WO2016059936A1 - Dispositif de traitement au laser à diode direct et procédé de traitement de métal en feuille l'utilisant - Google Patents

Dispositif de traitement au laser à diode direct et procédé de traitement de métal en feuille l'utilisant Download PDF

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WO2016059936A1
WO2016059936A1 PCT/JP2015/076457 JP2015076457W WO2016059936A1 WO 2016059936 A1 WO2016059936 A1 WO 2016059936A1 JP 2015076457 W JP2015076457 W JP 2015076457W WO 2016059936 A1 WO2016059936 A1 WO 2016059936A1
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workpiece
processing apparatus
controlled
laser light
wavelength
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Japanese (ja)
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宏 迫
宏明 石黒
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株式会社アマダホールディングス
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Definitions

  • the present invention relates to a direct diode laser processing apparatus and a sheet metal processing method using the same.
  • a laser processing apparatus for processing a sheet metal an apparatus using a carbon dioxide gas (CO 2 ) laser oscillator, a YAG laser oscillator, or a fiber laser oscillator as a laser light source is known.
  • CO 2 carbon dioxide gas
  • the fiber laser oscillator has advantages such as better light quality and extremely high oscillation efficiency than the YAG laser oscillator. For this reason, a fiber laser processing apparatus using a fiber laser oscillator is used for industrial purposes, particularly for sheet metal processing (cutting or welding).
  • Patent Document 1 merely suggests that may be applied to cutting the DDL machining apparatus, the quality and speed of cutting by DDL processing apparatus are conventionally used CO 2 laser processing device No specific comparative study has been made to raise the level to a level that can compete with fiber laser processing equipment.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a direct diode laser processing apparatus capable of cutting a workpiece at high speed with good quality and a sheet metal processing method using the same. It is to be.
  • a laser resonator that oscillates multi-wavelength laser light
  • a transmission fiber that transmits multi-wavelength laser light oscillated by the laser resonator, and a multi-wavelength transmitted by the transmission fiber
  • the laser resonator sets the wavelength of the multi-wavelength laser beam to 1000 nm.
  • the laser beam machine has a beam parameter product of 4 mm ⁇ mrad to 25 mm ⁇ mrad of the multi-wavelength laser light condensed to process the workpiece, and the workpiece
  • a direct diode laser processing apparatus is provided that controls the cutting speed to 0.1 m / min to 60 m / min.
  • the laser processing machine controls the pressure of the assist gas sprayed onto the workpiece to 0.05 MPa to 1.5 MPa.
  • the laser processing machine controls a condensing diameter of the multi-wavelength laser light condensed to process the workpiece to 247 ⁇ m to 364 ⁇ m.
  • the laser processing machine controls a Joule heat per unit cutting length of the workpiece to 6.9 J / mm to 137.1 J / mm.
  • the laser processing machine has an absorptance with an incident angle of 70 ° with respect to a condensing diameter of the multi-wavelength laser light condensed to process the workpiece.
  • the ratio is controlled to 0.00042% / ⁇ m to 0.11% / ⁇ m.
  • the material to be processed is mild steel having a thickness of 1 mm to 16 mm, and the pressure of the assist gas sprayed onto the material by the laser beam machine is 0.05 MPa to 1.5 MPa.
  • the Joule heat per unit cutting length of the workpiece is controlled to 12.0 J / mm to 137.1 J / mm, and the cutting speed of the workpiece is controlled to 14.6 mm / sec to 166.7 mm / sec. .
  • the workpiece is aluminum having a thickness of 1 mm to 4 mm, and the pressure of the assist gas sprayed onto the workpiece by the laser processing machine is 0.8 MPa to 1.5 MPa.
  • the Joule heat per unit cutting length of the workpiece is controlled to 6.9 J / mm to 43.6 J / mm, and the cutting speed of the workpiece is controlled to 45.8 mm / sec to 291.7 mm / sec. .
  • the present invention oscillates a multi-wavelength laser beam, transmits the oscillated multi-wavelength laser beam, and collects the transmitted multi-wavelength laser beam to be processed. Processing the material, and based on the thickness and absorptance of the workpiece, the wavelength of the multi-wavelength laser light is controlled to be less than 1000 nm and is focused to process the workpiece.
  • a sheet metal processing method is provided, wherein a beam parameter product of the multi-wavelength laser light is controlled to 4 mm ⁇ mrad to 25 mm ⁇ mrad, and a cutting speed of the workpiece is controlled to 0.1 m / min to 60 m / min. .
  • the pressure of the assist gas sprayed on the workpiece is controlled to 0.05 MPa to 1.5 MPa.
  • a condensing diameter of the multi-wavelength laser light condensed to process the workpiece is controlled to 247 ⁇ m to 364 ⁇ m.
  • the Joule heat per unit cutting length of the workpiece is controlled to 6.9 J / mm to 137.1 J / mm.
  • a ratio of an absorptivity at an incident angle of 70 ° with respect to a condensing diameter of the multi-wavelength laser light condensed to process the workpiece is 0.00042% / It is controlled to ⁇ m to 0.11% / ⁇ m.
  • the workpiece is mild steel having a thickness of 1 mm to 16 mm, and the pressure of the assist gas sprayed on the workpiece is 0.05 MPa to 1.5 MPa.
  • the Joule heat per cutting length is controlled to 12.0 J / mm to 137.1 J / mm, and the cutting speed of the workpiece is controlled to 14.6 mm / sec to 166.7 mm / sec.
  • the workpiece is aluminum having a thickness of 1 mm to 4 mm, and the pressure of the assist gas sprayed onto the workpiece by the laser processing machine is 0.8 MPa to 1.5 MPa,
  • the Joule heat per unit cutting length of the workpiece is controlled to 6.9 J / mm to 43.6 J / mm, and the cutting speed of the workpiece is controlled to 45.8 mm / sec to 291.7 mm / sec.
  • FIG. 2A is a side view showing an example of a laser oscillator according to the embodiment of the present invention.
  • FIG. 2B is a front view showing an example of a laser oscillator according to the embodiment of the present invention.
  • It is the schematic which shows an example of the DDL module which concerns on embodiment of this invention.
  • It is the schematic for demonstrating the optical parameter in the DDL processing apparatus which concerns on embodiment of this invention.
  • It is the schematic for demonstrating the incident angle of the laser beam in the DDL processing apparatus which concerns on embodiment of this invention.
  • FIG. 9A is a graph showing the relationship between the incident angle of the laser beam and the iron absorptance according to the third embodiment.
  • FIG. 9B is a graph showing the relationship between the incident angle of the laser beam and the absorptance of aluminum according to the third embodiment.
  • a DDL processing apparatus includes a laser oscillator 11 that oscillates multi-wavelength laser light LB, and a transmission fiber (process) that transmits the laser light LB oscillated by the laser oscillator 11.
  • Fiber) 12 and a laser beam machine 13 for condensing the laser beam LB transmitted by the transmission fiber 12 to a high energy density and irradiating the workpiece (workpiece) W.
  • the laser processing machine 13 includes a collimator unit 14 that converts the laser light LB emitted from the transmission fiber 12 into substantially parallel light by the collimator lens 15, and the laser light LB converted to substantially parallel light in the X-axis and Y-axis directions.
  • a bending mirror 16 that reflects downward in the Z-axis direction perpendicular to the laser beam, and a processing head 17 that condenses the laser beam LB reflected by the bending mirror 16 with a condenser lens 18.
  • a general lens such as a quartz plano-convex lens can be used.
  • a lens driving unit that drives the collimator lens 15 in a direction parallel to the optical axis (X-axis direction) is installed in the collimator unit 14.
  • the DDL processing apparatus further includes a control unit that controls the lens driving unit.
  • the laser processing machine 13 further includes a processing table 21 on which the workpiece W is placed, a portal X-axis carriage 22 that moves in the X-axis direction on the processing table 21, and an X-axis direction on the X-axis carriage 22. And a Y-axis carriage 23 that moves in the Y-axis direction perpendicular to the axis.
  • the collimator lens 15 in the collimator unit 14, the bend mirror 16, and the condensing lens 18 in the processing head 17 are fixed to the Y-axis carriage 23 in a state where the optical axis has been adjusted in advance. Move in the axial direction. It is also possible to provide a Z-axis carriage that can move in the vertical direction with respect to the Y-axis carriage 23 and to provide the condenser lens 18 on the Z-axis carriage.
  • the DDL processing apparatus irradiates the workpiece W with the laser beam LB having the smallest condensing diameter (minimum condensing diameter) condensed by the condensing lens 18 and coaxially assist gas.
  • the X-axis carriage 22 and the Y-axis carriage 23 are moved while the melt is removed by spraying. Thereby, the DDL processing apparatus can cut the workpiece W.
  • the workpiece W include various materials such as stainless steel, mild steel, and aluminum.
  • the plate thickness of the workpiece W is, for example, about 0.1 mm to 50 mm.
  • the laser oscillator 11 includes a housing 60, the DDL module 10 housed in the housing 60 and connected to the transmission fiber 12, and the housing 60.
  • a power supply unit 61 that is housed in the DDL module 10 and supplies power to the DDL module 10
  • a control module 62 that is housed in the housing 60 and controls the output of the DDL module 10, and the like are provided.
  • An air conditioner 63 that adjusts the temperature and humidity in the housing 60 is installed outside the housing 60.
  • the DDL module 10 superimposes and outputs laser beams of multiple wavelengths ( ⁇ 1 , ⁇ 2 , ⁇ 3 ,..., ⁇ n ).
  • the DDL module 10 includes a plurality of laser diodes (hereinafter referred to as “LD”) 3 1 , 3 2 , 3 3 ,...
  • LD 3 1 , 3 2 , 3 3 , ⁇ ⁇ ⁇ 3 n to the fiber 4 1, 4 2, 4 3, is connected via a ⁇ ⁇ ⁇ 4 n, multiple wavelengths lambda 1, lambda 2, lambda 3, ⁇ ⁇ ⁇ , to the laser beam of lambda n
  • a spectral beam combining unit 50 that performs spectral beam combining, and a condensing lens 54 that condenses the laser light from the spectral beam combining unit 50 and enters the transmission fiber 12 are provided.
  • LD3 1, 3 2, 3 3 as a ⁇ ⁇ ⁇ 3 n, various kinds of semiconductor lasers can be employed.
  • the combination of the types and numbers of LD3 1 , 3 2 , 3 3 ,... 3 n is not particularly limited, and can be appropriately selected according to the purpose of sheet metal processing.
  • the wavelengths ⁇ 1 , ⁇ 2 , ⁇ 3 ,..., ⁇ n of the LD 3 1 , 3 2 , 3 3 3 ,... 3 n are selected to be less than 1000 nm, for example, or in the range of 800 nm to 990 nm. , In the range of 910 nm to 950 nm.
  • the laser beams having multiple wavelengths ⁇ 1 , ⁇ 2 , ⁇ 3 ,..., ⁇ n are controlled by group (block) management for each wavelength band, for example.
  • the output can be variably adjusted individually for each wavelength band. Further, the output of the entire wavelength band can be adjusted to have a desired absorption rate.
  • LD3 1 , 3 2 , 3 3 ,... 3 n are simultaneously operated, and an appropriate assist gas such as oxygen or nitrogen is blown near the focal position.
  • an appropriate assist gas such as oxygen or nitrogen is blown near the focal position.
  • the laser beams of the respective wavelengths from the LD 3 1 , 3 2 , 3 3 ,... 3 n cooperate with each other and also with the assist gas such as oxygen to melt the workpiece at a high speed. Further, the molten work material is blown off by the assist gas, and the work is cut at a high speed.
  • the spectral beam combining unit 50 includes a fixing unit 51 that bundles and fixes the emission ends of the fibers 4 1 , 4 2 , 4 3 ,... 4 n to form a fiber array 4, and fibers 4 1 , 4 2 , 4 3. , a collimator lens 52 to the laser light into parallel light from ⁇ ⁇ ⁇ 4 n, multiple wavelengths ⁇ 1, ⁇ 2, ⁇ 3 , ⁇ , a diffraction grating for matching an optical axis diffracting a laser beam of lambda n (Diffraction grating) 53 and LD3 1 , 3 2 , 3 3 ,...
  • 3 n are provided with a partial reflection coupler 55 that constitutes a resonator together with a reflection surface provided at the rear end.
  • the partial reflection coupler 55 is disposed between the collimator lens 52 and the condenser lens 54, but the arrangement position of the partial reflection coupler 55 is not limited to this.
  • the partial reflection coupler 55 is disposed at an angle of 45 degrees with respect to the optical axis, and a part of the reflected light includes an external mirror (not shown) and LD3 1 , 3 2 , 3 3 ,. ..
  • the wavelength is fixed (locked) and stabilized by resonating a specific wavelength between 3 and n .
  • the laser beam LB emitted from the transmission fiber 12 with a divergence angle ⁇ is converted into parallel light having a beam diameter D by the collimator lens 15, condensed by the condenser lens 18, and becomes the minimum condensed diameter d at the focal length f.
  • the laser beam wavelength ⁇ and the laser beam spread angle ⁇ after the focal length f are the minimum condensing diameter d, Rayleigh length Zr, and beam parameter product (BPP)
  • BPP beam parameter product
  • the cutting speed V [mm / s] of the workpiece W can be expressed by the following formula (4).
  • P laser power [W]
  • A absorption rate
  • E melting energy or evaporation energy [J / mm 3 ]
  • d beam diameter [mm]
  • t plate thickness [mm].
  • the processing conditions of the DDL processing apparatus are as follows according to the thickness and the absorption rate of the workpiece W: To control.
  • the wavelength of the multi-wavelength laser light is, for example, less than 1000 nm, may be about 800 nm to 900 nm, or may be about 910 nm to 950 nm.
  • the BPP of the multi-wavelength laser light is, for example, about 4 mm ⁇ mrad to 25 mm ⁇ mrad, and may be about 7 mm ⁇ mrad to 20 mm ⁇ mrad.
  • the laser power is, for example, about 1.2 kW to 4.0 kW, and preferably about 1.6 kW to 2.0 kW.
  • the condensing diameter (beam waist) is, for example, about 150 ⁇ m to 370 ⁇ m, may be about 247 ⁇ m to 364 ⁇ m, and may be about 150 ⁇ m to 364 ⁇ m.
  • the incident diameter to the condensing lens 18 forming the beam waist is 20 mm, for example, the condensing diameter d is about 300 ⁇ m to 364 ⁇ m, and the focal length is about 150 mm to 190 mm, for example.
  • the thickness of the workpiece W is, for example, about 0.2 mm to 30 mm. If the workpiece W is a copper plate, the thickness is about 0.4 mm to 6 mm. If the workpiece W is a mild steel plate, the thickness is about 1 mm to 12 mm. If the workpiece W is an aluminum plate, the thickness is about 0.8 mm to 4 mm. In the case of a stainless steel plate, the thickness is about 0.3 mm to 12 mm.
  • the cutting speed of the workpiece W is, for example, about 0.1 m / min to 60 m / min, and may be about 0.8 m / min to 18 m / min, and 14.6 mm / sec to 291.7 mm / sec. It may be a degree.
  • the Joule heat per unit cutting length of the workpiece W is, for example, about 6.9 J / mm to 137.1 J / mm.
  • the output is 2 kW, and the processing conditions are controlled based on the absorption rate at an incident angle of 70 °.
  • the incident angle refers to an angle ⁇ formed by the center line of the laser beam LB and the perpendicular from the cutting front surface (cutting front) F of the workpiece W irradiated with the laser beam.
  • the absorptance of the material at an incident angle of 70 ° per collection diameter d is about 0.00042% / ⁇ m to 0.11% / ⁇ m.
  • the processing since the processing is performed while melting the material, the dissolved substance may adhere to the lower part of the material as a molten material (dross), particularly in the first implementation.
  • dross molten material
  • FIG. 6 dross has not occurred, and the state where the cut surface is uniform and melted away and is not dented or wavy is defined as a good cutting quality. Control the processing conditions to obtain good cutting quality.
  • the BPP of laser light in the DDL processing apparatus is 10.3 mm ⁇ mrad
  • the BPP of laser light in the CO 2 laser processing apparatus is 8 mm ⁇ mrad
  • the BPP of laser light in the fiber laser processing apparatus is 2 3 mm ⁇ mrad.
  • the assist gas was oxygen, and in the DDL processing apparatus, the gas pressure of the assist gas was controlled at 0.05 MPa to 1.5 MPa.
  • the condensing diameter d is controlled at a constant 364 ⁇ m
  • the Joule heat per unit cutting length of the workpiece W is controlled at 12.0 J / mm to 137.1 J / mm
  • the cutting speed is controlled.
  • Table 1 shows the experimental results when 1.0 mm mild steel is cut. From Table 1, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 2 shows the experimental results when a 1.6 mm mild steel was cut. From Table 2, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 3 shows the experimental results when a 2.3 mm mild steel was cut. From Table 3, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 4 shows the experimental results when a 3.2 mm mild steel was cut. From Table 4, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 5 shows the experimental results when cutting 4.5 mm mild steel. From Table 5, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 6 shows the experimental results when cutting 6 mm mild steel. From Table 6, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 7 shows the experimental results when 9 mm mild steel was cut. From Table 7, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 8 shows the experimental results when cutting 12 mm mild steel. From Table 8, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • Table 9 shows the experimental results when cutting 16 mm mild steel. From Table 9, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus and is efficient.
  • the graph shown in FIG. 7 was created.
  • the DDL processing apparatus can cut faster than the CO 2 laser processing apparatus under the processing conditions shown in Tables 1 to 9, and can also cut faster than the fiber laser processing apparatus. Can be evaluated.
  • the result in stainless steel (thickness 1 mm) has a cutting speed ratio of 1.9, and as a general tendency, the results for the CO 2 laser processing apparatus agree with the results for mild steel.
  • the BPP of laser light in the DDL processing apparatus is 10.3 mm ⁇ mrad
  • the BPP of laser light in the CO 2 laser processing apparatus is 8 mm ⁇ mrad
  • the BPP of laser light in the fiber laser processing apparatus is 2 3 mm ⁇ mrad.
  • the assist gas was nitrogen, and in the DDL processing apparatus, the gas pressure of the assist gas was controlled at 0.8 MPa to 1.5 MPa.
  • the condensing diameter d is controlled by a constant 364 ⁇ m or 300 ⁇ m, and the Joule heat per unit cutting length of the workpiece W is controlled by 6.9 J / mm to 43.6 J / mm, In addition, the cutting speed of the workpiece W was controlled at 45.8 mm / second to 291.7 mm / second.
  • Table 10 shows the experimental results when cutting 1 mm of aluminum. From Table 10, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is smaller and better than the CO 2 laser processing apparatus. Further, it can be seen that the cutting speed of the DDL processing apparatus is faster than that of the CO 2 laser processing apparatus, and the processing can be performed at a high speed. It can also be seen that the A / d of the DDL processing apparatus is the largest and the efficiency is high.
  • Table 11 shows the experimental results when cutting 2 mm of aluminum. From Table 11, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. It can also be seen that the A / d of the DDL processing apparatus is the largest and the efficiency is high.
  • Table 12 shows the experimental results when cutting 3 mm of aluminum. From Table 12, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is the smallest and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is the fastest, and the processing was possible at a high speed. It can also be seen that the A / d of the DDL processing apparatus is the largest and the efficiency is high.
  • Table 13 shows the experimental results when cutting 4 mm of aluminum.
  • the condensing diameter d of the DDL processing apparatus was changed from 247 ⁇ m to 300 ⁇ m, the values of A / d and A / d ratio also changed. From Table 13, it can be seen that the Joule heat per unit cutting length of the DDL processing apparatus is smaller than that of the CO 2 laser processing apparatus and is equivalent to that of the fiber laser processing apparatus and good. Further, it can be seen that the cutting speed of the DDL processing apparatus is faster than that of the CO 2 laser processing apparatus, which is equivalent to that of the fiber laser processing apparatus and can be processed at high speed. Further, it can be seen that the A / d of the DDL processing apparatus is larger than that of the CO 2 laser processing apparatus, is equivalent to the fiber laser processing apparatus, and is efficient.
  • the graph of FIG. 8 was created. As shown in FIG. 8, it can be evaluated that the DDL processing apparatus can be cut faster than the CO 2 laser processing apparatus under the above processing conditions. Further, even when compared with a fiber laser processing apparatus, it can be evaluated that when the aluminum thickness is 2 mm or more and less than 4 mm, it can be cut at high speed under the processing conditions shown in Tables 10 to 13.
  • ⁇ Third embodiment> As a third embodiment, the relationship between the incident angle of the laser beam on the workpiece W and the absorption rate of the material will be described.
  • Fig. 9 (a) and Fig. 9 (b) show the calculation results of the absorption characteristics for iron and aluminum, respectively.
  • 10.6 ⁇ m is a wavelength used in a CO 2 laser processing apparatus
  • 1080 nm is a wavelength used in a fiber laser processing apparatus
  • a range of 910 nm to 950 nm is a wavelength used in a DDL processing apparatus. is there.
  • the wavelength of the multi-wavelength laser light in the DDL processing apparatus is selected to be less than 1000 nm, preferably in the range of 910 nm to 950 nm so as to effectively use the absorptivity characteristics in the wavelength range used in the DDL processing apparatus.
  • cutting can be performed at a higher speed than the CO 2 laser processing apparatus.
  • the CO 2 laser processing apparatus is controlled by controlling the processing conditions such as the cutting speed of the DDL processing apparatus according to the absorption rate and thickness of the workpiece W.
  • the incident angle can be made smaller than that, and the melting effect of the specific cutting material of the thermal cutting in the laser cutting process can be enhanced as compared with the CO 2 laser processing apparatus.

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  • Semiconductor Lasers (AREA)

Abstract

L'invention porte sur un dispositif de traitement au laser à diode direct, lequel dispositif comporte : un résonateur à laser (11), qui fait osciller une lumière de laser à multiples longueurs d'onde ; une fibre de transmission (12), qui transmet la lumière de laser à multiples longueur d'onde qu'a fait osciller le résonateur à laser (11) ; et une machine de traitement au laser (13), qui condense la lumière de laser à multiples longueurs d'onde transmise par la fibre de transmission (12), de façon à traiter ainsi un matériau à traiter. Sur la base de l'épaisseur et du taux d'absorption du matériau à traiter (W), la longueur d'onde de la lumière de laser à multiples longueurs d'onde est commandée de façon à être inférieure à 1000 nm, le produit de paramètres de faisceau de la lumière de laser à multiples longueurs d'onde est commandé de façon à être de 4 à 25 mm∙mrad, et la vitesse de coupe du matériau traité est commandée de façon à être de 0,1 à 60 m/min, de façon à couper ainsi le matériau à traiter (W) rapidement et avec une bonne qualité.
PCT/JP2015/076457 2014-10-15 2015-09-17 Dispositif de traitement au laser à diode direct et procédé de traitement de métal en feuille l'utilisant WO2016059936A1 (fr)

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CN110877150A (zh) * 2019-12-27 2020-03-13 刘晓慧 一种具有清洁功能的高精度激光割圆设备
US12011778B2 (en) 2019-09-23 2024-06-18 Elbit Systems Electro-Optics Elop Ltd System and method for controlling output of light towards objects

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WO2019221034A1 (fr) * 2018-05-15 2019-11-21 パナソニックＩｐマネジメント株式会社 Dispositif laser et dispositif de traitement laser l'utilisant
JP6800271B2 (ja) * 2019-04-26 2020-12-16 株式会社アマダ レーザ加工機及び加工条件設定方法
JP7257372B2 (ja) * 2020-11-20 2023-04-13 株式会社アマダ レーザ加工機

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JP2004114090A (ja) * 2002-09-26 2004-04-15 Mitsubishi Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
US20140096376A1 (en) * 2011-05-25 2014-04-10 Giuseppe Riva Method for manufacturing lead grids for battery electrodes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12011778B2 (en) 2019-09-23 2024-06-18 Elbit Systems Electro-Optics Elop Ltd System and method for controlling output of light towards objects
CN110877150A (zh) * 2019-12-27 2020-03-13 刘晓慧 一种具有清洁功能的高精度激光割圆设备

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