WO2015188491A1 - Organic electroluminescent display panel and encapsulation method therefor, and display device - Google Patents

Organic electroluminescent display panel and encapsulation method therefor, and display device Download PDF

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Publication number
WO2015188491A1
WO2015188491A1 PCT/CN2014/086810 CN2014086810W WO2015188491A1 WO 2015188491 A1 WO2015188491 A1 WO 2015188491A1 CN 2014086810 W CN2014086810 W CN 2014086810W WO 2015188491 A1 WO2015188491 A1 WO 2015188491A1
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Prior art keywords
layer
display panel
device substrate
functional
package cover
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PCT/CN2014/086810
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French (fr)
Chinese (zh)
Inventor
宋文峰
罗程远
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京东方科技集团股份有限公司
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Publication of WO2015188491A1 publication Critical patent/WO2015188491A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • At least one embodiment of the present invention is directed to an organic electroluminescence display panel, a packaging method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • the organic luminescent materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen.
  • the presence of trace amounts of water and oxygen tends to cause device failure.
  • a large amount of heat is generated during the luminescence process and heat is often concentrated in specific parts.
  • the rapid transfer of heat also affects the lifetime of OLED devices.
  • At least one embodiment of the present invention provides an organic electroluminescence display panel, a packaging method thereof, and a display device, to avoid OLED device in an OLED device package structure being affected by water and oxygen erosion, without increasing packaging cost and packaging the complexity.
  • At least one embodiment of the present invention provides an organic electroluminescence display panel including a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover; the package protection structure includes a vertical In the multi-layer functional layer of the device substrate and the package cover, the functional layer comprises a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is a water blocking layer.
  • At least one embodiment of the present invention further provides a display device including the above-described organic electroluminescence display panel.
  • At least one embodiment of the present invention also provides a method of packaging an organic electroluminescent display panel.
  • the organic electroluminescent display panel includes a device substrate and a package cover, and a package protection structure is disposed between the device substrate and the package cover;
  • the packaging method includes: on the device substrate and the package A functional layer perpendicular to the device substrate and the package cover is formed between the cover plates as a package protection structure, the functional layer includes a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is blocked Water layer.
  • FIG. 1 is a cross-sectional view showing a package structure of an OLED device in an embodiment of the present invention
  • FIG. 2 is a top plan view of a package structure of the OLED device of FIG. 1;
  • a to c are schematic diagrams of forming an organic light emitting diode, a accommodating cavity and a water blocking layer on the device substrate;
  • 4 to a is a schematic view showing the formation of a buffer layer, a heat dissipation layer and a moisture absorbing layer on the package cover;
  • 5 to 7 are top views of package structures of other OLED devices in the embodiment of the present invention.
  • 1 device substrate; 2: package cover; 3: organic light emitting diode; 4: accommodating cavity; 5: water blocking layer; 6: moisture absorbing layer; 7: heat dissipation layer; 8: buffer layer.
  • the package structure of the OLED device is such that a functional layer such as a heat dissipation layer, a water blocking layer, and a dry layer (also called a moisture absorption layer) is sequentially stacked on the OLED device from bottom to top in a certain order, which correspondingly The spacing between the package cover and the TFT (Thin Film Transistor) substrate is increased, so that the OLED device is more susceptible to water and oxygen erosion on a horizontal level.
  • a functional layer such as a heat dissipation layer, a water blocking layer, and a dry layer (also called a moisture absorption layer) is sequentially stacked on the OLED device from bottom to top in a certain order, which correspondingly The spacing between the package cover and the TFT (Thin Film Transistor) substrate is increased, so that the OLED device is more susceptible to water and oxygen erosion on a horizontal level.
  • TFT Thin Film Transistor
  • a common and effective packaging method is to use the method of "dry material + encapsulant + groove cover" for OLED packaging, the method includes: The cover is fastened on the OLED device, and the groove cover and the device substrate are sealed and sealed by a sealant.
  • the inner cover of the groove cover is provided with a dry material, and the dry material is directly above the device substrate.
  • the groove cover is processed by an etching method, which increases the production cost of the product.
  • each package functional layer such as a water-blocking layer, a heat-dissipating layer, a moisture-absorbing layer, and the like
  • the layer structure of each package functional layer is easily stacked to form an OLED device which is susceptible to water and oxygen attack. , thereby affecting the display quality of the display device.
  • an organic electroluminescence display panel including: a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover;
  • the structure includes a plurality of functional layers perpendicular to the device substrate and the package cover, the functional layer including a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, the outermost layer of the functional layer being a water blocking layer.
  • the functional layer formed by the combination of the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is alternately distributed perpendicular to the device substrate and the package cover plate, so that the functional layers are alternately arranged in the same layer, that is, the heat dissipation adhesive material,
  • the three kinds of adhesive materials of the moisture absorbing layer rubber and/or the water blocking rubber material are interspersed and arranged.
  • the embodiment of the invention can effectively reduce the distance between the device substrate and the package cover plate, reduce the lateral water oxygen erosion area, and effectively dissipate the heat generated by the OLED device uniformly and rapidly, and
  • the structure is simple, the package is simple, and the package cost and package complexity are not increased.
  • the organic electroluminescent display panel of the present embodiment includes a device substrate 1 and a package cover 2 , and a package protection structure is formed between the device substrate 1 and the package cover 2 ;
  • the package protection structure includes a device substrate perpendicular to the device 1 and a plurality of functional layers of the package cover 2, each functional layer being a water blocking layer 5, and a moisture absorbing layer 6 and/or a heat dissipation layer 7, respectively, and the outermost layer of the packaging protection structure is a water blocking layer.
  • an organic light emitting diode 3 may be formed on the device substrate 1, and an accommodating cavity 4 is disposed outside the organic light emitting diode 3, and the accommodating cavity 4 is located between the device substrate 1 and each functional layer.
  • the accommodating cavity 4 may be made of a waterproof material to protect the OLED 3 from water vapor, and to prevent the water vapor from eroding the organic light emitting diode 3 during the formation of other structures later.
  • the outermost layer in the embodiment of the present invention means that it is closer to the outer side in the direction parallel to the device substrate.
  • the embodiment of the present invention does not limit the manner of disposing the moisture absorbing layer and the heat dissipating layer, and may include the moisture absorbing layer and the heat dissipating layer, and may also include one of the moisture absorbing layer and the heat dissipating layer.
  • the display panel may include a moisture absorbing layer and a heat dissipation layer, which can The function of the moisture absorbing layer and the heat dissipating layer has a good moisture absorption effect and also contributes to the heat dissipation of the panel.
  • a buffer layer 8 may be formed on the surface of the encapsulation cover 2, the buffer layer 8 being located above each functional layer inside the outermost water blocking layer.
  • the water blocking layer 5 functions to prevent water from invading the water; the moisture absorbing layer 6 absorbs water vapor to prevent moisture from intruding into the interior of the OLED device; the heat dissipation layer 7 absorbs heat and dissipates heat, and rapidly absorbs and diffuses heat generated by the OLED device, thereby dissipating heat.
  • the buffer layer 8 can be a heat dissipation function layer or a moisture absorption function layer to further function as heat dissipation and moisture absorption, and can effectively buffer the heat dissipation property of the heat dissipation adhesive and the moisture absorption of the moisture absorption adhesive material.
  • the functional layer shown in FIG. 1 is combined into a structure in which three functional layers of the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 are combined.
  • the functional layer combinations may also be Add a moisture absorbing layer to the water blocking layer, or add a heat dissipation layer to the water blocking layer.
  • the water-blocking layer is a functional layer that must be possessed to prevent the external water vapor from eroding the OLED device.
  • the outermost water blocking layer 5 has a ring shape in a section parallel to the direction of the device substrate, such as a rectangular ring.
  • the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 located inside the outermost water blocking layer 5 are parallel to the cross section of the device substrate (the cross sections described below are all parallel to the direction of the device substrate). It is a long strip rectangle, which is also a plate shape.
  • the block-shaped water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are alternately arranged to form a water blocking layer 5 arranged at intervals, and the moisture absorbing layer 6 is alternately disposed between the adjacent water blocking layers 5 and
  • the heat dissipation layer 7, each side of the water blocking layer 5 is a moisture absorbing layer 6 and a heat dissipation layer 7, respectively, each layer of the moisture absorbing layer 6 is a water blocking layer 5, and each layer of the heat dissipation layer 7 is also a water blocking layer. 5.
  • the arrangement of the water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 is not limited to the structure shown in FIG. 2, and the sectional shape of each functional layer may be from a rectangle, a rectangular ring, a circle, a ring, an ellipse.
  • the geometric shapes such as L-shaped, U-shaped, V-shaped, or triangular are randomly selected, and the functional layer structures are alternately interposed and arranged alternately, as shown in the structures of FIGS. 5 to 7.
  • the outermost water blocking layer 5 is annular, and its cross section is a rectangular ring.
  • the innermost water blocking layer 5 is internally nested from the outside to the inside, and a hygroscopic layer having a rectangular ring shape is sequentially arranged.
  • the water blocking layer 5, the rectangular ring is a rectangular moisture absorbing layer 6, and the rectangular annular heat absorbing layer 6 and the water blocking layer 5 are respectively provided with a heat dissipation layer 7 having a rectangular strip shape, which makes the water blocking layer 5
  • the moisture absorbing layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly, so that the water and oxygen barrier ability in all directions can be enhanced.
  • each functional layer structure is equivalent to dividing the upper and lower two regions on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 and the heat dissipation layer 7 are disposed in the same manner in each region, and each region is provided.
  • a plurality of moisture absorbing layers 6 having a rectangular strip shape are disposed at intervals, and two spaced apart heat dissipation layers 7 having a circular cross section are disposed between the adjacent two moisture absorbing layers 6, which makes the water blocking layer 5 and moisture absorbing.
  • the layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly.
  • each functional layer structure is equivalent to forming a plurality of columns of moisture absorbing layers 6 on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 has a rectangular strip shape in section, and each column of moisture absorbing layers 6 is divided into intervals.
  • a row of heat dissipation layers 7 is disposed between the adjacent two columns of moisture absorbing layers 6.
  • the heat dissipation layer 7 is also in the form of a rectangular strip.
  • the heat dissipation layer 7 is located at a gap between the two moisture absorption layers 6 in the longitudinal direction. This enables the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 to be disposed in each direction and distributed relatively uniformly.
  • the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 may be respectively attached on the device substrate 1 and the package cover 2, that is, the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 respectively
  • the device substrate 1 and the package cover 2 are in contact, so that a better sealing effect can be achieved, which is advantageous for blocking water oxygen and heat dissipation.
  • the buffer layer 8 may be a heat dissipation functional layer that may be formed of a fluorocarbon, or an organic polymer doped with carbon nanotubes or graphene, or doped with iron, or copper, or nitrided.
  • the detailed reaction equation is as follows:
  • the buffer layer 8 is capable of absorbing a small amount of moisture remaining in the OLED device and invading from the edge; and the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption region.
  • the water blocking layer 5 may be formed of any one or a combination of several of SiNx, SiOx, a hydrophobic epoxy resin.
  • the moisture absorbing layer 6 may be formed of an organic substance that reacts with water.
  • the heat dissipation layer 7 may be formed of an organic polymer doped with a metal having good thermal conductivity such as iron, or copper, or aluminum nitride, or aluminum oxide, and may also be made of a fluorocarbon or doped with carbon.
  • a metal having good thermal conductivity such as iron, or copper, or aluminum nitride, or aluminum oxide
  • An organic polymer of a thermally conductive inorganic substance such as a nanotube or graphene is formed.
  • At least one embodiment of the present invention further provides a display device, which may be: a television, an OLED display, a digital photo frame, a mobile phone, a tablet computer, etc., having any display function. Product or part.
  • the packaging method comprises: first preparing a device substrate and a package cover, the device substrate comprises an organic light emitting diode; then forming a package protection structure between the device substrate and the package cover, the package protection structure comprises a plurality of functional layers, a multi-layer functional layer As the water blocking layer, and the moisture absorbing layer and/or the heat dissipation layer, the outermost layer of the functional layer is a water blocking layer.
  • each functional layer has multiple layers, with different functional layers interspersed alternately.
  • a part of the functional layer is first formed on the device substrate, and the remaining functional layers are formed on the package cover; then the device substrate and the package cover are pressed together, and the device substrate is The upper functional layer and the functional layer on the package cover are nested.
  • each functional layer is first formed on a device substrate, and then the package cover is pressed onto the device substrate.
  • each functional layer is first formed on a package cover and then the device substrate is pressed onto the package cover.
  • a buffer layer parallel to the package cover and attached to the surface of the package cover is formed, and the buffer layer is located inside the outermost water barrier layer.
  • the buffer layer is a heat dissipation functional layer or a moisture absorption functional layer.
  • the buffer layer when the buffer layer is a heat dissipation functional layer, it may be composed of a fluorocarbon or a carbon doped An organic polymer of nanotubes or graphene is formed; for example, when the buffer layer is a hygroscopic functional layer, it may be formed of an alkenyl group-containing monomer organic having two electron withdrawing groups of -CN and -COOR.
  • the heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture.
  • an OLED device 3 (shown in FIG. 3a), a moisture-proof accommodating cavity 4 (shown in FIG. 3b), and a device substrate perpendicular to the OLED device 3 are sequentially formed on the device substrate 1.
  • a buffer layer 8 (shown in FIG. 4a), and a second functional layer (shown in FIG. 4b) and a third functional layer perpendicular to the package cover 2 are sequentially formed on the package cover 2 (FIG. 4c). Shown).
  • the second functional layer may be the heat dissipation layer 7
  • the third functional layer may be the moisture absorption layer 6.
  • the device substrate and the package cover are pressed together, the moisture absorbing layer 6 and the heat dissipation layer 7 are embedded in the gap between the plurality of water blocking layers 5, and the water blocking layer 5 is embedded in the gap between the moisture absorbing layer 6 and the heat dissipation layer 7,
  • the water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are arranged at intervals, and the outermost layer of each functional layer structure is a water blocking layer 5.
  • the buffer layer 8 is a heat dissipation functional layer or a moisture absorption functional layer.
  • the buffer layer may be integrally formed with the same rubber material as the heat dissipation layer 7, for example, it may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene;
  • the buffer layer is a moisture absorbing functional layer, it may be integrally formed with the same moisture-absorbing layer 6 as a moisture-absorbing layer 6, for example, it may be formed of an organic group-containing monomer having two electron-withdrawing groups of -CN and -COOR.
  • the heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture.
  • the specific functional layer corresponding to the first functional layer, the second functional layer and the third functional layer is not limited to the above-mentioned distribution mode.
  • the first functional layer may be a moisture absorption layer, the second functional layer and the third layer.
  • the functional layer is a water blocking layer and a heat dissipation layer, or the first functional layer is a heat dissipation layer, and the second functional layer and the third functional layer are a water blocking layer and a moisture absorbing layer, and only need to satisfy the cross arrangement of each functional layer structure and the outermost layer
  • the structure is a water blocking layer.
  • an inorganic water blocking layer (SiNx, SiOx, etc.) may be deposited on the device substrate as the moisture-proof accommodating cavity 4, for example, by enhanced chemical vapor deposition and atomic layer deposition. Etching is carried out in other ways.
  • the buffer layer 8 can be produced on the package cover by spin coating, ink jet printing or the like.
  • the buffer layer 8 may be a heat dissipation functional layer, and may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene, and can efficiently absorb heat transferred from the axial heat dissipation layer and timely dissipate heat.
  • These monomers are easily polymerized with nucleophilic materials such as H 2 O and RCH 2 OH to enable polymerization Absorbs a small amount of moisture remaining in the OLED device and invading from the edge, while the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption zone.
  • the water blocking layer may be attached to the device substrate by a film coater or the like, and the water blocking layer may be formed of any one or a combination of a polymer of SiNx, SiOx, and a hydrophobic epoxy resin.
  • the heat dissipation layer formed on the package cover plate may be mainly formed of an organic polymer doped with a metal having good thermal conductivity such as iron or copper; or the heat dissipation layer may be made of a thermally conductive inorganic material doped with carbon nanotubes or graphene. The composition of the organic polymer.
  • the moisture absorbing layer may be attached to the package cover by a film coater or the like, and the hydrophilic material forming the moisture absorbing layer may be mainly a sheet-like rubber material doped with inorganic nanoparticles having high hygroscopicity such as CaO or MgO.
  • the packaging method is similar to that of the example 1, except that when the first package portion is prepared, the second functional layer and the third functional layer are formed perpendicular to the device substrate, and perpendicular to the package cover when the second package portion is prepared.
  • a first functional layer is formed.
  • the first functional layer, the second functional layer and the third functional layer can be arbitrarily distributed from the three functional layer structures of the water blocking layer, the moisture absorbing layer and the heat dissipation layer, and the different effects brought about by the different preparation processes are formed and formed.
  • the buffer layer can be integrally formed with the heat dissipation layer or the moisture absorption layer to simplify the manufacturing process.
  • an organic light-emitting diode is fabricated on the prepared device substrate, and then the moisture-receiving cavity is covered on the organic light-emitting diode. Then, a plurality of heat dissipation layers are alternately applied on a surface perpendicular to the accommodating cavity and the device substrate, and the device substrate structure is completed. Then, a buffer layer parallel to the surface of the package cover is attached to the surface of the prepared package cover.
  • the buffer layer functions as a moisture absorbing functional layer, so that an alternating moisture absorbing layer can be formed perpendicular to the surface of the buffer layer before the buffer layer is applied, so that a single covering operation can be realized, and both the buffer layer and the moisture absorbing layer are formed on the package cover.
  • the water blocking layer is alternately inserted between the formed moisture absorbing layers; then, the device substrate and the package cover are pressed together, and the heat dissipation layer on the device substrate and the moisture absorbing layer and the water blocking layer on the package cover plate are correspondingly Nesting, complete the packaging of the organic electroluminescent display panel.
  • the packaging process of the display panel of other different structures is not further described herein.
  • the functional layer formed by the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is perpendicularly distributed to the device substrate and the package cover plate, so that the functional layers are arranged in the same layer.
  • the three kinds of adhesive materials namely heat-dissipating adhesive material, moisture-absorbing adhesive material and water-resisting adhesive material, are inserted and arranged, which can effectively reduce the distance between the device substrate and the package cover plate and reduce lateral water oxygen.
  • the eroded area effectively dissipates the heat generated by the OLED device evenly and quickly, and has a simple structure and a simple package, which does not increase packaging cost and package complexity.

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Abstract

An organic electroluminescent display panel and an encapsulation method therefor, and a display device. The display panel comprises a device substrate (1) and an encapsulation cover plate (2), wherein an encapsulation protection structure is manufactured between the device substrate (1) and the encapsulation cover plate (2). The encapsulation protection structure comprises a functional layer which is perpendicular to the device substrate (1) and the encapsulation cover plate (2), wherein the functional layer comprises a water-resistant layer (5), a moisture absorption layer (6) and/or a heat dissipation layer (7); and the outermost layer of the functional layer is the water-resistant layer (5). The display panel can reduce a lateral water oxygen erosion area, and effectively emit the heat generated by an organic light-emitting diode (3) uniformly and rapidly.

Description

有机电致发光显示面板及其封装方法、显示装置Organic electroluminescence display panel, packaging method thereof, and display device 技术领域Technical field
本发明的至少一个实施例涉及一种有机电致发光显示面板及其封装方法、显示装置。At least one embodiment of the present invention is directed to an organic electroluminescence display panel, a packaging method thereof, and a display device.
背景技术Background technique
OLED(Organic Light-Emitting Diode，有机发光二极管)器件由于其具有的全固态结构、高亮度、全视角、响应速度快、工作温度范围宽、可实现柔性显示等一系列优点，目前已经成为极具竞争力和发展前景的下一代显示技术。OLED (Organic Light-Emitting Diode) devices have become a very popular one because of their all-solid-state structure, high brightness, full viewing angle, fast response, wide operating temperature range, and flexible display. Next-generation display technology for competitiveness and development prospects.
OLED器件中使用的有机发光材料和阴极材料对水和氧气特别敏感，微量水氧的存在往往会使器件失效；同时，发光过程中会有大量的热产生且热量常常聚集于特定部位，若不能迅速地将热量转移，同样对OLED器件的寿命造成影响。The organic luminescent materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen. The presence of trace amounts of water and oxygen tends to cause device failure. At the same time, a large amount of heat is generated during the luminescence process and heat is often concentrated in specific parts. The rapid transfer of heat also affects the lifetime of OLED devices.
发明内容Summary of the invention
本发明的至少一个实施例提供了一种有机电致发光显示面板及其封装方法、显示装置，以避免OLED器件封装结构中的OLED器件受水氧侵蚀的影响，且不会增加封装成本和封装复杂度。At least one embodiment of the present invention provides an organic electroluminescence display panel, a packaging method thereof, and a display device, to avoid OLED device in an OLED device package structure being affected by water and oxygen erosion, without increasing packaging cost and packaging the complexity.
本发明的至少一个实施例提供了一种有机电致发光显示面板，其包括器件基板和封装盖板，所述器件基板和封装盖板之间制作有封装防护结构；所述封装防护结构包括垂直于所述器件基板和封装盖板的多层功能层，所述功能层包括阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。At least one embodiment of the present invention provides an organic electroluminescence display panel including a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover; the package protection structure includes a vertical In the multi-layer functional layer of the device substrate and the package cover, the functional layer comprises a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is a water blocking layer.
本发明的至少一个实施例进一步提供了一种显示装置，其包括上述有机电致发光显示面板。At least one embodiment of the present invention further provides a display device including the above-described organic electroluminescence display panel.
本发明的至少一个实施例还提供了一种有机电致发光显示面板的封装方法。所述有机电致发光显示面板包括器件基板和封装盖板，所述器件基板和封装盖板之间具有封装防护结构；所述封装方法包括：在所述器件基板和封 装盖板之间形成与器件基板和封装盖板垂直的功能层作为封装防护结构，所述功能层包括阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。At least one embodiment of the present invention also provides a method of packaging an organic electroluminescent display panel. The organic electroluminescent display panel includes a device substrate and a package cover, and a package protection structure is disposed between the device substrate and the package cover; the packaging method includes: on the device substrate and the package A functional layer perpendicular to the device substrate and the package cover is formed between the cover plates as a package protection structure, the functional layer includes a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, and the outermost layer of the functional layer is blocked Water layer.
附图说明DRAWINGS
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, and are not intended to limit the present invention. .
图1是本发明实施例中OLED器件的封装结构剖视图；1 is a cross-sectional view showing a package structure of an OLED device in an embodiment of the present invention;
图2是图1中OLED器件的封装结构俯视图；2 is a top plan view of a package structure of the OLED device of FIG. 1;
图3中a至c是器件基板上有机发光二极管、容置腔及阻水层的形成示意图；In FIG. 3, a to c are schematic diagrams of forming an organic light emitting diode, a accommodating cavity and a water blocking layer on the device substrate;
图4中a至c是封装盖板上缓冲层、散热层及吸湿层的形成示意图；4 to a is a schematic view showing the formation of a buffer layer, a heat dissipation layer and a moisture absorbing layer on the package cover;
图5至图7是本发明实施例中另外几种OLED器件的封装结构俯视图。5 to 7 are top views of package structures of other OLED devices in the embodiment of the present invention.
附图标记：Reference mark:
1：器件基板；2：封装盖板；3：有机发光二极管；4：容置腔；5：阻水层；6：吸湿层；7：散热层；8：缓冲层。1: device substrate; 2: package cover; 3: organic light emitting diode; 4: accommodating cavity; 5: water blocking layer; 6: moisture absorbing layer; 7: heat dissipation layer; 8: buffer layer.
具体实施方式detailed description
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions of the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.
本申请的发明人注意到，OLED器件的封装结构是将散热层、阻水层、干燥层(也叫吸湿层)等功能层按照一定的次序由下至上依次堆叠在OLED器件上，这相应地增加了封装盖板与TFT(Thin Film Transistor，薄膜场效应晶体管)基板的间距，使得OLED器件在水平层面上更容易遭受水氧的侵蚀。为了避免OLED器件水平层面上受水氧侵蚀，常用且有效的封装方法是采用“干燥材+封装胶+凹槽盖板”的方法进行OLED封装，该方法包括：将凹槽 盖板盖扣在OLED器件上，凹槽盖板与器件基板之间通过封框胶密封连接，在凹槽盖板的内顶盖上设置干燥材，干燥材位于器件基板正上方。在该方法中，凹槽盖板需采用刻蚀方法进行加工，这增加了产品的生产成本。The inventor of the present application has noted that the package structure of the OLED device is such that a functional layer such as a heat dissipation layer, a water blocking layer, and a dry layer (also called a moisture absorption layer) is sequentially stacked on the OLED device from bottom to top in a certain order, which correspondingly The spacing between the package cover and the TFT (Thin Film Transistor) substrate is increased, so that the OLED device is more susceptible to water and oxygen erosion on a horizontal level. In order to avoid the erosion of water and oxygen at the horizontal level of the OLED device, a common and effective packaging method is to use the method of "dry material + encapsulant + groove cover" for OLED packaging, the method includes: The cover is fastened on the OLED device, and the groove cover and the device substrate are sealed and sealed by a sealant. The inner cover of the groove cover is provided with a dry material, and the dry material is directly above the device substrate. In this method, the groove cover is processed by an etching method, which increases the production cost of the product.
OLED器件的封装结构中各封装功能层(如阻水层、散热层、吸湿层等任意组合的功能层)的各层结构按照上下层叠的方式设置时，容易使OLED器件受水氧侵蚀的影响，从而影响显示装置的显示质量。因此，本发明的至少一个实施例提供了一种有机电致发光显示面板，其包括：器件基板和封装盖板，所述器件基板和封装盖板之间制作有封装防护结构；所述封装防护结构包括垂直于所述器件基板和封装盖板的多个功能层，所述功能层包括阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。在该显示面板中，阻水层、散热层和/或吸湿层组合形成的功能层垂直于器件基板和封装盖板交替分布，这使得各功能层交替排列在同一层，即散热性胶材、吸湿层胶材和/或阻水性胶材三种胶材穿插排布。与上下层叠结构相比，本发明实施例能够有效的降低器件基板和封装盖板之间的距离，减少侧向水氧侵蚀面积，有效的将OLED器件产生的热量均匀、迅速的散发出去，并且结构简单、封装简便，不会增加封装成本和封装复杂度。In the package structure of the OLED device, the layer structure of each package functional layer (such as a water-blocking layer, a heat-dissipating layer, a moisture-absorbing layer, and the like) is easily stacked to form an OLED device which is susceptible to water and oxygen attack. , thereby affecting the display quality of the display device. Therefore, at least one embodiment of the present invention provides an organic electroluminescence display panel including: a device substrate and a package cover, and a package protection structure is formed between the device substrate and the package cover; The structure includes a plurality of functional layers perpendicular to the device substrate and the package cover, the functional layer including a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, the outermost layer of the functional layer being a water blocking layer. In the display panel, the functional layer formed by the combination of the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is alternately distributed perpendicular to the device substrate and the package cover plate, so that the functional layers are alternately arranged in the same layer, that is, the heat dissipation adhesive material, The three kinds of adhesive materials of the moisture absorbing layer rubber and/or the water blocking rubber material are interspersed and arranged. Compared with the upper and lower laminated structures, the embodiment of the invention can effectively reduce the distance between the device substrate and the package cover plate, reduce the lateral water oxygen erosion area, and effectively dissipate the heat generated by the OLED device uniformly and rapidly, and The structure is simple, the package is simple, and the package cost and package complexity are not increased.
实施例1Example 1
参照图1所示，本实施例的有机电致发光显示面板包括器件基板1和封装盖板2，器件基板1和封装盖板2之间制作有封装防护结构；封装防护结构包括垂直于器件基板1和封装盖板2的多层功能层，各功能层分别为阻水层5、以及吸湿层6和/或散热层7，封装防护结构的最外层为阻水层。Referring to FIG. 1 , the organic electroluminescent display panel of the present embodiment includes a device substrate 1 and a package cover 2 , and a package protection structure is formed between the device substrate 1 and the package cover 2 ; the package protection structure includes a device substrate perpendicular to the device 1 and a plurality of functional layers of the package cover 2, each functional layer being a water blocking layer 5, and a moisture absorbing layer 6 and/or a heat dissipation layer 7, respectively, and the outermost layer of the packaging protection structure is a water blocking layer.
在一个示例中，在器件基板1上还可以形成有有机发光二极管3，在有机发光二极管3的外部设置有容置腔4，所述容置腔4位于器件基板1和各功能层之间。例如，容置腔4可以采用防水材料制作，以保护有机发光二极管3使其免于受到水汽的侵蚀，避免后期形成其它结构的过程中水汽侵蚀有机发光二极管3。In one example, an organic light emitting diode 3 may be formed on the device substrate 1, and an accommodating cavity 4 is disposed outside the organic light emitting diode 3, and the accommodating cavity 4 is located between the device substrate 1 and each functional layer. For example, the accommodating cavity 4 may be made of a waterproof material to protect the OLED 3 from water vapor, and to prevent the water vapor from eroding the organic light emitting diode 3 during the formation of other structures later.
可以理解的是，本发明实施例所述的最外层是指其在平行于器件基板的方向更靠近于外侧。并且本发明实施例对吸湿层和散热层的设置方式不做限定，其可包括吸湿层和散热层，也可以包括吸湿层和散热层中的一种，例如，本发明实施例有机电致发光显示面板可以包括吸湿层和散热层，这样可以兼 有吸湿层和散热层的功能，在具有良好的吸湿效果的同时也有利于面板散热。It can be understood that the outermost layer in the embodiment of the present invention means that it is closer to the outer side in the direction parallel to the device substrate. The embodiment of the present invention does not limit the manner of disposing the moisture absorbing layer and the heat dissipating layer, and may include the moisture absorbing layer and the heat dissipating layer, and may also include one of the moisture absorbing layer and the heat dissipating layer. For example, the organic electroluminescence of the embodiment of the present invention. The display panel may include a moisture absorbing layer and a heat dissipation layer, which can The function of the moisture absorbing layer and the heat dissipating layer has a good moisture absorption effect and also contributes to the heat dissipation of the panel.
在一个示例中，封装盖板2的表面上可以形成有缓冲层8，缓冲层8位于最外层阻水层内部的各功能层上方。阻水层5起防水、遮挡水氧侵入的作用；吸湿层6吸附水汽，避免水份侵入OLED器件内部；散热层7吸热、散热，将OLED器件产生的热量迅速吸收并扩散出去，缓冲热量产生的形变；缓冲层8可以为散热功能层或吸湿功能层，以进一步起到散热和吸湿的作用，并且能够有效的缓冲散热性胶材吸热、吸湿性胶材吸水引起的膨胀效果。In one example, a buffer layer 8 may be formed on the surface of the encapsulation cover 2, the buffer layer 8 being located above each functional layer inside the outermost water blocking layer. The water blocking layer 5 functions to prevent water from invading the water; the moisture absorbing layer 6 absorbs water vapor to prevent moisture from intruding into the interior of the OLED device; the heat dissipation layer 7 absorbs heat and dissipates heat, and rapidly absorbs and diffuses heat generated by the OLED device, thereby dissipating heat. The resulting deformation; the buffer layer 8 can be a heat dissipation function layer or a moisture absorption function layer to further function as heat dissipation and moisture absorption, and can effectively buffer the heat dissipation property of the heat dissipation adhesive and the moisture absorption of the moisture absorption adhesive material.
图1中示出的功能层组合为阻水层5、吸湿层6和散热层7三种功能层相组合的结构，显然地，为了适应不同的显示面板结构的需要，各功能层组合也可以为阻水层加吸湿层，或者阻水层加散热层。阻水层是必须具备的功能层，能够首当其冲阻止外界水汽侵蚀OLED器件。The functional layer shown in FIG. 1 is combined into a structure in which three functional layers of the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 are combined. Obviously, in order to meet the needs of different display panel structures, the functional layer combinations may also be Add a moisture absorbing layer to the water blocking layer, or add a heat dissipation layer to the water blocking layer. The water-blocking layer is a functional layer that must be possessed to prevent the external water vapor from eroding the OLED device.
参照图2所示，在本实施例的一个示例中，最外层的阻水层5平行于器件基板方向的截面为环形，例如矩形环。在一个示例中，位于最外层阻水层5内部的阻水层5、吸湿层6和散热层7平行于器件基板方向的截面(下述的截面均为平行于器件基板方向的截面)均为长条状矩形，也即为板块状。在一个示例中，封装防护结构的各功能层可以均有多个，不同的功能层可以交替穿插布置。例如，如图2所示，板块状的阻水层5、吸湿层6和散热层7交替排列，形成间隔布置的阻水层5，相邻的阻水层5之间交替设置吸湿层6和散热层7，每层阻水层5的两侧分别为吸湿层6和散热层7，每层吸湿层6两侧都为阻水层5，每层散热层7两侧也都为阻水层5。Referring to FIG. 2, in an example of the present embodiment, the outermost water blocking layer 5 has a ring shape in a section parallel to the direction of the device substrate, such as a rectangular ring. In one example, the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 located inside the outermost water blocking layer 5 are parallel to the cross section of the device substrate (the cross sections described below are all parallel to the direction of the device substrate). It is a long strip rectangle, which is also a plate shape. In one example, there may be multiple functional layers of the encapsulation protection structure, and different functional layers may be alternately interspersed. For example, as shown in FIG. 2, the block-shaped water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are alternately arranged to form a water blocking layer 5 arranged at intervals, and the moisture absorbing layer 6 is alternately disposed between the adjacent water blocking layers 5 and The heat dissipation layer 7, each side of the water blocking layer 5 is a moisture absorbing layer 6 and a heat dissipation layer 7, respectively, each layer of the moisture absorbing layer 6 is a water blocking layer 5, and each layer of the heat dissipation layer 7 is also a water blocking layer. 5.
显然地，阻水层5、吸湿层6和散热层7的排布方式不局限于图2中所示的结构，各功能层的截面形状可以从矩形、矩形环、圆形、圆环、椭圆、L型、U型、V型、或三角形等几何形状中随意选择，各功能层结构之间可随意交替穿插排布，如图5至图7的结构所示。Obviously, the arrangement of the water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 is not limited to the structure shown in FIG. 2, and the sectional shape of each functional layer may be from a rectangle, a rectangular ring, a circle, a ring, an ellipse. The geometric shapes such as L-shaped, U-shaped, V-shaped, or triangular are randomly selected, and the functional layer structures are alternately interposed and arranged alternately, as shown in the structures of FIGS. 5 to 7.
例如，参照图5所示，最外层的阻水层5为环形，其截面为矩形环，最外层阻水层5内部由外至内依次嵌套设置有截面为矩形环状的吸湿层6、阻水层5，矩形环中心为矩形的吸湿层6，在矩形环状的吸湿层6和阻水层5上分别设置有截面为矩形条状的散热层7，这使得阻水层5、吸湿层6和散热层7能够在每个方向上都有设置且分布比较均匀，从而可以增强各个方向的水、氧阻隔能力。 For example, referring to FIG. 5, the outermost water blocking layer 5 is annular, and its cross section is a rectangular ring. The innermost water blocking layer 5 is internally nested from the outside to the inside, and a hygroscopic layer having a rectangular ring shape is sequentially arranged. 6. The water blocking layer 5, the rectangular ring is a rectangular moisture absorbing layer 6, and the rectangular annular heat absorbing layer 6 and the water blocking layer 5 are respectively provided with a heat dissipation layer 7 having a rectangular strip shape, which makes the water blocking layer 5 The moisture absorbing layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly, so that the water and oxygen barrier ability in all directions can be enhanced.
例如，参照图6所示，各功能层结构相当于在整个块状的阻水层5上划分了上下两个区域，两个区域内吸湿层6和散热层7的设置方式相同，每个区域内间隔布置了多个截面为矩形条状的吸湿层6，相邻的两个吸湿层6之间设置有两个间隔开的截面为圆形的散热层7，这使得阻水层5、吸湿层6和散热层7能够在每个方向上都有设置且分布比较均匀。For example, referring to FIG. 6, each functional layer structure is equivalent to dividing the upper and lower two regions on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 and the heat dissipation layer 7 are disposed in the same manner in each region, and each region is provided. A plurality of moisture absorbing layers 6 having a rectangular strip shape are disposed at intervals, and two spaced apart heat dissipation layers 7 having a circular cross section are disposed between the adjacent two moisture absorbing layers 6, which makes the water blocking layer 5 and moisture absorbing. The layer 6 and the heat dissipation layer 7 can be arranged in each direction and distributed relatively uniformly.
例如，参照图7所示，各功能层结构相当于在整个块状的阻水层5上形成了多列吸湿层6，吸湿层6截面为矩形条状，每列吸湿层6分为间隔开的两段，相邻的两列吸湿层6之间设置有一列散热层7，散热层7截面也为矩形条状，散热层7在长度方向上位于两段吸湿层6之间的间隙位置，这使得阻水层5、吸湿层6和散热层7能够在每个方向上都有设置且分布比较均匀。For example, referring to FIG. 7, each functional layer structure is equivalent to forming a plurality of columns of moisture absorbing layers 6 on the entire block-shaped water blocking layer 5, and the moisture absorbing layer 6 has a rectangular strip shape in section, and each column of moisture absorbing layers 6 is divided into intervals. In the two sections, a row of heat dissipation layers 7 is disposed between the adjacent two columns of moisture absorbing layers 6. The heat dissipation layer 7 is also in the form of a rectangular strip. The heat dissipation layer 7 is located at a gap between the two moisture absorption layers 6 in the longitudinal direction. This enables the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 to be disposed in each direction and distributed relatively uniformly.
本实施例的一个示例中，阻水层5、吸湿层6和散热层7可以分别贴覆在器件基板1和封装盖板2上，即阻水层5、吸湿层6和散热层7分别与器件基板1和封装盖板2接触，这样可以实现更好的封闭效果，有利于阻隔水氧和散热。在不同示例中，缓冲层8可以为散热功能层，其可以由氟碳化合物、或掺杂有碳纳米管或石墨烯的有机聚合物形成，或者由掺杂有铁、或铜、或氮化铝、或氧化铝等导热性好的金属的有机聚合物形成，其能够高效吸收轴向的散热层传至的热量，并及时将热量扩散出去，同时能够缓冲热量产生的形变。在不同示例中，缓冲层8也可以是吸湿功能层，可以由掺杂有Al、或Mg、或氧化钙、或氧化镁的聚合物形成；其也可以主要是一种与水反应的有机层(即水作为聚合反应引发剂)，例如，缓冲层8可以是一些具备两个强吸电子基团有机层，如-CN和-COOR的含烯基的单体，如NC-(ROOC)C＝CH2等。这些单体极易与亲核性物质，如H2O、RCH2OH进行聚合反应，详细反应方程式如下：In an example of the embodiment, the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 may be respectively attached on the device substrate 1 and the package cover 2, that is, the water blocking layer 5, the moisture absorbing layer 6, and the heat dissipation layer 7 respectively The device substrate 1 and the package cover 2 are in contact, so that a better sealing effect can be achieved, which is advantageous for blocking water oxygen and heat dissipation. In various examples, the buffer layer 8 may be a heat dissipation functional layer that may be formed of a fluorocarbon, or an organic polymer doped with carbon nanotubes or graphene, or doped with iron, or copper, or nitrided. It is formed of an organic polymer of a metal having good thermal conductivity such as aluminum or aluminum oxide, which can efficiently absorb the heat transferred to the axial heat dissipation layer and diffuse the heat in time, and can also buffer the deformation caused by the heat. In various examples, the buffer layer 8 may also be a hygroscopic functional layer, which may be formed of a polymer doped with Al, or Mg, or calcium oxide, or magnesium oxide; it may also be primarily an organic layer that reacts with water. (ie water as the polymerization initiator), for example, the buffer layer 8 may be an alkenyl group-containing monomer having two strong electron withdrawing group organic layers such as -CN and -COOR, such as NC-(ROOC)C =CH 2 and so on. These monomers are easily polymerized with nucleophilic materials such as H 2 O and RCH 2 OH. The detailed reaction equation is as follows:
Figure PCTCN2014086810-appb-000001
Figure PCTCN2014086810-appb-000001
缓冲层8能够吸收OLED器件中残余的及从边缘侵入的少量水分；同时聚合物层的弹性特性能够有效的缓冲吸湿区轴向的形变。The buffer layer 8 is capable of absorbing a small amount of moisture remaining in the OLED device and invading from the edge; and the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption region.
在不同示例中，阻水层5可以由SiNx、SiOx、疏水性环氧树脂的聚合物中的任意一种或几种的组合形成。在不同示例中，吸湿层6可以由与水反应的有机物形成，例如，吸湿层6可以主要由一些具备两个强吸电子基团的有机物形成，如-CN和-COOR的含烯基的单体，如NC-(ROOC)C＝CH2等，这些单体极易与亲核性物质，如H2O、RCH2OH进行聚合反应；吸湿层6也可以由掺杂有Al、或Mg、或氧化钙、或氧化镁的聚合物形成。在不同示例中，散热层7可以由掺杂有铁、或铜、或氮化铝、或氧化铝等导热性好的金属的有机聚合物形成，同样也可以由氟碳化合物或掺杂有碳纳米管或石墨烯等导热无机物的有机聚合物形成。In a different example, the water blocking layer 5 may be formed of any one or a combination of several of SiNx, SiOx, a hydrophobic epoxy resin. In a different example, the moisture absorbing layer 6 may be formed of an organic substance that reacts with water. For example, the moisture absorbing layer 6 may be formed mainly of some organic substances having two strong electron withdrawing groups, such as an alkenyl group containing -CN and -COOR. Such as NC-(ROOC)C=CH 2 , etc., these monomers are easily polymerized with nucleophilic substances such as H 2 O, RCH 2 OH; the moisture absorbing layer 6 may also be doped with Al, or Mg. Or a polymer of calcium oxide or magnesium oxide. In various examples, the heat dissipation layer 7 may be formed of an organic polymer doped with a metal having good thermal conductivity such as iron, or copper, or aluminum nitride, or aluminum oxide, and may also be made of a fluorocarbon or doped with carbon. An organic polymer of a thermally conductive inorganic substance such as a nanotube or graphene is formed.
基于上述有机电致发光显示面板，本发明实施例的至少一个实施例还提供了一种显示装置，该显示装置可以为：电视、OLED显示器、数码相框、手机、平板电脑等具有任何显示功能的产品或部件。Based on the above-mentioned organic electroluminescent display panel, at least one embodiment of the present invention further provides a display device, which may be: a television, an OLED display, a digital photo frame, a mobile phone, a tablet computer, etc., having any display function. Product or part.
实施例2Example 2
基于实施例1中提到的有机电致发光显示面板，本实施例对该种有机电致发光显示面板的封装方法进行描述。该封装方法包括：首先准备好器件基板和封装盖板，器件基板包括有机发光二极管；然后在器件基板和封装盖板之间形成封装防护结构，封装防护结构包括多层功能层，多层功能层为阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。在一个示例中，每一种功能层均有多层，不同的功能层之间交替穿插布置。Based on the organic electroluminescence display panel mentioned in Embodiment 1, the encapsulation method of the organic electroluminescence display panel is described in this embodiment. The packaging method comprises: first preparing a device substrate and a package cover, the device substrate comprises an organic light emitting diode; then forming a package protection structure between the device substrate and the package cover, the package protection structure comprises a plurality of functional layers, a multi-layer functional layer As the water blocking layer, and the moisture absorbing layer and/or the heat dissipation layer, the outermost layer of the functional layer is a water blocking layer. In one example, each functional layer has multiple layers, with different functional layers interspersed alternately.
在一个示例中，在显示面板的封装过程中，先将一部分功能层间隔形成在器件基板上，剩余部分功能层间隔形成在封装盖板上；然后将器件基板和封装盖板压合，器件基板上的功能层和封装盖板上的功能层对应嵌套。或者，在一个示例中，先将各功能层形成在器件基板上，然后将封装盖板压合在器件基板上。或者，在一个示例中，先将各功能层形成在封装盖板上，然后将器件基板压合在封装盖板上。在一个示例中，封装盖板上形成与其垂直的功能层之前，还形成有平行于封装盖板且贴附在封装盖板表面的缓冲层，缓冲层位于最外层阻水层内部的各功能层上方，缓冲层为散热功能层或吸湿功能层。例如，所述缓冲层为散热功能层时，其可以由氟碳化合物、或掺杂有碳 纳米管或石墨烯的有机聚合物形成；例如，所述缓冲层为吸湿功能层时，其可以由具备-CN和-COOR两个吸电子基团的含烯基单体有机物形成。散热功能层和吸湿功能层分别起散热或吸湿的作用。In one example, in the packaging process of the display panel, a part of the functional layer is first formed on the device substrate, and the remaining functional layers are formed on the package cover; then the device substrate and the package cover are pressed together, and the device substrate is The upper functional layer and the functional layer on the package cover are nested. Alternatively, in one example, each functional layer is first formed on a device substrate, and then the package cover is pressed onto the device substrate. Alternatively, in one example, each functional layer is first formed on a package cover and then the device substrate is pressed onto the package cover. In one example, before the functional layer perpendicular to the package cover is formed, a buffer layer parallel to the package cover and attached to the surface of the package cover is formed, and the buffer layer is located inside the outermost water barrier layer. Above the layer, the buffer layer is a heat dissipation functional layer or a moisture absorption functional layer. For example, when the buffer layer is a heat dissipation functional layer, it may be composed of a fluorocarbon or a carbon doped An organic polymer of nanotubes or graphene is formed; for example, when the buffer layer is a hygroscopic functional layer, it may be formed of an alkenyl group-containing monomer organic having two electron withdrawing groups of -CN and -COOR. The heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture.
下面以具体的两个示例来说明显示面板的详细封装过程。The detailed packaging process of the display panel will be described below with two specific examples.
示例1Example 1
首先，参照图3所示，在器件基板1上依次形成OLED器件3(图3a所示)、盖扣在OLED器件3上的防潮容置腔4(图3b所示)、以及垂直于器件基板1的多层第一功能层，第一功能层为阻水层5(图3c所示)。First, referring to FIG. 3, an OLED device 3 (shown in FIG. 3a), a moisture-proof accommodating cavity 4 (shown in FIG. 3b), and a device substrate perpendicular to the OLED device 3 are sequentially formed on the device substrate 1. A multilayer first functional layer of 1, the first functional layer being a water blocking layer 5 (shown in Figure 3c).
参照图4所示，在封装盖板2上依次形成缓冲层8(图4a所示)、以及垂直于封装盖板2的第二功能层(图4b所示)和第三功能层(图4c所示)。例如，第二功能层可以为散热层7，第三功能层可以为吸湿层6。Referring to FIG. 4, a buffer layer 8 (shown in FIG. 4a), and a second functional layer (shown in FIG. 4b) and a third functional layer perpendicular to the package cover 2 are sequentially formed on the package cover 2 (FIG. 4c). Shown). For example, the second functional layer may be the heat dissipation layer 7, and the third functional layer may be the moisture absorption layer 6.
其次，将器件基板和封装盖板压合，吸湿层6和散热层7嵌入多层阻水层5之间的间隙中，阻水层5嵌入吸湿层6和散热层7之间的间隙中，使阻水层5、吸湿层6和散热层7间隔排布且各功能层结构的最外层为一层阻水层5。Next, the device substrate and the package cover are pressed together, the moisture absorbing layer 6 and the heat dissipation layer 7 are embedded in the gap between the plurality of water blocking layers 5, and the water blocking layer 5 is embedded in the gap between the moisture absorbing layer 6 and the heat dissipation layer 7, The water blocking layer 5, the moisture absorbing layer 6 and the heat dissipation layer 7 are arranged at intervals, and the outermost layer of each functional layer structure is a water blocking layer 5.
所述缓冲层8为散热功能层或吸湿功能层。所述缓冲层为散热功能层时，可以和散热层7采用相同的胶材一体制作，例如，其可以由氟碳化合物、或掺杂有碳纳米管或石墨烯的有机聚合物形成；所述缓冲层为吸湿功能层时，可以和吸湿层6用相同的胶材一体制作，例如，其可以由具备-CN和-COOR两个吸电子基团的含烯基单体有机物形成。散热功能层和吸湿功能层分别起散热或吸湿的作用。上述第一功能层、第二功能层和第三功能层所对应的具体功能层不局限于上述的分配方式，例如，也可以设置为第一功能层为吸湿层，第二功能层和第三功能层为阻水层和散热层，或者第一功能层为散热层，第二功能层和第三功能层为阻水层和吸湿层，只需要满足各功能层结构交叉布置且最外一层结构为阻水层即可。The buffer layer 8 is a heat dissipation functional layer or a moisture absorption functional layer. When the buffer layer is a heat dissipation functional layer, it may be integrally formed with the same rubber material as the heat dissipation layer 7, for example, it may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene; When the buffer layer is a moisture absorbing functional layer, it may be integrally formed with the same moisture-absorbing layer 6 as a moisture-absorbing layer 6, for example, it may be formed of an organic group-containing monomer having two electron-withdrawing groups of -CN and -COOR. The heat dissipation function layer and the moisture absorption function layer respectively function to dissipate heat or absorb moisture. The specific functional layer corresponding to the first functional layer, the second functional layer and the third functional layer is not limited to the above-mentioned distribution mode. For example, the first functional layer may be a moisture absorption layer, the second functional layer and the third layer. The functional layer is a water blocking layer and a heat dissipation layer, or the first functional layer is a heat dissipation layer, and the second functional layer and the third functional layer are a water blocking layer and a moisture absorbing layer, and only need to satisfy the cross arrangement of each functional layer structure and the outermost layer The structure is a water blocking layer.
上述有机电致发光显示面板在制备的过程中，在器件基板上可以沉积一层无机阻水层(SiNx、SiOx等)作为防潮容置腔4，例如可通过增强型化学气相沉积、原子层沉积等方式进行沉积。在封装盖板上可以通过旋涂覆、喷墨打印等方式产生缓冲层8。例如，缓冲层8可以为散热功能层，可以由氟碳化合物、或掺杂有碳纳米管或石墨烯的有机聚合物形成，能够高效吸收轴向 的散热层传至的热量，并及时将热量扩散出去，同时能够缓冲热量产生的形变；例如，缓冲层8也可以是吸湿功能层，可以主要为与水反应的有机层，例如可以由具备两个强吸电子基团的有机层形成，如-CN和-COOR的含烯基的单体，如NC-(ROOC)C＝CH2等，这些单体极易与亲核性物质，如H2O、RCH2OH进行聚合反应，从而能够吸收OLED器件中残余的及从边缘侵入的少量水分，同时聚合物层的弹性特性能够有效的缓冲吸湿区轴向的形变。In the preparation process of the above organic electroluminescent display panel, an inorganic water blocking layer (SiNx, SiOx, etc.) may be deposited on the device substrate as the moisture-proof accommodating cavity 4, for example, by enhanced chemical vapor deposition and atomic layer deposition. Etching is carried out in other ways. The buffer layer 8 can be produced on the package cover by spin coating, ink jet printing or the like. For example, the buffer layer 8 may be a heat dissipation functional layer, and may be formed of a fluorocarbon compound or an organic polymer doped with carbon nanotubes or graphene, and can efficiently absorb heat transferred from the axial heat dissipation layer and timely dissipate heat. Diffusion, while being able to buffer the deformation caused by heat; for example, the buffer layer 8 may also be a hygroscopic functional layer, which may be mainly an organic layer reactive with water, for example, may be formed of an organic layer having two strong electron-withdrawing groups, such as -CN and -COOR alkenyl-containing monomers, such as NC-(ROOC)C=CH 2 , etc. These monomers are easily polymerized with nucleophilic materials such as H 2 O and RCH 2 OH to enable polymerization Absorbs a small amount of moisture remaining in the OLED device and invading from the edge, while the elastic properties of the polymer layer can effectively buffer the axial deformation of the moisture absorption zone.
此外，阻水层可以通过贴膜机等方式贴覆到器件基板上，所述阻水层可以由SiNx、SiOx、疏水性环氧树脂的聚合物中的任意一种或几种的组合形成。同时在封装盖板上形成的散热层可以主要由掺杂有铁、铜等导热性好的金属的有机聚合物形成；或者，散热层也可以由掺杂有碳纳米管或石墨烯等导热无机物的有机聚合物构成。吸湿层也可以通过贴膜机等方式贴覆到封装盖板，形成吸湿层的亲水性材料可以主要是掺杂有CaO、MgO等吸湿性强的无机纳米粒子的片状胶材。Further, the water blocking layer may be attached to the device substrate by a film coater or the like, and the water blocking layer may be formed of any one or a combination of a polymer of SiNx, SiOx, and a hydrophobic epoxy resin. At the same time, the heat dissipation layer formed on the package cover plate may be mainly formed of an organic polymer doped with a metal having good thermal conductivity such as iron or copper; or the heat dissipation layer may be made of a thermally conductive inorganic material doped with carbon nanotubes or graphene. The composition of the organic polymer. The moisture absorbing layer may be attached to the package cover by a film coater or the like, and the hydrophilic material forming the moisture absorbing layer may be mainly a sheet-like rubber material doped with inorganic nanoparticles having high hygroscopicity such as CaO or MgO.
示例2Example 2
该封装方法与示例1相似，其区别之处在于在制备第一封装部时，垂直于器件基板形成了第二功能层和第三功能层，在制备第二封装部时，垂直于封装盖板形成了第一功能层。第一功能层、第二功能层和第三功能层可以从阻水层、吸湿层、散热层三种功能层结构任意分配，所带来的不同的影响就是制备工艺过程的不同，以及在形成缓冲层时是否能够与散热层或吸湿层一体制作，以简化制作工艺。The packaging method is similar to that of the example 1, except that when the first package portion is prepared, the second functional layer and the third functional layer are formed perpendicular to the device substrate, and perpendicular to the package cover when the second package portion is prepared. A first functional layer is formed. The first functional layer, the second functional layer and the third functional layer can be arbitrarily distributed from the three functional layer structures of the water blocking layer, the moisture absorbing layer and the heat dissipation layer, and the different effects brought about by the different preparation processes are formed and formed. Whether the buffer layer can be integrally formed with the heat dissipation layer or the moisture absorption layer to simplify the manufacturing process.
以器件基板上形成吸湿层，封装盖板上形成阻水层和散热层为例，首先在准备好的器件基板上制作有机发光二极管，接着在有机发光二极管上盖合起防潮作用的容置腔，之后在垂直于容置腔和器件基板的表面交替贴覆多个散热层，至此将器件基板结构制作完成；然后，在准备好的封装盖板表面贴覆与封装盖板表面平行的缓冲层，缓冲层作为吸湿功能层，因此可以在贴覆缓冲层之前，垂直于缓冲层表面制作交替分布的吸湿层，即可实现一次贴覆操作将缓冲层和吸湿层均形成在封装盖板上，接着，在形成了的吸湿层之间交替穿插贴覆阻水层；接下来，将器件基板和封装盖板压合，器件基板上的散热层和封装盖板上的吸湿层和阻水层对应嵌套，完成有机电致发光显示面板的封装。其它不同结构的显示面板的封装过程在此不进一步赘述。 Taking the moisture-absorbing layer on the device substrate and the water-blocking layer and the heat-dissipating layer on the package cover, firstly, an organic light-emitting diode is fabricated on the prepared device substrate, and then the moisture-receiving cavity is covered on the organic light-emitting diode. Then, a plurality of heat dissipation layers are alternately applied on a surface perpendicular to the accommodating cavity and the device substrate, and the device substrate structure is completed. Then, a buffer layer parallel to the surface of the package cover is attached to the surface of the prepared package cover. The buffer layer functions as a moisture absorbing functional layer, so that an alternating moisture absorbing layer can be formed perpendicular to the surface of the buffer layer before the buffer layer is applied, so that a single covering operation can be realized, and both the buffer layer and the moisture absorbing layer are formed on the package cover. Then, the water blocking layer is alternately inserted between the formed moisture absorbing layers; then, the device substrate and the package cover are pressed together, and the heat dissipation layer on the device substrate and the moisture absorbing layer and the water blocking layer on the package cover plate are correspondingly Nesting, complete the packaging of the organic electroluminescent display panel. The packaging process of the display panel of other different structures is not further described herein.
由以上实施例可以看出，本发明实施例通过将阻水层、散热层和/或吸湿层形成的功能层垂直于器件基板和封装盖板间隔分布，使得各功能层交叉排列在同一层，即将散热性胶材、吸湿层胶材、阻水性胶材三种胶材穿插排布，与上下层叠结构相比，能够有效的降低器件基板和封装盖板之间的距离，减少侧向水氧侵蚀面积，有效的将OLED器件产生的热量均匀、迅速的散发出去，并且结构简单，封装简便，不会增加封装成本和封装复杂度。It can be seen from the above embodiment that the functional layer formed by the water blocking layer, the heat dissipation layer and/or the moisture absorbing layer is perpendicularly distributed to the device substrate and the package cover plate, so that the functional layers are arranged in the same layer. The three kinds of adhesive materials, namely heat-dissipating adhesive material, moisture-absorbing adhesive material and water-resisting adhesive material, are inserted and arranged, which can effectively reduce the distance between the device substrate and the package cover plate and reduce lateral water oxygen. The eroded area effectively dissipates the heat generated by the OLED device evenly and quickly, and has a simple structure and a simple package, which does not increase packaging cost and package complexity.
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和替换，这些改进和替换也应视为本发明的保护范围。The above is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention. It should also be considered as the scope of protection of the present invention.
本申请要求于2014年6月9日递交的中国专利申请第201410254148.8号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。 The present application claims the priority of the Chinese Patent Application No. 201410254148.8 filed on Jun. 9, 2014, the entire disclosure of which is hereby incorporated by reference.

Claims (17)

  1. 一种有机电致发光显示面板，包括：器件基板和封装盖板，其中，An organic electroluminescence display panel comprising: a device substrate and a package cover, wherein
    所述器件基板和封装盖板之间制作有封装防护结构；A package protection structure is formed between the device substrate and the package cover;
    所述封装防护结构包括垂直于所述器件基板和封装盖板的多个功能层，所述功能层包括阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。The package protection structure includes a plurality of functional layers perpendicular to the device substrate and the package cover, the functional layer including a water blocking layer, and a moisture absorbing layer and/or a heat dissipation layer, the outermost layer of the functional layer being a resist Water layer.
  2. 如权利要求1所述的有机电致发光显示面板，其中，所述封装防护结构的各功能层均有多个，不同的功能层交替穿插布置。The organic electroluminescent display panel according to claim 1, wherein each of the functional layers of the package protection structure has a plurality of different functional layers alternately interposed.
  3. 如权利要求1或2所述的有机电致发光显示面板，其中，最外层的所述阻水层平行于所述器件基板方向的截面为封闭的环形。The organic electroluminescence display panel according to claim 1 or 2, wherein a cross section of the outermost layer of the water blocking layer in a direction parallel to the device substrate is a closed ring shape.
  4. 如权利要求1-3任一所述的有机电致发光显示面板，其中，位于最外层阻水层内部的任一功能层平行于所述器件基板方向的截面为矩形、矩形环、圆形、圆环、椭圆、L型、U型、V型、或三角形中的任意一种。The organic electroluminescence display panel according to any one of claims 1 to 3, wherein a cross section of any functional layer located inside the outermost water blocking layer parallel to the direction of the device substrate is a rectangle, a rectangular ring, or a circle Any of a ring, an ellipse, an L-shape, a U-shape, a V-shape, or a triangle.
  5. 如权利要求1-4所述的有机电致发光显示面板，其中，所述封装盖板上还制作有缓冲层，所述缓冲层位于最外层所述阻水层内部的各功能层上方，所述缓冲层为散热功能层或吸湿功能层。The organic electroluminescent display panel according to any one of claims 1 to 4, wherein a buffer layer is further formed on the package cover, and the buffer layer is located above each functional layer inside the outermost water blocking layer. The buffer layer is a heat dissipation functional layer or a moisture absorption functional layer.
  6. 如权利要求5所述的有机电致发光显示面板，其中，The organic electroluminescence display panel according to claim 5, wherein
    所述缓冲层为散热功能层时，其由掺杂有铁、或铜、或氮化铝、或氧化铝的有机聚合物、氟碳化合物、或掺杂有碳纳米管或石墨烯的有机聚合物形成；When the buffer layer is a heat dissipation functional layer, it is composed of an organic polymer doped with iron, or copper, or aluminum nitride, or aluminum oxide, a fluorocarbon, or an organic polymerization doped with carbon nanotubes or graphene. Object formation
    所述缓冲层为吸湿功能层时，其由具备-CN和-COOR两个吸电子基团的含烯基单体有机物形成，或者由掺杂有Al、或Mg、或氧化钙、或氧化镁的聚合物形成。When the buffer layer is a hygroscopic functional layer, it is formed of an alkenyl group-containing monomer organic substance having two electron withdrawing groups of -CN and -COOR, or is doped with Al, or Mg, or calcium oxide, or magnesium oxide. The polymer is formed.
  7. 如权利要求1-6任一所述的有机电致发光显示面板，其中，所述散热层由掺杂有铁、或铜、或氮化铝、或氧化铝的有机聚合物、氟碳化合物或掺杂有碳纳米管或石墨烯的有机聚合物形成。The organic electroluminescence display panel according to any one of claims 1 to 6, wherein the heat dissipation layer is made of an organic polymer doped with iron, or copper, or aluminum nitride, or aluminum oxide, a fluorocarbon or An organic polymer doped with carbon nanotubes or graphene is formed.
  8. 如权利要求1-7任一所述的有机电致发光显示面板，其中，The organic electroluminescence display panel according to any one of claims 1 to 7, wherein
    所述吸湿层由掺杂有Al、或Mg、或氧化钙、或氧化镁的聚合物形成；或者， The hygroscopic layer is formed of a polymer doped with Al, or Mg, or calcium oxide, or magnesium oxide; or
    所述吸湿层由具备-CN和-COOR两个吸电子基团的含烯基单体有机物形成。The moisture absorbing layer is formed of an organic group containing an alkenyl group having two electron withdrawing groups of -CN and -COOR.
  9. 如权利要求1-8任一所述的有机电致发光显示面板，其中，所述阻水层材料由SiNx、SiOx、疏水性环氧树脂的聚合物中的任意一种或几种的组合形成。The organic electroluminescence display panel according to any one of claims 1 to 8, wherein the water blocking layer material is formed of any one or a combination of a polymer of SiNx, SiOx, and a hydrophobic epoxy resin. .
  10. 如权利要求1-9任一所述的有机电致发光显示面板，其中，所述器件基板上还形成有有机发光二极管，所述有机发光二极管的外部设有容置腔，所述容置腔位于器件基板和各功能层之间。The organic electroluminescent display panel according to any one of claims 1 to 9, wherein an organic light emitting diode is further formed on the device substrate, and an accommodating cavity is disposed outside the organic light emitting diode. Located between the device substrate and each functional layer.
  11. 如权利要求1-10任一所述的有机电致发光显示面板，其中，各层所述功能层分别贴覆在所述器件基板和封装盖板上。The organic electroluminescence display panel according to any one of claims 1 to 10, wherein each of the functional layers of each layer is attached to the device substrate and the package cover.
  12. 一种显示装置，包括权利要求1-11中任一项所述的有机电致发光显示面板。A display device comprising the organic electroluminescence display panel according to any one of claims 1-11.
  13. 一种有机电致发光显示面板的封装方法，其中，A method for packaging an organic electroluminescence display panel, wherein
    所述有机电致发光显示面板包括器件基板和封装盖板，所述器件基板和封装盖板之间具有封装防护结构；The organic electroluminescent display panel includes a device substrate and a package cover, and a package protection structure is disposed between the device substrate and the package cover;
    所述封装方法包括：在所述器件基板和封装盖板之间形成与器件基板和封装盖板垂直的功能层作为封装防护结构，所述功能层包括阻水层，以及吸湿层和/或散热层，所述功能层的最外层为阻水层。The packaging method includes forming a functional layer perpendicular to the device substrate and the package cover between the device substrate and the package cover as a package protection structure, the functional layer including a water blocking layer, and a moisture absorption layer and/or heat dissipation The outermost layer of the functional layer is a water blocking layer.
  14. 如权利要求13所述的有机电致发光显示面板的封装方法，其中，所述封装防护结构的各功能层均有多层，不同的功能层之间交替穿插布置。The method of packaging an organic electroluminescence display panel according to claim 13, wherein each functional layer of the package protection structure has a plurality of layers, and different functional layers are alternately interposed.
  15. 如权利要求13或14所述的有机电致发光显示面板的封装方法，其中，The method of packaging an organic electroluminescence display panel according to claim 13 or 14, wherein
    在所述显示面板的封装过程中，先将一部分功能层间隔形成在所述器件基板上，剩余部分功能层间隔形成在所述封装盖板上；In the packaging process of the display panel, a portion of the functional layer is first formed on the device substrate, and the remaining functional layers are formed on the package cover;
    然后将器件基板和封装盖板压合，器件基板上的功能层和封装盖板上的功能层对应嵌套。The device substrate and the package cover are then pressed together, and the functional layer on the device substrate and the functional layer on the package cover are nested.
  16. 如权利要求13或14所述的有机电致发光显示面板的封装方法，其中，The method of packaging an organic electroluminescence display panel according to claim 13 or 14, wherein
    在所述显示面板的封装过程中，先将各功能层形成在所述器件基板上，然后将封装盖板压合在所述器件基板上；或者， In the packaging process of the display panel, each functional layer is first formed on the device substrate, and then the package cover is pressed onto the device substrate; or
    先将各功能层形成在所述封装盖板上，然后将器件基板压合在所述封装盖板上。Each functional layer is first formed on the package cover, and then the device substrate is pressed onto the package cover.
  17. 如权利要求15或16所述的有机电致发光显示面板的封装方法，其中，The method of packaging an organic electroluminescence display panel according to claim 15 or 16, wherein
    所述封装盖板上在形成与其垂直的功能层之前，还形成有平行于所述封装盖板且贴附在封装盖板表面的缓冲层，所述缓冲层位于最外层所述阻水层内部的各功能层上方，所述缓冲层为散热层或吸湿层。 Forming a buffer layer parallel to the package cover plate and attached to a surface of the package cover plate on the package cover plate before forming a functional layer perpendicular thereto, the buffer layer being located at the outermost layer of the water blocking layer Above the internal functional layers, the buffer layer is a heat dissipation layer or a moisture absorption layer.
PCT/CN2014/086810 2014-06-09 2014-09-18 Organic electroluminescent display panel and encapsulation method therefor, and display device WO2015188491A1 (en)

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