WO2016101694A1 - Matériau de substrat métallique traité en surface, composite métal-résine, procédé de fabrication et application de celui-ci, enveloppe externe de produit électronique et son procédé de fabrication - Google Patents

Matériau de substrat métallique traité en surface, composite métal-résine, procédé de fabrication et application de celui-ci, enveloppe externe de produit électronique et son procédé de fabrication Download PDF

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Publication number
WO2016101694A1
WO2016101694A1 PCT/CN2015/092725 CN2015092725W WO2016101694A1 WO 2016101694 A1 WO2016101694 A1 WO 2016101694A1 CN 2015092725 W CN2015092725 W CN 2015092725W WO 2016101694 A1 WO2016101694 A1 WO 2016101694A1
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WIPO (PCT)
Prior art keywords
etching
metal substrate
water
soluble
range
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PCT/CN2015/092725
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English (en)
Chinese (zh)
Inventor
孙剑
吴彦琴
宋文广
陈梁
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比亚迪股份有限公司
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Publication of WO2016101694A1 publication Critical patent/WO2016101694A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon

Definitions

  • the present disclosure relates to a surface-treated metal substrate and a preparation method and application thereof, and in particular to a metal-resin composite, a preparation method and application thereof, and an electronic product casing and a preparation method thereof.
  • a commonly used method of combining aluminum or an aluminum alloy with a resin is a gluing technique.
  • the method combines aluminum or an aluminum alloy with a formed resin by a chemical adhesive to obtain a composite.
  • the bonding strength of aluminum or aluminum alloy to the resin is poor, and the adhesive bonding layer is not resistant to acid and alkali, which affects the use of the composite.
  • the adhesive bonding layer has a certain thickness, it affects the size of the final product.
  • One method is to surface-etch aluminum or aluminum alloy with an amine substance such as an aqueous solution of urethane, hydrazine monohydrate or ethylenediamine to form nano-scale micropores on the surface of aluminum or aluminum alloy, and The amine substance is retained in the formed micropores, and then the resin is injection molded on the treated surface, and the resin is combined with the aluminum or the aluminum alloy by a reaction between the amine substance and the resin, thereby obtaining a certain stretching.
  • Aluminium-plastic integrated product with shear strength is to surface-etch aluminum or aluminum alloy with an amine substance such as an aqueous solution of urethane, hydrazine monohydrate or ethylenediamine to form nano-scale micropores on the surface of aluminum or aluminum alloy.
  • the aluminum or aluminum alloy is etched by using the above amine substances, and the pores formed on the surface of the aluminum or aluminum alloy are too small, and the resin is difficult to be directly injected into the micropores of the nanometer order, so that it is difficult to significantly improve the bonding strength between the aluminum alloy and the resin. .
  • Another method is to directly corrode the surface of the aluminum alloy with an acidic etching solution containing an inorganic halogen compound, and then inject the resin to obtain an aluminum-plastic integrated product.
  • an acidic etching solution containing an inorganic halogen compound containing an inorganic halogen compound
  • inject the resin to obtain an aluminum-plastic integrated product.
  • the aluminum-plastic integrated product obtained by this method the bonding strength between the aluminum alloy and the resin still needs to be further improved.
  • an anodizing may be performed on the surface of the aluminum alloy to form a porous aluminum oxide film layer on the surface of the aluminum alloy, and then the resin is injection molded on the surface having the aluminum oxide film layer to obtain an aluminum-plastic integrated product.
  • the method obtained by this method In the aluminum-plastic integrated product, the bonding strength between the aluminum alloy and the resin is not high.
  • the purpose of the present disclosure is to overcome the technical problem that the bonding strength between the metal substrate and the resin layer is not high in the conventional metal-resin composite.
  • the present disclosure provides a surface-treated metal substrate, the metal being aluminum or an aluminum alloy, the metal substrate comprising a metal substrate and being formed on at least a portion of a surface of the metal substrate A hard anodized film layer having a first etching hole distributed on the surface of the hard anodized film layer.
  • the present disclosure provides a surface treatment method of a metal substrate, the metal being aluminum or an aluminum alloy, the method comprising providing a metal substrate including a metal substrate and forming a hard anodized film layer on at least a portion of the surface of the metal substrate; the metal substrate is subjected to a first etching to form a first etching hole in the hard anodized film layer.
  • the present disclosure provides a surface treated metal substrate prepared by the method according to the second aspect of the present disclosure.
  • the present disclosure provides a metal-resin composite, the metal being aluminum or an aluminum alloy, the composite comprising a metal substrate and a resin layer, the metal substrate being provided for the present disclosure a surface-treated metal substrate, the resin layer being attached to at least a portion of a surface of the metal substrate, a portion of the resin in the resin layer extending downward and filling a first etching hole of the metal substrate or A corrosion hole and a second corrosion hole.
  • the present disclosure provides a method of producing a metal-resin composite, the metal being aluminum or an aluminum alloy, the metal-resin composite including a metal substrate and attached to the metal a resin layer of at least a portion of a surface of the substrate, the metal substrate being a surface treated metal substrate provided by the present disclosure, the method comprising injecting a resin-containing composition onto at least a portion of a surface of the metal substrate and causing a partial composition
  • the first etching hole or the first etching hole and the second etching hole are filled in the metal substrate, and a resin layer is formed after molding.
  • the present disclosure provides a metal-resin composite prepared by the method according to the fifth aspect of the present disclosure.
  • the present disclosure provides an application of a metal-resin composite according to the present disclosure in preparing an electronic product casing.
  • the present disclosure provides an electronic product housing including a metal shell body and at least one resin member attached to at least a portion of an inner surface and/or at least a portion of an outer surface of the metal shell body Wherein the metal shell body is a metal substrate according to the present disclosure.
  • the present disclosure provides a method of fabricating an electronic product housing, the method comprising At least one resin member is formed on at least a portion of the inner surface and/or at least a portion of the outer surface of the metal shell body, wherein the resin member is formed using the method of preparing the metal-resin composite according to the present disclosure.
  • the bonding strength between the resin and the metal substrate is high, and the resin layer is not easily peeled off from the surface of the metal substrate, and thus the metal-resin composite provided by the present disclosure has high structural stability. It can meet the requirements of applications requiring high structural stability, for example, as an outer casing for various electronic products.
  • FIG. 1 is a cross-sectional view for schematically illustrating a cellular phone case according to the present disclosure, including a front view and a top view;
  • FIG. 2 is a cross-sectional view for schematically illustrating a smart watch case in accordance with the present disclosure.
  • the metal may be pure aluminum or aluminum alloy.
  • the aluminum alloy refers to an alloy formed by adding other elements to aluminum as a base element, and may be various common aluminum alloys.
  • the metal substrate is various molded bodies formed of aluminum or an aluminum alloy, and may have various shapes depending on specific use requirements.
  • the present disclosure provides a surface treated metal substrate, the metal being aluminum or an aluminum alloy, the metal substrate comprising a metal substrate and at least a portion of a surface formed on the metal substrate A hard anodized film layer having a first etching hole distributed on the surface of the hard anodized film layer.
  • the first etching hole may be used to accommodate a resin to anchor the resin to the surface of the metal substrate.
  • the bonding strength between the resin and the metal substrate can be increased by selecting the size of the first etching hole.
  • the pore diameter of the first etching hole may be in the range of 10 to 200 nm.
  • the pore diameter of the first etching hole is within the above range, on the one hand, it does not adversely affect the strength of the hard anodized film layer itself, and on the other hand, when used for preparing the metal-resin composite body, The resin layer is firmly anchored in the metal substrate to have a high bonding strength between the resin layer and the metal substrate, thereby making the metal-resin composite have high structural stability.
  • the pore diameter of the first etching hole It may be in the range of 50-200 nm, for example in the range of 80-200 nm, such as in the range of 100-200 nm.
  • the term "within the range of" includes the two end values.
  • the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer may be in the range of 0.1 to 1:1, for example, in the range of 0.2 to 1:1, such as 0.5 to 1:1. In the range.
  • the ratio of the depth of at least a portion of the first etching holes to the thickness of the hard anodized film layer is 1:1, such as at least 50%, at least 60%, at least 70% of the first
  • the ratio of the depth of a corrosion hole to the thickness of the hard anodized film layer is 1:1.
  • the pore diameter of the etching hole refers to the maximum dimension of the upper port of the etching hole (that is, the port located at the surface) in the radial direction
  • the depth of the etching hole refers to the vertical distance between the both ends of a corrosion hole.
  • the pore size and depth of the corrosion hole can be determined by electron microscopy.
  • the surface of the metal substrate may be free from corrosion holes.
  • the metal substrate comprises a base layer and an etching layer, the base layer and the etching layer are integrated, and the etching layer is in contact with the hard anodized film layer and is an integral structure.
  • the surface of the etching layer is distributed with a second etching hole, and a ratio of a depth of at least a portion of the first etching hole to a thickness of the hard anodized film layer is 1:1.
  • first etching holes the etching holes distributed on the surface of the hard anodized film layer
  • second corrosion hole the etching holes distributed on the surface of the metal substrate which is in contact with the hard anodized film layer It is called "second corrosion hole”.
  • the base layer is a dense layer. That is, there are no corrosion holes in the base layer.
  • the pore diameter of the second etching hole may be in the range of 200-2000 nm, for example, in the range of 400-2000 nm, such as in the range of 800-1500 nm, such as in the range of 1000-1500 nm.
  • the depth of the second etching hole is in the range of 0.1 to 500 ⁇ m, for example, in the range of 10 to 400 ⁇ m, such as in the range of 50 to 200 ⁇ m.
  • the ratio of the depth of at least a portion of the first etching holes to the thickness of the hard anodized film layer is 1:1, such as at least 50%, at least 60%, at least 70% of the first corrosion.
  • the ratio of the depth of the hole to the thickness of the hard anodized film layer was 1:1.
  • the pore size of the first etching hole is as described above, and will not be described in detail herein.
  • the hard anodized film layer has a high hardness, and its microhardness is generally 2000-2500 HV, and the metal substrate is used for bonding with a resin to prepare a metal-resin.
  • the resin can be more firmly fixed to the metal substrate than the surface of the metal substrate as the anodized film layer, thereby achieving higher bonding strength.
  • the thickness of the hard anodized film layer is not particularly limited in the present disclosure.
  • the thickness of the hard anodized film layer may be in the range of 0.1 to 500 ⁇ m, for example, in the range of 1 to 200 ⁇ m, such as in the range of 5 to 100 ⁇ m, such as in the range of 10 to 50 ⁇ m.
  • the hard anodized film layer is not sealed.
  • the present disclosure provides a surface treatment method of a metal substrate, the metal being aluminum or an aluminum alloy, the method comprising providing a metal substrate including a metal substrate and forming a hard anodized film layer on at least a portion of the surface of the metal substrate.
  • a portion means part or all.
  • the metal substrate can be hard anodized by various methods commonly used to obtain a hard oxidation surface.
  • the metal substrate of the film layer. Specifically, the metal substrate may be placed in an electrolyte under hard anodizing conditions, the metal substrate is used as an anode, and a conductive material that does not react with the electrolyte is used as a cathode, and the cathode and the anode are respectively connected to a power source.
  • the positive electrode and the negative electrode are electrically connected, and after energization, electrolysis is performed to form a hard anodized film on the metal substrate.
  • the electrolyte in the electrolytic solution may be one or more selected from the group consisting of sulfuric acid, oxalic acid, formic acid, and citric acid.
  • the conditions of the hard anodization may be selected according to the thickness of the intended hard anodized film layer.
  • the hard anodization allows the formed hard anodized film layer to have a thickness of 0.1 to 500 ⁇ m, for example, 1 to 200 ⁇ m, such as 10 to 100 ⁇ m, such as 15 to 50 ⁇ m.
  • the voltage may be 10-100 V, for example 40-80 V; the temperature of the electrolyte may be 0-60 ° C, for example 0-10 ° C.
  • the time of electrolysis can be selected according to specific electrolysis conditions, so that the thickness of the formed hard anodized film layer can meet the requirements. Generally, the electrolysis time can be 1-60 minutes, for example, 10-30. minute.
  • the metal substrate is optionally pretreated by various methods commonly used in the art prior to hard anodization. Generally, the pretreatment includes mechanical grinding or grinding to remove foreign matter on the surface of the metal substrate, and then the metal substrate is sequentially degreased and cleaned to remove grease from the surface of the metal substrate.
  • the method according to the present disclosure further includes subjecting the metal substrate to a first etching to form a first etching hole in the hard anodized film layer.
  • the first etching may cause the pore diameter of the first etching hole to be in the range of 10 to 200 nm, for example, in the range of 50 to 200 nm, such as in the range of 80 to 200 nm, such as in the range of 100 to 200 nm;
  • the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer may be in the range of 0.1 to 1:1, for example, in the range of 0.2 to 1:1, such as 0.5 to 1:1.
  • the ratio of the depth of at least a portion of the first etching hole to the thickness of the hard anodized film layer is 1:1, for example, 50% or more, such as 60% or more, such as at least 70% or more of the first etching hole
  • the ratio of the depth to the thickness of the hard anodized film layer is 1:1.
  • the metal substrate may be subjected to a first etching by various conventional methods to form a first etching hole in the hard anodized film layer.
  • the first etching includes: immersing the metal substrate in an alkaline etching solution to form a first etching hole in the hard anodized film layer.
  • the alkaline etching solution may be a common etching liquid capable of etching a hard anodized film layer.
  • the etching solution is one or a combination of the following two etching liquids.
  • the metal substrate can be etched by using one or a combination of the following two etching liquids, and a better etching effect can be obtained.
  • the two etching solutions will be separately described below.
  • the alkaline etching solution is one containing an anthracene derivative selected from the group consisting of water-soluble hydroxides, water-soluble basic salts, ammonia, water-soluble amines, hydrazine, and one or more hydrogen atoms substituted by a hydrocarbon group.
  • the water-soluble hydroxide may be an alkali metal hydroxide, and may be sodium hydroxide and/or potassium hydroxide, for example Sodium hydroxide.
  • the water-soluble basic salt refers to a water-soluble basic salt whose aqueous solution has a pH of more than 7.
  • the water-soluble basic salt may be a water-soluble carbonate, a water-soluble hydrogencarbonate, a water-soluble phosphate, a water-soluble monohydrogen phosphate, a water-soluble dihydrogen phosphate, and a water-soluble borate.
  • the water-soluble basic salt may be an alkali metal salt such as a sodium salt or a potassium salt such as a sodium salt.
  • the water-soluble basic salt is one or more of Na 2 CO 3 , NaHCO 3 , NaH 2 PO 4 , Na 2 HPO 4 , Na 3 PO 4 and Na 2 B 4 O 7 .
  • the water-soluble amine may be a common variety of amines which are soluble in water.
  • the water-soluble amine is one or more of ethylenediamine, diethylamine, ethanolamine, trimethylamine, methylamine, and dimethylamine.
  • the anthracene derivative refers to a compound in which one or more hydrogen atoms in the molecular structure of hydrazine (ie, H 2 N—NH 2 ) are substituted by a hydrocarbon group, and the hydrocarbon group may be a C 1 -C 4 alkyl group, specifically It may be monomethyl hydrazine and/or 1,1-dimethyl hydrazine.
  • the alkaline etching solution may be an aqueous solution containing a water-soluble hydroxide and/or a water-soluble basic salt.
  • the alkaline etchant is an aqueous solution containing a water-soluble basic salt, such as Na 2 CO 3 and/or NaHCO 3 , such as Na 2 CO 3 or NaHCO 3 .
  • the pH of the alkaline etching solution can be any pH of the alkaline etching solution.
  • the alkaline etching solution is an alkaline buffer solution, so that the finally formed corrosion holes are more evenly distributed and the pore size is more concentrated.
  • the alkaline etching solution may be an aqueous solution containing a water-soluble hydroxide and a water-soluble basic salt.
  • the cations of the water-soluble hydroxide and the water-soluble basic salt may be the same or different, for example, the same.
  • the water soluble hydroxide may be an alkali metal hydroxide, which may be sodium hydroxide and/or potassium hydroxide, such as sodium hydroxide.
  • the water-soluble basic salt may be one of a water-soluble carbonate, a water-soluble hydrogencarbonate, a water-soluble phosphate, a water-soluble monohydrogen phosphate, a water-soluble dihydrogen phosphate, and a water-soluble borate or Two or more.
  • the water-soluble basic salt may be an alkali metal salt such as a sodium salt or a potassium salt such as a sodium salt.
  • the water-soluble basic salt is one or more of Na 2 CO 3 , NaHCO 3 , NaH 2 PO 4 , Na 2 HPO 4 , Na 3 PO 4 and Na 2 B 4 O 7 .
  • the water-soluble basic salt is a water-soluble monohydrogen phosphate and/or a water-soluble dihydrogen phosphate.
  • the water-soluble basic salt is a water-soluble dihydrogen phosphate such as one or more of sodium dihydrogen phosphate, potassium dihydrogen phosphate, ammonium dihydrogen phosphate, and dihydrogen aluminum phosphate.
  • the alkaline etching solution may also be an aqueous solution containing a water-soluble normal salt and a water-soluble acid salt.
  • the normal salt refers to a salt in which a cation contains only a metal ion and/or an ammonium ion
  • the acid salt refers to a salt containing a hydrogen ion in addition to a metal ion and/or an ammonium ion.
  • the water-soluble normal salt and the cation and acid ion of the water-soluble acid salt Each may be the same or different, for example the same.
  • the alkaline etching solution may be an aqueous solution containing a water-soluble carbonate and a water-soluble hydrogencarbonate, or an aqueous solution containing a water-soluble phosphate and a water-soluble monohydrogen phosphate.
  • the alkaline etching solution may be an aqueous solution containing Na 2 CO 3 and NaHCO 3 or an aqueous solution containing Na 3 PO 4 and Na 2 HPO 4 .
  • the alkaline etching solution may also be an aqueous solution containing ammonia and a water-soluble ammonium salt.
  • the water-soluble ammonium salt may be one or more of NH 4 Cl, (NH 4 ) 2 SO 4 , NH 4 HCO 3 and NH 4 NO 3 .
  • the alkaline etching solution may be an aqueous solution containing NH 3 and NH 4 Cl, an aqueous solution containing NH 3 and (NH 4 ) 2 SO 4 , an aqueous solution containing NH 3 and NH 4 HCO 3 or containing NH 3 and An aqueous solution of NH 4 NO 3 .
  • the alkaline etching solution may be an aqueous solution containing a water-soluble hydroxide and a water-soluble basic salt, or an aqueous solution containing a water-soluble normal salt and a water-soluble acid salt, for example, containing a water-soluble normal salt and a water-soluble acid.
  • An aqueous solution of a salt may be an aqueous solution containing a water-soluble hydroxide and a water-soluble basic salt, or an aqueous solution containing a water-soluble normal salt and a water-soluble acid salt, for example, containing a water-soluble normal salt and a water-soluble acid.
  • the alkaline etching solution may be an alkaline buffer solution having a pH of 10-13, so that a suitable etching rate can be obtained, and the etching process is gentle and easy to control.
  • the temperature of the alkaline etching solution may be 10-60 ° C, for example, 20-40 ° C; the first etching time may be 1-60 minutes, for example, 5-20 minutes.
  • the metal substrate in which the first etching hole is formed in the hard anodized film layer by the first etching can be directly formed as a surface-treated metal substrate and integrally molded with the resin to prepare a metal-resin composite.
  • the first etched metal substrate is subjected to a second etch to form a second etched hole on the surface of the metal substrate that is in contact with the hard anodized film layer.
  • a second etch to form a second etched hole on the surface of the metal substrate that is in contact with the hard anodized film layer.
  • the second etching may cause the second etching hole to have a pore diameter in the range of 200 to 2000 nm, for example, in the range of 400 to 2000 nm, such as in the range of 800 to 1500 nm, such as in the range of 1000 to 1500 nm.
  • the second etching makes the The depth of the second etching hole may be in the range of 0.1 to 500 ⁇ m, for example, in the range of 10 to 400 ⁇ m, such as in the range of 50 to 200 ⁇ m.
  • the second etching comprises: immersing the first etched metal substrate in an acidic etchant.
  • the acidic etching solution is an aqueous solution containing an acid which is a hydrohalic acid and/or H 3 PO 4 , such as HCl or H 3 PO 4 .
  • the acidic etching solution further contains one or two or more water-soluble salts, which can further improve the stability of etching.
  • the acid salt of the water-soluble salt may be the same as the acid group of the acid contained in the acidic etching solution.
  • the acidic etching solution when the acidic etching solution is an aqueous solution containing a halogen acid, the acidic etching solution may further contain one or more water-soluble hydrohalic acid salts; when the acidic etching liquid is an aqueous solution containing phosphoric acid,
  • the acidic etching solution for example, also contains one or more water soluble phosphate salts.
  • the water-soluble salt may be one or more selected from the group consisting of NaCl, KCl, and AlCl 3 .
  • the acidic etching solution is phosphoric acid
  • the water-soluble salt is one or more of a water-soluble phosphate, a water-soluble monohydrogen phosphate and a water-soluble dihydrogen salt, such as NaH 2 PO 4 , Na 2 .
  • HPO 4 , Na 3 PO 4 , KH 2 PO 4 , K 2 HPO 4 and K 3 PO 4 is one or more of HPO 4 , Na 3 PO 4 , KH 2 PO 4 , K 2 HPO 4 and K 3 PO 4 .
  • the content of the water-soluble salt in the acidic etching solution depends on the amount of acid in the acidic etching solution.
  • the molar ratio of the water soluble salt to the acid may range from 0.1 to 1:1, such as from 0.2 to 0.8:1, such as from 0.4 to 0.6:1.
  • the acidic etching solution may have a pH of 1-3, and the surface-treated metal substrate thus formed has a more uniform distribution of corrosion holes and a more concentrated pore size distribution, and the metal-resin prepared from the metal substrate.
  • the bonding strength of the resin to the metal substrate in the composite is higher.
  • the temperature of the acidic etching solution may be 20-30 ° C
  • the soaking time of the metal substrate in the acidic etching solution may be 1-60 minutes, for example, 10-30 minutes.
  • the metal substrate is immersed in an alkaline etchant in the first etch; and the first etched metal base is etched in the second etch
  • the material is immersed in an acidic etching solution. Etching is performed in this way, the etching exotherm is small during the etching process, the etching process is gentle and easy to control, the distribution of the first etching hole and the second etching hole is more uniform, and the hole size (including the aperture and the depth) is more concentrated.
  • the surface-treated metal substrate obtained by the method is used for bonding with a resin to prepare a metal-resin composite, a higher bonding strength between the resin layer and the metal substrate is exhibited.
  • the first etching and the second etching may each be performed only once or in stages, and the duration of each etching is not particularly limited as long as the total etching time satisfies the above requirements.
  • the washing was performed with water between the two etchings to remove the etching liquid remaining in the previous etching.
  • the present disclosure provides a surface treated metal substrate prepared by the method according to the second aspect of the present disclosure.
  • the present disclosure provides a metal-resin composite, the metal being aluminum or an aluminum alloy, the composite comprising a metal substrate and a resin layer, the metal substrate being provided for the present disclosure a surface-treated metal substrate, the resin layer being attached to at least a portion of a surface of the metal substrate, a portion of the resin in the resin layer extending downward and filling a first etching hole of the metal substrate or A corrosion hole and a second corrosion hole.
  • the thickness of the resin layer can be selected depending on the specific use occasion.
  • the thickness of the resin layer may be in the range of 0.1 to 10 mm, for example, in the range of 0.5 to 5 mm.
  • the thickness of the resin layer means a vertical distance between the upper surface of the hard anodized film layer and the upper surface of the resin layer.
  • the host resin in the resin layer can be selected according to specific use requirements as long as the resin can be combined with aluminum or an aluminum alloy.
  • the host resin in the resin layer may be selected from a thermoplastic resin, and may be, for example, one or more of polyphenylene sulfide, polyester, polyamide, polycarbonate, and polyolefin.
  • the polyester may be a common polymer obtained by condensing a dicarboxylic acid and a diol, and specific examples thereof may include, but are not limited to, polybutylene terephthalate and/or polyethylene terephthalate. ester.
  • the polyamide may be a common polymer obtained by condensing a diamine and a dicarboxylic acid, and specific examples thereof may include, but are not limited to, polyhexamethylene adipamide, polysebacyldiamine, polysuccinic acid.
  • polystyrene polystyrene
  • polypropylene polymethyl methacrylate
  • poly(acrylonitrile-butadiene-styrene) polystyrene
  • the resin layer may contain at least one filler in addition to the host resin.
  • the type of the filler can be selected according to specific use requirements.
  • the filler may be a fibrous filler and/or a powder filler.
  • the fibrous filler may be one or more selected from the group consisting of glass fibers, carbon fibers, and aramid fibers.
  • the powder type filler may be one or more selected from the group consisting of calcium carbonate, magnesium carbonate, silica, heavy barium sulfate, talc, glass, and clay.
  • the content of the filler may be a conventional selection.
  • the filler may optionally be included in an amount of 20 to 150 parts by weight, for example, 25 to 100 parts by weight, such as 30 to 50 parts by weight, based on 100 parts by weight of the main body resin.
  • the present disclosure provides a method of producing a metal-resin composite, the metal being aluminum or an aluminum alloy, the metal-resin composite including a metal substrate and attached to the metal a resin layer of at least a portion of a surface of the substrate, the metal substrate being a surface treated metal substrate provided by the present disclosure, the method comprising injecting a resin-containing composition onto at least a portion of a surface of the metal substrate and causing a partial composition
  • the first etching hole or the first etching hole and the second etching hole are filled in the metal substrate, and a resin layer is formed after molding.
  • the resin in the resin-containing composition (hereinafter referred to as a host resin) is the same as the type of the host resin in the resin layer described above, and will not be described in detail herein.
  • the resin-containing composition may contain, in addition to the host resin, at least one filler and/or at least one fluidity improver.
  • the type of the filler is the same as that of the filler in the resin layer described above, and will not be described in detail herein.
  • the content of the filler may be a conventional selection.
  • the filler may be included in an amount of 20 to 150 parts by weight, for example, 25 to 100 parts by weight, such as 30 to 50 parts by weight, based on 100 parts by weight of the main body resin.
  • the fluidity improver is used to improve the flowability of the host resin and further improve the relationship between the metal substrate and the resin. Bond strength and processing properties of the resin.
  • the fluidity improver may be any of various substances capable of achieving the above effects, for example, a cyclic polyester.
  • the amount of the fluidity improver is based on the ability to increase the flowability of the host resin.
  • the fluidity improver is contained in an amount of 1 to 5 parts by weight based on 100 parts by weight of the main body resin.
  • the resin-containing composition may further contain various conventional auxiliaries such as a colorant and/or an antioxidant in accordance with specific use requirements to improve the properties of the resin layer in the finally formed metal-resin composite or to impart the The resin layer has new properties.
  • auxiliaries such as a colorant and/or an antioxidant in accordance with specific use requirements to improve the properties of the resin layer in the finally formed metal-resin composite or to impart the The resin layer has new properties.
  • the resin-containing composition can be obtained by uniformly mixing a host resin, an optional filler, an optional fluidity improver, and an optional auxiliary.
  • the host resin, the optional filler, the optional fluidity improver, and the optional auxiliary agent may be uniformly mixed and subjected to extrusion granulation.
  • the resin-containing composition can be injected into the etched surface of the metal substrate by various conventional methods.
  • the metal substrate is placed in a mold, and the resin-containing composition is injected by injection molding.
  • the conditions of the injection molding may be selected depending on the kind of the host resin in the resin-containing composition.
  • the conditions of the injection molding include: a mold temperature of 50-300 ° C, a nozzle temperature of 200-450 ° C, a dwell time of 1-50 seconds, an injection pressure of 50-300 MPa, and an injection time of 1-30 seconds.
  • the delay time is 1-30 seconds.
  • the amount of the resin-containing composition to be injected can be selected in accordance with the intended thickness of the resin layer.
  • the resin-containing composition is injected in an amount such that the thickness of the formed resin layer may be from 0.1 to 10 mm, for example, from 0.5 to 5 mm.
  • the surface on which the resin layer is not formed may be treated to remove surface holes and surface color change due to etching, which may be in injection molding. It is also carried out before the step, and it can also be carried out after the injection molding step, and is not particularly limited.
  • the present disclosure also provides a metal-resin composite prepared by the method according to the fifth aspect of the present disclosure.
  • the present disclosure provides an application of a metal-resin composite according to the present disclosure in preparing an electronic product casing.
  • the present disclosure provides an electronic product housing including a metal shell body and at least one resin member attached to at least a portion of an inner surface and/or at least a portion of an outer surface of the metal shell body Wherein the metal shell body is a metal substrate according to the present disclosure.
  • the outer casing includes not only an outer casing that is a sheet-like structure but also various frame structures such as an outer frame.
  • At least one opening may be disposed on the metal shell body to install an electronic product at a corresponding position of the opening to avoid the components of the metal shell body.
  • the position of at least part of the opening may correspond to a mounting position of the signal transmitting element and/or the signal receiving element, and at this time, the opening position may be provided with a resin member, and the resin is provided A portion of the resin in the member is filled in the opening, and a signal emitting element and/or a signal receiving member may be mounted on the resin member.
  • the metal shell body may be a unitary structure or a splicing structure.
  • the splicing structure means that the metal shell body includes at least two portions that are disconnected from each other, and the two portions are spliced together to form a metal shell body.
  • the adjacent two portions may be bonded together with an adhesive.
  • the splicing positions of the adjacent two portions are provided with the resin member, and the resin members respectively overlap the adjacent two portions and cover the splicing position (ie, the resin member bridges the adjacent two portions) In this way, the bonding strength of the splicing position can be improved; and the metal shell body can be divided into a plurality of parts according to the internal structure of the electronic product, and the resin member functions to form the metal shell body as a whole, and Can be used as a mounting base for some electronic components.
  • At least a part of the outer surface of the metal shell body may be attached with a resin member, which may cover the entire outer surface, or may cover a part of the outer surface of the metal shell body to form a pattern, such as decoration Sexual pattern.
  • the resin member when the inner surface of the metal shell body is attached with a resin member, the resin member may be disposed at one or more positions required.
  • the resin member is attached to the entire inner surface of the metal shell body, and the resin member may be, for example, a unitary structure. According to this specific embodiment, it is particularly suitable for the case where the metal shell body is a spliced structure.
  • the electronic product casing according to the present disclosure may be any electronic product casing that requires a metal as a casing, such as a casing or a frame of a mobile terminal, a casing or a frame of the wearable electronic device.
  • the mobile terminal refers to a device that can be in a mobile state and has a wireless transmission function, such as a mobile phone, a portable computer (including a laptop and a tablet).
  • the wearable electronic device refers to an intelligent wearable device, such as a smart watch or a smart bracelet.
  • the electronic product may specifically be, but not limited to, one or more of a mobile phone, a portable computer (such as a notebook computer and a tablet), a smart watch, and a smart wristband.
  • Fig. 1 shows a front view and a top view of an embodiment of the electronic product casing when it is a casing of a mobile phone.
  • a plurality of openings 3 are formed in the metal shell body 1 of the mobile phone.
  • the position of the opening 3 may correspond to the position where the antenna is mounted and the position at which various buttons are mounted.
  • the resin layer 2 is attached to the entire inner surface of the metal shell body 1 of the mobile phone, the resin layer 2 is an integral structure, and a part of the resin in the resin layer 2 is filled in the opening 3.
  • Fig. 2 shows a front view of an embodiment of the outer casing of the electronic product being a smart watch.
  • the smart watch metal case body 4 is provided with a signal element opening corresponding to the mounting signal transmitting element and/or the signal receiving element. 6.
  • the inner surface of the smart watch metal shell body 4 is adhered with a resin inner liner 5, and a part of the resin in the resin inner liner layer 5 is filled in the signal element opening 6, and the signal element can be mounted at a corresponding position on the resin inner liner 5. .
  • the present disclosure provides a method of fabricating an electronic product casing, the method comprising forming at least one resin member on at least a portion of an inner surface and/or at least a portion of an outer surface of the metal shell body, wherein The resin member is formed according to a method of producing a metal-resin composite of the present disclosure.
  • the average shear strength between the metal substrate and the resin layer in the metal-resin composite was measured on an INSTRON 3369 universal testing machine in accordance with the method specified in ASTM D1002-10.
  • the thickness of the anodized film layer and the depth of the etching hole were measured using a metallographic microscope of the model Axio Imager Alm available from ZEISS (five different positions of the same sample were observed, and the field of view was measured. The depth of all the corrosion holes that appeared) was measured by a scanning electron microscope of JSM-7600F model number from JEOL Ltd. (The five different positions of the same sample were observed, and all the fields appearing in the field of view were measured. Corrosion hole aperture).
  • microhardness of the hard anodized film layer was measured using a model HX-1000TM/LCD microhardness tester available from Shanghai Optical Instruments No. 1 Plant.
  • Examples 1-12 are used to illustrate the disclosure.
  • a commercially available 5052 aluminum alloy plate having a thickness of 1 mm was cut into a rectangular piece of 15 mm ⁇ 80 mm.
  • the rectangular piece is placed in a polishing machine for polishing. Then, it was washed with absolute ethanol, and then immersed in a 2% by weight aqueous sodium hydroxide solution. After 2 minutes, it was taken out and rinsed with deionized water to obtain a pretreated aluminum alloy sheet.
  • the aluminum alloy sheet obtained in the step (1) is placed as an anode in a hard anodizing bath containing an aqueous solution of 1% by weight of NaOH and 0.1% by weight of sodium silicate as an electrolytic solution, and a graphite carbon plate is used as a cathode. Electrolysis was carried out at 10 ° C for 15 minutes at a voltage of 60 V for hard anodization. The hard anodized aluminum alloy sheet was taken out and blown dry to obtain an aluminum alloy sheet having a hard anodized film layer on its surface. The cross section of the aluminum alloy sheet was observed with a microscope to confirm that the thickness of the hard anodized film layer was 25 ⁇ m, and the hardness of the hard anodized film layer was 2200 HV.
  • the cross section of the aluminum alloy sheet obtained by the step (3) was observed by a microscope, and it was found that a corrosion hole having a pore diameter in the range of 50-200 nm was distributed in the hard anodized film layer, and the depth of the etching hole was hard and an anodized film layer was formed.
  • Ratio of thickness In the range of 0.2 to 1:1, the ratio of the depth of the corrosion hole of 60% or more to the thickness of the hard anodized film layer is 1:1.
  • the injection molding conditions include: the mold temperature is 120 ° C, the nozzle temperature is 305 ° C, the dwell time is 5 seconds, the injection pressure is 120 MPa, the injection time is 5 seconds, and the delay time is 3 seconds.
  • the cooled product was placed in a constant temperature drying oven at 120 ° C for 1.5 h, and then naturally cooled to room temperature with the furnace to obtain a metal-resin composite (the thickness of the resin layer was 5 mm), and the average shear strength thereof is shown in Table 1. Listed in.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 1 to prepare a metal-resin composite, except that in the step (2), the electrolytic solution used was 1% by weight of NaOH and 0.1% by weight of phosphoric acid. An aqueous solution of sodium, the electrolysis time is 10 minutes.
  • the cross section of the aluminum alloy sheet obtained in the step (3) was observed by a microscope, and it was found that a corrosion hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the etching hole and the hard anodized film layer were distributed.
  • the ratio of the thickness is in the range of 0.1 to 1:1, and the ratio of the depth of the etching hole of 50% or more to the thickness of the hard anodized film layer is 1:1.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the cross section of the aluminum alloy sheet obtained in the step (3) was observed by a microscope, and it was found that a corrosion hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the etching hole and the hard anodized film layer were distributed.
  • the ratio of the thickness is in the range of 0.1 to 1:1, and the ratio of the depth of the etching hole of 50% or more to the thickness of the hard anodized film layer is 1:1.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • a pretreated aluminum alloy sheet was prepared in the same manner as in the step (1) of Example 1.
  • a pretreated aluminum alloy sheet was prepared in the same manner as in the step (1) of Example 1.
  • a pretreated aluminum alloy sheet was prepared in the same manner as in the step (1) of Example 1.
  • the aluminum alloy sheet obtained in the step (1) is placed as an anode in an anodizing bath having a concentration of 20% by weight of an aqueous solution of H 2 SO 4 as an electrolytic solution, and a graphite carbon plate is used as a cathode at a voltage of 18 V at 20 Electrolyze at °C for 15 minutes.
  • the anodized aluminum alloy sheet was taken out and blown dry to obtain an aluminum alloy sheet having an anodized film layer on its surface.
  • the cross section of the aluminum alloy sheet was observed with a microscope to determine that the thickness of the anodized film layer was 25 ⁇ m and the microhardness was 200 HV.
  • the cross section of the aluminum alloy sheet obtained in the step (3) was observed by a microscope, and it was found that the anodized film layer was distributed with corrosion holes having a pore diameter in the range of 50 to 200 nm, and the ratio of the depth of the etching hole to the thickness of the anodized film layer. In the range of 0.2 to 1:1, the ratio of the depth of the corrosion hole of 60% or more to the thickness of the hard oxide film layer is 1:1.
  • a metal-resin composite was prepared in the same manner as in the step (4) of Example 1, and the average shear strength thereof is shown in Table 1.
  • step (3) was divided into the step (3-1) and the step (3-2), in the step ( In 3-1), the hard anodized aluminum alloy sheet is etched in the same manner as in the step (3) of the first embodiment, and the alkali etched aluminum alloy sheet is treated with the acidic etching solution in the step (3-2).
  • Etching, step (3-2) is as follows:
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 50-200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.2 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard oxide film layer of 60% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 200-2000 nm, and the second etching hole has a depth in the range of 0.1-400 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 4 to prepare a metal-resin composite, except that the step (2) was carried out by forming an anode on the surface of the aluminum alloy sheet in the same manner as in the step (2) of Comparative Example 3.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 50-200 nm was distributed in the anodized film layer, and the depth of the first etching hole was anodized.
  • the ratio of the thickness of the layer is in the range of 0.2 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the anodized film layer of more than 60% is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and has A corrosion layer of the second etching hole, the etching layer is in contact with the anodized film layer, the second etching hole has a pore diameter in the range of 200-2000 nm, and the second etching hole has a depth in the range of 0.1-400 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 1 to prepare a metal-resin composite, except that the step (3) was divided into the step (3-1) and the step (3-2), in the step ( The hard anodized aluminum alloy sheet is etched in the same manner as the step (3-2) in the embodiment 4 in 3-1), and the step (3) is employed in the step (3-2).
  • the same method etches the acid etched aluminum alloy sheet.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the hard anodized film layer was divided into Having a first etching hole having a pore diameter in the range of 50 to 200 nm, a ratio of a depth of the first etching hole to a thickness of the hard anodized film layer is in a range of 0.2 to 1:1, and a first etching hole of 60% or more The ratio of the depth to the thickness of the hard anodized film layer is 1:1; the aluminum alloy substrate is divided into a dense base layer and a corrosion layer having a second etching hole, and the corrosion layer is in contact with the hard anodized film layer, The pores of the second etching holes are in the range of 500-4500 nm, and the depth of the second etching holes is in the range of 0.1-400 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 1 to prepare a metal-resin composite, except that the same method as in the step (3-2) of Example 4 was used in the step (3).
  • the anodized aluminum alloy sheet is etched.
  • the cross section of the aluminum alloy sheet obtained by the step (3) was observed by a microscope, and it was found that there was substantially no corrosion hole in the hard anodized film layer; the aluminum alloy substrate was divided into a dense base layer and a corrosion layer having corrosion holes, and the corrosion layer and The hard anodized film layers are connected, the pores of the etching holes are in the range of 800-5000 nm, and the depth of the etching holes is in the range of 0.01-500 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 50-200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.2 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer of 60% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 500-2000 nm, and the second etching hole has a depth in the range of 50-200 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 100-200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.5 to 1:1, and the depth of the first etching hole and the thickness of the hard anodized film layer are 70% or more.
  • the ratio of the aluminum alloy is divided into a dense base layer and a corrosion layer having a second etching hole, the corrosion layer is in contact with the hard anodized film layer, and the second etching hole has a pore diameter in the range of 1000-1500 nm.
  • the depth of the second etching hole is in the range of 10 to 300 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • a commercially available 5052 aluminum alloy plate having a thickness of 1 mm was cut into a rectangular piece of 15 mm ⁇ 80 mm.
  • the rectangular piece is placed in a polishing machine for polishing. Then, it was washed with absolute ethanol, and then immersed in a 2% by weight aqueous sodium hydroxide solution. After 2 minutes, it was taken out and rinsed with deionized water to obtain a pretreated aluminum alloy sheet.
  • the aluminum alloy sheet obtained in the step (1) is placed as an anode in a hard anodizing bath having a concentration of 20% by weight of oxalic acid as an electrolytic solution, and a graphite carbon plate is used as a cathode at a voltage of 60 V. Electrolysis was carried out at 5 ° C for 15 minutes for hard anodization. The hard anodized aluminum alloy sheet was taken out and blown dry to obtain an aluminum alloy sheet having a hard anodized film layer on its surface. The cross section of the aluminum alloy sheet was observed with a microscope to confirm that the thickness of the hard anodized film layer was 10 ⁇ m, and the hardness of the hard anodized film layer was 2500 HV.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 100-200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.7 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer of 70% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 1000-1500 nm, and the second etching hole has a depth in the range of 10-300 ⁇ m.
  • the aluminum alloy sheet obtained in the step (3-2) is placed in an injection molding mold, and a resin composition containing glass fiber and polyethylene terephthalate (PET) is injection molded on one surface of the aluminum alloy sheet.
  • PET polyethylene terephthalate
  • the content of the glass fiber was 40 parts by weight with respect to 100 parts by weight of PET), demolded and cooled.
  • the injection molding conditions include: the mold temperature is 110 ° C, the nozzle temperature is 300 ° C, the dwell time is 8 seconds, the injection pressure is 110 MPa, the injection time is 4 seconds, and the delay time is 2 seconds.
  • the cooled product was placed in a constant temperature drying oven at 120 ° C for 1.5 h, and then naturally cooled to room temperature with the furnace.
  • a metal-resin composite (the thickness of the resin layer was 5 mm) was obtained, and the average shear strength thereof is listed in Table 1.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.1 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer of 50% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 200-2000 nm, and the second etching hole has a depth in the range of 0.1-400 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.1 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer of 50% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 200-2000 nm, and the second etching hole has a depth in the range of 0.1-400 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • a commercially available 5052 aluminum alloy plate having a thickness of 1 mm was cut into a rectangular piece of 15 mm ⁇ 80 mm.
  • the rectangular piece is placed in a polishing machine for polishing. Then, it was washed with absolute ethanol, and then immersed in a 2% by weight aqueous sodium hydroxide solution. After 2 minutes, it was taken out and rinsed with deionized water to obtain a pretreated aluminum alloy sheet.
  • the aluminum alloy sheet obtained in the step (1) is placed as an anode in a hard anodizing bath having a concentration of 20% by weight of citric acid as an electrolytic solution, and a graphite carbon plate is used as a cathode at a voltage of 60 V. Electrolysis was carried out at 20 ° C for 15 minutes for hard anodization. The hard anodized aluminum alloy sheet was taken out and blown dry to obtain an aluminum alloy sheet having a hard anodized film on its surface. The cross section of the aluminum alloy sheet was observed with a microscope to confirm that the thickness of the hard anodized film layer was 21 ⁇ m, and the hardness of the hard anodized film layer was 2000 HV.
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.1 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer of 60% or more is 1:1;
  • the aluminum alloy substrate is divided into a dense base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 200-2000 nm, and the second etching hole has a depth in the range of 0.1-400 ⁇ m.
  • the injection molding conditions include: the mold temperature is 100 ° C, the nozzle temperature is 300 ° C, the dwell time is 6 seconds, the injection pressure is 100 MPa, the injection time is 5 seconds, and the delay time is 5 seconds.
  • the cooled product was placed in a constant temperature drying oven at 120 ° C for 1.5 h, and then naturally cooled to room temperature with the furnace to obtain a metal-resin composite (the thickness of the resin layer was 5 mm), and the average shear strength thereof is shown in Table 1. Listed in.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 10 to prepare a metal-resin composite, except that in the step (3-1), the etching liquid (the pH was the same as in Example 10) further contained Na 2 . CO 3 .
  • the cross section of the aluminum alloy sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etching hole having a pore diameter in the range of 80-200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard.
  • the ratio of the thickness of the anodic oxide film layer is in the range of 0.5 to 1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodic film layer of 60% or more is 1:1;
  • the aluminum alloy substrate is classified into dense a base layer and an etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 1000-1500 nm, and the second etching hole has a depth in the range of 10-300 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • the aluminum alloy sheet was subjected to surface treatment in the same manner as in Example 10 to prepare a metal-resin composite, except that in the step (3-2), the etching liquid (the pH was the same as in Example 10) further contained Na 2 .
  • the molar ratio of HPO 4 , Na 2 HPO 4 to H 3 PO 4 was 0.3:1.
  • the cross section of the aluminum sheet obtained by the step (3-2) was observed by a microscope, and it was found that the first etched hole having a pore diameter in the range of 10 to 200 nm was distributed in the hard anodized film layer, and the depth of the first etching hole was hard and hard.
  • the ratio of the thickness of the anodized film layer is 0.1-1:1, and the ratio of the depth of the first etching hole to the thickness of the hard anodized film layer is 1:1;
  • the aluminum substrate is divided into a dense base layer and An etching layer having a second etching hole, the etching layer is in contact with the hard anodized film layer, the second etching hole has a pore diameter in the range of 400-2000 nm, and the second etching hole has a depth in the range of 50-200 ⁇ m.
  • the average shear strength of the prepared metal-resin composites is listed in Table 1.
  • Example 1 Comparing Example 1 with Comparative Examples 1-3, it can be seen that in the metal-resin composite prepared by integrally molding the surface-treated metal substrate according to the present disclosure with a resin, the resin layer and the metal substrate There is a higher average shear strength (i.e., a higher bond strength), and thus the composite has higher structural stability.
  • Example 1 Numbering Average shear strength (MPa) Example 1 18.1 Example 2 17.6 Example 3 19.4 Comparative example 1 0.2 Comparative example 2 4 Comparative example 3 10.4 Example 4 23.5 Comparative example 4 14.9 Comparative example 5 7.2 Comparative example 6 5.5 Example 5 24.7 Example 6 25.3 Example 7 22.1 Example 8 20.5 Example 9 20.3 Example 10 18.8 Example 11 21.6 Example 12 20.2

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Abstract

L'invention concerne un matériau de substrat métallique traité en surface et son procédé de fabrication, et un composite métal-résine, le métal étant de l'aluminium ou un alliage d'aluminium, ledit matériau de substrat métallique comprenant un substrat métallique et une couche de film anodisé dur, attachée à au moins une partie de la surface du substrat métallique, des premier trous gravés étant répartis sur la surface de la couche de film anodisé dur.
PCT/CN2015/092725 2014-12-25 2015-10-23 Matériau de substrat métallique traité en surface, composite métal-résine, procédé de fabrication et application de celui-ci, enveloppe externe de produit électronique et son procédé de fabrication WO2016101694A1 (fr)

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CN113089047A (zh) * 2021-04-12 2021-07-09 四川九洲电器集团有限责任公司 一种铝合金构件及其制备方法、应用
US20220055346A1 (en) * 2018-04-20 2022-02-24 Taisei Plas Co., Ltd. Method for manufacturing a composite of aluminum alloy

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