WO2016080769A1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
WO2016080769A1
WO2016080769A1 PCT/KR2015/012429 KR2015012429W WO2016080769A1 WO 2016080769 A1 WO2016080769 A1 WO 2016080769A1 KR 2015012429 W KR2015012429 W KR 2015012429W WO 2016080769 A1 WO2016080769 A1 WO 2016080769A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
light
wavelength
emitting device
phosphor
Prior art date
Application number
PCT/KR2015/012429
Other languages
French (fr)
Korean (ko)
Inventor
이윤섭
김다혜
이상홍
박병규
김대욱
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140161071A external-priority patent/KR102341366B1/en
Priority claimed from KR1020140161073A external-priority patent/KR102288384B1/en
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Publication of WO2016080769A1 publication Critical patent/WO2016080769A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present invention relates to a light emitting device, and more particularly, to a light emitting device capable of emitting light of two or more different wavelengths and having reduced color coordinate variation among produced light emitting devices.
  • Light emitting diodes are inorganic semiconductor devices that emit light generated by recombination of electrons and holes. Recently, light emitting diodes are used in various fields such as displays, automobile lamps, and general lighting. Light emitting diodes have a long lifetime, low power consumption, and fast response times, so that light emitting devices including light emitting diodes are expected to replace conventional light sources.
  • the general light emitting diodes generally emit light close to a single color. Therefore, in order to implement white light in a light emitting device including a light emitting diode, in general, white light is implemented by inducing color mixing of light using a phosphor. Since the phosphor absorbs light having a relatively short wavelength and emits light having a relatively long wavelength, white light is emitted from the light emitting device by applying a light emitting diode emitting a short wavelength light such as a blue light emitting diode or a UV light emitting diode with a phosphor. Use a configuration that makes it possible.
  • An object of the present invention is to provide a light emitting device having reduced color coordinate variation of emitted light among produced light emitting devices.
  • a light emitting device including: a light emitting unit including a light emitting element, a wavelength conversion unit positioned on the light emitting element, and an adhesive unit positioned between the light emitting element and the wavelength conversion unit; And a side wall portion surrounding the side surface of the light emitting part and in contact with the side surface of the light emitting part, wherein the adhesive part comprises a phosphor, and the wavelength of the light emitted from the phosphor of the adhesive part is different from the wavelength of the light emitted from the wavelength conversion part.
  • the peak wavelength of the light emitted from the phosphor of the adhesive unit may be longer than the peak wavelength of the light emitted from the wavelength converter.
  • the phosphor of the adhesive part may be a red phosphor, and the wavelength converter may include a green phosphor or a yellow phosphor.
  • the adhesive portion and the wavelength conversion portion may each include one different phosphor.
  • the wavelength converter may include a single crystal phosphor sheet.
  • the single crystal phosphor sheet may include a single crystal of YAG: Ce, and the adhesive portion may include a red phosphor.
  • the adhesive part may extend to the side of the light emitting device.
  • portion of the adhesive portion located on the side of the light emitting device may have an inclined side surface.
  • An inclined portion of the side of the adhesive portion may contact the sidewall portion, and the sidewall portion may have a light reflective characteristic.
  • the foot and the device may further include a substrate, and the light emitting portion and the sidewall portion may be positioned on the substrate.
  • a light emitting device in another embodiment, includes a first light emitting element, a first wavelength converting portion positioned on the light emitting element, and a first adhesive portion positioned between the first light emitting element and the first wavelength converting portion.
  • a first light emitting unit comprising; A second light emitting part spaced apart from the first light emitting part and including a second light emitting element, a second wavelength converting part positioned on the light emitting element, and a second adhesive part positioned between the second light emitting element and the second wavelength converting part; 2 light emitting unit; A side wall part surrounding side surfaces of the first and second light emitting parts and contacting side surfaces of the first and second light emitting parts, wherein the first and second adhesive parts respectively include first and second phosphors, The wavelength of the light emitted from the first phosphor is different from the wavelength emitted from the first wavelength converter, the wavelength of the light emitted from the second phosphor is different from the wavelength emitted from the second wavelength converter, and the first light emission
  • the light emitting device may further include a substrate, and the first and second light emitting parts and the sidewall part may be positioned on the substrate.
  • the substrate may include first to fourth electrodes, wherein the first and second electrodes are electrically connected to the first light emitting part, and the third and fourth electrodes are electrically connected to a second light emitting part. Can be.
  • the first to fourth electrodes may be insulated from each other, and each of the first to fourth electrodes may be exposed to an outer surface of the substrate.
  • the first light emitting part may emit white light.
  • the wavelength conversion unit may include a single crystal phosphor sheet.
  • the single crystal phosphor sheet may include a single crystal of YAG: Ce, and the adhesive portion may include a red phosphor.
  • the peak wavelength of the light emitted from the phosphor of the adhesive unit may be longer than the peak wavelength of the light emitted from the wavelength converter.
  • the adhesive portion and the wavelength conversion portion may each include one different phosphor.
  • the adhesive part may extend to the side of the light emitting device, and a portion of the adhesive part disposed on the side of the light emitting device may have an inclined side surface.
  • a light emitting device that selectively emits light of different colors may be provided as needed, so that separately manufacturing at least two or more light emitting devices that emit light of different colors may be omitted, thereby manufacturing process This can be simplified.
  • the manufacturing process of the combination lamp that can perform a plurality of functions in one lamp can be simplified, the defect can be reduced.
  • a light emitting device having an adhesive portion containing a phosphor by providing a light emitting device having an adhesive portion containing a phosphor, it is easy to adjust the color coordinates of the light emitted from the light emitting device, and also significantly reduce the color coordinate deviation between the light emitting devices manufactured in the same process Can be.
  • FIG. 1 is a perspective view illustrating a light emitting device according to an embodiment of the present invention.
  • FIG. 2 is a plan view illustrating a light emitting device according to an embodiment of the present invention.
  • FIG. 3 is a bottom plan view illustrating a light emitting device according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
  • 5A and 5B are cross-sectional views illustrating light emitting devices according to other exemplary embodiments of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
  • FIGS. 7 to 9 are cross-sectional views illustrating a method of manufacturing a light emitting device according to still another embodiment of the present invention.
  • FIGS. 10 to 13 are a perspective view, a plan view, and a view illustrating a light emitting device according to an embodiment of the present invention; Bottom view and section view.
  • FIG. 14 is a plan view illustrating a light emitting device according to still another embodiment of the present invention.
  • 15 is a front view for explaining a vehicle lamp according to another embodiment of the present invention.
  • light emitting diodes emit light having a relatively narrow half-width
  • typical light emitting diodes generally emit light close to a single color. Therefore, in order for one light emitting module or a light emitting device to emit various colors as necessary, light emitting diode packages for emitting light of different colors must be installed in one module.
  • the mounting process of the light emitting diode package emitting different colors should be performed at least twice. As the number of processes increases, the manufacturing yield of the light emitting module or light emitting device may be reduced. In addition, as the plurality of light emitting diode packages are mounted, the volume of the light emitting module or the light emitting device is inevitably increased.
  • the light emitting device includes a blue light emitting diode and green and red phosphors positioned around the blue light emitting diode, and the blue light emitted from the blue light emitting diode, the green light and the red light emitted by wavelength conversion from each phosphor are mixed, and the white light is mixed. This can be implemented.
  • the color coordinates of the white light emitted from the light emitting device vary depending on which phosphor first emits light emitted from the light emitting diode.
  • color coordinate deviations occur between light emitting devices produced in the same process, thereby lowering the manufacturing yield of the light emitting device.
  • FIGS. 1 to 4 are a perspective view, a plan view, a bottom plan view, and a cross-sectional view for explaining a light emitting device according to an embodiment of the present invention, respectively.
  • the cross-sectional view of FIG. 4 shows a cross section of the region corresponding to the line A-A of FIGS. 1 to 3.
  • the light emitting device 10 may include at least two light emitting units. Specifically, the light emitting device 10 may include a first light emitting unit 100, a second light emitting unit 200, The side wall portion 300 is included. Furthermore, the light emitting device 10 may further include a substrate 400 and a protection element 310.
  • the substrate 400 may be located at the bottom of the light emitting device 10, and may support the first and second light emitting parts 100 and 200 and the sidewall part 300.
  • the substrate 400 may be an insulating or conductive substrate, and may also be a PCB including a conductive pattern.
  • the substrate 400 may include a polymer material or a ceramic material.
  • the substrate 400 may include a ceramic material having excellent thermal conductivity such as AlN.
  • the substrate 400 may include a base 410, and may further include first to fourth electrodes 421, 431, 423, and 433.
  • the base 410 may serve to support the substrate 400 and the electrodes 421, 431, 423, 433 as a whole, and to insulate the electrodes 421, 431, 423, 433 from each other. It may include a substance.
  • the base 410 may include a ceramic material such as AlN having excellent thermal conductivity.
  • the first to fourth electrodes 421, 431, 423, and 433 may be insulated from each other, and penetrate the base 410 up and down to be exposed on the upper and lower portions of the base 410. Accordingly, the electrodes 421, 431, 423, and 433 may be electrically connected to the first and second light emitting parts 100 and 200 positioned on the substrate 400, and may also be lower than the bottom of the substrate 400. The first and second light emitting units 100 and 200 may be electrically connected to the external power through the exposed portion.
  • the present invention is not limited thereto, and the first to fourth electrodes 421, 431, 423, and 433 may have various shapes.
  • at least one of the first to fourth electrodes 421, 431, 423, 433 may be exposed through the side of the base 410, and the first to fourth electrodes 421, 431, At least some of the 423, 433 may be electrically connected to each other.
  • the light emitting device 10 may include five or more electrodes. The electrical connection form between the light emitting parts 100 and 200 and the electrodes will be described in detail later.
  • the substrate 400 may be omitted.
  • the light emitting device 10 may include at least two light emitting units, and may include the first light emitting unit 100 and the second light emitting unit 200 as in the present embodiment. have.
  • the first light emitter 100 and the second light emitter 200 may be positioned on the substrate 400.
  • the first light emitting unit 100 may include a first light emitting device 110 and a first wavelength converter 120.
  • the first light emitting device 110 may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115.
  • the first light emitter 100 may emit light having a wavelength different from that of the second light emitter 200.
  • the first light emitter 100 may emit white light.
  • the light emitting structure 111 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer positioned between the n-type semiconductor layer and the p-type semiconductor layer, and thus, power may be supplied to the first light emitting element 110. When supplied, light may be emitted.
  • the first pad electrode 113 and the second pad electrode 115 may be electrically connected to the n-type semiconductor layer and the p-type semiconductor layer (or vice versa), respectively.
  • the first pad electrode 113 and the second pad electrode 115 may be formed to extend downward from the light emitting structure 111. Accordingly, the first and second pad electrodes 113 and 115 may be formed. It may be located below the first light emitting device 110.
  • first and second pad electrodes 113 and 115 may be positioned on substantially the same plane as the bottom surface of the light emitting structure 111.
  • first and second pad electrodes 113 and 115 may be positioned higher than the bottom surface of the light emitting structure 111.
  • grooves may be formed on the bottom surface of the light emitting structure 111, and the first and second pad electrodes 113 and 115 may be exposed in the grooves.
  • the structural shape of the first light emitting device 110 is not limited, and, for example, a flip chip type semiconductor in which the first pad electrode 113 and the second pad electrode 115 are positioned on one surface of the light emitting structure 111. It may be a light emitting device.
  • the first and second pad electrodes 113 and 115 may be electrically connected to the first electrode 421 and the second electrode 431 of the substrate 400, respectively. Accordingly, power may be supplied to the first light emitting device 110 through the first and second electrodes 421 and 431.
  • the first wavelength converter 120 may be positioned on the first light emitting device 110 and may cover at least a portion of an upper surface of the first light emitting device 110. Furthermore, the first wavelength converter 120 may be formed to have substantially the same area as the top surface of the first light emitting device 110, and thus, as illustrated, the side surface of the first light emitting device 110 and the first wavelength may be formed. Sides of the converter 120 may be formed generally side by side.
  • the first wavelength converter 120 may include a phosphor and a support part supporting the phosphor.
  • the first wavelength converter 120 may include various kinds of phosphors well known to those skilled in the art, for example, garnet-type phosphors, aluminate phosphors, sulfide phosphors, oxynitride phosphors, nitride phosphors, fluoride phosphors, and silicate phosphors.
  • the light emitted from the first light emitting device 110 may be wavelength-converted so that white light may be emitted from the first light emitting part 100.
  • the first wavelength converter 120 may have light having a peak wavelength longer than blue light (for example, green light). , Red light or yellow light).
  • blue light for example, green light
  • the first wavelength converter 120 may have light having a peak wavelength longer than that of the UV light (for example, blue light, Green light, red light or yellow light).
  • the supporting part may include a polymer resin, a ceramic such as glass, or the like.
  • the phosphor may be randomly disposed in the supporting portion.
  • the first wavelength conversion part 120 may be provided by applying and curing a resin including a phosphor on the first light emitting device 110. .
  • the first wavelength converter 120 may include a single crystal material.
  • the first wavelength conversion unit 120 including the single crystal material may be provided in the form of a phosphor sheet, and the first wavelength conversion unit 120 in the form of the sheet may be made of a single crystal phosphor.
  • Light passing through the first wavelength converter 120 including the single crystal phosphor may emit light having a predetermined color coordinate.
  • the single crystal phosphor may be single crystal YAG: Ce.
  • the sheet-shaped first wavelength converter 120 may be formed by being bonded to the first light emitting device 110.
  • the second light emitting unit 200 may be positioned on the substrate 400 and may be spaced apart from the first light emitting unit 100.
  • the second light emitting unit 200 may include a second light emitting device 210 and a second wavelength converter 220.
  • the second light emitting device 210 may include a light emitting structure 211, a third pad electrode 213, and a fourth pad electrode 215.
  • the second light emitting unit 200 may emit light having a wavelength different from that of the first light emitting unit 100, and may emit light of an amber color, for example.
  • the light emitting structure 211, the third pad electrode 213, and the fourth pad electrode 215 of the second light emitting device 210 are described with the light emitting structure 111 and the first light emitting device of the first light emitting device 110, respectively. It is generally similar to the pad electrode 113 and the second pad electrode 115. However, the third pad electrode 213 may be electrically connected to the third electrode 423, and the fourth pad electrode 215 may be electrically connected to the fourth electrode 433.
  • the first light emitting device 110 and the second light emitting device 120 may be electrically connected to separate electrodes 421, 431, 423, and 433, respectively.
  • the first light emitting unit 100 and the second light emitting unit 200 may be independently driven by separately connecting power supplied to the electrodes 421, 431, 423, and 433.
  • the present invention is not limited thereto, and the electrodes 421, 431, 423, and 433 may be electrically connected to each other.
  • the light emitting device 10 may further include a separate controller (not shown), and the driving of the first light emitting unit 100 and the second light emitting unit 200 may be controlled by the controller.
  • the description related to the second wavelength converter 220 is generally the same as the first wavelength converter 120, but the phosphor included in the second wavelength converter 220 is included in the first wavelength converter 120. Different phosphors.
  • the second wavelength converter 220 may include phosphors included in the first wavelength converter 120. And other phosphors. Accordingly, the light emitted from the second light emitting device 210 may be excited by the second wavelength converter 220 and emitted from the second light emitting part 200 to light having a peak wavelength of the amber light band.
  • the second wavelength converter 220 may not include a phosphor.
  • the second wavelength conversion unit 220 when the wavelength band of the light to be emitted by the second light emitting unit 200 substantially coincides with the emission light wavelength band of the second light emitting device 210, the second wavelength conversion unit 220 includes a phosphor. You may not.
  • the second wavelength converter 220 may include a light scattering agent such as TiO 2 .
  • the first and second wavelength conversion section (120, 220) has a larger area than the upper surface of the first and second light emitting device (110, 210), respectively It may be formed as, and may further cover the side of the first and second light emitting device (110, 210).
  • the first and second wavelength conversion parts 120a and 220a are formed to have a larger area than the top surfaces of the first and second light emitting devices 110 and 210, respectively. Can be. Accordingly, an area in which light is emitted from the first and second light emitting parts 100a and 200a may be formed to be relatively wider.
  • the first and second wavelength conversion parts 120b and 220b are formed to further cover side surfaces of the first and second light emitting devices 110 and 210, respectively. Can be.
  • first and second wavelength converters 120b and 220b may further cover at least a portion of the lower surfaces of the first and second light emitting devices 110 and 210, respectively.
  • the first and second wavelength converters 120b and 220b may surround side surfaces of the pad electrodes. In this case, light emitted from the side of the light emitting device may be immediately incident on the wavelength conversion portion, and the wavelength conversion efficiency may be further improved.
  • the sidewall part 300 may cover side surfaces of the first and second light emitting devices 110 and 210, and may further cover side surfaces of the first and second wavelength conversion parts 120 and 220.
  • the sidewall part 300 may contact the first and second light emitting parts 100 and 200.
  • a part of the sidewall part 300 may further cover a part of the lower surfaces of the first and second light emitting devices 110 and 210, and the side surfaces of the pad electrodes 113, 115, 213, and 215 may be sidewalls. It may be surrounded by the part 300.
  • the side wall part 300 may support the first and second light emitting parts 100 and 200, and may also protect the first and second light emitting parts 100 and 200 from an external environment. Furthermore, the side wall part 300 may serve to reflect light. Since the sidewall part 300 is formed on the outer side of the light emitting device 10, the light emitted from the light emitting parts 100 and 200 may be concentrated upward. However, the present invention is not limited thereto, and as necessary, the reflectance, the light transmittance, and the like of the sidewall part 300 may be adjusted to adjust the directing angles of the light emitted from the light emitting parts 100 and 200.
  • the sidewall portion 300 may include an insulating polymer material or a ceramic, and may further include a filler capable of reflecting or scattering light.
  • the sidewall part 300 may have light transmissive, light semitransparent or light reflective.
  • the sidewall part 300 may include a silicone resin or a polymer resin such as an epoxy resin, a polyimide resin, a urethane resin, or the like.
  • the side wall part 300 may include a white silicone resin having light reflectivity.
  • the filler may be uniformly distributed in the sidewall portion 300.
  • the filler is not limited as long as it is a material capable of reflecting or scattering light.
  • the filler may be titanium oxide (TiO 2 ), silicon oxide (SiO 2 ), or zirconium oxide (ZrO 2 ).
  • the side wall part 300 may include at least one of the fillers. By adjusting the type or concentration of the filler, the reflectivity of the sidewall portion 300 or the degree of scattering of light may be adjusted.
  • top surface of the sidewall part 300 and the top surfaces of the first and second light emitting parts 100 and 200 may have the same height. That is, as illustrated, the top surface of the sidewall portion 300 and the top surface of the wavelength conversion parts 120 and 220 may be flush with each other.
  • the thickness of the sidewall portion 300 formed between the first light emitting portion 100 and the second light emitting portion 200 may be smaller than the thickness of the outer side edge portion of the sidewall portion 300. That is, as shown in FIG. 2, the thickness x of the side wall 300 filling the spaced apart region of the first light emitting part 100 and the second light emitting part 200 is determined from the outer side surface of the side wall part 300. It may be smaller than the thickness y corresponding to the shortest distance to one side of one of the first and second light emitting parts 100 and 200. Accordingly, the light emitting device 10 may be further miniaturized by minimizing the separation distance between the first and second light emitting parts 100 and 200, and further, the first and second light emitting parts 100 and 200 may be separated from the outside. More effective protection.
  • the light emitting device 10 may further include a protection element 310.
  • the protection element 310 may be disposed in the sidewall part 300 and may include, for example, a zener diode.
  • the protection element 310 may be electrically connected to at least one of the first and second light emitting elements 110 and 120 to prevent the first and second light emitting elements 110 and 120 from being damaged due to electrostatic discharge. Can be.
  • the protection element 310 may be separately connected to each of the first and second light emitting devices 110 and 120, or may be simultaneously connected to the first and second light emitting devices 110 and 120.
  • the protection element 310 may be positioned at least one side of the sidewall part 300.
  • the protection element 310 may be positioned in the sidewall portion 300, biased to one side of the sidewall portion 300. Accordingly, the distance from one side of the side wall portion 300 where the protection element 310 is offset to the light emitting portions 100 and 200 is from the other side of the side wall portion 300 to the light emitting portions 100 and 200. It can be greater than the distance. That is, the sidewall thickness of the sidewall portion 300 of the portion where the protection element 310 is located may be thicker than the sidewall thickness of the other portion.
  • the light emitting devices 10, 10a, and 10b include a first light emitting part 100 and a second light emitting part 200 which are spaced apart from each other on the substrate 400.
  • the first and second light emitting parts 100 and 200 are electrically connected to different electrodes, respectively. Accordingly, the first light emitter 100 and the second light emitter 200 may be driven independently of each other, and a light emitting device 10 may be provided to selectively emit light of a different color as needed.
  • separately manufacturing at least two or more light emitting devices emitting light of different colors can be omitted, thereby simplifying the manufacturing process.
  • only one light emitting device can emit light of a plurality of colors, it is possible to reduce the spatial ratio occupied by the light emitting device in a specific application.
  • the light emitting device according to the present invention is not limited to the above-described embodiment and may include three or more light emitting parts.
  • the light emitting device of the present invention may include light emitting parts emitting light of three or more kinds of colors.
  • FIG. 6 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
  • the light emitting device 10c includes a light emitting unit 110, a wavelength converting unit 120, and a light emitting unit 100 and a sidewall portion 300 including an adhesive unit 130. Furthermore, the light emitting device 10 may further include a substrate 400 and a protection element (not shown). Hereinafter, detailed description of the same configuration will be omitted.
  • the substrate 400 may be positioned at the bottom of the light emitting device 10c and may support the light emitting device 110 and the sidewall 300.
  • the substrate 400 may be an insulating or conductive substrate, and may also be a PCB including a conductive pattern.
  • the substrate 400 may include a base 410, and may further include a first electrode 421 and a second electrode 431.
  • the present invention is not limited thereto, and the first and second electrodes 421 and 431 may be formed in various forms, and each of the first and second electrodes 421 and 431 may be formed in plural. have. For example, at least one of the first and second electrodes 421 and 431 may be exposed through the side surface of the base 410.
  • the substrate 400 may be omitted.
  • the light emitting device 110 may be positioned on the substrate 400, and may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115.
  • the wavelength converter 120 may be positioned on the light emitting device 110 and may cover at least a portion of an upper surface of the light emitting device 110.
  • the wavelength converter 120 may be formed to have substantially the same area as the top surface of the light emitting device 110.
  • the wavelength converter 120 may have an area of the top surface of the light emitting device 110. Can be greater than
  • the wavelength converter 120 may have a sheet shape, and the wavelength converter 120 having the sheet shape may be adhered to the light emitting device 110.
  • the wavelength conversion unit 120 in the form of a sheet may be bonded by the adhesive unit 130, and the adhesive unit 130 will be described in detail later.
  • the wavelength converter 120 may include a phosphor and a support portion for supporting the phosphor.
  • the wavelength converter 120 may include various kinds of phosphors well known to those skilled in the art, for example, garnet-type phosphors, aluminate phosphors, sulfide phosphors, oxynitride phosphors, nitride phosphors, fluoride phosphors, silicate phosphors, and the like.
  • the light emitted from the light emitting device 110 may be wavelength-converted to emit light of various colors.
  • the wavelength converter 120 may have light having a peak wavelength of a longer wavelength than blue light (for example, green light, red light, or yellow light). Light) to emit light).
  • the wavelength converter 120 may include light having a peak wavelength having a wavelength longer than that of the UV light (eg, blue light, green light, red light, or the like). Yellow light). Accordingly, the white light may be emitted from the light emitting device 10.
  • the wavelength converter 120 may include one type of phosphor.
  • the supporting part may include a polymer resin, a ceramic such as glass, or the like.
  • the phosphor may be randomly disposed in the supporting portion.
  • the wavelength conversion part 120 may include a single crystal material.
  • the wavelength conversion unit 120 including the single crystal material may be provided in the form of a phosphor sheet, and the wavelength conversion unit 120 in the form of the sheet may be made of a single crystal phosphor.
  • the single crystal phosphor may be formed of a single crystal.
  • YAG: Ce Light passing through the wavelength converting part 120 including the single crystal phosphor sheet may emit light having a predetermined color coordinate, so that the wavelength converting part 120 including the single crystal phosphor sheet is applied to a plurality of light emitting devices. If the color coordinate deviation between the plurality of light emitting devices can be reduced.
  • the adhesion part 130 may be positioned between the light emitting element 110 and the wavelength conversion part 120 and may serve to bond the light emitting element 110 and the wavelength conversion part 120.
  • the adhesive part 130 may include an adhesive material 131 and a phosphor 133 dispersed in the adhesive material 131.
  • the adhesive material 131 may be a general adhesive such as a polymer adhesive or a silicone adhesive.
  • the phosphor 133 included in the adhesion part 130 may convert the wavelength of the light emitted from the light emitting device 110. Accordingly, in the light emitting device according to the present exemplary embodiment, the light emitted from the light emitting element 110 may be first wavelength-converted at the adhesive part 130, and then may be wavelength-converted secondly at the wavelength converter 120. In this case, the wavelength of the wavelength-converted light emitted from the phosphor 133 of the adhesive unit 130 and the wavelength of the light converted by the wavelength converter 120 may be different from each other. In addition, the peak wavelength of the wavelength converted by the phosphor 133 of the adhesive unit 130 may be longer than the peak wavelength of the wavelength converted by the wavelength converter 120.
  • the phosphor 133 of the adhesive part 130 may emit red light, and the wavelength converter 120 may emit green light or yellow light.
  • the first wavelength-converted light in the adhesive part 130 may be wavelength-converted in the wavelength converter 120 again to prevent the light emitted from the light emitting device 10c from having unexpected color coordinates.
  • the light emitted from the light emitting device 110 is first wavelength-converted by the phosphor 133 included in the adhesive part 130, and is then secondarily wavelength-converted by the wavelength converter 120. Accordingly, since the light emitted from the light emitting device 110 is wavelength-converted in two stages, light having substantially uniform color coordinates may be emitted to the plurality of light emitting devices 10c. That is, deviations in color coordinates between the plurality of light emitting devices 10c may be reduced.
  • the adhesive unit 130 includes one phosphor and the wavelength converter 120 also includes one phosphor, the color coordinate deviation between the plurality of light emitting devices 10c may be further reduced. You can.
  • the color coordinates of the light emitted from the light emitting device 10c may be easily adjusted by adjusting the type and concentration of the phosphor included in the adhesive part 130.
  • the color coordinates of the light emitting devices 10c may be simply adjusted by adjusting only the phosphor 133 included in the adhesive part 130.
  • the single crystal phosphor sheet cannot adjust the concentration of the phosphor and the like, and the color coordinates of the light emitted from the wavelength converter 120 are substantially constant.
  • the color coordinates of the light emitted from the light emitting device 10c may be easily adjusted by adjusting the type and concentration of the phosphor 133 included in the adhesive part 130. Therefore, the color coordinates of the light emitting device 10c including the single crystal phosphor sheet can be easily adjusted, while significantly reducing the color coordinate deviation of the plurality of light emitting devices 10c produced in the same process.
  • the adhesive part 130 may be positioned between the light emitting device 110 and the wavelength conversion part 120, and may further cover at least a portion of the side surface of the light emitting device 110.
  • the adhesive part 130 formed on the side surface of the light emitting device 110 may have an inclination.
  • the adhesive portion 130 may be formed in a shape in which the width thereof becomes narrower from the top to the downward direction by its surface tension.
  • the adhesive part 130 is formed on the side surface of the light emitting device 110, the light emitted from the light emitting device 110 may be more effectively wavelength-converted.
  • the side wall part 300 may also be inclined so that the light emitted from the light emitting device 110 may be reflected upward. Therefore, the luminous efficiency of the light emitting device 10c can be increased.
  • the adhesive part 130 may extend to the lower surface of the light emitting device 110 and may also be in contact with side surfaces of the first and second electrodes 113 and 115. .
  • the sidewall part 300 may cover the side surface of the light emitting part 100, and specifically, may cover the side surface of the light emitting device 110, the side surface of the adhesive part 130, and the side surface of the wavelength conversion part 120. In addition, a part of the sidewall part 300 may further cover a part of the bottom surface of the light emitting device 110. In this case, side surfaces of the pad electrodes 113 and 115 may be surrounded by the sidewall part 300.
  • the side wall part 300 may support the light emitting device 110 and may also protect the light emitting device 110 from an external environment. Furthermore, the side wall part 300 may serve to reflect light. Since the side wall part 300 is formed on the outer side surface of the light emitting device 10, the light emitted from the light emitting part 100 may be concentrated upward. In particular, when the adhesive part 130 extends to the side surface of the light emitting device 110 and has an inclination, the side wall part 300 of the part contacting the side surface of the adhesive part 130 may be inclined. Therefore, the luminous efficiency of the light emitting device 10 can be further improved.
  • the present invention is not limited thereto, and as necessary, the reflection angle, the light transmittance, and the like of the sidewall part 300 may be adjusted to adjust the directing angle of the light emitted from the light emitting part 100.
  • the sidewall portion 300 may include an insulating polymer material or a ceramic, and may further include a filler capable of reflecting or scattering light.
  • the sidewall part 300 may have light transmissive, light semitransparent or light reflective.
  • the sidewall part 300 may include a silicone resin or a polymer resin such as an epoxy resin, a polyimide resin, a urethane resin, or the like.
  • the side wall part 300 may include a white silicone resin having light reflectivity.
  • the upper surface of the side wall portion 300 and the upper surface of the light emitting portion 100 may form the same height with each other. That is, as illustrated, the top surface of the sidewall portion 300 and the top surface of the wavelength conversion portion 120 may be formed flush with each other.
  • FIG. 7 to 9 are cross-sectional views illustrating a method of manufacturing a light emitting device according to still another embodiment of the present invention. 7 to 9, a light emitting device as shown in FIG. 6 may be provided, and a detailed description of the same configuration will be omitted.
  • the light emitting device 110 is disposed on the substrate 400, and the preliminary adhesion part 130a is formed on the light emitting device 110.
  • the preliminary adhesive part 130a may include an adhesive material and a phosphor, and may be a material having a viscosity.
  • the preliminary adhesive part 130a may have a form in which phosphors are dispersed in a viscous silicone adhesive.
  • the preliminary adhesive portion 130a may be formed using a method such as dispensing.
  • the wavelength converter 120 is disposed on the light emitting device 110, but the preliminary adhesive part 130a between the wavelength converter 120 and the light emitting device 110 is the light emitting device 110. It can spread along the top of). Accordingly, as shown in FIG. 9, the preliminary adhesive part 130a may be positioned between the light emitting device 110 and the wavelength conversion part 120, and further, may extend to the side of the light emitting device 110 to spread. Can be. In particular, since the preliminary adhesive portion 130a may be a viscous material, the inclined side surface may be formed as shown by its surface tension.
  • the amount of the preliminary adhesive portion 130a dispensed on the light emitting device 110 and the pressure for pressing the wavelength conversion part 120 in the direction toward the light emitting device 110 are adjusted, so that the preliminary adhesive portion 130a is a light emitting device.
  • the degree formed on the side of the 110 can be adjusted.
  • the light emitting device 10 as illustrated in FIG. 1 may be provided.
  • 10 to 13 are a perspective view, a plan view, a bottom plan view and a sectional view for describing a light emitting device according to an embodiment of the present invention.
  • 9 is a plan view illustrating a light emitting device according to still another embodiment of the present invention.
  • the light emitting device 10d described with reference to FIGS. 10 to 13 is different from the light emitting device 10c described with reference to FIG. 6 in that it includes a plurality of light emitting units 100 and 200.
  • the light emitting device 10d according to the present exemplary embodiment is different from the light emitting device 10 described with reference to FIGS. 1 to 4 in that it further includes adhesive parts 130 and 230.
  • the light emitting device 10d will be described based on differences, and a detailed description of the same configuration will be omitted.
  • the light emitting device 10d may include at least two light emitting parts. Specifically, the light emitting device 10d may include the first light emitting part 100, the second light emitting part 200, The side wall portion 300 is included. Furthermore, the light emitting device 10d may further include a substrate 400 and a protection element 310.
  • the substrate 400 may be located at the bottom of the light emitting device 10d and may serve to support the first and second light emitting parts 100 and 200 and the sidewall part 300.
  • the substrate 400 may include a base 410, and may further include first to fourth electrodes 421, 431, 423, and 433.
  • the first light emitter 100 and the second light emitter 200 may be positioned on the substrate 400.
  • the first light emitting part 100 may include a first light emitting device 110, a first wavelength converting part 120, and a first adhesive part 130.
  • the second light emitting unit 200 may include a second light emitting device 210, a second wavelength converting unit 220, and a second adhesive unit 230.
  • the first light emitter 100 may emit light having a wavelength different from that of the second light emitter 200.
  • the first light emitter 100 may emit white light and amber color light, respectively.
  • the first light emitting unit 100 may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115
  • the second light emitting unit 200 may include a light emitting structure 211.
  • the third pad electrode 213 and the fourth pad electrode 215 may be included.
  • the first and second wavelength converters 120 and 220 may be positioned on the first and second light emitting devices 110 and 210, respectively, and may include phosphors.
  • the first and second wavelength conversion parts 120 and 220 may further include a support part supporting the phosphor.
  • the first and second wavelength converters 120 and 220 may include a single crystal phosphor sheet, and the single crystal phosphor sheet may be, for example, single crystal YAG: Ce.
  • the first and second adhesive parts 130 and 230 may be positioned between the light emitting devices 110 and 210 and the wavelength converters 120 and 220, respectively.
  • the first and second adhesive parts 130 and 230 may each include an adhesive material and phosphors dispersed in the adhesive material.
  • the first and second pad electrodes 113 and 115 may be electrically connected to the first electrode 421 and the second electrode 431 of the substrate 400, respectively. Accordingly, power may be supplied to the first light emitting device 110 through the first and second electrodes 421 and 431.
  • the third pad electrode 213 may be electrically connected to the third electrode 423
  • the fourth pad electrode 215 may be electrically connected to the fourth electrode 433. Accordingly, power may be supplied to the second light emitting device 210 through the third and fourth electrodes 423 and 433.
  • the second wavelength converter 220 may not include a phosphor.
  • the second wavelength conversion unit 220 when the wavelength band of the light to be emitted by the second light emitting unit 200 substantially coincides with the emission light wavelength band of the second light emitting device 210, the second wavelength conversion unit 220 includes a phosphor. You may not.
  • the second wavelength converter 220 may include a light scattering agent such as TiO 2 .
  • the sidewall part 300 may cover side surfaces of the first and second light emitting devices 110 and 210, and may further cover side surfaces of the first and second wavelength conversion parts 120 and 220.
  • the sidewall part 300 may contact the first and second light emitting parts 100 and 200.
  • a part of the sidewall part 300 may further cover a part of the lower surfaces of the first and second light emitting devices 110 and 210, and the side surfaces of the pad electrodes 113, 115, 213, and 215 may be sidewalls. It may be surrounded by the part 300.
  • the light emitting device 10a may further include a protection element 310.
  • the protection element 310 may be disposed in the sidewall part 300 and may include, for example, a zener diode.
  • the light emitting devices 10, 10a, 10b, and 10d include a first light emitting part 100 and a second light emitting part 200 which are spaced apart from each other on the substrate 400.
  • the first and second light emitting parts 100 and 200 are electrically connected to different electrodes, respectively. Accordingly, the first light emitter 100 and the second light emitter 200 may be driven independently of each other, and a light emitting device 10a that selectively emits light of a different color may be provided as necessary.
  • separately manufacturing at least two or more light emitting devices emitting light of different colors can be omitted, thereby simplifying the manufacturing process. Furthermore, since only one light emitting device can emit light of a plurality of colors, it is possible to reduce the spatial ratio occupied by the light emitting device in a specific application.
  • the light emitting device 10e may include a plurality of first light emitting units 100 and a plurality of second light emitting units 200.
  • the plurality of first light emitting units 100 may be connected to each other in series or in parallel, and the plurality of second light emitting units 200 may also be connected to each other in series or in parallel.
  • the light emitting device 10e since the light emitting device 10e includes three or more light emitting parts, the light emission intensity of the light emitting device 10e may be improved.
  • the light emitting device of the present invention may include light emitting parts emitting light of three or more kinds of colors.
  • the light emitting device described in the above embodiments may emit light of two or more colors from one light emitting device. Such a light emitting device may be applied to an application device requiring a plurality of emission colors, and for example, may be applied to a vehicle lamp.
  • a vehicle lamp including a light emitting device according to embodiments of the present invention will be described with reference to FIG. 15.
  • 15 is a front view for explaining a vehicle lamp according to another embodiment of the present invention.
  • the vehicle lamp 20 may include a combination lamp 23, and further may further include a main lamp 21.
  • the vehicle lamp 20 may be applied to various parts of a vehicle such as a headlight, a backlight, or a side mirror light.
  • the main lamp 21 may be a main light in the vehicle lamp 20, and, for example, when the vehicle lamp 20 is used as a headlight, the main lamp 21 may serve as a headlight for illuminating the front of the vehicle.
  • the combination lamp 23 may include a light emitting device 10 according to embodiments of the present invention.
  • the light emitting device 10 may include at least one of the light emitting devices 10, 10a, 10b, 10c, 10d, and 10e according to the above-described embodiments.
  • the combination lamp 23 may serve at least two functions. For example, when the vehicle lamp 20 is used as a headlight, the combination lamp 23 may function as a daytime running light (DRL) and a turn signal.
  • DDL daytime running light
  • the light emitting device 10 of the combination lamp 23 emits light from the first light emitting unit 100 that emits white light. Emits. Accordingly, the combination lamp 23 may emit white light to function as a daytime running light.
  • the light emitting device 10 of the combination lamp 23 turns off the power of the first light emitting unit 100, and the second light emitting unit 200. Emits amber light. Accordingly, the combination lamp 23 may function as a turn signal by emitting light of amber color.
  • the driving of the combination lamp 23 and the light emitting device 10 may be controlled by a separate controller (not shown).
  • the light emitting device 10 may be used as a light source of the combination lamp 23 that emits two or more colors of light to perform at least two functions. Since the light emitting device 10 according to the embodiments of the present invention includes at least two light emitting parts emitting light of different wavelengths, two separate lamps are manufactured when the vehicle lamp 20 including the combination lamp 23 is manufactured. The process of mounting the above light emitting device can be omitted. Therefore, the defective rate of the vehicle lamp 20 can be reduced, and the manufacturing yield can be improved by simplifying the manufacturing process. In addition, when the light emitting device 10 includes the adhesive parts 130 and 230, color coordinate deviation between the manufactured light emitting devices 10 may be reduced, thereby improving production yield.
  • color deviation between applications to which the light emitting device 10 is applied may also be reduced.
  • volume of the light emitting device 10 is relatively small, spatial constraints in manufacturing the combination lamp 23 may be reduced, and various modifications and changes of the combination lamp 23 may be facilitated.
  • the present invention is not limited thereto, and the light emitting device may be applied to various other application mechanisms besides a vehicle lamp.
  • the present invention is not limited to the above-described various embodiments and features, and various modifications and changes may be made without departing from the technical spirit of the claims of the present invention.

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Abstract

A light emitting device is disclosed. The light emitting device comprises: a light emitting portion comprising a light emitting element, a wavelength conversion portion positioned on the light emitting element, and an attachment portion position between the light emitting element and the wavelength conversion portion; and a side wall portion contacting a side surface of the light emitting portion, wherein the attachment comprises a fluorescent body, and the wavelength of light emitted from the fluorescent body of the attachment portion is different from the wavelength of light emitted from the wavelength conversion portion.

Description

발광 장치Light emitting device
본 발명은 발광 장치에 관한 것으로, 특히, 두 종류 이상의 서로 다른 파장의 광을 방출할 수 있음과 아울러, 생산된 발광 장치들 간의 색좌표 편차가 감소된 발광 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a light emitting device capable of emitting light of two or more different wavelengths and having reduced color coordinate variation among produced light emitting devices.
발광 다이오드는 전자와 정공의 재결합으로 발생하는 광을 발하는 무기 반도체 소자로서, 최근, 디스플레이, 자동차 램프, 일반 조명 등의 여러 분야에서 사용된다. 발광 다이오드는 수명이 길고, 소비 전력이 낮으며, 응답 속도가 빨라서, 발광 다이오드를 포함하는 발광 장치는 종래의 광원을 대체할 것으로 기대된다.BACKGROUND ART Light emitting diodes are inorganic semiconductor devices that emit light generated by recombination of electrons and holes. Recently, light emitting diodes are used in various fields such as displays, automobile lamps, and general lighting. Light emitting diodes have a long lifetime, low power consumption, and fast response times, so that light emitting devices including light emitting diodes are expected to replace conventional light sources.
이러한 발광 다이오드는 상대적으로 좁은 반치폭을 갖는 광을 방출하므로, 일반적인 발광 다이오드는 대체로 단색에 가까운 광을 방출한다. 따라서 발광 다이오드를 포함하는 발광 장치에서 백색광을 구현하기 위해서, 일반적으로 형광체를 이용하여 광의 혼색을 유도하여 백색광을 구현한다. 형광체는 상대적으로 파장이 짧은 광을 흡수하여 상대적으로 파장이 긴 광을 방출하므로, 청색 발광 다이오드 또는 UV 발광 다이오드와 같은 짧은 파장의 광을 방출하는 발광 다이오드를 형광체로 도포하여 발광 장치에서 백색광이 방출되도록 하는 구성을 이용한다.Since such light emitting diodes emit light having a relatively narrow half-width, the general light emitting diodes generally emit light close to a single color. Therefore, in order to implement white light in a light emitting device including a light emitting diode, in general, white light is implemented by inducing color mixing of light using a phosphor. Since the phosphor absorbs light having a relatively short wavelength and emits light having a relatively long wavelength, white light is emitted from the light emitting device by applying a light emitting diode emitting a short wavelength light such as a blue light emitting diode or a UV light emitting diode with a phosphor. Use a configuration that makes it possible.
본 발명이 해결하고자 하는 과제는, 생산된 발광 장치들 간의 방출광의 색좌표 편차가 감소된 발광 장치를 제공하는 것이다.SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting device having reduced color coordinate variation of emitted light among produced light emitting devices.
본 발명의 일 측면에 따른 발광 장치는, 발광 소자, 상기 발광 소자 상에 위치하는 파장변환부, 및 상기 발광 소자와 파장변환부 사이에 위치하는 접착부를 포함하는 발광부; 및 상기 발광부의 측면을 둘러싸고, 상기 발광부의 측면과 접하는 측벽부를 포함하고, 상기 접착부는 형광체를 포함하며, 상기 접착부의 형광체로부터 방출되는 광의 파장은 상기 파장변환부로부터 방출되는 광의 파장과 서로 다르다.According to an aspect of an exemplary embodiment, there is provided a light emitting device, including: a light emitting unit including a light emitting element, a wavelength conversion unit positioned on the light emitting element, and an adhesive unit positioned between the light emitting element and the wavelength conversion unit; And a side wall portion surrounding the side surface of the light emitting part and in contact with the side surface of the light emitting part, wherein the adhesive part comprises a phosphor, and the wavelength of the light emitted from the phosphor of the adhesive part is different from the wavelength of the light emitted from the wavelength conversion part.
상기 접착부의 형광체로부터 방출되는 광의 피크 파장은 상기 파장변환부로부터 방출되는 광의 피크 파장보다 길 수 있다.The peak wavelength of the light emitted from the phosphor of the adhesive unit may be longer than the peak wavelength of the light emitted from the wavelength converter.
상기 접착부의 형광체는 적색 형광체일 수 있고, 상기 파장변환부는 녹색 형광체 또는 황색 형광체를 포함할 수 있다.The phosphor of the adhesive part may be a red phosphor, and the wavelength converter may include a green phosphor or a yellow phosphor.
상기 접착부 및 상기 파장변환부는 각각 서로 다른 1종의 형광체를 포함할 수 있다.The adhesive portion and the wavelength conversion portion may each include one different phosphor.
상기 파장변환부는 단결정 형광체 시트를 포함할 수 있다.The wavelength converter may include a single crystal phosphor sheet.
상기 단결정 형광체 시트는 단결정의 YAG:Ce를 포함할 수 있고, 상기 접착부는 적색 형광체를 포함할 수 있다.The single crystal phosphor sheet may include a single crystal of YAG: Ce, and the adhesive portion may include a red phosphor.
상기 접착부는 상기 발광 소자의 측면까지 연장되어 형성될 수 있다.The adhesive part may extend to the side of the light emitting device.
또한, 상기 발광 소자의 측면 상에 위치하는 접착부의 부분은, 경사진 측면을 가질 수 있다.In addition, the portion of the adhesive portion located on the side of the light emitting device may have an inclined side surface.
상기 접착부의 측면 중 경사진 부분은 상기 측벽부와 접하며, 상기 측벽부는 광 반사성 특성을 가질 수 있다.An inclined portion of the side of the adhesive portion may contact the sidewall portion, and the sidewall portion may have a light reflective characteristic.
상기 발과 장치는, 기판을 더 포함할 수 있고, 상기 발광부 및 상기 측벽부는 상기 기판 상에 위치할 수 있다.The foot and the device may further include a substrate, and the light emitting portion and the sidewall portion may be positioned on the substrate.
본 발명의 또 다른 측면에 따른 발광 장치는, 제1 발광 소자, 상기 발광 소자 상에 위치하는 제1 파장변환부, 및 상기 제1 발광 소자와 제1 파장변환부 사이에 위치하는 제1 접착부를 포함하는 제1 발광부; 상기 제1 발광부와 이격되며, 제2 발광 소자, 상기 발광 소자 상에 위치하는 제2 파장변환부, 및 상기 제2 발광 소자와 제2 파장변환부 사이에 위치하는 제2 접착부를 포함하는 제2 발광부; 상기 제1 및 제2 발광부의 측면을 둘러싸며, 상기 제1 및 제2 발광부의 측면과 접하는 측벽부를 포함하고, 상기 제1 및 제2 접착부는 각각 제1 및 제2 형광체를 포함하며, 상기 제1 형광체로부터 방출되는 광의 파장은 상기 제1 파장변환부로부터 방출되는 파장과 서로 다르고, 상기 제2 형광체로부터 방출되는 광의 파장은 상기 제2 파장변환부로부터 방출되는 파장과 서로 다르며, 상기 제1 발광부와 상기 제2 발광부는 서로 다른 피크 파장을 갖는 광을 방출한다.In another embodiment, a light emitting device includes a first light emitting element, a first wavelength converting portion positioned on the light emitting element, and a first adhesive portion positioned between the first light emitting element and the first wavelength converting portion. A first light emitting unit comprising; A second light emitting part spaced apart from the first light emitting part and including a second light emitting element, a second wavelength converting part positioned on the light emitting element, and a second adhesive part positioned between the second light emitting element and the second wavelength converting part; 2 light emitting unit; A side wall part surrounding side surfaces of the first and second light emitting parts and contacting side surfaces of the first and second light emitting parts, wherein the first and second adhesive parts respectively include first and second phosphors, The wavelength of the light emitted from the first phosphor is different from the wavelength emitted from the first wavelength converter, the wavelength of the light emitted from the second phosphor is different from the wavelength emitted from the second wavelength converter, and the first light emission The light emitting part and the second light emitting part emit light having different peak wavelengths.
상기 발광 장치는, 기판을 더 포함할 수 있고, 상기 제1 및 제2 발광부, 및 상기 측벽부는 상기 기판 상에 위치할 수 있다.The light emitting device may further include a substrate, and the first and second light emitting parts and the sidewall part may be positioned on the substrate.
상기 기판은 제1 내지 제4 전극을 포함할 수 있고, 상기 제1 및 제2 전극은 상기 제1 발광부에 전기적으로 연결되고, 상기 제3 및 제4 전극은 제2 발광부에 전기적으로 연결될 수 있다.The substrate may include first to fourth electrodes, wherein the first and second electrodes are electrically connected to the first light emitting part, and the third and fourth electrodes are electrically connected to a second light emitting part. Can be.
상기 제1 내지 제4 전극은 서로 절연되며, 상기 제1 내지 제4 전극 각각은 상기 기판의 외부 표면에 노출될 수 있다.The first to fourth electrodes may be insulated from each other, and each of the first to fourth electrodes may be exposed to an outer surface of the substrate.
상기 제1 발광부는 백색광을 방출할 수 있다.The first light emitting part may emit white light.
또한, 상기 파장변환부는 단결정 형광체 시트를 포함할 수 있다.In addition, the wavelength conversion unit may include a single crystal phosphor sheet.
상기 단결정 형광체 시트는 단결정의 YAG:Ce를 포함할 수 있고, 상기 접착부는 적색 형광체를 포함할 수 있다.The single crystal phosphor sheet may include a single crystal of YAG: Ce, and the adhesive portion may include a red phosphor.
상기 접착부의 형광체로부터 방출되는 광의 피크 파장은 상기 파장변환부로부터 방출되는 광의 피크 파장보다 길 수 있다.The peak wavelength of the light emitted from the phosphor of the adhesive unit may be longer than the peak wavelength of the light emitted from the wavelength converter.
상기 접착부 및 상기 파장변환부는 각각 서로 다른 1종의 형광체를 포함할 수 있다.The adhesive portion and the wavelength conversion portion may each include one different phosphor.
몇몇 실시예들에 있어서, 상기 접착부는 상기 발광 소자의 측면까지 연장되어 형성될 수 있고, 상기 발광 소자의 측면 상에 위치하는 접착부의 부분은, 경사진 측면을 가질 수 있다.In some embodiments, the adhesive part may extend to the side of the light emitting device, and a portion of the adhesive part disposed on the side of the light emitting device may have an inclined side surface.
본 발명에 따르면, 필요에 따라 선택적으로 다른 색의 광을 방출하는 발광 장치가 제공될 수 있어, 서로 다른 색의 광을 방출하는 적어도 둘 이상의 발광 장치를 별도로 제조하는 것을 생략할 수 있어, 제조 공정이 간소화될 수 있다.According to the present invention, a light emitting device that selectively emits light of different colors may be provided as needed, so that separately manufacturing at least two or more light emitting devices that emit light of different colors may be omitted, thereby manufacturing process This can be simplified.
또한, 상기 발광 장치를 차량용 램프에 적용하여, 하나의 램프에서 복수의 기능을 할 수 있는 콤비네이션 램프의 제조 공정이 간소화될 수 있고, 불량이 감소될 수 있다.In addition, by applying the light emitting device to a vehicle lamp, the manufacturing process of the combination lamp that can perform a plurality of functions in one lamp can be simplified, the defect can be reduced.
또한, 본 발명에 따르면, 형광체를 포함하는 접착부를 갖는 발광 장치를 제공함으로써, 발광 장치에서 방출되는 광의 색좌표 조절이 용이하고, 또한, 동일한 공정에서 제조된 발광 장치들 간의 색좌표 편차를 현저하게 감소시킬 수 있다.Further, according to the present invention, by providing a light emitting device having an adhesive portion containing a phosphor, it is easy to adjust the color coordinates of the light emitted from the light emitting device, and also significantly reduce the color coordinate deviation between the light emitting devices manufactured in the same process Can be.
도 1은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 사시도이다.1 is a perspective view illustrating a light emitting device according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 평면도이다.2 is a plan view illustrating a light emitting device according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 저부 평면도이다.3 is a bottom plan view illustrating a light emitting device according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 단면도이다.4 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
도 5a 및 도 5b는 본 발명의 다른 실시예들에 따른 발광 장치들을 설명하기 위한 단면도들이다.5A and 5B are cross-sectional views illustrating light emitting devices according to other exemplary embodiments of the present invention.
도 6은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 단면도이다.6 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
도 7 내지 도 9는 본 발명의 또 다른 실시예에 따른 발광 장치 제조 방법을 설명하기 위한 단면도들이다.도 10 내지 도 13은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 사시도, 평면도, 저부 평면도 및 단면도이다.7 to 9 are cross-sectional views illustrating a method of manufacturing a light emitting device according to still another embodiment of the present invention. FIGS. 10 to 13 are a perspective view, a plan view, and a view illustrating a light emitting device according to an embodiment of the present invention; Bottom view and section view.
도 14는 본 발명의 또 다른 실시예에 따른 발광 장치를 설명하기 위한 평면도이다.14 is a plan view illustrating a light emitting device according to still another embodiment of the present invention.
도 15은 본 발명의 또 다른 실시예에 따른 차량용 램프를 설명하기 위한 정면도이다.15 is a front view for explaining a vehicle lamp according to another embodiment of the present invention.
발광 다이오드는 상대적으로 좁은 반치폭을 갖는 광을 방출하므로, 일반적인 발광 다이오드는 대체로 단색에 가까운 광을 방출한다. 따라서 하나의 발광 모듈이나 발광 기구에서 필요에 따라 여러 색을 방출하도록 하려면, 서로 다른 색의 광을 방출하는 발광 다이오드 패키지 등을 하나의 모듈에 설치하여야 한다.Since light emitting diodes emit light having a relatively narrow half-width, typical light emitting diodes generally emit light close to a single color. Therefore, in order for one light emitting module or a light emitting device to emit various colors as necessary, light emitting diode packages for emitting light of different colors must be installed in one module.
이에 따라, 둘 이상의 색을 방출하는 발광 모듈이나 발광 기구를 제조할 때, 서로 다른 색을 방출하는 발광 다이오드 패키지의 실장 공정이 적어도 2회 이상 수행되어야 한다. 공정 수가 증가함에 따라, 발광 모듈이나 발광 기구의 제조 수율이 감소될 수 있다. 또한, 복수의 발광 다이오드 패키지가 실장됨에 따라, 발광 모듈이나 발광 기구의 부피가 상대적으로 증가할 수 밖에 없다.Accordingly, when manufacturing a light emitting module or a light emitting device that emits two or more colors, the mounting process of the light emitting diode package emitting different colors should be performed at least twice. As the number of processes increases, the manufacturing yield of the light emitting module or light emitting device may be reduced. In addition, as the plurality of light emitting diode packages are mounted, the volume of the light emitting module or the light emitting device is inevitably increased.
또한, 조명용으로 이용되는 백색 발광 장치의 경우, 높은 연색성이 요구되므로 2종 이상의 형광체가 적용된 발광 장치를 이용한다. 예컨대, 발광 장치는, 청색 발광 다이오드, 청색 발광 다이오드의 주변에 위치하는 녹색 및 적색 형광체를 포함하고, 청색 발광 다이오드에서 방출되는 청색광, 각각의 형광체에서 파장변환되어 방출되는 녹색광과 적색광이 혼색되어 백색광이 구현될 수 있다.In addition, in the case of a white light emitting device used for illumination, since high color rendering is required, a light emitting device to which two or more kinds of phosphors are applied is used. For example, the light emitting device includes a blue light emitting diode and green and red phosphors positioned around the blue light emitting diode, and the blue light emitted from the blue light emitting diode, the green light and the red light emitted by wavelength conversion from each phosphor are mixed, and the white light is mixed. This can be implemented.
그런데, 이와 같이 2종 이상의 형광체를 이용하는 경우, 발광 다이오드에 방출된 광이 어떤 형광체에 먼저 도달하느냐에 따라 발광 장치에서 방출되는 백색광의 색좌표가 달라지게 된다. 이에 따라, 동일한 공정에서 생산되는 발광 장치들 간의 색좌표 편차가 발생하여, 발광 장치의 제조 수율이 떨어진다.However, when two or more phosphors are used in this way, the color coordinates of the white light emitted from the light emitting device vary depending on which phosphor first emits light emitted from the light emitting diode. As a result, color coordinate deviations occur between light emitting devices produced in the same process, thereby lowering the manufacturing yield of the light emitting device.
이하, 첨부한 도면들을 참조하여 본 발명의 실시예들을 상세히 설명한다. 다음에 소개되는 실시예들은 본 발명이 속하는 기술분야의 통상의 기술자에게 본 발명의 사상이 충분히 전달될 수 있도록 하기 위해 예로서 제공되는 것이다. 따라서, 본 발명은 이하 설명되는 실시예들에 한정되지 않고 다른 형태로 구체화될 수도 있다. 그리고 도면들에 있어서, 구성요소의 폭, 길이, 두께 등은 편의를 위하여 과장되어 표현될 수도 있다. 또한, 하나의 구성요소가 다른 구성요소의 "상부에" 또는 "상에" 있다고 기재된 경우 각 부분이 다른 부분의 "바로 상부" 또는 "바로 상에" 있는 경우뿐만 아니라 각 구성요소와 다른 구성요소 사이에 또 다른 구성요소가 있는 경우도 포함한다. 명세서 전체에 걸쳐서 동일한 참조번호들은 동일한 구성요소들을 나타낸다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art to which the present invention pertains. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. In addition, when one component is described as "on" or "on" another component, each component is different from each other as well as when the component is "just above" or "on" the other component. This includes cases where there is another component between them. Like numbers refer to like elements throughout.
도 1 내지 도 4는 각각 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 사시도, 평면도, 저부 평면도 및 단면도이다. 특히, 도 4의 단면도는 도 1 내지 도 3의 A-A선에 대응하는 영역의 단면을 도시한다.1 to 4 are a perspective view, a plan view, a bottom plan view, and a cross-sectional view for explaining a light emitting device according to an embodiment of the present invention, respectively. In particular, the cross-sectional view of FIG. 4 shows a cross section of the region corresponding to the line A-A of FIGS. 1 to 3.
도 1 내지 도 4를 참조하면, 발광 장치(10)는 적어도 2 이상의 발광부를 포함할 수 있고, 구체적으로, 발광 장치(10)는 제1 발광부(100), 제2 발광부(200), 측벽부(300)를 포함한다. 나아가, 발광 장치(10)는 기판(400) 및 보호 소자(310)를 더 포함할 수 있다.1 to 4, the light emitting device 10 may include at least two light emitting units. Specifically, the light emitting device 10 may include a first light emitting unit 100, a second light emitting unit 200, The side wall portion 300 is included. Furthermore, the light emitting device 10 may further include a substrate 400 and a protection element 310.
기판(400)은 발광 장치(10)의 저부에 위치할 수 있으며, 제1 및 제2 발광부(100, 200)와 측벽부(300)를 지지하는 역할을 할 수 있다. 기판(400)은 절연성 또는 도전성 기판일 수 있으며, 또한, 도전성 패턴을 포함하는 PCB일 수 있다. 기판(400)이 절연성 기판인 경우, 기판(400)은 폴리머 물질, 또는 세라믹 물질을 포함할 수 있고, 예를 들어, AlN와 같이 열전도성이 우수한 세라믹 물질을 포함할 수 있다.The substrate 400 may be located at the bottom of the light emitting device 10, and may support the first and second light emitting parts 100 and 200 and the sidewall part 300. The substrate 400 may be an insulating or conductive substrate, and may also be a PCB including a conductive pattern. When the substrate 400 is an insulating substrate, the substrate 400 may include a polymer material or a ceramic material. For example, the substrate 400 may include a ceramic material having excellent thermal conductivity such as AlN.
또한, 기판(400)은 베이스(410)를 포함할 수 있고, 나아가, 제1 내지 제4 전극(421, 431, 423, 433)을 더 포함할 수 있다. 이때, 베이스(410)는 기판(400) 및 전극들(421, 431, 423, 433)을 전체적으로 지지하는 역할을 할 수 있으며, 전극들(421, 431, 423, 433)을 서로 절연시키기 위하여 절연성 물질을 포함할 수 있다. 예를 들어, 베이스(410)는 열전도성이 우수한 AlN과 같은 세라믹 물질을 포함할 수 있다.In addition, the substrate 400 may include a base 410, and may further include first to fourth electrodes 421, 431, 423, and 433. At this time, the base 410 may serve to support the substrate 400 and the electrodes 421, 431, 423, 433 as a whole, and to insulate the electrodes 421, 431, 423, 433 from each other. It may include a substance. For example, the base 410 may include a ceramic material such as AlN having excellent thermal conductivity.
제1 내지 제4 전극(421, 431, 423, 433)들은 서로 절연될 수 있으며, 베이스(410)를 상하로 관통하여, 베이스(410) 상부 및 하부 상에 노출될 수 있다. 이에 따라, 전극들(421, 431, 423, 433)은 기판(400) 상에 위치하는 제1 및 제2 발광부(100, 200)와 전기적으로 연결될 수 있고, 또한, 기판(400)의 하부에 노출된 부분을 통해 외부 전원과 전기적으로 연결되어 제1 및 제2 발광부(100, 200)에 전원을 공급할 수 있다.The first to fourth electrodes 421, 431, 423, and 433 may be insulated from each other, and penetrate the base 410 up and down to be exposed on the upper and lower portions of the base 410. Accordingly, the electrodes 421, 431, 423, and 433 may be electrically connected to the first and second light emitting parts 100 and 200 positioned on the substrate 400, and may also be lower than the bottom of the substrate 400. The first and second light emitting units 100 and 200 may be electrically connected to the external power through the exposed portion.
다만, 본 발명이 이에 한정되지 않으며, 제1 내지 제4 전극(421, 431, 423, 433)들의 형태는 다양하게 형성될 수 있다. 예를 들어, 제1 내지 제4 전극(421, 431, 423, 433)들 중 적어도 하나는 베이스(410)의 측면을 통해 노출될 수도 있으며, 또한, 제1 내지 제4 전극(421, 431, 423, 433)들 중 적어도 일부는 서로 전기적으로 연결될 수도 있다. 또한, 발광 장치(10)에 포함된 발광부의 수에 따라, 발광 장치(10)는 5개 이상의 전극을 포함할 수도 있다. 발광부들(100, 200)과 전극들의 전기적 연결 형태는 후술하여 상세하게 설명한다.However, the present invention is not limited thereto, and the first to fourth electrodes 421, 431, 423, and 433 may have various shapes. For example, at least one of the first to fourth electrodes 421, 431, 423, 433 may be exposed through the side of the base 410, and the first to fourth electrodes 421, 431, At least some of the 423, 433 may be electrically connected to each other. In addition, depending on the number of light emitting units included in the light emitting device 10, the light emitting device 10 may include five or more electrodes. The electrical connection form between the light emitting parts 100 and 200 and the electrodes will be described in detail later.
한편, 몇몇 실시예들에 있어서, 기판(400)은 생략될 수도 있다.Meanwhile, in some embodiments, the substrate 400 may be omitted.
다시 도 1 내지 도 4를 참조하면, 발광 장치(10)는 적어도 둘 이상의 발광부를 포함할 수 있고, 본 실시예와 같이 제1 발광부(100) 및 제2 발광부(200)를 포함할 수 있다. 제1 발광부(100) 및 제2 발광부(200)는 기판(400) 상에 위치할 수 있다.Referring back to FIGS. 1 to 4, the light emitting device 10 may include at least two light emitting units, and may include the first light emitting unit 100 and the second light emitting unit 200 as in the present embodiment. have. The first light emitter 100 and the second light emitter 200 may be positioned on the substrate 400.
제1 발광부(100)는 제1 발광 소자(110) 및 제1 파장변환부(120)를 포함할 수 있다. 또한, 제1 발광 소자(110)는 발광 구조체(111), 제1 패드 전극(113) 및 제2 패드 전극(115)을 포함할 수 있다. 제1 발광부(100)는 제2 발광부(200)와 다른 파장대의 광을 방출할 수 있으며, 예를 들어, 백색광을 방출할 수 있다.The first light emitting unit 100 may include a first light emitting device 110 and a first wavelength converter 120. In addition, the first light emitting device 110 may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115. The first light emitter 100 may emit light having a wavelength different from that of the second light emitter 200. For example, the first light emitter 100 may emit white light.
발광 구조체(111)는 n형 반도체층, p형 반도체층 및 n형 반도체층과 p형 반도체층의 사이에 위치하는 활성층을 포함할 수 있고, 이에 따라, 제1 발광 소자(110)에 전원이 공급되는 경우 광이 방출될 수 있다. 제1 패드 전극(113)과 제2 패드 전극(115)은 각각 n형 반도체층 및 p형 반도체층(또는 반대로)에 전기적으로 연결될 수 있다. 특히, 제1 패드 전극(113)과 제2 패드 전극(115)은 발광 구조체(111)로부터 아래 방향으로 연장되어 형성될 수 있고, 이에 따라, 제1 및 제2 패드 전극(113, 115)은 제1 발광 소자(110)의 하부에 위치할 수 있다. 이와 달리, 제1 및 제2 패드 전극(113, 115)은 발광 구조체(111)의 하면과 대체로 동일한 평면상에 위치할 수도 있다. 나아가, 제1 및 제2 패드 전극(113, 115)은 발광 구조체(111)의 하면보다 높이 위치할 수도 있다. 이 경우, 발광 구조체(111)의 하면에는 홈들이 형성될 수 있고, 상기 홈에 제1 및 제2 패드 전극(113, 115)가 노출될 수 있다. 제1 발광 소자(110)의 구조적인 형태는 제한되지 않으며, 예를 들어, 제1 패드 전극(113)과 제2 패드 전극(115)이 발광 구조체(111)의 일면 상에 위치하는 플립칩형 반도체 발광 소자일 수 있다.The light emitting structure 111 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer positioned between the n-type semiconductor layer and the p-type semiconductor layer, and thus, power may be supplied to the first light emitting element 110. When supplied, light may be emitted. The first pad electrode 113 and the second pad electrode 115 may be electrically connected to the n-type semiconductor layer and the p-type semiconductor layer (or vice versa), respectively. In particular, the first pad electrode 113 and the second pad electrode 115 may be formed to extend downward from the light emitting structure 111. Accordingly, the first and second pad electrodes 113 and 115 may be formed. It may be located below the first light emitting device 110. Alternatively, the first and second pad electrodes 113 and 115 may be positioned on substantially the same plane as the bottom surface of the light emitting structure 111. In addition, the first and second pad electrodes 113 and 115 may be positioned higher than the bottom surface of the light emitting structure 111. In this case, grooves may be formed on the bottom surface of the light emitting structure 111, and the first and second pad electrodes 113 and 115 may be exposed in the grooves. The structural shape of the first light emitting device 110 is not limited, and, for example, a flip chip type semiconductor in which the first pad electrode 113 and the second pad electrode 115 are positioned on one surface of the light emitting structure 111. It may be a light emitting device.
제1 및 제2 패드 전극(113, 115)은 각각 기판(400)의 제1 전극(421) 및 제2 전극(431)에 전기적으로 연결될 수 있다. 이에 따라, 제1 및 제2 전극(421, 431)을 통해 제1 발광 소자(110)에 전원이 공급될 수 있다.The first and second pad electrodes 113 and 115 may be electrically connected to the first electrode 421 and the second electrode 431 of the substrate 400, respectively. Accordingly, power may be supplied to the first light emitting device 110 through the first and second electrodes 421 and 431.
제1 파장변환부(120)는 제1 발광 소자(110) 상에 위치할 수 있고, 적어도 제1 발광 소자(110)의 상면의 적어도 일부를 덮을 수 있다. 나아가, 제1 파장변환부(120)는 제1 발광 소자(110)의 상면과 대체로 동일한 면적으로 형성될 수 있고, 이에 따라, 도시된 바와 같이 제1 발광 소자(110)의 측면과 제1 파장변환부(120)의 측면은 대체로 나란하게 형성될 수 있다.The first wavelength converter 120 may be positioned on the first light emitting device 110 and may cover at least a portion of an upper surface of the first light emitting device 110. Furthermore, the first wavelength converter 120 may be formed to have substantially the same area as the top surface of the first light emitting device 110, and thus, as illustrated, the side surface of the first light emitting device 110 and the first wavelength may be formed. Sides of the converter 120 may be formed generally side by side.
제1 파장변환부(120)는 형광체 및 상기 형광체를 담지하는 담지부를 포함할 수 있다. 제1 파장변환부(120)는 통상의 기술자에게 널리 알려진 다양한 종류의 형광체, 예를 들어, 가넷형 형광체, 알루미네이트 형광체, 황화물 형광체, 산질화물 형광체, 질화물 형광체, 불화물계 형광체, 규산염 형광체 등을 포함할 수 있고, 제1 발광 소자(110)에서 방출된 광을 파장변환하여 제1 발광부(100)에서 백색광이 방출되도록 할 수 있다. 예를 들어, 제1 발광 소자(110)가 청색광 대역의 피크 파장을 갖는 광을 방출하는 경우, 제1 파장변환부(120)는 청색광보다 긴 파장의 피크 파장을 갖는 광(예를 들어, 녹색광, 적색광 또는 황색광)을 방출시키는 형광체를 포함할 수 있다. 또는, 제1 발광 소자(110)가 UV 대역의 피크 파장을 갖는 광을 방출하는 경우, 제1 파장변환부(120)는 UV광보다 긴 파장의 피크 파장을 갖는 광(예를 들어, 청색광, 녹색광, 적색광 또는 황색광)을 방출시키는 형광체를 포함할 수 있다.The first wavelength converter 120 may include a phosphor and a support part supporting the phosphor. The first wavelength converter 120 may include various kinds of phosphors well known to those skilled in the art, for example, garnet-type phosphors, aluminate phosphors, sulfide phosphors, oxynitride phosphors, nitride phosphors, fluoride phosphors, and silicate phosphors. The light emitted from the first light emitting device 110 may be wavelength-converted so that white light may be emitted from the first light emitting part 100. For example, when the first light emitting device 110 emits light having a peak wavelength of a blue light band, the first wavelength converter 120 may have light having a peak wavelength longer than blue light (for example, green light). , Red light or yellow light). Alternatively, when the first light emitting device 110 emits light having a peak wavelength in the UV band, the first wavelength converter 120 may have light having a peak wavelength longer than that of the UV light (for example, blue light, Green light, red light or yellow light).
상기 담지부는 폴리머 수지, 유리와 같은 세라믹 등을 포함할 수 있다. 상기 형광체는 담지부 내에 무작위로 배치될 수 있다. 예를 들어, 담지부가 에폭시 수지 또는 아크릴 수지와 같은 수지로 형성된 경우, 제1 발광 소자(110) 상에 형광체를 포함하는 수지를 도포 및 경화시킴으로써 제1 파장변환부(120)가 제공될 수 있다. The supporting part may include a polymer resin, a ceramic such as glass, or the like. The phosphor may be randomly disposed in the supporting portion. For example, when the supporting part is formed of a resin such as an epoxy resin or an acrylic resin, the first wavelength conversion part 120 may be provided by applying and curing a resin including a phosphor on the first light emitting device 110. .
이와 달리, 제1 파장변환부(120)는 단결정 물질을 포함할 수 있다. 단결정 물질을 포함하는 제1 파장변환부(120)는 형광체 시트 형태로 제공될 수 있으며, 상기 시트 형태의 제1 파장변환부(120) 자체가 단결정 형광체로 이루어질 수 있다. 단결정 형광체를 포함하는 제1 파장변환부(120)를 통과하는 광은 대체로 일정한 색좌표를 갖는 광을 방출시킬 수 있다. 예를 들어, 상기 단결정 형광체는 단결정의 YAG:Ce일 수 있다. 이러한 시트 형태의 제1 파장변환부(120)는 제1 발광 소자(110) 상에 접착되어 형성될 수 있다.In contrast, the first wavelength converter 120 may include a single crystal material. The first wavelength conversion unit 120 including the single crystal material may be provided in the form of a phosphor sheet, and the first wavelength conversion unit 120 in the form of the sheet may be made of a single crystal phosphor. Light passing through the first wavelength converter 120 including the single crystal phosphor may emit light having a predetermined color coordinate. For example, the single crystal phosphor may be single crystal YAG: Ce. The sheet-shaped first wavelength converter 120 may be formed by being bonded to the first light emitting device 110.
제2 발광부(200)는 기판(400) 상에 위치할 수 있고, 또한, 제1 발광부(100)와 이격되어 위치할 수 있다. 제2 발광부(200)는 제2 발광 소자(210) 및 제2 파장변환부(220)를 포함할 수 있다. 또한, 제2 발광 소자(210)는 발광 구조체(211), 제3 패드 전극(213) 및 제4 패드 전극(215)을 포함할 수 있다. 제2 발광부(200)는 제1 발광부(100)와 다른 파장대의 광을 방출할 수 있으며, 예를 들어, 엠버(amber)색의 광을 방출할 수 있다.The second light emitting unit 200 may be positioned on the substrate 400 and may be spaced apart from the first light emitting unit 100. The second light emitting unit 200 may include a second light emitting device 210 and a second wavelength converter 220. In addition, the second light emitting device 210 may include a light emitting structure 211, a third pad electrode 213, and a fourth pad electrode 215. The second light emitting unit 200 may emit light having a wavelength different from that of the first light emitting unit 100, and may emit light of an amber color, for example.
제2 발광 소자(210)의 발광 구조체(211), 제3 패드 전극(213) 및 제4 패드 전극(215)과 관련된 설명은 각각 제1 발광 소자(110)의 발광 구조체(111), 제1 패드 전극(113) 및 제2 패드 전극(115)과 대체로 유사하다. 다만, 제3 패드 전극(213)은 제3 전극(423)에 전기적으로 연결되고, 제4 패드 전극(215)은 제4 전극(433)에 전기적으로 연결될 수 있다.Descriptions related to the light emitting structure 211, the third pad electrode 213, and the fourth pad electrode 215 of the second light emitting device 210 are described with the light emitting structure 111 and the first light emitting device of the first light emitting device 110, respectively. It is generally similar to the pad electrode 113 and the second pad electrode 115. However, the third pad electrode 213 may be electrically connected to the third electrode 423, and the fourth pad electrode 215 may be electrically connected to the fourth electrode 433.
이에 따라, 제1 발광 소자(110)와 제2 발광 소자(120)는 각각 별도의 전극들(421, 431, 423, 433)에 전기적으로 연결될 수 있다. 상기 전극들(421, 431, 423, 433)에 공급되는 전원을 별개로 연결함으로써 제1 발광부(100)와 제2 발광부(200)를 독립적으로 구동시킬 수 있다. 다만, 본 발명이 이에 한정되는 것은 아니며, 전극들(421, 431, 423, 433)은 서로 전기적으로 상호 연결될 수도 있다. 나아가, 발광 장치(10)는 별도의 제어부(미도시)를 더 포함할 수도 있고, 상기 제어부에 의하여 제1 발광부(100)와 제2 발광부(200)의 구동이 제어될 수 있다.Accordingly, the first light emitting device 110 and the second light emitting device 120 may be electrically connected to separate electrodes 421, 431, 423, and 433, respectively. The first light emitting unit 100 and the second light emitting unit 200 may be independently driven by separately connecting power supplied to the electrodes 421, 431, 423, and 433. However, the present invention is not limited thereto, and the electrodes 421, 431, 423, and 433 may be electrically connected to each other. In addition, the light emitting device 10 may further include a separate controller (not shown), and the driving of the first light emitting unit 100 and the second light emitting unit 200 may be controlled by the controller.
제2 파장변환부(220)와 관련된 설명은 제1 파장변환부(120)와 대체로 동일하나, 다만, 제2 파장변환부(220)에 포함된 형광체는 제1 파장변환부(120)에 포함된 형광체와 다를 수 있다.The description related to the second wavelength converter 220 is generally the same as the first wavelength converter 120, but the phosphor included in the second wavelength converter 220 is included in the first wavelength converter 120. Different phosphors.
즉, 제2 발광부(200)에서 방출되는 광은 제2 파장변환부(220)를 통해 방출될 수 있으므로, 제2 파장변환부(220)는 제1 파장변환부(120)에 포함된 형광체와 다른 형광체를 포함할 수 있다. 이에 따라, 제2 발광 소자(210)에서 방출된 광이 제2 파장변환부(220)에서 여기되어 엠버광 대역의 피크 파장을 갖는 광에 제2 발광부(200)에서 방출될 수 있다.That is, since the light emitted from the second light emitter 200 may be emitted through the second wavelength converter 220, the second wavelength converter 220 may include phosphors included in the first wavelength converter 120. And other phosphors. Accordingly, the light emitted from the second light emitting device 210 may be excited by the second wavelength converter 220 and emitted from the second light emitting part 200 to light having a peak wavelength of the amber light band.
몇몇 실시예들에 있어서, 제2 파장변환부(220)는 형광체를 포함하지 않을 수도 있다. 예를 들어, 제2 발광부(200)에서 방출시키고자 하는 광의 파장 대역이 제2 발광 소자(210)의 방출 광 파장 대역과 대체로 일치하는 경우, 제2 파장변환부(220)는 형광체를 포함하지 않을 수도 있다. 이 경우, 제2 파장변환부(220)는 TiO2와 같은 광 산란제를 포함할 수 있다.In some embodiments, the second wavelength converter 220 may not include a phosphor. For example, when the wavelength band of the light to be emitted by the second light emitting unit 200 substantially coincides with the emission light wavelength band of the second light emitting device 210, the second wavelength conversion unit 220 includes a phosphor. You may not. In this case, the second wavelength converter 220 may include a light scattering agent such as TiO 2 .
한편, 도 4에 도시된 바와 달리 도 5에 도시된 바와 같이, 제1 및 제2 파장변환부(120, 220)는 각각 제1 및 제2 발광 소자(110, 210)의 상면보다 더 큰 면적으로 형성될 수도 있고, 나아가, 제1 및 제2 발광 소자(110, 210)의 측면까지 더 덮을 수 있다. On the other hand, unlike shown in Figure 4, as shown in Figure 5, the first and second wavelength conversion section (120, 220) has a larger area than the upper surface of the first and second light emitting device (110, 210), respectively It may be formed as, and may further cover the side of the first and second light emitting device (110, 210).
도 5a를 참조하면, 발광 소자(10a)에 있어서, 제1 및 제2 파장변환부(120a, 220a)는 각각 제1 및 제2 발광 소자(110, 210)의 상면보다 더 큰 면적을 갖도록 형성될 수 있다. 이에 따라, 제1 및 제2 발광부(100a, 200a)에서 광이 방출되는 면적이 상대적으로 더 넓게 형성될 수 있다. 또한, 도 5b를 참조하면, 발광 소자(10b)에 있어서, 제1 및 제2 파장변환부(120b, 220b)는 각각 제1 및 제2 발광 소자(110, 210)의 측면까지 더 덮도록 형성될 수 있다. 나아가, 제1 및 제2 파장변환부(120b, 220b)는 각각 제1 및 제2 발광 소자(110, 210)의 하면 적어도 일부를 더 덮을 수도 있다. 이때, 제1 및 제2 파장변환부(120b, 220b)는 패드 전극들의 측면을 둘러쌀 수 있다. 이 경우, 발광 소자의 측면으로부터 방출된 광이 곧 바로 파장변환부에 입사될 수 있으며, 파장변환 효율이 더욱 향상될 수 있다.Referring to FIG. 5A, in the light emitting device 10a, the first and second wavelength conversion parts 120a and 220a are formed to have a larger area than the top surfaces of the first and second light emitting devices 110 and 210, respectively. Can be. Accordingly, an area in which light is emitted from the first and second light emitting parts 100a and 200a may be formed to be relatively wider. In addition, referring to FIG. 5B, in the light emitting device 10b, the first and second wavelength conversion parts 120b and 220b are formed to further cover side surfaces of the first and second light emitting devices 110 and 210, respectively. Can be. In addition, the first and second wavelength converters 120b and 220b may further cover at least a portion of the lower surfaces of the first and second light emitting devices 110 and 210, respectively. In this case, the first and second wavelength converters 120b and 220b may surround side surfaces of the pad electrodes. In this case, light emitted from the side of the light emitting device may be immediately incident on the wavelength conversion portion, and the wavelength conversion efficiency may be further improved.
측벽부(300)는 제1 및 제2 발광 소자(110, 210)의 측면을 덮을 수 있으며, 나아가, 제1 및 제2 파장변환부(120, 220)의 측면을 더 덮을 수 있다. 측벽부(300)는 제1 및 제2 발광부(100, 200)와 접촉될 수 있다. 또한, 측벽부(300)의 일부는 제1 및 제2 발광 소자(110, 210)의 하면의 일부를 더 덮을 수 있고, 이때, 패드 전극들(113, 115, 213, 215)의 측면은 측벽부(300)에 둘러싸일 수 있다.The sidewall part 300 may cover side surfaces of the first and second light emitting devices 110 and 210, and may further cover side surfaces of the first and second wavelength conversion parts 120 and 220. The sidewall part 300 may contact the first and second light emitting parts 100 and 200. In addition, a part of the sidewall part 300 may further cover a part of the lower surfaces of the first and second light emitting devices 110 and 210, and the side surfaces of the pad electrodes 113, 115, 213, and 215 may be sidewalls. It may be surrounded by the part 300.
측벽부(300)는 제1 및 제2 발광부(100, 200)를 지지할 수 있고, 또한, 외부 환경으로부터 제1 및 제2 발광부(100, 200)를 보호할 수 있다. 나아가, 측벽부(300)는 광을 반사시키는 역할을 할 수 있다. 측벽부(300)가 발광 장치(10)의 외곽 측면에 형성됨으로써, 발광부들(100, 200)에서 방출되는 광을 상부로 집중시킬 수 있다. 다만, 본 발명은 이에 한정되지 않으며, 필요에 따라 측벽부(300)의 반사도, 광 투과도 등을 조절하여, 발광부들(100, 200)에서 방출되는 광의 지향각을 조절할 수 있다.The side wall part 300 may support the first and second light emitting parts 100 and 200, and may also protect the first and second light emitting parts 100 and 200 from an external environment. Furthermore, the side wall part 300 may serve to reflect light. Since the sidewall part 300 is formed on the outer side of the light emitting device 10, the light emitted from the light emitting parts 100 and 200 may be concentrated upward. However, the present invention is not limited thereto, and as necessary, the reflectance, the light transmittance, and the like of the sidewall part 300 may be adjusted to adjust the directing angles of the light emitted from the light emitting parts 100 and 200.
측벽부(300)는 절연성의 폴리머 물질 또는 세라믹을 포함할 수 있고, 나아가, 광을 반사시키거나 산란시킬 수 있는 필러를 더 포함할 수 있다. 측벽부(300)는 광투과성, 광 반투과성 또는 광 반사성을 가질 수 있다. 예를 들어, 측벽부(300)는 실리콘 수지, 또는 에폭시 수지, 폴리이미드 수지, 우레탄 수지 등과 같은 폴리머 수지를 포함할 수 있다. 본 실시예에서 상기 측벽부(300)는 광 반사성을 갖는 백색 실리콘 수지를 포함할 수 있다.The sidewall portion 300 may include an insulating polymer material or a ceramic, and may further include a filler capable of reflecting or scattering light. The sidewall part 300 may have light transmissive, light semitransparent or light reflective. For example, the sidewall part 300 may include a silicone resin or a polymer resin such as an epoxy resin, a polyimide resin, a urethane resin, or the like. In the present embodiment, the side wall part 300 may include a white silicone resin having light reflectivity.
상기 필러는 측벽부(300) 내에 균일하게 분산 배치될 수 있다. 상기 필러는 광을 반사시키거나 산란시킬 수 있는 물질이면 제한되지 않으며, 예를 들어, 산화티탄(TiO2), 산화규소(SiO2), 또는 산화지르코늄(ZrO2) 등일 수 있다. 측벽부(300)는 상기 필러들 중 적어도 하나를 포함할 수 있다. 필러의 종류 또는 농도 등을 조절함으로써, 측벽부(300)의 반사도 또는 광의 산란 정도 등을 조절할 수 있다.The filler may be uniformly distributed in the sidewall portion 300. The filler is not limited as long as it is a material capable of reflecting or scattering light. For example, the filler may be titanium oxide (TiO 2 ), silicon oxide (SiO 2 ), or zirconium oxide (ZrO 2 ). The side wall part 300 may include at least one of the fillers. By adjusting the type or concentration of the filler, the reflectivity of the sidewall portion 300 or the degree of scattering of light may be adjusted.
한편, 측벽부(300)의 상면과 제1 및 제2 발광부(100, 200)의 상면은 서로 동일 높이를 이룰 수 있다. 즉, 도시된 바와 같이, 측벽부(300)의 상면과 파장변환부들(120, 220)의 상면이 서로 나란하게(flush) 형성될 수 있다. Meanwhile, the top surface of the sidewall part 300 and the top surfaces of the first and second light emitting parts 100 and 200 may have the same height. That is, as illustrated, the top surface of the sidewall portion 300 and the top surface of the wavelength conversion parts 120 and 220 may be flush with each other.
또한, 제1 발광부(100)와 제2 발광부(200)의 사이에 형성된 측벽부(300)의 두께는, 측벽부(300)의 외곽 측면 테두리 부분의 두께보다 작을 수 있다. 즉, 도 2에 도시된 바와 같이, 제1 발광부(100)와 제2 발광부(200)의 이격 영역을 채우는 측벽부(300)의 두께 x는, 측벽부(300)의 외곽 측면으로부터 제1 및 제2 발광부(100, 200) 중 하나의 측면까지의 최단 거리에 대응하는 두께 y보다 작을 수 있다. 이에 따라, 제1 및 제2 발광부(100, 200) 간의 이격 거리를 최소화하여 발광 장치(10)를 더욱 소형화시킬 수 있고, 나아가, 제1 및 제2 발광부(100, 200)를 외부로부터 더욱 효과적으로 보호할 수 있다.In addition, the thickness of the sidewall portion 300 formed between the first light emitting portion 100 and the second light emitting portion 200 may be smaller than the thickness of the outer side edge portion of the sidewall portion 300. That is, as shown in FIG. 2, the thickness x of the side wall 300 filling the spaced apart region of the first light emitting part 100 and the second light emitting part 200 is determined from the outer side surface of the side wall part 300. It may be smaller than the thickness y corresponding to the shortest distance to one side of one of the first and second light emitting parts 100 and 200. Accordingly, the light emitting device 10 may be further miniaturized by minimizing the separation distance between the first and second light emitting parts 100 and 200, and further, the first and second light emitting parts 100 and 200 may be separated from the outside. More effective protection.
또한, 본 실시예들에 따른 발광 장치(10)는 보호 소자(310)를 더 포함할 수 있다. 보호 소자(310)는 측벽부(300) 내에 배치될 수 있으며, 예를 들어, 제너 다이오드를 포함할 수 있다. 보호 소자(310)는 제1 및 제2 발광 소자(110, 120) 중 적어도 하나에 전기적으로 연결되어, 제1 및 제2 발광 소자(110, 120)가 정전기 방전 등으로 인하여 파손되는 것을 방지할 수 있다. 보호 소자(310)는 제1 및 제2 발광 소자(110, 120) 각각에 별도로 연결될 수도 있고, 또는, 제1 및 제2 발광 소자(110, 120)에 동시에 연결될 수도 있다.In addition, the light emitting device 10 according to the exemplary embodiments may further include a protection element 310. The protection element 310 may be disposed in the sidewall part 300 and may include, for example, a zener diode. The protection element 310 may be electrically connected to at least one of the first and second light emitting elements 110 and 120 to prevent the first and second light emitting elements 110 and 120 from being damaged due to electrostatic discharge. Can be. The protection element 310 may be separately connected to each of the first and second light emitting devices 110 and 120, or may be simultaneously connected to the first and second light emitting devices 110 and 120.
발광 장치(10)가 보호 소자(310)를 더 포함하는 경우, 보호 소자(310)는 측벽부(300)의 적어도 일 측면에 치우쳐 위치할 수 있다. 예를 들어, 도 2에 도시된 바와 같이, 보호 소자(310)는 측벽부(300)의 일 측면에 치우쳐, 측벽부(300) 내에 위치할 수 있다. 이에 따라, 보호 소자(310)가 치우쳐 위치하는 측벽부(300)의 일 측면으로부터 발광부들(100, 200)까지의 거리는, 측벽부(300)의 타 측면으로부터 발광부들(100, 200)까지의 거리보다 클 수 있다. 즉, 보호 소자(310)가 위치하는 부분의 측벽부(300)의 측벽 두께는 다른 부분의 측벽 두께보다 두꺼울 수 있다.When the light emitting device 10 further includes the protection element 310, the protection element 310 may be positioned at least one side of the sidewall part 300. For example, as shown in FIG. 2, the protection element 310 may be positioned in the sidewall portion 300, biased to one side of the sidewall portion 300. Accordingly, the distance from one side of the side wall portion 300 where the protection element 310 is offset to the light emitting portions 100 and 200 is from the other side of the side wall portion 300 to the light emitting portions 100 and 200. It can be greater than the distance. That is, the sidewall thickness of the sidewall portion 300 of the portion where the protection element 310 is located may be thicker than the sidewall thickness of the other portion.
상술한 실시예들에 따르면, 발광 장치(10, 10a, 10b)는 기판(400) 상에 서로 이격되어 위치하는 제1 발광부(100) 및 제2 발광부(200)를 포함하고, 상기 제1 및 제2 발광부(100, 200)는 각각 서로 다른 전극들에 전기적으로 연결된다. 이에 따라, 제1 발광부(100) 및 제2 발광부(200)는 서로 독립적으로 구동될 수 있으며, 필요에 따라 선택적으로 다른 색의 광을 방출하는 발광 장치(10)가 제공될 수 있다. 따라서, 서로 다른 색의 광을 방출하는 적어도 둘 이상의 발광 장치를 별도로 제조하는 것을 생략할 수 있어, 제조 공정이 간소화 될 수 있다. 나아가, 하나의 발광 장치만으로도 복수 색의 광을 방출시킬 수 있으므로, 특정 응용 장치에서 발광 장치가 차지하는 공간적 비율을 감소시킬 수 있다. According to the above-described embodiments, the light emitting devices 10, 10a, and 10b include a first light emitting part 100 and a second light emitting part 200 which are spaced apart from each other on the substrate 400. The first and second light emitting parts 100 and 200 are electrically connected to different electrodes, respectively. Accordingly, the first light emitter 100 and the second light emitter 200 may be driven independently of each other, and a light emitting device 10 may be provided to selectively emit light of a different color as needed. Thus, separately manufacturing at least two or more light emitting devices emitting light of different colors can be omitted, thereby simplifying the manufacturing process. Furthermore, since only one light emitting device can emit light of a plurality of colors, it is possible to reduce the spatial ratio occupied by the light emitting device in a specific application.
한편, 본 발명에 따른 발광 장치는 상술한 실시예에 한정되지 않으며, 셋 이상의 발광부를 포함할 수도 있다. 또한, 본 발명의 발광 장치는 세 종류 이상의 색의 광을 방출하는 발광부들을 포함할 수도 있다.Meanwhile, the light emitting device according to the present invention is not limited to the above-described embodiment and may include three or more light emitting parts. In addition, the light emitting device of the present invention may include light emitting parts emitting light of three or more kinds of colors.
도 6은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 단면도이다.6 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
도 6을 참조하면, 발광 장치(10c)는 발광 소자(110), 파장변환부(120) 및 접착부(130)를 포함하는 발광부(100) 및 측벽부(300)를 포함한다. 나아가, 발광 장치(10)는 기판(400) 및 보호 소자(미도시)를 더 포함할 수 있다. 이하, 동일한 구성에 대한 상세한 설명은 생략한다.Referring to FIG. 6, the light emitting device 10c includes a light emitting unit 110, a wavelength converting unit 120, and a light emitting unit 100 and a sidewall portion 300 including an adhesive unit 130. Furthermore, the light emitting device 10 may further include a substrate 400 and a protection element (not shown). Hereinafter, detailed description of the same configuration will be omitted.
기판(400)은 발광 장치(10c)의 저부에 위치할 수 있으며, 발광 소자(110)와 측벽부(300)를 지지하는 역할을 할 수 있다. 기판(400)은 절연성 또는 도전성 기판일 수 있으며, 또한, 도전성 패턴을 포함하는 PCB일 수 있다. 또한, 기판(400)은 베이스(410)를 포함할 수 있고, 나아가, 제1 전극(421) 및 제2 전극(431)을 더 포함할 수 있다. 다만, 본 발명은 이에 한정되지 않으며, 제1 및 제2 전극(421, 431)의 형태는 다양하게 형성될 수 있으며, 각각의 제1 및 제2 전극(421, 431)은 복수로 형성될 수도 있다. 예를 들어, 제1 및 제2 전극(421, 431) 중 적어도 하나는 베이스(410)의 측면을 통해 노출될 수도 있다.The substrate 400 may be positioned at the bottom of the light emitting device 10c and may support the light emitting device 110 and the sidewall 300. The substrate 400 may be an insulating or conductive substrate, and may also be a PCB including a conductive pattern. In addition, the substrate 400 may include a base 410, and may further include a first electrode 421 and a second electrode 431. However, the present invention is not limited thereto, and the first and second electrodes 421 and 431 may be formed in various forms, and each of the first and second electrodes 421 and 431 may be formed in plural. have. For example, at least one of the first and second electrodes 421 and 431 may be exposed through the side surface of the base 410.
한편, 몇몇 실시예들에 있어서, 기판(400)은 생략될 수도 있다.Meanwhile, in some embodiments, the substrate 400 may be omitted.
발광 소자(110)는 기판(400) 상에 위치할 수 있고, 발광 구조체(111), 제1 패드 전극(113) 및 제2 패드 전극(115)을 포함할 수 있다.The light emitting device 110 may be positioned on the substrate 400, and may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115.
파장변환부(120)는 발광 소자(110) 상에 위치할 수 있고, 적어도 발광 소자(110)의 상면의 적어도 일부를 덮을 수 있다. 나아가, 파장변환부(120)는 발광 소자(110)의 상면과 대체로 동일한 면적으로 형성될 수 있고, 이와 달리, 도시된 바와 같이 파장변환부(120)의 면적은 발광 소자(110)의 상면 면적보다 더 클 수 있다. The wavelength converter 120 may be positioned on the light emitting device 110 and may cover at least a portion of an upper surface of the light emitting device 110. In addition, the wavelength converter 120 may be formed to have substantially the same area as the top surface of the light emitting device 110. Alternatively, as illustrated, the wavelength converter 120 may have an area of the top surface of the light emitting device 110. Can be greater than
파장변환부(120)는 시트 형태를 가질 수 있으며, 상기 시트 형태의 파장변환부(120)는 발광 소자(110) 상에 접착될 수 있다. 시트 형태의 파장변환부(120)는 접착부(130)에 의해 접착될 수 있고, 접착부(130)와 관련하여서는 후술하여 상세하게 설명한다.The wavelength converter 120 may have a sheet shape, and the wavelength converter 120 having the sheet shape may be adhered to the light emitting device 110. The wavelength conversion unit 120 in the form of a sheet may be bonded by the adhesive unit 130, and the adhesive unit 130 will be described in detail later.
파장변환부(120)는 형광체 및 상기 형광체를 담지하는 담지부를 포함할 수 있다. 파장변환부(120)는 통상의 기술자에게 널리 알려진 다양한 종류의 형광체, 예를 들어, 가넷형 형광체, 알루미네이트 형광체, 황화물 형광체, 산질화물 형광체, 질화물 형광체, 불화물계 형광체, 규산염 형광체 등을 포함할 수 있고, 발광 소자(110)에서 방출된 광을 파장변환하여 다양한 색의 광을 방출하도록 할 수 있다. 예를 들어, 발광 소자(110)가 청색광 대역의 피크 파장을 갖는 광을 방출하는 경우, 파장변환부(120)는 청색광보다 긴 파장의 피크 파장을 갖는 광(예를 들어, 녹색광, 적색광 또는 황색광)을 방출시키는 형광체를 포함할 수 있다. 또는, 발광 소자(110)가 UV 대역의 피크 파장을 갖는 광을 방출하는 경우, 파장변환부(120)는 UV광보다 긴 파장의 피크 파장을 갖는 광(예를 들어, 청색광, 녹색광, 적색광 또는 황색광)을 방출시키는 형광체를 포함할 수 있다. 이에 따라, 발광 장치(10)에서 백색광이 방출되도록 할 수 있다. 다만, 본 발명이 이에 한정되는 것은 아니며, 특히, 본 실시예에 있어서, 파장변환부(120)는 1종의 형광체를 포함할 수 있다.The wavelength converter 120 may include a phosphor and a support portion for supporting the phosphor. The wavelength converter 120 may include various kinds of phosphors well known to those skilled in the art, for example, garnet-type phosphors, aluminate phosphors, sulfide phosphors, oxynitride phosphors, nitride phosphors, fluoride phosphors, silicate phosphors, and the like. The light emitted from the light emitting device 110 may be wavelength-converted to emit light of various colors. For example, when the light emitting device 110 emits light having a peak wavelength of a blue light band, the wavelength converter 120 may have light having a peak wavelength of a longer wavelength than blue light (for example, green light, red light, or yellow light). Light) to emit light). Alternatively, when the light emitting device 110 emits light having a peak wavelength in the UV band, the wavelength converter 120 may include light having a peak wavelength having a wavelength longer than that of the UV light (eg, blue light, green light, red light, or the like). Yellow light). Accordingly, the white light may be emitted from the light emitting device 10. However, the present invention is not limited thereto, and in particular, in the present embodiment, the wavelength converter 120 may include one type of phosphor.
상기 담지부는 폴리머 수지, 유리와 같은 세라믹 등을 포함할 수 있다. 상기 형광체는 담지부 내에 무작위로 배치될 수 있다. The supporting part may include a polymer resin, a ceramic such as glass, or the like. The phosphor may be randomly disposed in the supporting portion.
한편, 본 실시예에 있어서, 파장변환부(120)는 단결정 물질을 포함할 수 있다. 단결정 물질을 포함하는 파장변환부(120)는 형광체 시트 형태로 제공될 수 있으며, 상기 시트 형태의 파장변환부(120) 자체가 단결정 형광체로 이루어질 수 있으며, 예를 들어, 상기 단결정 형광체는 단결정의 YAG:Ce일 수 있다. 단결정 형광체 시트를 포함하는 파장변환부(120)를 통과하는 광은 대체로 일정한 색좌표를 갖는 광을 방출시킬 수 있어, 상기 단결정 형광체 시트를 포함하는 파장변환부(120)가 복수의 발광 장치들에 적용되는 경우 상기 복수의 발광 장치들 간의 색좌표 편차를 감소시킬 수 있다.Meanwhile, in the present embodiment, the wavelength conversion part 120 may include a single crystal material. The wavelength conversion unit 120 including the single crystal material may be provided in the form of a phosphor sheet, and the wavelength conversion unit 120 in the form of the sheet may be made of a single crystal phosphor. For example, the single crystal phosphor may be formed of a single crystal. YAG: Ce. Light passing through the wavelength converting part 120 including the single crystal phosphor sheet may emit light having a predetermined color coordinate, so that the wavelength converting part 120 including the single crystal phosphor sheet is applied to a plurality of light emitting devices. If the color coordinate deviation between the plurality of light emitting devices can be reduced.
접착부(130)는 발광 소자(110)와 파장변환부(120) 사이에 위치할 수 있고, 발광 소자(110)와 파장변환부(120)를 접착하는 역할을 할 수 있다. 접착부(130)는 접착성 물질(131) 및 상기 접착성 물질(131) 내에 분산되어 배치된 형광체(133)를 포함할 수 있다. 접착성 물질(131)은 폴리머 접착제, 실리콘 접착제 등 일반적일 접착제일 수 있다.The adhesion part 130 may be positioned between the light emitting element 110 and the wavelength conversion part 120 and may serve to bond the light emitting element 110 and the wavelength conversion part 120. The adhesive part 130 may include an adhesive material 131 and a phosphor 133 dispersed in the adhesive material 131. The adhesive material 131 may be a general adhesive such as a polymer adhesive or a silicone adhesive.
접착부(130)에 포함된 형광체(133)는 발광 소자(110)로부터 방출된 광을 파장변환할 수 있다. 이에 따라, 본 실시예에 따른 발광 장치에 있어서, 발광 소자(110)에서 방출된 광은 접착부(130)에서 1차로 파장변환되고, 이어서 파장변환부(120)에서 2차로 파장변환될 수 있다. 이때, 접착부(130)의 형광체(133)에서 방출되는 파장변환된 광의 파장과 파장변환부(120)에 의해 파장변환된 광의 파장은 서로 다를 수 있다. 나아가, 접착부(130)의 형광체(133)에서 파장변환된 광의 피크 파장은 파장변환부(120)에 의해 파장변환된 광의 피크 파장보다 길 수 있다. 예를 들어, 접착부(130)의 형광체(133)는 적색광을 방출할 수 있고, 파장변환부(120)는 녹색광 또는 황색광을 방출할 수 있다. 이에 따라, 접착부(130)에서 1차로 파장변환된 광이 파장변환부(120)에서 다시 파장변환되어, 발광 장치(10c)에서 방출되는 광이 예상하지 못한 색좌표를 갖는 것을 방지할 수 있다.The phosphor 133 included in the adhesion part 130 may convert the wavelength of the light emitted from the light emitting device 110. Accordingly, in the light emitting device according to the present exemplary embodiment, the light emitted from the light emitting element 110 may be first wavelength-converted at the adhesive part 130, and then may be wavelength-converted secondly at the wavelength converter 120. In this case, the wavelength of the wavelength-converted light emitted from the phosphor 133 of the adhesive unit 130 and the wavelength of the light converted by the wavelength converter 120 may be different from each other. In addition, the peak wavelength of the wavelength converted by the phosphor 133 of the adhesive unit 130 may be longer than the peak wavelength of the wavelength converted by the wavelength converter 120. For example, the phosphor 133 of the adhesive part 130 may emit red light, and the wavelength converter 120 may emit green light or yellow light. As a result, the first wavelength-converted light in the adhesive part 130 may be wavelength-converted in the wavelength converter 120 again to prevent the light emitted from the light emitting device 10c from having unexpected color coordinates.
본 실시예에 따르면, 발광 소자(110)에서 방출된 광이 접착부(130)에 포함된 형광체(133)에 의해 1차로 파장변환되고, 이어서 파장변환부(120)에 의해 2차로 파장변환된다. 이에 따라, 발광 소자(110)에서 방출된 광이 2단계에 걸쳐 파장변환되므로, 복수의 발광 장치(10c)들에 대해서 대체로 균일한 색좌표를 갖는 광이 방출될 수 있다. 즉, 복수의 발광 장치(10c)들 간의 색좌표 편차를 감소시킬 수 있다.According to the present exemplary embodiment, the light emitted from the light emitting device 110 is first wavelength-converted by the phosphor 133 included in the adhesive part 130, and is then secondarily wavelength-converted by the wavelength converter 120. Accordingly, since the light emitted from the light emitting device 110 is wavelength-converted in two stages, light having substantially uniform color coordinates may be emitted to the plurality of light emitting devices 10c. That is, deviations in color coordinates between the plurality of light emitting devices 10c may be reduced.
더욱이, 일반적으로 2종 이상의 형광체를 이용하는 경우, 발광 소자로부터 방출된 광이 어떤 형광체에 먼저 파장변환되는 것인지 예측하기 어려워 복수의 발광 장치들 간의 색좌표 편차를 감소시키는 것이 어려웠다. 그러나, 본 발명에 따르면, 접착부(130)가 1종의 형광체를 포함하고, 파장변환부(120) 역시 1종의 형광체를 포함하는 경우, 복수의 발광 장치(10c)들 간의 색좌표 편차를 더욱 감소시킬 수 있다. Moreover, in general, when two or more kinds of phosphors are used, it is difficult to predict which phosphors are emitted first from the light emitting element, and it is difficult to reduce color coordinate variation among the plurality of light emitting devices. However, according to the present invention, when the adhesive unit 130 includes one phosphor and the wavelength converter 120 also includes one phosphor, the color coordinate deviation between the plurality of light emitting devices 10c may be further reduced. You can.
나아가, 접착부(130)에 포함된 형광체의 종류 및 농도 등을 조절하여, 발광 장치(10c)에서 방출되는 광의 색좌표를 용이하게 조절할 수 있다. 특히, 복수의 발광 장치(10c)들에 대해서 동일한 파장변환부들을 적용하더라도, 접착부(130)에 포함되는 형광체(133)만을 조절함으로써, 간단하게 발광 장치(10c)들의 색좌표를 조절할 수 있다.In addition, the color coordinates of the light emitted from the light emitting device 10c may be easily adjusted by adjusting the type and concentration of the phosphor included in the adhesive part 130. In particular, even when the same wavelength conversion parts are applied to the plurality of light emitting devices 10c, the color coordinates of the light emitting devices 10c may be simply adjusted by adjusting only the phosphor 133 included in the adhesive part 130.
특히, 파장변환부(120)가 단결정 형광체 시트를 포함하는 경우, 단결정 형광체 시트는 형광체의 농도 등을 조절할 수 없어 파장변환부(120)로부터 방출되는 광의 색좌표는 거의 일정하다. 이때, 접착부(130)에 포함되는 형광체(133)의 종류 및 농도를 조절하여 발광 장치(10c)로부터 방출되는 광의 색좌표는 용이하게 조절할 수 있다. 따라서, 단결정 형광체 시트를 포함하는 발광 장치(10c)의 색좌표는 용이하게 조절하면서도, 동일 공정에서 생산된 복수의 발광 장치(10c)들의 색좌표 편차를 현저하게 감소시킬 수 있다.In particular, when the wavelength converter 120 includes a single crystal phosphor sheet, the single crystal phosphor sheet cannot adjust the concentration of the phosphor and the like, and the color coordinates of the light emitted from the wavelength converter 120 are substantially constant. In this case, the color coordinates of the light emitted from the light emitting device 10c may be easily adjusted by adjusting the type and concentration of the phosphor 133 included in the adhesive part 130. Therefore, the color coordinates of the light emitting device 10c including the single crystal phosphor sheet can be easily adjusted, while significantly reducing the color coordinate deviation of the plurality of light emitting devices 10c produced in the same process.
한편, 접착부(130)는 발광 소자(110)와 파장변환부(120)의 사이에 위치할 수 있으며, 나아가, 발광 소자(110) 측면의 적어도 일부를 더 덮을 수 있다. 파장변환부(120)의 면적이 발광 소자(110)의 상면보다 더 큰 경우, 도시된 바와 같이, 발광 소자(110)의 측면 상에 형성된 접착부(130)는 경사를 가질 수 있다. 이때, 접착부(130)는 그것의 표면 장력에 의하여 위에서 아래 방향으로 갈수록 그 폭이 좁아지는 형태로 형성될 수 있다.Meanwhile, the adhesive part 130 may be positioned between the light emitting device 110 and the wavelength conversion part 120, and may further cover at least a portion of the side surface of the light emitting device 110. When the area of the wavelength conversion unit 120 is larger than the top surface of the light emitting device 110, as shown, the adhesive part 130 formed on the side surface of the light emitting device 110 may have an inclination. At this time, the adhesive portion 130 may be formed in a shape in which the width thereof becomes narrower from the top to the downward direction by its surface tension.
접착부(130)가 발광 소자(110)의 측면에도 형성됨으로써, 발광 소자(110)로부터 방출된 광을 더욱 효과적으로 파장변환시킬 수 있다. 또한, 발광 소자(110)의 측면에 형성된 접착부(130)가 경사를 가짐으로써, 측벽부(300) 역시 경사지도록 형성되어 발광 소자(110)에서 방출된 광이 상부로 반사될 수 있다. 따라서 발광 장치(10c)의 발광 효율을 증가시킬 수 있다.Since the adhesive part 130 is formed on the side surface of the light emitting device 110, the light emitted from the light emitting device 110 may be more effectively wavelength-converted. In addition, since the adhesive part 130 formed on the side surface of the light emitting device 110 has an inclination, the side wall part 300 may also be inclined so that the light emitted from the light emitting device 110 may be reflected upward. Therefore, the luminous efficiency of the light emitting device 10c can be increased.
다만, 본 발명이 이에 한정되는 것은 아니며, 접착부(130)는 발광 소자(110)의 하면까지 연장되어 형성될 수 있으며, 나아가 제1 및 제2 전극(113, 115)의 측면에도 접촉될 수도 있다.However, the present invention is not limited thereto, and the adhesive part 130 may extend to the lower surface of the light emitting device 110 and may also be in contact with side surfaces of the first and second electrodes 113 and 115. .
측벽부(300)는 발광부(100)의 측면을 덮을 수 있고, 구체적으로 발광 소자(110)의 측면, 접착부(130)의 측면 및 파장변환부(120)의 측면을 덮을 수 있다. 나아가, 측벽부(300)의 일부는 발광 소자(110)의 하면의 일부를 더 덮을 수 있다. 이때, 패드 전극들(113, 115)의 측면은 측벽부(300)에 둘러싸일 수 있다.The sidewall part 300 may cover the side surface of the light emitting part 100, and specifically, may cover the side surface of the light emitting device 110, the side surface of the adhesive part 130, and the side surface of the wavelength conversion part 120. In addition, a part of the sidewall part 300 may further cover a part of the bottom surface of the light emitting device 110. In this case, side surfaces of the pad electrodes 113 and 115 may be surrounded by the sidewall part 300.
측벽부(300)는 발광 소자(110)를 지지할 수 있고, 또한, 외부 환경으로부터 발광 소자(110)를 보호할 수 있다. 나아가, 측벽부(300)는 광을 반사시키는 역할을 할 수 있다. 측벽부(300)가 발광 장치(10)의 외곽 측면에 형성됨으로써, 발광부(100)에서 방출되는 광을 상부로 집중시킬 수 있다. 특히, 접착부(130)가 발광 소자의(110)의 측면까지 연장되어 형성되고, 경사를 갖는 경우, 접착부(130)의 측면과 접하는 부분의 측벽부(300)는 경사질 수 있다. 따라서, 발광 장치(10)의 발광 효율이 더욱 향상될 수 있다.The side wall part 300 may support the light emitting device 110 and may also protect the light emitting device 110 from an external environment. Furthermore, the side wall part 300 may serve to reflect light. Since the side wall part 300 is formed on the outer side surface of the light emitting device 10, the light emitted from the light emitting part 100 may be concentrated upward. In particular, when the adhesive part 130 extends to the side surface of the light emitting device 110 and has an inclination, the side wall part 300 of the part contacting the side surface of the adhesive part 130 may be inclined. Therefore, the luminous efficiency of the light emitting device 10 can be further improved.
다만, 본 발명은 이에 한정되지 않으며, 필요에 따라 측벽부(300)의 반사도, 광 투과도 등을 조절하여, 발광부(100)에서 방출되는 광의 지향각을 조절할 수 있다.However, the present invention is not limited thereto, and as necessary, the reflection angle, the light transmittance, and the like of the sidewall part 300 may be adjusted to adjust the directing angle of the light emitted from the light emitting part 100.
측벽부(300)는 절연성의 폴리머 물질 또는 세라믹을 포함할 수 있고, 나아가, 광을 반사시키거나 산란시킬 수 있는 필러를 더 포함할 수 있다. 측벽부(300)는 광투과성, 광 반투과성 또는 광 반사성을 가질 수 있다. 예를 들어, 측벽부(300)는 실리콘 수지, 또는 에폭시 수지, 폴리이미드 수지, 우레탄 수지 등과 같은 폴리머 수지를 포함할 수 있다. 본 실시예에서 상기 측벽부(300)는 광 반사성을 갖는 백색 실리콘 수지를 포함할 수 있다.The sidewall portion 300 may include an insulating polymer material or a ceramic, and may further include a filler capable of reflecting or scattering light. The sidewall part 300 may have light transmissive, light semitransparent or light reflective. For example, the sidewall part 300 may include a silicone resin or a polymer resin such as an epoxy resin, a polyimide resin, a urethane resin, or the like. In the present embodiment, the side wall part 300 may include a white silicone resin having light reflectivity.
한편, 측벽부(300)의 상면과 발광부(100)의 상면은 서로 동일 높이를 이룰 수 있다. 즉, 도시된 바와 같이, 측벽부(300)의 상면과 파장변환부(120)의 상면이 서로 나란하게(flush) 형성될 수 있다. On the other hand, the upper surface of the side wall portion 300 and the upper surface of the light emitting portion 100 may form the same height with each other. That is, as illustrated, the top surface of the sidewall portion 300 and the top surface of the wavelength conversion portion 120 may be formed flush with each other.
도 7 내지 도 9는 본 발명의 또 다른 실시예에 따른 발광 장치 제조 방법을 설명하기 위한 단면도들이다. 도 7 내지 도 9에 따라, 도 6에 도시된 바와 같은 발광 장치가 제공될 수 있고, 동일한 구성에 대해서 상세한 설명은 생략한다.7 to 9 are cross-sectional views illustrating a method of manufacturing a light emitting device according to still another embodiment of the present invention. 7 to 9, a light emitting device as shown in FIG. 6 may be provided, and a detailed description of the same configuration will be omitted.
도 7를 참조하면, 기판(400) 상에 발광 소자(110)를 배치하고, 발광 소자(110) 상에 예비 접착부(130a)를 형성한다. 예비 접착부(130a)는 접착성 물질 및 형광체를 포함할 수 있고, 점성을 갖는 물질일 수 있다. 예비 접착부(130a)는 점성을 갖는 실리콘 접착체 내에 형광체가 분산된 형태일 수 있다. 이러한 예비 접착부(130a)는 디스펜싱과 같은 방법을 이용하여 형성될 수 있다.Referring to FIG. 7, the light emitting device 110 is disposed on the substrate 400, and the preliminary adhesion part 130a is formed on the light emitting device 110. The preliminary adhesive part 130a may include an adhesive material and a phosphor, and may be a material having a viscosity. The preliminary adhesive part 130a may have a form in which phosphors are dispersed in a viscous silicone adhesive. The preliminary adhesive portion 130a may be formed using a method such as dispensing.
이어서, 도 8을 참조하면, 발광 소자(110) 상에 파장변환부(120)를 배치하되, 파장변환부(120)와 발광 소자(110)의 사이의 예비 접착부(130a)는 발광 소자(110)의 상면을 따라 퍼질 수 있다. 이에 따라, 도 9에 도시된 바와 같이, 예비 접착부(130a)는 발광 소자(110)와 파장변환부(120)의 사이에 위치할 수 있으며, 나아가, 발광 소자(110)의 측면까지 연장되어 퍼질 수 있다. 특히, 예비 접착부(130a)는 점성을 갖는 물질일 수 있으므로, 그것의 표면 장력에 의해 도시된 바와 같이 경사를 갖는 측면이 형성될 수 있다. 따라서 발광 소자(110) 상에 디스펜싱되는 예비 접착부(130a)의 양, 및 발광 소자(110)를 향하는 방향으로 파장변환부(120)를 누르는 압력을 조절하여, 예비 접착부(130a)가 발광 소자(110)의 측면에 형성되는 정도를 조절할 수 있다.Subsequently, referring to FIG. 8, the wavelength converter 120 is disposed on the light emitting device 110, but the preliminary adhesive part 130a between the wavelength converter 120 and the light emitting device 110 is the light emitting device 110. It can spread along the top of). Accordingly, as shown in FIG. 9, the preliminary adhesive part 130a may be positioned between the light emitting device 110 and the wavelength conversion part 120, and further, may extend to the side of the light emitting device 110 to spread. Can be. In particular, since the preliminary adhesive portion 130a may be a viscous material, the inclined side surface may be formed as shown by its surface tension. Therefore, the amount of the preliminary adhesive portion 130a dispensed on the light emitting device 110 and the pressure for pressing the wavelength conversion part 120 in the direction toward the light emitting device 110 are adjusted, so that the preliminary adhesive portion 130a is a light emitting device. The degree formed on the side of the 110 can be adjusted.
이후, 예비 접착부(130a)를 경화시키고, 측벽부(300)를 형성함으로써, 도 1에 도시된 바와 같은 발광 장치(10)가 제공될 수 있다.Thereafter, by curing the preliminary adhesive portion 130a and forming the sidewall portion 300, the light emitting device 10 as illustrated in FIG. 1 may be provided.
도 10 내지 도 13은 본 발명의 일 실시예에 따른 발광 장치를 설명하기 위한 사시도, 평면도, 저부 평면도 및 단면도이다. 도 9는 본 발명의 또 다른 실시예에 따른 발광 장치를 설명하기 위한 평면도이다.10 to 13 are a perspective view, a plan view, a bottom plan view and a sectional view for describing a light emitting device according to an embodiment of the present invention. 9 is a plan view illustrating a light emitting device according to still another embodiment of the present invention.
도 10 내지 도 13을 참조하여 설명하는 발광 장치(10d)는 도 6을 참조하여 설명한 발광 장치(10c)와 비교하여, 복수의 발광부(100, 200)를 포함하는 점에서 차이가 있다. 또한, 본 실시예의 발광 장치(10d)는 도 1 내지 도 4를 참조하여 설명한 발광 장치(10)와 비교하여, 접착부(130, 230)를 더 포함하는 점에서 차이가 있다. 이하, 차이점을 중심으로 상기 발광 장치(10d)에 관하여 설명하며, 동일한 구성에 대한 상세한 설명은 생략한다.The light emitting device 10d described with reference to FIGS. 10 to 13 is different from the light emitting device 10c described with reference to FIG. 6 in that it includes a plurality of light emitting units 100 and 200. In addition, the light emitting device 10d according to the present exemplary embodiment is different from the light emitting device 10 described with reference to FIGS. 1 to 4 in that it further includes adhesive parts 130 and 230. Hereinafter, the light emitting device 10d will be described based on differences, and a detailed description of the same configuration will be omitted.
도 10 내지 도 13을 참조하면, 발광 장치(10d)는 적어도 2 이상의 발광부를 포함할 수 있고, 구체적으로, 발광 장치(10d)는 제1 발광부(100), 제2 발광부(200), 측벽부(300)를 포함한다. 나아가, 발광 장치(10d)는 기판(400) 및 보호 소자(310)를 더 포함할 수 있다.10 to 13, the light emitting device 10d may include at least two light emitting parts. Specifically, the light emitting device 10d may include the first light emitting part 100, the second light emitting part 200, The side wall portion 300 is included. Furthermore, the light emitting device 10d may further include a substrate 400 and a protection element 310.
기판(400)은 발광 장치(10d)의 저부에 위치할 수 있으며, 제1 및 제2 발광부(100, 200)와 측벽부(300)를 지지하는 역할을 할 수 있다. 기판(400)은 베이스(410)를 포함할 수 있고, 나아가, 제1 내지 제4 전극(421, 431, 423, 433)을 더 포함할 수 있다.The substrate 400 may be located at the bottom of the light emitting device 10d and may serve to support the first and second light emitting parts 100 and 200 and the sidewall part 300. The substrate 400 may include a base 410, and may further include first to fourth electrodes 421, 431, 423, and 433.
제1 발광부(100) 및 제2 발광부(200)는 기판(400) 상에 위치할 수 있다. 제1 발광부(100)는 제1 발광 소자(110), 제1 파장변환부(120) 및 제1 접착부(130)를 포함할 수 있다. 제2 발광부(200)는 제2 발광 소자(210), 제2 파장변환부(220) 및 제2 접착부(230)를 포함할 수 있다. 제1 발광부(100)는 제2 발광부(200)와 다른 파장대의 광을 방출할 수 있으며, 예를 들어, 각각 백색광 및 엠버색광을 방출할 수 있다.The first light emitter 100 and the second light emitter 200 may be positioned on the substrate 400. The first light emitting part 100 may include a first light emitting device 110, a first wavelength converting part 120, and a first adhesive part 130. The second light emitting unit 200 may include a second light emitting device 210, a second wavelength converting unit 220, and a second adhesive unit 230. The first light emitter 100 may emit light having a wavelength different from that of the second light emitter 200. For example, the first light emitter 100 may emit white light and amber color light, respectively.
또한, 제1 발광부(100)는 발광 구조체(111), 제1 패드 전극(113) 및 제2 패드 전극(115)을 포함할 수 있고, 제2 발광부(200)는 발광 구조체(211), 제3 패드 전극(213) 및 제4 패드 전극(215)을 포함할 수 있다.In addition, the first light emitting unit 100 may include a light emitting structure 111, a first pad electrode 113, and a second pad electrode 115, and the second light emitting unit 200 may include a light emitting structure 211. The third pad electrode 213 and the fourth pad electrode 215 may be included.
제1 및 제2 파장변환부(120, 220)는 각각 제1 및 제2 발광 소자(110, 210) 상에 위치할 수 있고, 형광체를 포함할 수 있다. 또한, 제1 및 제2 파장변환부(120, 220)는 상기 형광체를 담지하는 담지부를 더 포함할 수 있다. 특히, 제1 및 제2 파장변환부(120, 220)는 단결정 형광체 시트를 포함할 수 있고, 상기 단결정 형광체 시트는, 예를 들어, 단결정 YAG:Ce일 수 있다.The first and second wavelength converters 120 and 220 may be positioned on the first and second light emitting devices 110 and 210, respectively, and may include phosphors. In addition, the first and second wavelength conversion parts 120 and 220 may further include a support part supporting the phosphor. In particular, the first and second wavelength converters 120 and 220 may include a single crystal phosphor sheet, and the single crystal phosphor sheet may be, for example, single crystal YAG: Ce.
제1 및 제2 접착부(130, 230)는 각각 발광 소자들(110, 210)과 파장변환부(120, 220)들의 사이에 위치할 수 있다. 또한, 제1 및 제2 접착부(130, 230)는 각각 접착성 물질 및 상기 접착성 물질에 분산된 형광체를 포함할 수 있다.The first and second adhesive parts 130 and 230 may be positioned between the light emitting devices 110 and 210 and the wavelength converters 120 and 220, respectively. In addition, the first and second adhesive parts 130 and 230 may each include an adhesive material and phosphors dispersed in the adhesive material.
제1 및 제2 패드 전극(113, 115)은 각각 기판(400)의 제1 전극(421) 및 제2 전극(431)에 전기적으로 연결될 수 있다. 이에 따라, 제1 및 제2 전극(421, 431)을 통해 제1 발광 소자(110)에 전원이 공급될 수 있다. 또한, 제3 패드 전극(213)은 제3 전극(423)에 전기적으로 연결되고, 제4 패드 전극(215)은 제4 전극(433)에 전기적으로 연결될 수 있다. 이에 따라, 제3 및 제4 전극(423, 433)을 통해 제2 발광 소자(210)에 전원이 공급될 수 있다.The first and second pad electrodes 113 and 115 may be electrically connected to the first electrode 421 and the second electrode 431 of the substrate 400, respectively. Accordingly, power may be supplied to the first light emitting device 110 through the first and second electrodes 421 and 431. In addition, the third pad electrode 213 may be electrically connected to the third electrode 423, and the fourth pad electrode 215 may be electrically connected to the fourth electrode 433. Accordingly, power may be supplied to the second light emitting device 210 through the third and fourth electrodes 423 and 433.
몇몇 실시예들에 있어서, 제2 파장변환부(220)는 형광체를 포함하지 않을 수도 있다. 예를 들어, 제2 발광부(200)에서 방출시키고자 하는 광의 파장 대역이 제2 발광 소자(210)의 방출 광 파장 대역과 대체로 일치하는 경우, 제2 파장변환부(220)는 형광체를 포함하지 않을 수도 있다. 이 경우, 제2 파장변환부(220)는 TiO2와 같은 광 산란제를 포함할 수 있다.In some embodiments, the second wavelength converter 220 may not include a phosphor. For example, when the wavelength band of the light to be emitted by the second light emitting unit 200 substantially coincides with the emission light wavelength band of the second light emitting device 210, the second wavelength conversion unit 220 includes a phosphor. You may not. In this case, the second wavelength converter 220 may include a light scattering agent such as TiO 2 .
측벽부(300)는 제1 및 제2 발광 소자(110, 210)의 측면을 덮을 수 있으며, 나아가, 제1 및 제2 파장변환부(120, 220)의 측면을 더 덮을 수 있다. 측벽부(300)는 제1 및 제2 발광부(100, 200)와 접촉될 수 있다. 또한, 측벽부(300)의 일부는 제1 및 제2 발광 소자(110, 210)의 하면의 일부를 더 덮을 수 있고, 이때, 패드 전극들(113, 115, 213, 215)의 측면은 측벽부(300)에 둘러싸일 수 있다.The sidewall part 300 may cover side surfaces of the first and second light emitting devices 110 and 210, and may further cover side surfaces of the first and second wavelength conversion parts 120 and 220. The sidewall part 300 may contact the first and second light emitting parts 100 and 200. In addition, a part of the sidewall part 300 may further cover a part of the lower surfaces of the first and second light emitting devices 110 and 210, and the side surfaces of the pad electrodes 113, 115, 213, and 215 may be sidewalls. It may be surrounded by the part 300.
또한, 본 실시예들에 따른 발광 장치(10a)는 보호 소자(310)를 더 포함할 수 있다. 보호 소자(310)는 측벽부(300) 내에 배치될 수 있으며, 예를 들어, 제너 다이오드를 포함할 수 있다. 상술한 실시예들에 따르면, 발광 장치(10, 10a, 10b, 10d)는 기판(400) 상에 서로 이격되어 위치하는 제1 발광부(100) 및 제2 발광부(200)를 포함하고, 상기 제1 및 제2 발광부(100, 200)는 각각 서로 다른 전극들에 전기적으로 연결된다. 이에 따라, 제1 발광부(100) 및 제2 발광부(200)는 서로 독립적으로 구동될 수 있으며, 필요에 따라 선택적으로 다른 색의 광을 방출하는 발광 장치(10a)가 제공될 수 있다. 따라서, 서로 다른 색의 광을 방출하는 적어도 둘 이상의 발광 장치를 별도로 제조하는 것을 생략할 수 있어, 제조 공정이 간소화 될 수 있다. 나아가, 하나의 발광 장치만으로도 복수 색의 광을 방출시킬 수 있으므로, 특정 응용 장치에서 발광 장치가 차지하는 공간적 비율을 감소시킬 수 있다. In addition, the light emitting device 10a according to the exemplary embodiments may further include a protection element 310. The protection element 310 may be disposed in the sidewall part 300 and may include, for example, a zener diode. According to the above-described embodiments, the light emitting devices 10, 10a, 10b, and 10d include a first light emitting part 100 and a second light emitting part 200 which are spaced apart from each other on the substrate 400. The first and second light emitting parts 100 and 200 are electrically connected to different electrodes, respectively. Accordingly, the first light emitter 100 and the second light emitter 200 may be driven independently of each other, and a light emitting device 10a that selectively emits light of a different color may be provided as necessary. Thus, separately manufacturing at least two or more light emitting devices emitting light of different colors can be omitted, thereby simplifying the manufacturing process. Furthermore, since only one light emitting device can emit light of a plurality of colors, it is possible to reduce the spatial ratio occupied by the light emitting device in a specific application.
한편, 본 발명에 따른 발광 장치는 상술한 실시예에 한정되지 않으며, 셋 이상의 발광부를 포함할 수도 있다. 예를 들어, 도 14에 도시된 바와 같이, 발광 장치(10e)는 복수의 제1 발광부(100) 및 복수의 제2 발광부(200)를 포함할 수 있다. 복수의 제1 발광부(100)들은 서로 직렬 또는 병렬로 연결될 수 있고, 복수의 제2 발광부(200)들 역시 서로 직렬 또는 병렬로 연결될 수 있다. 이와 같이 발광 장치(10e)가 셋 이상의 발광부들을 포함함으로써, 발광 장치(10e) 발광 강도를 향상시킬 수 있다.Meanwhile, the light emitting device according to the present invention is not limited to the above-described embodiment and may include three or more light emitting parts. For example, as illustrated in FIG. 14, the light emitting device 10e may include a plurality of first light emitting units 100 and a plurality of second light emitting units 200. The plurality of first light emitting units 100 may be connected to each other in series or in parallel, and the plurality of second light emitting units 200 may also be connected to each other in series or in parallel. As such, since the light emitting device 10e includes three or more light emitting parts, the light emission intensity of the light emitting device 10e may be improved.
또한, 본 발명의 발광 장치는 세 종류 이상의 색의 광을 방출하는 발광부들을 포함할 수도 있다.In addition, the light emitting device of the present invention may include light emitting parts emitting light of three or more kinds of colors.
상술한 실시예들에서 설명한 발광 장치는, 하나의 발광 장치로부터 둘 이상의 색의 광을 방출될 수 있다. 이러한 발광 장치는 복수의 발광 색이 요구되는 응용 장치 등에 적용될 수 있으며, 예를 들어, 차량용 램프에 적용될 수 있다. 이하, 도 15를 참조하여 본 발명의 실시예들에 따른 발광 장치를 포함하는 차량용 램프에 관하여 설명한다.The light emitting device described in the above embodiments may emit light of two or more colors from one light emitting device. Such a light emitting device may be applied to an application device requiring a plurality of emission colors, and for example, may be applied to a vehicle lamp. Hereinafter, a vehicle lamp including a light emitting device according to embodiments of the present invention will be described with reference to FIG. 15.
도 15는 본 발명의 또 다른 실시예에 따른 차량용 램프를 설명하기 위한 정면도이다.15 is a front view for explaining a vehicle lamp according to another embodiment of the present invention.
도 15를 참조하면, 본 실시예에 따른 차량용 램프(20)는 콤비네이션 램프(23)를 포함할 수 있고, 나아가, 메인 램프(21)를 더 포함할 수 있다. 상기 차량용 램프(20)는 헤드라이트, 백라이트, 또는 사이드 미러 라이트 등 차량의 다양한 부분에 적용될 수 있다.Referring to FIG. 15, the vehicle lamp 20 according to the present embodiment may include a combination lamp 23, and further may further include a main lamp 21. The vehicle lamp 20 may be applied to various parts of a vehicle such as a headlight, a backlight, or a side mirror light.
메인 램프(21)는 차량용 램프(20)에 있어서 주 발광등일 수 있고, 예를 들어, 차량용 램프(20)가 헤드라이트로 이용되는 경우, 차량의 전방을 비추는 전조등 역할을 할 수 있다.The main lamp 21 may be a main light in the vehicle lamp 20, and, for example, when the vehicle lamp 20 is used as a headlight, the main lamp 21 may serve as a headlight for illuminating the front of the vehicle.
콤비네이션 램프(23)는 본 발명의 실시예들에 따른 발광 장치(10)를 포함할 수 있다. 상기 발광 장치(10)는 상술한 실시예들에 따른 발광 장치(10, 10a, 10b, 10c, 10d, 10e) 중 적어도 하나를 포함할 수 있다. 콤비네이션 램프(23)는 적어도 둘 이상의 기능을 할 수 있다. 예를 들어, 차량용 램프(20)가 헤드라이트로 이용되는 경우, 콤비네이션 램프(23)는 주간주행등(daytime running light; DRL) 및 방향 지시등의 기능을 할 수 있다.The combination lamp 23 may include a light emitting device 10 according to embodiments of the present invention. The light emitting device 10 may include at least one of the light emitting devices 10, 10a, 10b, 10c, 10d, and 10e according to the above-described embodiments. The combination lamp 23 may serve at least two functions. For example, when the vehicle lamp 20 is used as a headlight, the combination lamp 23 may function as a daytime running light (DRL) and a turn signal.
구체적으로, 본 실시예의 차량용 램프(20)를 포함하는 차량에 있어서, 상기 차량의 일반 주행 시, 콤비네이션 램프(23)의 발광 장치(10)는 백색광을 방출하는 제1 발광부(100)에서 광을 방출한다. 이에 따라, 상기 콤비네이션 램프(23)는 백색광을 방출하여 주간주행등의 기능을 할 수 있다. 또한, 상기 차량의 방향 지시등을 턴-온(turn-on)하는 경우, 콤비네이션 램프(23)의 발광 장치(10)는 제1 발광부(100)의 전원을 오프하고, 제2 발광부(200)에서 엠버색의 광을 방출한다. 이에 따라, 상기 콤비네이션 램프(23)는 엠버색의 광을 방출하여 방향 지시등의 기능을 할 수 있다. 이러한 콤비네이션 램프(23) 및 발광 장치(10)는 별도의 제어부(미도시)에 의해 그 구동이 제어될 수 있다.Specifically, in the vehicle including the vehicle lamp 20 of the present embodiment, during the normal driving of the vehicle, the light emitting device 10 of the combination lamp 23 emits light from the first light emitting unit 100 that emits white light. Emits. Accordingly, the combination lamp 23 may emit white light to function as a daytime running light. In addition, when the turn signal of the vehicle turns on, the light emitting device 10 of the combination lamp 23 turns off the power of the first light emitting unit 100, and the second light emitting unit 200. Emits amber light. Accordingly, the combination lamp 23 may function as a turn signal by emitting light of amber color. The driving of the combination lamp 23 and the light emitting device 10 may be controlled by a separate controller (not shown).
이와 같이, 둘 이상의 색의 광을 방출하여 적어도 둘 이상의 기능을 할 수 있는 콤비네이션 램프(23)의 광원으로, 본 발명의 실시예들에 따른 발광 장치(10)를 이용할 수 있다. 본 발명의 실시예들에 따른 발광 장치(10)는 적어도 둘 이상의 서로 다른 파장의 광을 방출하는 발광부들을 포함하므로, 콤비네이션 램프(23)를 포함하는 차량용 램프(20) 제조 시, 별도의 둘 이상의 발광 장치를 실장하는 공정이 생략될 수 있다. 따라서 차량용 램프(20)의 불량률을 감소시킬 수 있고, 제조 공정을 단순화하여 공정 수율을 향상시킬 수 있다. 또한, 발광 장치(10)가 접착부(130, 230)를 포함하는 경우, 제조된 발광 장치(10)들 간의 색좌표 편차를 감소시킬 수 있어서, 생산 수율을 향상시킬 수 있다. 따라서, 이러한 발광 장치(10)가 적용된 어플리케이션들 간의 색편차 역시 감소시킬 수 있다. 또한, 발광 장치(10)의 부피가 상대적으로 작으므로, 콤비네이션 램프(23) 제조 시 공간적 제약이 감소될 수 있고, 콤비네이션 램프(23)의 다양한 변형 및 변경이 용이해질 수 있다.As such, the light emitting device 10 according to the exemplary embodiments of the present invention may be used as a light source of the combination lamp 23 that emits two or more colors of light to perform at least two functions. Since the light emitting device 10 according to the embodiments of the present invention includes at least two light emitting parts emitting light of different wavelengths, two separate lamps are manufactured when the vehicle lamp 20 including the combination lamp 23 is manufactured. The process of mounting the above light emitting device can be omitted. Therefore, the defective rate of the vehicle lamp 20 can be reduced, and the manufacturing yield can be improved by simplifying the manufacturing process. In addition, when the light emitting device 10 includes the adhesive parts 130 and 230, color coordinate deviation between the manufactured light emitting devices 10 may be reduced, thereby improving production yield. Therefore, color deviation between applications to which the light emitting device 10 is applied may also be reduced. In addition, since the volume of the light emitting device 10 is relatively small, spatial constraints in manufacturing the combination lamp 23 may be reduced, and various modifications and changes of the combination lamp 23 may be facilitated.
다만, 본 발명이 이에 한정되는 것은 아니며, 상기 발광 장치는 차량용 램프 외 다양한 다른 응용 기구에 적용될 수 있다. 또한, 상술한 다양한 실시예들 및 특징들에 본 발명이 한정되는 것은 아니고, 본 발명의 특허청구범위에 의한 기술적 사상을 벗어나지 않는 범위 내에서 다양한 변형과 변경이 가능하다.However, the present invention is not limited thereto, and the light emitting device may be applied to various other application mechanisms besides a vehicle lamp. In addition, the present invention is not limited to the above-described various embodiments and features, and various modifications and changes may be made without departing from the technical spirit of the claims of the present invention.

Claims (20)

  1. 발광 소자, 상기 발광 소자 상에 위치하는 파장변환부, 및 상기 발광 소자와 파장변환부 사이에 위치하는 접착부를 포함하는 발광부; 및A light emitting unit including a light emitting element, a wavelength conversion unit positioned on the light emitting element, and an adhesive unit positioned between the light emitting element and the wavelength conversion unit; And
    상기 발광부의 측면을 둘러싸고, 상기 발광부의 측면과 접하는 측벽부를 포함하고,A side wall portion surrounding a side surface of the light emitting portion and in contact with a side surface of the light emitting portion;
    상기 접착부는 형광체를 포함하며, 상기 접착부의 형광체로부터 방출되는 광의 파장은 상기 파장변환부로부터 방출되는 광의 파장과 서로 다른 발광 장치.The adhesive unit includes a phosphor, and the wavelength of the light emitted from the phosphor of the adhesive unit is different from the wavelength of the light emitted from the wavelength conversion unit.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 접착부의 형광체로부터 방출되는 광의 피크 파장은 상기 파장변환부로부터 방출되는 광의 피크 파장보다 긴 발광 장치.The peak wavelength of the light emitted from the phosphor of the adhesive portion is longer than the peak wavelength of the light emitted from the wavelength conversion portion.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 접착부의 형광체는 적색 형광체이고,The phosphor of the adhesive portion is a red phosphor,
    상기 파장변환부는 녹색 형광체 또는 황색 형광체를 포함하는 발광 장치.The wavelength conversion unit includes a green phosphor or a yellow phosphor.
  4. 청구항 2에 있어서,The method according to claim 2,
    상기 접착부 및 상기 파장변환부는 각각 서로 다른 1종의 형광체를 포함하는 발광 장치.And the adhesive portion and the wavelength conversion portion each include one kind of phosphor different from each other.
  5. 청구항 1에 있어서,The method according to claim 1,
    상기 파장변환부는 단결정 형광체 시트를 포함하는 발광 장치.The wavelength conversion unit includes a single crystal phosphor sheet.
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 단결정 형광체 시트는 단결정의 YAG:Ce를 포함하고,The single crystal phosphor sheet contains YAG: Ce of single crystal,
    상기 접착부는 적색 형광체를 포함하는 발광 장치.The adhesive unit comprises a red phosphor.
  7. 청구항 1에 있어서,The method according to claim 1,
    상기 접착부는 상기 발광 소자의 측면까지 연장되어 형성된 발광 장치.The adhesive unit is formed to extend to the side of the light emitting element.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 발광 소자의 측면 상에 위치하는 접착부의 부분은, 경사진 측면을 갖는 발광 장치.A portion of the adhesive portion located on the side surface of the light emitting element has an inclined side surface.
  9. 청구항 8에 있어서,The method according to claim 8,
    상기 접착부의 측면 중 경사진 부분은 상기 측벽부와 접하며,The inclined portion of the side of the adhesive portion is in contact with the side wall,
    상기 측벽부는 광 반사성 특성을 갖는 발광 장치.The side wall portion has a light reflecting property.
  10. 청구항 1에 있어서,The method according to claim 1,
    기판을 더 포함하고, 상기 발광부 및 상기 측벽부는 상기 기판 상에 위치하는 발광 장치.The light emitting device further comprises a substrate, wherein the light emitting portion and the side wall portion are located on the substrate.
  11. 제1 발광 소자, 상기 발광 소자 상에 위치하는 제1 파장변환부, 및 상기 제1 발광 소자와 제1 파장변환부 사이에 위치하는 제1 접착부를 포함하는 제1 발광부;A first light emitting part including a first light emitting element, a first wavelength converting part positioned on the light emitting element, and a first adhesive part positioned between the first light emitting element and the first wavelength converting part;
    상기 제1 발광부와 이격되며, 제2 발광 소자, 상기 발광 소자 상에 위치하는 제2 파장변환부, 및 상기 제2 발광 소자와 제2 파장변환부 사이에 위치하는 제2 접착부를 포함하는 제2 발광부;A second light emitting part spaced apart from the first light emitting part and including a second light emitting element, a second wavelength converting part positioned on the light emitting element, and a second adhesive part positioned between the second light emitting element and the second wavelength converting part; 2 light emitting unit;
    상기 제1 및 제2 발광부의 측면을 둘러싸며, 상기 제1 및 제2 발광부의 측면과 접하는 측벽부를 포함하고,A side wall part surrounding side surfaces of the first and second light emitting parts and contacting side surfaces of the first and second light emitting parts,
    상기 제1 및 제2 접착부는 각각 제1 및 제2 형광체를 포함하며, 상기 제1 형광체로부터 방출되는 광의 파장은 상기 제1 파장변환부로부터 방출되는 파장과 서로 다르고, 상기 제2 형광체로부터 방출되는 광의 파장은 상기 제2 파장변환부로부터 방출되는 파장과 서로 다르며,The first and second adhesive parts include first and second phosphors, respectively, and the wavelength of light emitted from the first phosphor is different from the wavelength emitted from the first wavelength converting part, and is emitted from the second phosphor. The wavelength of the light is different from the wavelength emitted from the second wavelength converter,
    상기 제1 발광부와 상기 제2 발광부는 서로 다른 피크 파장을 갖는 광을 방출하는 발광 장치.The light emitting device of claim 1, wherein the first light emitting part and the second light emitting part emit light having different peak wavelengths.
  12. 청구항 11에 있어서,The method according to claim 11,
    기판을 더 포함하고, 상기 제1 및 제2 발광부, 및 상기 측벽부는 상기 기판 상에 위치하는 발광 장치.The light emitting device further comprises a substrate, wherein the first and second light emitting portions, and the side wall portion, are positioned on the substrate.
  13. 청구항 12에 있어서,The method according to claim 12,
    상기 기판은 제1 내지 제4 전극을 포함하고,The substrate includes first to fourth electrodes,
    상기 제1 및 제2 전극은 상기 제1 발광부에 전기적으로 연결되고, 상기 제3 및 제4 전극은 제2 발광부에 전기적으로 연결된 발광 장치.The first and second electrodes are electrically connected to the first light emitting part, and the third and fourth electrodes are electrically connected to a second light emitting part.
  14. 청구항 12에 있어서,The method according to claim 12,
    상기 제1 내지 제4 전극은 서로 절연되며, 상기 제1 내지 제4 전극 각각은 상기 기판의 외부 표면에 노출된 발광 장치.The first to fourth electrodes are insulated from each other, and each of the first to fourth electrodes is exposed to an outer surface of the substrate.
  15. 청구항 11에 있어서,The method according to claim 11,
    상기 제1 발광부는 백색광을 방출하는 발광 장치.The first light emitting unit emits white light.
  16. 청구항 15에 있어서,The method according to claim 15,
    상기 파장변환부는 단결정 형광체 시트를 포함하는 발광 장치.The wavelength conversion unit includes a single crystal phosphor sheet.
  17. 청구항 16에 있어서,The method according to claim 16,
    상기 단결정 형광체 시트는 단결정의 YAG:Ce를 포함하고,The single crystal phosphor sheet contains YAG: Ce of single crystal,
    상기 접착부는 적색 형광체를 포함하는 발광 장치.The adhesive unit comprises a red phosphor.
  18. 청구항 15에 있어서,The method according to claim 15,
    상기 접착부의 형광체로부터 방출되는 광의 피크 파장은 상기 파장변환부로부터 방출되는 광의 피크 파장보다 긴 발광 장치.The peak wavelength of the light emitted from the phosphor of the adhesive portion is longer than the peak wavelength of the light emitted from the wavelength conversion portion.
  19. 청구항 15에 있어서,The method according to claim 15,
    상기 접착부 및 상기 파장변환부는 각각 서로 다른 1종의 형광체를 포함하는 발광 장치.And the adhesive portion and the wavelength conversion portion each include one kind of phosphor different from each other.
  20. 청구항 11에 있어서,The method according to claim 11,
    상기 접착부는 상기 발광 소자의 측면까지 연장되어 형성되고,The adhesive part is formed to extend to the side of the light emitting device,
    상기 발광 소자의 측면 상에 위치하는 접착부의 부분은, 경사진 측면을 갖는 발광 장치.A portion of the adhesive portion located on the side surface of the light emitting element has an inclined side surface.
PCT/KR2015/012429 2014-11-18 2015-11-18 Light emitting device WO2016080769A1 (en)

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Application Number Priority Date Filing Date Title
KR10-2014-0161071 2014-11-18
KR1020140161071A KR102341366B1 (en) 2014-11-18 2014-11-18 Light emitting device and vehicle lamp comprising the same
KR1020140161073A KR102288384B1 (en) 2014-11-18 2014-11-18 Light emitting device
KR10-2014-0161073 2014-11-18

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