WO2016021818A1 - 파워 인덕터 - Google Patents
파워 인덕터 Download PDFInfo
- Publication number
- WO2016021818A1 WO2016021818A1 PCT/KR2015/005454 KR2015005454W WO2016021818A1 WO 2016021818 A1 WO2016021818 A1 WO 2016021818A1 KR 2015005454 W KR2015005454 W KR 2015005454W WO 2016021818 A1 WO2016021818 A1 WO 2016021818A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power inductor
- magnetic
- substrate
- coil patterns
- metal powder
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 229920000052 poly(p-xylylene) Polymers 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims description 98
- 239000002184 metal Substances 0.000 claims description 98
- 239000000843 powder Substances 0.000 claims description 81
- 239000011231 conductive filler Substances 0.000 claims description 39
- 239000000696 magnetic material Substances 0.000 claims description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 33
- 229920000642 polymer Polymers 0.000 claims description 32
- 230000035699 permeability Effects 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 8
- 239000003575 carbonaceous material Substances 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 239000006247 magnetic powder Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- -1 iron-aluminum-chromium Chemical compound 0.000 description 4
- 230000005415 magnetization Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- JSPBDYKPSGHCQF-UHFFFAOYSA-N [Cu]=O.[Zn].[Ni] Chemical compound [Cu]=O.[Zn].[Ni] JSPBDYKPSGHCQF-UHFFFAOYSA-N 0.000 description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910000480 nickel oxide Inorganic materials 0.000 description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000006200 vaporizer Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
Definitions
- the present invention relates to a power inductor, and more particularly, to a power inductor having excellent inductance characteristics and improved insulation characteristics and thermal stability.
- Power inductors are mainly provided in power supply circuits such as DC-DC converters in portable devices. Such power inductors are increasingly being used in place of the conventional coiled choke coils due to the high frequency and miniaturization of power circuits. In addition, power inductors are being developed in the direction of miniaturization, high current, and low resistance according to the size reduction and multifunction of portable devices.
- the power inductor may be manufactured in the form of a laminate in which ceramic sheets made of a plurality of ferrites or low dielectric constant dielectrics are stacked.
- a metal pattern is formed on the ceramic sheet in the form of a coil pattern, and the coil pattern formed on each ceramic sheet is connected by conductive vias formed in each ceramic sheet, and overlaps along the vertical direction in which the sheets are stacked. Can be achieved.
- the body constituting such a power inductor is conventionally manufactured using a magnetic material composed of quaternary systems of nickel (Ni) -zinc (Zn) -copper (Cu) -iron (Fe).
- the magnetic material may not implement the high current characteristic required by recent portable devices because the saturation magnetization value is lower than that of the metal material. Therefore, by manufacturing the body constituting the power inductor using metal powder, the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- eddy current loss and hysteresis loss at high frequencies may increase, resulting in a serious loss of material.
- a structure insulating a polymer between metal powders is applied.
- a power inductor manufactured using a metal powder and a polymer has a problem in that inductance is lowered as the temperature increases. That is, the temperature of the power inductor increases due to the heat generation of the portable device to which the power inductor is applied, and as a result, the inductance decreases while the metal powder forming the body of the power inductor is heated.
- the power inductor may be in contact with the coil pattern and the metal powder inside the body, to prevent the coil pattern and the body to be insulated.
- the present invention provides a power inductor capable of improving the stability to temperature by dissipating heat in the body and thus preventing a decrease in inductance.
- the present invention provides a power inductor capable of improving the insulation between the coil pattern and the body.
- the present invention provides a power inductor capable of improving capacity and permeability.
- a power inductor includes a body; At least one substrate provided in the body; At least one coil pattern provided on at least one surface of the substrate; And an insulation layer formed between the coil pattern and the body, wherein the insulation layer is formed of parylene.
- the body comprises a metal powder, a polymer and a thermally conductive filler.
- the metal powder includes a metal alloy powder including iron.
- the metal powder is coated on the surface with at least one of a magnetic body and an insulator.
- the insulator is coated with parylene having a thickness of 1 ⁇ m to 10 ⁇ m.
- the thermally conductive filler includes one or more selected from the group consisting of MgO, AlN, carbon-based materials.
- the thermally conductive filler is included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder, and has a size of 0.5 ⁇ m to 100 ⁇ m.
- the substrate is formed of a copper clad lamination, or a copper foil is bonded on both sides of a metal plate containing iron.
- the insulating layer is coated with a uniform thickness on the coil pattern by vaporizing the parylene.
- the insulating layer is formed to a thickness of 3 ⁇ m 100 ⁇ m.
- At least two substrates are provided, and the coil pattern is formed on each of the at least two substrates.
- connection electrode for connecting the at least two coil patterns.
- At least two external electrodes connected to the at least two coil patterns, respectively, are formed outside the body.
- the plurality of external electrodes are formed spaced apart from each other on the same side of the body, or formed on different sides of the body.
- a magnetic layer is provided on at least one region of the body and has a magnetic permeability higher than that of the body.
- the magnetic layer is formed including a thermally conductive filler.
- the body is manufactured using a metal powder, a polymer, and a thermally conductive filler.
- the thermally conductive filler may be included to release the heat of the body well to the outside, thereby preventing the reduction of the inductance due to the heating of the body.
- the pyrene may be formed to have a uniform thickness on the coil pattern, thereby improving insulation between the body and the coil pattern.
- the magnetic permeability of the power inductor may be prevented by fabricating a substrate having a coil pattern formed inside the body as a magnetic metal, and the magnetic permeability of the power inductor may be improved by providing at least one magnetic layer on the body.
- At least two or more substrates each having a coil-shaped coil pattern formed on at least one surface thereof may be provided in the body to form a plurality of coils in one body, thereby increasing the capacity of the power inductor.
- FIG. 1 is a perspective view of a power inductor according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
- 3 to 5 are cross-sectional views of a power inductor according to second embodiments of the present invention.
- FIG. 6 is a perspective view of a power inductor according to a third embodiment of the present invention.
- 7 and 8 are cross-sectional views taken along the line A-A 'and line B-B' of FIG.
- FIG. 9 is a perspective view of a power inductor according to a fourth embodiment of the present invention.
- 10 and 11 are cross-sectional views taken along the line A-A 'and line B-B' of FIG. 9;
- FIG. 12 is a perspective view of a power inductor according to a modification of the fourth embodiment of the present invention.
- 13 to 15 are cross-sectional views sequentially illustrating a method of manufacturing a power inductor according to an embodiment of the present invention.
- 16 and 17 are cross-sectional images of a power inductor according to a comparative example and an embodiment.
- FIG. 1 is a perspective view of a power inductor according to a first exemplary embodiment of the present invention
- FIG. 2 is a cross-sectional view of the power inductor taken along line AA ′ of FIG. 1.
- a power inductor may include a body 100 including a thermally conductive filler 130, a substrate 200 provided inside the body 100, and a substrate.
- Coil patterns 310, 320; 300 formed on at least one surface of the 200, and external electrodes 410, 420; 400 provided outside the body 100 may be included.
- the insulating layer 500 may be further formed on the coil patterns 310 and 320.
- the body 100 may be, for example, a hexahedral shape. However, the body 100 may have a shape of a polyhedron other than a hexahedron.
- the body 100 may include a metal powder 110, a polymer 120, and a thermally conductive filler 130.
- the metal powder 110 may have an average particle diameter of 1 ⁇ m to 50 ⁇ m.
- the metal powder 110 may use a single particle or two or more kinds of particles of the same size, or may use a single particle or two or more kinds of particles having a plurality of sizes. For example, the first metal particles having an average size of 30 ⁇ m and the second metal particles having an average size of 3 ⁇ m may be mixed and used.
- the filling rate of the body 100 may be increased to maximize the capacity. For example, when a metal powder of 30 ⁇ m is used, voids may occur between the metal powder of 30 ⁇ m, and thus the filling rate may be lowered. However, the filling rate can be increased by mixing a smaller 3 ⁇ m metal powder between the 30 ⁇ m metal powder.
- the metal powder 110 may use a metal material including iron (Fe), for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-Al-Cr). That is, the metal powder 110 may be formed of a metal alloy having magnetic structure or magnetic properties including iron, and may have a predetermined permeability. In addition, the surface of the metal powder 110 may be coated with a magnetic material, and the metal powder 110 may be coated with a material having a different permeability.
- Fe iron
- Fe-Ni iron-nickel
- Fe-Si-Si iron-nickel-silicon
- Fe-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-
- the magnetic body may be formed of a metal oxide magnetic material, and may be formed of a nickel oxide magnetic material, a zinc oxide magnetic material, a copper oxide magnetic material, a manganese oxide magnetic material, a cobalt oxide magnetic material, a barium oxide magnetic material, and a nickel-zinc-copper oxide magnetic material.
- One or more oxide magnetic materials selected may be used. That is, the magnetic body coated on the surface of the metal powder 110 may be formed of a metal oxide containing iron, it is preferable to have a higher permeability than the metal powder (110). On the other hand, since the metal powder 110 is magnetic, when the metal powder 110 contacts each other, insulation may be destroyed and a short may be generated.
- the metal powder 110 may be coated with at least one insulator on its surface.
- the metal powder 110 may be coated with an oxide on a surface thereof, or may be coated with an insulating polymer material such as parylene, which is preferably coated with parylene.
- Parylene may be coated with a thickness of 1 ⁇ m to 10 ⁇ m. In this case, when the parylene is formed to a thickness of less than 1 ⁇ m, the insulation effect of the metal powder 110 may be reduced. The distribution of the metal powder 110 in the interior may be reduced, so that the permeability may be lowered.
- the surface of the metal powder 110 may be coated using various insulating polymer materials in addition to parylene.
- the oxide coating the metal powder 110 may be formed by oxidizing the metal powder 110, TiO 2 , SiO 2 , ZrO 2 , SnO 2 , NiO, ZnO, CuO, CoO, MnO, MgO, Al
- One selected from 2 O 3 , Cr 2 O 3 , Fe 2 O 3 , B 2 O 3 and Bi 2 O 3 may be coated.
- the metal powder 110 may be coated with an oxide having a dual structure, and may be coated with a dual structure of an oxide and a polymer material.
- the metal powder 110 may be coated with an insulator after the surface is coated with a magnetic material.
- the surface of the metal powder 110 is coated with an insulator, it is possible to prevent a short due to contact between the metal powder 110.
- the metal powder 110 may be coated with an oxide, an insulating polymer material, or the like, or may be coated with a thickness of 1 ⁇ m to 10 ⁇ m even when the magnetic material and the insulator are double coated.
- the polymer 120 may be mixed with the metal powder 110 to insulate between the metal powders 110. That is, the metal powder 110 may have a problem in that the loss of materials is increased due to high eddy current loss and hysteresis loss at a high frequency. 120).
- the polymer 120 may include one or more polymers selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer (LCP), but is not limited thereto.
- the polymer 120 may be formed of a thermosetting resin to provide insulation between the metal powders 110.
- thermosetting resins include Novolac Epoxy Resin, Phenoxy Type Epoxy Resin, BPA Type Epoxy Resin and BPF Type Epoxy Resin.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder.
- the content of the polymer 120 is increased, the volume fraction of the metal powder 110 is lowered, so that the effect of increasing the saturation magnetization value is not properly implemented, and the magnetic properties of the body 100, that is, the permeability may be reduced.
- the content of the polymer 120 decreases, a strong acid or strong base solution used in the manufacturing process of the inductor may penetrate into the inside, thereby reducing the inductance characteristic. Therefore, the polymer 120 may be included in a range not to lower the saturation magnetization value and inductance of the metal powder 110.
- the thermally conductive filler 130 is included to solve the problem that the body 100 is heated by external heat. That is, the metal powder 110 of the body 100 may be heated by external heat, and the heat conductive filler 130 may be included to release heat of the metal powder 110 to the outside.
- the thermally conductive filler 130 may include one or more selected from the group consisting of MgO, AlN, and carbon-based materials, but is not limited thereto.
- the carbon-based material may include carbon and have various shapes, for example, graphite, carbon black, graphene, graphite, or the like.
- the thermally conductive filler 130 may be included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110.
- the thermally conductive filler 130 may have, for example, a size of 0.5 ⁇ m to 100 ⁇ m. That is, the thermally conductive filler 130 may have a size larger or smaller than the metal powder 110.
- the body 100 may be manufactured by stacking a plurality of sheets made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130. Here, when the body 100 is manufactured by stacking a plurality of sheets, the content of the thermally conductive filler 130 of each sheet may be different.
- the content of the thermally conductive filler 130 in the sheet may increase as it moves toward the upper side and the lower side with respect to the substrate 200.
- the body 100 is formed by printing a paste made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 to a predetermined thickness, or by pressing such paste into a mold and pressing the paste. If necessary, various methods may be applied and formed. In this case, the number of sheets laminated to form the body 100 or the thickness of the paste printed with a predetermined thickness may be determined to an appropriate number or thickness in consideration of electrical characteristics such as inductance required by the power inductor.
- the substrate 200 may be provided inside the body 100. At least one substrate 200 may be provided. For example, the substrate 200 may be provided along the long axis direction of the body 100 inside the body 100. Here, the substrate 200 may be provided in one or more, for example, two substrates 200 may be spaced apart by a predetermined interval in a direction orthogonal to the direction in which the external electrode 400 is formed, for example, in a vertical direction. Can be.
- the substrate 200 may be made of, for example, copper clad lamination (CCL) or a magnetic metal. In this case, the substrate 200 may be made of a magnetic metal to increase permeability and facilitate capacity implementation. That is, CCL is produced by bonding a copper foil to glass-reinforced fibers.
- the CCL does not have a permeability
- the permeability of the power inductor can be reduced.
- the magnetic metal is used as the substrate 200, the magnetic magnetic material has a magnetic permeability, so that the magnetic permeability of the power inductor is not lowered.
- Substrate 200 using such a magnetic metal material is a metal containing iron, for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum-silicon (Fe-Al -Si) and iron-aluminum-chromium (Fe-Al-Cr) can be produced by bonding a copper foil to a plate of a predetermined thickness consisting of at least one metal selected from the group consisting of. That is, the substrate 200 may be manufactured by manufacturing an alloy made of at least one metal including iron into a plate shape having a predetermined thickness, and bonding a copper foil to at least one surface of the metal plate.
- iron-Ni iron-nickel
- Fe-Ni-Si iron-nickel-silicon
- Fe-Al -Si iron-aluminum-silicon
- Fe-Al-Cr iron-aluminum-chromium
- At least one conductive via may be formed in a predetermined region of the substrate 200, and the coil patterns 310 and 320 formed at the upper side and the lower side of the substrate 200 by the conductive via may be electrically connected. Can be connected.
- the conductive via may be formed by forming a via (not shown) that penetrates the substrate 200 along the thickness direction, and then fills the via with a conductive paste.
- the coil patterns 310, 320; 300 may be formed on at least one surface of the substrate 200, preferably on both surfaces thereof.
- the coil patterns 310 and 320 may be formed in a spiral shape in a predetermined area of the substrate 200, for example, from the center portion to an outward direction, and two coil patterns 310 and 320 formed on the substrate 200 are connected to each other.
- the upper coil pattern 310 and the lower coil pattern 320 may be formed in the same shape.
- the coil patterns 310 and 320 may be formed to overlap each other, or the coil patterns 320 may be formed to overlap the region where the coil patterns 310 are not formed.
- the coil patterns 310 and 320 may be electrically connected by conductive vias formed in the substrate 200.
- the coil patterns 310 and 320 may be formed by, for example, thick film printing, coating, deposition, plating, and sputtering.
- the coil patterns 310 and 320 and the conductive via may be formed of a material including at least one of silver (Ag), copper (Cu), and a copper alloy, but is not limited thereto.
- a plating process for example, a metal layer, for example, a copper layer may be formed on the substrate 200 by a plating process, and patterned by a lithography process. That is, the coil patterns 310 and 320 may be formed by forming and patterning a copper layer by using a copper foil formed on the surface of the substrate 200 as a seed layer.
- the coil patterns 310 and 320 may be formed in multiple layers. That is, a plurality of coil patterns may be further formed above the coil pattern 310 formed above the substrate 200, and a plurality of coil patterns may be formed below the coil pattern 320 formed below the substrate 200. It may be further formed.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the external electrodes 410, 420; 400 may be formed at both ends of the body 100.
- the external electrodes 400 may be formed on two side surfaces facing each other in the long axis direction of the body 100.
- the external electrode 400 may be electrically connected to the coil patterns 310 and 320 of the body 100. That is, at least one end of the coil patterns 310 and 320 may be exposed to the outside of the body 100 and the external electrode 400 may be connected to the ends of the coil patterns 310 and 320.
- the external electrode 400 may be formed on both ends of the body 100 by various methods such as immersing the body 100 in the conductive paste, or printing, deposition and sputtering.
- the external electrode 400 may be formed of a metal having electrical conductivity.
- the external electrode 400 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof.
- the external electrode 400 may further include a nickel-plated layer (not shown) or tin plating layer (not shown) on its surface.
- the insulating layer 500 may be formed between the coil patterns 310 and 320 and the body 100 to insulate the coil patterns 310 and 320 and the metal powder 110. That is, the insulating layer 500 may be formed on the upper and lower portions of the substrate 200 to cover the coil patterns 310 and 320.
- the insulating layer 500 may be formed by coating parylene on the coil patterns 310 and 320. example For example, after preparing the substrate 200 having the coil patterns 310 and 320 in the deposition chamber, parylene may be deposited on the coil patterns 310 and 320 by vaporizing parylene and supplying it into the vacuum chamber.
- parylene is first heated in a vaporizer and vaporized to make a dimer state as shown in [Formula 1], and then thermally decomposed in a monomer state as shown in [Formula 2].
- the parylene is cooled using a cold trap and a mechanical vacuum pump connected to the deposition chamber, the parylene is converted into a polymer state in the monomer state as shown in [Formula 3].
- the insulating layer 500 may be formed of one or more materials selected from insulating polymers other than parylene, for example, epoxy, polyimide, and liquid crystal crystalline polymer.
- the insulating layer 500 may be formed to have a uniform thickness on the coil patterns 310 and 320, and the insulating property may be improved compared to other materials even when the thin layer is formed to a thin thickness. That is, in the case of coating the parylene as the insulating layer 500, the insulating property may be improved by increasing the dielectric breakdown voltage while forming a thinner thickness than in the case of forming the polyimide.
- the gap between the patterns of the coil patterns 310 and 320 may be buried between the patterns to have a uniform thickness or may be formed to have a uniform thickness along the step difference of the pattern.
- the insulating layer 500 may be formed to have a thickness of 3 ⁇ m to 100 ⁇ m using parylene. If the parylene is formed to a thickness of less than 3 ⁇ m may reduce the insulating properties, when formed to a thickness of more than 100 ⁇ m thickness of the insulating layer 500 within the same size increases the volume of the body 100 And the permeability can be lowered accordingly.
- the insulating layer 500 may be formed on the coil patterns 310 and 320 after being made of a sheet having a predetermined thickness.
- the insulation layer 500 is thinned by forming the insulation layer 500 using parylene between the coil patterns 310 and 320 and the body 100. It is possible to improve the insulating properties while forming.
- the body 100 including the metal powder 110 and the polymer 120, as well as the thermally conductive filler 130 the heat of the body 100 by the heating of the metal powder 110 can be released to the outside. It is possible to prevent the temperature rise of the body 100, thereby preventing problems such as inductance lowering.
- by reducing the magnetic permeability of the power inductor by forming the substrate 200 inside the body 100 using a magnetic metal material.
- FIG 3 is a cross-sectional view of a power inductor according to a second embodiment of the present invention.
- the power inductor according to the second embodiment of the present invention includes a body 100 including a thermally conductive filler 130, a substrate 200 provided inside the body 100, and a substrate 200.
- Coil patterns 310 and 320 formed on at least one surface of the body, external electrodes 410 and 420 provided outside the body 100, insulating layers 500 provided on the coil patterns 310 and 320, and the body, respectively.
- It may include at least one magnetic layer 600 (610, 620) provided on the upper and lower portions of the (100), respectively. That is, the magnetic layer 600 is further provided in an embodiment of the present invention, so that another embodiment of the present invention can be implemented.
- the second embodiment of the present invention will be described with reference to a configuration different from the first embodiment of the present invention.
- the magnetic layers 600 may be provided in at least one region of the body 100. That is, the first magnetic layer 610 may be formed on the upper surface of the body 100, and the second magnetic layer 620 may be formed on the lower surface of the body 100.
- the first and second magnetic layers 610 and 620 are provided to increase the magnetic permeability of the body 100, and may be made of a material having a higher magnetic permeability than the body 100.
- the permeability of the body 100 is 20 and the first and second magnetic layers 610 and 620 may be provided to have permeability of 40 to 1000.
- the first and second magnetic layers 610 and 620 may be manufactured using, for example, magnetic powder and a polymer.
- the first and second magnetic layers 610 and 620 may be formed of a material having a higher magnetic force than the magnetic body of the body 100 or have a higher content of the magnetic body so as to have a higher magnetic permeability than the body 100.
- the polymer may be added at 15 wt% with respect to 100 wt% of the metal powder.
- the magnetic powder is nickel magnetic (Ni Ferrite), zinc magnetic (Zn Ferrite), copper magnetic (Cu Ferrite), manganese magnetic (Mn Ferrite), cobalt magnetic (Co Ferrite), barium magnetic (Ba Ferrite) and nickel-zinc
- Ni Ferrite nickel magnetic
- Zn Ferrite zinc magnetic
- Cu Ferrite copper magnetic
- Mn Ferrite manganese magnetic
- Co Ferrite cobalt magnetic
- nickel-zinc nickel-zinc
- One or more or one or more oxide magnetic materials thereof selected from the group consisting of -Ni-Zn-Cu Ferrite can be used.
- the magnetic layer 600 may be formed using metal alloy powder containing iron or metal alloy oxide containing iron.
- the magnetic powder may be coated on the metal alloy powder to form the magnetic powder.
- one or more oxide magnetic materials selected from the group consisting of nickel oxide magnetic materials, zinc oxide magnetic materials, copper oxide magnetic materials, manganese oxide magnetic materials, cobalt oxide magnetic materials, barium oxide magnetic materials, and nickel-zinc-copper oxide magnetic materials, for example, iron It may be coated on the metal alloy powder to form a magnetic powder. That is, the magnetic oxide powder may be formed by coating the metal oxide including iron on the metal alloy powder.
- the first and second magnetic layers 610 and 620 may be manufactured in the form of a sheet, and may be provided on the upper and lower portions of the body 100 in which a plurality of sheets are stacked.
- the body 100 after forming a body 100 for printing a paste made of a material including the metal powder 110, the polymer 120 and the thermally conductive filler 130 to a predetermined thickness or by inserting the paste into a mold to press the body 100
- Magnetic layers 610 and 620 may be formed on the upper and lower portions, respectively.
- the magnetic layers 610 and 620 may be formed using a paste, and the magnetic layers 610 and 620 may be formed by applying a magnetic material to the upper and lower portions of the body 100.
- third and fourth magnetic layers 630 and 640 are further provided between the body 100 and the substrate 200.
- fifth and sixth magnetic layers 650 and 660 may be further provided therebetween. That is, at least one magnetic layer 600 may be provided in the body 100.
- the magnetic layer 600 may be manufactured in the form of a sheet and may be provided between the bodies 100 in which a plurality of sheets are stacked. That is, at least one magnetic layer 600 may be provided between the sheets for manufacturing the body 100.
- a magnetic layer may be formed during printing.
- the magnetic layer can be pressed in between.
- the magnetic layer 600 may be formed using a paste.
- a soft magnetic material may be applied to form the magnetic layer 600 in the body 100.
- the magnetic inductance of the power inductor may be improved by providing at least one magnetic layer 600 in the body 100.
- FIG. 6 is a perspective view of a power inductor according to a third exemplary embodiment of the present invention
- FIG. 7 is a cross-sectional view of the power inductor taken along the AA ′ line of FIG. 6
- FIG. 8 is a cut along the BB ′ line of FIG. 6. It is a cross section of.
- a power inductor may include a body 100, at least two substrates 210, 220, and 200 provided in the body 100, and at least two or more substrates.
- It may include a connection electrode 700 connected to the.
- At least two substrates 210, 220, and 200 may be provided inside the body 100.
- the at least two substrates 200 may be provided along the major axis direction of the body 100 inside the body 100 and spaced apart at a predetermined interval in the thickness direction of the body 100.
- the coil patterns 310, 320, 330, 340; 300 may be formed on at least one side of each of the at least two substrates 200, preferably on both sides.
- the coil patterns 310 and 320 may be formed on the lower and upper portions of the first substrate 210, respectively, and may be electrically connected to each other by conductive vias formed in the first substrate 210.
- the coil patterns 330 and 340 may be formed on the lower and upper portions of the second substrate 220 and electrically connected to each other by conductive vias formed on the second substrate 220.
- the plurality of coil patterns 300 may be formed in a spiral shape in a predetermined region of the substrate 200, for example, from the center portion to an outward direction, and two coil patterns formed on the substrate 200 may be connected to each other to form one coil. Can be achieved. That is, two or more coils may be formed in one body 100.
- the coil patterns 310 and 330 on the upper side of the substrate 200 and the coil patterns 320 and 340 on the lower side may be formed in the same shape.
- the plurality of coil patterns 300 may be formed to overlap each other, or the lower coil patterns 320 and 340 may be formed to overlap the region where the upper coil patterns 310 and 330 are not formed.
- the external electrodes 410, 420; 400 may be formed at both ends of the body 100.
- the external electrodes 400 may be formed on two side surfaces facing each other in the long axis direction of the body 100.
- the external electrode 400 may be electrically connected to the coil pattern 300 of the body 100. That is, at least one end of the plurality of coil patterns 300 may be exposed to the outside of the body 100 and the external electrode 400 may be connected to the ends of the plurality of coil patterns 300.
- the coil pattern 310 may be formed to be connected to the coil patterns 310 and 330
- the coil pattern 320 may be formed to be connected to the coil patterns 320 and 340.
- the connection electrode 700 may be formed on at least one side of the body 100 in which the external electrode 400 is not formed.
- the connection electrode 700 connects at least one of the coil patterns 310 and 320 formed on the first substrate 210 and at least one of the coil patterns 330 and 340 formed on the second substrate 220. Is prepared to. Therefore, the coil patterns 310 and 320 formed on the first substrate 210 and the coil patterns 330 and 340 formed on the second substrate 220 are electrically connected by the connection electrode 700 outside the body 100. Can be connected to each other.
- the connection electrode 700 may be formed on one side of the body 100 through various methods such as immersing the body 100 in the conductive paste, or printing, deposition and sputtering.
- connection electrode 700 is a metal capable of imparting electrical conductivity, and may include, for example, one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. In this case, a nickel-plating layer (not shown) or tin plating layer (not shown) may be further formed on the surface of the connection electrode 700 if necessary.
- At least two or more substrates 200 each having a coil pattern 300 formed on at least one surface thereof are provided in the body 100, so that the power inductor is in one body 100. It is possible to form a plurality of coils, thereby increasing the capacity of the power inductor.
- FIG. 9 is a perspective view of a power inductor according to a fourth exemplary embodiment of the present invention
- FIGS. 10 and 11 are cross-sectional views taken along the lines A-A 'and B-B' of FIG. 9.
- a power inductor may include a body 100, at least two substrates 210, 220; 200 provided inside the body 100, and at least two or more substrates.
- Coil patterns 310, 320, 330, 340; 300 formed on at least one surface of each of the substrates 200, and two side surfaces of the body 100 facing each other and connected to the coil patterns 310, 320, respectively.
- the second external electrodes 810, 820; 800, and the second external electrodes 810, 820 are provided on two opposite sides of the body 100, and are connected to the coil patterns 330, 340, respectively.
- External electrodes 910, 920; 900 may be included. That is, two or more power inductors are implemented in one body 100 by connecting coil patterns 300 formed on at least two substrates 200 to each other by different first and second external electrodes 800 and 900. do.
- the first external electrodes 810, 820; 800 may be formed at both ends of the body 100.
- the first external electrodes 810 and 820 may be formed on two side surfaces facing each other in the long axis direction of the body 100.
- the first external electrodes 810 and 820 may be electrically connected to the coil patterns 310 and 320 formed on the first substrate 210. That is, at least one end of the coil patterns 310 and 320 is exposed to the outside of the body 100 in a direction opposite to each other, and the first external electrodes 810 and 820 are connected to the ends of the coil patterns 310 and 320. Can be formed.
- the first external electrodes 810 and 820 may be formed by immersing the body 100 in a conductive paste, or by patterning and forming both ends of the body 100 through various methods such as printing, deposition, and sputtering.
- the first external electrodes 810 and 820 may be formed of a metal having electrical conductivity, for example, at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be formed.
- the first external electrodes 810 and 820 may further have a nickel-plated layer (not shown) or tin plating layer (not shown) on the surface thereof.
- the second external electrodes 910, 920 and 900 may be formed at both ends of the body 100 and spaced apart from the first external electrodes 810 and 820. That is, the first external electrodes 810 and 820 and the second external electrodes 910 and 920 may be formed on the same side of the body 100, and they are formed spaced apart from each other.
- the second external electrodes 910 and 920 may be electrically connected to the coil patterns 330 and 340 formed on the second substrate 220. That is, at least one end of the coil patterns 330 and 340 is exposed to the outside of the body 100 in a direction facing each other and the second external electrodes 910 and 920 are connected to the ends of the coil patterns 330 and 340. Can be formed.
- the coil patterns 330 and 340 may be exposed in the same direction as the coil patterns 310 and 320, but may be connected to the first and second external electrodes 800 and 900 by being exposed at a predetermined interval without being overlapped with each other.
- the second external electrodes 910 and 920 may be simultaneously formed in the same process as the first external electrodes 810 and 810. That is, the second external electrodes 910 and 920 may be formed by immersing the body 100 in a conductive paste, or by patterning and forming both ends of the body 100 through various methods such as printing, deposition, and sputtering. .
- the second external electrodes 910 and 920 may be formed of a metal having electrical conductivity, for example, at least one metal selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be formed. Meanwhile, the second external electrodes 910 and 920 may further have a nickel-plated layer (not shown) or tin plating layer (not shown) on the surface thereof.
- first external electrodes 810 and 820 and the second external electrodes 910 and 920 are formed in different directions. That is, the first external electrodes 810 and 820 and the second external electrodes 910 and 920 may be formed on side surfaces that are perpendicular to each other of the body 100.
- the first external electrodes 810 and 820 may be formed on two side surfaces facing each other in the major axis direction of the body 100, and the second external electrodes 910 and 920 may be in the minor axis direction of the body 100. It can be formed on two opposite sides.
- 13 to 15 are cross-sectional views sequentially illustrating a method of manufacturing a power inductor according to an exemplary embodiment of the present invention.
- coil patterns 310 and 320 having a predetermined shape are formed on at least one surface, preferably one surface and the other surface of the substrate 200.
- the substrate 200 may be made of CCL or a magnetic metal, and it is preferable to use a magnetic metal that can increase the effective permeability and facilitate the implementation of the capacity.
- the substrate 200 may be manufactured by bonding copper foil to one side and the other side of a metal plate having a predetermined thickness made of a metal alloy containing iron.
- the coil patterns 310 and 320 may be formed as coil patterns formed in a spiral shape from a predetermined region of the substrate 200, for example, a central portion thereof.
- the coil pattern 310 is formed on one surface of the substrate 200, and then a conductive via penetrates a predetermined region of the substrate 200 and is filled with a conductive material, and the coil pattern is formed on the other surface of the substrate 200.
- 320 may be formed.
- the conductive via may be formed by forming a via hole in the thickness direction of the substrate 200 using a laser or the like, and then filling the via hole with a conductive paste.
- the coil pattern 310 may be formed by, for example, a plating process. For this, a plating process using a copper foil on the substrate 200 as a seed is formed by forming a photoresist pattern having a predetermined shape on one surface of the substrate 200.
- the coil pattern 320 may be formed on the other surface of the substrate 200 in the same manner as the coil pattern 310.
- the coil patterns 310 and 320 may be formed in multiple layers.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the insulating layer 500 is formed to cover the coil patterns 310 and 320.
- the insulating layer 500 may be formed by coating an insulating polymer material such as parylene. That is, parylene may be deposited on the coil patterns 310 and 320 by preparing the substrate 200 on which the coil patterns 310 and 320 are formed in the deposition chamber and then supplying the parylene into the vacuum chamber. For example, parylene is first heated in a vaporizer to vaporize it into a dimer state, followed by second heating to pyrolyze into a monomer state, and a cold trap and a mechanical vacuum pump connected to a deposition chamber are provided. When the parylene is cooled by using the parylene, the parylene is converted into the polymer state from the monomer state and deposited on the coil patterns 310 and 320.
- an insulating polymer material such as parylene. That is, parylene may be deposited on the coil patterns 310 and 320 by preparing the substrate 200 on which the coil patterns 310 and 320 are formed in the deposition chamber and then supplying the parylene into
- the primary heating process for vaporizing parylene into a dimer state proceeds at a temperature of 100 ° C to 200 ° C and a pressure of 1.0 Torr, and the secondary heating process for pyrolyzing vaporized parylene to make a monomer state
- the temperature may be 400 ° C to 500 ° C and a pressure of 0.5 Torr or more.
- the deposition chamber may maintain a temperature of, for example, 25 ° C. and a pressure of 0.1 Torr to deposit parylene in a monomer state as a polymer state.
- the insulating layer 500 may be coated along the steps of the coil patterns 310 and 320, and thus the insulating layer 500 may be formed to have a uniform thickness.
- the insulating layer 500 may be formed by closely contacting the sheet including at least one material selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer on the coil patterns 310 and 320.
- a plurality of sheets 100a to 100h made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 are prepared.
- the metal powder 110 may use a metal material including iron (Fe)
- the polymer 120 may use an epoxy, polyimide, or the like, which may insulate between the metal powders 110, and may be thermally conductive.
- the filler 130 may use MgO, AlN, a carbon-based material or the like capable of releasing the heat of the metal powder 110 to the outside.
- the surface of the metal powder 110 may be coated with a magnetic material, for example, a metal oxide magnetic material, or may be coated with an insulating material such as parylene.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder, and the thermally conductive filler 130 may be 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110. It may be included in the content.
- the plurality of sheets 100a to 100h are disposed above and below the substrate 200 on which the coil patterns 310 and 320 are formed. Meanwhile, the plurality of sheets 100a to 100h may have different contents of the thermally conductive filler 130.
- the content of the thermally conductive filler 130 may increase from one side and the other side of the substrate 200 toward the upper side and the lower side.
- the content of the thermally conductive fillers 130 of the sheets 100b and 100e positioned above and below the sheets 100a and 100d in contact with the substrate 200 is greater than that of the thermally conductive fillers 130 of the sheets 100a and 100d.
- the content of the thermally conductive fillers 130 of the sheets 100c and 100f positioned above and below the sheets 100b and 100e is higher than the content of the thermally conductive fillers 130 of the sheets 100b and 100e. Can be higher.
- the content of the thermally conductive filler 130 may increase, thereby further improving heat transfer efficiency.
- the first and second magnetic layers 610 and 620 may be provided on the upper and lower portions of the uppermost and lowermost sheets 100a and 100h, respectively.
- the first and second magnetic layers 610 and 620 may be made of a material having a higher magnetic permeability than the sheets 100a to 100h.
- the first and second magnetic layers 610 and 620 may be manufactured using magnetic powder and an epoxy resin to have a magnetic permeability higher than the magnetic permeability of the sheets 100a to 100h.
- the first and second magnetic layers 610 and 620 may further include a thermally conductive filler.
- the body 100 is formed by stacking and pressing a plurality of sheets 100a to 100h with a substrate 200 therebetween.
- the external electrode 400 may be formed at both ends of the body 100 to be electrically connected to the drawn portions of the coil patterns 310 and 320.
- the external electrode 400 may be formed by immersing the body 100 in the conductive paste, printing the conductive paste on both ends of the body 10, or using a method such as deposition and sputtering.
- the conductive paste may use a metal material capable of imparting electrical conductivity to the external electrode 400.
- a nickel plating layer and a tin plating layer may be further formed on the surface of the external electrode 400.
- FIG. 16 is a cross-sectional image of a power inductor formed of an insulating layer of polyimide according to a comparative example
- FIG. 17 is a cross-sectional image of a power inductor formed of an insulating layer of parylene according to an embodiment.
- a thin thickness is formed along the steps of the coil patterns 310 and 320, but as shown in FIG. 16, the polyimide is formed in a thicker thickness than parylene.
- a voltage of 400 V was repeatedly applied one to ten times to the power inductors according to the 20 comparative examples and examples, respectively.
- the insulation power voltage was measured, which is about 25V in the comparative example and about 86V in the example. Therefore, by forming the insulation layer 500 for insulation of the coil patterns 310 and 320 and the body 100 from parylene, an insulation layer may be formed to a thin thickness and the insulation characteristics and the like may be improved.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
Claims (17)
- 바디;상기 바디 내부에 마련된 적어도 하나의 기재;상기 기재의 적어도 일면 상에 마련된 적어도 하나의 코일 패턴; 및상기 코일 패턴과 바디 사이에 형성된 절연층을 포함하고,상기 절연층은 파릴렌으로 형성된 파워 인덕터.
- 청구항 1에 있어서, 상기 바디는 금속 분말, 폴리머 및 열 전도성 필러를 포함하는 파워 인덕터.
- 청구항 2에 있어서, 상기 금속 분말은 철을 포함하는 금속 합금 분말을 포함하는 파워 인덕터.
- 청구항 3에 있어서, 상기 금속 분말은 표면에 자성체 및 절연체의 적어도 하나가 코팅된 파워 인덕터.
- 청구항 4에 있어서, 상기 절연체는 파릴렌이 1㎛ 내지 10㎛의 두께로 코팅된 파워 인덕터.
- 청구항 2에 있어서, 상기 열 전도성 필러는 MgO, AlN, 카본 계열의 물질로 구성된 군으로부터 선택된 하나 이상을 포함하는 파워 인덕터.
- 청구항 6에 있어서, 상기 열 전도성 필러는 상기 금속 분말 100wt%에 대하여 0.5wt% 내지 3wt%의 함량으로 포함되고, 0.5㎛ 내지 100㎛의 크기를 갖는 파워 인덕터.
- 청구항 1에 있어서, 상기 기재는 구리 클래드 라미네이션으로 형성되거나, 철을 포함하는 금속판의 양면 상에 구리 포일이 접합된 파워 인덕터.
- 청구항 1 내지 청구항 8 중 어느 한 항에 있어서, 상기 절연층은 상기 파릴렌을 기화시켜 상기 코일 패턴 상에 균일한 두께로 코팅된 파워 인덕터.
- 청구항 9에 있어서, 상기 절연층은 3㎛ 내지 100㎛의 두께로 형성된 파워 인덕터.
- 청구항 9에 있어서, 상기 바디의 외측에 형성되어 상기 코일 패턴과 연결된 외부 전극을 더 포함하는 파워 인덕터.
- 청구항 9에 있어서, 상기 기재는 적어도 둘 이상 마련되고, 상기 코일 패턴은 상기 적어도 둘 이상의 기재 상에 각각 형성되는 파워 인덕터.
- 청구항 12에 있어서, 상기 바디의 외측에 마련되며 상기 적어도 둘 이상의 코일 패턴을 연결하는 연결 전극을 더 포함하는 파워 인덕터.
- 청구항 13에 있어서, 상기 적어도 둘 이상의 코일 패턴과 각각 연결되어 상기 바디 외측에 형성된 적어도 둘 이상의 외부 전극을 포함하는 파워 인덕터
- 청구항 14에 있어서, 상기 복수의 외부 전극은 상기 바디의 동일 측면에 서로 이격되어 형성되거나, 상기 바디의 서로 다른 측면에 형성된 파워 인덕터.
- 청구항 9에 있어서, 상기 바디의 적어도 일 영역에 마련되며, 상기 바디의 투자율보다 높은 투자율을 갖는 자성층을 더 포함하는 파워 인덕터.
- 청구항 16에 있어서, 상기 자성층은 열 전도성 필러를 포함하여 형성된 파워 인덕터.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/502,501 US10541075B2 (en) | 2014-08-07 | 2015-06-01 | Power inductor |
EP15829286.2A EP3179490B1 (en) | 2014-08-07 | 2015-06-01 | Power inductor |
JP2017504690A JP6408688B2 (ja) | 2014-08-07 | 2015-06-01 | パワーインダクター |
CN201580042687.8A CN107077947B (zh) | 2014-08-07 | 2015-06-01 | 功率电感器 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0101508 | 2014-08-07 | ||
KR20140101508 | 2014-08-07 | ||
KR20140120128 | 2014-09-11 | ||
KR10-2014-0120128 | 2014-09-11 | ||
KR1020150062601A KR101686989B1 (ko) | 2014-08-07 | 2015-05-04 | 파워 인덕터 |
KR10-2015-0062601 | 2015-05-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016021818A1 true WO2016021818A1 (ko) | 2016-02-11 |
Family
ID=55264049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2015/005454 WO2016021818A1 (ko) | 2014-08-07 | 2015-06-01 | 파워 인덕터 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2016021818A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019530219A (ja) * | 2016-09-08 | 2019-10-17 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067214A (ja) * | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | パワーインダクタ |
JP2011077157A (ja) * | 2009-09-29 | 2011-04-14 | Murata Mfg Co Ltd | 積層型コイル装置 |
US20110308072A1 (en) * | 1999-02-26 | 2011-12-22 | Ahn Kie Y | Open pattern inductor |
KR20120031754A (ko) * | 2010-09-27 | 2012-04-04 | 주식회사 아모텍 | 적층형 파워 인덕터 및 이의 제조방법 |
KR20140003056A (ko) * | 2012-06-29 | 2014-01-09 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
-
2015
- 2015-06-01 WO PCT/KR2015/005454 patent/WO2016021818A1/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110308072A1 (en) * | 1999-02-26 | 2011-12-22 | Ahn Kie Y | Open pattern inductor |
JP2007067214A (ja) * | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | パワーインダクタ |
JP2011077157A (ja) * | 2009-09-29 | 2011-04-14 | Murata Mfg Co Ltd | 積層型コイル装置 |
KR20120031754A (ko) * | 2010-09-27 | 2012-04-04 | 주식회사 아모텍 | 적층형 파워 인덕터 및 이의 제조방법 |
KR20140003056A (ko) * | 2012-06-29 | 2014-01-09 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3179490A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019530219A (ja) * | 2016-09-08 | 2019-10-17 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
JP2021103796A (ja) * | 2016-09-08 | 2021-07-15 | モダ−イノチップス シーオー エルティディー | パワーインダクター |
US11476037B2 (en) | 2016-09-08 | 2022-10-18 | Moda-Innochips Co., Ltd. | Power inductor |
JP7499316B2 (ja) | 2016-09-08 | 2024-06-13 | モダ-イノチップス シーオー エルティディー | パワーインダクター |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2019117551A1 (ko) | 파워 인덕터 및 그 제조 방법 | |
CN107077947B (zh) | 功率电感器 | |
JP7499316B2 (ja) | パワーインダクター | |
WO2017171265A1 (ko) | 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자 | |
WO2017160032A1 (ko) | 코일 패턴 및 그 형성 방법, 이를 구비하는 칩 소자 | |
WO2018062825A1 (ko) | 파워 인덕터 | |
TW201611051A (zh) | 功率電感器 | |
KR101662206B1 (ko) | 파워 인덕터 | |
WO2018016821A1 (ko) | 파워 인덕터 | |
WO2016039518A1 (ko) | 파워 인덕터 및 그 제조 방법 | |
WO2016021938A1 (ko) | 파워 인덕터 | |
WO2018048135A1 (ko) | 파워 인덕터 | |
WO2016021818A1 (ko) | 파워 인덕터 | |
WO2017065528A1 (ko) | 파워 인덕터 | |
KR20170033828A (ko) | 파워 인덕터 | |
WO2017090950A1 (ko) | 파워 인덕터 | |
WO2016021807A1 (ko) | 파워 인덕터 | |
WO2016039516A1 (ko) | 파워 인덕터 | |
WO2016039517A1 (ko) | 파워 인덕터 | |
KR20160136267A (ko) | 파워 인덕터 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15829286 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017504690 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2015829286 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2015829286 Country of ref document: EP |