WO2016127427A1 - 电子设备外壳的加工方法、电子设备外壳及电子设备 - Google Patents
电子设备外壳的加工方法、电子设备外壳及电子设备 Download PDFInfo
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- WO2016127427A1 WO2016127427A1 PCT/CN2015/073096 CN2015073096W WO2016127427A1 WO 2016127427 A1 WO2016127427 A1 WO 2016127427A1 CN 2015073096 W CN2015073096 W CN 2015073096W WO 2016127427 A1 WO2016127427 A1 WO 2016127427A1
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- partition strip
- electronic device
- metal
- metal layer
- predetermined
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Definitions
- Embodiments of the present invention relate to electronic technologies, and in particular, to a method for processing an electronic device housing, an electronic device housing, and an electronic device.
- the partition is made of a part of the metal casing of the electronic device as a part of the antenna of the electronic device.
- the metal material of the metal casing is generally aluminum or stainless steel, and the surface is anodized or sandblasted.
- the insulating material of the partition strip plastic material, partition strip and metal casing are generally used.
- the width of the partition strip is generally above 0.6mm due to the strength of the plastic material and the performance of the antenna of the electronic device, as shown in Figure 1, due to the material of metal and plastic. Different from the surface treatment, the plastic material of the partition strip can not achieve the metallization effect of the metal shell.
- the existing technical solution is to make the surface of the partition strip as close as possible to the metallization effect by means of plastic material color matching or surface spray paint (the sprayed paint is actually also an organic polymer material). Due to the inherent difference between the two materials, the surface of the plastic material does not have a metallic luster. The color matching or surface coating does not make the surface of the partition strip have a metallized appearance consistent with the metal casing.
- the processing method of the electronic device casing, the electronic device casing and the electronic device provided by the embodiments of the present invention can solve the problem that the surface of the partitioning strip of the electronic device casing cannot have a metallized appearance effect consistent with the metal casing in the prior art.
- an embodiment of the present invention provides a method of processing an electronic device housing, the electronic device housing including a metal housing and a partition strip for blocking the metal housing, the method comprising: at the partition strip The predetermined area of the surface forms a predetermined metal layer, wherein the area of the partition strip surface other than the predetermined area is an insulating area.
- the partition strip is combined with the metal shell by an in-mold injection technique, or the partition strip and the metal shell are nano-formed.
- the technical NMT is combined, or the partition strip is combined with the metal casing by an assembly process.
- the material of the partition strip includes:
- LDS material processed by laser direct structuring technology LDS, plastic material with surface-printed or spray-activated activation component, or acrylonitrile-butadiene-styrene copolymer (English: Acrylonitrile Butadiene Styrene plastic, abbreviation: ABS) material.
- a predetermined metal layer on the predetermined area of the surface of the partition strip includes:
- the metal plated material is subjected to a plating treatment such that the predetermined metal layer is formed on the metal layer.
- the predetermined area on the surface of the partition strip is formed.
- the preset metal layer includes:
- the predetermined metal layer covering the surface of the partition strip over the area other than the predetermined area and the metal layer are removed.
- the method further includes:
- the electronic device housing is energized to prevent the electroless plating process from being performed on the metal housing.
- the method further includes: before performing the electroless plating treatment on the surface of the partition strip, the method further comprises:
- the electronic device housing is energized to prevent the electroless plating process from being performed on the metal housing.
- the predetermined metal layer covering the surface of the partition strip on a region other than the preset area And removing the metal layer includes:
- the predetermined metal layer covering the region other than the predetermined region and the metal layer on the surface of the partition strip are removed by a laser engraving.
- the metal material of the predetermined metal layer is aluminum or nickel.
- an embodiment of the present invention provides an electronic device housing, which is processed by the method as described in the first aspect or any possible implementation thereof.
- an embodiment of the present invention provides an electronic device, comprising the electronic device housing according to the second aspect, wherein the electronic device housing is internally provided with an electronic component of the electronic device.
- the processing method of the electronic device casing, the electronic device casing and the electronic device provided by the embodiment of the present invention include: forming a preset metal layer in a predetermined area on the surface of the partitioning strip of the electronic device casing, the partitioning strip surface except the preset area The area other than the insulation area.
- the partition strip surface of the electronic device casing can have a metallized appearance effect consistent with the metal casing.
- 1 is a schematic structural view of an electronic device housing
- FIG. 2 is a schematic flow chart 1 of a method for processing an electronic device casing according to an embodiment of the present invention
- FIG. 3 is a second schematic flowchart of a method for processing an electronic device casing according to an embodiment of the present invention.
- 4a is a partially enlarged schematic structural view of a partition strip of an electronic device casing processed by the processing method of the electronic device casing provided by the embodiment of the present invention
- 4b is a partially enlarged schematic structural view of an electronic device casing processed by the processing method of the electronic device casing provided by the embodiment of the present invention
- FIG. 5 is a schematic flowchart 3 of a method for processing an electronic device casing according to an embodiment of the present invention.
- In-mold injection technology refers to putting metal parts into a mold and then injecting them. Finally, the metal parts and the plastic parts are combined.
- LDS technology refers to the activation of the catalytic component in the plastic material by laser laser technology on the molded plastic part bracket, and the metal plating layer is formed on the activated plastic surface by electroless plating.
- LDS can provide electrical interconnection function, support component function and support and protection of plastic housing for common plastic components, as well as shielding and antenna functions realized by combining mechanical entities with conductive patterns.
- the LDS material is a modified plastic containing an organic metal composite. After laser irradiation, the organometallic composite releases metal particles.
- NMT technology refers to the technology of combining metal and plastic with nanotechnology. After the metal surface is nano-treated, nano-scale micropores are formed on the metal surface, and the plastic material is injected into the micro-hole and metal. NMT allows metal and plastic to be molded in one piece, which not only balances the appearance of metal. It also simplifies the design of product components.
- ABS material surface plating process is suitable for forming multiple metal layers on the surface of ABS material components, first forming a conductive medium on the surface of the component, and then forming a chemical metal layer (such as chemical copper layer or chemical nickel) by electroless plating.
- the layer is applied to the surface of the plastic component, and then the material properties of the surface of the component are adjusted, and then an electroplated metal layer (such as an electroplated aluminum layer, an electroplated nickel layer or an electroplated chromium layer) is formed on the surface of the chemical metal layer by electrolytic plating.
- the metallization layer has high structural strength and high electrical conductivity, and the component can retain the original characteristics of the material.
- Electroless plating also known as electroless plating or autocatalytic plating, is a plating method in which metal ions in a plating solution are reduced to metal and deposited on the surface of a part without an applied current by means of a suitable reducing agent. Electroless plating is a process of depositing a metal by a controlled redox reaction under the catalysis of a metal.
- electroless plating has been widely used in electronics, valve manufacturing, machinery, petrochemical, automotive, aerospace and other industries.
- the electroless plating treatment may be electroless copper plating, electroless nickel plating, electroless chrome plating, electroless tin plating, electroless gold plating or electroless silver plating, etc., and the actual implementation is selected according to actual needs.
- An embodiment of the present invention provides a method of processing an electronic device housing.
- the electronic device housing includes a metal housing and a partition strip for blocking the metal housing. As shown in FIG. 2, the method includes:
- Step 10 forming a predetermined metal layer on a predetermined area of the surface of the partition strip, wherein the area of the partition strip surface other than the preset area is an insulating area.
- the partition strip and the metal shell may be combined by in-mold molding technology, or the partition strip and the metal shell may be combined by a nano-forming technology NMT, or the partition strip and the metal shell may be further It can be combined by an assembly process.
- the material of the partition strip includes: an LDS material that can be processed by LDS, a plastic material that is surface-printed or sprayed with a laser-activated activation component, or an ABS material.
- the material of the partition strip is an LDS material or a plastic material whose surface is printed or sprayed with a laser-activated activation component, and the electroless plating process is selected as electroless copper plating, as shown in FIG. 3, step 10
- the forming a predetermined metal layer on the predetermined area of the surface of the partition strip may specifically include:
- Step 101 Perform a laser engraving process on a predetermined area of the surface of the partition strip.
- the laser laser engraving process is performed on the preset area of the surface of the partition strip as shown in FIG. 2, and the area outside the preset area in FIG. 2, that is, the width of the insulating area is 0.1-0.2 mm, which is activated by laser engraving.
- the electroless plating function of the area material is set.
- the shape of the partition strip may be a regular linear shape, a ring shape, or other irregular patterns.
- the shape of the partition strip shown in FIG. 2 is merely schematic, and the shape of the partition strip is specifically determined by a technician. The actual demand selection is not limited by the present invention.
- Step 102 Perform electroless copper plating on the preset area after the laser engraving, so that a copper layer is formed on the material corresponding to the preset area.
- Electroless copper plating is a mature technology in the existing application.
- the electroless copper plating on the preset area after the laser engraving treatment is as follows: the copper is reacted by formaldehyde, and the copper is attached to the surface of the preset area after the laser engraving treatment.
- the thickness of the copper layer is required to be 10 um or more.
- the electronic device housing can be energized to block the metal.
- the housing is electroless copper plated.
- the partition strip and the metal shell are combined by an assembly process, the partition strip can be treated separately, and the metal shell is not involved in the electroless copper plating on the predetermined area of the partition strip.
- Step 103 Electroplating the material coated with the copper layer to form a predetermined metal layer on the copper layer.
- the metal material of the metal casing is generally stainless steel or aluminum. If the metal casing is stainless steel, the surface of the metal casing and the predetermined surface of the partition strip are plated with nickel, and the effect of nickel plating is stainless steel. The effect after sand blasting is very close; if the metal shell is aluminum, the metal material of the preset metal layer is also selected as aluminum, and the surface of the copper layer is plated with aluminum by electroplating, and the thickness of the aluminum is generally required to be 0.1 mm or more.
- the electroless copper plating is naturally deposited and adhered to the surface, and the electroplating is forced exchange of electrons by electric current, and the plating layer is dense, and a bright surface effect can be achieved.
- the aluminum layer formed by electroplating the aluminum in the predetermined region is sandblasted or anodized to achieve a uniform metallization effect.
- FIG. 4a is a partially enlarged structural view of the partition strip, wherein the partition strip has four strips of 0.1-0.2 mm width except the predetermined area, and the insulating strip is still a plastic material for blocking the antenna. And the main housing, weakening the antenna coupling effect, achieving the effect equivalent to the complete disconnection, and ensuring the performance of the antenna while realizing the integrated metal effect of the outer casing.
- Figure 4b is electricity A partially enlarged schematic view of the sub-device housing, wherein the dotted line portion is an enlarged insulating tape.
- the metal material of the partition strip is the ABS material as an example, wherein the metal material of the metal shell is aluminum, the metal material of the predetermined metal layer is also selected as aluminum, and the electroless plating is selected as electroless copper plating, as shown in the figure.
- the forming a predetermined metal layer on the predetermined area of the surface of the partitioning strip in the step 10 may specifically include:
- Step 201 Perform electroless copper plating on the surface of the partition strip to form a copper layer on the surface of the partition strip.
- the electronic device housing can be energized to block the metal.
- the housing is electroless copper plated.
- Step 202 Perform a plating process on the copper layer attached to the surface of the partition strip, so that a predetermined metal layer is formed on the copper layer.
- step 103 aluminum is plated on the copper layer attached to the surface of the partition strip.
- Step 203 removing a predetermined metal layer and a copper layer covering the surface of the partition strip on a surface other than the preset area.
- the predetermined metal layer and the copper layer covering the area other than the preset area on the surface of the partition strip may be removed by using a laser engraving.
- step 202 is completely aluminizing the surface of the partition strip, the aluminum layer and the copper layer covering the area other than the predetermined area on the surface of the partition strip are removed by laser laser engraving to make the area Become an insulation zone.
- the aluminum layer formed by electroplating the aluminum in the predetermined region is sandblasted or anodized to achieve a uniform metallization effect.
- FIG. 4a is a partially enlarged structural view of the partition strip, wherein the partition strip has four strips of 0.1-0.2 mm width except the predetermined area, and the insulating strip is still a plastic material for blocking the antenna. And the main housing, weakening the antenna coupling effect, achieving the effect equivalent to the complete disconnection, and ensuring the performance of the antenna while realizing the integrated metal effect of the outer casing.
- Figure 4b is electricity A partially enlarged schematic view of the sub-device housing, wherein the dotted line portion is an enlarged insulating tape.
- a predetermined metal layer is formed on a predetermined area of the surface of the partitioning strip of the electronic device casing, and the surface of the partitioning strip except the predetermined area is an insulating region.
- the partition strip surface of the electronic device casing can have a metallized appearance effect consistent with the metal casing.
- Embodiments of the present invention provide an electronic device housing obtained by the processing method provided by the above method embodiment.
- the surface of the partition strip of the electronic device casing provided by the embodiment of the invention has the same metallization effect as the metal casing.
- the embodiment of the present invention further provides an electronic device, including the electronic device casing provided by the above embodiment, wherein the electronic device casing is internally provided with electronic components of the electronic device.
- the surface of the partition strip of the outer casing of the electronic device provided by the embodiment of the invention has a metallizing effect consistent with the metal casing.
- the disclosed apparatus and method may be implemented in other manners.
- the device embodiments described above are merely illustrative.
- the division of the unit is only a logical function division.
- there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
- the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
- the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
- each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
- the above integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional units.
- the above-described integrated unit implemented in the form of a software functional unit can be stored in a computer readable storage medium.
- the above software functional unit is stored in a storage medium and includes a plurality of instructions for causing a computer device (which may be a personal computer, a server, or a network)
- a device or the like or a processor performs part of the steps of the method of the various embodiments of the present invention.
- the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like, which can store program codes. .
- the foregoing program may be stored in a computer readable storage medium, and the program is executed when executed.
- the foregoing steps include the steps of the foregoing method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
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Abstract
一种电子设备外壳的加工方法、电子设备外壳及电子设备,包括:在电子设备外壳的隔断条表面的预设区域形成预设金属层,该隔断条表面除所述预设区域以外的区域为绝缘区。通过该方法,能够使得电子设备外壳的隔断条表面具有与金属壳体一致的金属化外观效果。
Description
本发明实施例涉及电子技术,尤其涉及一种电子设备外壳的加工方法、电子设备外壳及电子设备。
目前,电子设备例如智能手机、平板电脑等手持电子设备的外观结构件的发展趋势是金属化效果,由于金属是导体,对天线信号有屏蔽作用,因此目前业界主流方案是通过绝缘材料把金属外壳隔断,利用隔断的一部分金属外壳作为电子设备的部分天线,金属外壳的金属材料一般为铝或者不锈钢,表面阳极氧化或者喷砂处理,作为隔断条的绝缘材料一般选用塑胶材料,隔断条与金属外壳通过模内注塑(英文:Insert Molding)等方式结合在一起,由于塑胶材料强度及电子设备天线性能的要求,隔断条的宽度一般在0.6mm以上,如图1所示,由于金属与塑胶的材质和表面处理有差异,隔断条的塑胶材料并不能达到金属外壳的金属化效果。
现有的技术方案是通过塑胶材料配色或者表面喷涂油漆(喷涂的油漆实际也属于有机高分子材料)的方式使隔断条的表面尽量接近金属化效果。由于两者材料本质上的差异,塑胶材料表面并不具备金属光泽,通过配色或者表面喷涂并不能使隔断条表面具有与金属壳体一致的金属化外观效果。
发明内容
本发明实施例提供的电子设备外壳的加工方法、电子设备外壳及电子设备,能够解决现有技术方案中无法使电子设备外壳的隔断条表面具有与金属壳体一致的金属化外观效果的问题。
第一方面,本发明实施例提供一种电子设备外壳的加工方法,所述电子设备外壳包括金属壳体以及用于隔断所述金属壳体的隔断条,所述方法包括:在所述隔断条表面的预设区域形成预设金属层,其中,所述隔断条表面除所述预设区域以外的区域为绝缘区。
结合第一方面,在第一种可能的实现方式中,所述隔断条与所述金属壳体是通过模内注塑技术进行结合的、或所述隔断条与所述金属壳体是通过纳米成型技术NMT进行结合的、或所述隔断条与所述金属壳体是通过组装工艺进行结合的。
结合第一方面的第一种可能的实现方式,在第二种可能的实现方式中,所述隔断条的材料包括:
可利用激光直接成型技术LDS加工的LDS材料、表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料、或者丙烯腈-丁二烯-苯乙烯共聚物(英文:Acrylonitrile Butadiene Styrene plastic,缩写:ABS)材料。
结合第一方面的第二种可能的实现方式,在第三种可能的实现方式中,当所述隔断条的材料为所述LDS材料或所述表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料时,所述在所述隔断条表面的预设区域形成预设金属层包括:
对所述隔断条表面的预设区域进行镭雕处理;
对镭雕处理后的所述预设区域进行化学镀处理,使得在所述预设区域对应的材料上形成金属层;
对所述镀有金属层的材料进行电镀处理,使得在所述金属层上形成所述预设金属层。
结合第一方面的第二种可能的实现方式,在第四种可能的实现方式中,当所述隔断条的材料为所述ABS材料时,所述在所述隔断条表面的预设区域形成预设金属层包括:
对所述隔断条表面进行化学镀处理,使得在所述隔断条表面形成金属层;
对所述隔断条表面附着的技术层进行电镀处理,使得在所述金属层上形成所述预设金属层;
将所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层去除。
结合第一方面的第三种可能的实现方式,在第五种可能的实现方式中,当所述隔断条与所述金属壳体是通过模内注塑技术进行结合的或所述隔断条与所述金属壳体是通过纳米成型技术NMT进行结合的时,在所述对镭雕处理后的所述预设区域进行化学镀处理前,所述方法还包括:
为所述电子设备外壳进行通电以阻止对所述金属壳体进行所述化学镀处理。
结合第一方面的第四种可能的实现方式,在第六种可能的实现方式中,当所述隔断条与所述金属壳体通过模内注塑技术结合或所述隔断条与所述金属壳体通过纳米成型技术NMT结合时,其特征在于,在所述对所述隔断条表面进行化学镀处理前,所述方法还包括:
为所述电子设备外壳进行通电以阻止对所述金属壳体进行所述化学镀处理。
结合第一方面的第四种可能的实现方式,在第七种可能的实现方式中,所述将所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层去除包括:
利用镭雕去除所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层。
结合第一方面或其上述任一可能的实现方式,在第八种可能的实现方式,所述预设金属层的金属材料为铝或镍。
第二方面,本发明实施例提供一种电子设备外壳,所述电子设备外壳采用如第一方面或其任一可能的实现方式所述的方法加工得到。
第三方面,本发明实施例提供一种电子设备,包括如第二方面所述的电子设备外壳,所述电子设备外壳内部设置有所述电子设备的电子元件。
本发明实施例提供的电子设备外壳的加工方法、电子设备外壳及电子设备,包括:在电子设备外壳的隔断条表面的预设区域形成预设金属层,该隔断条表面除所述预设区域以外的区域为绝缘区。通过本发明提供的方案,能够使得电子设备外壳的隔断条表面具有与金属壳体一致的金属化外观效果。
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1为电子设备外壳的结构示意图;
图2为本发明实施例提供的电子设备外壳的加工方法的流程示意图一;
图3为本发明实施例提供的电子设备外壳的加工方法的流程示意图二;
图4a为利用本发明实施例提供的电子设备外壳的加工方法加工得到的电子设备外壳的隔断条的局部放大后的结构示意图;
图4b为利用本发明实施例提供的电子设备外壳的加工方法加工得到的电子设备外壳的局部放大后的结构示意图;
图5为本发明实施例提供的电子设备外壳的加工方法的流程示意图三。
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在介绍本发明实施例提供的技术方案前,先对技术方案涉及的一些相关内容进行说明:目前,模内注塑、激光直接成型技术(英文:Laser Direct Structuring,缩写:LDS)、纳米成型技术(英文:Nano Molding Technology,缩写:NMT)以及ABS材料表面电镀制作工艺已经是业界应用非常成熟的技术。
模内注塑技术是指将金属件放入模具中然后注塑,最后金属件和塑件结合在一起。
LDS技术是指在成型的塑胶件支架上,利用激光镭射技术激活塑胶材料中的催化成分,通过化学镀处理在激活后的塑胶表面形成金属镀层。LDS能为普通的塑料元件赋予电气互连功能、支撑元器件功能和塑料壳体的支撑、防护等功能,以及由机械实体与导电图形结合而实现的屏蔽、天线等功能。LDS材料是一种内含有机金属复合物的改性塑胶,激光照射后,使有机金属复合物释放出金属粒子。
NMT技术是指将金属与塑胶以纳米技术结合的工艺技术,先将金属表面经过纳米化处理后使金属表面形成纳米级微孔,塑胶材料注塑后进入微孔与金属结合。NMT可以让金属与塑胶一体成型,不但能够兼顾金属外观质感,
也可以简化产品机构件设计。
ABS材料表面电镀制作工艺,适用于在ABS材料元件的表面形成多重金属层,首先形成一导电介质于元件的表面,接着以化学镀的方式,形成一化学金属层(如化学铜层或化学镍层)于塑料元件的表面,然后调整元件表面的材料特性,接着以电解电镀的方式,形成一电镀金属层(如电镀铝层、电镀镍层或电镀铬层)于化学金属层的表面。该制作工艺除可达到局部电镀的目的之外,其电镀金属层更具有高结构强度及高导电度,同时可使元件能保留其材质的原有特性。
化学镀也称无电解镀或者自催化镀,是在无外加电流的情况下借助合适的还原剂,使镀液中金属离子还原成金属,并沉积到零件表面的一种镀覆方法。化学镀是在金属的催化作用下,通过可控制的氧化还原反应产生金属的沉积过程。目前,化学镀已在电子、阀门制造、机械、石油化工、汽车、航空航天等工业中得到广泛的应用。一般的,化学镀处理可以是化学镀铜、化学镀镍、化学镀铬、化学镀锡、化学镀金或化学镀银等等,具体实施时根据实际需求来选择。
为了使本领域技术人员能够更清楚地理解本发明实施例提供的技术方案,下面通过具体的实施例进行详细说明:
本发明的实施例提供的电子设备外壳的加工方法,该电子设备外壳包括金属壳体以及用于隔断该金属壳体的隔断条,如图2所示,该方法包括:
步骤10、在该隔断条表面的预设区域形成预设金属层,其中,该隔断条表面除预设区域以外的区域为绝缘区。
具体的,该隔断条与金属壳体可以是通过模内注塑技术进行结合的、或该隔断条与金属壳体还可以是通过纳米成型技术NMT进行结合的、或该隔断条与金属壳体还可以是通过组装工艺进行结合的。
该隔断条的材料包括:可利用LDS加工的LDS材料、表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料、或者ABS材料。
示例性的,以该隔断条的材料为LDS材料或表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料为例,且化学镀处理选为化学镀铜,如图3所示,步骤10中的在该隔断条表面的预设区域形成预设金属层具体可以包括:
步骤101、对该隔断条表面的预设区域进行镭雕处理。
示例性的,对如图2所示的隔断条表面的预设区域进行激光镭雕处理,图2中预设区域以外的区域也即绝缘区的宽度为0.1~0.2mm,通过镭雕激活预设区域材料的化学镀功能。
需要说明的是,隔断条的形状可以是规则的线性、环形,也可以是其他不规则的图形,图2所示的隔断条的形状仅仅是示意性的,隔断条的形状具体由技术人员根据实际需求选择,本发明对此并不做限定。
步骤102、对镭雕处理后的预设区域进行化学镀铜,使得在预设区域对应的材料上形成铜层。
化学镀铜已经是现有的应用很成熟的技术,对镭雕处理后的预设区域进行化学镀铜具体为:通过甲醛还原铜反应,铜附着在镭雕处理后的预设区域表面,一般要求铜层厚度达到10um以上。需要特别说明的是,当该隔断条与金属壳体是通过模内注塑技术进行结合的或该隔断条与金属壳体是通过NMT进行结合的时,可以为电子设备外壳进行通电以阻止对金属壳体进行化学镀铜。当该隔断条与金属壳体是通过组装工艺进行结合的时,可以单独对隔断条进行处理,在对隔断条的预设区域化学镀铜时并不牵涉金属壳体。
步骤103、对镀有铜层的材料进行电镀处理,使得在铜层上形成预设金属层。
需要说明的是,一般的,金属壳体的金属材料一般为不锈钢或铝,如果金属壳体是不锈钢的,则金属壳体表面以及隔断条表面预设区域镀镍,镀镍后的效果与不锈钢喷砂后的效果很接近;如果金属壳体是铝的,那么预设金属层的金属材料也选为铝,通过电镀处理在铜层表面镀铝,一般要求铝厚度达到0.1mm以上。
值得一提的是,化学镀铜是自然沉积附着,表面粗糙,电镀则通过电流实现强制电子交换,镀层致密,可以实现光亮的表面效果。
最后,对预设区域电镀铝后形成的铝层与铝质的金属壳体进行喷砂或者阳极氧化处理以实现整体一致的金属化效果。
示例性的,图4a所示为隔断条的局部放大后的结构示意图,其中,隔断条表面除预设区域外有四条宽度0.1~0.2mm绝缘带,绝缘带仍是塑胶材料,用于隔断天线及主壳体,弱化天线耦合效应,达到等效于完全断开的效果,在实现外壳一体化金属效果的同时保证天线的性能。图4b为电
子设备外壳的局部放大后的结构示意图,其中,虚线部分为放大后的绝缘带。
另外,以该隔断条的材料为ABS材料为例,其中,假设金属壳体的金属材料为铝,预设金属层的金属材料也选为铝,且化学镀处理选为化学镀铜,如图5所示,步骤10中的在该隔断条表面的预设区域形成预设金属层具体可以包括:
步骤201、对该隔断条表面进行化学镀铜,使得在该隔断条表面形成铜层。
示例性的,参照上述对ABS材料表面电镀制作工艺的说明,为该隔断条表面完成镀铜。需要特别说明的是,当该隔断条与金属壳体是通过模内注塑技术进行结合的或该隔断条与金属壳体是通过NMT进行结合的时,可以为电子设备外壳进行通电以阻止对金属壳体进行化学镀铜。当该隔断条与金属壳体是通过组装工艺进行结合的时,可以单独对隔断条进行处理,在对隔断条的预设区域化学镀铜时并不牵涉金属壳体。
步骤202、对该隔断条表面附着的铜层进行电镀处理,使得在铜层上形成预设金属层。
示例性的,参照步骤103中的说明,为隔断条表面附着的铜层上镀铝。
步骤203、将该隔断条表面上覆盖在除预设区域以外的区域的预设金属层以及铜层去除。
具体的,可以利用镭雕去除该隔断条表面上覆盖在除预设区域以外的区域的预设金属层以及铜层。
需要说明的是,由于步骤202是对隔断条的表面全部镀铝,通过激光镭雕蒸发的方式去除掉该隔断条表面上覆盖在除预设区域以外的区域的铝层和铜层使该区域成为绝缘区。
最后,对预设区域电镀铝后形成的铝层与铝质的金属壳体进行喷砂或者阳极氧化处理以实现整体一致的金属化效果。
示例性的,图4a所示为隔断条的局部放大后的结构示意图,其中,隔断条表面除预设区域外有四条宽度0.1~0.2mm绝缘带,绝缘带仍是塑胶材料,用于隔断天线及主壳体,弱化天线耦合效应,达到等效于完全断开的效果,在实现外壳一体化金属效果的同时保证天线的性能。图4b为电
子设备外壳的局部放大后的结构示意图,其中,虚线部分为放大后的绝缘带。
本发明实施例提供的电子设备外壳的加工方法,在电子设备外壳的隔断条表面的预设区域形成预设金属层,该隔断条表面除预设区域以外的区域为绝缘区。通过本发明提供的方案,能够使得电子设备外壳的隔断条表面具有与金属壳体一致的金属化外观效果。
本发明实施例提供一种电子设备外壳,该电子设备外壳通过上述方法实施例提供的加工方法得到。本发明实施例提供的电子设备外壳的隔断条表面与金属壳体具有一致的金属化效果。
本发明实施例还提供一种电子设备,包括上述实施例提供的电子设备外壳,该电子设备外壳内部设置有该电子设备的电子元件。本发明实施例提供的电子设备的外壳的隔断条表面与金属壳体具有一致的金属化效果。
在本发明所提供的几个实施例中,应该理解到,所揭露的装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个***,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用硬件加软件功能单元的形式实现。
上述以软件功能单元的形式实现的集成的单元,可以存储在一个计算机可读取存储介质中。上述软件功能单元存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器,或者网络
设备等)或处理器(processor)执行本发明各个实施例所述方法的部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(Read-Only Memory,ROM)、随机存取存储器(Random Access Memory,RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
本领域技术人员可以清楚地了解到,为描述的方便和简洁,仅以上述各功能模块的划分进行举例说明,实际应用中,可以根据需要而将上述功能分配由不同的功能模块完成,即将装置的内部结构划分成不同的功能模块,以完成以上描述的全部或者部分功能。上述描述的装置的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。
本领域普通技术人员可以理解:实现上述方法实施例的全部或部分步骤可以通过程序指令相关的硬件来完成,前述的程序可以存储于一计算机可读取存储介质中,该程序在执行时,执行包括上述方法实施例的步骤;而前述的存储介质包括:ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
Claims (11)
- 一种电子设备外壳的加工方法,其特征在于,所述电子设备外壳包括金属壳体以及用于隔断所述金属壳体的隔断条,所述方法包括:在所述隔断条表面的预设区域形成预设金属层,其中,所述隔断条表面除所述预设区域以外的区域为绝缘区。
- 根据权利要求1所述的方法,其特征在于,所述隔断条与所述金属壳体是通过模内注塑技术进行结合的、或所述隔断条与所述金属壳体是通过纳米成型技术NMT进行结合的、或所述隔断条与所述金属壳体是通过组装工艺进行结合的。
- 根据权利要求2所述的方法,其特征在于,所述隔断条的材料包括:可利用激光直接成型技术LDS加工的LDS材料、表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料、或者丙烯腈-丁二烯-苯乙烯共聚物ABS材料。
- 根据权利要求3所述的方法,其特征在于,当所述隔断条的材料为所述LDS材料或所述表面印刷或喷涂有可镭雕激活的活化成分的塑胶材料时,所述在所述隔断条表面的预设区域形成预设金属层包括:对所述隔断条表面的预设区域进行镭雕处理;对镭雕处理后的所述预设区域进行化学镀处理,使得在所述预设区域对应的材料上形成金属层;对所述镀有金属层的材料进行电镀处理,使得在所述金属层上形成所述预设金属层。
- 根据权利要求3所述的方法,其特征在于,当所述隔断条的材料为所述ABS材料时,所述在所述隔断条表面的预设区域形成预设金属层包括:对所述隔断条表面进行化学镀处理,使得在所述隔断条表面形成金属层;对所述隔断条表面附着的金属层进行电镀处理,使得在所述金属层上形成所述预设金属层;将所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层去除。
- 根据权利要求4所述的方法,当所述隔断条与所述金属壳体是通过模内注塑技术进行结合的或所述隔断条与所述金属壳体是通过纳米成型技术 NMT进行结合的时,其特征在于,在所述对镭雕处理后的所述预设区域进行化学镀处理前,所述方法还包括:为所述电子设备外壳进行通电以阻止对所述金属壳体进行所述化学镀处理。
- 根据权利要求5所述的方法,当所述隔断条与所述金属壳体通过模内注塑技术结合或所述隔断条与所述金属壳体通过纳米成型技术NMT结合时,其特征在于,在所述对所述隔断条表面进行化学镀处理前,所述方法还包括:为所述电子设备外壳进行通电以阻止对所述金属壳体进行所述化学镀处理。
- 根据权利要求5所述的方法,其特征在于,所述将所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层去除包括:利用镭雕去除所述隔断条表面上覆盖在除所述预设区域以外的区域的所述预设金属层以及所述金属层。
- 根据权利要求1至8任一所述的方法,其特征在于,所述预设金属层的金属材料为铝或镍。
- 一种电子设备外壳,其特征在于,所述电子设备外壳采用如权利要求1至9任一所述的方法加工得到。
- 一种电子设备,其特征在于,包括如权利要求10所述的电子设备外壳,所述电子设备外壳内部设置有所述电子设备的电子元件。
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