WO2016086331A1 - 芯片卡及其承载用载板与成型方法 - Google Patents

芯片卡及其承载用载板与成型方法 Download PDF

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Publication number
WO2016086331A1
WO2016086331A1 PCT/CN2014/001094 CN2014001094W WO2016086331A1 WO 2016086331 A1 WO2016086331 A1 WO 2016086331A1 CN 2014001094 W CN2014001094 W CN 2014001094W WO 2016086331 A1 WO2016086331 A1 WO 2016086331A1
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WO
WIPO (PCT)
Prior art keywords
chip
card
sim card
carrier
chip card
Prior art date
Application number
PCT/CN2014/001094
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English (en)
French (fr)
Inventor
璩泽明
宋大崙
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璩泽明
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Filing date
Publication date
Application filed by 璩泽明 filed Critical 璩泽明
Priority to PCT/CN2014/001094 priority Critical patent/WO2016086331A1/zh
Publication of WO2016086331A1 publication Critical patent/WO2016086331A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a chip card and a carrier board and a molding method thereof, in particular to a chip module used for forming a chip card to form a chip chip substrate and can be correspondingly embedded on a carrier board.
  • a slot in a range of area of a chip card body forms a chip card.
  • a chip card refers to a card embedded with a chip module, such as a smart card (SIM card), a financial card or a credit card.
  • SIM card refers to a Subscriber Identity Module (SIM), which is used to save a mobile phone.
  • SIM card of the user identification data of the service is generally referred to as a SIM card.
  • SIM card is divided into a Mini (mini) SIM card, a Micro (micro) SIM card and a Nano (Nai) SIM card, which are respectively set to a predetermined size.
  • the Mini SIM card is a 15mm x 25mm rectangular card body
  • the Micro SIM card is a 15mm x 12mm rectangular card body
  • the Nano SIM card is a 8.8mm x 12.3mm rectangular card body.
  • the above rectangular card bodies are not complete.
  • the rectangular shape, such as the chamfered corner on the corner, is not repeated here because it is not the focus of the present invention.
  • the existing SIM card structure utilizes a rectangular plastic card body having the above-mentioned predetermined size, such as 15mm x 25mm (Mini SIM card), 15mm x 12mm (Micro SIM card) or 8.8mm x 12.3mm (Nano SIM) Card), and a concave recessed groove is preset on the rectangular card body for embedding a chip module conforming to the SIM card function; in addition, according to the current SIM card technology, whether it is a Mini SIM card or a Micro
  • the size of the chip module embedded in the SIM card or the Nano SIM card can be designed to be the same or about the same, which is advantageous for the process of manufacturing the SIM card chip module or the chip card, but is not intended to limit the present invention.
  • the chip card described below is exemplified by a SIM card, but is not intended to limit the present invention.
  • the one-card one-core card 100 includes a SIM card (chip card) 200 and a carrier carrier (or card body) 300.
  • the carrier 300 is generally a rectangular plastic sheet card of 85.6 mm x 53.98 mm, but is not limited. Since the chip card such as a financial card or a credit card has been a large number of articles that have been produced and used for a long time, the carrier 300 has become a chip card.
  • the carrier 300 is also extended by the related industry to manufacture and/or store a SIM card having a smaller size.
  • the SIM card 200 can be Select the type of SIM card that currently exists as needed.
  • the size of the Mini SIM card is 15mm x 25mm
  • the size of the Micro SIM card is 15mm x 12mm
  • the size of the Nano SIM card is 8.8mm x 12.3mm.
  • the Mini SIM card is taken as an example, but is not limited. Since the manufacturing end is only a single SIM card 200 disposed on a carrier carrier 300, it is called a card and a core. However, it is also possible to make a card with multiple cores without limitation.
  • the existing SIM card 200 includes a chip card body 201 and a SIM card chip module 202 embedded in the slot (blind slot) 203 preset on the chip card body 201, as shown in FIG.
  • the chip module 202 further includes a circuit board 204, a chip circuit pattern layer 205 disposed on a first side of the circuit board 204 (as shown above), and a die 206 assembled on the circuit board 204.
  • the second surface (the bottom surface as shown) can be correspondingly connected to the chip circuit pattern layer 205.
  • the manufacturing end of the chip module 202 generally uses a continuous strip-shaped flexible circuit board (FPC). ) as a carrier (not shown), generally known as Roll to Roll FPC or Reel to Reel FPC (rolling strip mode) production method, and the long strip FPC along its length direction (ie feeding direction) in order Forming a series of chip modules 202 (including a chip circuit layer pattern 205 and a die 206) arranged at a predetermined pitch; and then, using the known dedicated machine equipment for the SIM card, together with the manufacturing end of the carrier 300
  • the subsequent process includes: taking out the singulated chip module 202 from the long strip FPC, and assembling each chip module 202 one by one on the mating carrier 300 as shown in FIG.
  • a core card 100 wherein, the breaks 207 of the SIM card 200 are formed on each of the carrier boards 300 for the user to conveniently take out the SIM card 200 from the card-core card 100, and the SIM
  • the surface of the chip card body 201 of the card 200 has to be grounded by a router to dig the slot 20 3, and the recessed groove 203 is further formed with a central cavity 208 for accommodating the die 206 and a stepped groove 209 provided on the bottom surface of the chip module 202 for the periphery of the bottom surface of the chip module 202 to be adhered by adhesive. It is fixed in the recessed groove 203; moreover, the above processes are currently produced by using a specially designed special machine equipment.
  • the existing one-card one-core card 100 (or one-card multi-core) process technology is limited by the dedicated machine equipment, so that the manufacturing process of the chip module 202 and the manufacturing end of the carrier 300 are also limited, so
  • the machine structure of the process technology is not only cumbersome, but also the process is relatively slow, it is difficult to achieve industrialization benefits, and the use of a flexible circuit board (FPC) as a carrier board also increases the process and material costs, and further causes the chip module 202.
  • FPC flexible circuit board
  • the main object of the present invention is to provide a chip card and a carrier board and a molding method thereof, comprising: providing a one-piece chip substrate, which is composed of a chip module and at least one plastic package layer, the chip module comprising a chip a circuit pattern layer is formed on a first surface of a circuit board and a die is assembled on the opposite second surface and is electrically connected to the chip circuit pattern layer; a carrier carrier is provided, and at least one chip card is provided thereon
  • the chip card body of the SIM card size and the separation line thereof are provided for the user to be taken out by the separation of the separation line so that the chip card body can be separated by the carrier board, and are pre-processed in the range area of the chip card body.
  • An open slot is disposed; the chip-type chip base is correspondingly embedded in the open slot of the chip card body to cooperate to form a chip card.
  • the chip module comprises a chip module that is compatible with the Mini SIM card, the Micro SIM card, and the Nano SIM card.
  • the chip-based chip-based system comprises a chip substrate for use with a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip card system comprises a chip card body compliant with a Mini SIM card, a Micro SIM card, and a Nano SIM card size.
  • the chip substrate is composed of a chip module and at least one plastic encapsulation layer having a thickness of 0.3-0.85 mm.
  • the invention also provides a carrier board for carrying a chip card, which is manufactured by the above molding method, and comprises:
  • a carrier board having at least one chip card body compliant with a chip card size and a separation line for defining the at least one chip card body for separation by the separation line so that each chip card body can be
  • the carrier carrier is separated and taken out, and an open slot is preset in a range region of each chip card body;
  • each chip chip base body is formed by a chip module and at least one plastic package layer, the chip module further comprises a circuit board, and a chip circuit pattern layer is formed on the first side of the circuit board And a die is assembled on the circuit board opposite to the second surface of the first surface and is electrically connected to the chip circuit pattern layer;
  • Each of the chip-type chip bases is correspondingly embedded in the open slots of each chip card body to cooperate to form a chip card;
  • the chip card is separated by the separation line so that the chip card can be separated and used by the carrier board.
  • the chip module comprises a chip module that is used in accordance with a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip-type chip substrate comprises a chip substrate for use with a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip card body comprises a chip card body having a SIM card size of one of a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the carrier carrier is a rectangular carrier having a size of 85.6 mm x 53.98 mm.
  • the chip-type chip substrate has a thickness of 0.3-0.85 mm formed by a chip module and at least one plastic packaging layer.
  • the range of the chip card body is equal to the open slot.
  • the present invention further provides a chip card, which is separated and taken out by a carrier board of the chip card, and the chip card includes:
  • a chip base body is composed of a chip module and at least one plastic package layer.
  • the chip module further comprises a circuit board, a chip circuit pattern layer formed on the first surface of the circuit board, and a die And being assembled on the second surface of the circuit board opposite to the first surface and electrically connected to the chip circuit pattern layer;
  • chip chip base body is correspondingly embedded in the open slot provided in the chip card body to form a chip card;
  • the chip-type chip substrate is bonded to the at least one plastic package layer by the increased thickness of the chip-type chip substrate, so that the chip-type chip substrate is embedded in the open slot formed in the chip card body.
  • the chip module comprises a chip module that is used in accordance with a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip-type chip substrate comprises a chip substrate for use with a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip card body is a card body having a size of one of a Mini SIM card, a Micro SIM card, and a Nano SIM card.
  • the chip chip substrate is composed of a chip module and at least one plastic package
  • the thickness of the layer is 0.3-0.85 mm.
  • the range of the chip card body is equal to the opening slot.
  • the chip-type chip substrate and the carrier carrier board or the chip card body can be separately industrialized and manufactured in a separate process, and then integrated into a single body, thereby avoiding that the existing chip card process technology must have a dedicated machine platform. Restrictions can meet the needs of industrialization, so as to enhance the economic benefits of the smart card process.
  • Figure 1-2 is a perspective view showing the combination and disassembly of the chip module and the carrier in the conventional one-card one-core card.
  • 3-4 are schematic perspective and cross-sectional views showing an embodiment of a chip substrate of the present invention.
  • FIG. 5-6 are exploded and assembled perspective views of an embodiment of a chip card (smart card) of the present invention embedded in a carrier board to form a card-core card.
  • chip card smart card
  • FIG. 7-11 show that the chip substrate is embedded in a carrier carrier board to form a card two-core card, a card four-core card, a card four-core card, a card six-core card, and a card nine-core.
  • the invention is: 10-chip substrate; 20-chip module; 21-circuit board; 22-chip circuit pattern layer; 23-die; 30-plastic encapsulation layer; 40-bearing carrier plate; 40a-bearing carrier plate; 40b-bearing carrier plate; 40c-bearing carrier plate; 40d-bearing carrier plate; 40e-bearing carrier plate; 41-separation line; 50-chip card body; 51-opening groove; 52-separation line; - chip card body; 61-open slot; 62-separation line; 70-chip card body;
  • Prior art 100-one card one core card; 200-smart (SIM) card; 201-chip card body; 202-chip module; 203-embedded slot; 204-circuit board; 205-chip circuit pattern layer; Grain; 207-break line; 208-central chamber; 209-step groove; 300-carrier.
  • SIM smartt
  • 201-chip card body 202-chip module
  • 203-embedded slot 204-circuit board
  • 205-chip circuit pattern layer Grain
  • 207-break line 208-central chamber
  • 209-step groove 300-carrier.
  • the chip card described below is exemplified by a SIM card (smart card), but is not intended to limit the present invention.
  • the method for molding the carrier plate for carrying the chip card of the invention comprises the following steps:
  • a chip-type chip substrate 10 is provided, which is composed of a chip module 20 and at least one plastic package layer 30.
  • the chip module 20 further includes: a circuit board 21; a chip A circuit pattern layer 22 is formed on the first surface of the circuit board 21; and a die 23 is assembled on the opposite second surface of the circuit board 21 and is electrically connected to the chip circuit pattern layer 22.
  • Step 2 Referring to FIG. 5, a carrier board 40 is provided, on which at least one chip card body (such as 50, 60, 70) conforming to the size of a chip card such as a SIM card and its separation line (such as 41, 52, 62) are provided. The user can be taken out by the separation of the separation line so that the chip card body can be separated by the carrier, and an opening slot (61) is preset in the range of the chip card body.
  • the chip card body comprises a larger size chip card body 50 such as a Mini SIM card, a center-sized chip card body 60 such as a micro SIM card and a smaller size.
  • the chip card body 70 is a Nano SIM card, but is not intended to limit the present invention, wherein a chip card body 50 having a larger size, such as a Mini SIM card, is disposed on the carrier board 40 through its separation line 41.
  • a center-sized chip card body 60 such as a Micro SIM card is disposed on the chip card body 50 through its separation line 52, and a smaller-sized chip card body 70 (such as a Nano SIM card) passes through the separation line 62 thereof.
  • the chip card body 60 is disposed on the chip card body 60, that is, the chip card bodies (50, 60, 70) of three different sizes are sequentially disposed on the carrier carrier board 40 according to the size thereof; 5, 6, wherein the smallest opening slot 61 can be regarded as an open slot preset in the range of the at least one chip card body (50, 60, 70) conforming to the size of the chip card, such as a SIM card. That is, the open slot 61 can be regarded as a range region of any of the chip card bodies 50, 60, and 70. Preset by a shared open slot, but not to limit the present invention.
  • the chip-type chip substrate 10 is correspondingly embedded in the opening slot 61 of the chip card body (50, 60, 70) to form a chip card, such as a Mini SIM card (50) or a Micro SIM card (60) or a Nano SIM card (70); since in the embodiment shown in Figures 5 and 6, the size of the open slot 61 is designed to be equal to the size of the smallest chip card body 70, the film
  • the body chip substrate 10 is designed as a Nano SIM card (70).
  • the chip-type chip substrate 10 is a chip-like structure composed of a chip module 20 and at least one plastic package layer 30 and having a suitable thickness as shown in FIGS. 3 and 4, and through the at least one plastic.
  • the increased thickness and rigidity of the encapsulation layer 30 allows the chip-type chip substrate 10 to have sufficient mechanical strength to be embedded in at least one chip card body disposed on the carrier carrier 40 with a certain degree of tightness (as shown in the figure). 5, 6 shown in the range of 50 or 60 or 70) of the open slot 61 as shown in Figures 5, 6, that is, the chip used in the chip card (SIM card)
  • the body chip substrate 10 can be stably embedded in the open slot 61 of the at least one chip card body (50 or 60 or 70) provided on the carrier board 40, and is not easily detached.
  • the main technical feature of the present invention is that a one-piece chip substrate 10 is provided, and a carrier carrier 40 is provided, and the chip-type chip substrate 10 is correspondingly embedded in the same.
  • An open slot 61 is defined in a range of at least one chip card body (50, 60, 70) provided on the carrier board 40 to form a SIM card such as a Mini SIM card (50) and a Micro SIM card ( 60) one of the Nano SIM cards (70) for the user to pass the separation of the separation lines (such as 41, 52, 62) for defining the at least one chip card body to make the SIM card (chip card body) It can be separated by the carrier 40 and taken out for use.
  • the chip-type chip substrate 10 is manufactured by the manufacturing end by first specifying one of a SIM card type such as a Mini SIM card (50), a Micro SIM card (60), and a Nano SIM card (70).
  • the chip module 20 used in the SIM card is combined with at least one plastic encapsulation layer 30 to form a one-piece chip substrate 10, so that the chip-type chip substrate 10 can be easily embedded in an opening slot 61 of the carrier carrier 40.
  • the formed chip substrate 10 is a chip substrate 10 used in accordance with one of a Mini SIM card, a Micro SIM card, and a Nano SIM card, so that when the chip substrate 10 is embedded in an open slot provided on a carrier carrier 40
  • the open slot 61 shown in FIG. 5 and FIG. 6 can constitute one of the Mini SIM card, the micro SIM card, and the Nano SIM card.
  • the SIM card (the chip card) is shown in FIG. 5 and FIG. Or Micro SIM card (60) or Nano SIM card (70).
  • the chip modules used in the Mini SIM card, the Micro SIM card or the Nano SIM card may be sized or considered to be identical or approximately identical to the chip module 20 as shown in FIGS. 3 and 4, thus In the embodiment shown in Figures 5 and 6, the chip substrate 10 is sized to conform to the chip substrate used in the Mini SIM card, Micro SIM card or Nano SIM card.
  • the size of the currently known SIM card is reduced from 15mm x 25mm for the Mini SIM card to 15mm x 12mm for the Micro SIM card, and further reduced to 8.8mm x 12.3mm for the Nano SIM card, so as shown in Figure 5.
  • the chip substrate 10 is made directly of the size of the Nano SIM card of 8.8 mm x 12.3 mm, but is not intended to limit the invention.
  • the thickness of the chip substrate 10 is preferably equal to the thickness of the carrier substrate 40 (as shown in FIG. 5), such as 0.3 mm to 0.85 mm, that is, when the carrier carrier 40 is an existing card-core card.
  • the thickness of the chip substrate 10 is preferably equal to the thickness of the carrier 40 (300), and the carrier carrier 40 is The size and shape of the open slot 61 (shown in FIGS.
  • the at least one plastic encapsulation layer 30 may utilize a process of a lamination process or an injection molding process, but is not limited to form a chip substrate 10 in combination with the chip module 20.
  • the at least one plastic encapsulation layer 30 may be laminated to form a plastic encapsulation layer 30 formed of a three-layer structure by laminating a glue layer, a first plastic layer and a second plastic layer, and further, the at least one The material of the plastic encapsulating layer 30 may be PVC (polyvinyl chloride) or ABS resin (Acrylonitrile Butadiene Styrene), but is not limited.
  • the three-dimensional exploded and combined schematic view of an embodiment of the chip substrate 10 of the chip card embedded in a carrier carrier 40 is shown.
  • the size of the currently known SIM card is reduced from 15mm x 25mm for the Mini SIM card to 15mm x 12mm for the Micro SIM card, and further reduced to 8.8mm x 12.3mm for the Nano SIM card, so
  • the chip substrate 10 is directly formed by the size of the Nano SIM card of 8.8 mm x 12.3 mm, that is, the chip substrate 10 itself becomes a Nano SIM card 70, but is not used to limit the present. invention.
  • the carrier carrier 40 is formed by using the existing carrier 300 of the existing card-core card 100 (as shown in FIG. 1 and FIG. 2), but is not limited (to be described later).
  • a chip card body 50 of a Mini SIM card conforming to a Mini SIM card size (15 mm x 25 mm) is defined and formed on the carrier carrier 40 (300) by a pre-punched separation (fracture) line 41.
  • a separation line 52 is further defined in the range of the chip card body 50 of the Mini SIM card to define and form a reduced first opening slot 51 and a micro SIM card size (15mm x 12mm).
  • the micro SIM card chip body 60 enables the chip card body 60 to be embedded in the first opening slot 51 with a certain degree of tightness; this embodiment is further in the range of the micro SIM card chip body 60.
  • a separation line 62 is defined to define and form a second opening slot 61 and a Nano SIM card chip body 70 conforming to the size of the Nano SIM card (8.8 mm x 12.3 mm), as shown in FIG. 5-6,
  • the chip card body 70 can be embedded in the second opening slot 61 with a certain degree of tightness; in the embodiment shown in FIGS. 5 and 6, the chip substrate 10 is directly made of a Nano SIM card size of 8.8 mm x 12.3 mm. Therefore, the chip substrate 10 is simultaneously fabricated as a Nano SIM card, but is not intended to limit the present invention.
  • the card 40 (300) of the card-core mode has only one second opening slot 61 for embedding a chip substrate 10, but the card is
  • the carrier mode 40 (300) of the one core mode can be selected by the manufacturing end to carry the Mini SIM card (50) and the Micro SIM card (60).
  • the above-mentioned Mini SIM card (50), Micro SIM card (60) or Nano SIM card (70) can be selected and combined according to actual needs, for example: Only the chip card body 50 of a Mini SIM card and a second opening slot 61 are defined on the board 40 (300) for embedding a chip base 10 for use with the Mini SIM card (such as a Mini SIM card 50 in FIG. 9). Or a chip card body 60 and a second opening slot 61 for defining and forming a micro SIM card on the carrier board 40 (300) for embedding a chip substrate 10 for use with the micro SIM card (such as FIG.
  • the micro SIM card 60); or the chip card body 70 and a second opening slot 61 of the Nano SIM card are defined and formed on the carrier board 40 (300) for embedding a chip substrate 10 for use with the Nano SIM card ( As shown in Fig. 11, a Nano SIM card 70), in the present embodiment, the chip substrate 10 is a Nano SIM card 70.
  • the carrier carrier 40 (300) is designated to carry a SIM card (50), a Micro SIM card 60, and a Nano SIM card (70)
  • the manufacturing end of the carrier board 40 (300) can be opened in a range of the size of the chip card body (50, 60) of the SIM card provided on the carrier board 40 (300).
  • the second opening slot 61 is adapted to embed a chip substrate 10 (also referred to as the Nano SIM card 70 as shown in Figures 5 and 6) that is sized for use with this type of SIM card.
  • the chip end of the chip substrate 10 of the present invention can be industrialized to form the chip substrate 10 so that the chip substrate 10 can be embedded as a shared chip unit.
  • the board 40 (300) is provided with at least one opening slot 61 provided in a range of the chip card body (50, 60, 70) conforming to the size of the chip card, such as a SIM card, so that a SIM card can be formed. 60, 70) use type.
  • the manufacturing end of the present invention can separately manufacture the chip substrate 10 and the carrier carrier 40 in a separate process, which not only avoids the limitation of the special machine necessary for the prior art technology, but also reduces the carrier plate.
  • the material cost of the layer is in line with the industrialization demand, so the economic benefit of the smart card process can be effectively improved, which is the advantage of the technology of the present invention.
  • the carrier carrier 40 of the present invention is designed according to the needs of use. As shown in FIGS. 5 and 6, the carrier carrier 40 is an embodiment of a card-core mode, but is not intended to limit the present invention.
  • the invention, that is, the one-card one-core carrier 40 can be analogized to the one-card multi-core carrier according to the technical features shown in FIGS. 5 and 6, respectively, as follows:
  • the carrier board 40a is a card two-core carrier board carrying two SIM cards, wherein the two SIM cards can be a Mini SIM card (50), a Micro SIM card 60, and a Nano SIM card (70). One of them, wherein the number of SIM cards carried can be set according to the size of the SIM card.
  • the carrier 40b is a card four-core carrier carrying four SIM cards, wherein The four SIM cards may be one of a Mini SIM card (50), a Micro SIM card 60, and a Nano SIM card (70), wherein the number of SIM cards carried may be set according to the size of the SIM card.
  • the four SIM cards may be one of a Mini SIM card (50), a Micro SIM card 60, and a Nano SIM card (70), wherein the number of SIM cards carried may be set according to the size of the SIM card.
  • the carrier board 40c is a card four-core carrier board carrying four SIM cards, wherein the four SIM cards can be one of a Mini SIM card (50) and a Nano SIM card (70).
  • the number of SIM cards carried therein can be set according to the size of the SIM card.
  • the carrier board 40d is a card six-core carrier board carrying six SIM cards, wherein the six SIM cards can be one of a Micro SIM card (60) and a Nano SIM card (70).
  • the number of SIM cards carried therein can be set according to the size of the SIM card.
  • the carrier 40e is a card nine-core carrier carrying nine SIM cards, wherein the nine SIM cards are SIM cards (70), wherein the number of SIM cards carried can be The size of the SIM card is set.

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Abstract

提供一种芯片卡及其承载用载板与成型方法，其包含：提供一片体式芯片基体，由一芯片模块（20）及至少一塑料封装层（30）所结合构成，该芯片模块（20）包含一芯片电路图案层形成在一电路板的第一面上及一晶粒组装在相对的第二面上并与该芯片电路图案层导通；提供一承载用载板（40），于其上开设至少一符合芯片卡如SIM卡尺寸的芯片卡体（50，60，70）及其分离线（41，52，62），供使用者可通过该分离线（41，52，62）的分离以使该芯片卡体（50，60，70）能由该承载用载板（40）分离而被取出使用，且在该芯片卡体的范围区域中预设一开口槽（61）；将该片体式芯片基体对应嵌置在该芯片卡体（50，60，70）所设的开口槽（61）内以配合组成一芯片卡。

Description

芯片卡及其承载用载板与成型方法 技术领域
本发明有关一种芯片卡及其承载用载板与成型方法，尤指一种将一芯片卡所使用的芯片模块形成一片体式芯片基体而能对应嵌置于一承载用载板上所设至少一芯片卡体的范围区域中的一开口槽中以构成一芯片卡。
背景技术
一般泛称的芯片卡是指嵌设有一芯片模块的卡片，如智能卡(SIM卡)、金融卡或***等，其中智能卡是指用户身份模块(Subscriber Identity Module，SIM)，乃是用以保存行动电话服务的用户身份识别数据的智能卡，通称为SIM卡，目前SIM卡分为Mini(迷你)SIM卡、Micro(微)SIM卡及Nano(奈)SIM卡，其分别设具一预定的规格尺寸，如Mini SIM卡为一15mm x 25mm的矩形卡体，Micro SIM卡为一15mm x 12mm的矩形卡体，Nano SIM卡为一8.8mm x 12.3mm的矩形卡体，上述各矩形卡体并非呈现完整的矩形形状，如其一边角上设有切角，因非本发明的诉求重点故在此不再赘述。以现有SIM卡结构而言，其利用一具有上述预定规格尺寸的矩形塑质卡体如15mm x 25mm(Mini SIM卡)、15mm x 12mm(Micro SIM卡)或8.8mm x 12.3mm(Nano SIM卡)，并于该矩形卡体上预设一内凹的嵌槽供嵌设一符合该SIM卡功能的芯片模块而构成；此外，依目前SIM卡技术而言，不论是Mini SIM卡、Micro SIM卡或Nano SIM卡，其上所嵌设的芯片模块的尺寸可设计为相同或约略相同，如此有利于SIM卡芯片模块或芯片卡的制造端的工艺，但非用以限制本发明。
以下所述的芯片卡以SIM卡为例说明，但非用以限制本发明。参考图1、2，其分别为现有的一卡一芯卡片中SIM卡的芯片模块与承载用载板的组合及分解立体示意图。该一卡一芯卡片100包含一SIM卡(芯片卡)200及一承载用载板(或称卡片本体)300。该载板300一般为一85.6mm x 53.98mm的矩形塑质片卡但不限制，由于芯片卡如金融卡或***长久来已是大量制作及使用的物品，故该载板300已成为芯片卡相关业界所认同的规格化片卡，换言之，用以制作该85.6mm x 53.98mm的载板的机械设备及其工艺或相关技术等，目前皆相当齐备及成熟，有利于业界大量制作及使用，因此该载板300也被相关业界延伸使用于制作及/或存放具有较小尺寸的SIM卡，如图1、2所示该SIM卡200可依 使用需要而选择目前已存在的SIM卡种类如Mini SIM卡的规格尺寸为15mm x 25mm、Micro SIM卡的规格尺寸为15mm x 12mm或Nano SIM卡的规格尺寸为8.8mm x 12.3mm中的一种，如图1、2所示为以Mini SIM卡为例说明但不限制，由于制造端在制作时是在一承载用载板300上只设单一SIM卡200，故称为一卡一芯，但亦可制成一卡多芯而不限制。
该现有SIM卡200包含一芯片卡体201及一SIM卡芯片模块202嵌置并黏固在该芯片卡体201上所预设的嵌槽(盲槽)203中如图2所示，其中该芯片模块202更包含一电路板204、一芯片电路图案层205设在该电路板204的第一面上(如图所示的上面)及一晶粒206组装在该电路板204的相对的第二面上(如图所示的底面)并能对应连通于该芯片电路图案层205。
以目前SIM卡的工艺技术而言，在此以图1、2所示一卡一芯卡片为例说明，该芯片模块202的制造端一般是使用一连续的长条状软性电路板(FPC)当作载板(图未示)，即一般通称Roll to Roll FPC或Reel to Reel FPC(滚动条方式)的生产方式，而该长条状FPC上沿其长度方向(即送料方向)依序形成有一连串以预定间距连续排列的芯片模块202(包含一芯片电路层图案205及一晶粒206)；之后，再配合载板300的制造端而利用已知的专用机台设备来进行SIM卡的后续工艺，包含：由该长条状FPC上取出单体化的芯片模块202，再将各芯片模块202逐一组装在相配合的载板300上如图2所示，以制成该一卡一芯卡片100；其中，在各载板300上须冲制成型该SIM卡200的折裂断207供使用者方便由该一卡一芯卡片100中取出该SIM卡200，又于该SIM卡200的芯片卡体201表面上须通过刳刨工具(router)以刳刨出该嵌槽203，且该嵌槽203更须刳刨形成有一中央室腔208供容纳该芯片模块202底面所设的晶粒206及一阶梯槽209供该芯片模块202底面的四周缘能藉黏胶而黏固在该嵌槽203内；更且，上述工艺目前皆是利用特殊设计的专用机台设备始能进行制作。
由上可知，现有一卡一芯卡片100(或一卡多芯)的工艺技术会受到专用机台设备的限制，以致芯片模块202制造端及载板300制造端的工艺也受到限制，故现有工艺技术的机台结构不但较烦杂，且工艺相对较慢，难以达成产业化效益，而且以软性电路板(FPC)来当作载板，也相对增加工艺及材料成本，更造成芯片模块202与载板300制造端的间生产管制的困扰，不符合经济效益。因此，针对芯片卡(SIM卡)工艺，如何发展一能符合产业化需求并提升经济效益的芯片卡工艺，乃为本发明亟欲解决的课题，而本发明即是针对上述欲解决的 课题，而提出一具有新颖性及进步性的技术方案。
发明内容
本发明的主要目的在于提供一种芯片卡及其承载用载板与成型方法，其包含：提供一片体式芯片基体，由一芯片模块及至少一塑料封装层所结合构成，该芯片模块包含一芯片电路图案层形成在一电路板的第一面上及一晶粒组装在相对的第二面上并与该芯片电路图案层导通；提供一承载用载板，其上开设至少一符合芯片卡如SIM卡尺寸的芯片卡体及其分离线，供使用者可通过该分离线的分离以使该芯片卡体能由该载板分离而被取出使用，且在该芯片卡体的范围区域中预设一开口槽；将该片体式芯片基体对应嵌置在该芯片卡体的开口槽中以配合组成一芯片卡。
在本发明的一实施例中，该芯片模块系包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
在本发明的一实施例中，该片体式芯片基体系包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
在本发明的一实施例中，该芯片卡体系包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡尺寸的芯片卡体。
在本发明的一实施例中，该芯片基体由一芯片模块及至少一塑料封装层所构成的厚度为0.3-0.85mm。
本发明还提出了一种芯片卡的承载用载板，利用上述成型方法所制成，包含：
一承载用载板，其上开设有至少一符合芯片卡尺寸的芯片卡体及用以定义该至少一芯片卡体的分离线，供可通过该分离线的分离以使各芯片卡体能由该承载用载板分离而被取出使用，且在各芯片卡体的范围区域中预设一开口槽；及
至少一片体式芯片基体，各片体式芯片基体由一芯片模块及至少一塑料封装层结合成一体所构成，该芯片模块更包含一电路板、一芯片电路图案层形成在该电路板的第一面上、及一晶粒组装在该电路板上相对该第一面的第二面上并与该芯片电路图案层导通；
其中各片体式芯片基体对应嵌置在各芯片卡体的开口槽中以配合组成一芯片卡；
其中该芯片卡通过该分离线的分离以使该芯片卡能由该承载用载板分离而被取出使用。
在本发明的一实施例中，该芯片模块包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
在本发明的一实施例中，该片体式芯片基体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
在本发明的一实施例中，该芯片卡体包含具有Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一SIM卡尺寸的芯片卡体。
在本发明的一实施例中，该承载用载板为一尺寸为85.6mm x 53.98mm的矩形载板。
在本发明的一实施例中，该片体式芯片基体由一芯片模块及至少一塑料封装层所构成的厚度为0.3-0.85mm。
在本发明的一实施例中，该芯片卡体的范围区域相等于该开口槽。
另外，本发明还提供了一种芯片卡，由上述芯片卡的承载用载板上分离取出，该芯片卡包含：
一芯片卡体，其中在该芯片卡体的范围区域中预设一开口槽；及
一片体式芯片基体，由一芯片模块及至少一塑料封装层结合成一体所构成，该芯片模块更包含一电路板、一芯片电路图案层形成在该电路板的第一面上、及一晶粒组装在该电路板上相对该第一面的第二面上并与该芯片电路图案层导通；
其中该片体式芯片基体对应嵌置在该芯片卡体所设的开口槽中以构成一芯片卡；
其中该片体式芯片基体通过该芯片模块与该至少一塑料封装层结合所增加的厚度，以使该该片体式芯片基体嵌置于该芯片卡体上所开设的开口槽中。
在本发明的一实施例中，该芯片模块包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
在本发明的一实施例中，该片体式芯片基体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
在本发明的一实施例中，该芯片卡体为一具有Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一SIM卡的尺寸的卡体。
在本发明的一实施例中，该片体式芯片基体由一芯片模块及至少一塑料封 装层所构成的厚度为0.3-0.85mm。
在本发明的一实施例中，当该芯片卡体具有Nano SIM卡的尺寸的卡体时，该芯片卡体的范围区域相等于该开口槽。
与现有技术相比，本发明的有益效果在于：
根据本发明制造端能以分开的工艺分别产业化制作该片体式芯片基体及该承载用载板或芯片卡体而再简易组合成一体，得避免现有芯片卡工艺技术必须具备专用机台的限制，又能符合产业化需求，藉以提升智慧卡工艺的经济效益。
附图说明
图1-2分别为现有一卡一芯卡片中芯片模块与载板的组合及分解立体示意图。
图3-4为本发明的芯片基体一实施例的立体及剖视示意图。
图5-6分别为本发明芯片卡(智能卡)的芯片基体嵌置于一承载用载板上以成为一卡一芯卡片实施例的分解及组合立体示意图。
图7-11分别为本发明中芯片基体嵌置于一承载用载板上以成为一卡二芯卡片、一卡四芯卡片、一卡四芯卡片、一卡六芯卡片及一卡九芯卡片实施例的组合立体示意图。
附图标记说明：
本发明：10-芯片基体；20-芯片模块；21-电路板；22-芯片电路图案层；23-晶粒；30-塑料封装层；40-承载用载板；40a-承载用载板；40b-承载用载板；40c-承载用载板；40d-承载用载板；40e-承载用载板；41-分离线；50-芯片卡体；51-开口槽；52-分离线；60-芯片卡体；61-开口槽；62-分离线；70-芯片卡体；
现有技术：100-一卡一芯卡片；200-智慧(SIM)卡；201-芯片卡体；202-芯片模块；203-嵌槽；204-电路板；205-芯片电路图案层；206-晶粒；207-折断线；208-中央室腔；209-阶梯槽；300-载板。
具体实施方式
为使本发明更加明确详实，兹列举较佳实施例并配合下列图示，将本发明的技术特征详述如后。
以下所述的芯片卡以SIM卡(智慧卡)为例说明，但非用以限制本发明。本发明芯片卡的承载用载板的成型方法，包含下列步骤：
步骤1：参考图3、4，提供一片体式芯片基体10，其由一芯片模块20及至少一塑料封装层30结合成一体所构成，其中该芯片模块20更包含：一电路板21；一芯片电路图案层22形成在该电路板21的第一面上；及一晶粒23组装在该电路板21的相对第二面上并与该芯片电路图案层22导通。
步骤2：参考图5，提供一承载用载板40，其上开设至少一符合芯片卡如SIM卡尺寸的芯片卡体(如50、60、70)及其分离线(如41、52、62)，供使用者可通过该分离线的分离以使该芯片卡体能由该载板分离而被取出使用，且在该芯片卡体的范围区域中预设一开口槽(61)。以图5、6为例说明，其中该芯片卡体包含一具较大尺寸的芯片卡体50如一Mini SIM卡、一具居中尺寸的芯片卡体60如一Micro SIM卡及一具较小尺寸的芯片卡体70如一Nano SIM卡，但非用以限制本发明，其中具较大尺寸的芯片卡体50如Mini SIM卡是通过其分离线41而设置在该承载用载板40上，而具居中尺寸的芯片卡体60如Micro SIM卡是通过其分离线52而设置在该芯片卡体50上，而具较小尺寸的芯片卡体70(如Nano SIM卡)是通过其分离线62而设置在该芯片卡体60上，也就是，三种不同尺寸的芯片卡体(50、60、70)依其尺寸由大至小依序设置在该承载用载板40上；此外，如图5、6所示，其中尺寸最小的开口槽61即可视为在该至少一符合芯片卡如SIM卡尺寸的芯片卡体(50、60、70)的范围区域中所预设的开口槽，也就是该开口槽61同时可当作芯片卡体50、60、70其中任一芯片卡体的范围区域中所预设的一共享的开口槽，但非用以限制本发明。
步骤3：参考图6，将该片体式芯片基体10对应嵌置在该芯片卡体(50、60、70)的开口槽61中以配合组成一芯片卡，如一Mini SIM卡(50)或一Micro SIM卡(60)或一Nano SIM卡(70)；由于在图5、6所示的实施例中，该开口槽61的尺寸被设计成等于该最小芯片卡体70的尺寸，因此该片体式芯片基体10即设计为一Nano SIM卡(70)。在本发明中，该片体式芯片基体10为由一芯片模块20及至少一塑料封装层30所结合构成并具有适当厚度的片体式结构体如图3、4所示，而通过该至少一塑料封装层30所增加的厚度及刚性，使该片体式芯片基体10得具有足够的机械强度供能以一定的紧密度嵌置于该承载用载板40上所设至少一芯片卡体(如图5、6所示的50或60或70)的范围区域中所设的开口槽61中如图5、6所示，也就是，该芯片卡(SIM卡)所使用的片 体式芯片基体10能稳固嵌置于该承载用载板40上所设至少一芯片卡体(50或60或70)的开口槽61中而不易脱离。
以图3-6所示的SIM卡为例说明，本发明的主要技术特征在于：提供一片体式芯片基体10，并提供一承载用载板40，再将该片体式芯片基体10对应嵌置在该承载用载板40上所设至少一芯片卡体(50、60、70)的范围区域中所设一开口槽61中以配合组成一SIM卡如Mini SIM卡(50)、Micro SIM卡(60)、Nano SIM卡(70)其中之一，供使用者可通过用以定义该至少一芯片卡体的分离线(如41、52、62)的分离以使该SIM卡(芯片卡体)能由该载板40分离而被取出使用。其中，该片体式芯片基体10的制作系由制造端先指定一种SIM卡型态如Mini SIM卡(50)、Micro SIM卡(60)、Nano SIM卡(70)其中之一，再将该SIM卡所使用的芯片模块20结合至少一塑料封装层30以结合构成一片体式芯片基体10，以使该片体式芯片基体10能简易嵌置于该承载用载板40上所设一开口槽61中以构成一所欲的SIM卡，也就是，当该芯片模块20被设计为符合Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一SIM卡使用的芯片模块时，则所形成的片体式芯片基体10即为符合Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一使用的芯片基体10，因此当该芯片基体10被嵌置于一承载用载板40上所设的开口槽中时如图5、6所示的开口槽61，则可构成Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一种SIM卡(芯片卡)如图5、6所示的Mini SIM卡(50)或Micro SIM卡(60)或Nano SIM卡(70)。
以现有SIM卡技术而言，Mini SIM卡、Micro SIM卡或Nano SIM卡所使用的芯片模块的尺寸可设计为或视为相同或约略相同如图3、4所示的芯片模块20，因此在如图5、6所示的实施例中，该芯片基体10的尺寸符合Mini SIM卡、Micro SIM卡或Nano SIM卡使用的芯片基体。此外，目前已知的SIM卡的规格尺寸是由Mini SIM卡的15mm x 25mm缩小至Micro SIM卡的15mm x 12mm，再进一步缩小至Nano SIM卡的8.8mm x 12.3mm，因此在如图5、6所示的实施例中，该芯片基体10直接以Nano SIM卡的规格尺寸8.8mm x 12.3mm制成，但非用以限制本发明。而该芯片基体10的厚度以相等于该承载用载板40的厚度为佳(如图5所示)如0.3mm-0.85mm，也就是当承载用载板40是以现有一卡一芯卡片100(如图1、2所示)的现有载板300做成时，该芯片基体10的厚度即以相等于该载板40(300)的厚度为佳，且该承载用载板40(300)上的开口槽61(如图5、6所示)的尺寸及形状亦配合该芯片基体10的尺寸，以使该芯片基体10 在嵌置于该载板40(300)的一开口槽61(如图5、6所示)内时得稳固嵌合且不会凸出于该载板40(300)的表面如图6所示。
参考图4，该至少一塑料封装层30可利用层压(lamination)工艺或射出成型(injection molding)工艺中的一种工艺但不限制以与芯片模块20结合构成一芯片基体10。此外，该至少一塑料封装层30可通过层压工艺以将一胶层、一第一塑料层及一第二塑料层压合成一由三层结构形成的塑料封装层30，此外，该至少一塑料封装层30的材料可为PVC(聚氯乙烯，polyvinyl chloride)或ABS树脂(丙烯腈-丁二烯-苯乙烯共聚物，Acrylonitrile Butadiene Styrene)但不限制。
再参考图5、6所示，其分别为本发明中芯片卡的芯片基体10嵌置于一承载用载板40上一实施例的立体分解及组合示意图。如前所述，目前已知的SIM卡的规格尺寸是由Mini SIM卡的15mm x 25mm缩小至Micro SIM卡的15mm x 12mm，再进一步缩小至Nano SIM卡的8.8mm x 12.3mm，因此在如图5、6所示实施例中，该芯片基体10直接以Nano SIM卡的规格尺寸8.8mm x 12.3mm制成，即该芯片基体10本身即成为一Nano SIM卡70，但非用以限制本发明。在本实施例中，该承载用载板40利用现有一卡一芯卡片100(如图1、2所示)的现有载板300做成但不限制(容后述)，而制造端得在该承载用载板40(300)上通过预先冲制的分离(折裂)线41而定义并形成一符合Mini SIM卡规格尺寸(15mm x 25mm)的Mini SIM卡的芯片卡体50。本实施例进一步在该Mini SIM卡的芯片卡体50的范围区域中内再开设一分离线52以定义并形成一较缩小的第一开口槽51及一符合Micro SIM卡规格尺寸(15mm x 12mm)的Micro SIM卡芯片卡体60，使该芯片卡体60能以一定的紧密度嵌置于该第一开口槽51中；本实施例更进一步在该Micro SIM卡芯片卡体60的范围区域中再开设一分离线62以定义并形成一第二开口槽61及一符合Nano SIM卡规格尺寸(8.8mm x 12.3mm)的Nano SIM卡芯片卡体70如图5-6所示，使该芯片卡体70能以一定的紧密度嵌置于该第二开口槽61中；在如图5、6所示实施例中，该芯片基体10直接以Nano SIM卡规格尺寸8.8mm x 12.3mm制成，故该芯片基体10同时被制成为一Nano SIM卡，但非用以限制本发明。
此外，在如图5、6所示的实施例中，该一卡一芯模式的载板40(300)上虽然只设有一第二开口槽61供嵌置一芯片基体10，但该一卡一芯模式的载板40(300)却可由制造端选择用以承载Mini SIM卡(50)、Micro SIM卡(60) 或Nano SIM卡(70)等现有三种不同SIM卡型态中的任一种SIM卡，也就是，当载板40的制造端在制出如图5、6所示的一卡一芯模式的载板40(300)时，可视实际使用需要而对上述的Mini SIM卡(50)、Micro SIM卡(60)或Nano SIM卡(70)三者加以选择及组合，例如：在该载板40(300)上只定义并形成一Mini SIM卡的芯片卡体50及一第二开口槽61供嵌置一符合Mini SIM卡使用的芯片基体10(如图9中一Mini SIM卡50)；或在该载板40(300)上只定义并形成一Micro SIM卡的芯片卡体60及一第二开口槽61供嵌置一符合Micro SIM卡使用的芯片基体10(如图10中一微SIM卡60)；或在该载板40(300)上只定义并形成一Nano SIM卡的芯片卡体70及一第二开口槽61供嵌置一符合Nano SIM卡使用的芯片基体10(如图11中一Nano SIM卡70)，在本实施例中该芯片基体10即为一Nano SIM卡70。换言的，不论该承载用载板40(300)被指定用来承载一Mini SIM卡(50)、一Micro SIM卡60、一Nano SIM卡(70)三者中那一种型态的SIM卡，该承载用载板40(300)的制造端皆可在该承载用载板40(300)上所设SIM卡的芯片卡体(50、60)的范围区域中开设一能共享尺寸的第二开口槽61供嵌置一符合该种型态SIM卡使用且又能共享尺寸的芯片基体10(亦如图5、6中所示的Nano SIM卡70)。而本发明的芯片卡(SIM卡)所采用芯片基体10的制造端即能先产业化制成该芯片基体10，以使该芯片基体10能当作一共享的芯片单位供嵌置于该载板40(300)所设至少一符合芯片卡如SIM卡尺寸的芯片卡体(50、60、70)的范围区域中所设的开口槽61中，如此即可形成一种SIM卡(50、60、70)的使用型态。因此，本发明的制造端能以分开二工艺分别产业化制作该芯片基体10及承载用载板40，不但可避免受到现有工艺技术所必备的专用机台的限制，亦能降低载板层材料成本并符合产业化需求，故得有效提升智慧卡工艺的经济效益，此乃本发明技术的优势所在。
本发明的承载用载板40得依使用需要而设计多种不同实施例，如图5、6所示，该承载用载板40为一卡一芯模式的实施例，但非用以限制本发明，也就是该一卡一芯的载板40可依据图5、6所示的技术特征而类推至一卡多芯的载板，分别说明如下：
如图7所示，该载板40a为一承载有二个SIM卡的一卡二芯载板，其中该二SIM卡可为Mini SIM卡(50)、Micro SIM卡60、Nano SIM卡(70)其中之一种，其中所承载的SIM卡数目可依该SIM卡的尺寸而设定。
如图8所示，该载板40b为一承载有四个SIM卡的一卡四芯载板，其中该 四个SIM卡可为Mini SIM卡(50)、Micro SIM卡60、Nano SIM卡(70)其中之一种，其中所承载的SIM卡的数目可依该SIM卡的尺寸而设定。
如图9所示，该载板40c为一承载有四个SIM卡的一卡四芯载板，其中该四个SIM卡可为Mini SIM卡(50)、Nano SIM卡(70)其中之一种，其中所承载的SIM卡的数目可依该SIM卡的尺寸而设定。
如图10所示，该载板40d为一承载有六个SIM卡的一卡六芯载板，其中该六个SIM卡可为Micro SIM卡(60)、Nano SIM卡(70)其中之一种，其中所承载的SIM卡的数目可依该SIM卡的尺寸而设定。
如图11所示，该载板40e为一承载有九个SIM卡的一卡九芯载板，其中该九个SIM卡为奈SIM卡(70)，其中所承载的SIM卡的数目可依该SIM卡的尺寸而设定。
以上所述仅为本发明的优选实施例，对本发明而言仅是说明性的，而非限制性的；本领域普通技术人员理解，在本发明权利要求所限定的精神和范围内可对其进行许多改变，修改，甚至等效变更，但都将落入本发明的保护范围内。

Claims (18)

  1. 一种芯片卡的承载用载板的成型方法，其特征在于，包含下列步骤：
    步骤1：提供一片体式芯片基体，该片体式芯片基体由一芯片模块及至少一塑料封装层结合成一体所构成，该芯片模块进一步包含：
    一电路板；一芯片电路图案层形成在该电路板的第一面上；及一晶粒组装在该电路板上相对该第一面的第二面上并与该芯片电路图案层导通；
    步骤2：提供一承载用载板，该承载用载板上开设至少一符合芯片卡尺寸的芯片卡体及用以定义该芯片卡体的分离线，供通过该分离线的分离以使该芯片卡体由该承载用载板分离而被取出使用，且在该芯片卡体的范围区域中预设一开口槽；及
    步骤3：使该片体式芯片基体对应嵌置在该芯片卡体的开口槽中以与该芯片卡体配合组成一芯片卡，藉此完成一芯片卡的承载用载板。
  2. 如权利要求1所述的成型方法，其特征在于，该芯片模块包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
  3. 如权利要求1所述的成型方法，其特征在于，该芯片基体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
  4. 如权利要求1所述的成型方法，其特征在于，该芯片卡体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡尺寸的芯片卡体。
  5. 如权利要求1所述的成型方法，其特征在于，该芯片基体由一芯片模块及至少一塑料封装层所构成的厚度为0.3-0.85mm。
  6. 一种芯片卡的承载用载板，利用权利要求1至5中任一项所述的成型方法所制成，其特征在于，包含：
    一承载用载板，其上开设有至少一符合芯片卡尺寸的芯片卡体及用以定义该至少一芯片卡体的分离线，供可通过该分离线的分离以使各芯片卡体能由该承载用载板分离而被取出使用，且在各芯片卡体的范围区域中预设一开口槽；及
    至少一片体式芯片基体，各片体式芯片基体由一芯片模块及至少一塑料封装层结合成一体所构成，该芯片模块更包含一电路板、一芯片电路图案层形成在该电路板的第一面上、及一晶粒组装在该电路板上相对该第一面的第二面上并与该芯片电路图案层导通；
    其中各片体式芯片基体对应嵌置在各芯片卡体的开口槽中以配合组成一芯 片卡；
    其中该芯片卡通过该分离线的分离以使该芯片卡能由该承载用载板分离而被取出使用。
  7. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该芯片模块包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
  8. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该片体式芯片基体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
  9. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该芯片卡体包含具有Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一SIM卡尺寸的芯片卡体。
  10. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该承载用载板为一尺寸为85.6mm x 53.98mm的矩形载板。
  11. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该片体式芯片基体由一芯片模块及至少一塑料封装层所构成的厚度为0.3-0.85mm。
  12. 如权利要求6所述的芯片卡的承载用载板，其特征在于，该芯片卡体的范围区域相等于该开口槽。
  13. 一种芯片卡，由权利要求6至12任一项中所述的芯片卡的承载用载板上分离取出，其特征在于，该芯片卡包含：
    一芯片卡体，其中在该芯片卡体的范围区域中预设一开口槽；及
    一片体式芯片基体，由一芯片模块及至少一塑料封装层结合成一体所构成，该芯片模块更包含一电路板、一芯片电路图案层形成在该电路板的第一面上、及一晶粒组装在该电路板上相对该第一面的第二面上并与该芯片电路图案层导通；
    其中该片体式芯片基体对应嵌置在该芯片卡体所设的开口槽中以构成一芯片卡；
    其中该片体式芯片基体通过该芯片模块与该至少一塑料封装层结合所增加的厚度，以使该该片体式芯片基体嵌置于该芯片卡体上所开设的开口槽中。
  14. 如权利要求13所述的芯片卡，其特征在于，该芯片模块包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片模块。
  15. 如权利要求13所述的芯片卡，其特征在于，该片体式芯片基体包含符合Mini SIM卡、Micro SIM卡、Nano SIM卡使用的芯片基体。
  16. 如权利要求13所述的芯片卡，其特征在于，该芯片卡体为一具有Mini SIM卡、Micro SIM卡、Nano SIM卡其中之一SIM卡的尺寸的卡体。
  17. 如权利要求13所述的芯片卡，其特征在于，该片体式芯片基体由一芯片模块及至少一塑料封装层所构成的厚度为0.3-0.85mm。
  18. 如权利要求16所述的芯片卡，其特征在于，当该芯片卡体具有Nano SIM卡的尺寸的卡体时，该芯片卡体的范围区域相等于该开口槽。
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CN1628320A (zh) * 2002-05-24 2005-06-15 都科摩欧洲通信技术研究所有限公司 具有向后兼容的缩小尺寸的芯片卡及其适配器
CN101662535A (zh) * 2008-08-28 2010-03-03 深圳富泰宏精密工业有限公司 芯片卡固持结构
CN103457089A (zh) * 2012-05-31 2013-12-18 深圳富泰宏精密工业有限公司 芯片卡卡持装置及应用其的电子装置
CN203788333U (zh) * 2014-04-16 2014-08-20 深圳酷比通信设备有限公司 一种智能手机及其主板组件

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