WO2015163319A1 - Surface-emitting module - Google Patents

Surface-emitting module Download PDF

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Publication number
WO2015163319A1
WO2015163319A1 PCT/JP2015/062099 JP2015062099W WO2015163319A1 WO 2015163319 A1 WO2015163319 A1 WO 2015163319A1 JP 2015062099 W JP2015062099 W JP 2015062099W WO 2015163319 A1 WO2015163319 A1 WO 2015163319A1
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WO
WIPO (PCT)
Prior art keywords
emitting
light
light source
wiring board
surface emitting
Prior art date
Application number
PCT/JP2015/062099
Other languages
French (fr)
Japanese (ja)
Inventor
木村　直樹
正利 米山
淳弥 若原
伸哉 三木
Original Assignee
コニカミノルタ株式会社
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Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2015559350A priority Critical patent/JP5983894B2/en
Publication of WO2015163319A1 publication Critical patent/WO2015163319A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Definitions

  • the present invention relates to a surface emitting module including a surface emitting light source and a wiring board.
  • Such a surface light emitting module is provided, as shown in Japanese Patent Application Laid-Open No. 2011-222223 (Patent Document 1), on the side opposite to the light emitting side of the organic EL element and the light emitting side of the organic EL element. And a wiring board for supplying power to the unit.
  • the surface emitting module is mainly used as a lighting device. Since the impression with respect to the building and the object where the said illuminating device is used changes with the light irradiated from an illuminating device, it is requested
  • Examples of means for design expression include a method of coating the surface of a surface-emitting light source, a method of forming an organic EL element in an arbitrary shape, and the like.
  • a method of coating the surface of a surface-emitting light source a method of forming an organic EL element in an arbitrary shape, and the like.
  • the manufacturing process of the surface-emitting light source becomes complicated, and a printing machine for coating, a dedicated vapor deposition mask for patterning into an arbitrary shape, and the like are required. As a result, the manufacturing cost increases.
  • FIG. 10 is a schematic cross-sectional view showing a conventional surface emitting module used for design expression.
  • the surface emitting module 100 when a design is simply expressed using a conventional surface emitting module as shown in Patent Document 1, the surface emitting module 100 includes a surface emitting light source 150, a wiring board, and the like. 130 and a light shielding member 140.
  • the surface emitting light source 150 includes a substrate 110 and a light emitting unit 120 that is provided on the substrate 110 and emits light upward in the drawing.
  • the wiring board 130 is provided on the side opposite to the light emitting side of the surface light source 150, and supplies power supplied from an external power source to the light emitting unit 120 via the wiring 160.
  • the light blocking member 140 is provided on the light emitting side of the surface light source 150 and includes an opening 141 for transmitting light from the surface light source 150.
  • the opening 141 has a shape expressing an arbitrary design. By having such a configuration, light is emitted from the surface emitting module 100 so that the shape of an arbitrary design can be visually recognized.
  • surface emitting modules are attracting attention due to their flexibility, so that they are required to be thin (low profile) from the viewpoint of design, convenience from the viewpoint of transportation, installation, and the like.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a surface light emitting module capable of expressing a design while realizing a low profile with a simple configuration.
  • a surface-emitting module includes a surface-emitting light source provided with a light-emitting region that emits light, a wiring board that is provided on the light-emitting side of the surface-emitting light source and is electrically connected to the surface-emitting light source.
  • the wiring board has an opening in a region overlapping the light emitting region, and shields a part of the light emitting region.
  • FIG. 2 is a schematic sectional view taken along line II-II shown in FIG. It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 1 of this invention.
  • FIG. 4 is a schematic sectional view taken along line IV-IV shown in FIG. 3. It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 2 of this invention.
  • FIG. 6 is a schematic sectional view taken along line VI-VI shown in FIG. 5. It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 3 of this invention.
  • FIG. 6 is a schematic plan view showing other shapes (A) to (C) of openings provided in the wiring board. It is a schematic sectional drawing which shows the conventional light emitting module used when performing design expression.
  • FIG. 1 is a schematic plan view showing a surface emitting light source provided in the surface emitting module according to the present embodiment.
  • FIG. 2 is a schematic sectional view taken along line II-II shown in FIG. With reference to FIG. 1 and FIG. 2, the surface emitting light source 10 which concerns on this Embodiment is demonstrated.
  • the surface-emitting light source 10 is composed of an organic EL element.
  • the organic EL element has a bottom emission type structure. It is preferable that the surface emitting light source 10 has flexibility so that it can be bent as a whole.
  • a surface emitting light source 10 includes a transparent substrate 11 (cover layer), an anode (anode) 14, an organic light emitting layer 15, a cathode (cathode) 16, a sealing member 17, and an insulating layer 18. Including.
  • the transparent substrate 11 forms the light emitting surface 12 (surface) of the surface light source 10.
  • the anode 14, the organic light emitting layer 15, and the cathode 16 are sequentially stacked on the main surface 13 on the back surface side of the transparent substrate 11 to constitute the stacked body 2.
  • the sealing member 17 forms the back surface 19 of the surface emitting light source 10.
  • a flexible transparent member As the member constituting the transparent substrate 11, a flexible transparent member is used.
  • a light transmissive film substrate such as polyethylene terephthalate (PET) or polycarbonate (PC) is used.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • Various glass substrates may be used for the transparent substrate 11.
  • polyimide polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP), etc. are used as the light transmissive film substrate.
  • PEN polyethylene naphthalate
  • PS polystyrene
  • PS polyethersulfone
  • PP polypropylene
  • the anode 14 is a conductive film having transparency.
  • ITO Indium Tin Oxide
  • PEDOT polyethylenedioxythiophene
  • the organic light emitting layer 15 (light emitting unit) can generate light (visible light) when electric power is supplied.
  • the organic light emitting layer 15 may be constituted by a single light emitting layer, or may be constituted by sequentially laminating a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like. .
  • the cathode 16 is made of a metal film such as aluminum (AL).
  • the cathode 16 is formed so as to cover the organic light emitting layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition.
  • Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
  • An insulating layer 18 is provided between the cathode 16 and the anode 14 so that the cathode 16 and the anode 14 are not short-circuited.
  • the insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method. .
  • the sealing member 17 is made of an insulating resin or a glass substrate.
  • the sealing member 17 is formed to protect the organic light emitting layer 15 from moisture and the like.
  • the sealing member 17 seals substantially the whole of the anode 14, the organic light emitting layer 15, and the cathode 16 (member provided inside the surface emitting light source 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.
  • the sealing member 17 is formed by laminating a plurality of layers of an inorganic thin film such as SiO 2 , AL 2 O 3 , SiNx, and a flexible acrylic resin thin film on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used. Gold, silver, copper, or the like may be further laminated on the electrode portion 21 and the electrode portion 22.
  • the portion exposed from the sealing member 17 of the anode 14 (left side in FIG. 2) constitutes an electrode portion 21 (for anode).
  • the electrode portion 21 and the anode 14 are made of the same material.
  • the electrode portion 21 is located on the outer periphery of one side surface of the surface emitting light source 10.
  • the portion of the cathode 16 exposed from the sealing member 17 (on the right side in FIG. 2) constitutes an electrode portion 22 (for the cathode).
  • the electrode part 22 and the cathode 16 are made of the same material.
  • the electrode portion 22 is also located on the other outer periphery of the surface emitting light source 10.
  • the electrode part 21 and the electrode part 22 are located on opposite sides of the organic light emitting layer 15.
  • a wiring 23 is attached to the electrode portion 21 and the electrode portion 22 using soldering (silver paste) or the like.
  • the organic light emitting layer 15 of the surface light source 10 configured as described above is provided with a wiring pattern, a wiring 23, and electrode portions 21 and 22 provided on a wiring board 30 (see FIG. 4) described later from an external power supply device. Power is supplied through the anode 14 and the cathode 16. The light generated in the organic light emitting layer 15 is taken out from the light emitting surface 12 (surface) through the anode 14 and the transparent substrate 11.
  • the position corresponding to the organic light emitting layer 15 forms the light emitting region R1, and the external region surrounding the organic light emitting layer 15 forms the non-light emitting region R2. .
  • FIG. 3 is a schematic plan view of the surface emitting module according to the present embodiment.
  • FIG. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. With reference to FIG. 3 and FIG. 4, the surface emitting module 1 which concerns on this Embodiment is demonstrated.
  • the surface emitting module 1 includes a surface emitting light source 10 and a wiring board 30.
  • the surface emitting light source 10 has the above-described configuration, and includes a light emitting region R1 that emits light toward the wiring substrate 30 as indicated by an arrow in FIG.
  • the wiring board 30 is electrically connected to the surface emitting light source 10 via the wiring 23.
  • the wiring board 30 has an opening 31 and covers the outer edge of the surface emitting light source 10 (that is, covers a part of the surface emitting light source 10). ) Side.
  • the wiring board 30 has a configuration in which a wiring pattern for energization is routed inside using a resin member such as glass epoxy or polyimide on the surface. In addition, the wiring pattern is provided so as not to be routed through an opening 31 described later.
  • the resin member of the wiring board 30 may be mixed with pigments of various colors such as black in order to improve the light shielding property or the light attenuation property.
  • the thermal conductivity of the wiring board 30 is preferably higher than the thermal conductivity of the surface emitting light source 10. By doing so, the heat generated by the surface-emitting light source 10 can be radiated through the wiring board 30. For this reason, the local heat_generation
  • the surface emitting light source 10 is preferably held in close contact with the wiring board 30.
  • the wiring substrate 30 may be fixed to the light emitting surface 12 of the surface emitting light source 10 using an adhesive or the like. You may fix by sealing these with the sealing members, such as a laminate, in the state which mounted the wiring board 30 in the surface 12.
  • the wiring substrate 30 When viewed from the normal direction of the main surface (light emitting surface 12) of the transparent substrate 11, the wiring substrate 30 has an opening 31 in a region overlapping with the light emitting region R1 of the surface emitting light source 10, and overlaps with the opening 31.
  • the light emitting region R1 other than the region is shielded.
  • the opening 31 has, for example, a rectangular shape when viewed from the normal direction of the main surface of the wiring board 30.
  • the opening 31 is preferably provided so as to be within a range overlapping with the light emitting region R1 when viewed from the normal direction of the light emitting surface of the surface light source 10.
  • the wiring board 30 By providing the wiring board 30 on the emission side of the surface emitting light source 10, part of the light emitted from the surface emitting light source 10 is blocked or reduced by the wiring board 30. For this reason, the light which permeate
  • the surface emitting light source 10 and the wiring board 30 have flexibility, for example, the surface emitting module 1 can be installed on a curved surface, or the surface emitting module 1 can be transported in a roll shape or the like. Thereby, the convenience of the surface emitting module 1 improves. Even when the surface emitting light source 10 and the wiring board 30 have flexibility, the same simple configuration can be adopted.
  • the surface emitting module 1 can express a desired design while realizing a reduction in the height of the surface emitting module with a simple configuration.
  • FIG. 5 is a schematic plan view showing the surface emitting module according to the present embodiment.
  • FIG. 6 is a schematic cross-sectional view along the line VI-VI shown in FIG. With reference to FIG. 5 and FIG. 6, the surface emitting module 1A according to the present embodiment will be described.
  • the surface emitting module 1 ⁇ / b> A includes a plurality of surface emitting light sources 10 ⁇ / b> A and 10 ⁇ / b> B when compared with the surface emitting module 1 according to the first embodiment.
  • the structure of the wiring board 30 and the point further provided with the design sheet 40 are different.
  • the configuration of the plurality of surface-emitting light sources 10A and 10B is the same as that of the surface-emitting light source 10 according to the first embodiment.
  • the plurality of surface emitting light sources 10A and 10B are arranged linearly.
  • the plurality of surface emitting light sources 10 ⁇ / b> A and 10 ⁇ / b> B are provided on a single wiring board 30.
  • the wiring board 30 is located on the light emitting side of the plurality of surface emitting light sources 10A and 10B, has openings 31A and 31B in areas overlapping with the respective light emitting areas R1, and does not overlap with the openings 31A and 31B. It is provided so as to cover.
  • the design sheet 40 is obtained by printing an arbitrary design such as a character or a design on a print medium such as a sheet member or paper made of a translucent resin member such as polyethylene resin, acrylic resin, or vinyl chloride resin.
  • the design sheet 40 is provided on the side opposite to the side where the surface emitting light sources 10 ⁇ / b> A and 10 ⁇ / b> B are positioned with respect to the wiring board 30.
  • the design sheet 40 is provided so as to cover the openings 31 ⁇ / b> A and 31 ⁇ / b> B of the wiring board 30.
  • the design sheet 40 may be provided with holes in portions overlapping the openings 31A and 31B when viewed from the normal direction of the light emitting surface 12 of the surface light source 10.
  • the design printed on the design sheet 40 can be emphasized and expressed, and the design properties can be enhanced.
  • the design can be expressed with light having a clear outline without bleeding.
  • the range which can express design can be expanded by providing several surface emitting light source 10A, 10B.
  • the wiring substrate 30 on the light emitting side of the surface emitting light sources 10A and 10B, it is possible to express the design and to realize a low profile with a simple configuration. be able to. Moreover, by providing the design sheet 40, the design properties can be further enhanced.
  • a case where a plurality of surface light emitting modules are configured by two surface light sources 10A and 10B has been described as an example.
  • the present invention is not limited to this, and three or more surface light sources are used. It may be configured.
  • the plurality of surface emitting light sources are preferably arranged in a matrix.
  • the design sheet 40, the wiring board 30, and the surface light source 10 are integrated.
  • the design sheet 40, the wiring board 30, and the surface emitting light source can be handled as an integrated module, and transportation and construction are further simplified.
  • FIG. 7 is a schematic plan view showing the surface emitting module according to the present embodiment. With reference to FIG. 7, the surface emitting module 1B according to the present embodiment will be described.
  • the surface emitting module 1B according to the present embodiment has a light emitting region R1 provided in the plurality of surface emitting light sources 10A and 10B when compared with the surface emitting module 1A according to the second embodiment.
  • This is different in that a plurality of openings 31 are provided in a region overlapping with each of the above.
  • the plurality of openings 31 are provided according to the design printed on the design sheet 40.
  • the surface emitting module 1B according to the present embodiment can obtain substantially the same effect as the surface emitting module 1A according to the second embodiment.
  • the range which can express design can be expanded by the combination of the number and arrangement
  • FIG. 8 is a schematic cross-sectional view showing the surface emitting module according to the present embodiment. With reference to FIG. 8, 1 C of surface emitting modules which concern on this Embodiment are demonstrated.
  • the surface emitting module 1C according to the present embodiment is different from the surface emitting module 1 according to the first embodiment in the configuration of the surface emitting light source 10C. Other configurations are almost the same.
  • the surface emitting light source 10C is composed of a top emission type organic EL element.
  • the surface emitting light source 10C includes a substrate 11C, and a stacked body 2 in which an anode 14C as a first electrode, an organic light emitting layer 15, and a cathode 16C as a second electrode are stacked in this order on the substrate 11C.
  • Light is emitted from the side opposite to the substrate 11c side (cathode 16 side).
  • the wiring board 30 is disposed on the emission side of the surface-emitting light source 10C so that the laminate 2 is positioned between the wiring board 30 and the board 11C.
  • the surface emitting light source 10 ⁇ / b> C further includes a sealing member 17.
  • the sealing member 17 seals substantially the entire anode 14 ⁇ / b> C, the organic light emitting layer 15, and the cathode 16 ⁇ / b> C on the transparent substrate 11.
  • the sealing member 17 forms a light emitting surface 19 ⁇ / b> C of the surface light source 10.
  • the sealing member 17 preferably has light transmittance.
  • the substrate may have translucency or non-translucency.
  • a glass substrate, a ceramic substrate, a film substrate formed of a synthetic resin, a metal thin plate, or the like is used as the substrate 11C.
  • the main surface of the substrate 11 ⁇ / b> C located on the opposite side of the stacked body 2 constitutes the back surface 12 ⁇ / b> C of the surface emitting light source 10.
  • the anode 14C is made of a metal film such as aluminum. In order to reliably emit light from the cathode 16C side, it is preferable to have light reflectivity.
  • the cathode 16C is formed of a conductive transparent conductive film such as ITO.
  • the organic light emitting layer 15 has a configuration substantially similar to that of the first embodiment.
  • the portion exposed from the sealing member 17 of the anode 14C constitutes the electrode portion 21 (for anode), and the portion exposed from the sealing member 17 of the cathode 16C constitutes the electrode portion 22 (for cathode). To do.
  • These electrode portions 21 and 22 are provided on the main surface 13 of the substrate facing the wiring substrate 30, and are electrically connected to the wiring substrate 30 through the wiring 23.
  • the wiring board 30 provided with the opening 31 having an arbitrary design shape is provided on the emission side of the surface emitting light source 10C.
  • the surface emitting module 1C according to the present embodiment can obtain substantially the same effect as the surface emitting module 1 according to the first embodiment.
  • the wiring board 30 having the light shielding function or the dimming function and the electrode parts 21 and 22 so as to face each other the electrical connection between the wiring board 30 and the electrode parts 21 and 22 is facilitated.
  • the surface emitting module 1C illustrated and demonstrated the case where a design sheet was not provided, even if it is provided with the design sheet which concerns on Embodiment 2 or 3, it is not limited to this. Good.
  • the surface emitting module 1C may be configured to include a plurality of surface emitting light sources.
  • the case where the first electrode is the anode 14C provided on the substrate and the second electrode is the cathode 16C provided on the organic light emitting layer has been described as an example.
  • the first electrode may be a cathode provided on the substrate
  • the second electrode may be a cathode provided on the organic light emitting layer.
  • the cathode as the first electrode is preferably a light-reflecting conductive member
  • the anode as the second electrode is preferably a light-transmitting conductive member.
  • FIG. 9 is a schematic plan view showing other shapes (A) to (C) of the opening provided in the wiring board. With reference to FIG. 9, other shapes (A) to (C) of the openings provided in the wiring board will be described.
  • the opening 31 is described by exemplifying the case where it has a rectangular shape when viewed from the normal direction of the main surface of the wiring substrate 30.
  • the present invention is not limited to this. It has a geometric shape such as a circular shape (see FIG. 9A), a polygonal shape such as a hexagon (see FIG. 9B), or a star shape (see FIG. 9C). It may have a shape expressing an arbitrary design such as a natural object such as an animal or plant, an artificial object such as various articles, or a shape expressing a part of the arbitrary design. That is, the opening 31 is provided in a desired shape.
  • Embodiments 1 to 4 described above the case where the surface emitting light source is configured by an organic EL element has been described as an example. It may be comprised from, and may be comprised using the cold cathode tube etc.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Planar Illumination Modules (AREA)

Abstract

This surface-emitting module (1) is provided with a surface-emitting light source (10) which has a light-emitting region (R1) that emits light, and with a wiring substrate (30) which is provided on the light-emitting side of the surface-emitting light source (10) and which is electrically connected to the surface-emitting light source (10). The wiring substrate (30) has an opening (31) in a region that overlaps with the light-emitting region (R1) and shields part of the light-emitting region (R1).

Description

面発光モジュールSurface emitting module
　本発明は、面発光光源と配線基板とを備える面発光モジュールに関する。 The present invention relates to a surface emitting module including a surface emitting light source and a wiring board.
　近年、有機ＥＬ（Electro　Luminescence）素子等の面発光光源を用いた発光効率の高い面発光モジュールが注目を集めている。このような面発光モジュールは、特開２０１１－２２２２２３号公報（特許文献１）に示すように、発光部を有する有機ＥＬ素子と、有機ＥＬ素子の光出射側と反対側に設けられ、当該発光部に電力を供給するための配線基板とを備える。 In recent years, surface emitting modules with high luminous efficiency using surface emitting light sources such as organic EL (Electro Luminescence) elements have attracted attention. Such a surface light emitting module is provided, as shown in Japanese Patent Application Laid-Open No. 2011-222223 (Patent Document 1), on the side opposite to the light emitting side of the organic EL element and the light emitting side of the organic EL element. And a wiring board for supplying power to the unit.
特開２０１１－２２２２２３号公報JP 2011-222223 A
　面発光モジュールは、主として照明装置として用いられる。照明装置から照射される光によって当該照明装置が用いられる建屋や物に対する印象が変化するため、面発光モジュールにおいては、意匠表現できることが要求される。 The surface emitting module is mainly used as a lighting device. Since the impression with respect to the building and the object where the said illuminating device is used changes with the light irradiated from an illuminating device, it is requested | required that a surface emitting module can express a design.
　意匠表現を行なう手段としては、面発光光源の表面に塗装を施す方法、有機ＥＬ素子を任意の形状で形成する方法等が挙げられる。しかしながら、これらの方法を採用した場合には、面発光光源の製造工程が複雑になる上、塗装を施すための印刷機や任意の形状にパターニングするための専用の蒸着マスク等が必要となる。この結果、製造コストが増加してしまう。 Examples of means for design expression include a method of coating the surface of a surface-emitting light source, a method of forming an organic EL element in an arbitrary shape, and the like. However, when these methods are employed, the manufacturing process of the surface-emitting light source becomes complicated, and a printing machine for coating, a dedicated vapor deposition mask for patterning into an arbitrary shape, and the like are required. As a result, the manufacturing cost increases.
　そこで、より簡便に意匠表現を行なう手段として、面発光光源の表面を遮光部材で覆う方法が考えられる。図１０は、意匠表現を行なう際に用いられる従来の面発光モジュールを示す概略断面図である。図１０に示すように、特許文献１に示すような従来の面発光モジュールを利用して、簡便に意匠表現する場合には、その構成として、面発光モジュール１００は、面発光光源１５０、配線基板１３０および遮光部材１４０を備える。 Therefore, as a means for expressing the design more easily, a method of covering the surface of the surface emitting light source with a light shielding member is conceivable. FIG. 10 is a schematic cross-sectional view showing a conventional surface emitting module used for design expression. As shown in FIG. 10, when a design is simply expressed using a conventional surface emitting module as shown in Patent Document 1, the surface emitting module 100 includes a surface emitting light source 150, a wiring board, and the like. 130 and a light shielding member 140.
　面発光光源１５０は、基板１１０と、基板１１０上に設けられ、図中上方にむけて光を出射する発光部１２０とを含む。配線基板１３０は、面発光光源１５０の光出射側と反対側に設けられ、外部電源から供給される電力を配線１６０を介して発光部１２０に供給する。遮光部材１４０は、面発光光源１５０の光出射側に設けられ、面発光光源１５０からの光を透過させるための開口部１４１を含む。開口部１４１は、任意の意匠を表現した形状を有する。このような構成を有することにより、任意の意匠の形状が視認されるように面発光モジュール１００から光が出射される。 The surface emitting light source 150 includes a substrate 110 and a light emitting unit 120 that is provided on the substrate 110 and emits light upward in the drawing. The wiring board 130 is provided on the side opposite to the light emitting side of the surface light source 150, and supplies power supplied from an external power source to the light emitting unit 120 via the wiring 160. The light blocking member 140 is provided on the light emitting side of the surface light source 150 and includes an opening 141 for transmitting light from the surface light source 150. The opening 141 has a shape expressing an arbitrary design. By having such a configuration, light is emitted from the surface emitting module 100 so that the shape of an arbitrary design can be visually recognized.
　さらに、面発光モジュールは、可撓性を有することにより注目されているところ、デザイン性の観点、運搬、設置等の利便性の観点から薄型化（低背化）も要求される。 Furthermore, surface emitting modules are attracting attention due to their flexibility, so that they are required to be thin (low profile) from the viewpoint of design, convenience from the viewpoint of transportation, installation, and the like.
　しかしながら、上述した構成を有する面発光モジュール１００にあっては、意匠表現をする際に、別途遮光部材が必要となる。このため、面発光モジュールの厚さが増加してしまい、低背化が困難となる。 However, in the surface emitting module 100 having the above-described configuration, a separate light shielding member is required when expressing the design. For this reason, the thickness of the surface emitting module increases, and it is difficult to reduce the height.
　本発明は、上記のような問題に鑑みてなされたものであり、本発明の目的は、簡易な構成で低背化を実現しつつ、意匠表現可能な面発光モジュールを提供することにある。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface light emitting module capable of expressing a design while realizing a low profile with a simple configuration.
　本発明に基づく面発光モジュールは、光を出射する発光領域が設けられた面発光光源と、上記面発光光源の光出射側に設けられ、上記面発光光源に電気的に接続された配線基板と、を備え、上記配線基板は、上記発光領域と重なる領域に開口部を有し、上記発光領域の一部分を遮蔽する。 A surface-emitting module according to the present invention includes a surface-emitting light source provided with a light-emitting region that emits light, a wiring board that is provided on the light-emitting side of the surface-emitting light source and is electrically connected to the surface-emitting light source. The wiring board has an opening in a region overlapping the light emitting region, and shields a part of the light emitting region.
　本発明によれば、簡易な構成で低背化を実現しつつ、意匠表現可能な面発光モジュールを提供することができる。 According to the present invention, it is possible to provide a surface light emitting module capable of expressing a design while realizing a low profile with a simple configuration.
本発明の実施の形態１に係る面発光モジュールに具備される面発光光源を示す概略平面図である。It is a schematic plan view which shows the surface emitting light source with which the surface emitting module which concerns on Embodiment 1 of this invention is comprised. 図１に示すＩＩ－ＩＩ線に沿った概略断面図である。FIG. 2 is a schematic sectional view taken along line II-II shown in FIG. 本発明の実施の形態１に係る面発光モジュールを示す概略平面図である。It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 1 of this invention. 図３に示すＩＶ－ＩＶ線に沿った概略断面図である。FIG. 4 is a schematic sectional view taken along line IV-IV shown in FIG. 3. 本発明の実施の形態２に係る面発光モジュールを示す概略平面図である。It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 2 of this invention. 図５に示すＶＩ－ＶＩ線に沿った概略断面図である。FIG. 6 is a schematic sectional view taken along line VI-VI shown in FIG. 5. 本発明の実施の形態３に係る面発光モジュールを示す概略平面図である。It is a schematic plan view which shows the surface emitting module which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係る面発光モジュールを示す概略断面図である。It is a schematic sectional drawing which shows the surface emitting module which concerns on Embodiment 4 of this invention. 配線基板に設けられる開口部のその他の形状（Ａ）～（Ｃ）を示す概略平面図である。FIG. 6 is a schematic plan view showing other shapes (A) to (C) of openings provided in the wiring board. 意匠表現を行なう際に用いられる従来の発光モジュールを示す概略断面図である。It is a schematic sectional drawing which shows the conventional light emitting module used when performing design expression.
　以下、本発明の実施の形態について、図を参照して詳細に説明する。なお、以下に示す実施の形態においては、同一のまたは共通する部分について図中同一の符号を付し、その説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.
　（実施の形態１）
　（面発光光源）
　図１は、本実施の形態に係る面発光モジュールに具備される面発光光源を示す概略平面図である。図２は、図１に示すＩＩ－ＩＩ線に沿った概略断面図である。図１および図２を参照して、本実施の形態に係る面発光光源１０について説明する。 (Embodiment 1)
(Surface emitting light source)
FIG. 1 is a schematic plan view showing a surface emitting light source provided in the surface emitting module according to the present embodiment. FIG. 2 is a schematic sectional view taken along line II-II shown in FIG. With reference to FIG. 1 and FIG. 2, the surface emitting light source 10 which concerns on this Embodiment is demonstrated.
　本実施の形態に係る面発光光源１０は、有機ＥＬ素子から構成される。有機ＥＬ素子は、ボトムエミッション型の構造を有する。面発光光源１０は、全体として曲げ可能となるように可撓性を有することが好ましい。 The surface-emitting light source 10 according to the present embodiment is composed of an organic EL element. The organic EL element has a bottom emission type structure. It is preferable that the surface emitting light source 10 has flexibility so that it can be bent as a whole.
　図１および図２を参照して、面発光光源１０は、透明基板１１（カバー層）、陽極（アノード）１４、有機発光層１５、陰極（カソード）１６、封止部材１７および絶縁層１８を含む。 Referring to FIGS. 1 and 2, a surface emitting light source 10 includes a transparent substrate 11 (cover layer), an anode (anode) 14, an organic light emitting layer 15, a cathode (cathode) 16, a sealing member 17, and an insulating layer 18. Including.
　透明基板１１は、面発光光源１０の発光面１２（表面）を形成する。陽極１４、有機発光層１５および陰極１６は、透明基板１１の裏面側の主面１３上に順次積層され、積層体２を構成する。封止部材１７は、面発光光源１０の背面１９を形成している。 The transparent substrate 11 forms the light emitting surface 12 (surface) of the surface light source 10. The anode 14, the organic light emitting layer 15, and the cathode 16 are sequentially stacked on the main surface 13 on the back surface side of the transparent substrate 11 to constitute the stacked body 2. The sealing member 17 forms the back surface 19 of the surface emitting light source 10.
　透明基板１１を構成する部材としては、可撓性有する透明部材が用いられる。材料としては、たとえば、ポリエチレンテレフタレート（ＰＥＴ）またはポリカーボネイト（ＰＣ）等の光透過性のフィルム基板が用いられる。透明基板１１に、各種ガラス基板を用いてもよい。 As the member constituting the transparent substrate 11, a flexible transparent member is used. As the material, for example, a light transmissive film substrate such as polyethylene terephthalate (PET) or polycarbonate (PC) is used. Various glass substrates may be used for the transparent substrate 11.
　光透過性のフィルム基板としては、他にポリイミド、ポリエチレンナフタレート（ＰＥＮ）、ポリスチレン（ＰＳ）、ポリエーテルサルフォン（ＰＥＳ）、ポリプロピレン（ＰＰ）等が用いられる。 In addition, polyimide, polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP), etc. are used as the light transmissive film substrate.
　陽極１４は、透明性を有する導電膜である。陽極１４を形成するためには、スパッタリング法等によって、ＩＴＯ（Indium　Tin　Oxide：インジウム錫酸化物）等が透明基板１１上に成膜される。陽極１４に用いられる他の材料としては、ポリエチレンジオキシチオフェン（ＰＥＤＯＴ）が用いられる。 The anode 14 is a conductive film having transparency. In order to form the anode 14, ITO (Indium Tin Oxide) or the like is formed on the transparent substrate 11 by sputtering or the like. As another material used for the anode 14, polyethylenedioxythiophene (PEDOT) is used.
　有機発光層１５（発光部）は、電力が供給されることによって光（可視光）を生成することができる。有機発光層１５は、単層の発光層から構成されていてもよく、正孔輸送層、発光層、正孔阻止層、および電子輸送層などが順次積層されることによって構成されていてもよい。 The organic light emitting layer 15 (light emitting unit) can generate light (visible light) when electric power is supplied. The organic light emitting layer 15 may be constituted by a single light emitting layer, or may be constituted by sequentially laminating a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like. .
　陰極１６は、たとえばアルミニウム（ＡＬ）等の金属膜によって構成される。陰極１６は、真空蒸着法等によって有機発光層１５を覆うように形成される。陰極１６を所定の形状にパターニングするために、真空蒸着の際にはマスクが用いられるとよい。陰極１６の他の材料としては、フッ化リチウム（ＬｉＦ）、ＡｌとＣａとの積層、ＡｌとＬｉＦとの積層、および、ＡｌとＢａとの積層等が用いられる。 The cathode 16 is made of a metal film such as aluminum (AL). The cathode 16 is formed so as to cover the organic light emitting layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition. Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
　陰極１６と陽極１４とが短絡しないように、陰極１６と陽極１４との間に絶縁層１８が設けられる。絶縁層１８は、たとえばスパッタリング法を用いてＳｉＯ２などが成膜された後、フォトリソグラフィ法等を用いて陽極１４と陰極１６とを互いに絶縁する箇所を覆うように所望のパターンに形成される。 An insulating layer 18 is provided between the cathode 16 and the anode 14 so that the cathode 16 and the anode 14 are not short-circuited. The insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method. .
　封止部材１７は、絶縁性を有する樹脂またはガラス基板などから構成される。封止部材１７は、有機発光層１５を水分等から保護するために形成される。封止部材１７は、陽極１４、有機発光層１５、および陰極１６（面発光光源１０の内部に設けられる部材）の略全体を透明基板１１上に封止する。陽極１４の一部は、電気的な接続のために、封止部材１７から露出している。 The sealing member 17 is made of an insulating resin or a glass substrate. The sealing member 17 is formed to protect the organic light emitting layer 15 from moisture and the like. The sealing member 17 seals substantially the whole of the anode 14, the organic light emitting layer 15, and the cathode 16 (member provided inside the surface emitting light source 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.
　封止部材１７には、ＰＥＴ、ＰＥＮ、ＰＳ、ＰＥＳ、ポリイミド等のフィルムに、ＳｉＯ２、ＡＬ２Ｏ３、ＳｉＮｘ等の無機薄膜と柔軟性のあるアクリル樹脂薄膜などを層状に複数層重ね合わせることでガスバリア性を備えたものが用いられる。電極部２１および電極部２２には、さらに金、銀、銅などを積層してもよい。 The sealing member 17 is formed by laminating a plurality of layers of an inorganic thin film such as SiO 2 , AL 2 O 3 , SiNx, and a flexible acrylic resin thin film on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used. Gold, silver, copper, or the like may be further laminated on the electrode portion 21 and the electrode portion 22.
　陽極１４の封止部材１７から露出している部分（図２左側）は、電極部２１（陽極用）を構成する。電極部２１と陽極１４とは互いに同じ材料で構成される。電極部２１は、面発光光源１０の一方の側面の外周に位置する。陰極１６の封止部材１７から露出している（図２右側の）部分は、電極部２２（陰極用）を構成する。電極部２２と陰極１６とは互いに同じ材料で構成される。電極部２２も、面発光光源１０の他方の外周に位置する。 The portion exposed from the sealing member 17 of the anode 14 (left side in FIG. 2) constitutes an electrode portion 21 (for anode). The electrode portion 21 and the anode 14 are made of the same material. The electrode portion 21 is located on the outer periphery of one side surface of the surface emitting light source 10. The portion of the cathode 16 exposed from the sealing member 17 (on the right side in FIG. 2) constitutes an electrode portion 22 (for the cathode). The electrode part 22 and the cathode 16 are made of the same material. The electrode portion 22 is also located on the other outer periphery of the surface emitting light source 10.
　電極部２１および電極部２２は、有機発光層１５を挟んで相互に反対側に位置している。電極部２１および電極部２２には、はんだ付け（銀ペースト）等を用いて配線２３（図４参照）が取り付けられる。 The electrode part 21 and the electrode part 22 are located on opposite sides of the organic light emitting layer 15. A wiring 23 (see FIG. 4) is attached to the electrode portion 21 and the electrode portion 22 using soldering (silver paste) or the like.
　以上のように構成される面発光光源１０の有機発光層１５には、外部の電源装置から、後述する配線基板３０（図４参照）に設けられた配線パターン、配線２３、電極部２１、２２、陽極１４および陰極１６を通して電力が供給される。有機発光層１５で生成された光は、陽極１４および透明基板１１を通して、発光面１２（表面）から外部に取り出される。 The organic light emitting layer 15 of the surface light source 10 configured as described above is provided with a wiring pattern, a wiring 23, and electrode portions 21 and 22 provided on a wiring board 30 (see FIG. 4) described later from an external power supply device. Power is supplied through the anode 14 and the cathode 16. The light generated in the organic light emitting layer 15 is taken out from the light emitting surface 12 (surface) through the anode 14 and the transparent substrate 11.
　面発光光源１０において、有機発光層１５から光が発光することから、有機発光層１５に対応する位置が発光領域Ｒ１を構成し、有機発光層１５を取り囲む外部領域が非発光領域Ｒ２を構成する。 Since light is emitted from the organic light emitting layer 15 in the surface light source 10, the position corresponding to the organic light emitting layer 15 forms the light emitting region R1, and the external region surrounding the organic light emitting layer 15 forms the non-light emitting region R2. .
　（面発光モジュール）
　図３は、本実施の形態に係る面発光モジュールの概略平面図である。図４は、図３に示すＩＶ－ＩＶ線に沿った概略断面図である。図３および図４を参照して、本実施の形態に係る面発光モジュール１について説明する。 (Surface emitting module)
FIG. 3 is a schematic plan view of the surface emitting module according to the present embodiment. FIG. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. With reference to FIG. 3 and FIG. 4, the surface emitting module 1 which concerns on this Embodiment is demonstrated.
　図３および図４に示すように、本実施の形態に係る面発光モジュール１は、面発光光源１０と、配線基板３０とを備える。面発光光源１０は、上述した構成を有し、図４中矢印に示すように配線基板３０側に向けて光を出射する発光領域Ｒ１を含む。 As shown in FIGS. 3 and 4, the surface emitting module 1 according to the present embodiment includes a surface emitting light source 10 and a wiring board 30. The surface emitting light source 10 has the above-described configuration, and includes a light emitting region R1 that emits light toward the wiring substrate 30 as indicated by an arrow in FIG.
　配線基板３０は、配線２３を介して面発光光源１０に電気的に接続される。配線基板３０は、開口部３１を有し、面発光光源１０の外縁部を覆うように（すなわち面発光光源１０の一部分を遮蔽するように）、面発光光源１０の光出射側（発光面１２）側に設けられている。配線基板３０は、主にガラスエポキシ、ポリイミドなどの樹脂部材を表面に用いて、内部に通電用の配線パターンが引き回される構成をとる。また、当該配線パターンは、後述する開口部３１には引き回されないように設けられている。なお、配線基板３０の樹脂部材には、遮光性または減光性を高めるために黒色等の各色の顔料等が混合されていてもよい。 The wiring board 30 is electrically connected to the surface emitting light source 10 via the wiring 23. The wiring board 30 has an opening 31 and covers the outer edge of the surface emitting light source 10 (that is, covers a part of the surface emitting light source 10). ) Side. The wiring board 30 has a configuration in which a wiring pattern for energization is routed inside using a resin member such as glass epoxy or polyimide on the surface. In addition, the wiring pattern is provided so as not to be routed through an opening 31 described later. The resin member of the wiring board 30 may be mixed with pigments of various colors such as black in order to improve the light shielding property or the light attenuation property.
　配線基板３０の熱伝導率は、面発光光源１０の熱伝導率よりも高くなることが好ましい。そうすることにより、面発光光源１０にて発生する熱を配線基板３０を介して放熱することができる。このため、発光領域Ｒ１における局所的な発熱を抑制することができ、これにより、温度に起因する面発光光源の輝度ムラを抑制したり、部材の劣化を抑制したりできる。 The thermal conductivity of the wiring board 30 is preferably higher than the thermal conductivity of the surface emitting light source 10. By doing so, the heat generated by the surface-emitting light source 10 can be radiated through the wiring board 30. For this reason, the local heat_generation | fever in light emission area | region R1 can be suppressed, and, thereby, the brightness nonuniformity of the surface emitting light source resulting from temperature can be suppressed, or deterioration of a member can be suppressed.
　放熱性を高めるために、面発光光源１０は、配線基板３０に密着して保持されることが好ましい。面発光光源１０を配線基板３０に密着して保持する際には、接着剤等を用いて面発光光源１０の発光面１２に配線基板３０を固定してもよいし、面発光光源１０の発光面１２に配線基板３０を載置した状態でこれらをラミネート等の封止部材にて封止することにより固定してもよい。 In order to improve heat dissipation, the surface emitting light source 10 is preferably held in close contact with the wiring board 30. When the surface emitting light source 10 is held in close contact with the wiring substrate 30, the wiring substrate 30 may be fixed to the light emitting surface 12 of the surface emitting light source 10 using an adhesive or the like. You may fix by sealing these with the sealing members, such as a laminate, in the state which mounted the wiring board 30 in the surface 12. FIG.
　配線基板３０は、透明基板１１の主面（発光面１２）の法線方向から見た場合に、面発光光源１０の発光領域Ｒ１と重なる領域に開口部３１を有し、開口部３１と重なる領域以外の発光領域Ｒ１を遮蔽する。開口部３１は、配線基板３０の主表面の法線方向から見た場合に、たとえば矩形形状を有する。開口部３１は、面発光光源１０の発光面の法線方向から見た場合に、発光領域Ｒ１と重なる範囲内に収まるように設けられることが好ましい。 When viewed from the normal direction of the main surface (light emitting surface 12) of the transparent substrate 11, the wiring substrate 30 has an opening 31 in a region overlapping with the light emitting region R1 of the surface emitting light source 10, and overlaps with the opening 31. The light emitting region R1 other than the region is shielded. The opening 31 has, for example, a rectangular shape when viewed from the normal direction of the main surface of the wiring board 30. The opening 31 is preferably provided so as to be within a range overlapping with the light emitting region R1 when viewed from the normal direction of the light emitting surface of the surface light source 10.
　面発光光源１０の出射側に配線基板３０を設けることにより、面発光光源１０から出射された光の一部は、配線基板３０によって、遮光または減光される。このため、面発光光源１０から出射された光のうち、所望の形状を有する開口部３１を透過する光が、強調されて視認される。これにより、意匠表現が可能となる。また、配線基板３０が遮光部材または減光部材としての機能を備えることにより、別途遮光部材または減光部材を設ける必要がなくなるため、簡易な構成で面発光モジュール１を低背化することができる。 By providing the wiring board 30 on the emission side of the surface emitting light source 10, part of the light emitted from the surface emitting light source 10 is blocked or reduced by the wiring board 30. For this reason, the light which permeate | transmits the opening part 31 which has a desired shape among the lights radiate | emitted from the surface emitting light source 10 is emphasized and visually recognized. Thereby, design expression becomes possible. Further, since the wiring board 30 has a function as a light shielding member or a light reducing member, it is not necessary to separately provide a light shielding member or a light reducing member, so that the surface emitting module 1 can be reduced in height with a simple configuration. .
　さらに、面発光光源１０および配線基板３０が可撓性を有することにより、たとえば曲面へ面発光モジュール１を設置したり、面発光モジュール１をロール形状等の状態で運搬したりすることができる。これにより、面発光モジュール１の利便性が向上する。面発光光源１０および配線基板３０が可撓性を有する場合でも、同様の簡易な構成をとることができる。 Furthermore, since the surface emitting light source 10 and the wiring board 30 have flexibility, for example, the surface emitting module 1 can be installed on a curved surface, or the surface emitting module 1 can be transported in a roll shape or the like. Thereby, the convenience of the surface emitting module 1 improves. Even when the surface emitting light source 10 and the wiring board 30 have flexibility, the same simple configuration can be adopted.
　以上のように、本実施の形態に係る面発光モジュール１は、簡易な構成で面発光モジュールの低背化を実現しつつ、所望の意匠表現をすることができる。 As described above, the surface emitting module 1 according to the present embodiment can express a desired design while realizing a reduction in the height of the surface emitting module with a simple configuration.
　（実施の形態２）
　（面発光モジュール）
　図５は、本実施の形態に係る面発光モジュールを示す概略平面図である。図６は、図５に示すＶＩ－ＶＩ線に沿った概略断面図である。図５および図６を参照して、本実施の形態に係る面発光モジュール１Ａについて説明する。 (Embodiment 2)
(Surface emitting module)
FIG. 5 is a schematic plan view showing the surface emitting module according to the present embodiment. FIG. 6 is a schematic cross-sectional view along the line VI-VI shown in FIG. With reference to FIG. 5 and FIG. 6, the surface emitting module 1A according to the present embodiment will be described.
　図５および図６に示すように、本実施の形態に係る面発光モジュール１Ａは、実施の形態１に係る面発光モジュール１と比較した場合に、複数の面発光光源１０Ａ，１０Ｂを備える点、配線基板３０の構成、および、意匠シート４０をさらに備える点が相違する。 As shown in FIG. 5 and FIG. 6, the surface emitting module 1 </ b> A according to the present embodiment includes a plurality of surface emitting light sources 10 </ b> A and 10 </ b> B when compared with the surface emitting module 1 according to the first embodiment. The structure of the wiring board 30 and the point further provided with the design sheet 40 are different.
　複数の面発光光源１０Ａ，１０Ｂの構成は、実施の形態１に係る面発光光源１０と同様の構成を有する。複数の面発光光源１０Ａ，１０Ｂは、直線状に配置されている。複数の面発光光源１０Ａ，１０Ｂは、単一の配線基板３０上に設けられている。配線基板３０は、複数の面発光光源１０Ａ，１０Ｂの光出射側に位置し、それぞれの発光領域Ｒ１と重なる領域に開口部３１Ａ，３１Ｂを有し、開口部３１Ａ，３１Ｂと重ならない発光領域Ｒ１を覆うように設けられている。 The configuration of the plurality of surface-emitting light sources 10A and 10B is the same as that of the surface-emitting light source 10 according to the first embodiment. The plurality of surface emitting light sources 10A and 10B are arranged linearly. The plurality of surface emitting light sources 10 </ b> A and 10 </ b> B are provided on a single wiring board 30. The wiring board 30 is located on the light emitting side of the plurality of surface emitting light sources 10A and 10B, has openings 31A and 31B in areas overlapping with the respective light emitting areas R1, and does not overlap with the openings 31A and 31B. It is provided so as to cover.
　意匠シート４０は、ポリエチレン樹脂、アクリル樹脂、塩化ビニル樹脂等の透光性を有する樹脂部材から成るシート部材や紙等の印刷媒体に文字や図柄等の任意の意匠が印刷されたものである。意匠シート４０は、配線基板３０に対して面発光光源１０Ａ，１０Ｂが位置する位置する側とは反対側に設けられている。また、意匠シート４０は、配線基板３０の開口部３１Ａ，３１Ｂを覆うように設けられている。なお、意匠シート４０には、面発光光源１０の発光面１２の法線方向から見た場合に、開口部３１Ａ，３１Ｂと重なる部分に孔部が設けられていてもよい。 The design sheet 40 is obtained by printing an arbitrary design such as a character or a design on a print medium such as a sheet member or paper made of a translucent resin member such as polyethylene resin, acrylic resin, or vinyl chloride resin. The design sheet 40 is provided on the side opposite to the side where the surface emitting light sources 10 </ b> A and 10 </ b> B are positioned with respect to the wiring board 30. The design sheet 40 is provided so as to cover the openings 31 </ b> A and 31 </ b> B of the wiring board 30. The design sheet 40 may be provided with holes in portions overlapping the openings 31A and 31B when viewed from the normal direction of the light emitting surface 12 of the surface light source 10.
　このような構成を有することにより、意匠シート４０に印刷された意匠を強調して表現することができ、意匠性を高めることができる。また、配線基板３０の開口部３１Ａ，３１Ｂによって面発光光源１０からの光が絞られるため、滲まずに輪郭のはっきりした光で意匠表現を行なうことができる。さらに、複数の面発光光源１０Ａ，１０Ｂを備えることにより、意匠表現できる範囲を拡張することができる。 By having such a configuration, the design printed on the design sheet 40 can be emphasized and expressed, and the design properties can be enhanced. In addition, since the light from the surface emitting light source 10 is narrowed by the openings 31A and 31B of the wiring board 30, the design can be expressed with light having a clear outline without bleeding. Furthermore, the range which can express design can be expanded by providing several surface emitting light source 10A, 10B.
　以上のように本実施の形態にあっては、面発光光源１０Ａ，１０Ｂの光出射側に配線基板３０を設けることにより、意匠表現が可能となるとともに、簡易な構成で低背化を実現することができる。また、意匠シート４０を設けることにより、意匠性をさらに高めることができる。 As described above, in the present embodiment, by providing the wiring substrate 30 on the light emitting side of the surface emitting light sources 10A and 10B, it is possible to express the design and to realize a low profile with a simple configuration. be able to. Moreover, by providing the design sheet 40, the design properties can be further enhanced.
　なお、本実施の形態においては、複数の面発光モジュールが２つ面発光光源１０Ａ，１０Ｂによって構成される場合を例示して説明したが、これに限定されず、３つ以上の面発光光源によって構成されてもよい。この場合には、複数の面発光光源は、行列状に配置されることが好ましい。 In the present embodiment, a case where a plurality of surface light emitting modules are configured by two surface light sources 10A and 10B has been described as an example. However, the present invention is not limited to this, and three or more surface light sources are used. It may be configured. In this case, the plurality of surface emitting light sources are preferably arranged in a matrix.
　また、本実施の形態においては、意匠シート４０と配線基板３０と面発光光源１０とが一体化されている構成が好ましい。この場合には、意匠シート４０と配線基板３０と面発光光源とが一体もののモジュールとして取り扱うことができ、運搬・施工がより一層簡単になる。 Further, in the present embodiment, a configuration in which the design sheet 40, the wiring board 30, and the surface light source 10 are integrated is preferable. In this case, the design sheet 40, the wiring board 30, and the surface emitting light source can be handled as an integrated module, and transportation and construction are further simplified.
　（実施の形態３）
　（面発光モジュール）
　図７は、本実施の形態に係る面発光モジュールを示す概略平面図である。図７を参照して、本実施の形態に係る面発光モジュール１Ｂについて説明する。 (Embodiment 3)
(Surface emitting module)
FIG. 7 is a schematic plan view showing the surface emitting module according to the present embodiment. With reference to FIG. 7, the surface emitting module 1B according to the present embodiment will be described.
　図７に示すように、本実施の形態に係る面発光モジュール１Ｂは、実施の形態２に係る面発光モジュール１Ａと比較した場合に、複数の面発光光源１０Ａ，１０Ｂに設けられた発光領域Ｒ１の各々と重なる領域に複数の開口部３１が設けられている点において相違する。複数の開口部３１は、意匠シート４０に印刷された意匠に応じて設けられる。 As shown in FIG. 7, the surface emitting module 1B according to the present embodiment has a light emitting region R1 provided in the plurality of surface emitting light sources 10A and 10B when compared with the surface emitting module 1A according to the second embodiment. This is different in that a plurality of openings 31 are provided in a region overlapping with each of the above. The plurality of openings 31 are provided according to the design printed on the design sheet 40.
　このように構成することにより、本実施の形態に係る面発光モジュール１Ｂは、実施の形態２に係る面発光モジュール１Ａとほぼ同様の効果を得ることができる。また、複数の開口部３１の数や配置の組合せにより、意匠表現できる範囲を拡張することができる。 With this configuration, the surface emitting module 1B according to the present embodiment can obtain substantially the same effect as the surface emitting module 1A according to the second embodiment. Moreover, the range which can express design can be expanded by the combination of the number and arrangement | positioning of the some opening part 31. FIG.
　（実施の形態４）
　（面発光光源および面発光モジュール）
　図８は、本実施の形態に係る面発光モジュールを示す概略断面図である。図８を参照して、本実施の形態に係る面発光モジュール１Ｃについて説明する。 (Embodiment 4)
(Surface emitting light source and surface emitting module)
FIG. 8 is a schematic cross-sectional view showing the surface emitting module according to the present embodiment. With reference to FIG. 8, 1 C of surface emitting modules which concern on this Embodiment are demonstrated.
　図８に示すように、本実施の形態に係る面発光モジュール１Ｃは、実施の形態１に係る面発光モジュール１と比較した場合に、面発光光源１０Ｃの構成が相違する。その他の構成については、ほぼ同様の構成である。 As shown in FIG. 8, the surface emitting module 1C according to the present embodiment is different from the surface emitting module 1 according to the first embodiment in the configuration of the surface emitting light source 10C. Other configurations are almost the same.
　面発光光源１０Ｃは、トップエミッション型の有機ＥＬ素子によって構成されている。面発光光源１０Ｃは、基板１１Ｃと、基板１１Ｃ上において第１電極としての陽極１４Ｃ、有機発光層１５、および第２電極としての陰極１６Ｃがこの順で積層されてなる積層体２とを含み、基板１１ｃ側とは反対側（陰極１６側）から光を出射する。これに伴い、配線基板３０は、面発光光源１０Ｃの出射側であり、かつ、基板１１Ｃとの間に積層体２が位置するように配置される。 The surface emitting light source 10C is composed of a top emission type organic EL element. The surface emitting light source 10C includes a substrate 11C, and a stacked body 2 in which an anode 14C as a first electrode, an organic light emitting layer 15, and a cathode 16C as a second electrode are stacked in this order on the substrate 11C. Light is emitted from the side opposite to the substrate 11c side (cathode 16 side). Along with this, the wiring board 30 is disposed on the emission side of the surface-emitting light source 10C so that the laminate 2 is positioned between the wiring board 30 and the board 11C.
　面発光光源１０Ｃは、さらに封止部材１７を含む。封止部材１７は、陽極１４Ｃ、有機発光層１５、および陰極１６Ｃの略全体を透明基板１１上に封止する。封止部材１７は、面発光光源１０の発光面１９Ｃを形成している。トップエミッション型の有機ＥＬ素子においては、封止部材１７は光透過性を有することが好ましい。 The surface emitting light source 10 </ b> C further includes a sealing member 17. The sealing member 17 seals substantially the entire anode 14 </ b> C, the organic light emitting layer 15, and the cathode 16 </ b> C on the transparent substrate 11. The sealing member 17 forms a light emitting surface 19 </ b> C of the surface light source 10. In the top emission type organic EL element, the sealing member 17 preferably has light transmittance.
　基板１１Ｃを構成する部材としては、透光性を有していてもよいし、非透光性を有していてもよい。基板１１Ｃとしては、ガラス基板、セラミック基板、合成樹脂によって形成されるフィルム基板、金属製薄板などが用いられる。積層体２と反対側に位置する基板１１Ｃの主面は、面発光光源１０の背面１２Ｃを構成する。 As a member constituting the substrate 11C, the substrate may have translucency or non-translucency. As the substrate 11C, a glass substrate, a ceramic substrate, a film substrate formed of a synthetic resin, a metal thin plate, or the like is used. The main surface of the substrate 11 </ b> C located on the opposite side of the stacked body 2 constitutes the back surface 12 </ b> C of the surface emitting light source 10.
　陽極１４Ｃは、たとえばアルミニウム等の金属膜によって構成される。陰極１６Ｃ側から光を確実に出射させるために、光反射性を有することが好ましい。陰極１６Ｃは、たとえばＩＴＯ等の導電性を有する透明導電膜によって構成される。有機発光層１５は、実施の形態１とほぼ同様の構成を有する。 The anode 14C is made of a metal film such as aluminum. In order to reliably emit light from the cathode 16C side, it is preferable to have light reflectivity. The cathode 16C is formed of a conductive transparent conductive film such as ITO. The organic light emitting layer 15 has a configuration substantially similar to that of the first embodiment.
　陽極１４Ｃの封止部材１７から露出している部分は、電極部２１（陽極用）を構成し、陰極１６Ｃの封止部材１７から露出している部分は、電極部２２（陰極用）を構成する。これら電極部２１，２２は、配線基板３０に対向する基板の主面１３上に設けられ、配線２３を介して配線基板３０に電気的に接続される。 The portion exposed from the sealing member 17 of the anode 14C constitutes the electrode portion 21 (for anode), and the portion exposed from the sealing member 17 of the cathode 16C constitutes the electrode portion 22 (for cathode). To do. These electrode portions 21 and 22 are provided on the main surface 13 of the substrate facing the wiring substrate 30, and are electrically connected to the wiring substrate 30 through the wiring 23.
　このような構成を有することにより、任意の意匠形状を有する開口部３１が設けられた配線基板３０が面発光光源１０Ｃの出射側に設けられることなる。このため、本実施の形態に係る面発光モジュール１Ｃは、実施の形態１に係る面発光モジュール１とほぼ同様の効果が得られる。また、遮光機能または減光機能を有する配線基板３０と、電極部２１，２２とが互いに向き合うように設けられることにより、配線基板３０と電極部２１，２２との電気的接続が容易になる。 By having such a configuration, the wiring board 30 provided with the opening 31 having an arbitrary design shape is provided on the emission side of the surface emitting light source 10C. For this reason, the surface emitting module 1C according to the present embodiment can obtain substantially the same effect as the surface emitting module 1 according to the first embodiment. Further, by providing the wiring board 30 having the light shielding function or the dimming function and the electrode parts 21 and 22 so as to face each other, the electrical connection between the wiring board 30 and the electrode parts 21 and 22 is facilitated.
　なお、本実施の形態においては、面発光モジュール１Ｃが、意匠シートを備えない場合を例示して説明したが、これに限定されず、実施の形態２または３に係る意匠シートを備えていてもよい。また、面発光モジュール１Ｃが複数の面発光光源を含むように構成されていてもよい。 In addition, in this Embodiment, although the surface emitting module 1C illustrated and demonstrated the case where a design sheet was not provided, even if it is provided with the design sheet which concerns on Embodiment 2 or 3, it is not limited to this. Good. Moreover, the surface emitting module 1C may be configured to include a plurality of surface emitting light sources.
　なお、本実施の形態においては、第１電極が、基板上に設けられた陽極１４Ｃであり、第２電極が有機発光層上に設けられた陰極１６Ｃである場合を例示して説明したが、これに限定されず、第１電極が、基板上に設けられた陰極であり、第２電極が有機発光層上に設けられた陰極であってもよい。この場合には、第１電極としての陰極は、光反射性を有する導電性部材がこのましく、第２電極としての陽極は、透光性を有する導電性部材が好ましい。 In the present embodiment, the case where the first electrode is the anode 14C provided on the substrate and the second electrode is the cathode 16C provided on the organic light emitting layer has been described as an example. Without being limited thereto, the first electrode may be a cathode provided on the substrate, and the second electrode may be a cathode provided on the organic light emitting layer. In this case, the cathode as the first electrode is preferably a light-reflecting conductive member, and the anode as the second electrode is preferably a light-transmitting conductive member.
　（配線基板に設けられる開口部の形状）
　図９は、配線基板に設けられる開口部のその他の形状（Ａ）～（Ｃ）を示す概略平面図である。図９を参照して、配線基板に設けられる開口部のその他の形状（Ａ）～（Ｃ）について説明する。 (Shape of the opening provided on the wiring board)
FIG. 9 is a schematic plan view showing other shapes (A) to (C) of the opening provided in the wiring board. With reference to FIG. 9, other shapes (A) to (C) of the openings provided in the wiring board will be described.
　上述した実施の形態１から４にあっては、開口部３１は、配線基板３０の主表面の法線方向から見た場合に、矩形形状を有する場合を例示して説明したが、これに限定されず、円形状（図９（Ａ）参照）、六角形（図９（Ｂ）参照）等の多角形状、星型形状（図９（Ｃ）参照）等の幾何学的な形状を有していてもよいし、動植物といった自然物や、各種の物品等の人工物等の任意の意匠を表現した形状、または、当該任意の意匠の一部を表現した形状等を有していてもよい。すなわち、開口部３１は、所望の形状に設けられる。 In the above-described first to fourth embodiments, the opening 31 is described by exemplifying the case where it has a rectangular shape when viewed from the normal direction of the main surface of the wiring substrate 30. However, the present invention is not limited to this. It has a geometric shape such as a circular shape (see FIG. 9A), a polygonal shape such as a hexagon (see FIG. 9B), or a star shape (see FIG. 9C). It may have a shape expressing an arbitrary design such as a natural object such as an animal or plant, an artificial object such as various articles, or a shape expressing a part of the arbitrary design. That is, the opening 31 is provided in a desired shape.
　（面発光光源のその他の例）
　上述した実施の形態１から４にあっては、面発光光源が有機ＥＬ素子によって構成される場合を例示して説明したが、これに限定されず、複数の発光ダイオード（ＬＥＤ）と拡散板とから構成されていてもよいし、冷陰極管等を用いて構成されていてもよい。 (Other examples of surface emitting light source)
In Embodiments 1 to 4 described above, the case where the surface emitting light source is configured by an organic EL element has been described as an example. It may be comprised from, and may be comprised using the cold cathode tube etc.
　以上、本発明の実施の形態について説明したが、今回開示された実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 As mentioned above, although embodiment of this invention was described, embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, and includes meanings equivalent to the terms of the claims and all changes within the scope.
　１，１Ａ，１Ｂ，１Ｃ　面発光モジュール、２　積層体、１０，１０Ａ，１０Ｂ　面発光光源、１１，１１Ｃ　透明基板、１２　発光面、１２Ｃ　背面、１３　主面、１４，１４Ｃ　陽極、１５　有機発光層、１６，１６Ｃ　陰極、１７　封止部材、１８　絶縁層、１９　背面、１９Ｃ　発光面、２１，２２　電極部、２３　配線、３０　配線基板、３１，３１Ａ，３１Ｂ　開口部、４０　意匠シート、１００　面発光モジュール、１１０　基板、１２０　発光部、１３０　配線基板、１４０　遮光部材、１４１　開口部、１５０　面発光光源、１６０　配線。 1, 1A, 1B, 1C surface light emitting module, 2 laminate, 10, 10A, 10B surface light source, 11, 11C transparent substrate, 12 light emitting surface, 12C back surface, 13 main surface, 14, 14C anode, 15 organic light emitting layer 16, 16C cathode, 17 sealing member, 18 insulating layer, 19 back surface, 19C light emitting surface, 21, 22 electrode part, 23 wiring, 30 wiring board, 31, 31A, 31B opening, 40 design sheet, 100 surface light emitting Module, 110 substrate, 120 light emitting unit, 130 wiring substrate, 140 light shielding member, 141 opening, 150 surface emitting light source, 160 wiring.

Claims (8)

  1. 　光を出射する発光領域が設けられた面発光光源と、
    　前記面発光光源の光出射側に設けられ、前記面発光光源に電気的に接続された配線基板と、を備え、
    　前記配線基板は、前記発光領域と重なる領域に開口部を有し、前記発光領域の一部分を遮蔽する、面発光モジュール。     A surface emitting light source provided with a light emitting region for emitting light;
    A wiring board provided on the light emitting side of the surface-emitting light source and electrically connected to the surface-emitting light source,
    The wiring substrate has a surface emitting module having an opening in a region overlapping the light emitting region and shielding a part of the light emitting region.
  2. 　前記面発光光源と前記配線基板とが可撓性を有する、請求項１に記載の面発光モジュール。 The surface emitting module according to claim 1, wherein the surface emitting light source and the wiring board are flexible.
  3. 　前記面発光光源は、前記配線基板に密着して保持される、請求項１または請求項２に記載の面発光モジュール。 3. The surface emitting module according to claim 1, wherein the surface emitting light source is held in close contact with the wiring board.
  4. 　前記面発光光源は、前記配線基板上に複数設けられ、
    　前記配線基板は、複数の前記面発光光源に設けられた前記発光領域の各々と重なる領域に前記開口部を有する、請求項１から請求項３のいずれか１項に記載の面発光モジュール。     A plurality of the surface-emitting light sources are provided on the wiring board,
    4. The surface emitting module according to claim 1, wherein the wiring board has the opening in a region overlapping with each of the light emitting regions provided in the plurality of surface emitting light sources. 5.
  5. 　前記配線基板の熱伝導率が、前記面発光光源の熱伝導率よりも高い、請求項１から請求項４のいずれか１項に記載の面発光モジュール。 The surface emitting module according to any one of claims 1 to 4, wherein a thermal conductivity of the wiring board is higher than a thermal conductivity of the surface emitting light source.
  6. 　前記面発光光源は、基板と、前記基板上において第１電極、有機発光層、および第２電極がこの順で積層されてなる積層体とを含み、前記基板側とは反対側から光を出射するトップエミッション型の有機ＥＬ素子であり、
    　前記配線基板に電気的に接続される電極部が、前記配線基板に対向する前記基板の主面上に設けられている、請求項１から請求項５のいずれか１項に記載の面発光モジュール。     The surface-emitting light source includes a substrate and a stacked body in which a first electrode, an organic light-emitting layer, and a second electrode are stacked in this order on the substrate, and emits light from a side opposite to the substrate side. Top emission type organic EL element
    The surface emitting module according to claim 1, wherein an electrode portion electrically connected to the wiring board is provided on a main surface of the board facing the wiring board. .
  7. 　前記配線基板に対して前記面発光光源が位置する側とは反対側に設けられ、前記配線基板の前記開口部を覆うように設けられた意匠シートをさらに備える、請求項１から請求項６のいずれか１項に記載の面発光モジュール。 7. The design sheet according to claim 1, further comprising a design sheet provided on a side opposite to the side on which the surface-emitting light source is located with respect to the wiring board and provided to cover the opening of the wiring board. The surface emitting module of any one of Claims.
  8. 　前記配線基板は、前記発光領域と重なる領域に複数の開口部を有する、請求項１から請求項７のいずれか１項に記載の面発光モジュール。 The surface emitting module according to any one of claims 1 to 7, wherein the wiring board has a plurality of openings in a region overlapping the light emitting region.
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