WO2015198955A1 - Plating device - Google Patents
Plating device Download PDFInfo
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- WO2015198955A1 WO2015198955A1 PCT/JP2015/067561 JP2015067561W WO2015198955A1 WO 2015198955 A1 WO2015198955 A1 WO 2015198955A1 JP 2015067561 W JP2015067561 W JP 2015067561W WO 2015198955 A1 WO2015198955 A1 WO 2015198955A1
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- WIPO (PCT)
- Prior art keywords
- plating
- jig
- seal member
- guide portion
- expansion seal
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
Definitions
- the present invention relates to a plating apparatus capable of uniforming the plating thicknesses of two wafers mounted on both front and back surfaces of a plating jig by preventing so-called current line wrapping and avoiding unintended plating growth. .
- the surface of a wafer used as a substrate for mounting a semiconductor is plated with copper for circuit formation. Specifically, a wafer is mounted on a plating jig, and the entire surface of the plating jig on which the wafer is mounted is immersed in a plating solution containing copper or the like stored in a plating tank. Is plated.
- Patent Document 1 discloses a wafer plating rack that can perform plating processing of two wafers at the same time by using a plating jig in which the pattern printing surfaces of two wafers are mounted outward. It is disclosed. By simultaneously plating the two wafers, the overall throughput can be improved.
- Patent Document 2 discloses a substrate plating jig in which both sides of the pattern printing surface of a semiconductor wafer are exposed and the power feeding portion is sealed. In Patent Document 2, it is possible to improve the overall throughput by simultaneously performing plating on both sides of a semiconductor wafer.
- the present invention has been made in view of such circumstances, and prevents the occurrence of so-called current line wrapping and avoids unintended plating growth, thereby preventing two wafers mounted on both front and back surfaces of a plating jig. It aims at providing the plating apparatus which can make plating thickness uniform.
- a plating apparatus mounts two wafers to be plated on both front and back surfaces of a plating jig, and targets the plating process of the two mounted wafers.
- a plating apparatus for performing a plating process by immersing a plating jig functioning as a cathode in a plating tank in which a plating solution is stored.
- the plating is provided with a guide part into which the plating jig can be inserted, and an expansion seal member provided in the guide part, and the expansion seal member is expanded and inserted into the plating tank
- Two wafers are divided by being pressed against a jig for use.
- the two wafers to be plated are mounted on both the front and back surfaces of the plating jig, the anodes are respectively opposed to the plating surfaces of the two mounted wafers, and the plating solution is Even when a plating jig that functions as a cathode is immersed in a stored plating tank and plating is performed, it is provided along the inner wall of the plating tank, and the plating jig can be inserted.
- a possible guide part and an expansion seal member provided on the guide part are provided, and the expansion seal member is expanded and pressed against a plating jig inserted into the plating tank to separate the two wafers. Therefore, one plating solution of the divided plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
- the guide portion has a seal groove along the inner wall of the plating tank, and the expansion seal member is embedded in the seal groove of the guide portion. It is preferable to arrange between the jig for plating inserted in the plating tank and the guide portion.
- the guide part has a sealing groove along the inner wall of the plating tank, and the expansion seal member is embedded in the sealing groove of the guide part, and the plating jig inserted into the plating tank Therefore, the plating jig and the expansion seal member, and the expansion seal member and the guide portion can be sealed at the same time, and the plating tank can be divided in a liquid-tight manner.
- the expansion seal member has a U-shaped or O-shaped cross-section and is filled over the entire region of the seal groove of the guide portion during expansion.
- the expansion seal member has a U-shaped or O-shaped cross-section and is filled over the entire seal groove of the guide portion during expansion. Therefore, the expansion seal member is inserted into the plating tank. Since the two wafers are divided by being pressed against the tool, one plating solution in the divided plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
- the expansion seal member is formed of a resin material having chemical resistance.
- the expansion seal member is made of a resin material having chemical resistance, so that corrosion or the like is not generated by the plating solution, and the inner surface of the guide portion can be maintained liquid-tight for a long period of time.
- the guide portion includes an insertion groove having a groove width larger than the thickness of the plating jig, and the plating jig extends along the insertion groove of the guide portion. It is preferable to be inserted into the plating tank.
- the guide portion includes an insertion groove having a groove width larger than the thickness of the plating jig, and the plating jig is inserted into the plating tank along the insertion groove of the guide portion. It becomes easy to put the jig for plating into and out of the bath. Further, if the expansion seal member is expanded after the plating jig is inserted, the wear of the expansion seal member during taking in and out can be suppressed.
- the expansion seal member is disposed on one side surface of the insertion groove of the guide portion, and when the expansion seal member expands, the plating jig It is preferable that the other is pressed against the expansion seal member against the other side surface of the insertion groove of the guide portion.
- the expansion seal member is disposed on one side surface of the insertion groove of the guide portion.
- the expansion seal member expands, one of the plating jigs is inserted into the expansion seal member and the other is inserted into the guide portion. Since it is pressed against the other side surface of the groove, the inner surface of the guide portion can be surely liquid-tight without depending on the shape of the expansion seal member, and one plating solution in the divided plating tank is transferred to the other. There is no inflow. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform. In addition, since the plating jig can be completely fixed, the plating jig does not move due to agitation and circulation of the plating solution, and plating abnormalities are unlikely to occur. Can be prevented.
- the two wafers to be plated are mounted on both the front and back surfaces of the plating jig, and the anode is provided so as to face each of the two wafers to be plated.
- the plating jig is inserted along the inner wall of the plating tank.
- an expansion seal member provided on the guide portion. The expansion seal member is expanded and pressed against a plating jig inserted in the plating tank, so that two wafers can be separated. Since it is bathed, one plating solution of the divided plating bath does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
- FIG. 6 is an AA arrow view of FIG. 5 of the expansion seal member of the plating apparatus according to the embodiment of the present invention.
- FIG. 1 is a schematic diagram for explaining an outline of a plating apparatus according to an embodiment of the present invention.
- a plating solution 40 is stored in a plating tank 30.
- the plating jig 10 holding the wafer 7 (see FIG. 2) to be plated on both the front and back surfaces is put into and out of the plating tank 30 in which the plating solution 40 is stored.
- An anode (anode electrode) 20 is installed at a position facing the target surface of the plating process of the wafer 7 held by the plating jig 10.
- the anode of the DC power supply 50 is connected to the anode 20, and the negative electrode that functions as the cathode is connected to the plating jig 10.
- a direct current a plating film is generated on the surface of the wafer 7 held on both the front and back surfaces.
- FIG. 2 is a perspective view showing a usage state of the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention.
- the grip portion 11 is gripped by a transport unit (not shown) and is moved to a position directly above the plating tank 30. Then, by lowering the plating jig 10 in the arrow direction and immersing the holding base 12 holding the wafer 7 to be plated on both surfaces in the plating solution 40 stored in the plating tank 30, The plating process on the surface of the two wafers 7 is executed.
- FIG. 3 is a plan view of one of the plating tanks 30 of the plating apparatus 1 according to the embodiment of the present invention as viewed from above.
- FIG. 3 shows a state where the plating jig 10 is not inserted for easy understanding.
- FIG. 4 is a partially enlarged plan view of the plating tank 30 of the plating apparatus 1 according to the embodiment of the present invention when the vicinity D of the guide portion 31 in FIG. 3 is viewed from above.
- a guide portion 31 that can be inserted in accordance with the shape of the plating jig 10 is provided along the inner wall (inner surface and inner bottom surface) of the plating tank 30.
- a guide portion 31 into which the plating jig 10 can be inserted is provided along the inner wall of the plating tank 30.
- the guide portion 31 is provided with a sealing groove 31 a along the inner wall of the plating tank 30.
- An expansion seal member 32 described later is provided in the seal groove 31a.
- the guide portion 31 on the inner side surface of the plating tank 30 has a U-shaped cross section and has an insertion groove 31b into which the plating jig 10 can be inserted.
- the plating jig 10 is inserted into the plating tank 30 along the insertion groove 31b.
- the groove width of the insertion groove 31 b is larger than the thickness of the holding base 12 of the plating jig 10.
- the expansion seal member 32 is embedded in the seal groove 31a of the guide portion 31. Accordingly, the expansion seal member 32 is disposed between the plating jig 10 inserted in the plating tank 30 and the guide portion 31. The expansion seal member 32 provided between the plating jig 10 and the guide portion 31 is expanded and pressed against the plating jig 10 inserted into the plating tank 30 to separate the two wafers 7. Can be tanked.
- the expansion seal member 32 is filled over the entire region of the sealing groove 31 a of the guide portion 31, so that one plating solution of the plating tank 30 divided by the plating jig 10 is prevented from flowing into the other. can do. Therefore, the occurrence of the wraparound of the current line can be avoided in advance, and it becomes easy to control the plating thickness of the two wafers 7 mounted on both the front and back surfaces of the plating jig 10 to be uniform.
- FIG. 5 is a perspective view showing a configuration of the expansion seal member 32 of the plating apparatus 1 according to the embodiment of the present invention.
- the expansion seal member 32 of the plating apparatus 1 according to the present embodiment is formed in a U shape in accordance with the shape of the guide portion 31 formed along the inner wall of the plating tank 30. ing.
- the expansion seal member 32 is also formed in a U-shaped cross section, and includes a compressed air port 35 through which fluid (for example, compressed air) can be injected from the U-shaped opening side.
- FIG. 6 is a view of the expansion seal member 32 of the plating apparatus 1 according to the embodiment of the present invention as seen in the direction of arrows AA in FIG.
- the expansion seal member 32 When compressed air is injected from the compressed air port 35, the expansion seal member 32 expands in the arrow S direction and the arrow F direction shown in FIG. By the expansion in the arrow S direction, the expansion seal member 32 provided in the guide portion 31 and the guide portion 31 are sealed. By the expansion in the direction of arrow F, the expansion seal member 32 and the plating jig 10 are sealed. As a result, the plating jig 10, the plating tank 30, and the expansion seal member 32 can be in a liquid-tight state.
- the expansion seal member 32 used in the present embodiment is designed so that the expansion amount in the arrow F direction is larger than the arrow S direction.
- the expansion seal member 32 is preferably formed of a material having chemical resistance. For example, by being formed of silicon rubber, fluorine rubber, or the like, corrosion or the like is not generated by the plating solution 40, and the sealing groove 31a of the guide portion 31 can be kept liquid-tight for a long period of time. .
- FIG. 7 is a partial schematic view of the plating apparatus 1 for explaining the wraparound of the current line in the conventional plating apparatus 1.
- the plating jig 10 with the wafer 7 mounted on both sides is inserted along the guide portion 31.
- a gap always exists between the plating jig 10 and the inner wall of the guide portion 31.
- the current line 71 wraps around and there is a flow path (gap) in which one plating solution in the plating tank 30 flows into the other, the other wafer is filled with the plating solution that flows into the other due to the wraparound of the current line 71. It becomes difficult to control the plating thickness of the two wafers 7 mounted on both surfaces to be uniform, such as the plating thickness of the surface 7 increases.
- FIG. 8 is a schematic diagram showing a state in which the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention is mounted.
- a guide portion 31 into which the plating jig 10 can be inserted is provided along the inner wall of the plating tank 30, and an expansion seal disposed in the seal groove 31 a of the guide portion 31.
- the member 32 is provided in a U shape.
- the plating jig 10 is inserted along the guide portion 31 until the bottom surface of the plating tank 30 is reached with the wafer 7 to be plated applied on both front and back surfaces.
- the plating jig 10 reaches the bottom surface, the liquid surface 81 of the plating solution 40 is positioned higher than the uppermost point of the wafer 7.
- the expansion seal member 32 is expanded by injecting compressed air from the compressed air joint 36 connected to the compressed air port 35.
- the expansion seal member 32 is brought into close contact with the plating jig 10, and the plating jig 10 is pressed against the guide portion 31 to bring the plating jig 10 into close contact with the guide portion 31.
- the flow path (gap) through which one plating solution 40 flows into the other is cut off, and the occurrence of current line wraparound can be avoided in advance, so that the plating jig 10 is mounted on both front and back surfaces. It becomes easy to control the plating thickness of the two wafers 7 to be uniform.
- FIG. 9 is a partial schematic view showing a state in which the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention is mounted.
- 9A shows a state before the expansion seal member 32 arranged on one side surface 31b1 of the insertion groove 31b of the guide portion 31 expands
- FIG. 9B shows one of the insertion grooves 31b of the guide portion 31. The state where the expansion seal member 32 disposed on the side surface 31b1 is expanded is shown.
- the guide part 31 and the plating provided so that the plating jig 10 can be inserted along the inner wall of the plating tank 30 are plated.
- the gap (flow path) 91 can be cut off in the expansion direction of the expansion seal member 32, one plating solution 40 does not flow into the other. Accordingly, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thicknesses of the two wafers 7 mounted on the front and back surfaces of the plating jig 10 to be uniform. .
- the plating jig 10 can be completely fixed, the plating jig 10 does not move due to stirring, circulation, etc. of the plating solution, and plating abnormalities are unlikely to occur. Can be prevented.
- two wafers to be plated are mounted on both the front and back surfaces of the plating jig, and the anodes facing the two wafer plating surfaces are respectively attached. Even when a plating jig that functions as a cathode is immersed in a plating tank in which a plating solution is stored and plating is performed, the plating jig is provided along the inner wall of the plating tank.
- the two wafers are divided by inflating the expansion seal member arranged on the inner surface of the guide portion into which the wafer can be inserted and pressing against the plating jig inserted into the plating tank.
- One plating solution in the plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
- the plating tank since the plating tank is divided into two for the first time by the expansion seal member after the plating jig is inserted into the plating tank, the plating tank can be handled as one tank at other times. Therefore, it can manage easily so that the density
- the cross-sectional shape of the expansion seal member 32 is not limited to a U shape, and is particularly limited as long as it is a cross-sectional shape that can be filled over the entire region of the sealing groove 31a of the guide portion 31 during expansion, such as an O shape. Is not to be done.
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Abstract
Provided is a plating device that can make plating thickness on two wafers attached to the front and back surfaces of a plating bath jig uniform by preventing occurrences of current lines going around and avoiding unintended plating growth.
In a plating device according to the present invention, two wafers (7) for plating treatment are attached to the front and back surfaces of a plating jig (10), and anodes (20) are provided that face each of the surfaces to be processed of the two wafers (7) that are attached. The plating device is provided with a guide section (31) that is provided along the inside wall of a plating tank (30) for retaining plating fluid and in which the plating jig (10) can be inserted, and an expansion seal member (32) provided on the guide section (31). The two wafers (7) are divided in the tank by making the expansion seal member (32) expand and push on the plating jig (10) that has been inserted in the plating tank (30).
Description
本発明は、いわゆる電流線の回り込みを防ぎ、意図しないめっきの成長を回避することでめっき用治具の表裏両面に装着した２枚のウェハのめっき厚を均一にすることが可能なめっき装置に関する。
The present invention relates to a plating apparatus capable of uniforming the plating thicknesses of two wafers mounted on both front and back surfaces of a plating jig by preventing so-called current line wrapping and avoiding unintended plating growth. .
半導体を実装する基板として用いるウェハの表面には、回路形成のために銅めっきが施される。具体的には、めっき用治具にウェハを装着し、ウェハが装着されためっき用治具の全体をめっき槽内に貯留されている銅等を含むめっき液に浸漬することで、ウェハの表面をめっき処理する。
The surface of a wafer used as a substrate for mounting a semiconductor is plated with copper for circuit formation. Specifically, a wafer is mounted on a plating jig, and the entire surface of the plating jig on which the wafer is mounted is immersed in a plating solution containing copper or the like stored in a plating tank. Is plated.
めっき処理の効率を高めるために、表裏両面にウェハを装着するめっき用治具も多々開発されている。例えば特許文献１には、２枚のウェハのパターン印刷面をそれぞれ外側に向けて装着しためっき用治具を用いて、同時に２枚のウェハのめっき処理を行うことができるウェハのめっき用ラックが開示されている。同時に２枚のウェハのめっき処理を行うことで、全体のスループットを向上させることができる。
In order to increase the efficiency of the plating process, many plating jigs for mounting wafers on both the front and back sides have been developed. For example, Patent Document 1 discloses a wafer plating rack that can perform plating processing of two wafers at the same time by using a plating jig in which the pattern printing surfaces of two wafers are mounted outward. It is disclosed. By simultaneously plating the two wafers, the overall throughput can be improved.
また、特許文献２には、半導体ウェハのパターン印刷面の両面が露出し、しかも給電部がシールされている基板めっき用治具が開示されている。特許文献２では、同時に半導体ウェハの両面のめっき処理を行うことで、全体のスループットを向上させることができる。
Further, Patent Document 2 discloses a substrate plating jig in which both sides of the pattern printing surface of a semiconductor wafer are exposed and the power feeding portion is sealed. In Patent Document 2, it is possible to improve the overall throughput by simultaneously performing plating on both sides of a semiconductor wafer.
しかし、いずれの特許文献もめっき用治具とめっき装置のめっき槽の内壁（底面）との間に隙間が存在し、いわゆる電流線の回り込みが発生する。したがって、電流線が回り込むことにより片方の面に余計にめっき処理が施され、めっき厚を均一にすることが困難になると言う問題点があった。
However, in any of the patent documents, there is a gap between the plating jig and the inner wall (bottom surface) of the plating tank of the plating apparatus, and so-called current lines wrap around. Accordingly, there is a problem in that it is difficult to make the plating thickness uniform by extra plating treatment on one surface due to the wrapping of the current line.
本発明は斯かる事情に鑑みてなされたものであり、いわゆる電流線の回り込みの発生を防ぎ、意図しないめっきの成長を回避することでめっき用治具の表裏両面に装着した２枚のウェハのめっき厚を均一にすることが可能なめっき装置を提供することを目的とする。
The present invention has been made in view of such circumstances, and prevents the occurrence of so-called current line wrapping and avoids unintended plating growth, thereby preventing two wafers mounted on both front and back surfaces of a plating jig. It aims at providing the plating apparatus which can make plating thickness uniform.
上記目的を達成するために本発明に係るめっき装置は、めっき処理の対象となる２枚のウェハをめっき用治具の表裏両面に装着し、装着された２枚のウェハのめっき処理の対象面にそれぞれ対向するアノードを備え、めっき液が貯留されているめっき槽に、カソードとして機能するめっき用治具を浸漬させてめっき処理を実行するめっき装置であって、前記めっき槽の内壁に沿って設けられ、前記めっき用治具を挿入することが可能なガイド部と、該ガイド部に設けられた膨張シール部材とを備え、該膨張シール部材を膨張させて前記めっき槽に挿入された前記めっき用治具に押し当てることにより、２枚のウェハを分槽することを特徴とする。
In order to achieve the above object, a plating apparatus according to the present invention mounts two wafers to be plated on both front and back surfaces of a plating jig, and targets the plating process of the two mounted wafers. A plating apparatus for performing a plating process by immersing a plating jig functioning as a cathode in a plating tank in which a plating solution is stored. The plating is provided with a guide part into which the plating jig can be inserted, and an expansion seal member provided in the guide part, and the expansion seal member is expanded and inserted into the plating tank Two wafers are divided by being pressed against a jig for use.
上記構成では、めっき処理の対象となる２枚のウェハをめっき用治具の表裏両面に装着し、装着された２枚のウェハのめっき処理の対象面にそれぞれ対向するアノードを備え、めっき液が貯留されているめっき槽に、カソードとして機能するめっき用治具を浸漬させてめっき処理を実行する場合であっても、めっき槽の内壁に沿って設けられ、めっき用治具を挿入することが可能なガイド部と、ガイド部に設けられた膨張シール部材とを備え、膨張シール部材を膨張させてめっき槽に挿入されためっき用治具に押し当てることにより、２枚のウェハを分槽するので、分割されためっき槽の一方のめっき液が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具の表裏両面に装着された２枚のウェハのめっき厚が均一になるよう制御することが容易となる。
In the above configuration, the two wafers to be plated are mounted on both the front and back surfaces of the plating jig, the anodes are respectively opposed to the plating surfaces of the two mounted wafers, and the plating solution is Even when a plating jig that functions as a cathode is immersed in a stored plating tank and plating is performed, it is provided along the inner wall of the plating tank, and the plating jig can be inserted. A possible guide part and an expansion seal member provided on the guide part are provided, and the expansion seal member is expanded and pressed against a plating jig inserted into the plating tank to separate the two wafers. Therefore, one plating solution of the divided plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
また、本発明に係るめっき装置は、前記ガイド部は、前記めっき槽の内壁に沿ったシール用溝を有し、前記膨張シール部材は、前記ガイド部の前記シール用溝に埋め込まれた状態で、前記めっき槽に挿入されためっき用治具と前記ガイド部との間に配置されることが好ましい。
Further, in the plating apparatus according to the present invention, the guide portion has a seal groove along the inner wall of the plating tank, and the expansion seal member is embedded in the seal groove of the guide portion. It is preferable to arrange between the jig for plating inserted in the plating tank and the guide portion.
上記構成では、ガイド部は、めっき槽の内壁に沿ったシール用溝を有し、膨張シール部材は、ガイド部のシール用溝に埋め込まれた状態で、めっき槽に挿入されためっき用治具とガイド部との間に配置されるので、めっき用治具及び膨張シール部材、ならびに膨張シール部材及びガイド部を同時にシールすることができ、液密にめっき槽を分割することが可能となる。
In the above configuration, the guide part has a sealing groove along the inner wall of the plating tank, and the expansion seal member is embedded in the sealing groove of the guide part, and the plating jig inserted into the plating tank Therefore, the plating jig and the expansion seal member, and the expansion seal member and the guide portion can be sealed at the same time, and the plating tank can be divided in a liquid-tight manner.
また、本発明に係るめっき装置は、前記膨張シール部材は、断面形状がＵ字形状又はＯ字形状であり、膨張時に前記ガイド部の前記シール用溝の全域にわたって充填されることが好ましい。
In the plating apparatus according to the present invention, it is preferable that the expansion seal member has a U-shaped or O-shaped cross-section and is filled over the entire region of the seal groove of the guide portion during expansion.
上記構成では、膨張シール部材の断面形状がＵ字形状又はＯ字形状であり、膨張時にガイド部のシール用溝の全域にわたって充填されるので、膨張シール部材をめっき槽に挿入されためっき用治具に押し当てることにより２枚のウェハを分槽するので、分割されためっき槽の一方のめっき液が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具の表裏両面に装着された２枚のウェハのめっき厚が均一になるよう制御することが容易となる。
In the above configuration, the expansion seal member has a U-shaped or O-shaped cross-section and is filled over the entire seal groove of the guide portion during expansion. Therefore, the expansion seal member is inserted into the plating tank. Since the two wafers are divided by being pressed against the tool, one plating solution in the divided plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
また、本発明に係るめっき装置は、前記膨張シール部材は、耐薬液性を有する樹脂材で形成されていることが好ましい。
In the plating apparatus according to the present invention, it is preferable that the expansion seal member is formed of a resin material having chemical resistance.
上記構成では、膨張シール部材は、耐薬液性を有する樹脂材で形成されているので、めっき液により腐食等が発生せず、長期間にわたってガイド部の内面を液密に維持することが可能となる。
In the above configuration, the expansion seal member is made of a resin material having chemical resistance, so that corrosion or the like is not generated by the plating solution, and the inner surface of the guide portion can be maintained liquid-tight for a long period of time. Become.
また、本発明に係るめっき装置は、前記ガイド部は、前記めっき用治具の厚みよりも大きい溝幅を有する挿入溝を備え、前記めっき用治具は、前記ガイド部の前記挿入溝に沿って前記めっき槽に挿入されることが好ましい。
In the plating apparatus according to the present invention, the guide portion includes an insertion groove having a groove width larger than the thickness of the plating jig, and the plating jig extends along the insertion groove of the guide portion. It is preferable to be inserted into the plating tank.
上記構成では、ガイド部は、めっき用治具の厚みよりも大きい溝幅を有する挿入溝を備え、めっき用治具は、ガイド部の挿入溝に沿って前記めっき槽に挿入されるので、めっき槽へのめっき用治具の出し入れが容易となる。また、めっき用治具を挿入した後に膨張シール部材を膨張させれば、出し入れする際の膨張シール部材の摩耗を抑制できる。
In the above configuration, the guide portion includes an insertion groove having a groove width larger than the thickness of the plating jig, and the plating jig is inserted into the plating tank along the insertion groove of the guide portion. It becomes easy to put the jig for plating into and out of the bath. Further, if the expansion seal member is expanded after the plating jig is inserted, the wear of the expansion seal member during taking in and out can be suppressed.
また、本発明に係るめっき装置は、前記膨張シール部材は、前記ガイド部の前記挿入溝の一方側面に配置されており、前記膨張シール部材が膨張した場合、前記めっき用治具は、一方を前記膨張シール部材に、他方を前記ガイド部の前記挿入溝の他方側面に、それぞれ押し付けられることが好ましい。
In the plating apparatus according to the present invention, the expansion seal member is disposed on one side surface of the insertion groove of the guide portion, and when the expansion seal member expands, the plating jig It is preferable that the other is pressed against the expansion seal member against the other side surface of the insertion groove of the guide portion.
上記構成では、膨張シール部材は、ガイド部の挿入溝の一方側面に配置されており、膨張シール部材が膨張した場合、めっき用治具は、一方を膨張シール部材に、他方をガイド部の挿入溝の他方側面に、それぞれ押し付けられるので、膨張シール部材の形状に依存することなく、確実にガイド部の内面を液密にすることができ、分割されためっき槽の一方のめっき液が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具の表裏両面に装着された２枚のウェハのめっき厚が均一になるよう制御することが容易となる。また、めっき用治具を完全に固定することができるので、めっき液の撹拌、循環等によりめっき用治具が動くことがなく、めっき異常が生じにくく、２枚のウェハのめっき厚の不均衡を防止することが可能となる。
In the above configuration, the expansion seal member is disposed on one side surface of the insertion groove of the guide portion. When the expansion seal member expands, one of the plating jigs is inserted into the expansion seal member and the other is inserted into the guide portion. Since it is pressed against the other side surface of the groove, the inner surface of the guide portion can be surely liquid-tight without depending on the shape of the expansion seal member, and one plating solution in the divided plating tank is transferred to the other. There is no inflow. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform. In addition, since the plating jig can be completely fixed, the plating jig does not move due to agitation and circulation of the plating solution, and plating abnormalities are unlikely to occur. Can be prevented.
上記構成によれば、めっき処理の対象となる２枚のウェハをめっき用治具の表裏両面に装着し、装着された２枚のウェハのめっき処理の対象面にそれぞれ対向するアノードを備え、めっき液が貯留されているめっき槽に、カソードとして機能するめっき用治具を浸漬させてめっき処理を実行する場合であっても、めっき槽の内壁に沿って設けられ、めっき用治具を挿入することが可能なガイド部と、ガイド部に設けられた膨張シール部材とを備え、膨張シール部材を膨張させてめっき槽に挿入されためっき用治具に押し当てることにより、２枚のウェハを分槽するので、分割されためっき槽の一方のめっき液が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具の表裏両面に装着された２枚のウェハのめっき厚が均一になるよう制御することが容易となる。
According to the above-described configuration, the two wafers to be plated are mounted on both the front and back surfaces of the plating jig, and the anode is provided so as to face each of the two wafers to be plated. Even when plating is performed by immersing a plating jig that functions as a cathode in the plating tank in which the solution is stored, the plating jig is inserted along the inner wall of the plating tank. And an expansion seal member provided on the guide portion. The expansion seal member is expanded and pressed against a plating jig inserted in the plating tank, so that two wafers can be separated. Since it is bathed, one plating solution of the divided plating bath does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。図１は、本発明の実施の形態に係るめっき装置の概要を説明するための模式図である。図１に示すように、本実施の形態に係るめっき装置１は、めっき槽３０にめっき液４０が貯留されている。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram for explaining an outline of a plating apparatus according to an embodiment of the present invention. As shown in FIG. 1, in the plating apparatus 1 according to the present embodiment, a plating solution 40 is stored in a plating tank 30.
めっき槽３０の中央部分において、めっき処理の対象となるウェハ７（図２参照）を表裏両面に保持しためっき用治具１０を、めっき液４０が貯留されているめっき槽３０に出し入れする。めっき用治具１０に保持されているウェハ７のめっき処理の対象面に対向する位置にはアノード（陽極電極）２０が設置されている。直流電源５０の陽極はアノード２０に、カソードとして機能する負極はめっき用治具１０に、それぞれ接続されている。直流電流を供給することにより、表裏両面に保持されているウェハ７の表面にめっき膜が生成される。
In the central portion of the plating tank 30, the plating jig 10 holding the wafer 7 (see FIG. 2) to be plated on both the front and back surfaces is put into and out of the plating tank 30 in which the plating solution 40 is stored. An anode (anode electrode) 20 is installed at a position facing the target surface of the plating process of the wafer 7 held by the plating jig 10. The anode of the DC power supply 50 is connected to the anode 20, and the negative electrode that functions as the cathode is connected to the plating jig 10. By supplying a direct current, a plating film is generated on the surface of the wafer 7 held on both the front and back surfaces.
図２は、本発明の実施の形態に係るめっき装置１のめっき用治具１０の使用状態を示す斜視図である。図２に示すように、本実施の形態に係るめっき装置１のめっき用治具１０は、把持部１１が図示しない搬送ユニットに把持され、めっき槽３０の直上まで移動される。そして、めっき用治具１０を矢印方向に下降させて、めっき処理の対象となるウェハ７を両面に保持した保持ベース１２をめっき槽３０内部に貯留されているめっき液４０へ浸漬させることにより、２枚のウェハ７表面へのめっき処理を実行する。
FIG. 2 is a perspective view showing a usage state of the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention. As shown in FIG. 2, in the plating jig 10 of the plating apparatus 1 according to the present embodiment, the grip portion 11 is gripped by a transport unit (not shown) and is moved to a position directly above the plating tank 30. Then, by lowering the plating jig 10 in the arrow direction and immersing the holding base 12 holding the wafer 7 to be plated on both surfaces in the plating solution 40 stored in the plating tank 30, The plating process on the surface of the two wafers 7 is executed.
めっき槽３０は、めっき装置１に複数設けられる。図３は、本発明の実施の形態に係るめっき装置１のめっき槽３０の一つを上から見た平面図である。図３では、分かりやすくするために、めっき用治具１０を挿入していない状態を示している。
A plurality of plating tanks 30 are provided in the plating apparatus 1. FIG. 3 is a plan view of one of the plating tanks 30 of the plating apparatus 1 according to the embodiment of the present invention as viewed from above. FIG. 3 shows a state where the plating jig 10 is not inserted for easy understanding.
図４は、本発明の実施の形態に係るめっき装置１のめっき槽３０の、図３のガイド部３１近傍Ｄを上から見た部分拡大平面図である。図４に示すように、めっき用治具１０の形状に合わせて、挿入することが可能なガイド部３１を、めっき槽３０の内壁（内側面及び内底面）に沿って備えている。
FIG. 4 is a partially enlarged plan view of the plating tank 30 of the plating apparatus 1 according to the embodiment of the present invention when the vicinity D of the guide portion 31 in FIG. 3 is viewed from above. As shown in FIG. 4, a guide portion 31 that can be inserted in accordance with the shape of the plating jig 10 is provided along the inner wall (inner surface and inner bottom surface) of the plating tank 30.
図３及び図４に示すように、めっき槽３０の内壁に沿って、めっき用治具１０を挿入することが可能なガイド部３１が設けてある。ガイド部３１には、めっき槽３０の内壁に沿ったシール用溝３１ａが設けられている。シール用溝３１ａには、後述する膨張シール部材３２が設けられている。めっき槽３０の内側面におけるガイド部３１は断面形状がＵ字形状であり、めっき用治具１０を挿入することが可能な挿入溝３１ｂを有する。めっき用治具１０は、挿入溝３１ｂに沿ってめっき槽３０に挿入される。挿入溝３１ｂの溝幅は、めっき用治具１０の保持ベース１２の厚みよりも大きい。
As shown in FIGS. 3 and 4, a guide portion 31 into which the plating jig 10 can be inserted is provided along the inner wall of the plating tank 30. The guide portion 31 is provided with a sealing groove 31 a along the inner wall of the plating tank 30. An expansion seal member 32 described later is provided in the seal groove 31a. The guide portion 31 on the inner side surface of the plating tank 30 has a U-shaped cross section and has an insertion groove 31b into which the plating jig 10 can be inserted. The plating jig 10 is inserted into the plating tank 30 along the insertion groove 31b. The groove width of the insertion groove 31 b is larger than the thickness of the holding base 12 of the plating jig 10.
ガイド部３１のシール用溝３１ａには、膨張シール部材３２が埋め込まれた状態となっている。これにより、めっき槽３０に挿入されためっき用治具１０とガイド部３１との間に膨張シール部材３２が配置される。めっき用治具１０とガイド部３１との間に設けられた膨張シール部材３２を膨張させて、めっき槽３０に挿入されためっき用治具１０に押し当てることにより、２枚のウェハ７を分槽することができる。
The expansion seal member 32 is embedded in the seal groove 31a of the guide portion 31. Accordingly, the expansion seal member 32 is disposed between the plating jig 10 inserted in the plating tank 30 and the guide portion 31. The expansion seal member 32 provided between the plating jig 10 and the guide portion 31 is expanded and pressed against the plating jig 10 inserted into the plating tank 30 to separate the two wafers 7. Can be tanked.
これにより、膨張シール部材３２がガイド部３１のシール用溝３１ａの全域にわたって充填されることで、めっき用治具１０で２分割されためっき槽３０の一方のめっき液が他方へ流れ込むことを抑制することができる。したがって、電流線の回り込みの発生を事前に回避することができ、めっき用治具１０の表裏両面に装着された２枚のウェハ７のめっき厚が均一になるよう制御しやすくなる。
Thereby, the expansion seal member 32 is filled over the entire region of the sealing groove 31 a of the guide portion 31, so that one plating solution of the plating tank 30 divided by the plating jig 10 is prevented from flowing into the other. can do. Therefore, the occurrence of the wraparound of the current line can be avoided in advance, and it becomes easy to control the plating thickness of the two wafers 7 mounted on both the front and back surfaces of the plating jig 10 to be uniform.
図５は、本発明の実施の形態に係るめっき装置１の膨張シール部材３２の構成を示す斜視図である。図５に示すように、本実施の形態に係るめっき装置１の膨張シール部材３２は、めっき槽３０の内壁に沿って形成されているガイド部３１の形状に合わせて、Ｕ字形状に形成されている。
FIG. 5 is a perspective view showing a configuration of the expansion seal member 32 of the plating apparatus 1 according to the embodiment of the present invention. As shown in FIG. 5, the expansion seal member 32 of the plating apparatus 1 according to the present embodiment is formed in a U shape in accordance with the shape of the guide portion 31 formed along the inner wall of the plating tank 30. ing.
そして、膨張シール部材３２は、断面形状もＵ字形状に形成されており、Ｕ字形状の開口側から内部へ流体（例えば圧縮空気）を注入することが可能な圧空口３５を備えている。図６は、本発明の実施の形態に係るめっき装置１の膨張シール部材３２の図５のＡ－Ａ矢視図である。
The expansion seal member 32 is also formed in a U-shaped cross section, and includes a compressed air port 35 through which fluid (for example, compressed air) can be injected from the U-shaped opening side. FIG. 6 is a view of the expansion seal member 32 of the plating apparatus 1 according to the embodiment of the present invention as seen in the direction of arrows AA in FIG.
圧空口３５から圧縮空気が注入された場合、膨張シール部材３２が図６に示す矢印Ｓ方向及び矢印Ｆ方向に膨張する。矢印Ｓ方向への膨張により、ガイド部３１に設けられた膨張シール部材３２とガイド部３１とがシールされる。矢印Ｆ方向への膨張により、膨張シール部材３２とめっき用治具１０とがシールされる。その結果、めっき用治具１０とめっき槽３０と膨張シール部材３２との間を液密状態とすることができる。なお、本実施の形態で用いる膨張シール部材３２は、矢印Ｓ方向よりも矢印Ｆ方向への膨張量が大きくなるように設計されている。
When compressed air is injected from the compressed air port 35, the expansion seal member 32 expands in the arrow S direction and the arrow F direction shown in FIG. By the expansion in the arrow S direction, the expansion seal member 32 provided in the guide portion 31 and the guide portion 31 are sealed. By the expansion in the direction of arrow F, the expansion seal member 32 and the plating jig 10 are sealed. As a result, the plating jig 10, the plating tank 30, and the expansion seal member 32 can be in a liquid-tight state. The expansion seal member 32 used in the present embodiment is designed so that the expansion amount in the arrow F direction is larger than the arrow S direction.
膨張シール部材３２は、耐薬品性を有する素材で形成されていることが好ましい。例えばシリコン系ゴム、あるいはフッ素系ゴム等で形成されることにより、めっき液４０により腐食等が発生せず、長期間にわたってガイド部３１のシール用溝３１ａを液密に維持することが可能となる。
The expansion seal member 32 is preferably formed of a material having chemical resistance. For example, by being formed of silicon rubber, fluorine rubber, or the like, corrosion or the like is not generated by the plating solution 40, and the sealing groove 31a of the guide portion 31 can be kept liquid-tight for a long period of time. .
図７は、従来のめっき装置１での電流線の回り込みを説明するためのめっき装置１の部分模式図である。図７に示すように、両面にウェハ７を装着しためっき用治具１０を、ガイド部３１に沿って挿入する。従来は、めっき用治具１０とガイド部３１の内壁との間に隙間が必ず存在する。
FIG. 7 is a partial schematic view of the plating apparatus 1 for explaining the wraparound of the current line in the conventional plating apparatus 1. As shown in FIG. 7, the plating jig 10 with the wafer 7 mounted on both sides is inserted along the guide portion 31. Conventionally, a gap always exists between the plating jig 10 and the inner wall of the guide portion 31.
したがって、電流線７１の回り込みが発生し、めっき槽３０の一方のめっき液が他方へと流れ込む流路（隙間）が存在するので、電流線７１の回り込みによって他方へ流れ込んだめっき液で他方のウェハ７の面のめっき厚が厚みを増す等、両面に装着された２枚のウェハ７のめっき厚が均一になるよう制御することが困難になる。
Accordingly, since the current line 71 wraps around and there is a flow path (gap) in which one plating solution in the plating tank 30 flows into the other, the other wafer is filled with the plating solution that flows into the other due to the wraparound of the current line 71. It becomes difficult to control the plating thickness of the two wafers 7 mounted on both surfaces to be uniform, such as the plating thickness of the surface 7 increases.
それに対して、図８は、本発明の実施の形態に係るめっき装置１のめっき用治具１０を装着した状態を示す模式図である。図８に示すように、めっき槽３０の内壁に沿って、めっき用治具１０を挿入することが可能なガイド部３１が設けてあり、ガイド部３１のシール用溝３１ａに配置された膨張シール部材３２をＵ字形状に設けてある。
On the other hand, FIG. 8 is a schematic diagram showing a state in which the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention is mounted. As shown in FIG. 8, a guide portion 31 into which the plating jig 10 can be inserted is provided along the inner wall of the plating tank 30, and an expansion seal disposed in the seal groove 31 a of the guide portion 31. The member 32 is provided in a U shape.
めっき用治具１０は、表裏両面にめっき処理の対象となるウェハ７を装着した状態で、めっき槽３０の底面に達するまで、ガイド部３１に沿って挿入される。めっき用治具１０が底面に到達した状態ではめっき液４０の液面８１は、ウェハ７の最上点よりも高い位置となる。
The plating jig 10 is inserted along the guide portion 31 until the bottom surface of the plating tank 30 is reached with the wafer 7 to be plated applied on both front and back surfaces. When the plating jig 10 reaches the bottom surface, the liquid surface 81 of the plating solution 40 is positioned higher than the uppermost point of the wafer 7.
そして、圧空口３５に繋がる圧空用継手３６から圧縮空気を注入することにより、膨張シール部材３２を膨張させる。これにより、膨張シール部材３２をめっき用治具１０に密着させるとともに、めっき用治具１０をガイド部３１に押し付け、めっき用治具１０をガイド部３１に密着させる。その結果、一方のめっき液４０が他方へと流れ込む流路（隙間）が断たれ、電流線の回り込みの発生を事前に回避することができるので、めっき用治具１０の表裏両面に装着された２枚のウェハ７のめっき厚が均一になるよう制御することが容易となる。
Then, the expansion seal member 32 is expanded by injecting compressed air from the compressed air joint 36 connected to the compressed air port 35. As a result, the expansion seal member 32 is brought into close contact with the plating jig 10, and the plating jig 10 is pressed against the guide portion 31 to bring the plating jig 10 into close contact with the guide portion 31. As a result, the flow path (gap) through which one plating solution 40 flows into the other is cut off, and the occurrence of current line wraparound can be avoided in advance, so that the plating jig 10 is mounted on both front and back surfaces. It becomes easy to control the plating thickness of the two wafers 7 to be uniform.
また、膨張シール部材３２は、ガイド部３１の挿入溝３１ｂの一方側面に配置されていても良い。図９は、本発明の実施の形態に係るめっき装置１のめっき用治具１０を装着した状態を示す部分模式図である。図９（ａ）は、ガイド部３１の挿入溝３１ｂの一方側面３１ｂ１に配置された膨張シール部材３２が膨張する前の状態を、図９（ｂ）は、ガイド部３１の挿入溝３１ｂの一方側面３１ｂ１に配置された膨張シール部材３２が膨張した状態を、それぞれ示している。
Further, the expansion seal member 32 may be disposed on one side surface of the insertion groove 31 b of the guide portion 31. FIG. 9 is a partial schematic view showing a state in which the plating jig 10 of the plating apparatus 1 according to the embodiment of the present invention is mounted. 9A shows a state before the expansion seal member 32 arranged on one side surface 31b1 of the insertion groove 31b of the guide portion 31 expands, and FIG. 9B shows one of the insertion grooves 31b of the guide portion 31. The state where the expansion seal member 32 disposed on the side surface 31b1 is expanded is shown.
図９（ａ）に示すように、膨張シール部材３２が膨張する前の状態では、めっき槽３０の内壁に沿ってめっき用治具１０を挿入することが可能に設けてあるガイド部３１とめっき用治具１０との間には隙間９１が存在する。そこで、図９（ｂ）に示すように、膨張シール部材３２を膨張させた場合、めっき用治具１０は、一方が膨張シール部材３２に、他方がガイド部３１の挿入溝３１ｂの他方側面３１ｂ２に、それぞれ押し付けられる。
As shown in FIG. 9A, in the state before the expansion seal member 32 expands, the guide part 31 and the plating provided so that the plating jig 10 can be inserted along the inner wall of the plating tank 30 are plated. There is a gap 91 between the jig 10. 9B, when the expansion seal member 32 is expanded, one of the plating jigs 10 is the expansion seal member 32 and the other is the other side surface 31b2 of the insertion groove 31b of the guide portion 31. Respectively.
したがって、膨張シール部材３２の膨張方向において隙間（流路）９１を断つことができるので、一方のめっき液４０が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具１０の表裏両面に装着された２枚のウェハ７のめっき厚が均一になるよう制御することが容易となる。
Therefore, since the gap (flow path) 91 can be cut off in the expansion direction of the expansion seal member 32, one plating solution 40 does not flow into the other. Accordingly, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thicknesses of the two wafers 7 mounted on the front and back surfaces of the plating jig 10 to be uniform. .
また、めっき用治具１０を完全に固定することができるので、めっき液の撹拌、循環等によりめっき用治具１０が動くことがなく、めっき異常が生じにくく、２枚のウェハ７のめっき厚の不均衡を防止することが可能となる。
In addition, since the plating jig 10 can be completely fixed, the plating jig 10 does not move due to stirring, circulation, etc. of the plating solution, and plating abnormalities are unlikely to occur. Can be prevented.
以上のように本実施の形態によれば、めっき処理の対象となる２枚のウェハをめっき用治具の表裏両面に装着し、２枚のウェハのめっき処理の対象面にそれぞれ対向するアノードを備え、めっき液が貯留されているめっき槽に、カソードとして機能するめっき用治具を浸漬させてめっき処理を実行する場合であっても、めっき槽の内壁に沿って設けられ、めっき用治具を挿入することが可能なガイド部の内面に配置された膨張シール部材を膨張させてめっき槽に挿入されためっき用治具に押し当てることにより、２枚のウェハを分槽するので、分割されためっき槽の一方のめっき液が他方へ流れ込むことがない。したがって、電流線の回り込みの発生を事前に回避することができるので、めっき用治具の表裏両面に装着された２枚のウェハのめっき厚が均一になるよう制御することが容易となる。
As described above, according to the present embodiment, two wafers to be plated are mounted on both the front and back surfaces of the plating jig, and the anodes facing the two wafer plating surfaces are respectively attached. Even when a plating jig that functions as a cathode is immersed in a plating tank in which a plating solution is stored and plating is performed, the plating jig is provided along the inner wall of the plating tank. The two wafers are divided by inflating the expansion seal member arranged on the inner surface of the guide portion into which the wafer can be inserted and pressing against the plating jig inserted into the plating tank. One plating solution in the plating tank does not flow into the other. Therefore, since the occurrence of the wraparound of the current line can be avoided in advance, it becomes easy to control the plating thickness of the two wafers mounted on the front and back surfaces of the plating jig to be uniform.
また、めっき用治具をめっき槽に挿入した後、膨張シール部材によって初めてめっき槽を２つに分割するので、それ以外の時間はめっき槽を１つの槽として扱うことができる。そのため、分割されるそれぞれのめっき槽内のめっき液の濃度や組成が同じ状態になるように容易に管理することができる。
In addition, since the plating tank is divided into two for the first time by the expansion seal member after the plating jig is inserted into the plating tank, the plating tank can be handled as one tank at other times. Therefore, it can manage easily so that the density | concentration and composition of the plating solution in each plating tank divided | segmented may become the same state.
その他、上述した実施の形態は、本発明の趣旨を逸脱しない範囲で変更することができることは言うまでもない。例えば膨張シール部材３２の断面形状はＵ字形状に限定されるものではなく、Ｏ字形状等、膨張時にガイド部３１のシール用溝３１ａの全域にわたって充填することができる断面形状であれば特に限定されるものではない。
In addition, it goes without saying that the embodiment described above can be changed without departing from the spirit of the present invention. For example, the cross-sectional shape of the expansion seal member 32 is not limited to a U shape, and is particularly limited as long as it is a cross-sectional shape that can be filled over the entire region of the sealing groove 31a of the guide portion 31 during expansion, such as an O shape. Is not to be done.
１ めっき装置
７ ウェハ
１０ めっき用治具
２０ アノード（陽極電極）
３０ めっき槽
３１ ガイド部
３１ａ シール用溝
３１ｂ 挿入溝
３２ 膨張シール部材
７１ 電流線 DESCRIPTION OFSYMBOLS 1 Plating apparatus 7 Wafer 10 Jig for plating 20 Anode (anode electrode)
Reference Signs List 30 plating tank 31 guide portion 31a sealing groove 31b insertion groove 32 expansion seal member 71 current line
７ ウェハ
１０ めっき用治具
２０ アノード（陽極電極）
３０ めっき槽
３１ ガイド部
３１ａ シール用溝
３１ｂ 挿入溝
３２ 膨張シール部材
７１ 電流線 DESCRIPTION OF
Claims (6)
- めっき処理の対象となる２枚のウェハをめっき用治具の表裏両面に装着し、
装着された２枚のウェハのめっき処理の対象面にそれぞれ対向するアノードを備え、
めっき液が貯留されているめっき槽に、カソードとして機能するめっき用治具を浸漬させてめっき処理を実行するめっき装置であって、
前記めっき槽の内壁に沿って設けられ、前記めっき用治具を挿入することが可能なガイド部と、
該ガイド部に設けられた膨張シール部材と
を備え、該膨張シール部材を膨張させて前記めっき槽に挿入された前記めっき用治具に押し当てることにより、２枚のウェハを分槽することを特徴とするめっき装置。 Attach two wafers to be plated on both the front and back sides of the plating jig,
Provided with anodes facing the target surfaces of the two wafers mounted, respectively,
A plating apparatus that performs a plating process by immersing a plating jig functioning as a cathode in a plating tank in which a plating solution is stored,
A guide portion provided along the inner wall of the plating tank, and capable of inserting the plating jig;
An expansion seal member provided on the guide portion, and expanding the expansion seal member and pressing the plating jig inserted into the plating tank to divide the two wafers. Features plating equipment. - 前記ガイド部は、前記めっき槽の内壁に沿ったシール用溝を有し、
前記膨張シール部材は、前記ガイド部の前記シール用溝に埋め込まれた状態で、前記めっき槽に挿入されためっき用治具と前記ガイド部との間に配置されることを特徴とする請求項１に記載のめっき装置。 The guide portion has a sealing groove along the inner wall of the plating tank,
The expansion seal member is disposed between the guide jig and the plating jig inserted into the plating tank in a state of being embedded in the seal groove of the guide part. The plating apparatus according to 1. - 前記膨張シール部材は、断面形状がＵ字形状又はＯ字形状であり、膨張時に前記ガイド部の前記シール用溝の全域にわたって充填されることを特徴とする請求項２に記載のめっき装置。 The plating apparatus according to claim 2, wherein the expansion seal member has a U-shaped or O-shaped cross-section and is filled over the entire area of the sealing groove of the guide portion during expansion.
- 前記膨張シール部材は、耐薬液性を有する樹脂材で形成されていることを特徴とする請求項１乃至３のいずれか一項に記載のめっき装置。 The plating apparatus according to any one of claims 1 to 3, wherein the expansion seal member is formed of a resin material having chemical resistance.
- 前記ガイド部は、前記めっき用治具の厚みよりも大きい溝幅を有する挿入溝を備え、
前記めっき用治具は、前記ガイド部の前記挿入溝に沿って前記めっき槽に挿入されることを特徴とする請求項１乃至４のいずれか一項に記載のめっき装置。 The guide portion includes an insertion groove having a groove width larger than the thickness of the plating jig,
The plating apparatus according to any one of claims 1 to 4, wherein the plating jig is inserted into the plating tank along the insertion groove of the guide portion. - 前記膨張シール部材は、前記ガイド部の前記挿入溝の一方側面に配置されており、
前記膨張シール部材が膨張した場合、前記めっき用治具は、一方を前記膨張シール部材に、他方を前記ガイド部の前記挿入溝の他方側面に、それぞれ押し付けられることを特徴とする請求項５に記載のめっき装置。 The expansion seal member is disposed on one side surface of the insertion groove of the guide portion,
6. The plating jig according to claim 5, wherein when the expansion seal member is expanded, one of the plating jigs is pressed against the expansion seal member and the other is pressed against the other side surface of the insertion groove of the guide portion. The plating apparatus as described.
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| JP2016529499A JP6369544B2 (en) | 2014-06-27 | 2015-06-18 | Plating equipment |
| KR1020167035905A KR101866675B1 (en) | 2014-06-27 | 2015-06-18 | Plating device |
| CN201580033874.XA CN106460223B (en) | 2014-06-27 | 2015-06-18 | Electroplanting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180223444A1 (en) * | 2017-02-08 | 2018-08-09 | Ebara Corporation | Plating apparatus and substrate holder used together with plating apparatus |
| CN114990648A (en) * | 2022-06-21 | 2022-09-02 | 广东捷盟智能装备有限公司 | Lithium equipment in advance of pole piece |
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| WO2022254579A1 (en) * | 2021-06-01 | 2022-12-08 | 株式会社荏原製作所 | Plating device and plating method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094737A (en) * | 1983-10-28 | 1985-05-27 | Matsushita Electric Works Ltd | Manufacture of semiconductor device |
| JPH07243097A (en) * | 1994-03-07 | 1995-09-19 | Electroplating Eng Of Japan Co | Wafer plating rack and plating method using the rack |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3342381B2 (en) * | 1997-12-26 | 2002-11-05 | キヤノン株式会社 | Anodizing equipment |
| JP4821067B2 (en) * | 2001-08-01 | 2011-11-24 | ソニー株式会社 | Anodizing apparatus, method for forming porous layer using the same, and method for producing semiconductor thin film |
| JP2006283157A (en) * | 2005-04-01 | 2006-10-19 | Showa Denko Kk | Tool for surface treatment and surface treatment method |
| JP4764899B2 (en) | 2008-04-25 | 2011-09-07 | 株式会社荏原製作所 | Substrate plating jig, substrate plating equipment |
| JP4927789B2 (en) * | 2008-06-06 | 2012-05-09 | 株式会社荏原製作所 | Contact seal, wafer holder and plating equipment |
| JP5398223B2 (en) * | 2008-10-23 | 2014-01-29 | 上村工業株式会社 | Gate device for treatment tank |
| US9228270B2 (en) * | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| CN102936744B (en) * | 2012-11-29 | 2015-04-29 | 成都瑞迪机械实业有限公司 | Chromium plating fixture for hole parts |
-
2015
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094737A (en) * | 1983-10-28 | 1985-05-27 | Matsushita Electric Works Ltd | Manufacture of semiconductor device |
| JPH07243097A (en) * | 1994-03-07 | 1995-09-19 | Electroplating Eng Of Japan Co | Wafer plating rack and plating method using the rack |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180223444A1 (en) * | 2017-02-08 | 2018-08-09 | Ebara Corporation | Plating apparatus and substrate holder used together with plating apparatus |
| CN108396360A (en) * | 2017-02-08 | 2018-08-14 | 株式会社荏原制作所 | Electroplanting device, substrate holder, electro-plating method, computer program and the storage medium being used together with electroplanting device |
| JP2018129387A (en) * | 2017-02-08 | 2018-08-16 | 株式会社荏原製作所 | Plating apparatus and substrate holder used with plating apparatus |
| TWI763762B (en) * | 2017-02-08 | 2022-05-11 | 日商荏原製作所股份有限公司 | Plating apparatus and substrate holder used together with plating apparatus |
| CN114990648A (en) * | 2022-06-21 | 2022-09-02 | 广东捷盟智能装备有限公司 | Lithium equipment in advance of pole piece |
| CN114990648B (en) * | 2022-06-21 | 2023-03-24 | 广东捷盟智能装备有限公司 | Electroplating lithium pre-preparing equipment for pole piece |
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| JP6369544B2 (en) | 2018-08-08 |
| KR101866675B1 (en) | 2018-06-11 |
| JPWO2015198955A1 (en) | 2017-04-27 |
| CN106460223B (en) | 2018-09-28 |
| CN106460223A (en) | 2017-02-22 |
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