WO2016127726A1 - 柔性线路板覆盖膜的预加工结构、制备方法和预加工方法 - Google Patents

柔性线路板覆盖膜的预加工结构、制备方法和预加工方法 Download PDF

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WO2016127726A1
WO2016127726A1 PCT/CN2016/000049 CN2016000049W WO2016127726A1 WO 2016127726 A1 WO2016127726 A1 WO 2016127726A1 CN 2016000049 W CN2016000049 W CN 2016000049W WO 2016127726 A1 WO2016127726 A1 WO 2016127726A1
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film
cover film
release
layer
cover
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PCT/CN2016/000049
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English (en)
French (fr)
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魏巧云
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深圳市奥创联科技有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the invention relates to a flexible circuit board, in particular to a pre-processed structure, a preparation method and a pre-processing method of a flexible circuit board cover film.
  • the cover film of the flexible circuit board is attached to the surface of the copper foil substrate on which the circuit pattern has been completed, and functions to insulate and protect the surface of the copper foil substrate.
  • the conventional cover film includes three layers of upper and lower layers: a base layer, an adhesive layer and a release layer, a polyimide film is generally used for the base layer, a polymer resin adhesive is used for the adhesive layer, and a release paper or release type is used for the release layer. membrane.
  • the cover film needs to be pre-machined before it is applied to the surface of the copper foil substrate.
  • the following two pre-processing methods are usually used:
  • the sheet processing method is to cut the roll-shaped cover film into a sheet shape, first perform NC drilling, and then use a punch to process the desired pattern on the cover film;
  • the cover plate, the backing plate and the drill needle are required as the processing auxiliary materials.
  • the single cover film is processed, the pre-processing productivity is low, and the auxiliary material consumption is large.
  • the technical problem to be solved by the present invention is to provide a flexible circuit board cover film pre-processing structure with high pre-processing productivity and low consumption of auxiliary materials.
  • Another technical problem to be solved by the present invention is to provide a method for preparing the above-mentioned flexible circuit board cover film pre-worked structure.
  • Still another technical problem to be solved by the present invention is to provide a flexible circuit board cover film pre-processing method with high pre-processing productivity and low consumption of auxiliary materials.
  • the technical solution adopted by the present invention is a pre-processed structure of a flexible circuit board cover film, comprising a plurality of cover films, the cover film including a base layer, an adhesive layer and a release layer in order from top to bottom.
  • a plurality of cover films are laminated and laminated, and the release layer of the upper cover film is adhered or electrostatically adsorbed to the base layer of the underlying cover film.
  • the pre-processed structure described above includes a mandrel, and the plurality of laminated films after lamination are wound on the mandrel.
  • the base layer is a polyimide film
  • the adhesive layer is a polymer resin adhesive layer
  • the release layer is a release paper or a release film
  • the release paper of the upper cover film is bonded to the base layer of the underlying cover film, and the upper cover film is separated from the film.
  • the film is bonded or electrostatically adsorbed to the base layer of the underlying cover film.
  • the release paper or the release film of the upper cover film and the base layer of the lower cover film are bonded by a low-viscosity.
  • a preparation method of a flexible circuit board cover film pre-processing structure comprising a plurality of cover films
  • the cover film comprises a base layer, an adhesive layer and a release layer in order from top to bottom, and the plurality of cover films are laminated and laminated, and the upper cover film
  • the release layer is bonded or electrostatically adsorbed to the underlying layer of the cover film.
  • the release layer is a release paper, and the release film of the upper cover film Or the release film is coated with a low viscosity adhesive and adhered to the base layer of the underlying cover film.
  • the release layer is a release film, and the release film has static electricity during the molding process of the cover film, and the release film of the upper cover film is followed by the release film.
  • the base layer of the cover film is electrostatically adsorbed; the release film of the lowermost cover film is subjected to static elimination treatment.
  • a pre-processing method for a flexible circuit board cover film the cover film composite body of the pre-processed structure of the flexible circuit board cover film is sandwiched between the cover plate and the back plate for drilling; the cover film is compounded The body is subjected to stamping processing; after the machining is completed, the cover film is separated.
  • the invention can improve the productivity of the pre-processing of the flexible circuit board cover film, reduce the consumption of the auxiliary material, and reduce the production cost of the flexible circuit board.
  • FIG. 1 is a schematic view showing a cover film composite of Example 1 of the present invention.
  • Figure 2 is a partial enlarged view of the I portion of Figure 1.
  • Fig. 3 is a schematic view showing the composite process of the cover film composite of the embodiment 1 of the present invention.
  • Figure 4 is a schematic view showing the structure of a cover film composite of Example 2 of the present invention.
  • Fig. 5 is a schematic view showing the composite process of the cover film composite of the embodiment 2 of the present invention.
  • the flexible circuit board cover film pre-processing structure of the embodiment 1 of the present invention comprises a mandrel 200 and three cover films A (this embodiment uses three cover films A to be composited, and may be used as needed Two to five cover films A) are composited, and the cover films A1, A2, and A3 are sequentially bonded from the top to the bottom by a polyimide film 1 as a base layer and a polymer resin (such as an epoxy resin) as an adhesive layer.
  • the agent layer 2 and the release paper 3 as a release layer are composed.
  • the low viscosity glue may be an acrylic glue or a silicone type glue.
  • the cover film composite 100 is wound around the mandrel 200 for ease of transportation and use.
  • the composite process of the cover film composite 100 is as shown in FIG. 3, and the cover film A1 and the cover film A2 are respectively coated with a low-viscosity on the bottom surface of the release paper (or release film) by the applicator roll 11, and then covered.
  • the films A1, A2, and A3 pass through the composite roll 12, and the composite roll 12 bonds the cover film A1, the cover film A2, and the cover film A3 to each other to form the cover film composite 100.
  • the flexible circuit board cover film pre-processing structure of Embodiment 2 of the present invention is different from that of Embodiment 1, in that the bottom layer of the three cover films A is a release film 5,
  • the release film 5 of the cover film A is electrostatically charged during the molding of the cover film A, and the release film 5 of the cover film and the polyimide film 1 of the underlying cover film are electrostatically adsorbed together.
  • the release film 5 of the lowermost cover film A3 is subjected to static elimination treatment.
  • the composite process of the cover film composite 100 of the present embodiment is as shown in FIG. 5.
  • the cover film A1 and the cover film A2 with static electricity and the cover film A3 subjected to electrostatic elimination are passed through the composite roll 12, and the composite roll 12 covers the cover film A1.
  • the cover film A2 and the cover film A3 are pressed together, and the cover film A1, the cover film A2 and the cover film A3 are mutually adsorbed by static electricity to form the cover film composite 100.
  • the cover film composite 100 is entirely subjected to press working; the cover film composite 100 is sandwiched between the cover plate and the backing plate for drilling. After the machining is completed, the cover films A1, A2, and A3 in the cover film composite 100 are separated and bonded to the copper foil substrate.
  • the above embodiments of the present invention can double the production efficiency of the cover film in the pre-processing process, for example, the two-layer composite can improve the production efficiency by 100%, the three-layer composite can be increased to 200%, and so on;
  • the composite of the multilayer cover film can be processed in the same way as the existing cover film, and due to the structure of the multilayer cover film, Achieve multi-fold efficiency improvement;
  • the above embodiment of the invention can save the consumption of the auxiliary material (the cover plate, the pad and the drill needle used in the NC drilling process) used in the pre-processing process of the cover film, and reduce the production cost, and the two-layer composite can be reduced by 50. With the use of % auxiliary materials, the three-layer composite can be reduced by 67%, and so on.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

一种柔性线路板覆盖膜的预加工结构、制备方法和预加工方法。柔性线路板覆盖膜的预加工结构包括复数张覆盖膜（A），覆盖膜从上到下依次包括基层（1）、粘合层（2）和离型层（3），复数张覆盖膜层叠复合，上面一张覆盖膜的离型层与下面一张覆盖膜的基层粘合或静电吸附。预加工时将覆盖膜复合体夹在盖板与垫板之间进行钻孔加工；将覆盖膜复合体进行冲压加工；机械加工完成后，将覆盖膜分离。预加工方法提高了柔性线路板覆盖膜预加工的生产率，减少辅材消耗量，降低柔性线路板的生产成本。

Description

柔性线路板覆盖膜的预加工结构、制备方法和预加工方法 [技术领域]
本发明涉及柔性线路板，尤其涉及一种柔性线路板覆盖膜的预加工结构、制备方法和预加工方法。
[背景技术]
柔性线路板(FPC)的覆盖膜贴合于已完成线路图形制作的铜箔基板表面，起到绝缘及保护铜箔基板表面线路的作用。
传统的覆盖膜包括上下三层：即基层、粘合层和离型层，基层一般采用聚酰亚胺膜，粘合层采用高分子树脂粘合剂，离型层采用离型纸或离型膜。覆盖膜贴合到铜箔基板表面时需要将离型层撕离，利用粘合层将基层粘合到铜箔基板的表面上。
覆盖膜在贴合到铜箔基板表面之前需要进行孔洞的预加工，通常采用以下两种预加工方式：
1)分张加工方式，将卷状覆盖膜裁切成片状，先进行NC钻孔，然后再使用冲床在覆盖膜上加工所需图形；
2)整卷加工方式：卷状覆盖膜使用冲床连续送料冲孔切加工后裁切成单片或卷状直接使用。
分张加工方式中，在NC加工过程中，需要用盖板、垫板和钻针作为加工的辅材。
以上两种方式都是对单张覆盖膜都是进行加工，预加工生产率低，辅材消耗量大。
[发明内容]
本发明要解决的技术问题是提供一种预加工生产率高，辅材消耗量少的柔性线路板覆盖膜预加工结构。
本发明另一个要解决的技术问题是提供一种上述柔性线路板覆盖膜预加工结构的制备方法。
本发明还有一个要解决的技术问题是提供一种预加工生产率高，辅材消耗量少的柔性线路板覆盖膜预加工方法。
为了解决上述技术问题，本发明采用的技术方案是，一种柔性线路板覆盖膜的预加工结构，包括复数张覆盖膜，覆盖膜从上到下依次包括基层、粘合层和离型层，复数张覆盖膜层叠复合，上面一张覆盖膜的离型层与下面一张覆盖膜的基层粘合或静电吸附。
以上所述的预加工结构，包括芯轴，层叠复合后的复数张覆盖膜卷绕在芯轴上。
以上所述的预加工结构，所述的基层是聚酰亚胺膜，所述的粘合层是高分子树脂粘合剂层。
以上所述的预加工结构，所述的离型层为离型纸或离型膜，上面一张覆盖膜的离型纸与下面一张覆盖膜的基层粘合，上面一张覆盖膜的离型膜与下面一张覆盖膜的基层粘合或静电吸附。
以上所述的制备方法，上面一张覆盖膜的离型纸或离型膜与下面一张覆盖膜的基层通过低粘胶粘合。
一种柔性线路板覆盖膜预加工结构的制备方法，包括复数张覆盖膜，覆盖膜从上到下依次包括基层、粘合层和离型层，复数张覆盖膜层叠复合，上面一张覆盖膜的离型层与下面一张覆盖膜的基层粘合或静电吸附。
以上所述的制备方法，所述的离型层为离型纸，上面一张覆盖膜的离型纸 或离型膜涂低粘胶后与下面一张覆盖膜的基层粘合。
以上所述的柔性线路板覆盖膜的预加工结构，所述的离型层为离型膜，离型膜在覆盖膜成型过程中带有静电，上面一张覆盖膜的离型膜后与下面一张覆盖膜的基层静电吸附；最下面一张覆盖膜的离型膜经过去除静电处理。
一种柔性线路板覆盖膜的预加工方法，将上述的柔性线路板覆盖膜的预加工结构的覆盖膜复合体夹在盖板与垫板之间进行钻孔加工；将所述的覆盖膜复合体进行冲压加工；机械加工完成后，将覆盖膜分离。
本发明可以提高柔性线路板覆盖膜预加工的生产率，减少辅材消耗量，降低柔性线路板的生产成本。
[附图说明]
下面结合附图和具体实施方式对本发明作进一步详细的说明。
图1是本发明实施例1覆盖膜复合体的示意图。
图2是图1中I部位的局部放大图。
图3是本发明实施例1覆盖膜复合体的复合过程示意图。
图4是本发明实施例2覆盖膜复合体的结构示意图。
图5是本发明本发明实施例2覆盖膜复合体的复合过程示意图。
[具体实施方式]
如图1和图2所示，本发明实施例1的柔性线路板覆盖膜预加工结构，包括芯轴200和3张覆盖膜A(本实施例采用3张覆盖膜A复合，根据需要，可以复合2张至5张覆盖膜A)，覆盖膜A1、A2和A3从上到下依次由作为基层的聚酰亚胺膜1、作为粘合层的高分子树脂(如环氧树脂)粘合剂层2和作为离型层的离型纸3构成。
三张覆盖膜A层叠复合，第一张覆盖膜A1的离型纸(或离型膜)3与第二 张覆盖膜A2的聚酰亚胺膜1通过低粘胶层4粘合，第二张覆盖膜A2的离型纸(或离型膜)3与第三张覆盖膜A3的聚酰亚胺膜1通过低粘胶层4粘合，3张覆盖膜A复合成为一张覆盖膜复合体100。低粘胶可以是丙稀酸类胶或硅胶类胶。
为了方便运输和使用，覆盖膜复合体100卷绕在芯轴200上。
覆盖膜复合体100的复合过程如图3所示，覆盖膜A1和覆盖膜A2和分别由涂胶辊11在其离型纸(或离型膜)的底面上涂上低粘胶，然后覆盖膜A1、A2和A3通过复合辊12，复合辊12将覆盖膜A1、覆盖膜A2与覆盖膜A3相互粘合在一起，形成覆盖膜复合体100。
如图4所示，本发明实施例2的柔性线路板覆盖膜预加工结构与实施例1不同的是，3张覆盖膜A的底层是离型膜5，
上面一张覆盖膜的离型膜5与下面一张覆盖膜的聚酰亚胺膜1之间没有低粘胶层4来进行粘合。覆盖膜A的离型膜5在覆盖膜A成型过程中就带有静电，覆盖膜的离型膜5与下面一张覆盖膜的聚酰亚胺膜1通过静电吸附在一起。最下面一张覆盖膜A3的离型膜5经过去除静电处理。
(注：塑料类的膜在卷式生产过程中会自然产生静电，静电可以用传统的去静电装置去除；离型纸是纸浆制成，表面带塑膜，离型膜为塑料薄膜)。
本实施例覆盖膜复合体100的复合过程如图5所示，带有静电的覆盖膜A1和覆盖膜A2与经过去除静电处理的覆盖膜A3，通过复合辊12，复合辊12将覆盖膜A1、覆盖膜A2与覆盖膜A3相互压合在一起，覆盖膜A1、覆盖膜A2与覆盖膜A3通过静电相互吸附形成覆盖膜复合体100。
实施例1和实施例2的柔性线路板覆盖膜进行预加工时，将覆盖膜复合体100整体进行冲压加工；将覆盖膜复合体100夹在盖板与垫板之间进行钻孔加 工；机械加工完成后，将覆盖膜复合体100中的覆盖膜A1、A2和A3分离开来，再与铜箔基板粘合。
本发明以上实施例可以成倍提升覆盖膜在预加工过程中的生产效率，如两层复合可提升100％的生产效率，三层复合可提升至200％，以此类推；
在裁切、NC钻孔、冲床加工过程中，在同样的加工时间及工艺过程中，多层覆盖膜的复合体可与现有覆盖膜一样方式加工，而由于多层覆盖膜的结构，可实现多倍式的效率提升；
本发明以上实施例可以节省覆盖膜在预加工过程中配套使用的辅助材料(NC钻孔过程中使用的盖板、垫板及钻针)的消耗量，降低生产成本，两层复合可减少50％的辅助材料使用，三层复合可减少67％，以此类推。

Claims (9)

  1. 一种柔性线路板覆盖膜的预加工结构，包括覆盖膜，覆盖膜从上到下依次包括基层、粘合层和离型层，其特征在于，包括复数张所述的覆盖膜，复数张覆盖膜层叠复合，上面一张覆盖膜的离型层与下面一张覆盖膜的基层粘合或静电吸附。
  2. 根据权利要求1所述的预加工结构，其特征在于，包括芯轴，层叠复合后的复数张覆盖膜卷绕在芯轴上。
  3. 根据权利要求1所述的预加工结构，其特征在于，所述的基层是聚酰亚胺膜，所述的粘合层是高分子树脂粘合剂层。
  4. 根据权利要求1所述的预加工结构，其特征在于，所述的离型层为离型纸或离型膜，上面一张覆盖膜的离型纸与下面一张覆盖膜的基层粘合，上面一张覆盖膜的离型膜与下面一张覆盖膜的基层粘合或静电吸附。
  5. 根据权利要求4所述的预加工结构，其特征在于，上面一张覆盖膜的离型纸或离型膜与下面一张覆盖膜的基层通过低粘胶粘合。
  6. 一种柔性线路板覆盖膜预加工结构的制备方法，其特征在于，包括复数张覆盖膜，覆盖膜从上到下依次包括基层、粘合层和离型层，复数张覆盖膜层叠复合，上面一张覆盖膜的离型层与下面一张覆盖膜的基层粘合或静电吸附。
  7. 根据权利要求6所述的制备方法，其特征在于，所述的离型层为离型纸，上面一张覆盖膜的离型纸或离型膜涂低粘胶后与下面一张覆盖膜的基层粘合。
  8. 根据权利要求6所述的制备方法，其特征在于，所述的离型层为离型膜，离型膜在覆盖膜成型过程中带有静电，上面一张覆盖膜的离型膜后与下面一张覆盖膜的基层静电吸附；最下面一张覆盖膜的离型膜经过去除静电处理。
  9. 一种柔性线路板覆盖膜的预加工方法，其特征在于，将权利要求1所述的柔性线路板覆盖膜的预加工结构的覆盖膜复合体夹在盖板与垫板之间进行钻孔加工；将所述的覆盖膜复合体进行冲压加工；机械加工完成后，将覆盖膜分离。
PCT/CN2016/000049 2015-02-10 2016-01-25 柔性线路板覆盖膜的预加工结构、制备方法和预加工方法 WO2016127726A1 (zh)

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