WO2015190234A1 - Adhesive tape, article, and motor - Google Patents

Adhesive tape, article, and motor Download PDF

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Publication number
WO2015190234A1
WO2015190234A1 PCT/JP2015/064266 JP2015064266W WO2015190234A1 WO 2015190234 A1 WO2015190234 A1 WO 2015190234A1 JP 2015064266 W JP2015064266 W JP 2015064266W WO 2015190234 A1 WO2015190234 A1 WO 2015190234A1
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WO
WIPO (PCT)
Prior art keywords
layer
adhesive
adhesive tape
thickness
composition
Prior art date
Application number
PCT/JP2015/064266
Other languages
French (fr)
Japanese (ja)
Inventor
誠二 秋山
森野　彰規
Original Assignee
Dic株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dic株式会社 filed Critical Dic株式会社
Priority to JP2016527712A priority Critical patent/JP6108033B2/en
Publication of WO2015190234A1 publication Critical patent/WO2015190234A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/27—Rotor cores with permanent magnets

Definitions

  • the present invention relates to an adhesive tape having a structure capable of expanding its volume in the thickness direction by giving a stimulus such as heating.
  • the adhesive tape can be suitably used for fixing one adherend to a flat surface portion or a curved surface portion of the other adherend, so that various products such as automobiles and electric devices can be manufactured. Widely used in the scene.
  • the adhesive tape is required to be used when, for example, the other adherend is fixed in the gap of one adherend.
  • a motor mounted on a hybrid vehicle or the like a motor having a configuration in which a gap is generally provided at a predetermined position of a core (rotor core) and a magnet is embedded in the gap is known. Yes.
  • the use of an adhesive tape is being studied when fixing the magnet in the gap of the core portion.
  • the adhesive tape that can be used in the above application is formed on the first surface of the base material having a first surface and a second surface on the opposite side of the first surface and having a communication port, for example.
  • a first adhesive layer containing a thermosetting thermally expandable epoxy adhesive, and the thermosetting thermally expandable epoxy adhesive passes through the communication port of the substrate when heated, and
  • a thermosetting thermally expandable adhesive sheet that forms a second adhesive layer on the second surface is known (see, for example, Patent Document 1).
  • fine irregularities may be formed on the surface of the second adhesive layer due to the thermal expansion.
  • the second adhesive layer having the surface on which the fine irregularities are formed cannot exhibit a sufficient adhesive force to the adherend.
  • the adhesive sheet as described above when the adhesive sheet as described above is simply placed or inserted into the gap of the adherend and is expanded to fill the gap, the adhesive sheet is expanded. As a result, fine irregularities are formed in the adhesive layers on both sides, and as a result, the gap is not sufficiently fixed in the gap and the gap may not be filled.
  • the problem to be solved by the present invention is to provide an adhesive tape that can maintain excellent adhesive strength even after the expansion, among adhesive tapes that can expand by stimulation such as heating.
  • the present inventors have an adhesive tape having an adhesive layer (B) on both sides of the layer (A) directly or via another layer, and the adhesive tape is left in an environment of 130 ° C. for 1 hour.
  • the expansion coefficient in the thickness direction of the layer (A) [the thickness of the layer (A) after being left / the thickness of the layer (A) before being left] ⁇ 100 is 200% or more
  • the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the thickness of the adhesive layer (B) before being left] ⁇ 100 is 120%
  • the adhesive tape of the present invention can maintain an excellent adhesive strength even after being expanded, it can be used for fixing two or more adherends, and in addition, the other adherend can be placed in the gap of one adherend. It can be suitably used for applications such as fixing the adherend and filling the voids of the adherend with the adhesive tape.
  • the adhesive tape of the present invention can follow the fine irregularities due to the expansion even when the adherend has minute irregularities and gaps, and as a result, exhibits excellent adhesive strength. Can do. Further, the adhesive tape of the present invention can be filled or filled in the gap by simply placing or inserting it into the gap of the adherend and expanding it. The production efficiency can be improved.
  • the adhesive tape of the present invention is less likely to cause variations in the adhesive strength even when the expansion coefficient is appropriately changed.
  • the adhesive tape of the present invention is an adhesive tape having an adhesive layer (B) on both sides of the layer (A) directly or via another layer, and the adhesive tape is placed in an environment of 130 ° C. for 1 hour.
  • the expansion coefficient in the thickness direction of the layer (A) after being left [the thickness of the layer (A) after being left / the thickness of the layer (A) before being left] ⁇ 100 is 200% or more.
  • the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the thickness of the adhesive layer (B) before being left) ⁇ 100 is 120. % Or less.
  • the layer (A) constituting the adhesive tape is a layer that can expand by applying a stimulus such as heat or light.
  • the coefficient of expansion in the thickness direction of the layer (A) [the thickness of the layer (A) after being left / The thickness of the layer (A) before leaving] ⁇ 100 is 200% or more.
  • the expansion coefficient is preferably 250% or more, and more preferably 250% to 1000%. If the adhesive tape has the expansion coefficient layer (A), for example, even if the height (thickness) of the gap of one adherend is large, the other adherend is placed in the gap. It can be suitably fixed, or the gap can be filled with the adhesive tape.
  • the expansion rate is the ratio of the layer (A) after being left to the thickness of the layer (A) before being left (before expansion) when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of thickness (thickness of the layer (A ′) formed by expansion).
  • the expansion coefficient indicates a value calculated by the following method.
  • the thickness of the layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left is taken out in an environment of 23 ° C., and the thickness of the layer (A ′) formed by the layer (A) expanding immediately is measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [Thickness of the layer (A) constituting the adhesive tape after standing] [Thickness of the layer (A ′) formed by swelling] / Thickness of the layer (A) constituting the adhesive tape before standing] ⁇ 100
  • the thickness of the layer (A) constituting the adhesive tape is preferably 1 ⁇ m or more, preferably in the range of 10 ⁇ m to 250 ⁇ m, more preferably in the range of 20 ⁇ m to 150 ⁇ m, and more preferably in the range of 30 ⁇ m to 70 ⁇ m. The range is more preferable for obtaining a further excellent adhesive strength.
  • the thickness of the layer (A ′) formed by expanding the layer (A) is preferably in the range of 20 ⁇ m to 2500 ⁇ m, and more preferably in the range of 40 ⁇ m to 1500 ⁇ m. It is preferable when obtaining adhesive strength.
  • the layer (A ′) preferably has a porous structure.
  • the thickness of the said layer (A) is 10% or more with respect to the total thickness of the said adhesive tape, and uses what is 30% or more. It is more preferable because the other adherend can be suitably fixed in the gap of one adherend or the gap can be filled with the adhesive tape.
  • said layer (A) which comprises the adhesive tape of this invention what can expand
  • the layer (A) can be formed, for example, by applying a composition (a) containing the resin and an expanding agent to a release liner or the like and drying or curing.
  • composition (a) that can be used for forming the layer (A), as described above a composition containing a resin, an expanding agent, and a solvent as required can be used.
  • the resin examples include an epoxy resin, a urethane resin, a silicone resin, a phenol resin, a urea resin, a fluororesin, an acrylonitrile resin, an acrylic resin, a styrene resin, a vinyl resin such as a butadiene resin, etc., alone or in combination. can do.
  • thermosetting resin As the resin, it is preferable to use a thermosetting resin as the resin, and the use of an epoxy resin is excellent in heat resistance after expansion, and the expanded layer (A ′) shrinks remarkably with time. It is more preferable to obtain an adhesive tape that can prevent this.
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hindered-in type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, and phenol novolac.
  • Type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, dicyclopentadiene / phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modification (carboxy-terminated butadiene nitrile modification) Halogen-modified epoxy resins or the like can be used alone or in combination of two or more, and the use of a cresol novolac type epoxy resin can be caused by the stimulation. Expansion easy, and preferable because it can hold the adhesive strength is excellent even after expansion.
  • thermosetting resin such as the epoxy resin is preferably contained in an amount of 10% by mass to 99% by mass with respect to the entire layer (A).
  • composition (a) it is preferable to use a composition containing a swelling agent in forming the layer (A) that can be swollen by the stimulus.
  • the expansion agent it is preferable to use a layer that can form a porous structure as the layer (A ′) after expansion.
  • inorganic compounds such as ammonium carbonate, ammonium hydrogen carbonate, ammonium nitrite, ammonium borohydride, azide, etc.
  • Fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as paratoluenesulfonyl hydrazide, semicarbazide compounds such as p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2,3 Triazole compounds such as 1,4-thiatriazole and N-nitroso compounds such as N, N′-dinitrosotephthalamide can be used.
  • azo compounds such as azobisisobutyronitrile
  • hydrazine compounds such as paratoluenesulfonyl hydrazide
  • semicarbazide compounds such as p-toluenesulfonyl semicarbazide
  • 5-morpholyl-1,2,3 Triazole compounds such as 1,4-thiatriazole and N-nitroso compounds such as N, N′-
  • expansion agent for example, heat obtained by microencapsulating a hydrocarbon-based solvent can use an expandable capsule such as an expandable capsule.
  • expansion agent it is preferable to use a material capable of generating gas and expanding at a temperature around the softening point of the resin.
  • expansion agent use of a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated among the above-described ones, for example, inhibits the curing of the epoxy resin or the layer (A) due to the influence of heat or the like. This is preferable for preventing deterioration and the like.
  • thermally expandable capsule it is preferable to use a capsule whose volume after expansion (volume expansion coefficient) is 8 to 60 times the volume of the capsule before expansion.
  • thermal expandable capsule examples include EXPANSEL (manufactured by Nippon Philite Co., Ltd.), Matsumoto Microsphere (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), and Microsphere (manufactured by Kureha Co., Ltd.).
  • the amount of the expansion agent used is preferably in the range of 0.3% by mass to 40% by mass with respect to the total amount of the layer (A). More preferably, the range is from 30% by mass to 30% by mass, and the range from 3.0% by mass to 20% by mass expands to a sufficient volume for filling the voids of the adherend. It is preferable for obtaining an adhesive tape that can be maintained and can maintain an even better adhesive strength.
  • composition (a) a composition containing a curing agent, a curing accelerator or the like can be used as necessary in addition to the above-described one.
  • curing agent examples include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methyl resorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin.
  • phenol resins such as terpene phenol resin, naphthol novolac resin, biphenyl phenol resin, polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, glyoxal, And modified phenols obtained by polycondensation of heavy oil or pitch, phenol and formaldehyde compounds
  • phenolic resins such as methyl resin, acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride and methylnadic acid, amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide Etc.
  • amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, dia
  • curing accelerator examples include imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole; 1,8-diazabicyclo [5.4.0] undecene-7, triethylenediamine, benzyl Tertiary amines such as dimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole
  • 1,8-diazabicyclo [5.4.0] undecene-7 triethylenediamine
  • benzyl Tertiary amines such as dimethylamine
  • organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
  • the adhesive tape one having an adhesive layer (B) on both sides of the layer (A) is used.
  • the adhesive layer (B) may be directly laminated on the surface of the layer (A), or may be laminated via another layer such as a resin film layer or a metal layer.
  • the expansion rate in the thickness direction of the adhesive layer (B) [the adhesive layer after being left ( B) thickness / thickness of adhesive layer (B) before standing] ⁇ 100 is 120% or less.
  • the expansion rate of the adhesive layer (B) is preferably 115% or less, and more preferably 100% to 115%.
  • the adhesive tape having the adhesive layer (B) having the expansion coefficient can maintain excellent adhesive strength to the adherend even after the layer (A) has expanded.
  • the expansion rate of the adhesive layer (B) is such that, when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the thickness of the adhesive layer (B) before being left is not changed. It refers to the ratio of the thickness of the adhesive layer.
  • the expansion rate of the adhesive layer (B) is the ratio of the adhesive layer (B) after being left with respect to the thickness of the adhesive layer (B) before being left when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of the thickness of the adhesive layer (B ′).
  • the expansion coefficient indicates a value calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
  • the adhesive tape after being left is taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) is immediately measured.
  • the expansion coefficient is calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100
  • the total thickness of the adhesive layer (B) is preferably in the range of 5 ⁇ m to 150 ⁇ m, and more preferably in the range of 10 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength.
  • the thickness of the adhesive layer (B ′) after being left for 1 hour in the environment of 130 ° C. varies within the above expansion coefficient range as compared with the thickness of the adhesive layer (B) before being left standing. However, it is preferable that the change be as small as possible in order to maintain excellent adhesive strength.
  • the total thickness of the adhesive layer (B ′) is preferably in the range of 5 ⁇ m to 150 ⁇ m, and more preferably in the range of 10 ⁇ m to 100 ⁇ m, in order to express even better adhesive strength. .
  • examples of the adhesive layer (B) include a layer having tackiness or adhesiveness, and examples thereof include a thermosetting adhesive layer and a pressure-sensitive adhesive layer.
  • the adhesive layer (B) can be formed using an adhesive (b) capable of forming a sticky or adhesive layer.
  • the adhesive (b) for example, an adhesive resin and, if necessary, a hardener can be used. Since the adhesive layer (B) formed using the adhesive (b) preferably has a low expansion coefficient as described above, it is exemplified as one that can be used when forming the layer (A). It is preferable that the expanded agent is substantially not contained.
  • the adhesive resin that can be used for the adhesive (b) a conventionally known resin can be selected and used.
  • a thermosetting resin or a pressure-sensitive adhesive resin can be used.
  • the adhesive resin in order to improve the production efficiency of the adhesive tape of the present invention, for example, those exemplified as the resin contained in the composition (a) that can be used for forming the layer (A) A similar one can be used.
  • an adhesive tape having an adhesive layer (B) a thermosetting resin is preferably used, and an epoxy resin is more preferably used.
  • the epoxy resin it is possible to use the same resin as that exemplified for the composition (a) as well as the same as that used for the adherend even after the layer (A) is expanded. On the other hand, it is preferable to obtain an adhesive tape having an adhesive layer (B) that can maintain excellent adhesive strength and can maintain excellent adhesive strength regardless of the influence of heat.
  • a material containing a curing agent, a curing accelerator or the like can be used as necessary in addition to the above-described ones.
  • curing agent and hardening accelerator the thing similar to what was illustrated as a hardening
  • a coupling agent in addition to those described above, a coupling agent, a tackifier, an antifoaming agent, a pigment, an antioxidant, a core-shell type reinforcing agent, a thixotropic agent, a heat conduction agent, if necessary.
  • a material containing a conductive filler, an insulating filler, or the like may be used.
  • the adhesive tape of the present invention is, for example, separate from the step [1] and the step [1] in which the layer (A) is formed by applying the composition (a) to a release liner and drying. b) is applied to a release liner and dried to form an adhesive layer (B) [2], and the adhesive layer (B) is transferred to both sides of the layer (A), Can be manufactured through the step [3] of pressure bonding or the like.
  • a part of the layer (A) may be cured in the process of producing the adhesive tape, but it is preferable that the layer (A) is not substantially expanded or cured.
  • a part of the adhesive layer (B) may also be cured in the process of producing the adhesive tape, but it is preferable that the adhesive layer (B) is not substantially cured.
  • an adhesive tape of this invention what has the layer (C) which consists of a resin film layer or a metal between the said layer (A) and an adhesive bond layer (B) as needed can be used. . Since such an adhesive tape has good rigidity, it is excellent in sticking workability.
  • the layer (C) examples include a resin film layer formed using a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper. Layer.
  • a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper.
  • the layer (C) it is preferable to use a layer having a thickness of 1 ⁇ m to 200 ⁇ m, and it is more preferable to use a layer having a thickness of 12 ⁇ m to 50 ⁇ m.
  • the adhesive tape of the present invention can be expanded by giving a stimulus to the layer (A) or the entire adhesive tape.
  • the stimulus include heat and light as described above.
  • the method for giving the stimulus include methods such as heating and light irradiation, and it is preferable to employ a heating method.
  • the heating temperature is preferably a temperature corresponding to, for example, a temperature at which the expansion agent expands (expansion start temperature), specifically 80 ° C. to 300 ° C., preferably 100 ° C. to 200 ° C. Preferably there is.
  • the adhesive tape of the present invention expands in the thickness direction after the stimulus such as heating is given.
  • the adhesive tape of the present invention does not substantially expand in the flow direction or the width direction after the stimulation such as heating is given.
  • one adhesive layer (B) constituting the adhesive tape on a flat portion or a curved portion of one adherend After sticking, there is a method of expanding by applying the stimulus, and then sticking the other adherend to the other adhesive layer (B).
  • the stimulus may be applied to the entire patch or the layer (A) after two adherends are pasted on both sides of the adhesive tape.
  • one adherend layer and one adhesive layer (B ) Is placed in the gap of the other adherend, and then the stimulus is applied to expand the article so that the one adherend is fixed in the gap.
  • the method of manufacturing is mentioned.
  • the use of the adhesive tape as described above can be suitably applied when manufacturing a motor mounted on, for example, a hybrid vehicle. Specifically, after placing the adhesive layer (B) on at least one side of the adhesive tape and a part of the magnet on the gap of the core member constituting the motor, at least the layer A method of manufacturing a motor or the like having a configuration in which the magnet is fixed in the gap by stimulating and expanding (A).
  • the adhesive tape can be used for the purpose of filling the voids of the adherend.
  • at least the layer (A) is provided. By stimulating and expanding, it can be used when forming a configuration in which two or more locations in the gap are bonded by the adhesive tape.
  • composition (a-1)> Epicron N-680 (a cresol novolac epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 21.4 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol) After mixing 48 parts by mass of an A-type epoxy resin solution, epoxy equivalent 3748 g / eq, nonvolatile content 50% by mass), 30.6 parts by mass of methyl ethyl ketone is mixed to obtain an epoxy resin composition having a nonvolatile content of 40% by mass (1 )
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • composition (a-2) ⁇ Preparation of composition (a-2)>
  • EXPANSEL 051-40 manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times
  • a composition (a-2) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 6.4 parts by mass.
  • composition (a-3) ⁇ Preparation of composition (a-3)>
  • the amount used of EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) is 3.2 mass.
  • a composition (a-3) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 9.6 parts by mass.
  • composition (a-4) ⁇ Preparation of composition (a-4)> Instead of 3.2 parts by mass of the above Expandel 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle diameter 12 ⁇ m, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) Other than using 1.6 parts by mass of EXPANSEL 920-120 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 127 ° C., volume expansion coefficient at 130 ° C. is 4 times) Obtained a composition (a-4) in the same manner as in Preparation Example 1.
  • Expandel 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 ⁇ m, expansion start temperature 110 ° C.) as an expansion agent with respect to 100 parts by mass of the epoxy resin composition (2) Is mixed with 3.2 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole-based curing accelerator) as a curing agent, and stirred for 10 minutes to obtain a composition (a- 5) was obtained.
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole-based curing accelerator
  • Curazole 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator
  • Example 1 On the surface of a release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 ⁇ m using a rod-shaped metal applicator. The layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • Two adhesive layers (B-1) were produced by coating the film so as to have a thickness of 50 ⁇ m and drying for 10 minutes with a drier set at 75 ° C.
  • the adhesive layer (B-1) is pasted on both sides of the layer (A-1) obtained above, and the layer (A-1) is reciprocated once by reciprocating the upper surface of the paste using a 2 kg hand roller.
  • An adhesive tape having an adhesive layer (B-1) laminated on both sides of -1) was obtained.
  • Example 2 An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-2) was used instead of the composition (a-1).
  • Example 3 An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-3) was used instead of the composition (a-1).
  • Example 4 The thickness after drying of the composition (a-1) was changed from 50 ⁇ m to 100 ⁇ m, and the thickness after drying of the adhesive composition (b-1) was changed from 50 ⁇ m to 25 ⁇ m.
  • An adhesive tape was produced in the same manner as in Example 1.
  • Example 5 An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-4) was used instead of the composition (a-1).
  • Example 6 The composition (a-5) is used instead of the composition (a-1), and the adhesive composition (b-2) is used instead of the adhesive composition (b-1).
  • An adhesive tape was produced in the same manner as in Example 1 except that.
  • Example 7 On the surface of a release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 ⁇ m using a rod-shaped metal applicator.
  • the layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
  • films made of polyethylene terephthalate having a thickness of 25 ⁇ m were bonded to both surfaces of the layer (A-1).
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • Two adhesive layers were prepared by coating the film so that the thickness of the film became 25 ⁇ m and drying it with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive layer is affixed to the film made of polyethylene terephthalate, and the upper surface of the adhesive is reciprocated once using a 2 kg hand roller, whereby polyethylene terephthalate is applied to both sides of the layer (A-1).
  • An adhesive tape in which films were laminated and an adhesive layer was laminated on the surface was obtained.
  • composition (a-1) On the surface of a release film having one surface of a 75 ⁇ m thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 150 ⁇ m using a rod-shaped metal applicator.
  • the adhesive tape was obtained by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
  • composition (a-1) On the surface of a release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 ⁇ m using a rod-shaped metal applicator.
  • the layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
  • the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 ⁇ m-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator.
  • the adhesive layer (B-1) was prepared by applying the coating to a thickness of 100 ⁇ m and drying for 10 minutes with a dryer set at 75 ° C.
  • the adhesive layer (B-1) is affixed to the layer (A-1) obtained above, and the layer (A-1) is reciprocated once by reciprocating the upper surface of the adhesive paste using a 2 kg hand roller.
  • An adhesive tape having an adhesive layer (B-1) laminated on one side was obtained.
  • Comparative Example 3 An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-2) was used instead of the composition (a-1).
  • Comparative Example 4 An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-3) was used instead of the composition (a-1).
  • Comparative Example 5 An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-4) was used instead of the composition (a-1).
  • Adhesive tape, layer constituting the same, and method for measuring expansion coefficient of adhesive layer The thickness of the adhesive tape produced by the above method and the thickness of each adhesive layer constituting it were measured using a thickness meter.
  • the adhesive tape was expanded by leaving it in an environment of 130 ° C. for 1 hour.
  • the thickness of the expanded adhesive tape and the thickness of the adhesive layer constituting it were measured using a thickness meter.
  • the expansion coefficient of the layer (A) was calculated by the following method.
  • the thickness of the layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after standing was taken out in a 23 ° C. environment, and the thickness of the layer (A ′) formed by immediately expanding the layer (A) was measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [Thickness of the layer (A) constituting the adhesive tape after standing] [Thickness of the layer (A ′) formed by swelling] / Thickness of the layer (A) constituting the adhesive tape before standing] ⁇ 100
  • the expansion coefficient of the pressure-sensitive adhesive layer (B) was calculated by the following method.
  • the thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) was immediately measured.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] ⁇ 100 The expansion coefficient of the adhesive tape was calculated by the following method.
  • the thickness of the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
  • the adhesive tape was left in an environment at 130 ° C. for 1 hour.
  • the adhesive tape after standing was taken out in a 23 ° C. environment and immediately measured for its thickness.
  • the expansion coefficient was calculated based on the measurement result and the following formula. [Thickness of the adhesive tape after being left / thickness of the adhesive tape before being left] ⁇ 100
  • the above fixed one was heated at 130 ° C. for 1 hour and then left to stand in a 23 ° C. environment for 30 minutes to cool.
  • the sample with the clip removed is used as a test piece, the ends of the two aluminum plates are chucked, and a tensile test is performed in a 180 ° direction at a tensile speed of 5 mm / min.
  • the adhesive strength of the adhesive tape was determined.
  • a 10 mm ⁇ 10 mm adhesive sheet (“X” in FIG. 1) was inserted into the gap formed between the aluminum plates (A1) and (A2). This was heated at 130 ° C. for 1 hour to thermally bond the two aluminum plates.
  • the adhesive strength of the material from which the clip was removed was subjected to a tensile test at a tensile speed of 5 mm / min by chucking each end of the aluminum plate using a tensile tester. Measured by

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Permanent Field Magnets Of Synchronous Machinery (AREA)

Abstract

The present invention addresses the problem of providing an adhesive tape capable of expansion due to stimulation such as heating, said adhesive tape exhibiting excellent adhesive strength even after expansion. The present invention relates to an adhesive tape having an adhesive layer (B) on both surfaces of a layer (A), said adhesive layer (B) being in direct contact with the layer (A) or having another layer interposed therebetween, wherein the adhesive tape is characterized in that, after being left to stand in a 130 °C environment for one hour, the expansion ratio (thickness of layer (A) after being left to stand/thickness of layer (A) before being left to stand) in the thickness direction of the layer (A) multiplied by 100 is 200% or more, and the expansion ratio (thickness of adhesive layer (B) after being left to stand/thickness of adhesive layer (B) before being left to stand) in the thickness direction of the adhesive layer (B) multiplied by 100 is 120% or less.

Description

接着テープ、物品及びモーターAdhesive tape, article and motor
　本発明は、加熱等の刺激を与えることによって、その厚さ方向に体積を膨張しうる構成を備えた接着テープに関する。 The present invention relates to an adhesive tape having a structure capable of expanding its volume in the thickness direction by giving a stimulus such as heating.
　前記接着テープは、一般に、一方の被着体を、他方の被着体の平面部分や曲面部分へ固定等する際に、好適に使用できることから、例えば自動車や電気機器等の様々な製品の製造場面で広く使用されている。 In general, the adhesive tape can be suitably used for fixing one adherend to a flat surface portion or a curved surface portion of the other adherend, so that various products such as automobiles and electric devices can be manufactured. Widely used in the scene.
　一方、接着テープの使用範囲がさらに拡大するなかで、前記接着テープとしては、例えば一方の被着体が有する空隙に、他方の被着体を固定する際に使用できることが求められている。具体的には、ハイブリッド自動車等に搭載されるモーターとしては、一般に、コア部（ローターコア）の所定の位置に空隙が設けられ、その空隙に磁石が埋め込まれた構成を有するものが知られている。前記コア部が有する空隙に前記磁石を固定する際、接着テープを使用することが検討されている。 On the other hand, as the range of use of the adhesive tape further expands, the adhesive tape is required to be used when, for example, the other adherend is fixed in the gap of one adherend. Specifically, as a motor mounted on a hybrid vehicle or the like, a motor having a configuration in which a gap is generally provided at a predetermined position of a core (rotor core) and a magnet is embedded in the gap is known. Yes. The use of an adhesive tape is being studied when fixing the magnet in the gap of the core portion.
　前記用途で使用可能な接着テープとしては、例えば第１面および前記第１面の反対側に第２面を有し、連通口を有する基材と、前記基材の第１面に形成された、熱硬化性熱膨張性エポキシ接着剤を含む第１接着層とを有し、前記熱硬化性熱膨張性エポキシ接着剤が、加熱時に前記基材の前記連通口を通過して前記基材の第２面上に第２接着層を形成する熱硬化性熱膨張性接着シートが知られている（例えば特許文献１参照。）。 The adhesive tape that can be used in the above application is formed on the first surface of the base material having a first surface and a second surface on the opposite side of the first surface and having a communication port, for example. A first adhesive layer containing a thermosetting thermally expandable epoxy adhesive, and the thermosetting thermally expandable epoxy adhesive passes through the communication port of the substrate when heated, and A thermosetting thermally expandable adhesive sheet that forms a second adhesive layer on the second surface is known (see, for example, Patent Document 1).
　しかし、前記第２接着層の表面には、前記熱膨張によって微細な凹凸が形成されてしまう場合がある。前記微細な凹凸が形成された表面を有する第２接着層は、被着体に対して十分な接着力を発現できない場合があった。 However, fine irregularities may be formed on the surface of the second adhesive layer due to the thermal expansion. In some cases, the second adhesive layer having the surface on which the fine irregularities are formed cannot exhibit a sufficient adhesive force to the adherend.
　また、前記したような接着シートを、被着体が有する空隙内へ、単に載置または挿入し、それを膨張させることによって前記空隙内を充填等しようとする場合、前記接着シートは、前記膨張によって両面の接着剤層に微細な凹凸が形成されてしまい、その結果、前記空隙内で十分に固定されず、前記空隙を充填することができない場合があった。 In addition, when the adhesive sheet as described above is simply placed or inserted into the gap of the adherend and is expanded to fill the gap, the adhesive sheet is expanded. As a result, fine irregularities are formed in the adhesive layers on both sides, and as a result, the gap is not sufficiently fixed in the gap and the gap may not be filled.
特開２０１３－０２３５５９号公報JP 2013-023559 A
　本発明が解決しようとする課題は、加熱等の刺激によって膨張しうる接着テープのうち、前記膨張後であっても優れた接着強度を保持することのできる接着テープを提供することである。 The problem to be solved by the present invention is to provide an adhesive tape that can maintain excellent adhesive strength even after the expansion, among adhesive tapes that can expand by stimulation such as heating.
　本発明者等は、層（Ａ）の両面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記層（Ａ）の厚さ方向の膨張率〔前記放置後の層（Ａ）の厚さ／前記放置前の層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする接着テープによって、前記課題を解決できることを見出した。 The present inventors have an adhesive tape having an adhesive layer (B) on both sides of the layer (A) directly or via another layer, and the adhesive tape is left in an environment of 130 ° C. for 1 hour. After that, the expansion coefficient in the thickness direction of the layer (A) [the thickness of the layer (A) after being left / the thickness of the layer (A) before being left] × 100 is 200% or more, And the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the thickness of the adhesive layer (B) before being left] × 100 is 120% It has been found that the above problems can be solved by an adhesive tape characterized by the following.
　本発明の接着テープは、膨張した後であっても優れた接着強度を維持できることから、２以上の被着体の固定に使用できることはもとより、一方の被着体が有する空隙内に他方の被着体を固定する用途、被着体が有する空隙内を前記接着テープで充填する用途等で好適に使用することができる。 Since the adhesive tape of the present invention can maintain an excellent adhesive strength even after being expanded, it can be used for fixing two or more adherends, and in addition, the other adherend can be placed in the gap of one adherend. It can be suitably used for applications such as fixing the adherend and filling the voids of the adherend with the adhesive tape.
　また、本発明の接着テープは、被着体が微小な凹凸や隙間を有する場合であっても、前記膨張によって、前記微細な凹凸等に追従でき、その結果、優れた接着強度を発現することができる。また、本発明の接着テープは、被着体が有する空隙内へ、単に載置または挿入し、それを膨張させることによって前記空隙内を充填等することができるため、モーターをはじめとする最終製品の生産効率を向上させることができる。 In addition, the adhesive tape of the present invention can follow the fine irregularities due to the expansion even when the adherend has minute irregularities and gaps, and as a result, exhibits excellent adhesive strength. Can do. Further, the adhesive tape of the present invention can be filled or filled in the gap by simply placing or inserting it into the gap of the adherend and expanding it. The production efficiency can be improved.
　また、本発明の接着テープは、その膨張率を適宜変更した場合であっても、前記接着強度のばらつきが生じにくい。 In addition, the adhesive tape of the present invention is less likely to cause variations in the adhesive strength even when the expansion coefficient is appropriately changed.
接着テープのせん断接着力の測定方法を示す概念図である。It is a conceptual diagram which shows the measuring method of the shearing adhesive force of an adhesive tape.
　本発明の接着テープは、層（Ａ）の両面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記層（Ａ）の厚さ方向の膨張率〔前記放置後の層（Ａ）の厚さ／前記放置前の層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする。 The adhesive tape of the present invention is an adhesive tape having an adhesive layer (B) on both sides of the layer (A) directly or via another layer, and the adhesive tape is placed in an environment of 130 ° C. for 1 hour. The expansion coefficient in the thickness direction of the layer (A) after being left [the thickness of the layer (A) after being left / the thickness of the layer (A) before being left] × 100 is 200% or more. And the expansion coefficient in the thickness direction of the adhesive layer (B) [the thickness of the adhesive layer (B) after being left / the thickness of the adhesive layer (B) before being left) × 100 is 120. % Or less.
　前記接着テープを構成する前記層（Ａ）は、例えば熱や光等の刺激を与えることによって膨張しうる層である。 The layer (A) constituting the adhesive tape is a layer that can expand by applying a stimulus such as heat or light.
　前記層（Ａ）としては、前記接着テープを１３０℃の環境下に１時間放置した場合に、前記層（Ａ）の厚さ方向の膨張率〔前記放置後の層（Ａ）の厚さ／前記放置前の層（Ａ）の厚さ〕×１００が２００％以上となるものを使用する。 As the layer (A), when the adhesive tape is allowed to stand in an environment of 130 ° C. for 1 hour, the coefficient of expansion in the thickness direction of the layer (A) [the thickness of the layer (A) after being left / The thickness of the layer (A) before leaving] × 100 is 200% or more.
　前記膨張率は、２５０％以上であることが好ましく、２５０％～１０００％であることがより好ましい。前記膨張率の層（Ａ）を有する接着テープであれば、例えば一方の被着体が有する空隙の高さ（厚さ）が大きい場合であっても、前記空隙内に他方の被着体を好適に固定したり、前記空隙内を前記接着テープで充填することができる。 The expansion coefficient is preferably 250% or more, and more preferably 250% to 1000%. If the adhesive tape has the expansion coefficient layer (A), for example, even if the height (thickness) of the gap of one adherend is large, the other adherend is placed in the gap. It can be suitably fixed, or the gap can be filled with the adhesive tape.
　なお、前記膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前（膨張前）の層（Ａ）の厚さに対する、前記放置後の層（Ａ）の厚さ（膨張して形成された層（Ａ’）の厚さ）の厚さの割合を指す。具体的には、前記膨張率は、以下の方法で算出した値を指す。 The expansion rate is the ratio of the layer (A) after being left to the thickness of the layer (A) before being left (before expansion) when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of thickness (thickness of the layer (A ′) formed by expansion). Specifically, the expansion coefficient indicates a value calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する層（Ａ）の厚さを、２３℃環境下で測定する。 The thickness of the layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置する。 ¡Leave the adhesive tape in an environment of 130 ° C for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記層（Ａ）が膨張して形成された層（Ａ’）の厚さを測定する。 The adhesive tape after being left is taken out in an environment of 23 ° C., and the thickness of the layer (A ′) formed by the layer (A) expanding immediately is measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出する。
［前記放置後の接着テープを構成する層（Ａ）〔膨張し形成された層（Ａ’）〕の厚さ／前記放置前の接着テープを構成する層（Ａ）の厚さ］×１００ The expansion coefficient is calculated based on the measurement result and the following formula.
[Thickness of the layer (A) constituting the adhesive tape after standing] [Thickness of the layer (A ′) formed by swelling] / Thickness of the layer (A) constituting the adhesive tape before standing] × 100
　前記接着テープを構成する層（Ａ）の厚さは、１μｍ以上であることが好ましく、１０μｍ～２５０μｍの範囲であることが好ましく、２０μｍ～１５０μｍの範囲であることがより好ましく、３０μｍ～７０μｍの範囲であることが、より一層優れた接着強度を得るうえでさらに好ましい。 The thickness of the layer (A) constituting the adhesive tape is preferably 1 μm or more, preferably in the range of 10 μm to 250 μm, more preferably in the range of 20 μm to 150 μm, and more preferably in the range of 30 μm to 70 μm. The range is more preferable for obtaining a further excellent adhesive strength.
　一方、前記層（Ａ）が膨張することによって形成された層（Ａ’）の厚さは、２０μｍ～２５００μｍの範囲であることが好ましく、４０μｍ～１５００μｍの範囲であることが、より一層優れた接着強度を得るうえで好ましい。また、前記層（Ａ’）は、多孔構造を有するものであることが好ましい。 On the other hand, the thickness of the layer (A ′) formed by expanding the layer (A) is preferably in the range of 20 μm to 2500 μm, and more preferably in the range of 40 μm to 1500 μm. It is preferable when obtaining adhesive strength. The layer (A ′) preferably has a porous structure.
　また、前記接着テープとしては、前記接着テープの総厚さに対して、前記層（Ａ）の厚さが１０％以上であるものを使用することが好ましく、３０％以上であるものを使用することが、一方の被着体が有する空隙内に他方の被着体を好適に固定したり、前記空隙内を前記接着テープで充填することができるためより好ましい。 Moreover, as said adhesive tape, it is preferable to use what the thickness of the said layer (A) is 10% or more with respect to the total thickness of the said adhesive tape, and uses what is 30% or more. It is more preferable because the other adherend can be suitably fixed in the gap of one adherend or the gap can be filled with the adhesive tape.
　本発明の接着テープを構成する前記層（Ａ）としては、前記したとおり熱や光等の刺激を与えることによって膨張しうるものを使用することができ、具体的には各種樹脂及び膨張剤を含有する層を使用することができる。 As said layer (A) which comprises the adhesive tape of this invention, what can expand | swell by giving irritation | stimulation, such as a heat | fever and light, as mentioned above can be used, Specifically, various resin and an expander are used. A containing layer can be used.
　前記層（Ａ）としては、例えば前記樹脂及び膨張剤等を含有する組成物（ａ）を離型ライナー等に塗布し乾燥または硬化等させることによって形成することができる。 The layer (A) can be formed, for example, by applying a composition (a) containing the resin and an expanding agent to a release liner or the like and drying or curing.
　前記層（Ａ）の形成に使用可能な組成物（ａ）としては、前記したとおり樹脂や膨張剤や必要に応じて溶媒等を含有する組成物を使用することができる。 As the composition (a) that can be used for forming the layer (A), as described above, a composition containing a resin, an expanding agent, and a solvent as required can be used.
　前記樹脂としては、例えばエポキシ樹脂、ウレタン樹脂、シリコーン樹脂、フェノール樹脂、ユリア樹脂、フッ素樹脂、アクリルニトリル樹脂、アクリル樹脂、スチレン系樹脂、ブタジエン樹脂等のビニル樹脂等を、単独または２以上組み合わせ使用することができる。 Examples of the resin include an epoxy resin, a urethane resin, a silicone resin, a phenol resin, a urea resin, a fluororesin, an acrylonitrile resin, an acrylic resin, a styrene resin, a vinyl resin such as a butadiene resin, etc., alone or in combination. can do.
　なかでも、前記樹脂としては、熱硬化性樹脂を使用することが好ましく、エポキシ樹脂を使用することが、膨張後に耐熱性に優れ、かつ、膨張した層（Ａ’）が経時的に著しく収縮することを防止可能な接着テープを得るうえでより好ましい。 Among these, it is preferable to use a thermosetting resin as the resin, and the use of an epoxy resin is excellent in heat resistance after expansion, and the expanded layer (A ′) shrinks remarkably with time. It is more preferable to obtain an adhesive tape that can prevent this.
　前記エポキシ樹脂としては、例えばビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、ヒンダトイン型エポキシ樹脂、ビフェニル型エポキシ樹脂、脂環式エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、ジシクロペンタジエン／フェノールエポキシ樹脂、脂環式アミンエポキシ樹脂、脂肪族アミンエポキシ樹脂、及び、ＣＴＢＮ変性（カルボキシターミネーティッドブタジエンニトリル変性）やハロゲン変性されたエポキシ樹脂等を、単独または２以上組み合わせ使用することができ、クレゾールノボラック型エポキシ樹脂を使用することが、前記刺激によって膨張しやすく、かつ、膨張後も優れた接着強度を保持できるため好ましい。 Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hindered-in type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, and phenol novolac. Type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, dicyclopentadiene / phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modification (carboxy-terminated butadiene nitrile modification) Halogen-modified epoxy resins or the like can be used alone or in combination of two or more, and the use of a cresol novolac type epoxy resin can be caused by the stimulation. Expansion easy, and preferable because it can hold the adhesive strength is excellent even after expansion.
　前記エポキシ樹脂等の熱硬化性樹脂は、前記層（Ａ）全体に対して１０質量％～９９質量％含まれることが好ましい。 The thermosetting resin such as the epoxy resin is preferably contained in an amount of 10% by mass to 99% by mass with respect to the entire layer (A).
　また、前記組成物（ａ）としては、前記刺激によって膨張し得る層（Ａ）を形成するうえで膨張剤を含有するものを使用することが好ましい。 Further, as the composition (a), it is preferable to use a composition containing a swelling agent in forming the layer (A) that can be swollen by the stimulus.
　前記膨張剤としては、前記膨張後の層（Ａ’）として多孔構造を形成できるものを使用することが好ましく、例えば炭酸アンモニウム、炭酸水素アンモニウム、亜硝酸アンモニウム、水素化ホウ素アンモニウム、アジド等の無機化合物、トリクロロモノフルオロメタン等のフッ化アルカン、アゾビスイソブチロニトリル等のアゾ化合物、パラトルエンスルホニルヒドラジド等のヒドラジン化合物、ｐ－トルエンスルホニルセミカルバジド等のセミカルバジド化合物、５－モルホリル－１，２，３，４－チアトリアゾール等のトリアゾール化合物、Ｎ，Ｎ’－ジニトロソテレフタルアミド等のＮ－ニトロソ化合物を使用することができる。 As the expansion agent, it is preferable to use a layer that can form a porous structure as the layer (A ′) after expansion. For example, inorganic compounds such as ammonium carbonate, ammonium hydrogen carbonate, ammonium nitrite, ammonium borohydride, azide, etc. , Fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as paratoluenesulfonyl hydrazide, semicarbazide compounds such as p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2,3 Triazole compounds such as 1,4-thiatriazole and N-nitroso compounds such as N, N′-dinitrosotephthalamide can be used.
　また、前記膨張剤としては、例えば炭化水素系溶剤をマイクロカプセル化した熱は膨張性カプセル等の膨張性カプセルを使用することができる。前記膨張剤としては、前記樹脂の軟化点前後の温度で気体を発生し膨張し得るものを使用することが好ましい。 In addition, as the expansion agent, for example, heat obtained by microencapsulating a hydrocarbon-based solvent can use an expandable capsule such as an expandable capsule. As the expansion agent, it is preferable to use a material capable of generating gas and expanding at a temperature around the softening point of the resin.
　前記膨張剤としては、前記したなかでも炭化水素系溶剤をマイクロカプセル化した熱膨張性カプセルを使用することが、例えば前記エポキシ樹脂の硬化を阻害したり、熱等の影響による層（Ａ）の劣化等を防止するうえで好ましい。 As the expansion agent, use of a thermally expandable capsule in which a hydrocarbon solvent is microencapsulated among the above-described ones, for example, inhibits the curing of the epoxy resin or the layer (A) due to the influence of heat or the like. This is preferable for preventing deterioration and the like.
　前記熱膨張性カプセルとしては、膨張前の前記カプセルの体積に対し、膨張後の体積（体積膨張率）８倍～６０倍であるものを使用することが好ましい。 As the thermally expandable capsule, it is preferable to use a capsule whose volume after expansion (volume expansion coefficient) is 8 to 60 times the volume of the capsule before expansion.
　前記熱膨張性カプセルの市販品としては、例えばエクスパンセル（日本フィライト株式会社製）、マツモトマイクロスフェアー（松本油脂製薬株式会社製）、マイクロスフェアー（株式会社クレハ製）等が挙げられる。 Examples of the commercially available thermal expandable capsule include EXPANSEL (manufactured by Nippon Philite Co., Ltd.), Matsumoto Microsphere (manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), and Microsphere (manufactured by Kureha Co., Ltd.).
　前記膨張剤の使用量、好ましくは前記熱膨張性カプセルの使用量は、前記層（Ａ）の全量に対して、０．３質量％～４０質量％の範囲であることが好ましく、１．０質量％～３０質量％の範囲であることがより好ましく、３．０質量％～２０質量％の範囲であることが、被着体が有する空隙を充填等するうえで十分な体積にまで膨張することができ、かつ、より一層優れた接着強度を維持可能な接着テープを得るうえで好ましい。 The amount of the expansion agent used, preferably the amount of the thermally expandable capsule, is preferably in the range of 0.3% by mass to 40% by mass with respect to the total amount of the layer (A). More preferably, the range is from 30% by mass to 30% by mass, and the range from 3.0% by mass to 20% by mass expands to a sufficient volume for filling the voids of the adherend. It is preferable for obtaining an adhesive tape that can be maintained and can maintain an even better adhesive strength.
　前記組成物（ａ）としては、前記したもののほかに必要に応じて、硬化剤、硬化促進剤等を含有するものを使用することができる。 As the composition (a), a composition containing a curing agent, a curing accelerator or the like can be used as necessary in addition to the above-described one.
　前記硬化剤としては、例えば、ビスフェノールＡ、ビスフェノールＦ、ビスフェノールＡＤ、ハイドロキノン、レゾルシン、メチルレゾルシン、ビフェノール、テトラメチルビフェノール、ジヒドロキシナフタレン、ジヒドロキシジフェニルエーテル、フェノールノボラック樹脂、ビスフェノールＡノボラック樹脂、ジシクロペンタジエンフェノール樹脂、テルペンフェノール樹脂、ナフトールノボラック樹脂、ビフェニルフェノール樹脂等の種々の多価フェノール樹脂、種々のフェノールと、ヒドロキシベンズアルデヒド、クロトンアルデヒド、グリオキザール等の種々のアルデヒドとの縮合反応で得られる多価フェノール樹脂、および重質油またはピッチ、フェノールおよびホルムアルデヒド化合物を重縮合させて得られた変性フェノール樹脂等の各種のフェノール樹脂、メチルテトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、無水ピロメリット酸、メチルナジック酸等の酸無水物、ジエチレントリアミン、イソホロンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ジシアンジアミド等のアミン等を使用することができる。 Examples of the curing agent include bisphenol A, bisphenol F, bisphenol AD, hydroquinone, resorcin, methyl resorcin, biphenol, tetramethylbiphenol, dihydroxynaphthalene, dihydroxydiphenyl ether, phenol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenol resin. Various polyphenol resins such as terpene phenol resin, naphthol novolac resin, biphenyl phenol resin, polyhydric phenol resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, glyoxal, And modified phenols obtained by polycondensation of heavy oil or pitch, phenol and formaldehyde compounds Various phenolic resins such as methyl resin, acid anhydrides such as methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride and methylnadic acid, amines such as diethylenetriamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and dicyandiamide Etc. can be used.
　前記硬化促進剤としては、例えば２－メチルイミダゾール、２－メチル－４－エチルイミダゾール、２－フェニルイミダゾール等のイミダゾール；１，８－ジアザビシクロ［５．４．０］ウンデセン－７、トリエチレンジアミン、ベンジルジメチルアミン等の３級アミン；トリブチルポスフィン、トリフェニルホスフィン等の有機ホスフィン等を、単独または２以上組み合わせ使用することができる。 Examples of the curing accelerator include imidazoles such as 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole; 1,8-diazabicyclo [5.4.0] undecene-7, triethylenediamine, benzyl Tertiary amines such as dimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine can be used alone or in combination of two or more.
　また、前記接着テープとしては、前記層（Ａ）の両面に接着剤層（Ｂ）を有するものを使用する。前記接着剤層（Ｂ）は、前記層（Ａ）の表面に直接積層されていてもよく、樹脂フィルム層や金属層等の他の層を介して積層されてもよい。 Further, as the adhesive tape, one having an adhesive layer (B) on both sides of the layer (A) is used. The adhesive layer (B) may be directly laminated on the surface of the layer (A), or may be laminated via another layer such as a resin film layer or a metal layer.
　前記接着剤層（Ｂ）としては、前記接着テープを１３０℃の環境下に１時間放置した場合に、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であるものを使用する。前記接着剤層（Ｂ）の膨張率は、１１５％以下であることが好ましく、１００％～１１５％であることがより好ましい。 As the adhesive layer (B), when the adhesive tape is allowed to stand in an environment of 130 ° C. for 1 hour, the expansion rate in the thickness direction of the adhesive layer (B) [the adhesive layer after being left ( B) thickness / thickness of adhesive layer (B) before standing] × 100 is 120% or less. The expansion rate of the adhesive layer (B) is preferably 115% or less, and more preferably 100% to 115%.
　前記膨張率の接着剤層（Ｂ）を有する接着テープであれば、前記層（Ａ）が膨張した後であっても、被着体に対する優れた接着強度を維持することができる。なお、前記接着剤層（Ｂ）の膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前の前記接着剤層（Ｂ）の厚さに対する、前記放置後の接着剤層の厚さの割合を指す。 The adhesive tape having the adhesive layer (B) having the expansion coefficient can maintain excellent adhesive strength to the adherend even after the layer (A) has expanded. It should be noted that the expansion rate of the adhesive layer (B) is such that, when the adhesive tape is left in an environment of 130 ° C. for 1 hour, the thickness of the adhesive layer (B) before being left is not changed. It refers to the ratio of the thickness of the adhesive layer.
　なお、前記接着剤層（Ｂ）の膨張率は、前記接着テープを１３０℃の環境下に１時間放置した場合において、前記放置前の接着剤層（Ｂ）の厚さに対する、前記放置後の接着剤層（Ｂ’）の厚さの割合を指す。具体的には、前記膨張率は、以下の方法で算出した値を指す。 Note that the expansion rate of the adhesive layer (B) is the ratio of the adhesive layer (B) after being left with respect to the thickness of the adhesive layer (B) before being left when the adhesive tape is left in an environment of 130 ° C. for 1 hour. It refers to the ratio of the thickness of the adhesive layer (B ′). Specifically, the expansion coefficient indicates a value calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ｂ）の厚さを、２３℃環境下で測定する。 The thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) is measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置する。 ¡Leave the adhesive tape in an environment of 130 ° C for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ｂ）に相当する接着剤層（Ｂ’）の厚さを測定する。 The adhesive tape after being left is taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) is immediately measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出する。
［前記放置後の接着テープを構成する接着剤層（Ｂ’）の厚さ／前記放置前の接着テープを構成する接着剤層（Ｂ）の厚さ］×１００ The expansion coefficient is calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] × 100
　前記接着剤層（Ｂ）の厚さは、その合計が５μｍ～１５０μｍの範囲であることが好ましく、１０μｍ～１００μｍの範囲であることが、より一層優れた接着強度を発現するうえでより好ましい。 The total thickness of the adhesive layer (B) is preferably in the range of 5 μm to 150 μm, and more preferably in the range of 10 μm to 100 μm, in order to express even better adhesive strength.
　前記１３０℃の環境下に１時間放置した後の接着剤層（Ｂ’）の厚さは、前記放置前の接着剤層（Ｂ）の厚さと比較して、上記膨張率の範囲で変化してもよいが、その変化は出来るだけ小さいことが優れた接着強度を維持するうえで好ましい。前記接着剤層（Ｂ’）の厚さは、その合計が５μｍ～１５０μｍの範囲であることが好ましく、１０μｍ～１００μｍの範囲であることが、より一層優れた接着強度を発現するうえでより好ましい。 The thickness of the adhesive layer (B ′) after being left for 1 hour in the environment of 130 ° C. varies within the above expansion coefficient range as compared with the thickness of the adhesive layer (B) before being left standing. However, it is preferable that the change be as small as possible in order to maintain excellent adhesive strength. The total thickness of the adhesive layer (B ′) is preferably in the range of 5 μm to 150 μm, and more preferably in the range of 10 μm to 100 μm, in order to express even better adhesive strength. .
　また、前記接着剤層（Ｂ）としては、粘着性または接着性を有する層が挙げられ、例えば熱硬化性接着剤層や感圧接着剤層等が挙げられる。 Also, examples of the adhesive layer (B) include a layer having tackiness or adhesiveness, and examples thereof include a thermosetting adhesive layer and a pressure-sensitive adhesive layer.
　前記接着剤層（Ｂ）は、粘着性または接着性を有する層を形成可能な接着剤（ｂ）を用いて形成することができる。 The adhesive layer (B) can be formed using an adhesive (b) capable of forming a sticky or adhesive layer.
　前記接着剤（ｂ）としては、例えば接着樹脂と、必要に応じて硬化剤とを含有するものを使用することができる。なお、前記接着剤（ｂ）を用いて形成される接着剤層（Ｂ）は、前記したとおり膨張率の低いことが好ましいため、前記層（Ａ）を形成する際に使用可能なものとして例示した膨張剤を実質的に含有しないものであることが好ましい。 As the adhesive (b), for example, an adhesive resin and, if necessary, a hardener can be used. Since the adhesive layer (B) formed using the adhesive (b) preferably has a low expansion coefficient as described above, it is exemplified as one that can be used when forming the layer (A). It is preferable that the expanded agent is substantially not contained.
　前記接着剤（ｂ）に使用可能な接着樹脂としては、従来知られる樹脂を選択し使用することができ、例えば熱硬化性樹脂や感圧接着性樹脂等を使用することができる。 As the adhesive resin that can be used for the adhesive (b), a conventionally known resin can be selected and used. For example, a thermosetting resin or a pressure-sensitive adhesive resin can be used.
　なかでも、前記接着樹脂としては、本発明の接着テープの生産効率を向上させるうえで、例えば前記層（Ａ）の形成に使用可能な組成物（ａ）に含有される樹脂として例示したものと、同様のものを使用することができる。 Among them, as the adhesive resin, in order to improve the production efficiency of the adhesive tape of the present invention, for example, those exemplified as the resin contained in the composition (a) that can be used for forming the layer (A) A similar one can be used.
　また、前記接着樹脂としては、前記層（Ａ）が膨張した後であっても、被着体に対して優れた接着強度を維持でき、特に熱の影響によらず優れた接着強度を維持可能な接着剤層（Ｂ）を備えた接着テープを得るうえで、熱硬化性樹脂を使用することが好ましく、エポキシ樹脂を使用することがより好ましい。 Further, as the adhesive resin, even after the layer (A) is expanded, excellent adhesive strength can be maintained on the adherend, and particularly excellent adhesive strength can be maintained regardless of heat. In order to obtain an adhesive tape having an adhesive layer (B), a thermosetting resin is preferably used, and an epoxy resin is more preferably used.
　前記エポキシ樹脂としては、前記組成物（ａ）に使用可能な樹脂として例示したものと、同様のものを使用することが、前記層（Ａ）が膨張した後であっても、被着体に対して優れた接着強度を維持でき、特に熱の影響によらず優れた接着強度を維持可能な接着剤層（Ｂ）を備えた接着テープを得るうえで好ましい。 As the epoxy resin, it is possible to use the same resin as that exemplified for the composition (a) as well as the same as that used for the adherend even after the layer (A) is expanded. On the other hand, it is preferable to obtain an adhesive tape having an adhesive layer (B) that can maintain excellent adhesive strength and can maintain excellent adhesive strength regardless of the influence of heat.
　前記接着剤（ｂ）としては、前記したもののほかに必要に応じて、硬化剤、硬化促進剤等を含有するものを使用することができる。前記硬化剤及び硬化促進剤としては、前記組成物（ａ）に使用可能な硬化剤及び硬化促進剤として例示したものと、同様のものを使用することができる。 As the adhesive (b), a material containing a curing agent, a curing accelerator or the like can be used as necessary in addition to the above-described ones. As said hardening | curing agent and hardening accelerator, the thing similar to what was illustrated as a hardening | curing agent and hardening accelerator which can be used for the said composition (a) can be used.
　前記接着剤（ｂ）としては、前記したもののほかに必要に応じて、カップリング剤、粘着性付与剤、消泡剤、顔料、酸化防止剤、コア－シェル型強化剤、チキソトロピー剤、熱伝導性フィラー、絶縁性フィラー等を含有するものを使用してもよい。 As the adhesive (b), in addition to those described above, a coupling agent, a tackifier, an antifoaming agent, a pigment, an antioxidant, a core-shell type reinforcing agent, a thixotropic agent, a heat conduction agent, if necessary. A material containing a conductive filler, an insulating filler, or the like may be used.
　本発明の接着テープは、例えば前記組成物（ａ）を離型ライナーに塗布し乾燥することによって層（Ａ）を形成する工程［１］、前記工程［１］とは別に、前記接着剤（ｂ）を離型ライナーに塗布し乾燥等することによって接着剤層（Ｂ）を形成する工程［２］、及び、前記層（Ａ）の両面に前記接着剤層（Ｂ）を転写し、それらを圧着等する工程［３］を経ることによって製造することができる。 The adhesive tape of the present invention is, for example, separate from the step [1] and the step [1] in which the layer (A) is formed by applying the composition (a) to a release liner and drying. b) is applied to a release liner and dried to form an adhesive layer (B) [2], and the adhesive layer (B) is transferred to both sides of the layer (A), Can be manufactured through the step [3] of pressure bonding or the like.
　前記層（Ａ）は、前記接着テープを製造する過程で、その一部分が硬化してもよいが、実質的に膨張または硬化していないことが好ましい。前記接着剤層（Ｂ）もまた、前記接着テープを製造する過程で、その一部分が硬化してもよいが、実質的に硬化していないことが好ましい。 A part of the layer (A) may be cured in the process of producing the adhesive tape, but it is preferable that the layer (A) is not substantially expanded or cured. A part of the adhesive layer (B) may also be cured in the process of producing the adhesive tape, but it is preferable that the adhesive layer (B) is not substantially cured.
　また、本発明の接着テープとしては、必要に応じ、前記層（Ａ）と接着剤層（Ｂ）との間に樹脂フィルム層または金属からなる層（Ｃ）を有するものを使用することができる。かかる接着テープは、良好な剛性を有するため、貼付作業性に優れる。 Moreover, as an adhesive tape of this invention, what has the layer (C) which consists of a resin film layer or a metal between the said layer (A) and an adhesive bond layer (B) as needed can be used. . Since such an adhesive tape has good rigidity, it is excellent in sticking workability.
　前記層（Ｃ）としては、例えばポリエステルフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、ポリ塩化ビニルフィルム、ポリイミドフィルム、ポリエチレンテレフタレートフィルム等のプラスチックフィルム等を用いて形成される樹脂フィルム層、アルミニウム、銅等の金属層が挙げられる。 Examples of the layer (C) include a resin film layer formed using a plastic film such as a polyester film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyimide film, and a polyethylene terephthalate film, and a metal such as aluminum and copper. Layer.
　前記層（Ｃ）としては、１μｍ～２００μｍの厚さを有するものを使用することが好ましく、１２μｍ～５０μｍの厚さのを有するものを使用することがより好ましい。 As the layer (C), it is preferable to use a layer having a thickness of 1 μm to 200 μm, and it is more preferable to use a layer having a thickness of 12 μm to 50 μm.
　前記層（Ｃ）を有する接着テープは、例えば前記組成物（ａ）を離型ライナーに塗布し乾燥することによって層（Ａ）を形成する工程［１］、前記工程［１］とは別に、前記接着剤（ｂ）を離型ライナーに塗布し乾燥等することによって接着剤層（Ｂ）を形成する工程［２］、前記層（Ａ）の片面または両面に、前記層（Ｃ）を積層する工程［４］、及び、前記層（Ａ）または前記層（Ｃ）からなる面に、前記接着剤層（Ｂ）を転写しそれらを圧着する工程［５］を経ることによって製造することができる。 In the adhesive tape having the layer (C), for example, the step (1) of forming the layer (A) by applying the composition (a) to a release liner and drying, separately from the step [1], Step [2] of forming the adhesive layer (B) by applying the adhesive (b) to a release liner and drying, etc., laminating the layer (C) on one or both sides of the layer (A) And the step [4] and the step [5] of transferring the adhesive layer (B) to the surface comprising the layer (A) or the layer (C) and press-bonding them. it can.
　本発明の接着テープは、前記層（Ａ）または前記接着テープ全体に刺激を与えることによって膨張させることができる。前記刺激としては、前記したとおり、熱や光等が挙げられる。刺激を与える方法としては、加熱または光照射等の方法が挙げられ、加熱する方法を採用することが好ましい。 The adhesive tape of the present invention can be expanded by giving a stimulus to the layer (A) or the entire adhesive tape. Examples of the stimulus include heat and light as described above. Examples of the method for giving the stimulus include methods such as heating and light irradiation, and it is preferable to employ a heating method.
　前記加熱温度は、例えば前記膨張剤が膨張する温度（膨張開始温度）に対応した温度であることが好ましく、具体的には、８０℃～３００℃であることが好ましく、１００℃～２００℃であることが好ましい。 The heating temperature is preferably a temperature corresponding to, for example, a temperature at which the expansion agent expands (expansion start temperature), specifically 80 ° C. to 300 ° C., preferably 100 ° C. to 200 ° C. Preferably there is.
　本発明の接着テープは、前記加熱等の刺激が与えられた後、その厚さ方向に膨張することが好ましい。一方、本発明の接着テープは、前記加熱等の刺激が与えられた後、その流れ方向または幅方向には実質的に膨張しないことが好ましい。 It is preferable that the adhesive tape of the present invention expands in the thickness direction after the stimulus such as heating is given. On the other hand, it is preferable that the adhesive tape of the present invention does not substantially expand in the flow direction or the width direction after the stimulation such as heating is given.
　本発明の接着テープを用いて２以上の被着体を固定等する方法としては、例えば一方の被着体の平面部または曲面部に、前記接着テープを構成する一方の接着剤層（Ｂ）を貼付した後、前記刺激を与えることで膨張させ、次に他方の被着体を、他方の接着剤層（Ｂ）に貼付する方法が挙げられる。前記刺激は、前記接着テープの両面に２個の被着体を貼付した後、貼付物全体または前記層（Ａ）に与えてもよい。 As a method of fixing two or more adherends using the adhesive tape of the present invention, for example, one adhesive layer (B) constituting the adhesive tape on a flat portion or a curved portion of one adherend. After sticking, there is a method of expanding by applying the stimulus, and then sticking the other adherend to the other adhesive layer (B). The stimulus may be applied to the entire patch or the layer (A) after two adherends are pasted on both sides of the adhesive tape.
　また、本発明の接着テープを用い、２以上の被着体を固定等することによって物品を製造する方法としては、例えば一方の被着体と前記接着テープを構成する一方の接着剤層（Ｂ）とを貼付したものを、他方の被着体が有する空隙内に載置した後、前記刺激を与え膨張させることによって、前記空隙内に前記一方の被着体が固定された構成を有する物品を製造する方法が挙げられる。 Moreover, as a method of manufacturing an article by fixing two or more adherends using the adhesive tape of the present invention, for example, one adherend layer and one adhesive layer (B ) Is placed in the gap of the other adherend, and then the stimulus is applied to expand the article so that the one adherend is fixed in the gap. The method of manufacturing is mentioned.
　前記したような接着テープの使用は、例えばハイブリッド自動車等に搭載されるモーターを製造する際に、好適に適用することができる。具体的には、前記接着テープの少なくとも片面の接着剤層（Ｂ）と、磁石の一部とを接着させたものを、モーターを構成するコア部材が有する空隙に載置した後、少なくとも前記層（Ａ）を刺激し膨張させることによって、前記磁石を前記空隙内に固定された構成を有するモーター等を製造する方法が挙げられる。 The use of the adhesive tape as described above can be suitably applied when manufacturing a motor mounted on, for example, a hybrid vehicle. Specifically, after placing the adhesive layer (B) on at least one side of the adhesive tape and a part of the magnet on the gap of the core member constituting the motor, at least the layer A method of manufacturing a motor or the like having a configuration in which the magnet is fixed in the gap by stimulating and expanding (A).
　また、前記接着テープは、被着体が有する空隙内を充填する目的で使用することでき、例えば、被着体が有する空隙に、前記接着テープを載置した後、少なくとも前記層（Ａ）を刺激し膨張させることによって、前記空隙内の２以上の箇所が前記接着テープによって接着された構成を形成する際に使用することができる。 The adhesive tape can be used for the purpose of filling the voids of the adherend. For example, after placing the adhesive tape in the voids of the adherend, at least the layer (A) is provided. By stimulating and expanding, it can be used when forming a configuration in which two or more locations in the gap are bonded by the adhesive tape.
　（調製例１）
　＜組成物（ａ－１）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）２１．４質量部と、「ＪＥＲ ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）４８質量部とを混合した後、メチルエチルケトン３０．６質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（１）を得た。 (Preparation Example 1)
<Preparation of composition (a-1)>
Epicron N-680 (a cresol novolac epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 21.4 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol) After mixing 48 parts by mass of an A-type epoxy resin solution, epoxy equivalent 3748 g / eq, nonvolatile content 50% by mass), 30.6 parts by mass of methyl ethyl ketone is mixed to obtain an epoxy resin composition having a nonvolatile content of 40% by mass (1 )
　次に、前記エポキシ樹脂組成物（１）１００質量部に対し、膨張剤としてエクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）を３．２質量部と、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部とを混合し、１０分間撹拌することによって、組成物（ａ－１）を得た。 Next, with respect to 100 parts by mass of the epoxy resin composition (1), EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., 3.2 parts by mass of a volume expansion coefficient at 130 ° C. of 7 times) and 0.4 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) as a curing agent are mixed for 10 minutes. The composition (a-1) was obtained by stirring.
　（調製例２）
　＜組成物（ａ－２）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）の使用量を、３．２質量部から６．４質量部に変更したこと以外は、調製例１と同様の方法で組成物（ａ－２）を得た。 (Preparation Example 2)
<Preparation of composition (a-2)>
The amount used of EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) is 3.2 mass. A composition (a-2) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 6.4 parts by mass.
　（調製例３）
　＜組成物（ａ－３）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）の使用量を、３．２質量部から９．６質量部に変更したこと以外は、調製例１と同様の方法で組成物（ａ－３）を得た。 (Preparation Example 3)
<Preparation of composition (a-3)>
The amount used of EXPANSEL 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) is 3.2 mass. A composition (a-3) was obtained in the same manner as in Preparation Example 1, except that the amount was changed to 9.6 parts by mass.
　（調製例４）
　＜組成物（ａ－４）の調製＞
　前記エクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃、１３０℃における体積膨張率が７倍）３．２質量部の代わりに、エクスパンセル９２０－１２０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１２７℃、１３０℃における体積膨張率が４倍）を１．６質量部使用すること以外は、調製例１と同様の方法で組成物（ａ－４）を得た。 (Preparation Example 4)
<Preparation of composition (a-4)>
Instead of 3.2 parts by mass of the above Expandel 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle diameter 12 μm, expansion start temperature 110 ° C., volume expansion coefficient at 130 ° C. is 7 times) Other than using 1.6 parts by mass of EXPANSEL 920-120 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 127 ° C., volume expansion coefficient at 130 ° C. is 4 times) Obtained a composition (a-4) in the same manner as in Preparation Example 1.
　（調製例５）
　＜組成物（ａ－５）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）３７．３質量部と、「ＪＥＲ ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）２４質量部とを混合し、次にメチルエチルケトン３８．７質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（２）を得た。 (Preparation Example 5)
<Preparation of composition (a-5)>
Epicron N-680 (a cresol novolac type epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 37.3 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol A type epoxy resin solution, epoxy equivalent 3748 g / eq, non-volatile content 50% by mass) 24 parts by mass, and then mixed with 38.7 parts by mass of methyl ethyl ketone, whereby an epoxy resin composition (non-volatile content 40% by mass) ( 2) was obtained.
　次に、前記エポキシ樹脂組成物（２）１００質量部に対し、膨張剤としてエクスパンセル０５１－４０（日本フィライト株式会社製、熱膨張性マイクロカプセル、初期粒子径１２μｍ、膨張開始温度１１０℃）を３．２質量部と、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部とを混合し、１０分間撹拌することによって、組成物（ａ－５）を得た。 Next, Expandel 051-40 (manufactured by Nippon Philite Co., Ltd., thermally expandable microcapsule, initial particle size 12 μm, expansion start temperature 110 ° C.) as an expansion agent with respect to 100 parts by mass of the epoxy resin composition (2) Is mixed with 3.2 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole-based curing accelerator) as a curing agent, and stirred for 10 minutes to obtain a composition (a- 5) was obtained.
　（調製例６）
　＜接着剤組成物（ｂ－１）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）２１．４質量部と、「ＪＥＲ ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）４８質量部とを混合した後、メチルエチルケトン３０．６質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（３）を得た。 (Preparation Example 6)
<Preparation of adhesive composition (b-1)>
Epicron N-680 (a cresol novolac epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 21.4 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol) After mixing 48 parts by mass of an A-type epoxy resin solution, epoxy equivalent 3748 g / eq, nonvolatile content 50% by mass), 30.6 parts by mass of methyl ethyl ketone was mixed to obtain an epoxy resin composition having a nonvolatile content of 40% by mass (3 )
　次に、前記エポキシ樹脂組成物（３）１００質量部に対し、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部を混合し、１０分間撹拌することによって、接着剤組成物（ｂ－１）を得た。 Next, 0.4 parts by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) is mixed with 100 parts by mass of the epoxy resin composition (3) and stirred for 10 minutes. As a result, an adhesive composition (b-1) was obtained.
　（調製例７）
　＜接着剤組成物（ｂ－２）の調製＞
　エピクロンＮ－６８０（ＤＩＣ株式会社製のクレゾールノボラック型エポキシ樹脂溶液、エポキシ当量２１５ｇ／ｅｑ、不揮発分７５質量％）３７．３質量部と、「ＪＥＲ ＹＬ－７８６２」（三菱化学株式会社製のビスフェノールA型エポキシ樹脂溶液、エポキシ当量３７４８ｇ／ｅｑ、不揮発分５０質量％）２４質量部とを混合し、次にメチルエチルケトン３８．７質量部を混合することによって不揮発分４０質量％のエポキシ樹脂組成物（４）を得た。 (Preparation Example 7)
<Preparation of adhesive composition (b-2)>
Epicron N-680 (a cresol novolac type epoxy resin solution manufactured by DIC Corporation, epoxy equivalent 215 g / eq, non-volatile content 75 mass%) 37.3 parts by mass, “JER YL-7862” (Mitsubishi Chemical Corporation bisphenol A type epoxy resin solution, epoxy equivalent 3748 g / eq, non-volatile content 50% by mass) 24 parts by mass, and then mixed with 38.7 parts by mass of methyl ethyl ketone, whereby an epoxy resin composition (non-volatile content 40% by mass) ( 4) was obtained.
　次に、前記エポキシ樹脂組成物（４）１００質量部に対し、硬化剤としてキュアゾール２ＭＡＯＫ－ＰＷ（四国化成株式会社製、イミダゾール系硬化促進剤）０．４質量部を混合し、１０分間撹拌することによって、接着剤組成物（ｂ－２）を得た。 Next, with respect to 100 parts by mass of the epoxy resin composition (4), 0.4 part by mass of Curazole 2MAOK-PW (manufactured by Shikoku Kasei Co., Ltd., imidazole curing accelerator) is mixed as a curing agent and stirred for 10 minutes. As a result, an adhesive composition (b-2) was obtained.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　＜接着テープの作製＞
　（実施例１）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって層（Ａ－１）を作製した。 <Preparation of adhesive tape>
Example 1
On the surface of a release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 μm using a rod-shaped metal applicator. The layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
　次に、厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層（Ｂ－１）を２個作製した。 Next, the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator. Two adhesive layers (B-1) were produced by coating the film so as to have a thickness of 50 μm and drying for 10 minutes with a drier set at 75 ° C.
　前記で得た層（Ａ－１）の両面に、前記接着剤層（Ｂ－１）を貼付し、２ｋｇのハンドローラーを用い、前記貼付物の上面を一往復させることによって、前記層（Ａ－１）の両面に接着剤層（Ｂ－１）が積層した接着テープを得た。 The adhesive layer (B-1) is pasted on both sides of the layer (A-1) obtained above, and the layer (A-1) is reciprocated once by reciprocating the upper surface of the paste using a 2 kg hand roller. An adhesive tape having an adhesive layer (B-1) laminated on both sides of -1) was obtained.
　（実施例２）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－２）を使用したこと以外は、実施例１と同様の方法で接着テープを作製した。 (Example 2)
An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-2) was used instead of the composition (a-1).
　（実施例３）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－３）を使用したこと以外は、実施例１と同様の方法で接着テープを作製した。 Example 3
An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-3) was used instead of the composition (a-1).
　（実施例４）
　前記組成物（ａ－１）の乾燥後の厚さを５０μｍから１００μｍに変更し、かつ、前記接着剤組成物（ｂ－１）の乾燥後の厚さを５０μｍから２５μｍに変更したこと以外は、実施例１と同様の方法で接着テープを作製した。 Example 4
The thickness after drying of the composition (a-1) was changed from 50 μm to 100 μm, and the thickness after drying of the adhesive composition (b-1) was changed from 50 μm to 25 μm. An adhesive tape was produced in the same manner as in Example 1.
　（実施例５）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－４）を使用したこと以外は、実施例１と同様の方法で接着テープを作製した。 (Example 5)
An adhesive tape was produced in the same manner as in Example 1 except that the composition (a-4) was used instead of the composition (a-1).
　（実施例６）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－５）を使用し、かつ、前記接着剤組成物（ｂ－１）の代わりに前記接着剤組成物（ｂ－２）を使用すること以外は、実施例１と同様の方法で接着テープを作製した。 (Example 6)
The composition (a-5) is used instead of the composition (a-1), and the adhesive composition (b-2) is used instead of the adhesive composition (b-1). An adhesive tape was produced in the same manner as in Example 1 except that.
　（実施例７）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって層（Ａ－１）を作製した。 (Example 7)
On the surface of a release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 μm using a rod-shaped metal applicator. The layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
　次に、前記層（Ａ－１）の両面に、厚さ２５μｍのポリエチレンテレフタレートからなるフィルムを貼り合わせた。 Next, films made of polyethylene terephthalate having a thickness of 25 μm were bonded to both surfaces of the layer (A-1).
　次に、厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが２５μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層を２個作製した。 Next, the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator. Two adhesive layers were prepared by coating the film so that the thickness of the film became 25 μm and drying it with a dryer set at 75 ° C. for 10 minutes.
　次に、前記ポリエチレンテレフタレートからなるフィルムに、前記接着剤層を貼付し、２ｋｇのハンドローラーを用い、前記貼付物の上面を一往復させることによって、前記層（Ａ－１）の両面にポリエチレンテレフタレートフィルムが積層し、その表面に接着剤層が積層した接着テープを得た。 Next, the adhesive layer is affixed to the film made of polyethylene terephthalate, and the upper surface of the adhesive is reciprocated once using a 2 kg hand roller, whereby polyethylene terephthalate is applied to both sides of the layer (A-1). An adhesive tape in which films were laminated and an adhesive layer was laminated on the surface was obtained.
　（比較例１）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって、接着テープを得た。 (Comparative Example 1)
On the surface of a release film having one surface of a 75 μm thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 150 μm using a rod-shaped metal applicator. The adhesive tape was obtained by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
　（比較例２）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記組成物（ａ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが５０μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって層（Ａ－１）を作製した。 (Comparative Example 2)
On the surface of a release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound, the composition (a-1) is dried to a thickness of 50 μm using a rod-shaped metal applicator. The layer (A-1) was prepared by coating for 10 minutes and drying with a dryer set at 75 ° C. for 10 minutes.
　次に、厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１００μｍになるように塗工し７５℃に設定した乾燥機で１０分間乾燥することによって接着剤層（Ｂ－１）を作製した。 Next, the adhesive composition (b-1) is dried on the surface of the release film having one surface of a 75 μm-thick polyethylene terephthalate film peel-treated with a silicone compound using a rod-shaped metal applicator. The adhesive layer (B-1) was prepared by applying the coating to a thickness of 100 μm and drying for 10 minutes with a dryer set at 75 ° C.
　前記で得た層（Ａ－１）に、前記接着剤層（Ｂ－１）を貼付し、２ｋｇのハンドローラーを用い、前記貼付物の上面を一往復させることによって、前記層（Ａ－１）の片面に接着剤層（Ｂ－１）が積層した接着テープを得た。 The adhesive layer (B-1) is affixed to the layer (A-1) obtained above, and the layer (A-1) is reciprocated once by reciprocating the upper surface of the adhesive paste using a 2 kg hand roller. An adhesive tape having an adhesive layer (B-1) laminated on one side was obtained.
　（比較例３）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－２）を使用したこと以外は、比較例２と同様の方法で接着テープを作製した。 (Comparative Example 3)
An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-2) was used instead of the composition (a-1).
　（比較例４）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－３）を使用したこと以外は、比較例２と同様の方法で接着テープを作製した。 (Comparative Example 4)
An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-3) was used instead of the composition (a-1).
　（比較例５）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－４）を使用したこと以外は、比較例２と同様の方法で接着テープを作製した。 (Comparative Example 5)
An adhesive tape was produced in the same manner as in Comparative Example 2, except that the composition (a-4) was used instead of the composition (a-1).
　（比較例６）
　前記組成物（ａ－１）の代わりに前記組成物（ａ－５）を使用し、かつ、前記接着剤組成物（ｂ－１）の代わりに前記接着剤組成物（ｂ－２）を使用すること以外は、比較例２と同様の方法で接着テープを作製した。 (Comparative Example 6)
The composition (a-5) is used instead of the composition (a-1), and the adhesive composition (b-2) is used instead of the adhesive composition (b-1). An adhesive tape was produced in the same manner as in Comparative Example 2 except that.
　（比較例７）
　厚さ７５μｍのポリエチレンテレフタレートフィルムの片面がシリコーン化合物で剥離処理された離型フィルムの表面に、前記接着剤組成物（ｂ－１）を、棒状の金属アプリケータを用いて、乾燥後の厚さが１５０μｍになるように塗工し乾燥することによって、接着テープを得た。 (Comparative Example 7)
The thickness of the adhesive composition (b-1) after drying on the surface of a release film obtained by peeling one side of a 75 μm thick polyethylene terephthalate film with a silicone compound using a rod-shaped metal applicator Was coated to a thickness of 150 μm and dried to obtain an adhesive tape.
　［接着テープ、それを構成する層及び接着剤層の膨張率の測定方法］
　前記方法で作製した接着テープの厚さ、それを構成する各接着剤層の厚さを、厚み計を用いてそれぞれ測定した。 [Adhesive tape, layer constituting the same, and method for measuring expansion coefficient of adhesive layer]
The thickness of the adhesive tape produced by the above method and the thickness of each adhesive layer constituting it were measured using a thickness meter.
　また、前記接着テープを、１３０℃の環境下１時間放置することによって膨張させた。 Further, the adhesive tape was expanded by leaving it in an environment of 130 ° C. for 1 hour.
　次に、前記膨張後の接着テープの厚さ、それを構成する接着剤層の厚さを厚み計を用いてそれぞれ測定した。 Next, the thickness of the expanded adhesive tape and the thickness of the adhesive layer constituting it were measured using a thickness meter.
　前記層（Ａ）の膨張率は、以下の方法で算出した。 The expansion coefficient of the layer (A) was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する層（Ａ）の厚さを、２３℃環境下で測定した。 The thickness of the layer (A) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記層（Ａ）が膨張して形成した層（Ａ’）の厚さを測定した。 The adhesive tape after standing was taken out in a 23 ° C. environment, and the thickness of the layer (A ′) formed by immediately expanding the layer (A) was measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープを構成する層（Ａ）〔膨張し形成された層（Ａ’）〕の厚さ／前記放置前の接着テープを構成する層（Ａ）の厚さ］×１００
　前記粘着剤層（Ｂ）の膨張率は、以下の方法で算出した。 The expansion coefficient was calculated based on the measurement result and the following formula.
[Thickness of the layer (A) constituting the adhesive tape after standing] [Thickness of the layer (A ′) formed by swelling] / Thickness of the layer (A) constituting the adhesive tape before standing] × 100
The expansion coefficient of the pressure-sensitive adhesive layer (B) was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープを構成する接着剤層（Ｂ）の厚さを、２３℃環境下で測定した。 The thickness of the adhesive layer (B) constituting the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちに前記接着剤層（Ｂ）に相当する接着剤層（Ｂ’）の厚さを測定した。 The adhesive tape after the standing was taken out in a 23 ° C. environment, and the thickness of the adhesive layer (B ′) corresponding to the adhesive layer (B) was immediately measured.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープを構成する接着剤層（Ｂ’）の厚さ／前記放置前の接着テープを構成する接着剤層（Ｂ）の厚さ］×１００
　前記粘着テープの膨張率は、以下の方法で算出した。 The expansion coefficient was calculated based on the measurement result and the following formula.
[The thickness of the adhesive layer (B ′) constituting the adhesive tape after being left / the thickness of the adhesive layer (B) constituting the adhesive tape before being left] × 100
The expansion coefficient of the adhesive tape was calculated by the following method.
　１３０℃の環境下に１時間放置する前（膨張前）の前記接着テープの厚さを、２３℃環境下で測定した。 The thickness of the adhesive tape before being left for 1 hour in a 130 ° C. environment (before expansion) was measured in a 23 ° C. environment.
　前記接着テープを１３０℃の環境下に１時間放置した。 The adhesive tape was left in an environment at 130 ° C. for 1 hour.
　前記放置後の接着テープを２３℃環境下に取り出し、直ちにその厚さを測定した。 The adhesive tape after standing was taken out in a 23 ° C. environment and immediately measured for its thickness.
　上記測定結果と下記式に基づいて、前記膨張率を算出した。
［前記放置後の接着テープの厚さ／前記放置前の接着テープの厚さ］×１００ The expansion coefficient was calculated based on the measurement result and the following formula.
[Thickness of the adhesive tape after being left / thickness of the adhesive tape before being left] × 100
　［せん断接着力１の測定方法］
　脱脂処理した平滑な表面を有するアルミニウム板（幅１５ｍｍ×長さ７０ｍｍ×厚さ０．５ｍｍ）の表面に、１０ｍｍ×１０ｍｍの大きさに裁断した正方形の接着テープを載置した。前記接着テープの上面に、脱脂処理した平滑な表面を有する他のアルミニウム板（幅１５ｍｍ×長さ７０ｍｍ×厚み０．５ｍｍ）を載置し、これらをクリップで固定した。 [Measurement method of shear adhesive strength 1]
A square adhesive tape cut to a size of 10 mm × 10 mm was placed on the surface of a degreased smooth aluminum plate (width 15 mm × length 70 mm × thickness 0.5 mm). On the upper surface of the adhesive tape, another aluminum plate (width 15 mm × length 70 mm × thickness 0.5 mm) having a degreased smooth surface was placed, and these were fixed with clips.
　上記固定したものを、１３０℃で１時間加熱した後、２３℃環境下に３０分間放置し冷却した。 The above fixed one was heated at 130 ° C. for 1 hour and then left to stand in a 23 ° C. environment for 30 minutes to cool.
　次に、前記クリップを外したものを試験片とし、前記２枚のアルミニウム板の端部をそれぞれチャッキングし、引張試験機を用いて１８０度方向に引張速度５ｍｍ／分で引張試験することによって、前記接着テープの接着強度を求めた。 Next, the sample with the clip removed is used as a test piece, the ends of the two aluminum plates are chucked, and a tensile test is performed in a 180 ° direction at a tensile speed of 5 mm / min. The adhesive strength of the adhesive tape was determined.
　［せん断接着力２の測定方法］
　幅１５ｍｍ×長さ７０ｍｍ×厚さ０．５ｍｍの２枚の表面平滑なアルミニウム板（図１の「Ａ」）を脱脂処理し、一方のアルミニウム板（Ａ１）の片面の端部に、厚さ０．３００ｍｍの２本のスペーサー（図１の「Ｂ」）を、１２ｍｍの間をあけて平行に並べ、接着剤を用いて接着した。 [Measurement method of shear adhesive strength 2]
Two aluminum plates ("A" in FIG. 1) having a width of 15 mm, a length of 70 mm, and a thickness of 0.5 mm are degreased, and at one end of one aluminum plate (A1), the thickness is reduced. Two spacers of 0.300 mm (“B” in FIG. 1) were arranged in parallel with a gap of 12 mm, and adhered using an adhesive.
　次に、前記スペーサーの上部に、他方のアルミニウム板（Ａ２）を載置し、クリップで固定した。 Next, the other aluminum plate (A2) was placed on the spacer and fixed with a clip.
　次に、前記アルミニウム板（Ａ１）と（Ａ２）との間に形成された空隙に、１０ｍｍ×１０ｍｍの接着シート（図１の「Ｘ」）を挿入した。これを、１３０℃で１時間加熱することによって、２枚のアルミニウム板を熱接着させた。 Next, a 10 mm × 10 mm adhesive sheet (“X” in FIG. 1) was inserted into the gap formed between the aluminum plates (A1) and (A2). This was heated at 130 ° C. for 1 hour to thermally bond the two aluminum plates.
　次に、２３℃で３０分間冷却した後、前記クリップを除去したものの接着強度を、引張り試験機を用い、前記アルミニウム板の端部をそれぞれチャッキングして、引張速度５ｍｍ／分での引張り試験することによって測定した。 Next, after cooling at 23 ° C. for 30 minutes, the adhesive strength of the material from which the clip was removed was subjected to a tensile test at a tensile speed of 5 mm / min by chucking each end of the aluminum plate using a tensile tester. Measured by
　なお、比較例２～６で得た接着テープは、各接着剤層が下側になるよう、前記空隙内に載置（挿入）した。 The adhesive tapes obtained in Comparative Examples 2 to 6 were placed (inserted) in the gaps so that each adhesive layer was on the lower side.
　比較例２～６で得た接着テープを用いた場合、前記膨張によって、層（Ａ’）とアルミニウム板（Ａ２）とが接着されたものの、前記層（Ａ’）の表面に微細な凹凸が形成されてしまったため、アルミニウム板（Ａ２）に対して十分な接着力を発現できなかった。 When the adhesive tapes obtained in Comparative Examples 2 to 6 were used, although the layer (A ′) and the aluminum plate (A2) were bonded by the expansion, fine irregularities were formed on the surface of the layer (A ′). Since it was formed, sufficient adhesive force with respect to the aluminum plate (A2) could not be expressed.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
１　アルミニウム板（Ａ１）
２　アルミニウム板（Ａ２）
３　スペーサー
４　接着テープ
５　接着テープとアルミニウム板（Ａ２）との間の空隙 1 Aluminum plate (A1)
2 Aluminum plate (A2)
3 Spacer 4 Adhesive tape 5 Gap between adhesive tape and aluminum plate (A2)

Claims (9)

  1. 層（Ａ）の両面に、直接または他の層を介して、接着剤層（Ｂ）を有する接着テープであって、前記接着テープを１３０℃の環境下に１時間放置した後の、前記層（Ａ）の厚さ方向の膨張率〔前記放置後の層（Ａ）の厚さ／前記放置前の層（Ａ）の厚さ〕×１００が２００％以上であり、かつ、前記接着剤層（Ｂ）の厚さ方向の膨張率〔前記放置後の接着剤層（Ｂ）の厚さ／前記放置前の接着剤層（Ｂ）の厚さ〕×１００が１２０％以下であることを特徴とする接着テープ。 An adhesive tape having an adhesive layer (B) on both sides of the layer (A) directly or via another layer, the layer after leaving the adhesive tape in an environment of 130 ° C. for 1 hour The expansion coefficient in the thickness direction of (A) [the thickness of the layer (A) after being left / the thickness of the layer (A) before being left] × 100 is 200% or more, and the adhesive layer The expansion coefficient in the thickness direction of (B) [the thickness of the adhesive layer (B) after being left / the thickness of the adhesive layer (B) before being left) × 100 is 120% or less. Adhesive tape.
  2. 前記層（Ａ）が、加熱または光照射によって膨張しうる層である請求項１に記載の接着テープ。 The adhesive tape according to claim 1, wherein the layer (A) is a layer that can expand by heating or light irradiation.
  3. 前記層（Ａ）が、熱硬化性樹脂及び膨張剤を含有する組成物を用いて形成された層である請求項１または２に記載の接着テープ。 The adhesive tape according to claim 1 or 2, wherein the layer (A) is a layer formed using a composition containing a thermosetting resin and an expansion agent.
  4. 前記接着剤層（Ｂ）が熱硬化性接着剤層または感圧接着剤層である請求項１～３のいずれか１項に記載の接着テープ。 The adhesive tape according to any one of claims 1 to 3, wherein the adhesive layer (B) is a thermosetting adhesive layer or a pressure-sensitive adhesive layer.
  5. 前記層（Ａ）が１μｍ以上の厚さを有するものであり、かつ、前記接着剤層（Ｂ）が合計５μｍ以上の厚さを有するものである請求項１～４のいずれか１項に記載の接着テープ。 5. The layer according to claim 1, wherein the layer (A) has a thickness of 1 μm or more, and the adhesive layer (B) has a total thickness of 5 μm or more. Adhesive tape.
  6. 前記層（Ａ）の少なくとも片面側に、樹脂フィルムまたは金属からなる層（Ｃ）を介して、前記接着剤層（Ｂ）を有するものである請求項１～５のいずれか１項に記載の接着テープ。 The adhesive layer (B) according to any one of claims 1 to 5, wherein the adhesive layer (B) is provided on at least one side of the layer (A) via a resin film or a layer (C) made of metal. Adhesive tape.
  7. 被着体が有する空隙に、請求項１～６のいずれか１項に記載の接着テープを載置した後、少なくとも前記層（Ａ）を刺激し膨張させることによって、前記空隙内の２以上の箇所が前記接着テープによって接着された構成を有することを特徴とする物品。 After the adhesive tape according to any one of claims 1 to 6 is placed in the gap of the adherend, at least the layer (A) is stimulated and expanded, so that two or more in the gap An article having a configuration in which a portion is bonded by the adhesive tape.
  8. 前記層（Ａ）が膨張することによって形成された層（Ａ’）が、多孔構造を有する層である請求項７に記載の物品。 The article according to claim 7, wherein the layer (A ') formed by expanding the layer (A) is a layer having a porous structure.
  9. 請求項１～８のいずれか１項に記載の接着テープの少なくとも片面の接着剤層（Ｂ）と、磁石の一部とを接着させたものを、モーターを構成するコア部材が有する空隙に載置した後、少なくとも前記層（Ａ）を刺激し膨張させることによって、前記磁石が前記空隙内で固定された構成を有することを特徴とするモーター。 The adhesive tape (B) of at least one side of the adhesive tape according to any one of claims 1 to 8 and a part of the magnet are mounted in a gap of a core member constituting the motor. A motor having a configuration in which the magnet is fixed in the gap by stimulating and expanding at least the layer (A) after being placed.
PCT/JP2015/064266 2014-06-11 2015-05-19 Adhesive tape, article, and motor WO2015190234A1 (en)

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EP3621181A4 (en) * 2017-08-21 2020-05-20 Aisin Aw Co., Ltd. Rotor manufacturing method and rotor manufacturing device

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JP2013023559A (en) * 2011-07-20 2013-02-04 Three M Innovative Properties Co Thermosetting thermally expandable bonding sheet and method of producing the same

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WO2017197087A1 (en) * 2016-05-12 2017-11-16 3M Innovative Properties Company Structural adhesive film, metal member assembly, and method for manufacturing the same
EP3621181A4 (en) * 2017-08-21 2020-05-20 Aisin Aw Co., Ltd. Rotor manufacturing method and rotor manufacturing device

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