WO2016021807A1 - Power inductor - Google Patents
Power inductor Download PDFInfo
- Publication number
- WO2016021807A1 WO2016021807A1 PCT/KR2015/004135 KR2015004135W WO2016021807A1 WO 2016021807 A1 WO2016021807 A1 WO 2016021807A1 KR 2015004135 W KR2015004135 W KR 2015004135W WO 2016021807 A1 WO2016021807 A1 WO 2016021807A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power inductor
- magnetic
- substrate
- thermally conductive
- metal powder
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 239000002184 metal Substances 0.000 claims abstract description 93
- 239000000843 powder Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000011231 conductive filler Substances 0.000 claims abstract description 49
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229920000642 polymer Polymers 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052742 iron Inorganic materials 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000000696 magnetic material Substances 0.000 claims description 38
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- 229910001092 metal group alloy Inorganic materials 0.000 claims description 11
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- 239000010949 copper Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
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- 229910052802 copper Inorganic materials 0.000 description 7
- 239000006247 magnetic powder Substances 0.000 description 7
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 6
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 6
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- 239000002245 particle Substances 0.000 description 5
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- 239000004593 Epoxy Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- -1 iron-aluminum-chromium Chemical compound 0.000 description 4
- 230000005415 magnetization Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
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- 239000011787 zinc oxide Substances 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- JSPBDYKPSGHCQF-UHFFFAOYSA-N [Cu]=O.[Zn].[Ni] Chemical compound [Cu]=O.[Zn].[Ni] JSPBDYKPSGHCQF-UHFFFAOYSA-N 0.000 description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
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- 229910000480 nickel oxide Inorganic materials 0.000 description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 2
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
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- 239000011701 zinc Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
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- 239000010941 cobalt Substances 0.000 description 1
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- 229910021389 graphene Inorganic materials 0.000 description 1
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- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
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- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
Definitions
- the present invention relates to a power inductor, and more particularly, to a power inductor having excellent inductance characteristics and improved thermal stability.
- Power inductors are mainly provided in power supply circuits such as DC-DC converters in portable devices. Such power inductors have been increasingly used in place of the conventional coiled choke coil patterns (Choke Coil) in accordance with the high frequency and miniaturization of the power circuit. In addition, power inductors are being developed in the direction of miniaturization, high current, and low resistance according to the size reduction and multifunction of portable devices.
- the power inductor may be manufactured in the form of a laminate in which ceramic sheets made of a plurality of ferrites or low dielectric constant dielectrics are stacked.
- a metal pattern is formed on the ceramic sheet in the form of a coil pattern, and the coil pattern formed on each ceramic sheet is connected by conductive vias formed in each ceramic sheet, and overlaps along the vertical direction in which the sheets are stacked. Can be achieved.
- the body constituting such a power inductor is conventionally manufactured using a magnetic material composed of quaternary systems of nickel (Ni) -zinc (Zn) -copper (Cu) -iron (Fe).
- the magnetic material may not implement the high current characteristic required by recent portable devices because the saturation magnetization value is lower than that of the metal material. Therefore, by manufacturing the body constituting the power inductor using metal powder, the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- the saturation magnetization value can be relatively increased as compared with the case in which the body is made of magnetic material.
- eddy current loss and hysteresis loss at high frequencies may increase, resulting in a serious loss of material.
- a structure insulating a polymer between metal powders is applied.
- a power inductor manufactured using a metal powder and a polymer has a problem in that inductance is lowered as the temperature increases. That is, the temperature of the power inductor increases due to the heat generation of the portable device to which the power inductor is applied, and as a result, the inductance decreases while the metal powder forming the body of the power inductor is heated.
- the present invention provides a power inductor capable of improving stability to temperature and thus preventing a decrease in inductance.
- the present invention provides a power inductor capable of improving temperature stability by dissipating heat in the body.
- a power inductor includes a body; A substrate provided inside the body; And a coil pattern provided on at least one surface of the substrate, wherein the body includes a metal powder, a polymer, and a thermally conductive filler.
- the metal powder includes a metal alloy powder including iron.
- the metal powder is a power inductor coated with at least one of a magnetic material and an insulator on the surface.
- the thermally conductive filler includes one or more selected from the group consisting of MgO, AlN, carbon-based materials.
- the thermally conductive filler is included in an amount of 0.5wt% to 3wt% with respect to 100wt% of the metal powder.
- the thermally conductive filler has a size of 0.5 ⁇ m to 100 ⁇ m.
- the substrate is bonded to the copper foil on both sides of the metal plate containing iron.
- the semiconductor device may further include an insulating layer formed on the coil pattern and an external electrode formed on the outside of the body and connected to the coil pattern.
- a magnetic layer is provided on at least one region of the body and has a magnetic permeability higher than that of the body.
- the magnetic layer is formed including a thermally conductive filler.
- a power inductor includes a body; A substrate provided inside the body; And a coil pattern provided on at least one surface of the substrate, wherein the substrate is bonded to a copper foil on both sides of a metal plate including iron.
- the body comprises a metal powder, a polymer and a thermally conductive filler.
- the thermally conductive filler includes one or more selected from the group consisting of MgO, AlN, carbon-based materials.
- the thermally conductive filler is included in an amount of 0.5wt% to 3wt% with respect to 100wt% of the metal powder.
- a magnetic layer is provided on at least one region of the body and has a magnetic permeability higher than that of the body.
- the body is manufactured using a metal powder, a polymer, and a thermally conductive filler.
- the thermally conductive filler may be included to release the heat of the body well to the outside, thereby preventing the reduction of the inductance due to the heating of the body.
- the magnetic permeability of the power inductor may be prevented by manufacturing a substrate having a coil pattern formed inside the body as a magnetic metal, and the magnetic permeability of the power inductor may be improved by providing at least one magnetic layer in the body.
- FIG. 1 is a perspective view of a power inductor according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
- 3 to 5 are cross-sectional views of a power inductor according to other embodiments of the present invention.
- 6 to 8 are cross-sectional views illustrating a method of manufacturing a power inductor according to an embodiment of the present invention.
- FIG. 1 is a perspective view of a power inductor according to an exemplary embodiment of the present invention
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
- a power inductor includes a body 100 including a thermally conductive filler 130, a substrate 200 provided inside the body 100, and a substrate ( The coil patterns 310 and 320 formed on at least one surface of the 200 and the external electrodes 410 and 420 provided outside the body 100 may be included.
- the body 100 may be, for example, a hexahedral shape. However, the body 100 may have a shape of a polyhedron other than a hexahedron.
- the body 100 may include a metal powder 110, a polymer 120, and a thermally conductive filler 130.
- the metal powder 110 may have an average particle diameter of 1 ⁇ m to 50 ⁇ m.
- the metal powder 110 may use a single particle or two or more kinds of particles of the same size, or may use a single particle or two or more kinds of particles having a plurality of sizes. For example, the first metal particles having an average size of 30 ⁇ m and the second metal particles having an average size of 3 ⁇ m may be mixed and used.
- the filling rate of the body 100 may be increased to maximize the capacity. For example, when a metal powder of 30 ⁇ m is used, voids may occur between the metal powder of 30 ⁇ m, and thus the filling rate may be lowered. However, the filling rate can be increased by mixing a smaller 3 ⁇ m metal powder between the 30 ⁇ m metal powder.
- the metal powder 110 may use a metal material including iron (Fe), for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-Al-Cr). That is, the metal powder 110 may be formed of a metal alloy having magnetic structure or magnetic properties including iron, and may have a predetermined permeability. In addition, the surface of the metal powder 110 may be coated with a magnetic material, and the metal powder 110 may be coated with a material having a different permeability.
- Fe iron
- Fe-Ni iron-nickel
- Fe-Si-Si iron-nickel-silicon
- Fe-aluminum- It may include one or more metals selected from the group consisting of silicon (Fe-Al-Si) and iron-aluminum-chromium (Fe-
- the magnetic body may be formed of a metal oxide magnetic material, and may be formed of a nickel oxide magnetic material, a zinc oxide magnetic material, a copper oxide magnetic material, a manganese oxide magnetic material, a cobalt oxide magnetic material, a barium oxide magnetic material, and a nickel-zinc-copper oxide magnetic material.
- a metal oxide magnetic material may be formed of a nickel oxide magnetic material, a zinc oxide magnetic material, a copper oxide magnetic material, a manganese oxide magnetic material, a cobalt oxide magnetic material, a barium oxide magnetic material, and a nickel-zinc-copper oxide magnetic material.
- One or more oxide magnetic materials selected may be used. That is, the magnetic body coated on the surface of the metal powder 110 may be formed of a metal oxide containing iron, it is preferable to have a higher permeability than the metal powder (110). In addition, the metal powder 110 may have a surface coated with at least one insulator.
- the metal powder 110 may be coated with an oxide on a surface thereof, or may be coated with an insulating polymer material such as parylene.
- the oxide may be formed by oxidizing the metal powder 110, and may be formed of TiO 2 , SiO 2 , ZrO 2 , SnO 2 , NiO, ZnO, CuO, CoO, MnO, MgO, Al 2 O 3 , Cr 2 O 3 , Fe One selected from 2 O 3 , B 2 O 3 and Bi 2 O 3 may be coated.
- the surface of the metal powder 110 may be coated using various insulating polymer materials in addition to parylene.
- the metal powder 110 may be coated with an oxide having a dual structure, and may be coated with a dual structure of an oxide and a polymer material.
- the metal powder 110 may be coated with an insulating material after the surface is coated with a magnetic material.
- the surface of the metal powder 110 is coated with an insulator, it is possible to prevent a short due to contact between the metal powder 110.
- the polymer 120 may be mixed with the metal powder 110 to insulate between the metal powders 110. That is, the metal powder 110 may have a problem in that the loss of materials is increased due to high eddy current loss and hysteresis loss at a high frequency. 120).
- the polymer 120 may include one or more polymers selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer (LCP), but is not limited thereto.
- the polymer 120 may be formed of a thermosetting resin to provide insulation between the metal powders 110.
- thermosetting resins include Novolac Epoxy Resin, Phenoxy Type Epoxy Resin, BPA Type Epoxy Resin and BPF Type Epoxy Resin.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder.
- the content of the polymer 120 is increased, the volume fraction of the metal powder 110 is lowered, so that the effect of increasing the saturation magnetization value is not properly implemented, and the magnetic properties of the body 100, that is, the permeability may be reduced.
- the content of the polymer 120 decreases, a strong acid or strong base solution used in the manufacturing process of the inductor may penetrate into the inside, thereby reducing the inductance characteristic. Therefore, the polymer 120 may be included in a range not to lower the saturation magnetization value and inductance of the metal powder 110.
- the thermally conductive filler 130 is included to solve the problem that the body 100 is heated by external heat. That is, the metal powder 110 of the body 100 may be heated by external heat, and the heat conductive filler 130 may be included to release heat of the metal powder 110 to the outside.
- the thermally conductive filler 130 may include one or more selected from the group consisting of MgO, AlN, and carbon-based materials, but is not limited thereto.
- the carbon-based material may include carbon and have various shapes, for example, graphite, carbon black, graphene, graphite, or the like.
- the thermally conductive filler 130 may be included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110.
- the thermally conductive filler 130 may have, for example, a size of 0.5 ⁇ m to 100 ⁇ m. That is, the thermally conductive filler 130 may have a size larger or smaller than the metal powder 110.
- the body 100 may be manufactured by stacking a plurality of sheets made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130. Here, when the body 100 is manufactured by stacking a plurality of sheets, the content of the thermally conductive filler 130 of each sheet may be different.
- the content of the thermally conductive filler 130 in the sheet may increase as it moves toward the upper side and the lower side with respect to the substrate 200.
- the body 100 is formed by printing a paste made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 to a predetermined thickness, or by pressing such paste into a mold and pressing the paste. If necessary, various methods may be applied and formed. In this case, the number of sheets laminated to form the body 100 or the thickness of the paste printed with a predetermined thickness may be determined to an appropriate number or thickness in consideration of electrical characteristics such as inductance required by the power inductor.
- the substrate 200 may be provided inside the body 100. At least one substrate 200 may be provided. For example, the substrate 200 may be provided along the long axis direction of the body 100 inside the body 100. Here, the substrate 200 may be provided in one or more, for example, two substrates 200 may be spaced apart by a predetermined interval in a direction orthogonal to the direction in which the external electrode 400 is formed, for example, in a vertical direction. Can be.
- the substrate 200 may be made of, for example, copper clad lamination (CCL) or a magnetic metal. In this case, the substrate 200 may be made of a magnetic metal to increase permeability and facilitate capacity implementation. That is, CCL is manufactured by bonding a copper foil to glass-reinforced fibers.
- the permeability of the power inductor is reduced.
- the magnetic metal is used as the substrate 200, the magnetic magnetic material has a magnetic permeability, so that the magnetic permeability of the power inductor is not lowered.
- Substrate 200 using such a magnetic metal material is a metal containing iron, for example iron-nickel (Fe-Ni), iron-nickel-silicon (Fe-Ni-Si), iron-aluminum-silicon (Fe-Al -Si) and iron-aluminum-chromium (Fe-Al-Cr) can be produced by bonding a copper foil to a plate of a predetermined thickness consisting of at least one metal selected from the group consisting of. That is, the substrate 200 may be manufactured by manufacturing an alloy made of at least one metal including iron into a plate shape having a predetermined thickness, and bonding a copper foil to at least one surface of the metal plate.
- iron-Ni iron-nickel
- Fe-Ni-Si iron-nickel-silicon
- Fe-Al -Si iron-aluminum-silicon
- Fe-Al-Cr iron-aluminum-chromium
- At least one conductive via may be formed in a predetermined region of the substrate 200, and the coil patterns 310 and 320 formed at the upper side and the lower side of the substrate 200 by the conductive via may be electrically connected. Can be connected.
- the conductive via may be formed by forming a via (not shown) that penetrates the substrate 200 along the thickness direction, and then fills the via with a conductive paste.
- the coil patterns 310 and 320 may be formed on at least one surface, and preferably both surfaces of the substrate 200.
- the coil patterns 310 and 320 may be formed in a spiral shape in a predetermined area of the substrate 200, for example, from the center portion to an outward direction, and two coil patterns 310 and 320 formed on the substrate 200 are connected to each other.
- the upper coil pattern 310 and the lower coil pattern 320 may be formed in the same shape.
- the coil patterns 310 and 320 may be formed to overlap each other, or the coil patterns 320 may be formed to overlap the region where the coil patterns 310 are not formed.
- the coil patterns 310 and 320 may be electrically connected by conductive vias formed in the substrate 200.
- the coil patterns 310 and 320 may be formed by, for example, thick film printing, coating, deposition, plating, and sputtering.
- the coil patterns 310 and 320 and the conductive via may be formed of a material including at least one of silver (Ag), copper (Cu), and a copper alloy, but is not limited thereto.
- a plating process for example, a metal layer, for example, a copper layer may be formed on the substrate 200 by a plating process, and patterned by a lithography process. That is, the coil patterns 310 and 320 may be formed by forming and patterning a copper layer by using a copper foil formed on the surface of the substrate 200 as a seed layer.
- the coil patterns 310 and 320 may be formed in multiple layers. That is, a plurality of coil patterns may be further formed above the coil pattern 310 formed above the substrate 200, and a plurality of coil patterns may be formed below the coil pattern 320 formed below the substrate 200. It may be further formed.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the external electrode 400 may be formed at both ends of the body 100.
- the external electrodes 400 may be formed on two side surfaces facing each other in the long axis direction of the body 100.
- the external electrode 400 may be electrically connected to the coil patterns 310 and 320 of the body 100. That is, at least one end of the coil patterns 310 and 320 may be exposed to the outside of the body 100 and the external electrode 400 may be connected to the ends of the coil patterns 310 and 320.
- the external electrode 400 may be formed on both ends of the body 100 by various methods such as immersing the body 100 in the conductive paste, or printing, deposition and sputtering.
- the external electrode 400 may be formed of a metal having electrical conductivity.
- the external electrode 400 may be formed of one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof.
- the external electrode 400 may further include a nickel-plated layer (not shown) or tin plating layer (not shown) on its surface.
- an insulating layer 500 may be further formed between the coil patterns 310 and 320 and the body 100 to insulate the coil patterns 310 and 320 and the metal powder 110. That is, the insulating layer 500 may be formed on the upper and lower portions of the substrate 200 to cover the coil patterns 310 and 320.
- the insulating layer 500 may include one or more materials selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer. That is, the insulating layer 500 may be made of the same material as the polymer 120 forming the body 100.
- the insulating layer 500 may be coated with an insulating polymer material such as parylene on the coil patterns 310 and 320. That is, the insulating layer 500 may be coated with a uniform thickness along the steps of the coil patterns 310 and 320.
- the insulating layer 500 may be formed on the coil patterns 310 and 320 using the insulating sheet.
- the power inductor may manufacture the body 100 including the metal powder 110, the polymer 120, and the thermally conductive filler 130. Since the thermally conductive filler 130 is included in the body 100, heat of the body 100 may be discharged to the outside by heating the metal powder 110, thereby preventing a temperature increase of the body 100. Accordingly, problems such as lowering of inductance can be prevented. In addition, by reducing the magnetic permeability of the power inductor by forming the substrate 200 inside the body 100 using a magnetic metal material.
- FIG 3 is a cross-sectional view of a power inductor according to another embodiment of the present invention.
- a power inductor includes a body 100 including a thermally conductive filler 130, a substrate 200 provided inside the body 100, and a substrate 200.
- Coil patterns 310 and 320 formed on at least one surface, external electrodes 410 and 420 provided outside the body 100, and at least one magnetic layer 600 and 610 provided respectively above and below the body 100. 620).
- the insulation layers 500 may be further provided on the coil patterns 310 and 320, respectively. That is, the magnetic layer 600 is further provided in an embodiment of the present invention, so that another embodiment of the present invention can be implemented. Another embodiment of the present invention will be described below with reference to a configuration different from the embodiment of the present invention.
- the magnetic layers 600 may be provided in at least one region of the body 100. That is, the first magnetic layer 610 may be formed on the upper surface of the body 100, and the second magnetic layer 620 may be formed on the lower surface of the body 100.
- the first and second magnetic layers 610 and 620 are provided to increase the magnetic permeability of the body 100, and may be made of a material having a higher magnetic permeability than the body 100.
- the permeability of the body 100 is 20 and the first and second magnetic layers 610 and 620 may be provided to have permeability of 40 to 1000.
- the first and second magnetic layers 610 and 620 may be manufactured using, for example, magnetic powder and a polymer.
- the first and second magnetic layers 610 and 620 may be formed of a material having a higher magnetic force than the magnetic body of the body 100 or have a higher content of the magnetic body so as to have a higher magnetic permeability than the body 100.
- the polymer may be added at 15 wt% with respect to 100 wt% of the metal powder.
- the magnetic powder is nickel magnetic (Ni Ferrite), zinc magnetic (Zn Ferrite), copper magnetic (Cu Ferrite), manganese magnetic (Mn Ferrite), cobalt magnetic (Co Ferrite), barium magnetic (Ba Ferrite) and nickel-zinc
- Ni Ferrite nickel magnetic
- Zn Ferrite zinc magnetic
- Cu Ferrite copper magnetic
- Mn Ferrite manganese magnetic
- Co Ferrite cobalt magnetic
- nickel-zinc nickel-zinc
- One or more or one or more oxide magnetic materials thereof selected from the group consisting of -Ni-Zn-Cu Ferrite can be used.
- the magnetic layer 600 may be formed using metal alloy powder containing iron or metal alloy oxide containing iron.
- the magnetic powder may be coated on the metal alloy powder to form the magnetic powder.
- one or more oxide magnetic materials selected from the group consisting of nickel oxide magnetic materials, zinc oxide magnetic materials, copper oxide magnetic materials, manganese oxide magnetic materials, cobalt oxide magnetic materials, barium oxide magnetic materials, and nickel-zinc-copper oxide magnetic materials, for example, iron It may be coated on the metal alloy powder to form a magnetic powder. That is, the magnetic oxide powder may be formed by coating the metal oxide including iron on the metal alloy powder.
- the first and second magnetic layers 610 and 620 may be manufactured in the form of a sheet, and may be provided on the upper and lower portions of the body 100 in which a plurality of sheets are stacked.
- the body 100 after forming a body 100 for printing a paste made of a material including the metal powder 110, the polymer 120 and the thermally conductive filler 130 to a predetermined thickness or by inserting the paste into a mold to press the body 100
- Magnetic layers 610 and 620 may be formed on the upper and lower portions, respectively.
- the magnetic layers 610 and 620 may be formed using a paste, and the magnetic layers 610 and 620 may be formed by applying a magnetic material to the upper and lower portions of the body 100.
- third and fourth magnetic layers 630 and 640 may be further provided between the body 100 and the substrate 200.
- fifth and sixth magnetic layers 650 and 660 may be further provided therebetween. That is, at least one magnetic layer 600 may be provided in the body 100.
- the magnetic layer 600 may be manufactured in the form of a sheet and may be provided between the bodies 100 in which a plurality of sheets are stacked. That is, at least one magnetic layer 600 may be provided between the sheets for manufacturing the body 100.
- a magnetic layer may be formed during printing.
- the magnetic layer can be pressed in between.
- the magnetic layer 600 may be formed using a paste.
- a soft magnetic material may be applied to form the magnetic layer 600 in the body 100.
- the magnetic inductance of the power inductor may be improved by providing at least one magnetic layer 600 in the body 100.
- 6 to 8 are cross-sectional views sequentially illustrating a method of manufacturing a power inductor according to an exemplary embodiment of the present invention.
- coil patterns 310 and 320 having a predetermined shape are formed on at least one surface, preferably one surface and the other surface of the substrate 200.
- the substrate 200 may be made of CCL or a magnetic metal, and it is preferable to use a magnetic metal that can increase the effective permeability and facilitate the implementation of the capacity.
- the substrate 200 may be manufactured by bonding copper foil to one side and the other side of a metal plate having a predetermined thickness made of a metal alloy containing iron.
- the coil patterns 310 and 320 may be formed as coil patterns formed in a spiral shape from a predetermined region of the substrate 200, for example, a central portion thereof.
- the coil pattern 310 is formed on one surface of the substrate 200, and then a conductive via penetrates a predetermined region of the substrate 200 and is filled with a conductive material, and the coil pattern is formed on the other surface of the substrate 200.
- 320 may be formed.
- the conductive via may be formed by forming a via hole in the thickness direction of the substrate 200 using a laser or the like, and then filling the via hole with a conductive paste.
- the coil pattern 310 may be formed by, for example, a plating process. For this, a plating process using a copper foil on the substrate 200 as a seed is formed by forming a photoresist pattern having a predetermined shape on one surface of the substrate 200.
- the coil pattern 320 may be formed on the other surface of the substrate 200 in the same manner as the coil pattern 310.
- the coil patterns 310 and 320 may be formed in multiple layers.
- an insulating layer may be formed between the lower layer and the upper layer, and conductive vias (not shown) may be formed in the insulating layer to connect the multilayer coil patterns.
- the insulating layer 500 is formed to cover the coil patterns 310 and 320.
- the insulating layer 500 may be formed by closely contacting the sheet including one or more materials selected from the group consisting of epoxy, polyimide, and liquid crystal crystalline polymer on the coil patterns 310 and 320.
- a plurality of sheets 100a to 100h made of a material including the metal powder 110, the polymer 120, and the thermally conductive filler 130 are prepared.
- the metal powder 110 may use a metal material including iron (Fe)
- the polymer 120 may use an epoxy, polyimide, or the like, which may insulate between the metal powders 110, and may be thermally conductive.
- the filler 130 may use MgO, AlN, a carbon-based material or the like capable of releasing the heat of the metal powder 110 to the outside.
- the surface of the metal powder 110 may be coated with a magnetic material, for example, a metal oxide magnetic material.
- the polymer 120 may be included in an amount of 2.0 wt% to 5.0 wt% with respect to 100 wt% of the metal powder, and the thermally conductive filler 130 may be 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder 110. It may be included in the content.
- the plurality of sheets 100a to 100h are disposed above and below the substrate 200 on which the coil patterns 310 and 320 are formed. Meanwhile, the plurality of sheets 100a to 100h may have different contents of the thermally conductive filler 130.
- the content of the thermally conductive filler 130 may increase from one side and the other side of the substrate 200 toward the upper side and the lower side.
- the content of the thermally conductive fillers 130 of the sheets 100b and 100e positioned above and below the sheets 100a and 100d in contact with the substrate 200 is greater than that of the thermally conductive fillers 130 of the sheets 100a and 100d.
- the content of the thermally conductive fillers 130 of the sheets 100c and 100f positioned above and below the sheets 100b and 100e is higher than the content of the thermally conductive fillers 130 of the sheets 100b and 100e. Can be higher.
- the content of the thermally conductive filler 130 may increase, thereby further improving heat transfer efficiency.
- the first and second magnetic layers 610 and 620 may be provided on the upper and lower portions of the uppermost and lowermost sheets 100a and 100h, respectively.
- the first and second magnetic layers 610 and 620 may be made of a material having a higher magnetic permeability than the sheets 100a to 100h.
- the first and second magnetic layers 610 and 620 may be manufactured using magnetic powder and an epoxy resin to have a magnetic permeability higher than the magnetic permeability of the sheets 100a to 100h.
- the first and second magnetic layers 610 and 620 may further include a thermally conductive filler.
- the body 100 is formed by stacking and pressing a plurality of sheets 100a to 100h with a substrate 200 therebetween.
- the external electrode 400 may be formed at both ends of the body 100 to be electrically connected to the drawn portions of the coil patterns 310 and 320.
- the external electrode 400 may be formed by immersing the body 100 in the conductive paste, printing the conductive paste on both ends of the body 10, or using a method such as deposition and sputtering.
- the conductive paste may use a metal material capable of imparting electrical conductivity to the external electrode 400.
- a nickel plating layer and a tin plating layer may be further formed on the surface of the external electrode 400.
Abstract
Description
Claims (15)
- 바디;body;상기 바디 내부에 마련된 기재; 및A substrate provided inside the body; And상기 기재의 적어도 일면 상에 마련된 코일 패턴을 포함하고,A coil pattern provided on at least one surface of the substrate,상기 바디는 금속 분말, 폴리머 및 열 전도성 필러를 포함하는 파워 인덕터.And the body comprises a metal powder, a polymer and a thermally conductive filler.
- 청구항 1에 있어서, 상기 금속 분말은 철을 포함하는 금속 합금 분말을 포함하는 파워 인덕터.The power inductor of claim 1, wherein the metal powder comprises a metal alloy powder including iron.
- 청구항 2에 있어서, 상기 금속 분말은 표면에 자성체 및 절연체의 적어도 하나가 코팅된 파워 인덕터.The power inductor of claim 2, wherein the metal powder is coated with at least one of a magnetic material and an insulator on a surface thereof.
- 청구항 1에 있어서, 상기 열 전도성 필러는 MgO, AlN, 카본 계열의 물질로 구성된 군으로부터 선택된 하나 이상을 포함하는 파워 인덕터.The power inductor of claim 1, wherein the thermally conductive filler comprises at least one selected from the group consisting of MgO, AlN, and carbon-based materials.
- 청구항 4에 있어서, 상기 열 전도성 필러는 상기 금속 분말 100wt%에 대하여 0.5wt% 내지 3wt%의 함량으로 포함되는 파워 인덕터.The power inductor of claim 4, wherein the thermally conductive filler is included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder.
- 청구항 5에 있어서, 상기 열 전도성 필러는 0.5㎛ 내지 100㎛의 크기를 갖는 파워 인덕터.The power inductor of claim 5, wherein the thermally conductive filler has a size of 0.5 μm to 100 μm.
- 청구항 1에 있어서, 상기 기재는 철을 포함하는 금속판의 양면 상에 구리 포일이 접합된 파워 인덕터.The power inductor of claim 1, wherein the substrate is bonded to a copper foil on both sides of a metal plate including iron.
- 청구항 1에 있어서, 상기 코일 패턴 상에 형성된 절연층과, 상기 바디의 외측에 형성되어 상기 코일 패턴과 연결된 외부 전극을 더 포함하는 파워 인덕터.The power inductor of claim 1, further comprising an insulating layer formed on the coil pattern and an external electrode formed outside the body and connected to the coil pattern.
- 청구항 1 내지 청구항 8중 어느 한 항에 있어서, 상기 바디의 적어도 일 영역에 마련되며, 상기 바디의 투자율보다 높은 투자율을 갖는 자성층을 더 포함하는 파워 인덕터.The power inductor of claim 1, further comprising a magnetic layer provided in at least one region of the body and having a magnetic permeability higher than that of the body.
- 청구항 9에 있어서, 상기 자성층은 열 전도성 필러를 포함하여 형성된 파워 인덕터.The power inductor of claim 9, wherein the magnetic layer comprises a thermally conductive filler.
- 바디;body;상기 바디 내부에 마련된 기재; 및A substrate provided inside the body; And상기 기재의 적어도 일면 상에 마련된 코일 패턴을 포함하고,A coil pattern provided on at least one surface of the substrate,상기 기재는 철을 포함하는 금속판의 양면 상에 구리 포일이 접합된 파워 인덕터.The substrate is a power inductor bonded to the copper foil on both sides of the metal plate containing iron.
- 청구항 11에 있어서, 상기 바디는 금속 분말, 폴리머 및 열 전도성 필러를 포함하는 파워 인덕터.The power inductor of claim 11, wherein the body comprises a metal powder, a polymer, and a thermally conductive filler.
- 청구항 12에 있어서, 상기 열 전도성 필러는 MgO, AlN, 카본 계열의 물질로 구성된 군으로부터 선택된 하나 이상을 포함하는 파워 인덕터.The power inductor of claim 12, wherein the thermally conductive filler comprises at least one selected from the group consisting of MgO, AlN, and carbon-based materials.
- 청구항 13에 있어서, 상기 열 전도성 필러는 상기 금속 분말 100wt%에 대하여 0.5wt% 내지 3wt%의 함량으로 포함되는 파워 인덕터.The power inductor of claim 13, wherein the thermally conductive filler is included in an amount of 0.5 wt% to 3 wt% with respect to 100 wt% of the metal powder.
- 청구항 11에 있어서, 상기 바디의 적어도 일 영역에 마련되며, 상기 바디의 투자율보다 높은 투자율을 갖는 자성층을 더 포함하는 파워 인덕터.The power inductor of claim 11, further comprising a magnetic layer provided in at least one region of the body and having a magnetic permeability higher than that of the body.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN201580042194.4A CN106605279B (en) | 2014-08-07 | 2015-04-27 | Power inductor |
US15/502,500 US10573451B2 (en) | 2014-08-07 | 2015-04-27 | Power inductor |
JP2017504678A JP6450448B2 (en) | 2014-08-07 | 2015-04-27 | Power inductor |
EP15829578.2A EP3179491B1 (en) | 2014-08-07 | 2015-04-27 | Power inductor |
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KR20140101508 | 2014-08-07 | ||
KR10-2014-0101508 | 2014-08-07 | ||
KR1020150032400A KR101681200B1 (en) | 2014-08-07 | 2015-03-09 | Power inductor |
KR1020150032401A KR101662206B1 (en) | 2014-08-07 | 2015-03-09 | Power inductor |
KR10-2015-0032400 | 2015-03-09 | ||
KR10-2015-0032401 | 2015-03-09 |
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