WO2016072605A1 - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
WO2016072605A1
WO2016072605A1 PCT/KR2015/009148 KR2015009148W WO2016072605A1 WO 2016072605 A1 WO2016072605 A1 WO 2016072605A1 KR 2015009148 W KR2015009148 W KR 2015009148W WO 2016072605 A1 WO2016072605 A1 WO 2016072605A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
heat
heat dissipation
coupled
Prior art date
Application number
PCT/KR2015/009148
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French (fr)
Korean (ko)
Inventor
이동주
Original Assignee
(주)우미앤씨
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Publication date
Application filed by (주)우미앤씨 filed Critical (주)우미앤씨
Publication of WO2016072605A1 publication Critical patent/WO2016072605A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades

Definitions

  • the present invention relates to an LED lighting device.
  • the LED lighting apparatus may be composed of an LED package packaged with an LED chip, a metal PCB on which the LED package is mounted on the upper surface, and a heat sink mounted on the lower surface of the metal PCB.
  • heat generated in the LED chip is transferred to the heat sink via the package substrate and the metal PCB of the LED package.
  • the prior art since a plurality of components are present on the heat transfer path, and all of the thermal resistances of these components act, there is a problem in that heat generated from the LED chip is not effectively released.
  • the present invention is to provide an LED lighting device having a high heat dissipation performance while having a simple structure.
  • the printed circuit board is formed in a plate-like structure with an open center, the LED chip mounted on one surface of the printed circuit board, an opening is formed in one end and the other end is coupled to the center of the printed circuit board, the inside Ventilation portion is formed in the air flow passage connecting the opening and the center of the printed circuit board, heat sink coupled to the other surface of the printed circuit board to cool the heat generated from the LED chip, air flow hole to correspond to the position of the opening
  • the cover member is formed to cover a portion of the printed circuit board, the LED chip, the vent and the heat sink, and a vent hole communicating with the air flow passage is formed, and the remaining portion of the printed circuit board, the LED chip, the vent and the heat sink is formed.
  • An LED lighting apparatus including a heat dissipation plate having a rectangular heat dissipation portion formed to extend from the heat absorption portion to release heat absorbed by the heat absorption portion.
  • the LED lighting apparatus further includes a power supply unit for supplying power to the LED chip, the heat dissipation plate may be disposed in an annular shape so that the radial heat dissipation portion is formed, the power supply portion may be installed to be inserted into the center region of the heat dissipation plate.
  • the other side of the printed circuit board is formed with a continuous insertion bone corresponding to the shape of the heat absorbing portion, and the heat dissipation plate may be combined with the printed circuit board by inserting the heat absorbing portion into the insertion bone.
  • the LED lighting device is formed in a plate-like structure further comprises a thermal base interposed between the printed circuit board and the heat sink, the thermal base is formed with an intermittent insertion groove corresponding to the shape of the heat absorbing portion on the surface coupled to the heat sink,
  • the heat dissipation plate may be combined with the thermal base by inserting the heat absorbing portion into the insertion groove.
  • the LED lighting device is formed in a plate-like structure further comprises a thermal base interposed between the printed circuit board and the heat sink, the thermal base is formed with intermittent through holes penetrating both sides corresponding to the shape of the heat absorbing portion, the heat radiating plate The heat absorbing portion may be inserted into the through hole to be in contact with the printed circuit board and combined with the thermal base.
  • the printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate may be coupled to each other by a thermally conductive adhesive.
  • the printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate may be coupled to each other by soldering.
  • the vent may include an air circulator for promoting the flow of air introduced into the air flow passage.
  • the LED lighting device since the heat sink is coupled to the other surface of the printed circuit board on which the LED chip is mounted on one surface and air is allowed to flow through the vent, the LED lighting device having a simple structure and high heat dissipation performance is provided. Can be implemented.
  • FIG. 1 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the LED lighting apparatus according to an embodiment of the present invention.
  • 3 and 4 is a view showing in more detail the printed circuit board, the vent and the heat sink in the LED lighting apparatus according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing an LED lighting apparatus according to another embodiment of the present invention.
  • FIG. 6 is a view showing in more detail a printed circuit board, a vent, a thermal base and a heat sink in the LED lighting apparatus according to another embodiment of the present invention.
  • FIG. 7 is a view showing in more detail a modification of the thermal base in the LED lighting apparatus according to another embodiment of the present invention.
  • first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
  • FIG. 1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention.
  • 2 is a cross-sectional view showing the LED lighting apparatus according to an embodiment of the present invention.
  • 3 and 4 are views showing in more detail the printed circuit board, the vent and the heat sink in the LED lighting apparatus according to an embodiment of the present invention.
  • the LED lighting apparatus 1000 includes a printed circuit board 100, an LED chip 200, a vent 300, and a heat sink 400. It includes, and may further include a power supply unit 500.
  • the printed circuit board 100 is a portion formed in a plate-shaped structure having an open center, and as shown in FIGS. 2 to 4, the LED chip 200 is mounted on one surface and the heat sink 400 is coupled to the other surface. Can be.
  • the printed circuit board 100 may be formed of an insulating layer such as FR-4 and a circuit pattern formed thereon.
  • the LED chip 200 is a portion mounted on one surface of the printed circuit board 100 and may emit light using electrical energy.
  • the LED chip 200 may be an LED package including a package substrate and an LED element packaged and packaged, and the specific configuration, number, and arrangement of the LED chip 200 may be variously selected as necessary. have.
  • Ventilation portion 300 is an opening is formed at one end and the other end is coupled to the center of the printed circuit board 100, the air flow passage connecting the opening and the center of the printed circuit board 100 is formed in the inside, As shown in FIG. 2 and FIG. 3 may be a pipe structure.
  • the air introduced into the opening through the vent 300 may exit the open center of the printed circuit board 100 along the air flow passage, thereby forming a flow of air.
  • the heat sink 400 is a portion coupled to the other surface of the printed circuit board 100 to cool the heat generated from the LED chip 200.
  • the heat sink 400 uses the heat conduction or tropical flow phenomenon from the printed circuit board.
  • the heat transferred through the 100 may be radiated.
  • the heat sink 400 is not limited to the structure shown in FIGS. 2 to 4, and a heat sink formed by forming a heat conductive metal such as copper in the shape of a wire or a coil may be used. Can be modified.
  • heat generated from the LED chip 200 is radiated through the heat sink 400 directly coupled to the printed circuit board 100 without passing through a complicated heat transfer path, thereby increasing the heat dissipation efficiency.
  • the heat sink 400 is coupled to the other surface of the printed circuit board 100 on which the LED chip 200 is mounted on one surface of the LED lighting apparatus 1000, and the air is vented through the vent 300. Since it is flexible, it has a simple structure and can exhibit high heat dissipation performance.
  • the heat sink 400 extends from the heat absorbing portion to release heat absorbed from the heat absorbing portion and the heat absorbing portion that are heat transferably coupled to the other surface of the printed circuit board 100. It may include a heat radiation plate 410 having a rectangular heat radiation portion is formed.
  • the portion of the heat dissipation plate 410 coupled to the other surface of the printed circuit board 100 may be a heat absorbing part that receives heat from the other surface of the printed circuit board 100.
  • the outer portion of the heat dissipation plate 410 spaced apart from the other surface of the printed circuit board 100 may be a main heat dissipation unit.
  • the heat dissipation plate 410 of the present embodiment is a rectangular shape in which the heat dissipation portion is formed to extend from the heat absorbing portion can be quickly dissipated a large amount of heat.
  • the rectangular heat dissipation plate 410 since the rectangular heat dissipation plate 410 is relatively light, it may be structurally stable when configuring the LED lighting apparatus 1000 according to the present embodiment.
  • the heat sink 400 may include a heat dissipation plate 410 to more effectively radiate heat.
  • the power supply unit 500 supplies power to the LED chip 200 and may include a power supply device that can be applied to the LED lighting device 1000, such as a switching mode power supply (SMPS). have.
  • SMPS switching mode power supply
  • the heat dissipation plate 410 may be disposed in an annular shape so that a radial heat dissipation part is formed, and the power supply unit 500 may be installed to be inserted into the center region of the heat dissipation plate 410.
  • the heat dissipation plate 410 is made of a unit plate radially arranged, it may be arranged in an annular form. Accordingly, since the heat radiating plate 410 is formed in a radial shape in which the center region is emptied, it may have high air permeability regardless of the installation direction, and thus may maintain excellent heat dissipation performance regardless of the installation direction.
  • the unit plate is provided with a heat dissipation plate 410 disposed radially, but is not limited to this, the shape of the heat dissipation plate 410 is provided with a reinforcing rod for connecting the unit plate formed in the horizontal direction It may include various shapes such as shape.
  • the power supply unit 500 may be installed to be inserted into a portion in which the center area is emptied in the heat dissipation plate 410, and heat generated from the power supply unit 500 itself may be partially radiated.
  • the structure and the size of the LED lighting apparatus 1000 according to the present embodiment may be relatively simplified.
  • the other surface of the printed circuit board 100 is formed with a continuous insertion bone 110 corresponding to the shape of the heat absorbing portion, and the heat radiation plate 410 has a heat absorbing portion inserted into the insertion bone ( It may be inserted into the 110 and coupled to the printed circuit board 100.
  • the continuous insertion bone 110 refers to the insertion bone 110 is formed to extend over a predetermined length along the other surface of the printed circuit board 100, as shown in FIG.
  • the insertion bone 110 as shown in FIGS. 2 to 4 is formed on the other surface of the printed circuit board 100, and the heat absorbing portion of the heat pipe loop 410 is inserted into the insertion bone 110 to be engaged with each other. By doing so, it is possible to further improve the adhesion strength and prevent the separation phenomenon.
  • the insertion bone 110 may be variously modified, such as to be formed on some or all of the other surface of the printed circuit board 100 as necessary.
  • the printed circuit board 100 and the heat dissipation plate 410 may be coupled to each other by a thermally conductive adhesive.
  • the printed circuit board 100 and the heat radiating plate 410 may be made of different materials from each other.
  • the printed circuit board 100 and the heat dissipation plate 410 are made of different materials from each other, it may be preferable to use an adhesive for bonding thereof. However, when a general adhesive is used, thermal conductivity may be deteriorated. .
  • the printed circuit board 100 and the heat radiating plate 410 may be coupled to each other by a soldering method.
  • the printed circuit board 100 and the heat dissipation plate 410 may be made of a metal material.
  • soldering method such as soldering may exhibit a higher adhesive strength than an adhesive.
  • the soldering method may be a more effective coupling method in that no special inclusions to lower the thermal conductivity are generated.
  • the vent 300 may include an air circulator 310 to promote the flow of air introduced into the air flow passage.
  • the speed of the air circulating through the LED lighting device 1000 may be adjusted through the air circulator 310.
  • the air circulator 310 may include both a device capable of sucking or releasing air through a wing or the like, such as a fan.
  • the cover member 600 may induce efficient air flow with protection of the internal parts.
  • the cover member 600 may be made of a transparent material to transmit light, and may be coupled to the base 900 to cover internal components, and an air flow hole may be formed to correspond to the position of the opening.
  • the cover member 600 may be formed to surround the side and the bottom of the LED lighting apparatus 1000 to cover the internal parts, thereby protecting the internal parts from external shock and contamination.
  • the base 800 may be formed to surround the side and top of the LED lighting apparatus 1000 so as to cover the internal parts and may be coupled to the cover member 600.
  • the base 800 may have a vent hole through which air introduced through the air flow passage of the vent 300 may be discharged.
  • the base 800 may be made of an insulating material such as synthetic resin.
  • the base 800 may be coupled to an electrical connection portion 700 electrically connected to the LED chip 200 through the power supply unit 500.
  • the base 800 may have a hemispherical structure having a space formed therein. have.
  • the electrical connection 700 may be a socket having a structure such as Edison type, Swan type.
  • vent holes are formed in all directions in the spherical surface of the base 800, the air flowing in the transverse direction around the base 800 also passes through the base 800, thereby improving heat dissipation performance.
  • 5 is a cross-sectional view showing the LED lighting apparatus according to another embodiment of the present invention.
  • 6 is a view showing in more detail the printed circuit board, the vent, the thermal base and the heat sink in the LED lighting apparatus according to another embodiment of the present invention.
  • the LED lighting apparatus 2000 compares the thermal base 900 with the LED lighting apparatus 1000 according to the embodiment of the present invention. It includes more.
  • the thermal base 900 is formed in a plate-like structure and is interposed between the printed circuit board 100 and the heat sink 400.
  • the thermal base 900 is provided to more stably combine the printed circuit board 100 with the heat sink 400. It may be an auxiliary member.
  • the thermal base 900 has an intermittent insertion groove 910 corresponding to the shape of the heat absorbing portion formed on the surface coupled with the heat sink 400, and the heat dissipation plate 410 has the heat absorbing portion inserted into the insertion groove 910. It may be inserted and combined with the thermal base 900.
  • the intermittent insertion groove 910 refers to a plurality of insertion grooves 910 are formed to be disconnected without being connected to each other along one surface of the thermal base 900, as shown in FIG.
  • each heat absorbing portion may be inserted into each insertion groove 910 corresponding thereto, thereby improving adhesion strength and preventing separation, and fixing the heat absorbing portion relatively more stably.
  • FIG. 7 is a view showing in more detail a modification of the thermal base in the LED lighting apparatus according to another embodiment of the present invention.
  • the thermal base 900 has an intermittent through hole 920 penetrating both sides corresponding to the shape of the heat absorbing portion, and the heat dissipation plate ( The heat absorbing portion 410 may be inserted into the through hole 920 to be in contact with the printed circuit board 100 to be coupled to the thermal base 900.
  • each of the heat absorbing portion is inserted into each corresponding through hole 920 to be in contact with the thermal base 900 while being in contact with the printed circuit board 100, some of the heat generated from the LED chip 200
  • the heat sink 400 may be transferred directly from the printed circuit board 100 without passing through the thermal base 900.
  • the printed circuit board 400 and the heat dissipation plate 410 or the thermal base 900 and the heat dissipation plate 410 are coupled to each other by a heat conductive adhesive, or a soldering method. Can be combined with each other.
  • the LED lighting apparatus 2000 according to another embodiment of the present invention is the same as or similar to the main configuration of the LED lighting apparatus 1000 according to an embodiment of the present invention except for the above-described configuration, overlapping content Only the detailed description will be omitted.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Disclosed is an LED lighting device. The LED lighting device, according to an aspect of the present invention, comprises: a printed circuit board formed in a plate structure in which the central portion thereof is open; an LED chip mounted on one surface of the printed circuit board; an air ventilation part that has an opening formed on one end thereof and an air flow passage formed therein for connecting the opening and the central portion of the printed circuit board and is connected, at the opposite end thereof, to the central portion of the printed circuit board; a heat sink coupled to the opposite surface of the printed circuit board to cool heat generated from the LED chip; a cover member that has an air flow hole formed to correspond to the position of the opening and covers a portion of the printed circuit board, a portion of the LED chip, a portion of the air ventilation part, and a portion of the heat sink; and a base that has an air vent formed therein to communicate with the air flow passage and is coupled to the cover member to cover the remaining portions of the printed circuit board, the LED chip, the air vent part, and the heat sink, wherein the heat sink includes a heat dissipation plate that has: a heat absorption part coupled to the opposite surface of the printed circuit board to transfer heat; and a heat dissipation part that has a rectangular shape and is formed to extend from the heat absorption part to discharge heat absorbed by the heat absorption part.

Description

엘이디 조명 장치LED lighting device
본 발명은 엘이디 조명 장치에 관한 것이다.The present invention relates to an LED lighting device.
엘이디 조명 장치에서는 엘이디의 발열로 인하여 다량의 열이 발생된다. 일반적으로 엘이디 조명 장치가 과열되면 작동 오류가 발생되거나 손상될 수 있는 바, 과열을 방지하기 위한 방열 구조가 필수적으로 요구된다. 또한, 엘이디에 전원을 공급하는 전원 장치의 경우에도 많은 열을 발생시키고 과열되면 수명이 단축되는 등의 문제가 있다.In the LED lighting device, a large amount of heat is generated due to the heat of the LED. In general, when the LED lighting device is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation structure is necessary to prevent overheating. In addition, even in the case of a power supply unit for supplying power to the LED, there is a problem such as generating a lot of heat and shortening the life if overheated.
종래 기술에 따른 엘이디 조명 장치의 경우, 엘이디칩이 패키징된 엘이디 패키지, 상면에 엘이디 패키지가 실장되는 메탈 PCB, 및 이러한 메탈 PCB의 하면에 장착되는 히트 싱크로 구성될 수 있다.In the LED lighting apparatus according to the prior art, it may be composed of an LED package packaged with an LED chip, a metal PCB on which the LED package is mounted on the upper surface, and a heat sink mounted on the lower surface of the metal PCB.
이와 같은 종래 기술에 따르면, 엘이디칩에서 발생된 열은 엘이디 패키지의 패키지 기판 및 메탈 PCB를 거쳐 히트 싱크로 전달된다. 그러나 이와 같은 종래 기술에 따르는 경우, 열의 전달 경로 상에 다수의 부품이 존재하게 되어 이들 부품들의 열 저항이 모두 작용하게 되므로, 엘이디칩에서 발생되는 열이 효과적으로 방출되지 못하는 문제가 있다.According to this prior art, heat generated in the LED chip is transferred to the heat sink via the package substrate and the metal PCB of the LED package. However, according to the prior art, since a plurality of components are present on the heat transfer path, and all of the thermal resistances of these components act, there is a problem in that heat generated from the LED chip is not effectively released.
또한, 엘이디 조명 장치의 구조 및 제조 과정이 복잡하여 비용 및 시간적인 면에서 비효율적이라는 문제가 있다.In addition, there is a problem that the structure and manufacturing process of the LED lighting device is complicated and inefficient in terms of cost and time.
- 선행기술문헌--Prior art document
한국공개실용신안 제20-2009-0046370호 (2009. 05. 11. 공개)Korean Utility Model Model No. 20-2009-0046370 (2009. 05. 11. disclosure)
본 발명은 단순한 구조를 가지면서도 높은 방열 성능을 갖는 엘이디 조명 장치를 제공하기 위한 것이다.The present invention is to provide an LED lighting device having a high heat dissipation performance while having a simple structure.
본 발명의 일 측면에 따르면, 중심부가 개방된 판상 구조로 형성되는 인쇄회로기판, 인쇄회로기판의 일면에 실장되는 엘이디칩, 일단에 개구부가 형성되고 타단이 인쇄회로기판의 중심부와 결합되며, 내측에 개구부와 인쇄회로기판의 중심부를 연결하는 공기 유동 통로가 형성되는 통기부, 엘이디칩에서 발생하는 열을 냉각시키도록 인쇄회로기판의 타면에 결합되는 히트싱크, 개구부의 위치에 대응되도록 공기 유동홀이 형성되어 인쇄회로기판, 엘이디칩, 통기부 및 히트싱크의 일부분을 커버하는 커버부재 및 공기 유동 통로와 연통 가능한 통기홀이 형성되고 인쇄회로기판, 엘이디칩, 통기부 및 히트싱크의 나머지 부분을 커버하도록 커버부재와 결합되는 베이스를 포함하고, 히트싱크는 인쇄회로기판의 타면과 열전달 가능하게 결합되는 흡열부와 흡열부에서 흡수된 열을 방출하도록 흡열부로부터 연장되게 형성되는 장방형 형상의 방열부를 구비한 방열플레이트를 포함하는 것을 특징으로 하는 엘이디 조명 장치가 제공된다.According to an aspect of the invention, the printed circuit board is formed in a plate-like structure with an open center, the LED chip mounted on one surface of the printed circuit board, an opening is formed in one end and the other end is coupled to the center of the printed circuit board, the inside Ventilation portion is formed in the air flow passage connecting the opening and the center of the printed circuit board, heat sink coupled to the other surface of the printed circuit board to cool the heat generated from the LED chip, air flow hole to correspond to the position of the opening The cover member is formed to cover a portion of the printed circuit board, the LED chip, the vent and the heat sink, and a vent hole communicating with the air flow passage is formed, and the remaining portion of the printed circuit board, the LED chip, the vent and the heat sink is formed. A base coupled to the cover member to cover the heat sink, and the heat sink includes a heat absorbing portion coupled to the other surface of the printed circuit board so as to be capable of heat transfer. An LED lighting apparatus is provided, including a heat dissipation plate having a rectangular heat dissipation portion formed to extend from the heat absorption portion to release heat absorbed by the heat absorption portion.
여기서, 엘이디 조명 장치는 엘이디칩에 전원을 공급하는 전원부를 더 포함하고, 방열플레이트는 방사상의 방열부가 형성되도록 환형으로 배치되고, 전원부는 방열플레이트의 중심 영역으로 삽입되게 설치될 수 있다.Here, the LED lighting apparatus further includes a power supply unit for supplying power to the LED chip, the heat dissipation plate may be disposed in an annular shape so that the radial heat dissipation portion is formed, the power supply portion may be installed to be inserted into the center region of the heat dissipation plate.
인쇄회로기판의 타면은 흡열부의 형상에 대응되는 연속적인 삽입골이 형성되고, 방열플레이트는 흡열부가 삽입골에 삽입되어 인쇄회로기판과 결합될 수 있다.The other side of the printed circuit board is formed with a continuous insertion bone corresponding to the shape of the heat absorbing portion, and the heat dissipation plate may be combined with the printed circuit board by inserting the heat absorbing portion into the insertion bone.
엘이디 조명 장치는 판상 구조로 형성되어 인쇄회로기판과 히트싱크 사이에 개재되는 써멀베이스를 더 포함하고, 써멀베이스는 히트싱크와 결합되는 면에 흡열부의 형상에 대응되는 단속적인 삽입홈이 형성되고, 방열플레이트는 흡열부가 삽입홈에 삽입되어 써멀베이스와 결합될 수 있다.The LED lighting device is formed in a plate-like structure further comprises a thermal base interposed between the printed circuit board and the heat sink, the thermal base is formed with an intermittent insertion groove corresponding to the shape of the heat absorbing portion on the surface coupled to the heat sink, The heat dissipation plate may be combined with the thermal base by inserting the heat absorbing portion into the insertion groove.
엘이디 조명 장치는 판상 구조로 형성되어 인쇄회로기판과 히트싱크 사이에 개재되는 써멀베이스를 더 포함하고, 써멀베이스는 흡열부의 형상에 대응되게 양면을 관통하는 단속적인 관통홀이 형성되고, 방열플레이트는 흡열부가 관통홀에 삽입되어 인쇄회로기판과 접촉되면서 써멀베이스와 결합될 수 있다.The LED lighting device is formed in a plate-like structure further comprises a thermal base interposed between the printed circuit board and the heat sink, the thermal base is formed with intermittent through holes penetrating both sides corresponding to the shape of the heat absorbing portion, the heat radiating plate The heat absorbing portion may be inserted into the through hole to be in contact with the printed circuit board and combined with the thermal base.
인쇄회로기판과 방열플레이트 또는 써멀베이스와 방열플레이트는 열전도성 접착제에 의해 서로 결합될 수 있다.The printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate may be coupled to each other by a thermally conductive adhesive.
인쇄회로기판과 방열플레이트 또는 써멀베이스와 방열플레이트는 솔더링 방식에 의해 서로 결합될 수 있다.The printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate may be coupled to each other by soldering.
그리고, 통기부는 공기 유동 통로로 유입되는 공기의 유동을 촉진시키는 공기순환기를 포함할 수 있다.And, the vent may include an air circulator for promoting the flow of air introduced into the air flow passage.
본 발명의 실시예에 따르면, 일면에 엘이디칩이 실장된 인쇄회로기판의 타면에 히트싱크가 결합되고 통기부를 통해 공기가 유동 가능하므로, 단순한 구조를 가지면서도 높은 방열 성능을 갖는 엘이디 조명 장치를 구현할 수 있다.According to an embodiment of the present invention, since the heat sink is coupled to the other surface of the printed circuit board on which the LED chip is mounted on one surface and air is allowed to flow through the vent, the LED lighting device having a simple structure and high heat dissipation performance is provided. Can be implemented.
도 1은 본 발명의 일 실시예에 따른 엘이디 조명 장치를 나타내는 사시도.1 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 엘이디 조명 장치를 나타내는 단면도.2 is a cross-sectional view showing the LED lighting apparatus according to an embodiment of the present invention.
도 3 및 도 4는 본 발명의 일 실시예에 따른 엘이디 조명 장치에서 인쇄회로기판, 통기부 및 히트싱크를 보다 상세히 나타내는 도면.3 and 4 is a view showing in more detail the printed circuit board, the vent and the heat sink in the LED lighting apparatus according to an embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 엘이디 조명 장치를 나타내는 단면도.5 is a cross-sectional view showing an LED lighting apparatus according to another embodiment of the present invention.
도 6은 본 발명의 다른 실시예에 따른 엘이디 조명 장치에서 인쇄회로기판, 통기부, 써멀베이스 및 히트싱크를 보다 상세히 나타내는 도면.6 is a view showing in more detail a printed circuit board, a vent, a thermal base and a heat sink in the LED lighting apparatus according to another embodiment of the present invention.
도 7은 본 발명의 다른 실시예에 따른 엘이디 조명 장치에서 써멀베이스의 변형례를 보다 상세히 나타내는 도면.7 is a view showing in more detail a modification of the thermal base in the LED lighting apparatus according to another embodiment of the present invention.
본 발명은 다양한 변환을 가할 수 있고 여러 가지 실시예를 가질 수 있는 바, 특정 실시예들을 도면에 예시하고 상세한 설명에 상세하게 설명하고자 한다. 그러나, 이는 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변환, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다. 본 발명을 설명함에 있어서 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.
제1, 제2 등의 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되어서는 안 된다. 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다.Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
본 출원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.
이하, 본 발명에 따른 엘이디 조명 장치의 실시예를 첨부도면을 참조하여 상세히 설명하기로 하며, 첨부 도면을 참조하여 설명함에 있어, 동일하거나 대응하는 구성 요소는 동일한 도면번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, an embodiment of the LED lighting apparatus according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated therefor The description will be omitted.
도 1은 본 발명의 일 실시예에 따른 엘이디 조명 장치를 나타내는 사시도이다. 도 2는 본 발명의 일 실시예에 따른 엘이디 조명 장치를 나타내는 단면도이다. 도 3 및 도 4는 본 발명의 일 실시예에 따른 엘이디 조명 장치에서 인쇄회로기판, 통기부 및 히트싱크를 보다 상세히 나타내는 도면이다.1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention. 2 is a cross-sectional view showing the LED lighting apparatus according to an embodiment of the present invention. 3 and 4 are views showing in more detail the printed circuit board, the vent and the heat sink in the LED lighting apparatus according to an embodiment of the present invention.
도 1 내지 도 4에 도시된 바와 같이, 본 발명의 일 실시예에 따른 엘이디 조명 장치(1000)는 인쇄회로기판(100), 엘이디칩(200), 통기부(300) 및 히트싱크(400)를 포함하고, 전원부(500)를 더 포함할 수 있다.1 to 4, the LED lighting apparatus 1000 according to an embodiment of the present invention includes a printed circuit board 100, an LED chip 200, a vent 300, and a heat sink 400. It includes, and may further include a power supply unit 500.
인쇄회로기판(100)은 중심부가 개방된 판상 구조로 형성되는 부분으로, 도 2 내지 도 4에 도시된 바와 같이, 일면에 엘이디칩(200)이 실장되고 타면에 히트싱크(400)가 결합될 수 있다. 이러한, 인쇄회로기판(100)은 FR-4 등의 절연층 및 그에 형성된 회로 패턴으로 이루어질 수 있다.The printed circuit board 100 is a portion formed in a plate-shaped structure having an open center, and as shown in FIGS. 2 to 4, the LED chip 200 is mounted on one surface and the heat sink 400 is coupled to the other surface. Can be. The printed circuit board 100 may be formed of an insulating layer such as FR-4 and a circuit pattern formed thereon.
엘이디칩(200)은 인쇄회로기판(100)의 일면에 실장되는 부분으로, 전기 에너지를 이용하여 광을 발산할 수 있다. 이 경우, 엘이디칩(200)은 패키지 기판과 이에 실장되어 패키징된 엘이디 소자로 구성되는 엘이디 패키지일 수 있는 등, 엘이디칩(200)의 구체적인 구성, 개수 및 배치는 필요에 따라 다양하게 선택될 수 있다.The LED chip 200 is a portion mounted on one surface of the printed circuit board 100 and may emit light using electrical energy. In this case, the LED chip 200 may be an LED package including a package substrate and an LED element packaged and packaged, and the specific configuration, number, and arrangement of the LED chip 200 may be variously selected as necessary. have.
통기부(300)는 일단에 개구부가 형성되고 타단이 인쇄회로기판(100)의 중심부와 결합되며, 내측에 개구부와 인쇄회로기판(100)의 중심부를 연결하는 공기 유동 통로가 형성되는 부분으로, 도 2 및 도 3에 도시된 바와 같이 파이프 구조로 이루어질 수 있다. Ventilation portion 300 is an opening is formed at one end and the other end is coupled to the center of the printed circuit board 100, the air flow passage connecting the opening and the center of the printed circuit board 100 is formed in the inside, As shown in FIG. 2 and FIG. 3 may be a pipe structure.
이러한 통기부(300)를 통해 개구부로 유입되는 공기는 공기 유동 통로를 따라 인쇄회로기판(100)의 개방된 중심부로 빠져나갈 수 있는 등, 공기의 유동을 형성할 수 있다.The air introduced into the opening through the vent 300 may exit the open center of the printed circuit board 100 along the air flow passage, thereby forming a flow of air.
이 경우, 엘이디칩(200)은 도 2 내지 도 4에 도시된 바와 같이, 통기부(300)의 외측에 배치되므로, 공기 유동 통로를 통해 유동하는 공기에 의해 일정 부분 방열이 이루어질 수 있다.In this case, since the LED chip 200 is disposed outside the vent 300 as shown in FIGS. 2 to 4, a partial heat dissipation may be achieved by air flowing through the air flow passage.
히트싱크(400)는 엘이디칩(200)에서 발생하는 열을 냉각시키도록 인쇄회로기판(100)의 타면에 결합되는 부분으로, 열전도 내지 열대류 현상을 이용하여 엘이디칩(200)으로부터 인쇄회로기판(100)을 통해 전달된 열을 방열할 수 있다.The heat sink 400 is a portion coupled to the other surface of the printed circuit board 100 to cool the heat generated from the LED chip 200. The heat sink 400 uses the heat conduction or tropical flow phenomenon from the printed circuit board. The heat transferred through the 100 may be radiated.
한편, 히트싱크(400)는 도 2 내지 도 4에 도시된 구조로 한정되는 것은 아니고, 구리 등의 열전도성 금속을 와이어 또는 코일 등의 형상으로 형성한 방열체가 사용될 수도 있는 등, 필요에 따라 다양하게 변형될 수 있다.Meanwhile, the heat sink 400 is not limited to the structure shown in FIGS. 2 to 4, and a heat sink formed by forming a heat conductive metal such as copper in the shape of a wire or a coil may be used. Can be modified.
이 경우, 엘이디칩(200)에서 발생하는 열은 복잡한 열전달 경로를 거치지 않고 인쇄회로기판(100)에 직접 결합된 히트싱크(400)를 통해 방열되므로 상대적으로 방열 효율을 높일 수 있다.In this case, heat generated from the LED chip 200 is radiated through the heat sink 400 directly coupled to the printed circuit board 100 without passing through a complicated heat transfer path, thereby increasing the heat dissipation efficiency.
또한, 히트싱크(400)를 통한 방열 시 통기부(300)로 유입되는 공기가 인쇄회로기판(100)의 중심부를 지나 히트싱크(400) 방향으로 유동하며 순환될 수 있으므로, 방열 효율을 더욱 향상시킬 수 있다.In addition, since the air flowing into the vent 300 during heat dissipation through the heat sink 400 may be circulated through the center of the printed circuit board 100 toward the heat sink 400, further improving heat dissipation efficiency. You can.
이와 같이, 본 실시예에 따른 엘이디 조명 장치(1000)는 일면에 엘이디칩(200)이 실장된 인쇄회로기판(100)의 타면에 히트싱크(400)가 결합되고 통기부(300)를 통해 공기가 유동 가능하므로, 단순한 구조를 가지면서도 높은 방열 성능을 발휘할 수 있다.As such, in the LED lighting apparatus 1000 according to the present embodiment, the heat sink 400 is coupled to the other surface of the printed circuit board 100 on which the LED chip 200 is mounted on one surface of the LED lighting apparatus 1000, and the air is vented through the vent 300. Since it is flexible, it has a simple structure and can exhibit high heat dissipation performance.
본 실시예에 따른 엘이디 조명 장치(1000)에서, 히트싱크(400)는 인쇄회로기판(100)의 타면과 열전달 가능하게 결합되는 흡열부와 흡열부에서 흡수된 열을 방출하도록 흡열부로부터 연장되게 형성되는 장방형 형상의 방열부를 구비한 방열플레이트(410)를 포함할 수 있다.In the LED lighting apparatus 1000 according to the present embodiment, the heat sink 400 extends from the heat absorbing portion to release heat absorbed from the heat absorbing portion and the heat absorbing portion that are heat transferably coupled to the other surface of the printed circuit board 100. It may include a heat radiation plate 410 having a rectangular heat radiation portion is formed.
이 경우, 도 2 내지 도 4에 도시된 바와 같이, 방열플레이트(410) 중 인쇄회로기판(100)의 타면과 결합되는 부분은 인쇄회로기판(100)의 타면으로부터 열을 전달받는 흡열부일 수 있다. 그리고, 인쇄회로기판(100)의 타면으로부터 이격된 방열플레이트(410)의 외측부분은 주요한 방열부가 될 수 있다.In this case, as shown in FIGS. 2 to 4, the portion of the heat dissipation plate 410 coupled to the other surface of the printed circuit board 100 may be a heat absorbing part that receives heat from the other surface of the printed circuit board 100. . The outer portion of the heat dissipation plate 410 spaced apart from the other surface of the printed circuit board 100 may be a main heat dissipation unit.
특히, 본 실시예의 방열플레이트(410)는 방열부가 흡열부로부터 연장되게 형성되는 장방형 형상으로 이루어짐으로써 대량의 열을 빠르게 발산할 수 있다. 또한, 장방형 형상의 방열플레이트(410)는 비교적 경량이므로, 본 실시예에 따른 엘이디 조명 장치(1000)를 구성할 때 구조적으로도 안정적일 수 있다.In particular, the heat dissipation plate 410 of the present embodiment is a rectangular shape in which the heat dissipation portion is formed to extend from the heat absorbing portion can be quickly dissipated a large amount of heat. In addition, since the rectangular heat dissipation plate 410 is relatively light, it may be structurally stable when configuring the LED lighting apparatus 1000 according to the present embodiment.
이와 같이, 본 실시예에 따른 엘이디 조명 장치(1000)에서, 히트싱크(400)는 방열플레이트(410)를 포함하여 보다 효과적으로 방열이 이루어지도록 할 수 있다.As such, in the LED lighting apparatus 1000 according to the present embodiment, the heat sink 400 may include a heat dissipation plate 410 to more effectively radiate heat.
전원부(500)는 엘이디칩(200)에 전원을 공급하는 부분으로, 교환방식 전원 공급 장치(SMPS; switching mode power supply) 등과 같이 엘이디 조명 장치(1000)에 적용될 수 있는 전원 공급 장치를 포함할 수 있다.The power supply unit 500 supplies power to the LED chip 200 and may include a power supply device that can be applied to the LED lighting device 1000, such as a switching mode power supply (SMPS). have.
여기서, 방열플레이트(410)는 방사상의 방열부가 형성되도록 환형으로 배치되고, 전원부(500)는 방열플레이트(410)의 중심 영역으로 삽입되게 설치될 수 있다.Here, the heat dissipation plate 410 may be disposed in an annular shape so that a radial heat dissipation part is formed, and the power supply unit 500 may be installed to be inserted into the center region of the heat dissipation plate 410.
구체적으로, 도 2 내지 도 4에 도시된 바와 같이, 방열플레이트(410)는 단위플레이트가 방사상으로 배치되어 이루어진 것으로서, 환형의 형태로 배치될 수 있다. 이에 따라, 방열플레이트(410)는 중심 영역이 비워진 방사상의 형태로 형성되어, 설치 방향에 상관없이 높은 통기성을 가질 수 있으므로, 설치 방향에 상관없이 뛰어난 방열성능을 유지할 수 있다.Specifically, as shown in Figures 2 to 4, the heat dissipation plate 410 is made of a unit plate radially arranged, it may be arranged in an annular form. Accordingly, since the heat radiating plate 410 is formed in a radial shape in which the center region is emptied, it may have high air permeability regardless of the installation direction, and thus may maintain excellent heat dissipation performance regardless of the installation direction.
또한, 본 실시예에서는 단위 플레이트가 방사상으로 배치된 방열플레이트(410)를 제시하였으나 이에 한정되지는 않으며, 방열플레이트(410)의 형태는 개별적으로 형성된 단위 플레이트를 횡방향으로 연결하는 보강대 등이 설치된 형태 등 다양한 형상을 포함할 수 있다.In addition, in the present embodiment, the unit plate is provided with a heat dissipation plate 410 disposed radially, but is not limited to this, the shape of the heat dissipation plate 410 is provided with a reinforcing rod for connecting the unit plate formed in the horizontal direction It may include various shapes such as shape.
그리고, 전원부(500)는 도 2 내지 도 4에 도시된 바와 같이, 방열플레이트(410)에서 중심 영역이 비워진 부분에 삽입되게 설치되어, 전원부(500) 자체에서 발생하는 열이 일정 부분 방열 가능할 수 있으며, 본 실시예에 따른 엘이디 조명 장치(1000)의 구조 및 규격을 상대적으로 단순화할 수 있다.2 to 4, the power supply unit 500 may be installed to be inserted into a portion in which the center area is emptied in the heat dissipation plate 410, and heat generated from the power supply unit 500 itself may be partially radiated. In addition, the structure and the size of the LED lighting apparatus 1000 according to the present embodiment may be relatively simplified.
본 실시예에 따른 엘이디 조명 장치(1000)에서, 인쇄회로기판(100)의 타면은 흡열부의 형상에 대응되는 연속적인 삽입골(110)이 형성되고, 방열플레이트(410)는 흡열부가 삽입골(110)에 삽입되어 인쇄회로기판(100)과 결합될 수 있다.In the LED lighting apparatus 1000 according to the present embodiment, the other surface of the printed circuit board 100 is formed with a continuous insertion bone 110 corresponding to the shape of the heat absorbing portion, and the heat radiation plate 410 has a heat absorbing portion inserted into the insertion bone ( It may be inserted into the 110 and coupled to the printed circuit board 100.
이 경우, 연속적인 삽입골(110)이란 도 4에 도시된 바와 같이, 삽입골(110)이 인쇄회로기판(100)의 타면을 따라 일정 길이 이상으로 연장되게 형성되는 것을 일컫는다.In this case, the continuous insertion bone 110 refers to the insertion bone 110 is formed to extend over a predetermined length along the other surface of the printed circuit board 100, as shown in FIG.
상술한 바와 같이, 인쇄회로기판(100)의 타면에 방열플레이트(410)가 직접 결합될 때, 부착 강도가 저하되거나 조립 및 사용 중의 이격 현상이 발생할 우려가 있다.As described above, when the heat dissipation plate 410 is directly coupled to the other surface of the printed circuit board 100, there is a possibility that the adhesive strength is reduced or the separation phenomenon during assembly and use may occur.
따라서, 인쇄회로기판(100)의 타면에 도 2 내지 도 4에 도시된 바와 같은 삽입골(110)을 형성하고, 이러한 삽입골(110)에 히트파이프루프(410)의 흡열부가 삽입되어 서로 맞물리도록 함으로써, 부착 강도를 보다 향상시키고 이격 현상을 방지할 수 있다.Accordingly, the insertion bone 110 as shown in FIGS. 2 to 4 is formed on the other surface of the printed circuit board 100, and the heat absorbing portion of the heat pipe loop 410 is inserted into the insertion bone 110 to be engaged with each other. By doing so, it is possible to further improve the adhesion strength and prevent the separation phenomenon.
한편, 삽입골(110)은 필요에 따라 인쇄회로기판(100)의 타면 중 일부 또는 전부에 형성하는 등, 다양하게 변형될 수 있다.On the other hand, the insertion bone 110 may be variously modified, such as to be formed on some or all of the other surface of the printed circuit board 100 as necessary.
본 실시예에 따른 엘이디 조명 장치(1000)에서, 인쇄회로기판(100)과 방열플레이트(410)는 열전도성 접착제에 의해 서로 결합될 수 있다. 이 경우, 인쇄회로기판(100)과 방열플레이트(410)는 서로 이질 재료로 이루어질 수 있다.In the LED lighting apparatus 1000 according to the present embodiment, the printed circuit board 100 and the heat dissipation plate 410 may be coupled to each other by a thermally conductive adhesive. In this case, the printed circuit board 100 and the heat radiating plate 410 may be made of different materials from each other.
만약, 인쇄회로기판(100)과 방열플레이트(410)는 서로 이질 재료로 이루어지는 경우, 그 결합을 위해서 접착제를 사용하는 것이 바람직할 수 있으나, 일반적인 접착제를 사용하는 경우 열전도 성능이 저하될 우려가 있다.If the printed circuit board 100 and the heat dissipation plate 410 are made of different materials from each other, it may be preferable to use an adhesive for bonding thereof. However, when a general adhesive is used, thermal conductivity may be deteriorated. .
따라서, 접착제 중 열전도성이 우수하도록 제조된 열전도성 접착제를 통해 인쇄회로기판(100)과 방열플레이트(410)를 결합시킴으로써, 방열 효율이 저하되는 것을 방지할 수 있다.Therefore, by combining the printed circuit board 100 and the heat dissipation plate 410 through a heat conductive adhesive manufactured to have excellent heat conductivity among the adhesives, it is possible to prevent the heat dissipation efficiency from being lowered.
또한, 본 실시예에 따른 엘이디 조명 장치(1000)에서, 인쇄회로기판(100)과 방열플레이트(410)는 솔더링 방식에 의해 서로 결합될 수 있다. 이 경우, 인쇄회로기판(100)과 방열플레이트(410)는 금속 재질로 이루어질 수 있다.In addition, in the LED lighting apparatus 1000 according to the present embodiment, the printed circuit board 100 and the heat radiating plate 410 may be coupled to each other by a soldering method. In this case, the printed circuit board 100 and the heat dissipation plate 410 may be made of a metal material.
만약, 인쇄회로기판(100)과 방열플레이트(410)가 금속 재질로 이루어지는 경우, 접착제보다는 납땜 등의 솔더링 방식이 더욱 높은 부착 강도를 발휘할 수 있다. 또한, 솔더링 방식에서는 열전도성을 저하시킬 특별한 개재물이 발생하지 않는다는 점에서도 솔더링 방식이 더욱 효과적인 결합 방식일 수 있다.If the printed circuit board 100 and the heat dissipation plate 410 are made of a metal material, a soldering method such as soldering may exhibit a higher adhesive strength than an adhesive. In addition, in the soldering method, the soldering method may be a more effective coupling method in that no special inclusions to lower the thermal conductivity are generated.
본 실시예에 따른 엘이디 조명 장치(1000)에서, 통기부(300)는 공기 유동 통로로 유입되는 공기의 유동을 촉진시키는 공기순환기(310)를 포함할 수 있다. 공기순환기(310)를 통해 엘이디 조명 장치(1000)를 순환하는 공기의 속도를 조절할 수 있다.In the LED lighting apparatus 1000 according to the present embodiment, the vent 300 may include an air circulator 310 to promote the flow of air introduced into the air flow passage. The speed of the air circulating through the LED lighting device 1000 may be adjusted through the air circulator 310.
이 경우, 공기순환기(310)는 팬(fan)과 같이 날개 등을 통해 공기를 흡입하거나 발산할 수 있는 장치를 모두 포함할 수 있다.In this case, the air circulator 310 may include both a device capable of sucking or releasing air through a wing or the like, such as a fan.
이로 인해, 자연 순환을 통한 공기의 순환만으로는 방열 성능이 부족한 경우, 강제 순환을 일으켜 엘이디 조명 장치(1000)의 방열 성능을 높이도록 조절할 수 있다.For this reason, when the heat dissipation performance is insufficient only by the circulation of air through natural circulation, the forced circulation may occur to adjust the heat dissipation performance of the LED lighting apparatus 1000.
커버부재(600)는 내부 부품의 보호와 더불어 효율적인 공기의 유동을 유도할 수 있다. 커버 부재(600)는 광이 투과되도록 투명한 재질로 이루어질 수 있으며, 내부 부품을 커버하도록 베이스(900)에 결합되며, 개구부의 위치에 대응되도록 공기 유동홀이 형성될 수 있다.The cover member 600 may induce efficient air flow with protection of the internal parts. The cover member 600 may be made of a transparent material to transmit light, and may be coupled to the base 900 to cover internal components, and an air flow hole may be formed to correspond to the position of the opening.
커버부재(600)는 내부 부품을 커버하도록 엘이디 조명 장치(1000)의 측면 및 하부를 감싸는 형태로 형성되어, 외부의 충격 및 오염으로부터 내부 부품을 보호할 수 있다.The cover member 600 may be formed to surround the side and the bottom of the LED lighting apparatus 1000 to cover the internal parts, thereby protecting the internal parts from external shock and contamination.
베이스(800)는 내부 부품을 커버하도록 엘이디 조명 장치(1000)의 측면 및 상부를 감싸는 형태로 형성되어 커버부재(600)와 결합될 수 있다. 베이스(800)에는 통기부(300)의 공기 유동 통로를 통해 유입된 공기가 배출 가능한 통기홀이 형성될 수 있다. 이러한 베이스(800)는 합성 수지 등과 같은 절연 물질로 이루어질 수 있다.The base 800 may be formed to surround the side and top of the LED lighting apparatus 1000 so as to cover the internal parts and may be coupled to the cover member 600. The base 800 may have a vent hole through which air introduced through the air flow passage of the vent 300 may be discharged. The base 800 may be made of an insulating material such as synthetic resin.
베이스(800)의 단부에는 전원부(500)를 통해 엘이디칩(200)과 전기적으로 연결되는 전기연결부(700)가 결합될 수 있으며, 이러한 베이스(800)는 내부에 공간부가 형성된 반구형 구조를 가질 수 있다. 여기서, 전기연결부(700)는 에디슨형, 스완형 등의 구조를 갖는 소켓일 수 있다.An end portion of the base 800 may be coupled to an electrical connection portion 700 electrically connected to the LED chip 200 through the power supply unit 500. The base 800 may have a hemispherical structure having a space formed therein. have. Here, the electrical connection 700 may be a socket having a structure such as Edison type, Swan type.
베이스(800)의 구면에는 모든 방향으로 통기홀이 형성되어 있으므로, 베이스(800)의 주변에 횡방향으로 유동하는 공기 역시 베이스(800)를 통과함으로써 방열 성능이 보다 향상될 수 있다.Since the vent holes are formed in all directions in the spherical surface of the base 800, the air flowing in the transverse direction around the base 800 also passes through the base 800, thereby improving heat dissipation performance.
도 5는 본 발명의 다른 실시예에 따른 엘이디 조명 장치를 나타내는 단면도이다. 도 6은 본 발명의 다른 실시예에 따른 엘이디 조명 장치에서 인쇄회로기판, 통기부, 써멀베이스 및 히트싱크를 보다 상세히 나타내는 도면이다.5 is a cross-sectional view showing the LED lighting apparatus according to another embodiment of the present invention. 6 is a view showing in more detail the printed circuit board, the vent, the thermal base and the heat sink in the LED lighting apparatus according to another embodiment of the present invention.
도 5 및 도 6에 도시된 바와 같이, 본 발명의 다른 실시예에 따른 엘이디 조명 장치(2000)는 본 발명의 일 실시예에 따른 엘이디 조명 장치(1000)와 비교하여, 써멀베이스(900)를 더 포함한다.5 and 6, the LED lighting apparatus 2000 according to another embodiment of the present invention compares the thermal base 900 with the LED lighting apparatus 1000 according to the embodiment of the present invention. It includes more.
써멀베이스(900)는 판상 구조로 형성되어 인쇄회로기판(100)과 히트싱크(400) 사이에 개재되는 부분으로, 인쇄회로기판(100)과 히트싱크(400)의 결합을 더욱 안정적이게 하기 위한 보조적인 부재일 수 있다.The thermal base 900 is formed in a plate-like structure and is interposed between the printed circuit board 100 and the heat sink 400. The thermal base 900 is provided to more stably combine the printed circuit board 100 with the heat sink 400. It may be an auxiliary member.
이 경우, 써멀베이스(900)는 히트싱크(400)와 결합되는 면에 흡열부의 형상에 대응되는 단속적인 삽입홈(910)이 형성되고, 방열플레이트(410)는 흡열부가 삽입홈(910)에 삽입되어 써멀베이스(900)와 결합될 수 있다.In this case, the thermal base 900 has an intermittent insertion groove 910 corresponding to the shape of the heat absorbing portion formed on the surface coupled with the heat sink 400, and the heat dissipation plate 410 has the heat absorbing portion inserted into the insertion groove 910. It may be inserted and combined with the thermal base 900.
여기서, 단속적인 삽입홈(910)이란 도 6에 도시된 바와 같이, 복수의 삽입홈(910)이 써멀베이스(900)의 일면을 따라 서로 연결되지 않고 단절되게 형성되는 것을 일컫는다.Here, the intermittent insertion groove 910 refers to a plurality of insertion grooves 910 are formed to be disconnected without being connected to each other along one surface of the thermal base 900, as shown in FIG.
따라서, 각각의 흡열부가 그에 대응되는 각각의 삽입홈(910)에 삽입되어 부착 강도를 보다 향상시키고 이격 현상을 방지함과 동시에 상대적으로 더욱 안정적으로 흡열부의 위치가 고정될 수 있다.Therefore, each heat absorbing portion may be inserted into each insertion groove 910 corresponding thereto, thereby improving adhesion strength and preventing separation, and fixing the heat absorbing portion relatively more stably.
도 7은 본 발명의 다른 실시예에 따른 엘이디 조명 장치에서 써멀베이스의 변형례를 보다 상세히 나타내는 도면이다.7 is a view showing in more detail a modification of the thermal base in the LED lighting apparatus according to another embodiment of the present invention.
도 7에 도시된 바와 같이, 본 실시예에 따른 엘이디 조명 장치(2000)에서 써멀베이스(900)는 흡열부의 형상에 대응되게 양면을 관통하는 단속적인 관통홀(920)이 형성되고, 방열플레이트(410)는 흡열부가 관통홀(920)에 삽입되어 인쇄회로기판(100)과 접촉되면서 써멀베이스(900)와 결합될 수 있다.As shown in FIG. 7, in the LED lighting apparatus 2000 according to the present embodiment, the thermal base 900 has an intermittent through hole 920 penetrating both sides corresponding to the shape of the heat absorbing portion, and the heat dissipation plate ( The heat absorbing portion 410 may be inserted into the through hole 920 to be in contact with the printed circuit board 100 to be coupled to the thermal base 900.
상기와 같이, 흡열부가 삽입홈(910)에 삽입되는 경우에는, 엘이디칩(200)에서 발생하는 열이 인쇄회로기판(100) 및 써멀베이스(900)를 거쳐 히트싱크(400)로 전달된다는 점에서, 상대적으로 열전달 경로가 복잡하여 방열 효율이 저하될 수 있다.As described above, when the heat absorbing portion is inserted into the insertion groove 910, heat generated from the LED chip 200 is transferred to the heat sink 400 via the printed circuit board 100 and the thermal base 900. In, the heat transfer path is relatively complicated, the heat dissipation efficiency may be lowered.
따라서, 각각의 흡열부가 그에 대응되는 각각의 관통홀(920)에 삽입되어 인쇄회로기판(100)과 접촉되면서 써멀베이스(900)와 결합되도록 함으로써, 엘이디칩(200)에서 발생하는 열 중 일부는 써멀베이스(900)를 거치지 않고 인쇄회로기판(100)에서 직접 히트싱크(400)로 전달될 수 있다.Therefore, each of the heat absorbing portion is inserted into each corresponding through hole 920 to be in contact with the thermal base 900 while being in contact with the printed circuit board 100, some of the heat generated from the LED chip 200 The heat sink 400 may be transferred directly from the printed circuit board 100 without passing through the thermal base 900.
이로 인해, 더욱 안정적으로 흡열부의 위치가 고정하면서도 방열 효율이 저하되는 것을 적절하게 방지할 수 있다.Therefore, it is possible to appropriately prevent the heat dissipation efficiency from being lowered while fixing the position of the heat absorbing portion more stably.
본 실시예에 따른 엘이디 조명 장치(2000)의 경우, 인쇄회로기판(400)과 방열플레이트(410) 또는 써멀베이스(900)와 방열플레이트(410)는 열전도성 접착제에 의해 서로 결합되거나, 솔더링 방식에 의해 서로 결합될 수 있다.In the LED lighting apparatus 2000 according to the present embodiment, the printed circuit board 400 and the heat dissipation plate 410 or the thermal base 900 and the heat dissipation plate 410 are coupled to each other by a heat conductive adhesive, or a soldering method. Can be combined with each other.
한편, 본 발명의 다른 실시예에 따른 엘이디 조명 장치(2000)는 상술한 구성을 제외하고는 본 발명의 일 실시예에 따른 엘이디 조명 장치(1000)의 주요 구성과 동일 또는 유사하므로, 중복되는 내용에 한하여 구체적인 설명은 생략하도록 한다.On the other hand, the LED lighting apparatus 2000 according to another embodiment of the present invention is the same as or similar to the main configuration of the LED lighting apparatus 1000 according to an embodiment of the present invention except for the above-described configuration, overlapping content Only the detailed description will be omitted.
이상, 본 발명의 일 실시예에 대하여 설명하였으나, 해당 기술 분야에서 통상의 지식을 가진 자라면 특허청구범위에 기재된 본 발명의 사상으로부터 벗어나지 않는 범위 내에서, 구성 요소의 부가, 변경, 삭제 또는 추가 등에 의해 본 발명을 다양하게 수정 및 변경시킬 수 있을 것이며, 이 또한 본 발명의 권리범위 내에 포함된다고 할 것이다.As mentioned above, although an embodiment of the present invention has been described, those of ordinary skill in the art may add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.
- 부호의 설명-Description of the sign
100: 인쇄회로기판100: printed circuit board
110: 삽입골110: insertion bone
200: 엘이디칩200: LED chip
300: 통기부300: vent
310: 공기순환기310: air circulator
400: 히트싱크400: heatsink
410: 방열플레이트410: heat dissipation plate
500: 전원부500: power supply
600: 커버부재600: cover member
700: 전기연결부700: electrical connection
800: 베이스800: base
900: 써멀베이스900: thermal base
910: 삽입홈910: insertion groove
920: 관통홀920: through hole
1000, 2000: 엘이디 조명 장치1000, 2000: LED lighting device

Claims (8)

  1. 중심부가 개방된 판상 구조로 형성되는 인쇄회로기판;A printed circuit board formed of a plate-shaped structure having an open center;
    상기 인쇄회로기판의 일면에 실장되는 엘이디칩;An LED chip mounted on one surface of the printed circuit board;
    일단에 개구부가 형성되고 타단이 상기 인쇄회로기판의 중심부와 결합되며, 내측에 상기 개구부와 상기 인쇄회로기판의 중심부를 연결하는 공기 유동 통로가 형성되는 통기부;An air vent formed at one end thereof and having an other end coupled to a center of the printed circuit board, and having an air flow passage connecting the opening and the center of the printed circuit board to an inside thereof;
    상기 엘이디칩에서 발생하는 열을 냉각시키도록 상기 인쇄회로기판의 타면에 결합되는 히트싱크;A heat sink coupled to the other surface of the printed circuit board to cool the heat generated from the LED chip;
    상기 개구부의 위치에 대응되도록 공기 유동홀이 형성되어 상기 인쇄회로기판, 상기 엘이디칩, 상기 통기부 및 상기 히트싱크의 일부분을 커버하는 커버부재; 및An air flow hole formed to correspond to the position of the opening to cover a portion of the printed circuit board, the LED chip, the vent and the heat sink; And
    상기 공기 유동 통로와 연통 가능한 통기홀이 형성되고 상기 인쇄회로기판, 상기 엘이디칩, 상기 통기부 및 상기 히트싱크의 나머지 부분을 커버하도록 상기 커버부재와 결합되는 베이스;를 포함하고,And a base having a vent hole communicating with the air flow passage and coupled with the cover member to cover the printed circuit board, the LED chip, the vent portion, and the rest of the heat sink.
    상기 히트싱크는The heat sink is
    상기 인쇄회로기판의 타면과 열전달 가능하게 결합되는 흡열부와 상기 흡열부에서 흡수된 열을 방출하도록 상기 흡열부로부터 연장되게 형성되는 장방형 형상의 방열부를 구비한 방열플레이트를 포함하는 것을 특징으로 하는 엘이디 조명 장치.And a heat dissipation plate having a heat dissipation unit coupled to the other surface of the printed circuit board so as to be capable of heat transfer, and a heat dissipation unit having a rectangular heat dissipation unit extending from the heat absorption unit to release heat absorbed from the heat absorption unit. Lighting device.
  2. 제1항에 있어서,The method of claim 1,
    상기 엘이디칩에 전원을 공급하는 전원부;A power supply unit supplying power to the LED chip;
    를 더 포함하고,More,
    상기 방열플레이트는 방사상의 방열부가 형성되도록 환형으로 배치되고,The heat dissipation plate is disposed in an annular shape so that a radial heat dissipation part is formed,
    상기 전원부는 상기 방열플레이트의 중심 영역으로 삽입되게 설치되는 것을 특징으로 하는 엘이디 조명 장치.LED power supply, characterized in that the power supply unit is installed to be inserted into the center area of the heat dissipation plate.
  3. 제1항에 있어서,The method of claim 1,
    상기 인쇄회로기판의 타면은 상기 흡열부의 형상에 대응되는 연속적인 삽입골이 형성되고,The other surface of the printed circuit board is formed with a continuous insertion bone corresponding to the shape of the heat absorbing portion,
    상기 방열플레이트는 상기 흡열부가 상기 삽입골에 삽입되어 상기 인쇄회로기판과 결합되는 것을 특징으로 하는 엘이디 조명 장치.The heat dissipation plate is an LED lighting device, characterized in that the heat absorbing portion is inserted into the insertion bone and coupled to the printed circuit board.
  4. 제1항에 있어서,The method of claim 1,
    판상 구조로 형성되어 상기 인쇄회로기판과 상기 히트싱크 사이에 개재되는 써멀베이스;A thermal base formed in a plate shape and interposed between the printed circuit board and the heat sink;
    를 더 포함하고,More,
    상기 써멀베이스는 상기 히트싱크와 결합되는 면에 상기 흡열부의 형상에 대응되는 단속적인 삽입홈이 형성되고,The thermal base is formed with an intermittent insertion groove corresponding to the shape of the heat absorbing portion on the surface coupled to the heat sink,
    상기 방열플레이트는 상기 흡열부가 상기 삽입홈에 삽입되어 상기 써멀베이스와 결합되는 것을 특징으로 하는 엘이디 조명 장치.The heat dissipation plate is an LED lighting device, characterized in that the heat absorbing portion is inserted into the insertion groove and coupled to the thermal base.
  5. 제1항에 있어서,The method of claim 1,
    판상 구조로 형성되어 상기 인쇄회로기판과 상기 히트싱크 사이에 개재되는 써멀베이스;A thermal base formed in a plate shape and interposed between the printed circuit board and the heat sink;
    를 더 포함하고,More,
    상기 써멀베이스는 상기 흡열부의 형상에 대응되게 양면을 관통하는 단속적인 관통홀이 형성되고,The thermal base is formed with an intermittent through hole penetrating both sides corresponding to the shape of the heat absorbing portion,
    상기 방열플레이트는 상기 흡열부가 상기 관통홀에 삽입되어 상기 인쇄회로기판과 접촉되면서 상기 써멀베이스와 결합되는 것을 특징으로 하는 엘이디 조명 장치.The heat dissipation plate is an LED lighting device, characterized in that the heat absorbing portion is inserted into the through hole and in contact with the printed circuit board and coupled to the thermal base.
  6. 제3항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 3 to 5,
    상기 인쇄회로기판과 상기 방열플레이트 또는 상기 써멀베이스와 상기 방열플레이트는 열전도성 접착제에 의해 서로 결합되는 것을 특징으로 하는 엘이디 조명 장치.And the printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate are coupled to each other by a thermally conductive adhesive.
  7. 제3항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 3 to 5,
    상기 인쇄회로기판과 상기 방열플레이트 또는 상기 써멀베이스와 상기 방열플레이트는 솔더링 방식에 의해 서로 결합되는 것을 특징으로 하는 엘이디 조명 장치.And the printed circuit board and the heat dissipation plate or the thermal base and the heat dissipation plate are coupled to each other by a soldering method.
  8. 제3항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 3 to 5,
    상기 통기부는The vent section
    상기 공기 유동 통로로 유입되는 공기의 유동을 촉진시키는 공기순환기An air circulator for promoting the flow of air into the air flow passage
    를 포함하는 것을 특징으로 하는 엘이디 조명 장치.LED lighting device comprising a.
PCT/KR2015/009148 2014-11-03 2015-08-31 Led lighting device WO2016072605A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0151498 2014-11-03
KR1020140151498A KR20160053345A (en) 2014-11-03 2014-11-03 Led lighting apparatus

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086709A (en) * 2008-09-30 2010-04-15 Toshiba Lighting & Technology Corp Bulb-type lamp
US20100277082A1 (en) * 2009-05-01 2010-11-04 Reed William G Gas-discharge lamp replacement with passive cooling
JP2011124182A (en) * 2009-12-14 2011-06-23 Sharp Corp Illuminating device
US20120218774A1 (en) * 2011-02-28 2012-08-30 Livingston Troy W Led light bulb
KR20140005455A (en) * 2012-07-04 2014-01-15 주식회사 애니텍 Heat dissipating device for led lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086709A (en) * 2008-09-30 2010-04-15 Toshiba Lighting & Technology Corp Bulb-type lamp
US20100277082A1 (en) * 2009-05-01 2010-11-04 Reed William G Gas-discharge lamp replacement with passive cooling
JP2011124182A (en) * 2009-12-14 2011-06-23 Sharp Corp Illuminating device
US20120218774A1 (en) * 2011-02-28 2012-08-30 Livingston Troy W Led light bulb
KR20140005455A (en) * 2012-07-04 2014-01-15 주식회사 애니텍 Heat dissipating device for led lamp

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