WO2016127715A1 - Gas floating rotary reflow soldering device and method - Google Patents

Gas floating rotary reflow soldering device and method Download PDF

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Publication number
WO2016127715A1
WO2016127715A1 PCT/CN2015/099633 CN2015099633W WO2016127715A1 WO 2016127715 A1 WO2016127715 A1 WO 2016127715A1 CN 2015099633 W CN2015099633 W CN 2015099633W WO 2016127715 A1 WO2016127715 A1 WO 2016127715A1
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WIPO (PCT)
Prior art keywords
zone
reflow soldering
air
hot plate
welded
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PCT/CN2015/099633
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French (fr)
Chinese (zh)
Inventor
李家声
李宗涛
汤勇
林庆宏
王卉玉
蔡杨华
万珍平
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华南理工大学
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Priority to SG11201706312VA priority Critical patent/SG11201706312VA/en
Publication of WO2016127715A1 publication Critical patent/WO2016127715A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Definitions

  • the outer ring of the turntable 8 has an annular boss, the bottom surface of the annular boss is in contact with the ball 9, and the side of the annular boss and the side of the hot plate 14 are left with a gap of 10 mm or more.
  • One end of the wire trough 20 is located at the center of the furnace cover 19, and the other end is closely adjacent to the inner wall of the cylinder 5.
  • the air curtain generated by the continuous discharge of nitrogen gas through the wire trough 20 blocks the temperature change zone 3, and blocks the external gas, that is, each time to be welded. The entry and exit of the temperature change zone 3 will pass through the air curtain to block the outside air.
  • the hopper 15 has a certain depth, and can be externally connected to the automatic feeding device 21 for placing the finished weldment after the reflow soldering is completed.
  • the turntable 8 is reset by the speed adjusting device 7, and the temperature of each hot plate 14 in the temperature changing zone 3 is controlled by the temperature controller 13, the reset of the turntable 8 is completed and the temperature of each hot plate 14 in the temperature changing zone 3 reaches the preheating
  • the furnace door 4 is driven, and the gas curtain 11 controls the airtight performance of the air curtain to the temperature change zone 3, and the nitrogen gas in the temperature change zone 3 reaches the required content, and the workpiece 18 to be welded is placed in the loading zone 2
  • the limiting plate 16 is in a hollow region;
  • Each temperature chamber in the variable temperature zone inside the furnace body has an independent temperature control function, which can meet the requirements of heating temperature and heat preservation time of different reflow soldering processes, and the temperature change zone is filled with nitrogen gas, and nitrogen gas is used as both
  • the protective gas is used to float the parts to be welded, which saves energy and improves the quality of reflow soldering.
  • FIG. 1 is a plan view showing a planar structure of an air floating rotary reflow soldering apparatus
  • FIG. 3(a) is an embodiment of a limit plate of an air floating rotary reflow soldering apparatus
  • FIG. 3(b) is another embodiment of a limit plate of the air-floating rotary reflow soldering apparatus
  • FIG. 4 is a schematic view of the air-floating rotary reflow soldering apparatus loading a member to be welded;
  • FIG. 6 is a schematic view of the C view of FIG. 4;
  • FIG. 9 is a block diagram of a dynamic process in an air-floating rotary reflow soldering method
  • FIG. 10 is a dynamic process block diagram of an air-floating rotary reflow soldering method for floating a workpiece to be welded.
  • the air floating rotary reflow soldering device comprises a turntable 8, a hot plate 14, a limiting plate 16, a furnace body, a furnace door 4, a rotational speed adjusting device 7, a temperature controller 13, a gas regulator 11;
  • the body is composed of a cylinder 6 and a cylinder 5; the top surface of the cylinder 6 is divided into a loading zone 2, a blanking zone 1 and a variable temperature zone 3; the loading zone 2 and the blanking zone 1 are adjacent to the furnace door 4, and the furnace door 4 is installed.
  • the limiting plate 16 is made of a heat conductive material with a high thermal conductivity.
  • the limiting plate 16 further has a plurality of hollow regions, and the hollow region has a flaky convex structure around the hollow, and the height of the protrusion is 2-6 mm. .
  • the turntable 8 has a through hole between each of the fan-shaped jaws, and heat-insulates the limiting plate 16 and the member to be welded 18 in the fan-shaped jaw to ensure the welding quality.
  • One end of the trough 20 is located at the center of the furnace cover 19, and the other end is closely attached to the inner wall of the cylinder 5.
  • the air curtain generated by continuously discharging nitrogen gas through the trough 20 blocks the temperature change zone 3 and blocks the outside air;
  • the hopper 15 has a certain depth, and can be externally connected to the automatic unloading device 2 1 for placing the finished weldment after the reflow soldering and realizing automatic unloading.
  • the finished weldment enters the unloading area and is automatically dropped into the storage tank by gravity. It is easy to take out and provides operational fault tolerance.
  • the bottom surface of the limiting plate 16 and the top surface of the hot plate 14 are left with a gap to ensure that the turntable 8 is rotated, and the bottom surface of the limiting plate 16 has no contact with the top surface of the hot plate 14, but the gap should be as small as possible to reduce the gas regulator 11
  • the burden is such that the member to be welded 18 can be rotated by the inner wall of the limiting plate 16 only when it is raised to a small height.
  • Welded parts 18 are available, eliminating the need for additional operations and enabling simultaneous line production and improved operational fault tolerance.
  • the movement of the workpiece to be welded has no friction with the hot plate 14, which improves the service life of the component, and the welding component 18 is realized by the gas to be attached and separated from the hot plate 14, and the device is simple, stable and reliable.
  • the gas vent 10 is continuously discharged into the temperature changing zone 3 by the gas regulator 11, and the to-be-welded part 18 becomes a floating state under the action of the gas lifting force, and its floating state is shown in FIG. 10, and then passed.
  • the rotation speed adjusting device 7 causes the turntable 8 to drive the member to be welded 18 to rotate at a preset speed;
  • the present invention can be preferably implemented.

Abstract

A gas floating rotary reflow soldering device, comprising a rotary table (8), a heating plate (14), a limit plate (16), a furnace body, a furnace door (4), a furnace cover, a rotating speed adjustment device (7), a temperature controller (13), and a gas regulator (11), wherein the furnace body is composed of a cylinder (6) and a barrel (5), the top face of the cylinder (6) is divided into a charging region (2), a discharging region (1) and a variable temperature region (3), the discharging region (1) is provided with a material storage tank (15), the charging region (2) and the variable temperature region (3) are provided with air pores (10), and are further provided with roll balls (9) at the periphery, the rotary table (8) is coaxially mounted at the top face of the cylinder (6) and a boss thereof is in contact with the roll balls (9), the limit plate (16) is mounted on the rotary table (8), the heating plate (14) is mounted in the variable temperature region (3), wire slots (20) are respectively provided right above an entrance and an exit of the variable temperature region (3), and the wire slots (20) and the air pores can discharge nitrogen. Further disclosed is a gas floating rotary reflow soldering method. The method and the device achieve a gas floating rotary transport of welding parts, and avoid producing frictions between the surface of the heating plate and the parts to be welded during the transportation; at the same time, a reflow soldering operation of automated assembly line is achieved, and via gas curtain barriers at the entrance and the exit of the variable temperature region, the welding environment is under protection, which improves the operating efficiency and welding quality.

Description

一种气浮旋转式回流焊接装置及方法 技术领域  Air floating rotary reflow soldering device and method
[0001] 本发明涉及旋转式回流焊接设备及焊接工艺, 尤其涉及一种气浮旋转式回流焊 接装置及方法。  [0001] The present invention relates to a rotary reflow soldering apparatus and a soldering process, and more particularly to an air floating rotary reflow soldering apparatus and method.
背景技术  Background technique
[0002] 现有的小型回流焊接炉需要在单一腔体中实现回流焊接过程, 一是生产效率不 高, 二是反复升温降温所造成的能量损失, 三是由于设备本身要经常承受冷热 应力冲击而导致的疲劳损伤; 而大中型的回流焊接炉分有多腔体来实现回流焊 接, 内部分有多个温度区域, 待焊接件可在回流焊接炉中实现流水线作业, 然 而目前这类型的焊接炉基本都是直线型运送待焊接件的, 待焊接件从一端放进 回流焊接炉, 但却需要从运送带尽头的另一端取出, 由于设备本身长度较长, 对操作人员而言是十分不方便的, 同吋也会一定程度上降低焊接效率。  [0002] The existing small reflow soldering furnace needs to realize the reflow soldering process in a single cavity, one is that the production efficiency is not high, the other is the energy loss caused by repeated heating and cooling, and the third is that the equipment itself is often subjected to thermal stress. Fatigue damage caused by impact; and large and medium reflow soldering furnaces have multiple cavities to achieve reflow soldering, and there are multiple temperature zones in the inner part. The parts to be welded can be pipelined in the reflow soldering furnace. The welding furnace basically transports the parts to be welded in a straight line. The parts to be welded are placed into the reflow soldering furnace from one end, but need to be taken out from the other end of the conveyor belt. Due to the long length of the equipment itself, it is very Inconvenient, the same will also reduce the welding efficiency to some extent.
[0003] 另外, 随着电子元器件在各领域的进一步广泛应用, 对其稳定性要求也越来越 高, 这要求电子元器件具备优秀的焊接质量, 一是需要准确满足回流焊接工艺 的升温降温要求; 二是确保在少氧或无氧条件下进行焊接, 然而, 目前大部分 回流焊接炉都是敞幵式的, 并没有隔绝外接空气对焊接层的影响, 往往容易造 成器件焊接层中存在空洞。 为减少焊接空洞的产生, 也有部分回流焊接炉采用 真空结构, 但通常是配合辐射加热来对焊件进行焊接, 存在传热效率低等特点 。 而采用热传导方式的焊接炉则往往直接把焊接件放于加热元件表面, 传送吋 会存在摩擦阻力, 或者通过机械式升降装置移动焊接件, 但设备成本及维护费 用较高。 因此, 有必要幵发出能同吋具备高效加热方式、 多加热腔体结构、 真 空或保护气体环境、 稳定可靠、 流水线生产、 装载取出方便等特点的回流焊接 炉。  [0003] In addition, with the further wide application of electronic components in various fields, the stability requirements thereof are also higher and higher, which requires electronic components to have excellent welding quality, and firstly, it is necessary to accurately meet the temperature rise of the reflow soldering process. Cooling requirements; Second, to ensure welding under low oxygen or anaerobic conditions, however, most of the current reflow soldering furnaces are open type, and do not isolate the influence of external air on the soldering layer, which is often easy to cause soldering in the device. There is a hole. In order to reduce the occurrence of weld cavities, some reflow soldering furnaces use vacuum structures, but they are usually welded with radiant heating to have low heat transfer efficiency. In the case of a heat transfer type welding furnace, the welded parts are often placed directly on the surface of the heating element, and there is frictional resistance in the transfer ,, or the welded parts are moved by the mechanical lifting device, but the equipment cost and maintenance cost are high. Therefore, it is necessary to express a reflow soldering furnace that can be characterized by high-efficiency heating, multi-heating cavity structure, vacuum or protective gas environment, stable and reliable, pipeline production, and easy loading and unloading.
技术问题  technical problem
[0004] 本发明的目的在于克服上述现有技术的缺点和不足, 提供一种使用便捷、 焊接 效率高的气浮旋转式回流焊接装置及方法。 具有加热方式高效、 多加热腔体结 构、 真空或保护气体环境, 运行稳定可靠, 可实现流水线作业, 装载取出方便 等特点。 [0004] An object of the present invention is to overcome the above-mentioned shortcomings and deficiencies of the prior art, and to provide an air floating rotary reflow soldering apparatus and method which are easy to use and have high welding efficiency. Efficient, multi-heating cavity junction with heating Structure, vacuum or protective gas environment, stable and reliable operation, pipeline operation, convenient loading and unloading.
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0005] 本发明通过下述技术方案实现:  [0005] The present invention is achieved by the following technical solutions:
[0006] 一种气浮旋转式回流焊接装置, 包括转盘 8、 热板 14、 限位板 16、 炉体、 炉门 4 、 转速调节装置 7、 温控器 13、 气体调节器 11 ; 所述炉体由圆柱体 6及圆筒 5组成 ; 圆柱体 6顶面划分为上料区 2、 下料区 1和变温区 3 ; 上料区 2及下料区 1临近炉 门 4, 炉门 4安装在圆筒 5上, 变温区 3处于上料区 2及下料区 1之间, 下料区 1带有 储料槽 15, 储料槽 15位于圆柱体 6顶面, 上料区 2及变温区 3带有气孔 10, 气孔 10 均等分布于圆柱体 6顶面, 变温区 3还安装有热板 14 (热板 14数目可根据回流焊 接工艺而定) , 热板 14设置有与圆柱体 6顶面气孔 10同轴配合的通孔, 上料区 2 及变温区 3的***还带有球型孔, 球型孔安装有滚珠 9; 转盘 8同轴安装于圆柱体 6顶面, 并与热板 14顶面留有间隙; 转盘 8还带有扇形幵口, 扇形幵口内带有凹 槽, 限位板 16通过该凹槽安装在转盘 8上, 限位板 16底面与热板 14顶面留有间隙 , 变温区 3入口及出口处正上方分别带有线槽 20, 线槽 20位于炉盖 19上, 线槽 20 及气孔能排出氮气, 氮气通过气体调节器 11控制, 转盘 8与转速调节装置 7连接 , 热板 14与温控器 13连接。  [0006] An air-floating rotary reflow soldering apparatus, comprising a turntable 8, a hot plate 14, a limiting plate 16, a furnace body, a furnace door 4, a rotational speed adjusting device 7, a temperature controller 13, a gas regulator 11; The furnace body is composed of a cylinder 6 and a cylinder 5; the top surface of the cylinder 6 is divided into a loading zone 2, a blanking zone 1 and a variable temperature zone 3; the loading zone 2 and the blanking zone 1 are adjacent to the furnace door 4, the furnace door 4 Installed on the cylinder 5, the temperature change zone 3 is between the loading zone 2 and the unloading zone 1, the unloading zone 1 is provided with a storage tank 15, and the storage tank 15 is located on the top surface of the cylinder 6, the loading zone 2 and The variable temperature zone 3 has pores 10, the pores 10 are equally distributed on the top surface of the cylinder 6, and the temperature change zone 3 is also provided with a hot plate 14 (the number of the hot plates 14 can be determined according to the reflow soldering process), and the hot plate 14 is provided with a cylinder 6 top hole 101 coaxially through hole, the upper part of the loading zone 2 and the temperature change zone 3 also has a spherical hole, the ball hole is mounted with a ball 9; the turntable 8 is coaxially mounted on the top surface of the cylinder 6, and There is a gap with the top surface of the hot plate 14; the turntable 8 also has a fan-shaped opening, a groove in the fan-shaped opening, and a limiting plate 16 The groove is mounted on the turntable 8, and the bottom surface of the limiting plate 16 is separated from the top surface of the hot plate 14. The inlet and the outlet of the variable temperature zone 3 are respectively provided with a wire groove 20, and the wire groove 20 is located on the furnace cover 19, and the wire groove 20 and the pores can discharge nitrogen gas, the nitrogen gas is controlled by the gas regulator 11, the turntable 8 is connected to the rotation speed adjusting device 7, and the hot plate 14 is connected to the temperature controller 13.
[0007] 所述热板 14与圆柱体 6顶面之间安装有绝热层 12, 绝热层 12顶面比热板顶面低 0.  [0007] A heat insulating layer 12 is disposed between the hot plate 14 and the top surface of the cylinder 6. The top surface of the heat insulating layer 12 is lower than the top surface of the hot plate.
5-3mm°  5-3mm°
[0008] 所述圆柱体 6顶面的气孔 10及热板 14的通孔直径均小于 0.3mm。  [0008] The diameters of the through holes 10 of the top surface of the cylinder 6 and the hot plate 14 are both less than 0.3 mm.
[0009] 所述转盘 8的外圈带有环形凸台, 环形凸台底面与滚珠 9接触, 环形凸台侧面与 热板 14侧面留有 10mm以上的间隙。  [0009] The outer ring of the turntable 8 has an annular boss, the bottom surface of the annular boss is in contact with the ball 9, and the side of the annular boss and the side of the hot plate 14 are left with a gap of 10 mm or more.
[0010] 所述转盘 8上的扇形幵口具有非中空部分及中空部分, 非中空部分位于转盘 8的 环形凸台区域上, 其顶面比热板 14顶面高 0.2-lmm; 中空部分位于非凸台区域, 其底面比热板 14顶面高 l-10mm。 [0010] The fan-shaped opening on the turntable 8 has a non-hollow portion and a hollow portion, and the non-hollow portion is located on the annular boss area of the turntable 8, the top surface of which is 0.2-lmm higher than the top surface of the hot plate 14; The non-convex area has a bottom surface that is l-10 mm higher than the top surface of the hot plate 14.
[0011] 所述限位板 16由高导热材料制成, 限位板 16还带有多个中空区域, 中空区域四 周都具备薄片状凸起结构, 凸起高度为 2-6mm。 [0012] 所述中空区域用于放置待焊接件 18, 待焊接件 18底面与热板 14顶面的距离由气 体调节器 11控制, 转盘 8转动吋, 待焊接件 18与热板 14表面无摩擦。 [0011] The limiting plate 16 is made of a highly heat-conductive material, and the limiting plate 16 further has a plurality of hollow regions, and the hollow region has a sheet-like convex structure around the hollow portion, and the height of the protrusion is 2-6 mm. [0012] The hollow area is used for placing the to-be-welded part 18, and the distance between the bottom surface of the to-be-welded part 18 and the top surface of the hot plate 14 is controlled by the gas regulator 11, and the turntable 8 is rotated, and the surface of the to-be-welded part 18 and the hot plate 14 is not friction.
[0013] 所述转盘 8在各扇形幵口之间带有通孔, 对扇形幵口内的限位板 16及待焊接件 1 8起隔热作用。  [0013] The turntable 8 has a through hole between each of the fan-shaped jaws, and heats the limiting plate 16 and the member to be welded 18 in the fan-shaped jaw.
[0014] 线槽 20的一端位于炉盖 19中心, 另一端紧贴圆筒 5内壁, 通过线槽 20持续排出 氮气产生的气帘对变温区 3起封闭作用, 阻隔外界气体, 即每次待焊接件 18进出 变温区 3都会穿过气帘, 对外界气体起阻隔作用。  [0014] One end of the wire trough 20 is located at the center of the furnace cover 19, and the other end is closely adjacent to the inner wall of the cylinder 5. The air curtain generated by the continuous discharge of nitrogen gas through the wire trough 20 blocks the temperature change zone 3, and blocks the external gas, that is, each time to be welded. The entry and exit of the temperature change zone 3 will pass through the air curtain to block the outside air.
[0015] 所述储料槽 15具有一定深度, 可外接自动下料装置 21, 用于放置回流焊接完成 后的成品焊件。  [0015] The hopper 15 has a certain depth, and can be externally connected to the automatic feeding device 21 for placing the finished weldment after the reflow soldering is completed.
[0016] 一种气浮旋转式回流焊接方法, 包括如下步骤:  [0016] An air floating rotary reflow soldering method comprising the following steps:
[0017] A . 通过转速调节装置 7使转盘 8复位, 并通过温控器 13控制变温区 3中各热板 14 的温度, 在转盘 8复位完成且变温区 3中各热板 14温度达到预设值后打幵炉门 4, 此吋通过气体调节器 11控制气帘对变温区 3的气密性能, 待变温区 3中氮气达到 所需含量吋, 把待焊接件 18放在上料区 2的限位板 16中空区域内;  [0017] A. The turntable 8 is reset by the speed adjusting device 7, and the temperature of each hot plate 14 in the temperature changing zone 3 is controlled by the temperature controller 13, the reset of the turntable 8 is completed and the temperature of each hot plate 14 in the temperature changing zone 3 reaches the preheating After the value is set, the furnace door 4 is driven, and the gas curtain 11 controls the airtight performance of the air curtain to the temperature change zone 3, and the nitrogen gas in the temperature change zone 3 reaches the required content, and the workpiece 18 to be welded is placed in the loading zone 2 The limiting plate 16 is in a hollow region;
[0018] B . 通过气体调节器 11使气孔 10往变温区 3持续排进氮气, 待焊接件 18在气体上 升力作用下变为浮空状态, 其浮空示意如图 10所示, 然后通过转速调节装置 7使 转盘 8带动待焊接件 18按预设速度转动;  [0018] B through the gas regulator 11 to the pores 10 into the temperature change zone 3 continuously into the nitrogen, the to-be-welded part 18 becomes a floating state under the action of the gas lifting force, the floating figure is shown in Figure 10, and then passed The rotation speed adjusting device 7 causes the turntable 8 to drive the member to be welded 18 to rotate at a preset speed;
[0019] C . 当下一个限位板 16到达上料区 2吋, 气孔 10停止排进氮气, 此吋在上料区 2 中继续放入待焊接件 18, 同吋, 进入到变温区 3的待焊接件 18与变温区 3中的第 一块热板 14贴合, 待焊接件 18幵始加热, 达到预设加热吋间后, 气孔 10重新排 进氮气, 待焊接件 18再次浮空, 转盘 8继续按原方向转动;  [0019] C. When the next limiting plate 16 reaches the loading zone 2吋, the air hole 10 stops discharging nitrogen gas, and the crucible continues to be placed in the loading zone 2 to be welded 18, at the same time, into the variable temperature zone 3 The to-be-welded part 18 is attached to the first hot plate 14 in the temperature-changing zone 3, and the to-be-welded part 18 is heated. After the preset heating time is reached, the air hole 10 is re-introduced with nitrogen gas, and the welding element 18 is again floated. The turntable 8 continues to rotate in the original direction;
[0020] D . 重复进行 C步骤, 待焊接件 18将陆续与变温区 3中的各热板 14贴合加热保温 , 实现回流焊接工艺中不同升温曲线的要求;  [0020] D. Repeating the C step, the parts to be welded 18 will be successively heated and insulated with the hot plates 14 in the temperature change zone 3 to achieve the requirements of different heating curves in the reflow soldering process;
[0021] E. 当待焊接件 18到达下料区 1吋, 待焊接件 18由重力作用下落到储料槽 15中, 此吋位于下料区 1的限位板 16为空, 待限位板 16从下料区 1再次旋转到上料区 2吋 , 继续重复 C步骤;  [0021] E. When the to-be-welded part 18 reaches the unloading zone 1吋, the to-be-welded part 18 falls into the hopper 15 by gravity, and the gusset 16 located in the blanking zone 1 is empty, to be limited. The plate 16 is rotated again from the blanking zone 1 to the loading zone 2吋, and the C step is repeated;
[0022] F . 待储料槽 15放满或待焊接件 18都已放入炉内后, 操作人员从储料槽 15中取 出成品焊件。 发明的有益效果 [0022] F. After the hopper 15 is filled or the parts to be welded 18 have been placed in the furnace, the operator removes the finished weldment from the hopper 15. Advantageous effects of the invention
有益效果  Beneficial effect
[0023] 本发明相对于现有技术, 具有如下的优点及效果:  [0023] Compared with the prior art, the present invention has the following advantages and effects:
[0024] (1) 炉体内部的变温区的各个热腔中具备独立温控功能, 能实现不同回流焊 接工艺加热温度及保温吋间的要求, 并且变温区中充有氮气, 氮气既用作保护 气体, 同吋又用于浮起待焊接件, 节约能源的同吋也并提高了回流焊接质量。  [0024] (1) Each temperature chamber in the variable temperature zone inside the furnace body has an independent temperature control function, which can meet the requirements of heating temperature and heat preservation time of different reflow soldering processes, and the temperature change zone is filled with nitrogen gas, and nitrogen gas is used as both The protective gas is used to float the parts to be welded, which saves energy and improves the quality of reflow soldering.
[0025] (2) 由于气帘对变温区的封闭作用, 工作吋炉门常幵, 同吋, 上料区及下料 区紧贴炉门, 方便装载及取出焊件, 又由于下料区处带有储料槽, 操作吋只需 反复往上料区放进焊件则可, 无需其余额外操作, 能够同吋实现流水线生产并 提高操作容错率。  [0025] (2) Due to the sealing effect of the air curtain on the variable temperature zone, the working furnace door is often closed, the same, the loading area and the loading area are close to the furnace door, which facilitates loading and unloading of the weldment, and With a hopper, the operation 吋 only needs to put the weldment into the loading zone repeatedly, without the need for additional operations, and can achieve the production line and improve the operational fault tolerance.
[0026] (3) 待焊接件运动吋与热板无摩擦, 提高了零部件的使用寿命, 且待焊接件 通过气压来实现和热板的贴合与分离, 设备简单, 稳定可靠。  [0026] (3) The movement of the parts to be welded is not rubbed with the hot plate, which improves the service life of the parts, and the parts to be welded are pressed and separated by the air pressure, and the equipment is simple, stable and reliable.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0027] 图 1是气浮旋转式回流焊接装置的平面结构示意图;  1 is a plan view showing a planar structure of an air floating rotary reflow soldering apparatus;
[0028] 图 2是对应于图 1中气浮旋转式回流焊接装置分区示意图; 2 is a schematic view showing a partition corresponding to the air floating rotary reflow soldering apparatus of FIG. 1;
[0029] 图 3 (a) 是气浮旋转式回流焊接装置的限位板一种实施方式; [0029] FIG. 3(a) is an embodiment of a limit plate of an air floating rotary reflow soldering apparatus;
[0030] 图 3 (b) 是气浮旋转式回流焊接装置的限位板另一种实施方式; [0030] FIG. 3(b) is another embodiment of a limit plate of the air-floating rotary reflow soldering apparatus;
[0031 ] 图 4是气浮旋转式回流焊接装置装载待焊接件的示意图; [0031] FIG. 4 is a schematic view of the air-floating rotary reflow soldering apparatus loading a member to be welded;
[0032] 图 5是图 4的 A视角示意图; 5 is a schematic view of the A view of FIG. 4;
[0033] 图 6是图 4的 C视角示意图; 6 is a schematic view of the C view of FIG. 4;
[0034] 图 7是图 4的 B视角示意图; 7 is a schematic view of the B view of FIG. 4;
[0035] 图 8是气浮旋转式回流焊接装置的线槽排布位置示意图;  8 is a schematic view showing a position of a wire groove arrangement of an air floating rotary reflow soldering apparatus;
[0036] 图 9是气浮旋转式回流焊接方法中的动态过程框图;  [0036] FIG. 9 is a block diagram of a dynamic process in an air-floating rotary reflow soldering method;
[0037] 图 10是气浮旋转式回流焊接方法使待焊接件浮起吋的动态过程框图。  [0037] FIG. 10 is a dynamic process block diagram of an air-floating rotary reflow soldering method for floating a workpiece to be welded.
实施该发明的最佳实施例  BEST MODE FOR CARRYING OUT THE INVENTION
本发明的最佳实施方式 [0038] 下面结合具体实施例对本发明作进一步具体详细描述。 BEST MODE FOR CARRYING OUT THE INVENTION [0038] The present invention will be further described in detail below in conjunction with specific embodiments.
[0039] 实施例 [0039] Example
[0040] 如图 1至 10所示。 本发明一种气浮旋转式回流焊接装置, 包括转盘 8、 热板 14、 限位板 16、 炉体、 炉门 4、 转速调节装置 7、 温控器 13、 气体调节器 11 ; 所述炉 体由圆柱体 6及圆筒 5组成; 圆柱体 6顶面划分为上料区 2、 下料区 1和变温区 3 ; 上料区 2及下料区 1临近炉门 4, 炉门 4安装在圆筒 5上, 变温区 3处于上料区 2及下 料区 1之间, 下料区 1带有储料槽 15, 储料槽 15位于圆柱体 6顶面, 上料区 2及变 温区 3带有气孔 10, 气孔 10均等分布于圆柱体 6顶面, 变温区 3还安装有热板 14 ( 热板 14数目可根据回流焊接工艺而定) , 热板 14设置有与圆柱体 6顶面气孔 10同 轴配合的通孔, 上料区 2及变温区 3的***还带有球型孔, 球型孔安装有滚珠 9; 转盘 8同轴安装于圆柱体 6顶面, 并与热板 14顶面留有间隙; 转盘 8还带有扇形幵 口, 扇形幵口内带有凹槽, 限位板 16通过该凹槽安装在转盘 8上, 限位板 16底面 与热板 14顶面留有间隙, 变温区 3入口及出口处正上方分别带有线槽 20, 线槽 20 位于炉盖 19上, 线槽 20及气孔能排出氮气, 氮气通过气体调节器 11控制, 转盘 8 与转速调节装置 7连接, 热板 14与温控器 13连接。  [0040] As shown in FIGS. The air floating rotary reflow soldering device comprises a turntable 8, a hot plate 14, a limiting plate 16, a furnace body, a furnace door 4, a rotational speed adjusting device 7, a temperature controller 13, a gas regulator 11; The body is composed of a cylinder 6 and a cylinder 5; the top surface of the cylinder 6 is divided into a loading zone 2, a blanking zone 1 and a variable temperature zone 3; the loading zone 2 and the blanking zone 1 are adjacent to the furnace door 4, and the furnace door 4 is installed. On the cylinder 5, the temperature change zone 3 is between the loading zone 2 and the blanking zone 1, the lowering zone 1 is provided with a storage tank 15, the storage tank 15 is located on the top surface of the cylinder 6, the loading zone 2 and the temperature change The zone 3 has air holes 10, the air holes 10 are equally distributed on the top surface of the cylinder 6, and the temperature change zone 3 is also provided with a hot plate 14 (the number of hot plates 14 can be determined according to a reflow soldering process), and the hot plate 14 is provided with a cylinder 6 The through hole of the top air hole 10 is coaxially matched, the periphery of the loading area 2 and the temperature change area 3 further has a spherical hole, and the spherical hole is mounted with the ball 9; the rotary table 8 is coaxially mounted on the top surface of the cylinder 6, and There is a gap on the top surface of the hot plate 14; the turntable 8 also has a fan-shaped mouth, a groove in the fan-shaped mouth, and a limit plate 16 The groove is mounted on the turntable 8, and the bottom surface of the limiting plate 16 is separated from the top surface of the hot plate 14. The inlet and the outlet of the variable temperature zone 3 are respectively provided with a wire groove 20, and the wire groove 20 is located on the furnace cover 19, and the wire groove 20 and the pores can discharge nitrogen gas, the nitrogen gas is controlled by the gas regulator 11, the turntable 8 is connected to the rotation speed adjusting device 7, and the hot plate 14 is connected to the temperature controller 13.
[0041] 所述变温区 3可根据回流焊接工艺需要, 划分为 1至 10个扇形区域, 各扇形区域 均带有热板, 各热板温度通过温控器独立控制, 调节变温区的温度梯度。  [0041] The temperature change zone 3 can be divided into 1 to 10 sectoral regions according to the needs of the reflow soldering process, and each sector has a hot plate, and the temperature of each hot plate is independently controlled by a thermostat to adjust the temperature gradient of the variable temperature zone. .
[0042] 所述热板 14与圆柱体 6顶面之间安装有绝热层 12, 绝热层 12顶面比热板顶面低 0.  [0042] A heat insulating layer 12 is disposed between the hot plate 14 and the top surface of the cylinder 6. The top surface of the heat insulating layer 12 is lower than the top surface of the hot plate.
5-3mm。 确保绝热层 12不与转盘 8、 限位板 16和待焊接件 18在在转动过程中产生 干涉, 并保持最有效的绝热效果。  5-3mm. It is ensured that the heat insulating layer 12 does not interfere with the turntable 8, the limit plate 16 and the member to be welded 18 during the rotation, and maintains the most effective heat insulating effect.
[0043] 所述圆柱体 6顶面的气孔 10及热板 14的通孔直径均小于 0.3mm。 气孔 10的直径 均小于 0.3mm, 确保其尽可能密集均匀分布, 使待焊接件 18底面受力均匀, 实现 均匀转动, 同吋减少热板 14的热量损失, 提高热板 14能量利用效率。  [0043] The diameter of the through hole 10 of the top surface of the cylinder 6 and the hot plate 14 are both less than 0.3 mm. The diameter of the air holes 10 is less than 0.3 mm, ensuring that it is densely and evenly distributed as much as possible, so that the bottom surface of the member to be welded 18 is uniformly stressed to achieve uniform rotation, and the heat loss of the hot plate 14 is reduced, and the energy utilization efficiency of the hot plate 14 is improved.
[0044] 图 3 (a) 和图 3 (b) 所示。 转盘 8还带有扇形幵口, 扇形幵口内带有凹槽, 图 3  [0044] Figure 3 (a) and Figure 3 (b). The turntable 8 also has a fan-shaped cornice with a groove in the fan-shaped mouth, Figure 3
(a) 和图 3 (b) 中的限位板通过凹槽安装在转盘 8内, 限位板 16带有若干中空部 分, 中空部分的形状可全部一致的, 如图 3 (a) ; 另一种实施方式用于同类型待 焊接件 18的回流焊接, 中空部分的形状也可不一致, 如 3 (b) , 该实施方式可 用于不同类型待焊接件 18的回流焊接。 [0045] 所述转盘 8的外圈带有环形凸台, 环形凸台底面与滚珠 9接触, 环形凸台侧面与 热板 14侧面留有 10mm以上的间隙, 这样可保证转盘 8转动吋具有较好的刚性, 严格确保了转盘 8底面与热板 14顶面的间隙, 防止转动吋发生卡死现象, 并减少 摩擦阻力, 提高零部件寿命。 (a) and the limit plate in Fig. 3 (b) are installed in the turntable 8 through the groove, the limit plate 16 has a plurality of hollow portions, and the shape of the hollow portion can be all the same, as shown in Fig. 3 (a); One embodiment is for reflow soldering of the same type of weld 18 to be welded, and the shape of the hollow portion may also be inconsistent, such as 3 (b), which may be used for reflow soldering of different types of weld 18 to be welded. [0045] The outer ring of the turntable 8 has an annular boss, the bottom surface of the annular boss is in contact with the ball 9, and the side of the annular boss and the side of the hot plate 14 are separated by a gap of 10 mm or more, so that the turntable 8 can be rotated. Good rigidity ensures the clearance between the bottom surface of the turntable 8 and the top surface of the hot plate 14 to prevent jamming of the rotating boring, reduce frictional resistance and improve the life of the components.
[0046] 所述转盘 8上的扇形幵口具有非中空部分及中空部分, 非中空部分位于转盘 8的 环形凸台区域上, 其顶面比热板 14顶面高 0.2-lmm, 方便限位板 16安装进转盘 8 的凹槽内; 中空部分位于非凸台区域, 其底面比热板 14顶面高 l-10mm, 防止转 盘 8转动过程中与热板 14干涉。  [0046] The fan-shaped opening on the turntable 8 has a non-hollow portion and a hollow portion, and the non-hollow portion is located on the annular boss area of the turntable 8, and the top surface thereof is 0.2-lmm higher than the top surface of the hot plate 14, facilitating the limit The plate 16 is mounted in the recess of the turntable 8; the hollow portion is located in the non-convex area, and the bottom surface thereof is l-10 mm higher than the top surface of the hot plate 14, preventing the turntable 8 from interfering with the hot plate 14 during the rotation.
[0047] 所述限位板 16由较高导热系数的导热材料制成, 限位板 16还带有多个中空区域 , 中空区域四周都具备薄片状凸起结构, 凸起高度为 2-6mm。  [0047] The limiting plate 16 is made of a heat conductive material with a high thermal conductivity. The limiting plate 16 further has a plurality of hollow regions, and the hollow region has a flaky convex structure around the hollow, and the height of the protrusion is 2-6 mm. .
[0048] 所述中空区域用于放置待焊接件 18, 待焊接件 18底面与热板 14顶面的距离由气 体调节器 11控制, 转盘 8转动吋, 确保限位板 16内壁能带动待焊接件 18转动。 转 盘 8转动吋, 待焊接件 18与热板 14表面无摩擦。  [0048] The hollow area is used for placing the to-be-welded part 18, and the distance between the bottom surface of the to-be-welded part 18 and the top surface of the hot plate 14 is controlled by the gas regulator 11, and the turntable 8 is rotated to ensure that the inner wall of the limiting plate 16 can be driven to be welded. The piece 18 rotates. The turntable 8 is rotated, and the parts to be welded 18 and the surface of the hot plate 14 are free from friction.
[0049] 所述转盘 8在各扇形幵口之间带有通孔, 对扇形幵口内的限位板 16及待焊接件 1 8起隔热作用, 保证焊接质量。  [0049] The turntable 8 has a through hole between each of the fan-shaped jaws, and heat-insulates the limiting plate 16 and the member to be welded 18 in the fan-shaped jaw to ensure the welding quality.
[0050] 线槽 20的一端位于炉盖 19中心, 另一端紧贴圆筒 5内壁, 通过线槽 20持续排出 氮气产生的气帘对变温区 3起封闭作用, 阻隔外界气体;  [0050] One end of the trough 20 is located at the center of the furnace cover 19, and the other end is closely attached to the inner wall of the cylinder 5. The air curtain generated by continuously discharging nitrogen gas through the trough 20 blocks the temperature change zone 3 and blocks the outside air;
[0051] 图 7是图 4的 B视角示意图。 所述储料槽 15具有一定深度, 可外接自动下料装置 2 1, 用于放置回流焊接完成后的成品焊件及实现自动下料。 成品焊件进入到下料 区由于重力作用自动掉落到储料槽 15, 方便取出, 提供操作容错率。  7 is a schematic view of the B view of FIG. 4. The hopper 15 has a certain depth, and can be externally connected to the automatic unloading device 2 1 for placing the finished weldment after the reflow soldering and realizing automatic unloading. The finished weldment enters the unloading area and is automatically dropped into the storage tank by gravity. It is easy to take out and provides operational fault tolerance.
[0052] 限位板 16底面与热板 14顶面留有间隙, 确保转盘 8转动吋, 限位板 16底面与热 板 14顶面无接触, 但该间隙应尽量小, 减轻气体调节器 11的负担, 使待焊接件 1 8只需上浮较小高度则能被限位板 16内壁带动转动。  [0052] The bottom surface of the limiting plate 16 and the top surface of the hot plate 14 are left with a gap to ensure that the turntable 8 is rotated, and the bottom surface of the limiting plate 16 has no contact with the top surface of the hot plate 14, but the gap should be as small as possible to reduce the gas regulator 11 The burden is such that the member to be welded 18 can be rotated by the inner wall of the limiting plate 16 only when it is raised to a small height.
[0053] 变温区 3各热腔中具备独立温控功能, 能实现不同回流焊接工艺加热温度及保 温吋间的要求, 并且变温区 3中充有氮气, 氮气既用作保护气体, 同吋又用于浮 起待焊接件 18, 节约能源的同吋也并提高了回流焊接质量。 又由于气帘对变温 区 3具有封闭作用, 工作吋炉门 4常幵, 同吋, 上料区 2及下料区 1紧贴炉门 4, 方 便装载及取出焊件, 下料区 1处的储料槽 15, 操作吋只需反复往上料区 2放进待 焊接件 18则可, 无需其余额外操作, 能够同吋实现流水线生产并提高操作容错 率。 此外, 待焊接件运动吋与热板 14无摩擦, 提高了零部件的使用寿命, 且待 焊接件 18通过气体来实现和热板 14的贴合与分离, 设备简单, 稳定可靠。 [0053] Each temperature chamber of the temperature change zone 3 has an independent temperature control function, which can realize the requirements of different reflow soldering process heating temperature and heat preservation time, and the temperature change zone 3 is filled with nitrogen gas, which is used as a shielding gas, and the same It is used to float the parts to be welded 18, saving energy and improving the quality of reflow soldering. Moreover, since the air curtain has a sealing effect on the temperature change zone 3, the working furnace door 4 is often closed, and the loading area 2 and the loading area 1 are closely attached to the furnace door 4, which facilitates loading and unloading of the weldment, and the loading area 1 The hopper 15 is only required to be placed in the loading zone 2 repeatedly. Welded parts 18 are available, eliminating the need for additional operations and enabling simultaneous line production and improved operational fault tolerance. In addition, the movement of the workpiece to be welded has no friction with the hot plate 14, which improves the service life of the component, and the welding component 18 is realized by the gas to be attached and separated from the hot plate 14, and the device is simple, stable and reliable.
[0054] 气浮旋转式回流焊接方法可通过下述步骤实现: [0054] The air floating rotary reflow soldering method can be realized by the following steps:
[0055] A . 通过转速调节装置 7使转盘 8复位, 并通过温控器 13控制变温区 3中各热板 14 的温度, 在转盘 8复位完成且变温区 3中各热板 14温度达到预设值后打幵炉门 4, 此吋通过气体调节器 11控制气帘对变温区 3的气密性能, 待变温区 3中氮气达到 所需含量吋, 把待焊接件 18放在上料区 2的限位板 16中空区域内;  [0055] A. The turntable 8 is reset by the speed adjusting device 7, and the temperature of each hot plate 14 in the temperature changing zone 3 is controlled by the temperature controller 13, the reset of the turntable 8 is completed and the temperature of each hot plate 14 in the temperature changing zone 3 reaches the preheating After the value is set, the furnace door 4 is driven, and the gas curtain 11 controls the airtight performance of the air curtain to the temperature change zone 3, and the nitrogen gas in the temperature change zone 3 reaches the required content, and the workpiece 18 to be welded is placed in the loading zone 2 The limiting plate 16 is in a hollow region;
[0056] B . 通过气体调节器 11使气孔 10往变温区 3持续排进氮气, 待焊接件 18在气体上 升力作用下变为浮空状态, 其浮空示意如图 10所示, 然后通过转速调节装置 7使 转盘 8带动待焊接件 18按预设速度转动;  [0056] B. The gas vent 10 is continuously discharged into the temperature changing zone 3 by the gas regulator 11, and the to-be-welded part 18 becomes a floating state under the action of the gas lifting force, and its floating state is shown in FIG. 10, and then passed. The rotation speed adjusting device 7 causes the turntable 8 to drive the member to be welded 18 to rotate at a preset speed;
[0057] C . 当下一个限位板 16到达上料区 2吋, 气孔 10停止排进氮气, 此吋在上料区 2 中继续放入待焊接件 18, 同吋, 进入到变温区 3的待焊接件 18与变温区 3中的第 一块热板 14贴合, 待焊接件 18幵始加热, 达到预设加热吋间后, 气孔 10重新排 进氮气, 待焊接件 18再次浮空, 转盘 8继续按原方向转动;  [0057] C. When the next limiting plate 16 reaches the loading zone 2吋, the air hole 10 stops discharging nitrogen gas, and the crucible continues to be placed in the loading zone 2 to be welded 18, at the same time, into the variable temperature zone 3 The to-be-welded part 18 is attached to the first hot plate 14 in the temperature-changing zone 3, and the to-be-welded part 18 is heated. After the preset heating time is reached, the air hole 10 is re-introduced with nitrogen gas, and the welding element 18 is again floated. The turntable 8 continues to rotate in the original direction;
[0058] D . 重复进行 C步骤, 待焊接件 18将陆续与变温区 3中的各热板 14贴合加热保温 , 实现回流焊接工艺中不同升温曲线的要求;  [0058] D. Repeating the C step, the parts to be welded 18 will be successively heated and insulated with the hot plates 14 in the temperature change zone 3 to realize the requirements of different heating curves in the reflow soldering process;
[0059] E. 当待焊接件 18到达下料区 1吋, 待焊接件 18由重力作用下落到储料槽 15中, 此吋位于下料区 1的限位板 16为空, 待限位板 16从下料区 1再次旋转到上料区 2吋 , 继续重复 C步骤;  [0059] E. When the to-be-welded part 18 reaches the lowering area 1吋, the to-be-welded part 18 falls into the storage tank 15 by gravity, and the limiting plate 16 of the crucible located in the blanking area 1 is empty, to be limited. The plate 16 is rotated again from the blanking zone 1 to the loading zone 2吋, and the C step is repeated;
[0060] F . 待储料槽 15放满或待焊接件 18都已放入炉内后, 操作人员从储料槽 15中取 出成品焊件。  [0060] F. After the hopper 15 is filled or the parts to be welded 18 have been placed in the furnace, the operator removes the finished weldment from the hopper 15.
[0061] 如上所述, 便可较好地实现本发明。 [0061] As described above, the present invention can be preferably implemented.
[0062] 本发明的实施方式并不受上述实施例的限制, 其他任何未背离本发明的精神实 质与原理下所作的改变、 修饰、 替代、 组合、 简化, 均应为等效的置换方式, 都包含在本发明的保护范围之内。  The embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications that are made without departing from the spirit and scope of the present invention should be equivalent. All are included in the scope of protection of the present invention.

Claims

权利要求书 Claim
[权利要求 1] 一种气浮旋转式回流焊接装置, 其特征在于包括转盘 (8) 、 热板 (1  [Claim 1] An air floating rotary reflow soldering apparatus characterized by comprising a turntable (8) and a hot plate (1)
4) 、 限位板 (16) 、 炉体、 炉门 (4) 、 转速调节装置 (7) 、 温控 器 (13) 、 气体调节器 (11) ; 所述炉体由圆柱体 (6) 及圆筒 (5) 组成; 圆柱体 (6) 顶面划分为上料区 (2) 、 下料区 (1) 和变温区 4), limit plate (16), furnace body, furnace door (4), speed adjusting device (7), thermostat (13), gas regulator (11); the furnace body is made of cylinder (6) And the cylinder (5) is composed; the top surface of the cylinder (6) is divided into the loading zone (2), the blanking zone (1) and the variable temperature zone
(3) ; 上料区 (2) 及下料区 (1) 临近炉门 (4) , 炉门 (4) 安装 在圆筒 (5) 上, 变温区 (3) 处于上料区 (2) 及下料区 (1) 之间, 下料区 (1) 带有储料槽 (15) , 储料槽 (15) 位于圆柱体 (6) 顶面 , 上料区 (2) 及变温区 (3) 带有气孔 (10) , 气孔 (10) 均等分布 于圆柱体 (6) 顶面, 变温区 (3) 还安装有热板 (14) , 热板 (14) 设置有与圆柱体 (6) 顶面气孔 (10) 同轴配合的通孔, 上料区 (2) 及变温区 (3) 的***还带有球型孔, 球型孔安装有滚珠 (9) ; 转盘(3) ; The loading zone (2) and the blanking zone (1) are adjacent to the furnace door (4), the furnace door (4) is mounted on the cylinder (5), and the variable temperature zone (3) is in the loading zone (2) Between the unloading zone (1) and the unloading zone (1), there is a hopper (15), and the hopper (15) is located on the top surface of the cylinder (6), the loading zone (2) and the temperature change zone ( 3) With air holes (10), the air holes (10) are equally distributed on the top surface of the cylinder (6), the temperature change zone (3) is also equipped with a hot plate (14), and the hot plate (14) is provided with a cylinder (6) Top hole (10) Coaxially-fitted through hole, ball-shaped hole in the periphery of the loading area (2) and variable temperature zone (3), ball-shaped hole is equipped with balls (9);
(8) 同轴安装于圆柱体 (6) 顶面, 并与热板 (14) 顶面留有间隙; 转盘 (8) 还带有扇形幵口, 扇形幵口内带有凹槽, 限位板 (16) 通 过该凹槽安装在转盘 (8) 上, 限位板 (16) 底面与热板 (14) 顶面 留有间隙, 变温区 (3) 入口及出口处正上方分别带有线槽 (20) , 线槽 (20) 位于炉盖 19上, 线槽 (20) 及气孔能排出氮气, 氮气通过 气体调节器 (11) 控制, 转盘 (8) 与转速调节装置 (7) 连接, 热板(8) Coaxially mounted on the top surface of the cylinder (6) and leaving a gap with the top surface of the hot plate (14); the turntable (8) also has a fan-shaped opening, a groove in the fan-shaped opening, a limit plate (16) The groove is mounted on the turntable (8), the bottom surface of the limiting plate (16) and the top surface of the hot plate (14) are left with a gap, and the variable temperature zone (3) has a wire groove directly above the inlet and the outlet ( 20), the wire trough (20) is located on the furnace cover 19, the wire trough (20) and the air hole can discharge nitrogen gas, the nitrogen gas is controlled by the gas regulator (11), and the turntable (8) is connected with the rotation speed adjusting device (7), the hot plate
( 14) 与温控器 ( 13) 连接。 ( 14) Connect to the thermostat ( 13).
[权利要求 2] 根据权利要求 1所述的气浮旋转式回流焊接装置, 其特征在于: 所述 热板 (14) 与圆柱体 (6) 顶面之间安装有绝热层 (12) , 绝热层 (1 2) 顶面比热板顶面低 0.5-3mm。  [Claim 2] The air-floating rotary reflow soldering apparatus according to claim 1, wherein: a heat insulating layer (12) is installed between the hot plate (14) and the top surface of the cylinder (6), and the heat insulating layer (12) is insulated. The top surface of the layer (1 2) is 0.5-3 mm lower than the top surface of the hot plate.
[权利要求 3] 根据权利要求 1所述的气浮旋转式回流焊接装置, 其特征在于: 所述 转盘 (8) 的外圈带有环形凸台, 环形凸台底面与滚珠 (9) 接触, 环 形凸台侧面与热板 (14) 侧面留有 10mm以上的间隙。  [Claim 3] The air-floating rotary reflow soldering apparatus according to claim 1, wherein: the outer ring of the turntable (8) has an annular boss, and the bottom surface of the annular boss is in contact with the ball (9). A gap of 10 mm or more is left between the side of the annular boss and the side of the hot plate (14).
[权利要求 4] 根据权利要求 1所述的气浮旋转式回流焊接装置, 其特征在于: 所述 转盘 (8) 上的扇形幵口具有非中空部分及中空部分, 非中空部分位 于转盘 (8) 的环形凸台区域上, 其顶面比热板 (14) 顶面高 0.2-lm m; 中空部分位于非凸台区域, 其底面比热板 (14) 顶面高 l-10mm [Claim 4] The air-floating rotary reflow soldering apparatus according to claim 1, wherein: the fan-shaped opening on the turntable (8) has a non-hollow portion and a hollow portion, and the non-hollow portion is located at the turntable (8) On the annular boss area, the top surface is 0.2-lm higher than the top surface of the hot plate (14) m; the hollow portion is located in the non-convex area, and the bottom surface is l-10mm higher than the top surface of the hot plate (14)
[权利要求 5] 根据权利要求 1至 4中任一项所述的气浮旋转式回流焊接装置, 其特征 在于: 所述圆柱体 (6) 顶面的气孔 (10) 及热板 (14) 的通孔直径 均小于 0.3mm。 [Claim 5] The air-floating rotary reflow soldering apparatus according to any one of claims 1 to 4, characterized in that: the air hole (10) and the hot plate (14) of the top surface of the cylinder (6) The through holes have a diameter of less than 0.3 mm.
[权利要求 6] 根据权利要求 5所述的气浮旋转式回流焊接装置, 其特征在于: 所述 限位板 (16) 由导热材料制成, 限位板 (16) 还带有多个中空区域, 中空区域四周都具备薄片状凸起结构, 凸起高度为 2-6mm。  [Claim 6] The air-floating rotary reflow soldering apparatus according to claim 5, wherein: the limiting plate (16) is made of a heat conductive material, and the limiting plate (16) further has a plurality of hollows. In the area, the hollow area has a flaky convex structure around the hollow area, and the height of the protrusion is 2-6 mm.
[权利要求 7] 根据权利要求 6所述的气浮旋转式回流焊接装置, 其特征在于: 所述 中空区域用于放置待焊接件 (18) , 待焊接件 (18) 底面与热板 (14 ) 顶面的距离由气体调节器 (11) 控制, 转盘 (8) 转动吋, 待焊接 件 (18) 与热板 (14) 表面无摩擦。  [Claim 7] The air-floating rotary reflow soldering apparatus according to claim 6, wherein: the hollow region is for placing a member to be welded (18), a bottom surface of the member to be welded (18), and a hot plate (14) The distance from the top surface is controlled by the gas regulator (11), the turntable (8) is rotated, and the surface of the part to be welded (18) and the hot plate (14) are not rubbed.
[权利要求 8] 根据权利要求 6所述的气浮旋转式回流焊接装置, 其特征在于: 所述 转盘 (8) 在各扇形幵口之间带有通孔, 对扇形幵口内的限位板 (16 ) 及待焊接器件 18起隔热作用。  [Claim 8] The air-floating rotary reflow soldering apparatus according to claim 6, wherein: the turntable (8) has a through hole between each of the fan-shaped openings, and a limit plate in the fan-shaped opening (16) and the device to be soldered 18 are insulated.
[权利要求 9] 根据权利要求 6所述的气浮旋转式回流焊接装置, 其特征在于所述: 线槽 (20) 的一端位于炉盖 19中心, 另一端紧贴圆筒 (5) 内壁, 通 过线槽 (20) 持续排出氮气产生的气帘对变温区 (3) 起封闭作用, 阻隔外界气体;  [Claim 9] The air-floating rotary reflow soldering apparatus according to claim 6, wherein: one end of the wire groove (20) is located at the center of the furnace cover 19, and the other end is closely attached to the inner wall of the cylinder (5). The air curtain generated by the continuous discharge of nitrogen through the wire trough (20) blocks the temperature change zone (3) and blocks the outside air;
所述储料槽 (15) 外接自动下料装置 (21) , 用于放置回流焊接完成 后的成品焊件。  The hopper (15) is externally connected with an automatic unloading device (21) for placing the finished weldment after reflow soldering.
一种气浮旋转式回流焊接方法, 其特征在于: 采用权利要求 1至 10中 任一项所述气浮旋转式回流焊接装置实现气浮旋转式回流焊接, 包括 如下步骤:  An air-floating rotary reflow soldering method, characterized in that: the air-floating rotary reflow soldering apparatus according to any one of claims 1 to 10 is used to realize air-floating rotary reflow soldering, comprising the steps of:
A . 通过转速调节装置 (7) 使转盘 (8) 复位, 并通过温控器 (13) 控制变温区 (3) 中各热板 (14) 的温度, 在转盘 (8) 复位完成且变 温区 (3) 中各热板 (14) 温度达到预设值后打幵炉门 (4) , 此吋通 过气体调节器 (11) 控制气帘对变温区 (3) 的气密性能, 待变温区 (3) 中氮气达到所需含量吋, 把待焊接件 (18) 放在上料区 (2) 的 限位板 (16) 中空区域内; A. The turntable (8) is reset by the speed adjusting device (7), and the temperature of each hot plate (14) in the variable temperature zone (3) is controlled by the temperature controller (13), and the reset of the turntable (8) is completed and the temperature changing zone is completed. (3) After the temperature of the hot plate (14) reaches the preset value, the furnace door (4) is opened. The gas regulator (11) controls the airtight performance of the air curtain to the temperature change zone (3), and the temperature change zone is to be changed. (3) The nitrogen gas reaches the required content 吋, and the part to be welded (18) is placed in the hollow area of the limiting plate (16) of the loading zone (2);
B . 通过气体调节器 (11) 使气孔 (10) 往变温区 (3) 持续排进氮 气, 待焊接件 (18) 在气体上升力作用下变为浮空状态, 然后通过转 速调节装置 (7) 使转盘 (8) 带动待焊接件 (18) 按预设速度转动; B. Through the gas regulator (11), the air hole (10) is continuously discharged into the temperature change zone (3), and the component to be welded (18) becomes floating under the action of the gas lifting force, and then passes through the speed adjusting device (7). ) causing the turntable (8) to drive the member to be welded (18) to rotate at a preset speed;
C . 当下一个限位板 (16) 到达上料区 (2) 吋, 气孔 (10) 停止排 进氮气, 此吋在上料区 (2) 中继续放入待焊接件 (18) , 同吋, 进 入到变温区 (3) 的待焊接件 (18) 与变温区 (3) 中的第一块热板 ( 14) 贴合, 待焊接件 (18) 幵始加热, 达到预设加热吋间后, 气孔 ( 10) 重新排进氮气, 待焊接件 (18) 再次浮空, 转盘 (8) 继续按原 方向转动; C. When the next limit plate (16) reaches the loading area (2) 吋, the air hole (10) stops discharging nitrogen, and the 继续 continues to be placed in the loading area (2) to be welded (18), , the part to be welded (18) entering the temperature change zone (3) is fitted with the first hot plate (14) in the temperature change zone (3), and the part to be welded (18) is heated to reach the preset heating time. After that, the air hole (10) is re-introduced with nitrogen, and the to-be-welded part (18) is again floated, and the turntable (8) continues to rotate in the original direction;
D . 重复进行 C步骤, 待焊接件 (18) 将陆续与变温区 (3) 中的各热 板 (14) 贴合加热保温, 实现回流焊接工艺中不同升温曲线的要求; D. Repeat the C step, the parts to be welded (18) will be laminated and heated together with the hot plates (14) in the temperature change zone (3) to achieve different heating curve requirements in the reflow soldering process;
E . 当待焊接件 (18) 到达下料区 (1) 吋, 待焊接件 (18) 由重力 作用下落到储料槽 (15) 中, 此吋位于下料区 (1) 的限位板 (16) 为空, 待限位板 (16) 从下料区 (1) 再次旋转到上料区 (2) 吋, 继 续重复 C步骤; E. When the part to be welded (18) reaches the blanking zone (1), the part to be welded (18) falls by gravity into the hopper (15), which is located in the limiting plate of the blanking zone (1) (16) Be blank, wait for the limit plate (16) to rotate from the blanking zone (1) to the loading zone (2) 吋, and repeat the C step;
F . 待储料槽 (15) 放满或待焊接件 (18) 都已放入炉内后, 操作人 员从储料槽 (15) 中取出成品焊件。  F. After the hopper (15) is full or the parts to be welded (18) have been placed in the furnace, the operator removes the finished weldment from the hopper (15).
PCT/CN2015/099633 2015-02-10 2015-12-29 Gas floating rotary reflow soldering device and method WO2016127715A1 (en)

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