WO2016107637A1

WO2016107637A1 - Masking arrangement for masking a substrate during a deposition process, deposition apparatus for layer deposition on a substrate, and method for cleaning a masking arrangement

Info

Publication number: WO2016107637A1
Application number: PCT/EP2014/079387
Authority: WO
Inventors: Andreas Sauer; Annabelle HOFMANN
Original assignee: Applied Materials, Inc.
Priority date: 2014-12-29
Filing date: 2014-12-29
Publication date: 2016-07-07
Also published as: TW201634717A; CN107109619A

Abstract

A masking arrangement (100) for masking a substrate (10) during a deposition process is provided. The masking arrangement (100) includes one or more surface areas (130) configured for exposure to a material deposition source during the deposition process, wherein the one or more surface areas (130) are at least partially coated with a solder (140).

Description

MASKING ARRANGEMENT FOR MASKING A SUBSTRATE DURING A DEPOSITION PROCESS, DEPOSITION APPARATUS FOR LAYER

DEPOSITION ON A SUBSTRATE, AND METHOD FOR CLEANING A

MASKING ARRANGEMENT

FIELD [0001] Embodiments of the present disclosure relate to a masking arrangement for masking a substrate during a deposition process, a deposition apparatus for layer deposition on a substrate, and a method for cleaning a masking arrangement. Embodiments of the present disclosure in particular relate to a masking arrangement for masking a substrate during a sputter process and a deposition apparatus for layer sputtering on a substrate.

BACKGROUND

[0002] Several methods are known for depositing a material on a substrate. For example, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, a thermal evaporation process etc. The process can be performed in a process apparatus or process chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials such as metals, and also oxides, nitrides or carbides thereof, may be used for deposition on the substrate. Further, other processing steps like etching, structuring, annealing, or the like can be conducted in processing chambers. Coated substrates can be used in several applications and in several technical fields. For example, an application lies in the field of electronics.

[0003] Substrates can be supported on carriers during processing thereof. A carrier can form a frame or a plate, which supports a surface of the substrate along the periphery thereof or, in the latter case, supports the surface as such. A masking arrangement for masking the substrate during processing can be attached to the carrier. One or more apertures can be provided in a mask of the masking arrangement, so that coating material can be deposited on a substrate portion that is exposed by the aperture.

[0004] Masking arrangements, or portions of masking arrangements, should be cleaned occasionally to remove coating material deposited thereon during the deposition process. Masking arrangements, or portions of masking arrangements, can for example be cleaned by sandblasting. During sandblasting, mechanical force or pressure is applied to the masking arrangement. This can lead to a bending or deformation of the masking arrangement or of portions of the masking arrangement, making the masking arrangement sometimes unusable. Also, when sandblasting is used for cleaning of the masking arrangement, recycling of the coating material removed from the masking arrangement can be challenging and expensive. Another cleaning method for removing coating material from the masking arrangement uses chemicals. Chemical cleaning is challenging or even impossible when precious metals are used as coating materials.

[0005] In view of the above, new masking arrangements for masking a substrate during a deposition process, deposition apparatuses for layer deposition on a substrate, and methods for cleaning a masking arrangement, that overcome at least some of the problems in the art, are beneficial. In particular, the present disclosure aims at providing new masking arrangements, deposition apparatuses, and methods for cleaning a masking arrangement, that reduce or even avoid deformation of at least portions of mask arrangements, such as a mask frame, during cleaning thereof.

SUMMARY

[0006] In light of the above, a masking arrangement for masking a substrate during a deposition process, a deposition apparatus for layer deposition on a substrate, and a method for cleaning a masking arrangement are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, a masking arrangement for masking a substrate during a deposition process is provided. The masking arrangement includes one or more surface areas configured for exposure to a material deposition source during the deposition process, wherein the one or more surface areas are at least partially coated with a solder.

[0008] According to another aspect of the present disclosure, a deposition apparatus for layer deposition on a substrate is provided. The deposition apparatus includes a processing chamber; one or more material deposition sources provided within the processing chamber; and a masking arrangement for masking the substrate, the masking arrangement including: one or more surface areas configured for exposure to the material deposition source during the deposition process, wherein the one or more surface areas are at least partially coated with a solder.

[0009] According to yet another aspect of the present disclosure, a method for cleaning a masking arrangement is provided. The method includes: heating one or more surface areas of the masking arrangement, wherein the one or more surface areas are at least partially coated with a solder, and wherein the one or more surface areas are at least partially covered with a material layer deposited on the one or more surface areas during a deposition process; and removing the material layer.

[0010] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing the described method aspects. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. It includes method aspects for carrying out the functions of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following: FIG. 1 shows a schematic view of a masking arrangement for masking a substrate during a deposition process according to embodiments described herein;

FIG. 2 shows a schematic view of a section of mask frame of a masking arrangement according to embodiments described herein;

FIG. 3 shows a cross-sectional view of a masking arrangement masking a substrate according to embodiments described herein; FIG. 4 shows a flow chart of method for cleaning a masking arrangement according to embodiments described herein;

FIG. 5A shows a cross-sectional view of a mask frame being coated with solder and having material layer thereon;

FIG. 5B shows a cross-sectional view of the mask frame of FIG. 5A during a cleaning process according to embodiments described herein; and

FIG. 6 shows a schematic view of a deposition apparatus for layer deposition on a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0013] FIG. 1 shows a schematic view of a masking arrangement 100 for masking a substrate during a deposition process according to embodiments described herein. FIG. 2 shows a schematic view of a section of mask frame 110 of the masking arrangement 100 according to embodiments described herein.

[0014] The masking arrangement 100 for masking the substrate during the deposition process includes one or more surface areas 130 configured for exposure to a material deposition source during the deposition process, wherein the one or more surface areas 130 are at least partially coated with a solder 140. The masking arrangement 100 of the present disclosure can also be referred to as "shield" or "coating shield".

[0015] According to some embodiments, the masking arrangement 100 includes a mask frame 110 and a mask 120. The mask frame 110 can be configured to support a surface of the substrate along a periphery thereof. The mask 120 can have a specific pattern, e.g., provided by a plurality of apertures such as openings or holes, so that coating material passes through the apertures to deposit a structured layer or film of the coating material on the substrate.

[0016] The one or more surface areas 130 are at least partially coated with the solder 140, e.g., a low temperature melting solder such as InSn. During the deposition process, at least a part of the one or more surface areas 130 can be exposed to the material deposition source, and coating material from the material deposition source is deposited on the one or more surface areas 130 to form a material layer. The solder 140 can provide a beneficial adhesion for the coating material and can avoid flaking. In a cleaning process, e.g., after a production run when a cleaning cycle is to be conducted, the coated parts can be heated in an oven or at a heating table to above a melting temperature of the solder 140. The material layer can for example be stripped away in one piece or removed with a spattle. This may depend on at least one of a type of the solder 140 and a thickness of the solder 140. [0017] The present disclosure provides a masking arrangement 100 that can be cleaned in a simple and efficient manner. The masking arrangement 100, or portions of the masking arrangement 100, can be reused, in particular since no mechanical pressure or force is applied during the cleaning process that would lead to a deformation or bending of the masking arrangement 100. The coating material can be recycled and reused. In view of this, the masking arrangement 100 of the present disclosure can be beneficial for coating applications where sensitive cleaning and cost-efficient recycling is performed.

[0018] The term "substrate" as used herein shall particularly embrace flexible substrates such as a web or a foil. However, the present disclosure is not limited thereto and the term "substrate" may also embrace inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.

[0019] The material deposition source can be configured to provide the coating material (e.g., by PVD, CVD, evaporation, sputtering, etc.) for deposition on the substrate. The coating material can be a precious metal, such as gold. The masking arrangement 100 can be positioned between the substrate and the material deposition source.

[0020] According to some embodiments, which can be combined with other embodiments described herein, the substrate and the mask arrangement 100 can be arranged in a vertical orientation during the deposition process. As used throughout the present disclosure, the term "vertical orientation" is understood to distinguish over "horizontal orientation". That is, the "vertical direction" or "vertical orientation" relates to a substantially vertical orientation e.g. of the mask arrangement 100 and the substrate, wherein a deviation of a few degrees, e.g. up to 10° or even up to 15°, from an exact vertical orientation is still considered as a "substantially vertical orientation". However, the present disclosure is not limited to a vertical orientation of the substrate and the mask arrangement 100 as described above. As an example, the material deposition source could be arranged above the substrate, i.e., the material deposition source and the substrate could be positioned in a horizontal arrangement. The deposition process, e.g., sputtering, could then be performed from top to bottom. In such a case, the term "vertical orientation" could for example refer to a main direction of a movement of the coating material. [0021] According to some embodiments, which can be combined with other embodiments described herein, the one or more surface areas 130 can at least partially be coated with a layer of the solder 140 ("solder layer"). The solder layer can be a thin solder layer. As an example the solder layer can have a thickness in a range of 0.01 mm to 1 mm, specifically in a range of 0.01 to 0.1 mm, and more specifically in a range of 0.02 to 0.05 mm.

[0022] The solder 140 according to the embodiments described herein can have a wettability that is beneficial with respect to a material of the one or more surface areas, such as copper or a copper alloy. The solder 140 can be malleable. In some implementations, the solder 140 can be configured for compensating thermal expansion differences, e.g., of a mask frame providing the one or more surface areas. The solder 140 can have a low vapor pressure.

[0023] According to some embodiments, which can be combined with other embodiments described herein, the solder 140 is soft solder. As an example, the soft solder can be a low temperature melting solder. The term "soft solder" as used throughout this application can be used to distinguish the solder 140 of the present disclosure from hard solder.

[0024] In some implementations, the solder 140 includes a metal alloy, in particular a fusible metal alloy. According to some implementations, the solder includes InSn, in particular InsoSnso. InsoSnso can be beneficial in terms of wettability.

[0025] According to some embodiments, the solder 140 has the melting point in a range of 90 to 450°C, specifically in a range of 90 to 200°C, and more specifically in a range of 90 to 160°C. In some implementations, a temperature of the melting point of the solder 140 is less than a temperature of a melting point of the coating material provided by the material deposition source. This allows for removing of the material layer of the coating material e.g. in one piece, since during a cleaning process only the solder 140 melts, but not the coating material.

[0026] According to some embodiments, which can be combined with other embodiments described herein, the masking arrangement 100 includes the mask frame 110. The mask frame 110 can be made of cooper or a copper alloy, or can be covered or coated with cooper or a copper alloy. In some implementations, the masking arrangement 100 can include the mask 120 configured for masking the substrate during a deposition process. As an example, the mask 120 can be connected to the mask frame 110 by at least one of clamping, welding, and a magnetically attachment.

[0027] In some implementations, the one or more surface areas 130 are provided by at least one of the mask frame 110 and the mask 120. As an example, at least one of the one or more surface areas 130 is provided by at least a part of the mask frame 110 and/or by at least a part of the mask 120. [0028] In some embodiments, the mask frame 110 includes one or more mask frame elements, wherein at least one surface area of the one or more surface areas 130 is provided by at least one of the one or more mask frame elements. The one or more frame elements can include a first frame element 111, a second frame element 112, a third frame element 113, and a fourth frame element 114. As an example, the first frame element 111 and the third frame element 113 can be referred to as top bar and bottom bar, respectively. The first frame element 111 and the third frame element 113 can also be referred to as horizontal frame elements. The second frame element 112 and the fourth frame element 114 can be referred to as sidebars or vertical frame elements. In some embodiments, the first frame element 111 and the third frame element 113 are arranged in parallel, and/or the second frame element 112 and the fourth frame element 114 are arranged in parallel.

[0029] According to some embodiments, which can be combined with other embodiments described herein, the one or more frame elements may define an aperture opening configured for accommodating the mask 120. The one or more frame elements can provide a mask support surface configured for supporting the mask 120. In some implementations, the one or more frame elements can be separate elements that are connectable to form the mask frame 110, or can be integrally formed. In some embodiments, the mask frame 110 can have a substantially rectangular shape.

[0030] The one or more surface areas 130 can be portions of a surface of the masking arrangement 100, such as portions of at least one of a surface of the mask frame 110 and a surface of the mask 120. As an example, the one or more surface areas 130 can be provided at a front side of the mask frame 110, and in particular at a front side of at least one of the first frame element 111, the second frame element 112, the third frame element 113, and the fourth frame element 114. The front side of the of the mask frame 110 can be a surface that is facing towards the material deposition source during the deposition process.

[0031] According to some embodiments, which can be combined with other embodiments described herein, at least a portion of the mask frame 110, e.g., of the front side of the mask frame 110, can be coated with the solder 140 to form or provide the one or more surface areas 130. As an example, at least 50%, specifically at least 80%, and more specifically about 100% of the front side of the mask frame 110 can be coated with the solder 140. In some implementations, substantially the entire front side of the mask frame 110 is coated with the solder 140 to form or provide the one or more surface areas 130.

[0032] According to some embodiments, the one or more surface areas 130 are provided by the mask frame 110. As an example, portions of the mask frame 110 are coated with solder, and the mask 120 does not have any coated portions. The mask frame 110 can then be cleaned and reused, wherein the mask 120 can for example be replaced by a new mask.

[0033] FIG. 3 shows a cross-sectional view of a masking arrangement 100 masking a substrate 10 according to embodiments described herein.

[0034] The mask 120 is positioned at a distance from the substrate 10 to mask or shield the substrate 10. The mask 120 is shown having apertures 122. For some applications, the structures on the substrate 10 formed by the coating material should have sharp features, such as sharp edges. Sharp features can for example provide for improved electrical characteristics of the structures formed on the substrate 10. For providing sharp features, the mask 120 should be positioned close to the substrate 10, e.g., at a distance of less than 5 mm, specifically of less than 1 mm, and more specifically of less than, or about, 0.3 mm. When the mask frame 110 and/or the mask 120 are cleaned by sandblasting, deformations of the mask frame 110 and/or the mask 120 can occur. A close positioning of the mask 120 with respect to the substrate 10 could not be possible anymore after cleaning, and/or the distance between the mask 120 and substrate 10 could vary and be not uniform over the substrate width and/or length. [0035] By the masking arrangement 100 of the present disclosure, a deformation of the mask frame 110 and/or the mask 120 during a cleaning process can be reduced or even avoided, and a close positioning of the mask 120 with respect to the substrate 10 is possible. The structures on the substrate 10 can be formed with sharp features, such as sharp edges, and improved electrical characteristics of the formed structures can be achieved.

[0036] FIG. 4 shows a flow chart of method 400 for cleaning a masking arrangement according to embodiments described herein. FIG. 5A shows a cross-sectional view of a mask frame 110 being coated with solder 140 and having a material layer 150 thereon. FIG. 5B shows a cross-sectional view of the mask frame 110 of FIG. 5A during a cleaning process according to embodiments described herein.

[0037] The method 400 includes: heating one or more surface areas of the masking arrangement (block 410), wherein the one or more surface areas are at least partially coated with a solder 140, and wherein the one or more surface areas are at least partially covered with a material layer 150 deposited on the one or more surface areas during a deposition process; and removing the material layer 150 (block 420). In some embodiments, a material of the material layer 150 includes a precious metal, in particular gold. In other words, the coating material provided by the material deposition source can be a precious metal, e.g., gold. [0038] In some implementations, heating the one or more surface areas includes heating the one or more surface areas (indicated with reference numeral 200 in FIG. 5B) to a temperature in a range of a range of 90 to 450°C, specifically in a range of 90 to 200°C, and more specifically to about 160°. The one or more surface areas can for example be heated to above a melting temperature of the solder 140. The material layer 150 can for example be stripped away in one piece or removed with a spattle (indicated with reference numeral 210 in FIG. 5B). This may depend on at least one of a type of the solder 140 and a thickness of the solder 140.

[0039] According to some embodiments, which can be combined with other embodiments described herein, heating of the one or more surface areas can be done using an oven or a heating table. As an example, the mask frame 110 can be placed on the heating table to heat the mask frame 110 to melt the solder 140. When the solder 140 has melted, the material layer 150 can be removed.

[0040] According to some embodiments, the method 400 includes coating the one or more surface areas with solder after having removed the material layer (block 430). This can be beneficial when at least some of the solder has been removed together with the material layer 150.

[0041] According to embodiments described herein, the method 400 for cleaning the masking arrangement can be conducted by means of computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output means being in communication with the corresponding components of the apparatus for processing a large area substrate.

[0042] FIG. 6 shows a schematic view of a deposition apparatus 600 for layer deposition on a substrate 10 according to embodiments described herein. According to some embodiments, the deposition apparatus is configured for sputter deposition. [0043] The deposition apparatus includes a processing chamber 612; one or more material deposition sources 630 provided within the processing chamber; and a masking arrangement 610 for masking the substrate 10, the masking arrangement 610 including: one or more surface areas configured for exposure to the material deposition source 630 during the deposition process, wherein the one or more surface areas are at least partially coated with a solder. The processing chamber 612 can be a vacuum processing chamber. The mask arrangement 610 can be configured according to the embodiments described herein.

[0044] The processing chamber 612 is adapted for a deposition process, such as a thermal evaporation process, a PVD process, a CVD process, a sputter process, etc. The substrate 10 is shown being located within or at a holding arrangement or carrier 605 on a substrate transport device 620. The material deposition source 630 is provided in the processing chamber 612 facing the side of the substrate 10 to be coated. The material deposition source 630 provides the coating material to be deposited on the substrate 10. [0045] The material deposition source 630 may be a target with the coating material thereon or any other arrangement allowing coating material to be released for deposition on substrate 10. In some embodiments, the material deposition source 630 may be a rotatable target. According to some embodiments, the material deposition source 630 may be movable in order to position and/or replace the material deposition source 630. According to other embodiments, the material deposition source 630 may be a planar target. Dashed lines 665 show exemplarily the path of the coating material during operation of the processing chamber 612.

[0046] According to some embodiments, the deposition material may be chosen according to the deposition process and the later application of the coated substrate. As an example, the deposition material can be a metal, in particular a precious metal. For instance, the coating material of the material deposition source 630 may be gold.

[0047] The present disclosure provides a masking arrangement that can be cleaned in a simple and efficient manner. The masking arrangement or portions of the masking arrangement can be reused, in particular since no mechanical pressure or force is applied during the cleaning process. The coating material, which can be expensive (e.g., gold), can be recycled and reused. In view of this, the masking arrangement can be beneficial for coating applications where sensitive cleaning and cost-efficient recycling is performed.

[0048] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A masking arrangement for masking a substrate during a deposition process, the masking arrangement comprising: one or more surface areas configured for exposure to a material deposition source during the deposition process, wherein the one or more surface areas are at least partially coated with a solder.

2. The masking arrangement of claim 1, wherein the solder is soft solder.

3. The masking arrangement of claim 1 or 2, wherein the solder includes a metal alloy, in particular a fusible metal alloy.

4. The masking arrangement of one of claim 1 to 3, wherein the solder includes InSn, in particular InsoSnso.

5. The masking arrangement of one of claims 1 to 4, wherein the solder has a melting point in a range of 90 to 450°C, specifically in a range of 90 to 200°C, and more specifically in a range of 90 to 160°C.

6. The masking arrangement of one of claims 1 to 5, wherein a temperature of a melting point of the solder is less than a temperature of a melting point of a coating material provided by the material deposition source.

7. The masking arrangement of one of claims 1 to 6, including a mask frame having one or more mask frame elements, wherein at least one surface area of the one or more surface areas is provided by at least one of the one or more mask frame elements.

8. The masking arrangement of one of claims 1 to 7, including a mask configured for masking the substrate during a deposition process.

9. The masking arrangement of claim 8, wherein at least one of the one or more surface areas is provided by at least a part of the mask.

10. Deposition apparatus for layer deposition on a substrate, comprising: a processing chamber; one or more material deposition sources provided within the processing chamber; and a masking arrangement for masking the substrate, the masking arrangement including: one or more surface areas configured for exposure to the material deposition source during the deposition process, wherein the one or more surface areas are at least partially coated with a solder.

11. The deposition apparatus of claim 10, wherein the deposition apparatus is configured for sputter deposition.

A method for cleaning a masking arrangement, comprising: heating one or more surface areas of the masking arrangement, wherein the one or more surface areas are at least partially coated with a solder, and wherein the one or more surface areas are at least partially covered with a material layer deposited on the one or more surface areas during a deposition process; and removing the material layer.

13. The method of claim 12, wherein heating the one or more surface areas includes: heating the one or more surface areas to a temperature in a range of 90 to 450°C, specifically in a range of 90 to 200°C, and more specifically to about 160°.

14. The method of claim 12 or 13, including: coating the one or more surface areas with solder after having removed the material layer.

15. The method of one of claims 12 to 14, wherein a material of the material layer includes a precious metal, in particular gold.