WO2016029607A1 - 电子部件的散热装置 - Google Patents
电子部件的散热装置 Download PDFInfo
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- WO2016029607A1 WO2016029607A1 PCT/CN2014/095146 CN2014095146W WO2016029607A1 WO 2016029607 A1 WO2016029607 A1 WO 2016029607A1 CN 2014095146 W CN2014095146 W CN 2014095146W WO 2016029607 A1 WO2016029607 A1 WO 2016029607A1
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- heat dissipation
- fins
- flow fan
- heat
- cross flow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to the field of electronic devices, and in particular, to a heat sink for an electronic component.
- the operator has increased the application ratio of the distributed base station.
- the remote radio unit (RRU) is installed close to the antenna.
- the heat consumption of the RRU module increases, and the heat dissipation requirements are higher and higher. It is required to provide a heat dissipation device with higher heat dissipation efficiency to meet the heat dissipation requirements of the current RRU module.
- Embodiments of the present invention provide a heat dissipation device for an electronic component, which can improve heat dissipation efficiency.
- a heat dissipating device for an electronic component.
- the heat dissipating device includes: a cross flow fan disposed on a heat dissipating surface of the electronic component and a plurality of first fins, and the first fins are formed between the first fins a heat dissipation channel, the plurality of first fins form a plurality of first heat dissipation channels; the cross flow fan is located at one end of the plurality of first fins, and the cross flow fan penetrates the plurality of first heat dissipation channels; the wind blown by the cross flow fan enters The first heat dissipation channel facilitates heat dissipation of the plurality of first fins.
- the heat dissipating device further includes: a plurality of second fins, a second heat dissipation channel is formed between the adjacent second fins, and the plurality of second fins are formed a plurality of second heat dissipation channels; the cross flow fan is located at one end of the plurality of second fins, and the cross flow fan penetrates the plurality of second heat dissipation channels; the wind flows from the outside into the second heat dissipation channel, and is blown through the second heat dissipation channel Flow fan.
- the axial length of the cross flow fan is greater than or equal to the distance between the outermost two second fins of the plurality of second fins, Take The wind output from each of the plurality of second heat dissipation channels is blown into the cross flow fan.
- the axial length of the cross flow fan is greater than or equal to the outermost two of the plurality of first fins The distance between the fins is such that the wind blown by the cross-flow fan enters each of the plurality of first heat dissipation channels.
- the cross flow fan comprises an axial parallel arrangement along the cross flow fan Multiple sub-flow fans.
- the plurality of first fins are disposed on an upper portion of the cross flow fan.
- the plurality of second fins are disposed at a lower portion of the cross flow fan, and the heat dissipating device further includes: a top cover disposed on the top of the heat dissipating device to cover the plurality of first fins and the plurality of first heat dissipating passages.
- the top cover is provided with a heat dissipation hole
- the heat dissipation device further includes: a guiding structure, wherein the introduction end of the guiding structure is disposed on the top cover Below the venting holes, the leading end of the guiding structure is disposed outside the plurality of first heat dissipating passages, and the liquid or debris entering from the louvers on the top cover plate is led out to the heat dissipating device.
- the heat dissipating device further includes: a front cover disposed between the top cover and the cross flow fan, and the plurality of first The fin and the outer side of the plurality of first heat dissipation channels, the plurality of first fins and the plurality of first heat dissipation channels are located between the heat dissipation surface of the electronic component and the front cover, and the labyrinth heat dissipation holes are disposed on the front cover.
- the heat dissipating device further includes: a side baffle disposed on the heat dissipating device On both sides, the heat dissipation holes are provided on the side fences.
- a base station comprising the heat dissipation device, the radio remote unit RRU and the antenna according to any one of the preceding claims, wherein the heat dissipation device is disposed on a heat dissipation surface of the RRU; and the RRU is configured to convert the baseband optical signal into a radio frequency The signal amplifies the RF signal and transmits the amplified RF signal to the antenna for transmission through the antenna.
- the cross-flow fan is disposed at one end of the plurality of fins, and the cross-flow fan penetrates the plurality of first heat dissipating passages.
- the wind blown by the flow fan directly enters the plurality of heat dissipation channels formed by the plurality of fins, so that the resistance of the wind entering the plurality of heat dissipation channels is small, thereby improving the heat dissipation efficiency.
- FIG. 1A is a schematic plan view of a heat sink of an electronic component in accordance with one embodiment of the present invention.
- FIGS. 1B and 1C are schematic plan views of a heat sink of an electronic component according to another embodiment of the present invention.
- FIG. 2 is a schematic plan view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- FIG. 3 is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- FIG. 4A is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- FIG. 4B is a front elevational view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- 5A is a side view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- 5B is a schematic structural view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.
- 5C is a schematic side view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.
- 5D is another schematic side view of a front cover of a heat sink of an electronic component according to another embodiment of the present invention.
- 5E is a side view of a heat sink of an electronic component in accordance with another embodiment of the present invention.
- FIG. 6A is a rear elevational view of a heat sink of an electronic component in accordance with still another embodiment of the present invention.
- 6B is a schematic view showing the assembly of a heat sink of an electronic component according to still another embodiment of the present invention.
- the heat sink 100 includes: a cross current disposed on a heat dissipating surface of an electronic component A fan and a plurality of first fins 110.
- a first heat dissipation channel 110b is formed between the adjacent first fins 110a, and the plurality of first fins 110a form a plurality of first heat dissipation channels 110b.
- the cross flow fan 120 is located at one end of the plurality of first fins 110a, and the cross flow fan 120 penetrates the plurality of first heat dissipation passages 110b. The wind blown by the cross flow fan 120 enters the first heat dissipation passage 110b, thereby facilitating heat dissipation of the first fin 110a.
- the electronic component in the embodiment of the present invention may be a remote radio unit (RRU), and may be other electronic components.
- RRU remote radio unit
- the heat dissipating surface of the electronic component may be any one or more surfaces of the electronic component.
- the embodiment of the present invention is described by taking only the heat dissipating surface of the heat dissipating device 100 shown in FIG. 1 as the front surface.
- the plurality of first fins 110a may be disposed on the air outlet side of the cross flow fan 120, and the air outlet direction of the air outlet of the cross flow fan 120 is the same as the air inlet direction of the plurality of first heat dissipation channels 110b. .
- the wind blown by the cross-flow fan 120 can directly enter the plurality of first heat dissipation channels 110b, and the wind receives less resistance during the flow into the first heat dissipation channel, so that the cross-flow fan 120 has less working resistance during the air supply process. Thereby, the heat dissipation efficiency of the heat sink can be improved.
- the cross-flow fan 120 has uniform airflow over the entire length of the impeller, and the wind output from the cross-flow fan 120 can directly flow into the plurality of second heat dissipation channels 120, the wind can be uniformly sent to the plurality of second heat dissipation channels 120.
- the heat dissipation of the heat sink 100 is made more uniform.
- the embodiment of the present invention does not need to provide a special air guiding structure to guide the wind output from the cross flow fan 120 into the heat dissipation channel 120, so that the structure of the heat dissipation device is simpler.
- the cross flow fan 120 can be embedded in the first fin 110a without taking up extra space, which can make the structure of the electronic component more compact.
- a certain gap may be provided between the first fin 110a and the impeller of the cross flow fan 120.
- a gap of 3 to 5 mm may be provided between the first fin 110a and the impeller of the cross flow fan 120.
- the cross flow fan 120 may include an impeller and a first motor, the first motor being disposed at one end of the impeller, and the motor driving the impeller to rotate.
- the motor of the cross-flow fan is disposed at one end of the impeller, the radius of the cross-section fan 120 perpendicular to the axial direction is small, and the cross-flow fan 120 is embedded in the first fin 110a, so that the height of the first fin 110a can be lowered. Therefore, the size of the heat sink is smaller. Since the impeller and the motor of the axial flow fan have overlapping regions, the height of the axial flow fan is the superimposed height of the impeller and the motor, so that the cross-flow fan can reach a smaller size that cannot be achieved by the axial flow fan, so that the heat dissipation of the embodiment of the present invention The device 100 can reach a smaller scale that cannot be achieved by the heat sink of the axial fan in the prior art. Inch. Therefore, embodiments of the present invention are advantageous for miniaturization of electronic products.
- the cross flow fan 120 may also be disposed at the top end or the bottom end of the heat dissipating surface, as shown in FIG. 1B and FIG. 1C. At this time, only the plurality of first fins 110a are disposed on the air outlet side of the cross flow fan 130.
- the heat dissipation device may further include: a plurality of second fins 130a, and a second heat dissipation channel 130b is formed between the adjacent second fins 130a, and the plurality of second fins 130a forms a plurality of second heat dissipation channels 130b.
- the cross flow fan 120 is located at one end of the plurality of second fins 130a, and the cross flow fan 120 penetrates the plurality of second heat dissipation passages 130b.
- the wind flows from the outside into the second heat dissipation passage 130b, and passes through the cross flow fan 120 blown by the second heat dissipation passage 130b.
- a certain gap may be provided between the second fin 130a and the impeller of the cross flow fan 120, for example, a gap of 3 to 5 mm is provided between the second fin 130a and the impeller of the cross flow fan 120.
- first heat dissipating fins 110a shown in FIG. 1A are disposed on the upper portion of the cross flow fan 120, and the second heat dissipating fins 130a are disposed on the lower portion of the cross flow fan 120 as an example for description.
- the flow direction of the airflow is from the bottom to the top, and the heat dissipation efficiency of the heat sink 100 is high.
- the first heat dissipating fins 110a may also be disposed at a lower portion of the cross flow fan 120, and the second heat dissipating fins 130a are disposed at an upper portion of the cross flow fan 120, as shown in FIG. 1C.
- the cross-flow fan When the cross-flow fan is maintained, it can be disassembled and maintained from the side of the heat sink 100 or other directions. When a plurality of electronic components are assembled, the cross-flow fan can be detached from the side of the heat sink 100, which makes maintenance more convenient.
- a cross-flow fan and a plurality of fins are disposed on a heat dissipating surface of the electronic component, and a cross-flow fan is disposed at one end of the plurality of fins, and the wind blown by the cross-flow fan directly enters
- the plurality of fins form a plurality of heat dissipating passages, so that the working resistance of the fan is small, thereby improving the heat dissipation efficiency.
- the first fins 110a and the second fins 120a may be disposed in a vertical direction, and may also be disposed to have a certain curvature as shown in FIG. 2.
- the cross-flow fan 120 may be horizontally disposed or non-horizontal, such that the airflow direction of the cross-flow fan is the same as the air-inflow direction of the second heat dissipation channel, and the airflow direction of the cross-flow fan and the first heat dissipation.
- the air outlet direction of the channel is the same.
- the cross-flow fan 120 is subjected to the minimum resistance of the heat dissipation channel during operation, so that the heat dissipation device 100 can achieve high heat dissipation efficiency.
- the angles of the inlet and outlet of the cross-flow fan 120 may be set to 135°, and the angles of the inlet and outlet of the cross-flow fan 120 are close to the horizontal, and the air inlet and outlet are The effect is equivalent to an axial fan. It should be understood that in the embodiment of the present invention, the air inlet and outlet of the cross flow fan 120 The angle is not limited to 135°, and the angles of the inlet and outlet of the cross-flow fan 120 may be other angles.
- the angle of the inlet and outlet of the cross-flow fan 120 is 90°, if the air outlet of the cross-flow fan is facing the extending direction of the first heat dissipation channel formed by the first fin 110a, the cross-flow fan at this time The air inlet is almost perpendicular to the direction of the second heat dissipation channel. At this time, it is disadvantageous to assemble a plurality of electronic components together, because the electronic components assembled in the front block the air inlets of the subsequent electronic components, thereby affecting the heat dissipation of the subsequent electronic components.
- the cross flow fan 120 may employ a magnetic suspension bearing. It should be understood that the cross flow fan 120 can also employ mechanical bearings. The use of magnetic suspension bearings can reduce bearing wear and improve the reliability of the heat sink.
- the cross flow fan 120 may further include a second motor disposed at the second end of the impeller.
- the first motor can be the main motor
- the second motor can be the standby motor. This forms a redundant configuration of the motor, which can improve the reliability of the cross-flow fan 120, thereby improving the overall reliability of the heat sink 100 of the electronic component.
- the axial length of the cross flow fan may also be greater than or equal to the distance between the outermost two first fins 110a of the plurality of first fins 110a, so that the cross flow fan The blown air of 120 flows to each of the plurality of first heat dissipation passages 110b.
- the wind blown by the cross-flow fan can cover all the heat dissipation channels on the heat dissipation surface of the electronic component, thereby improving the heat dissipation efficiency of the heat dissipation device and uniform heat dissipation.
- the axial length of the cross flow fan 120 may also be greater than or equal to the outermost two of the plurality of second fins 130a.
- the distance between the fins 130a is such that the wind output from each of the plurality of second heat dissipation passages 130b is blown into the cross flow fan 120.
- the cross flow fan 120 may include a plurality of sub-flow fans arranged in parallel along the axial direction of the cross flow fan 120.
- the embodiment of the present invention is described by taking only two sub-flow fans as an example. It should be understood that the cross-flow fan 120 may further include two or more sub-flow fans in the embodiment of the present invention.
- the two sub-flow fans may be two independently operating portions of the cross-flow fan 120, the overall configuration of which is still embodied as a complete fan assembly.
- the two sub-flow fans may be two independent cross-flow fans.
- the motor of the sub-flow fan on the left side is disposed on the left side
- the motor of the sub-flow fan on the right side is disposed on the right side, which can realize the coordinated operation or independent operation of the sub-flow fans on the left and right sides. This can reduce the synchronization requirements of the motors on both sides, the excessive long axis ratio of the impeller, and the torsional deformation of the impeller.
- the two sub-flow fans can be plugged and unplugged from both sides, so that the present invention
- the heat sink of the electronic component of the embodiment is easier to maintain.
- the heat dissipation device 100 may further include a top cover 140 disposed at the top of the heat dissipation device 100 to cover the first heat dissipation channel 110b and the first fin 110a.
- the top cover 140 of the embodiment of the present invention can prevent rainwater or debris from falling directly from the top of the heat sink 100 into the impeller and the motor of the fan, causing damage to the cross flow fan.
- the first fin 110a (the second fin 130a when the air inlet portion is disposed at the upper portion of the cross flow fan) may be disposed to maintain a certain distance from the top cover 140, or may be first as shown in FIG.
- An air guiding structure is disposed on the heat dissipating surface between the uppermost end of the fin 110 and the top cover 140, and the air guiding structure can guide the wind flowing out of the first heat dissipating passage 110b to the left and right sides of the heat dissipating device.
- the wind guiding structure may be composed of a pin fin or a sheet fin.
- a heat dissipation hole may be disposed on the top cover 140.
- the heat dissipation device 100 may further include: a guiding structure 150.
- the introduction end of the guiding structure 150 is disposed under the heat dissipation hole on the top cover 140, and the leading end of the guiding structure 150 is disposed in the plurality of first heat dissipation channels.
- the outside of the 110b, the liquid or foreign matter entering from the heat dissipation holes in the top cover 140 is led out to the heat sink 100.
- the guiding structure 150 can guide rainwater or debris to the left and right sides of the heat sink.
- the embodiment of the invention can simultaneously improve the heat dissipation amount while having the protection function.
- the embodiment of the present invention is described by taking the louver structure as shown in FIG. 4A as an example.
- the guiding structure 150 may also be in other forms, which is not limited by the embodiment of the present invention.
- rainwater falling from the top cover 140 falls onto the louver structure shown in FIG. 4A, and falls along the louver structure onto the louver at the bottom of the louver structure, and the louver is provided with a rain guide to guide the rainwater. Discharge to the left and right sides of the heat sink.
- the heat sink 100 may further include a front cover 160 disposed between the top cover 140 and the cross flow fan 120, and a plurality of first fins 110a and a plurality of first heat dissipation channels 110b.
- the plurality of first fins 110a and the plurality of first heat dissipation channels 110b are located between the heat dissipation surface of the electronic component and the front cover 160.
- the front cover 160 can form a duct with the plurality of first heat dissipation passages 110b formed by the plurality of first fins 110a, preventing the wind from flowing out from the outside of the first heat dissipation passage 110b, so that the wind output from the cross flow fan 120 flows through the plurality of A fin 110a and the entire surface of the plurality of first heat dissipation channels 110b further improve heat dissipation efficiency. Meanwhile, the embodiment of the present invention can further prevent rainwater or debris from falling between the top cover 140 and the cross flow fan 120 into the impeller of the cross flow fan 120 and Motor. At this time, the leading end of the guiding structure 150 in the embodiment shown in FIG.
- a heat dissipation hole is disposed on the front cover 160 at a position corresponding to the leading end of the guiding structure, so that the falling The rainwater derived from the outlet end can be directly discharged through the heat dissipation holes on the front cover 160.
- a labyrinth heat dissipation hole 161 may be disposed on the front cover 160.
- the wind can be discharged through the labyrinth vent 161 to dissipate the heat sink 100, which can further improve the heat dissipation efficiency of the heat sink.
- the labyrinth vents 161 also prevent rainwater from entering the heat sink 100.
- the top cover 140 and the front cover 160 may be provided as a single unit. It should be understood that the top cover 140 and the front cover 160 may also be provided as two separate cover plates as shown in FIG. 4B.
- FIG. 5B is a schematic structural view of a labyrinth heat dissipation hole on the front cover 160.
- the labyrinth vent 161 may be composed of a front cover 160, a baffle 162a, and a baffle 162b.
- the baffle 162a is disposed at a position facing the labyrinth louver 161, and the baffle 162b connects the baffle 162a and the lower edge of the labyrinth louver 161.
- the baffle 162b may be disposed to have a certain inclination so that rainwater falling on the baffle 162b flows out of the front cover 160 by gravity.
- 5C is a side view of the front cover 160 of an embodiment, and the baffle 162b may be directly connected to the lower edge of the labyrinth vent 161 as a whole.
- 5D is a side elevational view of the front cover 160 of another embodiment, the baffle 162b being coupled to the baffle 162c, and the baffle 162c being securable to the front cover 160 by a standard mounting member.
- FIG. 5E is a front elevational view of the labyrinth vent 161 of the embodiment shown in FIG. 5D.
- the heat dissipating device 100 of the electronic component can further increase the air volume, improve the heat dissipation efficiency, and ensure the heat dissipation device of the electronic component while preventing external rain or debris from entering the cross-flow fan from the top and the front. reliability.
- the heat dissipating device 100 further includes a side baffle 170 disposed on both sides of the heat dissipating device 100.
- a heat dissipation hole 171 is disposed on the baffle 170.
- the heat dissipation holes disposed at the corresponding air outlets are taken as an example, and it should be understood that the heat dissipation holes may be disposed at other positions on the shutter 170.
- Embodiments of the present invention can enhance the protection capability of the heat sink, thereby enhancing the reliability of the heat sink 100 of the electronic component.
- the duct may be composed of a sheet fin or a pin fin.
- the back side of the electronic component may or may not be a heat dissipating surface.
- only the air passage formed by the pin fins shown in FIG. 6A is disposed on the upper portion of the back surface as an example. It should be understood that the air passage may be disposed at the middle or the lower portion of the back surface.
- the heat dissipation hole 172 is disposed.
- the hot airflow discharged from the electronic component on the right side through the front cover 160 can pass through the air passage formed by the pin fins on the back side of the left electronic component. And the heat dissipation holes 172 on the side baffles are discharged.
- the embodiment of the invention can reduce the working resistance of the cross-flow fan and improve the overall heat dissipation capability of the multi-electronic component assembly.
- top cover 140, the front cover 160, and the side dam 170 may each be made of a heat conductive material, which can contribute to heat dissipation.
- a cross-flow fan and a plurality of fins are disposed on a heat dissipating surface of the electronic component, and a cross-flow fan is disposed at one end of the plurality of fins, and the wind blown by the cross-flow fan directly enters
- the plurality of fins form a plurality of heat dissipating passages, so that the working resistance of the fan is small, thereby improving the heat dissipation efficiency.
- the disclosed systems, devices, and methods may be implemented in other manners.
- the device embodiments described above are merely illustrative.
- the division of the unit is only a logical function division.
- there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
- the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
- the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
- each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated in one unit. In the unit.
- the functions may be stored in a computer readable storage medium if implemented in the form of a software functional unit and sold or used as a standalone product.
- the technical solution of the present invention which is essential or contributes to the prior art, or a part of the technical solution, may be embodied in the form of a software product, which is stored in a storage medium, including
- the instructions are used to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention.
- the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like, which can store program codes. .
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Abstract
本发明公开了一种电子部件的散热装置,该散热装置包括:设置在电子部件的散热表面上的贯流风扇(120)和多个第一翅片(110a),相邻的第一翅片(110a)之间形成第一散热通道(110b),多个第一翅片(110a)形成多个第一散热通道(110b);贯流风扇(120)位于多个第一翅片(110a)的一端的外侧,并且贯流风扇(120)贯通多个第一散热通道(110b);贯流风扇(120)吹出的风进入第一散热通道(110b),从而有利于多个第一翅片(110a)散热。本发明实施例的电子部件的散热装置能够提升散热效率。
Description
本申请要求于2014年08月27日提交中国专利局、申请号为201410429452.1,发明名称为“电子部件的散热装置”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本发明涉及电子设备领域,尤其涉及一种电子部件的散热装置。
由于机房获取越来越困难,机房建设成本越来越高,同时较长的馈缆增加了损耗,对***节能和降低运营电费很不利。
目前运营商增大了分布式基站的应用比例,在分布式基站中,远端射频模块(Remote Radio Unit,简称RRU)靠近天线安装。随着RRU模块输出功率的增加,RRU模块的热耗也不断增加,对散热要求越来越高,需要提供一种散热效率更高的散热装置,以满足当前RRU模块的散热需求。
发明内容
本发明实施例提供了一种电子部件的散热装置,能够提升散热效率。
第一方面,提供了一种电子部件的散热装置,该散热装置包括:设置在电子部件的散热表面上的贯流风扇和多个第一翅片,相邻的第一翅片之间形成第一散热通道,多个第一翅片形成多个第一散热通道;贯流风扇位于多个第一翅片的一端,并且贯流风扇贯通多个第一散热通道;贯流风扇吹出的风进入第一散热通道,从而有利于多个第一翅片散热。
结合第一方面,在第一种可能的实现方式中,该散热装置还包括:多个第二翅片,相邻的第二翅片之间形成第二散热通道,多个第二翅片形成多个第二散热通道;贯流风扇位于多个第二翅片的一端,并且贯流风扇贯通多个第二散热通道;风从外部流入第二散热通道,经过第二散热通道吹入到贯流风扇。
结合第一种可能的实现方式,在第二种可能的实现方式中,贯流风扇的轴向长度大于或等于多个第二翅片中最外侧的两个第二翅片之间的距离,以
使多个第二散热通道中每个第二散热通道输出的风吹入到贯流风扇。
结合第一方面或第一种或第二种可能的实现方式,在第三种可能的实现方式中,贯流风扇的轴向长度大于或等于多个第一翅片中最外侧的两个第一翅片之间的距离,以使贯流风扇吹出的风进入多个第一散热通道中的每个第一散热通道。
结合第一方面或第一种至第三种可能的实现方式中的任一种可能的实现方式,在第四种可能的实现方式中,贯流风扇包括沿贯流风扇的轴向并行排列的多个子贯流风扇。
结合第一方面或第一种至第四种可能的实现方式中的任一种可能的实现方式,在第五种可能的实现方式中,多个第一翅片设置在贯流风扇的上部,多个第二翅片设置在贯流风扇的下部,散热装置还包括:顶部盖板,设置在散热装置的顶部,遮盖多个第一翅片和多个第一散热通道。
结合第五种可能的实现方式,在第六种可能的实现方式中,顶部盖板上设置有散热孔,散热装置还包括:导引结构,导引结构的导入端设置在顶部盖板上的散热孔的下方,导引结构的导出端设置在多个第一散热通道的外部,将从顶部盖板上的散热孔进入的液体或杂物导出散热装置。
结合第五种或第六种可能的实现方式,在第七种可能的实现方式中,该散热装置还包括:前盖板,设置在顶部盖板与贯流风扇之间,及多个第一翅片和多个第一散热通道的外侧,多个第一翅片和多个第一散热通道位于电子部件的散热表面和前盖板之间,前盖板上设置迷宫式散热孔。
结合第一方面或第一种至第七种可能的实现方式中的任一种可能的实现方式,在第八种可能的实现方式中,该散热装置还包括:侧挡板,设置在散热装置的两侧,侧挡板上设置散热孔。
第二方面,提供了一种基站,包括如上述任一项所述的散热装置、射频拉远单元RRU和天线,散热装置设置在RRU的散热表面上;RRU用于将基带光信号转化成射频信号,对射频信号进行放大处理,以及将经过放大处理的射频信号传输给天线,以通过天线发送出去。
基于上述技术方案,通过在电子部件的散热表面设置贯流风扇和多个翅片,贯流风扇设置在多个翅片的一端,并且贯流风扇贯通多个第一散热通道,本方案中贯流风扇吹出的风直接进入多个翅片形成的多个散热通道,使得风进入所述多个散热通道的阻力较小,进而能够提升散热效率。
为了更清楚地说明本发明实施例的技术方案,下面将对本发明实施例中所需要使用的附图作简单地介绍,显而易见地,下面所描述的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1A是根据本发明一个实施例的电子部件的散热装置的平面示意图。
图1B和图1C是根据本发明另一实施例的电子部件的散热装置的平面示意图。
图2是根据本发明另一实施例的电子部件的散热装置的平面示意图。
图3是根据本发明另一实施例的电子部件的散热装置的正视图。
图4A是根据本发明另一实施例的电子部件的散热装置的正视图。
图4B是根据本发明另一实施例的电子部件的散热装置的正视图。
图5A是根据本发明另一实施例的电子部件的散热装置的侧视图。
图5B是根据本发明另一实施例的电子部件的散热装置的前盖板的结构示意图。
图5C是根据本发明另一实施例的电子部件的散热装置的前盖板的侧面示意图。
图5D是根据本发明另一实施例的电子部件的散热装置的前盖板的另一侧面示意图。
图5E是根据本发明另一实施例的电子部件的散热装置的侧视图。
图6A是根据本发明又一实施例的电子部件的散热装置的后视图。
图6B是根据本发明又一实施例的电子部件的散热装置的拼装示意图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明的一部分实施例,而不是全部实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都应属于本发明保护的范围。
图1示出了根据本发明实施例的电子部件的散热装置100的平面示意图。如图1所示,散热装置100包括:设置在电子部件的散热表面上的贯流
风扇和多个第一翅片110。
相邻的第一翅片110a之间形成第一散热通道110b,多个第一翅片110a形成多个第一散热通道110b。贯流风扇120位于多个第一翅片110a的一端,并且贯流风扇120贯通多个第一散热通道110b。贯流风扇120吹出的风进入第一散热通道110b,从而有利于第一翅片110a散热。
本发明实施例中的电子部件可以是远端射频模块(Remote Radio Unit,简称RRU),还可以是其他电子部件。
电子部件的散热表面可以为电子部件的任一或多个表面,本发明实施例仅以图1所示散热装置100的散热表面为正前方表面为例进行说明。
在本发明实施例中,多个第一翅片110a可以设置在贯流风扇120的出风口侧,贯流风扇120的出风口的出风方向与多个第一散热通道110b的入风方向相同。贯流风扇120吹出的风能够直接进入多个第一散热通道110b中,风在流入第一散热通道过程中受到的阻力较小,使得贯流风扇120在送风过程中的工作阻力较小,从而能够提升散热装置的散热效率。
同时,由于贯流风扇120在整个叶轮长度上出风均匀,且贯流风扇120输出的风能够直接流入多个第二散热通道120中,能够均匀地向多个第二散热通道120送风,使得散热装置100的散热更加均匀。
本发明实施例无需设置专门的导风结构将贯流风扇120输出的风引导到散热通道120中,使得散热装置的结构更加简单。
贯流风扇120可以嵌入第一翅片110a中,无需占用额外的空间,这样能够使得电子部件的结构更加紧凑。其中,可以在第一翅片110a与贯流风扇120的叶轮之间设置一定的间隙,例如,在第一翅片110a与贯流风扇120的叶轮之间设置3~5mm的间隙。
贯流风扇120可以包括叶轮和第一电机,第一电机设置在该叶轮的一端,电机驱动叶轮旋转。
由于贯流风扇的电机设置在叶轮的一端,贯流风扇120与轴向垂直的截面的半径较小,将贯流风扇120嵌入在第一翅片110a中,能够降低第一翅片110a的高度,从而使得散热装置的尺寸更小。由于轴流风扇的叶轮和电机存在重叠区域,使得轴流风扇的高度为叶轮和电机的叠加高度,因此贯流风扇可以达到轴流风扇无法达到的更小尺寸,从而使得本发明实施例的散热装置100能够达到现有技术中采用轴流风扇的散热装置无法达到的更小尺
寸。因此,本发明实施例有利于电子产品的小型化设计。
贯流风扇120还可以设置在散热表面的顶端或者底端,如图1B和图1C所示,此时仅在贯流风扇130的出风口侧设置多个第一翅片110a。
当贯流风扇120设置在散热表面的中部时,散热装置还可以包括:多个第二翅片130a,相邻的第二翅片130a之间形成第二散热通道130b,多个第二翅片130a形成多个第二散热通道130b。贯流风扇120位于该多个第二翅片130a的一端,并且贯流风扇120贯通多个第二散热通道130b。风从外部流入第二散热通道130b,经过第二散热通道130b吹入的贯流风扇120。可以在第二翅片130a与贯流风扇120的叶轮之间设置一定的间隙,例如,在第二翅片130a与贯流风扇120的叶轮之间设置3~5mm的间隙。
应理解,本发明实施例仅以图1A所示第一散热翅片110a设置在贯流风扇120的上部,第二散热翅片130a设置在贯流风扇120的下部为例进行描述。此时,气流的流向为从下往上,散热装置100的散热效率较高。应理解,第一散热翅片110a也可以设置在贯流风扇120的下部,第二散热翅片130a设置在贯流风扇120的上部,如图1C所示。
在对贯流风扇进行维护时,可以从散热装置100的侧面或其他方向进行拆卸维护。当多个电子部件拼装时,可以从散热装置100的侧面拆卸维护贯流风扇,使得维护更加方便。
因此,本发明实施例的电子部件的散热装置,通过在电子部件的散热表面设置贯流风扇和多个翅片,贯流风扇设置在多个翅片的一端,贯流风扇吹出的风直接进入多个翅片形成的多个散热通道,使得风扇的工作阻力较小,进而能够提升散热效率。
在本发明实施例中,如图1中所示,第一翅片110a和第二翅片120a可以沿竖直方向设置,还可以如图2所示设置成具有一定弧度。另外,贯流风扇120可以是水平设置的,也可以是非水平设置的,使得贯流风扇的出风方向与第二散热通道的入风方向相同,且贯流风扇的入风方向与第一散热通道的出风方向相同即可,此时贯流风扇120在工作时受到散热通道的阻力最小,使得散热装置100能够达到较高的散热效率。
在本发明实施例中,贯流风扇120的进风和出风的角度可以设置为135°,此时贯流风扇120的进风和出风的角度接近于水平,该进风和出风的效果相当于轴流风机。应理解,本发明实施例中,贯流风扇120的进风和出风
的角度并不限于135°,贯流风扇120的进风和出风的角度还可以为其他角度。应注意,当贯流风扇120的进风和出风的角度为90°时,若贯流风扇的出风口正对第一翅片110a形成的第一散热通道的延伸方向,此时贯流风扇的进风口几乎垂直于该第二散热通道的方向。此时不利于将多个电子部件拼装在一起,这是由于拼装在前面的电子部件会将后面的电子部件的进风口挡住,进而影响后面的电子部件的散热。
在本发明实施例中,贯流风扇120可以采用磁悬浮轴承。应理解,贯流风扇120也可以采用机械轴承。采用磁悬浮轴承能够减少轴承的磨损,提升散热装置的可靠性。
在本发明实施例中,贯流风扇120还可以包括第二电机,该第二电机设置在叶轮的第二端。此时第一电机可以为主电机,第二电机可以为备用电机。这样形成电机的冗余配置,能够提高贯流风扇120的可靠性,从而提升电子部件的散热装置100整体的可靠性。
优选地,在本发明实施例中,贯流风扇的轴向长度还可以大于或等于多个第一翅片110a中最外侧的两个第一翅片110a之间的距离,以使贯流风扇120的吹出的风流向多个第一散热通道110b中每个第一散热通道。
此时,贯流风扇吹出的风能够覆盖电子部件的散热表面上的所有散热通道,提升散热装置的散热效率,且散热均匀。
可选地,当贯流风扇的另一侧设置多个第二翅片130b时,贯流风扇120的轴向长度还可以大于或等于多个第二翅片130a中最外侧的两个第二翅片130a之间的距离,以使多个第二散热通道130b中每个第二散热通道130b输出的风吹入到贯流风扇120。
可选地,在本发明实施例中,贯流风扇120可以包括沿贯流风扇120的轴向并行排列的多个子贯流风扇。本发明实施例仅以两个子贯流风扇为例进行说明,应理解,本发明实施例中贯流风扇120还可以包括两个以上的子贯流风扇。两个子贯流风扇可以是贯流风扇120中的两个独立运行的部分,其整体形态仍体现为一个完整的风扇组件。或者,该两个子贯流风扇也可以是两个独立的贯流风扇。左侧的子贯流风扇的电机设置在左侧,右侧的子贯流风扇的电机设置在右侧,能够实现左右两侧的子贯流风扇配合运转或独立运转。这样能够降低两侧电机的同步性要求、叶轮长轴比过大、叶轮扭转变形等问题。在维护时,可以将两个子贯流风扇分别从两侧插拔,使得本发明实
施例的电子部件的散热装置更加易于维护。
可选地,作为另一实施例,如图3所示,散热装置100还可以包括:顶部盖板140,设置在散热装置100的顶部,遮盖第一散热通道110b和第一翅片110a。本发明实施例的顶部盖板140能够防止雨水或杂物从散热装置100的顶部直接落入风扇的叶轮和电机处,造成贯流风扇的损坏。此时第一翅片110a(当进风部设置在贯流风扇的上部时为第二翅片130a)可以设置成与顶部盖板140保持一定的距离,或者如图3所示可以在第一翅片110的最上端与顶部盖板140之间的散热表面上设置导风结构,该导风结构能够将第一散热通道110b流出的风引导至该散热装置的左右两侧排出。该导风结构可以是针状翅片或片状翅片组成的。贯流风扇120输出的风从第一散热通道110b的上方流出时,受到导风结构的引导,风向发生改变,向左右两侧流动,通过左右两侧排出。
可选地,作为另一实施例,如图4A所示,顶部盖板140上还可以设置散热孔。此时,散热装置100还可以包括:导引结构150,导引结构150的导入端设置在顶部盖板140上的散热孔的下方,导引结构150的导出端设置在多个第一散热通道110b的外部,将从顶部盖板140上的散热孔进入的液体或杂物导出散热装置100。例如,该导引结构150能够将雨水或杂物引导至散热装置的左右两侧排出。本发明实施例能够在提高散热量的同时兼具防护功能。本发明实施例仅以图4A所示的导引结构150为百叶窗结构为例对进行说明,导引结构150还可以为其他形式的结构,本发明实施例对此并不限制。例如,从顶部盖板140落入的雨水落到图4A所示的百叶窗结构上,沿着百叶窗结构落到该百叶窗结构最下方的百叶窗帘上,该百叶窗帘上设置导雨槽,将雨水引导至散热装置的左右两侧排出。
如图4B所示,散热装置100还可以包括前盖板160,设置在顶部盖板140与贯流风扇120之间,及多个第一翅片110a和多个第一散热通道110b的外侧,多个第一翅片110a和多个第一散热通道110b位于电子部件的散热表面和前盖板160之间。前盖板160能够与多个第一翅片110a形成的多个第一散热通道110b构成风道,防止风从第一散热通道110b的外侧流出,使得贯流风扇120输出的风流经多个第一翅片110a和多个第一散热通道110b的整个表面,进一步提升散热效率。同时,本发明实施例还能够进一步防止雨水或杂物从顶部盖板140和贯流风扇120之间落入贯流风扇120的叶轮和
电机处。此时,图4A所示的实施例中的导引结构150的导出端可以设置成延展至前盖板160,同时在前盖板160上对应导引结构导出端的位置设置散热孔,使得落在导出端导出的雨水可以直接通过前盖板160上的散热孔排出。
可选地,作为另一实施例,如图5A所示,前盖板160上可以设置迷宫式散热孔161。风可以通过迷宫式散热孔161排出散热装置100,能够进一步提升散热装置的散热效率。同时迷宫式散热孔161还能阻止雨水进入散热装置100中。如图5A所示,顶部盖板140和前盖板160可以设置为一个整体,应理解,顶部盖板140和前盖板160还可以如图4B所示设置为两个独立的盖板。
在本发明实施例中,图5B所示为前盖板160上的迷宫式散热孔的示意性结构图。迷宫式散热孔161可以由前盖板160、挡板162a和挡板162b两部分。挡板162a设置在与迷宫式散热孔161正对的位置,挡板162b将挡板162a和迷宫式散热孔161的下沿连接起来。挡板162b可以设置成具有一定的倾斜度,以便落在挡板162b上的雨水在重力作用下流出前盖板160。图5C所示为一种实施例的前盖板160的侧面示意图,挡板162b可以直接与迷宫式散热孔161的下沿连接为一个整体。图5D所示为另一实施例的前盖板160的侧面示意图,挡板162b和挡板162c连接,挡板162c可以通过标准安装件与前盖板160固定。图5E为图5D所示实施例的迷宫式散热孔161的正面示意图。本发明实施例的电子部件的散热装置100在防止外部的雨水或杂物从顶部和正面进入贯流风扇中的前提下,能够进一步增加出风量,提升散热效率,同时保证电子部件的散热装置的可靠性。
可选地,如图3、图4A、图4B、图5A和图5E所示,在本发明实施例中,散热装置100还可以包括侧挡板170,设置在散热装置100的两侧,侧挡板170上设置散热孔171。图中仅以设置在对应出风口的位置的散热孔为例,应理解,挡板170上还可以在其他位置设置散热孔。本发明实施例能够加强散热装置的防护能力,从而增强电子部件的散热装置100的可靠性。
如图6A所示,还可以在电子部件的对应散热表面的背面上设置风道,例如,风道可以由片状翅片或针状翅片组成。电子部件的背面可以是散热表面也可以不是散热表面。本发明实施例仅以图6A示出的针状翅片形成的风道设置在背面的上部为例进行说明,应理解,风道还可以设置在背面的中部或者下部。如图6A所示,还可以在侧挡板170上对应背面的风道的位置设
置散热孔172。当根据本发明实施例的多个电子部件拼装时,如图6B所示,右侧的电子部件通过前盖板160排出的热气流能够通过左侧电子部件背面的针状翅片形成的风道以及侧挡板上的散热孔172排出。本发明实施例能够降低贯流风扇工作阻力,提升多电子部件拼装的整体的散热能力。
另外,顶部盖板140、前盖板160和侧挡板170均可以采用导热材料,这样能够有助于散发热量。
因此,本发明实施例的电子部件的散热装置,通过在电子部件的散热表面设置贯流风扇和多个翅片,贯流风扇设置在多个翅片的一端,贯流风扇吹出的风直接进入多个翅片形成的多个散热通道,使得风扇的工作阻力较小,进而能够提升散热效率。
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。
所属领域的技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的***、装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。
在本申请所提供的几个实施例中,应该理解到,所揭露的***、装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个***,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一
个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器,或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(Read-Only Memory,ROM)、随机存取存储器(Random Access Memory,RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。
Claims (10)
- 一种电子部件的散热装置,其特征在于,所述散热装置包括:设置在所述电子部件的散热表面上的贯流风扇和多个第一翅片,相邻的所述第一翅片之间形成第一散热通道,所述多个第一翅片形成多个所述第一散热通道;所述贯流风扇位于所述多个第一翅片的一端,并且所述贯流风扇贯通所述多个第一散热通道;所述贯流风扇吹出的风进入所述第一散热通道,从而有利于所述多个第一翅片散热。
- 根据权利要求1所述的散热装置,其特征在于,还包括:多个第二翅片,相邻的所述第二翅片之间形成第二散热通道,所述多个第二翅片形成多个所述第二散热通道;所述贯流风扇位于所述多个第二翅片的一端,并且所述贯流风扇贯通所述多个第二散热通道;风从外部进入所述第二散热通道,经过所述第二散热通道吹入到所述贯流风扇。
- 根据权利要求2所述的散热装置,其特征在于,所述贯流风扇的轴向长度大于或等于所述多个第二翅片中最外侧的两个第二翅片之间的距离,以使所述多个第二散热通道中每个第二散热通道输出的风吹入到所述贯流风扇。
- 根据权利要求1至3中任一项所述的散热装置,其特征在于,所述贯流风扇的轴向长度大于或等于所述多个第一翅片中最外侧的两个第一翅片之间的距离,以使所述贯流风扇吹出的风进入所述多个第一散热通道中的每个第一散热通道。
- 根据权利要求1至4中任一项所述的散热装置,其特征在于,所述贯流风扇包括沿所述贯流风扇的轴向并行排列的多个子贯流风扇。
- 根据权利要求1至5中任一项所述的散热装置,其特征在于,所述多个第一翅片设置在所述贯流风扇的上部,所述多个第二翅片设置在所述贯流风扇的下部,所述散热装置还包括:顶部盖板,设置在所述散热装置的顶部,遮盖所述多个第一翅片和所述多个第一散热通道。
- 根据权利要求6所述的散热装置,其特征在于,所述顶部盖板上设 置有散热孔,所述散热装置还包括:导引结构,所述导引结构的导入端设置在所述顶部盖板上的散热孔的下方,所述导引结构的导出端设置在所述多个第一散热通道的外部,将从所述顶部盖板上的散热孔进入的液体或杂物导出所述散热装置。
- 根据权利要求6或7所述的散热装置,其特征在于,还包括:前盖板,设置在所述顶部盖板与所述贯流风扇之间,及所述多个第一翅片和所述多个第一散热通道的外侧,所述多个第一翅片和所述多个第一散热通道位于所述电子部件的散热表面和所述前盖板之间,所述前盖板上设置迷宫式散热孔。
- 根据权利要求1至8中任一项所述的散热装置,其特征在于,还包括:侧挡板,设置在所述散热装置的两侧,所述侧挡板上设置散热孔。
- 一种基站,包括如权1至9中任一项所述的散热装置、射频拉远单元RRU和天线,所述散热装置设置在所述RRU的散热表面上;所述RRU用于将基带光信号转化成射频信号,对所述射频信号进行放大处理,以及将经过放大处理的所述射频信号传输给所述天线,以通过所述天线发送出去。
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CN113115128A (zh) * | 2021-03-26 | 2021-07-13 | 宋凯 | 一种交换机用安全防护装置 |
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CN114584856A (zh) * | 2022-05-05 | 2022-06-03 | 中兴通讯股份有限公司 | 散热装置、基站设备 |
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CN115884553A (zh) * | 2023-02-17 | 2023-03-31 | 江苏天一航空工业股份有限公司 | 一种用于民航机场车路协同的无线通讯终端 |
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