO2016128090 A1 WO 2016128090A1 EP 2015079360 W EP2015079360 W EP 2015079360W WO 2016128090 A1 WO2016128090 A1 WO 2016128090A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
piezoelectric ultrasonic
sound transducer
transducer
membrane
Prior art date
Application number
PCT/EP2015/079360
Other languages
German (de)
English (en)
Inventor
Andre Gerlach
Bernd SCHEUFELE
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2016128090A1 publication Critical patent/WO2016128090A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Definitions

  • the invention relates to a sound transducer arrangement with at least two piezoelectric ultrasonic transducers.
  • the document DE 30 20 872 A1 discloses a method for producing ultrasonic layer transducers, in which a piezoceramic and thermoplastic plastic material are joined together by heat bonding. To generate the necessary heat for the bonding heat loss heat is produced in the piezoceramic by applying electrical signals.
  • Document DE 10 2008 049 788 A1 shows an ultrasound film converter in which piezo elements stacked on top of one another have a first electrode layer on a first surface and a second electrode layer on the opposite side. Stacked oriented terminals are selectively contacted by the first or second electrode layer.
  • An ultrasound array can be produced by means of a layer converter arranged in matrix form on a common carrier. The disadvantage here is that the individual layer transducers external influences, both mechanical and electrical type, are exposed.
  • the object of the invention is to protect the individual ultrasonic transducers against external influences.
  • the sound transducer arrangement according to the invention has at least two piezoelectric ultrasonic transducers, ie the sound transducer arrangement is designed as a sound transducer array.
  • the ultrasonic transducers are preferably layer converters or stack converters.
  • each piezoelectric ultrasonic transducer comprises a first side, which has a first connection layer.
  • One of the first side opposite second side has a second
  • the first connection layer is on one
  • a membrane layer which acts as a membrane in some areas.
  • the membrane layer preferably acts as a membrane at the locations which are located above the piezoelectric ultrasonic transducers.
  • the arrangement of the piezoelectric ultrasonic transducer, the support plate and the membrane layer form spaces. The spaces are at least partially filled with damping material.
  • Adjacent piezoelectric ultrasonic transducers have a spacing of typically less than one-half of an airborne sound wavelength, with the individual
  • Distances of the same size or different sizes can be selected.
  • the advantage here is that the individual ultrasonic transducers or layer transducers or stacked transducers are protected against external influences, since they are covered or covered by a single layer, namely the membrane layer.
  • Another advantage is that the attachment of the
  • the membrane layer has a structuring, so that the membrane layer has first regions and second regions.
  • the thickness of the first regions is greater than the thickness of the second regions.
  • Regions are located above the piezoelectric ultrasonic transducers.
  • a transducer head is arranged between the second connection layer and the membrane layer, the surface of which determines an active area of the piezoelectric ultrasonic transducer. Under active surface is understood to mean the area over which the sound recording or sound output.
  • the advantage here is that depending on the surface of the transducer head, the directional characteristic of the sound transmission or sound reception of the
  • Sound transducer arrangement is set.
  • the size of the surface of the transducer head determines the sound power level or the
  • the membrane layer at least partially
  • the metal layer is preferably within the
  • the first connection layer has a first adhesive and / or the second connection layer has a second adhesive.
  • the first adhesive preferably has different adhesive properties than the second adhesive.
  • the first adhesive preferably creates a rigid connection to allow the piezoelectric ultrasonic transducer to be fixed to the
  • Carrier element is connected.
  • the second adhesive preferably produces compounds that are more elastic. The bonds realize the
  • electrical contacts are arranged on the carrier element, which electrically connect the piezoelectric ultrasonic transducers with the carrier element.
  • the electrical contacts are designed as contact springs, so that the contact springs clamp the piezoelectric ultrasonic transducers.
  • Transducer elements is simple and robust.
  • each piezoelectric ultrasonic transducer has its own carrier element, wherein the individual carrier elements are arranged at a distance from one another, so that second intermediate spaces are formed.
  • the advantage here is that the piezoelectric ultrasonic transducer mutually have a greater vibration mechanical decoupling.
  • damping material at least partially fills the second spaces.
  • the thickness of the individual carrier elements adjusts the frequency range of the acoustic transducer arrangement.
  • the damping material on silicone.
  • the membrane layer is round or elliptical or square or rectangular or polygonal configured.
  • the advantage here is that the membrane layer can be adapted to an installation location of the sound transducer arrangement.
  • Ultrasonic transducers a membrane layer and a membrane
  • Figure 2 shows a transducer assembly with piezoelectric
  • Ultrasonic transducers a structured membrane layer and a carrier element
  • FIG. 3 shows a piezoelectric transducer arrangement
  • Ultrasonic transducers a membrane layer, transducer heads and a carrier element
  • FIG. 4 shows a piezoelectric transducer arrangement
  • Ultrasonic transducers a membrane layer, transducer heads and a plurality of support elements, and
  • FIG. 5 shows a piezoelectric transducer arrangement
  • Ultrasonic transducers a structured membrane layer and a plurality of carrier elements.
  • Figure 1 shows a sectional view in the x-z direction of a
  • Sound transducer assembly 100 with three arranged by way of example
  • the piezoelectric ultrasonic transducers 103 which form a transducer array.
  • the transducer array can take any geometric shapes of the transducer positions, preferably linear, matrix or oval.
  • the ultrasonic transducers 103 are preferably
  • piezoelectric ultrasonic transducers 103 is preferably less than half the airborne sound wavelength.
  • the ultrasonic transducer 103 consists of
  • the piezoelectric material arranged in multiple layers.
  • the Piezoelectric layers are each interrupted by electrically conductive layers, for. Metal. These electrically conductive layers each form electrodes for the piezo regions.
  • the electrodes 104 are led out for electrical contacting on electrically conductive surfaces laterally of the ultrasonic transducer 103, wherein the electrically conductive surfaces along the
  • Ultrasonic transducer 103 are arranged.
  • Ultrasonic transducers 103 are connected, for example, by electrical contacts 107 arranged on a carrier element 105 with conductor tracks which are arranged in or on the carrier element 105 and lead, for example, to an amplifier electronics.
  • the electrical contacts 107 are connected to the
  • Electrodes 104 of the piezoelectric ultrasonic transducer 103 connected by soldering, Leitkleben, bonding or thermo-compression welding.
  • resilient contact surfaces for. B. contact springs arranged, which pinch the piezoelectric ultrasonic transducer 103 to produce an electrical connection. Every piezoelectric
  • Ultrasonic transducer 103 has a first connection layer 108 and a second connection layer 109.
  • the two connection layers 108 and 109 are disposed on opposite sides of the piezoelectric ultrasonic transducer 103 at substantially right angles to the stacking direction of the individual layers of the piezoelectric ultrasonic transducer 103.
  • Bonding layer 108 is disposed on the support member 105.
  • the carrier element 105 is realized for example as a continuous carrier plate.
  • a membrane layer 101 is arranged on the second connection layer 109.
  • the membrane layer 101 functions as a diaphragm in portions at the positions connected to the piezoelectric ultrasonic transducers 103 through the second interconnection layer 109, that is, as shown in FIG. H. at the points where the ultrasonic waves are generated.
  • the membrane layer 101 is preferably more flexible or elastic at these locations.
  • Ultrasonic transducers 103 are connected, for example via an adhesive connection to the common array membrane.
  • Ultrasonic transducers 103 are arranged between the membrane layer 101 and the carrier element 105 such that first intermediate spaces 106 are formed.
  • the first spaces 106 are at least partially with a
  • FIG. 2 shows a sound transducer arrangement 200 with a structured sound
  • Membrane layer 201 in a sectional view in the x-z direction.
  • the remaining structure of the sound transducer assembly 200 corresponds to the structure of
  • the membrane layer 201 has different layer thicknesses in certain regions.
  • a first region 210 has a greater layer thickness than a second region 211. The first regions
  • the 210 are disposed above the piezoelectric ultrasonic transducers 203, i. H. the structuring is matched to the position of the piezoelectric ultrasonic transducers 203 in the acoustic transducer arrangement 200.
  • the structured membrane side preferably faces the piezoelectric ultrasonic transducers 203.
  • the first regions 210 are connected to the piezoelectric ultrasonic transducers 203 by means of the second connection layer 209. A horizontal spread of the first regions 210 in the illustrated
  • Cutting plane may be larger, smaller or equal to a horizontal spread of the piezoelectric ultrasonic transducer 203.
  • the second regions 211 are disposed between the piezoelectric ultrasonic transducers 203 and preferably have a smaller horizontal spread than the first regions 210.
  • the second regions 211 serve to reduce the
  • piezoelectric ultrasonic transducer 203 piezoelectric ultrasonic transducer 203.
  • the layer thickness of the membrane layer 101 and 201 is preferably between 50 ⁇ - 750 ⁇ . Such a layer thickness causes sufficient
  • FIG. 3 shows a sound transducer arrangement 300 with transducer heads 312 in a sectional view in the xz direction.
  • the transducer heads are disposed between the piezoelectric ultrasonic transducers 303 and the diaphragm layer 301.
  • the remainder of the construction of the acoustic transducer assembly 300 corresponds to the construction of the acoustic transducer assembly 100 of FIG. 1.
  • Each transducer head 312 is associated with a piezoelectric ultrasonic transducer 303 and substantially defines by its cross-section the active area of the piezoelectric transducer Ultrasonic transducer 303 with respect to sound recording and sound output.
  • the transducer heads 312 have a high modulus of elasticity, at least 1000 N / mm, and act as a mass. In conjunction with the piezoelectric
  • Ultrasonic transducers 303 which represent the resilient element, result in a spring-mass system which is applied to the carrier element.
  • Resonant frequency of this spring-mass system thus determines the frequency of the transducer array, the frequency of the transducer array is in particular between 20 kHz - 150 kHz.
  • Membrane layer 301 is preferably smaller than the layer thickness of
  • Membrane layer thickness is due to the composite with the additional
  • the layer thickness is between 50 ⁇ - 500 ⁇ , preferably between 70 ⁇ - 300 ⁇ .
  • Membrane layer thickness further improves the mobility or resilience of the membrane layer. In comparison with the membrane layers 101 and 201, this results in a lower rigidity of the membrane layer 301, which further reduces the crosstalk between the transducer elements.
  • FIG. 4 shows a sound transducer arrangement 401 with a plurality of support elements 405 in a sectional view in the x-z direction, each piezoelectric
  • Ultrasonic transducer 403 is assigned a separate carrier element.
  • the remaining structure of the sound transducer assembly 400 corresponds to the structure of
  • the support members 405 are spaced from each other. These distances form second
  • Gaps 413 The second spaces are at least partially with
  • the sound transducer assembly 400 is characterized by the
  • Membrane layer 401 and the potting stabilized with damping material.
  • the damping material also encloses the back of the back mass elements.
  • FIG. 5 shows a sound transducer arrangement 500 with a plurality of carrier elements 505 in a sectional view in the xz direction. It is each carrier element 505 associated with a piezoelectric ultrasonic transducer 503. The rest
  • Structure of the transducer assembly 500 corresponds to the structure of
  • the second spaces 413 and 513 between the carrier elements have a size of 1/100 to 1/3 of the center distances of the directly adjacent carrier elements 405 and 505.
  • the first connection layer 108, 208, 308, 408, 508 includes a first one
  • Adhesive and the second bonding layer 109, 209, 309, 409, 509 a second adhesive.
  • they are different adhesives, but they may also be the same, preferably not electrically conductive.
  • Selection of the adhesive is determined by the suitability of the adhesive for the
  • Material pairings influenced. For example, an epoxy resin or silicone based adhesive may be used. Just in case an electrical connection is required, a conductive adhesive must be used.
  • the membrane layers 101, 201, 301, 401, 501 at least partially a metal layer 102, 202, 302, 402, 502, which serves for EMC shielding.
  • the metal layer 102, 202, 302, 402, 502 is preferably disposed within the membrane layer 101, 201, 301, 401, 501, but may also be the
  • Metal layer 102, 202, 302, 402, 502 is disposed on the membrane layer 101, 201, 301, 401, 501.
  • the metal layer 102, 202, 302, 402, 502 is continuous.
  • the membrane layer 101, 201, 301, 401, 501 is a Kunststoffofffolie comprising, for example, polyimide.
  • the membrane layer 101, 201, 301, 401, 501 is a composite material, the plastic and metal or a
  • Carbon fiber fabric and resin has.
  • the support members 105, 205, 305, 405, 505 have a high rigidity and a high density, whereby sluggish elements are realized. They are made of metal, z. As aluminum or copper, metal alloys, z. As steel or Brass, or ceramics, also metallized ceramics.
  • the layer thickness of the carrier elements 105, 205, 305, 405, 505 is substantially between 1 mm - 20 mm, in particular between 4 mm - 10 mm. The range between 4 mm - 10 mm is particularly suitable to realize the necessary rigidity for supporting the piezoelectric ultrasonic transducer and limits the
  • the shape of the base surfaces of the piezoelectric ultrasonic transducers 103, 203, 303, 403, 503, the transducer heads 312 and 412, and the first regions 210 and 510 of the membrane layers 201 and 501 preferably have one
  • the shapes of the bases of the stacked piezoelectric ultrasonic transducers 103, 203, 303, 403, 503, the transducer heads 312 and 412, and the first regions 210 and 510 of the membrane layers 201 and 501 are similar.
  • Base areas can be different.
  • the shapes of the bases of the stacked piezoelectric ultrasonic transducers 103, 203, 303, 403, 503, the transducer heads 312 and 412, and the first regions 210 and 510 of the membrane layers 201 and 501 are different.
  • a piezoelectric ultrasonic transducer 303 and 403 having a round basic shape is combined with a transducer head 312 and 412 having a square basic shape.
  • the sound transducer assemblies 100, 200, 300, 400, 500 comprise 2 - 250, preferably 5 - 50 piezoelectric ultrasonic transducers 103, 203, 303, 403, 503, in particular layer transducers or stack transducers forming a transducer array.
  • Ultrasonic transducer 103, 203, 303, 403, 503 is for example linear, round, square, matrix-shaped or oval, as described in DE 102013207823 AI.
  • 18 piezoelectric ultrasonic transducers 103, 203, 303, 403, 503 are arranged to form a transducer array.
  • the ultrasonic transducers are not limited to layer converters or stack converters.
  • the acoustic transducer assemblies can be used, for example, in motor vehicles for parking and maneuvering. Furthermore, the acoustic transducer assemblies can be used, for example, in motor vehicles for parking and maneuvering. Furthermore, the acoustic transducer assemblies can be used, for example, in motor vehicles for parking and maneuvering. Furthermore, the acoustic transducer assemblies can be used, for example, in motor vehicles for parking and maneuvering. Furthermore, the

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

L'invention concerne un système de transducteurs acoustiques (100, 200, 300, 400, 500) comprenant au moins deux transducteurs à ultrasons piézoélectriques (103, 203, 303, 403, 503). Chaque transducteur à ultrasons piézoélectrique (103, 203, 303, 403, 503) comprend un premier côté qui possède une première couche de liaison (108, 208, 308, 408, 508) ainsi qu'un second côté, opposé au premier côté, qui possède une seconde couche de liaison (109, 209, 309, 409, 509). La première couche de liaison (108, 208, 308, 408, 508) est disposée sur un élément porteur (105, 205, 305) et au-dessus de la seconde couche de liaison (109, 209, 309, 409, 509) est disposée une couche de membrane (101, 201, 301, 401, 501) qui, dans certaines zones, fait office de membrane. Des premiers espaces intermédiaires (106, 206, 306, 406, 506) se trouvent entre deux transducteurs à ultrasons piézoélectriques (103, 203, 303, 403, 503), l'élément porteur (105, 205, 305) et la couche de membrane (101, 201, 301, 401, 501), et un matériau d'amortissement remplit au moins partiellement les premiers espaces intermédiaires (106, 206, 306, 406, 506).
PCT/EP2015/079360 2015-02-11 2015-12-11 Système de transducteurs acoustiques WO2016128090A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015202396.6 2015-02-11
DE102015202396.6A DE102015202396A1 (de) 2015-02-11 2015-02-11 Ultraschallarray

Publications (1)

Publication Number Publication Date
WO2016128090A1 true WO2016128090A1 (fr) 2016-08-18

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DE (1) DE102015202396A1 (fr)
WO (1) WO2016128090A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4672591A (en) * 1985-01-21 1987-06-09 Siemens Aktiengesellschaft Ultrasonic transducer
US5648942A (en) * 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
US5886454A (en) * 1996-02-29 1999-03-23 Hitachi Medical Corporation Ultrasonic probe and manufacturing method thereof
US20010041837A1 (en) * 2000-02-07 2001-11-15 Takashi Takeuchi Ultrasonic probe and method of manufacturing the same
US20070182287A1 (en) * 2004-04-20 2007-08-09 Marc Lukacs Arrayed Ultrasonic Transducer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3020872A1 (de) 1980-06-02 1981-12-10 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur ultraschall-abtastung
DE102008049788A1 (de) 2008-09-30 2010-06-10 Siemens Aktiengesellschaft Ultraschallwandler mit mindestens einem vollaktiven, monolithischen Piezoelement, Verfahren zum selektiven Kontaktieren von Innenelektroden des Ultraschallwandlers durch Abtrag von Elektrodenmaterial und Verwendung des Utraschallwandlers
DE102013207823A1 (de) 2013-04-29 2014-10-30 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung der Koordinaten eines Objekts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4672591A (en) * 1985-01-21 1987-06-09 Siemens Aktiengesellschaft Ultrasonic transducer
US5648942A (en) * 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
US5886454A (en) * 1996-02-29 1999-03-23 Hitachi Medical Corporation Ultrasonic probe and manufacturing method thereof
US20010041837A1 (en) * 2000-02-07 2001-11-15 Takashi Takeuchi Ultrasonic probe and method of manufacturing the same
US20070182287A1 (en) * 2004-04-20 2007-08-09 Marc Lukacs Arrayed Ultrasonic Transducer

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